Cover assembly of ray source, ray source, control method and security inspection machine

Abstract

The present invention discloses a cover assembly for a radiation source, a radiation source, a control method and a security inspection machine. It relates to the technical field of security inspection, and solves the technical problem that it is difficult for the radiation source and the security inspection machine to be used in high-temperature environments and / or low-temperature environments. The cover assembly includes: a cover body main body, a radiator and a thermoelectric cooler; the radiator is located on one side of the cover body main body; the thermoelectric cooler is located between the cover body main body and the radiator; the thermoelectric cooler includes a first temperature adjustment surface and a second temperature adjustment surface; the first temperature adjustment surface faces the cover body main body, and the second temperature adjustment surface faces the radiator. The cover assembly provided by the present invention can be used for a radiation source and a security inspection machine.

Description

Technical Field

[0001] The present invention relates to the technical field of security inspection, and particularly relates to a cover assembly of a radiation source, a radiation source, a control method, and an X-ray security inspection machine. Background Art

[0002] X-rays are generated by an X-ray tube inside the X-ray source. To prevent problems such as high-voltage breakdown or radiation leakage, the area near the X-ray tube is filled with insulating oil, and lead plates are provided in the oil tank for protection. Approximately 99% of the energy of the X-ray tube will be dissipated into the insulating oil in the form of heat. In a high-temperature environment, if the heat in the insulating oil cannot be dissipated in time, it will have a great negative impact on the stability and service life of the X-ray tube. In a low-temperature environment, the insulating oil will crystallize due to low temperature, resulting in a decrease in insulation strength. When the high voltage is turned on, creepage will occur between electrical components and between electrical components and structural components, affecting the performance and function of the equipment and even causing damage to the internal components of the equipment. Summary of the Invention

[0003] In a first aspect, an embodiment of the present invention provides a cover assembly of a radiation source. The cover assembly includes a cover body, a radiator, and a thermoelectric cooler. The radiator is located on one side of the cover body. The thermoelectric cooler is located between the cover body and the radiator. The thermoelectric cooler includes a first temperature adjustment surface and a second temperature adjustment surface. The first temperature adjustment surface faces the cover body, and the second temperature adjustment surface faces the radiator.

[0004] In an embodiment of the present invention, a thermoelectric cooler is provided between the cover body and the radiator, thereby realizing the hot and cold replacement of the first temperature adjustment surface and the second temperature adjustment surface. When the cover assembly is used for a radiation source, if the temperature inside the radiation source is too low, the first temperature adjustment surface can be switched to a hot surface and the second temperature adjustment surface can be switched to a cold surface to increase the temperature inside the radiation source through the first temperature adjustment surface; if the temperature inside the radiation source is too high, the first temperature adjustment surface can be switched to a cold surface and the second temperature adjustment surface can be switched to a hot surface to reduce the temperature inside the radiation source through the first temperature adjustment surface and dissipate heat to the outside through the second temperature adjustment surface, thereby realizing the use of the X-ray tube in a wide temperature range and solving the problem that the existing radiation source cannot be used in a high-temperature environment and / or a low-temperature environment. In addition, when the second temperature adjustment surface is a hot surface, the radiator can also be controlled to dissipate heat, thereby effectively accelerating the heat dissipation effect.

[0005] Optionally, a refrigeration sheet positioning groove is provided on the surface of the cover body facing the thermoelectric cooler. At least a part of the thermoelectric cooler is embedded in the refrigeration sheet positioning groove. By doing so, the thermoelectric cooler is positioned and fixed by using the refrigeration sheet positioning groove, preventing the thermoelectric cooler from moving significantly relative to the cover body after installation and improving the installation firmness of the thermoelectric cooler.

[0006] Optionally, the cover assembly further includes a heat transfer component. The heat transfer component is located on the surface of the cover body facing away from the thermoelectric cooler. With such an arrangement, the heat on the first temperature adjustment surface of the thermoelectric cooler is transferred to the inside of the radiation source through the heat transfer component, which can improve the heat transfer efficiency and area.

[0007] Optionally, the heat transfer component includes a plurality of first fins arranged at intervals. The plurality of first fins can be arranged in an array or irregularly, and adjacent two first fins can be connected to each other. With such an arrangement, the heat transfer area and efficiency can be improved.

[0008] Optionally, the cover assembly further includes a heat insulation substrate. The heat insulation substrate is located between the cover body and the radiator. The heat insulation substrate has a first opening. The first opening penetrates the surface of the heat insulation substrate close to the cover body and the surface of the heat insulation substrate close to the radiator. Among them, the thermoelectric cooler is embedded in the first opening. With such an arrangement, the heat on both sides of the thermoelectric cooler can be isolated by the heat insulation substrate, preventing the heat on both sides from being transferred to each other and affecting the heating or cooling effect.

[0009] Optionally, the cover assembly further includes a seal. The seal is located between the thermoelectric cooler and the inner wall of the first opening. With such an arrangement, the two sides of the thermoelectric cooler can be completely isolated and sealed, achieving better heat insulation.

[0010] Optionally, the radiator includes a heat dissipation component and a fan. The heat dissipation component includes heat dissipation fins and a plurality of second fins arranged at intervals on the same side of the heat dissipation fins, and the second fins are located on the side of the heat dissipation fins facing away from the thermoelectric cooler. The fan is located between the plurality of second fins. For example, the heat dissipation fins and the plurality of second fins can be integrally formed to form the heat dissipation component, improving the convenience of use. In addition, by arranging a plurality of second fins, the effective heat dissipation area can be increased. Moreover, by combining the heat dissipation component and the fan, not only can the heat dissipation cost be reduced, but also the flexibility during use can be improved. Optionally, the cover assembly further includes a protective cover. The protective cover is buckled on the side of the fan away from the heat dissipation fins. The protective cover has a plurality of ventilation holes. With such an arrangement, not only can the heat be transferred to the outside through the ventilation holes, but also the fan and the heat dissipation component can be protected from damage.

