Semiconductor measuring equipment

Abstract

The present invention provides a semiconductor measurement device, including: a frame, a beam, an optical probe, a beam adjustment assembly, a plurality of locking members, and a plurality of wedges; the optical probe is mounted on the beam, and a connecting portion is provided at both ends of the beam, the locking member and the beam adjustment assembly are used to mount the beam on the frame at the connecting portion, and the beam adjustment assembly is used to adjust the position of the beam and thus adjust the position of the optical probe; the beam adjustment assembly includes at least three adjustment units: a first adjustment unit arranged at a first connection point of the connecting portion at the first end of the beam, a second adjustment unit arranged at a second connection point of the connecting portion at the second end of the beam, and a third adjustment unit arranged at a third connection point of the connecting portion at the second end of the beam, and the first connection point, the second connection point, and the third connection point are not collinear; the wedge is fixed on the frame, and the wedge is arranged between the connecting portion and the frame. Through the present application, it is achieved to simultaneously meet the accuracy requirements of the incident angle of the optical lens and the stability of the structure.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor measurement technology, and in particular to a semiconductor measurement device. Background Art

[0002] In the field of semiconductor measurement equipment, optical lenses are the core components of semiconductor measurement equipment. In order to achieve the best measurement effect on silicon wafers, the optical lens has extremely high precision requirements for the incident angle (the angle between the optical axis and the silicon wafer surface). If the incident angle of the optical lens after installation does not meet the precision requirements, it will have a great impact on the final measurement error. The precision requirements of the incident angle cannot be directly controlled by mechanical processing accuracy. Therefore, it is particularly important to adjust the accuracy of the incident angle by using adjustment components to meet the precision requirements of the incident angle. In addition, while meeting the precision requirements of the incident angle of the optical lens, the stability of the optical lens structure also needs to be guaranteed.

[0003] However, when adjusting the incident angle accuracy of an optical lens, it is difficult for the semiconductor measurement equipment in the prior art to simultaneously meet the requirements of the incident angle accuracy of the optical lens and the stability of the structure.

[0004] In view of this, it is necessary to improve the measurement accuracy of semiconductor measurement equipment in the prior art to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to disclose a semiconductor measurement device for solving the many defects in the measurement accuracy of semiconductor measurement devices in the prior art, especially for achieving the simultaneous satisfaction of the accuracy requirements of the incident angle of the optical lens and the stability of the structure.

[0006] To achieve the above-mentioned object, the present invention provides a semiconductor measurement device, comprising: a frame, a beam, an optical probe, a beam adjustment assembly, a plurality of locking members, and a plurality of wedge blocks;

[0007] The optical probe is mounted on the crossbeam, and connecting parts are provided at both ends of the crossbeam. The locking member and the crossbeam adjustment assembly are used to mount the crossbeam on the frame at the connecting parts, and the crossbeam adjustment assembly is used to adjust the position of the crossbeam and thus adjust the position of the optical probe;

[0008] The beam adjustment assembly comprises at least three adjustment units: a first adjustment unit arranged at a first connection point of the first end connection portion of the beam, a second adjustment unit arranged at a second connection point of the second end connection portion of the beam, and a third adjustment unit arranged at a third connection point of the second end connection portion of the beam, wherein the first connection point, the second connection point and the third connection point are not collinear;

[0009] The wedge block is fixed on the frame and is arranged between the connecting part and the frame. The wedge block is constructed with an inclined surface supporting the bottom of the connecting part, and the wedge block is correspondingly arranged between the connecting part area at at least one of the first connecting point, the second connecting point and the third connecting point and the frame.

[0010] As a further improvement of the present invention, the crossbeam includes a plate area at the middle end, and the optical probe is fixed on the same side of the plate area.

[0011] As a further improvement of the present invention, a first connection line is formed between the first connection point and the second connection point, a second connection line is formed between the second connection point and the third connection point, and the first connection line is perpendicular to the second connection line.

[0012] As a further improvement of the present invention, the first adjustment unit, the second adjustment unit and the third adjustment unit are all top screws, and threaded openings matching the top screws are provided at the first connection point, the second connection point and the third connection point of the beam.

