A semiconductor chip packaging component and its packaging method

Abstract

The present invention discloses a semiconductor chip packaging component and a packaging method thereof. A semiconductor chip is fixedly installed on a base island, and a plurality of pads are formed on the surface of the semiconductor chip. A number of non-intersecting metal lead lines are provided inside a flexible high-temperature resistant insulating flexible board, and a first connection part and a second connection part are pre-formed at both ends of the metal lead lines. Only the first connection part is bonded to the semiconductor chip, and the connected semiconductor chip, base island and flexible high-temperature resistant insulating flexible board are encapsulated with a plastic encapsulant, and the second connection part is exposed. By the above method, only one connection is required, and all metal lead lines can be simultaneously bonded to the semiconductor chip, improving the bonding efficiency. The second connection part is used as a metal pin to connect to a PCB board, reducing the number of bondings. The flexible high-temperature resistant insulating flexible board has good high-temperature resistance and insulation effects, effectively avoiding short circuits caused by the contact of power lines or signal lines and the occurrence of arc electrical interference caused by the too-close distance between them.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and particularly relates to a semiconductor chip packaging component and a packaging method thereof. Background Art

[0002] As Figure 19 、 20 shown, in the traditional semiconductor chip packaging process, the semiconductor chip is generally first fixedly placed above the chip carrier area (commonly known as the base island) of a metal lead frame or an organic substrate through a conductive adhesive or a non-conductive adhesive, and then through the bonding method of metal wires, the semiconductor chip is bonded to the metal pins of the corresponding metal lead frame or organic substrate. After that, through the process of encapsulating with encapsulant, a component capable of protecting the semiconductor chip is formed, and for the encapsulant structure of each object and interface in the semiconductor chip, the metal pins extended from the encapsulant are interconnected and soldered to the PCB (printed circuit board) outside the encapsulant.

[0003] In the entire packaging process of the semiconductor chip, the bonding of metal wires (Wire bonding) plays the function of transmitting power and signals between the chip inside the encapsulant and the outside of the encapsulant for power and signals. Whether it is a digital chip, a memory chip, a power management chip, a control and drive chip, or a power electronics power stage chip, in the traditional chip packaging technology, the bare chip is bonded and interconnected with the metal pins outside the bare chip through metal wires. However, the bonding of metal wires requires one metal wire at a time, and is bonded successively under the conditions of temperature, time, and pressure. Especially for digital function or memory chips, there are often hundreds or even hundreds of metal wires that need to be bonded. As a result, the following common defects will occur, which are also the difficulties that need to be overcome in the global traditional semiconductor chip packaging industry:

[0004] 1. The large number of metal wires results in low production efficiency and invisibly increases the production cost.

[0005] 2. When the metal wire density is high and the length is long, if the distance is slightly close, it is easy to cause interference between the signals or electrical properties of different metal wires, and the distance between metal wires is determined according to the magnitude of the voltage.

[0006] When there are more and longer metal wires, the structural support force carried by the metal wires will be weaker, and in the process of plastic packaging, it is easy to cause poor wire arcs, collapse, or short circuits due to mutual contact between wires.

[0007] A flexible circuit board that can withstand high temperatures, commonly known as a "flexible board", is a printed circuit made of a flexible insulating substrate. The flexible circuit board that can withstand high temperatures provides excellent electrical performance, can meet the design requirements of smaller and higher-density installations, and also helps to reduce assembly processes and enhance reliability. The flexible circuit board that can withstand high temperatures is an effective solution to meet the requirements of thinner and mobile electronic products. It can be freely bent, wound, and folded, and can withstand millions of dynamic bends without damaging the wires. The flexible circuit board that can withstand high temperatures can be arranged arbitrarily according to the spatial layout requirements, and can move and stretch arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection; the flexible circuit board that can withstand high temperatures can greatly reduce the volume and weight of electronic products, and is suitable for the development needs of electronic products towards high density, thinness, and high reliability. Summary of the Invention

[0008] The object of the present invention is to provide a semiconductor chip packaging component and its packaging method to solve the following technical problems:

[0009] 1. Each time, only the bonding of a single metal lead wire can be achieved. When there are many bonding wires for connecting the semiconductor chip and the metal pins of the metal lead frame, the bonding time consumed will be very long;

[0010] 2. During the bonding of metal leads, due to the large number and long length of metal leads, it is easy to have the distance between metal leads too close. When the semiconductor chip is running, an arc will be generated due to the close distance between metal leads, or the leads will contact each other, resulting in a short circuit, and it is difficult to achieve the bonding of higher-density metal leads.

