Display panel manufacturing method and display panel

Abstract

The present application discloses a method for manufacturing a display panel and a display panel, wherein a metal film is welded to the side of a backplane through a soldering layer, and the soldering layer is converted into a soldering portion, so that the metal film is electrically connected to a plurality of first traces through the soldering portion; the metal film is bent to the second surface of the backplane; the metal film and the soldering portion are patterned to form a plurality of second traces, and the second traces are arranged on the side and the second surface of the backplane, and the second traces are electrically connected to the corresponding first traces, which can solve the technical problem of complex processes of traditional borderless or narrow-border technologies.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a method for manufacturing a display panel and a display panel. Background Art

[0002] There are two ways to implement the borderless or narrow border technology of display panels. One of them is the side binding method: shorten or shrink the front binding line into the surface, and then use the side printing process to form nano silver glue on the side of the display panel. The nano silver glue is connected to the front binding line, and then the nano silver glue is patterned by laser cutting process. After that, the chip on film (Chip On Film) is placed on the side of the display panel. The side binding method can also be: a side physical vapor deposition process is used to form a conductive layer on the side of the display panel, the conductive layer is connected to the front binding trace, and then the conductive layer is patterned by a laser cutting process or a mask process, and then the cover chip film is bound to the conductive layer on the side of the display panel, so as to achieve a narrow frame or no frame effect; the other is a back binding method, in which the front binding trace is shortened or retracted into the surface, and then a back binding trace is formed on the back of the display panel corresponding to the front binding trace, and then a side printing process or a side physical vapor deposition process is used to form nano silver glue on the side, and then the nano silver glue is patterned by a laser cutting process, the nano silver glue is connected to the front binding trace and the back binding trace, and finally the cover chip film is bound to the back binding trace, so as to achieve a narrow frame or no frame effect.

[0003] During the research and practice of the existing technology, the inventors of this application found that the above two borderless or narrow-border technologies need to be realized through a side printing process combined with a laser cutting process, or through a side physical vapor deposition process combined with a laser cutting method or a mask process. The process is complicated. Among them, the side printing accuracy requirements are extremely high. The process often causes silver ions to diffuse and penetrate or alignment abnormalities, resulting in a short circuit in the substrate or a reduction in the rigidity of the substrate, resulting in a low yield. At the same time, the cost remains high, resulting in the inability to widely adopt and popularize borderless technology. Summary of the Invention

[0004] The embodiments of the present application provide a method for manufacturing a display panel and a display panel, which can solve the technical problem of complex processes in traditional borderless or narrow border technologies.

[0005] An embodiment of the present application provides a method for manufacturing a display panel, comprising:

[0006] Step B1, providing a metal film and a backplane, wherein a first surface of the backplane is provided with a plurality of first traces;

[0007] Step B2, providing a soldering layer on the metal film, wherein the soldering layer is doped with conductive particles;

[0008] Step B3, attaching the side of the metal film provided with the soldering layer to the side surface of the backplane, and performing a hot pressing process on the metal film to convert the soldering layer into a soldering portion, wherein the metal film is electrically connected to the plurality of first traces through the soldering portion;

[0009] Step B4, bending the metal film to the second surface of the back plate;

[0010] Step B5: patterning the metal film and the welding portion to form a plurality of second traces, wherein the second traces are provided on the side surface and the second surface of the backplane, and the second traces are electrically connected to the corresponding first traces;

[0011] Step B6: Arrange a plurality of light-emitting devices on the first surface of the backplane.

[0012] Optionally, in some embodiments of the present application, after step B2 and before step B3, the method for manufacturing the display panel further includes:

[0013] The soldering layer is pre-cured.

[0014] Optionally, in some embodiments of the present application, the conductive particles are selected from one or more of gold conductive particles, tin conductive particles, silver conductive particles and indium conductive particles.

[0015] Optionally, in some embodiments of the present application, in step B3, the solder paste layer also covers the upper surface of the first trace.

[0016] Optionally, in some embodiments of the present application, in step B3, the welding portion includes a first welding portion and a second welding portion;

[0017] In step B3, the step of performing a hot pressing treatment on the metal film includes:

[0018] B31. Performing a first hot pressing process on the metal film on the side surface of the back plate, so that the soldering layer on the side surface of the back plate is transformed into the first soldering portion, and the first soldering portion contacts the end surface of the first trace;

[0019] B32. Perform a second hot pressing treatment on the soldering layer on the first surface of the backplane, so that the soldering layer on the first surface of the backplane is transformed into the second soldering portion, the second soldering portion contacts the upper surface of the first trace, and the first soldering portion and the second soldering portion are electrically connected.

