A bone conduction earphone head and bone conduction earphone

By sandwiching a flexible layer between the vibration-generating unit and the support assembly in the bone conduction headphone, and by setting up sound insulation components and a waterproof and breathable membrane, the impact of the vibration-generating unit on the circuit board and the sound leakage problem are solved, thereby improving the reliability of the circuit board and the sound quality.

CN115052222BActive Publication Date: 2026-04-03SUZHOU THOR ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-06-10
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

In existing bone conduction headphones, the contact between the vibration-generating unit and the circuit board can cause solder joints to fall off and sound leakage, affecting the reliability of the circuit board and the sound quality.

Method used

In bone conduction headphones, the vibration-generating unit is installed between the cover and the support assembly, with a flexible layer sandwiched between them. The flexible layer buffers vibrations, reducing the impact of vibrations on the housing and circuit board. At the same time, sound insulation components and a waterproof and breathable membrane are installed to reduce sound leakage.

Benefits of technology

It improves the reliability of the circuit board, reduces sound leakage, simplifies the installation process of the vibration sound-generating unit, and enhances assembly efficiency and product quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a bone conduction earphone head and a bone conduction earphone. The bone conduction earphone head includes a shell, a cover, a first circuit board, a vibration-generating unit, and a flexible layer. The shell includes a receiving cavity with one open end and a support assembly disposed within the receiving cavity; the cover is connected to the shell and seals the opening of the receiving cavity; the first circuit board is disposed within the receiving cavity and connected to the shell; the vibration-generating unit is disposed between the support assembly and the cover; the flexible layer is sandwiched between the support assembly and the vibration-generating unit, and separates the vibration-generating unit from the support assembly. In this invention, the flexible layer disposed between the vibration-generating unit and the support assembly can absorb the vibration transmitted from the vibration-generating unit to the shell, thereby helping to reduce the impact of vibration on the circuit board and reduce sound leakage.
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Description

Technical Field

[0001] This invention relates to the field of loudspeaker technology, and more particularly to a bone conduction headphone head and a bone conduction headphone. Background Technology

[0002] Bone conduction headphones use the principle of bone conduction to produce hearing. They include a bone conduction headpiece, which contacts the skin of the face and generates sound waves through mechanical vibration. The sound waves travel through the skull, causing corresponding fluctuations in the perilymph and stimulating the cochlea's spiral organ to produce hearing.

[0003] The bone conduction headphone contains a vibration sound-generating unit and a circuit board electrically connected to the vibration sound-generating unit. The circuit board is connected to the control compartment and battery compartment of the bone conduction headphone via a cable, which can power the vibration sound-generating unit and control its vibration.

[0004] The vibration of the vibration-generating unit has an adverse effect on the normal operation of the circuit board. For example, it may cause solder joints on the circuit board to fall off, resulting in poor contact. In the prior art, the vibration-generating unit is in direct contact with the bottom of the housing, which will have a significant impact on the circuit board installed at the bottom of the housing. In addition, the direct contact between the vibration-generating unit and the bottom of the housing will directly drive the bottom of the housing to vibrate, which can easily lead to sound leakage problems.

[0005] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0006] The purpose of this invention is to provide a bone conduction headphone and a bone conduction headphone that can reduce the impact of vibration on the circuit board and reduce sound leakage.

[0007] To achieve the above-mentioned objectives, in a first aspect, the present invention provides a bone conduction headphone head, comprising:

[0008] The housing includes a receiving cavity open at one end and a support assembly disposed within the receiving cavity;

[0009] A cover, connected to the housing, and sealing the opening of the receiving cavity;

[0010] A first circuit board is disposed within the receiving cavity and connected to the housing;

[0011] A vibration-generating sound unit is disposed between the support assembly and the cover; and,

[0012] A flexible layer is sandwiched between the support assembly and the vibration sound-generating unit, and separates the vibration sound-generating unit from the support assembly.

[0013] Furthermore, the housing includes a base plate disposed opposite to the opening and a peripheral side plate connected to the outer periphery of the base plate, and the support assembly is connected to the base plate and / or the peripheral side plate.

[0014] Furthermore, the support assembly includes a support column connected to the base plate, the support column passing through the first circuit board and abutting against the flexible layer.

[0015] Furthermore, the support assembly includes stiffening plates connected to the base plate and / or the peripheral side plate, the stiffening plates extending above the first circuit board and abutting against the flexible layer.

[0016] Furthermore, the first circuit board is provided with a micro switch facing the base plate, the base plate has a button through hole corresponding to the micro switch, and the bone conduction earphone head also includes a button assembly disposed in the button through hole.

[0017] Furthermore, the button assembly includes an elastic layer connected to the base plate, an abutting member connected to the elastic layer and abutting against the micro switch, and a pressing member connected to the abutting member. The elastic layer, the abutting member, and the pressing member cooperate to seal the button through hole.

[0018] Furthermore, the first circuit board includes a microphone, the housing has a microphone hole corresponding to the microphone, and the bone conduction headphone also includes a sound insulation component disposed between the housing and the first circuit board. The sound insulation component is provided with a waterproof and breathable membrane corresponding to the microphone hole, and the sound entering through the microphone hole is transmitted to the microphone through the waterproof and breathable membrane.

[0019] Furthermore, the sound insulation component includes a sound insulation ring that abuts against the first circuit board, the sound insulation ring surrounding the outside of the microphone's pickup diaphragm, and the waterproof and breathable membrane covering the central hole of the sound insulation ring.

[0020] Furthermore, the housing has a guide hole communicating with the microphone hole, and the waterproof and breathable membrane covers the guide hole.

[0021] Furthermore, the flexible layer is made of foam, sponge, EVA, rubber, or silicone.

[0022] Furthermore, the vibration sound-generating unit includes an annular outer shell and a spring piece connected to the end of the outer shell, and the cover includes a convex ring surrounding the end of the outer shell and a relief cavity to avoid vibration of the spring piece.

[0023] Furthermore, the vibration sound-generating unit also includes an end plate connected to the housing and a second circuit board connected to the end plate. The end plate and the spring are respectively connected to both ends of the housing. The second circuit board is located outside the housing. The flexible layer is provided with avoidance holes to avoid the pads on the second circuit board.

