Implantable medical device including electrodes formed therein

Abstract

Embodiments of the present disclosure relate to implantable medical devices. According to an exemplary embodiment, a method for forming an electrode on an implantable medical device (IMD) includes forming a non-conductive body having a well with a bottom surface and at least one side extending from the bottom surface. The method also includes forming a conduit through the bottom surface and inserting the non-conductive body into an opening on an outer surface of the IMD. The method also includes depositing a conductive material into the well and coupling the conductive material to circuitry of the IMD via the conduit through the bottom surface of the well.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to provisional application No. 62 / 976,080, filed February 13, 2020, which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present disclosure relate to medical devices and systems for sensing physiological parameters and / or delivering therapy. More particularly, embodiments of the present disclosure relate to devices and methods for forming electrodes with non-conductive bodies. Background Art

[0004] An implantable medical device (IMD) can be configured to sense physiological parameters and / or provide therapy and can include one or more electrodes for performing various aspects of these functions. An IMD can also include an antenna for communicating with other devices. Conventionally, devices such as programmers and control wands have been used to cause an IMD to take various actions, such as, for example, marking a record of a physiological parameter, initiating communication with other devices, and the like. Summary of the Invention

[0005] Exemplary embodiments of the present disclosure include, but are not limited to, the following examples.

[0006] In Example 1, a method for forming an electrode on an implantable medical device (IMD) includes: forming a non-conductive body comprising a well having a bottom surface and at least one side extending from the bottom surface; forming a conduit through the bottom surface; inserting the non-conductive body into an opening in an outer surface of the IMD; depositing a conductive material into the well; and coupling the conductive material to a circuit of the IMD via the conduit through the bottom surface of the well.

[0007] In Example 2, the method of Example 1, wherein coupling the conductive material to the circuit of the IMD includes soldering a wire coupling the conductive material to the circuit.

[0008] In Example 3, the method of any of Examples 1 or 2, wherein at least one side surface extends perpendicularly from the bottom surface.

[0009] In Example 4, the method described in any one of Examples 1-3 further includes surface grinding the top of the non-conductor, the conductive material, or the non-conductor and the conductive material to remove excess portions of the non-conductor, the conductive material, or the non-conductor and the conductive material.

[0010] In Example 5, the method described in any one of Examples 1-4 further includes laser etching the top of the non-conductor, the conductive material, or the non-conductor and the conductive material to remove excess portions of the non-conductor, the conductive material, or the non-conductor and the conductive material.

[0011] In Example 6, the method of any of Examples 1-5 further includes applying a mask to the conductive material to remove any excess portions of the conductive material.

[0012] In Example 7, the method of any of Examples 1-6, wherein depositing the conductive material into the well comprises using photolithography and / or vapor deposition techniques.

[0013] In Example 8, the method of any of Examples 1-7, wherein the conductive material is titanium nitride (TiN).

[0014] In Example 9, the method of any of Examples 1-8, wherein the non-conductive body is made of ceramic, glass, or sapphire.

[0015] In Example 10, the method of any of Examples 1-9, wherein the well is about 0.1 to 1 mm deep.

[0016] In Example 11, the method of any of Examples 1-10, wherein an outer diameter of the non-conductive body is approximately 1.1 to 1.5 times the diameter of the bottom surface.

[0017] In Example 12, an implantable medical device (IMD) includes: a housing enclosing a power source, a processing device, and a memory; a non-conductive body disposed in an opening of the housing, the non-conductive body including a well having a bottom surface and at least one side extending from the bottom surface; and a conductive material deposited in the well, wherein the conductive material is electrically coupled to the processing device.

[0018] In Example 13, the IMD of Example 12, wherein the top surface of the conductive material is flush with the top surface of the housing, wherein the top surface of the conductive material is flush with the top surface of the non-conductive body, or wherein the top surface of the conductive material is flush with the top surface of the housing and the top surface of the non-conductive body.

[0019] In Example 14, the IMD of any of Examples 12 or 13, wherein at least one side surface extends perpendicularly from the bottom surface.

[0020] In Example 15, the IMD of any of Examples 12 or 13, wherein the non-conductive body is made of ceramic, glass, or sapphire.

[0021] In Example 16, a method for forming an electrode on an implantable medical device (IMD) includes: forming a non-conductive body comprising a well having a bottom surface and at least one side extending from the bottom surface; forming a conduit through the bottom surface; inserting the non-conductive body into an opening in an outer surface of the IMD; depositing a conductive material into the well; and coupling the conductive material to a circuit of the IMD via the conduit through the bottom surface of the well.