[0011] To achieve the above object, the present invention provides the following technical solution: A semiconductor chip component packaging component, comprising: a metal lead frame, on which a base island is provided; further comprising a semiconductor chip fixedly connected to the base island, and a plurality of pads for connecting the semiconductor chip to the outside are provided on the semiconductor chip; further comprising a flexible high-temperature-resistant insulating soft board, in which a number of non-intersecting grooves are formed; further comprising a metal lead wire, which is made of a conductive material and is installed in the groove; both ends of the metal lead wire have a section exposed from the side of the flexible high-temperature-resistant insulating soft board to form a connection part, the connection part includes a first connection part and a second connection part, the first connection part is connected to the semiconductor chip; and a molding compound that coats the semiconductor chip, the metal lead frame, the flexible high-temperature-resistant insulating soft board, and part of the metal lead wire, and exposes the second connection part of the metal lead wire outside the molding compound.

[0012] Preferably, both end faces of the metal lead line are not surrounded and sealed by the flexible high-temperature resistant insulating flexible board. One end of the flexible high-temperature resistant insulating flexible board forms a notch, and the notch is located on the same side of the flexible high-temperature resistant insulating flexible board. The part of the metal lead line exposed in the notch constitutes the first connection part.

[0013] Preferably, one end face of the metal lead line is surrounded and sealed by the flexible high-temperature resistant insulating flexible board. A skylight is opened at a position of the flexible high-temperature resistant insulating flexible board adjacent to the sealed end, and the skylight is located on the same side of the flexible high-temperature resistant insulating flexible board. The part of the metal lead line exposed in the skylight constitutes the first connection part.

[0014] Preferably, bumps are provided on the pads of the semiconductor chip or the first connection part of the metal lead line.

[0015] Preferably, a plurality of the flexible high-temperature resistant insulating flexible boards are stacked up and down, and a plurality of the first connection parts and the second connection parts are exposed from the side surfaces of the plurality of flexible high-temperature resistant insulating flexible boards.

[0016] Preferably, a vacancy part is opened in the middle of the flexible high-temperature resistant insulating flexible board, and the vacancy part is used to place one or more semiconductor chips to be bonded.

[0017] Preferably, a plurality of material guiding through holes are opened on the flexible high-temperature resistant insulating flexible board at positions avoiding the metal lead line, and the encapsulating material can enter the lower part covered by the flexible high-temperature resistant insulating flexible board through the material guiding through holes.

[0018] Preferably, an extension part is provided at the end of the first connection part, and the extension part increases the contact area of the first connection part to facilitate the connection with the semiconductor chip.

[0019] Preferably, a plug-in part is provided at the end of the second connection part, and the shape of the plug-in part is adapted to the shape of the part to be connected.

[0020] A semiconductor chip component encapsulation method is also provided, including the following steps:

[0021] Step 1: Fix and install the semiconductor chip on the base island, and a plurality of pads for external connection are formed on the surface of the semiconductor chip;

[0022] Step 2: Form a plurality of non-intersecting conductive metal lead lines inside the flexible high-temperature resistant insulating flexible board, and pre-form a first connection part and a second connection part at both ends of the metal lead line;

[0023] Step 3: Make a plurality of first connection parts contact a plurality of pads on the semiconductor chip, and fix and electrically connect the first connection parts with the pads;

[0024] Step 4: Encapsulate the connected semiconductor chip, base island, and flexible high-temperature resistant insulating flexible board with encapsulant, and expose the second connection part.