[0020] Optionally, in some embodiments of the present application, in step B3, the metal film also covers the solder paste layer on the first trace.

[0021] Optionally, in some embodiments of the present application, in step B3, the welding portion includes a first welding portion and a second welding portion;

[0022] In step B3, the step of performing a hot pressing treatment on the metal film includes:

[0023] B231′, performing a first hot pressing process on the metal film on the side surface of the back plate, so that the soldering layer on the side surface of the back plate is transformed into the first soldering portion, and the first soldering portion contacts the end surface of the first trace;

[0024] B232', perform a second hot pressing treatment on the metal film on the first surface of the backplane, so that the soldering layer on the first surface of the backplane is transformed into the second soldering portion, the second soldering portion contacts the upper surface of the first trace, and the first soldering portion and the second soldering portion are electrically connected.

[0025] Optionally, in some embodiments of the present application, after step B5, the method for manufacturing the display panel further includes:

[0026] Binding a chip-on-film to the second trace on the second surface of the backplane;

[0027] The first wiring, the second wiring and the chip-on-film are packaged.

[0028] The present application also provides a display panel, including:

[0029] A backplane, wherein a first surface of the backplane is provided with a plurality of first traces;

[0030] Multiple second traces, each of the second traces includes a trace body and a welding portion, the trace body is at least arranged on the side and second surface of the backplane, the welding portion is at least arranged between the side of the backplane and the trace body, and the trace body is electrically connected to the first trace through the welding portion.

[0031] Optionally, in some embodiments of the present application, the welding portion includes a first welding portion and a second welding portion, the first welding portion and the second welding portion are connected, the first welding portion is arranged between the side of the back panel and the wiring body, the first welding portion contacts the end face of the first wiring, and the second welding portion covers the upper surface of the first wiring.

[0032] Optionally, in some embodiments of the present application, the wiring body also covers the second welding portion on the first wiring.

[0033] The embodiment of the present application adopts a method for manufacturing a display panel and a display panel, wherein a metal film is welded to the side of a back plate through a soldering layer, and the soldering layer is converted into a soldering portion, so that the metal film is connected to a plurality of first traces through the soldering portion, and then the metal film is bent to the second surface of the back plate, and finally the metal film is patterned to form a plurality of second traces. Compared with realizing borderless or narrow border technology through a side printing process combined with a laser cutting process, or realizing borderless or narrow border technology through a side physical vapor deposition process combined with a laser cutting method or a mask process, the manufacturing method of the present application greatly simplifies the process and reduces the difficulty of manufacturing. In addition, there will be no situation where silver ions short-circuit the substrate or reduce the rigidity of the substrate due to diffusion and penetration or alignment abnormalities, thereby effectively improving the product yield; at the same time, there is no need to use nano silver glue, side printing equipment or physical vapor deposition equipment, which greatly reduces the manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0035] Figure 2 Schematic diagram of applying flux on a metal film according to an embodiment of the present application;

[0036] Figure 3 This is a first schematic diagram of laminating a metal film to the side of a backplane provided in an embodiment of the present application;

[0037] Figure 4 This is a first schematic diagram of performing hot pressing treatment on the soldering layer provided in an embodiment of the present application;

[0038] Figure 5 is a cross-sectional schematic diagram of bending the metal film to the second surface of the back plate provided in an embodiment of the present application;

[0039] Figure 6 is a side view schematic diagram of bending the metal film to the second surface of the back plate provided in an embodiment of the present application;

[0040] Figure 7 is a bottom-view schematic diagram of bending the metal film to the second surface of the backplane provided in an embodiment of the present application;

[0041] Figure 8 is a side view schematic diagram of patterning a metal film and a welding portion provided in an embodiment of the present application;

[0042] Figure 9is a bottom view schematic diagram of patterning a metal film and a welding portion provided in an embodiment of the present application;

[0043] Figure 10 This is a schematic diagram of bonding a chip-on-film to a second conductive line on a second surface of a backplane, as provided in an embodiment of the present application;

[0044] Figure 11 is a bottom-view schematic diagram of packaging a first wire, a second wire, and a chip-on-film provided in an embodiment of the present application;

