Resin molding device and method for manufacturing resin molded product

Abstract

The present invention provides a resin molding device and a method for manufacturing a resin molded product that can improve versatility. The resin molding device includes: a resin storage portion that stores a plurality of small pieces of resin while moving along a first direction; a resin dropping mechanism that moves along a second direction intersecting the first direction and can drop the stored plurality of small pieces of resin by a rotational action; an extrusion mechanism that squeezes out the plurality of small pieces of resin stored in the resin storage portion and stores them in the resin dropping mechanism; a conveying mechanism that is provided with a hole portion for storing the small pieces of resin dropped from the resin dropping mechanism; and a resin molding portion that is provided with a molding die that is provided with a groove for supplying the small pieces of resin transported by the conveying mechanism, and resin molding a resin molding object using the small pieces of resin supplied to the molding die.

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Patent document 1 discloses a resin molding device for resin sealing using a small piece of resin. In the resin molding device, a tablet clamper is used to supply a small piece of resin whose weight is measured by a weighing mechanism to a plurality of grooves formed in a support portion. Thereafter, a pusher is used to squeeze out the small piece of resin arranged in the groove and supply it to a holding portion, and the holding portion is rotated by a reversing mechanism, so that the small piece of resin falls onto a lead frame arrangement plate. The small piece of resin and the lead frame can be transported to a molding die through the lead frame arrangement plate.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 63-116437 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] However, the technology described in Patent Document 1 can simply drop a row of small pieces of resin accommodated in the holding portion downward, so it is difficult to cope with molding dies designed in various shapes, and there is room for improvement in terms of low versatility.

[0008] The present invention has been made in view of the above-mentioned situation, and an object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can improve versatility.

[0009] [Technical means to solve the problem]

[0010] The problem to be solved by the present invention is as described above. In order to solve the problem, the resin molding device of the present invention includes: a resin containing section, which contains a plurality of small pieces of resin while moving along a first direction; a resin dropping mechanism, which moves along a second direction intersecting the first direction and can cause the contained plurality of small pieces of resin to drop by a rotational action; an extrusion mechanism, which extrude the plurality of small pieces of resin contained in the resin containing section and contain them in the resin dropping mechanism; a conveying mechanism, which is provided with a hole portion for containing the small pieces of resin dropped from the resin dropping mechanism; and a resin molding section, which is provided with a molding die, which is provided with a groove for supplying the small pieces of resin conveyed by the conveying mechanism, and resin molding is performed on a resin molding object using the small pieces of resin supplied to the molding die.

[0011] Furthermore, a method for producing a resin molded product according to the present invention produces a resin molded product using the resin molding apparatus.

[0012] [Effects of the Invention]

[0013] According to the present invention, the versatility of a resin molding apparatus can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic plan view showing the overall structure of a resin molding apparatus according to one embodiment.

[0015] Figure 2 It is a plan view (partial cross-sectional view) showing the structure of a resin supply unit, a loader, a preheating unit, and a forming mold.

[0016] Figure 3 It is a perspective view showing the structure of the resin supply unit and the loader.

[0017] Figure 4 It is a side cross-sectional view showing the operation of the resin supply unit.

[0018] [Explanation of Symbols]

[0019] 1: Resin molding device

[0020] 10: Supply module

[0021] 20: Resin molding module

[0022] 300: Resin supply unit

[0023] 320: Resin storage unit

[0024] 340: Extrusion mechanism

[0025] 341: Cylindrical part

[0026] 350: Resin drop mechanism

[0027] 400: Loader

[0028] 410: Receiving hole

[0029] 410L: Receiving hole array

[0030] 500: Preheating unit

[0031] 700: Forming die

[0032] 710: Slot

[0033] 710L: Slot array DETAILED DESCRIPTION

[0034] In the following, the directions indicated by arrow U, arrow D, arrow L, arrow R, arrow F and arrow B shown in the drawings are defined as upward direction, downward direction, left direction, right direction, front direction and rear direction respectively for explanation.

