Pressurizing device, manufacturing device, and manufacturing method for element array

Abstract

The present application provides a pressurizing device for an element array, a manufacturing device, and a manufacturing method, which can stably manufacture an element array on a mounting substrate. The pressurizing device (10) for an element array includes a pressurizing plate (11) having a pressurizing portion (12) that pressurizes an element array (40) composed of a plurality of elements (40a to 40c) arranged on a mounting substrate (30). The pressurizing portion (12) has a plate-shaped hard member (13) with higher surface precision than the surface of the pressurizing plate (11).

Description

TECHNICAL FIELD

[0001] The present application relates to a pressurizing device that pressurizes an element array of a plurality of elements arranged on a mounting substrate, a manufacturing device and a manufacturing method of the element array. BACKGROUND

[0002] As a method of manufacturing an element array of a plurality of elements (for example, light emitting elements) on a mounting substrate, there is known a method as shown below, for example. That is, a plurality of elements are arranged in an array on a mounting substrate provided with an electrically conductive joining material such as an ACF (Anisotropic Conductive Film), an ACP (Anisotropic Conductive Paste), or a eutectic metal such as Sn, Pb, Ag, Au, Bi, In, Ca, Cu, Ge. Then, a plurality of elements arranged in an array (element array) is pressurized by a pressurizing plate made of a metal such as stainless steel, and is mounted to the mounting substrate via the electrically conductive joining material. Thus, it is possible to manufacture an element array on a mounting substrate.

[0003] When pressurizing an element array by a pressurizing plate, for example, as the invention described in Patent Literature 1, an attempt is made to make the uniformity of pressurization among a plurality of elements good by providing a soft layer having fluidity in advance between the pressurizing plate and the element array.

[0004] However, according to the invention described in Patent Literature 1, it is difficult to sufficiently avoid the occurrence of uneven pressurization (non-uniformity of pressurization) of a plurality of elements arranged on a mounting substrate, and there is a possibility that mounting failure occurs.

[0005] PRIOR ART DOCUMENTS

[0006] PATENT LITERATURE

[0007] Patent Literature 1: Japanese Patent Application Laid-Open No. 2004-296746 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] The present application has been achieved in view of such circumstances, and has an object to provide a pressurizing device of an element array, a manufacturing device and a manufacturing method capable of stably manufacturing an element array on a mounting substrate.

[0010] TECHNICAL SOLUTION FOR SOLVING THE PROBLEMS

[0011] To achieve the above object, a pressurizing device of an element array according to a first aspect of the present application, in which,

[0012] A pressing plate having a pressing portion that presses an element array of a plurality of elements arranged on a mounting substrate, and

[0013] The pressing portion has a plate-shaped hard member having a higher surface precision than the surface of the pressing plate.

[0014] In the element array pressing device of the present application, the pressing portion has a plate-shaped hard member having a higher surface precision than the surface of the pressing plate. Therefore, when pressing by the pressing plate, the element array of a plurality of elements arranged on the mounting substrate can be pressed via the hard member. The surface precision (e.g., flatness, smoothness, etc.) of the hard member is higher than the surface precision (e.g., flatness, smoothness, etc.) of the pressing plate, so the contact between the surface of the element array, etc. and the pressing surface (the surface that comes into contact with the element array) of the pressing portion (the hard member) becomes good, and pressure can be uniformly applied to the plurality of elements arranged on the mounting substrate. Therefore, the element array pressing device of the present application can prevent mounting failure from occurring and stably manufacture the element array on the mounting substrate.

[0015] The hard member can be provided on the surface of the pressing plate. With this structure, even if the surface precision of the pressing plate is poor, it can be directly moderated (absorbed) by the hard member. Therefore, mounting failure can be effectively prevented from occurring and the element array can be stably manufactured on the mounting substrate.

[0016] Preferably, the pressing portion has a plate-shaped elastic member provided on the surface of the hard member. In this case, when pressing by the pressing plate, the plurality of elements arranged on the mounting substrate can be pressed via the elastic member. The elastic member is moderately deformed in accordance with the surface shape of the element array, etc., so pressure can be more uniformly applied to the plurality of elements arranged on the mounting substrate.

[0017] The pressing portion can have a plate-shaped elastic member provided on the surface of the pressing plate, and the hard member can be provided on the surface of the elastic member. In this case, the surface of the element array, etc. and the surface of the hard member that constitutes the surface that comes into contact with the element array, etc. are easily made parallel by the moderate deformation of the elastic member, so pressure can be more uniformly applied to the plurality of elements that constitute the element array.

[0018] Preferably, at least one hard member and at least one elastic member are alternately stacked on the surface of the pressing plate. In this case, the effects of providing the pressing plate with the hard member and the elastic member can be combined, and pressure can be more uniformly applied to the plurality of elements arranged on the mounting substrate.

[0019] Preferably, a first hydrophobic layer subjected to a hydrophobic treatment is formed on the surface of the hard member. With this configuration, when the array of components formed on the mounting substrate is pressed through the surface of the hard member, the components can be prevented from adhering to the surface of the hard member, and mounting failure can be effectively prevented. In addition, when the array of components is mounted on the mounting substrate using a conductive joining material, even if the pressing portion contacts the conductive joining material when the pressing plate is pressed, the conductive joining material can be prevented from adhering to the pressing portion by the first hydrophobic layer. Thus, damage to the pressing plate caused by the conductive joining material adhering to the pressing portion can be prevented.

[0020] Preferably, a second hydrophobic layer subjected to a hydrophobic treatment is formed on the surface of the elastic member. With this configuration, when the array of components formed on the mounting substrate is pressed through the surface of the elastic member, the components can be prevented from adhering to the surface of the elastic member, and mounting failure can be effectively prevented. In addition, when the array of components is mounted on the mounting substrate using a conductive joining material, even if the pressing portion contacts the conductive joining material when the pressing plate is pressed, the conductive joining material can be prevented from adhering to the pressing portion by the second hydrophobic layer.

[0021] Preferably, the thickness of the first hydrophobic layer is smaller than the thickness of the hard member, and the thickness of the second hydrophobic layer is smaller than the thickness of the elastic member. With this configuration, the components can be effectively prevented from adhering to the surface of the hard member or the elastic member, and the like.

[0022] Preferably, the hard member is detachably provided to the pressing plate. With this configuration, the hard member or the like provided to the pressing plate can be easily replaced with a new hard member or the like. In addition, depending on the type of components, the shape of the mounting substrate, and the like, the hard member or the like provided to the pressing plate can be replaced with an appropriate hard member or the like.

[0023] Preferably, the hard member is fixed to the pressing plate by a clamp member. With this configuration, the hard member can be fixed to the pressing plate with sufficient fixing strength by the clamp member. In addition, the hard member can be easily detached from the pressing plate, and replacement of the hard member or the like can be easily performed.

[0024] To achieve the above object, the manufacturing device for an array of components of the present application has any of the pressing devices described above. With any of the pressing devices described above, the array of components is mounted on the mounting substrate, and thus pressure can be uniformly applied to the plurality of components arranged on the mounting substrate, mounting failure can be prevented, and the array of components can be stably manufactured on the mounting substrate.

[0025] Also, the mounting base, the supply base, and the conveyance device can be provided, the mounting base can be configured to mount the mounting substrate, the supply base can be configured to mount the supply substrate on which the plurality of components are arranged, and the conveyance device can be configured to move to the supply base, pick up the plurality of components from the supply substrate, and move to the mounting base to transfer the plurality of components picked up to the mounting substrate, and the pressing plate can be configured to press the component array composed of the plurality of components transferred to the mounting substrate by the conveyance device.

[0026] With such a configuration, even in so-called mass transfer in which the plurality of components are collectively transferred from the supply substrate to the mounting substrate, and the component array composed of the plurality of components is pressed by the pressing plate, it is possible to stably manufacture the component array on the mounting substrate, and it is possible to improve the yield at the time of manufacturing.

[0027] To achieve the above object, the manufacturing method of the component array of the present application includes:

[0028] a step of preparing a mounting substrate on which a plurality of components are arranged; and

[0029] a step of pressing the plurality of components arranged on the mounting substrate using a pressing device provided with a plate-shaped hard member having higher surface accuracy than the surface of the pressing plate.

[0030] In the manufacturing method of the component array of the present application, the plurality of components arranged on the mounting substrate are pressed using the pressing device provided with the plate-shaped hard member having higher surface accuracy than the surface of the pressing plate. Therefore, the contact (degree of parallelism, etc.) between the surfaces of the plurality of components and the pressing surface (abutting surface with the component array) of the pressing portion (hard member) becomes good, and it is possible to uniformly apply pressure to the plurality of components arranged on the mounting substrate. Therefore, according to the manufacturing method of the component array of the present application, it is possible to prevent occurrence of mounting failure, and to stably manufacture the component array on the mounting substrate.

