A method for realizing local electromagnetic shielding, electronic packaging module and electronic equipment

Abstract

The present application provides a method for achieving local electromagnetic shielding, an electronic packaging module and an electronic device. The provided method is used to achieve local electromagnetic shielding for an electronic packaging module with a special-shaped side, and includes the following steps: S1, providing a PCB substrate, including a plurality of installation areas and a plurality of specific areas located on one side, wherein the specific areas have special-shaped sides; S2, arranging electronic components in the installation areas; S3, forming an electronic packaging module after plastic sealing; S4, performing a first cutting to form a plurality of single electronic packaging modules; S5, pasting tape in a specific area; S6, forming a shielding layer; S7, removing the tape in a specific area; S8, performing a second cutting along the special-shaped side of a single electronic packaging module; S9, arranging electronic components in a specific area to form an electronic packaging module product. The electronic packaging module includes a local electromagnetic shielding structure formed by the above method, and the electronic device includes the above electronic packaging module.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment and electromagnetic shielding, and in particular to a method for realizing local electromagnetic shielding, an electronic packaging module and an electronic equipment. Background Art

[0002] Electronic devices can be seen everywhere in daily life. Some electronic products have high requirements for anti-electromagnetic interference. Not only does it require systematic design in the early stage of product development, but also it requires high material and process costs to achieve an ideal solution. Electromagnetic interference includes internal interference between electronic components inside electronic devices such as chips and PCB circuit boards, interference from factors outside electronic devices or electronic systems to electronic devices, and interference from electronic devices to their external devices. As electronic devices become more and more complex, and their application in systems with high safety requirements such as vehicles, the reliability requirements for electronic devices or electronic components are getting higher and higher, and high requirements are placed on the anti-electromagnetic interference, that is, electromagnetic shielding technology, of electronic devices and electronic components.

[0003] In addition to controlling interference sources and reducing the sensitivity of electronic equipment to interference signals through filtering, reasonable grounding and other means, the most commonly used anti-electromagnetic interference technology is to block the conduction path of interference signals and suppress the intensity of interference signals through shielding isolation and other technologies. For example, an electromagnetic shielding cover is set for electronic components, or an electromagnetic shielding layer is formed on the insulating structure on the outer surface of electronic components through a coating process. However, in addition to the pads for connection, some electronic components also include microstrip antennas, other connectors and electronic units that need to interact with the outside, such as sensors, optoelectronic units, etc. These structures need to be in the non-shielded area.

[0004] In the prior art, local non-shielding areas are generally formed by opening windows on the electromagnetic shielding cover, or by covering part of the structure with protective means such as tape before applying the electromagnetic shielding layer. However, these methods make it difficult to form local non-shielding areas on the side of a flat substrate. Therefore, the side walls of electronic components are usually uniformly defined as electromagnetic shielding areas or non-electromagnetic shielding areas, and local electromagnetic shielding cannot be completed. If the side walls require electromagnetic shielding, multiple components produced in batches on the same substrate are cut into single products and a shielding body is added; if the side walls do not require electromagnetic shielding, they are cut after the shielding body is added. Due to the poor adaptability of these technical means, in order to achieve the best electromagnetic shielding effect, it is often necessary to set more or more complex electromagnetic shielding structures to achieve the goal, thereby increasing the size and cost of the electronic components. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a method for realizing local electromagnetic shielding on various structures of an electronic packaging module, which has good adaptability and forms a compact local electromagnetic shielding structure, as well as an electronic packaging module and electronic equipment based on the method.

[0006] In order to achieve the above objectives, this application provides the following technical solutions.

[0007] A method for realizing local electromagnetic shielding for an electronic packaging module with a special-shaped side edge, comprising the steps of:

[0008] S1. Provide a PCB substrate, wherein the PCB substrate comprises a plurality of mounting areas and a plurality of specific areas located on the end surface, wherein the specific areas are located at the edge of the PCB substrate and have the special-shaped side edges;

[0009] S2, arranging electronic components in the installation area;

[0010] S3, plastic-sealing the PCB substrate in areas other than the specific area to form a plastic-sealed electronic packaging module;

[0011] S4, performing a first cutting on the plastic-sealed electronic packaging module along a preset cutting path to form a plurality of single electronic packaging modules, wherein the single electronic packaging module comprises a plastic-sealed area and the specific area, and an outward expansion portion of the special-shaped side edge of the specific area is reserved;

[0012] S5, sticking tape on the specific area;

[0013] S6, forming a shielding layer on the single electronic packaging module;

[0014] S7, removing the tape from the specific area;

[0015] S8, performing a second cutting along the special-shaped side of the single electronic packaging module;

[0016] S9. Arrange electronic components in the specific area to form an electronic packaging module product.

