Polishing pad and polishing method

Abstract

The present invention provides a polishing pad, which is suitable for polishing an object, has a polishing track area and includes a polishing layer and an adhesive layer. The polishing layer has a polishing surface and a roughened bottom surface opposite to each other, wherein the roughened bottom surface includes a plurality of discontinuous indentations. The adhesive layer is adhered to the roughened bottom surface.

Description

Technical Field

[0001] The present invention relates to a polishing pad and a polishing method, and in particular to a polishing pad with improved adhesion to an adhesive layer and a polishing method using the polishing pad. Background Art

[0002] In the component manufacturing process of the industry, the grinding process is a technology that is commonly used today to flatten the surface of the object being ground. During the grinding process, a grinding liquid can be provided between the surface of the object and the grinding pad, and the mechanical friction generated by the relative movement of the object and the grinding pad is used to flatten the surface. The interface between the layers of the grinding pad is usually tightly bonded using an adhesive layer, but during the grinding process, the grinding liquid, waste liquid or heat generated by friction may cause the adhesive layer to deteriorate, deform or reduce viscosity, thereby causing the layers of the grinding pad to separate and affect the stability of the grinding pad.

[0003] Therefore, there is still a need to provide a means to improve the stability of the polishing pad for the industry to choose. Summary of the invention

[0004] The invention provides a polishing pad and a polishing method, so that the polishing pad can have improved stability.

[0005] The polishing pad of the present invention is suitable for polishing an object, has a polishing track area and comprises a polishing layer and an adhesive layer. The polishing layer has a polishing surface and a roughened bottom surface opposite to each other, wherein the roughened bottom surface comprises a plurality of discontinuous indentations. The adhesive layer is adhered to the roughened bottom surface.

[0006] The polishing pad of the present invention is suitable for polishing an object, has a polishing track area and comprises a polishing layer, a base layer and an adhesive layer. The base layer is arranged below the polishing layer, wherein the base layer has a roughened surface, and the roughened surface comprises a plurality of discontinuous indentations. The adhesive layer adheres to the roughened surface.

[0007] The polishing method of the present invention comprises the following steps: providing a polishing pad, wherein the polishing pad is the polishing pad as described above; applying pressure to an object to press it onto the polishing surface of the polishing pad; providing relative movement between the object and the polishing pad to perform a polishing procedure.

[0008] Based on the above, the polishing pad of the present invention includes a polishing layer having a plurality of discontinuous indentations on the bottom surface and an adhesive layer adhered to the bottom surface and filled with the plurality of discontinuous indentations, or a base layer having a plurality of discontinuous indentations on the surface and an adhesive layer adhered to the surface and filled with the plurality of discontinuous indentations, thereby improving the adhesion and adhesion retention between the adhesive layer and the polishing layer, or the adhesion and adhesion retention between the adhesive layer and the base layer. In this way, the polishing pad of the present invention can have improved stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a top view schematically showing a polishing pad and a polishing system according to one embodiment of the present invention;

[0010] Figure 2 is a schematic back view of a polishing pad according to one embodiment of the present invention;

[0011] Figure 3 is along Figure 1 and Figure 2 A schematic cross-sectional view of the middle section line I-I';

[0012] Figure 4 yes Figure 3 A partial enlarged schematic diagram of the polishing pad;

[0013] Figure 5 is along Figure 1 and Figure 2 A schematic cross-sectional view of the middle section line II-II';

[0014] FIG. 6A to FIG. 6D is a schematic back view of a polishing pad according to another embodiment of the present invention;

[0015] Figure 7 is a cross-sectional schematic diagram of a polishing pad according to another embodiment of the present invention;

[0016] Figure 8 is a cross-sectional schematic diagram of a polishing pad according to another embodiment of the present invention;

[0017] Fig. 9 is a flow chart of a grinding method according to another embodiment of the present invention. DETAILED DESCRIPTION

[0018] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0019] As used herein, "about" includes the stated value and the average value within an acceptable deviation range of the particular value determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within, for example, ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, as used herein, "about" can select a more acceptable deviation range or standard deviation depending on the measured property, cutting property or other property, and can apply to all properties without a single standard deviation.

[0020] Figure 1 1 is a top view schematically showing a polishing pad and a polishing system according to one embodiment of the present invention. Figure 2 is a schematic back view of a polishing pad according to one embodiment of the present invention. Figure 3 is along Figure 1 and Figure 2 Schematic cross-section diagram along the middle section line II'. Figure 4 yes Figure 3 A partial enlarged schematic diagram of the polishing pad. Figure 5 is along Figure 1 and Figure 2 Schematic cross-sectional view along the middle section line II-II'.

[0021] Please refer to Figure 1 , the polishing system 1000 includes a polishing pad 100 and an object 200. Figure 1 and Figure 3 The polishing pad 100 includes a polishing layer 102 and an adhesive layer 110, wherein the adhesive layer 110 is disposed below the polishing layer 102. In the present embodiment, the polishing layer 102 is, for example, formed of a polymer substrate, wherein the polymer substrate may be polyester, polyether, polyurethane, polycarbonate, polyacrylate, polybutadiene, or other polymer substrates synthesized by a suitable thermosetting resin or thermoplastic resin, but the present invention is not limited thereto. In addition to the polymer substrate, the polishing layer 102 may further include a conductive material, abrasive particles, microspheres, or soluble additives in the polymer substrate.

