An efficient silicon wafer clamping and transferring device and transfer method thereof

Abstract

The present invention discloses an efficient silicon wafer gripping and transfer device and a transfer method thereof, comprising a first component, a second component, a third component, and a fourth component. The first component comprises a mounting plate, one end of which is integrally formed with a raised block, an arc-shaped groove is formed between the raised block and the surface of the mounting plate, and the upper surface of the mounting plate is provided with a square hole. The second component comprises a handle and a fixed block, one end of the handle is provided with a fixed block, the bottom surface of the fixed block is uniformly provided with mounting grooves, and the thickness of the mounting grooves matches the thickness of the mounting plate surface. One end of the mounting plate is plugged into the mounting groove on the fixed block. The present invention can grip an entire basket of silicon wafers at a time, effectively improving transfer efficiency. After transfer, the surface of the silicon wafers can be inspected to ensure no contamination occurs, thereby effectively ensuring product quality.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon wafer polishing processing, and in particular relates to an efficient silicon wafer clamping and transferring device, and also relates to an efficient silicon wafer clamping and transferring method. Background Art

[0002] During semiconductor silicon wafer processing, especially polishing, wafer handling often requires gripping and transferring wafers. For example, transferring wafers between flower baskets or between flower baskets and other workpieces, such as quartz boats, often requires the use of tools. Existing gripping tools primarily consist of tweezers and vacuum pens. These tools clamp the wafers on both sides using the tweezers, or on one side using the vacuum generated by the vacuum pens. While these tools achieve the desired gripping and transfer, they suffer from several drawbacks. First, they are inefficient, as they can only grip one wafer at a time, significantly impacting efficiency for batch transfer operations. Second, they can easily damage the wafers. When gripping with tweezers, excessive force can cause chipping and render the wafer scrapped, as the tweezers grip the wafer's edge. Third, they can cause contamination. Both the tweezers and the vacuum pens come into contact with the wafer's surface, and particles or organic matter from the tweezers or pens can easily transfer to the wafer surface, causing contamination and impacting wafer quality. The transfer process between the flower basket and quartz boat is also accomplished using a wafer rewinder, utilizing a specially designed module with V-grooves to transfer the silicon wafers between the flower basket and quartz boat. However, in actual use, this is complicated, requiring multiple transfers between the two toolings. Furthermore, because the V-grooves have fixed dimensions, typically matching standard 625 or 525µm thickness silicon wafers, any deviation in the thickness of the clamped wafers can result in the wafers coexisting in three states: left-leaning, upright, and right-leaning. This can easily lead to misalignment during the next transfer, resulting in transfer failure and even wafer breakage. This poor versatility not only impacts efficiency but also can easily cause losses.

[0003] Therefore, achieving batch wafer gripping while improving wafer transfer efficiency and ensuring product quality has been a topic of ongoing research within the industry. The clamp of this invention, utilizing the principle of three points defining a plane, addresses efficiency issues during wafer gripping and transfer in a novel way, while effectively minimizing adverse product quality impacts. This approach is both efficient and safe. Summary of the Invention

[0004] The purpose of the present invention is to provide an efficient silicon wafer clamping and transfer device and a transfer method thereof, which can clamp a whole basket of silicon wafers at one time, effectively improve the transfer efficiency, check the surface of the silicon wafers after the transfer is completed, and ensure no contamination occurs, thereby effectively ensuring the quality of the product, so as to solve the problems in the prior art raised in the above background technology.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] An efficient silicon wafer gripping and transferring device comprises a first component, a second component, a third component, and a fourth component. The first component comprises a mounting plate, one end of which is integrally formed with a raised block, an arc-shaped groove is formed between the raised block and the surface of the mounting plate, and a square hole is formed on the upper surface of the mounting plate. The second component comprises a handle and a fixing block, one end of the handle is mounted with a fixing block, the bottom surface of the fixing block is uniformly formed with mounting grooves, and the thickness of the mounting grooves matches the thickness of the mounting plate surface. One end of the mounting plate is plugged into the mounting groove on the fixing block.