[0017] In some real-time methods, in step S4, the preset cutting path includes a first cutting path and a second cutting path, the first cutting path is a cutting path for forming a number of the single electronic packaging modules except for the special-shaped side edges; the second cutting path is a cutting path for removing part of the structure outside the specific distance d of the cutting path at the special-shaped side edges.

[0018] In some embodiments, the minimum value of the specific distance d is determined by the cutting process capability.

[0019] In some embodiments, in step S8, the cutting path of the second cutting is a cutting path at the special-shaped side edge, so as to cut off the reserved outward expansion portion.

[0020] In some embodiments, before step S5, a step is further included: preparing a plurality of tapes, wherein the shapes of the tapes match the outer contours of the specific areas in step S4.

[0021] In some embodiments, in step S6, the shielding layer is formed by a sputtering or electroplating process.

[0022] In some implementations, in step S9, the electronic components include connectors and / or electronic units that need to interact with the outside; the electronic components also include microstrip or patch antennas.

[0023] The present application also provides an electronic packaging module having a local electromagnetic shielding structure, wherein the local electromagnetic shielding structure is formed by any of the aforementioned methods for achieving local electromagnetic shielding.

[0024] In some embodiments, the specific area is provided with: connectors and / or electronic components that need to interact with the outside; a microstrip or patch antenna; the antenna is close to the edge of the special-shaped side, and at least part of the side surface of the special-shaped side is a local non-shielded area.

[0025] The present application also provides an electronic device, comprising any of the aforementioned electronic packaging modules.

[0026] Each embodiment of the present application has at least one of the following technical effects:

[0027] 1. By reserving a structure for removal on the special-shaped side of a single electronic packaging module and removing the structure after forming the shielding layer, a local electromagnetic shielding structure can be formed on various structures of the electronic packaging module, especially the side of the PCB substrate, and a continuous or discontinuous local non-shielding area can be formed on the side of the PCB substrate of any shape;

[0028] 2. By combining with the method of sticking tape and other protective structures, local non-shielding areas of various shapes can be formed on the PCB substrate of the electronic packaging module, so that these local non-shielding areas are suitable for setting antennas, connectors and electronic units that need to interact with the outside;

[0029] 3. By placing the microstrip antenna or patch antenna in a non-shielded area with a profiled side, and setting the side of the profiled side as a non-shielded area, the antenna signal can be blocked to a minimum;

[0030] 4. By realizing a local electromagnetic shielding structure with a maximum shielding area and setting connectors, antennas and electronic components that need to interact with the outside world, such as sensors and optoelectronic components, in the non-shielding area, electronic packaging module products such as system-level core SOCs and PCB circuit boards with radio frequency functions that are more complex in functions and have higher operational reliability can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0032] Figure 1 is a flow chart of an embodiment of a method for implementing local electromagnetic shielding;

[0033] Figure 2 This is an exploded view of an electronic packaging module after plastic sealing according to an embodiment of a method for realizing local electromagnetic shielding;

[0034] Figure 3 yes Figure 2 Schematic diagram of the PCB substrate after placement;

[0035] Figure 4 yes Figure 2 A schematic diagram of a single electronic packaging module formed after the first cutting in the embodiment;

[0036] Figure 5 yes Figure 2 A schematic diagram of a first cutting path of an embodiment;

[0037] Figure 6 is a schematic diagram of a single electronic packaging module according to another embodiment;

[0038] Figure 7 yes Figure 6 A schematic diagram of a single electronic packaging module with a shielding layer according to an embodiment;

[0039] Figure 8 yes Figure 6 An exploded view of a single electronic package module with a shielding layer;

[0040] Fig. 9 yes Figure 6 Schematic diagram of the second cutting process of the embodiment;

[0041] Fig.10 yes Fig. 9 Schematic diagram of the cutting path of the second cutting in FIG.

