FOUP Transfer Device

Abstract

Provided is a FOUP transfer device that transfers a FOUP between a loading port, and the FOUP transfer device can minimize the modification work of a conveyor that has already been installed. The FOUP transfer devices (1-1, 1-2) are provided near the loading ports of a conveyor having one or more loading ports (18-1, 18-2), and transfer the FOUP 3 between the loading ports (18-1, 18-2). The FOUP transfer devices (1-1, 1-2) have first optical I / O communication devices (31-3, 31-4), and are arranged to be connected to second optical I / O communication devices (31-1, 31-2) of the loading ports (18-1, 18-2), so as to perform optical I / O communication between the loading ports (18-1, 18-2) and the OHT cart (11) instead of the above-mentioned loading ports (18-1, 18-2).

Description

Technical Field

[0001] The present invention relates to a FOUP transfer device that is provided near a load port and transfers a FOUP between the load port and the FOUP. Background Art

[0002] In the manufacturing process of semiconductor chips, a large number of surface treatment processes and inspection processes are required. In a semiconductor manufacturing factory, a plurality of dedicated processing devices for various surface processing and inspection of the wafer surface are arranged. The wafer is transported by an inter-process transfer device in a state of being housed in a closed container called a FOUP (Front-Opening Unified Pod) between the processing devices. Each processing device has a transfer device called an EFEM (Equipment Front End Module) in the front. After receiving the FOUP transported by an inter-process transfer device called an OHT (Overhead Hoist Transport) or an AGV (Automated Guided Vehicle), the EFEM takes out the wafer from the inside of the FOUP and transports it to the processing device. The EFEM has one or more opening and closing devices called load ports for placing and opening and closing the lid of the FOUP, and transports the wafer after the processing by the processing device to a FOUP different from the FOUP housing the wafer before the processing. After the processing is completed, if the number of wafers transported from the processing device reaches a specified number, the lid of the FOUP is closed, and the FOUP is transported to the next process by the OHT.

[0003] Generally, the processing processes performed by the processing device and the inspection device are diverse. Depending on the processing process, the time required for wafer processing varies greatly. Even if one processing is completed, it is not necessarily possible to immediately transport the FOUP to the next process. Therefore, semiconductor manufacturing factories adopt the following method: temporarily storing the FOUP in a stocker and using an inter-process transfer device to transport the FOUP to the processing device in a timely manner. A stocker is a device provided in a semiconductor manufacturing factory and storing FOUPs on dozens or more than a hundred shelves, and has a shelf for holding each FOUP and a FOUP transfer robot for transporting the FOUP between the shelf and the inter-process transfer device.

[0004] However, the OHT and AGV for transporting FOUP can only travel in one direction along the tracks laid in the semiconductor manufacturing factory. As a result, when the processing device finishes processing the wafers, during the period of waiting for the arrival of the carts of the OHT and AGV, the processing device stands by in a state of halting processing. The processing device is an expensive device, and such downtime has a great negative impact in terms of production efficiency.

[0005] Therefore, for the purpose of shortening such downtime, the following countermeasure is implemented in Patent Document 1: A temporary storage device for temporarily storing FOUP is provided near the EFEM, and a plurality of FOUPs containing wafers before processing are stored. After the processing process of the processing device ends, the FOUP before processing and the FOUP after processing are replaced without delay. However, in order to install the temporary storage device near the EFEM that has already been installed in the factory and is in operation, the processing device must be stopped for a long time, during which the production capacity of the semiconductor manufacturing factory decreases. And since the temporary storage device stores a plurality of FOUPs for transportation, it becomes a relatively large and expensive device, resulting in an increase in the production cost of semiconductors.

[0006] In addition, as another countermeasure, in Patent Document 2, a FOUP transfer port is added to a dual-port type conveying device having two load ports, and the FOUP before processing stored in the FOUP transfer port is transferred to the stage of the load port where the FOUP has been retrieved, thereby shortening the FOUP supply time to the load port. See Figure 18 . The FOUP transfer port has a relatively simple structure, so it is inexpensive. Furthermore, the space size can also be reduced. Therefore, it is considered to be more cost-effective than the above-mentioned temporary storage device.

[0007] Prior Art Documents

[0008] Patent Documents

[0009] Patent Document 1: JP Patent No. 4182521

[0010] Patent Document 2: JP-A-2014-160882 Summary of the Invention

[0011] Problems to be Solved by the Invention

[0012] However, even if a FOUP transfer port is added, it is necessary to modify the loading port and upgrade the software that enables communication between the software that operates the conveying device and the OHT and AGV. As a result, the problem that the setup work cannot be completed in a short time cannot be solved. The present invention is proposed in view of the above problems, and an object of the present invention is to provide a FOUP transfer device that transfers a FOUP between the loading port, and the FOUP transfer device can minimize the modification work of the already installed conveying device.

[0013] Technical solution for solving the problem

[0014] In order to achieve the above object, the FOUP transfer device of the present invention is provided near the loading port of a conveying device having one or more loading ports, and exchanges FOUP with the loading port. The FOUP transfer device is characterized in that it has a first communication device and is connected to a second communication device of the loading port, so as to perform communication between the loading port and a third communication device of the OHT transfer cart on behalf of the loading port. By adopting the above structure, the FOUP transfer device can be set without imposing major changes on the equipment in the semiconductor manufacturing factory.

[0015] In addition, the FOUP transfer device of the present invention further has a control PC that communicates with the main computer of the semiconductor manufacturing factory, so that the FOUP transfer device and the main computer of the semiconductor manufacturing factory can communicate via the control PC, and thus the change of the conveying device already installed in the semiconductor manufacturing factory can be minimized.

[0016] Moreover, the FOUP transfer device of the present invention has a communication mechanism for exchanging FOUP transfer signals between the loading port, whereby the supply and recovery of the FOUP from the OHT cart to the loading port and the exchange of the FOUP between the loading port and the FOUP transfer device can be smoothly performed. Preferably, the first communication device, the second communication device, and the third communication device are optical I / O communication devices. By using the optical I / O communication device, communication can be performed without being affected by noise generated from the processing device or the like.

[0017] In addition, the FOUP transfer device of the present invention is characterized in that it is arranged in line with the arrangement of a plurality of loading ports of the conveying device, and the arrangement of the loading port and the FOUP transfer device is disposed directly below the OHT track. With the above structure, the supply and recovery of the FOUP can be performed between the FOUP transfer device without changing the existing OHT track installed in the semiconductor manufacturing factory.

[0018] In addition, the FOUP transfer device of the present invention is characterized in that it is arranged at a position inconsistent with the arrangement of a plurality of load ports provided directly below the OHT track and directly below a second OHT track different from the OHT track. With the above structure, when the FOUP transfer device of the present invention is provided in a semiconductor manufacturing factory where a second OHT track is laid, by arranging the FOUP transfer device of the present invention directly below the second OHT track, it is possible to supply and retrieve the FOUP toward the FOUP transfer device using an OHT track different from the OHT track for supplying and retrieving the FOUP between the load ports. Therefore, the supply and retrieval of the FOUP can be carried out efficiently.

[0019] Furthermore, the FOUP transfer device of the present invention is characterized in that it includes: a placement table for placing the FOUP at a predetermined position, a holding part for holding the FOUP placed on the placement table, an arm part for moving the holding part on a substantially circular arc-shaped track, and a lifting mechanism for moving the arm part up and down. With the above structure, the transfer of the FOUP can be carried out with a simple structure.

[0020] Advantages of the Invention

[0021] According to the FOUP transfer device of the present invention, it can be set near the EFEM provided in a semiconductor manufacturing factory in a short time. Therefore, the productivity of the semiconductor manufacturing factory will not be reduced during the setting operation. Description of the Drawings

[0022] Figure 1 It is a front view showing the FOUP transfer device according to an embodiment of the present invention.

[0023] Figure 2 It is a cross-sectional view showing the FOUP transfer device according to an embodiment of the present invention.

[0024] Figure 3 A and Figure 3 B are cross-sectional views showing the holding part of the FOUP transfer device according to an embodiment of the present invention.

[0025] Figure 4 It is a schematic diagram showing a semiconductor manufacturing factory.