[0011] Optionally, the thermoelectric cooler includes a first semiconductor layer and a second semiconductor layer arranged in a stack. The first semiconductor layer and the second semiconductor layer are connected to form a thermocouple pair. The surface of the first semiconductor layer away from the second semiconductor layer is the first temperature adjustment surface, and the surface of the second semiconductor layer away from the first semiconductor layer is the second temperature adjustment surface. Among them, one of the first semiconductor layer and the second semiconductor layer is an N-type semiconductor layer, and the other is a P-type semiconductor layer.

[0012] Optionally, the thermoelectric cooler further includes a first pole and a second pole. The first pole is connected to the first semiconductor layer, and the second pole is connected to the second semiconductor layer. The cover assembly further includes a drive control device. The drive control device is electrically connected to the first pole and the second pole of the thermoelectric cooler. The drive control device is configured to control the electrical signals transmitted to the first pole and the second pole, so that one of the first temperature adjustment surface and the second temperature adjustment surface is a cold surface and the other is a hot surface. With this arrangement, automatic control of the two polarities of the thermoelectric cooler is achieved, and thus automatic alternation between the cold surface and the hot surface of the thermoelectric cooler is realized.

[0013] Optionally, the drive control device includes a power supply, a full-bridge circuit, and a control circuit. The power supply is electrically connected to the first input terminal and the second input terminal of the full-bridge circuit respectively. The first output terminal of the full-bridge circuit is electrically connected to the first pole of the thermoelectric cooler, and the second output terminal of the full-bridge circuit is electrically connected to the second pole of the thermoelectric cooler. The control circuit is electrically connected to the full-bridge circuit. With this arrangement, by alternately switching the switching tubes of the full-bridge circuit, the power supply mode of the power supply to the thermoelectric cooler is changed, and the control structure is simple and easy to implement.

[0014] In a second aspect, an embodiment of the present invention provides a radiation source. The radiation source includes a box body, a radiation tube, and the cover assembly of the first aspect described above. One side of the box body has an installation opening. The radiation tube is installed inside the box body. The cover assembly covers the installation opening. Among them, the thermoelectric cooler and the radiator are located outside the box body. The box body also has a radiation outlet. The radiation outlet is used for the radiation emitted by the radiation tube to pass through.

[0015] The radiation source provided by the embodiment of the present invention includes the cover assembly of the first aspect described above, and thus has all the beneficial effects of the first aspect described above, which will not be repeated here.

[0016] Optionally, the radiation source further includes insulating oil and an oil pump. The insulating oil is filled inside the box body. The oil pump is located inside the box body. With this arrangement, not only can the flow rate of the insulating oil in the oil tank be increased, but also the temperature of the insulating oil in the box body can be made more uniform.

[0017] Optionally, the radiation source further includes a temperature sensor. The temperature sensor is located inside the box body. The temperature sensor is electrically connected to the drive control device of the cover assembly. With this arrangement, the cold surface and the hot surface of the thermoelectric cooler can be directly and automatically controlled by using the temperature of the insulating oil detected by the temperature sensor, without manual control, further improving the control accuracy.

[0018] Optionally, the radiation source further includes at least one handle. The handle is located on the box body. With this arrangement, it is convenient to carry when in use.

[0019] Optionally, the radiation source further includes a circuit module. The circuit module is located inside the box body and is electrically connected to the radiation tube. With such an arrangement, it is possible to achieve the emission of high-voltage radiation by the radiation tube.

[0020] In a third aspect, an embodiment of the present invention provides a control method for a radiation source. The radiation source includes the cover assembly of the first aspect, a box body having a radiation outlet, and a radiation tube and insulating oil located inside the box body. The control method includes: obtaining the temperature of the insulating oil. If the temperature of the insulating oil is less than a second temperature threshold, switch the first temperature adjustment surface of the thermoelectric cooler to the hot surface and the second temperature adjustment surface of the thermoelectric cooler to the cold surface. If the temperature of the insulating oil is greater than a first temperature threshold, switch the first temperature adjustment surface of the thermoelectric cooler to the cold surface and the second temperature adjustment surface of the thermoelectric cooler to the hot surface, and at the same time control the radiator to dissipate heat. The first temperature threshold is greater than the second temperature threshold.

[0021] The control method provided by the embodiment of the present invention includes the radiation source of the second aspect, and thus has all the beneficial effects of the second aspect, which will not be elaborated here.

[0022] Optionally, when the radiation source further includes a temperature sensor, obtaining the temperature of the insulating oil includes: using the temperature sensor to obtain the temperature of the insulating oil. With such an arrangement, it is possible to directly and automatically control the cold and hot surfaces of the thermoelectric cooler using the temperature of the insulating oil detected by the temperature sensor, without manual control, and thus further improve the control accuracy compared to manual control.

[0023] An embodiment of the present invention provides a security inspection machine. The security inspection machine includes the radiation source of the second aspect and a semiconductor detector. The semiconductor detector receives the radiation reflected by the object to be inspected.

