Cooling device for cooling electronic components of automobile and method for manufacturing the same

Abstract

The present invention relates to a cooling device (10) for cooling an electronic component (12) of a vehicle, comprising: a plate-shaped cooling channel cover (14), on the first side (141) of which an electronic component is fixed at a cooling position (143), and on the second side (142) a turbulence pad (18) is fixed in a material-bonded manner in the region of the cooling position, and a coolant guide housing (20), wherein an inlet channel (201) and an outlet channel (202) are provided, and the cover plate (16) of the coolant guide housing has a turbulence pad receiving recess (24), in which the turbulence pad is embedded. The present invention is characterized in that one side of the turbulence pad is laser welded to the cooling channel cover, and the turbulence pad extends into the turbulence pad receiving recess without forming a material-bonded connection with the bottom of the turbulence pad receiving recess, wherein the cooling channel cover is laser welded to the cover plate of the coolant guide housing on the periphery of its second side. The present invention also relates to a method for manufacturing such a cooling device.

Description

Technical Field

[0001] The present invention relates to a cooling device for cooling electronic components of an automobile, the cooling device comprising:

[0002] a plate-shaped cooling channel cover, on a first side of which the electronic component to be cooled is fixed in thermal contact at a cooling point, and on a second side of which, lying opposite the first side, a turbulence mat is fixed in a materially bonded manner in the region of the cooling point,

[0003] - and a coolant guide housing, wherein an inlet channel and an outlet channel for coolant to flow through are provided, and a cover plate of the coolant guide housing which is fluid-tightly connected to the second side of the cooling channel cover has a turbulence pad receiving recess constituting the cooling channel, the turbulence pad receiving recess being fluidly connected to the inlet channel via a coolant inlet and fluidly connected to the outlet channel via a coolant outlet, and the turbulence pad is embedded in the turbulence pad receiving recess.

[0004] The invention also relates to a method for manufacturing a cooling device for cooling electronic components of a vehicle, comprising the following steps:

[0005] - providing a plate-shaped cooling channel cover, on a first side of which the electronic components to be cooled are fastened in thermal contact at cooling locations,

[0006] - Turbulence pads are provided,

[0007] - providing a coolant-conducting housing which is open on the cover side and in which supply channels and discharge channels are arranged through which the coolant can flow,

[0008] - providing a cover plate for the coolant-conducting housing, the cover plate having a turbulence pad receiving recess forming a cooling channel with a coolant inlet for flow connection with the supply channel and a coolant outlet for flow connection with the discharge channel,

[0009] A turbulence mat is fixed in a materially bonded manner on a second side of the cooling channel cover, which is opposite the first side, in the region of the cooling point. Background Art

[0010] Such a cooling device and such a production method are described in German patent application DE 10 2020 207 966.8, which was not yet published at the date of filing of the present application.

[0011] Higher powers are handled in power electronics of automobiles, especially pure electric or hybrid electric vehicles. Electronic components used for this purpose, such as so-called power modules IGBT, require coolers to dissipate the generated heat. Such electronic components are usually equipped with cooling structures, such as labyrinth-like cooling fins, which are surrounded by a common liquid coolant. These cooling structures can be arranged directly on the electronic components and protrude into the coolant channels (hereinafter referred to as cooling channels). However, it is also known that the electronic components are connected in a planar manner to a plate covering the cooling channel opening and the cooling structures are arranged on the opposite side of the plate-shaped cooling channel cover facing the channel.

[0012] From the patent application mentioned above, a cooling device for cooling the electronic components of a car having such a plate-shaped cooling channel cover is known, wherein the electronic components to be cooled are fixed, in particular welded or sintered, and are in thermal contact at multiple positions or points on the first side of the cooling channel cover, which are respectively referred to as cooling positions here. On the second side of the cooling channel cover opposite to the first side, a turbulence pad is welded in the area of ​​each cooling position. The turbulence pad should be understood here as any planar expansion and a structure that can allow the coolant to flow turbulently parallel to the expansion surface and excite the coolant fluid into turbulence. In general applications, the preferred embodiment of such a turbulence pad is also described in the context of the present application as an arrangement of corrugated sheet strips connected based on wave periods with phase shifts.

