A laser processing device and method for brittle products

Abstract

The present invention belongs to the field of laser processing technology and relates to a laser processing device and method for brittle products. The laser processing device includes: a laser, a beam shaping component, and a focusing element; the laser is used to emit a laser beam; the beam shaping component is arranged on the output optical path of the laser and is used to shape and modulate the laser beam emitted by the laser to obtain a modulated beam; the focusing element is arranged above the brittle product to be processed and is used to focus the modulated beam to obtain a processing beam with multiple focal points, wherein the focal points of the processing beam are at preset distances in horizontal and vertical distances. This application can improve the yield rate and processing efficiency when processing brittle materials.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a laser processing device and method for brittle products. Background Art

[0002] With the rapid development of the electronics market, the demand for electronic displays is increasing. The outer screen of an electronic display is typically made of glass, and before formal use, the glass needs to be chamfered to smooth out sharp edges and points. Existing technologies generally employ traditional mechanical grinding and laser processing. However, traditional mechanical grinding suffers from a low yield rate for increasingly thin glass, while existing laser processing methods require multiple reciprocating cuts to achieve chamfering, resulting in low efficiency. Therefore, improving the efficiency and yield rate of chamfering or other cutting operations on fragile products such as glass has become a pressing issue. Summary of the Invention

[0003] The purpose of the embodiments of the present invention is to solve the technical problem of low processing yield and efficiency when processing brittle products.

[0004] In order to solve the above technical problems, an embodiment of the present invention provides a laser processing device for brittle products, which adopts the following technical solution:

[0005] The laser processing device includes: a laser, a beam shaping component and a focusing element;

[0006] The laser is used to emit a laser beam;

[0007] The beam shaping component is arranged on the output light path of the laser and is used to shape and modulate the laser beam emitted by the laser to obtain a modulated beam;

[0008] The focusing element is arranged above the brittle product to be processed, and is used to focus the modulated light beam to obtain a processing light beam with multiple focal points, wherein the focal points of the processing light beam are at preset distances in horizontal and vertical distances.

[0009] Furthermore, the beam shaping component includes: a beam expansion and collimation element and a beam modulation element;

[0010] The beam expansion and collimation element is arranged on the outgoing light path of the laser, and is used to expand and collimate the laser beam of the laser;

[0011] The beam modulating element and the beam modulating element are coaxially arranged to modulate the laser beam after the beam expansion and collimation to obtain a modulated beam with a preset phase distribution.

[0012] Furthermore, the beam expansion and collimation element includes at least two lenses arranged in parallel.

[0013] Furthermore, a reflective element is provided between the beam shaping component and the focusing element for reflecting the modulated light beam.

[0014] Furthermore, the focusing unit is a high-power objective lens, the numerical aperture value of the high-power objective lens is between 0.4 and 0.8, and the magnification is greater than or equal to 20 times.

[0015] Furthermore, the laser processing device also includes a stage for placing the brittle product, and the stage is placed directly below the focusing element.

[0016] Furthermore, the laser processing device also includes a motion component, which is connected to the stage to control the movement of the stage.

[0017] Furthermore, the laser processing device also includes a grabbing assembly, which is arranged on the adjacent side of the worktable and is used to grab the brittle product before or after processing.

[0018] In order to solve the above technical problems, an embodiment of the present invention further provides a laser processing method using the above laser processing device, the method comprising:

[0019] The laser emits a laser beam, the laser beam is shaped and modulated by a beam shaping component to obtain a modulated beam, and the modulated beam is then focused by a focusing element to obtain a processing beam having multiple focal points, wherein the focal points of the processing beam are at preset distances in horizontal and vertical distances;

[0020] Controlling the processing light beam to project onto the brittle product to be processed according to a preset processing path for scanning, so that the brittle product to be processed forms a modified area along the processing path;

[0021] The scanned product is placed in a preset corrosive solution for corrosion treatment, so that the material to be removed falls off the product along the processing path.

[0022] Furthermore, before the laser emits a laser beam and the laser beam is processed by the laser processing optical path, the method further includes:

[0023] Receiving processing morphology parameters corresponding to the product and the product parameters, wherein the product parameters include the refractive index and thickness of the product;

[0024] Calculating the horizontal distance and vertical distance between the focal points of the processing light beam when it propagates in the air based on the processing topography parameters, refractive index and thickness;

[0025] A beam modulating element in the beam shaping assembly is adjusted based on the horizontal distance and the vertical distance.