[0026] Figure 5 It is a view showing the state where the FOUP transfer device of this embodiment is provided near the EFEM as seen from the front.

[0027] Figure 6 It is a view showing the state where the FOUP transfer device of this embodiment is provided near the EFEM as seen from above.

[0028] Figure 7A block diagram showing the communication system of the EFEM in the past.

[0029] Figure 8 A block diagram showing the communication system after adding the FOUP transfer device of the present embodiment.

[0030] Figure 9 A and Figure 9 B are diagrams showing the operation of the FOUP transfer device of the present embodiment.

[0031] Figure 10 A and Figure 10 B are diagrams showing the operation of the FOUP transfer device of the present embodiment.

[0032] Figure 11 A and Figure 11 B are diagrams showing the operation of the FOUP transfer device of the present embodiment.

[0033] Figure 12 A diagram showing the FOUP transfer device according to an embodiment of the present invention.

[0034] Figure 13 A diagram of the FOUP transfer device according to an embodiment of the present invention as viewed from above.

[0035] Figure 14 A perspective view showing the FOUP transfer device according to an embodiment of the present invention.

[0036] Figure 15 A front view showing the FOUP transfer device according to an embodiment of the present invention.

[0037] Figure 16 A diagram showing the state where the FOUP transfer device of the present embodiment is provided near the EFEM as viewed from above.

[0038] Figure 17 A block diagram showing the communication system after adding the FOUP transfer device of the present embodiment.

[0039] Figure 18 A diagram showing the past FOUP transfer device. Detailed Embodiment

[0040] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Figure 1 A front view showing the FOUP transfer device 1 according to an embodiment of the present invention, Figure 2 is a cross-sectional view thereof. In addition, Figure 3 A and Figure 3FIG. B is a cross-sectional view showing the holding part 6 of the FOUP transfer device 1. The FOUP transfer device 1 of the present embodiment has a substantially rectangular parallelepiped housing 2, a mounting table 4 fixed to the upper surface of the housing 2 for mounting the FOUP 3, and a FOUP transfer mechanism 5. The FOUP transfer mechanism 5 at least includes a holding part 6 for holding the top flange 3a of the FOUP 3, an arm part 7 for supporting the holding part 6 and moving it on an arc-shaped track, an arm driving mechanism 8 for driving the arm part 7, and a lifting mechanism 9 for moving the arm part 7 and the arm driving mechanism 8 up and down. In addition, drive sources 15 and 17 are provided in the holding mechanism, the arm driving mechanism 8, and the lifting mechanism 9 of the holding part 6, and the operations of these drive sources 15 and 17 are controlled by the control part 10 of the FOUP transfer device 1. In addition, the control part 10, in addition to controlling the operations of the respective drive sources 15 and 17 of the above-mentioned FOUP transfer mechanism 5, also has a communication mechanism for communicating with the AGV, Figure 5 the transport cart 11 of the OHT 26 shown in FIG.

[0041] Three FOUP support pins 12 are erected on the upper part of the mounting table 4. When the FOUP 3 is mounted on the support pins 12, three groove parts formed at predetermined positions on the bottom surface of the FOUP 3 come into contact with the tops of the corresponding FOUP support pins 12, thereby positioning the FOUP 3 and mounting it at a predetermined position on the mounting table 4. The holding part 6 has a pair of left and right FOUP support members 13 for supporting the top flange 3a of the FOUP 3 from below and a cylinder 14 for moving the pair of FOUP support members 13 between a holding position (closed position) and a release position (open position). By supplying compressed air to the cylinder 14, the piston rod 14a of the cylinder 14 projects and moves out of the main body of the cylinder 14, and the pair of FOUP support members 13 move to the holding position (closed position). In addition, when the compressed air supplied to the cylinder 14 is discharged, the piston rod 14a moves into the main body of the cylinder 14, and the pair of support members 13 move to the release position (open position). In addition, the upper part of the holding part 6 is rotatably connected to the front end of the arm part 7.

[0042] The base end of the arm part 7 is connected to the output shaft of the stepping motor 15 of the arm driving mechanism 8 via a speed reducer. With the above structure, by the forward and reverse rotations of the output shaft of the stepping motor 15 of the arm driving mechanism 8, the arm part 7 swings around the rotation axis C1. In addition, the rotation axis C1 of the arm part 7 and the rotation axis C2 of the holding part 6 are connected by a gear and a belt with a rotation ratio of 1:1. Even when the arm part 7 swings, the holding part 6 maintains a certain posture with the FOUP support members 13 facing downward.

[0043] In addition, the arm 7 is fixed to the lifting table 16, which is configured to be capable of lifting and moving in the vertical direction by a lifting mechanism 9. The lifting mechanism 9 includes a lifting table 16 that supports the arm 7 and the arm driving mechanism 8, a linear actuator 17 that guides a moving member connected to the lifting table 16 in the vertical direction to lift and move it, and a stepping motor 15 that serves as a driving source of the linear actuator 17. By the forward or reverse rotation of the output shaft of the stepping motor 15, the lifting table 16 and the arm 7 fixed to the lifting table 16 lift and move in the vertical direction. As described above, the FOUP transfer device 1 is the same as Figure 5 the loading ports 18-1 and 18-2 shown later in that it has the feature of being able to place the FOUP 3 at a predetermined position, but the FOUP transfer device 1 does not have a mechanism for opening and closing the lid of the FOUP 3 of the loading ports 18-1 and 18-2, a mechanism called a mapper for detecting the placement condition of the wafers housed inside the FOUP 3, and has a FOUP transfer mechanism 5 that the loading ports 18-1 and 18-2 do not have.

[0044] The FOUP transfer device 1 of the present embodiment is configured to be easily movable to a predetermined location by casters 19 mounted on the four corners of the lower surface of the housing 2. In addition, regulators 20 are arranged adjacent to the respective casters 19 to form a structure capable of adjusting the horizontal inclination of the mounting table 4. Further, a manual switch 21 is provided in the FOUP transfer device 1 to form the following structure: by an operator operating this switch, the swinging operation of the arm driving mechanism 8 and the lifting operation of the lifting mechanism 9 can be respectively executed. Also, an emergency stop switch 22 for stopping the operation of the FOUP transfer device 1 in an emergency is provided, and a zone sensor 23 is provided in the FOUP transfer device 1 to form a structure capable of stopping the operation of each driving mechanism in an emergency.

[0045] Moreover, the FOUP transfer device 1 of the present embodiment may also be configured to have an atmosphere replacement unit for replacing the internal atmosphere of the FOUP 3 with an inert gas. The atmosphere replacement unit includes an inert gas supply mechanism (not shown in the figure) for supplying an inert gas, an exhaust mechanism (not shown in the figure) for discharging the internal atmosphere of the FOUP 3, a supply nozzle 35 for supplying the inert gas from the inert gas supply mechanism to the internal space of the FOUP 3 through a gas supply port provided on the bottom surface of the FOUP 3, and an exhaust nozzle 36 for discharging the internal atmosphere of the FOUP 3 through a gas exhaust port provided on the bottom surface of the FOUP 3. Refer to Figure 13。With the above structure, the FOUP transfer device 1 can maintain the interior of the FOUP 3 it holds in an inert gas atmosphere. Therefore, even if the FOUP 3 waits for processing for a long time, it is possible to prevent the formation of a native oxide film on the surface of the wafer W housed in the FOUP 3.

[0046] The supply nozzle 35 and the exhaust nozzle 36 are arranged on the upper surface of the mounting table 4 and are positioned opposite to the gas supply port and the gas exhaust port of the FOUP 3 supported on the FOUP support pins 12. In addition, the supply nozzle 35 and the exhaust nozzle 36 are structured to be able to move forward and backward toward the gas supply port and the gas exhaust port of the FOUP 3 by a forward and backward mechanism (not shown in the figure). With the above structure, it is possible to replace the interior of the FOUP 3 placed on the mounting table 4 from an atmospheric atmosphere to an inert gas atmosphere, and it is possible to prevent deterioration of the surface of the wafer W housed inside the FOUP 3. In addition, a structure having a fixing member 37 for fixing the FOUP 3 to the mounting table 4 may be formed. By having the fixing member 37, it is possible to prevent the FOUP 3 from being displaced due to the operation of the supply nozzle 35 and the exhaust nozzle 36 protruding toward the FOUP 3. Further, a structure having an RF receiver 38 for receiving the signal of the RF (Radio Frequency) tag provided on the FOUP 3 may be formed in the mounting table 4.

