Heat Dissipation Pad Bonding Method and Equipment

Abstract

The present invention provides a method and a device for attaching a heat dissipation gasket. The method for attaching the heat dissipation gasket includes: conveying an object to be attached along a conveying flow path; arranging heat dissipation gaskets at intervals on a tape; arranging a fitting device with the tape and a pressing member, the tape winding around the pressing member and forming an input side and an output side with the pressing member as a boundary; displacing the pressing member towards the input side of the tape, so that the heat dissipation gaskets are completely attached to the upper surface of the object to be attached on the other side while being simultaneously peeled off and attached from the tape on one side; thereby, attaching the heat dissipation gasket to the object to be attached has better economic benefits.

Description

Technical Field

[0001] The present invention relates to a bonding method and device, and particularly to a heat dissipation gasket bonding method and device for automatically bonding a heat dissipation gasket onto an object to be bonded. Background Art

[0002] In a general chip packaging process, an adhesive is usually coated on a substrate first, and then a die is adhered to the substrate. A layer of heat dissipation glue needs to be coated above the die, and then a heat sink is adhered to the heat dissipation glue and covers the die and the substrate. Recently, the heat dissipation glue has been gradually replaced by a heat dissipation gasket with heat dissipation function. The heat dissipation gasket usually has a double-sided adhesive state on its upper and lower surfaces, and each upper and lower surface of each heat dissipation gasket is adhered with a layer of coating film. The operator first tears off one layer of the coating film, then adheres the surface of the heat dissipation gasket without the coating film to the upper surface of the die, then tears off the coating film on the other side, and then adheres the heat sink above the heat dissipation gasket.

[0003] Although the prior art replaces the heat dissipation glue with the heat dissipation gasket, it can reduce the coating process of the heat dissipation glue. However, manually adhering each heat dissipation gasket cannot improve the process efficiency, and the adhesion quality of each heat dissipation gasket is different, which is not economically viable in mass production. A method and device for automatically adhering a heat dissipation gasket to the upper surface of a die on a substrate first and then covering a heat sink on the substrate have been adopted. For example, in the patent case of "Heat Dissipation Gasket Bonding Method and Device" with the publication number of No. 1716906 applied by the applicant. Although this patent case can solve the problem of automatic bonding of the heat dissipation gasket in the heat sink mounting process, there is still room for improvement under the requirement of economic efficiency in semiconductor process technology! Summary of the Invention

[0004] Therefore, an object of the present invention is to provide a heat dissipation gasket bonding method with economic efficiency.

[0005] Another object of the present invention is to provide a heat dissipation gasket bonding device for performing the heat dissipation gasket bonding method as described above.

[0006] The heat dissipation gasket bonding method according to the object of the present invention includes: conveying an object to be bonded in a conveying flow path; arranging heat dissipation gaskets at intervals on a tape; providing a bonding device with the tape and a pressing member, the tape passing around the pressing member and forming an input side and an output side with the pressing member as a boundary; displacing the pressing member towards the input side of the tape, so that the heat dissipation gasket is completely bonded to the upper surface of the object to be bonded from one side to the other side while being peeled off and bonded from the tape at the same time.

[0007] The heat dissipation gasket bonding device according to another object of the present invention is used to perform the heat dissipation gasket bonding method as described above.

[0008] The heat dissipation gasket laminating method and device according to the embodiments of the present invention are such that the laminating device is provided with the tape and a pressing member. The tape winds around the pressing member and forms an input side and an output side with the pressing member as the boundary. The pressing member is displaced towards the input side of the tape, so that the heat dissipation gasket is completely laminated onto the upper surface of the object to be laminated from one side to the other side while being simultaneously peeled off and laminated from the tape, and thus it can be applied to adjacent and closely arranged objects, such as the grains that have been cut into individual entities on the wafer but have not yet been placed on the substrate. Since each grain is still on the same film layer, the transfer between the two objects to be laminated can be reduced and the lamination efficiency can be increased. At the same time, because it is simultaneously peeled off and laminated, there is no need to peel off the tape after lamination, which can increase the lamination efficiency. Description of the Drawings

[0009] Figure 1 It is a schematic diagram of the object to be laminated located on a film layer in the first embodiment of the present invention.