[0024] Furthermore, the spring includes an outer support connected to the end face of the outer shell, a central body located within the outer support, and an elastic arm connecting the outer support and the central body;

[0025] The vibration sound-generating unit further includes a vibration component and a coil component. The vibration component includes a magnetic cup connected to the central body and a first magnet connected inside the magnetic cup. The coil component includes a coil and a second magnet, both connected to the end plate. The second magnet is disposed inside the coil and is arranged opposite to the first magnet with the same pole. The coil is electrically connected to the solder pad.

[0026] Furthermore, the bone conduction headphone also includes a soft layer connected to the outer surface of the cover body, the soft layer having a plurality of protrusions protruding away from the cover body.

[0027] Furthermore, the thickness of the protrusion protruding from the soft layer is 0.1 to 3 mm.

[0028] In a second aspect, the present invention also provides a bone conduction headphone, comprising two bone conduction headphone heads as described in any of the preceding claims, wherein the two bone conduction headphone heads are a first bone conduction headphone head and a second bone conduction headphone head;

[0029] The bone conduction headphones also include:

[0030] The control compartment includes a main control board for controlling the first bone conduction earpiece and the second bone conduction earpiece;

[0031] The battery compartment includes a power supply for powering the first bone conduction earpiece, the second bone conduction earpiece, and the main control board;

[0032] The first ear hook is connected between the first bone conduction headphone and the control chamber;

[0033] The second ear hook connects between the second bone conduction earphone head and the battery compartment; and...

[0034] A neck strap connects the control compartment and the battery compartment.

[0035] Furthermore, both the first ear hook and the second ear hook include a first outer skin layer and a first cable passing through the first outer skin layer. One end of the first cable of the first ear hook is electrically connected to the main control board, and the other end is electrically connected to the first circuit board of the first bone conduction earphone head. One end of the first cable of the second ear hook is electrically connected to the power supply, and the other end is electrically connected to the first circuit board of the second bone conduction earphone head.

[0036] The neckband includes a second outer sheath and a second cable passing through the second outer sheath. One end of the second cable is electrically connected to the main control board, and the other end is electrically connected to the power supply.

[0037] Furthermore, the ends of the first ear hook, the second ear hook, and the neckband are all provided with connectors, and the first bone conduction headphone, the second bone conduction headphone, the control compartment, and the battery compartment are all provided with connector holes adapted to the connectors.

[0038] Furthermore, the first ear hook and / or the second ear hook and / or the neckband are provided with a soft rubber layer covering the outer periphery of the connector at its end, and the soft rubber layer is tightly fitted with the connector hole.

[0039] Furthermore, both the first ear hook and the second ear hook include a first elastic metal wire passing through the first outer skin layer, and the neck strap includes a second elastic metal wire passing through the second outer skin layer. The ends of both the first elastic metal wire and the second elastic metal wire are provided with concave recesses and / or convex protrusions, and the connector covers the end of the elastic metal wire.

[0040] Furthermore, the control compartment includes a control box and a light source electrically connected to the main control board. The main control board is disposed inside the control box. The control box has a light-transmitting hole corresponding to the position of the light source. The control compartment also includes a panel covering the light-transmitting hole. The panel has a light-transmitting part for light to pass through.

[0041] Furthermore, the control compartment also includes a flexible circuit board electrically connected to the main control board. The flexible circuit board has a relief groove to avoid the light from the light source, and a capacitor is provided on the flexible circuit board for sensing touch signals on the panel.

[0042] Furthermore, the control compartment also includes a light guide column located between the light source and the light-transmitting part, the light guide column being located within the clearance groove.

[0043] Furthermore, the control compartment also includes a light diffusion film attached to the surface of the panel facing the light source, the light diffusion film covering the light-transmitting portion.

[0044] Compared with the prior art, the present invention has at least the following beneficial effects:

[0045] 1. In this invention, the vibration sound-generating unit is installed between the cover and the support assembly, and a flexible layer is provided to separate the vibration sound-generating unit and the support assembly. The vibration of the vibration sound-generating unit can be buffered and absorbed by the flexible layer 5, thereby reducing the vibration energy transmitted to the shell, which is beneficial to reduce the vibration of the first circuit board, improve its working reliability, and also reduce the sound leakage caused by the vibration of the shell.

[0046] 2. In this invention, the vibration sound-generating unit can be installed as a whole, simply by clamping it between the cover and the support assembly. Installation is very convenient, facilitating automation and improving assembly efficiency. As an improvement, the cover is provided with a protruding ring surrounding the end of the outer shell of the vibration sound-generating unit, which facilitates the installation and positioning of the unit, further simplifying assembly and improving assembly quality. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of the structure of a first bone conduction earphone head according to one embodiment of the present invention.

[0048] Figure 2 yes Figure 1 The image shows a side view of the first bone conduction headphone.

[0049] Figure 3 It is along Figure 2 The sectional view obtained by cutting along section line AA.

[0050] Figure 4 yes Figure 1 The diagram shows the structural structure of the housing of the first bone conduction earphone.

[0051] Figure 5 yes Figure 4 The diagram shows the structure of the housing with the first circuit board mounted on it.

[0052] Figure 6 The flexible layer 5 is installed on Figure 5 The diagram shows the internal structure of the shell.

[0053] Figure 7 This is a schematic diagram of the cover body according to one embodiment of the present invention.

[0054] Figure 8 This is a schematic diagram showing the connection between the cover and the vibration sound-generating unit in one embodiment of the present invention.

[0055] Figure 9 This is a schematic diagram of the structure of a vibration sound-generating unit according to one embodiment of the present invention.

[0056] Figure 10yes Figure 9 The diagram shows the position of the vibration-generating unit and the flexible layer.

[0057] Figure 11 This is the front view of the cover in this invention.

[0058] Figure 12 It is along Figure 11 The sectional view obtained by cutting along the DD section line.

[0059] Figure 13 yes Figure 1 The diagram shows the structure of the bone conduction headphone housing, button assembly, and first circuit board.

[0060] Figure 14 This is a side view of the second bone conduction headphone head according to one embodiment of the present invention.

[0061] Figure 15 It is along Figure 14 A sectional view obtained by cutting along the BB section line.

[0062] Figure 16 yes Figure 14 A schematic diagram of the middle shell structure.

[0063] Figure 17 yes Figure 14 The diagram shows the structure of the housing with the first circuit board mounted on it.

[0064] Figure 18 yes Figure 14 A three-dimensional schematic diagram of the second bone conduction earpiece is shown.

[0065] Figure 19 yes Figure 14 The diagram shown illustrates the housing with sound insulation components installed.