[0007] The fourth component includes a U-shaped frame, the U-shaped frame is fixed to the top surface of the fixed block, the two ends of the U-shaped frame are symmetrically provided with mounting holes, and the adjustable third component is installed on the U-shaped frame;

[0008] The third component includes a pressing handle, a cylindrical pin, a pressure strip and a limiting groove. The surface of the pressing handle is provided with a cylindrical pin, and the cylindrical pin is movably installed in the mounting hole of the U-shaped frame. A pressure strip is installed at the end of the pressing handle. The pressure strip has a limiting groove on the surface corresponding to the mounting piece. The limiting groove is a circular arc with the arc surface facing downward, and the diameter of the circular arc is 100-200mm.

[0009] Preferably, a square mounting strip is inserted into the fixing block, and the cross-sectional area of ​​the mounting strip matches the square hole provided on the mounting plate. The mounting strip is inserted into the fixing block, and the mounting strip passes through the mounting groove provided on the fixing block in sequence, and the mounting strip passes through the square hole on the mounting plate inserted into the mounting groove in sequence.

[0010] Preferably, threaded sections are integrally formed at both ends of the mounting bar, and locking nuts are screwed onto both ends of the mounting bar.

[0011] Preferably, the fixing block is an integrated structure made of aluminum alloy material, and the surface of the fixing block is provided with a PFA-coated protective layer.

[0012] Preferably, the bottom of the fixing block is provided with 1 to 30 installation grooves, and the installation grooves are spaced at the same intervals.

[0013] Preferably, the pressing handle and the pressing strip are in a flip-up lifting adjustment structure with a U-shaped frame as a fulcrum, and the lifting distance is 10-50 mm.

[0014] Preferably, a circular arc groove is provided on the surface of the protruding block itself, and the arc diameter of the circular arc groove is 50-200 mm.

[0015] An efficient silicon wafer clamping and transfer method, characterized by comprising the following steps:

[0016] S1. Hold the handle and manually press the handle to lift the downward pressure bar upward;

[0017] S2. Based on step 1, move the fixture so that each mounting piece of the first component is partially inserted into the gap between the silicon wafers to be removed. Lower the fixture parallel to the surface of the silicon wafer without touching the wafer until the upward protrusion extends beyond the top of the lower arc of the silicon wafer. Then, move the fixture horizontally so that the upward concave arc groove is aligned with the silicon wafer.

[0018] S3. Lift the fixture so that the upward-facing protrusions support the outer diameter of the silicon wafer. Then release the lower handle and lower the pressure bar until it presses on the outer diameter of the upper part of the silicon wafer. At this time, the various limit grooves on the pressure bar press the silicon wafer and cooperate with the upward-facing protrusions to clamp the silicon wafer.

[0019] S4. Lift the fixture vertically, and the fixture will lift the silicon wafer up and out of the basket.

[0020] S5. Use a clamp to carry the silicon wafer to the top of the quartz boat, align the slot with the silicon wafer on the quartz boat, lower the clamp to allow the silicon wafer to enter the slot, then press the pressing handle to lift the downward pressure bar, lower the clamp to separate the clamp from the silicon wafer, and move the clamp sideways in the opposite direction of clamping to completely separate the mounting plate from the silicon wafer. Lift the clamp so that the silicon wafer remains on the quartz boat, completing the transfer of the silicon wafer from the flower basket to the quartz boat.

[0021] Technical effects and advantages of the present invention: Compared with the prior art, the present invention provides an efficient silicon wafer gripping and transferring device and a transfer method thereof, which have the following advantages:

[0022] 1. The present invention provides an efficient silicon wafer clamping and transferring device that can clamp a whole basket of silicon wafers at one time and complete the transfer from the flower basket to the quartz boat in 10-15 seconds. The traditional single-wafer clamping transfer of 25 silicon wafers takes 150-200 seconds. The work efficiency of the present invention is significantly improved. After the transfer is completed, the surface of the silicon wafer is checked and no contamination occurs, thereby effectively ensuring the quality of the product.