[0045] Figure 12 It is a cross-sectional schematic diagram of packaging the first wire, the second wire and the chip-on-film and a structural schematic diagram of the first display panel provided in an embodiment of the present application;

[0046] Figure 13 This is a second schematic diagram of laminating a metal film to the side of a backplane provided in an embodiment of the present application;

[0047] Figure 14 This is a second schematic diagram of performing hot pressing treatment on the soldering layer provided in an embodiment of the present application;

[0048] Figure 15 is a structural diagram of a second display panel provided in an embodiment of the present application;

[0049] Figure 16 This is a third schematic diagram of laminating a metal film to the side of a backplane provided in an embodiment of the present application;

[0050] Figure 17 This is a third schematic diagram of performing hot pressing treatment on the soldering layer provided in an embodiment of the present application;

[0051] Figure 18 This is a schematic structural diagram of the third display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0053] The embodiments of the present application provide a method for manufacturing a display panel and a display panel. Detailed descriptions are provided below. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments.

[0054] See also Figure 1 , an embodiment of the present application provides a method for manufacturing a display panel, comprising:

[0055] Step B1: Figure 3 As shown, a metal film 200 and a back plate 100 are provided, and a first surface 110 of the back plate 100 is provided with a plurality of first traces 140;

[0056] Step B2: Figure 2 As shown, a soldering layer 300 is provided on the metal film 200 , and the soldering layer 300 is doped with conductive particles 310 ;

[0057] Step B3: Figure 3 and Figure 4 As shown, the side of the metal film 200 provided with the soldering layer 300 is attached to the side surface 120 of the backplane 100, and the metal film 200 is subjected to a hot pressing process so that the soldering layer 300 is transformed into a soldering portion 400. The metal film 200 is electrically connected to the plurality of first traces 140 through the soldering portion 400;

[0058] Step B4: Figures 5 to 7 As shown, the metal film 200 is bent to the second surface 130 of the back plate 100;

[0059] Step B5: Figure 8 and Figure 9 As shown, the metal film 200 and the welding portion 400 are patterned to form a plurality of second traces 500 . The second traces 500 are provided on the side surface 120 and the second surface 130 of the backplane 100 . The second traces 500 are electrically connected to the corresponding first traces 140 .

[0060] Step B6: Figure 12 As shown, a plurality of light emitting devices 150 are disposed on the first surface 110 of the back plate 100 .

[0061] The method for manufacturing a display panel according to an embodiment of the present application is to weld a metal film 200 to the side surface 120 of the back plate 100 so that the metal film 200 is connected to the plurality of first traces 140 through the welding portion 400, then bend the metal film 200 to the second surface 130 of the back plate 100, and finally pattern the metal film 200 to form a plurality of second traces 500. Compared to achieving borderless or narrow border technology through a side printing process combined with a laser cutting process, or achieving borderless or narrow border technology through a side physical vapor deposition process combined with a laser cutting method or a mask process, the manufacturing method of the present application greatly simplifies the process and reduces the difficulty of manufacturing. In addition, there will be no situation in which silver ions diffuse, penetrate, or align abnormalities, causing a short circuit in the substrate or a reduction in the rigidity of the substrate, thereby effectively improving the product yield. At the same time, there is no need to use nano silver paste, side printing equipment, or physical vapor deposition equipment, greatly reducing the manufacturing cost.

[0062] Specifically, the display panel manufactured in the embodiment of the present application can be a Mini LED (mini light-emitting diode) display panel or a Micro LED (micro light-emitting diode) display panel. In this embodiment, the light-emitting device 150 can be a Mini LED or Micro LED. It is understood that, depending on the actual situation and specific requirements, the display panel can also be a liquid crystal display panel or an organic light-emitting diode display panel, and this is not limited here.

[0063] Specifically, the material of the metal film 200 can be copper or silver, that is, the metal film 200 can be copper foil or silver foil. Of course, according to the actual selection and specific requirements, the material of the metal film 200 can be appropriately modified and is not limited here.

[0064] Specifically, in step B1, the step of providing the metal film 200 is as follows: forming the metal film 200 on the substrate, specifically by physical vapor deposition or electroplating, and then peeling the metal film 200 from the substrate to obtain the metal film 200.

[0065] Specifically, such as Figure 1 As shown, the method for manufacturing the display panel further includes:

[0066] Step B51: Figures 10 to 12 As shown, a chip-on-film 600 is bonded to the second trace 500 on the second surface 130 of the backplane 100 ;

[0067] Step B52: Encapsulate the first trace 140, the second trace 500 and the COF 600. In this structure, the first trace 140, the second trace 500 and the COF 600 are covered with encapsulation glue 700 to protect them from moisture and oxygen corrosion.