[0010] Figure 2 It is an exploded schematic diagram of the object to be laminated and the heat dissipation gasket in the first embodiment of the present invention.

[0011] Figure 3 It is a three-dimensional schematic diagram of a tape provided with a heat dissipation gasket forming a roll in the first embodiment of the present invention.

[0012] Figure 4 It is a three-dimensional schematic diagram of the laminating device in the first embodiment of the present invention.

[0013] Figure 5 It is a schematic diagram of the jig and the lower mechanism in the first embodiment of the present invention.

[0014] Figure 6 It is an exploded three-dimensional schematic diagram of the laminating device in the first embodiment of the present invention.

[0015] Figure 7 It is a three-dimensional schematic diagram of another side of the laminating device in the first embodiment of the present invention.

[0016] Figure 8 It is a schematic diagram of the pressing member operating to laminate the heat dissipation gasket in the first embodiment of the present invention.

[0017] Figure 9 It is a schematic diagram of the laminating device operating in the first embodiment of the present invention.

[0018] Figure 10 It is a three-dimensional schematic diagram of the laminating device in the second embodiment of the present invention.

[0019] Figure 11 It is a schematic diagram of the pressing member operating to laminate the heat dissipation gasket in the second embodiment of the present invention.

[0020]

Symbol Description

[0021] A: Object to be pasted

[0022] A1: Wafer

[0023] A2: Film layer

[0024] A3: Frame

[0025] A4: Thermal conductive gasket

[0026] A41: Tape

[0027] A411: Pinhole

[0028] A412: Input side

[0029] A413: Output side

[0030] A42: Wrapping film

[0031] A43: Sleeve

[0032] A431: Axial hole

[0033] B: Machine

[0034] C: Conveyor flow path

[0035] C1: First rail rack

[0036] C11: Fixture

[0037] C111: Adsorption part

[0038] C112: Side frame

[0039] C113: Belt

[0040] C114: Track

[0041] C12: Heating element

[0042] C13: Base

[0043] C131: Spacer

[0044] C14: Linkage part

[0045] C141: Pivot rod

[0046] C15: Fixing part

[0047] C151: Pivot sleeve

[0048] C16: Fixing base

[0049] C161: Support part

[0050] C17: Driving part

[0051] C171: Rotating shaft

[0052] D: Transfer mechanism

[0053] D1: Gantry rail frame

[0054] D11: Column

[0055] D12: Cross beam

[0056] D13: Y-axis drive component

[0057] D2: Cantilever

[0058] D21: X-axis drive component

[0059] E: Laminating device

[0060] E1: Deflection mechanism

[0061] E11: Carrier seat

[0062] E12: Linkage component

[0063] E121: First grooving interval

[0064] E122: Interval between grooves

[0065] E123: Upper linkage part

[0066] E1231: First slide rail

[0067] E1232: First slide block

[0068] E124: Lower linkage part

[0069] E1241: Second slide rail

[0070] E1242: Second slide block

[0071] E125: Drive component

[0072] E1251: Shaft rod

[0073] E13: Fixing component

[0074] E131: Second grooving interval

[0075] E132: Slide rail

[0076] E133: Slide block

[0077] E14: Z-axis rail seat

[0078] E15: Swing seat

[0079] E151: Upper swing seat

[0080] E1511: Pivoting part

[0081] E152: Lower hem seat

[0082] E153: Pivot

[0083] E154: Driving part

[0084] E1541: Fixing part

[0085] E1542: Output shaft

[0086] E1543: Swing arm

[0087] E155: Connecting part

[0088] E2: Tape winding mechanism

[0089] E21: Fixed seat

[0090] E22: Tape wheel

[0091] E221: Driving part

[0092] E222: Belt

[0093] E23: First winding wheel

[0094] E231: Driving part

[0095] E232: Belt

[0096] E24: Second winding wheel

[0097] E241: Driving part

[0098] E242: Belt

[0099] E25: Driving mechanism

[0100] E251: Driving shaft

[0101] E252: Pin wheel