[0035] <Overall Structure of Resin Molding Device 1>

[0036] First, use Figure 1 The structure of a resin molding device 1 according to an embodiment of the present invention is described. The resin molding device 1 performs resin sealing on electronic components such as semiconductor chips (hereinafter referred to as "chips") to manufacture resin molded products. In particular, in this embodiment, a resin molding device 1 that performs resin molding using a transfer molding method is exemplified.

[0037] The resin molding device 1 includes a supply module 10 and a resin molding module 20 as components. Each component is detachable from other components and can be replaced.

[0038] <Supply module 10>

[0039] The supply module 10 supplies a lead frame (hereinafter referred to as "substrate 2"), which is a type of substrate on which a chip is mounted, and a small piece of resin T to the resin molding module 20. In this embodiment, the lead frame is exemplified as the substrate 2, but in addition to the lead frame, various other substrates (epoxy glass substrate, ceramic substrate, resin substrate, metal substrate, etc.) can also be used. The supply module 10 mainly includes: a substrate supply unit 100, a transfer unit 200, a resin supply unit 300, a loader 400, a preheating unit 500 and a control unit 600.

[0040] The substrate supply unit 100 supplies the substrate 2 which is not resin-sealed and is housed in a cassette unit (not shown) to the delivery unit 200 .

[0041] The interface 200 receives the substrates 2 from the substrate supply unit 100 , and appropriately arranges the received substrates 2 before delivering them to the loader 400 . The interface 200 is disposed on the right side of the substrate supply unit 100 .

[0042] The resin supply unit 300 supplies a small piece of resin T (see Figure 2 ) is supplied to the loader 400. The resin supply unit 300 is arranged behind the delivery unit 200.

[0043] The loader 400 transports the substrate 2 and the small pieces of resin T received from the substrate supply unit 100 and the resin supply unit 300 to the resin molding module 20. The loader 400 is one embodiment of the transport mechanism of the present invention. The loader 400 can move left and right through the supply module 10 (the interface 200 and the preheating unit 500) and the resin molding module 20 (the molding die 700) described later.

[0044] The preheating unit 500 preheats the substrate 2 supplied to the resin molding module 20 . The preheating unit 500 is one embodiment of the heating unit of the present invention. The preheating unit 500 is disposed on the right side of the interface 200 .

[0045] The control unit 600 controls the operation of each module of the resin molding apparatus 1. The operation of the supply module 10 and the resin molding module 20 is controlled by the control unit 600. In addition, the operation of each module can be arbitrarily changed (adjusted) using the control unit 600.

[0046] Furthermore, in the present embodiment, an example in which the control unit 600 is provided in the supply module 10 is shown, but the control unit 600 may also be provided in other modules. In addition, a plurality of control units 600 may also be provided. For example, a control unit 600 may also be provided for each module or each device, and the operations of each module or the like may be linked to each other while being controlled individually.

[0047] <Resin molding module 20>

[0048] The resin molding module 20 performs resin sealing on the chip mounted on the substrate 2. The resin molding module 20 is one embodiment of the resin molding part of the present invention. The resin molding module 20 mainly includes a molding die 700 (a lower die and an upper die) and a mold clamping mechanism (not shown).

[0049] The forming mold 700 uses a molten resin material to resin-seal the chip mounted on the substrate 2. The forming mold 700 includes a pair of upper and lower molds, namely a lower mold and an upper mold (not shown). The forming mold 700 is provided with a heating unit such as a heater (not shown). The forming mold 700 is arranged on the right side of the preheating unit 500.

[0050] The mold clamping mechanism (not shown) closes or opens the molding die 700 by moving the lower mold up and down.

[0051] <Overview of Operation of Resin Molding Apparatus 1>

[0052] Next, an outline of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing a resin molded product using the resin molding apparatus 1 ) will be described.