[0025] Advantages of the present invention:

[0026] In the present invention, a number of conductive metal lead lines are pre-formed inside the flexible high-temperature resistant insulating flexible board. A first connection part connected to the semiconductor chip is formed at one end of the number of metal lead lines, and a second connection part connected to an external PCB board is formed at the other end of the number of metal lead lines. Connect and fix the number of first connection parts to the semiconductor chip, and encapsulate the semiconductor chip and the flexible high-temperature resistant insulating flexible board; through the above method, during the bonding process, no matter how many bonding point positions are required, only one connection action is needed to simultaneously connect all the metal lead lines to the semiconductor chip, improving the bonding efficiency. At the same time, expose the second connection part to be used as a metal pin to connect to the external PCB board, reducing the number of bonding times and facilitating subsequent connection and fixation; the flexible high-temperature resistant insulating flexible board itself uses polyimide or polyester film as the base material, having good insulation effect, and can effectively avoid the occurrence of arc or short circuit phenomena. Description of the Drawings

[0027] Figure 1 It is a top view schematic diagram of the metal lead line bonding structure of the present invention;

[0028] Figure 2 It is a front view schematic diagram of the metal lead line bonding structure of the present invention;

[0029] Figure 2a It is a front view schematic diagram of the pressing structure of the flexible high-temperature resistant insulating flexible board of the present invention;

[0030] Figure 3 It is a front view sectional schematic diagram of the structure with a notch provided at the end of the flexible high-temperature resistant insulating flexible board of the present invention;

[0031] Figure 4 It is a front view sectional schematic diagram of the structure with a skylight provided near the end of the flexible high-temperature resistant insulating flexible board of the present invention;

[0032] Figure 5 It is a top view schematic diagram of the structure with bumps provided on the semiconductor chip of the present invention;

[0033] Figure 6 It is a top view schematic diagram of the structure with bumps provided at the end of the first connection part of the present invention;

[0034] Figure 7 It is a three-dimensional schematic diagram of the stacked structure of multiple flexible high-temperature resistant insulating flexible boards of the present invention;

[0035] Figure 8Schematic top-down sectional view of the cross-line bonding structure of the present invention;

[0036] Figure 9 Front view schematic of the height difference structure at the connection part of the metal lead line of the present invention;

[0037] Figure 10 Top view schematic of the bonding structure around the vacancy part of the present invention;

[0038] Figure 11 Top view schematic of the bonding structure on both sides of the vacancy part of the present invention;

[0039] Figure 12 Top view schematic of the bonding structure on three sides of the vacancy part of the present invention;

[0040] Figure 13 Top view schematic of the structure of the second connection part led out from one side of the bonding around the vacancy part of the present invention;

[0041] Figure 14 Top view schematic of the structure of the second connection part led out from one side of the bonding on both sides of the vacancy part of the present invention;

[0042] Figure 15 Top view schematic of the structure of the second connection part led out from one side of the bonding on three sides of the vacancy part of the present invention;

[0043] Figure 16 Top view schematic of the structure of the material guiding perforation formed on the flexible high-temperature resistant insulating flexible board of the present invention;

[0044] Figure 17 Top view schematic of the structure of the extension part arranged at the end of the first connection part of the present invention;

[0045] Figure 18 Top view schematic of the structure of the insertion part arranged at the end of the second connection part of the present invention;

[0046] Figure 19 Front view sectional schematic of the prior art mosfet packaging structure;

[0047] Figure 20 Top view sectional schematic of the prior art mosfet packaging structure.

[0048] In the figure: 1. Base island; 2. Semiconductor chip; 3. Metal lead line; 31. First connection part; 32. Second connection part; 4. Flexible high-temperature resistant insulating flexible board; 5. Plastic sealing material; ⑥. Notch; 7. Skylight; 8. Vacancy part; 9. Material guiding perforation; 10. Extension part; 11. Insertion part; 12. Bump. Detailed implementation manners