[0026] A laser processing device and method for brittle products provided in an embodiment of the present application has at least the following beneficial effects compared with the prior art:

[0027] The laser processing device includes: a laser, a beam shaping component and a focusing element. The laser is used to emit a laser beam. The beam shaping component is arranged on the output optical path of the laser and is used to shape and modulate the laser beam emitted by the laser to obtain a modulated beam. The modulated beam is a beam with a preset phase distribution. The modulated beam is then focused by the focusing element to obtain a processing beam with multiple focuses. The horizontal and vertical distances between the focuses of the processing beam are preset, so that the processing beam has a preset shape, thereby meeting the cutting requirements. The processing beam can be used to cut and shape in one time, avoiding multiple reciprocating cutting and improving cutting efficiency. In addition, the use of laser cutting improves the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] To more clearly illustrate the solutions of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort. Among them:

[0029] Figure 1 1 is a schematic structural diagram of a laser processing device for brittle products provided by one embodiment of the present invention;

[0030] Figure 2 This is another structural schematic diagram of a laser processing device for brittle products provided by one embodiment of the present invention;

[0031] Figure 3 1 is another structural schematic diagram of a laser processing device for brittle products provided by one embodiment of the present invention;

[0032] Figure 4 A focus distribution diagram of each focus within a brittle product provided by an embodiment of the present invention;

[0033] Figure 5 A phase distribution diagram of a modulated light beam provided in one embodiment of the present invention;

[0034] Figure 6 This is a final effect diagram of the brittle product provided by one embodiment of the present invention;

[0035] Figure 7This is a final effect diagram of a brittle product provided by another embodiment of the present invention;

[0036] Figure 8 It is a flow chart of a laser processing method provided in one embodiment of the present application.

[0037] The reference numerals in the accompanying drawings are as follows:

[0038] 1. Laser; 2. Beam shaping component; 21. Beam expansion and collimation element; 22. Beam modulation element; 3. Focusing element; 4. Reflection element; 5. Stage. DETAILED DESCRIPTION

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which the present invention pertains; the terms used in the specification herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention; for example, the directions or positions indicated by the terms "length", "width", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the accompanying drawings and are for ease of description only and should not be construed as limiting the present technical solution.

[0040] The terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions; the terms "first", "second", etc. in the specification and claims of the present invention or the above-mentioned drawings are used to distinguish different objects rather than to describe a specific order.

[0041] In the specification and claims of the present invention and the above-mentioned description of the drawings, when an element is referred to as being “fixed to,” “mounted on,” “disposed on,” or “connected to” another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being “connected to” another element, it may be directly or indirectly connected to the other element.

[0042] Furthermore, references herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0043] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0044] It should be noted that the laser processing device is used to chamfer or perform other cutting on brittle products, and ultimately cut the brittle products into a preset shape.

[0045] The embodiment of the present invention provides a laser processing device for brittle products, such as Figure 1 As shown, the laser processing device includes a laser 1, a beam shaping component 2 and a focusing element 3;

[0046] The laser 1 is used to emit a laser beam;

[0047] The beam shaping component 2 is arranged on the outgoing light path of the laser 1 and is used to shape and modulate the laser beam emitted by the laser 1 to obtain a modulated beam;

[0048] The focusing element 3 is arranged above the brittle product to be processed, and is used to focus the modulated light beam to obtain a processing light beam with multiple focal points, wherein the focal points of the processing light beam are at preset distances in the horizontal and vertical distances.

[0049] It can be understood that the working principle of the laser processing device is as follows: the laser beam emitted by the laser 1 passes through the beam shaping component 2 and the focusing element 3 in sequence to generate a processing beam with multiple focal points, such as Figure 4 As shown, in one embodiment, the horizontal and vertical distances between the focal points of the processing light beam are preset. By adopting this processing light beam, its multiple focal points can be in a preset shape in the brittle product. Compared with the existing laser focus, it is only arranged vertically in the brittle product. To process a specific shape, such as chamfering the brittle product, it is necessary to use the light beam to perform multiple scans to achieve it; the processing light beam of the present application can directly arrange the focus in the brittle product, and at the angle required for chamfering, which can be achieved with one scan; when the processing light beam is irradiated into the brittle product, a cavity is formed in the brittle product at the focus position.