[0053] In the supply module 10, the substrate supply unit 100 supplies the substrate 2 accommodated in the cassette unit (not shown) to the delivery unit 200. The delivery unit 200 properly arranges the received substrate 2. The loader 400 holds the substrate 2 placed in the delivery unit 200 from above and supplies it to the preheating unit 500. The preheating unit 500 heats the substrate 2 received from the loader 400. After supplying the substrate 2 to the preheating unit 500, the loader 400 moves to the top of the delivery unit 200 again.

[0054] The resin supply unit 300 supplies the small pieces of resin T to the loader 400 located above the delivery unit 200. After receiving the small pieces of resin T from the resin supply unit 300, the loader 400 moves to the top of the preheating unit 500 and holds the heated substrate 2. Thereafter, the loader 400 transports the small pieces of resin T and the substrate 2 to the molding die 700 of the resin molding module 20.

[0055] In the resin molding module 20, the mold clamping mechanism clamps the molding die 700. Then, the resin flakes T are heated and melted by a heating unit (not shown) of the molding die 700, and the substrate 2 is resin-sealed with the generated fluid resin.

[0056] After the resin sealing is completed, the mold clamping mechanism opens the molding die 700 to demold the resin-sealed substrate 2. Thereafter, the resin-sealed substrate 2 is removed from the molding die 700. At this time, the useless parts (waste resin such as residual material and runner) of the resin-molded substrate 2 are appropriately removed. In this way, the resin-sealed substrate 2 (resin molded product) is manufactured.

[0057] <Detailed Structure of Resin Supply Unit 300 >

[0058] Next, the structure of the resin supply unit 300 will be described in more detail. Figure 2 and Figure 3 As shown, the resin supply unit 300 mainly includes: a resin delivery unit 310 , a resin storage unit 320 , a chuck 330 , an extrusion mechanism 340 and a resin dropping mechanism 350 .

[0059] <Resin delivery section 310>

[0060] Figure 2 and Figure 3 The resin delivery unit 310 shown in the figure delivers the small pieces of resin T to the resin storage unit 320 described later. The resin delivery unit 310 can deliver the small pieces of resin T stored inside to the front while arranging them.

[0061] <Resin Accommodating Section 320>

[0062] Figures 2 to 4The resin storage unit 320 shown in the figure stores and conveys the small pieces of resin T sent out from the resin sending unit 310 . The resin storage unit 320 is formed in a rectangular parallelepiped shape that is long in the left and right directions. The resin storage unit 320 includes a storage hole 321 .

[0063] The receiving hole 321 is a portion capable of receiving a small piece of resin T. The receiving hole 321 is formed in a manner that penetrates the resin receiving portion 320 from front to back. A plurality of receiving holes 321 are formed along the length direction (left-right direction) of the resin receiving portion 320. In addition, in the present embodiment, an example in which four receiving holes 321 are provided is shown, but the present invention is not limited thereto, and the number of receiving holes 321 can be arbitrarily changed.

[0064] The resin storage unit 320 can be moved in the left-right direction by an appropriate moving mechanism (e.g., a guide rail that guides the resin storage unit 320 so that it can move in the left-right direction, a servo motor that moves the resin storage unit 320 to an arbitrary position along the guide rail, etc.). The resin storage unit 320 can move in the left-right direction from the front of the resin delivery unit 310 through the front of the extrusion mechanism 340 described later.

[0065] <Chuck 330>

[0066] Figure 3 The chuck 330 shown in the figure delivers the small piece of resin T from the resin delivery part 310 to the resin storage part 320 . The chuck 330 holds the small piece of resin T delivered from the resin delivery part 310 and can store it in the storage hole 321 of the resin storage part 320 .

[0067] <Extrusion mechanism 340>

[0068] Figures 2 to 4 The extrusion mechanism 340 shown in the figure extrudes the small piece of resin T accommodated in the resin accommodation part 320 and delivers it to the resin dropping mechanism 350 described later. The extrusion mechanism 340 is arranged on the left side of the resin delivery part 310. The extrusion mechanism 340 mainly includes a cylindrical part 341 and a connecting part 342.