[0068] Specifically, in step B2, a soldering agent is applied to the metal film 200 to form a soldering layer 300; in step B3, the soldering layer 300 is heated to evaporate the solvent in the soldering layer 300, and the conductive particles 310 are melted together to form a soldering portion 400, or the conductive particles 310, the portion of the metal film 200 provided with the soldering layer 300, and one end of the first trace 140 are melted together to form a soldering portion 400.

[0069] In the embodiment of this application, Figure 2 As shown, the metal film 200 includes a first section 210 and a second section 220, the first section 210 and the second section 220 are connected, the first section 210 corresponds to the side surface 120 of the back plate 100, and the second section 220 corresponds to the second surface 130 of the back plate 100. In the above step B2, as Figure 3 As shown, the soldering layer 300 is coated on the first section 210 of the metal film 200, and the coating position of the soldering layer 300 corresponds to at least the end surface of the first trace 140. In the above step B3, as Figure 4 As shown, the first section 210 of the metal film 200 is attached to the side surface 120 of the back plate 100, and the soldering layer 300 is located between the first section 210 and the side surface 120 of the back plate 100, and the soldering layer 300 is in contact with the end surface of the first trace 140. In the above step B3, as Figure 4 As shown, by subjecting the metal film 200 to a hot pressing process, the soldering layer 300 is also heated, thereby converting the soldering layer 300 into a soldering portion 400. The metal film 200 and the soldering portion 400 are tightly bonded, and the soldering portion 400 is also tightly bonded to the end surface of the first trace 140, thereby electrically connecting the metal film 200 to the plurality of first traces 140 via the soldering portion 400. In step B4, the second section 220 of the metal film 200 is bent onto the second surface 130 of the backplane 100. In step B5, the second trace 500 also includes a first section 210 and a second section 220, with the first section 210 connected to the second section 220, and the first section 210 is electrically connected to the first trace 140 via the soldering portion 400. In step B51, a chip-on-film 600 is bonded to the second section 220 of the second trace 500.

[0070] Specifically, the conductive particles 310 are selected from one or more of gold conductive particles 310, tin conductive particles 310, silver conductive particles 310, and indium conductive particles 310. It is understood that the material of the conductive particles 310 can be appropriately modified based on actual selection and specific requirements, and is not limited here.

[0071] Specifically, after step B2 and before step B3, the method for manufacturing a display panel further includes: pre-curing the soldering layer 300. This setting can solidify the surface of the soldering layer 300, ensuring that the soldering layer 300 is stably attached to the metal film 200 and preventing the soldering layer 300 from flowing, so as to facilitate the subsequent step B3.

[0072] Specifically, in step B3, if Figure 13 As shown, during the process of the metal film 200 being attached to the side surface 120 of the back plate 100, the soldering layer 300 between the first section 210 of the metal film 200 and the side surface 120 of the back plate 100 is squeezed and overflows to the first surface 110 of the back plate 100, so that the soldering layer 300 also covers the upper surface of the first trace 140. Under this setting, in the subsequent step B3, as shown in FIG. Figure 14 As shown, after the soldering layer 300 is heated, the formed soldering portion 400 covers the end surface and the upper surface of the first trace 140, which can increase the contact area between the soldering portion 400 and the first trace 140 and reduce the contact resistance between the soldering portion 400 and the first trace 140. Figure 15 As shown, in the display panel formed subsequently, the second line 500 is electrically connected to the first line 140 through the welding portion 400, and the contact resistance between the welding portion 400 and the first line 140 is small, thereby preventing excessive signal transmission loss between the second line 500 and the first line 140, and effectively avoiding poor contact between the second line 500 and the first line 140.

[0073] Specifically, in step B3, if Figure 14 As shown, the welding portion 400 includes a first welding portion 410 and a second welding portion 420. The first welding portion 410 is provided on the side surface 120 of the back plate 100, and the first section 210 of the metal film 200, the first welding portion 410, and the end surface of the first trace 140 are tightly bonded. The second welding portion 420 is provided on the first surface 110 of the back plate 100, and the second welding portion 420 is tightly bonded to the upper surface of the first trace 140. In step B3, the step of hot pressing the metal film 200 includes:

[0074] B31. Perform a first hot pressing process on the metal film 200 on the side surface 120 of the backplane 100, so that the soldering layer 300 on the side surface 120 of the backplane 100 is transformed into a first soldering portion 410. That is, perform a first hot pressing process on the first section 210 of the metal film 200, so that the soldering layer 300 between the first section 210 of the metal film 200 and the side surface 120 of the backplane 100 is transformed into the first soldering portion 410. The first section 210 of the metal film 200 is in close contact with the first soldering portion 410, and the first soldering portion 410 is in close contact with the end surface of the first trace 140.