[0042] Fig.11 yes Fig. 9 A magnified view of the part A in the middle;

[0043] Fig.12 yes Figure 6 A three-dimensional diagram of an electronic packaging module product of an embodiment;

[0044] Fig.13 yes Fig.12 A magnified view of the part B in the middle;

[0045] Fig.14 is a three-dimensional diagram of an electronic packaging module product according to another embodiment;

[0046] Fig.15 yes Fig.14 A magnified view of the local C in the middle;

[0047] Description of Figure Numbers:

[0048] 100. Shielding layer, 110. End face shielding layer, 120. Side shielding layer, 200. Plastic sealing layer, 300. PCB substrate, 301. Installation area, 302. Specific area, 303. Cutting path of the first cutting, 304. Cutting path of the second cutting, 310. PCB substrate of a single electronic packaging module, 311. PCB substrate of an electronic packaging module product, 312. External expansion part, 314. Side non-shielding area, 320. Microstrip antenna, 330. Electronic components, 400. Tape, 1000. Electronic packaging module after plastic sealing, 2000. Single electronic packaging module, 2500. Single electronic packaging module with shielding layer, 3000. Electronic packaging module product. DETAILED DESCRIPTION

[0049] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the specific implementation methods of the present application will be described below with reference to the accompanying drawings. The accompanying drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0050] In order to make the drawings concise, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In some figures, only one of the parts with the same structure or function is schematically drawn, or only one of them is marked. In this article, "one" not only means "only one", but also means "more than one". The term "and / or" used in the specification of this application and the attached claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes these combinations. The terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0051] Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0052] Example 1. Figure 1 As shown, the method for realizing local electromagnetic shielding of the present application is used to realize local electromagnetic shielding for an electronic packaging module with a special-shaped side, comprising the steps of:

[0053] S1. Provide a PCB substrate 300, such as Figure 2 and Figure 3 As shown, the PCB substrate 300 includes a mounting area 301 and a specific area 302 located on one side, and the specific area 302 is located at the edge of the PCB substrate 300 and has a special-shaped side edge;

[0054] S2, installing electronic components 330 in the installation area 301; there may be multiple electronic components 330;

[0055] S3, performing plastic sealing on the PCB substrate 300 except the specific area 302 to form a plastic sealing layer 200, and obtaining a plastic sealed electronic packaging module 1000;

[0056] S4, cutting the encapsulated electronic packaging module 1000 for the first time along the preset cutting path to form a plurality of single electronic packaging modules 2000. After the first cutting, the PCB substrate 300 becomes a PCB substrate 310 of a single electronic packaging module. Figure 5 As shown, the cutting path 303 of the first cutting is the outline of the PCB substrate 310 of the single electronic packaging module. The single electronic packaging module 2000 includes a plastic sealing area and a specific area 302, and the outer expansion part of the special-shaped side of the reserved specific area 302; Figure 4 As shown, the plastic sealing area is the area covered by the plastic sealing layer 200; the specific area 302 is a non-plastic sealing area, which is located outside the plastic sealing area;

[0057] S5, sticking the tape 400 on the specific area 302; Figure 6 As shown, the tape 400 covers a specific area 302;

[0058] S6, forming a shielding layer 100 on the single electronic packaging module 2000; Figure 7 and Figure 8 As shown, after this step is completed, a single electronic packaging module 2500 with a shielding layer is formed;

[0059] S7, removing the tape 400 from the specific area 302 to form a local non-shielding area;

[0060] S8, perform a second cut along the irregular side of the single electronic packaging module 2500 with a shielding layer; the PCB substrate 310 of the single electronic packaging module becomes a PCB substrate 311 of the electronic packaging module product after the second cut. Fig. 9 As shown, the second cutting is performed along the contour of the PCB substrate 311 of the electronic packaging module product, and the outward expansion portion 312 is removed;

[0061] S9, placing electronic components 330 in the specific area 302, such as Fig.14 As shown, an electronic packaging module product 3000 is formed.

[0062] The PCB substrate 300 may include only a single PCB unit for making one electronic package module product 3000, or may include an array of multiple PCB units made on a larger substrate for making multiple electronic package module products 3000. The PCB substrate 300 including a single PCB unit or multiple PCB units is cut for the first time to form Figure 3 The PCB substrate 310 of a single electronic package module is shown for manufacturing a single electronic package module product 3000 .

[0063] The first cutting and the second cutting can be performed by laser cutting or mechanical cutting. The present invention can realize a more complex local electromagnetic shielding structure by performing a second cutting on the PCB substrate 310 of a single electronic packaging module formed by the first cutting to remove the reserved outward expansion part on the PCB substrate 300 after forming the shielding layer 100. Specifically, the outer edge outward expansion part 312 (see Fig. 9 ), and in step S8, the outwardly expanded portion 312 is cut off to form a local non-shielding area on any special-shaped side.