[0023] 2. The pressing handle and the pressure strip are flipped and lifted with the U-shaped frame as the fulcrum, and the lifting distance is 10-50mm. The angle between the pressing handle and the pressure strip is adjustable, and the size of the angle can be adjusted according to the needs of the lifting space. A limit groove structure is provided to fix the silicon wafer, and the arc groove on the mounting plate can be used to complete the positioning of the silicon wafer during the clamping process, which can not only play an auxiliary fixing effect, but also correct the situation where the silicon wafer is not vertical, making the clamping and placement actions more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention;

[0025] Figure 2This is a schematic diagram of the main structure of the present invention;

[0026] Figure 3 This is a schematic diagram of the installation structure of the mounting plate;

[0027] Figure 4 This is a schematic structural diagram of the first component of the present invention;

[0028] Figure 5 This is a schematic structural diagram of the second component of the present invention;

[0029] Figure 6 This is a schematic structural diagram of the third component of the present invention;

[0030] Figure 7 This is a schematic structural diagram of the fourth component of the present invention.

[0031] In the figure: 1. First component; 101. Mounting plate; 102. Raised block; 103. Square hole; 2. Second component; 201. Handle; 202. Fixing block; 203. Mounting strip; 204. Locking nut; 3. Third component; 301. Pressing handle; 302. Column pin; 303. Pressing strip; 304. Limiting groove; 4. Fourth component; 401. U-shaped frame; 402. Mounting hole; 5. Silicon wafer. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. The specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] The present invention provides Figure 1-7The device for gripping and transferring a silicon wafer shown in the figure comprises a first component 1, a second component 2, a third component 3 and a fourth component 4. The first component 1 comprises a mounting plate 101, one end of which is integrally formed with a protruding block 102, an arc-shaped groove is formed between the protruding block 102 and the surface of the mounting plate 101, and a square hole 103 is opened on the upper surface of the mounting plate 101. The second component 2 comprises a handle 201 and a fixing block 202, one end of the handle 201 is mounted with the fixing block 202, and the bottom surface of the fixing block 202 is provided with a square hole 103. The surface is evenly provided with mounting grooves, and the thickness of the mounting grooves matches the surface thickness of the mounting piece 101. One end of the mounting piece 101 is plugged into the mounting groove on the fixed block 202. The mounting piece 101 is made of thin plate with a thickness of 1-2mm, a width of 15-45mm, a length of 120-200mm, and a diameter of the lower arc of 50-200mm. It is made of aluminum alloy rigid plate and its surface is coated with PP or PFA protective layer, which is convenient for hygienic cleaning and can prevent metal contamination.

[0034] A square mounting bar 203 is inserted into the fixing block 202, and the cross-sectional area of ​​the mounting bar 203 matches the square hole 103 provided on the mounting plate 101. The mounting bar 203 is inserted into the fixing block 202, and the mounting bar 203 sequentially passes through the mounting slots provided on the fixing block 202, and then the mounting bar 203 sequentially passes through the square hole 103 on the mounting plate 101 inserted into the mounting slot. The structural coordination of the mounting bar 203 provides a fixed position for each mounting plate 101, ensuring that each mounting plate 101 is parallel and consistent after installation, avoiding unevenness, and helping to ensure the clamping and transfer of the silicon wafer 5. The mounting bar 203 has a threaded section integrally formed at each end, and a locking nut 204 is screwed to each end of the mounting bar 203. The fixing block 202 is an integrated structure made of aluminum alloy, and the surface of the fixing block 202 is provided with a PFA-coated protective layer.

[0035] The fourth component 4 comprises a U-shaped frame 401, secured to the top surface of the fixed block 202. Mounting holes 402 are symmetrically defined at each end of the U-shaped frame 401. The adjustable third component 3 is mounted on the U-shaped frame 401. The bottom of the fixed block 202 is defined by 1 to 30 mounting slots, spaced uniformly. For silicon wafers 5 with a diameter of 6 inches or less, the spacing is 4.7 ± 0.3 mm; for 8-inch silicon wafers, the spacing is 6.5 ± 0.3 mm. The lower pressure handle 301 and the pressure bar 303, using the U-shaped frame 401 as a fulcrum, form a flip-up, adjustable lift mechanism, with a lift range of 10-50 mm.

