A method and device for adjusting crystal rod cutting

Abstract

The present invention provides a method and device for adjusting the cutting of a crystal rod, which includes the following steps: determining the total cutting process according to the size of the crystal rod; dividing the total cutting process into a plurality of equally spaced cutting segments, and calculating the cutting cross-sectional area corresponding to the crystal rod and each cutting segment; adjusting the feed rate of each cutting segment in inverse proportion to the size of each cutting cross-sectional area, and cutting the crystal rod to obtain a substrate sheet; measuring the WARP curve on the surface of the substrate sheet to check whether the WARP value of the substrate sheet meets the requirements; if not, adjusting the cutting parameters accordingly. By performing segmented precision cutting of the crystal rod, the quality of the WARP warpage of the line cutting can be improved; by measuring the surface curve of the substrate sheet, by observing the change of the curve, the adjustment direction is determined, and the process procedure of the corresponding segment is adjusted, which can further reduce the change of the warpage of each cutting segment, reduce the warpage of the entire substrate sheet, and improve the cutting quality.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a crystal rod cutting adjustment method and device. Background Art

[0002] At present, the chip substrate material is mainly sapphire substrate. Because the hardness of sapphire material is extremely high, the industry generally adopts diamond wire multi-wire cutting method. The above-mentioned diamond wire refers to diamond powder of a certain particle size evenly electroplated on the surface of the bare wire, so that the steel wire has sufficient cutting force. On the circumferential surface of two polyurethane groove wheels, equidistant V-shaped grooves are machined by CNC lathes, and diamond wires are distributed and wound in the V-shaped grooves. The two groove wheels are driven to rotate by high-speed servo motors, and the cutting steel wire is guided by the guide wheel to form a cutting diamond wire net with a certain tension on the groove wheels; the processed sapphire crystal rod is first bonded to the sticking pad, and then the crystal rod with the pad bonded to the material plate according to the angle direction of the sapphire crystal, and the material plate is clamped on the workbench with a swing mechanism of the online cutting machine, and then the crystal rod is fed by the top-down movement of the workbench, and the saw-like cutting force is formed by the high-speed pulling of the cutting steel wire, so that the cutting diamond powder blade material attached to the cutting steel wire acts on the surface of the crystal rod with a continuous and stable cutting force field, and the sapphire crystal rod moves from top to bottom at a certain speed to generate continuous pressure on the cutting steel wire. Under the action of pressure, cutting blade materials such as diamond are pressed into the surface of the sapphire crystal rod, and the sapphire crystal rod is cut into sapphire substrate sheets with uniform thickness.

[0003] The quality of sapphire substrate cutting mainly depends on the WARP warp and BOW surface type after cutting, the crystal orientation angle of the substrate after cutting, the thickness of the substrate, and the TTV thickness difference. The Bow surface type can be repaired in the subsequent processing process, and the crystal orientation angle is also relatively easy to control. The thickness is generally controlled by the precision of the groove wheel grooving, which is very easy to achieve. The most difficult to control is the WARP warp after cutting. Generally, the WARP of a 2-inch substrate after cutting is required to be controlled within 25um, the WARP of a 4-inch substrate after cutting is required to be controlled within 30um, and the WARP of a 6-inch substrate after cutting is required to be controlled within 45um. If the WARP after cutting is too large, it will be difficult to repair it in the subsequent grinding, annealing and polishing process, so the quality of wire cutting is crucial.

[0004] In the prior art, the usual practice is to control the quality of wire cutting by adjusting the downward feed speed of the crystal rod and the amount of wire used. However, this has the disadvantage that it is difficult to accurately control the curvature of each cutting step, the consumption of diamond wire is large, the material cost increases, and it is easy to cause the WARP to be too large after cutting, the quality of the substrate is unstable, the product is scrapped and the efficiency is reduced. Summary of the invention

[0005] In view of the deficiencies in the prior art, an object of the present invention is to provide a method and device for adjusting crystal rod cutting, aiming to solve the technical problem of poor cutting effect in the prior art.

[0006] On the one hand, embodiments of the present invention provide:

[0007] A method for adjusting a crystal rod cutting comprises the following steps:

[0008] Determine the total cutting process according to the size of the crystal rod;

[0009] Dividing the total cutting process into a plurality of equally spaced cutting segments, and calculating the cutting cross-sectional area corresponding to the crystal rod and each of the cutting segments;

[0010] According to the size of each of the cut cross-sectional areas, the feed rate of each of the cut segments is adjusted in inverse proportion, and the crystal rod is cut according to each of the feed rates to obtain substrate sheets;

[0011] Performing WARP curve measurement on the surface of the substrate to obtain a plurality of WARP values ​​corresponding to the WARP curve, and determining whether each of the WARP values ​​meets the requirements;

[0012] If not, the cutting parameters of the cutting segment corresponding to the WARP value that does not meet the requirement are adjusted accordingly, and the cutting parameters at least include the feed rate.