[0047] Next, an embodiment in which the FOUP transfer device 1 is provided near the EFEM 25 provided in the semiconductor manufacturing factory F will be described. Figure 4 is a schematic diagram showing the arrangement of each device in the semiconductor manufacturing factory F. In addition, Figure 5 is a front view showing the EFEM 25 and the FOUP transfer devices 1-1 and 1-2 of the present embodiment provided near the EFEM 25, Figure 6 and is a top view thereof. In the semiconductor manufacturing factory F, a plurality of dedicated processing devices for performing various surface treatments and inspections on wafers are arranged, and the wafers are transported to the EFEM 25 provided in each processing device by the OHT cart 11 of the OHT 26 in a state of being housed in the FOUP 3 between the respective processing devices. In addition, stockers 33 for temporarily storing the FOUP 3 are arranged at various locations in the semiconductor manufacturing factory F, and the FOUP 3 stored in the stocker 33 is transported to the EFEM 25 in a timely manner. As Figure 6As shown, the OHT 26 moves multiple OHT carts 11 on the track 26a to carry the FOUP 3. The track 26a is laid in such a way that it passes directly above each EFEM 25 installed in the semiconductor manufacturing plant F. Also, in multiple semiconductor manufacturing plants F, only one system of the track 26a of the OHT 26 is laid, and the OHT cart 11 is configured to be able to move in only one direction on this track.

[0048] As Figure 5 shown, the OHT cart 11 that has moved above the platforms 24-1 and 24-2 of the predetermined load ports 18-1 and 18-2 lowers the lifting mechanism 11a in the vertical direction to hold the top flange 3a of the FOUP 3, and then raises the lifting mechanism 11a to store the FOUP 3 in the unmanned OHT cart 11, thereby recovering the FOUP 3. In addition, the lifting mechanism 11a holding the FOUP 3 is lowered in the vertical direction to place the FOUP 3 on the platforms 24-1 and 24-2. After releasing the holding of the top flange 3a, the FOUP 3 is supplied by raising the lifting mechanism 11a. The position information of devices such as the EFEM 25 and the load ports 18-1 and 18-2 configured in the semiconductor manufacturing plant F is pre-stored in the OHT cart 11. When receiving an instruction from the main computer 28 described later, it automatically travels to the designated position. In addition, identification marks such as barcodes are provided at positions on the track 26a directly above each load port 18-1 and 18-2. The OHT cart 11 identifies the target position by detecting this identification mark.

[0049] Moreover, the following structure is formed. In this structure, the OHT carriage 11 is provided with an optical I / O communication device 31-0. When the OHT carriage 11 arrives above each of the load ports 18-1 and 18-2, signals can be transmitted and received between the optical I / O communication device 31-0 provided in the OHT carriage 11 and the optical I / O communication devices 31-1 and 31-2 provided in each of the load ports 18-1 and 18-2. Here, the optical I / O communication devices 31-0 to 31-2 and the optical I / O communication devices 31-3 to 31-6 used in the following described embodiments convert electrical signals sent from the control mechanism and the like of the equipment into optical signals such as infrared rays and transmit and receive them. Preferably, an optical I / O communication device conforming to the standard SEMI E84 established by the international industry group SEMI (Semiconductor Equipment and Materials International) for semiconductor manufacturing equipment, materials, etc. is used. In the EFEM 25 of the present embodiment, the transmitting and receiving portions of the optical I / O communication devices 31-1 and 31-2 connected to each of the load ports 18-1 and 18-2 are arranged in the ceiling portion of the EFEM 25 at positions where optical I / O communication can be performed with the transmitting and receiving portion of the optical I / O communication device 31-0 provided in the OHT carriage 11 when the OHT carriage 11 moves to a position where the FOUP 3 can be transferred to / from the load ports 18-1 and 18-2. In addition, the optical I / O communication devices 31-1 and 31-2 connected to each of the load ports 18-1 and 18-2 may be fixed in a manner other than to the ceiling portion of the EFEM 25. For example, they may be fixed to the track 26a.

[0050] The EFEM 25 of this embodiment has two load ports 18-1 and 18-2. For the load ports 18-1 and 18-2 of the EFEM 25, when viewed from the front, the left load port 18-1 is given the identification number of port 1, and the right load port 18-2 is given the identification number of port 2. In addition, by additionally arranging two FOUP transfer devices 1-1 and 1-2 near the load ports 18-1 and 18-2 respectively, the EFEM 25 of the two ports substantially has the function of placing four-port amounts of FOUPs 3. The first FOUP transfer device 1-1 of this embodiment is located on the left side of the load port 18-1 (port 1) and is arranged adjacent to the load port 18-1 (port 1) when viewed from the front. The second FOUP transfer device 1-2 is located on the right side of the load port 18-2 (port 2) and is arranged adjacent to the load port 18-2 (port 2) when viewed from the front. In addition, the first FOUP transfer device 1-1 is given the identification number of port 3, and the second FOUP transfer device 1-2 is given the identification number of port 4. In addition, the load ports 18-1 and 18-2 of the EFEM 25 are arranged on a track 26a extending in the X direction. The first FOUP transfer device 1-1 and the second FOUP transfer device 1-2 provided near the load ports 18-1 and 18-2 are also arranged directly below the track 26a extending in the X direction in the same manner as these load ports 18-1 and 18-2, and are set to be able to transfer the FOUP 3 with the OHT cart 11. In other words, the load ports 18-1 and 18-2 and the FOUP transfer devices 1-1 and 1-2 are arranged in a state of being arranged in the X direction in a manner consistent with the track 26a extending in the X direction. And, at the position on the track 26a above the first FOUP transfer device 1-1 and the second FOUP transfer device 1-2, and where the OHT cart 11 transfers the FOUP 3 between the first FOUP transfer device 1-1 and the second FOUP transfer device 1-2, an identification mark (not shown in the figure) for the OHT cart 11 to identify the position is provided.

[0051] The FOUP transfer mechanism 5-1 of the first FOUP transfer device 1-1 in this embodiment includes an arm portion 7-1 having a length dimension capable of transferring the FOUP 3 between the first FOUP transfer device 1-1 (port 3) and port 1. The FOUP transfer mechanism 5-2 of the second FOUP transfer device 1-2 includes an arm portion 7-2 having a length dimension capable of transferring the FOUP 3 between the second FOUP transfer device 1-2 (port 4) and port 2. In addition, the first FOUP transfer device 1-1 and the second FOUP transfer device 1-2 have a symmetric structure when observed in the drawing. The rotation axis C1 of the FOUP transfer mechanism 5-1 of the first FOUP transfer device 1-1 is arranged at the right end of the first FOUP transfer device 1-1, that is, at a position close to the loading port 18-1 when observed in the drawing. In contrast, the rotation axis C1' of the FOUP transfer mechanism 5-2 of the second FOUP transfer device 1-2 is arranged at the left end of the second FOUP transfer device 1-2, that is, at a position close to the loading port 18-2 when observed in the drawing. Thus, the first FOUP transfer device 1-1 can move the FOUP 3 between port 1 adjacent to the right side, and the second FOUP transfer device 1-2 can move the FOUP 3 between port 2 adjacent to the left side.

[0052] Next, the communication between the FOUP transfer device 1 in this embodiment and the OHT 26 will be described. Figure 7 FIG. is a block diagram showing the communication system of the EFEM 25 before adding the FOUP transfer devices 1-1 and 1-2 of this embodiment. Figure 8 FIG. is a block diagram showing the communication systems of the EFEM 25 and the respective FOUP transfer devices 1-1 and 1-2 after adding the FOUP transfer devices 1-1 and 1-2 of this embodiment. The EFEM 25 has a control device 27. The control device 27 communicates between the loading ports 18-1 and 18-2 that open and close the lid of the FOUP 3, the wafer transfer robot that transfers the wafer between the FOUP 3 and the processing device, and the wafer aligner that positions the wafer, thereby grasping the operation status of each mechanism and sending operation instructions to these respective mechanisms according to the pre-stored operation program. In addition, the control device 27 also exchanges operation information with the processing device arranged on the back surface of the EFEM 25. Moreover, the control device 27 also exchanges information related to the processing process with the main computer 28 that manages the manufacturing process of the semiconductor manufacturing factory F.

