Optical module wire bonding system and wire bonding method

Abstract

The present invention relates to the field of packaging technology, and specifically to an optical module wire bonding system and wire bonding method, including a workbench, a material strip, a pressure plate, a wire bonding device, and a material strip conveying mechanism; the pressure plate and the workbench can move up and down, and are respectively arranged above and below the material strip; the wire bonding device is arranged above the pressure plate; a plurality of receiving grooves for placing optical transceiver modules to be wired are arranged side by side on the material strip, and a transmitting end wire bonding area and a receiving end wire bonding area are arranged on the workbench, which correspond to two adjacent receiving grooves on the material strip respectively; the workbench cooperates with the receiving groove to fix the transmitting end substrate of the optical transceiver module in the transmitting end wire bonding area; the pressure plate cooperates with the receiving groove to fix the receiving end substrate of the optical transceiver module in the receiving end wire bonding area. The present invention can realize the wire bonding of optical modules with a height difference between the transmitting end substrate and the receiving end substrate on the same wire bonding equipment and material strip, and has simple operation, high efficiency, good wire bonding yield, and is easy to realize production automation.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to an optical module wire bonding system and a wire bonding method. Background Art

[0002] In the field of optical communications, in order to meet the high-speed requirements of optical transceiver modules, COB (Chips on Board) packaging is often used to package multiple groups of optical chips together, that is, the optical chips and related components are directly mounted on the substrate, and then the electrical connection is achieved through wire bonding, etc. This packaging method has the advantages of saving space, simplifying packaging operations, good heat dissipation, and low cost.

[0003] like Figure 1 As shown, the optical transceiver module 1 includes an optical receiving component and an optical transmitting component. In some COB-packaged optical transceiver modules, since the optical transmitting component is sensitive to temperature, it is set on a high thermal conductivity substrate (heat sink), and a high thermal conductivity substrate (heat sink) is used as a transmitting end substrate 11; while the optical receiving component only needs to be set on an ordinary substrate (PCB board), and an ordinary substrate (PCB board) is used as a receiving end substrate 12; the transmitting end substrate 11 of the optical transmitting component and the receiving end substrate 12 of the optical receiving component are assembled and fixed together by glue or other means, and are usually spliced ​​up and down. Since there are many components distributed on the lower surface of the receiving end substrate 12 of the optical receiving component, and the optical transmitting component is set on the transmitting end substrate 11, and there are no components distributed on the lower surface of the corresponding transmitting end substrate 11, usually one end of the transmitting end substrate 11 of the optical transmitting component is fixedly connected to the bottom of the receiving end substrate 12 of the optical receiving component for easy packaging. During packaging, the optical receiving component needs to be wire-bonded to its receiving end substrate 12, and the optical transmitting component also needs to be wire-bonded to the receiving end substrate 12 of the optical receiving component to achieve electrical connection. The optical transceiver module 1 needs to be fixed during the wire bonding process. In the prior art, it is often fixed by pressing the substrate of the optical transceiver module with a pressure plate.

[0004] As for the optical emission component, multiple high-speed optical chips need to be integrated on the size-limited emission end substrate 11, so the components on the optical emission component will be densely distributed, and it is not easy to have free space for the pressing plate to press and fix; when using the pressing plate to fix the optical emission component, it is easy to touch the chip or component and cause damage.

[0005] Moreover, the transmitting end substrate 11 of the optical transmitting component and the receiving end substrate 12 of the optical receiving component are prone to unstable height difference during splicing and assembly, which may make the pre-designed pressure plate unable to match the transmitting end substrate 11 of the optical transmitting component and the receiving end substrate 12 of the optical receiving component at the same time, resulting in the inability to simultaneously press the transmitting end substrate 11 of the optical transmitting component and the receiving end substrate 12 of the optical receiving component on a strip or a fixing fixture, thereby causing poor wiring of the optical transmitting component or the optical receiving component. For this reason, for this type of optical module, the existing wiring method is generally to use different strips and fixing fixtures for the transmitting component and the receiving component respectively. For example, after the wiring of the transmitting component is completed, the strip and the optical module are manually removed, and the optical module is switched to the receiving end wiring strip and fixed with a corresponding fixture, and then the fixed optical module is placed in the wiring equipment for the receiving end wiring. This method requires the design of two types of material strips and fixtures. In addition, the optical module transmitting component end and the receiving component end cannot complete the wiring operation in the same material strip and wiring equipment, and need to switch back and forth. During the switching process, the chip or circuit may be damaged due to accidental human contact. In addition, the operation is cumbersome and the production efficiency is low. Summary of the invention

[0006] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide an optical module wire bonding system and a wire bonding method, which fix the optical transceiver modules corresponding to the transmitting end bonding area and the receiving end bonding area by different fixing methods, so that the transmitting end and the receiving end of the optical transceiver module with uncertain height difference between the transmitting end substrate and the receiving end substrate can be wired on the same wire bonding equipment and material strip, and the need to switch back and forth between different material strips or fixtures can be avoided. The operation is simple, the efficiency is high, the wire bonding yield is good, and it is easy to realize production automation.