[0036] The surface of the raised block 102 itself is provided with an arc groove, and the arc diameter of the arc groove is 50-200mm. The third component 3 includes a pressing handle 301, a cylindrical pin 302, a pressure strip 303 and a limiting groove (304). The surface of the pressing handle 301 is provided with a cylindrical pin 302, and the cylindrical pin 302 is movably installed at the mounting hole 402 of the U-shaped frame 401. The end of the pressing handle 301 is provided with a pressure strip 303. The pressure strip 303 is provided with a limiting groove 304 on the surface corresponding to the mounting plate 101. The limiting groove 304 is an arc with an arc surface facing downward, and the arc diameter is 100-200mm. The limiting groove 304 structure is provided to fix the silicon wafer 5. It can cooperate with the arc groove on the mounting plate 101 to complete the positioning of the silicon wafer 5 during the clamping process, which can not only play an auxiliary fixing effect, but also correct the situation where the silicon wafer 5 is not vertical, making the clamping and placement action more stable.

[0037] Example 1

[0038] Taking the transfer between the flower basket and the quartz boat as an example, use the following steps:

[0039] Step 1: Hold the handle 201 and manually press the pressing handle 301 to lift the downward pressing strip 303 upward;

[0040] Step 2: Based on step 1, move the fixture so that each mounting piece 101 of the first component 1 is partially inserted into the gap of the silicon wafer 5 to be removed, and probe downward parallel to the surface of the silicon wafer 5 without touching the silicon wafer 5 until the upward protrusion 102 extends beyond the top of the lower arc of the silicon wafer 5. Then move the fixture horizontally so that the upward concave arc groove is aligned with the silicon wafer 5;

[0041] Step 3: Lift the clamp upward so that the upward protrusion 102 supports the outer circumference of the silicon wafer 5, then release the lower pressing handle 301 to lower the holding bar 303 until it presses on the outer circumference of the upper part of the silicon wafer 5. At this time, the limiting grooves 304 on the holding bar 303 press the silicon wafer 5 and cooperate with the upward protrusion 102 to clamp the silicon wafer 5;

[0042] Step 4: Lift the fixture vertically, and the fixture will lift the silicon wafer 5 up together and separate from the basket;

[0043] Step 5: Use a clamp to carry the silicon wafer 5 to the top of the quartz boat, align the slot with the silicon wafer 5 on the quartz boat, lower the clamp to allow the silicon wafer 5 to enter the slot, then press the pressing handle 301 to lift the downward pressure bar 303, lower the clamp to separate the clamp from the silicon wafer 5, and move the clamp sideways in the opposite direction of clamping to completely disengage the mounting plate 101 from the silicon wafer 5. Lift the clamp so that the silicon wafer 5 remains on the quartz boat, completing the transfer of the silicon wafer 5 from the flower basket to the quartz boat.

[0044] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An efficient silicon wafer gripping and transferring device, comprising a first component (1), a second component (2), a third component (3) and a fourth component (4), characterized in that: The first component (1) includes a mounting plate (101), one end of the mounting plate (101) is integrally formed with a protruding block (102), an arc-shaped groove is formed between the protruding block (102) and the surface of the mounting plate (101), and a square hole (103) is provided on the upper surface of the mounting plate (101); the second component (2) includes a handle (201) and a fixing block (202), one end of the handle (201) is mounted with a fixing block (202), the bottom surface of the fixing block (202) is uniformly provided with mounting grooves in sequence, and the thickness of the mounting grooves matches the thickness of the surface of the mounting plate (101), and one end of the mounting plate (101) is plugged into the mounting groove on the fixing block (202); The fourth component (4) comprises a U-shaped frame (401), the U-shaped frame (401) being fixed to the top surface of the fixed block (202), the U-shaped frame (401) having mounting holes (402) symmetrically formed at both ends, and an adjustable third component (3) being mounted on the U-shaped frame (401); The third component (3) includes a pressing handle (301), a cylindrical pin (302), a pressure strip (303) and a limiting groove (304). The surface of the pressing handle (301) is provided with a cylindrical pin (302). The cylindrical pin (302) is movably mounted to the mounting hole (402) of the U-shaped frame (401). The end of the pressing handle (301) is provided with a pressure strip (303). The pressure strip (303) is provided with a limiting groove (304) on the surface at a position corresponding to the mounting plate (101). The limiting groove (304) is a circular arc with a downward arc surface and a diameter of the circular arc of 100-200 mm.