[0013] In some embodiments, the step of cutting the crystal rod according to each of the feed rates further includes:

[0014] Controlling the wire net to perform a wire supply operation, when the wire supply length of the wire net reaches a first preset length, controlling the wire net to perform a wire return operation, the wire return length of the wire net being a second preset length, and the first preset length being greater than the second preset length;

[0015] The above-mentioned wire mesh collinear operation and wire looping operation are carried out as a cycle until the overall cutting process is completed.

[0016] In some embodiments, the step of cutting the crystal rod according to each of the feed rates further includes:

[0017] The substrate sheet is controlled to swing back and forth along the direction of the cutting line when moving on the side close to the cutting machine.

[0018] In some embodiments, the step of adjusting the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement specifically includes:

[0019] When a portion of the substrate sheet is bent toward one side of the cutting machine, the feed rate of the cutting section corresponding to the bent portion is increased.

[0020] In some embodiments, the step of adjusting the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement specifically includes:

[0021] When a portion of the substrate sheet is bent toward one side of the cutting machine, the linear speed of the cutting section corresponding to the bent portion is reduced.

[0022] In some embodiments, the step of adjusting the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement specifically includes:

[0023] When the portion of the substrate sheet is bent toward one side of the cutting machine, the first preset length is reduced.

[0024] In some embodiments, after the step of obtaining the substrate sheet, the method further comprises:

[0025] The surface shape of the substrate sheet is measured, and when the convexity of the single-side surface shape of the substrate sheet exceeds a preset value, the swing speed of the substrate sheet is reduced.

[0026] On the other hand, an embodiment of the present invention further provides a crystal rod cutting adjustment device, comprising:

[0027] A process module is used to determine the total cutting process according to the size of the crystal rod;

[0028] A cutting module, used for dividing the total cutting process into a plurality of equally spaced cutting segments, and calculating the cutting cross-sectional areas corresponding to the crystal rod and each of the cutting segments;

[0029] A cutting module, used for adjusting the feed rate of each cutting segment in inverse proportion to the size of each cutting cross-sectional area, and cutting the crystal rod according to each feeding rate to obtain a substrate sheet;

[0030] A first measurement module, configured to perform WARP curve measurement on the surface of the substrate to obtain a plurality of WARP values ​​corresponding to the WARP curve, and determine whether each of the WARP values ​​meets the requirements;

[0031] The adjustment module is used to adjust the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement if the WARP value does not meet the requirement.

[0032] In some embodiments, the cutting module further comprises:

[0033] A wire supply and return unit, used for controlling the wire network to perform wire supply operation, and when the wire supply length of the wire network reaches a first preset length, controlling the wire network to perform a wire return operation, the wire return length of the wire network is a second preset length, and the first preset length is greater than the second preset length;

[0034] The circulation unit is used for performing the above-mentioned wire web co-linear operation and wire looping operation as a cycle until the overall cutting process is completed.

[0035] In some embodiments, the cutting module further comprises:

[0036] The swing unit is used to control the substrate sheet to swing back and forth along the direction of the cutting line when the substrate sheet moves close to the cutting machine.

[0037] In some embodiments, the adjustment module specifically includes:

[0038] The feeding unit is used to speed up the feeding rate of the cutting segment corresponding to the bent portion when the portion of the substrate sheet is bent toward one side of the cutting machine.

[0039] In some embodiments, the adjustment module specifically includes:

[0040] The speed unit is used to reduce the linear speed of the cutting section corresponding to the bent portion when the portion of the substrate sheet is bent toward one side of the cutting machine.

[0041] In some embodiments, the adjustment module specifically includes:

[0042] The wire supply adjusting unit is used to reduce the first preset length when a portion of the substrate sheet is bent toward one side of the cutting machine.

[0043] In some embodiments, the crystal rod cutting adjustment device further includes:

[0044] A second measuring module, used for measuring the surface shape of the substrate sheet;

[0045] The adjusting module is used to reduce the swinging speed of the substrate sheet when the protrusion of the single-side profile of the substrate sheet exceeds a preset value.

[0046] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: by performing precision cutting on the sapphire substrate sheet area through a segmented program, the consumption of diamond wire is greatly reduced on the basis of improving the quality of wire cutting WARP warpage; by measuring the surface curve of the substrate sheet after the initial program cutting, the adjustment direction is determined by observing the change of the curve, and the corresponding segmented process program is adjusted, the change of warpage of each cutting section can be further reduced, and the warpage of the entire substrate sheet can be reduced, which plays a role in improving cutting quality, reducing wire cutting time, improving equipment utilization rate, and increasing output. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 Flow chart of the crystal rod cutting adjustment method in the first embodiment of the present invention;

[0048] Figure 2 Flow chart of the crystal rod cutting adjustment method in the second embodiment of the present invention;

[0049] Figure 3 A schematic diagram of the size of the crystal rod and the area of ​​the cut segments in the second embodiment of the present invention;

