A method for manufacturing a cavity-on-layer component

By using laser drilling and screen printing technology to create cavity contours on green ceramic tape, combined with the use of silver glass powder, the complexity and precision issues of cavity manufacturing are solved, achieving adjustable cavity depth and reliable circuit connection, and supporting efficient mass production of components.

CN115223957BActive Publication Date: 2025-11-28GUANGDONG HUANBO NEW MATERIAL CO LTD +1
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Patent Information

Application Number
CN202210828718.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-07-13
Publication Date
2025-11-28
Estimated Expiration
2042-07-13

AI Technical Summary

Technical Problem

In existing technologies, cavity manufacturing is complex and difficult to achieve the required precision. Furthermore, cavity depth adjustment is challenging, which hinders the integration and miniaturization of components.

Method used

Laser drilling technology is used to outline the cavity on the green ceramic tape. Combined with screen printing and positioning hole fabrication, the cavity is formed by stacking and extrusion. Silver glass powder is used to improve adhesion and conductivity, so as to achieve precise manufacturing of the cavity.

Benefits of technology

The cavity manufacturing process has been simplified, enabling mass production. The cavity depth is adjustable, and the cavity pattern can be set arbitrarily, improving the weldability of the cavity bottom and the reliability of the circuit connection.

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Abstract

The application discloses a manufacturing method of a cavity belt laminated component, and relates to the field of electronic component manufacturing processes. The method comprises the following steps: making interval holes on each green ceramic belt by laser drilling technology, and outlining a target cavity profile, so that the cavity pattern does not completely fall off the green ceramic belt; making positioning holes of each green ceramic belt by the same laminated image, so as to ensure that the positioning holes on each green ceramic belt are consistent with the laminated image; and after all the green ceramic belts are laminated to form an initial bar block, the target cavity on the initial bar block can be easily squeezed off along the target cavity profile to obtain a first cavity belt laminated bar block. The manufacturing method of the cavity belt laminated component is simple in process and can realize mass production; the cavity depth can be arbitrarily adjusted according to the number of laminated green ceramic belts, and can be between 10 um and 10 mm; the cavity pattern can be arbitrarily set; the cavity bottom can be designed with a welding point; and each layer of green ceramic belt can be designed with a circuit pattern and a through hole connected upward and downward.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic component manufacturing process, in particular to a manufacturing method of a cavity-containing laminated component. BACKGROUND

[0002] Low Temperature Co-fired Ceramic (LTCC) is a kind of multi-disciplinary integrated component technology that has attracted much attention in recent years. Due to its excellent electronic, mechanical and thermal properties, it has become the preferred way for future electronic component integration and modularization, and is widely used in substrate, packaging and microwave devices.

[0003] LTCC technology is to make low-temperature sintering ceramic powder into green ceramic tape with accurate thickness and density. The required circuit pattern is made on the green ceramic tape by punching or laser punching, micro-hole grouting, and precise conductor paste printing process. Passive components and functional circuits can be embedded in the multilayer ceramic substrate, and then stacked together and sintered at high temperature to form a three-dimensional high-density circuit. Low temperature co-fired ceramic substrate (LTCC) is an ideal multilayer substrate material for three-dimensional assembly. The cavity structure constructed by LTCC technology is very suitable for the embedding of passive devices, which greatly reduces the size of the components and the area of the packaging substrate. In addition, the cavity structure in the LTCC substrate is also widely used in LTCC micro-flow channels, LTCC micro-reactors, LTCC sensors, LTCC drivers, and LTCC multifunctional integrated substrates.

[0004] The demand for devices containing cavity devices is gradually increasing, but the current cavity manufacturing technology is complex, and the depth of the cavity is difficult to meet the precision requirements. SUMMARY

[0005] The purpose of the present application is to provide a manufacturing method of a cavity-containing laminated component, which can improve the above problems.