[0024] The security inspection machine provided by the embodiment of the present invention includes the radiation source of the second aspect, and thus has all the beneficial effects of the second aspect, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic structural diagram of a security inspection machine according to some embodiments of the present invention;

[0026] Figure 2 Front structural schematic diagram of a radiation source according to some embodiments of the present invention;

[0027] Figure 3 Back structural schematic diagram of a radiation source according to some embodiments of the present invention;

[0028] Figure 4 Schematic diagram of the internal structure of a box body according to some embodiments of the present invention;

[0029] Figure 5Explosion schematic diagram of a radiation source according to some embodiments of the present invention;

[0030] Figure 6 Structural schematic diagram of a radiator according to some embodiments of the present invention;

[0031] Figure 7 Structural schematic diagram of a protective cover according to some embodiments of the present invention;

[0032] Figure 8 Structural schematic diagram of a radiation source according to some embodiments of the present invention;

[0033] Figure 9 Flowchart of a control method for a radiation source according to some embodiments of the present invention. Detailed implementation manners

[0034] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific manner, and thus should not be construed as a limitation to the present invention.

[0036] In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more. In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] Figure 1 Shows the structural block diagram of an X-ray security inspection machine in some embodiments of the present invention. As Figure 1As shown in the figure, some embodiments of the present invention provide an X-ray security inspection machine 1. The X-ray security inspection machine 1, also known as an X-ray security scanner, is an electronic device that completes inspections by means of a conveyor belt to send the items to be inspected into the X-ray inspection channel. The X-ray security inspection machine 1 is widely used in airports, railway stations, subway stations, bus stations, government office buildings, embassies, conference centers, exhibition centers, hotels, shopping malls, large-scale events, post offices, schools, the logistics industry, industrial inspections, etc.

[0038] It can be understood that the embodiments of the present invention do not further limit the use of the X-ray security inspection machine 1. The following is an example of the detection principle of the X-ray security inspection machine 1.

[0039] The X-ray security inspection machine 1 detects the items to be inspected by means of X-rays. For example, the X-ray source emits X-rays, and a fan-shaped X-ray beam passing through the collimator passes through the items to be inspected on the conveyor belt. The X-rays are absorbed by the items to be inspected and finally bombard the dual-energy semiconductor detector installed in the channel. The dual-energy semiconductor detector converts the X-rays into signals, and these very weak signals are amplified and sent to the signal processing chassis for further processing.

[0040] X-rays are electromagnetic waves that can penetrate opaque objects such as wood, cardboard, and leather. The X-ray security inspection machine 1 can present images of different colors on the screen according to the degree of absorption of X-rays by objects. For example, orange represents organic matter, such as food, plastics, etc.; books, ceramics, etc. are displayed in green; metals are displayed in blue. At this time, the security inspector quickly views the image scanned by the X-rays and can, based on rich experience, determine whether there are any prohibited items.

[0041] With the advancement of smart city and modernization construction, higher requirements are put forward for the item detection ability, heat resistance, and cold resistance working ability of the X-ray security inspection machine 1. Such as express sorting, industrial part inspection, etc. The X-ray security inspection machine 1 needs to work continuously all day long at high power. Since the temperature of the insulating oil in the ray source is different in different use environments, too high or too low temperature of the insulating oil will directly affect the working state and service life of the ray tube. In order to enable the ray source to work both in high-temperature environments and in low-temperature environments, the existing ray source has been improved. Continuing with Figure 1 as an example for illustration. The above-mentioned high-temperature environment is an environment greater than the first temperature threshold, and the above-mentioned low-temperature environment is an environment less than the second temperature threshold. The first temperature threshold and the second temperature threshold are set according to actual needs. For example, the first temperature threshold can be 45°C, and the second temperature threshold can be -20°C.

[0042] In some embodiments, such as Figure 1As shown in the figure, the security inspection machine 1 includes a housing 11, a radiation source 12, and a semiconductor detector 13. Among them, both the radiation source 12 and the semiconductor detector 13 are installed inside the housing 11. By way of example, the radiation source 12 can be an X-ray source, or can also be a γ-ray source, a β-ray source, an α-ray source, etc. In the following embodiments, the X-ray source is taken as an example for illustration.

[0043] The number of the radiation sources 12 can be set to one or more. When the radiation source 12 is set to one, it can be used in conjunction with a collimator. When the radiation source 12 is set to multiple, they can be arranged at different positions inside the housing 11 to irradiate the item to be measured from multiple angles.

[0044] Figure 2 It is a front view structural diagram of the radiation source 12 according to some embodiments of the present invention. Figure 3 It is a rear view structural diagram of the radiation source 12 according to some embodiments of the present invention. Figure 4 It is a schematic diagram of the internal structure of the box body 123 according to some embodiments of the present invention. Figure 5 It is an exploded view of the radiation source 12 according to some embodiments of the present invention. Below, with reference to Figures 2 to 5 , the structure of the radiation source 12 will be illustrated by way of example.

[0045] In some embodiments, as Figures 2 to 3 shown, the radiation source 12 includes a box body 123 and a cover body assembly 121. Referring to Figure 4 , one side of the box body 123 has an installation opening 1232. The cover body assembly 121 can be covered on the installation opening 1232.

[0046] By way of example, the cover body assembly 121 can be installed at the installation opening 1232 of the box body 123 by screws, or the cover body assembly 121 can also be installed at the installation opening 1232 of the box body 123 by snap fasteners. When choosing to install the cover body assembly 121 at the installation opening 1232 of the box body 123 with screws, at least two screws are selected to prevent the problem of unstable installation with only one screw. By way of example, as Figures 4 to 5 shown, a ring of equally spaced screws can be used to install the cover body assembly 121 at the installation opening 1232 of the box body 123.

