Flexible circuit board and display device

Abstract

The present disclosure provides a flexible circuit board and a display device, belonging to the field of display technology, wherein the display device includes a first circuit board and a second circuit board connected thereto; the first circuit board includes a first electronic component; the second circuit board includes a second electronic component; the first circuit board has a first side surface and a second side surface relative to each other in a first direction; the second circuit board has a third side surface and a fourth side surface relative to each other in the first direction; the first electronic component is arranged on the second side surface of the first circuit board; the second electronic component is arranged on the fourth side surface of the second circuit board; when the flexible circuit board is in a bent state, the fourth side surface of the second circuit board is arranged relative to the second side surface of the first circuit board; the orthographic projection of the first electronic component on the first circuit board and the orthographic projection of the second electronic component on the first circuit board do not overlap, which can limit the width and thickness of the flexible circuit board and increase the available space of the entire machine in which the flexible circuit board is used.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a flexible circuit board and a display device. Background Art

[0002] Flexible Printed Circuit (FPC) is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film as a substrate. With the continuous innovation of display technology, the demand for thinner and lighter display products is getting higher and higher. While meeting the demand for thinner and lighter display products, expanding the battery compartment of the entire product to make it have a longer standby time is also a challenge for display product design. In related technologies, the demand for thinness and lighter can be achieved by adjusting the outer dimensions of the FPC. However, the large number of signal lines, power lines, and electronic components and chips densely distributed on the board area greatly limit the FPC space that needs to be adjusted. Therefore, while achieving the thinness of the display device, increasing the available space of the display device has become a difficult problem. Summary of the Invention

[0003] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provide a flexible circuit board and a display device.

[0004] In a first aspect, an embodiment of the present disclosure provides a flexible circuit board, comprising a first circuit board and a second circuit board connected thereto; the first circuit board comprises a first electronic component; the second circuit board comprises a second electronic component; the first circuit board has a first side surface and a second side surface opposite to each other in a first direction; the second circuit board has a third side surface and a fourth side surface opposite to each other in the first direction; the first electronic component is disposed on the second side surface of the first circuit board; the second electronic component is disposed on the fourth side surface of the second circuit board; the first direction is a thickness direction of the flexible circuit board;

[0005] When the flexible circuit board is in a bent state, the fourth side surface of the second circuit board and the second side surface of the first circuit board are arranged opposite to each other; the orthographic projection of the first electronic component on the first circuit board and the orthographic projection of the second electronic component on the first circuit board do not overlap.

[0006] In some embodiments, when the flexible circuit board is in a bent state, the flexible circuit board is divided into at least one device group; the electronic components in each device group include the first electronic component and the second electronic component;

[0007] For any device group, the largest electronic component includes a first side and a second side that are oppositely arranged and extend along the length direction of the first circuit board; the orthographic projection of each electronic component on the first circuit board is located between the extension line of the first side and the orthographic projection of the extension line of the second side on the first circuit board.

[0008] In some embodiments, the first circuit board includes a main body portion and a solder pad connected to the main body portion;

[0009] In the width direction of the first circuit board, the ratio between the first width dimension of the main body and the second width dimension of the largest electronic component is between 1.8 and 2; the second width dimension is the distance between the first side and the second side.

[0010] In some embodiments, the first circuit board includes a first clearance area and at least one first mounting area, and the second circuit board includes a second clearance area and at least one second mounting area; the first electronic component is located in the first mounting area; and the second electronic component is located in the second mounting area.

[0011] At least one of the first clearance area of ​​the first circuit board and the second clearance area of ​​the second circuit board is provided with a bonding structure; when the flexible circuit board is in a bent state, the bonding structure connects the first circuit board and the second circuit board.

[0012] In some embodiments, when the flexible circuit board is in a bent state, an orthographic projection of the first electronic component on the first circuit board exists between the orthographic projections of two adjacent second electronic components on the first circuit board;

[0013] The orthographic projection of the bonding structure on the first circuit board is located between the orthographic projection of the first electronic component on the first circuit board and the orthographic projection of the second electronic component on the first circuit board.

[0014] In some embodiments, the flexible circuit board includes an alignment line; the alignment line and the bonding structure bonded thereto are provided on different circuit boards;

[0015] When the flexible circuit board is in a bent state, the edge of the alignment line overlaps with the outline of the bonding structure.

