A conformal circuit, an adaptive conformal circuit printing method and system

By obtaining the standard and actual data model of the carrier workpiece, correcting the laying points and trajectories of the circuit, realizing adaptive conformal circuit printing, solving the problems of poor printing quality and complex process in the prior art, improving efficiency and reducing costs.

CN115103521BActive Publication Date: 2025-06-24BEIJING DREAM INK TECH CO LTD
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Patent Information

Application Number
CN202210902740.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-07-29
Publication Date
2025-06-24
Estimated Expiration
2042-07-29

AI Technical Summary

Technical Problem

In the prior art, the printing quality of the conformal circuit is poor, the process is complicated and cumbersome, the cost is high and the efficiency is low.

Method used

By obtaining the standard and actual data model of the carrier workpiece, the differences between the two are determined, and the laying points and trajectories of the circuit are corrected according to the differences, and the actual laying trajectory is generated to realize adaptive conformal circuit printing.

Benefits of technology

Improves printing quality, reduces the requirements for workpiece accuracy, simplifies the process flow, reduces costs and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a conformal circuit, an adaptive conformal circuit printing method and system, relating to the technical field of additive manufacturing of conformal circuits. The adaptive conformal circuit printing method includes: obtaining a standard data model of the conformal circuit; the standard data model includes a standard data model of a carrier workpiece and standard laying points of a circuit to be fabricated; obtaining an actual data model of the carrier workpiece and determining the difference therebetween; generating an actual laying trajectory according to the above difference and the standard laying points; and performing a printing operation based on the actual laying trajectory. The present invention corrects the circuit laying trajectory by using the difference between the actual model and the standard model of the carrier workpiece, so that it conforms to the setting of expected printing parameters, which is beneficial to improving the printing quality; the present invention does not require additional equipment to perform post-processing of adding or subtracting materials on the appearance of the workpiece, reduces the requirement for the accuracy of the workpiece, improves the overall manufacturing efficiency of the conformal circuit, and reduces the manufacturing cost.
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Description

Technical Field

[0001] The present invention belongs to the technical field of conformal circuit additive manufacturing, and particularly relates to a conformal circuit, an adaptive conformal circuit printing method and a system. Background Art

[0002] A circuit board is an important electronic component, a support for electronic components, and an important carrier for the electrical connection of electronic components. Almost all electronic devices are inseparable from circuit boards. From electronic watches, general computers, televisions to supercomputers, communication devices, military weapon systems, etc., circuit boards are used for their electrical interconnection.

[0003] With the continuous development of electronic products, the conformal circuit manufacturing technology to meet the market's miniaturization requirements has received great attention from major manufacturers. The 3D printing process is one of the technical routes to realize the conformal circuit manufacturing technology. The conventional 3D printing technology refers to the use of a multi-material layer-by-layer stacking method to realize the conformal circuit. However, the workpiece (circuit carrier) manufactured by this method has low structural strength, making it difficult to be practically applied.

[0004] In addition, there is also a method of first manufacturing a workpiece by casting or injection molding, and then using 3D printing technology to directly manufacture a circuit on the three-dimensional surface of the workpiece. In order to ensure good printing quality, the 3D printing technology has strict requirements for setting parameters such as printing distance. Therefore, when there are large errors in the workpiece, the printing quality of the conformal circuit is poor, and usually additional equipment is required for post-processing of the appearance of the workpiece by adding or subtracting materials to make it meet the standard requirements.

[0005] When the above 3D printing technology is applied to the manufacturing of conformal circuits, it is easy to have defects such as poor printing quality, complex and cumbersome process, high cost, and low efficiency. Summary of the Invention

[0006] In view of this, an object of the present invention is to propose an adaptive conformal circuit printing method to solve the defects of poor printing quality, complex and cumbersome process, high cost, and low efficiency in the prior art.

[0007] In some illustrative embodiments, the adaptive conformal circuit printing method includes: obtaining a standard data model of the conformal circuit; the standard data model at least includes a standard data model of a carrier workpiece and standard laying points of a circuit to be manufactured on the carrier workpiece; obtaining an actual data model of the carrier workpiece and determining the difference between the actual data model of the carrier workpiece and the standard data model; generating an actual laying trajectory of conductive paste on the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be manufactured; performing a printing operation on the surface of the carrier workpiece based on the actual laying trajectory.

