Mask and cleaning method

Abstract

The application discloses a mask plate and a cleaning method. The mask plate comprises a plate body and an adhesion layer. The plate body comprises a mask pattern area and a non-mask pattern area. The mask pattern area and the non-mask pattern area are arranged adjacently. The adhesion layer is arranged below the non-mask pattern area. The mask plate is used for adhering pollution particles by arranging the adhesion layer below the plate body, so that the occurrence rate of product dark spots or bright spots is reduced, and the product yield is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a mask and a cleaning method. Background Technology

[0002] Organic light-emitting diodes (OLEDs) possess advantages such as being all-solid-state, ultra-thin, having no viewing angle limitations, fast response, low-temperature operation, and ease of implementation in flexible and 3D displays. They are widely recognized as the next generation of mainstream display technology after liquid crystal displays (LCDs). Currently, the main method for manufacturing OLED devices is thermal evaporation deposition. This involves using a heating container to heat the deposition material in a vacuum environment, causing the sublimated or molten deposition material to vaporize at high temperatures and deposit onto a glass substrate with a thin-film transistor structure or an anode structure.

[0003] Among these processes, mask exposure using a photomask is a crucial core technology, determining both product quality and yield. In the mass production of large-size organic light-emitting diode (OLED) displays, line-source evaporation is typically employed. Current evaporation apparatuses, from top to bottom, consist of a magnetic plate, a substrate, and a photomask. The photomask is placed on transport rollers to move to the preset evaporation position. However, during transport, friction between the photomask and the rollers easily generates contaminant particles. These particles, upon contact with the substrate, can cause dark or bright spots, reducing product yield. Therefore, minimizing the impact of contaminant particles on product yield is a pressing technical challenge. Summary of the Invention

[0004] This application provides a mask and a cleaning method, wherein the mask can adhere to contaminant particles, thereby reducing the impact of contaminant particles on product yield.

[0005] In a first aspect, embodiments of this application provide a mask plate, comprising: a plate body and an adhesive layer, wherein the plate body includes a mask pattern area and a non-mask pattern area, the mask pattern area and the non-mask pattern area being disposed adjacent to each other; the adhesive layer is disposed below the non-mask pattern area.

[0006] Optionally, in some embodiments of this application, the material of the adhesive layer includes abrasion-resistant rubber.

[0007] Optionally, in some embodiments of this application, the adhesive layer includes a plurality of spaced adhesive blocks, which are uniformly disposed below the non-mask pattern area.

[0008] Optionally, in some embodiments of this application, the adhesive layer includes a plurality of adhesive strips, which are spaced apart along the length direction of the mask, and / or the plurality of adhesive strips are spaced apart along the width direction of the mask.

[0009] Optionally, in some embodiments of the present application, the cross-sectional shape of the adhesion layer is a "mouth" shape.

[0010] Optionally, in some embodiments of the present application, the plate body includes a first side wall and a second side wall, the first side wall and the second side wall are disposed opposite to each other, and the adhesion layer is further provided on the first side wall and the second side wall.

[0011] Optionally, in some embodiments of the present application, the adhesion layer includes at least two adhesion strips, and at least one of the adhesion strips is provided on each of the first side wall and the second side wall.

[0012] Optionally, in some embodiments of the present application, the thickness of the adhesion layer on the first side wall and the second side wall is less than or equal to the thickness of the adhesion layer under the plate body.

[0013] Optionally, in some embodiments of the present application, the thickness range of the adhesion layer is from 0.1 mm to 100 mm.

[0014] On the other hand, the present application provides a cleaning method, using the mask plate as described above. The cleaning method includes: placing at least one of the mask plates on a transfer roller; starting the transfer roller to make the mask plate move along a preset direction, and during the movement, the adhesion layer of the mask plate adheres to the particles on the transfer roller.