[0022] In this embodiment, the polishing layer 102 has a polishing surface 102a. When the polishing pad 100 is used to perform a polishing process on the object 200, the object 200 will contact the polishing surface 102a of the polishing layer 102, and a polishing track will be formed on the polishing layer 102. Figure 1 As shown, when the polishing pad 100 is used to perform a polishing process on the object 200, the polishing track of the object 200 on the polishing surface 102a is located in the polishing track area A. In the embodiment shown, the polishing track area A is distributed throughout the polishing layer 102. However, the present invention is not limited thereto. The polishing pad 100 can be applied to any type of polishing system to polish the object 200, and the position of the object 200 relative to the polishing pad 100 can be determined according to the actual polishing process. In one embodiment, the polishing track area A can be configured in the polishing layer 102 and does not contact the rotation center C and the edge of the polishing pad 100. In another embodiment, the polishing track area A can be configured in the polishing layer 102 and only contact the rotation center C and the edge of the polishing pad 100. In addition, during the polishing process, the polishing pad 100 rotates counterclockwise or clockwise with the rotation center C as the center. The rotation center C is, for example, located at the center point of the polishing pad 100. In addition, during the grinding process, the object 200 is driven by the object carrier (not shown) to move on the grinding surface 102a of the grinding layer 102. That is, during the grinding process, there is a relative movement between the object 200 and the grinding surface 102a of the grinding layer 102. In some embodiments, the object carrier (not shown) drives the object 200 to rotate on the grinding surface 102a of the grinding layer 102. In other embodiments, in addition to driving the object 200 to rotate on the grinding surface 102a of the grinding layer 102, the object carrier (not shown) also drives the object 200 to swing left and right on the grinding surface 102a of the grinding layer 102. In these embodiments, the distance of the swinging movement of the object 200 can be determined according to the actual grinding process. In the above embodiments, the relative movement between the object 200 and the grinding surface 102a of the grinding layer 102 generates a shear force on the grinding surface 102a. In some embodiments, the shear force generated by the object carrier (not shown) carrying the object 200 to perform rotational motion and outward swinging motion on the grinding surface 102a of the grinding layer 102 is a circular cyclic shear force according to the principle of mechanics.

[0023] In this embodiment, the polishing surface 102a of the polishing layer 102 may include a plurality of polishing grooves 104, but the present invention is not limited thereto. The number of the polishing grooves 104 may be determined according to the actual polishing process. As long as the polishing pad 100 includes at least one polishing groove 104, it falls within the scope of the present invention. Figure 1As shown, in the illustrated embodiment, the distribution shape of the plurality of grinding grooves 104 is concentric circles. However, the present invention is not limited thereto. In other embodiments, the distribution pattern formed by the grinding grooves 104 may be, for example, non-concentric circles, ellipses, polygonal rings, spiral rings, irregular rings, parallel lines, radial lines, radial arcs, spirals, dots, XY grids, crosses, polygonal grids, irregular shapes, or combinations thereof. In addition, as Figure 3 As shown, the grinding groove 104 has a maximum depth D1.

[0024] In this embodiment, the grinding layer 102 has a bottom surface 102b opposite to the grinding surface 102a, and the bottom surface 102b includes a plurality of discontinuous indentations 106. That is, in this embodiment, the bottom surface 102b of the grinding layer 102 is a non-flat surface. In other words, in this embodiment, the bottom surface 102b of the grinding layer 102 can be regarded as a roughened bottom surface. Figure 1 and Figure 2 As shown, the plurality of discontinuous indentations 106 on the bottom surface 102b are arranged in the grinding track region A. As described above, in the illustrated embodiment, the grinding track region A is distributed over the entire grinding layer 102, and thus the plurality of discontinuous indentations 106 are distributed over the entire bottom surface 102b. However, the present invention is not limited thereto. As described above, in other embodiments, depending on the selected grinding system, the plurality of discontinuous indentations 106 may be distributed only in a part or a specific region of the bottom surface 102b.

[0025] In this embodiment, the plurality of discontinuous indentations 106 are spaced apart from each other. Figure 2 As shown, in the radial direction, the plurality of discontinuous indentations 106 have non-constant spacing. Figure 2 As shown, in the circumferential direction, the plurality of non-continuous indentations 106 have a non-fixed spacing. That is, in the illustrated embodiment, the plurality of non-continuous indentations 106 are irregularly distributed on the bottom surface 102b. However, the present invention is not limited thereto. In other embodiments, the plurality of non-continuous indentations 106 may have a fixed spacing and be regularly distributed on the bottom surface 102b. For example, in one embodiment, the plurality of non-continuous indentations 106 have a fixed spacing in both the radial direction and the circumferential direction. From another point of view, Figure 2 and Figure 3 As shown, the bottom surface 102b further includes a continuous plane 108, which is connected to the plurality of discontinuous indentations 106. That is, in this embodiment, the plurality of discontinuous indentations 106 spaced apart from each other are connected to each other via the continuous plane 108. In other words, the area outside the plurality of discontinuous indentations 106 in the bottom surface 102b is the continuous plane 108.

[0026] like Figures 3 to 5As shown, the discontinuous indentation 106 has a maximum depth D2 from the continuous plane 108. In some embodiments, the maximum depth D2 of the discontinuous indentation 106 is between about 0.1 mm and about 0.2 mm. Figure 3 and Figure 4 As shown, the plurality of non-continuous indentations 106 have a non-constant maximum depth D2. Figure 3 and Figure 4 As shown in FIG. 1 , the bottoms of at least two of the plurality of discontinuous indentations 106 on the bottom surface 102 b are not coplanar. However, the present invention is not limited thereto. In other embodiments, the plurality of discontinuous indentations 106 may have a fixed maximum depth D2. That is, the plurality of discontinuous indentations 106 on the bottom surface 102 b have coplanar bottoms. In addition, in the present embodiment, the maximum depth D2 of the discontinuous indentations 106 is less than the maximum depth D1 of the grinding groove 104.