[0053] The host computer 28 has a communication mechanism for communicating with communication terminals of each processing device provided in the semiconductor manufacturing plant F, a storage mechanism for pre-storing programs and communication records with each terminal, and an arithmetic device. The host computer 28 further includes an MES (Manufacturing Execution System) 29 that manages the manufacturing processes of the entire plant, and an MCS (Material Control System) 30 that controls the operations of FOUP transfer equipment 3 and stockers 33 in the plant, receives signals from the MES 29, and issues conveyance instructions to FOUP transfer equipment such as the OHT 26. According to the progress status of the EFEM 25, the MCS 30 issues instructions to the OHT 26 to supply the FOUP 3 to the EFEM 25 or to retrieve the FOUP 3 from the EFEM 25. The MES 29 is an integrated production information system that plays a central role in managing various information in the semiconductor manufacturing plant F, and provides production support and management such as process management, lot management, and progress management. In addition, the MCS 30 manages the FOUP 3 containing wafers and the empty FOUP 3 according to the manufacturing processes pre-stored in the storage mechanism, and sends conveyance instructions to the control mechanisms of the stocker 33 and the OHT 26. In the MCS 30, the position information of each load port 18-1, 18-2 in the semiconductor manufacturing plant F is pre-registered by the operator, and the MCS 30 issues a conveyance instruction for the FOUP 3 to the OHT 26 based on this information. In addition, information on newly installed FOUP transfer devices 1-1, 1-2 in the semiconductor manufacturing plant F is also registered in the MCS 30 by the operator at the time of installation.

[0054] When receiving a FOUP transfer instruction from the MCS 30, the stocker 33 hands over the FOUP 3 loaded with semi-finished products or the empty FOUP 3 to the predetermined OHT carriage 11 of the OHT 26. When the OHT carriage 11 moves above the indicated loading ports 18-1 and 18-2, it confirms whether the FOUP 3 can be placed between it and the loading ports 18-1 and 18-2, and when it receives a signal indicating that it can be placed from the loading ports 18-1 and 18-2, it places the FOUP 3. In addition, the OHT carriage 11 moves to above the specified loading ports 18-1 and 18-2 in an empty state without holding the FOUP 3. After communicating with the loading ports 18-1 and 18-2, it retrieves the FOUP 3 placed on the placement tables 24-1 and 24-2 of the loading ports 18-1 and 18-2 and transports it to the stocker 33. Furthermore, the optical I / O communication device 31-0 of the FOUP transfer devices 1-1 and 1-2, the loading ports 18, and the OHT carriage 11 in the present embodiment is a communication device that conforms to the SEMI (Semiconductor Equipment and Materials International) standard established by the international industry group related to semiconductor manufacturing equipment. It transmits and receives the required data to and from each other using infrared rays.

[0055] Next, the communication method between the FOUP transfer devices 1-1 and 1-2 of the present embodiment and the load ports 18 will be described. The FOUP transfer devices 1-1 and 1-2 of the present embodiment are provided near the load ports 18-1 and 18-2 of the EFEM 25 already installed in the semiconductor manufacturing factory F. As described above, the load ports 18-1 and 18-2 of the EFEM 25 are respectively provided with optical I / O communication devices 31-1 and 31-2, and each transceiver unit is fixed to the ceiling portion of the EFEM 25 in such a manner that the OHT cart 11 of the OHT 26 is disposed directly above each of the FOUP transfer devices 1-1 and 1-2. In addition, each of the FOUP transfer devices 1-1 and 1-2 is also provided with optical I / O communication devices 31-3 and 31-4, and each transceiver unit is fixed to the ceiling portion of the EFEM 25 in such a manner that the OHT cart 11 of the OHT 26 is disposed directly above each of the FOUP transfer devices 1-1 and 1-2. Thus, the already installed load ports 18-1 and 18-2 and the newly added FOUP transfer devices 1-1 and 1-2 have a structure in which the optical I / O communication devices 31-1 to 4 can communicate with the OHT cart 11 independently. However, in the case where each of the load ports 18-1 and 18-2 communicates with each of the FOUP transfer devices 1-1 and 1-2 independently with the OHT cart 11, in order to change the program of the control device 27 of the EFEM 25 and the communication settings, it is necessary to temporarily cut off the power supply of the EFEM 25 itself, and the modification of each device accompanying the additional installation of the FOUP transfer devices 1-1 and 1-2 will take a lot of time.

[0056] Therefore, the FOUP transfer devices 1-1 and 1-2 of the present embodiment have the following structure, in which not only can optical I / O communication be performed with the OHT cart 11, but also the optical I / O communication performed between the adjacent load ports 18-1 and 18-2 and the OHT cart 11 can be performed instead of the load ports 18-1 and 18-2. Specifically, the FOUP transfer device 1-1 (port 3) adjacent to the left of the load port 18-1 provided at the first port not only performs optical I / O communication with the OHT cart 11 serving as the third port, but also performs optical I / O communication with the OHT cart 11 serving as the first port instead of the load port 18-1. In addition, the FOUP transfer device 1-2 (port 4) adjacent to the right of the load port 18-2 provided at the second port not only performs optical I / O communication with the OHT cart 11 serving as the fourth port, but also performs optical I / O communication with the OHT cart 11 serving as the second port instead of the load port 18-2 (port 2).

[0057] Moreover, the FOUP transfer devices 1-1 and 1-2 are provided with a control PC 32 that communicates with the MCS 30 possessed by the semiconductor manufacturing factory F. The control PC 32 exchanges the operation information of the loading ports 18-1 and 18-2 and the operation information of the OHT 26 between the two FOUP transfer devices 1-1 and 1-2 and the MCS 30. In addition, the communication between the control PC 32 of the present embodiment and the MCS 30 is carried out over Ethernet (registered trademark). With the above structure, without imposing major changes on the control units of the EFEM 25 and the loading ports 18-1 and 18-2, the FOUP transfer devices 1-1 and 1-2 can be assembled into the network system of the semiconductor manufacturing factory F. In addition, since the control PC 32 is in a relatively small box shape, it can be housed in the internal space of the housing 2 of the FOUP transfer devices 1-1 and 1-2, or can also be housed in the internal space of the EFEM 25.

[0058] The control units 10-1 and 10-2 of the FOUP transfer devices 1-1 and 1-2 of the present embodiment at least include a CPU, a communication mechanism for communicating with other devices, and a storage mechanism for storing operation programs and various data. The communication mechanism of the control units 10-1 and 10-2 includes an LP communication mechanism for communicating between the adjacent loading ports 18-1 and 18-2, an optical I / O communication mechanism for communicating with the OHT cart 11 via the optical I / O communication devices 31-3 and 31-4, and a PC communication mechanism for communicating with the control PC 32 that uniformly controls the FOUP transfer devices 1-1 and 1-2. In addition, the optical I / O communication mechanism of the control units 10-1 and 10-2 of the present embodiment is connected to the second optical I / O communication devices 31-1 and 31-2 possessed by the loading ports 18-1 and 18-2 in addition to the first optical I / O communication devices 31-3 and 31-4 possessed by the FOUP transfer devices 1-1 and 1-2. Thereby, in addition to communicating with the OHT cart 11 via the first optical I / O communication devices 31-3 and 31-4 possessed by the FOUP transfer devices 1-1 and 1-2, the control units 10-1 and 10-2 can also communicate with the OHT cart 11 via the second optical I / O communication devices 31-1 and 31-2 originally possessed by the loading ports 18-1 and 18-2 on behalf of the respective loading ports 18-1 and 18-2.