[0066] Figure 20 This is a schematic diagram showing the positions of the sound insulation component, guide hole, and microphone hole in this invention.

[0067] Figure 21 This is a schematic diagram of the structure of a bone conduction headphone according to one embodiment of the present invention.

[0068] Figure 22 This is an exploded view of the control compartment according to one embodiment of the present invention.

[0069] Figure 23 This is an exploded view of the battery compartment according to one embodiment of the present invention.

[0070] Figure 24 This is a schematic diagram of the ear hook structure according to one embodiment of the present invention.

[0071] Figure 25 yes Figure 24The exploded view of the ear hook shown.

[0072] Figure 26 This is a schematic diagram of the structure of a neck brace according to one embodiment of the present invention.

[0073] Figure 27 yes Figure 26 The exploded view of the neck strap shown.

[0074] Figure 28 This is a schematic diagram of the structure when the connector is connected to the battery box according to one embodiment of the present invention.

[0075] Figure 29 This is a schematic diagram of the main control board and control box according to one embodiment of the present invention.

[0076] Figure 30 This is a cross-sectional view of the control chamber according to one embodiment of the present invention, in which the control chamber is provided with a light guide column.

[0077] Figure 31 yes Figure 29 The diagram shows a structure with a light guide column.

[0078] Figure 32 This is a cross-sectional view of the control chamber according to one embodiment of the present invention. The control chamber is provided with a light diffusion film.

[0079] Figure 33 This is a schematic diagram of a light diffusion film connected to a panel according to one embodiment of the present invention. Detailed Implementation

[0080] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0081] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0082] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0083] like Figures 1 to 20 As shown, the present invention proposes a bone conduction headphone head, including a shell 1, a cover 2, a first circuit board 3, a vibration sound generating unit 4, and a flexible layer 5.

[0084] like Figure 3 As shown, the housing 1 includes a base plate 11 and a peripheral side plate 12 connected to the outer periphery of the base plate 11. The peripheral side plate 12 surrounds the outer periphery of the base plate 11 and forms a receiving cavity 10 with the base plate 11. Obviously, the upper end of the receiving cavity 10 is open. The housing 1 also includes a support assembly disposed in the receiving cavity 10. The support assembly can be connected to the base plate 11 or the peripheral side plate 12, or it can be connected to both the base plate 11 and the peripheral side plate 12 at the same time.

[0085] The cover 2 is connected to the housing 1, and is connected to the open end of the housing 1, sealing the opening of the receiving cavity 10, so that a sealed space is formed between the housing 1 and the cover 2. The first circuit board 3, the vibration sound generating unit 4 and the flexible layer 5 are all disposed in the receiving cavity 10.

[0086] The first circuit board 3 is connected to the housing 1, preferably to the base plate 11 of the housing 1. The connection method can be, for example, adhesive bonding, screw bonding, or thermoplastic bonding. In some embodiments, such as... Figures 3 to 5 As shown, the first circuit board 3 is directly connected to the bottom plate 11 of the housing 1. The bottom plate 11 has a hot-melt column 111 protruding into the receiving cavity 10. The hot-melt column 111 extends through the first circuit board 3 to above it, serving to position the first circuit board 3 and simultaneously fixing it in place by hot-melting its upper end. In other embodiments, such as... Figures 15 to 17 As shown, the base plate 11 is provided with a plurality of first protrusions 115 protruding toward the receiving cavity 10. The first circuit board 3 is placed on the first protrusions 115, supported by the first protrusions 115, and connected to the first protrusions 115 by screws 32. The base plate 11 is also provided with a plurality of hot melt pillars 111, which serve to position and fix the first circuit board 3.

[0087] The vibration-generating unit 4 is electrically connected to the first circuit board 3 and is capable of generating vibration. (Reference) Figure 3 and Figure 15The vibration sound-generating unit 4 is located between the support component and the cover 2, and the flexible layer 5 is located between the support component and the vibration sound-generating unit 4, separating the vibration sound-generating unit 4 and the support component. The cover 2 and the support component have a clamping force on the vibration sound-generating unit 4 and the flexible layer 5 inside, so as to fix the vibration sound-generating unit 4. That is to say, the flexible layer 5 is clamped between the vibration sound-generating unit 4 and the support component, and it generates a certain elastic deformation, so that the vibration sound-generating unit 4 and the cover 2 remain in contact.

[0088] The vibrating sound-generating unit 4 has its two ends along its vibration axis A in contact with the cover 2 and the flexible layer 5, respectively. During vibration, it can directly transmit the vibration through the cover 2 to the facial skin that is in contact with the cover 2, thus achieving bone conduction sound transmission. Because the flexible layer 5 is provided between the housing 1 and the vibrating sound-generating unit 4, the vibration of the vibrating sound-generating unit 4 can be buffered and absorbed by the flexible layer 5. Compared to direct transmission to the housing 1, this reduces the vibration energy transmitted to the housing 1, thereby mitigating sound leakage caused by the vibration of the housing 1. Simultaneously, the amount of vibration experienced by the first circuit board 3 is reduced, which helps improve its operational reliability. Furthermore, in this invention, the vibrating sound-generating unit 4 can be assembled as a whole; it only needs to be clamped between the cover 2 and the support assembly at both ends, making installation more convenient and improving production efficiency.

[0089] In some embodiments, such as Figure 4 , Figure 5 , Figure 6 , Figure 16 and Figure 17 As shown, the support assembly includes a stiffener 121 connected to the base plate 11 and the peripheral side plate 12. The stiffener 121 is integrally injection molded with the base plate 11 and the peripheral side plate 12 and is located outside the first circuit board 3. The upper end of the stiffener 121 extends above the first circuit board 3 and abuts against the flexible layer 5. Preferably, the vibration sound-generating unit 4 is at least partially located directly above the stiffener 121 so that the stiffener 121 can provide better support for the vibration sound-generating unit 4. In other embodiments, the support assembly includes a support column (not shown in the figure, but refer to the structure of the hot-melt column 111) connected to the base plate 11. The support column passes through the first circuit board 3 and extends above the first circuit board 3, thereby abutting against the flexible layer 5. The support column also serves to position the first circuit board 3. Preferably, the support column is located directly below the vibration sound-generating unit 4. It is understood that the support assembly may include both the stiffener 121 and the support column.

[0090] The flexible layer 5 is made of materials such as foam, sponge, EVA, rubber or silicone, and its cross-sectional shape is preferably the same as that of the vibrating sound-generating unit 4. For example, when the vibrating sound-generating unit 4 is cylindrical, the outer contour of the flexible layer 5 is also cylindrical.