[0016] In some embodiments, the flexible circuit board further includes a connecting portion; the first circuit board and the second circuit board are connected via the connecting portion, and the first circuit board, the second circuit board and the connecting portion are an integrated structure.

[0017] In some embodiments, when the flexible circuit board is in a bent state, in the first direction, the first distance between the first electronic component and the second circuit board is between 0.2 mm and 0.4 mm; in the first direction, the second distance between the second electronic component and the first circuit board is between 0.2 mm and 0.4 mm.

[0018] In some embodiments, the flexible circuit board further includes a connector; the connector is connected to one end of the first circuit board; and the connector is used to connect to a printed circuit board.

[0019] In a second aspect, an embodiment of the present disclosure further provides a display device, which includes a display panel and the flexible circuit board described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of a traditional six-layer FPC design;

[0021] Figure 2 This is a schematic diagram of a traditional two-layer FPC design;

[0022] Figure 3 A schematic diagram of the structure of the flexible circuit board in an unfolded state provided by an embodiment of the present disclosure;

[0023] Figure 4 A schematic diagram of the structure of the flexible circuit board in a bent state provided by an embodiment of the present disclosure;

[0024] Figure 5 A schematic diagram of the distribution of electronic components provided in an embodiment of the present disclosure;

[0025] Figure 6a A schematic diagram of the distribution of a bonding structure provided by an embodiment of the present disclosure when the flexible circuit board is in an unfolded state;

[0026] Figure 6b A schematic diagram of the distribution of a bonding structure provided by an embodiment of the present disclosure when the flexible circuit board is in a bent state;

[0027] Figure 7 A schematic diagram of the distribution of another bonding structure provided by an embodiment of the present disclosure when the flexible circuit board is in a bent state;

[0028] Figure 8 for Figure 6b Cross-sectional view along AA direction;

[0029] Figure 9 A schematic diagram of the overall structure of the flexible circuit board provided in an embodiment of the present disclosure.

[0030] The figures are marked as follows: flexible circuit board 100; device group 10; first circuit board 01; second circuit board 02; connecting portion 03; first electronic component 11; second electronic component 21; second side surface 01b of the first circuit board; third side surface 02a of the second circuit board; fourth side surface 02b of the second circuit board; first side edge 11a of the largest electronic component; second side edge 11b of the largest electronic component; main body 12; solder pad 13; first clearance area 14; first mounting area 15; second clearance area 22; second mounting area 23; bonding structure 04; alignment line 05; connector 06. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the disclosure for which protection is sought, but merely represents selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present disclosure.

[0032] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0033] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0034] It should be noted that in this disclosure, the first direction Z, the second direction X, and the third direction Y intersect in pairs. This disclosure uses the example of the first direction Z and the second direction X being perpendicular to each other in the plane of the substrate, with the first direction Z being the horizontal direction, the second direction X being the vertical direction, and the third direction Y being the vertical direction, perpendicular to the plane of the substrate, as an example for illustration, but this does not constitute a limitation of this disclosure. In this disclosure, the first direction Z is the thickness direction of the circuit board, the second direction X is the length direction of the circuit board, and the third direction Y is the width direction of the circuit board.

[0035] It should be noted that, in the present disclosure, the circuit board includes a first circuit board and a second circuit board, and the electronic components include a first electronic component and a second electronic component.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0037] In the related art, the demand for thinness and lightness is achieved by adjusting the external dimensions of the FPC. In one case, Figure 1 This is a schematic diagram of the traditional six-layer FPC100 design scheme, as shown in Figure 1 As shown, the multi-layer FPC100 is stacked along the first direction Z, using a six-layer FPC100 stacking solution, in which electronic components can be more densely distributed in the board area and the wiring design can be carried out by taking advantage of the multi-layer empty board. Although this solution can effectively save the width of the single-layer FPC100, the multi-layer FPC stacked in the first direction Z occupies a larger space of the display device. At the same time, the multi-layer FPC100 increases the component cost of the FPC100. Therefore, this situation cannot achieve the lightness and thinness of the display device, and at the same time increases the material cost. Considering cost reasons, another situation is that the conventional design of two-layer boards is usually adopted in the prior art. Figure 2 This is a schematic diagram of a traditional two-layer FPC design solution, such as Figure 2As shown, it includes a first board area 2 for arranging electronic components and a second board area 3 for routing. The numerous signal lines, power lines, and electronic components and chips densely distributed on the board area greatly limit the width of the FPC 100, which is the sum of the widths of the first board area 2 and the second board area 3. This results in the FPC 100 occupying a larger size in the width direction (i.e., the third direction Y) in the display device, as shown in FIG. Figure 2 As shown, while there is no multilayer board, a larger board area is required for circuit layout, namely the second board area 3. Although the cost of FPC 100 components is well controlled, the larger width of FPC 100 is still sacrificed, which does not provide more favorable space for the overall design of the display device.

