Non-contact detection device and method for heat pipe

Abstract

The present invention provides a non-contact heat pipe inspection device and method. This device controls an infrared heating module to heat the heat pipe under test based on heating parameters, and controls an infrared temperature measurement module to measure the heat pipe's temperature. During the heating process, the temperature slope of the measured temperature data is monitored. When the temperature slope converges to a stop slope, a score is determined based on the temperature slope, and the heat pipe's quality is determined based on the score. This device can effectively assess the conductivity of a heat pipe.

Description

Technical Field

[0001] The present invention relates to the detection of heat pipes, and in particular to the non-contact detection of heat pipes. Background Art

[0002] Currently, heat pipe testing is mostly performed using a contact-based testing method. Specifically, a heating block is first heated to a constant temperature. The block is then brought into contact with the heat pipe, heating it through heat conduction until the temperature reaches a steady state. Next, a contact temperature sensor is placed in contact with two points on the heat pipe to measure their temperatures. The temperature difference between these two points is used to determine the heat pipe's conductivity.

[0003] The existing contact detection method has at least the following problems:

[0004] 1. The contact detection method requires heating the heating block to a constant temperature and waiting for the temperature of the heat pipe to reach a steady state, which greatly increases the detection time.

[0005] 2. The heating block has a heat dissipation problem, and the different contact forces or areas between the heating block and the heat pipe will result in different heating power provided, and it is impossible to provide stable heating power to the heat pipe.

[0006] 3. The temperature of a contact temperature sensor is typically lower than that of the heated heat pipe. This temperature difference can cause measurement errors when the contact temperature sensor contacts the heat pipe. Furthermore, the contact force also affects the thermal resistance, resulting in different measurement results.

[0007] 4. The temperature difference between two points on the heat pipe will be different due to different heating power, which makes the test results unable to be used to judge the conduction effect.

[0008] Therefore, the existing contact-type detection method has the above-mentioned problems, and a more effective solution is urgently needed. Summary of the Invention

[0009] The main purpose of the present invention is to provide a non-contact detection device and method for a heat pipe, which uses non-contact heating and temperature measurement, and can complete the detection without the temperature of the heat pipe reaching a steady state.

[0010] The present invention provides a non-contact detection method for heat pipes, which is applied to a non-contact detection device including an infrared heating module and an infrared temperature measurement module. The method comprises the following steps: a) obtaining a heating parameter and object information of a heat pipe to be detected; b) calculating a stop slope based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe to be detected; c) controlling the infrared heating module to heat the heat pipe to be detected based on the heating parameter, and controlling the infrared temperature measurement module to measure temperature data of the heat pipe to be detected; d) monitoring a temperature slope of the temperature data during the heating process; e) performing a scoring process based on the temperature slope to determine a score for detecting the heat pipe to be detected when a stop condition is detected, wherein the stop condition includes the temperature slope converging to the stop slope; and f) determining the heat pipe to be detected as a good product if the score of the heat pipe to be detected is better than a score threshold, and determining the heat pipe to be detected as a bad product if the score is not better than the score threshold.

[0011] The present invention also provides a non-contact detection device for a heat pipe, comprising an infrared heating module, an infrared temperature measuring module, and a control module electrically connected to the infrared heating module and the infrared temperature measuring module. The infrared heating module is configured to heat a heat pipe under test based on a heating parameter; the infrared temperature measurement module is configured to measure temperature data of the heat pipe under test; the control module is configured to obtain the heating parameter and object information of the heat pipe under test, and the control module is configured to calculate a stop slope based on the infrared heating parameter of the infrared heating module and the object heating parameter of the heat pipe under test. The control module is configured to monitor a temperature slope of the measured temperature data during the heating process and, when a stop condition is met, determine a score for the heat pipe under test based on the temperature slope. The control module is configured to determine that the heat pipe under test is a good product if the score of the heat pipe under test exceeds a score threshold, and to determine that the heat pipe under test is a bad product if the score does not exceed the score threshold. The stop condition includes the temperature slope converging to the stop slope.

[0012] The present invention can effectively judge the quality of the conductivity of a heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 FIG. 4 is a structural diagram of a non-contact detection device according to an embodiment of the present invention.

[0014] Figure 2 FIG. 4 is a structural diagram of a non-contact detection device according to another embodiment of the present invention.

[0015] Figure 3 FIG. 4 is an architectural diagram of a processor according to another embodiment of the present invention.

[0016] Figure 4 Flowchart of a non-contact detection method according to an embodiment of the present invention.

[0017] Figure 5 This is a partial flow chart of a non-contact detection method according to another embodiment of the present invention.

[0018] Figure 6 This is a partial flow chart of a non-contact detection method according to another embodiment of the present invention.

[0019] Figure 7 This is a partial flow chart of a non-contact detection method according to another embodiment of the present invention.

[0020] Figure 8 FIG. 1 is a schematic diagram of a non-contact detection configuration according to an embodiment of the present invention.

[0021] Figure 9 FIG. 1 is a schematic diagram of the appearance of one side of a heat pipe according to an embodiment of the present invention.

[0022] Figure 10 for Figure 9 Schematic diagram of the appearance of the other side of the heat pipe.

[0023] Figure 11 FIG. 4 is a heating power-voltage relationship curve diagram according to an embodiment of the present invention.

[0024] Figure 12 FIG. 4 is a temperature slope-time relationship curve diagram according to an embodiment of the present invention.

