Wafer Carrying and Fixing Device and Thin Film Deposition Equipment

Abstract

The present invention relates to a wafer carrier and fixing device, which mainly comprises a carrier plate, a first cover ring and a second cover ring. The carrier plate includes a carrying surface for carrying a wafer. The second cover ring is connected to the first cover ring and is placed inside the first cover ring. The circumference of the first cover ring is greater than that of the second cover ring, and the first cover ring is used to carry the second cover ring. When the carrier plate moves towards the first cover ring and the second cover ring, the second cover ring will contact the wafer on the carrier plate to fix the wafer on the carrying surface of the carrier plate, and a thin film deposition process can be performed on the wafer.

Description

Technical Field

[0001] The present invention relates to a wafer carrier fixing device, and more particularly to a thin film deposition apparatus using the wafer carrier fixing device for fixing a wafer on a carrier and performing a thin film deposition process on the wafer. Background Art

[0002] Chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD) are all commonly used thin film deposition apparatuses and are widely used in processes such as integrated circuits, light emitting diodes, and displays.

[0003] The deposition apparatus mainly includes a chamber and a wafer carrier. The wafer carrier is located in the chamber and is used to carry at least one wafer. Taking physical vapor deposition as an example, a target needs to be provided in the chamber, and the target faces the wafer on the wafer carrier. During physical vapor deposition, the wafer is fixed on the wafer carrier by a fixing device, and an inert gas and / or a reaction gas are transported into the chamber. A bias voltage is applied to the target and the wafer carrier respectively. The wafer carrier also heats the carried wafer. The inert gas in the chamber forms ionized inert gas due to the action of a high-voltage electric field. The ionized inert gas is attracted by the bias voltage on the target and bombards the target. The target atoms or molecules sputtered from the target are attracted by the bias voltage on the wafer carrier and deposited on the surface of the heated wafer to form a thin film on the surface of the wafer.

[0004] Generally, the thin film deposition apparatuses manufactured by semiconductor equipment manufacturers are usually only applicable to wafers of a single size. If wafers of different sizes need to be deposited, it is often necessary to significantly modify the structure of the thin film deposition apparatus or purchase thin film deposition apparatuses of different specifications. This not only causes inconvenience in use but also significantly increases the cost of the process. Summary of the Invention

[0005] As described in the prior art, conventional thin film deposition apparatuses can usually only deposit wafers of a single size, which causes inconvenience in use and may significantly increase the cost of the process. Therefore, the present invention provides a novel wafer carrier fixing device and a thin film deposition apparatus using the wafer carrier fixing device, which can be used to fix wafers of two or more sizes on the carrier and perform deposition, which is beneficial to improving the applicable range of the wafer carrier fixing device and the thin film deposition apparatus and can reduce the cost of the process.

[0006] An object of the present invention is to provide a wafer carrier fixing device, which mainly includes a carrier plate, a first retaining ring and a second retaining ring, wherein the carrier plate is used to carry at least one wafer. The first retaining ring is used to carry the second retaining ring, wherein the circumference or radius of the second retaining ring is smaller than that of the first retaining ring, and it is placed inside the first retaining ring. When the carrier plate drives the carried wafer to approach the second retaining ring, the second retaining ring will contact the wafer and fix the wafer on the carrier plate.

[0007] In practical applications, the second retaining ring can be removed from the first retaining ring, and the first retaining ring with a larger radius or circumference can be used to fix a larger-sized wafer on the carrier plate. In addition, when the second retaining ring is placed on the first retaining ring, the second retaining ring with a smaller radius or circumference can be used to fix a smaller-sized wafer on the carrier plate, so that the wafer carrier fixing device is applicable to fixing two different-sized wafers and can be used for thin film deposition on two different-sized wafers. In addition, the weight of the second retaining ring is less than that of the first retaining ring or the sum of the first and second retaining rings, which can avoid damaging the wafer when fixing the wafer on the carrier plate.