[0006] The embodiment of the present application is implemented as follows:

[0007] In a first aspect, the present application provides a manufacturing method of a cavity-containing laminated component, which comprises:

[0008] providing a plurality of green ceramic tapes with the same size;

[0009] laser punching according to the target cavity profile on each green ceramic tape, and the pattern of laser holes connected on each green ceramic tape is the target cavity profile;

[0010] making corresponding grouting micro-holes and alignment holes on each green ceramic tape, and printing corresponding circuits, alignment patterns and cutting lines on each green ceramic tape by screen printing process;

[0011] According to the alignment pattern printed on the first green ceramic tape, a positioning hole is punched on each green ceramic tape according to the target image;

[0012] Each positioning hole on each green ceramic tape is aligned, and each green ceramic tape is stacked to obtain an initial bar block;

[0013] The cavity part in the initial bar block is extruded out along the target cavity contour to obtain a first cavity-stacked bar block.

[0014] It can be understood that the application provides a method for manufacturing a cavity-stacked component. The method includes the following steps: a plurality of green ceramic tapes are provided; a plurality of positioning holes are punched on each green ceramic tape by laser punching technology to outline a target cavity contour without completely separating the cavity pattern from the green ceramic tape; a positioning hole punching device is used to punch a positioning hole on each green ceramic tape according to the alignment pattern printed on the first green ceramic tape to ensure that the positioning hole on each green ceramic tape is consistent with the target image; and after all the green ceramic tapes are stacked to form an initial bar block, the target cavity on the initial bar block is easily extruded out along the target cavity contour to obtain a first cavity-stacked bar block. The method for manufacturing the cavity-stacked component provided by the application is simple in process and can realize mass production. The cavity depth can be arbitrarily adjusted according to the number of stacked green ceramic tapes, and can be between 10 um and 10 mm. The cavity pattern can be arbitrarily set. The cavity bottom can be designed with a welding point, and each layer of green ceramic tape can be designed with a circuit pattern and a through hole connected to the upper and lower layers.

[0015] In an optional embodiment of the application, the method further includes the following process steps: static pressure, cutting, and sintering, to manufacture the first cavity-stacked component.

[0016] The cutting step is performed along the cutting line.

[0017] Specifically, a bottom plate is provided, the bottom plate is provided with a clamping hard block, and the contour of the clamping hard block is consistent with the contour of the target cavity corresponding to the first cavity-stacked bar block. The cavity of the first cavity-stacked bar block is clamped on the clamping hard block of the bottom plate. The cavity of the first cavity-stacked bar block is filled with hot melt adhesive. After vacuum packaging of the bottom plate and the first cavity-stacked bar block, the process steps of static pressure, cutting, and sintering are performed to manufacture the first cavity-stacked component.

[0018] In an optional embodiment of the application, a corresponding circuit is printed on each green ceramic tape by a screen printing process, including:

[0019] After the alignment structure on the printing screen is aligned with the alignment hole, a conductor paste is injected into the injection micro-hole to form a corresponding circuit on each green ceramic tape.

[0020] The conductor paste comprises silver glass powder containing silver ions. The silver glass powder is used as an inorganic binder. The silver in the silver glass powder exists in an ionic state at high temperatures and is better embedded in the ceramic surface to form a metal layer combined with the ceramic, thereby improving adhesion. The silver ions in the silver glass powder are between the glass and the metal layer, which plays a role of nucleating agent barrier, inhibits glass floating, and avoids affecting solderability.

[0021] The silver glass powder contains silver ions of different sizes. For example, a combination of silver powder, ultra-fine silver powder and flaky silver powder is used to further improve the density of the metal layer and improve the conductivity.

[0022] In an optional embodiment of the present application, the cavity part in the initial bar block is extruded out along the target cavity profile to obtain a first cavity-containing laminated bar block, comprising:

[0023] An extrusion plate is provided, and the extrusion plate is provided with an extrusion hard block, and the profile of the extrusion hard block is consistent with the target cavity profile;

[0024] The extrusion hard block is extruded in alignment with the target cavity profile on the initial bar block until the cavity part is extruded out to obtain a first cavity-containing laminated bar block.

[0025] It can be understood that, since the target cavity profile is outlined on each green ceramic tape in the initial bar block, the cavity part in the initial bar block can be easily removed by gently pressing the extrusion plate.