[0091] like Figure 4 and Figure 7 As shown, to improve the sealing between the cover 2 and the housing 1, the cover 2 is provided with an outwardly protruding annular flange 24, and the housing 1 is provided with an annular groove 16 that matches the annular flange 24. The annular flange 24 is installed in the annular groove 16, and the two are connected by adhesive, which can achieve the effect of fixing and sealing. The cover 2 is also provided with a positioning post 25 protruding towards the housing 1. Correspondingly, the housing 1 is provided with a positioning hole 17 that matches the positioning post 25. The accurate positioning of the cover 2 and the housing 1 is achieved by the mating of the positioning post 25 and the positioning hole 17, which can further enhance the connection strength between the cover 2 and the housing 1.

[0092] In some embodiments, reference Figure 8 The vibration sound-generating unit 4 includes a housing 40, a spring piece 41 and an end plate 42 respectively connected to both ends of the housing 40, a vibration component 43 connected to the spring piece 41 and a coil component 44 connected to the end plate 42, and the vibration component 43 and the coil component 44 are both located inside the housing 40.

[0093] The outer casing 40 is annular with openings at both ends. Spring plates 41 and end plates 42 are respectively connected to the end faces at both ends of the outer casing 40 and cover the openings. The vibration assembly 43 and the coil assembly 44 are both housed within the outer casing 40. The outer casing 40 may, for example, be made of non-magnetic stainless steel.

[0094] Further reference Figure 9 The spring piece 41 includes an outer support 410 connected to the end face of the outer casing 40, a central body 411 located at the center of the outer support 410, and an elastic arm 412 connecting the outer support 410 and the central body 411. The vibration assembly 43 includes a magnetic cup 430 connected to the central body 411 and a first magnet 431 connected inside the magnetic cup 430. The magnetic cup 430 is made of a magnetic material and can be attracted by magnetic force. The first magnet 431 is made of a magnetic material, such as a magnet or a magnetic steel, and can be connected to the magnetic cup 430 by means of adhesive or welding.

[0095] The coil assembly 44 includes a coil 440 and a second magnet 441 disposed within the coil 440. Both the coil 440 and the second magnet 441 are connected to the end plate 42. The first magnet 431 and the second magnet 441 are arranged opposite each other with the same poles and have a gap space 45 between them to provide space for the vibration assembly 43 to vibrate. The end plate 42 and the magnetic cup 430 are both made of magnetically conductive material and can be attracted by magnets. There is a first attraction between the first magnet 431 and the end plate 42, and a second attraction between the second magnet 441 and the magnetic cup 430. In a preferred embodiment, the repulsive force between the first magnet 431 and the second magnet 441 is equal in magnitude and opposite in direction to the resultant force of the first attraction and the second attraction, so that a static balance is formed between the vibration assembly 43 and the coil assembly 44, which is beneficial to improving the vibration performance and sensitivity of the vibration assembly 43.

[0096] When the coil 440 is energized, it generates a magnetic field, which in turn generates a magnetic force that drives the vibration component 43 to vibrate. The spring 41 provides a spring force to drive the vibration component 43 to reset. It can be understood that the vibration axis of the vibration component 43 is the same as the vibration axis of the vibration sound generating unit 4.

[0097] In a preferred embodiment, the second magnet 441 does not extend beyond the upper end face of the coil 440, so that the distance between the vibration assembly 43 and the coil assembly 44 can be smaller, while the driving force of the coil assembly 44 on the vibration assembly 2 can be greater.

[0098] The vibrating sound-generating unit 4 has an end of a spring piece 41 connected to the cover 2. Specifically, the cover 2 includes a protruding ring 20 surrounding the end of the outer shell 40. The end of the vibrating sound-generating unit 4 is fitted inside the protruding ring 20 and can be limited by the protruding ring 20, which facilitates the installation and positioning of the vibrating sound-generating unit 4. At the same time, the inner surface 23 of the cover 2 that contacts the vibrating sound-generating unit 4 is provided with a relief cavity 21 to avoid the vibration of the spring piece 41. The inner surface 23 is annular and is correspondingly arranged with the outer support 410 of the spring piece 41 and the outer shell 40. The relief cavity 21 is arranged opposite to the elastic arm 412 and the central body 411, which can prevent the vibrating component 43 from impacting the cover 2 during vibration.

[0099] refer to Figure 8 and Figure 10 The vibration-generating unit 4 also includes a second circuit board 46 connected to the outer surface of the end plate 42. The second circuit board 46 is provided with a plurality of solder pads 460, some of which are used for soldering to the leads of the coil 440, and some of which are used for wiring to external circuits (such as the first circuit board 5). The flexible layer 5 is provided with clearance holes 50, which surround the outside of the solder pads 430 to avoid the solder pads 430. This facilitates wiring and prevents the flexible layer 5 from directly contacting the solder joints, thus affecting the reliability of the solder joint.

[0100] like Figure 4 As shown, the housing 1 is also provided with a connector hole 87 that communicates with the receiving cavity 10. The cable outside the bone conduction headphone can enter the receiving cavity 10 through the connector hole 87, thereby connecting with the internal components, such as the first circuit board 5 or the second circuit board 5.

[0101] like Figure 1 , Figure 11 and Figure 12 As shown, the bone conduction headphone also includes a soft layer 22 attached to the outer surface of the cover 2. The soft layer 22 is made of materials such as silicone and is used to contact human skin to improve comfort. The outer end face 220 of the soft layer 22 that contacts the skin has several protrusions 221 that protrude away from the cover 2. During use, the protrusions 221 fit more closely to the skin, allowing vibrations to be transmitted more directly to the skin, reducing energy loss and thus increasing volume.

[0102] In a preferred embodiment, the thickness of the protrusion 221 protruding from the soft layer 22 is 0.1–3 mm, more preferably 0.1–1 mm, and even more preferably 0.2–0.5 mm. Further, as... Figure 1 As shown, the protrusions 221 on the soft layer 22 form a cat paw shape, which can enhance the aesthetics. There are five protrusions 221, namely one large protrusion on one side and four small protrusions on the other side. Preferably, the thickness of the large protrusion protruding from the soft layer 22 is 0.1 to 0.6 mm greater than the thickness of the small protrusions protruding from the soft layer 22.