[0027] In the present embodiment, the non-continuous indentations 106 on the bottom surface 102b may be wear marks, knife marks, embossing marks, impact marks or a combination thereof caused by an applied force or energy. In one embodiment, when the non-continuous indentations 106 are wear marks, the method for forming the bottom surface 102b having a plurality of non-continuous indentations 106 includes performing a grinding process. The grinding process may be performed by using a grinding belt having abrasive particles fixed on the surface. In detail, the grinding process provides mechanical grinding between the grinding belt and the grinding layer 102, for example, by the friction between the grinding belt and the bottom surface of the grinding layer 102 opposite to the grinding surface 102a, thereby forming the bottom surface 102b having a plurality of non-continuous indentations 106. In another embodiment, when the non-continuous indentations 106 are knife marks, the method for forming the bottom surface 102b having a plurality of non-continuous indentations 106 includes performing a mechanical cutting process. The mechanical cutting process may be performed by using a cutting tool. In detail, cutting marks (i.e., discontinuous indentations 106) of different embodiments can be generated by adjusting processing parameters, such as cutting platform rotation speed, feed speed, cutting depth, tool, material and deformation characteristics of the grinding layer 102. In another embodiment, when the discontinuous indentations 106 are embossed marks, the method for forming the bottom surface 102b having a plurality of discontinuous indentations 106 includes performing an embossing process. The embossing process can be performed by using a printing plate with a pattern on the surface. In detail, the embossing process is, for example, performed by contacting the printing plate with the bottom surface of the grinding layer 102 opposite to the grinding surface 102a, and then heating and / or pressurizing, thereby forming the bottom surface 102b having a plurality of discontinuous indentations 106. In another embodiment, when the discontinuous indentations 106 are impact marks, the method for forming the bottom surface 102b having a plurality of discontinuous indentations 106 includes performing an impact process. The impact process can be performed by the collision of fine particles. In detail, the impact process is, for example, a shot peening process, which allows fine metal particles (such as steel balls) to impact the bottom surface of the grinding layer 102 opposite to the grinding surface 102a at a very high speed, thereby forming a bottom surface 102b with multiple discontinuous indentations 106.

[0028] In this embodiment, if Figure 2 As shown in FIG. 1 , the distribution pattern of the plurality of discontinuous indentations 106 is an annular pattern. That is, on the bottom surface 102b, the plurality of discontinuous indentations 106 that are spaced apart from each other are arranged at the same radial position. However, the present invention is not limited thereto. FIG. 6A to FIG. 6D Other variations and implementations are described in detail. FIG. 6A to FIG. 6D is a schematic back view of a polishing pad according to another embodiment of the present invention.

[0029] In another embodiment, the distribution pattern of the plurality of discontinuous indentations 106 may be a parallel pattern. Fig. 6A As shown, the distribution pattern of the plurality of discontinuous indentations 106 may be a parallel straight line pattern. However, the present invention is not limited thereto. In other embodiments, the distribution pattern of the plurality of discontinuous indentations 106 may be a parallel curve pattern, a parallel dot pattern, a parallel arc pattern, or other parallel patterns. Fig. 6A In the illustrated embodiment, at least two of the plurality of discontinuous indentations 106 are located on the same virtual extension line V1. Fig. 6A In the embodiment shown, a plurality of discontinuous indentations 106 are irregularly distributed on the bottom surface 102b. Fig. 6A As shown, in the direction X parallel to the extension direction of the discontinuous indentations 106 and in the direction Y perpendicular to the direction X, the plurality of discontinuous indentations 106 have non-fixed spacing. However, the present invention is not limited thereto. In other embodiments, in the direction X and the direction Y, the plurality of discontinuous indentations 106 may have fixed spacing and be regularly distributed on the bottom surface 102b.

[0030] In another embodiment, the distribution pattern of the plurality of non-continuous indentations 106 may be a non-parallel pattern. Figure 6B As shown, the distribution pattern of the plurality of non-continuous indentations 106 in a non-parallel pattern can be implemented in a grid pattern. Figure 6B In the illustrated embodiment, the plurality of discontinuous indentations 106 include a plurality of discontinuous indentations 106a and a plurality of discontinuous indentations 106b, wherein the extension direction of the discontinuous indentations 106a and the extension direction of the discontinuous indentations 106b intersect with each other. Figure 6B As shown in FIG. 1 , although the angle between the extension direction of the discontinuous notch 106a and the extension direction of the discontinuous notch 106b is an acute angle, the present invention is not limited thereto. In other embodiments, the angle between the extension direction of the discontinuous notch 106a and the extension direction of the discontinuous notch 106b may be a right angle or an obtuse angle. Figure 6B In the illustrated embodiment, at least two of the plurality of discontinuous indentations 106a are located on the same virtual extension line V2, and at least two of the plurality of discontinuous indentations 106b are located on the same virtual extension line V3. Figure 6B In the embodiment shown, a plurality of discontinuous indentations 106 are irregularly distributed on the bottom surface 102b. Figure 6B As shown, in the extension direction of the discontinuous indentation 106a and the extension direction of the discontinuous indentation 106b, the plurality of discontinuous indentations 106 have a non-fixed spacing. However, the present invention is not limited thereto. In other embodiments, in the extension direction of the discontinuous indentation 106a and the extension direction of the discontinuous indentation 106b, the plurality of discontinuous indentations 106 may have a fixed spacing and be regularly distributed on the bottom surface 102b.