[0025] Description of reference numerals:

[0026] 1: Non-contact detection equipment

[0027] 10: Control module

[0028] 11: Infrared heating module

[0029] 12: Infrared temperature measurement module

[0030] 10: Control module

[0031] 100: Processor

[0032] 101: Communication device

[0033] 102: Human-Machine Interface

[0034] 103: Storage device

[0035] 11: Infrared heating module

[0036] 110: Heating element

[0037] 12: Infrared temperature measurement module

[0038] 120: Measuring element

[0039] 121: Measuring element

[0040] 20: Computing Platform

[0041] 21: Positioning fixture

[0042] 210-212: Mounting structure

[0043] 213: Base

[0044] 22: Heat pipe

[0045] 30: Heating control module

[0046] 31: Measurement control module

[0047] 32: Stop monitoring module

[0048] 33: Scoring Module

[0049] 34: Heating scoring module

[0050] 35: Conduction Scoring Module

[0051] 36: Convection Scoring Module

[0052] 37: Threshold calculation module

[0053] 38: Initialization module

[0054] A1-A3, T1, T2, H: Location

[0055] L1, L2: distance

[0056] D1-D3: Area

[0057] S10-S15: Heating and detection steps

[0058] S20-S23: Initialization step

[0059] S30-S33: Scoring Steps

[0060] S40-S45: Judgment step

[0061] S50-S51: Threshold acquisition steps DETAILED DESCRIPTION

[0062] A preferred embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0063] The present invention provides a non-contact detection device and method that achieves non-contact heating and temperature measurement through infrared heating and infrared temperature measurement, thereby providing stable heating power and eliminating the problem of "measurement error caused by the temperature difference between the contact temperature sensor and the heat pipe."

[0064] Furthermore, the present invention evaluates the thermal conductivity of the heat pipe based on the slope of the temperature change, which is not only highly accurate but also can complete the test without waiting for the heat pipe to reach a steady-state temperature, thereby significantly reducing the test time.

[0065] See also Figure 1 , is a structural diagram of a non-contact detection device according to an embodiment of the present invention.

[0066] The non-contact detection device 1 of this embodiment includes an infrared heating module 11 , an infrared temperature measurement module 12 , and a control module 10 electrically connected to the above modules.

[0067] The infrared heating module 11 , such as a halogen heater, a shortwave infrared heater, a fast mediumwave infrared heater, a carbon mediumwave infrared heater, a (carbon dioxide) laser heater or other types of infrared heaters, is controlled to heat the object based on heating parameters.

[0068] It is worth mentioning that compared to hot air furnaces that perform indirect heating through hot air convection and have poor heating efficiency, the infrared heating module 11 of the present invention performs direct heating through infrared irradiation of heat pipes, which can provide better heating efficiency.

[0069] The infrared temperature measurement module 12 , such as a single-point infrared thermometer, a multi-point infrared thermometer, a laser thermometer or other types of infrared thermometers, is used to continuously measure the surface temperature of the heat pipe.

[0070] The control module 10 (such as a computer, a processor, a microcontroller, a control box, etc.) is used to control the non-contact detection device 1 to implement the non-contact detection of the present invention.

[0071] See also Figure 2 , is an architectural diagram of a non-contact detection device according to another embodiment of the present invention.

[0072] like Figure 2 As shown, the control module 10 can be a computer system (such as a general computer system such as a personal computer, tablet computer, smart phone, laptop computer, etc.), and is connected to the infrared heating module 11 and the infrared temperature measurement module 12 through the communication device 101.

[0073] The control module 10 may include a communication device 101 , a human-machine interface 102 , a storage device 103 , and a processor 100 (eg, a central processing unit) electrically connected to the above devices.

[0074] The communication device 101 (such as a network card, a Wi-Fi interface, a Bluetooth interface, a USB interface, an Ethernet interface, a ZigBee interface, an RS232 interface, or any combination thereof) is used to connect to an external device for communication.

[0075] The human-machine interface 102 (such as input devices such as a keyboard, mouse, and touchpad, output devices such as a display, speaker, buzzer, indicator light, or any combination of input and output devices such as a touch screen) is used to receive user input and output information.

[0076] The storage device 103 (such as a hard disk, solid state drive, flash memory, RAM, EEPROM or other storage module) is used to store data.

[0077] The processor 100 is used to control various devices and modules to implement the non-contact detection of the present invention (described in detail later).

[0078] See also Figure 3 , is an architecture diagram of a processor according to another embodiment of the present invention. The processor 100 of the present invention may include all or part of the following modules 30-38, where the modules 30-38 are used to implement different functions.

[0079] 1. Heating control module 30 : configured to control the infrared heating module 11 .

[0080] 2. Measurement control module 31 : configured to control the infrared temperature measurement module 12 .

[0081] 3. Stop monitoring module 32: configured to monitor whether a preset stop condition is met.

[0082] 4. Scoring module 33: configured to perform scoring processing on this detection.

[0083] In one embodiment, the scoring module 33 may include a heating scoring module 34, a conduction scoring module 35, and a convection scoring module 36. The heating scoring module 34 is configured to score the heating state of the current test. The conduction scoring module 35 is configured to score the conductivity of the heated conductive object. The convection scoring module 36 is configured to score the environmental state (e.g., thermal convection) of the current test.

[0084] 5. Threshold calculation module 37: configured to calculate scoring thresholds (such as heating scoring threshold, conduction scoring threshold and convection scoring threshold). The aforementioned scoring thresholds are used as a judgment basis to determine the quality of properties such as heating status, environmental status or conductivity.

[0085] 6. Initialization module 38: configured to perform initialization settings before detection.

[0086] The aforementioned modules 30-38 are interconnected (which may be electrical connections and information connections), and may be hardware modules (such as electronic circuit modules, integrated circuit modules, SoCs, etc.), software modules (such as firmware, operating systems or applications) or a mix of hardware and software modules, without limitation.