[0069] The cylindrical portion 341 is a portion from which the small piece of resin T is extruded. The cylindrical portion 341 is formed into a cylindrical shape with the length direction facing the front-back direction. A plurality of cylindrical portions 341 are provided along the left-right direction. In the present embodiment, the cylindrical portions 341 are provided in a number corresponding to the number of the receiving holes 321 of the resin receiving portion 320 (i.e., four). The intervals between the plurality of cylindrical portions 341 arranged along the left-right direction are formed in a manner that is the same as the intervals between the plurality of receiving holes 321 of the resin receiving portion 320.

[0070] The connecting portion 342 is a portion that connects the plurality of cylindrical portions 341. The connecting portion 342 is formed in a rectangular plate shape with the longitudinal direction facing the left-right direction. The rear ends of the plurality of cylindrical portions 341 are fixed to the front side surface of the connecting portion 342.

[0071] The extrusion mechanism 340 can be moved in the front-rear direction by an appropriate moving mechanism (for example, a guide rail that guides the connection part 342 so that it can move in the front-rear direction, a cylinder that moves the connection part 342 along the guide rail, etc.).

[0072] <Resin drop mechanism 350>

[0073] The resin dropping mechanism 350 drops the small pieces of resin T received from the resin storage unit 320 at a predetermined position and supplies the resin to the loader 400. The resin dropping mechanism 350 is arranged in front of the extrusion mechanism 340. The resin dropping mechanism 350 mainly includes a moving part 351, a lifting part 352, and a rotating part 353. Figure 2 and Figure 4 In the figure, for the sake of convenience, the illustration of the resin dropping mechanism 350 is partially omitted.

[0074] Figure 3 and Figure 4 The moving part 351 shown is a part that supports the lifting part 352 and the rotating part 353 described later and moves in the horizontal direction. The moving part 351 is formed in a rectangular parallelepiped shape that is long in the left and right directions.

[0075] The moving part 351 can be moved to any position in the front-to-back direction by an appropriate moving mechanism (e.g., a guide rail 351a that guides the moving part 351 so that it can move in the front-to-back direction, a servo motor that moves the moving part 351 along the guide rail 351a, etc.). The moving part 351 can be moved from the vicinity (directly in front) of the extrusion mechanism 340 to the interface 200 (see Figure 1 ) moves in the front-rear direction above the loader 400 above the upper portion. The moving portion 351 can move to any position within the movable range.

[0076] The lifting part 352 is a part that supports the rotating part 353 described later and moves (lifts and lowers) in the up-down direction relative to the moving part 351. The lifting part 352 is formed into a long strip shape that is long in the left and right directions by combining appropriate plate-like members and the like. The lifting part 352 is arranged below the moving part 351. The lifting part 352 is supported by the moving part 351 via appropriate members.

[0077] The lifting part 352 can be moved in the vertical direction relative to the moving part 351 by an appropriate moving mechanism (for example, a guide rail that guides the lifting part 352 so that it can move in the vertical direction, a cylinder that moves the lifting part 352 along the guide rail, etc.).

[0078] Figures 2 to 4The rotating part 353 shown is provided to be rotatable relative to the lifting part 352, and receives and conveys the small pieces of resin T delivered from the resin receiving part 320. The rotating part 353 is formed in a rectangular parallelepiped shape that is long in the left and right directions. The rotating part 353 includes a rotating shaft 353a and a receiving hole 353b.

[0079] The rotating shaft 353a is a portion that connects the rotating part 353 in a manner that allows it to rotate relative to the lifting part 352. The rotating shaft 353a is provided at the left and right ends of the rotating part 353. The rotating shaft 353a is configured so that the length direction is oriented in the left and right directions. The rotating part 353 can rotate around the rotating shaft 353a by power from a driving source (cylinder, etc.) not shown in the figure. Specifically, the rotating part 353 can rotate about 90 degrees from a position where the rotating part 353 faces rearward when viewed from the side (a position that protrudes rearward from the lifting part 352) to a position where the rotating part 353 faces downward (a position that protrudes downward from the lifting part 352) (refer to Figure 4 ).