[0103] In some embodiments, the normal B of the outer end face 220 is parallel to or coincides with the vibration axis A, and the angle between them is 0 degrees. In other embodiments, reference... Figure 12 The normal B of the outer end face 220 is inclined relative to the vibration axis A, forming an angle C between them, so that the soft layer 22 can make closer contact with the skin. Preferably, the angle C ranges from 0 to 35°, and more preferably, the angle C ranges from 0 to 10°. The inclination angle of the normal B of the outer end face 220 can be changed by making the soft layer 22 into a form with uneven wall thickness. In the figure, the thickness of the soft layer 22 increases from left to right.

[0104] refer to Figure 21 Bone conduction headphones typically consist of two bone conduction headphone heads, one for each ear. Different components can be installed on each head to provide different functions. For example, one head can have buttons for power on / off, play / pause, and track skipping, while the other head can have a microphone for sound pickup and noise reduction. For ease of description, the two headphone heads will be referred to as the first bone conduction headphone head 8 and the second bone conduction headphone head 80 below.

[0105] like Figure 3 , Figure 4 and Figure 13 As shown in the figure, a first bone conduction earphone head 8 according to an embodiment is provided, which is equipped with a button assembly 6. Specifically, the first circuit board 3 of the first bone conduction earphone head 8 is provided with a micro switch 30 facing the base plate 11. The base plate 11 has a button through hole 110 corresponding to the micro switch 30, and the button assembly 6 is disposed in the button through hole 110. By pressing the button assembly 6, the micro switch 30 can be triggered to perform functions such as power on / off, play, pause, and track skipping.

[0106] In some embodiments, the button assembly 6 includes an elastic layer 60 connected to the base plate 11, an abutment 61 connected to the elastic layer 60 and corresponding to the micro switch 30, a pressing member 62 connected to the abutment 61, and a decorative plate 63 connected to the pressing member 62. The elastic layer 60, the abutment 61, and the pressing member 62 cooperate to seal the button through hole 110. The elastic layer 60 is preferably made of silicone, and it can be molded together with the housing 1 by two-color injection molding. The abutment 61 is located in the middle of the elastic layer 60, and the pressing member 62 is fixedly connected to the abutment 61. The pressing member 62 has a larger plate area than the abutment 61, thereby facilitating pressing. The abutment 61 and the pressing member 62 are preferably made of rigid plastic parts, which facilitates injection molding. When the pressing member 62 is pressed down, the pressing member 62 drives the abutment member 61 to press down the micro switch 30. At the same time, the elastic layer 60 undergoes elastic deformation. After the pressing member 62 is released, the elastic layer 60 drives the abutment member 61 and the pressing member 62 back to their original positions.

[0107] The button assembly 6 also includes a decorative metal piece 63 disposed on the exterior of the pressing member 62. A knurled pattern can be provided on the surface of the decorative piece 63, making the bone conduction headphone more aesthetically pleasing and providing greater friction and a better feel during use. Understandably, to improve the overall aesthetics of the bone conduction headphones, such as… Figure 15 As shown, although the second bone conduction headphone 80 does not have a button assembly 6, it can still be equipped with the same decorative plate 63 to make the two bone conduction headphone heads more symmetrical.

[0108] Preferably, a recessed mounting groove 114 is provided on the outer surface of the base plate 11, and the button assembly 6 is disposed in the mounting groove 114. The mounting groove 114 can play a guiding role, making it easier to press the button assembly 6. At the same time, the protrusion height of the pressing assembly 6 is smaller, which is more aesthetically pleasing.

[0109] like Figures 14 to 18 As shown in the figure, a second bone conduction earphone head 80 according to an embodiment is illustrated, which has the functions of sound pickup and noise reduction. Specifically, as shown... Figure 17As shown, the first circuit board 3 of the second bone conduction headphone 80 includes a microphone 31. The number of microphones 31 is usually two. One of the two microphones 31 is mainly used to receive the user's voice (speech), and the other is mainly used to receive ambient sound (background noise) for active noise reduction, thereby realizing the functions of sound pickup and noise reduction.

[0110] In order to ensure that external sounds are received more clearly by microphone 31, such as Figure 18 As shown, the housing 1 has a microphone hole 13 corresponding to the microphone 31, and sound can be directly transmitted to the microphone 31 through the microphone hole 13. Furthermore, the bone conduction headphone also includes a sound insulation component 7 disposed between the housing 1 and the first circuit board 3. The sound insulation component 7 is provided with a waterproof and breathable membrane 70 communicating with the microphone hole 13. The waterproof and breathable membrane 70 has the functions of waterproofing and sound transmission, which can prevent external moisture from entering the bone conduction headphone, and the sound entering from the microphone hole 13 can be transmitted to the microphone 31 through the waterproof and breathable membrane 70.

[0111] like Figure 20 As shown, the sound insulation component 7 also includes a sound insulation ring 71, which covers the outside of the microphone 31's pickup diaphragm. Specifically, a waterproof and breathable membrane 70 is connected to one end of the sound insulation ring 71, covering the central hole 710 of the sound insulation ring 71. The sound insulation ring 71 abuts against the first circuit board 3 and surrounds the outside of the microphone 31's pickup diaphragm, which can improve the blocking effect of external sound and prevent the sound inside the central hole 710 from escaping to the outside of the sound insulation component 7.

[0112] The sound insulation component 7 is made of foam, sound-absorbing cotton, sponge, or other materials with sound insulation and sound absorption effects. It is clamped between the first circuit board 3 and the base plate 11 and can play a sealing role. Since the sound insulation component 7 has a noise reduction function, external sounds can be better transmitted to the microphone 31 through the microphone hole 13, reducing the sound leakage to the outside. The sound transmitted from outside the microphone hole 13 to the housing cavity 10 (such as the sound from another microphone hole 13 or the sound transmitted through the housing 1) can be absorbed by the sound insulation component 7, reducing sound interference. This makes the sound signal picked up by the microphone 31 more accurate and clear, and also achieves a better active noise reduction effect.

[0113] The axis of microphone hole 13 does not necessarily point directly to microphone 31, such as... Figure 16 and Figure 17As shown, a guide hole 14 can be provided to transmit the sound from the microphone hole 13 to the microphone 31. Specifically, a second boss 112 protruding into the receiving cavity 10 is provided on the base plate 11. The second boss 112 has a positioning groove 113 adapted to the sound insulation component 7. The sound insulation component 7 is partially disposed in the positioning groove 113 and is limited by the positioning groove 113. The guide hole 14 is formed on the bottom surface of the positioning groove 113 and communicates with the microphone hole 13. The sound insulation component 7 and the microphone 31 are located directly above the guide hole 14, and the axis of the microphone hole 13 is perpendicular to the guide hole 14.