[0059] In addition, the control units 10-1 and 10-2 send signals corresponding to the signals received via the first optical I / O communication devices 31-3 and 31-4. For the signals received via the second optical I / O communication devices 31-1 and 31-2 of the original loading ports 18-1 and 18-2, the control units 10-1 and 10-2 send signals suitable for the states of the loading ports 18-1 and 18-2 obtained via an LP communication mechanism (not shown in the figure) to the OHT cart 11 via the second optical I / O communication devices 31-1 and 31-2. In addition, in addition to the FOUP transfer devices 1-1 and 1-2 recognizing the states of the loading ports 18-1 and 18-2 as described above, the LP communication mechanism is also used to notify the start of operation to the loading ports 18-1 and 18-2 when transferring the FOUP 3 between the FOUP transfer devices 1-1 and 1-2 and the loading ports 18-1 and 18-2.

[0060] The control PC 32 communicates between the control units 10-1 and 10-2 of the FOUP transfer devices 1-1 and 1-2 and the MCS 30. In addition, the control PC 32 can not only control the two FOUP transfer devices 1-1 and 1-2 of the present embodiment, but also uniformly control other multiple FOUP transfer devices 1 within the limit of the number of ports of the communication port. The communication between the control PC 32 and the MCS 30 is carried out on Ethernet (registered trademark), sending the signals sent from the MCS 30 to each FOUP transfer device 1-1 and 1-2, and sending the signals sent from each FOUP transfer device 1-1 and 1-2 to the MCS 30.

[0061] Here, it should be noted that the EFEM 25 sends the device state to the MES 29 that manages the overall process of the semiconductor manufacturing plant F or receives control signals from the MES 29. In contrast, the FOUP transfer devices 1-1 and 1-2 of the present embodiment communicate with the MCS 30 via the control PC 32. The MCS 30 is connected to the transfer equipment set in the semiconductor manufacturing plant F and plays a role in uniformly controlling the transfer commands for each transfer equipment. In addition, the MCS 30 moves the FOUP 3 housed in the cassette 33 to the FOUP transfer devices 1-1 and 1-2 at a stage before the required time, and immediately sends an instruction at the required time to transfer the FOUP 3 from the FOUP transfer devices 1-1 and 1-2 to the loading ports 18-1 and 18-2, thereby shortening the waiting time of the loading ports 18-1 and 18-2 for the FOUP 3.

[0062] Next, the operations of the FOUP transfer devices 1-1 and 1-2 and the OHT cart 11 of the present embodiment will be described in detail. Figure 9 A and Figure 9 B,Figure 10 A and Figure 10 B, Figure 11 A and Figure 11 B represent the EFEM 25 of the FOUP transfer device 1-1 of the present embodiment shown in Figure 5 FIG. showing the operation of transferring the FOUP 3 between the FOUP transfer device 1-1 and the load port 18-1. A first FOUP 3-1 is placed on the load port 18-1 (port 1), and the first FOUP 3-1 houses a predetermined wafer to be processed by the processing device next. The first FOUP 3-1 was previously on standby on the placement table 4-1 of the FOUP transfer device 1-1 and was transferred to the stage 24-1 of the load port 18-1 by the arm 7-1 of the FOUP transfer device 1-1. The first FOUP 3-1 opens the lid through the load port 18-1, and the unprocessed wafers in the first FOUP 3-1 are sequentially transported to the processing device. Then, the wafers that have been subjected to the predetermined processing by the processing device are then transported to the FOUP 3 that houses the processed wafers placed on the load port 18-2.

[0063] At this time, the host computer 28 sends a signal requesting the FOUP transfer device 1-1 to notify the state of the device to the FOUP transfer device 1-1 via the control PC 32. The FOUP transfer device 1-1 that has received the signal from the host computer 28 sends a signal indicating that a new FOUP 3 can be placed on the placement table 4-1 to the host computer 28 via the control PC 32. Here, the arm 7-1 of the FOUP transfer device 1-1 stands by at a position where it does not interfere with the lifting operation of the lifting mechanism 11a of the OHT cart 11 and the operation of the load port 18-1.

[0064] The host computer 28 that has received the signal from the FOUP transfer device 1-1 operates the stocker 33 and the OHT cart 11 of the OHT 26 to move the second FOUP 3-2 housing the unprocessed wafers to a predetermined position directly above the FOUP transfer device 1-1 (port 3). Refer to Figure 9A. Before the OHT cart 11 that transports the second FOUP 3-2 to a predetermined position lowers the second FOUP 3-2, it sends a signal requesting to place the second FOUP 3-2 to the first optical I / O communication device 31-3 of the FOUP transfer device 1-1 via the optical I / O communication device 31-0. If the FOUP transfer device 1-1 that receives this signal is in a state where a FOUP can be placed, it sends an approval (ACK) signal. If it is in a non-placeable state, it sends a non-approval (NACK) signal to the OHT cart 11 via the first optical I / O communication device 31-3. If the OHT cart 11 receives an approval (ACK) signal from the FOUP transfer device 1-1, it operates the lifting mechanism 11a to place the second FOUP 3-2 on the placement table 4-1 of the FOUP transfer device 1-1. See Figure 9 B. The second FOUP 3-2 contains wafers that have not been processed by the processing device, just like the first FOUP 3-1, and waits on the placement table 4-1 until the first FOUP 3-1 is removed from the placement table 24-1 of the load port 18-1.

[0065] Then, when all the wafers contained in the first FOUP 3-1 are transported to the processing device, the host computer 28 moves the OHT cart 11 to a predetermined position directly above the load port 18-1 in order to recover the emptied first FOUP 3-1 placed at the load port 18-1 (port 1). Then, the OHT cart 11 sends a signal requesting to recover the first FOUP 3-1 to the load port 18-1 via the optical I / O communication device 31-0. Here, the second optical I / O communication device 31-1 of the load port 18-1 is changed to be connected to the control unit 10-1 inside the FOUP transfer device 1-1 when the FOUP transfer device 1-1 is set up. Therefore, the FOUP transfer device 1-1 (port 3) receives the signal sent from the optical I / O communication device 31-0 of the OHT cart 11 that has moved directly above the load port 18-1 (port 1) to the second optical I / O communication device 31-1 of the load port 18-1 (port 1) instead of the load port 18-1 (port 1). See Figure 10 A.

[0066] After communicating with the load port 18-1 (port 1), the FOUP transfer device 1-1 (port 3) that receives the signal from the OHT cart 11 sends an approval (ACK) signal or a non-approval (NACK) signal to the OHT cart 11 via the second optical I / O communication device 31-1.

[0067] There are inventory detection sensors in the loading ports 18-1 and 18-2 for detecting whether FOUPs 3-1 and 3-2 are placed on the stages 24-1 and 24-2 and whether they are placed normally. Based on the detection results of the inventory detection sensors, the loading port 18-1 identifies that there is nothing placed on the stage 24-1 and sends a signal indicating that there is no inventory on the stage 24-1 to the FOUP transfer device 1-1. After receiving the signal from the loading port 18-1, the FOUP transfer device 1-1 operates the arm 7-1 to transfer the second FOUP 3-2 placed on the stage 4-1 to the stage 24-1 of the adjacent loading port 18-1. See Figure 10 B. In addition, each FOUP transfer device 1-1 sends the same signal as the signal sent to the OHT cart 11 to the host computer 28 via the control PC 32 as needed. When receiving the signal for retrieval permission, the OHT cart 11 operates the lifting mechanism 11a and the FOUP holding mechanism to retrieve the first FOUP 3-1 placed on the loading port 18-1. Then, the OHT cart 11 transports the first FOUP 3-1 to the transport destination designated by the host computer 28.

[0068] After the loading port 18-1 (port 1) where the second FOUP 3-2 is placed by the FOUP transfer device 1-1 fixes the second FOUP 3-2 to the stage 24-1 using the fixing unit, it performs the action of opening the lid of the second FOUP 3-2. Then, the unprocessed wafers in the second FOUP 3-2 are sequentially transported to the processing device, and the wafers that have undergone the predetermined processing by the processing device are transported to the FOUP 3 that houses the processed wafers placed in the loading port 18-2. In addition, when the action of opening the lid of the second FOUP 3-2 ends, the loading port 18-1 sends a wafer removable signal to the control device 27 of the EFEM 25. Also, the EFEM 25 that receives the wafer transportable signal from the loading port 18-1 operates the transport robot, sends an instruction to take out the wafer from the second FOUP 3-2 of the loading port 18-1 and transport it to the processing device, and resumes the wafer processing action again. Also, it sends an instruction to transport the processed wafer from the processing device to the FOUP 3 set in the loading port 18-2. Since the control device 27 of the EFEM 25 is originally electrically connected to the loading port 18-1, there is no need to add wiring, etc. when setting the FOUP transfer devices 1-1 and 1-2.