[0008] An object of the present invention is to provide a wafer carrier fixing device, which mainly includes a carrier plate and a carrier member, wherein a carrying surface of the carrier plate is used to carry at least one wafer, and the carrier member is arranged on the carrier plate and located below the wafer.

[0009] The carrier member is connected to at least one lifting unit, and the lifting unit drives the carrier member to displace relative to the carrier plate. When the lifting unit drives the carrier member away from the carrier plate, the carrier member will drive the wafer away from the carrying surface of the carrier plate, which is beneficial for taking the wafer on the carrier member by a robotic arm or placing the wafer on the carrier member. Then the lifting unit can drive the carrier member to displace towards the carrier plate and place the wafer on the carrying surface of the carrier plate.

[0010] To achieve the above object, the present invention provides a wafer carrier fixing device for carrying and fixing at least one wafer, including: a carrier plate including a carrying surface for carrying the wafer; a first retaining ring located above the carrier plate; and a second retaining ring connected to the first retaining ring and placed inside the first retaining ring, wherein the circumference of the first retaining ring is larger than that of the second retaining ring and is used to carry the second retaining ring, and when the carrier plate displaces towards the second retaining ring, the second retaining ring will contact the wafer.

[0011] The present invention provides a thin film deposition apparatus, comprising: a chamber including an accommodation space; at least one baffle located in the accommodation space of the chamber, wherein one end of the baffle has an annular flange and an opening is formed inside the annular flange; a wafer carrier fixing device located in the accommodation space and used for carrying at least one wafer, comprising: a carrier plate including a carrying surface for carrying the wafer; a first cover ring disposed on the annular flange of the baffle; and a second cover ring connected to the first cover ring and placed on an inner side of the first cover ring, wherein the circumference of the first cover ring is greater than that of the second cover ring and is used for carrying the second cover ring; and a support member connected to and driving the carrier plate to displace relative to the baffle, wherein when the support member drives the carrier plate to displace towards the baffle, the second cover ring will contact the wafer.

[0012] The wafer carrier fixing device or the thin film deposition apparatus as described above comprises: a carrying member disposed on the carrier plate and located below the wafer; and at least one lifting unit connected to the carrying member and used for driving the carrying member to displace relative to the carrier plate, wherein when the lifting unit drives the carrying member away from the carrier plate, the carrying member will drive the wafer away from the carrying surface of the carrier plate.

[0013] The wafer carrier fixing device or the thin film deposition apparatus as described above, wherein the carrying member comprises a first carrying portion and a second carrying portion, the first carrying portion includes a notch, and the second carrying portion is located in the notch, and the lifting unit is connected to and drives the first carrying portion and the wafer to displace relative to the carrier plate.

[0014] The wafer carrier fixing device or the thin film deposition apparatus as described above, wherein the first cover ring includes at least one first alignment portion, and the second cover ring includes at least one second alignment portion. When the second cover ring is connected to the first cover ring, the second alignment portion will align with the first alignment portion to align the second cover ring and the first cover ring.

[0015] The wafer carrier fixing device or the thin film deposition apparatus as described above comprises an annular member connected to the carrier plate, the annular member being located around the carrying surface of the carrier plate, wherein the annular member and the first cover ring include at least one corresponding alignment portion for aligning the annular member and the first cover ring.

[0016] The thin film deposition apparatus as described above, wherein the carrying member comprises a first carrying portion and a second carrying portion, the chamber includes a wafer inlet and outlet, the first carrying portion includes a notch facing the wafer inlet and outlet, the second carrying portion is located in the notch, and the lifting unit is connected to and drives the first carrying portion and the wafer to displace relative to the carrier plate.

[0017] The beneficial effects of the present invention are: to provide a novel wafer carrier fixing device and a thin film deposition apparatus applying the wafer carrier fixing device, which can be used to fix wafers of two or more sizes on the carrier plate and perform deposition, is beneficial to improving the applicable range of the wafer carrier fixing device and the thin film deposition apparatus, and can reduce the cost of the process. Brief Description of the Drawings

[0018] Figure 1 FIG. 1 is an exploded perspective view of an embodiment of the wafer carrier and fixing device of the present invention.