[0047] In some embodiments, as Figure 4 shown, the radiation source 12 further includes a ray tube 122. The ray tube 122 is installed inside the box body 123. Referring to Figure 3 , the box body 123 also has a ray outlet 1231. The ray outlet 1231 is used for the rays emitted by the ray tube 122 to pass through.

[0048] Exemplarily, the ray tube 122 and the ray outlet 1231 can be directly or indirectly correspondingly arranged, as long as the emission of rays through the ray outlet 1231 can be achieved, and specific limitations are not provided herein.

[0049] In some embodiments, as Figure 4 shown, the ray source 12 further includes insulating oil 124 and an oil pump 125. The insulating oil 124 is filled inside the box body 123. The oil pump 125 is installed inside the box body 123.

[0050] Exemplarily, the oil pump 125 can be installed at any position inside the box body 123, as long as the circulation of the insulating oil 124 can be accelerated by the oil pump 125, and the position of the oil pump 125 in Figure 4 is not limited and can be adjusted as needed.

[0051] In some embodiments, as Figure 4 shown, the ray source 12 further includes a circuit module 126. The circuit module 126 is located inside the box body 123. The circuit module 126 is electrically connected to the ray tube 122.

[0052] Exemplarily, the circuit module 126 is a high-voltage circuit, and the high-voltage circuit is electrically connected to the ray tube 122 for the purpose of emitting high-voltage rays. The high-voltage rays mentioned here are rays above KHZ.

[0053] Some embodiments of the present invention provide a cover assembly 121 for a ray source 12, as Figure 5 shown, the cover assembly 121 includes a cover body main body 1211, a radiator 1212, and a thermoelectric cooler 1213. The radiator 1212 is located on one side of the cover body main body 1211. The thermoelectric cooler 1213 is located between the cover body main body 1211 and the radiator 1212. The thermoelectric cooler 1213 includes a first temperature adjustment surface and a second temperature adjustment surface. The first temperature adjustment surface faces the cover body main body 1211, and the second temperature adjustment surface faces the radiator 1212.

[0054] Exemplarily, the cover body main body 1211 is used to fix various devices, and the material of the cover body main body 1211 can be a material capable of shielding rays. In addition, the cover body main body 1211 can be fixed to the box body 123 by screws or by snaps, and the fixing method can be selected according to actual needs.

[0055] In some embodiments, the thermoelectric cooler 1213 includes a first semiconductor layer and a second semiconductor layer that are stacked. The first semiconductor layer and the second semiconductor layer are connected to form a thermocouple pair. The surface of the first semiconductor layer away from the second semiconductor layer is the first temperature adjustment surface, and the surface of the second semiconductor layer away from the first semiconductor layer is the second temperature adjustment surface. Among them, one of the first semiconductor layer and the second semiconductor layer is an N-type semiconductor layer, and the other is a P-type semiconductor layer. At the same time, the thermoelectric cooler 1213 also includes a first pole and a second pole. The first pole is connected to the first semiconductor layer, and the second pole is connected to the second semiconductor layer.

[0056] In addition, there are no special requirements for the actual shape of the thermoelectric cooler 1213, which can be square, circular, triangular, or any irregular shape. The number of thermoelectric coolers 1213 can be selected according to the area of the box 123. If the area of the box 123 is very large, several thermoelectric coolers 1213 can be selected. If the area of the box 123 is very small, fewer thermoelectric coolers 1213 can be selected. Multiple thermoelectric coolers 1213 can be arranged in an array or irregularly.

[0057] Due to the problem that the radiation source cannot be used in high-temperature environments and / or low-temperature environments, some embodiments of the present invention provide a cover assembly 121. The cover assembly 121 is used for the radiation source 12, and the thermoelectric cooler 1213 is abutted against the cover main body 1211 to control the temperature inside the box 123 by using the thermoelectric cooler 1213. If the temperature of the insulating oil 124 inside the box 123 is lower than the second temperature threshold, the first temperature adjustment surface can be switched to the hot surface and the second temperature adjustment surface can be switched to the cold surface to increase the temperature of the insulating oil 124 inside the radiation source through the first temperature adjustment surface; if the temperature of the insulating oil 124 inside the box 123 is higher than the first temperature threshold, the first temperature adjustment surface can be switched to the cold surface and the second temperature adjustment surface can be switched to the hot surface to reduce the temperature of the insulating oil 124 inside the box 123 through the first temperature adjustment surface and dissipate heat to the outside through the second temperature adjustment surface, thereby enabling the ray tube to work in a wide temperature range and solving the problem that the existing radiation source cannot be used in high-temperature environments and / or low-temperature environments. Moreover, further, the present invention also provides a radiator 1212 on the side of the thermoelectric cooler 1213 away from the cover main body 1211, and the radiator 1212 is abutted against the thermoelectric cooler 1213. The radiator 1212 can dissipate heat from the hot surface of the thermoelectric cooler 1213, and further can further accelerate the speed of the thermoelectric cooler 1213 dissipating heat to the outside.

[0058] In some embodiments, such as Figure 6As shown, the radiator 1212 includes a heat dissipation member 12121 and a fan 12122. The heat dissipation member 12121 includes heat dissipation fins 12123 and a plurality of second fins 12124 arranged at intervals on the same side of the heat dissipation fins 12123, and the plurality of second fins 12124 are located on the side of the heat dissipation fins 12123 facing away from the semiconductor refrigeration chip 1213.

[0059] In some examples, the side of the heat dissipation fins 12123 facing away from the plurality of second fins 12124 can be attached to the second temperature adjustment surface of the semiconductor refrigeration chip 1213. The heat of the second temperature adjustment surface can be transferred to the heat dissipation fins 12123. Therefore, by providing the heat dissipation fins 12123, the heat dissipation area can be increased and the heat dissipation efficiency can be improved.