[0075] B32. Perform a second hot pressing process on the soldering layer 300 on the first surface 110 of the backplane 100, so that the soldering layer 300 on the first surface 110 of the backplane 100 is transformed into a second soldering portion 420. The first soldering portion 410 and the second soldering portion 420 are in close contact and electrically connected, and the second soldering portion 420 is in close contact with the upper surface of the first trace 140. This arrangement allows the metal film 200, the soldering layer 300, and the second trace 500 to be tightly bonded, effectively improving the soldering strength. It also allows the soldering layer 300 to be fully solidified, effectively preventing excessive signal transmission loss between the second trace 500 and the first trace 140, and effectively avoiding poor contact between the second trace 500 and the first trace 140.

[0076] In step B31, the metal film 200 on the side surface 120 of the back panel 100 is subjected to a first hot pressing treatment, so that the conductive particles 310 on the side surface 120 of the back panel 100 are melted together to form a first welding portion 410, or the conductive particles 310 on the side surface 120 of the back panel 100, the portion of the first section 210 provided with the soldering layer 300 and one end of the first trace 140 are melted together to form the first welding portion 410; in step B32, the soldering layer 300 on the first surface 110 of the back panel 100 is subjected to a second hot pressing treatment, so that the conductive particles 310 on the first surface 110 of the back panel 100 are melted together to form a second welding portion 420, or the conductive particles 310 on the first surface 110 of the back panel 100 and one end of the first trace 140 are melted together to form a second welding portion 420.

[0077] Specifically, in step B3, if Figure 16 As shown, during the process of the metal film 200 being attached to the side surface 120 of the back plate 100, the metal film 200 also covers the soldering layer 300 on the first trace 140. Under this setting, in the subsequent step B3, as shown in FIG. Figure 17 As shown, after the soldering layer 300 is heated, the formed soldering portion 400 also covers the upper surface of the first trace 140, which can increase the contact area between the soldering portion 400 and the first trace 140 and reduce the contact resistance between the soldering portion 400 and the first trace 140; at the same time, the metal film 200 also covers the soldering portion 400 on the first trace 140, which can increase the contact area between the soldering portion 400 and the metal film 200 and reduce the contact resistance between the soldering portion 400 and the metal film 200. Figure 18As shown, in the display panel subsequently formed, the second line 500 is electrically connected to the first line 140 through the welding portion 400, and the contact resistance between the welding portion 400 and the first line 140 is small. The contact resistance between the welding portion 400 and the second line 500 is small, thereby preventing excessive signal transmission loss between the second line 500 and the first line 140, and effectively avoiding poor contact between the second line 500 and the first line 140.

[0078] Specifically, such as Figure 16 As shown, the metal film 200 further includes a third section 230, which is connected to the first section 210. Specifically, one end of the first section 210 is connected to the second section 220, and the other end of the first section 210 is connected to the third section 230, that is, the third section 230 is connected to the second section 220 through the first section 210. In step B3, as shown in FIG. Figure 16 As shown, during the process of laminating the metal film 200 to the side surface 120 of the back plate 100, the first section 210 of the metal film 200 is arranged corresponding to the side surface 120 of the back plate 100, and the third section 230 of the metal film 200 is arranged corresponding to the first surface 110 of the back plate 100, and a soldering layer 300 is provided between the first section 210 and the side surface 120 of the back plate 100, and a soldering layer 300 is provided between the third section 230 and the first surface 110 of the back plate 100, and the third section 230 specifically covers the soldering layer 300 on the first trace 140. In step B3, as shown in FIG. Figure 17 As shown, by heating the soldering layer 300 between the first section 210 and the side surface 120 of the back panel 100, the soldering layer 300 between the first section 210 and the side surface 120 of the back panel 100 is transformed into a first welding portion 410, and by heating the soldering layer 300 between the third section 230 and the first surface 110 of the back panel 100, the soldering layer 300 between the third section 230 and the first surface 110 of the back panel 100 is transformed into a second welding portion 420.