[0019] Figure 2 FIG. 2 is an exploded enlarged view of a part of the structure of an embodiment of the wafer carrier and fixing device of the present invention.

[0020] Figure 3 FIG. 3 is an exploded enlarged view of a part of the structure of another embodiment of the wafer carrier and fixing device of the present invention.

[0021] Figures 4 to 6 FIG. 4 is a schematic diagram of the operation flow of an embodiment of the wafer carrier and fixing device of the present invention.

[0022] Figure 7 FIG. 5 is a cross-sectional schematic diagram of an embodiment of the thin film deposition equipment of the present invention.

[0023] Description of the reference numerals: 10 - wafer carrier and fixing device; 11 - carrier plate; 111 - carrying surface; 12 - wafer; 13 - first cover ring; 130 - first opening; 131 - upper surface; 132 - lower surface; 133 - first groove; 135 - first protrusion; 137 - flange; 139 - third protrusion; 15 - second cover ring; 150 - second opening; 151 - lower surface; 153 - second groove; 155 - second protrusion; 17 - annular member; 171 - third groove; 191 - lifting unit; 193 - carrying member; 1931 - first carrying part; 1932 - notch; 1933 - second carrying part; 1934 - gap; 20 - thin film deposition equipment; 21 - cavity; 211 - air inlet; 215 - loading and unloading port; 22 - accommodating space; 23 - support member; 26 - target; 27 - baffle; 271 - annular flange. Detailed Description of the Invention

[0024] Please refer to Figure 1 and Figure 2 , which are respectively an exploded perspective view and an exploded enlarged view of a part of the structure of an embodiment of the wafer carrier and fixing device of the present invention. As shown in the figure, the wafer carrier and fixing device 10 is used to carry and fix at least one wafer 12, and mainly includes at least one carrier plate 11, a first cover ring 13 and a second cover ring 15, wherein the first cover ring 13 and the second cover ring 15 are located above the carrier plate 11 and the wafer 12.

[0025] The carrier plate 11 includes a carrying surface 111 for carrying the wafer 12. The top views of the first cover ring 13 and the second cover ring 15 are annular, and the maximum circumference and / or maximum radius of the first cover ring 13 are greater than the maximum circumference and / or maximum radius of the second cover ring 15. The second cover ring 15 is located above the first cover ring 13, and the first cover ring 13 carries the second cover ring 15. When the carrier plate 11 is displaced towards the first cover ring 13 and / or the second cover ring 15, the second cover ring 15 will contact the edge of the wafer 12 carried by the carrier plate 11 and fix the wafer 12 on the carrying surface 111 of the carrier plate 11.

[0026] Specifically, the first cover ring 13 includes a first opening 130, and the second cover ring 15 includes a second opening 150. The radius, circumference, and / or area of the first opening 130 are greater than those of the second opening 150, and the maximum radius and / or maximum circumference of the second cover ring 15 are greater than the first opening 130. Therefore, the second cover ring 15 can be set or placed inside the first cover ring 13. When the second cover ring 15 is placed on the first cover ring 13, the inner side of a part of the second cover ring 15 will protrude from the inner side of the first cover ring 13 and cover a part of the first opening 130. For example, a part of the second cover ring 15 protrudes radially inward towards the first cover ring 13.

[0027] The weight of the second cover ring 15 is less than the sum of the first cover ring 13 and the combination of the first cover ring 13 and the second cover ring 15. The force exerted by the second cover ring 15 on the wafer 12 is small, which can prevent the wafer 12 from being under excessive pressure and resulting in breakage. Therefore, the wafer carrier fixing device 10 described in the present invention is particularly suitable for fixing the wafer 12 with a relatively thin thickness on the carrier plate 11.