[0008] In some optional embodiments, generating an actual laying trajectory of the conductive paste on the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated includes: correcting the standard laying points of the circuit to be fabricated according to the difference of the carrier workpiece; and generating the actual laying trajectory based on the corrected actual laying points of the circuit to be fabricated.

[0009] In some optional embodiments, after obtaining the standard data model of the conformal circuit, it further includes: generating a reference laying trajectory of the conductive paste on the standard data model of the carrier workpiece according to the standard laying points of the circuit to be fabricated; and the step of generating the actual laying trajectory of the conductive paste on the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated specifically includes: correcting the reference laying trajectory according to the difference of the carrier workpiece to form the corrected actual laying trajectory.

[0010] In some optional embodiments, obtaining the actual data model of the carrier workpiece and determining the difference between the actual data model of the carrier workpiece and the standard data model includes: detecting the local data model of the carrier workpiece according to the reference laying trajectory and determining the difference between the local data model of the carrier workpiece and the corresponding position of the standard data model.

[0011] In some optional embodiments, after generating the reference laying trajectory, it includes: detecting the local points of the carrier workpiece according to the trajectory nodes in the reference laying trajectory; determining the difference between the local points of the carrier workpiece and the corresponding points of the standard data model; correcting the trajectory nodes according to the difference, and performing the printing operation based on the corrected trajectory nodes; repeating the above steps until the printing operation is completed.

[0012] In some optional embodiments, during the process of performing the printing operation on the surface of the carrier workpiece based on the actual laying trajectory, it includes: adjusting the relative orientation between the carrier workpiece and the print head to make the plane where the current laying point of the carrier workpiece is located horizontal and vertically opposite to the print head.

[0013] In some optional embodiments, during or after the process of performing the printing operation on the surface of the carrier workpiece based on the actual laying trajectory, it further includes: curing the conductive paste laid on the carrier workpiece.

[0014] In some optional embodiments, generating the actual laying trajectory of the conductive paste on the carrier workpiece includes: generating at least a printing instruction indicating the generation of the actual laying trajectory of the conductive paste on the carrier workpiece.

[0015] Another object of the present invention is to provide an adaptive conformal circuit printing system for implementing the above-mentioned adaptive conformal circuit printing method.

[0016] In some illustrative embodiments, the adaptive conformal circuit printing system includes: a reading module for obtaining a standard data model of the conformal circuit; the standard data model at least includes a standard data model of a carrier workpiece and standard laying points of a circuit to be fabricated on the carrier workpiece; a scanning module for obtaining an actual data model of the carrier workpiece; a calculation module for determining a difference between the actual data model of the carrier workpiece and the standard data model; a correction module for generating an actual laying trajectory of conductive paste on the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated; and a printing module for performing a printing operation on the surface of the carrier workpiece based on the actual laying trajectory.

[0017] Still another object of the present invention is to provide a conformal circuit obtained by the above-mentioned adaptive conformal circuit printing method or the above-mentioned adaptive conformal circuit printing system.

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] The present invention corrects the circuit laying trajectory by using the difference between the actual model and the standard model of the carrier workpiece, so that it conforms to the setting of parameters such as the expected printing distance, which is beneficial to improving the printing quality. In addition, the present invention does not require additional equipment for post-processing of the workpiece appearance by adding or subtracting materials, reduces the requirement for the accuracy of the workpiece, improves the overall production efficiency of the conformal circuit, and reduces the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a first flow example of the adaptive conformal circuit printing method in an embodiment of the present invention;

[0021] Figure 2 is a second flow example of the adaptive conformal circuit printing method in an embodiment of the present invention;

[0022] Figure 3 is a third flow example of the adaptive conformal circuit printing method in an embodiment of the present invention;

[0023] Figure 4 is a fourth flow example of the adaptive conformal circuit printing method in an embodiment of the present invention;

[0024] Figure 5 is a structural block diagram of the adaptive conformal circuit printing system in an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The following description and the drawings fully illustrate specific embodiments of the present invention so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process, and other changes. Examples only represent possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations can vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. The scope of the embodiments of the present invention includes the entire scope of the claims and all available equivalents of the claims. In this document, these embodiments of the present invention may be individually or collectively referred to by the term "invention" for convenience only, and if more than one invention is actually disclosed, it is not intended to automatically limit the scope of the application to any single invention or inventive concept.