[0031] It is preferable that the plurality of components be connected to the mounting substrate by pressing the plurality of components toward the conductive joining material provided in the mounting substrate. With such a configuration, it is possible to mount the plurality of components to the mounting substrate using a conductive joining material such as ACF (Anisotropic Conductive Film) or ACP (Anisotropic Conductive Paste), and it is possible to easily manufacture the component array on the mounting substrate.

[0032] To achieve the above object, the pressing device of the component array of the second aspect of the present application includes:

[0033] The presser plate includes a presser portion that presses an element array of a plurality of elements arranged on a mounting substrate.

[0034] The presser portion includes an elastic member in a plate shape.

[0035] The thickness of the elastic member is 0.5 to 2.0 times the thickness of the elements.

[0036] The presser portion includes an elastic member in a plate shape. Therefore, when pressing by the presser plate, the element array of a plurality of elements arranged on a mounting substrate can be pressed via the elastic member.

[0037] In particular, in the presser device for an element array of the present application, the thickness of the elastic member is 0.5 to 2.0 times the thickness of the elements. When the thickness of the elastic member is set to such a range with respect to the thickness of the elements, the elastic member easily deforms in accordance with the surface shape of the element array or the like because the elastic member has an appropriate thickness, and the entire element array (without omission) can be pressed via the elastic member. In addition, the elastic member has an appropriate hardness, and thus a sufficient pressing force can be applied to the element array via the elastic member. Therefore, a uniform pressing force can be applied to the plurality of elements arranged on the mounting substrate.

[0038] In addition, when the elastic member deforms, a pressure is generated, but when the thickness of the elastic member is set to the range as described above with respect to the thickness of the elements, the pressure is not excessively large to affect the pressing force of the presser plate. Therefore, when pressing by the presser plate, the pressing force of the presser plate can be prevented from being unevenly dispersed, and a uniform pressing force can be applied to the plurality of elements arranged on the mounting substrate. Therefore, the presser device for an element array of the present application can prevent mounting failure from occurring and can stably manufacture an element array on a mounting substrate.

[0039] The elastic member can be provided on the surface of the presser plate. With such a structure, when pressing by the presser plate, heat of the presser plate is easily transferred to the elastic member when the presser plate is heated, and a plurality of elements can be favorably mounted to a mounting substrate using, for example, a conductive joining material provided on the mounting substrate.

[0040] Also, the pressing portion can have a plate-shaped hard member having a higher surface precision than the surface of the pressing plate, and the hard member can be provided on the surface of the elastic member, and another elastic member can be provided on the surface of the hard member. The surface precision (e.g., flatness, smoothness, etc.) of the hard member is higher than the surface precision (e.g., flatness, smoothness, etc.) of the pressing plate, and thus by providing the hard member between the elastic members, the elastic member constituting the outer side of the contact surface with the component array can be arranged in a state close to parallel with respect to the horizontal plane. Thus, the contact (degree of parallelism, etc.) between the surface of the component array and the pressing surface (contact surface with the component array) of the pressing portion (elastic member) becomes good, and pressure can be uniformly applied to the plurality of components arranged on the mounting substrate. Thus, mounting failure can be effectively prevented, and the component array can be stably manufactured on the mounting substrate.

[0041] In addition, the surface of the component array and the surface of the elastic member constituting the outer side of the contact surface with the component array easily become parallel by deformation of the elastic member provided on the surface of the pressing plate, and pressure can be more uniformly applied to the plurality of components constituting the component array.

[0042] Also, the pressing portion can have a plate-shaped hard member having a higher surface precision than the surface of the pressing plate, and the hard member can be provided on the surface of the elastic member, and another elastic member can be provided on the surface of the hard member. The surface precision (e.g., flatness, smoothness, etc.) of the hard member is higher than the surface precision (e.g., flatness, smoothness, etc.) of the pressing plate, and thus by providing the hard member between the elastic members, the elastic member constituting the outer side of the contact surface with the component array can be arranged in a state close to parallel with respect to the horizontal plane. Thus, the contact (degree of parallelism, etc.) between the surface of the component array and the pressing surface (contact surface with the component array) of the pressing portion (elastic member) becomes good, and pressure can be uniformly applied to the plurality of components arranged on the mounting substrate. Thus, mounting failure can be effectively prevented, and the component array can be stably manufactured on the mounting substrate.

[0043] Preferably, at least one hard member and at least one elastic member are alternately stacked on the surface of the pressing plate. By adopting such a structure, the above-described effects obtained by providing the pressing plate with a hard member and an elastic member can be favorably obtained, and pressure can be more uniformly applied to the plurality of components arranged on the mounting substrate.

[0044] It is preferable that a hydrophobic layer subjected to a hydrophobic treatment be formed on the surface of the elastic member. With this configuration, when the element array formed on the mounting substrate is pressed via the surface of the elastic member, the elements can be prevented from adhering to the surface of the elastic member, and mounting failure can be effectively prevented. In addition, when the plurality of elements are mounted to the mounting substrate using a conductive joining material, even if the pressing portion contacts the conductive joining material when the pressing plate is pressed, the conductive joining material can be prevented from adhering to the pressing portion by the hydrophobic layer. Thus, damage to the pressing plate that accompanies the conductive joining material adhering to the pressing portion can be prevented.

[0045] It is preferable that the thickness of the hydrophobic layer be smaller than the thickness of the elastic member. With this configuration, the elements can be effectively prevented from adhering to the surface of the elastic member or the like.

[0046] The thickness of the elements can be 50 μm or less. Even when an element array formed of such small elements is the object of pressing, the plurality of elements that constitute the element array can be uniformly pressed by the elastic member deforming in accordance with the surface shape of the element array or the like.

[0047] To achieve the above object, the manufacturing device of an element array of the present application has any of the above pressing devices. By mounting an element array to a mounting substrate using any of the above pressing devices, the plurality of elements arranged on the mounting substrate can be uniformly pressed, mounting failure can be prevented, and an element array can be stably manufactured on the mounting substrate.

[0048] The manufacturing device can further include a mounting table on which the mounting substrate is placed, a supply table on which a supply substrate on which the plurality of elements are arranged is placed, and a transfer device that moves to the supply table to pick up the plurality of elements from the supply substrate and moves to the mounting table to transfer the picked-up plurality of elements to the mounting substrate, and the pressing plate presses the element array constituted by the plurality of elements transferred to the mounting substrate by the transfer device.

[0049] With this configuration, even when the plurality of elements are collectively transferred from the supply substrate to the mounting substrate in so-called mass transfer, and the element array constituted by these elements is pressed by the pressing plate, an element array can be stably manufactured on the mounting substrate, and the yield at the time of manufacturing can be improved.

[0050] To achieve the above object, the manufacturing method of an element array of the present application includes:

[0051] a step of preparing a mounting substrate on which a plurality of elements are arranged; and

[0052] The plurality of elements arranged on the mounting substrate are pressed using a pressing device provided with an elastic member in the form of a plate having a thickness of 0.5 to 2.0 times the thickness of the elements.

[0053] In the mounting method of the element array according to the present application, the plurality of elements arranged on the mounting substrate are pressed using a pressing device provided with an elastic member in the form of a plate having a thickness of 0.5 to 2.0 times the thickness of the elements. Therefore, the elastic member easily deforms in accordance with the surface shape of the element array or the like, and the element array can be pressed as a whole (without omission) with sufficient pressing force via the elastic member. In addition, the pressing force of the pressing plate can be prevented from being unevenly distributed, and the plurality of elements arranged on the mounting substrate can be uniformly pressed. Therefore, according to the mounting method of the element array according to the present application, mounting failure can be prevented, and the element array can be stably manufactured on the mounting substrate.

[0054] It is preferable that the plurality of elements be connected to the mounting substrate by pressing the plurality of elements toward the conductive joining material provided in the mounting substrate. Therefore, the plurality of elements can be mounted to the mounting substrate using a conductive joining material such as ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), or the like, and the element array can be easily manufactured on the mounting substrate. BRIEF DESCRIPTION OF DRAWINGS

[0055] Figure 1 is a schematic side view showing a pressing device according to a first embodiment of the present application.

[0056] Figure 2 is a schematic side view showing a pressing device according to a first embodiment of the present application. Figure 1 is a block diagram showing the functional configuration of a manufacturing device of an element array using the pressing device shown in

[0057] Figure 3A is a cross-sectional view showing a step of transferring elements from a supply substrate to a mounting substrate by mass transfer.

[0058] Figure 3B is a cross-sectional view showing a next step of Figure 3A

[0059] Figure 3C is a cross-sectional view showing a next step of Figure 3B

[0060] Figure 4 is a schematic side view showing a pressing device according to a second embodiment of the present application.