[0079] Specifically, in step B3, if Figure 17 As shown, the welding portion 400 includes a first welding portion 410 and a second welding portion 420. The first welding portion 410 is provided on the side surface 120 of the back plate 100, and the first section 210 of the metal film 200, the first welding portion 410, and the end surface of the first trace 140 are tightly bonded. The second welding portion 420 is provided on the first surface 110 of the back plate 100, and the third section 230 of the metal film 200, the second welding portion 420, and the upper surface of the first trace 140 are tightly bonded. In step B3, the step of performing a hot pressing treatment on the metal film 200 includes:

[0080] B31′, performing a first hot pressing process on the metal film 200 on the side surface 120 of the back plate 100, so that the soldering layer 300 on the side surface 120 of the back plate 100 is transformed into a first soldering portion 410. That is, performing a first hot pressing process on the first section 210 of the metal film 200, so that the soldering layer 300 between the first section 210 of the metal film 200 and the side surface 120 of the back plate 100 is transformed into the first soldering portion 410. The first section 210 of the metal film 200 is in close contact with the first soldering portion 410, and the first soldering portion 410 is in close contact with the end surface of the first trace 140.

[0081] B32', the metal film 200 on the first surface 110 of the backplane 100 is subjected to a second hot pressing treatment, so that the soldering layer 300 on the first surface 110 of the backplane 100 is converted into a second welding portion 420, that is, the third section 230 of the metal film 200 is subjected to a second hot pressing treatment, so that the soldering layer 300 between the third section 230 of the metal film 200 and the first surface 110 of the backplane 100 is converted into a second welding portion 420, the first welding portion 410 and the second welding portion 420 are in close contact and electrically connected, the third section 230 of the metal film 200 is in close contact with the second welding portion 420, and the second welding portion 420 is in close contact with the upper surface of the first trace 140.

[0082] In step B31', the metal film 200 on the side surface 120 of the back panel 100 is subjected to a first hot pressing treatment, so that the conductive particles 310 on the side surface 120 of the back panel 100 are melted together to form a first welding portion 410, or the conductive particles 310 on the side surface 120 of the back panel 100, the portion of the first section 210 provided with the soldering layer 300 and one end of the first trace 140 are melted together to form the first welding portion 410; in step B32', the metal film 200 on the first surface 110 of the back panel 100 is subjected to a second hot pressing treatment, so that the conductive particles 310 on the first surface 110 of the back panel 100 are melted together to form a second welding portion 420, or the conductive particles 310 on the first surface 110 of the back panel 100, the third section 230 and one end of the first trace 140 are melted together to form a second welding portion 420.

[0083] In the method for manufacturing a display panel according to an embodiment of the present application, after the first segment 210 of the metal film 200 is subjected to a first hot pressing process, the portion of the first segment 210 of the metal film 200 provided with the soldering layer 300 can be melt-bonded to the end surface of the first trace 140 through the crystal layer, while the portion of the first segment 210 of the metal film 200 not provided with the soldering layer 300 is melt-bonded to the side surface 120 of the backplane 100. Similarly, after the third segment 230 of the metal film 200 is subjected to a second hot pressing process, the portion of the third segment 230 of the metal film 200 provided with the soldering layer 300 can be melt-bonded to the upper surface of the first trace 140, while the portion of the third segment 230 of the metal film 200 not provided with the soldering layer 300 melts and is melt-bonded to the upper surface of the first trace 140.

[0084] Specifically, after step B4 and before step B5, the method for manufacturing the display panel further includes:

[0085] The metal film 200 on the second surface 130 of the backplane 100 is subjected to a third hot pressing treatment, so that the metal film 200 on the second surface 130 of the backplane 100 is melt-bonded to the second surface 130 of the backplane 100, that is, the second section 220 of the metal film 200 is subjected to a third hot pressing treatment, so that the third section 230 of the metal film 200 is melt-bonded to the second surface 130 of the backplane 100.

[0086] See also Figure 12 The present application also provides a display panel manufactured using the above-described manufacturing method. The display panel includes a backplane 100 and a plurality of second traces 500. The first surface 110 of the backplane 100 is provided with a plurality of first traces 140. The second traces 500 include a trace body 200 and a welding portion 400. The trace body 200 is provided at least on the side surface 120 and the second surface 130 of the backplane 100. The welding portion 400 is provided at least between the side surface 120 of the backplane 100 and the trace body 200. The trace body 200 is electrically connected to the first traces 140 via the welding portion 400.