[0007] To achieve the above-mentioned purpose, the technical solution of the present invention is a wire bonding system for an optical module, comprising a workbench, a material strip, a pressure plate, a wire bonding device and a material strip conveying mechanism for conveying the material strip; the pressure plate and the workbench can both move up and down, and are respectively arranged above and below the material strip; the wire bonding device is arranged above the pressure plate; a plurality of receiving grooves for placing optical transceiver modules to be wired are arranged side by side on the material strip, and a transmitting end bonding area and a receiving end bonding area are provided on the workbench, which respectively correspond to the two adjacent receiving grooves on the material strip; the workbench cooperates with the receiving grooves to fix the transmitting end substrate of the optical transceiver module in the transmitting end bonding area; the pressure plate cooperates with the receiving grooves to fix the receiving end substrate of the optical transceiver module in the receiving end bonding area.

[0008] Furthermore, a through hole is provided on the bottom surface of the accommodating groove for the transmitting end substrate of the optical transceiver module to pass through, and a vacuum adsorption block for adsorbing and fixing the transmitting end substrate is provided on the transmitting end wiring area of ​​the workbench, and the vacuum adsorption block matches the through hole.

[0009] Furthermore, a plurality of ventilation holes are arranged on the top surface of the vacuum adsorption block, a suction hole connected to the suction device is arranged on the workbench, and each of the ventilation holes is connected to the suction hole.

[0010] Furthermore, the sum of the depth of the emitting end substrate extending into the through hole and the height of the vacuum adsorption block is greater than the depth of the through hole.

[0011] Furthermore, a full opening is provided at a position on the pressure plate corresponding to the wiring area of ​​the transmitting end, for allowing the wiring head of the wiring device to pass through to perform wiring on the transmitting end of the optical transceiver module; an avoidance opening is provided at a position on the pressure plate corresponding to the wiring area of ​​the receiving end, for allowing the wiring head of the wiring device to pass through to perform wiring on the receiving end of the optical transceiver module.

[0012] Furthermore, a receiving end gold finger limiting boss is arranged in the accommodating groove, and a receiving end gold finger pressing platform is arranged at the position of the receiving end gold finger limiting boss corresponding to the receiving end wiring area on the bottom surface of the pressure plate, and the receiving end gold finger limiting boss and the receiving end gold finger pressing platform cooperate to press the receiving end substrate near the receiving end gold finger of the optical transceiver module.

[0013] Furthermore, a back limiting boss of the wave splitter-combiner component is arranged in the accommodating groove, and a receiving end wave splitter-combiner component pressing platform is arranged at the position of the back limiting boss of the wave splitter-combiner component corresponding to the receiving end wiring area on the bottom surface of the pressure plate, and the back limiting boss of the wave splitter-combiner component cooperates with the receiving end wave splitter-combiner component pressing platform to press the receiving end substrate near the receiving end wave splitter-combiner component of the optical transceiver module.

[0014] The present invention also provides an optical module wiring method, comprising the following steps:

[0015] S1. Place the strip on the strip conveying mechanism. Starting from the end away from the wire bonding area of ​​the transmitting end, the first receiving slot is vacant, and the optical transceiver modules are placed in the remaining receiving slots in sequence.

[0016] S2, the material strip conveying mechanism drives the material strip to move, so that the first receiving slot and the second receiving slot are respectively placed in the receiving end wiring area and the transmitting end wiring area;

[0017] S3, preheating and moving the workbench upward, and fixing the transmitting end substrate of the optical transceiver module therein by cooperating with the workbench and the second receiving groove;

[0018] S4, the bonding head of the bonding device bonds the transmitting end of the optical transceiver module above the second receiving slot; after the bonding of the transmitting end is completed, the workbench is moved down so that the optical transceiver module falls back and is placed flat in the second receiving slot;