[0087] It is worth mentioning that when the aforementioned modules 30-38 are software modules (such as applications), the storage device 103 may include a non-transitory computer-readable recording medium, and the aforementioned non-transitory computer-readable recording medium stores a computer program, and the computer program records a computer-executable program code. When the processor 100 executes the aforementioned program code, the functions of the aforementioned modules 30-38 can be realized.

[0088] Please refer to Figure 2 In one embodiment, the control module 10 is only used to control the heating of the infrared heating module 11 and the temperature measurement of the infrared temperature measurement module 12, but does not perform the scoring process.

[0089] Specifically, modules 33-38 can be implemented on a computing platform 20 (e.g., a cloud computing service platform or a remote server). The control module 10 can connect to the computing platform 20 via a communication device 101 to obtain initialization-related data (e.g., scoring thresholds and stop conditions, described later). The control module 10 then uploads the collected data (e.g., temperature measurement data or slope data) to the computing platform 20 for computational processing to obtain various scores. Thus, since the computing platform 20 is responsible for performing high-load computations, the control module 10 only needs to have general processing capabilities and can utilize a lower-end processor.

[0090] In one embodiment, the infrared heating module 11 may include one or more heating elements ( Figure 2 (For example, a single heating element 110 is used, such as a combination of an infrared light source and a lens.) Each heating element 110 can heat a single point or a small area on the heat pipe (the heating area depends on the projection area of the infrared light). Providing multiple heating elements 110 allows simultaneous heating of multiple points or a large area on the heat pipe 22, thereby increasing heating efficiency.

[0091] In one embodiment, the infrared temperature measurement module 12 may include one or more measurement elements ( Figure 2 Two measuring elements 120-121 are used as an example. Each measuring element 120-121 can be, for example, a set of infrared thermometers that can measure the temperature of a single point on the heat pipe 22. Thus, when multiple measuring elements 120-121 are provided, the temperature of multiple points on the heat pipe can be measured simultaneously, thereby obtaining more temperature measurement data.

[0092] In one embodiment, the non-contact detection device 1 further includes a positioning fixture 21. The positioning fixture 21 is used to secure the heat pipe 22 to be tested, allowing the infrared heating module 11 to continuously heat the same location on the heat pipe 22 during the heating process, and the infrared temperature measurement module 12 to continuously measure the temperature at the same location on the heat pipe 22.

[0093] See also Figure 8 , which is a schematic diagram of a non-contact detection arrangement according to an embodiment of the present invention. As shown, the positioning fixture 21 may include a first mounting structure 211, a second mounting structure 212, a third mounting structure 210 disposed between the first and second mounting structures 211, 212, and a base 213.

[0094] When testing the heat pipe 22 to be tested, the heating element 110 of the infrared heating module 1 is fixedly mounted on the first mounting structure 211 , the measuring elements 120 - 121 of the infrared temperature measuring module 12 are fixedly mounted on the second mounting structure 212 , and the heat pipe 22 to be tested is fixedly clamped on the third mounting structure 210 .

[0095] In this way, the heating element 110 can heat the heating position A1 on one side of the heat pipe 22 , and the measuring elements 120 - 121 can measure the temperature of the multiple measuring positions A2 and A3 on the other side (different side) of the heat pipe 22 .

[0096] In one embodiment, one measurement position A2 is located directly behind heating position A1 to measure the temperature near the heating point, and at least one measurement position A3 is located away from heating position A1 to measure the temperature away from the heating point. Through this configuration, the present invention can determine the temperature difference between measurement positions A2 and A3 and use this temperature difference to evaluate the conductivity of the heat pipe 22 (described in detail later).

[0097] In one embodiment, the heat pipe 22 is coated with dark radiation paint at the heating position A1 and the measuring positions A2 and A3. The dark radiation paint can enhance the absorption of radiant heat, thereby improving heating efficiency and increasing the success rate and accuracy of temperature measurement.

[0098] In one embodiment, the dark radiant paint coating area at heating position A1 is larger than the (laser) infrared irradiation area D1 of heating element 110, ensuring that the heating infrared light fully illuminates the dark radiant paint. Furthermore, the dark radiant paint coating areas at measurement positions A2 and A3 are larger than the measurement areas D2 and D3 of measurement elements 120 and 120, ensuring that the temperature-measuring infrared light fully illuminates the dark radiant paint.

[0099] In one embodiment, the distance L1 (first distance) between the heating element 110 and the heat pipe 22 is adjusted based on the focal length of the lens of the heating element 110 , such as being equal to the focal length of the lens, so that the thermal infrared rays can be effectively focused on the heating position A1 .

[0100] In addition, the distance L2 (second distance) between the measuring elements 120 and 121 and the heat pipe 22 is adjusted based on the focal length of the lens of the measuring elements 120 and 121, such as being equal to the focal length of the lens, so that the temperature measuring infrared light can be effectively focused on the measuring positions A2 and A3.

[0101] In one embodiment, the second distances between the measuring elements 120 , 121 and the heat pipe 22 are equal, such as the distance L2 , thereby eliminating temperature measurement errors caused by different measuring distances.

[0102] See also Figure 9 and Figure 10 , Figure 9 FIG1 is a schematic diagram of the appearance of one side of a heat pipe according to an embodiment of the present invention. Figure 10 for Figure 9 Schematic diagram of the appearance of the other side of the heat pipe.

[0103] The present invention is particularly suitable for thermal conductivity detection of ultra-thin vapor chambers (VC). Specifically, the present invention can detect the heat conduction of a heating position H ( Figure 10 ) is heated, and the temperature of the measurement positions T1 and T2 on the other side is measured, where the measurement position T1 is located on the front and back sides of the heating position H.