[0080] The receiving hole 353b is a portion capable of receiving a small piece of resin T. The receiving hole 353b is formed in a manner that penetrates the rotating portion 353 in a state facing backward from front to back. A plurality of receiving holes 353b are formed along the length direction (left-right direction) of the rotating portion 353. In the present embodiment, the receiving holes 353b are provided in a number corresponding to the receiving holes 321 of the resin receiving portion 320 (i.e., four). The intervals between the plurality of receiving holes 353b arranged in the left-right direction are formed in a manner that is the same as the intervals between the plurality of receiving holes 321 of the resin receiving portion 320. A shutter 353c for preventing the received small piece of resin T from falling is provided in the receiving hole 353b. The shutter 353c can be opened / closed at any time.

[0081] <Supply form of small flake resin T>

[0082] Hereinafter, a case where the resin is supplied to the loader 400 using the resin supply unit 300 configured as described above will be described.

[0083] Furthermore, if Figure 1 and Figure 2 As shown, the forming die 700 (more specifically, the lower die) is formed with grooves 710 for accommodating small pieces of resin T used in resin molding. In this embodiment, the forming die 700 is formed with a plurality of groove rows 710L (three rows in the front-to-back direction in this embodiment), wherein the groove row 710L is formed with a plurality of grooves 710 arranged in a row along the left-right direction.

[0084] In addition, a receiving hole 410 for receiving and transporting the small piece of resin T is formed in the loader 400 that transports the small piece of resin T to the groove 710 of the forming mold 700. The receiving hole 410 is one embodiment of the hole portion of the present invention. A plurality of receiving holes 410 are arranged in a manner corresponding to the groove 710 of the forming mold 700. That is, in the loader 400, similarly to the forming mold 700, a plurality of (three rows in the front-to-back direction in the present embodiment) receiving hole rows 410L are formed, wherein the receiving hole row 410L is a plurality of receiving holes 410 arranged in a row along the left-right direction. The receiving hole row 410L is one embodiment of the hole portion row of the present invention. A shutter 411 (see FIG. 4 ) for preventing the received small piece of resin T from falling is provided in the receiving hole 410. Figure 4 ). The switch 411 can be opened / closed at any timing.

[0085] The resin supply unit 300 of the present embodiment can supply the small pieces of resin T to the plurality of rows of the receiving holes 410 of the loader 400 formed as described above.

[0086] When the resin sheet T is supplied from the resin supply unit 300 to the loader 400, first, Figure 2 As shown, the resin storage unit 320 moves rightward so as to be located in front of the resin delivery unit 310. The resin storage unit 320 stops so that the storage hole 321 located on the far left is located in front of the front end of the resin delivery unit 310 (the part for arranging the small pieces of resin T).

[0087] Next, the small pieces of resin T arranged in the resin delivery section 310 are delivered to each receiving hole 321 of the resin receiving section 320 by the chuck 330. At this time, the chuck 330 delivers the small pieces of resin T from the resin delivery section 310 to the receiving holes 321 on the front. Every time a small piece of resin T is delivered to a receiving hole 321, the resin receiving section 320 moves to the left at the interval of the receiving holes 321. The chuck 330 delivers the small pieces of resin T to the receiving holes 321 located on the front of the resin delivery section 310 in sequence. Thus, the small pieces of resin T are received in all the receiving holes 321.

[0088] When all the receiving holes 321 contain the small pieces of resin T, the resin receiving portion 320 moves to the left and stops in front of the extrusion mechanism 340. Figure 3 As shown, the resin dropping mechanism 350 stops (stands by) in front of the resin storage section 320 (standby position) in a state where the rotating section 353 is directed backward.

[0089] Then, if Figure 4As shown, the extrusion mechanism 340 moves forward, and each cylindrical portion 341 simultaneously extrudes the small pieces of resin T received in each receiving hole 321 of the resin receiving portion 320 forward. As a result, the small pieces of resin T are respectively delivered to the receiving holes 353b of the rotating portion 353 arranged in front of the receiving holes 321. When the small pieces of resin T are received in the receiving holes 353b of the rotating portion 353, the shutter 353c is closed to prevent the small pieces of resin T from falling.