[0061] Figure 5 ​​This is a schematic side view showing the pressurization device according to the third embodiment of the present invention.

[0062] Figure 6 This is a schematic side view showing the pressurization device according to the fourth embodiment of the present invention.

[0063] Figure 7 This is a schematic side view showing the pressurization device according to the fifth embodiment of the present invention.

[0064] Figure 8 This is a schematic side view showing the pressurization device according to the sixth embodiment of the present invention.

[0065] Figure 9 This is a schematic side view showing the pressurization device according to the seventh embodiment of the present invention. Detailed Implementation

[0066] The present invention will now be described based on the embodiments shown in the accompanying drawings.

[0067] Implementation Method 1

[0068] like Figure 1 As shown, the pressurizing device 10 of the first embodiment of the present invention includes a pressurizing plate 11. The pressurizing plate 11 is made of a metal such as stainless steel and pressurizes a non-pressurized object (in this embodiment, a plurality of elements 40a to 40c). The pressurizing device 10 is part of a manufacturing apparatus for an element array 40 consisting of a plurality of elements 40a to 40c, which is manufactured on a mounting substrate 30. Hereinafter, the X-axis corresponds to the width direction of the mounting substrate 30, the Y-axis corresponds to the depth direction of the mounting substrate 30, and the Z-axis corresponds to the height direction of the mounting substrate 30. The X-axis and Y-axis are parallel to the horizontal plane, the Z-axis is parallel to the vertical line, and the X-axis, Y-axis, and Z-axis are perpendicular to each other. Furthermore, in Figure 1 For ease of explanation, components 40a to 40c are shown in a slightly larger form relative to the other structures.

[0069] like Figure 2 As shown, the manufacturing apparatus for the component array 40 includes a control unit 91, a pressure control mechanism 92, a drive mechanism 93, a heating mechanism 94, and a temperature control mechanism 95. These units control the pressure plate 11 and the like. The drive mechanism 93 drives the pressure plate 11 in the vertical direction. The pressure control mechanism 92 controls the magnitude of the pressure applied (load) when driving the pressure plate 11. The heating mechanism 94 is, for example, a heater, and has a built-in... Figure 1 The pressure plate 11 and the mounting stage 20 on which the mounting substrate 30 is placed are shown. The temperature control mechanism 95 controls the heating temperature of the pressure plate 11 and the mounting stage 20 by controlling the heating temperature of the heating mechanism 94. The control unit 91 controls the operation of the pressure control mechanism 92, the drive mechanism 93, the heating mechanism 94 and the temperature control mechanism 95.

[0070] Figure 1 In this embodiment, the mounting substrate 30 is also expanded in the Y-axis direction in the figure, and has a circular or quadrangular outer shape. The material of the mounting substrate 30 in this embodiment is glass epoxy resin. However, the material of the mounting substrate 30 is not limited to this, and for example, a flexible substrate such as Si02, AI203as a glass substrate, polyimide, polyamide, polypropylene, polyether ether ketone, urethane, silicone, polyethylene terephthalate, polyethylene naphthalate, or the like, or a flexible substrate composed of glass wool or the like can also be used.

[0071] The mounting substrate 30 is placed on the mounting table 20 via the mounting auxiliary substrate 32. On the surface of the mounting substrate 30, a conductive joining material not shown is formed in advance. The conductive joining material electrically or mechanically connects the mounting substrate 30 and the elements 40a to 40c by anisotropic conductive particles connection or bump press connection, or the like, and is cured by heating. As the conductive joining material, for example, ACF, ACP, NCF, or NCP, or the like can be cited. The thickness of the conductive joining material is preferably 1.0 to 10,000 μm.

[0072] The mounting substrate 30 is formed with the wiring 31_1 and the wiring 31_2 in a predetermined pattern. In the example shown in the figure, the wiring 31_1 and the wiring 31_2 are formed in pairs, and the pairs of the plurality of wiring 31_1 and the wiring 31_2 are arranged along the X-axis direction. The wiring 31_1 and the wiring 31_2 can be connected to any of the elements 40a to 40c via the conductive joining material.

[0073] The mounting auxiliary substrate 32 is composed of a thin plate body (rigid body) in a flat plate shape. The mounting auxiliary substrate 32 is placed on the mounting table 20, and is composed of a member having high surface accuracy (flatness, smoothness, or the like). The surface accuracy of the mounting auxiliary substrate 32 is more excellent than that of the mounting table 20, and the surface of the mounting auxiliary substrate 32 (particularly, the surface on the side on which the mounting table 20 is arranged) is less uneven (i.e., is smooth) and less inclined with respect to the horizontal plane (i.e., is flat) than the surface of the mounting table 20.

[0074] The mounting auxiliary substrate 32 is made of a hard material. In the present embodiment, the mounting auxiliary substrate 32 is made of a glass substrate. However, the material constituting the mounting auxiliary substrate 32 is not limited thereto, and can be made of, for example, quartz glass (SiO2), diamond, or sapphire, alumina (Al2O3), cordierite (2MgO-2Al2O3-5SiO2), aluminum nitride (AIN), silicon nitride (SiN), silicon carbide (SiC), zirconia (ZrO2), or the like. As the surface precision, the surface roughness Ra of the mounting auxiliary substrate 32 is preferably 0.1 to 2.0 μm, and more preferably 0.1 to 1.0 μm.

[0075] In the illustrated example, the thickness of the mounting auxiliary substrate 32 is thicker than the thickness of the mounting substrate 30 or the elements 40a to 40c. The thickness of the mounting auxiliary substrate 32 is preferably 1 mm to 20 mm. The surface of the mounting auxiliary substrate 32 can also be processed to form a hydrophobic layer (omitted from the illustration) by applying a hydrophobic treatment. The hydrophobic treatment is performed by applying, for example, a fluorine-based resin to the surface of the mounting auxiliary substrate 32. The thickness of the hydrophobic layer is preferably 8 μm or less.

[0076] Thus, by placing the mounting substrate 30 on the mounting auxiliary substrate 32 having excellent surface precision, the mounting substrate 30 can be stably disposed without tilting with respect to the horizontal plane. In addition, by forming a hydrophobic layer on the surface of the mounting auxiliary substrate 32, when the element array 40 is pressed by the pressing plate 11, the pressing portion 12 contacts the electrically conductive joining material formed on the mounting substrate 30, and even if the electrically conductive joining material flows to the mounting auxiliary substrate 32 side, the electrically conductive joining material can be prevented from adhering to the mounting auxiliary substrate 32 by the hydrophobic layer. As a result, the electrically conductive joining material can also be prevented from adhering to the pressing portion 12, and the pressing plate 11 can be prevented from being damaged.

[0077] The elements 40a to 40c are arranged in an array on the substrate 30. The array refers to a state in which the elements 40a to 40c are arranged in multiple rows and multiple columns in a predetermined pattern, and the intervals in the row direction and the column direction can be the same or different.

[0078] The elements 40a to 40c are arranged as respective pixels of RGB in a display substrate for display, and are arranged as light emitters of a backlight in an illumination substrate. The element 40a is a red light emitting element, the element 40b is a green light emitting element, and the element 40c is a blue light emitting element.

[0079] The elements 40a to 40c in the present embodiment are micro light emitting elements (micro LED elements), and the size (width x depth) thereof is, for example, 5 μm x 5 μm to 50 μm x 50 μm. In addition, the thickness (height) of the elements 40a to 40c is, for example, 50 μm or less.

[0080] On the side of the element 40a to 40c (the side on which the mounting substrate 30 is arranged), a pair of electrodes (bumps) 41_1 and 41_2 are provided protruding. The pair of electrodes 41_1 and 41_2 are connected to the wiring 31_1 and 31_2 provided on the mounting substrate 30, respectively. The thickness (height) of the electrodes 41_1 and 41_2 is, for example, 3 μm or less.

[0081] By pressing the elements 40a to 40c with the pressing plate 11, the conductive joining material arranged so as to be sandwiched between the respective electrodes 41_1 and 41_2 of the elements 40a to 40c and the wiring 31_1 and 31_2 provided on the mounting substrate 30 is compressed, and the compressed portion becomes conductive. Thus, the wiring 31_1 and 31_2 and the electrodes 41_1 and 41_2 become in an on state, and the element array 40 constituted by the plurality of elements 40a to 40c is mounted on the mounting substrate 30.

[0082] The pressing plate 11 has a pressing portion 12 that presses the element array 40 constituted by the plurality of elements 40a to 40c arranged on the mounting substrate 30. The pressing portion 12 has a plate-shaped hard member 13 having higher surface precision (flatness, smoothness, etc.) than the surface of the pressing plate 11. The hard member 13 is constituted by a flat plate-shaped thin plate body (rigid body).

