Substrate cleaning device

Abstract

The present invention relates to a substrate cleaning device, which is characterized by comprising: a vacuum chuck portion for placing a wafer; and an ultrasonic cleaning module for spraying cleaning liquid onto the wafer and applying ultrasonic waves to the cleaning liquid to cause the cleaning liquid to vibrate ultrasonically.

Description

Technical Field

[0001] The present invention relates to a substrate cleaning device, and more particularly, to a substrate cleaning device capable of improving substrate processing performance and reducing substrate processing time. Background Art

[0002] Generally, semiconductor processes include an etching process for etching a wafer, a singulation process for cutting a wafer into a plurality of dies, and a cleaning process for cleaning the wafer. A substrate processing apparatus is used in the wafer etching process or the wafer cleaning process.

[0003] The substrate processing apparatus is rotatably arranged and includes a rotating table on which wafers are placed, a sealing ring in an annular shape coupled to the edge of the rotating table, etc. While the rotating table rotates, a processing liquid is supplied to the wafers placed on the rotating table.

[0004] However, when cleaning a wafer cut into multiple dies, conventional substrate processing equipment finds it difficult to remove foreign matter remaining in the gaps between the dies. Furthermore, the cleaning time may be increased because the cleaning time must be substantially extended to remove the foreign matter in the gaps between the dies.

[0005] Furthermore, the process of attaching the seal ring to the top of the turntable is cumbersome, and the seal ring's alignment is not constant, which can lead to errors in the seal ring (such as misalignment). Furthermore, when the seal ring is misaligned, the process fluid can seep outside the seal ring, potentially damaging structures surrounding the turntable.

[0006] Furthermore, a wafer fixing module is provided to prevent the position of the wafer from being shifted, and a sealing ring fixing module is provided to fix the sealing ring. Therefore, the structure of the substrate processing apparatus becomes complicated and the manufacturing cost may increase.

[0007] The background technology of the present invention is disclosed in Korean Patent Publication No. 10-2016-0122067 (published on October 21, 2016, invention title: Wafer processing device and sealing ring for wafer processing device). Summary of the Invention

[0008] An object of the present invention is to provide a substrate cleaning device that can improve substrate processing performance and shorten substrate processing time.

[0009] The substrate cleaning device of the present invention is characterized by comprising: a vacuum chuck portion for placing a wafer; and an ultrasonic cleaning module for spraying a cleaning liquid onto the wafer and applying ultrasonic waves to the cleaning liquid to cause the cleaning liquid to generate ultrasonic vibrations.

[0010] The ultrasonic cleaning module may include: a lifting arm driving part; a lifting arm part, connected to the lifting arm driving part so as to be lifted and lowered by the lifting arm driving part; a swing part, connected to the lifting arm part so as to rotate the lifting arm part; and an ultrasonic cleaning part, connected to the lifting arm part, for spraying cleaning liquid onto the wafer and applying ultrasonic waves to the cleaning liquid.

[0011] The ultrasonic cleaning part may include: a cleaning head connected to the lifting arm part and immersed in the cleaning liquid; an ultrasonic generating part, arranged inside the cleaning head to apply ultrasonic waves to the cleaning liquid; a voltage applying part, arranged inside the cleaning head to apply voltage to the ultrasonic generating part; an internal pressure forming part, forming a pressure higher than atmospheric pressure inside the cleaning head; and a cleaning liquid spraying part, formed on the cleaning head to spray cleaning liquid onto the wafer.

[0012] The cleaning liquid spraying portion may include a cleaning liquid inlet portion into which the cleaning liquid flows; and a plurality of spray nozzles for spraying the cleaning liquid discharged from the cleaning liquid inlet portion toward the wafer.

[0013] The plurality of spray nozzles may spray the cleaning liquid at an angle along a direction in which the cleaning liquid flows in the wafer.

[0014] The lower surface portion of the cleaning head may be formed so that an inflow side of the cleaning liquid is higher than an outflow side of the cleaning liquid.

[0015] The cleaning head can adjust the height of a lower surface portion of one side of the cleaning head according to a change in the height of the wafer.

[0016] The substrate cleaning device may include: an annular cover portion, arranged on one side of the vacuum chuck portion; an expander module, configured to enable the annular cover portion to apply pressure to the retaining ring portion of the wafer toward the side of the vacuum chuck portion to expand the interval between grains in the wafer; and a chuck module, arranged on the vacuum chuck portion to confine the annular cover portion, to which pressure is applied by the expander module, to the vacuum chuck portion.

[0017] The expander module may include: an expander moving portion; an expander head configured to be movable by the expander moving portion; and a plurality of expander arms connected to the expander head to grip the annular cover portion to move the annular cover portion and apply pressure to the annular cover portion so that the chuck module restrains the annular cover portion.

[0018] When the chuck module restrains the annular cover portion on the vacuum chuck portion, the expander arm portion may release the pressure applied to the annular cover portion.

[0019] The expander head may include: an expander sleeve portion, connected to the expander moving portion; a plurality of expander slider portions, coupled to the expander sleeve portion in a radially movable manner and respectively connected to the expander arm portions; an expander rod portion, arranged inside the expander sleeve portion to move the plurality of expander slider portions; and an expander driving portion, connected to the expander sleeve portion to move the expander rod portion.

[0020] The expander sleeve portion may include: a sleeve body portion, formed with a movable space portion for moving the expander rod portion; a first baffle portion for closing one side of the sleeve body portion; and a second baffle portion for closing the other side of the sleeve body portion and formed with a movable hole portion for allowing the expander rod portion to be inserted in a movable manner.

[0021] The expander rod may include: a movable disk portion movably disposed on the expander sleeve portion; a plunger portion connected to the movable disk portion to be inserted into the movable hole portion of the expander sleeve portion; and a pusher portion connected to the plunger portion and the expander slider portion to move the expander slider portion as the plunger portion moves.

[0022] The expander driving portion may include: a first supply port for supplying a driving medium to one side of the moving space portion to move the moving plate portion toward the expander slider portion; and a second supply port for supplying the driving medium to the other side of the moving space portion to move the moving plate portion toward the opposite side of the expander slider portion.

[0023] The expander arm may include an arm member connected to the expander slider; and a hook member disposed on the arm member to restrict the annular cover.

[0024] The chuck module may include: a chuck base, which is arranged on the vacuum chuck part; a chuck rotating part, which is connected to the chuck base to rotate the chuck base; a plurality of chuck connecting rod parts, which are respectively radially connected to the chuck base and move when the chuck base rotates; and a plurality of cover limiting parts, which are connected to the chuck connecting rod part to limit the annular cover part to the vacuum chuck part when the chuck connecting rod part moves.

[0025] The chuck base may include: a base main body portion formed in a ring shape in a concentric manner with the rotation axis of the vacuum chuck portion; a plurality of guide portions formed on the base main body portion so that the chuck link portion is movably coupled to the guide portions; and a base gear portion formed on the base main body portion and connected to the chuck rotating portion.

[0026] The chuck connecting rod portion may include: a guide slider movably coupled to the chuck base; a connecting rod component connected to the guide slider, which moves linearly along the radius of the chuck base when the guide slider moves; and a connecting rod gear portion formed on the connecting rod component to engage with the cover limiting portion to move.

[0027] The cover limiting portion may include: a cover limiting shaft portion, which is rotatably arranged on the vacuum chuck portion; a limiting gear portion, formed on the cover limiting shaft portion to engage with the connecting rod gear portion; a cover limiting rod, connected to the cover limiting shaft portion to apply pressure to the annular cover portion and release the pressure on the annular cover portion; and a limiting roller portion, which is rotatably arranged on the cover limiting rod to be in rolling contact with the annular cover portion.