[0026] In a second aspect, the present application provides another method for manufacturing a cavity-containing laminated component, comprising:

[0027] The step of manufacturing the first cavity-containing laminated bar block is repeated to manufacture a second cavity-containing laminated bar block;

[0028] At least one cavity-free laminated bar block is provided;

[0029] The cavity-free laminated bar blocks are laminated to form an intermediate bar block;

[0030] The first cavity-containing laminated bar block and the second cavity-containing laminated bar block are respectively laminated on opposite surfaces of the intermediate bar block to form a first target bar block;

[0031] The first target bar block is subjected to process steps including static pressure, cutting and sintering to be manufactured into a first target cavity-containing laminated component.

[0032] It can be understood that the steps of repeatedly manufacturing the first cavity-containing laminated bar block, manufacturing a second cavity-containing laminated bar block, and sintering the first cavity-containing laminated bar block and the second cavity-containing laminated bar block on the two sides of the intermediate bar block can obtain a cavity-containing laminated component with double cavities. The cavity depth of each cavity in the double cavities can be adjusted by adjusting the number of green ceramic tapes of the corresponding cavity-containing laminated bar block.

[0033] For the sake of preparation, the target layering image used for manufacturing the second cavity-containing laminated bar block is the same as the target layering image used for manufacturing the first cavity-containing laminated bar block, so that the positions of the positioning holes are completely consistent, and the through holes and the circuit pattern of the first and second cavity-containing laminated bar blocks are connected.

[0034] The first target bar block is manufactured into a first target cavity-containing laminated component through process steps including static pressure, cutting and sintering, and the process steps include:

[0035] A bottom plate is provided, and the bottom plate is provided with a clamping hard block, and the contour of the clamping hard block is consistent with the contour of the target cavity corresponding to the second cavity-containing laminated bar block;

[0036] The cavity of the second cavity-containing laminated bar block of the first target bar block is clamped on the clamping hard block of the bottom plate;

[0037] The cavity of the first cavity-containing laminated bar block of the first target bar block is filled with hot melt adhesive;

[0038] After vacuum packaging the bottom plate and the first target bar block, the process steps including static pressure, cutting and sintering are performed to manufacture the first target cavity-containing laminated component.

[0039] In a third aspect, the application provides another method for manufacturing a cavity-containing laminated component, which includes:

[0040] The steps of manufacturing the first cavity-containing laminated bar block are repeated to manufacture a second cavity-containing laminated bar block and at least one third cavity-containing laminated bar block;

[0041] The third cavity-containing laminated bar block is laminated to form an intermediate bar block;

[0042] The first cavity-containing laminated bar block and the second cavity-containing laminated bar block are laminated on the opposite two surfaces of the intermediate bar block to form a second target bar block;

[0043] The second target bar block is manufactured into a second target cavity-containing laminated component through process steps including static pressure, cutting and sintering.

[0044] The target cavity profile corresponding to the third cavity-laminated block is different in size, position and / or shape from the target cavity profile corresponding to the first cavity-laminated block.

[0045] For example, the target cavity profile corresponding to the third cavity-laminated block can form a misaligned or overlaid relative relationship with the target cavity profile corresponding to the first cavity-laminated block.

[0046] For the sake of preparation convenience, the target layering image used in the manufacturing of the second and third cavity-laminated blocks is the same as the target layering image used in the manufacturing of the first cavity-laminated block.

[0047] In the optional embodiment of the present application, the second target block is manufactured into a second target cavity-laminated component through process steps including static pressure, cutting and sintering, comprising:

[0048] A bottom plate is provided, and the bottom plate is provided with a clamping hard block, and the profile of the clamping hard block is consistent with the target cavity profile corresponding to the second cavity-laminated block of the second target block;

[0049] The cavity of the second cavity-laminated block of the second target block is clamped on the clamping hard block of the bottom plate;

[0050] The cavity of the first cavity-laminated block of the second target block is filled with hot melt adhesive;

[0051] After vacuum packaging of the bottom plate and the second target block, process steps including static pressure, cutting and sintering are performed to manufacture the second target cavity-laminated component.