[0083] In the present embodiment, the hard member 13 is provided on the surface of the pressing plate 11 (the surface on the side on which the elements 40a to 40c are arranged). The hard member 13 is fixed to the surface of the pressing plate 11 by adhesion or joining.

[0084] When pressed by the pressing plate 11, the surface of the hard member 13 (the surface on the side on which the elements 40a to 40c are arranged) constitutes the abutting surface or the pressing surface with the elements 40. That is, in the present embodiment, the element array 40 is pressed via the hard member 13.

[0085] The surface area of the side of the surface of the hard member 13 on the side on which the elements 40a to 40c are arranged is preferably the same as or larger than the surface area of the element array 40 or the mounting substrate 30. In this case, when pressed by the pressing plate 11, the entire surface of the element array 40 can be pressed via the hard member 13. However, the surface area of the hard member 13 can be smaller than the surface area of the element array 40 or the mounting substrate 30.

[0086] The surface precision of the hard member 13 is higher than the surface precision of the pressing plate 11. The surface of the hard member 13 (particularly, the abutting surface with the element array 40) has less irregularities (i.e., is smooth) and less inclination with respect to the horizontal plane (i.e., is flat) than the surface of the pressing plate 11.

[0087] In the present embodiment, the hard member 13 is composed of a glass substrate. However, the material constituting the hard member 13 is not limited to this, and can be composed of, for example, quartz (Si02), diamond, or sapphire, alumina (AI2O3), cordierite (2MgO-2AI2O3-5Si02), aluminum nitride (AIN), silicon nitride (SiN), silicon carbide (SiC), zirconia (Zr02), or the like. As the surface precision, the surface roughness Ra of the hard member 13 is preferably 0.1 to 2.0 μm, and more preferably 0.1 to 1.0 μm.

[0088] By setting the surface roughness Ra of the hard member 13 in such a range, when the pressing plate 11 is pressed, the elements 40a to 40c can be prevented from adhering to the surface of the hard member 13, and the contact (parallelism) between the surface of the hard member 13 and the surface of the element array 40 can be made good.

[0089] In addition, since the pressing plate 11 is composed of a common metal, it deforms when heated, but the hard member 13 composed of the above-described material has a small coefficient of thermal expansion and is not easily deformed. Therefore, when the pressing plate 11 is pressed, the contact between the surface of the element array 40 and the pressing surface of the pressing portion 12 (hard member 13) becomes good, and pressure can be uniformly applied to the plurality of elements 40a to 40c arranged on the mounting substrate 30.

[0090] In addition, the hard member 13 is preferably composed of a member / material having a high thermal conductivity. Since the hard member 13 is composed of such a member / material, when the pressing plate 11 is heated when the pressing plate 11 is pressed, the heat of the pressing plate 11 is easily transferred to the hard member 13. Therefore, heat of sufficient heat quantity can be transferred to the electrically conductive joining material via the hard member 13, and the electrodes 41_1 and 41_2 and the wiring 31_1 and 31_2 can be connected via the electrically conductive joining material efficiently and stably.

[0091] In the illustrated example, the thickness of the hard member 13 is thinner than the thickness of the mounting auxiliary substrate 32, but can be thicker than the thickness of the mounting auxiliary substrate 32. The thickness of the hard member 13 is preferably 1 mm to 20 mm.

[0092] By setting the thickness of the hard member 13 in such a range, when the pressing plate 11 is heated when the pressing plate 11 is pressed, the heat of the pressing plate 11 is easily transferred to the hard member 13. Therefore, heat of sufficient heat quantity can be transferred to the electrically conductive joining material via the hard member 13, and the electrodes 41_1 and 41_2 and the wiring 31_1 and 31_2 of the elements 40a to 40c can be connected via the electrically conductive joining material efficiently and stably.

[0093] A hydrophobic layer (first hydrophobic layer) 13a is formed on the surface of the rigid component 13. The hydrophobic layer 13a is formed by performing a hydrophobic treatment process on the surface of the rigid component 13 (in the illustrated example, the surface of the rigid component 13 on one side where the plurality of elements 40a-40c are located). The hydrophobic treatment process is performed by coating the surface of the rigid component 13 with, for example, a fluoropolymer resin. The thickness of the hydrophobic layer 13a is preferably smaller than the thickness of the rigid component 13, preferably 8 μm or less.

[0094] The method for manufacturing the element array 40 on the mounting substrate 30 will now be described.

[0095] First, such as Figure 1 As shown, a mounting substrate 30 is prepared to be configured with multiple components 40a to 40c. The mounting substrate 30, for example... Figures 3A-3C The manufacturing process is carried out according to the steps shown. That is, as follows: Figure 3A As shown, a supply substrate 80, incorporating multiple components 40a, is placed on a supply stage 70. The supply substrate 80 comprises, for example, a substrate body 81 and an adhesive layer 82 formed on the surface of the substrate body 81. The adhesive layer 82 is made of resins such as natural rubber, synthetic rubber, acrylic resin, or silicone. Alternatively, the substrate body 81 may be a flexible adhesive sheet. Components 40a are detachably attached to the surface of the adhesive layer 82 in a matrix pattern at predetermined intervals in both the X-axis and Y-axis directions.

[0096] like Figure 3B As shown, the flexible stamp tool 61 of the conveying device 60 is moved to the supply table 70, and multiple components 40a attached to the adhesive layer 82 are picked up from the supply substrate 80. Thus, as... Figure 3C As shown, the flexible impression tool 61 is moved to the mounting stage 20 to transfer (configure) the picked-up components 40a onto the mounting substrate 30. Furthermore, the flexible impression tool 61 has multiple protrusions arranged at predetermined intervals. By attaching the multiple components 40a to an adhesive layer (not shown) formed on the surface of these protrusions, the tool can pick up the multiple components 40a. The multiple components 40a configured on the mounting substrate 30 are attached to a conductive bonding material formed on the mounting substrate 30 (not shown).

[0097] Similarly, a supply substrate 80 (omitted from the illustration) prepared to be provided with a plurality of elements 40b is placed on the supply stage 70. Then, the elastic stamp tool 61 is moved to the supply stage 70, the plurality of elements 40b is picked up from the supply substrate 80, and the elastic stamp tool 61 is moved to the mounting stage 20 to transfer (provide) the picked-up plurality of elements 40b to the mounting substrate 30. Further, a supply substrate 80 (omitted from the illustration) prepared to be provided with a plurality of elements 40c is placed on the supply stage 70. Then, the elastic stamp tool 61 is moved to the supply stage 70, the plurality of elements 40c is picked up from the supply substrate 80, and the elastic stamp tool 61 is moved to the mounting stage 20 to transfer (provide) the picked-up plurality of elements 40c to the mounting substrate 30. Thus, the mounting substrate 30 provided with the plurality of elements 40a to 40c shown in the illustration can be prepared. Figure 3C The mounting substrate 30 provided with the plurality of elements 40a to 40c shown in the illustration.

[0098] Next, the element array 40 composed of the plurality of elements 40a to 40c transferred to the mounting substrate 30 by the elastic stamp tool 61 is pressed by the hard member 13 provided on the surface of the pressing plate 11. The heating temperature of the pressing plate 11 at the time of pressing is at most about 500 degrees. Thus, the plurality of elements 40a to 40c is pressed toward the conductive joining material provided on the mounting substrate 30, and the plurality of elements 40a to 40c (electrodes 41_1, 41_2) is electrically connected to the mounting substrate 30 (wiring 31_1 and wiring 31_2) via the conductive joining material. As described above, the element array 40 can be manufactured on the mounting substrate 30.

[0099] In the pressing device 10 of the element array 40 of the present embodiment, the pressing portion 12 has the plate-shaped hard member 13 having a higher surface precision than the surface of the pressing plate 11. Thus, at the time of pressing by the pressing plate 11, the element array 40 composed of the plurality of elements 40a to 40c provided on the mounting substrate 30 can be pressed via the hard member 13. Since the surface precision (e.g., flatness, smoothness, etc.) of the hard member 13 is higher than the surface precision (e.g., flatness, smoothness, etc.) of the pressing plate 11, the contact (degree of parallelism, etc.) between the surface of the element array 40 or the like and the pressing surface (abutting surface with the element array 40) of the pressing portion 12 (hard member 13) becomes good, and the pressure can be uniformly applied to the plurality of elements 40a to 40c provided on the mounting substrate 30. Thus, according to the pressing device 10 of the element array 40 of the present embodiment, it is possible to prevent occurrence of mounting failure and to stably manufacture the element array 40 on the mounting substrate 30.