[0028] According to the present invention, the cleaning process is performed while the spacing between the grains in the wafer is expanded. Therefore, foreign matter adhering to the surface of the grains and foreign matter located in the gaps between the grains can be easily removed by the cleaning liquid. As a result, the wafer cleaning performance can be significantly improved and the wafer defect rate can be significantly reduced.

[0029] Furthermore, according to the present invention, as the chuck base rotates via the chuck rotating portion, the annular cover portion is restrained by the vacuum chuck portion, so that the wafer can be restrained on the vacuum chuck portion using only one chuck rotating portion. Therefore, the structure of the substrate cleaning apparatus can be simplified.

[0030] Furthermore, according to the present invention, the height adjustment portion adjusts the height of the cover restriction portion, thereby adjusting the height between the upper surface of the annular cover portion and the upper surface of the vacuum chuck portion. Therefore, by adjusting the degree of stretching of the wafer bonding sheet, the spacing between multiple dies can be adjusted.

[0031] Furthermore, according to the present invention, the ultrasonic cleaning module sprays cleaning liquid onto the wafer and applies ultrasonic waves to the cleaning liquid, causing it to vibrate ultrasonically. Thus, the wafer is cleaned chemically by the cleaning liquid, while the physical cleaning is performed through the cavitation phenomenon of the ultrasonic waves, significantly improving the wafer cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 FIG. 1 is a top view briefly illustrating a wafer being processed in a substrate cleaning apparatus according to an embodiment of the present invention.

[0033] Figure 2 The figure briefly shows a side view of a wafer being processed in a substrate cleaning apparatus according to an embodiment of the present invention.

[0034] Figure 3 FIG. 1 is a side view schematically showing a substrate cleaning device according to an embodiment of the present invention.

[0035] Figure 4 A side view schematically illustrates a state in which the expander module in a substrate cleaning apparatus according to an embodiment of the present invention applies pressure to the annular cover and the retaining ring of the wafer, thereby increasing the spacing between the plurality of wafers.

[0036] Figure 5 The present invention is a perspective view schematically showing a state in which an expander module holds and moves an annular cover in a substrate cleaning apparatus according to an embodiment of the present invention.

[0037] Figure 6 A side view schematically illustrates an expander module, an annular cover, and a vacuum chuck in a substrate cleaning apparatus according to an embodiment of the present invention.

[0038] Figure 7 The figure is a cross-sectional view briefly showing a state where a chuck module restricts an annular cover portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0039] Figure 8 The figure is a perspective view schematically showing an expander module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0040] Figure 9 FIG. 1 is a cross-sectional view schematically illustrating an expander head of an expander module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0041] Figure 10 The figure is a cross-sectional view schematically showing a state in which the expander slider portion of the expander module of the substrate cleaning device according to one embodiment of the present invention has moved toward the inner side of the expander head portion.

[0042] Figure 11 FIG. 1 is a top view briefly illustrating a chuck module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0043] Figure 12 The present invention is a top view briefly showing a state in which a chuck base of a chuck module is rotated to drive a chuck link portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0044] Figure 13 The present invention is a perspective view briefly showing a state in which a cover restricting portion of a chuck module is driven to restrict an annular cover portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0045] Figure 14 The figure is a top view schematically showing a state in which an ultrasonic cleaning module and a cleaning liquid spraying module are arranged outside a vacuum chuck portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0046] Figure 15 FIG. 1 is a top view briefly illustrating an ultrasonic cleaning module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0047] Figure 16FIG. 1 is a side view schematically illustrating an ultrasonic cleaning module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0048] Figure 17 The figure is a side view schematically showing a state in which a cleaning head of an ultrasonic cleaning module is tilted relative to a wafer in a substrate cleaning apparatus according to an embodiment of the present invention.

[0049] Figure 18 The figure is a cross-sectional view briefly showing a coupling bolt portion and an angle adjustment bolt portion of a cleaning head in a substrate cleaning device according to an embodiment of the present invention.

[0050] Figure 19 The figure is a cross-sectional view schematically showing a state where an angle adjustment bolt portion is provided in a substrate cleaning apparatus according to an embodiment of the present invention.

[0051] Figure 20 The figure is a side view schematically showing an ion generator and a transfer unit of a substrate cleaning device according to an embodiment of the present invention.

[0052] Figure 21 FIG. 1 is a flow chart illustrating a method for controlling a substrate cleaning apparatus according to an embodiment of the present invention.

[0053] Description of Reference Numerals

[0054] 10: Wafer; 11: Die; 12: Adhesive sheet; 13: Clamping ring; 100: Substrate cleaning device; 101: Housing; 102: Chamber; 105: Cup-shaped cover; 110: Drive unit; 111: Rotating shaft; 113: Motor; 120: Vacuum chuck; 122: Vacuum flow path; 124: Vacuum chamber; 130: Ring cover; 131: Cover body; 132: Limiting step; 133: Cover pressure; 135: Cover hole; 140: Expander module; 141: Expander moving unit; 150: Expander head; 151: Expander sleeve; 152: Sleeve body; 152a : Slider groove; 152b: Moving space; 153: First baffle; 153a: First sealing member; 153b: Snap ring; 154: Second baffle; 154a: Second sealing member; 154b: Moving hole; 155: Expander slider; 156: Expander rod; 156a: Moving disk; 156b: Plunger; 156c: Pushing member; 156d: Disk sealing member; 158: Expander drive; 158a: First supply port; 158b: Second supply port; 160: Expander arm; 161: Arm member; 163: Hook; 164: Hook body; 165: Hook pin 170: Chuck module; 171: Chuck base; 172: Base body; 173: Guide; 174: Base gear; 175: Chuck rotating portion; 180: Chuck connecting rod; 181: Guide slider; 182: Connecting rod component; 183: Connecting rod gear; 184: Guide roller; 190: Cover limiting portion; 191: Cover limiting shaft; 192: Limiting gear; 193: Cover limiting rod; 194: Limiting roller; 210: Height adjustment module; 211: Adjustment component; 213: Height adjustment portion; 220: Ultrasonic cleaning module; 221: Lifting arm drive unit; 222: Lifting arm unit; 2 23: Swinging part; 224: Ultrasonic cleaning part; 225: Cleaning head; 225a: Connecting bolt part; 225b: Angle adjustment bolt part; 226: Ultrasonic generating part; 227: Voltage applying part; 228: Internal pressure forming part; 229: Cleaning liquid injection part; 229a: Cleaning liquid inflow part; 229b: Injection nozzle; 230: Cleaning liquid injection module; 231: Rotating arm driving part; 232: Rotating arm part; 233: Rotating part; 234: Cleaning liquid spraying part; 240: Ion generator; 250: Transfer unit; 251: Transfer moving part; 253: Transfer lifting part; 255: Transfer carrying part. DETAILED DESCRIPTION

[0055] Below, an embodiment of the substrate cleaning apparatus of the present invention is described with reference to the accompanying drawings. When describing the substrate cleaning apparatus, the thickness of lines or the dimensions of structural elements shown in the accompanying drawings may be exaggerated for clarity and convenience. Furthermore, the terms described below are defined based on their functions within the present invention and may vary depending on the intentions or practices of users and application personnel. Therefore, the definitions of such terms should be based on the entire content of this specification.

[0056] Figure 1 To briefly illustrate a top view of a wafer being processed in a substrate cleaning apparatus according to an embodiment of the present invention, Figure 2 To briefly illustrate a side view of a wafer being processed in a substrate cleaning apparatus according to an embodiment of the present invention, Figure 3 To briefly illustrate a side view of a substrate cleaning device according to an embodiment of the present invention, Figure 4 A side view schematically illustrates a state in which the expander module in a substrate cleaning apparatus according to an embodiment of the present invention applies pressure to the annular cover and the retaining ring of the wafer, thereby increasing the spacing between the plurality of wafers.