[0102] E26: Contact part

[0103] E261: First side

[0104] E262: Second side

[0105] E263: Contact part

[0106] E264: Bottom edge

[0107] F: Contact part

[0108] F1: First side

[0109] F2: Second side

[0110] F3: Contact part

[0111] α1: Acute angle

[0112] α2: Acute angle

[0113] α3: Acute angle

[0114] β1: Acute angle

[0115] β2: Acute angle Specific implementation manner

[0116] Please refer to Figure 1 , for the object A to which the heat dissipation gasket bonding method of the first embodiment of the present invention is applied, such as the crystal grains on the wafer A1 shown in the figure. The wafer A1 is located on a film layer A2, and a frame-shaped border A3 is provided on the outer periphery of the film layer A2. The object A is planned on the wafer A1 and has been cut into individual entities. Each object A is arranged in a matrix on the wafer A1 and is laid adjacent to each other in a common butting and planar manner; when performing the heat dissipation gasket bonding method of the present invention, as shown in Figure 2 , a heat dissipation gasket A4 is adhered to the upper part of each object A

[0117] The embodiment of the present invention is not limited to only bonding the heat dissipation gasket A4 to the crystal grains of the wafer A1 on the film layer A2. It can also be applied to bonding the heat dissipation gasket A4 to the crystal grains that have been placed on the substrate. However, due to the same reason, it will not be elaborated here Figure 1

[0118] Please refer to Figure 3 , for the heat dissipation gasket bonding method of the first embodiment of the present invention, the heat dissipation gasket A4 is provided on a strip-shaped tape A41, and a film A42 is covered above the heat dissipation gasket A4. The tape A41 and the film A42 jointly cover the heat dissipation gasket A4. A plurality of the heat dissipation gaskets A4 are arranged continuously and equidistantly on the tape. Both the upper and lower surfaces of each heat dissipation gasket A4 have adhesiveness and are respectively adhered to the tape A41 and the inner layer of the film A42. Among them, both sides of the tape A41 each have a row of a plurality of equally spaced and continuously arranged pinholes A411. The distance between the two rows of pinholes A411 is a certain interval, and this interval is greater than the width of the heat dissipation gasket A4 and is used for the heat dissipation gasket A4 to be adhesively placed therein. The tape A41 can be wound around the outer diameter of a sleeve A43 with a shaft hole A431 to form a ring-shaped roll

[0119] Please refer to Figure 4 , for the heat dissipation gasket bonding device of the first embodiment of the present invention, it can be implemented by the device shown in the figure. It is provided on a machine B with

[0120] ​A conveying flow path C is formed by a first rail frame C1; a fixture C11 is provided in the first rail frame C1, and a plurality of concentrically arranged circular groove-shaped adsorption parts C111 are provided on the fixture C11, and each adsorption part C111 provides negative pressure suction; a track C114 is provided on the first rail frame C1, which is formed by two spaced side frames C112 and two belts C113 respectively placed on the inner sides of the two side frames C112, and the conveying flow path C is formed between the two tracks C114, and can be driven to Figure 1 The object A, which is formed by the wafer A1 with the frame A3, is transported or positioned above the fixture C11 by linear displacement in the X-axis direction in the track C114; the fixture C11 can be lifted up and down so that the adsorption part C111 thereon adsorbs the object A to perform an upward or downward operation;