[0064] The electronic packaging module product 3000 has a radio frequency function, in which part of the circuit that needs to transmit or receive signals must be set in the non-shielded area, while other circuit structures need to be set in the shielding layer 100. As a variation of this embodiment, the electronic packaging module product 3000 can also be an integrated circuit chip, such as a system-on-chip SOC with complex functions and complex structures, whose main structure needs to be set in the shielding layer 100 so that it can still ensure high reliability in complex application environments; and the electronic components 330 that need to interact with the outside need to be set in the non-shielded area, such as micro sensors, optoelectronic units and other structures on the SOC used in wearable devices, vehicles, drones and other smart devices.

[0065] In a specific area 302 with a larger area, it is relatively easy to form a local non-shielding area by pasting and subsequently removing the tape 400. However, it is not easy to paste the tape 400 well on the side of the PCB substrate 311 of the electronic packaging module product, especially when the side is a special-shaped side. The method of removing the outward expansion part 312 by laser cutting and other methods can be applied to various structures, such as the substrate structure with a groove structure in this embodiment. Through the above method, the present application can set a local non-shielding area and a local shielding structure on a complex structure, which is not only compact in structure, but also can design the best shielding solution with ideal anti-interference effect and cost according to the simulation results.

[0066] Embodiment 2. Based on Embodiment 1, in step S4, the preset cutting path for the first cutting includes a first cutting path and a second cutting path, wherein the first cutting path is a cutting path for forming a plurality of single electronic packaging modules 2000 except for the irregular side edges; that is, Figure 4 and Figure 5 The PCB substrate 310 of the single electronic package module shown in FIG. 1 is a cutting path for removing the contour of the irregular side edge except for the part of the structure extending beyond the specific distance d of the cutting path at the irregular side edge. Fig. 9 and Fig.10 The cutting path shown is for removing the area outside the expanded portion 312. The details of the specific distance d are as follows: Fig.11 shown.

[0067] Embodiment 3: Based on embodiment 2, the minimum value of the specific distance d is determined by the cutting process capability, for example, it can be selected between 0.1 mm and 1.0 mm.

[0068] Embodiment 4: Based on the embodiment 2, in step S8, the cutting path 304 of the second cutting is the cutting path at the irregular side edge, so as to remove the part of the structure that is extended by a specific distance d from the cutting path at the irregular side edge.

[0069] Embodiment 5. Based on the above embodiments, a step is further included before step S5: preparing a plurality of adhesive tapes 400, such as Figure 6 As shown, the shape of the tape 400 matches the outer contour of the specific area 302 in step S4.

[0070] like Fig.12 and Fig.13As shown, the shielding layer 100 includes an end face shielding layer 110 and a side shielding layer 120 covering the outer surface of the plastic packaging layer 200. The end face shielding layer 110 and the side shielding layer 120 are both local shielding structures, and together form a local electromagnetic shielding structure of the electronic packaging module product 3000. Similarly, the local non-shielding area includes an end face non-shielding area (i.e., the specific area 302 shown in the figure) located on the upper end face or the upper and lower end faces of the PCB substrate 311 of the electronic packaging module product, and a side non-shielding area 314 located on a partial area of ​​the side face. The end face non-shielding area and the side non-shielding area 314 are also local non-shielding areas.

[0071] Embodiment 6 Based on the above embodiments, in step S6, the shielding layer 100 is formed by a process such as sputtering or electroplating.

[0072] Embodiment 7 Based on the above embodiments, in step S9, the electronic component 330 includes a connector and / or an electronic unit that needs to interact with the outside; and a microstrip antenna 320, or a patch antenna.

[0073] See also Fig.14 and Fig.15 In this embodiment, a microstrip antenna 320 is arranged in a part of the area of ​​the local non-shielding area. In step S5, the adhesive tape 400 covers at least a part of the area of ​​the microstrip antenna 320. The microstrip antenna 320 is arranged in the removed part of the special-shaped side edge of the PCB substrate 311 close to the electronic packaging module product. The microstrip antenna 320 can also be an antenna in other forms, such as a patch antenna, or an assembled antenna fixed to the substrate. When the microstrip antenna 320 is arranged close to the edge of the special-shaped side edge, it can be away from the shielding layer 100 to avoid being blocked by the shielding layer 100 when sending and receiving signals; at the same time, since the side of the substrate close to the microstrip antenna 320 is also a local non-shielding area, it will not cause blocking of the antenna signal, and the other end faces and sides away from the microstrip antenna 320 are protected by the shielding layer 100 to the greatest extent, so that the local electromagnetic shielding structure formed by the shielding layer 100 and the setting of the local non-shielding area are optimized.