[0057] Reference Figures 1 to 4 A substrate cleaning apparatus 100 according to an embodiment of the present invention includes a vacuum chuck portion 120 and an ultrasonic cleaning module 220 .

[0058] Substrate cleaning apparatus 100 cleans wafer 10. After etching in the etching process, wafer 10 is cut into a matrix shape in the singulation process, forming a plurality of crystal dies 11. During the cleaning process, cleaning liquid is sprayed onto wafer 10, removing foreign matter adhering to the plurality of crystal dies 11. Various cleaning liquids, such as deionized water (DI-water), can be used.

[0059] Wafer 10 comprises a plurality of die 11 arranged in a matrix; a bonding sheet 12 for attaching the die 11; and a retaining ring 13 connected to the periphery of the bonding sheet 12 to maintain its tension. Bonding sheet 12 is made of a horizontally stretchable material. As bonding sheet 12 is tightened by retaining ring 13, the die 11 are positioned, maintaining the thin sheet of die 11 in a flat position.

[0060] A chamber 102 is formed inside the housing 101, and a cup-shaped cover 105 is provided in the chamber 102. The vacuum chuck 120 is arranged inside the cup-shaped cover 105 for containing the cleaning liquid. The cup-shaped cover 105 is provided to surround the outside of the vacuum chuck 120. The cup-shaped cover 105 can prevent the vacuum from entering the cup-shaped cover 105 (see FIG. 1 ). Figure 14 ) The sprayed cleaning fluid is discharged or scattered to the outside.

[0061] The vacuum chuck part 120 is rotatably provided on the driving part 110. The vacuum chuck part 120 may be in the shape of a disk as a whole.

[0062] The drive unit 110 includes a rotating shaft 111 connected to the rotation center of the vacuum chuck unit 120 and a motor unit 113 disposed on the rotating shaft 111. The motor unit 113 includes a stator (not shown) disposed within a housing (not shown) and a rotor (not shown) disposed within the stator and arranged to surround the rotating shaft 111. Furthermore, the drive unit 110 can employ a belt drive method, in which the rotating shaft 111 is rotated by a belt, or a chain drive method, in which the rotating shaft 111 is rotated by a chain. This drive unit 110 can employ various methods as long as it rotates the vacuum chuck unit 120.

[0063] A vacuum flow path 122 for creating a vacuum in the vacuum chuck 120 is formed on the rotating shaft 111. The vacuum flow path 122 extends along the length of the rotating shaft 111. A vacuum chamber 124 is formed in the vacuum chuck 120 to connect to the vacuum flow path 122. A plurality of vacuum holes (not shown) are formed in the vacuum chuck 120 to apply vacuum pressure to the wafer 10. The vacuum chuck 120 can be formed in a variety of ways.

[0064] The wafer 10 is placed on the vacuum chuck 120. The wafer 10, which has been cut into a plurality of dies 11, is placed on the vacuum chuck 120. When the wafer 10 is cut into dies 11, foreign matter may remain on the surface of the dies 11 and in the gaps between the dies 11.

[0065] The annular cover portion 130 is opposite to the retaining ring portion 13 of the wafer 10. The annular cover portion 130 includes: a cover body portion 131 formed to surround the periphery of the vacuum chuck portion 120; a limiting step portion 132 protruding inward from the lower side of the cover body portion 131; and a cover pressure portion 133 extending inward from the upper side of the cover body portion 131 for applying pressure to the retaining ring portion 13 of the wafer 10 (see FIG. Figure 7 The thickness of the cover pressing portion 133 may be formed to gradually become thinner toward the end. The cover pressing portion 133 seals the upper side of the collar portion 13, thereby preventing the cleaning liquid from penetrating into the components outside the collar portion 13.

[0066] The expander module 140 is configured to move the annular cover portion 130 and apply pressure to the retaining ring portion 13 toward the vacuum chuck portion 120 to expand the intervals between the dies 11 in the wafer 10 .

[0067] A chuck module 170 is provided on the vacuum chuck 120 to secure the retaining ring 13 of the wafer 10 to the vacuum chuck 120. The chuck module 170 secures the retaining ring 13 to the periphery of the vacuum chuck 120 by pressing the retaining ring 13 downward. Therefore, when the vacuum chuck 120 rotates, the chuck module 170 presses against the annular cover 130 and the retaining ring 13, preventing the wafer 10 from shifting in position and maintaining a flat surface. This chuck module 170 will be described in detail below.

[0068] Figure 5 This is a perspective view briefly showing a state in which the expander module holds and moves the annular cover in a substrate cleaning device according to an embodiment of the present invention. Figure 6 A side view briefly illustrates an expander module, an annular cover, and a vacuum chuck in a substrate cleaning device according to an embodiment of the present invention. Figure 7 This is a cross-sectional view briefly illustrating a state in which a chuck module restricts an annular cover portion in a substrate cleaning device according to an embodiment of the present invention. Figure 8 This is a perspective view briefly showing an expander module in a substrate cleaning device according to an embodiment of the present invention. Figure 9 A cross-sectional view briefly illustrates an expander head portion of an expander module in a substrate cleaning device according to an embodiment of the present invention. Figure 10 The figure is a cross-sectional view schematically showing a state in which the expander slider portion of the expander module of the substrate cleaning device according to one embodiment of the present invention has moved toward the inner side of the expander head portion.

[0069] Reference Figures 5 to 10 The expander module 140 includes an expander moving portion 141 , an expander head portion 150 and a plurality of expander arms 160 .

[0070] The expander moving part 141 is arranged on the upper side of the vacuum chuck part 120 in a manner that allows it to move up and down. The expander moving part 141 can be arranged in a variety of ways, such as a robotic arm method that allows it to move up and down, a ball screw method, etc. The expander head 150 is arranged in a manner that allows it to move through the expander moving part 141. A plurality of expander arms 160 are connected to the expander head 150 to grip and move the annular cover part 130, and to apply pressure to the annular cover part 130 so that the chuck module 170 restricts the annular cover part 130 to the vacuum chuck part 120. The plurality of expander arms 160 are radially arranged on the expander head 150. Four or more expander arms 160 can be provided around the periphery of the expander head 150.

[0071] When the multiple expander arms 160 apply pressure to the annular cover 130, the chuck module 170 restricts the annular cover 130 to the vacuum chuck 120. Therefore, the retaining ring 13 of the wafer 10 moves downward through the annular cover 130. In this case, as the annular cover 130 descends, the bonding sheet 12 of the wafer 10 is pulled in the radial direction. As the bonding sheet 12 is stretched in the radial direction, the intervals between the multiple dies 11 will expand (see FIG. Figure 4 If cleaning liquid is sprayed onto the plurality of crystal grains 11 while the spacing between the plurality of crystal grains 11 is expanded, the cleaning liquid can easily remove foreign matter adhering to the surface of the crystal grains 11 and foreign matter located in the gaps between the plurality of crystal grains 11. Therefore, the performance of cleaning foreign matter from the wafer 10 can be significantly improved. Furthermore, as the cleaning performance of the wafer 10 is significantly improved, the defective rate of the wafer 10 can be significantly reduced.

[0072] Once the chuck module 170 has restrained the annular cover 130 within the vacuum chuck 120, the expander arm 160 releases the pressure on the annular cover 130. The expander moving unit 141 then moves the expander head 150 and the expander arm 160 upward from the vacuum chuck 120. This prevents the ultrasonic cleaning module 220 from colliding with or being disturbed by the expander module 140 as it moves upward from the wafer 10.