[0013] As a further improvement of the present invention, when the first adjustment unit is rotated, it is used to adjust the deflection amount of the optical probe along the second connecting line;

[0014] When the third adjustment unit is rotated, it is used to adjust the deflection amount of the optical probe along the first connecting line;

[0015] When the first adjustment unit, the second adjustment unit and the third adjustment unit are rotated simultaneously, the vertical position of the optical probe is adjusted.

[0016] As a further improvement of the present invention, the wedge block includes at least one separation area, which is recessed in the inclined surface and is used to divide the inclined surface into a plurality of sub-supporting surfaces, and the sub-supporting surfaces form contact points with the bottom of the connecting portion to support the beam.

[0017] As a further improvement of the present invention, the wedge blocks are correspondingly arranged between the connection area where the first connection point is located, the connection area where the second connection point is located, and the connection area where the third connection point is located and the frame.

[0018] As a further improvement of the present invention, the contact point formed by the wedge block corresponding to the connection point and the area enclosed by the corresponding connection point form a locking area, and the locking piece is arranged in the locking area.

[0019] As a further improvement of the present invention, the wedge blocks are configured to have a number that is the same as or greater than the number of the adjustment units.

[0020] As a further improvement of the present invention, an opening is provided on the end of the wedge block, and the wedge block is fixed to the frame by a screw through the opening. A thread groove matching the screw is provided on the frame, and the position of the contact point formed on the inclined surface of the wedge block is adjusted by adjusting the position of the screw in the thread groove.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] Three adjustment units form three connection points with the beam and form three-point supports for the beam. Since the three adjustment units are not collinear, the position of the beam can be adjusted by controlling the three adjustment units to achieve adjustment of the optical probe in the three degrees of freedom directions of Rx, Ry, and Z to meet the incident angle accuracy requirements of the optical probe.

[0023] At the same time, since a wedge block is correspondingly arranged between the connection area at at least one of the three connection points and the frame, the wedge block can form an area for installing the locking piece together with the corresponding adjustment unit while supporting the crossbeam. By installing the locking piece at the center of the area between the wedge block and the adjustment unit, the stability of the locking piece in fixing the crossbeam can be increased, thereby achieving the effect of simultaneously meeting the requirements of the incident angle accuracy of the optical lens and the stability of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A perspective view of a semiconductor measuring device according to the present invention;

[0025] Figure 2 It is a partial top view of a semiconductor measurement device;

[0026] Figure 3 It is a partial cross-sectional view of a semiconductor measurement device;

[0027] Figure 4 for Figure 2 A partial top view of the

[0028] Figure 5 is a top view of the wedge;

[0029] Figure 6 This is a front view of the wedge.

[0030] Reference numerals:

[0031] 1. silicon wafer; 10. rack; 20. beam; 201. plate area; 21. connection part; 21a. first end connection part; 21b. second end connection part; 211. connection point; 211a. first connection point; 211c. second connection point; 211b. third connection point; 211ab. first connection line; 211cb. second connection line; 30. optical probe; 301. output optical component; 302. detection light academic component; 40, wafer carrier; 50, beam adjustment component; 51, adjustment unit; 51a, first adjustment unit; 51b, second adjustment unit; 51c, third adjustment unit; 511, top screw; 512, threaded opening; 523, opening; 53, locking area; 54, locking member; 551, threaded groove; 55, screw; 52, wedge block; 522, partition area; 521, inclined surface; 5211, sub-supporting surface. DETAILED DESCRIPTION

[0032] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0033] It should be understood that, in the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present technical solution and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present technical solution.

[0034] Please refer to Figures 1 to 6 A specific embodiment of a semiconductor measurement device is disclosed. For example, the semiconductor measurement device can be an ellipsometric measurement device, and can perform critical dimension (CD) features such as line width, side wall angle (SWA), height / depth, film thickness or overall morphology measurement of two-dimensional or three-dimensional samples in various process stages such as after-development inspection (ADI) and after-etching inspection (AEI) on silicon wafers (e.g., wafers).