[0114] The axes of the two microphone holes 13 are at an angle. In a preferred embodiment, the angle between the positive directions of the axes of the two microphone holes 13 is not less than 70°, so that the correlation of the sounds collected by the two microphones 31 is low, thereby improving the noise reduction effect. More preferably, the angle between the positive directions of the axes of the two microphone holes 13 is 90°. At this point, the correlation of the sounds collected by the two microphones 31 is minimal, and the noise reduction effect is optimal. The positive direction of the axis refers to the direction from the inside of the receiving cavity 10 to the outside.

[0115] This invention also proposes a bone conduction headphone, such as Figure 21 As shown, it includes two bone conduction headphone heads as described above. Further, the two bone conduction headphone heads are the first bone conduction headphone head 8 and the second bone conduction headphone head 80 as described above.

[0116] The bone conduction headphones also include a control compartment 81, a battery compartment 82, a first ear hook 83 connected between the control compartment 81 and the first bone conduction headphone 80, a second ear hook 84 connected between the battery compartment 82 and the second bone conduction headphone 80, and a neckband 85 connected between the control compartment 81 and the battery compartment 82.

[0117] like Figure 22 As shown, the control compartment 81 includes a control box 811, a control box cover 812 that seals the control box 811, and a main control board 810 disposed inside the control box 811. The main control board 810 is used to control the vibration sound generation unit 4 inside the two bone conduction earphone heads to vibrate and generate sound.

[0118] like Figure 23 As shown, the battery compartment 82 includes a battery box 821, a battery box cover 822 that seals the battery box 821, and a power supply 820 disposed inside the battery box 821. The power supply 820 may be, for example, a rechargeable lithium battery, used to power the electronic components of the bone conduction headphones, such as the main control board 810 and the vibration sound generation unit 4.

[0119] Preferably, the control compartment 81 and the battery compartment 82 have the same shape, so that the entire bone conduction headphones are more symmetrical and aesthetically pleasing, and the force is more even and comfortable when worn.

[0120] Both the first ear hook 83 and the second ear hook 84 are arc-shaped. The control compartment 81, the battery box 821, and the two bone conduction headphone heads all protrude to the same side. When worn, the first ear hook 83 and the second ear hook 84 are hooked above the ears. The first bone conduction headphone head 8 and the control compartment 81, as well as the second bone conduction headphone head 80 and the battery box 82, are located on the sides of the corresponding ears, and the two bone conduction headphone heads are clamped tightly on both sides of the head. In this way, the bone conduction headphones are worn more securely and are not easy to fall off.

[0121] like Figure 24 and Figure 25 As shown, the first ear hook 83 and the second ear hook 84 have the same structure, both including a first outer sheath 831, two connectors 86 respectively connected to both ends of the first outer sheath 831, and a first cable 830 and a first elastic metal wire 832 passing through the first outer sheath 831. The connectors 86 extend from both ends of the first cable 830 to facilitate wiring to electrical components. One end of the first cable 830 of the first ear hook 83 is electrically connected to the main control board 810, and the other end is electrically connected to the first circuit board 3 of the first bone conduction earphone head 8. One end of the first cable 830 of the second ear hook 84 is electrically connected to the power supply 820, and the other end is electrically connected to the circuit board 3 of the second bone conduction earphone head 80.

[0122] like Figure 26 and Figure 27 As shown, the neckband 85 includes a second outer sheath 851, two connectors 86 connected to both ends of the second outer sheath 851, and a second cable 850 and a second elastic metal wire 852, both passing through the second outer sheath 831. The two ends of the second cable 850 extend out of the connectors 86; one end is electrically connected to the main control board 810, and the other end is electrically connected to the power supply 820. Power and signals are transmitted between the bone conduction headphone, control compartment 81, and battery compartment 82 via cables.

[0123] A connector 86 is provided at the end of the first ear loop 83, the second ear loop 84, and the neckband cable 85, such as... Figure 4 , Figure 16 , Figure 22 and Figure 23 As shown, the housing 1 of the two bone conduction earphone heads, the control box 811 of the control compartment 81, and the battery box 821 of the battery compartment 82 are all provided with connector holes 87 that are adapted to the connector 86. The various components can be easily connected by mating the connector 86 with the connector holes 87. The housing 1, control box 811, and battery box 821 are all provided with a snap-fit ​​portion 870 located at the bottom of the connector hole 87. Further reference... Figure 28The connector 86 has two locking arms 860 that are spaced apart from each other. The locking arms 860 have hooks 861 that protrude laterally. After the connector 86 is inserted into the socket 87, the hooks 861 of the two locking arms 860 hook the locking parts 870, thereby preventing the connector 86 from coming out of the socket 87.

[0124] like Figure 24 As shown, to improve waterproofing, the first ear hook 83 is provided with a soft rubber layer 88 covering the outer periphery of the connector 86 at its end. The annular soft rubber layer 88 is larger than the connector 86, and it fits tightly (interference fit) with the connector hole 87, thereby achieving a seal between the connector 86 and the connector hole 87 and improving waterproofing. The soft rubber layer 88 is preferably made of silicone, which is integrally molded with the first ear hook 83 and molded together with the connector 86 by two-color injection molding. Furthermore, adhesive is coated on the outside of the soft rubber layer 88, which adheres to the connector hole 87, further improving waterproofing and increasing the connection strength between the first ear hook 83, the bone conduction headphone head, and the control chamber 81. Obviously, the aforementioned structure can also be applied to the connector 86 on the second ear hook 84 and the neckband cable 85.

[0125] The first elastic metal wire 832 and the second elastic metal wire 852 can be a single metal or an alloy of multiple metals, such as aluminum alloy, magnesium alloy, titanium alloy, spring steel, etc., or a composite material including both metallic and non-metallic materials. As a preferred embodiment, the elastic metal wire is made of titanium wire. The elastic metal wire provides the elastic force to drive the ear hook and neckband 85 back to their original shape, and also provides the bone conduction headphone head to fit snugly against the skin during wear, making the fit more secure and comfortable. Figure 25 As shown, to improve the connection between the elastic metal wire and the connector 86, the end of the elastic metal wire is provided with multiple radially concave recesses 833 and / or multiple radially convex protrusions 834. The connector 86 covers the end of the elastic metal wire, encompassing the recesses 833 and protrusions 834, thereby making the connection between the connector 86 and the elastic metal wire more secure, preventing the elastic metal wire from shifting, and making the connector 86 less likely to fall off. The aforementioned recesses 833 and protrusions 834 can be formed by radially pressing the elastic metal wire.