[0015] The present application provides a mask plate and a cleaning method. The mask plate includes a plate body and an adhesion layer. The plate body includes a mask pattern area and a non-mask pattern area, and the mask pattern area and the non-mask pattern area are adjacent to each other; the adhesion layer is provided under the non-mask pattern area. By providing an adhesion layer under the plate body, the mask plate of the present application is used to adhere to contaminated particles, which can reduce the influence of contaminated particles on the product yield, reduce the occurrence rate of product dark spots or bright spots, and improve the product yield. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. The following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 is a schematic cross-sectional structure diagram of the mask plate provided by the first embodiment of the present application;

[0018] Figure 2 is a schematic bottom plan structure diagram of the mask plate provided by the first embodiment of the present application;

[0019] Figure 3 This is a cross-sectional structural schematic diagram of the mask plate provided in the second embodiment of this application;

[0020] Figure 4 This is a bottom view schematic diagram of the mask plate provided in the second embodiment of this application;

[0021] Figure 5 This is a bottom view schematic diagram of the mask plate provided in the third embodiment of this application;

[0022] Figure 6 This is a cross-sectional structural schematic diagram of the mask plate provided in the fourth embodiment of this application;

[0023] Figure 7 This is a bottom view schematic diagram of the mask plate provided in the fourth embodiment of this application;

[0024] Figure 8 This is a schematic flowchart of a cleaning method provided in an embodiment of this application;

[0025] Figure 9 This is a schematic diagram of a cleaning process provided in an embodiment of this application. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0027] This application provides a photomask and a cleaning method. The photomask can adhere to contaminant particles, thereby reducing the impact of contaminant particles on product yield. Detailed descriptions are provided below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of embodiments. Furthermore, in the description of this application, the term "comprising" means "including but not limited to". The terms "first," "second," "third," etc., are used merely as identifiers to distinguish different objects, and are not used to describe a specific order.

[0028] Please see Figure 1 and Figure 2 , Figure 1 This is a cross-sectional structural schematic diagram of the mask plate provided in the first embodiment of this application; Figure 2 This is a bottom-view planar structural diagram of the mask plate provided in the first embodiment of this application. Figure 1 and Figure 2As shown, this application embodiment provides a mask plate 100, including: a plate body 10 and an adhesive layer 20. The plate body 10 includes a mask pattern area 11 and a non-mask pattern area 12, which are disposed adjacent to each other; the adhesive layer 20 is disposed below the non-mask pattern area 12.

[0029] The mask provided in this application embodiment has an adhesion layer 20 set below the plate body 10 to adhere to contaminant particles, which can reduce the impact of contaminant particles on product yield, reduce the occurrence rate of dark spots or bright spots in the product, and improve product yield.

[0030] In this embodiment, the mask plate includes multiple effective mask areas 111 in the mask pattern area 11. Figure 2 Only six effective mask areas 111 are shown as an example. The specific number of effective mask areas 111 can be adjusted by those skilled in the art as needed, and this application does not limit it. Furthermore, each effective mask area 111 corresponds to an area where a display panel to be vapor-deposited (not shown in the figure) is located.

[0031] In this embodiment, the mask is a mask used in film deposition processes, such as vacuum evaporation, plasma-enhanced chemical vapor deposition, and magnetron sputtering. In these processes, the mask contacts the substrate of the display panel, allowing only the film-forming material to pass through the perforated mask pattern area to form a specific pattern on the substrate. Specifically, the plate body 10 is generally a metal plate body 10. A metal mask body is less prone to deformation due to tension and stress, which is beneficial for controlling the precision introduced by evaporation in the display panel manufacturing process, thereby improving the production quality of the display product.

[0032] In this embodiment, the material of the adhesive layer 20 includes abrasion-resistant rubber. Specifically, the material of the adhesive layer 20 includes at least one of natural rubber, butadiene rubber, styrene-butadiene rubber, and nitrile rubber. Specifically, the adhesive layer 20 is used to adhere contaminant particles generated during the vapor deposition process of the display panel. Using abrasion-resistant rubber for the adhesive layer 20 improves the adhesion function of the mask and also facilitates its removability and reusability. When removing particles from the adhesive layer 20, the adhesive layer 20 is first peeled off from the board 10, and then the peeled adhesive layer 20 is cleaned separately with an acidic liquid. This not only removes contaminant particles that affect product yield but also effectively prevents the acidic liquid from corroding the board 10.

[0033] In this embodiment, the adhesion layer 20 includes a plurality of spaced-apart adhesion blocks, which are uniformly disposed below the non-mask pattern area 12. This design helps to improve adhesion force for more thorough adhesion of contaminant particles and ensures that the lower surface of the mask remains horizontal, avoiding tilting or imbalance of the mask.