[0050] The laser beam emitted by the laser 1 is a laser beam with a Gaussian distribution, that is, a Gaussian beam. The amplitude of the cross section of the Gaussian beam satisfies the Gaussian function, and the phase peak-to-valley difference is 0. The use of a Gaussian beam facilitates shaping and modulation by the beam shaping component 2, and can obtain a better modulated beam.

[0051] In summary, compared with the existing technology, the laser processing device has at least the following beneficial effects: the laser processing device includes: a laser 1, a beam shaping component 2 and a focusing element 3, the laser 1 is used to emit a laser beam, the beam shaping component 2 is arranged on the output light path of the laser 1, and is used to shape and modulate the laser beam emitted by the laser 1 to obtain a modulated beam, and the modulated beam is a beam with a preset phase distribution; the modulated beam is then focused by the focusing element 3 to obtain a processing beam with multiple focuses, wherein the horizontal and vertical distances between the focuses of the processing beam are preset, so that the processing beam has a preset shape, thereby meeting the cutting requirements; the processing beam can be used to cut and shape in one time, avoiding multiple reciprocating cuttings and improving the cutting efficiency; and the use of laser for cutting improves the yield rate.

[0052] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0053] like Figure 1 As shown, in some embodiments of the present invention, the laser 1 is an ultrashort pulse laser, the wavelength of the laser beam emitted by the ultrashort pulse laser is 300nm to 1100nm, the pulse width is 300fs to 50000fs, the repetition frequency is 10KH to 200KH, the single pulse energy is 10uJ to 1000uJ, and the ultrashort pulse laser power is 1W to 100W.

[0054] like Figure 2 As shown, in some embodiments of the present invention, the beam shaping component 2 includes: a beam expansion and collimation element 21 and a beam modulation element 22;

[0055] The beam expansion and collimation element 21 is arranged on the outgoing light path of the laser 1 and is used to expand and collimate the laser beam of the laser 1;

[0056] The beam modulating element 22 and the beam expanding and collimating element 21 are coaxially arranged to modulate the laser beam after the beam expansion and collimation to obtain a modulated beam with a preset phase distribution.

[0057] Specifically, after being emitted from the laser 1, the laser beam first enters the beam expansion and collimation element 21 for beam expansion and collimation. The amplitude of the laser beam after beam expansion and collimation on the cross section also satisfies the Gaussian function, and the phase peak-to-valley difference is 0. Compared with the laser beam that has not undergone beam expansion and collimation, its spot size is increased.

[0058] The laser beam after beam expansion and collimation then enters the beam modulating element 22 for modulation to obtain a modulated beam with a preset phase distribution. In this embodiment, Figure 5As shown, the preset phase distribution has multiple arc-shaped belt areas, the phase of each area is sawtooth-shaped, the curvature centers of the arc belts are on the same straight line, and the width of the arc belts increases as the curvature radius decreases; Figure 5 The phase distribution shown in Figure 4 As shown in the effect diagram of multiple focal points located inside the processing component, the horizontal distance between each focal point is a first distance, and the vertical distance is a second distance, thereby enabling the transparent brittle product to be cut at a preset angle. The distance between each adjacent focal point perpendicular to the light propagation direction is a first distance, and the distance between each adjacent focal point along the light propagation direction is a second distance. The positional relationship of the multiple focal points when propagating in the air corresponds to the preset phase distribution. Furthermore, the distance perpendicular to the light propagation direction is a second distance. Figure 5 The straight lines where the centers of curvature of the multiple arc-shaped strips are located are relatively parallel, and the relative parallelism means that the law of reflection is satisfied in the actual processing system.

[0059] Furthermore, the beam modulating element 22 includes but is not limited to the diffraction optical element and the spatial light modulator element. Any element that can make the laser beam reach the above-mentioned preset phase distribution can be the beam modulating element 22. In a preferred embodiment, the beam modulating element 22 is a diffraction optical element.

[0060] By providing the beam expansion and collimation element 21 and the beam modulation element 22 , the laser beam is shaped and modulated to obtain a modulated beam with a preset phase distribution, so that the subsequently obtained processing beam has multiple focal points.