[0121] A transfer mechanism D is provided with two gantry rail frames D1 which are spaced apart and respectively span over the conveying flow path C, each gantry rail frame D1 comprises Z-axis columns D11 respectively located on both sides of the conveying flow path C, and a horizontal beam D12 which is located above the two columns D11 and is horizontally arranged in the Y-axis direction, and each beam D12 is respectively provided with a Y-axis driving member D13 such as a wire code; a cantilever D2 is commonly spanned in the X-axis direction on the two beams D12 of the two gantry rail frames D1, and both ends of the cantilever D2 are driven by the Y-axis driving member D13 to make a Y-axis displacement, and an X-axis driving member D21 such as a wire code is provided on the cantilever D2, and an operating seat D3 is provided on the cantilever D2, and can be driven by the X-axis driving member D21 to make an X-axis displacement;

[0122] A laminating device E is disposed above the first rail C1 of the conveying channel C and is located on the operating seat D3 of the transfer mechanism D, and can be driven to move in the X, Y, and Z axial directions.

[0123] See also Figure 4 , 5 The fixture C11 is provided with a heating element C12 which can indirectly heat the Figure 1 The jig C11 is raised to a proper height by a spacer C131 on a base C13. The base C13 is supported and linked by a plurality of pivot rods C141 on a linking member C14 under a table top of a machine B. A fixing member C15 is provided on the table top of the machine B. The fixing member C15 is provided with a plurality of pivot sleeves C151 for the pivot rods C141 to be pivoted. A fixing seat C16 is provided below the fixing member C15 with a plurality of supporting members C161. A driving member C17 such as a motor is provided below the fixing seat C16. The driving member C17 drives the linking member C14 through a rotating shaft C171 with a rotating thread by a rotating force of rotation, so as to drive the base C13 to support the jig C11 for up and down displacement.

[0124] Please refer to Figure 6 and 7 The laminating device E is provided with a deflection mechanism E1 and a tape winding mechanism E2. Among them,

[0125] The deflection mechanism E1 is provided with a carrier E11 fixed on a Z-axis rail seat E14 at the rear side of the fixing member E13 through a first engraving section E121 of a plate-shaped linkage member E12 and a second engraving section E131 of a plate-shaped fixing member E13. The laminating device E is fixed on the operation seat D3 of the transfer mechanism D through the Z-axis rail seat E14 and is driven by it. The fixing member E13 is provided with a Z-axis slide rail E132 and a slide block E133 between the fixing member E13 and the linkage member E12, and the linkage member E12 is fixed on the slide block E133 and can move up and down in the Z-axis direction. The deflection mechanism E1 is fixed with a swing seat E15 extending through the first engraving section E121 of the linkage member E12 and the fixing member E13, so that when the deflection mechanism E1 drives the carrier E11 to move in the Z-axis direction by the rail seat E14, the linkage member E12 can be driven to move synchronously in the Z-axis direction. The swing seat E15 includes an upper swing seat E151 and a lower swing seat E152 respectively located above and below the carrier E11. A pivot shaft E153 is commonly arranged in the Z-axis direction between the carrier E11 and the upper swing seat E151 and the lower swing seat E152 of the swing seat E15. On both sides of the pivot shaft E153, two outwardly convex pivot parts E1511 are respectively arranged on both sides of the upper swing seat E151 of the swing seat E15. A driving member E154 composed of a motor is fixed on the front side of the carrier E11 through a fixing member E1541. Its output shaft E1542 is fixed at the center of a swing arm E1543. Both sides of the swing arm E1543 are respectively pivoted with the two pivot parts E1511 through a connecting member E155, so that the swing arm E1543, the two connecting members E155, and the two pivot parts E1511 together form a four-bar linkage mechanism. When the driving member E154 drives the output shaft E1542 to rotate, the swing arm E1543 fixed to the output shaft E1542 will swing horizontally, so that the two connecting members E155 pivoted on both sides form a forward and backward swing, and the two pivot parts E1511 drive the upper swing seat E151 of the swing seat E15, so that the linkage member E12 fixed to the upper swing seat E151 and the lower swing seat E152 drives the components on it to swing with the pivot shaft E153 as the axis;