[0087] It should be noted that the wiring body 200 is the metal film 200 in the above embodiment, and the wiring body 200 will not be repeatedly explained hereinafter.

[0088] Specifically, the display panel manufactured in the embodiment of the present application can be a Mini LED (mini light-emitting diode) display panel or a Micro LED (micro light-emitting diode) display panel. In this embodiment, the first surface 110 of the backplane 100 is further provided with a plurality of light-emitting devices 150, which can be Mini LEDs or Micro LEDs. It is understood that the display panel can also be a liquid crystal display panel or an organic light-emitting diode display panel, depending on the actual situation and specific requirements. This is not a limitation.

[0089] Specifically, such as Figure 15 As shown, the welding part 400 includes a first welding part 410 and a second welding part 420. The first welding part 410 and the second welding part 420 are connected. The first welding part 410 is arranged between the side surface 120 of the back panel 100 and the wiring body 200. The first welding part 410 is in close contact with the end face of the first wiring 140, and the second welding part 420 covers the upper surface of the first wiring 140.

[0090] Specifically, the wiring body 200 includes a first section 210 and a second section 220, which are connected. The first section 210 is arranged corresponding to the side surface 120 of the backplane 100, and the second section 220 is arranged corresponding to the second surface 130 of the backplane 100. The first section 210 of the wiring body 200 is in close contact with the first soldering portion 410, and the first soldering portion 410 is in close contact with the end surface of the first wiring 140. The first soldering portion 410 and the second soldering portion 420 are in close contact and electrically connected, and the second soldering portion 420 is in close contact with the upper surface of the first wiring 140. In this structure, the second wiring 500 is electrically connected to the first wiring 140 via the soldering portion 400. The contact resistance between the soldering portion 400 and the first wiring 140 is low, thereby preventing excessive signal transmission loss between the second wiring 500 and the first wiring 140 and effectively avoiding poor contact between the second wiring 500 and the first wiring 140.

[0091] Specifically, such as Figure 18 As shown, the wiring body 200 also covers the second soldering portion 420 on the first wiring 140. In this structure, the wiring body 200 also covers the second soldering portion 420 on the first wiring 140, which can increase the contact area between the soldering portion 400 and the wiring body 200 and reduce the contact resistance between the soldering portion 400 and the wiring body 200. The second wiring 500 is electrically connected to the first wiring 140 via the soldering portion 400. The contact resistance between the soldering portion 400 and the first wiring 140 is low, and the contact resistance between the soldering portion 400 and the second wiring 500 is low, thereby preventing excessive signal transmission loss between the second wiring 500 and the first wiring 140, effectively avoiding poor contact between the second wiring 500 and the first wiring 140.

[0092] Specifically, such as Figure 18 As shown, the wiring body 200 further includes a third section 230, which is connected to the first section 210. Specifically, one end of the first section 210 is connected to the second section 220, and the other end of the first section 210 is connected to the third section 230. That is, the third section 230 is connected to the second section 220 through the first section 210. The third section 230 covers the second welding portion 420 on the first wiring 140.

[0093] Specifically, the display panel also includes a chip-on-chip film 600, which is arranged on the second surface 130 of the back panel 100. The chip-on-chip film 600 is bound to the second trace 500 on the second surface 130 of the back panel 100, specifically bound to the second section 220 of the trace body 200 of the second trace 500.

[0094] Specifically, the display panel further includes a packaging glue 700 , which covers the first wiring 140 , the second wiring 500 and the chip-on-film 600 , and can play a protective role and effectively prevent corrosion by water vapor and oxygen.

[0095] Specifically, the material of the welding portion 400 includes one or more of gold, tin, silver, and indium. It is understood that the material of the welding portion 400 can be appropriately modified according to actual selection and specific requirements, and is not limited here.

[0096] Specifically, the material of the wiring body 200 can be copper or silver, that is, the wiring body 200 can be copper foil or silver foil. Of course, according to the actual selection and specific requirements, the material of the wiring body 200 can be appropriately modified, and is not limited here.