[0100] In addition, in the present embodiment, the hard member 13 is provided on the surface of the pressurizing plate 11. Therefore, even in the case where the surface precision of the pressurizing plate 11 is poor, it is possible to directly moderate (absorb) the surface precision of the pressurizing plate 11 using the hard member 13. Therefore, it is possible to effectively prevent mounting failure from occurring, and to stably manufacture the element array 40 on the mounting substrate 30.

[0101] In addition, in the present embodiment, the surface of the hard member 13 is formed with a hydrophobic layer 13a that has been subjected to a hydrophobic treatment process. Therefore, when the element array 40 formed on the mounting substrate 30 is pressed via the surface of the hard member 13, it is possible to prevent the elements 40a to 40c from adhering to the surface of the hard member 13, and to effectively prevent mounting failure from occurring. In addition, when the plurality of elements 40a to 40c are mounted to the mounting substrate 30 using an electrically conductive joining material, even if the pressurizing portion 12 comes into contact with the electrically conductive joining material when the mounting substrate 30 is pressed using the pressurizing plate 11, it is possible to prevent the electrically conductive joining material from adhering to the pressurizing portion 12 using the hydrophobic layer 13a.

[0102] In addition, in the present embodiment, the thickness of the hydrophobic layer 13a is smaller than the thickness of the hard member 13. Therefore, it is possible to effectively prevent the elements 40a to 40c from adhering to the surface of the hard member 13 and the like.

[0103] In addition, in the present embodiment, the conveyance device 60 (the elastomeric stamp tool 61) moves to the supply stage 70 to pick up the plurality of elements 40a to 40c from the supply substrate 80, and moves to the mounting stage 20 to transfer the plurality of picked-up elements 40a to 40c to the mounting substrate 30. Therefore, even in so-called mass transfer in which the plurality of elements 40a to 40c are collectively transferred from the supply substrate 80 to the mounting substrate 30, it is possible to stably manufacture the element array 40 on the mounting substrate 30 in the case where the element array 40 constituted by the elements 40a to 40c is pressed using the pressurizing plate 11, and to improve the yield at the time of manufacture.

[0104] In addition, in the present embodiment, the plurality of elements 40a to 40c are connected to the mounting substrate 30 by pressing the plurality of elements 40a to 40c against the electrically conductive joining material provided on the mounting substrate 30. Therefore, it is possible to mount the plurality of elements 40a to 40c to the mounting substrate 30 using an electrically conductive joining material such as an ACF (Anisotropic Conductive Film) or an ACP (Anisotropic Conductive Paste), and to easily manufacture the element array 40 on the mounting substrate 30.

[0105] Furthermore, in this embodiment, the thickness of elements 40a to 40c is less than 50 μm. Thus, even when the element array 40, composed of tiny elements 40a to 40c, is the object of pressure, pressure can be uniformly applied to the multiple elements 40a to 40c constituting the element array 40 by appropriately deforming the elastic member 14 according to the surface shape of the element array 40, etc.

[0106] Implementation Method 2

[0107] Figure 4 The pressurizing device 110 of the illustrated embodiment has the same structure as the pressurizing device 10 of the first embodiment, except for the aspects shown below, and performs the same function. Figure 4 In this document, components that are identical to those in the pressurizing device 10 of the first embodiment are marked with the same symbols, and their descriptions are partially omitted.

[0108] like Figure 4 As shown, the pressurizing device 110 has a pressurizing plate 111. The pressurizing plate 111 has a pressurizing part 112, which is different from the pressurizing part 12 in the first embodiment in that, in addition to the rigid member 13 provided on the surface of the pressurizing plate 111, the pressurizing part 112 also has an elastic member 14.

[0109] The elastic member 14 is flat (sheet-like) and is disposed on the surface of the rigid member 13. The elastic member 14 is fixed to the surface of the rigid member 13 by means of adhesive bonding or joining. When pressure is applied by the pressure plate 111, the surface of the elastic member 14 (the surface on the side where the plurality of elements 40a to 40c are arranged) forms a contact surface or a pressure surface with the element array 40. That is, in this embodiment, the element array 40 is pressurized via the elastic member 14.

[0110] Preferably, the surface area of ​​one side of the elastic member 14 located on the side where the elements 40a-40c are arranged is the same as or larger than the surface area of ​​the element array 40 or the mounting substrate 30. In this case, when pressure is applied using the pressure plate 111, the entire surface of the element array 40 can be pressurized via the elastic member 14. However, the surface area of ​​the elastic member 14 may also be smaller than the surface area of ​​the element array 40 or the mounting substrate 30.

[0111] In this embodiment, the elastic member 14 is made of a carbon sheet. However, the material that constitutes the elastic member 14 is not limited to this, and can be made of, for example, a heat-resistant resin such as polyimide, polytetrafluoroethylene (Teflon (registered trademark)), polypropylene, or an elastomer such as urethane, silicone, polyethylene terephthalate, polyethylene naphthalate, or a sheet made of glass wool.

[0112] In addition, the elastic member 14 is preferably made of a member / material that has excellent heat conductivity. By making the elastic member 14 of such a member / material, when the pressing plate 111 is pressed, heat of the pressing plate 111 is easily transmitted to the elastic member 14 when the pressing plate 111 is heated. Thus, sufficient heat can be transmitted to the electrically conductive joining material via the elastic member 14, and the electrodes 41_1 and 41_2 and the wiring 31_1 and 31_2 can be effectively and stably connected via the electrically conductive joining material.

[0113] The thickness L1 of the elastic member 14 is preferably 1 mm or less. The ratio L1 / L2 of the thickness L1 of the elastic member 14 to the thickness (height) L2 of the elements 40a to 40c is preferably 0.5 to 2.0. Further, the thickness L2 of the elements 40a to 40c corresponds to the sum of the thicknesses of the elements and the electrodes 41_1 and 41_2. In the case where the thickness of the elastic member 14 is set to be within this range with respect to the thickness of the elements 40a to 40c, since the elastic member 14 has a moderate thickness, the elastic member 14 easily deforms in accordance with the surface shape of the element array 40 and the like, and the entire element array 40 (without omission) can be pressed via the elastic member 14. In addition, since the elastic member 14 has a moderate hardness, a sufficient pressing force can be applied to the element array 40 via the elastic member 14. Thus, a pressure can be uniformly applied to the plurality of elements 40a to 40c arranged on the mounting substrate 30.

[0114] In addition, when the elastic member 14 is deformed, a pressure is generated, but in the case where the thickness of the elastic member 14 is set to be within the above range with respect to the thickness of the elements 40a to 40c, the above pressure is not excessively large to affect the pressing force of the pressing plate 111. Thus, when the pressing plate 111 is pressed, the pressing force of the pressing plate 111 can be prevented from being unevenly dispersed, and a pressure can be uniformly applied to the plurality of elements 40a to 40c arranged on the mounting substrate 30.

[0115] Further, by setting the thickness of the elastic member 14 in the above range, when the pressing plate 111 is pressed, heat of the pressing plate 111 is easily transmitted to the elastic member 14 when the pressing plate 111 is heated. Therefore, sufficient heat can be transmitted to the conductive joining material via the elastic member 14, and the electrodes 41_1 and 41_2 and the wirings 31_1 and 31_2 can be effectively and stably connected via the conductive joining material.

[0116] A hydrophobic layer (second hydrophobic layer) 14a is formed on the surface of the elastic member 14. The hydrophobic layer 14a is formed by performing a hydrophobic treatment process on the surface of the elastic member 14 (in the illustrated example, the surface of the side of the elastic member 14 on which the elements 40a to 40c are disposed). The hydrophobic treatment process is performed by applying, for example, a fluorine-based resin to the surface of the elastic member 14. The thickness of the hydrophobic layer 14a is preferably smaller than the thickness of the elastic member 14, and is preferably 8 μm or less.

[0117] In the present embodiment, the pressing portion 112 has the plate-shaped elastic member 14, which is disposed on the surface of the hard member 13. In this case, when pressed by the pressing plate 111, the plurality of elements 40a to 40c disposed on the mounting substrate 30 can be pressed via the elastic member 14. The elastic member 14 is moderately deformed in accordance with the surface shape of the element array 40 or the like, and thus the plurality of elements 40a to 40c disposed on the mounting substrate 30 can be more uniformly pressed.

[0118] Further, in the present embodiment, the hydrophobic layer 14a subjected to a hydrophobic treatment process is formed on the surface of the elastic member 14. Therefore, when the element array 40 formed on the mounting substrate 30 is pressed via the surface of the elastic member 14, the elements 40a to 40c can be prevented from adhering to the surface of the elastic member 14, and mounting failure can be effectively prevented. Further, in a case where the plurality of elements 40a to 40c is mounted to the mounting substrate 30 using a conductive joining material, even when the pressing portion 112 contacts the conductive joining material when pressed by the pressing plate 111, the conductive joining material can be prevented from adhering to the pressing portion 112 by the hydrophobic layer 14a. Therefore, damage to the pressing plate 111 caused by the conductive joining material adhering to the pressing portion 112 can be prevented.