[0038] Based on this, the present disclosure provides a flexible circuit board (FPC) comprising a first circuit board (01) and a second circuit board (02) connected thereto. Electronic components are arranged on the first and second circuit boards (01, 02) according to a predetermined pattern. When the FPC 100 is bent, the sides of the first and second circuit boards (01, 02) with the electronic components disposed thereon face each other, significantly reducing the overall thickness (in the first direction Z) of the FPC. Furthermore, when the FPC 100 is bent, the first and second circuit boards (01, 02) face each other, reducing the overall width (in the third direction Y) of the FPC. Furthermore, the orthographic projections of the first and second electronic components (11, 21) on the first circuit board (01) and (21) on the first circuit board (01) do not overlap, ensuring no interference between the first and second electronic components (11, 21) located on different circuit boards. Compared to conventional technologies, the present disclosure addresses the currently widely used two-layer FPC solution, reducing the width of a single-layer FPC in a display device by at least 50%, while still effectively controlling the FPC component cost compared to a six-layer FPC.

[0039] A flexible circuit board provided by an embodiment of the present disclosure will be described below with reference to the accompanying drawings in the embodiment of the present disclosure.

[0040] Figure 3 This is a schematic structural diagram of the flexible circuit board provided in an embodiment of the present disclosure in an unfolded state. Figure 4 The bent state of the flexible circuit board 100 is a schematic diagram of the structure of the flexible circuit board provided in an embodiment of the present disclosure. The bent state of the flexible circuit board 100 is the state in which the first circuit board 01 and the second circuit board 02 are unfolded and the second circuit board 02 is rotated 180° around the connection axis I.

[0041] like Figure 3 and Figure 4As shown, the flexible circuit board 100 includes a first circuit board 01 and a second circuit board 02 connected thereto; the first circuit board 01 includes a first electronic component 11; the second circuit board 02 includes a second electronic component 21; the first circuit board 01 has a first side surface and a second side surface 01b opposite to each other in a first direction Z; the second circuit board 02 has a third side surface 02a and a fourth side surface 02b opposite to each other in the first direction; the first electronic component 11 is arranged on the second side surface 01b of the first circuit board 01; the second electronic component 21 is arranged on the fourth side surface 02b of the second circuit board 02.

[0042] like Figure 3 As shown, the first circuit board 01 is the main board of the flexible circuit board 100; the second circuit board 02 is the sub-board of the flexible circuit board 100. The second side surface 01b of the first circuit board 01 is the front surface, and the first side surface is the bottom surface opposite to the second side surface 01b ( Figure 3 The fourth side surface 02b of the second circuit board 02 is the front surface, and the third side surface 02a is the bottom surface opposite to the fourth side surface 02b ( Figure 4 shown in ).

[0043] The first electronic component 11 can be an electronic component pre-selected and placed on the first circuit board 01, and the second electronic component 21 can be an electronic component pre-selected and placed on the second circuit board 02. Specifically, the electronic components can be reasonably classified and laid out according to their dimensions to determine their distribution on the circuit board. Electronic components include chips, resistors, inductors, capacitors, and the like. Copper holes are provided in the circuit board, and a plurality of connecting lines (such as signal lines and power lines, etc.) are arranged. The electronic components are soldered on the circuit board and electrically connected to other electronic components through the copper holes and connecting lines. Among them, the first electronic component 11 is provided on the second side 01b of the first circuit board 01, and the second electronic component 21 is provided on the fourth side 02b of the second circuit board 02, and both are distributed on the same side.

[0044] like Figure 4 As shown, when the flexible circuit board 100 is in a bent state, the fourth side surface 02b of the second circuit board 02 and the second side surface 01b of the first circuit board 01 are arranged opposite to each other; the orthographic projection of the first electronic component 11 on the first circuit board 01 and the orthographic projection of the second electronic component 21 on the first circuit board 01 do not overlap.