[0074] Embodiment 8. Fig.12 and Fig.13 As shown, this embodiment is an electronic packaging module product 3000, which has a local electromagnetic shielding structure, and the local electromagnetic shielding structure is formed by any of the aforementioned methods for realizing local electromagnetic shielding. The electronic packaging module product 3000 can be a radio frequency PCB board, or a system-on-chip SOC with a microstrip antenna 320 or an optoelectronic unit, a micro sensor or other electronic components 330.

[0075] Embodiment 9. On the basis of Embodiment 8, the specific area 302 of the electronic packaging module product 3000, i.e., the local non-shielding area, is provided with: a connector (not shown in the figure) and an electronic component 330 that needs to interact with the outside, and a microstrip antenna 320 or a patch antenna; the electronic packaging module product 3000 has a special-shaped side, the microstrip antenna 320 is close to the edge of the special-shaped side, and the side surface of the edge of the special-shaped side is at least partially a non-shielding area, so that the microstrip antenna 320 is away from the shielding layer 100, thereby minimizing the obstruction of the signal of the microstrip antenna 320.

[0076] Embodiment 10. This embodiment is an electronic device, including the electronic package module product 3000 in the above embodiment. This embodiment can be a wearable device with a sensor, or a smart device with a wireless transceiver function.

[0077] The above are only preferred embodiments of the present application and the technical principles used. Various obvious changes, readjustments and substitutions can be made without departing from the concept of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. In the absence of conflict, the above embodiments and the features in the embodiments can be combined with each other.

Claims

1. A method for realizing local electromagnetic shielding for an electronic packaging module with a special-shaped side edge, characterized in that: Includes steps: S1. Provide a PCB substrate, wherein the PCB substrate comprises a plurality of mounting areas and a plurality of specific areas located on one side, wherein the specific areas are located at the edge of the PCB substrate and have the special-shaped side edges; and the specific areas are non-plastic-sealed areas; S2, arranging electronic components in the installation area; S3, plastic-sealing the PCB substrate in areas other than the specific area to form a plastic-sealed electronic packaging module; S4, performing a first cutting on the plastic-sealed electronic packaging module along a preset cutting path to form a plurality of single electronic packaging modules, wherein the single electronic packaging module comprises a plastic-sealed area and the specific area, and an outward expansion portion of the special-shaped side edge of the specific area is reserved; S5, sticking tape on the specific area; S6, forming a shielding layer on the single electronic packaging module; S7, removing the tape from the specific area; S8, performing a second cutting along the special-shaped side of the single electronic packaging module; S9, arranging electronic components in the specific area to form an electronic packaging module product; Wherein, in step S4, the preset cutting path includes a first cutting path and a second cutting path, the first cutting path is a cutting path for forming a plurality of the single electronic packaging modules except for the irregular side edges; the second cutting path is a cutting path for removing a portion of the structure other than the outer expansion distance d of the irregular side edges; In step S8, the cutting path of the second cutting is a cutting path at the special-shaped side edge to cut off the reserved outward expansion part.

2. The method for realizing local electromagnetic shielding according to claim 1, characterized in that: The minimum value of the distance d is determined by the cutting process capability.

3. The method for realizing local electromagnetic shielding according to claim 1, characterized in that: Before step S5, a step is further included: preparing a plurality of adhesive tapes, the shapes of the adhesive tapes being consistent with the outer contour of the specific area in step S4.

4. The method for realizing local electromagnetic shielding according to claim 1, characterized in that: In step S6, the shielding layer is formed by a sputtering or electroplating process.

5. The method for realizing local electromagnetic shielding according to claim 1, characterized in that: In step S9, the electronic components include connectors and / or electronic units that need to interact with the outside; The electronic components also include microstrip or patch antennas.

6. An electronic packaging module, characterized in that: The invention has a local electromagnetic shielding structure, wherein the local electromagnetic shielding structure is formed by the method for realizing local electromagnetic shielding according to any one of claims 1 to 5.

7. The electronic packaging module according to claim 6, characterized in that: The specific area includes: Connectors and / or electronic components that need to interact with the outside world; Microstrip or patch antenna; The antenna is close to the edge of the special-shaped side, and at least part of the side surface of the special-shaped side is a local non-shielding area.

8. An electronic device, characterized in that: Comprising the electronic packaging module as described in claim 6 or 7.

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