[0104] Moreover, when the heating position H of the ultra-thin heat spreader is heated, the liquid under the wall at the heating position H absorbs heat and turns into vapor and flows to other positions with low pressure (such as the measuring position T2 end). After absorbing heat by contacting the wall at the measuring position T2 end, it condenses back into liquid again and then flows back to the heating position H end, forming a thermal cycle, thereby realizing the heat dissipation function.

[0105] See also Figure 4 , which is a flow chart of a non-contact detection method according to an embodiment of the present invention.

[0106] Step S10 : The processor 100 obtains the heating parameters, the stop slope, and the object information of the heat pipe 22 to be tested.

[0107] The aforementioned heating parameters are used to control the heating power output by the infrared heating module 11. The stop slope is used to determine whether to stop detection. Object information may include, but is not limited to, the mass, area, specific heat capacity, and target temperature of the heat pipe 22.

[0108] The aforementioned heating parameters, stop slope, and object information may be pre-set and stored in the storage device 103 , or manually input by the user, without limitation.

[0109] In one embodiment, the processor 100 may obtain infrared heating parameters of the infrared heating module 11 (i.e., the heating capacity of the infrared heating module 11) and object heating parameters of the heat pipe 22 (i.e., the temperature change capacity of the heat pipe 22), and calculate the aforementioned stop slope based on the infrared heating parameters and the object heating parameters.

[0110] Step S11: The processor 100 controls the infrared heating module 11 to heat the heat pipe 22 based on the heating parameters through the heating control module 30, and controls the infrared temperature measurement module 12 to continuously measure the temperature of the heat pipe 22 during heating through the measurement control module 31 to obtain measured temperature data at the measurement position.

[0111] In one embodiment, the processor 100 may control the plurality of measuring elements 120 - 121 of the infrared temperature measurement module 12 to simultaneously measure the plurality of measurement positions A2 - A3 of the heat pipe 22 to obtain a plurality of measured temperature data of the plurality of measurement positions A2 - A3 .

[0112] Step S12: During the heating process, the processor 100 obtains the measured temperature data of the infrared temperature measurement module 12 through the measurement control module 31, and monitors the temperature slope of the measured temperature data in real time, such as calculating the slope corresponding to the temperature change between two consecutive time points (such as 0.5 seconds, 1 second, 5 seconds, 10 seconds, etc.).

[0113] Step S13: The processor 100 monitors whether a preset stop condition is met through the stop monitoring module 32 .

[0114] In one embodiment, the stop condition includes the temperature slope converging to the stop slope (eg, the temperature slope gradually decreases to the stop slope), that is, the stop monitoring module 32 determines to stop detection when it detects that the real-time temperature slope converges to the stop slope.

[0115] In one embodiment, the stop condition includes that the cumulative heating time (i.e., heating duration) reaches the detection time upper limit (such as 1 minute, 5 minutes, 30 minutes, etc.), that is, the stop monitoring module 32 determines to stop the detection when it detects that the cumulative heating time has exceeded.

[0116] In one embodiment, the stop condition includes the temperature slope converging to the stop slope and the accumulated heating time. That is, when the temperature slope converges to the stop slope or the accumulated heating time exceeds, the stop monitoring module 32 will determine to stop detection.

[0117] If the stop condition is not satisfied, step S13 is repeated to continue heating, measuring temperature, monitoring the temperature slope, and monitoring whether the stop condition is satisfied.

[0118] If the stop condition is met, step S14 is executed: the processor 100 controls the infrared heating module 11 to stop heating through the heating control module 30 , and controls the infrared temperature measurement module 12 to stop temperature measurement through the measurement control module 31 .

[0119] It is worth mentioning that step S14 is not a necessary step. In one embodiment, the present invention can continue heating and measuring temperature after the stop condition is met, and directly execute step S15 to score the heat pipe 22 based on the data before the stop condition is met.

[0120] Step S15: The processor 100 performs a scoring process based on the temperature slope of the measured temperature data via the scoring module 33 to determine a score for the heat pipe 22. The score can be a numerical value, where the magnitude of the numerical value indicates the quality of the property (e.g., conduction state, convection state, or heating state), with a larger numerical value indicating a better quality, and a smaller numerical value indicating a better quality.

[0121] In one embodiment, the scoring module 33 can further compare the score of the inspected heat pipe 22 with a pre-set scoring threshold. If the score exceeds the scoring threshold, the heat pipe 22 is deemed acceptable. If the score does not exceed the scoring threshold, the heat pipe 22 is deemed defective. The aforementioned scoring can be set so that a larger value indicates better quality, or a smaller value indicates better quality, without limitation.

[0122] In one embodiment, the scoring module 33 may compare one or more temperature slopes (slope data) of the measured temperature data with one or more preset good product slopes, and assign scores based on the degree of compliance.

[0123] In one embodiment, when the cumulative heating time exceeds the limit, it indicates that the heat pipe 22 may have poor conductivity and cannot find a clear conductive feature within the specified time. In this case, the scoring module 33 can directly give the heat pipe 22 a poor score (such as a low-quality score) or directly determine that it is a low-quality product.

[0124] Therefore, the present invention can detect the conductivity of the heat pipe in a non-contact detection manner.

[0125] Please also refer to Figure 4 and Figure 5 , Figure 5 This is a partial flow chart of a non-contact detection method according to another embodiment of the present invention. Figure 4 An embodiment of Figure 5The step S10 of the embodiment further includes specific initialization steps S20-S23, wherein the execution order of steps S21-S23 can be changed arbitrarily according to user needs, or can be executed simultaneously.

[0126] Step S20 : The processor 100 sets the object information and the target temperature via the initialization module 38 .