[0028] In an embodiment of the present invention, the first cover ring 13 includes at least one first alignment portion, and the second cover ring 15 includes at least one second alignment portion. When the second cover ring 15 is placed on the first cover ring 13, the second alignment portion will align with the first alignment portion to align the second cover ring 15 and the first cover ring 13.

[0029] As Figure 2 shown, the first alignment portion of the first cover ring 13 includes at least one first groove 133 and / or at least one first protrusion 135, where the first groove 133 and / or the first protrusion 135 are disposed on the upper surface 131 of the first cover ring 13. The second alignment portion of the second cover ring 15 includes at least one second groove 153 and / or at least one second protrusion 155, where the second groove 153 and / or the second protrusion 155 are disposed on the lower surface 151 of the second cover ring 15. For example, the first groove 133 and the second groove 153 are annular grooves, and the first protrusion 135 and the second protrusion 155 are annular protrusions.

[0030] The first groove 133 and / or the first protrusion 135 of the first cover ring 13 respectively correspond to the second protrusion 155 and / or the second groove 153 of the second cover ring 15. The cross-sectional shapes of the first groove 133 and the second protrusion 155 are similar, and the cross-sectional shapes of the second groove 153 and the first protrusion 135 are similar. For example, the opening area of the second groove 153 is larger than the bottom area, and the bottom area of the first protrusion 135 is larger than the end area. The first protrusion 135 and the second groove 153 have at least one inclined surface. When the second cover ring 15 is placed on the first cover ring 13, the first groove 133, the first protrusion 135, the second protrusion 155 and / or the second groove 153 can guide the second cover ring 15 to the fixed position of the first cover ring 13 to complete the connection between the first cover ring 13 and the second cover ring 15.

[0031] In addition, at least one flange 137 and at least one third protrusion 139 may be provided on the lower surface 132 of the first cover ring 13, and the flange 137 and the third protrusion 139 may be annular protrusions. In an embodiment of the present invention, the flange 137 connects to the outer edge of the first cover plate 13, and the third protrusion 139 is located inside the flange 137.

[0032] In actual application, the second cover ring 15 can be placed on the first cover ring 13, and the smaller-sized wafer 12 can be fixed on the carrier plate 11 through the second cover ring 15. In addition, the second cover ring 15 can also be removed from the first cover ring 13, and the larger-sized wafer 12 can be fixed on the carrier plate 11 through the first cover ring 13. When the larger-sized wafer 12 is fixed on the carrier plate 11 with the first cover ring 13, it may be necessary to replace the carrier plate 11 or configure additional components on the carrier plate 11.

[0033] In an embodiment of the present invention, the wafer carrier fixing device 10 may include an annular member 17, where the annular member 17 is connected to the carrier plate 11 and is located around the bearing surface 111 of the carrier plate 11 and / or the wafer 12. For example, the annular member 17 can be sleeved on a part of the carrier plate 11, as Figure 2 shown.

[0034] The annular member 17 and the first cover ring 13 include at least one corresponding alignment portion to align the annular member 17 and the first cover ring 13. For example, the upper surface of the annular member 17 may include at least one third groove 171, where the third groove 171 corresponds to the third protrusion 139 of the first cover ring 13 and is used to guide the first cover ring 13 and the second cover ring 15 to the fixed position of the carrier plate 11, so that the second cover ring 15 contacts and fixes the wafer 12 on the carrier plate 11.

[0035] In an embodiment of the present invention, the wafer carrier fixing device 10 may include at least one lifting unit 191 and a carrier member 193. The carrier member 193 is disposed on the carrier plate 11 and is located below the wafer 12 carried by the carrier plate 11. For example, the appearance of the carrier member 193 may be annular and is located inside the annular member 17. The lifting unit 191 is connected to the carrier member 193 and the carrier plate 11 and is used to drive the carrier member 193 to displace relative to the carrier plate 11. For example, the lifting unit 191 can extend relative to the carrying surface 111 of the carrier plate 11 and drive the carrier member 193 away from the carrier plate 11, so as to drive the wafer 12 away from the carrying surface 111 of the carrier plate 11 through the carrier member 193.