[0119] Further, in the present embodiment, the thickness of the hydrophobic layer 14a is smaller than the thickness of the elastic member 14. Therefore, the elements 40a to 40c can be effectively prevented from adhering to the surface of the elastic member 14 or the like.

[0120] Furthermore, in this embodiment, the rigid member 13 is disposed on the surface of the pressure plate 111, and the elastic member 14 is disposed on the surface of the rigid member 13. Therefore, even if the surface precision of the pressure plate 111 is not good, it can be directly mitigated (absorbed) by the rigid member 13. Therefore, the elastic member 14, which forms the contact surface with the element array 40, can be arranged in a near-parallel state relative to the horizontal plane, and the contact (parallelism, etc.) between the surface of the element array 40 and the pressure surface (the contact surface with the element array 40) of the pressure part 112 (elastic member 14) becomes good. Therefore, pressure can be uniformly applied to the plurality of elements 40a to 40c disposed on the mounting substrate 30, installation defects can be effectively prevented, and the element array 40 can be stably manufactured on the mounting substrate 30.

[0121] Furthermore, when the surface roughness Ra of the rigid member 13 is set within the range shown in the first embodiment (preferably 0.1 to 2.0 μm, more preferably 0.1 to 1.0 μm), the tilt relative to the horizontal plane can be reduced, and when the elastic member 14 is provided on the surface of the rigid member 13, good contact (parallelism, etc.) between the surface of the rigid member 13 and the surface of the element array 40 can be achieved when pressure is applied by the pressure plate 111. Additionally, the surface of the rigid member 13 may also have a hydrophobic layer 14a. In this case, the surface roughness Ra is preferably a value that includes the thickness of the hydrophobic layer 14a.

[0122] Third implementation method

[0123] Figure 5 The pressurizing device 210 of the illustrated embodiment has the same structure as the pressurizing device 110 of the second embodiment, except for the aspects shown below, and performs the same function. Figure 5 In this document, components that are identical to those in the pressurizing device 110 of the second embodiment are marked with the same symbols, and their descriptions are partially omitted.

[0124] like Figure 5 As shown, the pressurizing device 210 has a pressurizing plate 211, and the pressurizing plate 211 has a pressurizing part 212. (Comparison) Figure 4 and Figure 5 As can be seen, in the pressure section 212, the arrangement of the rigid member 13 and the elastic member 14 is interchanged. That is, in this embodiment, the elastic member 14 is provided on the surface of the pressure plate 211, and the rigid member 13 is provided on the surface of the elastic member 14. Furthermore, in the illustrated example, the surface of the rigid member 13 does not have… Figure 1 The hydrophobic layer 13a shown is actually present.

[0125] In this case, the elastic member 14 functions as a buffer material. By freely deforming the elastic member 14, the rigid member 13 can freely tilt or change its position according to the deformed shape of the elastic member 14. By moderately deforming the elastic member 14, the surface of the element array 40 and the like can easily become parallel to the surface of the rigid member 13 that forms the contact surface with the element array 40 and the like, and pressure can be applied more evenly to the multiple elements 40a to 40c constituting the element array 40.

[0126] Implementation Method 4

[0127] Figure 6 The pressurizing device 310 of the illustrated embodiment has the same structure as the pressurizing device 210 of the third embodiment, except for the aspects shown below, and performs the same function. Figure 6 In this document, components that are identical to those in the pressurizing device 210 of the third embodiment are marked with the same symbols, and their descriptions are partially omitted.

[0128] like Figure 6 As shown, the pressurizing device 310 includes a pressurizing plate 311. The pressurizing plate 311 has a pressurizing portion 312, which differs from the pressurizing portion 212 in the third embodiment in that it also has an elastic member 14 disposed on the surface of the rigid member 13. In this embodiment, the elastic member 14 is disposed on the surface of the pressurizing plate 311, the rigid member 13 is disposed on the surface of the elastic member 14, and other elastic members 14 are disposed on the surface of the rigid member 13.

[0129] That is, in this embodiment, at least one rigid member 13 (one in the illustrated example) and at least one elastic member 14 (two in the illustrated example) are alternately stacked on the surface of the pressure plate 311, and the pressure part 312 is composed of three layers of rigid members 13 and elastic members 14. Furthermore, in the illustrated example, the elastic member 14 disposed on the surface of the rigid member 13 does not have... Figure 4 The hydrophobic layer 14a shown is actually present.

[0130] In this embodiment, at least one rigid member 13 and at least one elastic member 14 are alternately stacked on the surface of the pressure plate 311. In this case, the effects obtained by equipping the pressure plate 11 with the rigid member 13 (the effects obtained in the first embodiment) and the effects obtained by equipping the pressure plates 111 and 211 with the elastic member 14 (the effects obtained in the second and third embodiments) can be achieved simultaneously, and pressure can be applied more uniformly to the plurality of elements 40a to 40c disposed on the mounting substrate 30.

[0131] In this embodiment, the hard member 13 is provided on the surface of the elastic member 14, and another elastic member 14 is provided on the surface of the hard member 13. The surface precision (e.g., flatness, smoothness, etc.) of the hard member 13 is higher than the surface precision (e.g., flatness, smoothness, etc.) of the pressing plate 311, and thus by providing the hard member 13 between the elastic members 14 in advance, the elastic member 14 constituting the outer side of the abutting surface of the component array 40 can be arranged in a state close to parallel with respect to the horizontal plane. Thus, the contact (degree of parallelism, etc.) between the surface of the component array 40 and the pressing surface (abutting surface of the component array 40) of the pressing portion 312 (elastic member 14 on the outer side) becomes good, and pressure can be uniformly applied to the plurality of components 40a to 40c arranged on the mounting substrate 30. Thus, occurrence of mounting failure can be effectively prevented, and the component array 40 can be stably manufactured on the mounting substrate 30.

[0132] In addition, by deforming the elastic member 14 provided on the surface of the pressing plate 311, the surface of the component array 40 and the surface of the elastic member 14 constituting the outer side of the abutting surface of the component array 40 easily become parallel, and pressure can be more uniformly applied to the plurality of components 40a to 40c constituting the component array 40.

[0133] Fifth Embodiment

[0134] Figure 7 The pressing device 410 of the illustrated embodiment has the same structure as the pressing device 310 of the fourth embodiment and functions to achieve the same effects except for the following aspects. Figure 7 In the fourth embodiment, the same components as those in the pressing device 310 of the fourth embodiment are denoted by the same reference numerals, and the description thereof is partly omitted.

[0135] As shown in FIG. 10, the pressing device 410 has a pressing plate 411, and the pressing plate 411 has a pressing portion 412. The pressing portion 412 of the pressing device 410 is different from the pressing portion 312 of the fourth embodiment in that the pressing portion 412 has an elastic member 15 in addition to the hard member 13 and the elastic member 14. The elastic member 15 is provided on the surface of the hard member 13. Figure 7

[0136] The elastic member 15 has a different shape from the elastic member 14 and has a smaller X-axis direction width and / or Y-axis direction width than the elastic member 14. In addition, the elastic member 15 has a greater thickness than the elastic member 14. The material constituting the elastic member 15 can be the same as or different from the elastic member 14. In the illustrated example, the elastic member 15 does not have a hydrophobic layer (corresponding to the hydrophobic layer 14a of the hydrophobic layer 14), but actually has a hydrophobic layer. Figure 4

[0137] ​​Thus, in a case where the surface of the hard member 13 is provided with the elastic member 15 that is different in shape and material from the elastic member 14, the same effects as those of the fourth embodiment can be obtained.

[0138] Sixth Embodiment

[0139] Figure 8 The pressurizing device 510 of the illustrated embodiment has the same structure as and functions as the pressurizing device 210 of the third embodiment except for the aspects described below. Figure 8 In the sixth embodiment, the same components as those in the pressurizing device 210 of the third embodiment are denoted by the same reference numerals, and the description thereof is partly omitted.

[0140] As Figure 8 The pressurizing device 510 has clamp members (carriages) 50_1 and 50_2. The clamp member 50_1 is disposed on one end side in the X-axis direction of the hard member 13 and fixes one end of the hard member 13. The clamp member 50_2 is disposed on the other end side in the X-axis direction of the hard member 13 and fixes the other end of the hard member 13.