[0019] S5, the material strip conveying mechanism drives the material strip to move, so that the second receiving slot and the third receiving slot are respectively placed in the receiving end wiring area and the transmitting end wiring area;

[0020] S6, preheating and moving the workbench upward, fixing the transmitting end substrate of the optical transceiver module therein by cooperating with the workbench and the third receiving groove; moving the pressing plate downward, fixing the receiving end substrate of the optical transceiver module therein by cooperating with the pressing plate and the second receiving groove;

[0021] S7, the bonding head of the bonding device bonds the receiving end of the optical transceiver module above the second receiving slot; after the bonding of the receiving end is completed, the bonding head of the bonding device moves and bonds the transmitting end of the optical transceiver module above the third receiving slot; after the bonding of the transmitting end is completed, the workbench is moved down to make the optical transceiver module fall back and lay flat in the third receiving slot, and the pressure plate is moved up at the same time;

[0022] S8, looping steps S5-S7 until all optical transceiver modules in the strip are wired.

[0023] Furthermore, in step S3 and step S6, when preheating and moving the workbench upward, vacuum adsorption is turned on, so that the vacuum adsorption block on the workbench extends into the through hole on the corresponding receiving groove and adsorbs and fixes the transmitting end substrate of the optical transceiver module in the receiving groove; then the workbench continues to be moved upward until the workbench contacts the bottom surface of the corresponding receiving groove, so that the optical transceiver module is suspended and fixed above the corresponding receiving groove; in step S4 and step S7, after the wiring of the transmitting end is completed, the vacuum adsorption is turned off, and the workbench is moved downward, so that the optical transceiver module falls back and is placed flat in the corresponding receiving groove, and the workbench continues to be moved downward, so that the vacuum adsorption block withdraws and leaves the through hole on the corresponding receiving groove.

[0024] Further, in step S6, the pressure plate is moved downward so that the receiving end gold finger pressure platform and the receiving end wave splitter / combiner component pressure platform on the bottom surface of the pressure plate are respectively pressed on the receiving end gold finger limiting boss and the limiting boss on the back of the wave splitter / combiner component in the second accommodating groove, and the receiving end substrate of the optical transceiver module in the second accommodating groove is fixed on the material strip.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] (1) The present invention sets a transmitting end bonding area and a receiving end bonding area on a workbench respectively, and adopts different fixing structures for the optical transceiver modules corresponding to the transmitting end bonding area and the receiving end bonding area respectively, so as to respectively bond the transmitting end on the optical transceiver module in the transmitting end bonding area and the receiving end on the optical transceiver module in the receiving end bonding area on the material strip, so that when bonding the transmitting end and the receiving end respectively, the optical transceiver modules in the corresponding bonding areas can be well fixed, thereby avoiding the problem of poor fixation due to uncertainty of the height difference between the transmitting end substrate and the receiving end substrate on the optical module, which affects the bonding yield;

[0027] (2) The present invention can realize the bonding of the transmitting end and the receiving end of an optical transceiver module with an uncertain height difference between the transmitting end substrate and the receiving end substrate on the same bonding equipment and material strip, effectively solving the problem of fixing the bonding of the two ends with different height differences, avoiding the need to switch back and forth between different material strips or fixtures to respectively realize the bonding of the receiving end and the transmitting end. The operation is simple, the efficiency is high, and it is easy to realize production automation;

[0028] (3) The present invention avoids the influence of height difference uncertainty by staggering the wiring operations of the transmitting end and the receiving end of an optical transceiver module, performing the wiring in two steps and fixing them in different ways. At the same time, through the wire bonding system, after the wiring of the receiving end of the previous module is completed, the wiring of the transmitting end of the next adjacent module can be directly carried out without additional operations. After the wiring is completed, the material strip can be moved to repeat the wiring of the receiving end of the next module and the transmitting end of the next module. The problem of cumbersome operations such as switching material strips and fixing devices when wiring the transmitting end and the receiving end is avoided. The equipment is simple, does not require additional design of fixtures and material strips, has high efficiency, and has a good wiring yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a simplified schematic diagram of an existing optical transceiver module;

[0031] Figure 2 A schematic diagram of the structure of an optical module wire bonding system provided in an embodiment of the present invention;

[0032] Figure 3 A schematic diagram of the structure of a workbench provided by an embodiment of the present invention;

[0033] Figure 4 A schematic diagram of the structure of the back side of a workbench provided by an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of the structure of a material strip provided by an embodiment of the present invention;

[0035] Figure 6 A schematic diagram of the structure of a pressing plate provided in an embodiment of the present invention;