[0090] Next, the resin drop mechanism 350 conveys the small piece of resin T to the delivery section 200 (see Figure 2 ) above the loader 400 waiting. Specifically, as Figure 4 As shown, the rotating part 353 containing the small pieces of resin T is lifted to a predetermined height by the lifting part 352. Thereafter, the moving part 351 moves forward, and the rotating part 353 rotates downward. The movement of the moving part 351 and the rotation of the rotating part 353 are performed in parallel. That is, the rotating part 353 rotates downward while moving forward. The moving part 351 stops above one of the receiving hole rows 410L of the loader 400. Figure 4 , an example is shown in which the moving portion 351 stops above the frontmost receiving hole row 410L.

[0091] Next, the rotating part 353 is lowered to a predetermined height by the lifting part 352. Thereafter, the shutter 353c is opened, and the small pieces of resin T fall downward from the downward receiving hole 353b due to the rotating action of the rotating part 353. The small pieces of resin T falling from the rotating part 353 are received in the receiving hole 410 of the loader 400.

[0092] After the resin dropping mechanism 350 transfers the small pieces of resin T to the loader 400 as described above, it returns to the front of the extrusion mechanism 340 (standby position). In addition, while the resin dropping mechanism 350 transfers the small pieces of resin T to the loader 400, the resin storage unit 320 receives the small pieces of resin T from the resin delivery unit 310 in parallel.

[0093] In this way, the resin supply unit 300 can collect and transport a plurality of small pieces of resin T in a row of receiving holes 410 (receiving hole row 410L) formed in the loader 400. By repeating the above operation multiple times, the small pieces of resin T are supplied to all the receiving holes 410 (receiving hole row 410L) of the loader 400.

[0094] Thereafter, the loader 400 receives the heated substrate 2 from the preheating unit 500 while moving linearly to the right as described above, and transports the small piece of resin T together with the substrate 2 to the forming die 700 (see Figure 1Specifically, the loader 400 moves above the forming mold 700 (more specifically, the lower mold) and places the substrate 2 on the upper surface of the lower mold. In addition, the loader 400 opens the shutter 411, thereby causing the small piece of resin T to fall downward and be supplied to the groove 710 of the forming mold 700.

[0095] Thus, in this embodiment, by using the resin receiving portion 320 that moves in the left-right direction and the resin dropping mechanism 350 that moves in the front-back direction, it is possible to cope with the molding die 700 (loader 400) designed in various shapes. That is, the resin dropping mechanism 350 can be moved back and forth to any position, so even if the position or number of the receiving hole array 410L formed in the loader 400 is changed, the small piece of resin T can be supplied accordingly.

[0096] In addition, the resin storage section 320 can be moved arbitrarily to the left and right, so that, for example, when the small pieces of resin T are delivered from the resin delivery section 310 to the resin storage section 320, the small pieces of resin T are not stored in all the storage holes 321, but only in any storage holes 321. Thus, even if the number of storage holes 410 formed in each storage hole row 410L of the loader 400 changes, the small pieces of resin T can be supplied accordingly.

[0097] In addition, in the present embodiment, the moving direction (left-right direction) of the resin receiving portion 320 and the moving direction (front-back direction) of the resin dropping mechanism 350 are set to intersect in a plan view, so that the space of the entire device can be saved. That is, as in the present embodiment, the resin receiving portion 320 and the resin dropping mechanism 350 can be arranged in a substantially L-shaped range in a plan view (see FIG. Figure 2 ), so the increase in the front and rear widths and the left and right widths can be suppressed. In addition, the space in front of the resin receiving portion 320 and to the right of the resin dropping mechanism 350 can be flexibly used (in the present embodiment, a preheating portion 500 is provided), so that the overall space saving of the device can be achieved. Furthermore, in the present embodiment, an example is shown in which the moving direction of the resin receiving portion 320 and the moving direction of the resin dropping mechanism 350 are substantially orthogonal when viewed from above. Here, the so-called substantially orthogonal refers to a state of being vertical or intersecting with a certain error from the vertical, for example, a state of being intersecting at a degree of not less than 85° and not more than 95°.