[0026] When fabricating conformal circuits on carrier workpieces using 3D printing technology in the prior art, corresponding workpiece repair processes often need to be supported, which has problems of high cost and low efficiency. However, if the above-mentioned repair treatment is not performed on the workpiece, the error values on the actual carrier workpiece will cause non-conformance with the set printing parameters (such as printing distance). When performing printing operations based on the set printing parameters, it is difficult for the error points on the carrier workpiece to conform to the set printing distance with the print head. For non-contact printing processes such as extrusion and spraying, it is easy to cause poor printing quality; for contact printing processes such as direct writing, it is easy to cause unexpected rigid collisions between the print head and the carrier workpiece, and even cause direct damage to the carrier workpiece and / or the print head, which are not desired for the fabrication of conformal circuits.

[0027] In addition, the applicant has found that in some industrial electronic products in certain industries, the requirements for manufacturing precision are not so high, and some precision errors will not affect the actual application of conformal circuits. Therefore, the requirements for printing quality are not high, and the defects of poor printing quality that occur are also acceptable; in scenarios such as conformal circuit design or verification (such as in the fields of makers, teaching, and R & D), the requirements for workpiece precision are generally not high, and it is not expected to spend more time and costs such as money to improve workpiece precision.

[0028] Therefore, the applicant has found that there is a need for an adaptive conformal circuit fabrication process for error workpieces in both some industrial electronic products and non-industrial electronic product fields, and has proposed a conformal circuit printing method to meet this need.

[0029] The "laying trajectory of the conductive paste (such as the actual laying trajectory and the reference laying trajectory)" in the embodiments of the present invention refers to the forming trajectory of the conductive paste on the target area of the carrier workpiece, which is directly related to the appearance characteristics of the carrier workpiece; in addition, when the printing distance between the print head and the carrier workpiece is maintained at a set value, the laying trajectory of the conductive paste can also be converted to obtain the relative movement trajectory between the print head and / or the carrier workpiece, or determined by converting the relative movement trajectory between the print head and / or the carrier workpiece.

[0030] In some embodiments, the printing distance between the print head and the carrier workpiece in the embodiments of the present invention is constant, so the laying trajectory of the conductive paste and the relative movement trajectory between the print head and / or the carrier workpiece are convertible.

[0031] The "correction" in the embodiments of the present invention specifically refers to adjusting the actual laying trajectory of the conductive paste according to the difference in the appearance characteristics of the carrier workpiece so that it meets the setting of the printing distance between the print head and the carrier workpiece.

[0032] It should be noted that, without conflict, the technical features in the embodiments of the present invention can be combined with each other.

[0033] An adaptive conformal circuit printing method is disclosed in the embodiments of the present invention. Specifically, as Figure 1 shown, Figure 1 is the first process example of the adaptive conformal circuit printing method in the embodiments of the present invention; the adaptive conformal circuit printing method includes:

[0034] Step S11, obtaining a standard data model of the conformal circuit;

[0035] Wherein, the standard data model at least includes the standard data model of the carrier workpiece and the standard laying points of the circuit to be fabricated on the carrier workpiece;

[0036] Step S12, obtaining the actual data model of the carrier workpiece and determining the difference between the actual data model of the carrier workpiece and the standard data model;

[0037] Step S13, generating the actual laying trajectory of the conductive paste on the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated;

[0038] Step S14, performing a printing operation on the surface of the carrier workpiece based on the actual laying trajectory.

[0039] The present invention corrects the circuit laying trajectory by using the difference between the actual model and the standard model of the carrier workpiece, so that it conforms to the setting of parameters such as the expected printing distance, which is conducive to improving the printing quality. In addition, the present invention does not require additional equipment for post-processing of adding or subtracting materials to the appearance of the workpiece, reduces the requirement for the accuracy of the workpiece, improves the overall production efficiency of the conformal circuit, and reduces the production cost.