[0034] In this embodiment, the thickness of the adhesion layer 20 ranges from 0.1 mm to 100 mm. The thickness of the adhesion layer can be adjusted according to actual needs, making it widely applicable and beneficial for achieving the adhesion of contaminant particles in different vapor deposition processes, thereby improving product yield.

[0035] The mask provided in this application embodiment has multiple adhesion blocks set under the mask body for adhering contaminant particles, which can reduce the impact of contaminant particles on product yield, reduce the occurrence rate of dark spots or bright spots in the product, and improve product yield.

[0036] Please see Figure 3 and Figure 4 , Figure 3 This is a cross-sectional structural schematic diagram of the mask plate provided in the second embodiment of this application; Figure 4 This is a bottom-view planar structural diagram of the mask plate provided in the second embodiment of this application. Figure 3 and Figure 4 As shown, this application embodiment provides a mask 200. The difference between mask 200 and mask 100 is that the adhesive layer 20 includes multiple adhesive strips, which are spaced apart along the length direction of the mask and / or spaced apart along the width direction of the mask. This design helps to improve adhesion to more fully adhere to contaminant particles and ensures that the lower surface of the mask remains horizontal, avoiding tilting or imbalance of the mask.

[0037] In the embodiments of this application, the width of the adhesive strip may be unequal, which is applicable to mask plates with different mask pattern areas and various setting methods. Those skilled in the art can make adjustments as needed, and this application does not limit them.

[0038] In this embodiment, the mask plate 200 further includes a plate body 10 and an adhesive layer 20. The plate body 10 includes a mask pattern area 11 and a non-mask pattern area 12, which are disposed adjacent to each other. The adhesive layer 20 is disposed below the non-mask pattern area 12. Specifically, the mask plate includes a plurality of effective mask areas 111 in the mask pattern area 11. Figure 4 Only six effective mask areas 111 are shown as an example. The specific number of effective mask areas 111 can be adjusted by those skilled in the art as needed, and this application does not limit it. Furthermore, each effective mask area 111 corresponds to an area where a display panel to be vapor-deposited (not shown in the figure) is located.

[0039] In the embodiments of the present application, the mask plate is a mask plate for a film-forming process, which is preferably applied to film-forming processes such as vacuum evaporation, plasma-enhanced chemical vapor deposition, magnetron sputtering, etc. That is, in these processes, the mask plate contacts the substrate of the display panel, so that only the film-forming material can pass through the hollow mask pattern area, and a specific pattern is formed on the substrate. Specifically, the plate body 10 is generally a metal plate body 10. The metal mask body is not easily deformed due to the tension force and stress, which is beneficial to controlling the accuracy brought by evaporation in the process of manufacturing the display panel, thereby improving the production quality of the display product.

[0040] In the embodiments of the present application, the material of the adhesion layer 20 includes wear-resistant rubber. Specifically, the material of the adhesion layer 20 includes at least one of rubber materials such as natural rubber, cis-1,4-polybutadiene rubber, styrene-butadiene rubber, nitrile rubber, etc. Specifically, the adhesion layer 20 is used to adhere to the pollution particles generated during the evaporation process of the display panel. The use of wear-resistant rubber material for the adhesion layer 20 is beneficial to improving the adhesion function of the mask plate. At the same time, it is beneficial to the detachable and reusable of the adhesion layer 20. When removing the particles on the adhesion layer 20, first peel the adhesion layer 20 from the plate body 10, and then use an acidic liquid alone to clean the peeled adhesion layer 20, which not only removes the pollution particles that affect the product yield, but also effectively avoids the erosion of the acidic liquid on the plate body 10.

[0041] In the embodiments of the present application, the thickness range of the adhesion layer 20 is from 0.1 mm to 100 mm. The thickness of the adhesion layer can be adjusted according to actual needs, and the applicable range is large, which is beneficial to realizing the adhesion of pollution particles in different evaporation processes and improving the product yield.

[0042] The mask plate provided by the embodiments of the present application can reduce the impact of pollution particles on the product yield, reduce the occurrence rate of dark spots or bright spots of the product, and improve the product yield by providing a plurality of adhesion strips under the mask plate body for adhering pollution particles.