[0022] In Example 17, the method of Example 16, wherein coupling the conductive material to the circuit of the IMD comprises soldering a wire coupling the conductive material to the circuit.

[0023] In Example 18, the method of Example 16, wherein at least one side surface extends perpendicularly from the bottom surface.

[0024] In Example 19, the method of Example 16 further includes surface grinding the top of the non-conductor, the conductive material, or the non-conductor and the conductive material to remove excess portions of the non-conductor, the conductive material, or the non-conductor and the conductive material.

[0025] In Example 20, the method of Example 16 further includes laser cleaning the top of the non-conductor, the conductive material, or the non-conductor and the conductive material to remove excess portions of the non-conductor, the conductive material, or the non-conductor and the conductive material.

[0026] In Example 21, the method of Example 16 further includes applying a mask to the conductive material to remove any excess portions of the conductive material.

[0027] In Example 22, the method of Example 16, wherein depositing the conductive material into the well includes using photolithography and / or vapor deposition techniques.

[0028] In Example 23, the method of Example 16, wherein the conductive material is titanium nitride (TiN).

[0029] In Example 24, the method of Example 16, wherein the non-conductive body is made of ceramic, glass, or sapphire.

[0030] In Example 25, the method of Example 16, wherein the well is about 0.1 to 1 mm deep.

[0031] In Example 26, the method of Example 16, wherein an outer diameter of the non-conductive body is approximately 1.1 to 1.5 times the diameter of the bottom surface.

[0032] In Example 27, an implantable medical device (IMD) includes: a housing enclosing a power source, a processing device, and a memory; a non-conductive body disposed in an opening in the housing, the non-conductive body including a well having a bottom surface and at least one side extending from the bottom surface; and a conductive material deposited in the well, wherein the conductive material is electrically coupled to the processing device.

[0033] In Example 28, the IMD of Example 27, wherein the top surface of the conductive material is flush with the top surface of the housing, wherein the top surface of the conductive material is flush with the top surface of the non-conductive body, or wherein the top surface of the conductive material is flush with the top surface of the housing and the top surface of the non-conductive body.

[0034] In Example 29, the IMD of Example 27, wherein the at least one side surface extends perpendicularly from the bottom surface.

[0035] In Example 30, the IMD of Example 27, wherein the non-conductive body is made of ceramic, glass, or sapphire.

[0036] In Example 31, the IMD of Example 27, wherein the conductive material is titanium nitride (TiN).

[0037] In Example 32, a method for forming an antenna on an implantable medical device (IMD) includes: forming an elongated non-conductive body; forming a conduit through the non-conductive body; inserting the non-conductive body into an opening on an outer surface of the IMD; depositing a conductive material on the non-conductive body, wherein the conductive material is deposited in a non-linear path; and coupling the conductive material to a circuit of the IMD via the conduit through the non-conductive body.

[0038] In Example 33, the method of Example 32 further includes surface grinding or laser etching the top of the non-conductor, the conductive material, or the non-conductor and the conductive material to remove excess portions of the non-conductor, the conductive material, or the non-conductor and the conductive material.

[0039] In Example 34, the method of Example 32, wherein the non-conductive body is made of ceramic, glass, or sapphire.

[0040] In Example 35, the method of Example 32, wherein the conductive material is titanium nitride (TiN).

[0041] Although multiple embodiments are disclosed, other embodiments of the present disclosure will become apparent to those skilled in the art from the following detailed description, which shows and describes exemplary embodiments of the subject matter disclosed herein. Accordingly, the drawings and detailed description are to be regarded as illustrative in nature and not restrictive. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 is a schematic diagram of a system having an implantable medical device (IMD) and a receiving device.

[0043] Figure 2 is a perspective view of an IMD according to an embodiment.

[0044] Figure 3A is a schematic diagram of an IMD according to some embodiments.

[0045] Figure 3B yes Figure 3A Schematic diagram of an IMD operating with a receiving device.

[0046] Figure 4is a perspective view of a non-conductive body used to contain electrodes of an IMD according to an embodiment.

[0047] Figure 5A yes Figure 4 A side view of a non-conductive body is shown with conductive material deposited therein.

[0048] Figure 5B yes Figure 5A A side view of the non-conductive body is shown after the deposited conductive material has been smoothed.