[0052] Advantages:

[0053] The present application provides a manufacturing method of a cavity-laminated component, which outlines a target cavity profile through laser punching technology to interval punch each green ceramic tape, without making the cavity pattern completely fall off from the green ceramic tape; a target layering image is determined according to a printed alignment pattern on the first green ceramic tape, and a positioning hole stamping device logs the target layering image to punch the positioning hole of each green ceramic tape, so as to ensure that the positioning hole on each green ceramic tape is consistent with the layering image; after laminating all green ceramic tapes to form an initial block, the target cavity on the initial block can be easily squeezed off along the target cavity profile to obtain a first cavity-laminated block.

[0054] The manufacturing method of the cavity-laminated component provided by the present application is relatively simple in process and can realize mass production; the cavity depth can be arbitrarily adjusted according to the number of laminated green ceramic tapes, and can be between 10 um and 10 mm; the cavity pattern can be arbitrarily set; the cavity bottom can be designed with a welding point, and each layer of green ceramic tape can be designed with a circuit pattern and a through hole connected upward and downward.

[0055] The corresponding circuit is printed on each green ceramic tape, including: making corresponding injection micro-holes on each green ceramic tape; injecting a conductor paste into the injection micro-holes to form the corresponding circuit of each green ceramic tape. The conductor paste includes silver glass powder containing silver ions. The silver glass powder is used as an inorganic binder, and the silver in the silver glass powder exists in an ionic state at high temperatures, better embedding in the ceramic surface to form a metal layer combined with the ceramic to improve adhesion. The silver ions in the silver glass powder are between the glass and the metal layer, playing a role of nucleating agent barrier to inhibit glass floating and avoid affecting the solderability. The silver glass powder contains silver ions of different sizes. For example, a combination of silver micro-powder, ultra-fine silver powder and flaky silver powder is used to further improve the density of the metal layer and improve the conductivity.

[0056] In addition, the step of making the first cavity-tape stacked bar block is repeated to make a second cavity-tape stacked bar block, and the first cavity-tape stacked bar block and the second cavity-tape stacked bar block are respectively stacked on both sides of the intermediate bar block for sintering, so that a cavity-tape stacked component with a double-sided cavity can be obtained. The cavity depth of each cavity in the double-sided cavity can be arbitrarily adjusted by adjusting the number of green ceramic tapes of the corresponding cavity-tape stacked bar block.

[0057] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the following optional embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0058] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0059] Figure 1 is a schematic diagram of the method for making the initial bar block provided by the present application;

[0060] Figure 2 is a schematic diagram of the method for making the first cavity-tape stacked bar block provided by the present application;

[0061] Figure 3 is a schematic diagram of the method for making the first target cavity-tape stacked component provided by the present application;

[0062] Figure 4 is a schematic diagram of the method for making the second target cavity-tape stacked component provided by the present application. DETAILED DESCRIPTION

[0063] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0064] In a first aspect, as shown in the drawings, Figures 1 to 2 The present application provides a manufacturing method of a cavity laminated component, which comprises the following steps:

[0065] S11, providing a plurality of green ceramic tapes 110 with the same size.

[0066] In the embodiments of the present application, the plurality of green ceramic tapes 110 with the same size can be obtained by casting and cutting. Generally, an LTCC manufacturer directly purchases materials from a green ceramic film manufacturer, but if the LTCC manufacturer has its own formula, it can develop and cast individual green ceramic film tapes by itself and wind them up for standby use. The film of the LTCC production equipment will be cut from a roll to a single piece, including cutting to the required size and punching a positioning hole for preliminary positioning, without a carrier tape or with a carrier tape.

[0067] S12, laser drilling on each green ceramic tape 110 according to a target cavity profile 111, and the pattern of the laser holes connected on each green ceramic tape 110 is the target cavity profile 111.

[0068] In the embodiments of the present application, the target cavity profile 111 is outlined by laser drilling on each green ceramic tape 110 at intervals, so that the cavity pattern is not completely separated from the green ceramic tape 110.