[0043] Please refer to Figure 5 and continue to refer to Figure 3 Figure 5 is a schematic diagram of the bottom view plane structure of the mask plate provided by the third embodiment of the present application. As Figure 5 and Figure 3 shown, the embodiments of the present application provide a mask plate 300. The difference between the mask plate 300 and the mask plate 100 is that the cross-sectional shape of the adhesion layer 20 is a "mouth" shape.

[0044] ​In this embodiment, the mask plate 300 further includes a plate body 10 and an adhesive layer 20. The plate body 10 includes a mask pattern area 11 and a non-mask pattern area 12, which are arranged adjacent to each other. The adhesive layer 20 is disposed below the non-mask pattern area 12. Specifically, the adhesive layer 20 is arranged in a "U" shape corresponding to the non-mask pattern area 12. Preferably, the adhesive layer 20 covers the non-mask pattern area 12 located around the mask pattern area 11. This design can prevent the mask pattern area 11 from being affected by contaminant particles. At the same time, the adhesive layer 20 has a larger area and can adhere to more contaminant particles, further improving the adhesion of the mask plate, thereby reducing the occurrence rate of dark spots or bright spots in the product and improving the product yield.

[0045] In this embodiment, the mask plate includes multiple effective mask areas 111 in the mask pattern area 11. Figure 5 Only six effective mask areas 111 are shown as an example. The specific number of effective mask areas 111 can be adjusted by those skilled in the art as needed, and this application does not limit it. Furthermore, each effective mask area 111 corresponds to an area where a display panel to be vapor-deposited (not shown in the figure) is located.

[0046] In this embodiment, the mask is a mask used in film deposition processes, such as vacuum evaporation, plasma-enhanced chemical vapor deposition, and magnetron sputtering. In these processes, the mask contacts the substrate of the display panel, allowing only the film-forming material to pass through the perforated mask pattern area to form a specific pattern on the substrate. Specifically, the plate body 10 is generally a metal plate body 10. A metal mask body is less prone to deformation due to tension and stress, which is beneficial for controlling the precision introduced by evaporation in the display panel manufacturing process, thereby improving the production quality of the display product.

[0047] In this embodiment, the material of the adhesive layer 20 includes abrasion-resistant rubber. Specifically, the material of the adhesive layer 20 includes at least one of natural rubber, butadiene rubber, styrene-butadiene rubber, and nitrile rubber. Specifically, the adhesive layer 20 is used to adhere contaminant particles generated during the vapor deposition process of the display panel. Using abrasion-resistant rubber for the adhesive layer 20 improves the adhesion function of the mask and also facilitates its removability and reusability. When removing particles from the adhesive layer 20, the adhesive layer 20 is first peeled off from the board 10, and then the peeled adhesive layer 20 is cleaned separately with an acidic liquid. This not only removes contaminant particles that affect product yield but also effectively prevents the acidic liquid from corroding the board 10.

[0048] In this embodiment, the thickness of the adhesion layer 20 ranges from 0.1 mm to 100 mm. The thickness of the adhesion layer can be adjusted according to actual needs, making it widely applicable and beneficial for achieving the adhesion of contaminant particles in different vapor deposition processes, thereby improving product yield.

[0049] The mask provided in this application embodiment has an adhesion layer 20 provided under the mask body to adhere to contaminant particles, which can reduce the impact of contaminant particles on product yield, reduce the occurrence rate of dark spots or bright spots in the product, and improve product yield.

[0050] Please see Figure 6 and Figure 7 , Figure 6 This is a cross-sectional structural schematic diagram of the mask plate provided in the fourth embodiment of this application; Figure 7 This is a bottom-view planar structural diagram of the mask plate provided in the fourth embodiment of this application. (See diagram below.) Figure 6 and Figure 7 As shown, this application embodiment provides a mask plate 400. The difference between the mask plate 400 and the mask plate 100 is that the plate body 10 includes a first sidewall 13 and a second sidewall 14, the first sidewall 13 and the second sidewall 14 are disposed opposite to each other, and the adhesion layer 20 is also disposed on the first sidewall 13 and the second sidewall 14.