[0049] While the subject matter disclosed herein is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and described in detail below. However, it is not intended to limit the disclosure to the specific embodiments described. On the contrary, this disclosure is intended to cover all modifications, equivalents, and alternatives falling within the scope of the subject matter disclosed herein as defined by the appended claims.

[0050] Although the term "block" may be used herein to imply different elements employed illustratively, the term should not be construed to imply any requirement for the various steps disclosed herein or a specific order among or between the various steps disclosed herein unless and except where an order for the individual steps is explicitly mentioned. DETAILED DESCRIPTION

[0051] Implantable medical devices (IMDs) can be used to sense one or more physiological measurements of a subject. To this end, IMDs typically include one or more electrodes attached to an external surface of the IMD. Embodiments disclosed herein provide a more efficient and cost-effective method for incorporating electrodes into an IMD.

[0052] Figure 1 is a schematic diagram of a system 100 including an IMD 102 implanted within a patient's body 104 and configured to communicate with a receiving device 106. In embodiments, the IMD 102 may be implanted subcutaneously within an implantation site or pocket within the patient's chest or abdomen and may be configured to monitor (e.g., sense and / or record) physiological parameters associated with the patient's heart 108. In embodiments, the IMD 102 may be an implantable cardiac monitor (ICM) (e.g., an implantable diagnostic monitor (IDM), an implantable loop recorder (ILR), etc.) configured to record physiological parameters such as, for example, one or more cardiac activation signals, heart sounds, blood pressure measurements, oxygen saturation, and / or the like.

[0053] In some instances, IMD 102 can be configured to monitor physiological parameters, which can include one or more signals indicating the patient's physical activity level and / or metabolic level, such as acceleration signals. In some instances, IMD 102 can be configured to monitor physiological parameters associated with one or more other organs, systems, and / or the like. IMD 102 can be configured to sense and / or record at regular intervals, continuously, and / or in response to detected events. In some instances, such detected events can be detected by one or more sensors of IMD 102, another IMD (not shown), an external device (e.g., receiving device 106), and / or the like.

[0054] In addition, IMD 102 can be configured to detect various physiological signals that can be used in conjunction with various diagnostic, therapeutic, and / or monitoring embodiments. For example, IMD 102 can include sensors or circuits for detecting respiratory system signals, cardiac system signals, and / or signals related to patient activity. In some instances, IMD 102 can be configured to sense intrathoracic impedance, from which various respiratory parameters can be derived, including, for example, respiratory tidal volume and minute ventilation. Sensors and associated circuits can be combined with IMD 102 to detect one or more body motion or body posture and / or position-related signals. For example, accelerometers and / or GPS devices can be used to detect patient activity, patient positioning, body orientation, and / or torso position.

[0055] For purposes of illustration and not limitation, various embodiments of devices that may be used to record physiological parameters according to the present disclosure are described herein in the context of an IMD that is implantable under the skin in the chest region of a patient.

[0056] As shown, IMD 102 may include a housing 110 having two electrodes 112 and 114 coupled thereto. According to certain examples, IMD 102 may include any number of electrodes (and / or other types of sensors, such as, for example, thermometers, barometers, pressure sensors, optical sensors, motion sensors, and / or the like) in any number of various configurations, and housing 110 may include any number of different shapes, sizes, and / or features. In certain examples, IMD 102 may be configured to sense physiological parameters using, for example, electrodes 112, 114, and to record the physiological parameters. For example, IMD 102 may be configured to activate (e.g., periodically, continuously, upon detection of an event, and / or the like), record a specified amount of data (e.g., physiological parameters) in memory, and transmit the recorded data to receiving device 106. For example, in the case of an IMD, IMD 102 may activate, record cardiac signals for a period of time, deactivate, and activate again to transmit the recorded signals to receiving device 106.

[0057] In some instances, the receiving device 106 may be, for example, a programmer, a controller, a patient monitoring system, and / or the like. Figure 1 102, which may be, for example, a control device, another monitoring device, a pacemaker, an implantable defibrillator, a cardiac resynchronization therapy (CRT) device, and / or the like, and may be an implantable medical device known in the art or later developed for providing therapeutic and / or diagnostic data about the patient and / or IMD 102. In some instances, IMD 102 may be a pacemaker, an implantable cardioverter-defibrillator (ICD) device, or a cardiac resynchronization therapy (CRT) device. In some instances, IMD 102 may include both defibrillation and pacing / CRT capabilities (e.g., a CRT-D device).