[0069] S13, manufacturing corresponding grouting micro-holes and positioning holes on each green ceramic tape, and printing corresponding circuits, positioning patterns and cutting lines on each green ceramic tape by a silk screen printing process.

[0070] In the optional embodiments of the present application, step S13 comprises:

[0071] After aligning the positioning structure on the printing silk screen with the positioning holes, a conductor paste is injected into the grouting micro-holes to form the corresponding circuits of each green ceramic tape 110.

[0072] Screen printing refers to using a silk screen as a plate base and making a silk screen printing plate with graphics by a photosensitive plate making method. Screen printing is composed of five elements, a silk screen printing plate, a squeegee, ink, a printing table and a printing substrate. It is printed by using the basic principle that the ink can pass through the screen holes of the graphic part of the silk screen printing plate and cannot pass through the screen holes of the non-graphic part. During printing, ink is poured into one end of the silk screen printing plate, a squeegee is used to apply pressure to the ink part of the silk screen printing plate, and at the same time, the squeegee is uniformly moved to the other end of the silk screen printing plate. The ink is squeezed out of the screen holes of the graphic part by the squeegee and is printed on the printing substrate.

[0073] In the formula, the conductor paste comprises silver glass powder containing silver ions. The silver glass powder is used as an inorganic binder. The silver in the silver glass powder exists in an ionic state at high temperatures, better embeds the ceramic surface, forms a metal layer combined with the ceramic, and improves the adhesion. The silver ions in the silver glass powder are between the glass and the metal layer, play a role of nucleating agent barrier, inhibit the glass floating, and avoid affecting the weldability.

[0074] In the formula, the silver glass powder contains silver ions of different sizes. For example, a combination of silver powder, ultra-fine silver powder and flaky silver powder is used to further improve the density of the metal layer and improve the conductivity.

[0075] S14. Determine a target layer image according to the printed circuit on the first green ceramic tape, and make positioning holes 130 on each green ceramic tape 110 according to the target layer image 120.

[0076] In the embodiments of the present application, the positioning holes 130 of each green ceramic tape 110 are made by the same layer image 120, so as to ensure that the positioning holes 130 on each green ceramic tape 110 are consistent with the layer image 120.

[0077] S15. Align each positioning hole 130 on each green ceramic tape 110, and stack each green ceramic tape 110 to obtain an initial bar block 140.

[0078] S16. Extrude the cavity part in the initial bar block 140 along the target cavity contour 111 to obtain a first cavity-stripped layer bar block 150.

[0079] In the optional embodiments of the present application, as shown in Figure 2 S16 step includes:

[0080] S161. Provide an extrusion plate 160, and the extrusion plate 160 is provided with an extrusion hard block 161. The contour of the extrusion hard block 161 is consistent with the target cavity contour 111.

[0081] S162. Align the extrusion hard block 161 with the target cavity contour 111 on the initial bar block 140 and extrude it until the cavity part 170 is extruded out to obtain the first cavity-stripped layer bar block 150.

[0082] It can be understood that, since each green ceramic tape 110 in the initial bar block 140 outlines the target cavity profile 111, the cavity part in the initial bar block 140 can be easily squeezed off by gently pressing the pressing plate 160.

[0083] It can be understood that the present application provides a method for manufacturing a cavity-laminated component, which outlines the target cavity profile 111 by laser drilling technology to make interval holes on each green ceramic tape 110, without making the cavity pattern completely fall off from the green ceramic tape 110; according to the printed alignment pattern on the first green ceramic tape, the positioning hole punching equipment punches the positioning hole of each green ceramic tape to ensure that the positioning hole 130 on each green ceramic tape is consistent with the target laminated image 120; after laminating all green ceramic tapes 110 to form an initial bar block 140, the target cavity on the initial bar block 140 can be easily squeezed off along the target cavity profile 111 to obtain a first cavity-laminated bar block 150. The method for manufacturing a cavity-laminated component provided by the present application has a relatively simple process and can realize mass production; the cavity depth can be arbitrarily adjusted according to the number of laminated green ceramic tapes 110, and can be between 10 um and 10 mm; the cavity pattern can be arbitrarily set; the cavity bottom can be designed with a soldering point, and each green ceramic tape 110 can be designed with a circuit pattern and a through hole connected to the upper and lower layers.