[0049] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0050] As Figure 1 、 2 、as shown in 2a, the present invention provides a semiconductor chip packaging component, including a base island 1, a semiconductor chip 2, a flexible high-temperature resistant insulating flexible board 4, metal lead lines 3, and a molding compound 5; wherein, a plurality of pads (not shown in the figure) for connecting the semiconductor chip 2 to the outside are formed on the surface of the semiconductor chip 2; a number of non-intersecting conductive metal lead lines 3 are provided inside the flexible high-temperature resistant insulating flexible board 4. Specifically, a number of non-intersecting grooves can be first formed in the flexible high-temperature resistant insulating flexible board 4, and then the metal lead lines 3 are internally provided in the grooves by existing methods, and first connection portions 31 and second connection portions 32 are pre-formed at both ends of the metal lead lines 3. The flexible high-temperature resistant insulating flexible board 4 can be made into a single-sided, double-sided, and multi-layer board; the base material used is mainly polyimide copper clad laminate. This material has high heat resistance and good dimensional stability, and is formed into the final product by pressing with a cover film having both mechanical protection and good electrical insulation performance; the metal lead lines 3 are preferably made of conductive materials such as copper, palladium copper, silver, and gold, and the number of metal lead lines 3 can be adjusted according to the model of the semiconductor chip 2;

[0051] And a semiconductor chip packaging method, including the following steps:

[0052] Step 1, fixing and installing the chip on the base island 1 through an adhesive substance, and the adhesive substance can be selected from conductive adhesives, solder pastes, etc.;

[0053] Step 2, bringing a number of first connection portions 31 into contact with a number of pads on the semiconductor chip 2, and at the same time fixing and electrically connecting the number of first connection portions 31 to the pads;

[0054] Among them, the fixing methods between the first connection portion 31 and the chip 2 are as follows:

[0055] Solder paste welding

[0056] Solder paste welding is to first attach solder paste to the part of the first connection portion 31 and / or the pad, and then the first connection portion 31 and the pad part are butted. After reflow soldering, the first connection portion 31 and the pad are welded together;

[0057] High-frequency welding

[0058] High-frequency welding utilizes high-frequency electromagnetic fields to cause intense collisions between the material molecules of the first connecting portion 31, generating high temperatures to achieve the purpose of welding and fusion welding. High-frequency welding can achieve local welding heating without affecting other parts except the welded part;

[0059] Laser thermal fusion welding

[0060] Laser thermal fusion welding uses a laser beam as the energy source, impacting on the first connecting portion 31 to melt its material and connect it to the pad;

[0061] Step 3: Use a plastic encapsulation mold to inject plastic encapsulation material 5 into the connected semiconductor chip 2, base island 1, and flexible high-temperature resistant insulating flexible board 4 for encapsulation. After the plastic encapsulation material 5 cools, a plastic encapsulation body is formed, and the second connecting portion 32 is exposed from the side of the plastic encapsulation body.

[0062] During the bonding process of the above components, only one connection is required to simultaneously connect all the metal lead lines 3 and the semiconductor chip 2, improving the bonding efficiency; at the same time, the second connecting portion 32 is exposed to be used as a metal pin to connect with the external PCB board, reducing the number of bondings and facilitating subsequent connection and fixation; the specific connection method with the PCB board: Attach a metal bonding material to the PCB board and / or the second connecting portion 32, and align the second connecting portion 32 with the part to be welded on the PCB board. The connection process can be achieved through baking or reflow soldering;

[0063] As Figure 2a shown, due to the good flexibility of the flexible high-temperature resistant insulating flexible board 4, when specifically connecting to the PCB board, the flexible high-temperature resistant insulating flexible board 4 can be pressed down by a mold to connect the second connecting portion 32 to the PCB board; in addition, the flexible high-temperature resistant insulating flexible board 4 itself uses polyimide or polyester film as the substrate, having good insulation effects, which can effectively avoid the occurrence of arc or short-circuit phenomena. The flexible high-temperature resistant insulating flexible board 4 can meet the design requirements of smaller size and higher density installation, and also helps to reduce the assembly process and enhance reliability. The flexible high-temperature resistant insulating flexible board 4 is an effective solution to meet the requirements of thinness and mobility of electronic products. It can be freely bent, wound, and folded, and can withstand millions of dynamic bends without damaging the metal lead lines 3. The flexible high-temperature resistant insulating flexible board 4 can be arranged arbitrarily according to the space layout requirements and can move and stretch arbitrarily in three-dimensional space, thus achieving the integration of component assembly and connection; the flexible high-temperature resistant insulating flexible board 4 can greatly reduce the volume and weight of electronic products and meet the development needs of electronic products towards high density, thinness, and high reliability.