[0126] The linkage member E12 extends horizontally in the X-axis direction to one side, and is partitioned by a hollow slot area E122 to form an upper linkage part E123 and a lower linkage part E124. The upper linkage part E123 is provided with a first slide rail E1231 having a longer length in the X-axis direction, and the lower linkage part E124 is provided with a second slide rail E1241 having a shorter length. A first slide block E1232 is provided on the first slide rail E1231, and a second slide block E1242 is provided on the second slide rail E1241; the tape winding mechanism E2 is fixed on the first slide block E1232 and the second slide block E1242 by a plate-shaped fixing seat E21. A driving member E125 is provided in the slot E122 of the linkage member E12. It is pivotally mounted on a fixed pivot seat E1252 on the linkage member E12 after being screwed through a nut seat E211 at the rear side of the fixing seat E21 by a threaded shaft rod E1251, so that the fixing seat E21 and the tape winding mechanism E2 thereon can be driven by the driving member E125 and displace in the X-axis direction relative to the linkage member E12 on the first slide rail E1231 and the second slide rail E1241; when the linkage member E12 pivots the components thereon with the pivot shaft E153 as the axis, it will also pivot the fixing seat E21 and the tape winding mechanism E2 thereon.

[0127] The tape winding mechanism E2 is provided on the front surface of the fixing seat E21:

[0128] A tape wheel E22 is provided on the right side of the fixing seat E21 and is driven by a driving member E221 at the rear side of the fixing seat E21 by a belt E222 to rotate. The tape wheel E22 is used to sleeved with the annularly wound tape A41;

[0129] A first winding wheel E23 is provided on the upper right side of the fixing seat E21 and is located above the tape wheel E22. It is driven by a belt E232 driven by a driving member E231 at the rear side of the fixing seat E21 to rotate, and is used to wind the packaging film A42;

[0130] A second winding wheel E24 is provided on the upper left side of the fixing seat E21 and is located above the tape wheel E22. It is driven by a belt E242 driven by a driving member E241 at the rear side of the fixing seat E21 to rotate, and is used to wind the packaging film A42 after the heat dissipation gasket A4 has been completely extracted;

[0131] A driving mechanism E25 is provided near the lower part of the front surface of the fixing seat E21. The driving mechanism E25 is provided with two pin wheels E252 coaxially sleeved and nested at a spaced interval on a driving shaft E251 in the Y-axis direction. The driving shaft E251 is driven by a driving member E253 on the front side of the fixing seat E21 to traction drive the tape A41 with the two pin wheels E252;

[0132] The abutting member E26 is disposed near the lower part of the front surface of the fixing seat E21 and below the driving mechanism E25. The abutting member E26 is arranged in the Y-axis direction, with one end disposed on the linking member E12 and the other end suspended.

[0133] Please refer to Figure 7 、 8 As shown in FIGS., after the film coating A42 of the tape A41 is first wound and peeled off by the first reel E23, the tape A41 with the heat dissipation pad A4 still adhered thereto is hung on the two-pin wheel E252 of the driving mechanism E25 and is wound by the two-pin wheel E252; when the tape A41 passes around the lower part of the abutting member E26, the tape A41 approaches the abutting member E26, the heat dissipation pad A4 faces downward and is on the other side of the tape A41 relative to the abutting member E26; the tape A41 forms an input side A412 and an output side A413 with the abutting member E26 as the boundary. The abutting member E26 includes a first side surface E261 inclined towards the input side A412 of the tape A41 and a second side surface E262 inclined towards the output side A413. At the downward intersection of the first side surface E261 and the second side surface E262 of the abutting member E26, a abutting portion E263 with a sharp angle is formed. The abutting portion E263 has an acute angle α1 less than 90 degrees, and an arc-shaped bottom edge E264 is formed at the end of the abutting portion E263. The input side A412 and the output side A413 of the tape A41 form an acute angle α2 less than 90 degrees, where the acute angle α2 is greater than the acute angle α1, and the input side A412 of the tape A41 is input to the surface of the object to be pasted A in an inclined manner, and the inclination angle is an acute angle α3 less than 90 degrees.