[0058] According to an embodiment of the present disclosure, the system 100 can be used to implement coordinated patient measurement and / or monitoring, diagnosis and / or treatment. The system 100 can include, for example, one or more internal patient medical devices, such as an IMD 102, and one or more external patient medical devices, such as a receiving device 106. The receiving device 106 can be configured to perform monitoring, and / or diagnostic and / or treatment functions external to the patient (i.e., not invasively implanted in the patient). The receiving device 106 can be positioned on the patient, near the patient, or anywhere external to the patient.

[0059] IMD 102 and receiving device 106 can communicate via a wireless link. For example, IMD 102 and receiving device 106 can be coupled via a short-range radio link such as Bluetooth, IEEE 802.11, and / or a proprietary wireless protocol. The communication link can facilitate one-way and / or two-way communication between IMD 102 and receiving device 106. Data and / or control signals can be sent between IMD 102 and receiving device 106 to coordinate the functions of IMD 102 and / or receiving device 106. Patient data can be downloaded from one or more of IMD 102 and receiving device 106 periodically or upon command. A physician and / or patient can communicate with IMD 102 and receiving device 106, for example, to obtain patient data or to initiate, terminate, or modify a recording and / or treatment.

[0060] Figure 1 The illustrative system 100 shown in is not intended to suggest any limitation as to the scope of use or functionality of embodiments of the subject matter disclosed throughout this disclosure. Nor should the illustrative system 100 be construed as having any Figure 1 100. For example, in embodiments, the illustrative system 100 may include additional components. Additionally, in embodiments, Figure 1 Any one or more components depicted in the drawings may be integrated with various components of the other components depicted therein (and / or components not shown). Any number of other components or combinations of components may be integrated with Figure 1 , all of which are considered within the scope of the present disclosure.

[0061] Figure 2 1 is a perspective view of an IMD 102 according to embodiments disclosed herein. IMD 102 has a first electrode 112, a second electrode 114, and an antenna 204 embedded in housing 110. Each of first electrode 112, second electrode 114, and antenna 204 includes a conductive portion 200 surrounded by a larger non-conductive portion 202 to prevent conductive portion 200 from contacting an outer surface 206 of housing 110 (which may be conductive).

[0062] In some examples, electrodes 112 and 114 and antenna 204 are all located on the same side of outer surface 206, such as on a frontward facing portion 208 or a rearward facing portion 210 of outer surface 206. IMD 102 has a longitudinal axis 212 along which components of IMD 102 are located. Antenna 204 can be configured to wirelessly communicate data with receiving device 106. Housing 110 is made of any suitable material, such as a metal, e.g., titanium, and non-conductive portion 202 is made of any suitable material having non-conductive or insulating properties, such as a ceramic substrate, glass, or sapphire. Non-conductive portion 202 can be transparent, translucent, or opaque, depending on the material used.

[0063] Figure 3A An example of components within an IMD 102 is shown, in accordance with some embodiments. Housing 110 contains a battery 304, a charging coil 306 for wirelessly charging battery 304 using an external charging device 318, assuming battery 304 is rechargeable. If battery 304 is non-rechargeable, charging coil 306 and external charger 318 may be eliminated. IMD 102 also includes control circuitry, such as a microcontroller 308 and / or one or more application-specific integrated circuits (ASICs) 310, as appropriate. The one or more ASICs 310 may include current generation circuitry for providing stimulation pulses at one or more of electrodes 112 and 114, and may also include telemetry modulation and demodulation circuitry for enabling bidirectional wireless communication at antenna 204, battery charging and protection circuitry that may be coupled to charging coil 306, DC blocking capacitors in each current path to electrodes 112 and 114, and the like.

[0064] The components within the housing 110 are integrated via a printed circuit board (PCB) 312, which includes electrical traces (not shown) printed on one or more of the surfaces 300 and 302 of the PCB 312 to electrically couple the various components to each other (as appropriate). For example, the traces can be used to electrically couple control circuitry (e.g., microcontroller 308 and ASIC 310) with electrodes 112, 114 and antenna 204. The traces are made of any suitable conductive material, such as, for example, gold, silver, or a platinum alloy.

[0065] Figure 3BFurther illustrated are external components referenced above (e.g., receiving device 106), which may be used to communicate with IMD 102. Receiving device 106 may include an external charger 318 and an external controller 320. External controller 320 may be used to control and monitor IMD 102 via a bidirectional wireless communication link 324 that passes through patient tissue. For example, external controller 320 may be used to monitor measurements taken by electrodes 112 and 114.