[0127] In one embodiment, the user can directly input object information of the heat pipe 22 (such as mass, size, material, specific heat capacity, single-side area or full area, etc.) and a target temperature (such as 60, 70 or 80 degrees Celsius, etc.) through the human-machine interface 102 .

[0128] In one embodiment, the initialization module 38 can read a plurality of pre-stored object information and a plurality of target temperatures from the storage device 103 and display them on the human-machine interface 102 for the user to select via the human-machine interface 102 .

[0129] Step S21 : the processor 100 calculates heating parameters of the infrared heating module 11 through the initialization module 38 .

[0130] In one embodiment, the heating parameter includes a heating input voltage of the infrared heating module 11 . The heating power output by the infrared heating module 11 can be adjusted by adjusting the heating input voltage.

[0131] Specifically, the initialization module 38 can obtain the object heating parameters of the heat pipe 22 based on the mass and specific heat capacity of the heat pipe 22, and then calculate the heating input voltage as the heating parameter based on the object heating parameters and the infrared heating parameters of the infrared heating module 11 (such as infrared heater power, infrared emissivity, and radiation attenuation rate).

[0132] In one embodiment, the object heating parameter P of the heat pipe 22 is VC Based on the infrared heater power P IR , infrared emissivity E IR It can be calculated based on all or part of the factors such as the radiation attenuation rate σ, but is not limited to this.

[0133] In one embodiment, the object heating parameter P of the heat pipe 22 is VC The value may also be calculated based on all or part of factors such as the mass m of the heat pipe 22 , the specific heat capacity Cρ of the heat pipe 22 , and the measured temperature T1 of the heat pipe 22 , but is not limited thereto.

[0134] Therefore, through the above relationship, the present invention can obtain the infrared emissivity E IR .

[0135] In one embodiment, the initialization module 38 may calculate the infrared heater power based on the following (Formula 1) and (Formula 2).

[0136] P VC =P IR ×E IR ×σ-------------(Formula 1)

[0137]

[0138] Among them, P VC P is the object heating parameter of the heat-conducting object 22; IR is the infrared heater power; E IR is the infrared emissivity; σ is the radiation attenuation rate; m is the mass of the thermal conductive object 22; Cρ is the specific heat capacity of the thermal conductive object 22; and T1 is the measured temperature of the thermal conductive object 22.

[0139] See also Figure 11 , is a graph showing the relationship between heating power and voltage according to an embodiment of the present invention. After calculating the infrared heater power, the initialization module 38 can be configured according to the specifications of the infrared heating module 11 (e.g. Figure 11 ), the corresponding heating input voltage is calculated as the heating parameter. For example, when the infrared heater power is 10W, the heating input voltage is 7.5V.

[0140] Please refer to Figure 5 , step S22: the processor 100 calculates the upper limit of the detection time through the initialization module 38. The upper limit of the detection time can be used as a part of the stop condition.

[0141] Specifically, the initialization module 38 obtains the set target temperature and calculates the upper limit of the detection time based on the temperature difference between the target temperature and the ambient temperature, the object information and object heating parameters of the heat pipe 22 , and the ambient convection parameters.

[0142] In one embodiment, the detection time upper limit T max The heat pipe 22 mass m, the heat pipe 22 specific heat capacity Cρ, the target temperature SV, the ambient temperature T env , the object heating parameter P of the heat pipe 22 VC , the single surface area A of the heat pipe 22 vc , environmental convection coefficient H (generally between ) and other factors to calculate, but not limited to this.

[0143] In one embodiment, the initialization module 38 may calculate the upper limit of the detection time based on the following (Formula 3).

[0144]

[0145] Among them, T max is the upper limit of the detection time; m is the mass of the heat-conducting object 22; Cρ is the specific heat capacity of the heat-conducting object 22; SV is the target temperature; T env is the ambient temperature; P VC A is the object heating parameter of the heat conducting object 22; vc is the single surface area of the heat conducting object 22; H is the ambient convection coefficient, which is generally between

[0146] Step S23: The processor 100 calculates a stop slope through the initialization module 38. The stop slope is used as a part of the stop condition.

[0147] See also Figure 12 , is a temperature slope-time relationship curve diagram of an embodiment of the present invention.

[0148] Specifically, the initialization module 38 can simulate and calculate the time-temperature simulation change of the heat pipe 22 based on the temperature difference between the target temperature and the ambient temperature, the object information and object heating parameters of the heat pipe to be tested, and the ambient convection parameters (such as Figure 12 The stop slope is set based on the time-temperature simulation change and the upper limit of the detection time. For example, a slope of 4 (corresponding to a time of 50 seconds) or a slope of 2.8 (corresponding to a time of 100 seconds) can be selected.

[0149] In one embodiment, the stop slope is greater than 1, that is, the detection is terminated before the temperature of the heat pipe 22 reaches a steady state.

[0150] In this way, the present invention can complete the initialization setting.

[0151] Please also refer to Figure 4 and Figure 6 , Figure 6 This is a partial flow chart of a non-contact detection method according to another embodiment of the present invention. Figure 4 An embodiment of Figure 6 The step S15 of the embodiment further includes specific initialization steps S30-S33, wherein the execution order of steps S31-S33 can be changed arbitrarily according to user needs, or can be executed simultaneously.

[0152] Step S30 : The processor 100 calculates slope data of the acquired measured temperature data through the scoring module 33 . The slope data includes a plurality of slopes, each corresponding to a temperature change degree of the heat pipe 22 at different time intervals during the heating process.

[0153] Step S31 : The processor 100 calculates a heating score of the infrared heating module 11 in this detection based on multiple slopes of the slope data through the heating score module 34 .

[0154] In one embodiment, the heating score module 34 may select all or part of the multiple slopes of the slope data (eg, a specified time interval), and calculate an average of the selected multiple slopes to obtain the aforementioned heating score.