[0064] As Figure 3As shown, as an embodiment of the present invention, the end faces at both ends of the metal lead line 3 are not surrounded and sealed by the flexible high-temperature resistant insulating soft board 4. One end of the flexible high-temperature resistant insulating soft board 4 forms a notch 6. The notch 6 is located on the same side of the flexible high-temperature resistant insulating soft board 4. The shape of the notch 6 is determined according to the actual situation. The exposed part of the metal lead line 3 within the notch 6 constitutes the first connection part 31, thereby meeting the use of semiconductor chips 2 of various models and making its adaptability better. In this form of structure, it is more suitable to fix the first connection part 31 and the semiconductor chip 2 by soldering with solder paste.

[0065] As Figure 4 shown, as an embodiment of the present invention, one end face of the metal lead line 3 is surrounded and sealed by the flexible high-temperature resistant insulating soft board 4. A skylight 7 is opened at a position of the flexible high-temperature resistant insulating soft board 4 adjacent to the sealed end. The skylight 7 is located on the same side of the flexible high-temperature resistant insulating soft board 4. The shape of the skylight 7 is determined according to the actual situation. The exposed part of the metal lead line 3 within the skylight 7 constitutes the first connection part 31, thereby meeting the use of semiconductor chips 2 of various models and making its adaptability better. In this form of structure, it is more suitable to fix the first connection part 31 and the semiconductor chip 2 by soldering with solder paste.

[0066] As Figure 5 、 6 shown, as an embodiment of the present invention, bumps 12 are provided on the pads of the semiconductor chip 2 or the first connection part 31 of the metal lead line 3. As Figure 5 shown, the bumps 12 are provided on the pads of the semiconductor chip 2. As Figure 6 shown, the bumps 12 are provided on the first connection part 31 of the metal lead line 3; the bumps 12 can be formed by means such as 3D printing, ball planting, and etching. The material can be made of conductive materials such as tin, copper, palladium copper, silver, and gold; taking Figure 5 as an example, when the bumps 12 are provided on the pads of the semiconductor chip 2 and the bumps 12 are made of conductive materials with relatively high melting points such as copper, palladium copper, silver, and gold, fixing materials such as conductive glue or solder paste can be pre-coated on the bumps 12 to achieve the connection between the first connection part 31 and the bumps 12; when tin or a conductive metal with a melting point lower than 260°C is selected, the bumps 12 can be directly in contact with the first connection part 31, and then the bumps 12 are melted by heating to fixedly connect the bumps 12 and the first connection part 31. In this form of structure, it is more suitable to solder with solder paste, high-frequency welding machine bonding, and laser hot melting welding between the first connection part 31 and the semiconductor chip 2.

[0067] As Figures 7 - 9As shown, as an embodiment of the present invention, multiple flexible high-temperature resistant insulating flexible boards 4 are stacked on top of each other, and multiple first connection parts 31 and second connection parts 32 are exposed from the sides of the multiple flexible high-temperature resistant insulating flexible boards 4. During the actual bonding process, the bonding parts of the semiconductor chip 2 are different, but the required guiding directions are the same. This will result in the situation where the metal lead lines 3 cross lines and intersect. When encountering the situation where the metal lead lines 3 cross lines and / or have a height difference, the flexible high-temperature resistant insulating flexible boards 4 can be arranged in multiple layers, and metal lead lines 3 for electrical conduction are arranged between the flexible high-temperature resistant insulating flexible boards 4 of different layers, so that the metal lead lines 3 are separated from each other, and the bonding of cross lines and / or height difference can be achieved simultaneously.