[0069] Next, the FOUP transfer device 1-1 that transfers the second FOUP 3-2 to the adjacent load port 18-1 sends a transfer completion signal to the control PC 32. The control PC 32 that receives the signal sends a signal indicating that the FOUP transfer device 1-1 can place the next FOUP 3 to the host computer 28. The host computer 28 that receives the placeable signal sends a FOUP transfer signal to the FOUP transfer device 1-1 to the stocker 33 and the OHT 26 shown in Figure 4 The stocker 33 and the OHT 26 that receive the transfer signal from the host computer 28 take out the third FOUP 3-3 containing unprocessed wafers from the shelf of the stocker 33 and move it to a predetermined position directly above the FOUP transfer device 1-1 using the OHT cart 11. In addition, the arm 7-1 of the FOUP transfer device 1-1 stands by at a position where it does not interfere with the lifting operation of the lifting mechanism 11a of the OHT cart 11 and the operation of the load port 18-1. Refer to Figure 11 A.

[0070] Before lowering the third FOUP 3-3 to the predetermined position, the OHT cart 11 that transports the third FOUP 3-3 sends a signal requesting to place the third FOUP 3-3 to the first optical I / O communication device 31-3 of the FOUP transfer device 1-1 via the optical I / O communication device 31-0. If the FOUP transfer device 1-1 that receives this signal is in a FOUP placeable state, it sends an approval (ACK) signal, and if it is in a non-placeable state, it sends a non-approval (NACK) signal to the OHT cart 11 via the first optical I / O communication device 31-3. If the OHT cart 11 receives an approval (ACK) signal from the FOUP transfer device 1-1, it operates the lifting mechanism 11a to place the third FOUP 3-3 on the placement table 4-1 of the FOUP transfer device 1-1. Refer to Figure 11 B. The third FOUP 3-3, like the first FOUP 3-1 and the second FOUP 3-2, contains wafers that have not been processed by the processing device and waits on the placement table 4-1 until the second FOUP 3-2 is removed from the placement table 24-1 of the load port 18-1.

[0071] Above, a series of FOUP transfer operations performed by the FOUP transfer device 1-1 are completed. In addition, the FOUP transfer device 1-2 (port 4) provided near the load port 18-2 (port 2) basically performs the same operations as the FOUP transfer device 1-1. The FOUP transfer device 1-2 (port 4) performs optical I / O communication with the OHT cart 11 via the first optical I / O communication device 31-4 and the second I / O communication device 31-2, and supplies and retrieves the FOUP 3 to and from the load port 18-2 (port 2).

[0072] By using the FOUP transfer device 1-1 of the present embodiment as described above, after the first FOUP 3-1 placed on the load port 18-1 (port 1) is retrieved by the OHT cart 11, the FOUP transfer device 1-1 (port 3) can supply the second FOUP 3-2 to the load port 18-1 (port 1). Thus, the EFEM 25 can minimize the time for stopping the wafer supply operation. In addition, by using the FOUP transfer devices 1-1 and 1-2 of the present embodiment, an efficient FOUP 3 replacement operation can be performed only by performing a simple modification operation on the existing transfer device.

[0073] Next, other embodiments of the present invention will be described. The FOUP transfer devices 1-1 and 1-2 of the first embodiment of the present invention are arranged in a row of load ports 18-1 and 18-2 that are arranged directly below one OHT track 26a and arranged in a column in the X direction. However, the FOUP transfer devices 34-1 and 34-2 of the second embodiment are arranged so as to be offset in the Y direction with respect to the row in which the load ports 18-1 and 18-2 are arranged and parallel to the X direction. In the semiconductor manufacturing factory F, in order to quickly transfer the FOUP 3, in addition to the track 26a of the OHT 26, a second track 26b extending parallel to the track 26a is sometimes provided, and the FOUP transfer devices 34-1 and 34-2 of the second embodiment of the present invention are arranged at a position directly below such a second track 26b.

[0074] Figure 12The figure showing the positional relationship between the FOUP transfer devices 34-1 and 34-2 of the present embodiment and the load ports 18-1 and 18-2. In the semiconductor manufacturing factory F where the FOUP transfer devices 34-1 and 34-2 of the present embodiment are provided, in addition to the first track 26a, a second track 26b that is separated from the first track 26a in the Y direction and extends parallel to the first track 26a is also laid. The FOUP transfer device 34-1 of the present embodiment is arranged at a position separated from the load port 18-1 in the Y direction and directly below the second track 26b. In addition, the FOUP transfer device 34-2 of the present embodiment is arranged at a position separated from the load port 18-2 in the Y direction and directly below the second track 26b. In addition, the arm 7-3 of the FOUP transfer device 34-1 has a length that can transfer the FOUP 3 between the load port 18-1, and the arm 7-4 of the FOUP transfer device 34-2 has a length that can transfer the FOUP 3 between the load port 18-2. And, the rotation axis C3 of the arm 7-3 and the rotation axis C3' of the arm 7-4 are arranged at the front ends of the FOUP transfer devices 34-1 and 34-2, that is, at positions close to the load ports 18-1 and 18-2 when observed in the drawing. Thus, the FOUP transfer device 34-1 can move the FOUP 3 between the load port 18-1 (port 1) arranged in the front, and the FOUP transfer device 34-2 can move the FOUP 3 between the load port 18-2 (port 2) arranged in the front.

[0075] In addition, although not shown in the figure, the first optical I / O communication devices of the FOUP transfer devices 34-1 and 34-2 of the present embodiment are configured such that when the OHT cart 11-1 moving on the second track 26b moves directly above the FOUP transfer devices 34-1 and 34-2, communication can be performed between the OHT cart 11-1 and the FOUP transfer devices 34-1 and 34-2. In addition, the connection of other electrical components has the same structure as that of the first embodiment. The communication between the second optical I / O communication device 31-1 of the load port 18-1 and the optical I / O communication device 31-0 of the OHT cart 11 is performed through the FOUP transfer device 34-1, and the communication between the second optical I / O communication device 31-2 of the load port 18-2 and the optical I / O communication device 31-0 of the OHT cart 11 is performed through the FOUP transfer device 34-2. With the above structure, the FOUP transfer devices 34-1 and 34-2 can exchange the FOUP 3 for the load ports 18-1 and 18-2 in the same manner as the FOUP transfer devices 1-1 and 1-2 of the first embodiment.

[0076] In the first and second embodiments of the present invention described above, the FOUP transfer devices 1-1, 1-2, 34-1, and 34-2 having the placement table 4 for placing one FOUP 3 are described. However, the present invention is not limited thereto, and it is also possible to have a plurality of placement tables 4 for placing the FOUP 3. Figure 14 FIG. is a perspective view of the FOUP transfer device 39 showing the third embodiment of the present invention, Figure 15 and FIG. is its front view. In addition, Figure 16 FIG. is a view of the FOUP transfer device 39 as viewed from above. The FOUP transfer device 39 of the present embodiment includes a support 40 assembled in a rectangular parallelepiped shape, a vertical plate 41 fixed to the support 40, a plurality of placement tables 4-3 to 4-8 fixed to the vertical plate 41 at intervals in the vertical direction (Z direction), and a FOUP transfer mechanism 42 for transferring the FOUP 3 between each of the placement tables 4-3 to 4-8 and each of the loading ports 18-1 and 18-2.

[0077] The FOUP transfer device 39 is provided on the front surface of the EFEM 25. Six placement tables 4-3 to 4-8 for placing the FOUP 3 are provided on the vertical plate 41. Each of the placement tables 4-3 to 4-8 is provided in three layers at intervals larger than the height dimension of the FOUP 3 in the vertical direction, and is arranged on the left and right sides of the EFEM 25. In addition, each of the placement tables 4-3 to 4-8 stacked in three layers constitutes one storage unit S1, S2. Further, preferably, the placement tables 4-7 and 4-8 provided at the lowermost layer of each of the storage units S1 and S2 are set to be substantially the same height as the placement tables 24-1 and 24-2 provided in each of the loading ports 18-1 and 18-2, or are arranged at a position slightly higher than the placement tables 24-1 and 24-2.