[0051] In this embodiment, the mask plate 400 further includes a plate body 10 and an adhesive layer 20. The plate body 10 includes a mask pattern area 11 and a non-mask pattern area 12, which are disposed adjacent to each other. The adhesive layer 20 is disposed below the non-mask pattern area 12. Specifically, the mask plate includes a plurality of effective mask areas 111 in the mask pattern area 11. Figure 7 Only six effective mask areas 111 are shown as an example. The specific number of effective mask areas 111 can be adjusted by those skilled in the art as needed, and this application does not limit it. Furthermore, each effective mask area 111 corresponds to an area where a display panel to be vapor-deposited (not shown in the figure) is located.

[0052] In this embodiment, the mask is a mask used in film deposition processes, such as vacuum evaporation, plasma-enhanced chemical vapor deposition, and magnetron sputtering. In these processes, the mask contacts the substrate of the display panel, allowing only the film-forming material to pass through the perforated mask pattern area to form a specific pattern on the substrate. Specifically, the plate body 10 is generally a metal plate body 10. A metal mask body is less prone to deformation due to tension and stress, which is beneficial for controlling the precision introduced by evaporation in the display panel manufacturing process, thereby improving the production quality of the display product.

[0053] In this embodiment, the material of the adhesive layer 20 includes abrasion-resistant rubber. Specifically, the material of the adhesive layer 20 includes at least one of natural rubber, butadiene rubber, styrene-butadiene rubber, and nitrile rubber. Specifically, the adhesive layer 20 is used to adhere contaminant particles generated during the vapor deposition process of the display panel. Using abrasion-resistant rubber for the adhesive layer 20 improves the adhesion function of the mask and also facilitates its removability and reusability. When removing particles from the adhesive layer 20, the adhesive layer 20 is first peeled off from the board 10, and then the peeled adhesive layer 20 is cleaned separately with an acidic liquid. This not only removes contaminant particles that affect product yield but also effectively prevents the acidic liquid from corroding the board 10.

[0054] In this embodiment, the adhesion layer 20 includes at least two adhesion strips, with at least one adhesion strip provided on each of the first sidewall 13 and the second sidewall 14. This design facilitates the adhesion of contaminant particles located on the side of the mask, further enhancing the adhesion of the mask, thereby reducing the incidence of dark spots or bright spots in the product and improving product yield. Figure 7 The image only shows, by way of example, that three adhesive strips are provided on the first sidewall 13 and the second sidewall 14 respectively. The specific number can be adjusted according to actual needs, and this application does not limit it.

[0055] In this embodiment, the adhesive layer 20 may also cover the entire first sidewall 13, and / or the adhesive layer 20 may cover the entire second sidewall 14. This design allows the adhesive layer 20 to have a larger area, enabling it to adhere to more contaminant particles, further enhancing the adhesion of the mask, thereby reducing the incidence of dark or bright spots in the product and improving product yield.

[0056] In this embodiment of the application, the thickness of the adhesive layer 20 located on the first sidewall 13 and the second sidewall 14 is less than or equal to the thickness of the adhesive layer 20 located below the plate body 10. Figure 6 The example illustrates that the thickness of the adhesive layer 20 located on the first sidewall 13 and the second sidewall 14 is less than the thickness of the adhesive layer 20 located below the plate body 10. Specifically, the first sidewall 13 and the second sidewall 14 are the left and right sidewalls of the mask. This design not only avoids damage to the mask and reduction in evaporation accuracy caused by displacement to the left or right during movement, but also allows the adhesive layer 20 on the first sidewall 13 and the second sidewall 14 to adhere to contaminant particles located on the sides of the mask, further improving the adhesion of the mask, thereby reducing the incidence of dark spots or bright spots in the product and improving product yield.

[0057] In this embodiment, the thickness of the adhesion layer 20 ranges from 0.1 mm to 100 mm. The thickness of the adhesion layer can be adjusted according to actual needs, making it widely applicable and beneficial for achieving the adhesion of contaminant particles in different vapor deposition processes, thereby improving product yield.

[0058] Please see Figure 8 and Figure 9 , Figure 8 This is a schematic flowchart of a cleaning method provided in an embodiment of this application; Figure 9 This is a schematic diagram of a cleaning process provided in an embodiment of this application. Figure 8 and Figure 9 As shown in the embodiment of this application, a cleaning method is provided. This cleaning method uses the above-described mask and includes the following steps:

[0059] S10. Place at least one mask plate 400 on the transfer roller 500;

[0060] It should be noted that photomasks of 100 / 200 / 300 / 400 mm are all acceptable. Figure 8 The mask 400 is selected as an example.