[0036] In another embodiment of the present invention, as Figure 3 shown, the lifting unit 191 is connected to the carrier plate 11 and is located below the wafer 12 carried by the carrier plate 11. The lifting unit 191 can extend relative to the carrying surface 111 of the carrier plate 11 and drive the wafer 12 away from the carrying surface 111 of the carrier plate 11. In this way, it is not necessary to provide the carrier member 193.

[0037] In actual application, as Figure 2 and Figure 4 shown, the first cover ring 13 can be placed on a stopper 27, and one end of the stopper 27 can form an annular flange 271. The annular flange 271 of the stopper 27 is located between the flange 137 and the third convex portion 139 of the first cover ring 13 and is used to carry the first cover ring 13.

[0038] The carrier plate 11 is connected to a support member 23, and the support member 23 is used to drive the carrier plate 11 to displace relative to the stopper 27 and the first cover ring 13 and the second cover ring 15 carried thereon. As Figure 5 shown, the second cover ring 15 contacts the wafer 12 carried by the carrier plate 11 and fixes the wafer 12 on the carrier plate 11.

[0039] In an embodiment of the present invention, as Figure 6 shown, after the support member 23 drives the carrier plate 11 away from the stopper 27, the first cover ring 13 and the second cover ring 15, the lifting unit 191 can further drive the carrier member 193 away from the carrier plate 11, so that the carrier member 193 lifts the wafer 12 originally located on the carrying surface 111 of the carrier plate 11 and forms a gap 1934 between the wafer 12 and the carrying surface 111 of the carrier plate 11. A robotic arm (not shown) can extend into the gap 1934 and is located below the wafer 12 to take out the wafer 12 on the carrier member 193 or place the wafer 12 on the carrier member 193.

[0040] After the robotic arm places the wafer 12 on the carrier member 193, the lifting unit 191 drives the carrier member 193 and the wafer 12 carried thereon to displace towards the carrying surface 111 of the carrier plate 11, so as to place the wafer 12 on the carrying surface 111 of the carrier plate 11, as Figure 4 shown.

[0041] In another embodiment of the present invention, the carrier member 193 includes a first carrier portion 1931 and a second carrier portion 1933. The first carrier portion 1931 includes a notch 1932, and the second carrier portion 1933 is located within the notch 1932. Specifically, the outer appearance of the carrier member 193 can be annular, and the first carrier portion 1931 and the second carrier portion 1933 are partially annular structures. When the second carrier portion 1933 is located within the notch 1932 of the first carrier portion 1931, the two will form an annular carrier member 193.

[0042] In addition, the lifting unit 191 is only connected to the first carrier portion 1931. The lifting unit 191 can drive the first carrier portion 1931 and the wafer 12 away from the carrying surface 111 of the carrier plate 11, so as to facilitate the robotic arm to pick up the wafer 12 through the notch 1932 of the first carrier portion 1931, or place the wafer 12 on the first carrier portion 1931 through the notch 1932.

[0043] Please refer to Figure 7 , which is a schematic cross-sectional view of an embodiment of the thin film deposition device of the present invention. As shown in the figure, the thin film deposition device 20 includes at least one wafer carrier fixing device 10 and a cavity 21. The cavity 21 includes an accommodation space 22, and the wafer carrier fixing device 10 is located within the accommodation space 22 and is used to carry at least one wafer 12.

[0044] As Figure 1 shown, the wafer carrier fixing device 10 mainly includes at least one carrier plate 11, a first cover ring 13 and a second cover ring 15. The first cover ring 13 and the second cover ring 15 are located above the carrier plate 11 and the wafer 12. The top views of the first cover ring 13 and the second cover ring 15 are annular, and the maximum circumference and / or maximum radius of the first cover ring 13 is greater than the maximum circumference and / or maximum radius of the second cover ring 15.