[0097] The above is a detailed introduction to a method for manufacturing a display panel and a display panel provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for manufacturing a display panel, characterized in that: include: Step B1: providing a metal film and a backplane, wherein a plurality of first traces are provided on a first surface of the backplane, and the metal film includes a first section and a second section, wherein the first section corresponds to a side surface of the backplane, and the second section corresponds to a second surface of the backplane; Step B2: providing a soldering layer on the metal film, wherein the soldering layer is doped with conductive particles, the soldering layer is coated on the first section of the metal film, and the coating position of the soldering layer at least corresponds to the end surface of the first trace; Step B3, attaching the side of the metal film provided with the soldering layer to the side surface of the back plate, and performing a hot pressing process on the metal film to convert the soldering layer into a soldering portion, wherein the metal film is electrically connected to the plurality of first traces via the soldering portion, wherein the soldering portion includes a first soldering portion and a second soldering portion, wherein the first soldering portion is provided on the side surface of the back plate, and the second soldering portion is provided on the first surface of the back plate; Step B4, bending the metal film to the second surface of the back plate; Step B5: patterning the metal film and the soldering portion to form a plurality of second traces, wherein the second traces are provided on the side surface and the second surface of the backplane, the second traces are electrically connected to the corresponding first traces, the second traces include the first segment and the second segment, the first segment is connected to the second segment, and the first segment is electrically connected to the first trace via the soldering portion; Step B6: Arrange a plurality of light-emitting devices on the first surface of the backplane.

2. The method for manufacturing a display panel according to claim 1, wherein: After step B2 and before step B3, the method for manufacturing the display panel further includes: The soldering layer is pre-cured.

3. The method for manufacturing a display panel according to claim 1, wherein: The conductive particles are selected from one or more of gold conductive particles, tin conductive particles, silver conductive particles and indium conductive particles.

4. The method for manufacturing a display panel according to claim 1, wherein: In step B3, the soldering layer also covers the upper surface of the first trace.

5. The method for manufacturing a display panel according to claim 4, wherein: In step B3, the step of performing a hot pressing treatment on the metal film includes: B31. Performing a first hot pressing process on the metal film on the side surface of the back plate, so that the soldering layer on the side surface of the back plate is transformed into the first soldering portion, and the first soldering portion contacts the end surface of the first trace; B32. Perform a second hot pressing treatment on the soldering layer on the first surface of the backplane, so that the soldering layer on the first surface of the backplane is transformed into the second soldering portion, the second soldering portion contacts the upper surface of the first trace, and the first soldering portion and the second soldering portion are electrically connected.

6. The method for manufacturing a display panel according to claim 4, wherein: In the step B3, the metal film also covers the soldering layer on the first trace.

7. The method for manufacturing a display panel according to claim 6, wherein: In step B3, the step of performing a hot pressing treatment on the metal film includes: B31′, performing a first hot pressing process on the metal film on the side surface of the back plate, so that the soldering layer on the side surface of the back plate is transformed into the first soldering portion, and the first soldering portion contacts the end surface of the first trace; B32', performing a second hot pressing treatment on the metal film on the first surface of the backplane, so that the soldering layer on the first surface of the backplane is transformed into the second soldering portion, the second soldering portion contacts the upper surface of the first trace, and the first soldering portion and the second soldering portion are electrically connected.

8. The method for manufacturing a display panel according to claim 1, wherein: After step B5, the method for manufacturing the display panel further includes: Binding a chip-on-film to the second trace on the second surface of the backplane; The first wiring, the second wiring and the chip-on-film are packaged.

9. A display panel, characterized in that: include: A backplane, wherein a first surface of the backplane is provided with a plurality of first traces; Multiple second traces, the second traces include a trace body and a welding portion, the trace body is at least arranged on the side and second surface of the back plate, the welding portion is at least arranged between the side of the back plate and the trace body, the trace body is electrically connected to the first trace through the welding portion, the trace body includes a first section and a second section, the first section is arranged corresponding to the side of the back plate, and the second section is arranged corresponding to the second surface of the back plate; the welding portion includes a first welding portion and a second welding portion, the first welding portion and the second welding portion are connected, the first welding portion is arranged between the side of the back plate and the trace body, and the second welding portion covers the upper surface of the first trace; the first welding portion and the second welding portion are electrically connected.

10. The display panel according to claim 9, wherein: The welding part includes a first welding part and a second welding part, the first welding part and the second welding part are connected, the first welding part is arranged between the side surface of the back plate and the wiring body, the first welding part contacts the end surface of the first wiring, and the second welding part covers the upper surface of the first wiring.

11. The display panel according to claim 10, wherein: The wiring body also covers the second welding portion on the first wiring.

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