[0061] S20. Turn on the transfer roller 500 so that the mask plate 400 moves in a preset direction. During the movement, the adhesive layer 20 of the mask plate 400 adheres to the particles 510 on the transfer roller 500.

[0062] In this embodiment, the material of the adhesive layer 20 includes abrasion-resistant rubber. Specifically, the material of the adhesive layer 20 includes at least one of natural rubber, butadiene rubber, styrene-butadiene rubber, and nitrile rubber. Specifically, the adhesive layer 20 is used to adhere contaminant particles generated during the vapor deposition process of the display panel. Using abrasion-resistant rubber for the adhesive layer 20 improves the adhesion function of the mask and also facilitates its removability and reusability. When removing particles from the adhesive layer 20, the adhesive layer 20 is first peeled off from the board 10, and then the peeled adhesive layer 20 is cleaned separately with an acidic liquid. This not only removes contaminant particles that affect product yield but also effectively prevents the acidic liquid from corroding the board 10.

[0063] In this embodiment, the transfer roller 500 is made of metal. During the transfer of the metal mask plate 400, the mask plate 400 moves on the transfer roller 500, and the two rub against each other, which can easily generate contaminant particles 510. The adhesive layer 20 is used to adhere the contaminant particles 510 generated by the friction between the transfer roller 500 and the mask plate 400, thereby reducing the impact of contaminant particles 510 on product yield, reducing the occurrence rate of dark spots or bright spots in the product, and improving product yield.

[0064] This application provides a photomask 100 / 200 / 300 / 400 and a cleaning method. The photomask 100 / 200 / 300 / 400 includes a plate body 10 and an adhesive layer 20. The plate body 10 includes a mask pattern area 11 and a non-mask pattern area 12, which are arranged adjacent to each other. The adhesive layer 20 is disposed below the non-mask pattern area 12. By providing an adhesive layer 20 below the plate body 10, the photomask 100 / 200 / 300 / 400 of this application can adhere to contaminant particles 510, thereby reducing the impact of contaminant particles 510 on product yield, reducing the occurrence rate of dark spots or bright spots in the product, and improving product yield.

[0065] The above provides a detailed description of a mask plate and cleaning method provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A mask, characterized in that, Comprising: A plate body, the plate body includes a mask pattern area and a non-mask pattern area, and the mask pattern area and the non-mask pattern area are adjacent to each other; An adhesion layer, the adhesion layer is provided below the non-mask pattern area, and the adhesion layer is configured to adhere to contaminant particles.

2. The mask defined in claim 1, wherein The material of the adhesion layer includes wear-resistant rubber.

3. The mask defined in claim 2, wherein The adhesion layer includes a plurality of spaced adhesion blocks, and the plurality of adhesion blocks are evenly arranged below the non-mask pattern area.

4. The mask defined in claim 2, wherein The adhesion layer includes a plurality of adhesion strips, and the plurality of adhesion strips are spaced along the length direction of the mask plate, and / or, the plurality of adhesion strips are spaced along the width direction of the mask plate.

5. The mask of claim 2, wherein, The cross-sectional shape of the adhesion layer is a "square" shape.

6. The mask defined in claim 2, wherein The plate body includes a first side wall and a second side wall, the first side wall and the second side wall are arranged opposite to each other, and the adhesion layer is also provided on the first side wall and the second side wall.

7. The mask of claim 6, wherein, The adhesion layer includes at least two adhesion strips, and at least one of the adhesion strips is provided on each of the first side wall and the second side wall.

8. The mask defined in claim 6, wherein The thickness of the adhesion layer on the first side wall and the second side wall is less than or equal to the thickness of the adhesion layer below the plate body.

9. The mask of claim 1, wherein, The thickness range of the adhesion layer is from 0.1 millimeter to 100 millimeters.

10. A cleaning method characterized by, Using the mask plate according to any one of claims 1-9, the cleaning method includes: Placing at least one of the mask plates on a transfer roller; Starting the transfer roller to make the mask plate move along a preset direction, and during the movement, the adhesion layer of the mask plate adheres to the particles on the transfer roller.

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