[0073] The dilator head 150 includes a dilator sleeve portion 151 , a plurality of dilator slider portions 155 , a dilator rod portion 156 and a dilator driving portion 158 .

[0074] The expander sleeve portion 151 is connected to the expander moving portion 141. The expander sleeve portion 151 may be cylindrical as a whole. A plurality of expander slider portions 155 are coupled to the expander sleeve portion 151 in a radially movable manner and are respectively connected to the expander arm portion 160. In this case, slider groove portions 152a are radially formed on the peripheral portion of the expander sleeve portion 151 so that the expander slider portions 155 are movably coupled. The expander rod portion 156 is arranged inside the expander sleeve portion 151 to move the plurality of expander slider portions 155. The expander rod portion 156 is arranged inside the expander sleeve portion 151 in a manner that allows for vertical movement. The expander drive portion 158 is arranged on the expander sleeve portion 151 to move the expander rod portion 156.

[0075] When the expander driving portion 158 is driven, the expander slider portion 155 moves radially within the expander sleeve portion 151 as the expander rod portion 156 moves. As the expander slider portion 155 moves outward of the expander sleeve portion 151, the expander arm portion 160 moves outward and releases the restriction on the annular cover portion 130. As the expander slider portion 155 moves inward of the expander sleeve portion 151, the expander arm portion 160 moves inward and restricts the annular cover portion 130.

[0076] The expander cannula 151 includes a cannula body 152 , a first baffle 153 , and a second baffle 154 .

[0077] A movable space 152b is formed in the cannula body 152 to allow the expander rod 156 to move. The movable space 152b can be cylindrical. A first baffle 153 is provided to close one side of the cannula body 152. The first baffle 153 is detachably mounted on the upper side of the cannula body 152. A first sealing member 153a is provided around the first baffle 153. A snap ring 153b is provided on one side of the first baffle 153 to prevent the first baffle 153 from separating from the cannula body 152. After the expander rod 156 is inserted into the movable space 152b, the first baffle 153 closes one side of the cannula body 152. The second baffle 154 closes the other side of the cannula body 152 and forms a movable hole 154b to allow the expander rod 156 to be movably inserted. A second sealing member 154a is provided around the movable hole 154b to seal a gap between the movable hole 154b and the expander rod 156. The expander rod 156 is provided to be movable in the vertical direction.

[0078] The expander rod 156 includes a movable plate 156 a , a plunger 156 b , and a pusher 156 c .

[0079] The movable disc 156a is movably disposed within the movable space 152b. A disc seal 156d is provided around the movable disc 156a to seal the gap between the inner surface of the expander sleeve 151 and the outer surface of the movable disc 156a. The movable disc 156a is disc-shaped. The plunger 156b is connected to the movable disc 156a and inserted into the movable hole 154b. The movable disc 156a is engaged with the center of the plunger 156b. The pusher 156c is connected to the plunger 156b and the expander slider 155 to move the expander slider 155 as the plunger 156b moves. As the pusher 156c descends, applying pressure to the expander slider 155, the expander slider 155 moves outward. As the pusher 156c rises, releasing the pressure on the expander slider 155, the expander slider 155 moves inward.

[0080] A conical portion (not shown) is formed on the plunger portion 156b. As the conical portion applies pressure to the pushing portion 156c, the pushing portion 156c expands radially. Furthermore, as the conical portion releases pressure on the pushing portion 156c, the pushing portion 156c contracts radially due to the restoring force. The pushing portion 156c can be connected by a spring (not shown) or made of a retractable material, allowing the multiple pushing pieces (not shown) to expand and contract.

[0081] The expander drive unit 158 ​​includes a first supply port 158a for supplying a driving medium to one side of the movable space 152b to move the movable disk 156a toward the expander slider 155, and a second supply port 158b for supplying a driving medium to the other side of the movable space 152b to move the movable disk 156a toward the side opposite the expander slider 155. The first supply port 158a is connected to a first supply line, and the second supply port 158b is connected to a second supply line. When the first supply port 158a supplies the driving medium to one side of the movable space 152b, the second supply port 158b discharges the driving medium to the other side of the movable space 152b. When the second supply port 158b supplies the driving medium to the other side of the movable space 152b, the first supply port 158a discharges the driving medium to one side of the movable space 152b. Therefore, as the driving medium is supplied to the first supply port 158a or the second supply port 158b, the movable disk portion 156a can move to one side or the other side of the movable space portion 152b, and thus the expander arm portion 160 can move radially in the cannula body portion 152.

[0082] The expander arm 160 includes an arm member 161 connected to the expander slider 155 and a hook 163 configured on the arm member 161 to restrain the annular cover 130. The arm member 161 is radially disposed in the cannula body 152. The hook 163 is disposed at the end of the arm member 161. When the expander slider 155 moves inward of the cannula body 152, the hook 163 restrains the annular cover 130.

[0083] The hook portion 163 includes a hook body portion 164 connected to the arm member 161 to surround the outer side of the annular cover portion 130; and a hook pin portion 165 combined with the hook body portion 164 to be inserted into the cover hole portion 135 of the annular cover portion 130. The hook body portion 164 can be substantially The hook pin 165 is shaped so as to contact the outer corners of the annular cover 130. The hook pin 165 is formed to protrude inwardly from the hook body 164. As the arm member 161 moves inwardly via the expander slider 155, the hook pin 165 is inserted into the cover hole 135 of the annular cover 130, thereby preventing the annular cover 130 from being separated from the expander module 140 when the expander module 140 is moved.

[0084] Figure 11 To briefly illustrate a top view of a chuck module in a substrate cleaning device according to an embodiment of the present invention, Figure 12 This is a top view briefly illustrating a state in which a chuck base of a chuck module rotates to drive a chuck link portion in a substrate cleaning apparatus according to an embodiment of the present invention. Figure 13 The present invention is a perspective view briefly showing a state in which a cover restricting portion of a chuck module is driven to restrict an annular cover portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0085] Reference Figures 11 to 13 The chuck module 170 includes a chuck base 171 , a chuck rotating portion 175 , a plurality of chuck connecting rod portions 180 and a plurality of cover limiting portions 190 .

[0086] A chuck base 171 is mounted on the vacuum chuck portion 120. A chuck rotating portion 175 is connected to the chuck base 171 to rotate the chuck base 171. A plurality of chuck connecting rods 180 are radially connected to the chuck base 171 and move when the chuck base 171 rotates. A plurality of cover restricting portions 190 are respectively connected to the chuck connecting rods 180 to secure the annular cover portion 130 to the vacuum chuck portion 120 when the chuck connecting rods 180 move.

[0087] As the chuck rotating portion 175 is driven, the base gear portion 174 rotates, and the base main body 172 rotates along with the base gear portion 174. Consequently, the chuck link portion 180 moves in the radial direction of the base main body 172. In this case, when the base main body 172 of the chuck base 171 rotates, the multiple chuck link portions 180 move simultaneously. As the chuck link portions 180 move, the annular cover portion 130 is secured to the vacuum chuck portion 120. Therefore, the wafer 10 and the annular cover portion 130 can be simultaneously secured to the vacuum chuck portion 120 using a single chuck base 171 and a single chuck rotating portion 175, thereby further simplifying the structure of the substrate cleaning apparatus 100.

[0088] The chuck base 171 includes a base body portion 172 , a plurality of guide portions 173 , and a base gear portion 174 .