[0061] In some embodiments of the present invention, the beam expansion and collimation element 21 includes at least two lenses arranged in parallel;

[0062] At least two lenses are provided to expand and collimate the laser beam, thereby achieving a better effect while simplifying the structure.

[0063] In some embodiments of the present invention, Figure 3 As shown, a reflective element 4 is further provided between the beam shaping component 2 and the focusing element 3 for reflecting the modulated light beam;

[0064] Specifically, by providing a reflective element 4 between the beam shaping component 2 and the focusing element 3, the volume of the entire laser processing device can be reduced and the length in the axial direction can be avoided to be too long; the reflective element 4 is an optical element having at least one reflective surface, which totally reflects the modulated light beam obtained after processing by the beam shaping component 2 onto the focusing element 3.

[0065] By arranging the reflective element 4 between the beam shaping component 2 and the focusing element 3, the effect of shrinking the entire laser processing device can be achieved.

[0066] In some embodiments of the present invention, the focusing unit is a high-power objective lens, the numerical aperture value of the high-power objective lens is between 0.4 and 0.8, and the magnification is greater than or equal to 20 times.

[0067] Specifically, the numerical aperture is the product of the refractive index of the medium between the objective lens and the object and the sine of half the aperture angle. As the numerical aperture value increases, the magnification is higher, the system resolution is higher, and the field of view width and working distance are smaller.

[0068] Therefore, when the focusing unit adopts a high-power objective lens with a numerical aperture value between 0.4 and 0.8 and a magnification greater than or equal to 20 times, its focusing effect is better.

[0069] like Figure 3 As shown, in some embodiments of the present invention, the laser processing device further includes a stage 5 for placing the fragile product, and the stage 5 is placed directly below the focusing element 3.

[0070] The loading platform 5 is provided to place the transparent brittle product, so as to carry and fix the transparent brittle product to prevent it from sliding freely during processing.

[0071] In some embodiments of the present invention, the laser processing device further includes a motion component, which is connected to the stage 5 to control the movement of the stage 5 .

[0072] Specifically, the laser processing device also includes a control component and a motion component. The control component controls the motion component to drive the stage 5 to move, thereby driving the brittle product to move. The movement includes translation and rotation. The brittle product is moved relative to the processing beam at a preset angular velocity or translation speed, so that the processing beam scans along a preset path, and finally forms a processing trajectory on the brittle product along the preset processing path, specifically, forming multiple points with a preset spacing on the preset path, that is, forming a modified area.

[0073] The control module controls the stage 5 , that is, controls the brittle product to rotate at a preset angular velocity or moving speed, and in combination with the frequency of the processing light beam, a plurality of points with a preset spacing can be obtained on the brittle product.

[0074] The control component controls the movement of the motion component so that the processing light beam can move along a preset processing path to achieve scanning of the fragile product.

[0075] Furthermore, the motion component may be a galvanometer beam control system or a mobile platform, or a combination of the two. The galvanometer beam control system is a precise control system that can achieve precise movement of brittle products along a preset processing path.

[0076] By connecting the motion component with the stage 5, the movement of the brittle product is finally achieved, and the processing light beam is used to process the brittle product along a preset path, thereby achieving a precise control effect.

[0077] In some embodiments of the present invention, the laser processing device further includes a grabbing assembly, which is disposed adjacent to the stage 5 and is used to grab the brittle product before or after processing.

[0078] Specifically, the gripping device includes but is not limited to a manipulator, and the loading and unloading of brittle products is achieved through the gripping device, and the loading and unloading of brittle products is achieved by controlling the gripping component through the control component.

[0079] The present application realizes loading and unloading of fragile products by arranging the grabbing assembly adjacent to the loading platform 5 .

[0080] like Figure 3 As shown, taking the best embodiment of the present application as an example, the entire processing flow is explained by processing a 200-micron-thick glass substrate;

[0081] In this embodiment, the laser beam emitted by the laser 1 has a wavelength of 1030 nanometers, a single pulse energy of 200 μJ, a repetition frequency of 50 kHz, and a pulse width of 6 ps. The laser beam is passed through the beam expansion and collimation element 21, the beam modulation element 22, the reflection element 4, and the focusing element 3 to obtain a processing beam, which can penetrate a 200-micron thick glass substrate.