[0060] In addition, a second fin 12124 is also provided on the side of the heat dissipation fins 12123 facing away from the semiconductor refrigeration chip 1213, and the heat of the heat dissipation fins 12123 can be transferred to the second fin 12124. Therefore, by providing the second fin 12124, the heat dissipation area can be further increased and the heat dissipation efficiency can be improved.

[0061] In addition, the fan 12122 is located between the plurality of second fins 12124. Therefore, the airflow generated when the fan 12122 rotates can take away the heat of the second fins 12124 and the heat of the heat dissipation fins 12123, improving the heat dissipation efficiency.

[0062] Exemplarily, continue to refer to Figure 6 , the radiator 1212 can further include a reinforcing plate 12125 located on the same side of the heat dissipation fins 12123. The reinforcing plate 121225 is located at both ends of the heat dissipation fins 12123 and can also be located between the plurality of second fins 12124, playing a role in strengthening the stability of the radiator.

[0063] Exemplarily, the heat dissipation fins 12123, the reinforcing plate 12125 located on the same side of the heat dissipation fins 12123, and the plurality of second fins 12124 are integrally formed to form a profile member, which is convenient for directly installing and using the heat dissipation member 12121 subsequently. In addition, by providing a plurality of irregular second fins 12124 for heat dissipation, the effective heat dissipation area can be increased. Moreover, by combining the heat dissipation member 12121 with the fan 12122, not only can the heat dissipation cost be reduced, but also the flexibility during use can be improved.

[0064] In some embodiments, the heat sink 12123 has a second opening, and the orthographic projection of the fan 12122 on the heat sink 12123 at least partially overlaps with the second opening. Installing the fan 12122 at the second opening can not only reduce the thickness of the radiator 1212, but also achieve a better ventilation and heat dissipation effect. In addition, the shape of the second opening can be the same as or different from the shape of the fan 12122. Moreover, the second opening can be a single opening or multiple openings. For example, when the second opening is multiple openings, they are arranged at intervals to achieve ventilation and heat dissipation.

[0065] In some embodiments, as Figure 5 shown, a refrigeration chip positioning groove 12111 is provided on the surface of the cover body 1211 facing the thermoelectric cooler 1213. At least a part of the thermoelectric cooler 1213 is embedded in the refrigeration chip positioning groove 12111. By setting it like this, the thermoelectric cooler 1213 can be positioned and fixed by using the refrigeration chip positioning groove 12111, preventing the thermoelectric cooler 1213 from moving significantly relative to the cover body 1211 after installation, and improving the installation firmness of the thermoelectric cooler 1213.

[0066] For example, the number of the refrigeration chip positioning grooves 12111 provided can be equal to the number of the thermoelectric coolers 1213; the size of the refrigeration chip positioning grooves 12111 provided can be greater than or equal to the size of the thermoelectric coolers 1213. By setting it like this, each thermoelectric cooler 1213 is correspondingly provided with a refrigeration chip positioning groove 12111 that matches it, further improving the positioning accuracy.

[0067] In some embodiments, as Figure 5 shown, the cover assembly 121 further includes a heat transfer assembly 1214. The heat transfer assembly 1214 is located on the surface of the cover body 1211 facing away from the thermoelectric cooler 1213, and the heat transfer assembly 1214 can at least partially penetrate into the insulating oil 124. By setting it like this, the heat on the first temperature adjustment surface of the thermoelectric cooler 1213 is transferred to the insulating oil 124 through the heat transfer assembly 1214, which can improve the heat transfer efficiency and area.

[0068] For example, the heat transfer assembly 1214 includes a plurality of first fins 12141 arranged at intervals. Two adjacent first fins are connected to each other. The plurality of first fins 12141 can be arranged in an array or irregularly, as long as the insulating oil 124 near the ray tube 122 can be driven onto the first fins 12141 by using the oil pump 125. By setting it like this, the heat transfer area and efficiency can be improved.

[0069] In some embodiments, as Figure 5As shown, the cover assembly 121 further includes a heat insulation substrate 1215. The heat insulation substrate 1215 is located between the cover body 1211 and the radiator 1212. The heat insulation substrate 1215 has a first opening 12151. The first opening 12151 penetrates through the surface of the heat insulation substrate 1215 close to the cover body 1211 and the surface of the heat insulation substrate 1215 close to the radiator 1212. Among them, the thermoelectric cooler 1213 is embedded into the first opening 12151. With such a setting, the heat on both sides of the thermoelectric cooler 1213 can be isolated, preventing the heat on both sides from being transferred to each other and affecting the heating or cooling effect.

[0070] Exemplarily, the number of the first openings 12151 can be the same as the number of the thermoelectric coolers 1213, and at the same time, the shape of the first openings 12151 can also be the same as the shape of the thermoelectric coolers 1213. With such a setting, each thermoelectric cooler 1213 is correspondingly provided with a first opening 12151 that matches it, avoiding interference between two thermoelectric coolers 1213.

[0071] In some embodiments, as Figure 5 shown, the cover assembly 121 further includes a seal 1216. The seal 1216 is located between the thermoelectric cooler 1213 and the inner wall of the first opening 12151. With such a setting, it can achieve complete isolation and sealing on both sides of the thermoelectric cooler 1213, and better heat insulation.

[0072] Exemplarily, the seal 1216 can be made of relatively soft silicone material, but it is not limited to this.