[0089] The base body 172 is formed in a ring shape so as to be concentric with the rotation axis 111 of the vacuum chuck portion 120. The base body 172 is arranged inside the vacuum chuck portion 120. A plurality of guide portions 173 are formed on the base body 172 to allow the chuck link portion 180 to be movably coupled. The number of the plurality of guide portions 173 is the same as the number of the chuck link portions 180, and they are formed at equal intervals along the circumferential direction of the base body 172. The base gear portion 174 is formed on the base body 172 and is connected to the chuck rotating portion 175. The base gear portion 174 is arranged in an arc shape on the inner circumferential surface of the base body 172. As the chuck rotating portion 175 is driven, the base gear portion 174 rotates, and the base body 172 rotates together with the base gear portion 174, thereby causing the chuck link portion 180 to move in the radial direction of the base body 172.

[0090] The guide portion 173 is formed obliquely relative to the radial direction of the base body 172. The guide portion 173 may be a guide hole, a guide groove, or a guide protrusion. Because the guide portion 173 is formed obliquely relative to the radial direction of the base body 172, as the base body 172 rotates a certain angle, the chuck link portion 180 moves linearly in the radial direction of the base body 172.

[0091] The chuck link portion 180 includes a guide slider 181 , a link member 182 , and a link gear portion 183 .

[0092] Guide slider 181 is movably coupled to guide portion 173. Link member 182 is coupled to guide slider 181 and, when guide slider 181 moves, linearly moves along the radius of base body 172. Link gear portion 183 is formed on link member 182 and moves by meshing with lid stopper 190. Link member 182 is formed in a straight rod shape. Link gear portion 183 is formed in a rack shape arranged in parallel along the length of link member 182.

[0093] The chuck link 180 further includes guide rollers 184 that support both sides of the link member 182. The guide rollers 184 prevent the chuck link 180 from rotating in the circumferential direction of the base body 172 when the base body 172 rotates. Therefore, when the base body 172 rotates, if the guide slider 181 moves along the guide rollers 184, the link member 182 can move linearly without rotating.

[0094] The cover limiting portion 190 includes: a cover limiting shaft portion 191, which is rotatably arranged on the vacuum chuck portion 120; a limiting gear portion 192, formed on the cover limiting shaft portion 191 to engage with the connecting rod gear portion 183; a cover limiting rod 193, which is connected to the cover limiting shaft portion 191 to apply pressure to the annular cover portion 130 and release the pressure on the annular cover portion 130; and a limiting roller portion 194, which is rotatably arranged on the cover limiting rod 193 to be in rolling contact with the annular cover portion 130.

[0095] As connecting rod member 182 moves linearly, connecting rod gear portion 183 engages with limiting gear portion 192 and is driven. As limiting gear portion 192 rotates, cover limiting shaft portion 191 and cover limiting rod 193 rotate, causing limiting roller portion 194 to roll and move along limiting step portion 132 of annular cover portion 130. Consequently, limiting roller portion 194 rolls and contacts limiting step portion 132 of annular cover portion 130, thereby preventing the generation of foreign matter due to wear or scratches on limiting step portion 132 of annular cover portion 130. Consequently, the defective rate of wafer 10 can be reduced by preventing foreign matter from entering wafer 10 located inside annular cover portion 130.

[0096] The substrate cleaning apparatus 100 further includes a height adjustment module 210 disposed at the vacuum chuck portion 120 for adjusting the height of the cover restricting portion 190. The height adjustment module 210 adjusts the height of the cover restricting portion 190 before the cleaning process begins.

[0097] If the setting height of the cover limiting portion 190 is adjusted by the height adjustment portion 213, the height between the upper surface of the annular cover portion 130 and the upper surface of the vacuum chuck portion 120 is adjusted. As the setting height of the cover limiting portion 190 is adjusted, the height of the limiting roller portion 194 of the cover limiting portion 190 is adjusted. In this case, if the annular cover portion 130 is restricted by the cover limiting portion 190 in the state of crimping the retaining ring portion 13, the degree of stretching of the bonding sheet 12 of the wafer 10 is adjusted according to the restriction height of the retaining ring portion 13. For example, the lower the setting height of the cover limiting portion 190, the greater the degree of stretching of the bonding sheet 12, and the higher the setting height of the cover limiting portion 190, the smaller the degree of stretching of the bonding sheet 12. As the degree of stretching of the bonding sheet 12 is adjusted, the spacing between the multiple grains 11 can be adjusted.

[0098] The height adjustment module 210 includes an adjustment member 211, which is provided with a cover stopper 190 and is movably coupled to the periphery of the vacuum chuck unit 120; and a height adjustment unit 213, which is connected to the adjustment member 211 to adjust the installation height of the adjustment member 211. The adjustment member 211 can be formed into a block-shaped structure that is disposed around the vacuum chuck unit 120 so as to be movable up and down. The height adjustment unit 213 can adopt various methods, such as a cylinder or a ball screw, to adjust the height of the adjustment member 211.

[0099] Height adjustment module 210 can adjust the height of lid stopper 190 so that the height difference between the upper surface of vacuum chuck 120 and the upper surface of retaining ring 13 is approximately within a range of 5 mm to 15 mm. The height of lid stopper 190 can be adjusted appropriately based on the size of wafer 10, the cleaning speed of wafer 10, and other factors.

[0100] Figure 14 This is a top view briefly showing a state in which an ultrasonic cleaning module and a cleaning liquid spraying module are arranged outside a vacuum chuck portion in a substrate cleaning apparatus according to an embodiment of the present invention. Figure 15 To briefly illustrate a top view of an ultrasonic cleaning module in a substrate cleaning device according to an embodiment of the present invention, Figure 16 1 is a side view briefly showing an ultrasonic cleaning module in a substrate cleaning device according to an embodiment of the present invention. Figure 17 This is a side view briefly illustrating a state in which a cleaning head of an ultrasonic cleaning module in a substrate cleaning apparatus according to an embodiment of the present invention is tilted and disposed on a wafer. Figure 18 This is a cross-sectional view briefly illustrating a connecting bolt portion and an angle adjustment bolt portion of a cleaning head in a substrate cleaning device according to an embodiment of the present invention. Figure 19 The figure is a cross-sectional view schematically showing a state where an angle adjustment bolt portion is provided in a substrate cleaning apparatus according to an embodiment of the present invention.

[0101] Reference Figures 14 to 19 The substrate cleaning apparatus 100 further includes an ultrasonic cleaning module 220 for spraying a cleaning liquid onto the wafer 10 and applying ultrasonic waves to the cleaning liquid to cause ultrasonic vibrations. In this case, the wafer 10 is cleaned chemically by the cleaning liquid, while the physical cleaning is performed through cavitation by the ultrasonic waves, thereby significantly improving the cleaning efficiency of the wafer 10.

[0102] The ultrasonic cleaning module 220 applies ultrasonic waves to the cleaning liquid while being immersed in the cleaning liquid, so that cavitation can be actively generated at the lower side of the ultrasonic cleaning module 220 .

[0103] The ultrasonic cleaning module 220 includes a lifting arm driving unit 221, a lifting arm unit 222, a swinging unit 223 and an ultrasonic cleaning unit 224. The lifting arm driving unit 221 includes a motor, a cylinder or a ball screw unit. The lifting arm unit 222 is connected to the lifting arm driving unit 221 so as to be lifted and lowered by the lifting arm driving unit 221. The swinging unit 223 is connected to the lifting arm unit 222 so as to rotate the lifting arm unit 222. The ultrasonic cleaning unit 224 is connected to the lifting arm unit 222 and is used to spray cleaning liquid onto the wafer 10 and apply ultrasonic waves to the cleaning liquid. While the wafer 10 is placed on the vacuum chuck unit 120, the swinging unit 223 is arranged on the outside of the vacuum chuck unit 120. After the wafer 10 is placed in the vacuum chuck unit 120, the swinging unit 223 moves toward the upper side of the vacuum chuck unit 120.