[0084] In an optional embodiment of the present application, the method further comprises: S17, performing process steps including static pressure, cutting, and sintering on the first cavity-laminated bar block 150 to manufacture a first cavity-laminated component.

[0085] Specifically, a bottom plate is provided, and the bottom plate is provided with a clamping hard block, and the profile of the clamping hard block is consistent with the target cavity profile 111 corresponding to the first cavity-laminated bar block 150; the cavity of the first cavity-laminated bar block 150 is clamped on the clamping hard block of the bottom plate; the cavity of the first cavity-laminated bar block 150 is filled with hot melt adhesive; after vacuum packaging the bottom plate and the first cavity-laminated bar block 150, process steps including static pressure, cutting, and sintering are performed to manufacture a first cavity-laminated component.

[0086] In a second aspect, as shown in Figure 3 the present application provides another method for manufacturing a cavity-laminated component, which comprises:

[0087] S21, repeating the step of manufacturing the first cavity-laminated bar block 210 to manufacture a second cavity-laminated bar block 220.

[0088] For the convenience of preparation, the target laminated image used when manufacturing the second cavity-laminated bar block is the same laminated image as that used when manufacturing the first cavity-laminated bar block.

[0089] S22, providing at least one cavity-free laminated bar block 230.

[0090] In the embodiment of the present application, a plurality of green ceramic tapes with the same size can be obtained by the method of casting and cutting; the corresponding circuit is printed on each green ceramic tape; and the plurality of green ceramic tapes are laminated to obtain the cavity-free laminated block 230.

[0091] S23, laminating the cavity-free laminated block 230 to form an intermediate block.

[0092] Figure 3 The intermediate block in the above embodiment only laminates one cavity-free laminated block 230, and in fact, two or more cavity-free laminated blocks 230 can be laminated.

[0093] S24, laminating the first cavity-containing laminated block 210 and the second cavity-containing laminated block 220 to opposite surfaces of the intermediate block to form a first target block 240.

[0094] S25, performing process steps including static pressure, cutting, and sintering on the first target block 240 to manufacture the first target cavity-containing laminated component.

[0095] It can be understood that the first cavity-containing laminated block 210 is repeatedly manufactured, the second cavity-containing laminated block 220 is manufactured, and the first cavity-containing laminated block 210 and the second cavity-containing laminated block 220 are laminated to the two sides of the intermediate block and sintered, so that a cavity-containing laminated component with double-sided cavities can be obtained. The cavity depth of each cavity in the double-sided cavities can be adjusted by adjusting the number of green ceramic tapes of the corresponding cavity-containing laminated block.

[0096] The step S25 includes:

[0097] S251, providing a bottom plate, and the bottom plate is provided with a clamping hard block, and the profile of the clamping hard block is consistent with the profile of the target cavity corresponding to the second cavity-containing laminated block 220;

[0098] S252, clamping the cavity of the second cavity-containing laminated block 220 of the first target block 240 on the clamping hard block of the bottom plate;

[0099] S253, coating the cavity of the first cavity-containing laminated block 210 of the first target block 240 with hot melt adhesive;

[0100] S254, after vacuum packaging the bottom plate and the first target block 240, performing process steps including static pressure, cutting, and sintering to manufacture the first target cavity-containing laminated component.

[0101] In a third aspect, as shown in Figure 4 The present application provides another method for manufacturing a cavity-containing laminated component, which includes:

[0102] S31, repeat the step of making the first cavity-containing stacked bar 310 to make a second cavity-containing stacked bar 320 and at least one third cavity-containing stacked bar 330.

[0103] For the sake of preparation convenience, the target layer stack image used in making the second and third cavity-containing stacked bars is the same as the target layer stack image used in making the first cavity-containing stacked bar.