[0155] In one embodiment, if Figure 8 When measuring the temperature of multiple measurement positions of the heat pipe 22 simultaneously, the heating score module 34 may select the temperature measurement data of the measurement position A2 directly behind (or closest to) the heating position A1 to calculate the aforementioned heating score, so that the heating score is closer to the heating performance of the infrared heating module 11.

[0156] Step S32 : the processor 100 calculates the convection score of the detection environment through the convection scoring module 36 .

[0157] Step S33 : the processor 100 calculates the conductivity score of the heat pipe 22 through the conductivity score module 35 .

[0158] In one embodiment, if Figure 8 When measuring multiple measurement locations A2 and A3 and obtaining multiple temperature measurement data at the multiple measurement locations A2 and A3 (e.g., two sets of temperature curves at the measurement locations A2 and A3 during the period from the start of heating to the satisfaction of a stop condition, or two sets of temperature curves at the measurement locations A2 and A3 during the period from the start of heating (e.g., 3 seconds after the start of heating) to the satisfaction of a stop condition), the processor 100 first calculates temperature difference data between the multiple measured temperature data (e.g., performing a subtraction between two sets of measured temperature data to obtain the temperature difference data between the measurement locations A2 and A3) through the convection scoring module 36 and the conduction scoring module 35, and then calculates the aforementioned convection score and conduction score based on the slope data and the temperature difference data.

[0159] In one embodiment, the convection scoring module 36 and the conduction scoring module 35 first divide the slope data by the temperature difference data to obtain characteristic data (e.g., convection characteristic data or conduction characteristic data). A regression (e.g., least squares method) is then performed on the characteristic data to obtain an exponential decay equation (e.g., the characteristic data is fitted to a set of curves to obtain an exponential decay equation for the curves). The convection score and the conduction score are then determined based on the exponential decay equation.

[0160] Furthermore, if Figure 8 When there are multiple measurement positions A2 and A3, the above calculation selects the slope data of the temperature measurement data of the measurement position A2 directly behind (or closest to) the heating position A1 and divides it by the temperature difference data to obtain the characteristic data. However, this is not limited to this, and the temperature measurement data of the farther measurement position A2 may also be used.

[0161] It is worth mentioning that the aforementioned exponential decay formula includes a base part and an exponential part. The present invention determines the aforementioned conduction score based on the base part, and determines the convection score based on the exponential part.

[0162] In this way, the present invention can determine different types of ratings.

[0163] Figure 6 In the embodiment, steps S40-S45 are further included for determining the detection result based on the score, wherein the execution order of steps S40-S42 can be changed arbitrarily according to user needs, or can be executed simultaneously.

[0164] Step S40: The processor 100 determines whether the heating score is worse than a preset heating score threshold through the heating score module 34.

[0165] If the heating score is worse than the heating score threshold, step S44 is executed: the processor 100 issues a warning through the human-machine interface 102 to remind the user that the heating status is not good.

[0166] If the heating score is better than the heating score threshold, it indicates that the current heating state is good (eg, the heating power is stable), and step S41 is executed: the processor 100 determines whether the convection score is worse than the preset convection score threshold through the convection scoring module 36 .

[0167] If the convection score is worse than the convection score threshold, step S44 is executed: the processor 100 issues a warning through the human-machine interface 102 to remind the user that the environmental status (especially the convection status) is not good.

[0168] After executing step S44 , the processor 100 may then execute step S42 to continue determining whether the conduction score is qualified, but the present invention is not limited thereto.

[0169] In another embodiment, when the heating state or the environmental condition is poor, the detected conductivity score may not accurately reflect the conductivity of the heat pipe 22. In this case, the processor 100 may directly end the test after executing step S4 without evaluating the conductivity of the heat pipe 22.

[0170] If the convection score is better than the convection score threshold, indicating that the current environmental condition is good, step S42 is executed: the processor 100 uses the scoring module 33 (conduction scoring module 35) to determine whether the score (conduction score) of the heat pipe 22 is better than the scoring threshold (conduction score threshold), thereby determining whether the heat pipe 22 is a good product or a bad product (defective product).

[0171] If the conductivity score is lower than the conductivity score threshold, indicating poor conductivity, step S43 is executed: the processor 100 determines that the heat pipe 22 is defective through the conductivity scoring module 35 and may further display a defective notification through the human-machine interface 102 .

[0172] If the conductivity score is better than the conductivity score threshold, indicating good conductivity, step S45 is executed: the processor 100 determines that the heat pipe 22 is good through the conductivity scoring module 35 and may further display a good notification through the human-machine interface 102 .

[0173] The present invention can effectively detect the conductivity of the heat pipe 22 and automatically generate the detection result.

[0174] In addition, the present invention can detect the heating state and the environmental state at the same time to avoid misjudgment of the detection result due to poor heating state or environmental state.

[0175] Please also refer to Figure 4-7 , Figure 7 This is a partial flow chart of a non-contact detection method according to another embodiment of the present invention. Figure 4 An embodiment of Figure 7 The embodiment further provides a scoring threshold calculation function, and the scoring threshold of the corresponding good product can be obtained by testing good products of the same type. The method of this embodiment also includes the following steps.

[0176] Step S50: The user may perform multiple tests on a non-contact testing device 1 (by performing steps S10-S15 at least twice) on a qualified heat pipe of the same type as the heat pipe to be tested 22 to obtain multiple qualified scores (by performing steps S30-S33), such as multiple heating qualified scores, multiple convection qualified scores, and multiple conduction qualified scores obtained through multiple tests.

[0177] Step S51: the processor 100 obtains the plurality of good product scores through the threshold calculation module 37 and sets a score threshold based on the plurality of good product scores.