[0031] In addition, if Figure 6C As shown, the distribution pattern of the plurality of non-continuous dimples 106 in a non-parallel pattern may be implemented in a radial pattern. Figure 6C In the illustrated embodiment, at least two of the plurality of discontinuous indentations 106 are located on the same virtual extension line V4. Figure 6C In the embodiment shown, a plurality of discontinuous indentations 106 are irregularly distributed on the bottom surface 102b. Figure 6C As shown, in the radial direction and the circumferential direction, the plurality of discontinuous indentations 106 have non-fixed spacing. However, the present invention is not limited thereto. In other embodiments, in the radial direction and the circumferential direction, the plurality of discontinuous indentations 106 may have fixed spacing and be regularly distributed on the bottom surface 102b. In addition, although Figure 6C The discontinuous indentation 106 shown in FIG. 1 is in a straight line shape, but the present invention is not limited thereto. In other embodiments, the discontinuous indentation 106 may be in an arc shape, such as Fig.6D shown.

[0032] In this embodiment, the polishing layer 102 is a non-porous layer. In this article, a non-porous layer is defined as a film layer having very few pores or even having no pores. However, the present invention is not limited thereto.

[0033] In other embodiments, the grinding layer 102 may be a porous layer. In this article, the porous layer is defined as having a plurality of tiny holes of different sizes, and the number of holes in the porous layer is greater than that in the non-porous layer. In yet other embodiments, the grinding layer 102 may also include a porous layer and a non-porous layer. In some such embodiments, the non-porous layer covers the porous layer, that is, the bottom surface 102b is located on the bottom surface of the non-porous layer. In other such embodiments, the non-porous layer is only located above the porous layer, that is, the porous layer is closer to the adhesive layer 110 than the non-porous layer, and the bottom surface 102b is located on the bottom surface of the porous layer. In yet other such embodiments, the non-porous layer is only located below the porous layer, that is, the non-porous layer is closer to the adhesive layer 110 than the porous layer, and the bottom surface 102b is located on the bottom surface of the non-porous layer. In addition, the porous layer and the non-porous layer may be made of the same material (such as a polymer material). In addition, the non-porous layer may be a skin layer, the porous layer may be a main layer, and the main layer and the skin layer are made of the same polymer material.

[0034] In this embodiment, if Figure 3As shown, the adhesive layer 110 is adhered to the bottom surface 102b of the grinding layer 102. In one embodiment, the adhesive layer 110 can be used to adhere the bottom surface 102b of the grinding layer 102 to the grinding platform (not shown). That is, the grinding pad 100 can be adhered and fixed on the grinding platform (not shown) by the adhesive layer 110 adhering to the bottom surface 102b. In this embodiment, the adhesive layer 110 is a continuous adhesive layer, wherein the adhesive layer includes (but is not limited to): a carrier-free adhesive layer or a double-sided adhesive layer. The material of the above-mentioned adhesive layer is, for example (but not limited to): an acrylic-based adhesive, a silicone adhesive, a rubber silicone, an epoxy resin adhesive or a polyurethane adhesive, but the present invention is not limited thereto.

[0035] like Figures 3 to 5 As shown, the adhesive layer 110 fills the plurality of discontinuous indentations 106 on the bottom surface 102b. In this way, the contact area between the adhesive layer 110 and the polishing layer 102 is increased, thereby improving the adhesive retention force between the adhesive layer 110 and the polishing layer 102, so that the polishing pad 100 can maintain a good adhesive state with the polishing machine during the polishing process, and can have improved stability. In addition, as shown in FIG. Figure 5 As shown, the depth of the discontinuous indentation 106 can be deep first and then shallow or shallow first and then deep. That is, along the formation direction of the discontinuous indentation 106, the discontinuous indentation 106 has a non-fixed depth. Taking the example that the depth of the discontinuous indentation 106 is deep first and then shallow, the discontinuous indentation 106 will form a hook-like shape (such as Figure 5 As shown), after the adhesive layer 110 is subsequently filled into the bottom surface 102b, the adhesive layer 110 located in the discontinuous indentation 106 also conforms to the hook-like shape (as shown in FIG. Figure 5 That is, in the polishing pad 100, there is a hook-shaped contact area between the adhesive layer 110 and the polishing layer 102. In this way, when an external force is applied to the polishing layer 102, the adhesive layer 110 and the polishing layer 102 can be tightly grasped by each other due to the aforementioned hook-shaped contact area, so that the adhesive layer 110 and the polishing layer 102 will not be separated due to the external force, and the adhesive retention force between the adhesive layer 110 and the polishing layer 102 can be effectively improved.

[0036] From another point of view, during the grinding process, the adhesive layer 110 is filled with a plurality of discontinuous indentations 106 disposed in the grinding track area A on the bottom surface 102b, so that an anti-reverse force can be generated to resist the shear force generated by the relative movement between the object 200 and the grinding surface 102a of the grinding layer 102 during the grinding process. In other words, the adhesive layer 110 and the grinding layer 102 have good anti-shear force characteristics. In this way, when the grinding pad 100 is used to grind the object 200, by setting a plurality of discontinuous indentations 106 located in the grinding track area A on the bottom surface 102b, the effect of the shear force on the adhesive layer 110 can be reduced, thereby reducing the chance of debonding of the adhesive layer 110 and improving its adhesive retention. In some embodiments, the shear force mentioned above belongs to a kind of cyclic shear force according to the principle of mechanics, which is a shear force generated in the cyclic direction due to the rotation and swinging movement of the object 200 on the grinding pad during the grinding process.

[0037] In order to verify the effect of the polishing pad proposed in the present invention on improving the adhesion retention, a shear resistance (adhesion retention) experiment was actually conducted. In the experimental test, the test method and sample settings used were as follows, and the test results are listed in Table 1.

[0038] Shear resistance (adhesion retention) test method: adopt ASTM D3654 standard test method.

[0039] Adhesive layer material: acrylic adhesive.