[0035] The semiconductor measurement equipment disclosed in this embodiment can simultaneously meet the accuracy requirements of the incident angle of the optical probe 30 and the stability of the structure when adjusting the optical probe 30. The optical probe 30 includes an output optical component 301 for emitting incident light to the surface of the silicon wafer 1, and the incident light forms an incident angle on the surface of the silicon wafer 1. After the incident light is reflected by the silicon wafer 1, reflected light (and diffuse reflected light) is formed and the reflected light (and diffuse reflected light) is detected by the detection optical component 302 to characterize the surface morphology data of the silicon wafer 1. The output optical component 301 and the detection optical component 302 are symmetrically arranged relative to the silicon wafer 1, and the output optical component 301 and the detection optical component 302 are both fixed on the beam 20. The optical probe 30 is adjusted along the beam 20 by three non-collinear adjustment units 51. Figure 2 Rotate along the X or Y axis, or Figure 2 The middle Z axis is raised and lowered to adjust the incident angle of the optical probe 30 relative to the silicon wafer 1 so that the incident angle meets the accuracy requirements, and adjust the position and size of the elliptical measuring spot formed by the incident light on the surface of the silicon wafer 1. At the same time, the crossbeam 20 is supported by the wedge block 52, and the locking member 54 is installed at the center of the area between the wedge block 52 and the adjustment unit 51, so that the locking member 54 can increase the stability of the crossbeam 20, so as to improve the stability of the optical probe 30 structure. The specific implementation method of a semiconductor measurement device disclosed in this application is described in detail below.

[0036] Ginseng Figure 1 and Figure 2 As shown, in this embodiment, the semiconductor measurement equipment includes: a frame 10, a beam 20, an optical probe 30, a beam adjustment assembly 50, a plurality of locking members 54, and a plurality of wedge blocks 52; the optical probe 30 is installed on the beam 20, and connecting parts 21 are provided at both ends of the beam 20. The locking members 54 and the beam adjustment assembly 50 are used to install the beam 20 on the frame 10 at the connecting parts 21, and the beam adjustment assembly 50 is used to adjust the position of the beam 20 and thereby adjust the position of the optical probe 30. The beam 20 is mounted on the frame 10, and the connecting parts 21 at both ends of the beam 20 are fixed to the frame 10 by means of the locking member 54 and the beam adjustment assembly 50, so that the beam 20 can be fixed on the frame 10, and the height positions of the connecting parts 21 at both ends of the beam 20 are longitudinally adjusted simultaneously or separately by means of the beam adjustment assembly 50, so that the optical probe 30 on the beam 20 can be adjusted in the directions of three degrees of freedom Rx, Ry, and Z, so that the incident angle of the optical probe 30 relative to the silicon wafer 1 meets the accuracy requirements.

[0037] Specifically, Figure 1 , Figure 2 and Figure 4As shown, the beam adjustment assembly 50 includes at least three adjustment units 51: a first adjustment unit 51a arranged at a first connection point 211a of the first end connection portion 21a of the beam 20, a second adjustment unit 51b arranged at a second connection point 211c of the second end connection portion 21b of the beam 20, and a third adjustment unit 51c arranged at a third connection point 211b of the second end connection portion 21b of the beam 20, the first connection point 211a, the second connection point 211c and the third connection point 211b are not collinear.

[0038] Exemplarily, non-collinearity means that when the first adjustment unit 51a, the second adjustment unit 51b and the third adjustment unit 51c are respectively arranged at the first end connection portion 21a and the second end connection portion 21b of the beam 20, the first adjustment unit 51a, the second adjustment unit 51b and the third adjustment unit 51c are distributed in a triangle along the top view, and the maximum internal angle of the triangle can be 90°, or greater than 90°, or even less than 90°, as long as it can be achieved that the beam 20 can rotate along the first connecting line 211ac or the second connecting line cb when adjusting any adjustment unit 51, in this embodiment, the maximum internal angle of the triangle is preferably 90°.