[0082] The control component controls the grabbing component to grab the glass substrate onto the stage 5 .

[0083] The processing light beam distributes 40 focused spots within the glass substrate, each with a size of 5 microns. Adjacent spots are spaced 6 microns apart in a first direction and 8 microns apart in a second direction. The control assembly controls the motion assembly to move along a preset path, with the processing light beam scanning along the preset path at a 6-micron dot pitch. The scanned area along the preset path forms a modified zone.

[0084] The control component then controls the grabbing component to grab the scanned glass substrate and place it in a corrosion tank; the corrosion tank is filled with a corrosive solution, which includes hydrofluoric acid and nitric acid.

[0085] like Figure 6 As shown, since the area scanned by the processing beam can be corroded by the etching solution faster than the area not scanned by the processing beam, the scanned glass substrate is placed in the etching tank, and the glass substrate is taken out by the grabbing assembly after a preset time, and the material to be removed automatically falls off the glass substrate; in this embodiment, the preset time is greater than 3 hours.

[0086] The laser 1, beam expansion and collimation element 21, beam modulation element 22, reflection element 4, focusing element 3, stage 5, motion component, control component and gripping component are all arranged on the base and fixed.

[0087] An ultrashort pulse laser is used to emit a laser beam, and the beam expander and collimator 21 and the beam modulator 22 perform shaping and modulation on the laser beam to obtain a modulated beam with a preset phase distribution. The modulated beam is then reflected by the reflective element 4 and reflected onto the focusing element 3 for focusing to obtain a processing beam. The processing beam has multiple focal points, and the horizontal and vertical distances between the focal points are preset. The multiple focal points pass through the glass substrate. Through the cooperation of the control component, the motion component and the stage 5, the processing beam is made to process the glass substrate along the preset processing path. When processing such thin and brittle products, the processing yield and processing efficiency can be improved.

[0088] like Figure 7 As shown, in other embodiments of the present application, by adjusting the beam modulating element 22 to change the phase distribution of the modulated beam, different focus distributions can be achieved, thereby obtaining different cutting surfaces for processing more complex contours, such as Figure 7 Double-sided chamfering and arc contour processing.

[0089] In order to solve the above technical problems, the present application also provides a laser processing method using the above laser processing device, referring to Figure 8 , which is a flow chart of a laser processing method provided in one embodiment of the present application.

[0090] In this embodiment, the Figure 3 The laser processing method is described, and the laser processing method includes:

[0091] S1. Laser 1 emits a laser beam, which is shaped and modulated by beam shaping component 2 to obtain a modulated beam. The modulated beam is then focused by focusing element 3 to obtain a processing beam having multiple focal points, wherein the focal points of the processing beam are at preset distances in horizontal and vertical distances.

[0092] Specifically, the control component first controls the grabbing component to grab the brittle product onto the stage; the beam shaping component 2 includes a beam expansion and collimation element 21 and a beam modulation element 22. The laser beam is first expanded and collimated by the beam expansion and collimation element 21. The laser processing beam after expansion and collimation is then modulated by the beam modulation element 22 to obtain a modulated beam with a preset phase distribution. The modulated beam is then focused by the focusing element 3 to obtain a processing beam with multiple focal points. The positional relationship of the multiple focal points when propagating in the air corresponds to the preset phase distribution. The horizontal and vertical distances between the focal points of the processing beam are preset. The processing beam passes through the brittle product.

[0093] like Figure 5 As shown, the preset phase distribution is a plurality of arc-shaped belt-shaped areas, the phase of each area is sawtooth-shaped, the curvature centers of the arc-shaped belts are on the same straight line, and the width of the arc-shaped belts increases as the curvature radius decreases.

[0094] Furthermore, before the modulated light beam is incident on the focusing element 3, the modulated light beam is also reflected by the reflecting element 4 and reflected to the focusing element 3. Through the reflection of the reflecting element 4, the volume of the laser processing device can be reduced to avoid its axial length being too long.

[0095] S2, controlling the processing light beam to be projected onto the brittle product to be processed along a preset processing path for scanning, so that the brittle product to be processed forms a modified area along the processing path;

[0096] Specifically, the brittle product is placed on the stage 5, and the stage 5 is connected to the motion component. The control component controls the stage 5 to move in a rotation or translation manner. Since the processing light beam has a certain frequency, the motion component cooperates with the processing light beam to project the processing light beam onto the brittle product to be processed according to a preset processing path for scanning. After scanning, there are multiple points with preset intervals on the preset processing path of the brittle product, which are the modified areas.