[0050] Figure 4 is a WARP curve diagram of a substrate sheet in a second embodiment of the present invention;

[0051] Figure 5 It is a schematic structural diagram of a cutting machine and a crystal rod in a second embodiment of the present invention;

[0052] Figure 6 It is a structural block diagram of a crystal rod cutting and adjusting device in a third embodiment of the present invention;

[0053] Description of main component symbols:

[0054] Process module 10, slicing module 20, cutting module 30, wire supply and return unit 31, circulation unit 32, swing unit 33, first measuring module 40, adjustment module 50, feeding unit 51, speed unit 52, wire supply adjustment unit 53, second measuring module 60, adjustment module 70, groove wheel 81, crystal rod 82, sticking rod pad 83, material plate 84, wire mesh 85. DETAILED DESCRIPTION

[0055] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0056] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0058] Embodiment 1

[0059] A first embodiment of the present invention provides a method for adjusting a crystal ingot cut. Figure 1 is a flow chart of a method for adjusting a crystal rod cutting according to an embodiment of the present application. Figure 1 As shown, the process includes the following steps:

[0060] Step S101, determining the total cutting process according to the size of the crystal ingot. Specifically, in this step, the total cutting process is determined by the actual cutting stroke, and the size of the crystal ingot is the vertical distance from the round edge fixed point of the crystal ingot to the flat edge of the crystal ingot.

[0061] Step S102, the total cutting process is divided into a plurality of equidistant cutting segments, and the cutting cross-sectional area corresponding to the crystal rod and each of the cutting segments is calculated. Specifically, in this step, the total cutting process is divided into a plurality of equidistant cutting segments, and the distance of each cutting segment is set as the cutting amount of each segment of the wire cutting process. At the same time, for subsequent measurement errors, it is convenient to precisely adjust the parameter page of the corresponding cutting segment.

[0062] Step S103, according to the size of each of the cut cross-sectional areas, the feed rate of each of the cut sections is adjusted in inverse proportion, and the crystal rod is cut according to each of the feed rates to obtain a substrate sheet. Specifically, in this step, since the splitting capacity is proportional to the required splitting capacity, and the larger the required cutting area of ​​the crystal rod, the slower the downward cutting speed needs to be, in order to ensure the stability of the cutting, so as to ensure the WARP warping after cutting.

[0063] Step S104, measuring the WARP curve of the surface of the substrate to obtain a plurality of WARP values ​​corresponding to the WARP curve, and determining whether each WARP value meets the requirements. Specifically, in this step, the WARP value of the substrate is measured by a surface curve measuring instrument.

[0064] Step S105: if not, the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement are adjusted accordingly, and the cutting parameters at least include the feed rate.

[0065] In the above steps S101 to S105, precise cutting is performed by segmenting the area of ​​the sapphire substrate sheet, thereby improving the quality of the wire cutting WARP and greatly reducing the consumption of diamond wire; by measuring the surface curve of the substrate sheet after the initial program cutting, the adjustment direction is determined by observing the change of the curve, and the corresponding segmented process program is adjusted, which can further reduce the change of the warpage of each cutting section and reduce the warpage of the entire substrate sheet, thereby improving the cutting quality, reducing the wire cutting time, improving the equipment utilization rate, and increasing the output.

[0066] Embodiment 2

[0067] like Figure 2-5 As shown, the second embodiment of the present invention provides a crystal rod cutting adjustment method.

[0068] For ease of understanding, in some application scenarios of this embodiment, such as Figure 5 As shown, the cutting machine in the present invention includes two groove wheels 81 and a wire mesh 85 arranged between the two groove wheels. The crystal rod 82 is fixed on the material plate 84 through a sticking pad 83. The material plate 84 moves the crystal rod 82 toward the wire mesh 85 through a driving component (not shown) to cut the crystal rod 82 through the high-speed rotating wire mesh 85.

[0069] Figure 2 is a flow chart of a method for adjusting a crystal rod cutting according to an embodiment of the present application. Figure 2 As shown, the process includes the following steps:

[0070] Step S201, determining the total cutting process according to the size of the crystal rod. Specifically, in this step, the total cutting process includes the actual cutting stroke, the reserved stroke of the upper knife and the lower knife.

[0071] Step S202, dividing the total cutting process into a plurality of equidistant cutting segments, and calculating the cutting cross-sectional area corresponding to the crystal rod and each cutting segment.

[0072] Step S203, adjusting the feed rate of each cutting segment in inverse proportion to the size of each cutting cross-sectional area.

[0073] Step S204, control the wire net to perform wire supply operation, when the wire supply length of the wire net reaches the first preset length, control the wire net to perform wire return operation, the wire return length of the wire net is the second preset length, and the first preset length is greater than the second preset length. Specifically, in this step, the first preset length is greater than the second preset length, which means that the length of the new wire supplied is greater than the retracted length, that is, in each cutting process, it can be guaranteed that there is a small amount of new wire with strong cutting ability, which ensures the cutting strength while reducing the amount of wire used. In addition, in the specific operation process, the common line operation and the return line operation of the wire net are used as a cycle until the total cutting process is completed.