[0039] Exemplarily, at least three adjustment units 51 may be provided, or more than three may be provided, as long as any three adjustment units 51 are respectively arranged at the two ends of the beam 20 and are in a triangular shape along the top view angle to enable the optical probe 30 to be adjusted in three degrees of freedom. In this embodiment, there are preferably three adjustment units 51, namely a first adjustment unit 51a, a second adjustment unit 51b and a third adjustment unit 51c, and the three adjustment units 51 are respectively arranged at the first end connection portion 21a and the second end connection portion 21b of the beam 20 and form a first connection point 211a, a second connection point 211c and a third connection point 211b accordingly. Since the first connection point 211a, the second connection point 211c and the third connection point 211b are not collinear, when one of the adjustment units 51 is adjusted, the crossbeam 20 can drive the optical probe 30 to rotate along the connecting line between the other two adjustment units 51. When the three adjustment units 51 are adjusted at the same time, the crossbeam 20 will be driven to make the optical probe 30 rise and fall along the Z axis, so that the optical probe 30 can be adjusted in the directions of three degrees of freedom, so that the incident angle of the optical probe 30 relative to the silicon wafer 1 meets the accuracy requirements.

[0040] Specifically, Figures 1 to 4As shown, the wedge block 52 is fixed on the frame 10, and the wedge block 52 is arranged between the connecting portion 21 and the frame 10. The wedge block 52 is constructed with an inclined surface 521 for supporting the bottom of the connecting portion 21, and a wedge block 52 is correspondingly arranged between the connecting portion area at at least one of the first connecting point 211a, the second connecting point 211c and the third connecting point 211b and the frame 10. After the incident angle of the optical probe 30 relative to the silicon wafer 1 meets the accuracy requirement, there is a certain inclination angle between the beam 20 and the frame 10 (the inclination angle is the angle formed by the inclination of the frame 10 along the Y-axis direction and the connecting portion 21 of the beam 20 along the Z-axis direction). A plurality of wedge blocks 52 can be installed between the connecting portion 21 and the frame 10, and the inclined surface 521 of the wedge block 52 is close to the bottom of the connecting portion 21 of the beam 20, so that the wedge block 52 can support the connecting portion 21, so as to improve the stability of the beam 20 installed on the frame 10.

[0041] Exemplarily, the inclined surface 521 can be configured as a plane or a curved surface, as long as it can be close to the bottom of the connecting portion 21 of the beam 20. The present embodiment is preferably a plane, so that the wedge block 52 can support the beam 20, and is conducive to improving the adjustment accuracy along the Z-axis direction, and the adjustment has a linear effect. Optionally, the bottom of the connecting portion 21 of the beam 20 can be set to a rounded corner to increase the contact area between the bottom of the connecting portion 21 of the beam 20 and the inclined surface 521, increase the friction between the bottom of the connecting portion 21 of the beam 20 and the inclined surface 521, increase the contact strength between the bottom of the connecting portion 21 of the beam 20 and the inclined surface 521, prevent the beam 20 from sliding and deviating on the inclined surface 521 of the wedge block 52 along the inclination direction of the inclined surface 521, thereby avoiding the adjustment accuracy of the optical probe 30 and the stability of the structure affected by the sliding deviation of the beam 20.

[0042] like Figure 1 and Figure 2 As shown, the crossbeam 20 includes a plate area 201 at the middle end, and the optical probe 30 is fixed on the same side of the plate area 201. Figure 2As shown, a first connection line 211ac is formed between the first connection point 211a and the second connection point 211c, and a second connection line 211cb is formed between the second connection point 211c and the third connection point 211b. The first connection line 211ac is perpendicular to the second connection line 211cb. When the first adjustment unit 51a located at the first connection point 211a is adjusted, the beam 20 will rotate along the second connection line 211cb, that is, rotate along the Y axis, so that the optical probe 30 is adjusted in the Ry direction. When the third adjustment unit 51c located at the third connection point 211b is adjusted, the beam 20 will rotate along the first connection line 211ac, that is, rotate along the X axis, so that the optical probe 30 is adjusted in the Rx direction. When the first adjustment unit 51a, the second adjustment unit 51b and the third adjustment unit 51c are adjusted at the same time, the beam 20 will drive the optical probe 30 to move longitudinally, that is, move along the Z direction, so that the optical probe 30 is adjusted in the Z direction. Based on the above technical solution, the optical probe 30 can be adjusted in the three degrees of freedom directions of Rx, Ry and Z, so that the incident angle of the optical probe 30 relative to the silicon wafer 1 meets the accuracy requirements.