[0104] S32, stack the third cavity-containing stacked bar 330 to form an intermediate bar.

[0105] Figure 4 The intermediate bar in the above embodiment only stacks one cavity-free stacked bar 230, and in fact, can stack two or more cavity-free stacked bars 230.

[0106] S33, stack the first cavity-containing stacked bar 310 and the second cavity-containing stacked bar 320 on opposite surfaces of the intermediate bar respectively to form a second target bar 340.

[0107] S34, perform process steps including static pressure, cutting, and sintering on the second target bar 340 to make it into a second target cavity-containing stacked component.

[0108] The target cavity profile corresponding to the third cavity-containing stacked bar 330 is different in size, position, and / or shape from the target cavity profile corresponding to the first cavity-containing stacked bar 310.

[0109] For example, the target cavity profile corresponding to the third cavity-containing stacked bar 330 can form a misaligned or overlapping relationship with the target cavity profile corresponding to the first cavity-containing stacked bar 310.

[0110] In an optional embodiment of the present application, the step S34 includes:

[0111] S341, provide a base plate, and the base plate is provided with a clamping hard block, and the profile of the clamping hard block is consistent with the target cavity profile corresponding to the second cavity-containing stacked bar 320;

[0112] S342, clamp the cavity of the second cavity-containing stacked bar 320 of the second target bar 340 on the clamping hard block of the base plate;

[0113] S343, fill the cavity of the first cavity-containing stacked bar 310 of the second target bar 340 with hot melt adhesive;

[0114] S344, after vacuum packaging the base plate and the second target bar 340, perform process steps including static pressure, cutting, and sintering to make it into a second target cavity-containing stacked component.

[0115] The expressions "first", "second", "the first", or "the second" used in various embodiments of the disclosure can modify various components regardless of order and / or importance, but the expressions do not limit the corresponding components. The above expressions are configured only for the purpose of distinguishing the elements from other elements. For example, the first user device and the second user device represent different user devices, although both are user devices. For example, without departing from the scope of the disclosure, a first element can be called a second element, and similarly, a second element can be called a first element.

[0116] When an element (e.g., a first element) is referred to as being "(operatively or communicatively) coupled with / to" or "connected to" another element (e.g., a second element), it should be understood that the one element is directly connected to the other element or the one element is indirectly connected to the other element via yet another element (e.g., a third element). In contrast, it will be understood that an element (e.g., a first element) is "directly connected to" or "directly coupled with / to" another element (e.g., a second element) when the two elements are connected to each other without intervention of a third element.

[0117] It should be noted that, in this document, the terms "comprise", "comprising", or any other variant thereof are intended to cover non-exclusive inclusions, such that processes, methods, articles, or apparatuses that comprise a list of elements do not only include those elements, but also include other elements not expressly listed, or other elements inherent to such processes, methods, articles, or apparatuses. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element, and furthermore, components, features, elements with the same name in different embodiments of the present application can have the same meaning or different meanings, and the specific meaning thereof should be determined in the interpretation of the specific embodiment or further in conjunction with the context of the specific embodiment.

[0118] The above description is only optional embodiments of the present application and an explanation of the technical principles applied. Those skilled in the art should understand that the scope of the application involved in the present application is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above inventive concept. For example, the above features are replaced with each other to form technical solutions with similar functions disclosed in the present application (but not limited to).

[0119] Depending on the context, the words “if” or “suppose” as used here can be interpreted as “when” or “in response to determination” or “in response to detection.” Similarly, depending on the context, the phrases “if determination” or “if detection (of the stated condition or event)” can be interpreted as “when determination” or “in response to determination” or “when detection (of the stated condition or event)” or “in response to detection (of the stated condition or event).”

[0120] The above description is merely an optional embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in this application.