[0074] Step S205, cutting the crystal rod according to each of the feed rates, controlling the substrate sheet to swing back and forth along the cutting line when moving close to the side of the cutting machine, so as to obtain a substrate sheet. Specifically, in this step, by controlling the substrate sheet to swing back and forth along the cutting line during the downward feeding process, the cutting contact area between the diamond wire and the crystal rod can be reduced, thereby improving the cutting efficiency.

[0075] Step S206 , measuring the WARP curve of the surface of the substrate to obtain a plurality of WARP values ​​corresponding to the WARP curve, and determining whether each of the WARP values ​​meets the requirements.

[0076] Step S207, when part of the substrate sheet is bent toward one side of the cutting machine, the feed rate of the cutting segment corresponding to the bent part is accelerated. Specifically, in this step, when part of the substrate sheet is bent toward one side of the cutting machine, it means that the cutting capacity is too strong when cutting this part. By accelerating the feed rate of the corresponding part, the required cutting amount at the same cutting frequency is increased to balance the cutting capacity, thereby ensuring stable cutting and reducing the warpage WARP value. At the same time, the cutting efficiency can be accelerated and the output can be improved. In addition, it can be understood that in some application scenarios of this embodiment, when the cutting capacity is weak, the substrate surface at the inlet end cannot be cut. Under the action of the downward pressure of the substrate sheet, the diamond wire will retreat in the opposite direction, causing the substrate sheet to bend toward the outside of the cutting machine. At this time, the feed rate of the corresponding part can be reduced to achieve a cutting balance effect.

[0077] Step S208, when part of the substrate sheet is bent toward one side of the cutting machine, the linear speed of the cutting segment corresponding to the part is reduced. Specifically, in this step, when part of the substrate sheet is bent toward one side of the cutting machine, it means that the cutting ability is too strong when cutting this part. By reducing the linear speed of the corresponding part, the cutting ability is balanced, thereby ensuring the cutting stability and reducing the warpage WARP value. In addition, it can be understood that in some application scenarios of this embodiment, when the cutting ability is weak, the substrate surface at the inlet end cannot be cut. Under the action of the downward pressure of the substrate sheet, the diamond wire will retreat in the opposite direction, causing the substrate sheet to bend toward the outside of the cutting machine. At this time, the linear speed of the corresponding part can be accelerated to achieve a cutting balance effect.

[0078] Step S209, when part of the substrate sheet is bent toward one side of the cutting machine, the first preset length is reduced. Specifically, in this step, when part of the substrate sheet is bent toward one side of the cutting machine, it means that the cutting capacity is too strong when cutting this part. By reducing the first preset length, that is, reducing the supply line length, that is, reducing the amount of new line, the purpose of balancing the cutting capacity, ensuring stable cutting, and reducing the warpage WARP value can be achieved, and the amount of steel wire can also be saved. In addition, it can be understood that in some application scenarios of this embodiment, when the cutting capacity is weak, the substrate surface at the inlet end cannot be cut. Under the action of the downward pressure of the substrate sheet, the diamond wire will retreat in the opposite direction, causing the substrate sheet to bend toward the outside of the cutting machine. At this time, the first preset length can be increased and new line cases can be added to achieve a cutting balance effect.

[0079] Step S210, measuring the surface shape of the substrate sheet. Specifically, in this step, the surface shape of the cut substrate sheet is measured by a surface shape measuring machine.

[0080] Step S211, when the protrusion of the single-side profile of the substrate sheet exceeds the preset value, reduce the swing speed of the substrate sheet. Specifically, in this step, the left and right swing angles are related to the surface profile changes of the wafer along the vertical center line on both sides. The left and right sides of the center line will present different concave and convex deformations. The single-side profile is too convex, and the swing cutting force can be enhanced by reducing the swing speed. It can be understood that in this embodiment, when the protrusion exceeds the preset value, the swing cutting force can also be enhanced by increasing the swing angle to ensure the stability of the substrate sheet surface profile after cutting. In addition, it can be understood that in some application scenarios of this embodiment, when the concavity of the single-side profile of the substrate sheet exceeds the preset value, it means that the swing cutting force is too strong. By increasing the swing speed and reducing the swing angle, the swing cutting force can be reduced to ensure the stability of the substrate sheet surface profile after cutting.

[0081] It can be understood that after this step, when the cutting parameters are adjusted, the cutting test can be performed again, and steps S206 to S211 can be performed again until the measurement results meet the requirements.