[0036] Figure 7 A three-dimensional schematic diagram of the back side of a pressing plate provided in an embodiment of the present invention;

[0037] In the figure: 1. Optical transceiver module; 11. Transmitter substrate; 12. Receiver substrate; 2. Workbench; 21. Transmitter bonding area; 211. Vacuum adsorption block; 212. Vent; 213. Exhaust hole; 22. Receiver bonding area; 3. Material strip; 31. Through hole; 32. Receiver gold finger limiting boss; 33. Splitter and combiner component back limiting boss; 34. Carrying platform; 4. Press plate; 41. Full opening; 42. Receiver gold finger pressing platform; 43. Receiver wave combining component pressing platform; 44. Avoid opening. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0041] Embodiment 1

[0042] like Figure 2As shown, the present embodiment provides an optical module wire bonding system, comprising a workbench 2, a material strip 3, a pressure plate 4, a wire bonding device and a material strip conveying mechanism for conveying the material strip 3; the pressure plate 4 and the workbench 2 can both move up and down, and are respectively arranged above and below the material strip 3; the wire bonding device is arranged above the pressure plate 4; a plurality of receiving grooves for placing the optical transceiver module 1 to be wired are arranged side by side on the material strip 3, and a transmitting end bonding area 21 and a receiving end bonding area 22 are provided on the workbench 2, which respectively correspond to the two adjacent receiving grooves on the material strip 3; the workbench 2 cooperates with the receiving grooves to fix the transmitting end substrate 11 of the optical transceiver module 1 in the transmitting end bonding area 21; the pressure plate 4 cooperates with the receiving grooves to fix the receiving end substrate 12 of the optical transceiver module 1 in the receiving end bonding area 22. In this embodiment, a transmitting end bonding area 21 and a receiving end bonding area 22 are respectively arranged on the workbench 2, and different fixing structures are respectively adopted for the optical transceiver modules corresponding to the transmitting end bonding area 21 and the receiving end bonding area 22, so as to respectively bond the transmitting end on the optical transceiver module 1 in the transmitting end bonding area 21 and the receiving end on the optical transceiver module 1 in the receiving end bonding area 22 on the material strip 3, so that when bonding the transmitting end and the receiving end respectively, the substrate of the optical transceiver module 1 in the corresponding bonding area can be well fixed, thereby avoiding the problem of the optical module being damaged due to the bonding of the optical module. The uncertainty of the height difference between the transmitting end substrate 11 and the receiving end substrate 12 on the block causes the problem of poor fixation and affects the wire bonding yield; and it is possible to realize the wire bonding of the transmitting end and the receiving end of the optical transceiver module 1 with uncertain height difference between the transmitting end substrate 11 and the receiving end substrate 12 on the same wire bonding equipment and material strip 3, effectively solving the problem of fixing the wire bonding at both ends with different height differences, avoiding the need to switch back and forth between different material strips or fixtures to respectively realize the receiving end bonding and the transmitting end bonding, which is simple to operate, efficient, and easy to realize production automation.

[0043] The workbench 2 is a heating platform, and a heating device can be arranged inside the workbench 2 to heat the workbench 2 for preheating the bonding area. The workbench 2 is provided with at least one set of transmitting end bonding area 21 and receiving end bonding area 22, and multiple sets of transmitting end bonding area 21 and receiving end bonding area 22 can also be arranged to correspond to multiple adjacent receiving grooves on the material strip 3.

[0044] The pressure plate 4 is fixed above the material strip 3 by a pressure plate movement mechanism, and the pressure plate movement mechanism can drive the pressure plate 4 to move up and down; when the receiving end of the optical transceiver module 1 is wired, the pressure plate movement mechanism drives the pressure plate 4 to move downward and cooperates with the receiving groove to fix the receiving end substrate 12 of the optical transceiver module 1 on the material strip 3; after the wire bonding is completed at the receiving end, the pressure plate movement mechanism drives the pressure plate 4 to move upward and away from the material strip 3, so as to facilitate the movement of the material strip 3 to carry out the wiring of the optical transceiver module 1 in the next receiving groove.

[0045] The workbench 2 is fixed under the material strip 3 by a workbench movement mechanism, and the workbench movement mechanism can drive the workbench 2 to move up and down; when the transmitting end of the optical transceiver module 1 is wired, the workbench movement mechanism drives the workbench 2 to move up and cooperates with the receiving groove to fix the transmitting end substrate 11 of the optical transceiver module 1 and lift it up and suspend it away from the material strip, thereby avoiding the influence of the uncertainty of the height difference between the transmitting end substrate 11 and the receiving end substrate 12; after the wire bonding is completed at the transmitting end, the workbench movement mechanism drives the workbench 2 to move down and drop the optical transceiver module 1 back and place it flat in the receiving groove, so as to facilitate the movement of the material strip 3 to carry out the wiring of the optical transceiver module 1 in the next receiving groove.