[0126] like Figure 29 and Figure 30As shown, the control compartment 81 also includes a light source 816 electrically connected to the main control board 810. The light source 816 is preferably an LED bead connected to the main control board 810. The control box 811 has a light-transmitting hole 812 corresponding to the position of the light source 816. The control compartment 81 also includes a panel 813 covering the light-transmitting hole 812. The panel 813 has a light-transmitting portion (not shown) for light to pass through. When the light source 816 emits light, the light illuminates the light-transmitting portion, thereby displaying information corresponding to the shape of the light-transmitting portion. For example, the shape of the light-transmitting portion can be the same as the company logo or product name to display an illuminated company logo or product name, which is more aesthetically pleasing. The shape of the light-transmitting hole 812 is adapted to the light-transmitting portion. For example, when the light-transmitting portion is elongated text, the light-transmitting hole 812 can be elongated.

[0127] In a preferred embodiment, such as Figure 30 and Figure 31 As shown, a light guide post 815 is provided between the light-transmitting part and the light source 816 to allow light to be transmitted to the light-transmitting part more evenly, resulting in more uniform brightness in the light-transmitting part. In another preferred embodiment, as... Figure 32 and Figure 33 As shown, a light diffusion film 817 is provided on the surface of panel 813 facing the light source 816, covering the light-transmitting part. When light shines from the light-transmitting hole 812 onto the light diffusion film 817, the light is diffused by the light diffusion film 817, making the light emitted from the light-transmitting part more uniform in brightness and lower in intensity, resulting in more comfortable viewing. It is understood that the control chamber 81 can also be provided with both a light guide column 815 and a light diffusion film 817.

[0128] like Figures 29 to 31 As shown, the control compartment 81 also includes a flexible circuit board 814 electrically connected to the main control board 810. The flexible circuit board 814 is disposed opposite to the panel 813. Multiple capacitors (not shown) are disposed on the flexible circuit board 814. These capacitors are used to sense touch signals on the panel 813. When a finger is located at different positions on the panel 813, the capacitors on the flexible circuit board 814 corresponding to the finger positions are sensed. When the finger slides across different positions, the capacitors at those positions sense changes in capacitance. This signal is transmitted to the main control board 810 through lines led out from the flexible circuit board 814. The main control board 810 processes and calculates the signal to obtain corresponding control commands. Thus, different control commands can be obtained based on different finger gestures on the panel 813. For example, sliding the finger from bottom to top indicates increasing the volume, while sliding the finger from top to bottom indicates decreasing the volume.

[0129] The closer the capacitor is to the panel 813, the better its sensing sensitivity. Therefore, preferably, the capacitor is disposed on the surface of the flexible circuit board 814 facing the panel 813, and the flexible circuit board 814 is disposed close to the panel 813.

[0130] To enable a larger area of ​​panel 813 to be touched and generate sensing signals, flexible circuit board 814 is configured in a U-shape, with a relief groove 8140 to avoid the light from light source 816. Light guide post 815 is disposed within the relief groove 8140. In this way, flexible circuit board 814 surrounds three sides of light guide post 815, and its area opposite to panel 813 is larger, enabling touch sensing over a larger area and improving the user experience.

[0131] The above are merely specific embodiments of the present invention, and any improvements made based on the concept of the present invention shall be considered within the scope of protection of the present invention.

Claims

1. A bone conduction earphone head, characterized in that, include: The housing (1) includes a receiving cavity (10) with one end open and a support assembly disposed in the receiving cavity (10). The housing (1) includes a bottom plate (11) disposed opposite to the opening and a peripheral side plate (12) connected to the outer periphery of the bottom plate (11). The support assembly is connected to the bottom plate (11) and / or the peripheral side plate (12). The peripheral side plate (12) and the bottom plate (11) cooperate to form the receiving cavity (10). The cover (2) is connected to the housing (1) and seals the opening of the receiving cavity (10). The housing (1) and the cover (2) are connected by glue. The first circuit board (3) is disposed in the receiving cavity (10) and is connected to the bottom plate (11) of the housing (1); A vibration-generating sound unit (4) is disposed between the support assembly and the cover (2); and, A flexible layer (5) is sandwiched between the support assembly and the vibration sound-generating unit (4) and separates the vibration sound-generating unit (4) from the support assembly. The first circuit board (3) is located between the flexible layer (5) and the base plate (11).

2. The bone conduction headphone as described in claim 1, characterized in that, The support assembly includes a support column connected to the base plate (11), the support column passing through the first circuit board (3) and abutting against the flexible layer (5).

3. The bone conduction headphone as described in claim 1, characterized in that, The support assembly includes a stiffener (121) connected to the base plate (11) and / or the peripheral side plate (12), the stiffener (121) extending above the first circuit board (3) and abutting against the flexible layer (5).

4. The bone conduction headphone as described in claim 1, characterized in that, The first circuit board (3) is provided with a micro switch (30) facing the base plate (11). The base plate (11) has a button through hole (110) corresponding to the micro switch (30). The bone conduction headphone also includes a button assembly (6) disposed in the button through hole (110).

5. The bone conduction headphone head as described in claim 4, characterized in that, The button assembly (6) includes an elastic layer (60) connected to the base plate (11), an abutting member (61) connected to the elastic layer (60) and abutting against the micro switch (30), and a pressing member (62) connected to the abutting member (61). The elastic layer (60), the abutting member (61) and the pressing member (62) cooperate to seal the button through hole (110).

6. The bone conduction headphone as described in claim 1, characterized in that, The first circuit board (3) includes a microphone (31), and the housing (1) has a microphone hole (13) corresponding to the microphone (31). The bone conduction headphone also includes a sound insulation component (7) disposed between the housing (1) and the first circuit board (3). The sound insulation component (7) is provided with a waterproof and breathable membrane (70) corresponding to the microphone hole (13). The sound entering through the microphone hole (13) is transmitted to the microphone (31) through the waterproof and breathable membrane (70).