[0082] In the above steps S201 to S211, precise cutting is performed on the sapphire substrate sheet area by segmented program, so as to improve the quality of the wire cutting WARP warp. By setting the wire supply and return line, the consumption of diamond wire can be greatly reduced, and the cutting ability of diamond wire can be improved by controlling the substrate sheet to swing. By measuring the surface curve of the substrate sheet after the initial program cutting, the adjustment direction is determined by observing the change of the curve, and the corresponding segmented process program is adjusted, the change of the warp of each cutting section can be further reduced, and the warp of the entire substrate sheet can be reduced, which plays a role in improving the cutting quality, reducing the wire cutting time, improving the equipment utilization rate, and increasing the output. By measuring the surface shape of the substrate sheet after cutting, the swing parameters are adjusted to make the concavity of the substrate sheet after cutting meet the requirements.

[0083] For ease of understanding, in some application scenarios of this embodiment, based on a diamond wire with a wire diameter of 0.23 mm, taking a wire cutting machine with 60 segments as an example, the specific operation process is as follows:

[0084] (I) Design the initial cutting program

[0085] 1. Determine the cutting range;

[0086] a. Initial reserve amount A: When sticking the rod, the positioning flat edge of the crystal rod will be adhered to the surface of the sticking pad. When cutting, the flat edge of the crystal rod faces upward and the round edge faces downward. A 1mm position is reserved below the round edge as the rod pressing point. It is set as the program zero point, which is the starting point of the wire cutting. Leaving a 1mm position can ensure that the wire cutting wire net can gradually contact the round edge position of the crystal rod and cut into the crystal rod according to the feed rate designed by the program when pulling and cutting, reducing the damage to the round edge position of the crystal rod caused by direct contact with the crystal rod for cutting;

[0087] b. The cross-section cutting distance B of the crystal rod: that is, the vertical distance from the vertex of the round edge of the crystal rod to the flat edge of the crystal rod, which is the original size of the crystal rod;

[0088] c. Distance C of cutting into the adhesive rod pad: When the online cutting machine is working, the swing mechanism swings left and right, and the highest point of the vertical center of the flat edge of the crystal rod can finally be cut through, so the left and right sides of the pad will be cut into a distance, which is set to 5mm in this embodiment.

[0089] like Figure 3 As shown, the total cutting process L=A+B+C=1+B+5mm.

[0090] d. Divide the cutting range L into 60 equally spaced segments, and set the distance of each segment to the cutting amount of each of the 60 segments of the wire cutting process.

[0091] 2. Design the feed speed for pressing down the sheet;

[0092] a. According to the starting position of each cut segment, the corresponding cross-sectional area of ​​each substrate sheet is calculated, and the cross-sectional area of ​​each segment is calculated according to the trigonometric formula;

[0093] b. Calculate the inverse ratio of the area of ​​each segment according to the total cross-sectional area of ​​the crystal rod / the cross-sectional area of ​​each segmented crystal rod;

[0094] c. According to the inverse ratio of the area of ​​each section * the standard value of the feed rate, a standard value is generally fixed at 1.0, the feed speed of each section is calculated, the wire supply is fixed, and the feed speed of the material plate is designed to be 200-500um / min. The feed speed of each section is inversely proportional to the area after segmentation, that is, the larger the area of ​​the crystal rod, the slower the speed of the downward cutting. In this way, different wire consumptions are designed in different areas, so that the area is proportional to the cutting capacity. The feed of the material plate downward pressure can more directly control the wire bow to ensure the warp degree after cutting;

[0095] d. According to the feeding distance / feeding speed of each section, calculate the cutting time of each section and the cutting time of the entire crystal rod;

[0096] e. Set a standard value of 20m / min for wire supply, calculate the number of meters of wire consumed in each section, and reversely calculate and verify the number of meters of wire consumed in each section / the area of ​​each section, so that the calculated values ​​are consistent.

[0097] 3. Design the line speed of each section. The line speed of each section is consistent during the initial design, generally set at 1200-1450m / min. After the first cutting in the initial wire cutting program, further adjustments are made based on the warpage measurement of the substrate after cutting.

[0098] 4. Design supply and return lines;

[0099] a. Reasons for designing the supply and return wire: If you always use new diamond wire and cut in one direction, the diamond wire will wear out quickly during the cutting process, which will cause the cutting force of the diamond wire from the position where it enters the crystal rod to the position where the diamond wire exits the crystal rod. This will cause uneven cutting due to the decrease in cutting ability. Therefore, we adopt the method of rotating the groove wheel in the positive direction, supplying the wire net for a distance, and then rotating the groove wheel in the opposite direction, and returning the wire net for a distance. The old wire that has been cut is used for cutting in a cycle to supply and return the wire. The length of the supply wire is greater than the length of the return wire. A small amount of new wire is provided in each cycle to ensure the cutting ability, and to ensure the uniformity of the steel wire cutting ability during the entire cutting process;

[0100] b. The initial design is to supply 1000 meters of wire at a time, return 960-970 meters, and use 30-40 meters of wire for a single cycle. The wire usage for each segment and the total wire usage are calculated through the feed speed and wire speed of the material plate. The amount of wire usage directly determines the strength of the wire cutting capability. After the first cutting of the initial wire cutting program, further adjustments are made based on the warpage measurement of the substrate after cutting.