[0104] The ultrasonic cleaning unit 224 includes a cleaning head 225, an ultrasonic wave generating unit 226, a power supply applying unit 227, an internal pressure generating unit 228, and a cleaning liquid spraying unit 229. The ultrasonic cleaning unit 224 is disposed outside the cup-shaped housing 105.

[0105] The cleaning head 225 is connected to the lifting arm 222. An ultrasonic wave generator 226 is disposed within the cleaning head 225 to apply ultrasonic waves to the cleaning liquid. A power supply unit 227 is disposed within the cleaning head 225 to apply voltage to the ultrasonic wave generator 226. The power supply unit 227 is connected to an electrical wire (not shown). An internal pressure generator 228 is provided within the cleaning head 225 to create a pressure higher than atmospheric pressure within the cleaning head 225. A cleaning liquid spray unit 229 is formed within the cleaning head 225 to spray cleaning liquid onto the wafer 10. When the power supply unit 227 applies voltage to the ultrasonic wave generator 226, ultrasonic waves are generated within the ultrasonic wave generator 226, causing the cleaning liquid to vibrate ultrasonically. In this case, the internal pressure generator 228 creates a pressure higher than atmospheric pressure within the cleaning head 225, thereby preventing the cleaning liquid from flowing into the cleaning head 225. Consequently, the power supply unit 227 and the ultrasonic wave generator 226 can be prevented from leaking electricity or being damaged by the cleaning liquid.

[0106] The cleaning liquid spraying portion 229 includes: a cleaning liquid inlet portion 229a for allowing the cleaning liquid to flow in; and a plurality of spray nozzles 229b for spraying the cleaning liquid discharged from the cleaning liquid inlet portion 229a onto the wafer 10. The plurality of spray nozzles 229b can form one or more rows on the lower side of the cleaning head 225. The spray nozzles 229b are arranged along the radial direction of the wafer 10. The plurality of spray nozzles 229b spray the cleaning liquid onto the wafer 10, so that the wafer 10 can be cleaned by the spray pressure of the cleaning liquid. In addition, the plurality of spray nozzles 229b are arranged along the radial direction of the wafer 10. Therefore, when the wafer 10 is rotated by the vacuum chuck portion 120, the cleaning liquid can be sprayed onto the wafer 10 while the cleaning head 225 is positioned.

[0107] The plurality of spray nozzles 229b spray the cleaning liquid obliquely in the direction in which the cleaning liquid flows in the wafer 10 (see Figure 17 For example, when the wafer 10 rotates clockwise, the plurality of spray nozzles 229b spray the cleaning liquid at an angle clockwise relative to the cleaning head 225. Furthermore, when the wafer 10 rotates counterclockwise, the plurality of spray nozzles 229b spray the cleaning liquid at an angle counterclockwise relative to the cleaning head 225. This allows the cleaning liquid to flow smoothly out from the bottom side of the cleaning head 225, thereby preventing stagnation of the cleaning liquid and ensuring fluidity.

[0108] The lower surface of the cleaning head 225 is formed so that the inflow side of the cleaning liquid is higher than the outflow side of the cleaning liquid (H1>H2). This prevents the cleaning liquid from colliding with the inflow corners of the cleaning head 225 and stagnating. Furthermore, after flowing smoothly into the lower surface of the cleaning head 225, the cleaning liquid can flow out of the lower surface of the cleaning head 225 more quickly.

[0109] The height of the lower surface of the cleaning head 225 is adjusted based on the height of the wafer 10. For example, the height of the lower surface of the cleaning head 225 can be adjusted based on the tilt angle of the cleaning head 225 within the lifting arm 222. Therefore, the height of the lower surface of the cleaning head 225 can be appropriately adjusted to ensure that the cleaning liquid flows smoothly into the lower surface of the cleaning head 225 and then flows out of the lower surface of the cleaning head 225 more quickly.

[0110] The cleaning head 225 further includes: a plurality of coupling bolts 225a, which are threadedly coupled to the cleaning head 225 and the lifting arm 222; and an angle adjustment bolt 225b, which is threadedly coupled to the cleaning head 225 and the lifting arm 222 to adjust the angle θ of the cleaning head 225 (refer to FIG. Figure 17 、 Figure 18 and Figure 19 ). A plurality of coupling bolt portions 225a and angle adjustment bolt portions 225b are provided on both sides of the cleaning head 225 in the width direction. As the angle adjustment bolt portion 225b protrudes and couples to the cleaning head 225, the cleaning head 225 is slightly spaced apart from one side of the lifting arm portion 222, so that the coupling bolt portion 225a is coupled to the cleaning head 225 and the lifting arm portion 222. Therefore, as the cleaning head 225 is coupled to the lifting arm portion 222 in a slightly tilted state, the setting angle of the cleaning head 225 can be adjusted. The setting angle of the cleaning head 225 can be appropriately designed in consideration of the rotation speed of the wafer 10, the size of the wafer 10, the spacing distance of the cleaning head 225, the viscosity of the cleaning liquid, and the like.

[0111] The substrate cleaning apparatus 100 further includes a cleaning liquid spraying module 230 for spraying a cleaning liquid toward the wafer 10. The cleaning liquid spraying module 230 may spray a cleaning liquid containing deionized water (DIW) and nitrogen gas toward the wafer 10.

[0112] The cleaning liquid spraying module 230 includes a rotary arm driving unit 231 , a rotary arm unit 232 , a rotary unit 233 , and a spraying unit 234 .

[0113] The pivot arm drive unit 231 includes a motor, a cylinder, or a ball screw. The pivot arm unit 232 is connected to the pivot arm drive unit 231 so as to be raised and lowered by the pivot arm drive unit 231. The pivot unit 233 is connected to the pivot arm unit 232 so as to rotate the pivot arm unit 232. The spray unit 234 is connected to the pivot arm unit 232 and is used to spray the cleaning liquid onto the wafer 10.

[0114] The spraying portion 234 may include a spraying nozzle that sprays the cleaning liquid toward the wafer 10 . Thus, when the wafer 10 rotates through the vacuum chuck portion 120 , the spraying portion 234 repeatedly rotates within a certain angle range and sprays the cleaning liquid toward the wafer 10 .

[0115] The ultrasonic cleaning module 220 and the cleaning liquid spraying module 230 may be selectively used according to a processing step of the wafer 10 .

[0116] Figure 20 The figure is a side view schematically showing an ion generator and a transfer unit of a substrate cleaning device according to an embodiment of the present invention.

[0117] Reference Figure 20 An ion generator 240 is provided inside the housing 101. The ion generator 240 is located above the chamber 102 and is used to remove static electricity generated during the processing and non-processing steps of the wafer 10. The ion generator 240 prevents static electricity from being generated within the wafer 10 and the chamber, thereby preventing foreign matter from reattaching to the wafer 10 due to static electricity.

[0118] If air is supplied as the supply gas to the ionizer 240 and deionized water (DI water) is supplied as the cleaning liquid, the cations and anions ionized by the ionizer 240 can be sprayed onto the upper portion of the wafer together with the cleaning liquid.

[0119] Before deionized water containing cations and anions was sprayed onto the top of wafer 10, the measured electrostatic potential of wafer 10 was approximately 3.6 kV. After the deionized water containing cations and anions was sprayed onto the top of wafer 10, the measured electrostatic potential was approximately -0.10 kV to -0.17 kV. With such a negative voltage, the static electricity of wafer 10 can be controlled to an ideal value close to "0" by increasing the amount of (+) ions generated by ion generator 240.