[0097] S3. Place the scanned product into a preset corrosive solution for corrosion treatment, so that the material to be removed falls off the product along the processing path.

[0098] Specifically, the control component also controls the gripping component to load and unload the brittle product. After scanning, the control component controls the gripping component to grab the scanned brittle product and place it in a corrosion tank. The corrosion tank contains a corrosive solution. After the scanned brittle product is placed in the corrosive solution, the scanned area on the brittle product corrodes faster than the unscanned area.

[0099] The corrosive solution includes hydrofluoric acid and nitric acid;

[0100] After the scanned brittle product is placed in the corrosive solution for a preset time, the control component controls the gripper component to remove the brittle product. The material to be removed is then separated from the product along the processing path. This completes the cutting and separation process of the brittle product. In this embodiment of the present application, the preset time is greater than three hours.

[0101] A laser beam is emitted by a laser 1, and the laser beam is processed by a beam shaping component 2 and a focusing element 3 to obtain a processing beam with multiple focuses, and the horizontal and vertical distances between the focuses are preset. Through the cooperation of the control component, the motion component and the stage 5, the processing beam is scanned in the brittle product according to the preset processing path, and the scanned area forms a modified area; then, through the cooperation of the control component, the motion component and the stage 5, the scanned brittle product is placed in a corrosive solution for corrosion treatment, so that the material to be removed is separated along the preset processing path. When the contour of the brittle product is processed, the yield rate and processing efficiency of the brittle product can be improved.

[0102] Furthermore, the laser 1 emits a laser beam, and before the laser beam is processed by the laser processing optical path, the method further includes:

[0103] Receiving processing morphology parameters corresponding to the product and the product parameters, wherein the processing morphology parameters include a chamfer angle and a chamfer width, and the product parameters include a product refractive index and thickness;

[0104] Calculating the horizontal distance and vertical distance between the focal points of the processing light beam when it propagates in the air based on the angle value, refractive index and thickness;

[0105] The beam modulating element 22 in the beam shaping assembly 2 is adjusted based on the horizontal distance and the vertical distance.

[0106] Specifically, receiving processing topography parameters and brittle product parameters input by a user, wherein the processing topography parameters include a chamfer angle and a chamfer width, and the product parameters include a product refractive index and thickness, and calculating the horizontal distance and vertical distance between the focal points of the processing light beam when propagating in the air based on the chamfer angle and the chamfer width, the refractive index and the thickness;

[0107] Furthermore, since the number of focal points is certain and evenly distributed, after knowing the thickness of the brittle product and the angle value to be processed, the horizontal distance and vertical distance between each focal point in the brittle product can be obtained; the horizontal distance is the spacing distance perpendicular to the direction of light propagation, and the vertical distance is the spacing distance in the direction of light propagation.

[0108] Due to the different refractive indices of air and brittle materials, laser light will refract when it enters the brittle material from air. This is because the equation (transmission distance in air × air refractive index = transmission distance in the material × material refractive index) makes the laser focus in air deeper than the laser focus in the material. Therefore, when the vertical distance of the laser focus in air is 8 microns, the corresponding vertical distance of the laser inside the material must be divided by the corresponding refractive index. This allows the beam modulator 22 in the beam shaping assembly 2 to be adjusted based on the horizontal and vertical distances, so that the laser beam, after passing through the beam modulator 22, obtains a phase distribution corresponding to the horizontal and vertical distances of the focus in air.

[0109] By receiving and processing the refractive index, thickness and angle value to be processed of the product to be processed, the light beam modulation element 22 is regulated and controlled, and multiple focal points are arranged in the brittle product to be processed according to the angle value to be processed.

[0110] Obviously, the embodiments described above are only some of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present application specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present application.