[0066] Communication over wireless communication link 324 may occur via magnetic inductive coupling between an antenna (not shown) in external controller 320 and antenna 204 in IMD 102. The magnetic field comprising link 324 may be modulated via frequency shift keying (FSK) or the like to encode the transmitted data. Other methods may also be employed, including but not limited to short-range RF telemetry (e.g., Bluetooth, WiFi, Zigbee, MICS, etc.).

[0067] When battery 304 is rechargeable, external charger 318 provides power to recharge battery 304. This power transfer may occur by energizing a charging coil (not shown) in external charger 318, which generates magnetic field 322, which then energizes charging coil 306 in IMD 102, which is rectified, filtered, and used to recharge battery 304.

[0068] Furthermore, antenna 204 can be positioned facing the tissue, or positioned closest to the skin side or outside of the patient's body, to minimize or avoid RF interference by having less body tissue through which to transmit wireless data. Furthermore, in some examples, the integrated circuit includes Kelvin connections to first electrode 112 and second electrode 114. In some cases, IMD 102 can include an accelerometer to determine whether IMD 102 has been turned or flipped. The accelerometer can determine periods of electrode inactivity to determine a stable signal and select between first electrode 112 and second electrode 114.

[0069] In some examples, the housing 110 can be formed by combining or bonding two separate housing portions (e.g., one defining the forward-facing portion 208 and the other defining the rear-facing portion 210) into a single assembly. In some examples, the combined portions can be laser welded or ultrasonically welded together to form the housing 110. In some examples, the combined portions can be brazed together using any suitable metal, such as a gold alloy, to form the housing 110. In some examples, the combined portions can be attached together using a suitable adhesive to form the housing 110. In some examples, the combined portions can be shrink-wrapped using any suitable polymer, including but not limited to PVC, polyolefins, polyethylene, and polypropylene, to form the housing 110. In some examples, the housing 110 is sealed using any one or more of the methods outlined above to ensure hermiticity.

[0070] The functions of the first electrode 112 and the second electrode 114 can be controlled by an integrated circuit (e.g., a microcontroller 308 and / or an ASIC 310). For example, the integrated circuit can be configured to select between the first electrode 112 and the second electrode 114. In addition, the integrated circuit can be configured to measure the sensing capability of the first electrode 112 and the sensing capability of the second electrode 114. In some instances, the integrated circuit can be configured to select between the first electrode 112 and the second electrode 114 in response to determining which of the first electrode 112 and the second electrode 114 has a greater sensing capability. The integrated circuit can be configured to measure the impedance on the sensing signal of the first electrode 112 and the impedance on the sensing signal of the second electrode 114 to determine the sensing capability of the first electrode 112 and the sensing capability of the second electrode 114. The integrated circuit configured to select between the first electrode 112 and the second electrode 114 can improve sensing capability and signal capture by selecting the one of the first electrode 112 and the second electrode 114 having a stronger sensing signal.

[0071] Figure 4 An example of a non-conductive body 400 is shown, according to some embodiments, which serves as the non-conductive portion 202 to contain the electrodes 112, 114 or the antenna 204 while insulating these components from the housing 110 of the IMD 102. Specifically, the non-conductive body 400 has an exterior portion defined by a top surface 402 and side surfaces 406. The non-conductive body 400 also includes a well 404 that defines a recess relative to the top surface 402. In some examples, the well 404 is approximately 0.01 mm to 0.1 mm, 0.1 mm to 0.5 mm, 0.5 mm to 1 mm, 1 mm to 2 mm, 3 mm to 4 mm, or 4 mm to 5 mm lower than the top surface 402. The well 404 may also include a conduit 408, which is defined as an opening, hole, or aperture through the non-conductive body 400.

[0072] Although the non-conductive body 400 is shown as circular when viewed from above, it should be understood that the non-conductive body 400 can be formed in any shape or configuration. For example, the non-conductive body 400 can be formed in an elongated oval shape according to the non-conductive portion 202 surrounding the antenna 204, such as Figure 2 When the non-conductive body 400 is elongated and oval in shape, it may or may not include a well defining a recess relative to the top surface 402. In some examples, for example, the outer diameter 410 of the non-conductive body 400 (also referred to as the diameter of the non-conductive portion 202) may be between approximately 1.1 and 1.2 times, 1.2 and 1.5 times, 1.5 and 2 times, 2 and 3 times, or 3 and 5 times the outer diameter 412 of the well 404 (also referred to as the diameter of the conductive portion 200).