[0045] The first circuit board 01 is connected to the second circuit board 02, with the connecting line as the axis I. The second circuit board 02 is bent 180° around the axis. At this time, the flexible circuit board 100 is in a bent state, and the fourth side surface 02b of the second circuit board 02 is arranged opposite to the second side surface 01b of the first circuit board 01.

[0046] A first electronic component 11 is disposed on the second side 01b of the first circuit board 01, and a second electronic component 21 is disposed on the fourth side 02b of the second circuit board 02. When the flexible circuit board 100 is bent, the fourth side 02b of the second circuit board 02 is positioned opposite the second side 01b of the first circuit board 01. This means that the sides of the first and second circuit boards 01 and 02 with the electronic components disposed thereon are positioned opposite each other. This significantly reduces the overall thickness of the flexible circuit board 100 (i.e., its dimension in the first direction Z). Furthermore, when the flexible circuit board 100 is bent, the first and second circuit boards 01 and 02 are positioned opposite each other, reducing the overall width of the flexible circuit board 100 (i.e., its dimension in the third direction Y). Furthermore, the orthographic projections of the first and second electronic components 11 and 21 on the first circuit board 01 do not overlap, ensuring that there is no interference between the first and second electronic components 11 and 21 located on different circuit boards.

[0047] In some examples, when the flexible circuit board 100 is in a bent state, the flexible circuit board 100 is divided into at least one device group 10; the electronic components in each device group 10 include a first electronic component 11 and a second electronic component 21; for any device group 10, the largest electronic component includes a first side 11a and a second side 11b that are oppositely arranged and extend along the length direction of the first circuit board 01. Figure 5 A schematic diagram of the distribution of electronic components provided in an embodiment of the present disclosure, such as Figure 5 As shown, to ensure that the width of the circuit board is minimized and can accommodate the largest electronic components, when the flexible circuit board 100 is in a bent state, the orthographic projections of the electronic components distributed on the circuit board on the first circuit board 01 are all located between the orthographic projections of the extension line of the first side 11a and the extension line of the second side 11b on the first circuit board 01.

[0048] The largest electronic component can be a regular-shaped electronic component, such as a rectangular one. For the largest electronic component with a regular shape, the first side 11 a and the second side 11 b are two sides arranged opposite to each other in the third direction Y.

[0049] Alternatively, the largest electronic component may be an irregularly shaped electronic component. For the irregularly shaped largest electronic component, the first side 11a and the second side 11b are the two sides extending along the length direction X of the first circuit board 01 at the two farthest points in the third direction Y.

[0050] Here, the distribution area of ​​each electronic component on the circuit board is designed according to the external dimensions of the largest electronic component. When the flexible circuit board 100 is in a bent state, each electronic component can be located between the extension line of the first side 11a and the extension line of the second side 11b on the first circuit board 01. When the flexible circuit board 100 can accommodate each electronic component, the width of the flexible circuit board 100 is maximized, providing more favorable space for the overall design of the display device.

[0051] In some examples, such as Figure 5 As shown, the first circuit board 01 includes a main body 12 and solder pads 13 connected thereto. In the width direction of the first circuit board 01, the ratio between the first width dimension L1 of the main body 12 and the second width dimension L2 of the largest electronic component is between 1.8 and 2. The second width dimension L2 is the distance between the first side 11a and the second side 11b. This rational design of the distance between the electronic components and the edge contour of the main body 12 can further reduce the width of the first circuit board 01, thereby reducing the width of the flexible circuit board 100, providing more space for the overall design of the display device.

[0052] Here, the pad 13 is electrically connected to the electronic components inside the flexible circuit board 100 through the first connecting lead, and is electrically connected to the coil inside the flexible circuit board 100 or the display panel outside the flexible circuit board 100 through the second connecting lead.

[0053] In some examples, Figure 6a A schematic diagram of the distribution of a bonding structure provided by an embodiment of the present disclosure when the flexible circuit board is in an unfolded state is shown. Figure 6b A schematic diagram of the distribution of a bonding structure provided in an embodiment of the present disclosure when the flexible circuit board is in a bent state.