[0101] 5. Design the tension of the diamond wire mesh. The general design range is between 38-45N, and the initial design is 41N. After the first cutting in the initial wire cutting program, further adjustments are made based on the warpage measurement of the substrate after cutting.

[0102] 6. Design the flow rate and temperature of wire cutting coolant;

[0103] a. Sufficient coolant flow will promptly flush away the crystal rod powder caused by the cutting process, reducing the wear between the crystal rod powder and the groove wheel and diamond wire. Since the cutting steel wire will generate heat due to the friction between the two during the cutting process of the sapphire crystal rod, the contact surface between the sapphire crystal rod and the cutting steel wire will generate high temperature. The cutting coolant has a cooling effect on the sapphire crystal rod and the cutting steel wire;

[0104] b. The initial design coolant flow rate is 120L / Min. After the first cut in the initial wire cutting program, further adjustments are made based on the warpage measurement of the substrate after cutting;

[0105] c. The temperature of the cutting coolant is generally set at 20-21°C. If the temperature is too high, the cooling effect will be reduced, the bearings at both ends of the groove wheel will dissipate heat slowly, the deformation will be large, and the cutting quality will be unstable. If the temperature is too low, the difference with the working environment temperature will cause condensation in the bearing boxes at both ends of the groove wheel, and the metal structure in the bearing box will rust and wear. Therefore, the adjustment program is generally not adjusted.

[0106] 7. Design the left and right swing angle and swing speed of the swing mechanism. Generally, the left and right swing angle is designed to be 5-7°, the swing speed is 6-10m / min, and the swing interval is 0. Further adjustments are made based on the warpage measurement after the substrate sheet is cut.

[0107] In addition, because the first section of the pressing rod reserves 1mm of space, the corresponding cross-sectional area of ​​the crystal rod is smaller. In order to reduce the edge chipping of the wire cutting knife and balance the cutting capacity, the cutting process parameters of the second section are generally used. Because the last two sections (segments 59-60) mainly correspond to the cutting of the sticking rod pad, there is no substrate sheet cutting area. In order to flatten the wire bow and control the edge chipping of the knife, the cutting process parameters of the 58th section are generally used.

[0108] After the initial cutting program design is completed, check whether the total wire consumption and total cutting time are calculated correctly and meet the basic requirements of diamond wire material consumption and cutting efficiency.

[0109] (ii) Set the designed initial cutting program in 60 segments to the wire cutting parameter page, start the program to cut the crystal rod, and then adjust the cutting program according to the curve measurement of the substrate surface after cutting to further improve the cutting quality, reduce the warp, reduce the amount of wire used, and reduce the cutting time

[0110] 1. Use a surface curve measuring instrument to measure the WARP of the substrate after cutting;

[0111] a. When unloading the machine, place the side of the substrate facing the inside of the wire cutting machine as the measuring surface, place the cut substrate with the round edge facing left and the flat edge facing right on the measuring platform of the surface curve measuring instrument, turn on the switch to control the left and right drives to move left and right, and make sure that the measuring needle must pass through the vertical center line of the substrate;

[0112] b. Press down the probe, so that the left and right drivers are pressed down along the Z-axis column, and the probe tip touches the surface of the substrate, which is the starting position of the round edge;

[0113] c. Set the measuring length to B-2mm, leave 1mm space on the left and right as the measurement start and end points, click the measurement button to start the measurement, and when it is 1mm away from the flat edge, the measurement stops and the probe automatically rises. The measuring instrument automatically calculates the WARP curve of the substrate and the measurement distance corresponding to the curve fluctuation, and displays them on the display.

[0114] 2. Perform process analysis and adjustments based on the measured WARP curve and the measured distance corresponding to the curve fluctuation;

[0115] a. Figure 4 As shown: the curve shown starts to bend upward from the second segment, passes through the highest point of the warping, then the curve slowly bends downward, passes through the lowest point of the warping, and then slowly bends upward;

[0116] b. If the cutting capacity is too strong, the amount of cutting from the substrate surface at the inlet end will increase, and the substrate sheet will bend toward the inside of the cutting machine. On the contrary, if the cutting capacity is too weak, the substrate surface at the inlet end cannot be cut. Under the pressure of the material plate, the diamond wire will retreat in the opposite direction, causing the substrate sheet to bend toward the outside of the cutting machine. If the cutting capacity is too strong when it bends upward, and too weak when it bends downward, make program adjustments:

[0117] c. Adjust the warpage after cutting: According to the measuring distance point corresponding to the curve fluctuation, adjust the program parameters of each segment within the 60-point segment. The cutting ability is too strong. Follow the steps below to adjust. Only one item needs to be adjusted each time. The program parameters between each segment should change gradually according to the uniform transition parabola.