[0073] The non-conductor 400 having the well 404 can be made using any insulating material, including but not limited to ceramic, glass, or sapphire. The conduit 408 can then be brazed with a conductive material, such as copper and zinc alloys. In some examples, the housing 110 has an opening in which the non-conductor 400 can be positioned before or after brazing. In an embodiment, one end of the wire is brazed to the conduit 408 and the other end of the wire can be connected to the PCB 312. Alternatively, in some examples, the non-conductor 400 can be brazed directly to the surface 300 of the PCB 312, where electrical traces can be printed on the surface 300 rather than brazed to the wire. After brazing, a conductive material (e.g., titanium nitride (TiN)) to form the conductive portion 200 of the electrode can be deposited or sputtered into the conduit 408 and the well 404 until the top 500 of the conductive material is flush with or protrudes from the top surface 402 of the non-conductor 400, as shown in FIG. Figure 5A shown.

[0074] In an embodiment, the extraneous portion extending beyond the top surface 402 (including the top portion 500) may be smoothed using methods such as laser etching or surface grinding, so that the surface of the conductive portion 200 is substantially flush with the top surface 402 of the non-conductive body 400. Figure 5B As shown. The term "substantially flush" can indicate that the difference between two adjacent surfaces is small enough to be essentially undetectable to the naked eye, or the difference is so small that it has no effect during use of the device. In some examples, the difference can be less than about 1 mm or 0.5 mm. In some examples, the difference can be less than about 0.1 mm, or even less than 0.01 mm.

[0075] In some examples, surface grinding can be achieved by back grinding using a suitable back grinding belt. In some examples, masking can be used as a supplement or alternative to the back grinding method. Alternatively, other methods can be used to deposit the conductive material into the conduit 408 and the well 404. In some examples, semiconductor lithography can be used, which can pattern or define the electrodes or conductive areas 200 more accurately than some other methods. If ceramic is used for the non-conductive body 400, then use Figure 5B The resulting electrodes 112, 114 formed from the non-conductive body 400 retain physical properties similar to ceramics, such as high temperature resistance and hardness, as well as the ability to undergo plastic deformation without cracking or breaking.

[0076] Additionally or alternatively, the antenna 204 and / or the non-conductive body 400 can be made substantially flush with the outer surface 206 (i.e., the front-facing portion 208 or the rear-facing portion 210) of the IMD 102, which allows the IMD 102 to have a smaller profile than if the metal components were directly attached to the outer surface 206 of the IMD 102.

[0077] The illustrative components shown in the figures are not intended to imply any limitation on the scope of use or functionality of the embodiments of the disclosed subject matter. The illustrative components should not be interpreted as having any dependency or requirement related to any single component or combination of components shown therein. Moreover, in embodiments, any one or more components depicted in the figures may be integrated with various other components depicted therein (and / or components not shown), all of which are considered within the scope of the disclosed subject matter.

[0078] Various modifications and additions may be made to the exemplary embodiments discussed without departing from the scope of the present disclosure. For example, while the embodiments described above refer to particular features, the scope of the present disclosure also includes embodiments having different combinations of features and embodiments that do not include all of the described features. Therefore, the scope of the present disclosure is intended to include all such alternatives, modifications, and variations that fall within the scope of the claims, along with all equivalents thereof.

Claims

1. An implantable medical device (IMD), comprising: an enclosure that encloses the power supply, processing equipment, and memory; a non-conductive body disposed in the opening of the housing, the non-conductive body comprising a well having a bottom surface and at least one side surface extending from the bottom surface; a conductive material deposited in the well, wherein the conductive material is electrically coupled to the processing equipment, The bottom surface of the well includes a conduit extending through the non-conductive body and brazed to the conductive material.

2. The IMD of claim 1, wherein: The top surface of the conductive material is flush with the top surface of the housing, wherein the top surface of the conductive material is flush with the top surface of the non-conductive body, or wherein the top surface of the conductive material is flush with the top surface of the housing and the top surface of the non-conductive body.

3. The IMD of claim 1 or 2, wherein: The at least one side surface extends perpendicularly from the bottom surface.

4. The IMD of claim 1 or 2, wherein: The non-conductive body is made of ceramic, glass or sapphire.

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