[0040] Samples 1 to 10: Sample 1 is a test substrate without a dent, and Samples 2 to 10 are test substrates with discontinuous dents of different angles, wherein the depth of the discontinuous dents in this test is first deep and then shallow along the formation direction, and the material of the test substrate is polyurethane polymer.

[0041] Table 1

[0042]

[0043] Table 1 (continued)

[0044]

[0045] It can be seen from Table 1 that, compared with sample 1 without indentations, samples 2 to 10 with discontinuous wear scars have better shear resistance retention time. In the grinding process, due to the relative movement between the object to be ground and the grinding pad, the grinding pad must be able to remain intact under the shear force for a long time, so the shear resistance retention time is an extremely important indicator for testing the performance of the grinding pad. Therefore, according to the above experimental results, it can be seen that compared with the grinding pad without discontinuous indentations, the grinding pad of the present invention with discontinuous indentations formed on the grinding layer has better adhesion retention performance and stability.

[0046] In addition, it can be seen from Table 1 that, relative to the direction of the shear force, different directions of the formation of the indentation will affect the anti-shear force characteristics between the adhesive layer and the sample. Samples 2 and 10 are used as examples for illustration. As mentioned above, the angle of sample 2 is 0 degrees, which means that the direction of the indentation of sample 2 is the same as the direction of the shear force, while the angle of sample 10 is 180 degrees, which means that the direction of the indentation of sample 10 is opposite to the direction of the shear force. From the results shown in Table 1, it can be seen that the anti-shear force maintenance time of samples 2 and 10 is 34 hours and 36 hours respectively, which is about five times longer than the anti-shear force maintenance time of sample 1 without indentation, which is 6.8 hours. In addition, as described above, the non-continuous indentations formed in this test create a shape with depths from deep to shallow, whereby the adhesive layers of sample 2 and sample 10 also have a shape from deep to shallow because they are filled in the indentations in accordance with the shape of the indentations. Sample 2 has a slightly lower effect of forming barbs than sample 10, whose indentation formation direction is the same as the shear force direction, and thus the shear resistance of sample 10 is maintained longer than that of sample 2. In summary, in the polishing pad of the present invention, the distribution pattern of the plurality of non-continuous indentations 106 in the polishing track area A can be adjusted according to the actual polishing process (e.g., the implementation method of relative motion between the object 200 and the polishing surface 102a), so that the anti-shear force characteristics (adhesion retention force) between the adhesive layer 110 and the polishing layer 102 are improved.

[0047] As mentioned above, in Figures 1 to 5 In the embodiment shown, the polishing pad 100 includes a polishing layer 102 and an adhesive layer 110 disposed below the polishing layer 102, and the polishing pad 100 is adhered and fixed to the polishing platform by the adhesive layer 110. However, the present invention is not limited thereto. In other embodiments, the polishing pad 100 may further include a base layer, a waterproof layer, other adhesive layers, or a combination thereof disposed below the adhesive layer 110. Figure 7 and Figure 8 Other variations and implementations are described in detail.

[0048] Figure 7is a cross-sectional schematic diagram of a polishing pad according to another embodiment of the present invention. Figure 7 and Figure 3 , Figure 7 The polishing pad 300 and Figure 3 The polishing pad 100 of the present invention is similar to that of the present invention, so the same or similar elements are represented by the same or similar symbols, and the related descriptions are not repeated. The differences between the two will be described below.

[0049] Please refer to Figure 7 The polishing pad 300 includes a base layer 302 and an adhesive layer 304 disposed below the adhesive layer 110. Specifically, the base layer 302 mainly acts as a cushion for the polishing layer 102. The polishing layer 102 and the base layer 304 are bonded together by the adhesive layer 110. Figure 7 As shown, in the present embodiment, the adhesive layer 110 is adhered to the surface 302a of the base layer 302. The material of the base layer 302 used in the present embodiment may be, for example, polyurethane, polybutadiene, polyethylene, polypropylene, a copolymer of polyethylene and ethylene vinyl acetate, or a copolymer of polypropylene and ethylene vinyl acetate, but the present invention is not limited thereto. In the present embodiment, the adhesive layer 110 is a continuous adhesive layer, wherein the adhesive layer includes (but is not limited to): carrier-free adhesive, double-sided adhesive, hot melt adhesive or moisture-hardening adhesive. The material of the above-mentioned adhesive layer may be, for example (but is not limited to): acrylic adhesive, silicone adhesive, rubber adhesive, epoxy resin adhesive or polyurethane adhesive, but the present invention is not limited thereto.

[0050] like Figure 7 As shown, in this embodiment, the surface 302b of the base layer 302 opposite to the surface 302a includes a plurality of discontinuous indentations 306. That is, in this embodiment, the surface 302b of the base layer 302 is a non-flat surface. In other words, in this embodiment, the surface 302b of the base layer 302 can be regarded as a roughened surface. Figure 7 The non-continuous indentation 306 in the illustrated embodiment is Figure 1 The corresponding ones in the illustrated embodiment (i.e., the discontinuous indentation 106) are the same or similar, and the relevant contents of the discontinuous indentation 106 have been described in detail in the aforementioned embodiment, so some related descriptions are not repeated, and the description of the omitted parts can be referred to the aforementioned Figures 1 to 6D In addition, Figure 7 As shown, since the surface 302 a is closer to the polishing layer 102 than the surface 302 b , the surface 302 a can be referred to as the upper surface of the base layer 302 , and the surface 302 b can be referred to as the lower surface of the base layer 302 .