[0013] The second side of the cooling channel cover is welded to the cover plate of the coolant guide housing in a fluid-tight manner, and the coolant guide housing is provided with an inlet channel for coolant to flow through and an outlet channel for coolant to flow through inside. The cover plate of the coolant guide housing has a recess at the location of the turbulence pad, which is referred to as a turbulence pad receiving recess, which is used to form a cooling channel defined at the cooling position between the coolant guide housing, the cooling channel cover, and the turbulence pad receiving portion. The turbulence pads embedded in the receiving recess are respectively welded to the bottom of the turbulence pad receiving recess on their bottom sides facing away from the cooling channel cover.

[0014] The coolant can reach the cooling channel from the interior of the coolant-conducting housing through a coolant inlet (which is fluidically connected to the feed channel). The coolant can return from the cooling channel to the interior of the coolant housing through a coolant outlet fluidically connected to the discharge channel.

[0015] To produce this known device, the electronic components are first soldered or sintered to the cooling channel cover, which is then soldered to the turbulence pad and the cover of the coolant guide housing, as described above. The rest of the coolant guide housing is then fastened to its cover.

[0016] A disadvantage of this known device is that the welded connections between the turbulence pad and the cooling channel cover, the welded connections between the turbulence pad and the cover plate of the coolant guide housing and the full-surface welded connections between the cooling channel cover and the cover plate of the coolant guide housing formed outside the cooling position (at least in the case of melt welding) require additional layers of solder. This is not only disadvantageous in terms of cost and production. The additional layers also increase the thickness of the cooling channel cover in the area of ​​the cooling position, making it more difficult to cool the electronic components. In addition, the welded connections are generally not very robust to mechanical influences and high temperatures, so that relatively large surfaces must be bonded together to achieve sufficient mechanical stability of the cooling device, which makes the production of the cooling device particularly complicated. Summary of the invention

[0017] The technical problem to be solved by the present invention is to provide a low-cost, easy-to-produce cooling device which can cool electronic components particularly effectively, and to provide a cooling method.

[0018] The technical problem is solved by a cooling device for cooling electronic components of a motor vehicle, namely, a turbulence pad is laser welded to a cooling channel cover on one side, and the turbulence pad extends into the turbulence pad receiving recess without forming a material connection with the bottom of the turbulence pad receiving recess, wherein the cooling channel cover is laser welded to a cover plate of a coolant guide housing on its second side periphery.

[0019] The technical problem is also solved by a method for manufacturing a cooling device for cooling electronic components of a vehicle, namely, a turbulence pad is fixed to a cooling channel cover by means of laser welding in a material-joined manner, and the cover plate is fixed to the coolant guide housing in a manner that closes the coolant guide housing on the cover side, and then the cooling channel cover is placed on the cover plate of the coolant guide housing in such a way that the turbulence pad fixed to the cooling channel cover extends into the turbulence pad receiving recess without forming a material-joined connection with the bottom of the turbulence pad receiving recess, whereby the cooling channel cover is fluid-tightly connected to the cover plate of the coolant guide housing on the periphery of its second side by means of laser welding.

[0020] In the cooling device according to the invention or in the manufacturing method according to the invention, both the turbulence pad and the cover plate of the coolant-conducting housing are laser welded to the cooling channel cover. The use of laser welding technology allows the use of slim cooling structures, such as the preferred embodiment of the turbulence pad, and the use of thin-walled plates for the cooling channel cover and / or the cover plate of the coolant-conducting housing. The use of such thin-walled plates as a layer between the electronic components that generate waste heat and the cooling channels that conduct the coolant allows the electronic components to be cooled more effectively, because more heat is transferred from the electronic components to the coolant through the thin-walled layer.

[0021] Furthermore, it is provided according to the invention that the turbulence pad is surrounded by a cooling channel wall formed by a cooling channel cover and the side walls and the bottom of the turbulence pad receiving recess, and that the turbulence pad is connected to the cooling channel wall only on one side. More precisely, the turbulence pad is laser welded only to the cooling channel cover, and there is no material connection between it and the bottom of the turbulence pad receiving recess. It has been found that a unilateral fastening of the turbulence pad to the side carrying the electronic power component is sufficient to ensure adequate mechanical stability of the cooling device.