[0046] The material strip 3 is placed on the material strip conveying mechanism, and the material strip conveying mechanism drives the material strip 3 to move in the horizontal direction; specifically, gears are provided on both sides of the material strip 3 along the conveying direction and cooperate with the material strip guide rails on the material strip conveying mechanism to realize the shifting and switching of the material strip 3.

[0047] Furthermore, a through hole 31 is provided on the bottom surface of the receiving groove for the transmitting end substrate 11 of the optical transceiver module 1 to pass through, and a vacuum adsorption block 211 for adsorbing and fixing the transmitting end substrate 11 is provided on the transmitting end wiring area 21 of the workbench 2, and the vacuum adsorption block 211 matches the through hole 31. Figure 3 As shown, by protruding the vacuum adsorption block 211 on the upper surface of the workbench 2, the vacuum adsorption block 211 can pass through the corresponding through hole 31 on the material strip 3 to adsorb and fix the transmitter substrate 11, thereby fixing the transmitter and preheating the transmitter during wire bonding. The size of the vacuum adsorption block 211 can be matched with the size of the transmitter substrate 11 of the actual optical transceiver module 1, so that the vacuum adsorption block 211 can at least cover the overlapping area of ​​the transmitter substrate 11 and the receiver substrate 12, that is, cover the area to be wire-bonded on the receiver substrate 12 where the transmitter substrate 11 is wire-bonded; the through hole 31 can accommodate the transmitter substrate 11, and can also accommodate the vacuum adsorption block 211 protruding from the workbench 2.

[0048] Furthermore, a plurality of vents 212 are provided on the top surface of the vacuum adsorption block 211, and a suction hole 213 connected to the suction device is provided on the workbench 2, and each of the vents 212 is connected to the suction hole 213. Figure 3 and Figure 4 As shown, the vent hole 212 on the vacuum adsorption block 211 is connected to the exhaust device through the exhaust hole 213 on the workbench 2, and the vacuum adsorption block 211 is vacuumed by the exhaust device so that the emission end substrate 11 is adsorbed and fixed. Among them, the exhaust device can be a vacuum pump. Optimally, a vacuum meter is also provided on the exhaust device to monitor whether the expected vacuum adsorption index is achieved when the vacuum adsorption block 211 fixes the emission end substrate 11, so as to ensure the reliability of vacuum adsorption fixation.

[0049] Furthermore, the sum of the depth of the transmitting end substrate 11 extending into the through hole 31 and the height of the vacuum adsorption block 211 is greater than the depth of the through hole 31, so that when the vacuum adsorption block 211 adsorbs and lifts the transmitting end substrate 11 until the top surface of the workbench 2 contacts the bottom surface of the material strip 3, the transmitting end of the optical transceiver module 1 is suspended from the material strip, thereby ensuring that the wiring is not affected by the uncertainty of the height difference between the transmitting end and the receiving end.

[0050] Furthermore, a full opening 41 is provided at a position corresponding to the transmitting end bonding area 21 on the pressing plate 4, for allowing a bonding head of a bonding device to pass through to bond the transmitting end of the optical transceiver module 1; an avoidance opening 44 is provided at a position corresponding to the receiving end bonding area 22 on the pressing plate 4, for allowing a bonding head of a bonding device to pass through to bond the receiving end of the optical transceiver module 1, such as Figure 6 shown.

[0051] Furthermore, a receiving end gold finger limiting boss 32 is provided in the accommodating groove, and a receiving end gold finger pressing platform 42 is provided on the bottom surface of the pressing plate 4 at a position corresponding to the receiving end gold finger limiting boss 32 of the receiving end wiring area 22. The receiving end gold finger limiting boss 32 corresponds to the receiving end gold finger pressing platform 42 in upper and lower positions and cooperates with each other to press and fix the receiving end substrate 12 near the receiving end gold finger of the optical transceiver module 1, such as Figure 5 and Figure 7 shown.

[0052] Furthermore, a bearing platform 34 is provided at the edge of the receiving groove at one end opposite to the receiving end gold finger limiting boss 32. Figure 5 shown.