[0043] like Figure 3 As shown, the first adjustment unit 51a, the second adjustment unit 51b, and the third adjustment unit 51c are all top screws 511, and the first connection point 211a, the second connection point 211c, and the third connection point 211b of the beam 20 are all provided with threaded openings 512 matching the top screws 511. Exemplarily, the adjustment unit 51 can be configured as a top screw or a bolt, as long as it can realize the longitudinal movement of the end of the beam 20. The present embodiment is preferably a top screw 511, because the first connection point 211a, the second connection point 211c, and the third connection point 211b of the beam 20 are all provided with threaded openings 512 matching the top screw 511, so that the top screw 511 can pass through the threaded openings 512, and the top screw 511 can be rotated along the Z axis to drive the end of the beam 20 to move longitudinally, thereby adjusting the incident angle accuracy of the optical probe 30 so that the incident angle accuracy meets the requirements.

[0044] like Figure 2 As shown, when the first adjustment unit 51a is rotated, it is used to adjust the deflection amount Ry of the optical probe 30 along the second line 211cb (Y axis); when the third adjustment unit 51c is rotated, it is used to adjust the deflection amount Rx of the optical probe 30 along the first line 211ac (X axis); when the first adjustment unit 51a, the second adjustment unit 51b, and the third adjustment unit 51c are rotated at the same time, they are used to adjust the vertical movement amount Z of the optical probe 30.

[0045] Specifically, the adjustment accuracy formulas of Rx, Ry, and Z are as follows:

[0046] H = (T / 360°) × β;

[0047] R Y =α Y =arcran(H / L1)=arcran((T / 360°)×β / L1);

[0048] R x =α x =arcran(H / L2)=arcran((T / 360°)×β / L2);

[0049] Z=H=(T / 360°)×β.

[0050] The parameter L1 represents the distance between the first connection point 211a and the third connection point 211b, the parameter L2 represents the distance between the first connection point 211b and the second connection point 211c, the parameter H represents the adjustment amount of the top screw 511, and the parameter α x , α Y They respectively represent the adjustment angles of the optical probe 30 along the X-axis and the Y-axis, the parameter T represents the pitch of the top screw 511 , and the parameter β represents the rotation angle of the top screw 511 .

[0051] Specifically, the size of parameter L1 and parameter L2 is designed according to the spatial size of the optical probe 30 and the required adjustment accuracy. When the size of parameter L1 and parameter L2 is larger and parameter T is smaller, the adjustment accuracy is higher. Parameter β is the rotation angle of the top screw 511. Generally, a rotation of 5° is easier to achieve. For example, the adjustment accuracy calculation under a specific working condition is given as follows: when parameter L1 = 900mm, parameter L2 = 200mm, parameter T = 0.5mm (the minimum pitch for conventional processing), parameter β = 5°, then R X , R Y , Z adjustment resolution is as follows:

[0052] R Y =α Y =arcran((T / 360°)×β / L1)=arcran((0.5 / 360°)×5° / 900)=0.000442°;

[0053] R x =α x =arcran((T / 360°)×β / L2)=arcran((0.5 / 360°)×5° / 200)=0.0019°;

[0054] Z=(T / 360°)×β=(0.5 / 360°)×5°=0.0069mm.

[0055] like Figures 4 to 6As shown, the wedge block 52 includes at least one separation area 522 , which is recessed in the inclined surface 521 to divide the inclined surface 521 into a plurality of sub-supporting surfaces 5211 . The sub-supporting surfaces 5211 form contact points with the bottom of the connecting portion 21 to support the crossbeam 20 . Exemplarily, a separation area 522 can separate the inclined surface 521 into two sub-supporting surfaces 5211, thereby creating a distance between the two sub-supporting surfaces 5211, and further creating a distance between the contact points (not shown) formed between the sub-supporting surfaces 5211 and the end of the beam 20. If the distance between the two sub-supporting surfaces 5211 is larger, the greater the stability of the locking member 54 in locking the end of the beam 20 when the sub-supporting surfaces 5211 support the beam 20; when the separation area 522 is configured as more than one, the inclined surface 521 can be separated into several sub-supporting surfaces 5211 to increase the contact points (not shown) formed between the inclined surface 521 and the end of the beam 20, thereby improving the stability of the locking member 54 in locking the end of the beam 20.