[0040] In some embodiments, the specific method for obtaining the standard data model of the conformal circuit in step S11 may refer to the standard data model of the conformal circuit directly imported by the user or designed by software. The coordinate data of the appearance points of the standard model of the known conformal circuit are known, and two-dimensional or three-dimensional positioning identifiers of the standard data model of the conformal circuit are set.

[0041] In some embodiments, the specific method for obtaining the actual data model of the carrier workpiece in step S12 may be obtained by using one or more linear array or area array laser scanners, and positioning points corresponding to the two-dimensional or three-dimensional positioning identifiers of the standard data model are set on the printing device, so that the standard data model and the actual data model are in a three-dimensional space coordinate system with the positioning points as reference points (such as the initial origin), and then the appearance differences between the standard data model and the actual data model are compared, and the difference data is obtained.

[0042] Exemplarily, a positioning identifier surrounding the standard data model is set on the bottom surface (i.e., the bearing surface) of the standard data model of the conformal circuit, and then a fixed tooling with a positioning identifier is designed with the bottom surface with the positioning identifier as the printing base of the printing device or the fixed tooling on the base. At this time, by scanning the actual carrier workpiece based on the positioning identifier on the fixed tooling, a three-dimensional space coordinate system with the same reference point as the standard data model can be obtained, thus meeting the comparison requirements.

[0043] In addition, alternatively, by performing similarity matching analysis processing on the standard data model and the actual data model of the carrier workpiece, the reference points for constructing the same three-dimensional space coordinate system for the two models are determined.

[0044] In some embodiments, the above-mentioned positioning identifier recognition and similarity matching analysis processing jointly determine the reference points for constructing the same three-dimensional space coordinate system for the two models.

[0045] In some embodiments, in the process of generating the actual laying trajectory of the conductive paste on the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be manufactured in step S13, it may specifically include: step S131, correcting the standard laying points of the circuit to be manufactured according to the difference of the carrier workpiece; step S132, generating the actual laying trajectory based on the corrected actual laying points of the circuit to be manufactured.

[0046] In some embodiments, as Figure 2 shown, after obtaining the standard data model of the conformal circuit in step S11, it may further include:

[0047] S11.5. Generate a reference laying trajectory of the conductive paste on the standard data model of the carrier workpiece according to the standard laying points of the circuit to be fabricated;

[0048] Correspondingly, in step S13, generating the actual laying trajectory of the conductive paste on the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated may specifically include:

[0049] S13". Correct the reference laying trajectory according to the difference of the carrier workpiece to form the corrected actual laying trajectory.

[0050] In some embodiments, as Figure 3 shown, in step S12, obtaining the actual data model of the carrier workpiece and determining the difference between the actual data model of the carrier workpiece and the standard data model may include:

[0051] Step S12". Detect the local data model of the carrier workpiece according to the reference laying trajectory, and determine the difference between the local data model of the carrier workpiece and the corresponding position of the standard data model.

[0052] The local data model in this embodiment refers to the bearing surface of the carrier workpiece for the circuit to be fabricated (i.e., the set of laying points of the circuit to be fabricated on the carrier workpiece). Since the conformal circuit is generally formed on the local surface of the carrier workpiece, it is not necessary to compare all the morphological features of the carrier workpiece. It is only necessary to detect and scan the bearing surface of the circuit to be fabricated, and then determine the difference between the target local part of the carrier workpiece and the standard model. This embodiment has the advantage of being more efficient than full scanning.

[0053] In some embodiments, as Figure 4 shown, after generating the reference laying trajectory in step S12, it may include:

[0054] Step S21. Detect the local points of the carrier workpiece according to the trajectory nodes in the reference laying trajectory;

[0055] Step S22. Determine the difference between the local points of the carrier workpiece and the corresponding points of the standard data model;

[0056] Step S23. Correct the trajectory nodes according to the difference, and perform the printing operation based on the corrected trajectory nodes;

[0057] Step S24. Repeat the above steps until the printing operation is completed.