[0134] In the implementation of the first embodiment of the present invention, when the crystal grains as the object to be pasted A are still on the film layer A2 after being cut from the wafer A1, the operation of pasting the heat dissipation pad A4 is carried out. When the object to be pasted A is conveyed by the conveying flow path formed by the first rail frame C1 to above the jig C11 (as shown in Figure 9 ), the jig C11 rises and adsorbs and pushes up the film layer A2 with the frame A3 provided on its outer periphery, thereby driving the crystal grains as the object to be pasted A on the film layer A2 to move up to an appropriate height for positioning. The heating element C12 indirectly heats the object to be pasted A placed on the jig C11; the transfer mechanism D drives the Z-axis rail seat E14 of the deflection mechanism E1 ( Figure 7 ) by the operation seat D3 to make a large displacement, so that the bonding device E including the deflection mechanism E1 and the tape winding mechanism E2 is transferred to a position where the abutting member E26 corresponds exactly above the object to be pasted A, and the abutting portion E263 ( Figure 9) corresponds to being located above the side close to the object A to be bonded. The bonding device E can be aligned and inspected by a device for alignment inspection (such as a CCD lens, not shown in the figure), and then deflected and aligned through the deflection mechanism E1 to link the winding mechanism E2, and then descend to bond the heat dissipation pad A4 with the abutment member E26.

[0135] During the bonding process of the first embodiment of the present invention, when the material strip A41 to which the heat dissipating adhesive pad A4 is adhered is transported from the input side A412 through the bottom edge E264 of the abutting portion E263 of the abutting member E26 and turns to the output side A413, the heat dissipating adhesive pad A4 is peeled off from the material strip A41 on the output side A413; the peeled side of the heat dissipating adhesive pad A4 is pressed against the upper surface of the adhered object A by the bottom edge E264 in a line contact manner and adhered to the surface of the adhered object A; then the abutting member E26 is horizontally displaced toward the input side of the material strip A41, so that the heat dissipating adhesive pad A4 is completely adhered to the adhered object A from one side from the material strip A41 to the other side in a simultaneous peeling and bonding process. The upper surface of the attached object A; after the entire piece of the heat dissipation pad A4 is completely attached to the upper surface of the attached object A, the bottom edge E264 of the abutment portion E263 of the abutment member E26 is linked to leave the upper surface of the attached object A; the abutment member E26 is horizontally displaced toward the input side A412 of the material tape A41, which is achieved by making the deflection mechanism E1 that performs deflection on the abutment member E26 and the winding mechanism E2 that sets the abutment member E26 perform relative displacement. In this way, since multiple attached objects A in the same row on the wafer A1 all belong to small displacements, the operating seat D3 of the transfer mechanism D that performs large displacement can remain in position without displacement, so as to make more efficient planning.

[0136] See also Figure 10 , 11The second embodiment of the present invention can use a contact piece F with a semicircular cross-section under the same first embodiment as the mechanisms and devices. The contact piece F includes a first side surface F1 that is inclined near the input side A412 of the material strip A41, and a second side surface F2 that is arc-shaped near the output side A413. An abutment portion F3 with an acute angle is formed at the intersection of the first side surface F1 and the second side surface F2 of the contact piece F, and a horizontally arranged bottom edge F31 is formed at the end of the abutment portion F3; wherein the second side surface F2 of the abutment portion F3 has an arc of 110 degrees, and the input side A412 and the output side A413 of the material strip A41 form an acute angle β1 that is less than 90 degrees. The input side A412 of the material strip A41 is inputted in an inclined manner to the surface of the object A, and the inclination angle is an acute angle β2 less than ninety degrees; the bottom edge F31 is used to press one side of the heat dissipation pad A4 against the upper surface of the object A, so that the abutment member F is horizontally displaced toward the other side of the heat dissipation pad A4 (i.e., toward the input side A412), so that the heat dissipation pad A4 is adhered to the upper surface of the object A and adhered to the surface of the object A in a process of peeling and pasting at the same time; then the abutment member F3 is horizontally displaced toward the input side of the material strip A41, so that the heat dissipation pad A4 is completely adhered to the upper surface of the object A from one side of the material strip A41 to the other side in a process of peeling and pasting at the same time.