[0053] Furthermore, a back limiting boss 33 of the splitter / combiner component is provided in the accommodating groove, and a receiving end splitter / combiner component pressing platform 43 is provided on the bottom surface of the pressing plate 4 at a position corresponding to the back limiting boss 33 of the splitter / combiner component in the receiving end wiring area 22. The back limiting boss 33 of the splitter / combiner component corresponds to the receiving end splitter / combiner component pressing platform 43 in upper and lower positions and cooperates with each other to press and fix the receiving end substrate 12 near the receiving end splitter / combiner component of the optical transceiver module 1, as shown in FIG. Figure 5-Figure 7 shown.

[0054] Embodiment 2

[0055] This embodiment also provides an optical module wiring method, which uses the system provided in the first embodiment and includes the following steps:

[0056] S1, placing the material strip 3 on the material strip conveying mechanism, starting from the end away from the transmitting end wiring area 21, the first receiving slot is vacant, and the optical transceiver modules 1 are placed in the remaining receiving slots in sequence;

[0057] S2, the material strip conveying mechanism drives the material strip 3 to move, so that the first receiving slot and the second receiving slot are respectively placed in the receiving end wiring area 22 and the transmitting end wiring area 21;

[0058] S3, turn on the vacuum adsorption, preheat and move the workbench 2 upward, so that the vacuum adsorption block 211 on the workbench 2 extends into the through hole 31 on the second receiving groove and adsorbs and fixes the transmitting end substrate 11 of the optical transceiver module 1 in the second receiving groove, and preheats the wiring area of ​​the transmitting end of the optical transceiver module 1; then continue to move the workbench 2 upward until the workbench 2 contacts the bottom surface of the material strip 3, so that the optical transceiver module 1 leaves the second receiving groove and is suspended and fixed above the second receiving groove by the vacuum adsorption block 211, thereby avoiding the influence of the uncertainty of the height difference between the transmitting end substrate 11 and the receiving end substrate 12; in this process, the optical transceiver modules 1 in the remaining receiving grooves are still naturally placed on the corresponding receiving grooves, and the material strips 3 are all naturally flat on the workbench 2;

[0059] S4. The bonding head of the bonding device can directly pass through the full opening 41 on the pressing plate 4 to bond the transmitting end of the optical transceiver module 1 above the second receiving groove; after the bonding of the transmitting end is completed, the vacuum adsorption is turned off, and the workbench 2 is moved down, so that the optical transceiver module 1 falls back and is placed flat in the second receiving groove, and the workbench 2 is continued to be moved down, so that the vacuum adsorption block 211 withdraws and leaves the through hole 31 on the second receiving groove, and the transmitting end substrate 11 moves down into the through hole 31 and the bottom surface of the transmitting end substrate 11 does not protrude from the lower surface of the through hole 31 of the material strip 3, thereby avoiding the influence of the uncertainty of the height difference between the two substrates;

[0060] S5, the material strip conveying mechanism drives the material strip 3 to move, so that the second receiving slot and the third receiving slot are respectively placed in the receiving end wiring area 22 and the transmitting end wiring area 21;

[0061] S6, start vacuum adsorption, preheat and move the workbench 2 upward, so that the vacuum adsorption block 211 on the workbench 2 extends into the through hole 31 on the third receiving groove and adsorbs and fixes the transmitting end substrate 11 of the optical transceiver module 1 in the third receiving groove, and preheats the wiring area of ​​the transmitting end of the optical transceiver module 1; then continue to move the workbench 2 upward until the workbench 2 contacts the bottom surface of the material strip 3, so that the optical transceiver module 1 leaves the third receiving groove and is suspended and fixed above the third receiving groove by the vacuum adsorption block 211;

[0062] Move the pressing plate 4 downward, so that the receiving end gold finger pressing platform 42 and the receiving end wave splitter / combiner pressing platform 43 on the bottom surface of the pressing plate 4 are pressed on the receiving end gold finger limiting boss 32 and the limiting boss 33 on the back of the wave splitter / combiner in the second receiving groove respectively, and the receiving end substrate 12 of the optical transceiver module 1 in the second receiving groove is pressed on the material strip 3, and the material strip 3 is pressed on the receiving end wiring area 22 of the workbench 2, and the workbench 2 preheats the wiring area of ​​the receiving end of the optical transceiver module 1 through the material strip 3 and the limiting boss on the material strip 3;