[0120] A transfer unit 250 is provided in the chamber section 102 to receive the wafer 10 from the transfer unit (not shown). The transfer unit 250 includes a transfer moving section 251 movably provided on the bottom surface of the chamber section 102; a transfer elevating section 253 provided on the transfer moving section 251; and a transfer supporting section 255 provided on the transfer elevating section 253. When the wafer 10 transferred from the transfer unit is supported on the transfer supporting section 255, the transfer elevating section 253 moves toward both sides of the vacuum chuck section 120 via the transfer transport section. When the transfer elevating section 253 lowers the transfer supporting section 255, the wafer 10 is placed on the upper side of the vacuum chuck section 120. After the wafer 10 is placed on the vacuum chuck section 120, the transfer unit 250 returns to its original position to receive the wafer 10 from the transfer unit.

[0121] A control method of the substrate cleaning apparatus according to an embodiment of the present invention constructed in the above manner will be described below.

[0122] Figure 21 FIG. 1 is a flow chart illustrating a method for controlling a substrate cleaning apparatus according to an embodiment of the present invention.

[0123] Reference Figure 21 , the expander module 140 restrains the annular cover 130 (step S11). In this case, as the expander arms 160 of the expander module 140 move outward through the expander head 150, the hooks 163 of the expander arms 160 correspond to the annular cover 130. As the expander arms 160 move inward through the expander head 150, the hooks 163 restrain the annular cover 130.

[0124] The transfer unit 250 places the wafer 10 on the vacuum chuck 120 (step S12). As the transfer unit 250 receives the wafer 10 from the transfer unit, the transfer and transport sections of the transfer unit 250 move toward both sides of the vacuum chuck 120, and the transfer carrier 255 moves toward the upper side of the vacuum chuck 120. The transfer carrier 255 of the transfer unit 250 descends to place the wafer 10 on the vacuum chuck 120. After the wafer 10 is placed on the vacuum chuck 120, the transfer unit 250 returns to its original position to receive a new wafer 10.

[0125] The expander module 140 descends and applies pressure to the annular cover 130 (step S13), thereby increasing the spacing between the dies 11 on the wafer 10. As the expander module 140 grips the annular cover 130 and moves it upward toward the wafer 10, the expander module 140 descends. Consequently, the expander arm 160 of the expander module 140 applies downward pressure to the annular cover 130. As the annular cover 130 applies downward pressure to the retaining ring 13 and moves downward, the bonding sheet 12 of the wafer 10 is pulled radially, stretching the bonding sheet 12 in the radial direction. As the bonding sheet 12 stretches radially, the spacing between the dies 11 increases.

[0126] When the expander module 140 applies pressure to the entire annular cover 130, the chuck module 170 restrains the annular cover 130 within the vacuum chuck 120 (step S14). Specifically, when the chuck rotating portion 175 of the chuck module 170 engages with the base gear portion 174 and is driven, the chuck link 180 moves outward as the chuck base 171 rotates a certain angle. As the link gear portion 183 of the chuck link 180 engages with the restraining gear portion 192 of the cover restraining portion 190 and is driven, the cover restraining rod 193 and the restraining roller portion 194 rotate and restrain the restraining step 132 of the annular cover 130. As the cover restraining portion 190 restrains the annular cover 130, the retaining ring portion 13 of the wafer 10 remains lowered, thereby maintaining the expanded spacing between the dies 11 within the wafer 10.

[0127] When cover restrictor 190 completely restricts annular cover 130, expander module 140 releases its restriction on annular cover 130 and moves to the standby position (step S15). In this state, expander module 140 is sufficiently spaced apart from vacuum chuck 120 to prevent ultrasonic cleaning module 220 from colliding with or contacting the vacuum chuck 120 as it moves upward.

[0128] The ultrasonic cleaning module 220 sprays cleaning liquid onto the wafer 10 and causes the cleaning liquid to vibrate ultrasonically (step S16). In this case, the ultrasonic cleaning module 220 applies ultrasonic waves to the cleaning liquid while being immersed in the cleaning liquid. Specifically, the lifting arm 222 is raised by the lifting arm driving unit 221, the swinging unit 223 rotates the lifting arm 222 toward the upper side of the vacuum chuck unit 120, and the lifting arm driving unit 221 lowers the lifting arm 222 so that the cleaning head 225 of the ultrasonic cleaning module 220 is immersed in the cleaning liquid. The cleaning liquid spraying unit 229 sprays the cleaning liquid onto the wafer 10, and the ultrasonic wave generating unit 226 causes the cleaning liquid to vibrate ultrasonically.

[0129] In this case, the intervals between the plurality of crystal grains 11 remain expanded, so foreign matter between the crystal grains 11 can be removed more quickly and easily. Furthermore, the wafer 10 can be cleaned more quickly and cleanly by the spray pressure of the cleaning liquid and the ultrasonic vibration of the cleaning liquid.

[0130] It is determined whether the cleaning time of the wafer 10 is over (step S17). In this case, the cleaning time of the wafer 10 can be pre-set in the control unit (not shown).

[0131] After the cleaning time of the wafer 10 is completed, the cleaning liquid is discharged from the cup-shaped cover 105 (step S18). The cleaning liquid discharged from the cup-shaped cover 105 is recovered again in a cleaning liquid recovery tank (not shown).

[0132] Then, the ultrasonic cleaning module 220 moves outward from the vacuum chuck 120 (step S19 ). In this case, as the lifting arm driving unit 221 raises the lifting arm 222 and the swing unit 223 rotates the lifting arm 222 , the ultrasonic cleaning unit 224 moves outward from the vacuum chuck 120 .

[0133] Determine whether the discharge of cleaning fluid ends (step S20). In this case, the cleaning fluid discharge time is pre-set in the control unit. And, can detect whether the cleaning fluid is fully discharged from the cup-shaped outer cover 105 by a discharge detection sensor (not shown).

[0134] As the vacuum chuck portion 120 rotates, the wafer 10 is dried (step S21). In this case, no cleaning liquid is supplied to the cup-shaped outer cover 105. As the vacuum chuck portion 120 rotates, the cleaning liquid remaining on the wafer 10 is removed from the wafer 10 by centrifugal force. In this case, the wafer 10 is rotated by the vacuum chuck portion 120 while the intervals between the crystal grains 11 of the wafer 10 are expanded. Therefore, the cleaning liquid remaining between the crystal grains 11 can be removed more quickly. In addition, as air or gas is sprayed onto the wafer 10, the drying of the wafer 10 can be promoted.

[0135] The expander module 140 moves to restrain the annular cover 130 (step S22). In this state, the expander module 140 descends toward the vacuum chuck 120, and the hook 163 of the expander arm 160 faces the annular cover 130. As the expander head 150 moves the expander arm 160 inward, the hook body 164 abuts against the annular cover 130, and the hook pin 165 of the hook 163 inserts into the cover hole 135 of the annular cover 130, restraining the annular cover 130.

[0136] Chuck module 170 releases the restraint on annular cover 130 (step S23). In this case, when chuck rotating unit 175 rotates chuck base 171 by a certain angle, chuck link 180 moves toward the center of chuck base 171. As link gear 183 engages and drives with restraining gear 192, the cover restraining rod 193 and restraining roller 194 disengage from the restraining step 132 of annular cover 130. Even at the moment the restraint on annular cover 130 is released, the expander module 140 maintains its pressure on the annular cover 130.