7. The bone conduction headphone head as described in claim 6, characterized in that, The sound insulation component (7) also includes a sound insulation ring (71) that abuts against the first circuit board (3). The sound insulation ring (71) surrounds the outside of the pickup diaphragm of the microphone (31), and the waterproof and breathable membrane (70) covers the central hole (710) of the sound insulation ring (71).

8. The bone conduction earphone head as described in claim 6, characterized in that, The housing (1) has a guide hole (14) communicating with the microphone hole (13), and the waterproof and breathable membrane (70) covers the guide hole (14).

9. The bone conduction headphone head as described in any one of claims 1 to 8, characterized in that, The flexible layer (5) is made of foam, sponge, EVA, rubber or silicone.

10. The bone conduction headphone head as described in any one of claims 1 to 8, characterized in that, The vibration sound-generating unit (4) includes an annular outer shell (40) and a spring piece (41) connected to the end of the outer shell (40). The cover (2) includes a convex ring (20) surrounding the end of the outer shell (40) and a relief cavity (21) to avoid the vibration of the spring piece (41).

11. The bone conduction headphone head as described in claim 10, characterized in that, The vibration sound-generating unit (4) also includes an end plate (42) connected to the outer shell (40) and a second circuit board (46) connected to the end plate (42). The end plate (42) and the spring piece (41) are respectively connected to the two ends of the outer shell (40). The second circuit board (46) is located outside the outer shell (40). The flexible layer (5) is provided with a clearance hole (50) to avoid the pads (460) on the second circuit board (46).

12. The bone conduction headphone head as described in claim 11, characterized in that, The spring (41) includes an outer support (410) connected to the end face of the outer shell (40), a central body (411) located inside the outer support (410), and an elastic arm (412) connected between the outer support (410) and the central body (411). The vibration sound-generating unit (4) further includes a vibration assembly (43) and a coil assembly (44). The vibration assembly (43) includes a magnetic cup (430) connected to the central body (411) and a first magnet (431) connected inside the magnetic cup (430). The coil assembly (44) includes a coil (440) and a second magnet (441) both connected to the end plate (42). The second magnet (441) is disposed inside the coil (440) and is arranged opposite to the first magnet (431) with the same pole. The coil (440) is electrically connected to the pad (460).

13. The bone conduction headphone head as described in any one of claims 1 to 8, characterized in that, It also includes a soft layer (22) connected to the outer surface of the cover (2), the soft layer (22) being provided with a plurality of protrusions (221) protruding in a direction away from the cover (2).

14. The bone conduction headphone as described in claim 13, characterized in that, The thickness of the protrusion (221) protruding from the soft layer (22) is 0.1~3mm.

15. A bone conduction headphone, characterized in that, It includes two bone conduction headphone heads as described in any one of claims 1 to 14, wherein the two bone conduction headphone heads are a first bone conduction headphone head (8) and a second bone conduction headphone head (80). The bone conduction headphones also include: The control compartment (81) includes a main control board (810) for controlling the first bone conduction earphone head (8) and the second bone conduction earphone head (80); The battery compartment (82) includes a power supply (820) for supplying power to the first bone conduction headphone (8), the second bone conduction headphone (80) and the main control board (810). The first ear hook (83) is connected between the first bone conduction headphone (8) and the control chamber (81); The second ear hook (84) is connected between the second bone conduction headphone (80) and the battery compartment (82); and, A neck strap (85) is connected between the control compartment (81) and the battery compartment (82).

16. The bone conduction headphones as described in claim 15, characterized in that, Both the first ear hook (83) and the second ear hook (84) include a first outer skin layer (831) and a first cable (830) passing through the first outer skin layer (831). One end of the first cable (830) of the first ear hook (83) is electrically connected to the main control board (810), and the other end is electrically connected to the first circuit board (3) of the first bone conduction headphone (8). One end of the first cable (830) of the second ear hook (84) is electrically connected to the power supply (820), and the other end is electrically connected to the first circuit board (3) of the second bone conduction headphone (80). The neckband (85) includes a second outer sheath (851) and a second cable (850) passing through the second outer sheath (851). One end of the second cable (850) is electrically connected to the main control board (810), and the other end is electrically connected to the power supply (820).

17. The bone conduction headphones as described in claim 16, characterized in that, The ends of the first ear hook (83), the second ear hook (84) and the neckband (85) are all provided with connectors (86), and the first bone conduction headphone (8), the second bone conduction headphone (80), the control compartment (81) and the battery compartment (82) are all provided with connector holes (87) that are compatible with the connectors (86).

18. The bone conduction headphones as described in claim 17, characterized in that, The first ear hook (83) and / or the second ear hook (84) and / or the neck strap (85) are provided with a soft rubber layer (88) covering the periphery of the connector (86) at its end, and the soft rubber layer (88) is tightly fitted with the connector hole (87).

19. The bone conduction headphones as described in claim 17, characterized in that, The first ear hook (83) and the second ear hook (84) each include a first elastic metal wire (832) passing through the first outer skin layer (831), and the neck strap (85) includes a second elastic metal wire (852) passing through the second outer skin layer (851). The ends of the first elastic metal wire (832) and the second elastic metal wire (852) are provided with an inwardly concave portion (833) and / or an outwardly convex portion (834). The connector (86) covers the end of the elastic metal wire (89).

20. The bone conduction headphones as claimed in any one of claims 15 to 19, characterized in that, The control compartment (81) includes a control box (811) and a light source (816) electrically connected to the main control board (810). The main control board (810) is disposed inside the control box (811). The control box (811) has a light-transmitting hole (812) corresponding to the position of the light source (816). The control compartment (81) also includes a panel (813) covering the light-transmitting hole (812). The panel (813) has a light-transmitting part for light to pass through.

21. The bone conduction headphones as described in claim 20, characterized in that, The control compartment (81) also includes a flexible circuit board (814) electrically connected to the main control board (810). The flexible circuit board (814) is provided with a relief groove (8140) to avoid the light of the light source (816). The flexible circuit board (814) is provided with a capacitor for sensing touch signals on the panel (813).

22. The bone conduction headphones as described in claim 21, characterized in that, The control compartment (81) also includes a light guide column (815) located between the light source (816) and the light-transmitting part, the light guide column (815) being located within the clearance groove (8140).

23. The bone conduction headphones as described in claim 20, characterized in that, The control compartment (81) further includes a light diffusion film (817) attached to the surface of the panel (813) facing the light source (816), the light diffusion film (817) covering the light-transmitting portion.

Citation Information

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