[0178] In one embodiment, the threshold calculation module 37 calculates a heating score threshold based on a plurality of heating yield scores, calculates a convection score threshold based on a plurality of convection yield scores, and calculates a conduction score threshold based on a plurality of conduction yield scores.

[0179] In one embodiment, the threshold calculation module 37 calculates an average value (such as a weighted average or a general average) of a plurality of good product scores and appropriately adjusts the average value.

[0180] For example, if a higher score indicates a better score, the score threshold may be a decrease of 20%, a decrease of 10%, or a range of ±10% from the average value.

[0181] In another example, if a lower score indicates a better score, the score threshold may be a 20% increase, a 10% increase, or a ±15% increase in the average value.

[0182] In this way, the present invention can effectively set various scoring thresholds, which is helpful for judging the usability of the detection results.

[0183] The above description is only a preferred embodiment of the present invention, and does not limit the claims of the present invention. Therefore, all equivalent changes made by applying the contents of the present invention are similarly included in the scope of the present invention and are hereby stated.

Claims

1. A non-contact detection method for a heat pipe, applied to a non-contact detection device comprising an infrared heating module and an infrared temperature measurement module, the method comprising the following steps: a) obtaining a heating parameter and object information of a heat pipe to be tested; b) calculating a stop slope based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe to be tested; c) controlling the infrared heating module to heat the heat pipe to be tested based on the heating parameter, and controlling the infrared temperature measurement module to measure a temperature data of the heat pipe to be tested; d) monitoring a temperature slope of the measured temperature data during the heating process; e) performing a scoring process based on the temperature slope to determine a score for detecting the heat pipe under test when a stop condition is detected, wherein the stop condition includes the temperature slope converging to the stop slope; and f) when the score of the heat pipe to be tested is better than a score threshold, determining the heat pipe to be tested is a good product; and when the score is not better than the score threshold, determining the heat pipe to be tested is a bad product.

2. The method of claim 1, wherein step a) comprises the following steps: g1) obtaining heating parameters of the object based on the mass and specific heat capacity of the heat pipe to be measured; and g2) obtaining a heating input voltage of the infrared heating module as the heating parameter based on the object heating parameter and the infrared heating parameter.

3. The method of claim 1 , wherein the stopping condition comprises a cumulative heating time reaching a detection time upper limit; in, Before step c) The following steps are involved: h1) setting a target temperature based on user operation; and h2) obtaining the upper limit of the detection time based on a temperature difference between the target temperature and the ambient temperature, the object information, the object heating parameter, and an ambient convection parameter.

4. The method of claim 1, wherein step b) comprises the following steps: i1) simulating and calculating a time-temperature simulation change of the heat pipe to be tested based on a temperature difference between a target temperature and an ambient temperature, the object information, the object heating parameter, the infrared heating parameter, and an ambient convection parameter; and i2) setting the stop slope based on the time-temperature simulation change and the detection time upper limit, wherein the stop slope is greater than 1.

5. The method according to claim 1, further comprising the following steps before step e): j1) controlling the infrared heating module to heat a qualified heat pipe of the same type as the heat pipe to be tested based on the heating parameter, and controlling the infrared temperature measurement module to measure temperature data of the qualified heat pipe; j2) calculating a quality score of the qualified heat pipe based on the measured temperature data of the qualified heat pipe; j3) Repeating steps j1) and j2) at least twice to obtain multiple good product scores; and j4) Setting the scoring threshold based on the multiple good product scores.

6. The method of claim 1 , wherein the scoring process comprises: k1) calculating a slope data of the measured temperature data; and k2) calculating a heating score based on a plurality of slopes of the slope data, wherein the plurality of slopes respectively correspond to different time intervals of the heating process; The step e) includes a step l1) issuing an alarm to indicate that the heating status is poor when the heating score is lower than a heating score threshold.

7. The method of claim 1 , wherein the step c) comprises controlling the infrared temperature measurement module to measure a plurality of measurement positions of the heat pipe to be measured to obtain the plurality of measured temperature data at the plurality of measurement positions; in, The scoring process includes: m1) calculating a slope data of the measured temperature data; m2) calculating a temperature difference data between the plurality of measured temperature data; and m3) calculating a convection score and a conduction score based on the slope data and the temperature difference data; Wherein, the step e) comprises the following steps: n1) when the convection score is worse than a convection score threshold, issuing an alarm to indicate that the environmental status is not good; n2) when the conductivity score is better than a conductivity score threshold, determining that the heat pipe under test is a good product; and n3) When the conductivity score is worse than the conductivity score threshold, the heat pipe to be tested is determined to be defective.

8. The method of claim 7, wherein the step m3) comprises dividing the slope data by the temperature difference data to obtain characteristic data, performing regression on the characteristic data to obtain an exponential decay equation, and determining the convection score and the conduction score based on the exponential decay equation.

9. The method of claim 1 , wherein step c) comprises controlling the infrared heating module to heat a heating position on one side of the heat pipe to be tested, and controlling the infrared temperature measurement module to measure a plurality of measurement positions on another side of the heat pipe to obtain the plurality of measured temperature data at the plurality of measurement positions; in, The heating position is located directly behind one of the measuring positions. The heating position and the multiple measuring positions are coated with dark radiation paint. The area of the dark radiation paint at the heating position is larger than the laser illumination area of the infrared heating module. The area of the dark radiation paint at each measuring position is larger than the measurement area of the infrared heating module.

10. The method according to claim 9, wherein the heat pipe to be tested is an ultra-thin vapor chamber, and step c) is to heat the heating position of the heat pipe to be tested so that liquid below the wall surface of the heating position absorbs heat and turns into vapor, flows to other positions with lower pressure, absorbs heat by contacting the wall surface of the other positions, and then condenses back into liquid, and then flows back to the heating position, forming a thermal cycle.