Claims

1. A laser processing device for brittle products, characterized in that: The laser processing device includes: a laser, a beam shaping component and a focusing element; The laser is used to emit a laser beam; The beam shaping component is arranged on the output light path of the laser and is used to shape and modulate the laser beam emitted by the laser to obtain a modulated beam; The beam shaping component includes: a beam expansion and collimation element and a beam modulation element; The beam expansion and collimation element is arranged on the outgoing light path of the laser, and is used to expand and collimate the laser beam of the laser; After being emitted from the laser, the laser beam first enters the beam expansion and collimation element for beam expansion and collimation. After beam expansion and collimation, the amplitude of the laser beam on the cross section satisfies the Gaussian function, and the phase peak-to-valley difference is 0. The beam modulating element and the beam expanding and collimating element are coaxially arranged to modulate the laser beam after beam expansion and collimation to obtain a modulated beam with a preset phase distribution; The preset phase distribution has multiple arc-shaped belt-shaped areas, the phase of each area is sawtooth-shaped, the curvature centers of the arc-shaped belts are on the same straight line, and the width of the arc-shaped belts increases as the curvature radius decreases; The focusing element is disposed above the brittle product to be processed and is used to focus the modulated light beam to obtain a processing light beam having multiple focal points, wherein the focal points of the processing light beam are spaced apart by a predetermined distance in horizontal and vertical distances; Adjacent focal points are separated by a first distance perpendicular to the light propagation direction and a second distance along the light propagation direction. The positional relationship of the multiple focal points when propagating in the air corresponds to a preset phase distribution.

2. The laser processing device according to claim 1, wherein The beam expansion and collimation element includes at least two lenses arranged in parallel.

3. The laser processing device according to claim 1, wherein A reflecting element is further provided between the beam shaping component and the focusing element for reflecting the modulated light beam.

4. The laser processing device according to claim 1, wherein The focusing element is a high-power objective lens, the numerical aperture value of the high-power objective lens is between 0.4 and 0.8, and the magnification is greater than or equal to 20 times.

5. The laser processing device according to claim 1, wherein The laser processing device further comprises a stage for placing the fragile product, and the stage is placed directly below the focusing element.

6. The laser processing device according to claim 5, characterized in that The laser processing device further includes a motion component connected to the stage to control the movement of the stage.

7. The laser processing device according to claim 5, characterized in that The laser processing device further includes a grabbing assembly, which is disposed adjacent to the stage and is used to grab the brittle product before or after processing.

8. A laser processing method using the laser processing device according to any one of claims 1 to 7, characterized in that: The method comprises: The laser emits a laser beam, which is shaped and modulated by the beam shaping component to obtain a modulated beam, which is then focused by the focusing element to obtain a processing beam with multiple focal points. The beam shaping component includes: a beam expansion and collimation element and a beam modulation element; The beam expansion and collimation element is arranged on the outgoing light path of the laser, and is used to expand and collimate the laser beam of the laser; After being emitted from the laser, the laser beam first enters the beam expansion and collimation element for beam expansion and collimation. After beam expansion and collimation, the amplitude of the laser beam on the cross section satisfies the Gaussian function, and the phase peak-to-valley difference is 0. The beam modulating element and the beam expanding and collimating element are coaxially arranged to modulate the laser beam after beam expansion and collimation to obtain a modulated beam with a preset phase distribution; The preset phase distribution has multiple arc-shaped belt-shaped areas, the phase of each area is sawtooth-shaped, the curvature centers of the arc-shaped belts are on the same straight line, and the width of the arc-shaped belts increases as the curvature radius decreases; wherein the focal points of the processing light beams are at preset distances in terms of horizontal and vertical distances; Adjacent focal points are separated by a first distance perpendicular to the light propagation direction and a second distance along the light propagation direction, and a positional relationship of the multiple focal points when propagating in the air corresponds to a preset phase distribution; Controlling the processing light beam to project onto the brittle product to be processed according to a preset processing path for scanning, so that the brittle product to be processed forms a modified area along the processing path; The scanned product is placed in a preset corrosive solution for corrosion treatment, so that the material to be removed falls off the product along the processing path.

9. The laser processing method according to claim 8, characterized in that: Before the laser emits a laser beam and the laser beam is processed by a laser processing optical path, the method further includes: Receiving processing morphology parameters and product parameters corresponding to the product, wherein the product parameters include the refractive index and thickness of the product; Calculating the horizontal distance and vertical distance between the focal points of the processing light beam when it propagates in the air based on the processing topography parameters, refractive index and thickness; A beam modulating element in the beam shaping assembly is adjusted based on the horizontal distance and the vertical distance.

Images