[0056] like Figure 2 As shown, wedges 52 are correspondingly arranged between the connection area where the first connection point 211a is located, the connection area where the second connection point 211c is located, and the connection area where the third connection point 211b is located and the frame 10. Since wedges 52 are correspondingly arranged between the connection areas where the three connection points 211 are located and the frame 10, the wedges 52 can be arranged correspondingly with the adjustment units 51 located at the connection points 211, so that the locking member 54 located at the center of the area between the wedges 52 and the adjustment units 51 can make the connection part 21 of the beam 20 evenly stressed when locking the connection part 21 of the beam 20, thereby increasing the stability of the locking member 54 locking the connection part 21 of the beam 20, thereby improving the stability of the structure of the optical probe 30.

[0057] like Figure 3 and Figure 4As shown, the contact points formed by the wedge block 52 corresponding to the connection point 211 and the area enclosed by the corresponding connection point 211 form a locking area 53, and a locking member 54 is arranged in the locking area 53. Exemplarily, since the contact points (not shown) formed by the wedge block 52 and the bottom of the connecting portion 21 of the beam 20 are all on a straight line, the area enclosed by the contact point (not shown) and the connection point 211 is triangular in a top view. At the same time, a plurality of separation areas 522 divide the inclined surface 521 into a plurality of sub-supporting surfaces 5211, so that the sub-supporting surfaces 5211 and the bottom of the connecting portion 21 of the beam 20 form a plurality of contact points (not shown), wherein the two contact points (not shown) farthest from each other will determine whether the locking area 53 is a normal triangle or an isosceles triangle or an equilateral triangle. The present embodiment is preferably an equilateral triangle. At the same time, the locking piece 54 can be set at any position of the locking area 53. In this embodiment, the locking piece 54 is preferably set at the center of the locking area 53 in the shape of an equilateral triangle (not shown), so that when the locking piece 54 locks the connecting portion 21 of the beam 20, the locking area 53 in the shape of an equilateral triangle located at the connecting portion 21 of the beam 20 can be uniformly stressed, thereby increasing the stability of the locking piece 54 locking the connecting portion 21 of the beam 20, thereby improving the stability of the optical probe 30 structure.

[0058] like Figure 1 and Figure 2 As shown, the wedge blocks 52 are configured to be the same as or greater than the number of the adjustment units 51. The locking members 54 are configured to be the same as or greater than the number of the adjustment units 51. Exemplarily, when the wedge blocks 52 and the locking members 54 are both configured to be the same as the number of the adjustment units 51, the locking members 54 are arranged between the wedge blocks 52 and the adjustment units 51, which can increase the stability of the locking members 54 on the connection part 21 of the beam 20; when the wedge blocks 52 and the locking members 54 are both configured to be greater than the number of the adjustment units 51, the stability of the support for the beam 20 can be increased by a plurality of wedge blocks 52, so as to improve the structural rigidity of the beam 20, and the stability of the locking of the connection part 21 of the beam 20 can be further increased by a plurality of locking members 54, so as to improve the stability of the structure of the optical probe 30.

[0059] like Figures 3 to 6As shown, an opening 523 is provided at the end of the wedge block 52, and the wedge block 52 is fixed to the frame 10 through the opening 523 by a screw 55. A threaded groove 551 (not shown) matching the screw 55 is provided on the frame 10, and the wedge block 52 is guided by the screw 55 to move along the opening 523 to adjust the position of the contact point formed on the inclined surface 521 of the wedge block 52. Exemplarily, at least one opening 523 may be provided at the end of the wedge block 52. When two or more openings 523 are provided, the two or more openings 523 are arranged in parallel in the distribution direction of the wedge block 52, so that the wedge block 52 can move along the distribution direction of the openings 523. When the wedge block 52 supports the cross beam 20, the screw 55 can be passed through the opening 523 and inserted into the threaded groove 551 (not shown), and the wedge block 52 can be fixed on the frame 10 by tightening the screw 55. When the position of the wedge block 52 needs to be adjusted, the wedge block 52 can be controlled to slide on the frame 10 so that the wedge block 52 will move along the distribution direction of the opening 523 under the guidance of the screw 55, so as to adjust the contact point position formed on the inclined surface 521 of the wedge block 52.