[0058] This embodiment is a dynamic correction method that performs point-by-point scanning, comparison, correction, and printing by following a reference laying trajectory. Compared with the static correction method, the correction is more accurate, which is beneficial to further improving the printing quality.

[0059] In some embodiments, during the process of performing a printing operation on the surface of the carrier workpiece based on the actual laying trajectory, it includes: adjusting the relative orientation between the carrier workpiece and the print head so that the plane where the current laying point of the carrier workpiece is located is horizontal and vertically opposite to the print head.

[0060] Specifically, in this embodiment, the orientation adjustment of the carrier workpiece can be achieved through a multi-axis motion base, and a three-dimensional motion mechanism or a robotic arm is used to drive the print head to shift, so as to make the print head vertically downward and the plane where the current laying point of the carrier workpiece is located horizontal. This embodiment is applicable to low-viscosity conductive paste to avoid overflow or deformation of the conductive paste located on the carrier workpiece. For high-viscosity conductive paste, printing operations can be allowed within an appropriate angle range between the print head and the carrier workpiece.

[0061] In some embodiments, during or after the process of performing a printing operation on the surface of the carrier workpiece in step S14 based on the actual laying trajectory, it further includes: step S15, curing the conductive paste laid on the carrier workpiece.

[0062] Among them, the curing treatment can be based on natural curing, ultraviolet curing, thermal curing, etc., which specifically depends on the curing form of the selected conductive paste. In addition, the curing treatment can be performed in an integrated manner after the conformal circuit is fabricated, or in a segmented manner after a part of the conformal circuit is fabricated, or the printed conductive paste can be cured in real time following the movement trajectory of the print head.

[0063] In some embodiments, generating the actual laying trajectory of the conductive paste on the carrier workpiece may refer to: generating at least a printing instruction indicating the actual laying trajectory of the conductive paste on the carrier workpiece. Correspondingly, generating the reference laying trajectory of the conductive paste on the standard data model of the carrier workpiece may also refer to: generating at least a printing instruction indicating the reference laying trajectory of the conductive paste on the carrier workpiece.

[0064] Another object of the present invention is to propose an adaptive conformal circuit printing system for implementing the above adaptive conformal circuit printing method. Specifically, as Figure 5 shown, Figure 5It is a structural block diagram of an adaptive conformal circuit printing system in an embodiment of the present invention; the adaptive conformal circuit printing system 100 includes: a reading module 101 for obtaining a standard data model of a conformal circuit; the standard data model at least includes a standard data model of a carrier workpiece and standard laying points of a circuit to be fabricated on the carrier workpiece; a scanning module 102 for obtaining an actual data model of the carrier workpiece; a calculation module 103 for determining a difference between the actual data model of the carrier workpiece and the standard data model; a correction module 104 for generating an actual laying trajectory of a conductive paste on the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated; a printing module 105 for performing a printing operation on the surface of the carrier workpiece based on the actual laying trajectory.

[0065] Another object of the present invention is to propose a conformal circuit obtained by the above-mentioned adaptive conformal circuit printing method or the above-mentioned adaptive conformal circuit printing system.

[0066] The conductive pastes applicable to the adaptive conformal circuit printing method and / or the adaptive conformal circuit printing system in the embodiments of the present invention for printing and forming conformal circuits include but are not limited to: conductive silver paste, conductive copper paste, conductive aluminum paste, liquid metal, conductive carbon paste, silver nanowire, liquid metal conductive paste, etc.

[0067] The material of the carrier workpiece applicable to the adaptive conformal circuit printing method and / or the adaptive conformal circuit printing system in the embodiments of the present invention can be any material other than metal, as well as a composite (or combination) material of metal and insulating material. When printing, it should be avoided that the conductive paste forms on the metal surface, which may lead to circuit failure.