[0141] More specifically, the clamp members 50_1 and 50_2 have clamp inclined portions 51_1 and 51_2 that are formed obliquely with respect to the YZ plane. In addition, the hard member 13 has tapered portions 130_1 and 130_2 that are formed obliquely with respect to the YZ plane. The tapered portion 130_1 is formed on one end in the X-axis direction of the hard member 13, and the tapered portion 130_2 is formed on the other end in the X-axis direction of the hard member 13. The clamp inclined portion 51_1 is engaged with (abuts against) the tapered portion 130_1, and the clamp inclined portion 51_2 is engaged with (abuts against) the tapered portion 130_2. Thus, the hard member 13 is fixed in a manner of being clamped by the clamp inclined portions 51_1 and 51_2 and is fixed to the inner side in the X-axis direction of the clamp inclined portions 51_1 and 51_2.

[0142] The tapered portion 130_1 is fixed by the clamp inclined portion 51_1, and the tapered portion 130_2 is fixed by the clamp inclined portion 51_2, whereby the hard member 13 can be detachably fixed to the pressurizing plate 11 by the clamp members 50_1 and 50_2. In addition, the clamp members 50_1 and 50_2 are fixed to the pressurizing plate 11 by bolts or the like.

[0143] In this embodiment, the rigid member 13 is provided in a detachable manner relative to the pressure plate 11. Therefore, the rigid member 13 provided with the pressure plate 11 can be easily replaced with a new rigid member 13. In addition, when removing and installing the rigid member 13, the elastic member 14 can also be removed and installed at the same time, and the elastic member 14 can be easily replaced with a new elastic member 14. Furthermore, depending on the type of components 40a to 40c, the shape of the mounting substrate 30, etc., the rigid member 13 or the elastic member 14 provided with the pressure plate 11 can be replaced with a suitable rigid member 13 or elastic member 14.

[0144] Furthermore, in this embodiment, the rigid component 13 is fixed to the pressure plate 11 by the clamping components 50_1 and 50_2. Therefore, with the help of the clamping components 50_1 and 50_2, the rigid component 13 can be fixed to the pressure plate 11 with sufficient fixing strength. In addition, the rigid component 13 is easy to install and remove from the pressure plate 11, and the rigid component 13 or the elastic component 14 can be easily replaced.

[0145] Implementation Method 7

[0146] Figure 9 The pressurizing device 610 of the illustrated embodiment has the same structure as the pressurizing device 110 of the second embodiment, except for the aspects shown below, and performs the same function. Figure 9 In this document, components that are identical to those in the pressurizing device 110 of the second embodiment are marked with the same symbols, and their descriptions are partially omitted.

[0147] like Figure 9 As shown, the pressurizing device 610 includes a pressurizing plate 611. The pressurizing plate 611 has a pressurizing portion 612, and the elastic member 14 of the pressurizing portion 612 is directly disposed (aggregate) on the surface of the pressurizing plate 11, which differs from the pressurizing portion 112 in the second embodiment. The elastic member 14 is fixed to the surface of the pressurizing plate 611 by means of adhesive bonding or joining. When pressurized by the pressurizing plate 611, the surface of the elastic member 14 (the surface on the side where the plurality of elements 40a to 40c are arranged) forms an abutment surface or pressurizing surface with the element array 40. That is, in the pressurizing device 610 for the element array 40 of this embodiment, when pressurized by the pressurizing plate 611, the element array 40 composed of the plurality of elements 40a to 40c arranged on the mounting substrate 30 can be pressurized via the elastic member 14. Furthermore, a hydrophobic layer 14a is formed on the surface of the elastic member 14.

[0148] In this embodiment, since the elastic member 14 has a suitable thickness (the ratio of the thickness L1 of the elastic member 14 to the thickness L2 of the plurality of elements 40a to 40c, L1 / L2, is preferably 0.5 to 2.0), the elastic member 14 can easily deform appropriately according to the surface shape of the element array 40, etc., and pressure can be applied to the entire element array 40 (without omissions) via the elastic member 14. In addition, since the elastic member 14 has a suitable hardness, sufficient pressure can be applied to the element array 40 via the elastic member 14. Therefore, pressure can be applied uniformly to the plurality of elements 40a to 40c disposed on the mounting substrate 30.

[0149] In this embodiment, the elastic member 14 is provided on the surface of the pressure plate 611. Therefore, when pressure is applied by the pressure plate 611, when the pressure plate 611 is heated, the heat of the pressure plate 611 is easily transferred to the elastic member 14, and multiple components 40a to 40c can be well mounted to the mounting substrate 30 using, for example, a conductive bonding material provided on the mounting substrate 30.

[0150] Example

[0151] The present invention will now be described with reference to more detailed embodiments, but the present invention is not limited to these embodiments.

[0152] Example 1

[0153] like Figure 9 As shown, a sample of a mounting substrate 30 with components 40a to 40c is fabricated, and an elastic element 14 is provided on the surface of the pressure device 610. Carbon sheet is used as the elastic element 14. The thickness L1 of the elastic element 14 is 5 μm, the thickness L2 of the components 40a to 40c is 8 μm (component thickness: 5 μm / electrode thickness: 3 μm), and the ratio L1 / L2 of the thickness L1 of the elastic element 14 to the thickness (height) L2 of the components 40a to 40c is 1.60.

[0154] A hydrophobic layer 14a, consisting of a hydrophobic coating agent with a thickness of 0.05 μm, is formed on the surface of the elastic member 14 (the surface on one side of the elastic member 14 where elements 40a to 40c are located).

[0155] Ten identical samples were prepared. Each sample was pressurized using a pressure plate 611 with an elastic element 14 on its surface. The surface of the mounting base 30 was then observed to evaluate for any installation defects. Samples with no installation defects were rated GOOD, while those with minor installation defects were rated NG. The results are shown in Table 1.

[0156] Examples 2-3, Comparative Examples 1-2

[0157] By changing the thickness L1 of the elastic member 14 provided on the surface of the pressurizing plate 611 from Example 1, the same evaluation as Example 1 was performed except for changing the ratio L1 / L2 of the thickness L1 of the elastic member 14 to the thickness (height) L2 of the elements 40a to 40c. The results are shown in Table 1.

[0158] Table 1

[0159]

[0160] Evaluation

[0161] As shown in Table 1, when the ratio L1 / L2 of the thickness L1 of the elastic member 14 to the thickness (height) L2 of the plurality of elements 40a to 40c is in the range of 0.5 to 2.0, mounting failure does not occur, and it can be confirmed that the element array 40 can be stably manufactured on the mounting substrate 30.

[0162] In addition, the present application is not limited to the above-described embodiments, and various changes can be made within the scope of the present application.

[0163] In the above-described first embodiment, micro LEDs are exemplified as the elements 40a to 40c mounted on the mounting substrate 30, but other elements than micro LEDs can be mounted on the mounting substrate 30. For example, the elements 40a to 40c are elements used in electronic circuits, and can be chips such as MEMS, semiconductor elements, resistors, and capacitors. Among the semiconductor elements, there are discrete semiconductors such as transistors, diodes, LEDs, and thyristors, or integrated circuits such as ICs and LSIs. Among the LEDs, there are Mini LEDs (mini light emitting diodes) and the like. When such elements are used, the thickness (height) of the elements 40a to 40c is preferably 100 μm or less, and more preferably 50 μm or less. The same applies to the above-described second embodiment to the above-described seventh embodiment.

[0164] In the above-described first embodiment, it is also possible to form a concave-convex (surface roughness Ra: 0.1 to 1.0 μm) smaller than that which can be formed on the surface of the pressurizing plate 11 on the surface of the hard member 13 or the surface of the hydrophobic layer 13a. In this case, when the pressurizing plate 11 is used for pressurization, it is possible to prevent the elements 40a to 40c from adhering to the surface of the pressurizing portion 12 (hard member 13), and it is possible to effectively prevent mounting failure from occurring. The same applies to the above-described third embodiment.

[0165] In the above-described second embodiment, the surface of the elastic member 14 or the surface of the hydrophobic layer 14a can be formed with a smaller concavo-convex (surface roughness Ra: 0.1 to 1.0 μm) than the concavo-convex formed on the surface of the pressurizing plate 11. In this case, when the pressurizing plate 11 is pressed, the elements 40a to 40c can be prevented from adhering to the surface of the pressurizing portion 12 (elastic member 14), and mounting failure can be effectively prevented. The same applies to the above-described fourth embodiment and the above-described seventh embodiment. In the above-described fifth embodiment, the same concavo-convex can be formed on the surface of the elastic member 15 or the surface of the hydrophobic layer provided on the elastic member 15.

[0166] In the above-described first embodiment, the hydrophobic layer 13a is provided only on one side of the hard member 13 (the side on which the plurality of elements 40a to 40c are present), but can be provided on the opposite side. In the above-described second embodiment, the hydrophobic layer 14a is provided only on one side of the elastic member 14 (the side on which the plurality of elements 40a to 40c are present), but can be provided on the opposite side. The same applies to the above-described third embodiment to the above-described sixth embodiment.