2. The efficient silicon wafer gripping and transferring device according to claim 1, characterized in that: A square mounting strip (203) is plugged into the fixing block (202), and the cross-sectional area of ​​the mounting strip (203) matches the square hole (103) provided on the mounting piece (101). The mounting strip (203) is plugged into the fixing block (202), and the mounting strip (203) sequentially penetrates the mounting slot provided on the fixing block (202), and the mounting strip (203) sequentially penetrates the square hole (103) on the mounting piece (101) plugged into the mounting slot.

3. The efficient silicon wafer gripping and transferring device according to claim 2, characterized in that: Both ends of the installation strip (203) are integrally formed with threaded sections, and both ends of the installation strip (203) are screwed with locking nuts (204).

4. The efficient silicon wafer gripping and transferring device according to claim 1, characterized in that: The fixing block (202) is an integrated structure made of an aluminum alloy material, and a PFA-coated protective layer is provided on the surface of the fixing block (202).

5. The efficient silicon wafer gripping and transferring device according to claim 1, characterized in that: The bottom of the fixing block (202) is provided with 1 to 30 installation grooves, and the spacing between the installation grooves is the same.

6. The efficient silicon wafer gripping and transferring device according to claim 1, characterized in that: The pressing handle (301) and the pressure strip (303) are in a flip-type lifting and adjusting structure with the U-shaped frame (401) as a fulcrum, and the lifting distance is 10-50 mm.

7. The efficient silicon wafer gripping and transferring device according to claim 1, characterized in that: The surface of the protruding block (102) is provided with an arc groove, and the arc diameter of the arc groove is 50-200 mm.

8. An efficient silicon wafer gripping and transfer method, characterized by: The silicon wafer gripping and transferring device according to claim 1 is used, and the steps are as follows: S1. Hold the handle (201) and manually press the handle (301) to lift the downward pressure strip (303) in linkage; S2. Based on step 1, the fixture is moved so that each mounting piece (101) of the first component (1) is partially inserted into the gap of the silicon wafer (5) to be removed, and the fixture is moved downward parallel to the surface of the silicon wafer (5) without touching the silicon wafer (5) until the upward protrusion (102) extends out of the top of the lower arc of the silicon wafer (5), and then the fixture is moved horizontally so that the upward concave arc groove is aligned with the silicon wafer (5); S3. Lift the clamp upward so that the upward protrusion (102) supports the outer circle of the silicon wafer (5), then release the pressing handle (301) to lower the pressure strip (303) until it presses on the outer circle of the upper part of the silicon wafer (5). At this time, the limiting grooves (304) on the pressure strip (303) press the silicon wafer (5) and cooperate with the upward protrusion (102) to clamp the silicon wafer (5); S4. Lift the fixture vertically, and the fixture drives the silicon wafer (5) to rise together and leave the basket; S5. Use a clamp to carry the silicon wafer (5) to the top of the quartz boat, align the silicon wafer (5) on the quartz boat with the slot, lower the clamp to allow the silicon wafer (5) to enter the slot, then press the pressing handle (301) to lift the downward pressure bar (303), lower the clamp to separate the clamp from the silicon wafer (5), move the clamp sideways in the opposite direction to the clamping direction, completely separate the mounting plate (101) from the silicon wafer (5), lift the clamp, and the silicon wafer (5) remains on the quartz boat, completing the transfer of the silicon wafer (5) from the flower basket to the quartz boat.

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