[0073] In some embodiments, as Figure 5 shown, the cover assembly 121 further includes a protective cover 1217. The protective cover 1217 is buckled on the side of the fan 12122 away from the heat sink 12123. The protective cover 1217 has a plurality of ventilation holes. With such a setting, it can not only transfer the heat to the outside through the ventilation holes, but also protect the fan 12122 and the heat dissipation member 12121 from being damaged.

[0074] Exemplarily, the protective cover 1217 can be fixed to the heat dissipation member 12121 by screws, and can also be fixed to the heat dissipation member 12121 by buckles, including but not limited to the above several types. The fixing method can be selected according to actual needs.

[0075] In some embodiments, as Figure 7 shown, the protective cover 1217 includes a fan cover 12171 and a cover plate 12172. The cover plate 12172 is provided with a third opening. The fan cover 12171 is buckled at the third opening.

[0076] For example, the cover plate 12172 can be fixed to the heat sink 12121 by screws, and the cover plate 12172 can also be fixed to the heat sink 12121 by snaps, including but not limited to the above several types. The fixing method can be selected according to actual needs. In addition, the fan cover 12171 can be fastened to the cover plate 12172 by screws, and the fan cover 12171 can also be fastened to the cover plate 12172 by snaps, including but not limited to the above several types. The fastening method can be selected according to actual needs. In addition, the fan cover 12171 can be made of stainless steel to prevent rusting due to water stains.

[0077] In some embodiments, as Figure 8 shown, the cover body assembly 121 further includes a drive control device 1218. The drive control device 1218 is electrically connected to the first pole and the second pole of the thermoelectric cooler 1213. The drive control device 1218 is used to control the electrical signals transmitted to the first pole and the second pole, so that one of the first temperature adjustment surface and the second temperature adjustment surface is the cold surface and the other is the hot surface. With such a setting, the two polarities of the thermoelectric cooler 1213 are automatically controlled, and thus the cold surface and the hot surface of the thermoelectric cooler 1213 are automatically and alternately changed.

[0078] For example, the drive control device 1218 can be divided into two types.

[0079] The first type is: the drive control device 1218 includes a power supply, a full-bridge circuit and a control circuit. The power supply is electrically connected to the first input terminal and the second input terminal of the full-bridge circuit respectively. The first output terminal of the full-bridge circuit is electrically connected to the first pole of the thermoelectric cooler 1213, and the second output terminal of the full-bridge circuit is electrically connected to the second pole of the thermoelectric cooler 1213. The control circuit is electrically connected to the temperature sensor 127 and the full-bridge circuit respectively. The above solution mainly uses the control circuit and the full-bridge circuit to control the thermoelectric cooler 1213.

[0080] The second type is: the drive control device 1218 includes two power supplies, four switches and a control circuit. The positive pole of the first power supply is connected to the first pole of the thermoelectric cooler 1213 through the first switch, the negative pole of the first power supply is connected to the second pole of the thermoelectric cooler 1213 through the second switch, the positive pole of the second power supply is connected to the second pole of the thermoelectric cooler 1213 through the third switch, and the negative pole of the second power supply is connected to the first pole of the thermoelectric cooler 1213 through the fourth switch. The control circuit is electrically connected to the temperature sensor 127 and each switch respectively. The above solution mainly uses the control circuit and multiple switches to control the thermoelectric cooler 1213.

[0081] For example, the drive control device 1218 can be placed either inside the box body 123 or outside the box body 123.

[0082] In some embodiments, as Figure 4 shown, the radiation source 12 further includes a temperature sensor 127. The temperature sensor 127 is located inside the box body 123. As Figure 8 shown, the temperature sensor 127 can be electrically connected to the drive control device 1218 of the cover assembly 121. By way of example, as Figure 3 shown, the temperature sensor 127 can be arranged on the circuit module 126 or at other positions, as long as it can detect the temperature of the insulating oil 124. Moreover, on this basis, the type of the temperature sensor 127 is not limited either.

[0083] With such a setting, the temperature of the insulating oil 124 can be detected by the temperature sensor 127, and the temperature of the insulating oil 124 is sent to the drive control device 1218. The drive control device 1218 can control the electrical signals transmitted to the first pole and the second pole according to the detected temperature of the insulating oil 124, so that one of the first temperature adjustment surface and the second temperature adjustment surface is a cold surface and the other is a hot surface, so as to keep the temperature of the insulating oil 124 within the working range of the ray tube 122, realizing fully automatic constant temperature adjustment without manual control, and further improving the control speed and accuracy.

[0084] In some embodiments, as Figure 3 and Figure 5 shown, the radiation source 12 further includes: at least one handle 128; each handle 128 is installed on the box body 123. By way of example, the handle 128 and the box body 123 can be integrally formed, or the handle 128 can be fixedly installed on the box body 123 by screws, or the handle 128 can be fixedly installed on the box body 123 by buckles. The specific connection methods are not limited one by one here, as long as the handle 128 can be connected to the box body 123. In addition, when two handles 128 are provided, the two handles 128 are installed on the parts of the box body 123 on both sides of the radiation outlet 1231.

[0085] In the present invention, by switching the polarities of the first pole and the second pole of the semiconductor refrigeration chip 1213, the functions of refrigeration or heating of the semiconductor refrigeration chip 1213 are realized. By way of example, when the temperature is higher than 45 °C, the first temperature adjustment surface of the semiconductor refrigeration chip 1213 is controlled to be a cold surface, the second temperature adjustment surface of the semiconductor refrigeration chip 1213 is a hot surface, and the radiator 1212 is controlled to dissipate heat at the same time. When the temperature is lower than -20 °C, the first temperature adjustment surface of the semiconductor refrigeration chip 1213 is switched to be a hot surface, and the second temperature adjustment surface of the semiconductor refrigeration chip 1213 is a cold surface. The above control process realizes the operation of the insulating oil 124 in a relatively wide temperature range of -20 to 45 °C.