[0078] The FOUP transfer mechanism 42 included in the FOUP transfer device 39 includes a holding portion 6 that holds the top flange 3a of the FOUP 3, a horizontal drive mechanism 43 that supports the holding portion 6 and moves it in the horizontal direction (X direction), and a pair of left and right vertical drive mechanisms 44 that support the horizontal drive mechanism 43 and move it in the vertical direction (Z direction). The horizontal drive mechanism 43 and the vertical drive mechanism 44 each have a motor as a drive source, and the holding portion 6 is moved to a specified position by rotating the motor forward or backward. The operations of the motors included in the horizontal drive mechanism 43 and the vertical drive mechanism 44 and the holding portion 6 are controlled by a control unit 10-3 included in the FOUP transfer mechanism 42.

[0079] Each of the storage units S1 and S2 included in the FOUP transfer mechanism 42 is located adjacent to the placement tables 24-1 and 24-2 in a plan view, and is arranged directly below the track 26a of the OHT 26 laid directly above the placement tables 24-1 and 24-2. Refer to Figure 16By being disposed directly below the rail 26a of the OHT 26, it is possible to transfer the FOUP 3 between the upper most placement tables 4-3 and 4-4 disposed in the respective storage units S1 and S2 on the left and right and the OHT carriage 11. In addition, since the respective storage units S1 and S2 do not protrude into the space directly above the loading ports 18-1 and 18-2, the FOUP 3 transfer operation between the loading ports 18-1 and 18-2 and the OHT carriage 11 is not obstructed.

[0080] By providing the FOUP transfer device 39 of the present embodiment above the loading ports 18-1 and 18-2, the optical I / O communication devices 31-1 and 31-2 respectively connected to the loading ports 18-1 and 18-2 are fixed at predetermined positions on the bracket 40 of the FOUP transfer device 39. The OHT carriage 11 communicates via the optical I / O communication device 31-1 when exchanging the FOUP 3 with the placement table 24-1, and communicates via the optical I / O communication device 31-2 when exchanging the FOUP 3 with the placement table 24-2. In addition, on the bracket 40 of the FOUP transfer device 39, an optical I / O communication device 31-5 used when the OHT carriage 11 exchanges the FOUP 3 with the placement table 4-3 and an optical I / O communication device 31-6 used when exchanging the FOUP 3 with the placement table 4-4 are fixed at specified positions. In addition, these optical I / O communication devices 31-1, 31-2, 31-5, and 31-6 are connected to the control unit 10-3 provided in the FOUP transfer device 39 of the present embodiment, and when the FOUP 3 is exchanged, the control unit 10-3 performs optical I / O communication with the OHT carriage 11.

[0081] Each storage unit S1, S2 is respectively provided with three placement tables 4-3 to 4-8 at intervals in the vertical direction. The OHT cart 11 exchanges the FOUP 3 between the placement tables 4-3, 4-4 disposed at the uppermost layer of each storage unit S1, S2. The FOUP 3 placed on the uppermost placement tables 4-3, 4-4 is transferred to the predetermined placement tables 24-1, 24-2 by the FOUP transfer mechanism 42 of the FOUP transfer device 39, or is transferred to other placement tables 4-5 to 4-8 of the storage units S1, S2. In addition, when all the processes of the wafer W are completed, the FOUP 3 containing the processed wafer W is transferred from the placement tables 24-1, 24-2 to the placement tables 4-3 to 4-8 of the storage units S1, S2, and the new FOUP 3 containing the wafer W before processing is transferred from the placement tables 4-3 to 4-8 to the placement tables 24-1, 24-2 in the state where the FOUP 3 is not placed. In addition, each placement table 4-3 to 4-8 of the storage units S1, S2, like the placement tables 24-1, 24-2, is provided with an inventory detection sensor for detecting whether the FOUP 3 is placed and whether the FOUP 3 is placed normally. The inventory detection sensors of each placement table are electrically connected to the control unit 10-3.

[0082] In the FOUP transfer device 39 of the present embodiment, the placement location of the FOUP 3 can be appropriately changed as follows: the uppermost placement tables 4-3, 4-4 are used to exchange the FOUP 3 between the uppermost placement tables 4-3, 4-4 and the OHT cart 11, and the remaining placement tables 4-5 to 4-8 are used to temporarily store the FOUP 3. Thus, even if the arrival timing of the OHT cart 11 is delayed, the supply and removal of the FOUP 3 to and from the loading ports 18-1, 18-2 can be performed without waiting time.

[0083] The FOUP transfer device 39 of the present embodiment is provided with a control unit 10-3, which controls the supply and removal of the FOUP 3 to and from the placement tables 24-1, 24-2 and each placement table 4-5 to 4-8. In addition to controlling the transfer of the FOUP 3 with respect to the uppermost placement table 4 between the OHT cart 11, the control unit 10-3, in the same manner as in the first and second embodiments, controls the transfer of the FOUP 3 with respect to the loading ports 24-1, 24-2 between the OHT cart 11 instead of the loading ports 18-1, 18-2. See Figure 17 . By forming the above structure, the modification work on the already installed EFEM 25 can be minimized as much as possible, and the productivity of the entire wafer processing device can be improved.

[0084] When placing the FOUP 3 carried by the OHT cart 11 on the loading port 18-1 (port 1) of the EFEM 25, the OHT cart 11 moves directly above the mounting table 24-1 of the loading port 18-1. Before lowering the FOUP 3, a signal requesting the placement of the second FOUP 3-2 is sent to the optical I / O communication device 31-1 via the optical I / O communication device 31-0. The FOUP transfer device 39 that receives this signal communicates with the loading port 18-1. If the loading port 18-1 is in a state where the FOUP can be placed, an approval (ACK) signal is sent. If the loading port 18-1 is in a non-placeable state, a non-approval (NACK) signal is sent to the OHT cart 11 via the first optical I / O communication device 31-1. If the OHT cart 11 receives an approval (ACK) signal from the FOUP transfer device 39, the lifting mechanism 11a is operated to place the FOUP 3 on the mounting table 24-1 of the loading port 18-1. In addition, the communication operation of the above-mentioned FOUP transfer device 39 is also carried out in the same manner for the loading port 18-2 (port 2). The OHT cart 11 and the control unit 10-3 perform communication related to the exchange of the FOUP 3 via the optical I / O communication device 31-2 corresponding to the loading port 18-2. In addition, not only when placing the FOUP 3 from the OHT cart 11 on the loading ports 18-1 and 18-2, but also when transferring the FOUP 3 placed on the loading ports 18-1 and 18-2 to the OHT cart 11, the above communication operation is performed.

[0085] Next, the operation in the case where the FOUP 3 carried by the OHT cart 11 is placed on the respective placement tables 4-3 to 4-8 of the FOUP transfer device 39 will be described. When the FOUP 3 is transferred between the OHT cart 11 and the FOUP transfer device 39, the placement tables 4-3 and 4-4 arranged at the uppermost layer of the left and right storage units S1 and S2 among the plurality of placement tables 4-3 to 4-8 provided in the FOUP transfer device 39 are used. When the FOUP 3 carried by the OHT cart 11 is placed on the placement table 4-3 (port 5) at the uppermost layer of the storage unit S1 provided in the FOUP transfer device 39, the OHT cart 11 moves to directly above the placement table 4-3, and before lowering the FOUP 3, a signal requesting placement of the FOUP 3 is sent to the optical I / O communication device 31-5 via the optical I / O communication device 31-0. The FOUP transfer device 39 that receives this signal confirms the signal of the presence / absence sensor of the FOUP 3 provided on the placement table 4-3. If the placement table 4-3 is in a state where the FOUP can be placed, an approval (ACK) signal is sent, and if the placement table 4-3 is in a non-placeable state, a non-approval (NACK) signal is sent to the OHT cart 11 via the optical I / O communication device 31-5. If the OHT cart 11 receives the approval (ACK) signal from the FOUP transfer device 39, the lifting mechanism 11a is operated to place the FOUP 3 on the placement table 4-3.