[0051] like Figure 7As shown, the surface 302b further includes a continuous plane 308, which is connected to the plurality of discontinuous indentations 306. That is, in this embodiment, the plurality of discontinuous indentations 306 spaced apart from each other are connected to each other via the continuous plane 308. In other words, the area outside the plurality of discontinuous indentations 306 in the bottom surface 302b is the continuous plane 308. Figure 7 As shown, the discontinuous indentation 306 has a maximum depth D3 from the continuous plane 308. In some embodiments, the maximum depth D3 of the discontinuous indentation 306 is between about 0.1 mm and about 0.2 mm. Figure 7 As shown, the plurality of non-continuous indentations 306 have a non-constant maximum depth D3. Figure 7 As shown, the bottoms of at least two of the plurality of discontinuous indentations 306 on the surface 302b are not coplanar. However, the present invention is not limited thereto. In other embodiments, the plurality of discontinuous indentations 306 may have a fixed maximum depth D3. That is, the plurality of discontinuous indentations 306 on the surface 302b have coplanar bottoms. In addition, in the present embodiment, the maximum depth D3 of the discontinuous indentations 306 is less than the maximum depth D1 of the grinding groove 104.

[0052] In this embodiment, the base layer 302 is a non-porous layer. However, the present invention is not limited thereto. In other embodiments, the base layer 302 may be a porous layer. In yet other embodiments, the base layer 302 may include: a porous layer and a non-porous layer. In some such embodiments, the non-porous layer covers the porous layer, that is, the surface 302a is located on the upper surface of the non-porous layer, and the surface 302b is located on the lower surface of the non-porous layer. In other such embodiments, the non-porous layer is only located above the porous layer, that is, the non-porous layer is closer to the adhesive layer 110 than the porous layer, and the surface 302b is located on the lower surface of the porous layer. In yet other such embodiments, the non-porous layer is only located below the porous layer, that is, the porous layer is closer to the adhesive layer 110 than the non-porous layer, and the surface 302b is located on the lower surface of the non-porous layer. In addition, the porous layer and the non-porous layer may be made of the same material (such as a polymer material). In addition, the non-porous layer may be a skin layer, the porous layer may be a main layer, and the main layer and the skin layer may be made of the same polymer material.

[0053] In this embodiment, if Figure 7As shown, the adhesive layer 304 is disposed below the base layer 302. Specifically, the adhesive layer 304 is adhered to the surface 302b of the base layer 302. In one embodiment, the adhesive layer 304 can be used to adhere the surface 302b of the base layer 302 to the grinding platform (not shown). That is, the grinding pad 300 can be adhered and fixed on the grinding platform (not shown) by the adhesive layer 304 adhering to the surface 302b. In this embodiment, the adhesive layer 304 is a continuous adhesive layer, wherein the adhesive layer includes (but is not limited to): a carrier-free adhesive layer or a double-sided adhesive layer. The material of the above-mentioned adhesive layer is, for example (but not limited to): acrylic adhesive, silicone adhesive, rubber silicone, epoxy resin adhesive or polyurethane adhesive, but the present invention is not limited to this.

[0054] like Figure 7 As shown, the adhesive layer 304 fills a plurality of discontinuous indentations 306 on the surface 302b. In this way, the contact area between the adhesive layer 304 and the base layer 302 is increased, thereby improving the adhesive retention force between the adhesive layer 304 and the base layer 302, so that the polishing pad 300 can maintain a good adhesive state with the polishing machine during the polishing process, and can have improved stability. In addition, similar to the discontinuous indentations 106, since the discontinuous indentations 306 can be formed into a hook-like shape, the adhesive layer 304 that is subsequently filled into the surface 302b will have a contact area with the base layer 302 that is similar to the hook shape. In this way, when an external force is applied to the base layer 302, the adhesive layer 304 and the base layer 302 can be tightly grasped with each other due to the aforementioned hook-shaped contact area, so that the adhesive layer 304 and the base layer 302 will not be separated due to the external force, which can effectively improve the adhesive retention force between the adhesive layer 304 and the base layer 302.

[0055] From another point of view, during the grinding process, the adhesive layer 304 fills the surface 302b with a plurality of discontinuous indentations 306 disposed in the grinding track area A, so that an anti-reverse force can be generated to resist the shear force generated by the relative movement between the object 200 and the grinding surface 102a of the grinding layer 102 during the grinding process. In other words, the adhesive layer 304 and the base layer 302 have good anti-shear force characteristics. In this way, when the grinding pad 300 is used to grind the object 200, by setting a plurality of discontinuous indentations 306 located in the grinding track area A on the surface 302b, the effect of the shear force on the adhesive layer 304 can be reduced, thereby reducing the chance of debonding of the adhesive layer 304 and improving its adhesive retention. In some embodiments, the shear force mentioned above belongs to a cyclic shear force according to the principle of mechanics, which is a shear force generated in a cyclic direction due to the rotation and swinging movement of the object 200 on the grinding pad during the grinding process.

[0056] Figure 8 is a cross-sectional schematic diagram of a polishing pad according to another embodiment of the present invention. Figure 8 and Figure 7 , Figure 8 The polishing pad 400 with Figure 7 Therefore, the same or similar elements are represented by the same or similar symbols, and the related descriptions are not repeated. The differences between the two will be described below.

[0057] like Figure 8 As shown in FIG. 4 , in the polishing pad 400 , in addition to the plurality of discontinuous indentations 306 on the surface 302 b of the base layer 302 , the surface 302 a also includes a plurality of discontinuous indentations 406 . Figure 8 In the illustrated embodiment, both surfaces of the base layer 302 (ie, the surface 302 a and the surface 302 b , or also referred to as the upper surface and the lower surface) can be regarded as roughened surfaces. Figure 8 The non-continuous indentation 406 in the illustrated embodiment is Figure 1 The corresponding ones in the illustrated embodiment (i.e., the discontinuous indentation 106) are the same or similar, and the relevant contents of the discontinuous indentation 106 have been described in detail in the aforementioned embodiment, so some related descriptions are not repeated, and the description of the omitted parts can be referred to the aforementioned Figures 1 to 6D The embodiment shown.