[0086] The present invention automatically regulates the working mode of the semiconductor refrigeration chip 1213 by the real-time feedback of the temperature of the insulating oil 124 through the temperature sensor 127, and has the advantages of fast regulation speed, high stability and high control accuracy.

[0087] The present invention can assemble the cover body main body 1211, the radiator 1212, the semiconductor refrigeration chip 1213, the heat transfer component 1214, the heat insulation substrate 1215, the seal 1216 and the protective cover 1217, etc. into the cover body assembly 121 to form an integrated design. Subsequently, the cover body main body 1211 can be fixed on the box body 123 for storing the ray tube 122 and the insulating oil 124 inside by screws. It has the characteristics of compact structure and light weight, and is convenient for installation and later maintenance.

[0088] In some embodiments, as Figure 9 shown, a control method for the radiation source 12 is also invented. The radiation source 12 includes the above-mentioned cover body assembly 121, a box body 123 having a radiation outlet 1231, and a ray tube 122 and an insulating oil 124 located inside the box body 123. The control method includes:

[0089] S1: Obtain the temperature of the insulating oil.

[0090] Exemplarily, a temperature sensor 127 is provided inside the box body 123. In the case where the temperature sensor 127 is provided, the temperature sensor 127 in Figure 4 can collect the temperature of the insulating oil 124 inside the box body 123 in real time, and can also collect the temperature of the insulating oil 124 in the box body 123 regularly. With such a setting, the temperature of the insulating oil 124 detected by the temperature sensor 127 can be more accurate than manual reading.

[0091] S21: If the temperature of the insulating oil is less than the second temperature threshold, switch the first temperature adjustment surface of the semiconductor refrigeration chip to the hot surface, and the second temperature adjustment surface of the semiconductor refrigeration chip to the cold surface. Exemplarily, the second temperature threshold can be -20 °C.

[0092] In this step, when it is detected that the temperature of the insulating oil 124 is less than the second temperature threshold, the insulating oil 124 will cause a decrease in insulation strength due to low-temperature crystallization. After the high voltage is turned on, creeping discharge will occur between electrical components (for example, between the high-voltage circuit and the oil pump), and between electrical components and structural components (for example, between the ray tube and the lead plate), affecting the performance and function of the equipment, and even causing damage to the internal components of the equipment. To overcome the above problems, the present invention switches the first temperature adjustment surface of the semiconductor refrigeration chip 1213 to the hot surface, and the second temperature adjustment surface of the semiconductor refrigeration chip 1213 to the cold surface, heats the semiconductor refrigeration chip 1213, and then passes the heat of the semiconductor refrigeration chip 1213 through Figure 5The heat transfer component 1214 in it transfers heat to the insulating oil 124 for heating, solving the problem that the insulating strength of the insulating oil 124 decreases due to crystallization at low temperatures.

[0093] Exemplarily, it is possible to adopt Figure 8 The drive control device 1218 in it directly and automatically controls the cold surface and the hot surface of the semiconductor refrigeration chip 1213 according to the temperature of the insulating oil 124, without manual control, and thus, compared with manual control, further improves the control accuracy.

[0094] S22: If the temperature of the insulating oil is greater than the first temperature threshold, switch the first temperature adjustment surface of the semiconductor refrigeration chip to the cold surface, and the second temperature adjustment surface of the semiconductor refrigeration chip to the hot surface, and at the same time control the radiator to dissipate heat; wherein, the first temperature threshold is greater than the second temperature threshold. Exemplarily, the first temperature threshold can be 45 °C.

[0095] In this step, when it is detected that the temperature of the insulating oil 124 is greater than the first temperature threshold, there is a large amount of heat in the insulating oil 124 that cannot be dissipated in time, which will directly affect the stability and service life of the X-ray tube. To overcome the above problems, the present invention switches the first temperature adjustment surface of the semiconductor refrigeration chip 1213 to the cold surface, the second temperature adjustment surface of the semiconductor refrigeration chip 1213 to the hot surface, and at the same time controls the radiator 1212 to dissipate heat, and thus transfers the heat of the semiconductor refrigeration chip 1213 through Figure 5 the heat transfer component 1214 in it to the insulating oil 124 for refrigeration, solving the problem that the heat in the insulating oil 124 cannot be dissipated in time.

[0096] Exemplarily, it is possible to manually control the cold surface and the hot surface of the semiconductor refrigeration chip 1213. This process is simple to control and does not require a complex circuit. It is also possible to adopt Figure 8 the drive control device 1218 in it to directly and automatically control the cold surface and the hot surface of the semiconductor refrigeration chip 1213 according to the temperature of the insulating oil 124, further improving the control accuracy.

[0097] In the description of this specification, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0098] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, and all should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claimed rights.

Claims

1. A cover assembly of a radiation source, It is characterized in that include: Cover body; a heat sink, located on one side of the cover body; and A semiconductor cooling chip is located between the cover body and the radiator; the semiconductor cooling chip includes a first temperature regulating surface and a second temperature regulating surface; the first temperature regulating surface faces the cover body, and the second temperature regulating surface faces the radiator; Among them, the semiconductor refrigeration plate is configured as follows: if the temperature of the insulating oil inside the radiation source is lower than the second temperature threshold, the first temperature regulating surface is switched to the hot surface, the second temperature regulating surface is switched to the cold surface, and the temperature of the insulating oil inside the radiation source is increased through the first temperature regulating surface; if the temperature of the insulating oil inside the radiation source is higher than the first temperature threshold, the first temperature regulating surface is switched to the cold surface, the second temperature regulating surface is switched to the hot surface, the temperature of the insulating oil inside the radiation source is lowered through the first temperature regulating surface, and heat is dissipated to the outside through the second temperature regulating surface.