[0063] S7, the bonding head of the bonding device passes through the avoidance opening 44 on the pressing plate 4 to bond the receiving end of the optical transceiver module 1 above the second receiving slot; after the bonding of the receiving end is completed, the bonding head of the bonding device moves and passes through the full opening 41 on the pressing plate 4 to bond the transmitting end of the optical transceiver module 1 above the third receiving slot;

[0064] After the wire bonding of the transmitting end is completed, the vacuum adsorption is turned off, and the workbench 2 is moved down, so that the optical transceiver module 1 falls back and is placed flat in the third receiving groove, and the workbench 2 is further moved down, so that the vacuum adsorption block 211 withdraws and leaves the through hole 31 on the third receiving groove, and the transmitting end substrate 11 moves down into the through hole 31 and the bottom surface of the transmitting end substrate 11 does not protrude from the lower surface of the through hole 31 of the material strip 3, and the pressing plate 4 is moved up at the same time;

[0065] S8, looping steps S5-S7 until all the optical transceiver modules 1 in the material strip 3 have completed bonding.

[0066] In this embodiment, the wiring operations of the transmitting end and the receiving end of an optical transceiver module 1 are staggered, and the wiring is performed in two times and fixed in different fixing methods, thereby avoiding the influence of the height difference uncertainty; and in the wiring process, after the wiring of the receiving end of the previous optical module is completed, the wiring of the transmitting end of the next adjacent optical module can be directly carried out without additional operation; after the wiring is completed, the material strip 3 is moved to repeat the wiring of the receiving end of the next optical module and the transmitting end of the next optical module; the problem of cumbersome operations such as switching material strips and fixing devices when wiring the transmitting end and the receiving end is avoided, the equipment is simple, no additional design of fixtures and material strips is required, the efficiency is high, and the wiring yield is good.

[0067] When bonding at the transmitting end, the transmitting end substrate 11 of the optical transceiver module 1 is fixed by adsorption only by the vacuum adsorption block 211. Since the vacuum adsorption block 211 basically covers the transmitting end substrate 11, and the transmitting end substrate 11 covers the corresponding bonding areas on the transmitting end chip and the receiving end substrate 12, the entire transmitting end substrate 11 can be adsorbed and fixed by the vacuum adsorption block 211, and then the transmitting end chip and the bonding area can be supported and fixed; when bonding at the transmitting end, the transmitting end of the optical transceiver module 1 is suspended from the material strip 3, so the influence of the uncertainty of the height difference between the transmitting end and the receiving end is avoided, and the transmitting end chip can be well bonded to the bonding area on the receiving end substrate 12.

[0068] Optimally, in step S3 and step S6, when the vacuum adsorption block 211 is used to adsorb the transmitter substrate 11, when the air pressure measured by the vacuum meter on the exhaust device connected to the vacuum adsorption block 211 meets the vacuum adsorption index, it means that the end face of the vacuum adsorption block 211 in the transmitter wiring area 21 on the workbench 2 is in contact with and adsorbed and fixed to the transmitter substrate 11.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An optical module wire bonding system, characterized in that: It includes a workbench, a material strip, a pressure plate, a bonding device and a material strip conveying mechanism for conveying the material strip; the pressure plate and the workbench can move up and down, and are respectively arranged above and below the material strip; the bonding device is arranged above the pressure plate; a plurality of receiving grooves for placing optical transceiver modules to be bonded are arranged side by side on the material strip, and a transmitting end bonding area and a receiving end bonding area are provided on the workbench, which respectively correspond to two adjacent receiving grooves on the material strip; the workbench cooperates with the receiving grooves to fix the transmitting end substrate of the optical transceiver module in the transmitting end bonding area; the pressure plate cooperates with the receiving grooves to fix the receiving end substrate of the optical transceiver module in the receiving end bonding area.

2. The optical module wire bonding system according to claim 1, characterized in that: A through hole is provided on the bottom surface of the receiving groove for the transmitting end substrate of the optical transceiver module to pass through, and a vacuum adsorption block for adsorbing and fixing the transmitting end substrate is provided on the transmitting end wiring area of ​​the workbench, and the vacuum adsorption block matches the through hole.

3. The optical module wire bonding system according to claim 2, characterized in that: A plurality of vents are arranged on the top surface of the vacuum adsorption block, an exhaust hole connected to an exhaust device is arranged on the workbench, and each of the vents is connected to the exhaust hole.

4. The optical module wire bonding system according to claim 2, characterized in that: The sum of the depth of the emitting end substrate extending into the through hole and the height of the vacuum adsorption block is greater than the depth of the through hole.