[0045] At least one stopper 27 is disposed within the accommodation space 22 of the cavity 21. One end of the stopper 27 is connected to the cavity 21, and the other end forms an opening. In an embodiment of the present invention, the end of the stopper 27 not connected to the cavity 21 can form an annular flange 271, and an opening is formed inside the annular flange 271. The annular flange 271 of the stopper 27 is used to carry the first cover ring 13, and the first cover ring 13 is used to carry the second cover ring 15.

[0046] In an embodiment of the present invention, the thin film deposition apparatus 20 may be a physical vapor deposition apparatus, and a target 26 is disposed in the cavity 21, wherein the target 26 faces the carrier plate 11 and / or the wafer 12. The cavity 21 is provided with at least one gas inlet 211, wherein the gas inlet 211 is fluidly connected to the accommodation space 22 of the cavity 21 and is used to transport a process gas into the accommodation space 22 to perform a deposition process. For example, the process gas may be an inert gas or a reactive gas. In addition, an air extraction port may be provided on the cavity 21, and the gas in the cavity 21 is extracted through the air extraction port by a pump.

[0047] The cavity 21 may include a loading and unloading port 215, and the wafer 12 may be transported into the cavity 21 through the loading and unloading port 215 by a robotic arm, or the wafer 12 in the cavity 21 may be taken out through the loading and unloading port 125.

[0048] In an embodiment of the present invention, the carrier plate 11 is connected to a support member 23, wherein the support member 23 is used to drive the carrier plate 11 to displace relative to the stopper 27, the first cover ring 13 and the second cover ring 15. As Figure 5 shown, the support member 23 drives the carrier plate 11 to displace towards the stopper 27, so that the second cover ring 15 contacts the wafer 12 carried by the carrier plate 11 to fix the wafer 12 on the carrier plate 11.

[0049] As Figure 6 and Figure 7 shown, after the support member 23 drives the carrier plate 11 away from the stopper 27, the first cover ring 13 and the second cover ring 15, the lifting unit 191 can further drive the carrier member 193 or the first carrier portion 1931 away from the carrier plate 11, so that the carrier member 193 or the first carrier portion 1931 lifts the wafer 12 originally located on the bearing surface 111 of the carrier plate 11, and a gap 1934 is formed between the wafer 12 and the bearing surface 111 of the carrier plate 11, which is beneficial to taking out the wafer 12 carried by the carrier member 193 or the first carrier portion 1931 from the cavity 21 through the loading and unloading port 125 by a robotic arm (not shown), or placing the wafer 12 on the carrier member 193 or the first carrier portion 1931 through the loading and unloading port 125.

[0050] After the robotic arm places the wafer 12 on the carrier member 193 or the first carrier portion 1931, the lifting unit 191 drives the carrier member 193 and the wafer 12 carried thereon to displace towards the bearing surface 111 of the carrier plate 11 to place the wafer 12 on the bearing surface 111 of the carrier plate 11, as Figure 4 shown.

[0051] Advantages of the present invention:

[0052] Provided is a novel wafer carrier fixing device and a thin film deposition apparatus using the same, which can be used to fix wafers of two or more sizes on a carrier plate and perform deposition, facilitating the improvement of the applicable range of the wafer carrier fixing device and the thin film deposition apparatus, and reducing the process cost.