[0137] The heat dissipation pad bonding method and equipment of the embodiment of the present invention are as follows: the bonding device E is provided with the material strip A41 and a bonding member F, the material strip A41 passes through the bonding member F and forms an input side A412 and an output side A413 with the bonding member F as the boundary; the bonding member F is displaced toward the input side A412 of the material strip A41, so that the heat dissipation pad A4 is completely bonded to the upper surface of the object A from one side to the other side in a simultaneous peeling and bonding process from the material strip A41. Therefore, it is suitable for closely adjacent, such as the grains on the wafer A1 that have been cut into individual individuals but have not yet been placed on the substrate. Since each grain is still on the same film layer A2, the transmission between the two objects A can be reduced and the bonding time can be increased. At the same time, since the peeling and bonding are performed simultaneously, there is no need to peel the material strip A41 after bonding, thereby increasing the bonding efficiency.

[0138] The above description is only a preferred embodiment of the present invention, and it cannot be used to limit the scope of the present invention. That is, all simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the invention description are still within the scope of the patent of the present invention.

Claims

1. A method for attaching a heat dissipation gasket, comprising: Conveying an object to be attached along a conveying flow path; Arranging heat dissipation gaskets at intervals on a tape; Providing a laminating device with the tape and a pressing member, the tape passing around the pressing member and forming an input side and an output side with the pressing member as a boundary; Displacing the pressing member towards the input side of the tape, so that the heat dissipation gasket is completely laminated onto the upper surface of the object to be attached from one side to the other side while being simultaneously peeled off and laminated from the tape.

2. The heat dissipation gasket fitting method according to claim 1, wherein, The horizontal displacement of the pressing member towards the input side of the tape is achieved by the relative displacement of a deflection mechanism for deflecting the pressing member and a tape winding mechanism for providing the pressing member.

3. The heat dissipation pad laminating method according to claim 1, wherein, The object to be attached is a die that has been cut into individual pieces on a wafer, and the object to be attached is located on a film layer, and a frame is provided on the outer periphery of the film layer.

4. The heat dissipation pad laminating method according to claim 1, wherein, The input side and the output side of the tape form an acute angle less than 90 degrees.

5. The heat dissipation gasket fitting method according to claim 1, wherein, The input side of the tape is inputted in an inclined manner with respect to the surface of the object to be attached, and the inclination angle is an acute angle less than 90 degrees.

6. The heat dissipation pad fitting method according to claim 1, wherein, The pressing member includes a first side surface inclined towards the input side of the tape and a second side surface inclined towards the output side, and a pressing portion with an acute angle is formed at the intersection of the first side surface and the second side surface facing downwards, and the pressing portion has an acute angle less than 90 degrees.

7. The heat dissipation gasket fitting method according to claim 1, wherein, The tape forms an input side and an output side with the pressing member as a boundary. When the tape is conveyed from the input side through the bottom edge of a pressing portion of the pressing member and turns to the output side, the heat dissipation gasket is peeled off from the tape on the output side.

8. The heat dissipation pad fitting method according to claim 7, wherein, The side of the heat dissipation gasket where peeling occurs is pressed against the upper surface of the object to be attached in a line contact manner by the bottom edge and laminated onto the surface of the object to be attached.

9. A heat dissipation gasket laminating device for performing the heat dissipation gasket laminating method according to any one of claims 1 to 8.

10. The heat dissipation gasket laminating device according to claim 9, wherein, Including: On a machine table, there is provided: The conveying flow path, in which a fixture is provided, and the object to be attached can be linearly displaced or positioned above the fixture in the conveying flow path; A transfer mechanism, provided with an operating seat that can be driven to displace; The laminating device, provided above the conveying flow path and located on the operating seat of the transfer mechanism, and can be driven to displace.

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