[0068] As Figures 10 - 15 shown, as an embodiment of the present invention, a vacancy part 8 is formed in the middle of the flexible high-temperature resistant insulating flexible board 4, and the vacancy part 8 is used to place one or more semiconductor chips 2; for some types of semiconductor chips 2, taking the analog semiconductor chip 2 or the digital semiconductor chip 2 as an example, generally multiple parts of the semiconductor chip 2 need to be bonded to different metal pins, and many semiconductor chips 2 also need to bond metal lead lines 3 on the peripheral part (around, three sides or two sides) of the semiconductor chip 2. The metal lead lines 3 adapted to the semiconductor chip 2 can be pre-set in the flexible high-temperature resistant insulating flexible board 4 around, three sides or two sides of the vacancy part 8 to adapt to the situation where bonding is required around, three sides or two sides of the semiconductor chip 2; As Figures 13 - 15 shown, in order to make it more convenient for the subsequent second connection part 32 to be connected to the PCB board, by arranging the metal lead lines 3, the second connection part 32 is led out from one side of the flexible high-temperature resistant insulating flexible board 4.

[0069] As Figure 16 shown, as an embodiment of the present invention, in order to enable the encapsulant 5 to better enter the lower part covered by the flexible high-temperature resistant insulating flexible board 4, a number of material guiding perforations 9 are formed in the part of the flexible high-temperature resistant insulating flexible board 4 that avoids the metal lead lines 3; for the bulging flexible high-temperature resistant insulating flexible board 4, it is preferably to form the material guiding perforations 9 at the bulging part. For the connection mode composed of double-layer or multi-layer flexible high-temperature resistant insulating flexible boards 4, the material guiding perforations 9 can be formed by etching after integral molding, or the material guiding perforations 9 can be formed on the pre-existing single-layer flexible high-temperature resistant insulating flexible board 4.

[0070] As Figure 17As shown, as an embodiment of the present invention, in order to better connect the first connection portion 31 to the semiconductor chip 2, an extension portion 10 may be provided at the end of the first connection portion 31 to increase the contact area between the first connection portion 31 and the semiconductor chip 2, thereby making it more convenient to connect to the pads on the semiconductor chip 2. After the extension portions 10 are connected to the semiconductor chip 2, the extension portions 10 shall not contact each other to avoid short circuits.

[0071] As Figure 18 shown, as an embodiment of the present invention, a plug-in portion 11 may be provided at the end of the second connection portion 32. After encapsulation, the plug-in portion 11 is exposed from the side of the flexible high-temperature resistant insulating soft board 4, and the shape of the plug-in portion 11 is adapted to the portion to be connected on the PCB board.

[0072] It should be noted that in all embodiments, the shape of the flexible high-temperature resistant insulating soft board 4 can be designed according to requirements; each hole, groove, notch, etc. can also be formed into the required shape according to actual needs.

[0073] The working principle of this utility model:

[0074] Referring to the accompanying drawings of the specification, when using the present invention, a groove is pre-opened in the flexible high-temperature resistant insulating soft board 4, and the metal lead line 3 is placed in the groove so that the middle part of the metal lead line 3 is inside the flexible high-temperature resistant insulating soft board 4, and the first connection portion 31 and the second connection portion 32 are formed at both ends of the metal lead line 3; the semiconductor chip 2 is fixedly connected to the base island 1, the first connection portion 31 is connected to the pads on the semiconductor chip 2, and finally the connected semiconductor chip 2, base island 1 and flexible high-temperature resistant insulating soft board 4 are encapsulated with the encapsulant 5, and the second connection portion 32 is exposed from the side of the encapsulant 5; by the above method, during the bonding process of the metal lead line 3, only one connection is required to simultaneously connect all the metal lead lines 3 to the semiconductor chip 2, improving the bonding efficiency. At the same time, the second connection portion 32 is exposed to be used as a metal pin to connect to the external PCB board, reducing the number of bonding times and facilitating subsequent connection and fixation; the flexible high-temperature resistant insulating soft board 4 itself uses polyimide or polyester film as the base material, having good insulation effect, which can effectively avoid short circuits caused by the power line or signal line touching each other and the occurrence of arc phenomenon due to the too close distance between them.