[0058] like Figure 8 As shown, the surface 302a further includes a continuous plane 408, which is connected to the plurality of discontinuous indentations 406. That is, in this embodiment, the plurality of discontinuous indentations 406 spaced apart from each other are connected to each other via the continuous plane 408. In other words, the area outside the plurality of discontinuous indentations 406 in the bottom surface 302a is the continuous plane 408. Figure 8 As shown, the discontinuous indentation 406 has a maximum depth D4 from the continuous plane 408. In some embodiments, the maximum depth D4 of the discontinuous indentation 406 is between about 0.1 mm and about 0.2 mm. Figure 8 As shown, the plurality of non-continuous indentations 406 have a non-constant maximum depth D4. Figure 8 As shown, the bottoms of at least two of the plurality of discontinuous indentations 406 on the surface 302a are not coplanar. However, the present invention is not limited thereto. In other embodiments, the plurality of discontinuous indentations 406 may have a fixed maximum depth D4. That is, the plurality of discontinuous indentations 406 on the surface 302a have coplanar bottoms. In addition, in the present embodiment, the maximum depth D4 of the discontinuous indentations 406 is less than the maximum depth D1 of the grinding groove 104.

[0059] In the embodiment where the base layer 302 includes a porous layer and a non-porous layer, and the non-porous layer covers the porous layer, the surface 302a is located on the non-porous layer. That is, in such an embodiment, both surfaces of the base layer 302 (i.e., the surface 302a and the surface 302b) are located on the non-porous layer.

[0060] In this embodiment, if Figure 8 As shown, the adhesive layer 110 fills in a plurality of discontinuous indentations 406 on the surface 302a. In this way, the contact area between the adhesive layer 110 and the base layer 302 is increased, thereby improving the adhesive retention force between the adhesive layer 110 and the base layer 302, so that the polishing pad 400 can maintain a good adhesive state with the polishing machine during the polishing process, and can have improved stability. In addition, similar to the discontinuous indentations 106, since the discontinuous indentations 406 can be formed into a hook-like shape, the adhesive layer 110 that will be filled in the surface 302a will have a contact area with the base layer 302 that is similar to the hook shape. In this way, when an external force is applied to the base layer 302, the adhesive layer 110 and the base layer 302 can be tightly grasped with each other due to the aforementioned hook-shaped contact area, so that the adhesive layer 110 and the base layer 302 will not be separated due to the external force, which can effectively improve the adhesive retention force between the adhesive layer 110 and the base layer 302.

[0061] From another point of view, during the grinding process, the adhesive layer 110 is filled with a plurality of discontinuous indentations 406 disposed in the grinding track area A on the surface 302a, so that an anti-reverse force can be generated to resist the shear force generated by the relative movement between the object 200 and the grinding surface 102a of the grinding layer 102 during the grinding process. In other words, the adhesive layer 110 and the base layer 302 have good anti-shear force characteristics. In this way, when the object 200 is subjected to a grinding process using the grinding pad 400, by providing a plurality of discontinuous indentations 406 located in the grinding track area A on the surface 302a, the effect of the shear force on the adhesive layer 110 can be reduced, thereby reducing the chance of debonding of the adhesive layer 110 and improving its adhesive retention. In some embodiments, the shear force mentioned above is a kind of cyclic shear force according to the principle of mechanics, which is a shear force generated in a cyclic direction due to the rotation and swinging motion of the object 200 on the grinding pad during the grinding process.

[0062] In addition, if Figure 7 and Figure 8As shown, although in the polishing pad 300 and the polishing pad 400, the polishing layer 102 and the base layer 302 both have a roughened surface (for example: the bottom surface 102b of the polishing layer 102, the surface 302a of the base layer 302, and the surface 302b of the base layer 302), the present invention is not limited thereto. In other embodiments, the polishing layer 102 may not have a roughened surface. In other words, at least one of the polishing layer and the base layer having a roughened surface falls within the scope of the present invention. In addition, in other embodiments, only the surface 302a of the base layer 302 may be a roughened surface.

[0063] Fig. 9 1 is a flow chart of a grinding method according to an embodiment of the present invention. The grinding method is applicable to grinding an object. In detail, the grinding method can be applied to the grinding process of manufacturing industrial components, such as components used in the electronics industry, which may include semiconductors, integrated circuits, micro-electromechanical, energy conversion, communications, optics, storage disks and displays, and the objects used to make these components may include semiconductor wafers, IIIV group wafers, storage component carriers, ceramic substrates, polymer substrates and glass substrates, but are not used to limit the scope of the present invention.

[0064] Please refer to Fig. 9 First, step S10 is performed to provide a polishing pad. Specifically, in this embodiment, the polishing pad can be any of the polishing pads described in the above embodiments, such as polishing pad 100 / 300 / 400. The relevant description of the polishing pad 100 / 300 / 400 has been described in detail above, so it will not be repeated here.

[0065] Next, step S12 is performed to apply pressure to the object. Thereby, the object is pressed onto the polishing pad and contacts the polishing pad. Specifically, in the present embodiment, the object may be the object 200 described in the aforementioned embodiment, and the relevant description of the object 200 has been described in detail above, so it is not repeated here. In addition, as described above, the object contacts the polishing surface 102a of the polishing layer 102 of the polishing pad 100 / 300 / 400. In addition, the method of applying pressure to the object is, for example, to use a carrier capable of holding the object.