[0167] In the above-described second embodiment, the hydrophobic layer 13a can be provided on the surface (both sides or one side) of the hard member 13. Similarly, in the above-described third embodiment, the hydrophobic layer 14a can be provided on the surface (both sides or one side) of the elastic member 14. In the above-described fourth embodiment, in the case where the pressurizing portion 312 is provided with a plurality of hard members 13 and / or elastic members 14, the hydrophobic layer 13a and the hydrophobic layer 14a can be provided on the surface (both sides or one side) of each hard member 13 and each elastic member 14, respectively.

[0168] In the above-described fourth embodiment, the pressurizing portion 312 is provided with one hard member 13 and two elastic members 14, but the number of hard members 13 and elastic members 14 provided in the pressurizing portion 312 is not limited thereto, and can be more. For example, the pressurizing portion 312 can be provided with two hard members 13 and two elastic members 14, or can be provided with two hard members 13 and three elastic members 14.

[0169] In the above-described fourth embodiment, the hard member 13 can be provided on the surface of the pressurizing plate 111, the elastic member 14 can be provided on the surface of the hard member 13, and the hard member 13 can be provided on the surface of the elastic member 14. In this case, the pressurizing portion 312 can be provided with a plurality of hard members 13 and / or elastic members 14.

[0170] In the fifth embodiment described above, the shape of the elastic member 15 is not limited to the example shown in the figure and can be appropriately modified. Furthermore, the arrangement of the elastic members 14 and 15 can be interchanged. Additionally, the technique shown in the fourth embodiment can be applied to the pressurizing device 410 of the fifth embodiment, by alternately stacking at least one rigid member 13, at least one elastic member 14, and at least one elastic member 15 on the surface of the pressure plate 411.

[0171] In the first embodiment described above, the mounting auxiliary substrate 32 may be omitted. The same applies to the second to seventh embodiments described above.

[0172] In the first embodiment described above, a method for mounting elements 40a to 40c on the mounting substrate 30 by heat and pressure bonding is provided. However, elements 40a to 40c can also be mounted on the mounting substrate 30 by solid-state bonding, anodic bonding, or other methods. The same applies to the second to seventh embodiments described above.

[0173] In the second embodiment described above, the hydrophobic layer 14a is provided only on one side of the elastic member 14 (the side where the plurality of elements 40a to 40c are located), but it may also be provided on the opposite side. Furthermore, the same applies to the fourth, fifth, and seventh embodiments described above.

[0174] In the third embodiment described above, a hydrophobic layer may also be provided on the surface (both sides or one side) of the elastic member 14. This is also true for the elastic member 14 in the fourth embodiment (the elastic member 14 that abuts against the pressure plate 311) and the elastic member 14 in the fifth embodiment. Furthermore, in this case, the thickness of the hydrophobic layer is preferably 8 μm or less.

[0175] In the fourth embodiment described above, a rigid member 13 may be provided on the surface of the pressure plate 311, an elastic member 14 may be provided on the surface of the rigid member 13, and other rigid members 13 and other elastic members 14 may be provided on the surface of the elastic member 14. Alternatively, in this case, the pressure section 312 may additionally include a rigid member 13 and an elastic member 14.

[0176] Explanation of reference numerals in the attached figures

[0177] 10, 110, 210, 310, 410, 510, 610... Pressurization device

[0178] 11, 111, 211, 311, 411, 511, 611... Pressure plate

[0179] 12, 112, 212, 312, 412, 512, 612... Pressurization section

[0180] 13 ……hard member

[0181] 130_1, 130_2 ……tapered portion

[0182] 14, 15 ……elastic member

[0183] 20 ……mounting stage

[0184] 30 ……mounting substrate

[0185] 31_1, 31_2 ……wiring pattern

[0186] 32 ……mounting auxiliary substrate

[0187] 40 ……element array

[0188] 40a, 40b, 40c ……element

[0189] 41_1, 41_2 ……electrode

[0190] 50_1, 50_2 ……jig member

[0191] 51_1, 51_2 ……jig inclined portion

[0192] 60 ……conveying device

[0193] 61 ……elastic stamp tool

[0194] 70 ……supply stage

[0195] 80 ……supply substrate

[0196] 81 ……substrate body

[0197] 82 ……adhesive layer

[0198] 91 ……control section

[0199] 92 ……pressurization control mechanism

[0200] 93 ……driving mechanism

[0201] 94 ……heating mechanism

[0202] 95 ……temperature control mechanism

Claims

1. A pressurizing device for an element array, comprising: a pressurizing plate having a pressurizing portion that pressurizes an element array composed of a plurality of elements arranged on a mounting substrate, wherein the pressurizing portion has an elastic member that is plate-shaped, and a hard member that is plate-shaped and has a higher surface accuracy than a surface of the pressurizing plate, the surface roughness of the hard member is 0.1 to 2.0 μm, the thickness of the elastic member is 0.5 to 2.0 times the thickness of the elements, the hard member is immovably joined to the surface of the pressurizing plate, the elastic member is joined to the surface of the hard member, and the surface of the elastic member constitutes an abutting surface or a pressurizing surface with the plurality of elements.

2. The pressurizing device for an element array according to claim 1, wherein a hydrophobic layer that has been subjected to a hydrophobic treatment process is formed on the surface of the elastic member.

3. The pressurizing device for an element array according to claim 2, wherein the thickness of the hydrophobic layer is smaller than the thickness of the elastic member.

4. The pressurizing device for an element array according to any one of claims 1 to 3, wherein the hard member is detachably provided to the pressurizing plate.

5. The pressurizing device for an element array according to claim 4, wherein the hard member is fixed to the pressurizing plate by a clamp member.

6. A manufacturing device for an element array, comprising the pressurizing device for an element array according to claim 1 or 2.

7. The manufacturing device for an element array according to claim 6, further comprising: a mounting stage on which the mounting substrate is placeable; a supply stage on which a supply substrate on which the plurality of elements are arranged is placeable; and a conveyance device that moves to the supply stage to pick up the plurality of elements from the supply substrate, and moves to the mounting stage to transfer the picked-up plurality of elements to the mounting substrate, wherein the pressurizing plate pressurizes the element array composed of the plurality of elements transferred to the mounting substrate by the conveyance device.

8. A manufacturing method for an element array, comprising: a step of preparing a mounting substrate on which a plurality of elements are arranged; and a step of pressurizing the plurality of elements arranged on the mounting substrate using the pressurizing device for an element array according to claim 1.

9. The manufacturing method for an element array according to claim 8, wherein the plurality of elements are connected to the mounting substrate by pressurizing the plurality of elements toward a conductive joining material provided to the mounting substrate.

10. A pressurizing device for an element array, comprising: a pressurizing plate having a pressurizing portion that pressurizes an element array composed of a plurality of elements arranged on a mounting substrate, wherein the pressurizing portion has an elastic member that is plate-shaped, and a hard member that is plate-shaped and has a higher surface accuracy than a surface of the pressurizing plate, the thickness of the elastic member is 0.5 to 2.0 times the thickness of the elements, the surface roughness of the hard member is 0.1 to 2.0 μm, the hard member is joined to the surface of the pressurizing plate, the elastic member is joined to the surface of the hard member, and the surface of the elastic member is joined to another hard member that has a surface roughness of 0.1 to 2.0 μm with respect to the hard member. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The surface of the other hard member constitutes an abutting surface or a pressing surface of the plurality of elements.

11. The pressing device of an array of elements according to claim 10, wherein A hydrophobic layer subjected to a hydrophobic treatment is formed on the surface of the other hard member.

12. The pressing device of an array of elements according to claim 11, wherein The thickness of the hydrophobic layer is smaller than the thickness of the other hard member.

13. The pressing device of an array of elements according to any one of claims 10 to 12, wherein The thickness of the elements is 50 μm or less.

14. A manufacturing device of an array of elements, comprising the pressing device of an array of elements according to any one of claims 10 to 12.

15. The manufacturing device of an array of elements according to claim 14, further comprising: a mounting stage on which the mounting substrate is placed; a supply stage on which a supply substrate provided with a plurality of the elements is placed; and a conveyance device that moves to the supply stage to pick up the plurality of the elements from the supply substrate, and moves to the mounting stage to transfer the picked-up plurality of the elements to the mounting substrate; the pressing plate presses the array of elements constituted by the plurality of the elements transferred to the mounting substrate by the conveyance device.

16. A manufacturing method of an array of elements, comprising: a step of preparing a mounting substrate provided with a plurality of elements; and a step of pressing the plurality of the elements provided on the mounting substrate using the pressing device according to claim 10.

17. The manufacturing method of an array of elements according to claim 16, wherein the plurality of the elements are connected to the mounting substrate by pressing the plurality of the elements against a conductive joining material provided on the mounting substrate. ​ ​

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