2. The cover assembly according to claim 1, It is characterized in that A cooling fin positioning groove is provided on the surface of the cover body facing the semiconductor cooling fin; at least a portion of the semiconductor cooling fin is embedded in the cooling fin positioning groove.

3. The cover assembly according to claim 1, It is characterized in that The cover assembly also includes: The heat transfer component is located on the surface of the cover body facing away from the semiconductor cooling plate.

4. The cover assembly according to claim 3, It is characterized in that The heat transfer assembly includes a plurality of first fins disposed in a spaced relationship.

5. The cover assembly according to claim 1, It is characterized in that The cover assembly also includes: A heat-insulating substrate is located between the cover body and the radiator; the heat-insulating substrate has a first opening, and the first opening passes through a surface of the heat-insulating substrate close to the cover body and a surface of the heat-insulating substrate close to the radiator; Wherein, the semiconductor cooling sheet is embedded in the first opening.

6. The cover assembly according to claim 5, It is characterized in that The cover assembly also includes: A sealing member is located between the semiconductor cooling plate and the inner wall of the first opening.

7. The cover assembly according to claim 1, It is characterized in that The radiator comprises: A heat sink, comprising a heat sink and a plurality of second fins disposed at intervals on the same side of the heat sink, wherein the second fins are located on a side of the heat sink away from the semiconductor refrigeration fin; and The fan is located between the plurality of second fins.

8. The cover assembly according to claim 7, It is characterized in that The cover assembly also includes: The protective cover is buckled on a side of the fan away from the heat sink; the protective cover is provided with a plurality of ventilation holes.

9. The cover assembly according to any one of claims 1 to 8, It is characterized in that The semiconductor refrigeration sheet comprises: A first semiconductor layer and a second semiconductor layer arranged in a stacked manner; the first semiconductor layer and the second semiconductor layer are connected to form a thermocouple pair; a surface of the first semiconductor layer away from the second semiconductor layer is a first temperature adjustment surface, and a surface of the second semiconductor layer away from the first semiconductor layer is a second temperature adjustment surface; Wherein, one of the first semiconductor layer and the second semiconductor layer is an N-type semiconductor layer, and the other is a P-type semiconductor layer.

10. The cover assembly according to claim 9, Characterized in that, The semiconductor refrigeration sheet further includes: a first pole and a second pole; the first pole is connected to the first semiconductor layer, and the second pole is connected to the second semiconductor layer; the cover assembly further includes: A drive control device, electrically connected to the first pole and the second pole of the semiconductor refrigeration sheet; the drive control device is used to control the electrical signals transmitted to the first pole and the second pole, so that one of the first temperature adjustment surface and the second temperature adjustment surface is a cold surface, and the other is a hot surface.

11. The cover assembly according to claim 10, Characterized in that, The drive control device includes: A power supply; A full-bridge circuit; and, A control circuit; the power supply is electrically connected to the first input terminal and the second input terminal of the full-bridge circuit respectively, the first output terminal of the full-bridge circuit is electrically connected to the first pole of the semiconductor refrigeration sheet, the second output terminal of the full-bridge circuit is electrically connected to the second pole of the semiconductor refrigeration sheet, and the control circuit is electrically connected to the full-bridge circuit.

12. A ray source, Characterized in that, The ray source includes: A box body, having an installation opening on one side; A ray tube, installed inside the box body; and, The cover assembly according to any one of claims 1 to 11, covered on the installation opening; Wherein, the semiconductor refrigeration sheet and the radiator are located outside the box body; the box body also has a ray outlet, and the ray outlet is used for the ray emitted by the ray tube to pass through.

13. The ray source according to claim 12, Characterized in that, The ray source further includes: Insulating oil, filled inside the box body; and, An oil pump, located inside the box body.

14. The ray source according to claim 13, Characterized in that, The ray source further includes: A temperature sensor, located inside the box body, and electrically connected to the drive control device of the cover assembly.

15. The ray source according to claim 12, Characterized in that, The ray source further includes: At least one handle, located on the box body.

16. The ray source according to claim 12, Characterized in that, The ray source further includes: A circuit module, located inside the box body, and electrically connected to the ray tube.

17. A control method for a ray source, Characterized in that, The ray source includes the cover assembly according to any one of claims 1 to 11, a box body having a ray outlet, and a ray tube and insulating oil located inside the box body; the control method includes: Obtaining the temperature of the insulating oil; If the temperature of the insulating oil is less than the second temperature threshold, switch the first temperature adjustment surface of the semiconductor refrigeration chip to the hot surface and the second temperature adjustment surface of the semiconductor refrigeration chip to the cold surface; If the temperature of the insulating oil is greater than the first temperature threshold, switch the first temperature adjustment surface of the semiconductor refrigeration chip to the cold surface and the second temperature adjustment surface of the semiconductor refrigeration chip to the hot surface, and at the same time control the radiator to dissipate heat; the first temperature threshold is greater than the second temperature threshold.

18. The control method according to claim 17, characterized in that when the radiation source further includes a temperature sensor, the obtaining of the temperature of the insulating oil includes: obtaining the temperature of the insulating oil by using the temperature sensor.

19. An X-ray security inspection machine, characterized in that it includes: the radiation source according to any one of claims 12 to 16; a semiconductor detector for receiving the rays reflected back by the object to be measured.

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