[0053] The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the shape, structure, features and spirit described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A wafer carrier and fixing device for carrying and fixing large-sized or small-sized wafers, characterized in that, Comprising: A carrier plate including a carrying surface for carrying the wafer; A carrying member disposed on the carrier plate and located below the wafer, wherein the carrying member includes a first carrying portion and a second carrying portion, the first carrying portion includes a notch, and the second carrying portion is located within the notch; At least one lifting unit connected to the carrying member and configured to drive the first carrying portion and the wafer to displace relative to the carrier plate, so that the wafer leaves the carrying surface of the carrier plate; A first cover ring located above the carrier plate; And A second cover ring connected to the first cover ring and placed on the first cover ring, wherein the circumference of the first cover ring is greater than that of the second cover ring and is configured to carry the second cover ring. When the carrier plate carries a small-sized wafer and displaces towards the second cover ring, the second cover ring will contact the small-sized wafer; or when the second cover ring is removed from the first cover ring and the carrier plate carries a large-sized wafer and displaces towards the first cover ring, the first cover ring will contact the large-sized wafer.

2. The wafer carrier and fixing device according to claim 1, characterized in that, Wherein the first cover ring includes at least one first alignment portion, and the second cover ring includes at least one second alignment portion. When the second cover ring is connected to the first cover ring, the second alignment portion will align with the first alignment portion to align the second cover ring and the first cover ring.

3. The wafer carrier and fixing device according to claim 1, characterized in that, Comprising an annular member connected to the carrier plate, the annular member being located around the carrying surface of the carrier plate, wherein the annular member and the first cover ring include at least one corresponding alignment portion for aligning the annular member and the first cover ring.

4. A thin film deposition device, characterized in that, Comprising: A cavity including an accommodating space; At least one stopper located within the accommodating space of the cavity, wherein one end of the stopper has an annular flange and an opening is formed inside the annular flange; A wafer carrying and fixing device located within the accommodating space and configured to carry a large-sized or small-sized wafer, including: A carrier plate including a carrying surface for carrying the wafer; A carrying member disposed on the carrier plate and located below the wafer, wherein the carrying member includes a first carrying portion and a second carrying portion, the first carrying portion includes a notch, and the second carrying portion is located within the notch; At least one lifting unit connected to the carrying member and configured to drive the first carrying portion and the wafer to displace relative to the carrier plate, so that the wafer leaves the carrying surface of the carrier plate; A first cover ring disposed on the annular flange of the stopper; and A second cover ring connected to the first cover ring and placed on the first cover ring, wherein the circumference of the first cover ring is greater than that of the second cover ring and is configured to carry the second cover ring. When the carrier plate carries a small-sized wafer and displaces towards the second cover ring, the second cover ring will contact the small-sized wafer; or when the second cover ring is removed from the first cover ring and the carrier plate carries a large-sized wafer and displaces towards the first cover ring, the first cover ring will contact the large-sized wafer; and A support member connected to and driving the carrier plate to displace relative to the stopper, wherein when the support member drives the carrier plate to displace towards the stopper, the second cover ring will contact the wafer.

5. The thin film deposition device according to claim 4, characterized in that, Comprising: A carrying member disposed on the carrier plate and located below the wafer; And At least one lifting unit, connected to the carrying member and used to drive the carrying member to displace relative to the carrying plate, wherein when the lifting unit drives the carrying member away from the carrying plate, the carrying member will drive the wafer away from the carrying surface of the carrying plate.

6. The thin film deposition device according to claim 5, characterized in that, Wherein the carrying member includes a first carrying portion and a second carrying portion, the cavity includes a wafer inlet and outlet, the first carrying portion includes a notch facing the wafer inlet and outlet, the second carrying portion is located within the notch, and the lifting unit is connected to and drives the first carrying portion and the wafer to displace relative to the carrying plate.

7. The thin film deposition device according to claim 4, characterized in that, Wherein the first cover ring includes at least one first alignment portion, and the second cover ring includes at least one second alignment portion. When the second cover ring is connected to the first cover ring, the second alignment portion will align with the first alignment portion to align the second cover ring and the first cover ring.

8. The thin film deposition device according to claim 4, characterized in that, It includes an annular member connected to the carrying plate, the annular member is located around the carrying surface of the carrying plate, wherein the annular member and the first cover ring include at least one corresponding alignment portion for aligning the annular member and the first cover ring.

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