[0086] When it is detected that the FOUP 3 is placed on the placement table 4-3, the control unit 10-3 operates the FOUP transfer mechanism 42, the horizontal drive mechanism 43, and the vertical drive mechanism 44 to transfer the FOUP 3 to other placement tables 4-4 to 4-6, or directly place the FOUP 3 on the placement table 4-3. Then, after being in a state where the FOUP 3 can be transferred to the loading ports 18-1 and 18-2, the FOUP 3 is transferred to the placement table 24-1 of the loading port 18-1 or the placement table 24-2. In addition, the above-described communication operation of the FOUP transfer device 39 is also performed in the same manner for the placement table 4-4 (port 8) arranged at the uppermost layer of the storage unit S2. The OHT cart 11 and the control unit 10-3 perform communication related to the exchange of the FOUP 3 via the optical I / O communication device 31-6 corresponding to the placement table 4-4. In addition, the above-described communication operation is performed not only when the FOUP 3 is placed on the placement tables 4-3 and 4-4 from the OHT cart 11, but also when the FOUP 3 placed on the placement tables 4-3 and 4-4 is transferred to the OHT cart 11.

[0087] As described above, the present invention has been described in detail by various embodiments, but the present invention is not limited to these embodiments, and various modifications can be made without departing from the gist thereof. For example, the communication devices included in the OHT cart 11 and the FOUP transfer devices 1-1, 1-2, 34-1, 34-2, 39 are not limited to the optical I / O communication devices 31-0 to 31-6, and the present invention can also be applied to communication devices conforming to wireless communication standards such as wireless LAN and Bluetooth (registered trademark). In addition, instead of moving the FOUP 3 along an arc-shaped track by using the arm portion 7, the FOUP 3 may be moved along various tracks. Further, the number of the mounting tables 4 provided in each storage unit S1, S2 can also be appropriately increased or decreased.

[0088] Description of reference numerals:

[0089] Reference numeral 1, 1-1, 1-2 denote the first FOUP transfer device;

[0090] Reference numeral 2 denotes the housing;

[0091] Reference numeral 3 denotes the FOUP;

[0092] Reference numeral 3a denotes the top flange;

[0093] Reference numerals 4, 4-1, 4-3 to 4-8 denote the mounting tables;

[0094] Reference numerals 5, 5-1, 5-2 denote the FOUP transfer mechanisms;

[0095] Reference numeral 6 denotes the holding portion;

[0096] Reference numerals 7, 7-1, 7-2, 7-3, 7-4 denote the arm portions;

[0097] Reference numeral 8 denotes the arm drive mechanism;

[0098] Reference numeral 9 denotes the lifting mechanism;

[0099] Reference numerals 10, 10-1, 10-2, 10-3 denote the control portions;

[0100] Reference numeral 11 denotes the transfer cart (OHT cart);

[0101] Reference numeral 11a denotes the lifting mechanism;

[0102] Reference numeral 12 denotes the FOUP support pin;

[0103] Reference numeral 13 denotes the FOUP support member;

[0104] Reference numeral 14 denotes the cylinder;

[0105] Reference numeral 14a denotes the piston rod;

[0106] Reference numeral 15 represents a drive source;

[0107] Reference numeral 16 represents a lift table;

[0108] Reference numeral 17 represents a linear actuator (drive source);

[0109] Reference numerals 18, 18-1, 18-2 represent load ports;

[0110] Reference numeral 19 represents a caster;

[0111] Reference numeral 20 represents a regulator;

[0112] Reference numeral 21 represents a manual switch;

[0113] Reference numeral 22 represents an emergency stop switch;

[0114] Reference numeral 23 represents a zone sensor;

[0115] Reference numerals 24, 24-1, 24-2 represent load platforms;

[0116] Reference numeral 25 represents an EFEM;

[0117] Reference numeral 26 represents an OHT;

[0118] Reference numeral 26a represents a track;

[0119] Reference numeral 26b represents a second track;

[0120] Reference numeral 27 represents a control device;

[0121] Reference numeral 28 represents a host computer;

[0122] Reference numeral 29 represents an MES;

[0123] Reference numeral 30 represents an MCS;

[0124] Reference numerals 31, 31-0 to 31-6 represent optical I / O communication devices;

[0125] Reference numeral 32 represents a control PC;

[0126] Reference numeral 33 represents a magazine;

[0127] Reference numerals 34, 34-1, 34-2 represent a second FOUP transfer device;

[0128] Reference numeral 35 represents a supply nozzle;

[0129] Reference numeral 36 represents an exhaust nozzle;

[0130] Reference numeral 37 represents a fixing member;

[0131] Reference numeral 38 represents an RF receiver;

[0132] Reference numeral 39 denotes the third FOUP transfer device;

[0133] Reference numeral 40 denotes the bracket;

[0134] Reference numeral 41 denotes the lead straight plate;

[0135] Reference numeral 42 denotes the FOUP transfer mechanism;

[0136] Reference numeral 43 denotes the horizontal drive mechanism;

[0137] Symbols C1 and C2 denote the rotating shafts;

[0138] Symbol W denotes the wafer;

[0139] Symbol F denotes the semiconductor manufacturing plant;

[0140] Symbols S1 and S2 denote the storage units.

Claims

1. A FOUP transfer device (1-1, 1-2) is provided near the loading ports (18-1, 18-2) of a conveying device having one or more loading ports (18-1, 18-2), and performs the handover of the FOUP (3) between it and the above-mentioned loading ports (18-1, 18-2). Characterized in that, The above-mentioned FOUP transfer device (1-1, 1-2) has a first communication device (31-3, 31-4), and is connected to a second communication device (31-1, 31-2) possessed by the above-mentioned loading ports (18-1, 18-2). The above-mentioned FOUP transfer device (1-1, 1-2) can communicate with the above-mentioned loading ports (18-1, 18-2), so as to perform the communication that is carried out between the above-mentioned loading ports (18-1, 18-2) and a third communication device (31-0) possessed by the OHT cart (11) instead of the above-mentioned loading ports (18-1, 18-2). When the above-mentioned second communication device (31-1, 31-2) receives the signal for retrieving the above-mentioned FOUP (3) from the above-mentioned OHT cart (11), the above-mentioned FOUP transfer device (1-1, 1-2) obtains a permission signal or a non-permission signal from the above-mentioned loading ports (18-1, 18-2), and instead of the above-mentioned loading ports (18-1, 18-2), sends a signal from the above-mentioned second communication device (31-1, 31-2) to the above-mentioned third communication device (31-0). If the above-mentioned FOUP (3) is retrieved from the above-mentioned loading ports (18-1, 18-2) to the above-mentioned OHT cart (11), according to the arm part possessed by the above-mentioned FOUP transfer device (1-1, 1-2), the FOUP loaded by itself is loaded on the nearby above-mentioned loading ports (18-1, 18-2). The above-mentioned first communication device, the second communication device and the third communication device are optical I / O communication devices.

2. The FOUP transfer device according to claim 1, Characterized in that, The above-mentioned FOUP transfer device further has a control PC that communicates with the main computer possessed by the semiconductor manufacturing factory.

3. The FOUP transfer device according to claim 1 or 2, Characterized in that, The above-mentioned FOUP transfer device is arranged in line with the arrangement of a plurality of loading ports possessed by the above-mentioned conveying device, and the arrangement of the above-mentioned plurality of loading ports and the above-mentioned FOUP transfer device is arranged directly below the OHT track.

4. The FOUP transfer device according to claim 1 or 2, Characterized in that, The above-mentioned FOUP transfer device is arranged at a position that is not in line with the arrangement of the above-mentioned plurality of loading ports arranged directly below the OHT track, and directly below a second OHT track different from the above-mentioned OHT track.

5. The FOUP transfer device according to claim 1 or 2, Characterized in that, The above-mentioned FOUP transfer device includes: a placement table for placing the above-mentioned FOUP at a predetermined position, a holding part for holding the above-mentioned FOUP placed on the above-mentioned placement table, an arm part for moving the above-mentioned holding part on an arc-shaped track, and a lifting mechanism for moving the above-mentioned arm part up and down.

Images