[0068] Embodiment 1

[0069] The adaptive conformal circuit printing method includes:

[0070] Step S301, obtaining a standard data model of a conformal circuit;

[0071] Wherein, the standard data model at least includes a standard data model of a carrier workpiece and standard laying points of a circuit to be fabricated on the carrier workpiece;

[0072] Step S302, obtaining an actual data model of the carrier workpiece and determining a difference between the actual data model of the carrier workpiece and the standard data model;

[0073] Step S303, correcting the standard laying points of the circuit to be fabricated according to the difference of the carrier workpiece;

[0074] Step S304: Generate the actual laying trajectory based on the actually laid points after correcting the circuit to be fabricated.

[0075] Step S305: Execute a printing operation on the surface of the carrier workpiece based on the actual laying trajectory.

[0076] This embodiment is mainly used to correct the standard laid points according to the comparison differences, and generate the actual laying trajectory based on the actually laid points after correction.

[0077] Embodiment 2

[0078] This adaptive conformal circuit printing method includes:

[0079] Step S401: Obtain the standard data model of the conformal circuit.

[0080] Among them, the standard data model at least includes the standard data model of the carrier workpiece and the standard laid points of the circuit to be fabricated on the carrier workpiece.

[0081] Step S402: Generate a reference laying trajectory of the conductive paste on the standard data model of the carrier workpiece according to the standard laid points of the circuit to be fabricated.

[0082] Step S403: Obtain the actual data model of the carrier workpiece, and determine the difference between the actual data model of the carrier workpiece and the standard data model.

[0083] Step S404: Correct the reference laying trajectory according to the difference of the carrier workpiece to form the corrected actual laying trajectory.

[0084] Step S405: Execute a printing operation on the surface of the carrier workpiece based on the actual laying trajectory.

[0085] This embodiment is mainly used to correct the reference laying trajectory according to the comparison differences, so as to form the corrected actual laying trajectory.

[0086] Embodiment 3

[0087] This adaptive conformal circuit printing method includes:

[0088] Step S501: Obtain the standard data model of the conformal circuit.

[0089] Among them, the standard data model at least includes the standard data model of the carrier workpiece and the standard laid points of the circuit to be fabricated on the carrier workpiece.

[0090] Step S502: Generate a reference laying trajectory of the conductive paste on the standard data model of the carrier workpiece according to the standard laid points of the circuit to be fabricated.

[0091] Step S503: Detect the local data model of the carrier workpiece according to the reference laying trajectory, and determine the difference between the corresponding positions of the local data model of the carrier workpiece and the standard data model;

[0092] Step S504: Correct the reference laying trajectory according to the local difference of the carrier workpiece to form the corrected actual laying trajectory;

[0093] Step S505: Execute a printing operation on the surface of the carrier workpiece based on the actual laying trajectory.

[0094] In this embodiment, it is mainly used to correct the reference laying trajectory according to the compared local differences, so as to form the corrected actual laying trajectory.

[0095] Embodiment 4

[0096] The adaptive conformal circuit printing method includes:

[0097] Step S601: Obtain the standard data model of the conformal circuit;

[0098] Wherein, the standard data model at least includes the standard data model of the carrier workpiece and the standard laying points of the circuit to be fabricated on the carrier workpiece;

[0099] Step S602: Generate a reference laying trajectory of the conductive paste on the standard data model of the carrier workpiece according to the standard laying points of the circuit to be fabricated;

[0100] Step S603: Detect the local points of the carrier workpiece according to the trajectory nodes in the reference laying trajectory;

[0101] Step S604: Determine the difference between the local points of the carrier workpiece and the corresponding points of the standard data model;

[0102] Step S605: Correct the trajectory nodes according to the difference, and perform a printing operation based on the corrected trajectory nodes;

[0103] Step S606: Repeat the above steps S603 - S605 until the printing operation is completed.

[0104] In this embodiment, it is mainly used to implement a real-time dynamic correction printing strategy of point-by-point scanning, comparison, correction, and printing during the printing process.

[0105] Those skilled in the art should also understand that all the various illustrative logical blocks, modules, circuits, and algorithmic steps described in connection with the embodiments herein can be implemented as electronic hardware, computer software, or a combination thereof. To clearly illustrate the interchangeability of hardware and software, the above various illustrative components, blocks, modules, circuits, and steps have been generally described in terms of their functions. Whether such a function is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Skilled artisans can implement the described functions in a flexible manner for each specific application, but such implementation decisions should not be construed as departing from the scope of protection of the present disclosure.