[0054] like Figure 6a As shown, the first circuit board 01 includes a first clearance area 14 and at least one first mounting area 15, and the second circuit board 02 includes a second clearance area 22 and at least one second mounting area 23; the first electronic component 11 is located in the first mounting area 15; the second electronic component 21 is located in the second mounting area 23. The first clearance area 14 is the area of ​​the main body 12 of the first circuit board 01 excluding the first mounting area 15. The second clearance area 22 is the area of ​​the second circuit board 02 excluding the second mounting area 23. The first mounting areas 15 are arranged in an array on the main body 12 of the first circuit board 01; the second mounting areas 23 are arranged in an array on the second circuit board 02. The electronic components are located in the mounting area and can be reasonably arranged according to factors such as the external dimensions of the electronic components, the connection relationship between the electronic components, and whether it does not affect the wiring layout, to ensure that as many electronic components as possible are arranged in the mounting area.

[0055] Exemplarily, the first installation area 15 and the second installation area 23 have the same shape and area, and the present disclosure takes a rectangle as an example.

[0056] At least one of the first clearance area 14 of the first circuit board 01 and the second clearance area 22 of the second circuit board 02 is provided with an adhesive structure 04. For example, the adhesive structure 04 may be provided only in the first clearance area 14; or only in the second clearance area 22; or both in the first clearance area 14 and the second clearance area 22. The arrangement can be flexible as needed and is not limited in the present embodiment.

[0057] The following disclosure is described by taking the example of setting the bonding structure 04 only in the second clearance area 22 of the second circuit board 02. Figure 6b As shown, when the flexible circuit board 100 is in a bent state, the bonding structure 04 can connect the first circuit board 01 and the second circuit board 02, and the orthographic projection of the bonding structure 04 on the first circuit board 01 can be located between the orthographic projections of two adjacent first electronic components 11 on the first circuit board 01; or, the orthographic projection of the bonding structure 04 on the first circuit board 01 can also be located between the orthographic projections of two adjacent second electronic components 21 on the first circuit board 01; or, the orthographic projection of the bonding structure 04 on the first circuit board 01 can also be located between the orthographic projection of the first electronic component 11 on the first circuit board 01 and the orthographic projection of the adjacent second electronic component 21 on the first circuit board 01.

[0058] Here, the bonding structure 04 can be a foam colloid. This colloid not only secures the connection between the first and second circuit boards 01 and 02, but also prevents interference between electronic components in different mounting areas. It also blocks the effects of external moisture or oxygen on the electronic components within the flexible circuit board 100. Furthermore, due to the inherent elasticity of the foam colloid, the spacing between the first and second circuit boards 01 and 02 in the thickness direction Z can be minimized during the bending and bonding process.

[0059] In some examples, Figure 7 A schematic diagram of the distribution of another bonding structure provided in an embodiment of the present disclosure when the flexible circuit board is in a bent state.

[0060] like Figure 6a 、 Figure 6b and Figure 7As shown, when the flexible circuit board 100 is in a bent state, there is an orthographic projection of the first electronic component 11 on the first circuit board 01, which is located between the orthographic projections of any two adjacent second electronic components 21 on the first circuit board 01; the orthographic projection of the bonding structure 04 on the first circuit board 01 is located between the orthographic projection of the first electronic component 11 on the first circuit board 01 and the orthographic projection of the second electronic component 21 on the first circuit board 01.

[0061] like Figure 6a and Figure 6b As shown, when the flexible circuit board 100 is in a bent state, the orthographic projection of the first electronic component 11 on the first circuit board 01 lies between the orthographic projections of two adjacent second electronic components 21 on the first circuit board 01. In one scenario, the orthographic projections of some first electronic components 11 on the first circuit board 01 may lie between the orthographic projections of two adjacent second electronic components 21 on the first circuit board 01; the orthographic projections of the remaining first electronic components 11 on the first circuit board 01 lie on either side of the orthographic projection of the second circuit board 02 on the first circuit board 01 along the length direction X of the first circuit board 01. For example, the first electronic component 11 in the first first mounting area 15 and the first electronic component 11 in the last first mounting area 15 on the first circuit board 01 along the length direction X. In this case, the bonding structures 04 are evenly distributed on the second circuit board, improving the rigidity of the bonding between the first circuit board 01 and the second circuit board 02, thereby achieving stable support between the circuit boards. In addition, the first first mounting area 15 and the last first mounting area 15 can be saved, and the second circuit board 02 facing along the first direction Z can be saved, thereby reducing the cost of setting up the second circuit board 02 and increasing the available space between the mounting area along the first direction Z and the extension surface of the second circuit board 02.