[0060] Exemplarily, the semiconductor measurement device further includes a wafer stage 40, which is fixed on the frame 10 and located below the bottom of the optical probe 30. The wafer stage 40 is used to place the silicon wafer 1, and the wafer stage 40 can be moved along the Figure 1 The wafer stage 40 drives the silicon wafer 1 to move horizontally in the X, Y and Z directions so that the optical probe 30 can measure different potentials of the silicon wafer 1. The wafer stage 40 drives the silicon wafer 1 to move to the best focal plane of the optical probe 30 so as to achieve the best measurement effect of the optical probe 30 on the silicon wafer 1.

[0061] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0062] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0063] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor measurement device, characterized in that: include: Frame, beam, optical probe, beam adjustment assembly, several locking parts, several wedges; The optical probe is mounted on the crossbeam, and connecting parts are provided at both ends of the crossbeam. The locking member and the crossbeam adjustment assembly are used to mount the crossbeam on the frame at the connecting parts, and the crossbeam adjustment assembly is used to adjust the position of the crossbeam and thus adjust the position of the optical probe; The beam adjustment assembly includes at least three adjustment units: a first adjustment unit arranged at a first connection point of the first end connection portion of the beam, a second adjustment unit arranged at a second connection point of the second end connection portion of the beam, and a third adjustment unit arranged at a third connection point of the second end connection portion of the beam, the first adjustment unit forms a first connection point corresponding to the first end connection portion of the beam, the second adjustment unit and the third adjustment unit form a second connection point and a third connection point corresponding to the second end connection portion of the beam, the first connection point, the second connection point and the third connection point are not collinear, and the first adjustment unit, the second adjustment unit and the third adjustment unit are distributed in a triangle; The wedge block is fixed on the frame and is arranged between the connecting part and the frame. The wedge block is constructed with an inclined surface supporting the bottom of the connecting part, and the wedge block is correspondingly arranged between the connecting part area at at least one of the first connecting point, the second connecting point and the third connecting point and the frame.

2. The semiconductor measurement device according to claim 1, characterized in that: The crossbeam comprises a plate area at the middle end, and the optical probe is fixed on the same side of the plate area.

3. The semiconductor measurement device according to claim 1, characterized in that: A first connection line is formed between the first connection point and the second connection point, a second connection line is formed between the second connection point and the third connection point, and the first connection line is perpendicular to the second connection line.

4. The semiconductor measurement device according to claim 3, characterized in that: The first adjustment unit, the second adjustment unit, and the third adjustment unit are all top screws, and the first connection point, the second connection point, and the third connection point of the crossbeam are all provided with threaded openings matching the top screws.

5. The semiconductor measurement device according to claim 4, characterized in that: When the first adjustment unit is rotated, it is used to adjust the deflection amount of the optical probe along the second connecting line; When the third adjustment unit is rotated, it is used to adjust the deflection amount of the optical probe along the first connecting line; When the first adjustment unit, the second adjustment unit and the third adjustment unit are rotated simultaneously, the vertical position of the optical probe is adjusted.

6. The semiconductor measurement device according to any one of claims 1 to 5, characterized in that: The wedge block includes at least one separation area, which is recessed in the inclined surface and is used to divide the inclined surface into a plurality of sub-supporting surfaces. The sub-supporting surfaces form contact points with the bottom of the connecting portion to support the crossbeam.

7. The semiconductor measurement device according to claim 6, characterized in that: The wedge blocks are correspondingly arranged between the connection area where the first connection point is located, the connection area where the second connection point is located, the connection area where the third connection point is located and the frame.

8. The semiconductor measurement device according to claim 7, characterized in that: The contact points formed by the wedge blocks corresponding to the connection points and the areas enclosed by the corresponding connection points form a locking area, and the locking piece is arranged in the locking area.

9. The semiconductor measurement device according to claim 6, characterized in that: The wedges are configured to be the same in number as or greater in number than the adjustment units.

10. The semiconductor measurement device according to claim 6, wherein: An opening is set at the end of the wedge block, and the wedge block is fixed to the frame through the opening by a screw. A thread groove matching the screw is opened on the frame, and the wedge block can move along the opening under the guidance of the screw to adjust the position of the contact point formed on the inclined surface of the wedge block.

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