[0118] (1) The feeding speed of the material plate can be increased accordingly, which can increase the cutting speed and reduce the cutting time. While adjusting the wire cutting quality, it can also speed up the cutting efficiency and increase the output.

[0119] (2) Line speed is reduced. The line speed of the corresponding segment is reduced by 15-20m / min for every 2um of warp;

[0120] (3) Adjust the length of the supply wire and the return wire to reduce the amount of supply wire. For every 2um of warp, the length of the corresponding supply wire-return wire is reduced by 4m. Multiple adjustments will eventually use the least amount of diamond wire to cut the best quality, thus saving steel wire.

[0121] In addition, if the line cutting performance is too weak, adjust it in the opposite direction.

[0122] d. Adjust the wire cutting tension according to the WARP of the substrate after cutting. The greater the tension, the better the WARP cutting. However, it should be noted that too much tension will cause the V-groove wear of the sheave to increase, the wear of the wire pulley to increase, the torque borne by the sheave bearing to increase, and the service life to decrease.

[0123] e. Adjust the flow rate and temperature of the wire cutting coolant according to the bearing box temperature recorded during the wire cutting process. Generally, the bearing box temperature is controlled at 25-26°C. The smaller the flow rate and the higher the set temperature, the worse the cooling effect on the bearing box. However, if the bearing box temperature is too low, condensed water will damage the bearing box.

[0124] f. Adjust the swing angle and swing speed. Generally, a special surface measuring machine for substrates is used to measure the surface of the cut substrates. The left and right swing angles are related to the surface changes on both sides of the wafer along the vertical center line. The left and right sides of the center line will show different concave and convex deformations. If the single side is too convex, the swing angle can be appropriately increased and the swing speed can be reduced to enhance the swing cutting force.

[0125] In addition, if one side profile is too concave, adjust it in the opposite direction.

[0126] (III) Generally, after 2-4 adjustments to the process, the quality requirements of the substrate after cutting can be met, and WARP can be controlled to the lowest level. At the same time, the amount of diamond wire used can be reduced, the material cost can be reduced, the cutting time can be shortened, and the output efficiency can be improved.

[0127] Embodiment 3

[0128] Figure 6 is a structural block diagram of the crystal rod cutting adjustment device in the embodiment of the present application, such as Figure 6 As shown, the crystal rod cutting adjustment device in the third embodiment of the present invention includes a process module 10, a cutting module 20, a cutting module 30, a first measurement module 40 and an adjustment module 50. The process module 10 is used to determine the total cutting process according to the size of the crystal rod; the cutting module 20 is used to divide the total cutting process into a plurality of equidistant cutting segments, and obtain the cutting cross-sectional area of ​​the crystal rod corresponding to each of the cutting segments; the cutting module 30 is used to adjust the feed rate of each of the cutting segments in inverse proportion to the size of each of the cutting cross-sectional areas, and cut the crystal rod according to each of the feed rates to obtain a substrate sheet; the first measurement module 40 is used to perform WARP curve measurement on the surface of the substrate sheet to check whether the WARP value of the substrate sheet meets the requirements; the adjustment module 50 is used to adjust the cutting parameters of the cutting segment corresponding to the WARP value that does not meet the requirements if the WARP value does not meet the requirements.

[0129] Furthermore, in the present embodiment, the cutting module 30 also includes a wire supply and return unit 31 and a circulation unit 32. The wire supply and return unit 31 is used to control the wire network to perform wire supply operations. When the wire supply length of the wire network reaches a first preset length, the wire network is controlled to perform a return operation. The return length of the wire network is a second preset length, and the first preset length is greater than the second preset length. The circulation unit 32 is used to use the common line operation and return operation of the wire network as a cycle until the overall cutting process is completed.

[0130] Furthermore, in this embodiment, the cutting module 30 further includes a swing unit 33 for controlling the substrate sheet to swing back and forth along the direction of the cutting line when the substrate sheet moves toward one side of the cutting machine.

[0131] Specifically, in this embodiment, the adjustment module 50 specifically includes a feeding unit 51, which is used to increase the feeding rate of the cutting segment corresponding to the bent portion when a portion of the substrate sheet is bent toward one side of the cutting machine.

[0132] In some embodiments, the adjustment module 50 specifically includes a speed unit 52, which is used to reduce the line speed of the cutting segment corresponding to the bent portion when the portion of the substrate sheet is bent toward one side of the cutting machine. In some embodiments, the adjustment module 50 specifically includes: a line supply adjustment unit 53, which is used to reduce the first preset length when the portion of the substrate sheet is bent toward one side of the cutting machine.

[0133] In addition, in this embodiment, the above-mentioned crystal rod cutting and adjustment device also includes a second measuring module 60 and an adjustment module 70: the above-mentioned second measuring module 60 is used to measure the surface shape of the substrate sheet; the above-mentioned adjustment module 70 is used to reduce the swing speed of the substrate sheet when the protrusion of the single-side surface shape of the substrate sheet exceeds a preset value.