[0062] like Figure 7 As shown, when the flexible circuit board 100 is in a bent state, the orthographic projection of any first electronic component 11 on the first circuit board 01 is located between the orthographic projections of any two adjacent second electronic components 21 on the first circuit board 01 .

[0063] The above examples can all achieve an interlaced arrangement between the first electronic component 11 and the second electronic component 21. The orthographic projection of the bonding structure 04 on the first circuit board 01 is located between the orthographic projection of the first electronic component 11 on the first circuit board 01 and the orthographic projection of the second electronic component 21 on the first circuit board 01. The bonding structure 04 is evenly distributed in the circuit board, thereby improving the rigidity of the bonding and fixation between the first circuit board 01 and the second circuit board 02, and achieving stable support between the circuit boards.

[0064] In some embodiments, there are multiple component groups 10, each of which is arranged in an array along the width direction Y of the first circuit board 01. When the flexible circuit board 100 is in a bent state, the orthographic projection of the bonding structure 04 on the first circuit board 01 is located between the orthographic projections of adjacent component groups 10 on the first circuit board 01, thereby stably supporting the two circuit boards.

[0065] In some examples, such as Figure 6a As shown, the flexible circuit board 100 further includes alignment lines 05; the alignment lines 05 are used to cooperate with the adhesive structure 04 in the bent state to achieve alignment and fixation of the adhesive structure 04. The alignment lines 05 and the adhesive structure 04 bonded thereto are arranged on different circuit boards. For example, Figure 6a As shown, if the adhesive structures 04 are all disposed on the second circuit board 02, then the alignment traces 05 are all disposed on the first circuit board 01. If the adhesive structures 04 are disposed on the first circuit board 01, then the alignment traces 05 bonded thereto are disposed on the second circuit board 02. When the flexible circuit board 100 is bent, the edges of the alignment traces 05 overlap with the outlines of the adhesive structures 04, securing the adhesive structures 04 in position. This ensures that the orthographic projections of the second electronic component 21 and the first electronic component 11 on the first circuit board 01 do not overlap, thereby eliminating interference between the first electronic component 11 and the second electronic component 21.

[0066] For example, the alignment marking 05 may be an ink mark printed on the flexible circuit board 100 .

[0067] In some examples, Figure 8 for Figure 6b The cross-sectional view along the AA direction is as follows: Figure 8 As shown, when the flexible circuit board 100 is in a bent state and the spacing between the first circuit board 01 and the second circuit board 02 in the thickness direction is limited, a first spacing L3 between the first electronic component 11 and the second circuit board 02 is between 0.2 mm and 0.4 mm in the first direction Z; and a second spacing L4 between the second electronic component 21 and the first circuit board 01 is between 0.2 mm and 0.4 mm in the first direction Z. These spacings L3 and L4 ensure that there is no coupling between the first electronic component 11 and the second circuit board 02, and between the second electronic component 21 and the first circuit board 01.

[0068] In some examples, such as Figure 3 and Figure 4 As shown, the flexible circuit board 100 further includes a connecting portion 03 ; the first circuit board 01 and the second circuit board 02 are connected via the connecting portion 03 , and the first circuit board 01 , the second circuit board 02 and the connecting portion 03 are an integrated structure.

[0069] The first circuit board 01, the second circuit board 02 and the connecting part 03 are reused as the same base substrate of the flexible circuit board 100, wherein the first circuit board 01 includes, in addition to the base substrate, a first electronic component 11 arranged on the base substrate and various connecting wires for connecting the first electronic component 11; the second circuit board 02 includes, in addition to the base substrate, a second electronic component 21 arranged on the base substrate and various connecting wires for connecting the second electronic component 21; the connecting part 03 includes, in addition to the base substrate, various connecting wires arranged on the base substrate for connecting the first electronic component 11, various connecting wires for connecting the second electronic component 21, and at least one of various connecting leads for connecting the first electronic component 11 and the second electronic component 21.