[0098] As described above, the resin molding device 1 of the present embodiment includes: a resin receiving section 320, which receives a plurality of small pieces of resin T while moving along a first direction (left-right direction); a resin dropping mechanism 350, which moves along a second direction (front-back direction) intersecting the first direction and can cause the received plurality of small pieces of resin T to fall by a rotational action; an extrusion mechanism 340, which extrude the plurality of small pieces of resin T received in the resin receiving section 320 and receive them in the resin dropping mechanism 350; a loader 400 (conveying mechanism), which is provided with a receiving hole 410 (hole portion) for receiving the small pieces of resin T dropped from the resin dropping mechanism 350; and a resin molding module 20 (resin molding section), which is provided with a molding die 700, which is provided with a groove 710 for supplying the small pieces of resin T conveyed by the loader 400, and resin molding is performed on a substrate 2 (resin molding object) using the small pieces of resin T supplied to the molding die 700.

[0099] This configuration can improve the versatility of the resin molding apparatus 1. That is, by using the resin storage unit 320 and the resin drop mechanism 350 that can move in different directions, it is possible to cope with the molding die 700 (loader 400) designed in various shapes.

[0100] In addition, the resin dropping mechanism 350 can perform the movement along the second direction and the rotation operation in parallel.

[0101] With such a configuration, a plurality of operations are performed in parallel, thereby achieving a reduction in the time required for the resin molding process.

[0102] In addition, the extrusion mechanism 340 includes a plurality of cylindrical parts 341 capable of simultaneously extruding a plurality of the small pieces of resin T.

[0103] With such a configuration, a plurality of small pieces of resin T can be collectively accommodated in the resin dropping mechanism 350 , and thus the time required for the resin molding process can be shortened.

[0104] In addition, the loader 400 transfers the small piece of resin T together with the substrate 2 to the forming die 700 .

[0105] With such a configuration, the substrate 2 and the small pieces of resin T can be collectively conveyed, and thus the time required for the resin molding process can be shortened.

[0106] The molding die 700 is provided with a plurality of groove rows 710L, wherein the plurality of groove rows 710L are formed by arranging the plurality of grooves 710 in a row, and the loader 400 is provided with a plurality of receiving hole rows 410L (hole portion rows), wherein the plurality of receiving hole rows 410L (hole portion rows) include the plurality of receiving holes 410 arranged in a manner corresponding to the plurality of groove rows 710L. The resin dropping mechanism 350 can be moved to any position in the second direction so as to be able to move above the plurality of receiving hole rows 410L of the loader 400.

[0107] With such a configuration, the resin drop mechanism 350 can be used to supply the small pieces of resin T to the plurality of receiving hole rows 410L. In addition, even if the position or number of the receiving hole rows 410L is changed, the small pieces of resin T can be supplied accordingly.

[0108] In addition, the resin molding device 1 also includes a preheating unit 500 (heating unit), which is arranged between the resin dropping position (above the junction 200) where the resin dropping mechanism 350 causes the small piece of resin T to drop and the molding mold 700, so as to heat the substrate 2 before resin molding. The loader 400 can move in a linear manner by passing through the resin dropping position, the preheating unit 500 and the molding mold 700.

[0109] By configuring in this manner, the moving direction of the loader 400 can be made linear, so that the structure (especially the structure related to the movement of the loader 400) can be simplified.

[0110] In addition, the method for manufacturing a resin molded product according to the present embodiment manufactures a resin molded product using the resin molding apparatus 1 described above.

[0111] By configuring in this manner, the versatility of the resin molding apparatus 1 can be improved.