[0134] In summary, the crystal rod cutting and adjustment device in this embodiment performs precision cutting on the segmented program of the sapphire substrate sheet area through the cutting module 20 and the cutting module 30, thereby greatly reducing the consumption of diamond wire on the basis of improving the quality of the wire cutting WARP warp; the first measurement module 40 measures the surface curve of the substrate sheet after the initial program cutting, and by observing the change of the curve, the adjustment direction is determined based on the adjustment module 50, and the corresponding segmented process program is adjusted, which can further reduce the change of the warp of each cutting section and reduce the warp of the entire substrate sheet, thereby improving the cutting quality, reducing the wire cutting time, improving the equipment utilization rate, and increasing the output. The second measurement module 60 measures the surface shape of the substrate sheet, and the parameters of the swing mechanism are adjusted based on the adjustment module 70 to ensure that the surface shape meets the requirements.

[0135] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0136] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A method for adjusting a crystal rod cutting, It is characterized in that The following steps are involved: Determine the total cutting process according to the size of the crystal rod; Dividing the total cutting process into a plurality of equally spaced cutting segments, and calculating the cutting cross-sectional area corresponding to the crystal rod and each of the cutting segments; According to the size of each of the cut cross-sectional areas, the feed rate of each of the cut segments is adjusted in inverse proportion, and the crystal rod is cut according to each of the feed rates to obtain substrate sheets; Performing WARP curve measurement on the surface of the substrate to obtain a plurality of WARP values ​​corresponding to the WARP curve, and determining whether each of the WARP values ​​meets the requirements; If not, correspondingly adjusting the cutting parameters of the cutting segment corresponding to the WARP value that does not meet the requirement, the cutting parameters at least including the feed rate; Wherein, the step of cutting the crystal rod according to each of the feed rates further includes: Controlling the wire net to perform a wire supply operation, when the wire supply length of the wire net reaches a first preset length, controlling the wire net to perform a wire return operation, the wire return length of the wire net being a second preset length, and the first preset length being greater than the second preset length; The wire feeding operation and the wire returning operation of the wire net are used as a cycle until the overall cutting process is completed.

2. The method for adjusting the crystal rod cutting according to claim 1, It is characterized in that The step of cutting the crystal rod according to each of the feed rates further comprises: The substrate sheet is controlled to swing back and forth along the direction of the cutting line when moving on the side close to the cutting machine.

3. The method for adjusting the crystal rod cutting according to claim 1, It is characterized in that The step of adjusting the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement specifically includes: When a portion of the substrate sheet is bent toward one side of the cutting machine, the feed rate of the cutting section corresponding to the bent portion is increased.

4. The method for adjusting the crystal rod cutting according to claim 1, It is characterized in that The step of adjusting the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement specifically includes: When a portion of the substrate sheet is bent toward one side of the cutting machine, the linear speed of the cutting section corresponding to the bent portion is reduced.

5. The method for adjusting the crystal rod cutting according to claim 1, It is characterized in that The step of adjusting the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement specifically includes: When the portion of the substrate sheet is bent toward one side of the cutting machine, the first preset length is reduced.

6. The method for adjusting the crystal rod cutting according to claim 2, It is characterized in that After the step of obtaining the substrate sheet, the method further comprises: Measuring the surface shape of the substrate sheet; When the protrusion of the single-side profile of the substrate sheet exceeds a preset value, the swing speed of the substrate sheet is reduced.

7. A crystal rod cutting and adjustment device, It is characterized in that include: A process module is used to determine the total cutting process according to the size of the crystal rod; A cutting module, used for dividing the total cutting process into a plurality of equally spaced cutting segments, and calculating the cutting cross-sectional areas corresponding to the crystal rod and each of the cutting segments; A cutting module, used for adjusting the feed rate of each cutting segment in inverse proportion to the size of each cutting cross-sectional area, and cutting the crystal rod according to each feeding rate to obtain a substrate sheet; A first measurement module, configured to perform WARP curve measurement on the surface of the substrate to obtain a plurality of WARP values ​​corresponding to the WARP curve, and determine whether each of the WARP values ​​meets the requirements; An adjustment module, for adjusting the cutting parameters of the segment corresponding to the WARP value that does not meet the requirement if the WARP value does not meet the requirement; Wherein, the cutting module also includes: A wire supply and return unit, used for controlling the wire network to perform wire supply operation, and when the wire supply length of the wire network reaches a first preset length, controlling the wire network to perform a wire return operation, the wire return length of the wire network is a second preset length, and the first preset length is greater than the second preset length; The circulation unit is used for performing the wire supply operation and the wire return operation of the wire web as a cycle until the overall cutting process is completed.

8. The ingot cutting and adjusting device according to claim 7, It is characterized in that The cutting module also includes: The swing unit is used to control the substrate sheet to swing back and forth along the direction of the cutting line when the substrate sheet moves close to the cutting machine.

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