5. The optical module wire bonding system according to claim 1, characterized in that: A full opening is provided at a position on the pressure plate corresponding to the wiring area of ​​the transmitting end, for allowing a wiring head of a wiring device to pass through to perform wiring on the transmitting end of the optical transceiver module; an avoidance opening is provided at a position on the pressure plate corresponding to the wiring area of ​​the receiving end, for allowing a wiring head of a wiring device to pass through to perform wiring on the receiving end of the optical transceiver module.

6. The optical module wire bonding system according to claim 1, characterized in that: A receiving end gold finger limiting boss is arranged in the accommodating groove, and a receiving end gold finger pressing platform is arranged at the position of the receiving end gold finger limiting boss corresponding to the receiving end wiring area on the bottom surface of the pressing plate. The receiving end gold finger limiting boss and the receiving end gold finger pressing platform cooperate to press and fix the receiving end substrate near the receiving end gold finger of the optical transceiver module.

7. The optical module wire bonding system according to claim 1, characterized in that: A back limiting boss of the wave splitter-combiner component is arranged in the accommodating groove, and a receiving end wave splitter-combiner component pressing platform is arranged at the position of the back limiting boss of the wave splitter-combiner component corresponding to the receiving end wiring area on the bottom surface of the pressing plate. The back limiting boss of the wave splitter-combiner component cooperates with the receiving end wave splitter-combiner component pressing platform to press and fix the receiving end substrate near the receiving end wave splitter-combiner component of the optical transceiver module.

8. A method for bonding an optical module, characterized in that: The steps include: S1. Place the strip on the strip conveying mechanism. Starting from the end away from the wire bonding area of ​​the transmitting end, the first receiving slot is vacant, and the optical transceiver modules are placed in the remaining receiving slots in sequence. S2, the material strip conveying mechanism drives the material strip to move, so that the first receiving slot and the second receiving slot are respectively placed in the receiving end wiring area and the transmitting end wiring area; S3, preheating and moving the workbench upward, and fixing the transmitting end substrate of the optical transceiver module therein by cooperating with the workbench and the second receiving groove; S4, the bonding head of the bonding device bonds the transmitting end of the optical transceiver module above the second receiving slot; after the bonding of the transmitting end is completed, the workbench is moved down so that the optical transceiver module falls back and is placed flat in the second receiving slot; S5, the material strip conveying mechanism drives the material strip to move, so that the second receiving slot and the third receiving slot are respectively placed in the receiving end wiring area and the transmitting end wiring area; S6, preheating and moving the workbench upward, fixing the transmitting end substrate of the optical transceiver module therein by cooperating with the workbench and the third receiving groove; moving the pressing plate downward, fixing the receiving end substrate of the optical transceiver module therein by cooperating with the pressing plate and the second receiving groove; S7, the bonding head of the bonding device bonds the receiving end of the optical transceiver module above the second receiving slot; after the bonding of the receiving end is completed, the bonding head of the bonding device moves and bonds the transmitting end of the optical transceiver module above the third receiving slot; after the bonding of the transmitting end is completed, the workbench is moved down to make the optical transceiver module fall back and lay flat in the third receiving slot, and the pressure plate is moved up at the same time; S8, looping steps S5-S7 until all optical transceiver modules in the strip are wired.

9. The optical module bonding method according to claim 8, characterized in that: In step S3 and step S6, when preheating and moving the workbench upward, turn on the vacuum adsorption, so that the vacuum adsorption block on the workbench extends into the through hole on the corresponding receiving groove and adsorbs and fixes the transmitting end substrate of the optical transceiver module in the receiving groove; then continue to move the workbench upward until the workbench contacts the bottom surface of the corresponding receiving groove, so that the optical transceiver module is suspended and fixed above the corresponding receiving groove; in step S4 and step S7, after the wiring of the transmitting end is completed, turn off the vacuum adsorption, and move the workbench downward, so that the optical transceiver module falls back and is placed flat in the corresponding receiving groove, and continue to move the workbench downward, so that the vacuum adsorption block withdraws and leaves the through hole on the corresponding receiving groove.

10. The optical module bonding method according to claim 8, characterized in that: In step S6, the pressure plate is moved downward so that the receiving end gold finger pressure platform and the receiving end wave splitter / combiner pressure platform on the bottom surface of the pressure plate are respectively pressed on the receiving end gold finger limiting boss and the limiting boss on the back of the wave splitter / combiner in the second accommodating groove, and the receiving end substrate of the optical transceiver module in the second accommodating groove is fixed on the material strip.

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