Claims

1. An adaptive conformal circuit printing method, characterized in that, Including: Obtain the standard data model of the conformal circuit; The standard data model at least includes the standard data model of the carrier workpiece and the standard laying points of the circuit to be fabricated on the carrier workpiece; Obtain the actual data model of the carrier workpiece, and determine the difference between the actual data model of the carrier workpiece and the standard data model; Generate a relative movement trajectory between the print head and the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated; wherein, the printing distance between the print head and the carrier workpiece in the relative movement trajectory is constant; Execute a printing operation on the surface of the carrier workpiece based on the relative movement trajectory.

2. The adaptive conformal circuit printing method according to claim 1, wherein The generating a relative movement trajectory between the print head and the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated includes: Correct the standard laying points of the circuit to be fabricated according to the difference of the carrier workpiece; Generate the relative movement trajectory based on the actual laying points of the circuit to be fabricated after correction.

3. The adaptive conformal circuit printing method according to claim 1, wherein After obtaining the standard data model of the conformal circuit, it further includes: Generate a reference movement trajectory of the print head on the standard data model of the carrier workpiece according to the standard laying points of the circuit to be fabricated; The generating a relative movement trajectory between the print head and the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated specifically includes: Correct the reference movement trajectory according to the difference of the carrier workpiece to form the corrected relative movement trajectory.

4. The adaptive conformal circuit printing method according to claim 3, wherein The obtaining the actual data model of the carrier workpiece and determining the difference between the actual data model of the carrier workpiece and the standard data model includes: Detect the local data model of the carrier workpiece according to the reference movement trajectory, and determine the difference between the local data model of the carrier workpiece and the corresponding position of the standard data model.

5. The adaptive conformal circuit printing method according to claim 4, wherein After generating the reference movement trajectory, it includes: Detect the local points of the carrier workpiece according to the trajectory nodes in the reference movement trajectory; Determine the difference between the local points of the carrier workpiece and the corresponding points of the standard data model; Correct the trajectory nodes according to the difference, and perform the printing operation based on the corrected trajectory nodes; Repeat the above steps until the printing operation is completed.

6. The adaptive conformal circuit printing method according to claim 1, characterized in that, During the process of performing the printing operation on the surface of the carrier workpiece based on the relative movement trajectory, it includes: Adjust the relative orientation between the carrier workpiece and the print head, so that the plane where the current laying point of the carrier workpiece is located is horizontal and in a vertically opposite state to the print head.

7. The adaptive conformal circuit printing method according to claim 1, wherein During or after the process of performing the printing operation on the surface of the carrier workpiece based on the relative movement trajectory, it further includes: Cure the conductive paste laid on the carrier workpiece.

8. The adaptive conformal circuit printing method according to claim 1, wherein The generating a relative movement trajectory between the print head and the carrier workpiece includes: Generate at least a printing instruction indicating the generation of a relative movement trajectory between the print head and the carrier workpiece.

9. An adaptive conformal circuit printing system, characterized in that Including: A reading module for obtaining the standard data model of the conformal circuit; The standard data model at least includes the standard data model of the carrier workpiece and the standard laying points of the circuit to be fabricated on the carrier workpiece; A scanning module for acquiring the actual data model of the carrier workpiece; A calculation module for determining the difference between the actual data model of the carrier workpiece and the standard data model; A correction module for generating a relative movement trajectory between the print head and the carrier workpiece according to the difference of the carrier workpiece and the standard laying points of the circuit to be fabricated; wherein, the printing distance between the print head and the carrier workpiece in the relative movement trajectory is constant; A printing module for performing a printing operation on the surface of the carrier workpiece based on the relative movement trajectory.

10. A conformal circuit, characterized in that, Obtained by the adaptive conformal circuit printing method according to any one of claims 1-8, or the adaptive conformal circuit printing system according to claim 9.

Citation Information

Patent Citations

  • Control method for printing system

    CN104842668A

  • Local repair method based on three-dimensional printing

    CN106271364A