11. A non-contact detection device for a heat pipe, comprising: an infrared heating module configured to heat a heat pipe to be tested based on a heating parameter; an infrared temperature measurement module configured to measure a temperature data of the heat pipe to be measured; and A control module is electrically connected to the infrared heating module and the infrared temperature measurement module, and is configured to obtain a heating parameter and object information of the heat pipe under test. The control module is configured to calculate a stop slope based on the infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe under test. The control module is configured to monitor a temperature slope of the measured temperature data during the heating process and, when a stop condition is met, determine a score for the heat pipe under test based on the temperature slope. The control module is configured to determine the heat pipe under test as a good product if the score of the heat pipe under test exceeds a score threshold, and to determine the heat pipe under test as a bad product if the score does not exceed the score threshold. The stop condition includes the temperature slope converging to the stop slope.

12. The non-contact detection device according to claim 11, wherein the control module comprises: An initialization module is configured to obtain the object heating parameter based on the mass and specific heat capacity of the heat pipe to be tested, and to obtain a heating input voltage of the infrared heating module as the heating parameter based on the object heating parameter and the infrared heating parameter. The initialization module is configured to simulate and calculate a time-temperature simulation change of the heat pipe to be tested based on a temperature difference between a target temperature and an ambient temperature, the object information, the object heating parameter, and an ambient convection parameter, and to set a stop slope based on the time-temperature simulation change and the detection time upper limit, wherein the stop slope is greater than 1.

13. The non-contact detection device according to claim 11, wherein the stop condition further comprises a cumulative heating time reaching an upper detection time limit; in, The control module includes: An initialization module is configured to set a target temperature based on a user operation, and obtain an upper limit of a detection time based on a temperature difference between the target temperature and the ambient temperature, the object information, the object heating parameter, and an ambient convection parameter.

14. The non-contact detection device according to claim 11, wherein the control module comprises: a heating control module configured to control the infrared heating module to perform heating; a measurement control module configured to control the infrared temperature measurement module to perform temperature measurement; a stop monitoring module configured to monitor whether the stop condition is satisfied; a scoring module configured to calculate the score and to compare the score with the score threshold; and A threshold calculation module is configured to perform multiple heating tests on a qualified heat pipe of the same type as the heat pipe to be tested through the heating control module, the measurement control module, the stop monitoring module, and the scoring module to obtain a plurality of qualified scores, and to set a scoring threshold based on the plurality of qualified scores.

15. The non-contact detection device according to claim 11, wherein the control module comprises: A heating score module is configured to calculate a heating score based on multiple slopes of a slope data of the measured temperature data, and to issue an alarm to indicate a poor heating status when the heating score is worse than a heating score threshold, wherein the multiple slopes correspond to different time intervals of the heating process.

16. The non-contact detection device according to claim 11, wherein the infrared temperature measurement module comprises a plurality of measurement elements, the plurality of measurement elements being used to measure a plurality of measurement positions of the heat pipe to be measured to obtain the plurality of measured temperature data at the plurality of measurement positions; in, The control module includes: a conductivity scoring module configured to calculate a conductivity score based on a slope of the measured temperature data and a temperature difference between the plurality of measured temperature data, and to determine that the heat pipe under test is a good product when the conductivity score is better than a conductivity score threshold, and to determine that the heat pipe under test is a bad product when the conductivity score is worse than the conductivity score threshold; and The convection scoring module is configured to calculate a convection score based on the slope data and the temperature difference data, and to issue an alarm to indicate that the environmental status is not good when the convection score is worse than a convection score threshold.

17. The non-contact detection device according to claim 11, further comprising a positioning jig, the positioning jig comprising: a first mounting structure for mounting the infrared heating module so that the infrared heating module heats a heating position on one side of the heat pipe to be tested; a second mounting structure for mounting the infrared temperature measurement module, so that the plurality of measuring elements of the infrared temperature measurement module can measure a plurality of measurement positions on the other side of the heat pipe to be measured; and a third mounting structure, disposed between the first mounting structure and the second mounting structure, for fixing the heat pipe to be tested; The infrared heating module installed on the first installation structure and the infrared temperature measuring module installed on the second installation structure are respectively facing different surfaces of the heat pipe to be measured placed on the third installation structure.

18. The non-contact detection device according to claim 17, wherein the heating position is located directly behind one of the measuring positions, and at least one of the measuring positions is located away from the rear of the heating position; in, The heat pipe to be tested is coated with dark radiation paint at the heating position and the multiple measurement positions. The area of the dark radiation paint at the heating position is larger than the laser illumination area of the infrared heating module, and the area of the dark radiation paint at each measurement position is larger than the measurement area of the infrared heating module.

19. The non-contact detection device of claim 17, wherein a first distance between the infrared heating module mounted on the first mounting structure and the heat pipe to be tested placed on the third mounting structure is adjusted based on a focal length of a lens of the infrared heating module; in, A second distance between the infrared temperature measurement module installed on the second installation structure and the heat pipe to be measured placed on the third installation structure is adjusted based on a preset measurement distance of the infrared temperature measurement module.

20. The non-contact detection device according to claim 11, wherein the heat pipe to be tested is an ultra-thin vapor chamber, and the infrared heating module is used to heat the heating position of the heat pipe to be tested, so that the liquid under the wall surface of the heating position absorbs heat and turns into vapor, and flows to other positions with lower pressure. After absorbing heat by contacting the wall surface of the other position, it condenses back into liquid and then flows back to the heating position, forming a thermal cycle.

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