[0137] The expander module 140 moves to the waiting position (step S24). As the expander moving unit 141 rises, the expander head 150 and expander arm 160 also rise. As the expander arm 160 rises while restraining the annular cover 130, the retaining ring 13 of the wafer 10 rises, while the bonding sheet 12 of the wafer 10 contracts back to its original position. Consequently, the spacing between the dies 11 on the wafer 10 returns to its original position.

[0138] The wafer 10 is ejected from the vacuum chuck 120 (step S25). In this process, the transfer moving portion 251 of the transfer unit 250 moves toward both sides of the vacuum chuck 120, and the transfer lifting portion 253 descends. As the transfer carrier 255 rotates, the wafer 10 is carried on the transfer carrier 255. When the transfer moving portion 251 is moved to the ejection position for the wafer 10, the transfer unit receives the wafer 10 and ejects it outside the chamber 102. The transfer unit then transfers the wafer 10 to a wafer storage unit or to a subsequent process.

[0139] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely examples, and those skilled in the art will appreciate that various modifications and equivalent embodiments may be implemented.

[0140] Therefore, the true scope of protection of the present invention is defined by the following claims.

Claims

1. A substrate cleaning device, characterized in that: include: a vacuum chuck portion for placing a wafer; and The ultrasonic cleaning module is used to spray cleaning liquid onto the wafer and apply ultrasonic waves to the cleaning liquid to cause ultrasonic vibrations in the cleaning liquid. The ultrasonic cleaning module includes an ultrasonic cleaning part, which is used to spray cleaning liquid onto the wafer and apply ultrasonic waves to the cleaning liquid. The ultrasonic cleaning unit comprises: an ultrasonic wave generating unit, disposed inside the cleaning head, for applying ultrasonic waves to the cleaning liquid; as well as A cleaning liquid spraying unit is arranged inside the cleaning head to spray the cleaning liquid toward the wafer and is separated from the ultrasonic generating unit. The ultrasonic cleaning module can adjust the height of the lower surface portion of the cleaning head where the cleaning liquid injection portion is configured and the height of the lower surface portion of the cleaning head where the ultrasonic generating portion is configured to different heights. The cleaning liquid injection portion and the ultrasonic generating portion are located at different distances from the surface of the wafer, and the surface of the lower surface portion of the cleaning head where the ultrasonic generating portion is configured is closer to the surface of the wafer.

2. The substrate cleaning device according to claim 1, wherein: The ultrasonic cleaning module also includes: Lifting arm drive unit; a lifting arm portion connected to the lifting arm driving portion so as to be lifted and lowered by the lifting arm driving portion; and A swinging portion connected to the lifting arm portion to enable the lifting arm portion to rotate, The ultrasonic cleaning part is connected to the lifting arm part.

3. The substrate cleaning device according to claim 2, wherein: The ultrasonic cleaning unit also includes: The cleaning head is connected to the lifting arm and immersed in the cleaning liquid; a voltage applying unit, disposed inside the cleaning head, for applying voltage to the ultrasonic wave generating unit; and The internal pressure generating unit generates a pressure higher than atmospheric pressure inside the cleaning head.

4. The substrate cleaning device according to claim 3, wherein: The cleaning liquid spraying unit includes: a cleaning liquid inlet portion for the cleaning liquid to flow into; and A plurality of spray nozzles are used to spray the cleaning liquid discharged from the cleaning liquid inlet portion toward the wafer.

5. The substrate cleaning device according to claim 4, wherein: The plurality of spray nozzles spray the cleaning liquid at an angle along a direction in which the cleaning liquid flows in the wafer.

6. The substrate cleaning device according to claim 4, wherein: The lower surface portion of the cleaning head is formed so that an inflow side of the cleaning liquid is higher than an outflow side of the cleaning liquid.

7. The substrate cleaning device according to claim 4, wherein: The cleaning head adjusts the height of a lower surface portion of one side of the cleaning head according to a height change of the wafer.

8. The substrate cleaning device according to claim 1, wherein: include: an annular cover portion, disposed on one side of the vacuum chuck portion; an expander module, configured to move the annular cover portion, the expander module applying pressure to the retaining ring portion of the wafer toward the vacuum chuck portion to expand the intervals between the dies in the wafer; as well as A chuck module is provided on the vacuum chuck portion to confine the annular cover portion to which pressure is applied by the expander module on the vacuum chuck portion.

9. The substrate cleaning device according to claim 8, wherein: The expander module comprises: Expander moving part; an expander head configured to be movable by the expander moving portion; and A plurality of expander arms are connected to the expander head to hold the annular cover to move the annular cover. The expander arms apply pressure to the annular cover so that the chuck module restricts the annular cover.

10. The substrate cleaning device according to claim 9, wherein: When the chuck module restrains the annular cover portion on the vacuum chuck portion, the expander arm portion releases the pressure applied to the annular cover portion.

11. The substrate cleaning device according to claim 9, wherein: The expander head comprises: an expander sleeve portion connected to the expander moving portion; A plurality of expander sliders are coupled to the expander sleeve in a radially movable manner and are respectively connected to the expander arm portions; an expander rod portion, disposed inside the expander sleeve portion, to move the plurality of expander slider portions; and The expander driving part is connected to the expander sleeve part to move the expander rod part.

12. The substrate cleaning device according to claim 11, wherein: The expander casing portion comprises: The sleeve body is formed with a moving space portion for moving the expander rod portion; a first baffle portion, configured to close one side of the sleeve body; and The second baffle portion is used to close the other side of the sleeve main body portion and is formed with a movable hole portion so that the expander rod portion can be inserted in a movable manner.

13. The substrate cleaning device according to claim 11, wherein: The expander rod portion includes: a movable disc portion, movably disposed on the expander sleeve portion; a plunger portion connected to the movable disk portion to be inserted into the movable hole portion of the expander sleeve portion; and The pushing portion is connected to the plunger portion and the expander slider portion so as to move the expander slider portion along with the movement of the plunger portion.

14. The substrate cleaning device according to claim 11, wherein: The expander arm comprises: an arm member connected to the expander slider; and The hook portion is disposed on the arm member to restrict the annular cover portion.

15. The substrate cleaning device according to claim 8, wherein The chuck module comprises: a chuck base, disposed on the vacuum chuck portion; a chuck rotating portion connected to the chuck base to rotate the chuck base; a plurality of chuck connecting rods, each radially connected to the chuck base and moving when the chuck base rotates; and A plurality of cover restricting portions are connected to the chuck link portion to restrict the annular cover portion to the vacuum chuck portion when the chuck link portion moves.

16. The substrate cleaning device according to claim 15, wherein: The chuck base comprises: a base body portion formed in an annular shape so as to be concentric with the rotation axis of the vacuum chuck portion; A plurality of guide portions are formed on the base body, and the chuck link portion is movably coupled to the guide portions; and The base gear portion is formed on the base body portion and is connected to the chuck rotating portion.

17. The substrate cleaning device according to claim 15, wherein: The chuck connecting rod portion comprises: A guide slider movably coupled to the chuck base; a connecting rod component connected to the guide slider, and moving linearly along the radius direction of the chuck base when the guide slider moves; and A link gear portion is formed on the link member and moves by meshing with the cover restricting portion.

18. The substrate cleaning device according to claim 17, wherein: The cover restricting portion includes: a cover limiting shaft portion rotatably disposed on the vacuum chuck portion; a limiting gear portion formed on the cover limiting shaft portion to engage with the connecting rod gear portion; a cover limiting rod connected to the cover limiting shaft portion to apply pressure to the annular cover portion and release the pressure on the annular cover portion; and The restriction roller portion is rotatably provided on the cover restriction lever so as to be in rolling contact with the annular cover portion.

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