[0070] In some examples, Figure 9 The overall structure diagram of the flexible circuit board provided in the embodiment of the present disclosure is as follows Figure 9 As shown, flexible circuit board 100 also includes a connector 06, such as a board-to-board (BTB) connector. Connector 06 is connected to one end of first circuit board 01; connector 06 is used to connect printed circuit boards. First circuit board 01 includes a main body 12 and solder pads 13. Along the width of first circuit board 01, main body 12 and solder pads 13 are connected. The side of main body 12 facing away from solder pads 13 is connected to one end of connector 03. The other end of connector 03 is connected to one side of second circuit board 02 along the width.

[0071] Secondly, based on the same inventive concept, an embodiment of the present disclosure further provides a display device, which includes the flexible circuit board 100 as described above, and a display panel.

[0072] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A flexible circuit board, used in a display device, wherein: The flexible circuit board includes a first circuit board and a second circuit board connected thereto; the first circuit board includes a first electronic component; the second circuit board includes a second electronic component; the first circuit board has a first side surface and a second side surface opposite to each other in a first direction; the second circuit board has a third side surface and a fourth side surface opposite to each other in the first direction; the first electronic component is arranged on the second side surface of the first circuit board; the second electronic component is arranged on the fourth side surface of the second circuit board; the first direction is the thickness direction of the flexible circuit board; When the flexible circuit board is in a bent state, the fourth side surface of the second circuit board and the second side surface of the first circuit board are arranged opposite to each other; the orthographic projection of the first electronic component on the first circuit board and the orthographic projection of the second electronic component on the first circuit board do not overlap; When the flexible circuit board is in a bent state, the flexible circuit board is divided into at least one device group; the electronic components in each device group include the first electronic component and the second electronic component; for any device group, the largest electronic component includes a first side and a second side that are oppositely arranged and extend along the length direction of the first circuit board; and the orthographic projection of each electronic component on the first circuit board is located between the orthographic projection of the extension line of the first side and the extension line of the second side on the first circuit board; The first circuit board includes a first clearance area and at least one first mounting area, and the second circuit board includes a second clearance area and at least one second mounting area; the first electronic component is located in the first mounting area; and the second electronic component is located in the second mounting area; At least one of the first clearance area of ​​the first circuit board and the second clearance area of ​​the second circuit board is provided with a bonding structure; when the flexible circuit board is in a bent state, the orthographic projection of the bonding structure on the first circuit board is located between the orthographic projection of the first electronic component on the first circuit board and the orthographic projection of the adjacent second electronic component on the first circuit board; The bonding structure connects the first circuit board and the second circuit board.

2. The flexible circuit board according to claim 1, characterized in that: The first circuit board includes a main body and a solder pad connected to the main body; In the width direction of the first circuit board, the ratio between the first width dimension of the main body and the second width dimension of the largest electronic component is between 1.8 and 2; the second width dimension is the distance between the first side and the second side.

3. The flexible circuit board according to claim 1, wherein: When the flexible circuit board is in a bent state, an orthographic projection of the first electronic component on the first circuit board exists between the orthographic projections of two adjacent second electronic components on the first circuit board; The orthographic projection of the bonding structure on the first circuit board is located between the orthographic projection of the first electronic component on the first circuit board and the orthographic projection of the second electronic component on the first circuit board.

4. The flexible circuit board according to claim 1, wherein: The flexible circuit board includes an alignment printed line; the alignment printed line and the bonding structure bonded thereto are arranged on different circuit boards; When the flexible circuit board is in a bent state, the edge of the alignment line overlaps with the outline of the bonding structure.

5. The flexible circuit board according to claim 1, wherein: The flexible circuit board further includes a connecting portion; the first circuit board and the second circuit board are connected via the connecting portion, and the first circuit board, the second circuit board and the connecting portion form an integrated structure.

6. The flexible circuit board according to claim 1, wherein: When the flexible circuit board is in a bent state, in the first direction, the first distance between the first electronic component and the second circuit board is between 0.2 mm and 0.4 mm; in the first direction, the second distance between the second electronic component and the first circuit board is between 0.2 mm and 0.4 mm.

7. The flexible circuit board according to claim 1, wherein: The flexible circuit board also includes a connector; the connector is connected to one end of the first circuit board; the connector is used to connect to a printed circuit board.

8. A display device comprising a display panel and the flexible circuit board according to any one of claims 1 to 7.

Images