[0066] Then, step S14 is performed to provide relative motion between the object and the polishing pad so as to use the polishing pad to polish the object to achieve the purpose of flattening. Specifically, the method of providing relative motion between the object and the polishing pad is, for example, to rotate the polishing platform to drive the polishing pad fixed on the polishing platform to rotate.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A polishing pad, suitable for polishing an object, and having a polishing track area, wherein the polishing pad comprises: A polishing layer having a polishing surface and a roughened bottom surface opposite to each other, wherein the roughened bottom surface comprises a plurality of discontinuous indentations, at least one of the plurality of discontinuous indentations has a depth gradient along a formation direction of the at least one discontinuous indentation and has a hook shape, and the polishing layer comprises a polymer substrate; as well as The adhesive layer is adhered to the roughened bottom surface, wherein the adhesive layer directly contacts the polymer substrate and the adhesive layer fills the at least one discontinuous indentation to have the hook shape. 2 . The polishing pad according to claim 1 , wherein the plurality of discontinuous indentations have a fixed interval, so that the plurality of discontinuous indentations are regularly distributed on the roughened bottom surface. 3 . The polishing pad according to claim 1 , wherein the plurality of non-continuous dimples have a non-fixed interval, so that the plurality of non-continuous dimples are irregularly distributed on the roughened bottom surface. 4 . The polishing pad according to claim 1 , wherein a distribution pattern of the plurality of non-continuous dimples comprises a parallel pattern, a non-parallel pattern, a grid pattern, a radial pattern, or a ring pattern. 5 . The polishing pad according to claim 1 , wherein at least two of the plurality of non-continuous dimples are located on the same virtual extension line. The polishing pad according to claim 1 , wherein the plurality of non-continuous indentations are disposed within the polishing track region. 7 . The polishing pad according to claim 1 , wherein the plurality of non-continuous indentations comprise wear marks, knife marks, embossing marks, impact marks, or a combination thereof. 8 . The polishing pad according to claim 1 , wherein a region other than the plurality of discontinuous dimples in the roughened bottom surface is a continuous plane. 9 . The polishing pad according to claim 8 , wherein the polishing layer is a non-porous layer. 10 . The polishing pad according to claim 8 , wherein the polishing layer comprises a porous layer and a non-porous layer, and the non-porous layer covers the porous layer. 11 . The polishing pad according to claim 8 , wherein the polishing layer comprises a porous layer and a non-porous layer, the porous layer is located below the non-porous layer, and the roughened bottom surface is located on a bottom surface of the porous layer. 12 . The polishing pad according to claim 8 , wherein the polishing layer comprises a porous layer and a non-porous layer, the non-porous layer is located below the porous layer, and the roughened bottom surface is located on a bottom surface of the non-porous layer.

13. The polishing pad according to claim 1, wherein the adhesive layer fills the plurality of non-continuous indentations.

14. A polishing pad, suitable for polishing an object, and having a polishing track area, wherein the polishing pad comprises: Grinding layer; A base layer is disposed below the polishing layer, wherein the base layer has a roughened surface, the roughened surface includes a plurality of discontinuous indentations, and at least one of the plurality of discontinuous indentations has a depth gradient along a formation direction of the at least one discontinuous indentation and has a hook shape; as well as The adhesive layer is adhered to the roughened surface, wherein the adhesive layer fills the at least one discontinuous indentation to have the hook shape. 15 . The polishing pad according to claim 14 , wherein the plurality of non-continuous dimples have a fixed interval, so that the plurality of non-continuous dimples are regularly distributed on the roughened surface. 16 . The polishing pad according to claim 14 , wherein the plurality of non-continuous dimples have a non-constant interval, so that the plurality of non-continuous dimples are irregularly distributed on the roughened surface. 17 . The polishing pad according to claim 14 , wherein a distribution pattern of the plurality of non-continuous dimples comprises a parallel pattern, a grid pattern, a radial pattern, or a ring pattern. 18 . The polishing pad according to claim 14 , wherein at least two non-continuous dimples among the plurality of non-continuous dimples are located on the same virtual extension line.

19. The polishing pad according to claim 14, wherein the plurality of non-continuous indentations are disposed in the polishing track region.

20. The polishing pad according to claim 14, wherein the plurality of non-continuous indentations comprise wear marks, knife marks, embossing marks, impact marks, or a combination thereof.

21. The polishing pad according to claim 14, wherein the area outside the plurality of discontinuous dimples in the roughened surface is a continuous plane.

22. The polishing pad according to claim 21, wherein the base layer is a non-porous layer. 23 . The polishing pad according to claim 21 , wherein the base layer comprises a porous layer and a non-porous layer, and the non-porous layer covers the porous layer. 24 . The polishing pad according to claim 21 , wherein the base layer comprises an upper surface and a lower surface opposite to each other, and the roughened surface is located on the lower surface of the base layer. 25 . The polishing pad according to claim 21 , wherein the base layer comprises an upper surface and a lower surface opposite to each other, and the roughened surface is located on the upper surface of the base layer. 26 . The polishing pad according to claim 21 , wherein the base layer comprises an upper surface and a lower surface opposite to each other, and the roughened surface is located on the upper surface and the lower surface of the base layer.

27. The polishing pad according to claim 14, wherein the adhesive layer fills in the plurality of non-continuous indentations.

28. A grinding method comprising: Providing a polishing pad, the polishing pad being the polishing pad according to any one of claims 1 to 13; Applying pressure to an object so as to press it onto the polishing surface of the polishing pad; as well as Relative motion is provided to the object and the polishing pad to perform a polishing process.

29. A grinding method comprising: providing a polishing pad, the polishing pad being the polishing pad as claimed in any one of claims 14 to 27; Applying pressure to the object so as to press it onto the polishing surface of the polishing pad; and Relative motion is provided to the object and the polishing pad to perform a polishing process.

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