[0112] As mentioned above, although embodiment of this invention was described, this invention is not limited to this embodiment, It can change suitably within the range of the technical idea of ​​the invention described in a claim.

[0113] For example, the components (supply module 10, etc.) used in the resin molding device 1 of the embodiment are examples, and can be appropriately loaded, unloaded or replaced. For example, the number of resin molding modules 20 can be changed, or a carry-out module for carrying out the resin-sealed substrate 2 can be further provided. In addition, the structure or operation of the components (supply module 10, etc.) used in the resin molding device 1 of the present embodiment is an example, and can be appropriately changed.

[0114] In addition, in this embodiment, the resin receiving portion 320 moves in the left-right direction (first direction) and the resin dropping mechanism 350 moves in the front-back direction (second direction) (an example of moving in directions orthogonal to each other) is shown, but the present invention is not limited to this. That is, as long as both move in directions intersecting with each other (non-parallel), the specific directions are not limited.

[0115] In the present embodiment, the resin dropping mechanism 350 moves forward and rotates the rotating portion 353 in parallel (see Figure 4 ), but the present invention is not limited thereto, and for example, it is also possible to move and rotate in sequence. In addition, the operation of the resin drop mechanism 350 is an example and can be changed arbitrarily. For example, in this embodiment, an example of moving the rotating part 353 up and down (lifting and lowering) is illustrated, but it is not necessarily necessary to lift and lower the rotating part 353.

[0116] In addition, in the present embodiment, the extrusion mechanism 340 extrude a plurality of small pieces of resin T simultaneously, but the present invention is not limited thereto, and for example, a structure in which the resin pieces T are extruded one by one in sequence may also be employed.

Claims

1. A resin molding device, comprising: The resin receiving portion receives a plurality of small pieces of resin while moving in the left-right direction; The resin dropping mechanism moves in the front-rear direction and can drop the plurality of small pieces of resin contained therein by a rotational action; An extrusion mechanism that extrudes the plurality of small pieces of resin contained in the resin containing portion and contains them in the resin dropping mechanism; A conveying mechanism, provided with a plurality of hole portion rows, the plurality of hole portion rows including a plurality of hole portions, the plurality of hole portions receiving the small pieces of resin dropped from the resin dropping mechanism; as well as The resin forming section is provided with a forming mold, wherein the forming mold is provided with a plurality of slots arranged in a row for supplying the small pieces of resin conveyed by the conveying mechanism, wherein the slots are arranged in a row, and a resin forming object is resin-formed using the plurality of small pieces of resin supplied to the forming mold. wherein the plurality of hole columns are arranged in a manner corresponding to the plurality of groove columns, The resin dropping mechanism can be moved to any position in the front-rear direction so as to be able to move above the plurality of hole columns of the conveying mechanism. The resin dropping mechanism supplies a plurality of the small pieces of resin and collects the plurality of the small pieces of resin into a plurality of the hole portions included in one hole portion row. The resin dropping mechanism moves to above each of the plurality of hole portions rows, and repeats an operation of supplying a plurality of small resin pieces and collecting the plurality of small resin pieces in the plurality of holes included in the hole portions rows.

2. The resin molding device according to claim 1, wherein: The resin dropping mechanism can perform the movement along the front-rear direction and the rotation operation in parallel.

3. The resin molding device according to claim 1 or 2, wherein: The extrusion mechanism includes a plurality of cylindrical parts capable of simultaneously extruding a plurality of the small pieces of resin.

4. The resin molding device according to claim 1 or 2, wherein: The conveying mechanism conveys the small piece of resin together with the resin molding object to the molding die.

5. The resin molding device according to claim 1 or 2, further comprising a heating unit, The heating unit is disposed between a resin dropping position where the resin dropping mechanism drops the small pieces of resin and the molding die, and heats the resin molding object before resin molding. The conveying mechanism is capable of linearly moving so as to pass through the resin dropping position, the heating unit, and the forming mold. 6 . A method for producing a resin molded product, comprising producing the resin molded product using the resin molding apparatus according to claim 1 .

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