[0121] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for fabricating a cavity-mounted multilayer component, characterized in that, The method comprises the following steps: providing a plurality of green ceramic tapes with the same size; printing corresponding circuits on each of the green ceramic tapes; laser drilling on each of the green ceramic tapes according to a target cavity profile, and the pattern of the laser holes on each of the green ceramic tapes is the target cavity profile; making positioning holes on each of the green ceramic tapes according to the same layering image; aligning each of the positioning holes on each of the green ceramic tapes, and layering each of the green ceramic tapes to obtain an initial bar block; extruding a cavity part in the initial bar block along the target cavity profile to obtain a first bar cavity layering bar block.

2. The method according to claim 1, wherein the method further comprises: performing process steps including static pressure, cutting and sintering on the first bar cavity layering bar block to manufacture a first bar cavity layering component.

3. The method according to claim 1, wherein the printing of the corresponding circuits on each of the green ceramic tapes comprises: making corresponding grouting micro-holes on each of the green ceramic tapes; injecting conductor paste into the grouting micro-holes to form the corresponding circuits of each of the green ceramic tapes.

4. The method according to claim 3, wherein the conductor paste comprises silver glass powder containing silver ions.

5. The method according to claim 4, wherein the silver glass powder contains silver ions with different sizes.

6. The method according to claim 1, wherein the extruding of the cavity part in the initial bar block along the target cavity profile to obtain the first bar cavity layering bar block comprises: providing an extrusion plate provided with an extrusion hard block, wherein the profile of the extrusion hard block is consistent with the target cavity profile; aligning the extrusion hard block with the target cavity profile on the initial bar block and extruding until the cavity part is extruded out to obtain the first bar cavity layering bar block.

7. The method according to claim 1, wherein the steps of manufacturing the first bar cavity layering bar block are repeated to manufacture a second bar cavity layering bar block; providing at least one cavity-free layering bar block; layering the cavity-free layering bar block to form an intermediate bar block; layering the first bar cavity layering bar block and the second bar cavity layering bar block on opposite surfaces of the intermediate bar block respectively to form a first target bar block; and performing process steps including static pressure, cutting and sintering on the first target bar block to manufacture a first target bar cavity layering component.

8. The method according to claim 1, wherein the steps of manufacturing the first bar cavity layering bar block are repeated to manufacture a second bar cavity layering bar block and at least one third bar cavity layering bar block; layering the third bar cavity layering bar block to form an intermediate bar block; layering the first bar cavity layering bar block and the second bar cavity layering bar block on opposite surfaces of the intermediate bar block respectively to form a second target bar block; and ​ ​ ​ ​ ​ ​ ​ The second target bar block is processed by steps of static pressure, cutting and sintering to form a second target band cavity laminated component.

9. The method of claim 8, wherein the third band cavity laminated bar block has a target cavity profile different from the target cavity profile of the first band cavity laminated bar block in size, position and / or shape.

10. The method of claim 7, wherein the first target bar block is processed by steps of static pressure, cutting and sintering to form a first target band cavity laminated component, comprising: providing a base plate with a clamping hard block, the clamping hard block having a profile identical to the target cavity profile of the second band cavity laminated bar block; clamping the cavity of the second band cavity laminated bar block of the first target bar block on the clamping hard block of the base plate; filling the cavity of the first band cavity laminated bar block of the first target bar block with hot melt adhesive; after vacuum packaging the base plate and the first target bar block, processing by steps of static pressure, cutting and sintering to form the first target band cavity laminated component.

11. The method of claim 8, wherein the second target bar block is processed by steps of static pressure, cutting and sintering to form a second target band cavity laminated component, comprising: providing a base plate with a clamping hard block, the clamping hard block having a profile identical to the target cavity profile of the second band cavity laminated bar block; clamping the cavity of the second band cavity laminated bar block of the second target bar block on the clamping hard block of the base plate; filling the cavity of the first band cavity laminated bar block of the second target bar block with hot melt adhesive; after vacuum packaging the base plate and the second target bar block, processing by steps of static pressure, cutting and sintering to form the second target band cavity laminated component. ​ ​ ​

Citation Information

Patent Citations

  • Method for preparing low temperature co-fired ceramic substrate cavity structure

    CN107591336A

  • Method for manufacturing multilayer ceramic substrate with cavity

    JP2003318309A