[0075] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, specific orientation structure and operation. Therefore, it should not be construed as a limitation of the invention. In addition, "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0076] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor chip packaging component, characterized in that, Comprising: A metal lead frame, on which a base island (1) is provided; A semiconductor chip (2), which is fixedly connected to the base island (1), and a plurality of pads for connecting the semiconductor chip (2) to the outside are provided on the semiconductor chip (2); A flexible high-temperature resistant insulating flexible board (4), in which a plurality of non-intersecting grooves are formed; A metal lead line (3), which is made of a conductive material and is installed in the groove; both ends of the metal lead line (3) have a section exposed from the side of the flexible high-temperature resistant insulating flexible board (4) to form a connection part, and the connection part includes a first connection part (31) and a second connection part (32), and the first connection part (31) is connected to the pad on the semiconductor chip (2); And a molding compound (5), which covers the semiconductor chip (2), the metal lead frame, the flexible high-temperature resistant insulating flexible board (4) and a part of the metal lead line (3), and exposes the second connection part (32) of the metal lead line (3) outside the molding compound (5).

2. The semiconductor chip packaging component according to claim 1, wherein Both end faces of the metal lead line (3) are not surrounded and sealed by the flexible high-temperature resistant insulating flexible board (4), and one end of the flexible high-temperature resistant insulating flexible board (4) forms a notch (6), and the notch (6) is located on the same side of the flexible high-temperature resistant insulating flexible board (4), and the part of the metal lead line (3) exposed from the notch (6) constitutes the first connection part (31).

3. A semiconductor chip packaging component according to claim 1, characterized in that, One end face of the metal lead line (3) is surrounded and sealed by the flexible high-temperature resistant insulating flexible board (4), and a skylight (7) is formed in the part of the flexible high-temperature resistant insulating flexible board (4) adjacent to the sealed end, and the skylight (7) is located on the same side of the flexible high-temperature resistant insulating flexible board (4), and the part of the metal lead line (3) exposed from the skylight (7) constitutes the first connection part (31).

4. A semiconductor chip packaging component according to claim 1, characterized in that, Bumps (12) are provided on the pads of the semiconductor chip (2) or the first connection part (31) of the metal lead line (3).

5. A semiconductor chip packaging component according to claim 1, characterized in that, A plurality of the flexible high-temperature resistant insulating flexible boards (4) are stacked up and down, and a plurality of the first connection parts (31) and the second connection parts (32) are exposed from the sides of the plurality of the flexible high-temperature resistant insulating flexible boards (4).

6. A semiconductor chip packaging component according to claim 1, characterized in that, A vacant part (8) is formed in the middle of the flexible high-temperature resistant insulating flexible board (4), and the vacant part (8) is used to place the semiconductor chips (2) that need to be bonded on at least two sides.

7. A semiconductor chip packaging component according to claim 1, characterized in that, A plurality of material guiding through holes (9) are formed in the flexible high-temperature resistant insulating flexible board (4) at positions avoiding the metal lead line (3), and the molding compound (5) can enter the lower part covered by the flexible high-temperature resistant insulating flexible board (4) through the material guiding through holes (9).

8. A semiconductor chip packaging component according to any one of claims 1-7, characterized in that, An extension part (10) is provided at the end of the first connection part (31), and the extension part (10) increases the overall contact area of the first connection part (31) to facilitate the connection with the semiconductor chip (2).

9. A semiconductor chip packaging component according to claim 8, characterized in that, The end of the second connecting part (32) is provided with a plugging part (11), and the shape of the plugging part (11) is adapted to the shape of the part to be connected.

10. A semiconductor chip component packaging method, characterized in that, It includes the following steps: Step 1: Fix and install the semiconductor chip (2) on the base island (1). A plurality of pads for connecting the semiconductor chip (2) to the outside are formed on the surface of the semiconductor chip (2). Step 2: Arrange a number of non-intersecting conductive metal lead lines (3) inside the flexible high-temperature resistant insulating flexible board (4), and pre-form a first connecting part (31) and a second connecting part (32) at both ends of the metal lead lines (3). Step 3: Bring a number of first connecting parts (31) into contact with a number of pads on the semiconductor chip (2), and fix and electrically connect the first connecting parts (31) to the pads. Step 4: Encapsulate the connected semiconductor chip (2), base island (1) and flexible high-temperature resistant insulating flexible board (4) with a plastic encapsulant (5), and expose the second connecting part (32) from the side of the plastic encapsulant (5).

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