[0022] In fact, according to the invention, the turbulence mat is first fixed on one side to the cooling channel cover carrying the electronic components, and on the other side the coolant guide housing is connected to its cover plate, after which the two parts are combined, which allows the cooling channel cover to be simply placed on the cover plate and laser welded on its periphery for the final connection of the components. The manufacturing process for the cooling device according to the invention is therefore particularly simple. In addition, as mentioned above, the laser welding technology is used multiple times, namely both for fixing the turbulence mat and for fixing the cover plate of the coolant guide housing to the cooling channel cover. This saves machine changes.

[0023] Furthermore, it is advantageous that the temperature-sensitive electronic components which have been fixed to the cooling channel cover during the laser welding step do not suffer any damage due to the use of a highly localized thermal joining method such as laser welding.

[0024] For convenience, a turbulence pad is used, which is sized so that it rests on the bottom of the turbulence pad receiving recess after the cooling channel cover is placed on the cover plate. In the completed cooling device, the turbulence pad also rests ideally on the bottom of the turbulence pad receiving recess. This means that there is no free space between the bottom of the turbulence pad and the bottom of the turbulence pad receiving recess. This ensures that all coolant passing through the cooling channel flows through the structure of the turbulence pad. In this way, the time required for the coolant to enter the cooling channel through the coolant inlet until it flows out again through the coolant outlet is maximized, so that more heat is absorbed per unit coolant volume. Therefore, the heat absorption of the coolant is more effective than the case where the turbulence pad is spaced from the bottom of the receiving recess and part of the coolant will flow along the bottom of the receiving recess (the coolant will not flow through the turbulence pad, be converted into turbulence by the turbulence pad and absorb the waste heat of the electronic components there). However, in most cases, a small gap between the turbulence pad and the bottom of the turbulence pad receiving recess is harmless.

[0025] In an improved design of the present invention, the cooling channel cover is additionally connected to the cover plate of the coolant guide housing in a point-shaped material connection at a material connection position, which is arranged on the second side of the cooling channel cover, spaced from its outer edge and arranged outside the cooling position. The cooling channel cover is connected to the cover plate of the coolant guide housing in a material connection not only through the periphery of its second side, but also through the material connection position. The material connection position is located on the second side of the cooling channel cover, but not on its outer edge, nor on the cooling position where the turbulent pad is fixed. The additional material connection of the cooling channel cover and the cover plate of the coolant guide housing gives the entire cooling device a higher mechanical stability. In particular, more coolant can pass through the cooling channel in a shorter time, and the higher pressure generated in the cooling channel will not squeeze the cooling channel cover and the cover plate of the coolant guide housing away from each other, and allow the coolant to penetrate into the free space between the cooling channel cover and the cover plate. It has been found that if there is an additional material connection selectively, that is, at several separate connection points, it is sufficient to achieve the advantages. This embodiment is therefore particularly economical since no full-surface material-bonded connection is required between the cooling channel cover and the cover plate of the coolant-conducting housing.

[0026] The cooling channel cover is preferably welded, in particular laser welded, to the cover of the coolant-conducting housing at a material-joined connection point. Compared to other material-joined connections, such as adhesive connections and soldered connections, a welded connection has the advantage that it is particularly strong against mechanical influences and high temperatures. Therefore, as described above, the welded connection can also withstand higher pressures in the cooling channel. The welded connection is also suitable for cooling devices of electronic components with relatively high heat losses. This is because the welded connection can also withstand higher waste heat, which can reach the material-joined connection point by heat conduction through the cooling channel cover.

[0027] More preferably, the material joining connection location is configured as a through hole on the cooling channel cover, and the cooling channel cover is fusion-welded to the cover plate of the coolant-conducting housing at the inner periphery of the through hole, in particular laser welded. The through hole is a through opening in the cooling channel cover, so that after the cooling channel cover is placed on the cover plate, the surface of the cover plate is visible at the material joining connection location and can be touched by the laser welding beam. Therefore, these through holes enable simple, highly localized laser welding of the cooling channel cover and the cover plate at the material joining connection location, wherein the weld seam is formed only on the inner periphery of the through hole. Laser welding is particularly advantageous because, compared with other welding, very thin-walled sheets can be used for the cooling channel cover and / or the cover plate of the coolant-conducting housing. As mentioned above, this improves the cooling of the electronic components. In addition, laser welding is the result of a highly localized heat input, which is why this type of connection is particularly gentle for heat-sensitive electronic components fixed to the cooling channel cover. Finally, the effort and costs of the manufacturing process are reduced since the laser welding technology is always available since it is already used to secure the turbulence mat to the cooling channel cover by material bonding and to secure the cover plate of the coolant-conducting housing at its periphery to the cooling channel cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Further details and advantages of the present invention are obtained from the following detailed description and the accompanying drawings. In the accompanying drawings:

[0029] Figure 1 A perspective view showing a cooling channel cover with an electronic board fixed thereto,

[0030] Figure 2 A perspective view showing a turbulence pad,

[0031] Figure 3a A perspective view of a coolant guide housing with a cover plate fastened to the coolant guide housing is shown,

[0032] Figure 3b Show Figure 3a Cross-sectional view of the coolant guide housing,

[0033] Figure 4 Show Figure 2 The turbulence pad shown is Figure 1 The laser welding on the second side of the cooling channel cover is shown,

[0034] Figure 5 Show Figure 4 The cooling channel cover shown is placed on Figure 3a The cover of the coolant guide housing is shown.

[0035] Figure 6 Shows the cooling channel cover with Figure 5 The cover of the coolant guide housing is laser welded on its periphery, and

[0036] Figure 7 Shows the cooling channel cover with Figure 6 Laser welding of the cover of the coolant-conducting housing at the material-joined connection location forming the through-opening.

[0037] The same reference numbers in the drawings indicate the same or similar elements. DETAILED DESCRIPTION

[0038] Figure 1 A three-dimensional view of a plate-shaped cooling channel cover 14 suitable for preparing a cooling device according to the present invention is shown, on whose first side 141 three electronic components 12 spaced apart from each other have been fixed in thermal contact. An aluminum plate with a copper coating is used as the cooling channel cover 14, on which the electronic components 12 are fixed by sintering (in particular, silver sintering using sintered silver paste at 250° C. and 20 MPa). The position where the electronic component 12 is fixed defines the cooling position 143 of the cooling device. In order to prepare the cooling device according to the present invention, such a cooling channel cover 14 is provided in the first step. The specific connection technology for connecting the electronic component 12 to the cooling channel cover 14 is not the focus in the scope of the present invention. However, good thermal contact should be established between the electronic component 12 and the cooling channel cover 14 in any case.

[0039] exist Figure 2 1 and 2 also show a turbulence mat 18 provided for producing a cooling device according to the invention. The turbulence mat 18 is designed as an array of corrugated strips which are connected to one another with a phase shift relative to the wave period.

[0040] Figure 3a and Figure 3b A coolant guide housing 20 suitable for preparing the cooling device according to the invention is shown, to which the cover plate 16 has been fixed in such a way as to close the coolant guide housing 20. Three turbulence pad receiving recesses 24 can be seen in the cover plate 16, which can receive turbulence pads (not numbered) and form cooling channels 22. In the central area of ​​the bottom of each turbulence pad receiving recess 24, a coolant inlet 241 is provided, through which coolant can flow from an inlet channel 201 arranged in the coolant guide housing 20 into the turbulence pad receiving recess 24 and thus into the cooling channel 22. During operation, this coolant then flows through the turbulence pad and leaves the turbulence pad receiving recess 24 through a coolant outlet 242, which is formed here as the open side of the turbulence pad receiving recess 24, and thus enters the discharge channel 202 arranged in the coolant guide housing 20. Preferably, the cover plate 16 is made of a thin-walled aluminum sheet, which is connected to the coolant guide housing 20, which is preferably also made of aluminum, by brazing (or brazing) at 600° C. The coolant guide housing 20 in combination with the cover plate 16 can therefore be produced from a small number of inexpensive individual components.

[0041] exist Figure 4 The steps for preparing the cooling device according to the present invention are shown in FIG. Figure 2 The turbulence pad 18 is fixed to the Figure 1 The turbulence pad 18 is shown on the second side 142 of the cooling channel cover 14. For this purpose, the turbulence pad 18 is placed on the cooling position 143 of the second side 142 of the cooling channel cover 14. The bottom surface of the trough of the turbulence pad 18 is in contact with the second side 142 of the cooling channel cover 14. The turbulence pad 18 is fixed to the cooling channel cover 14 by highly locally melting the contact points with the aid of a laser beam, so that a material-bonded connection between the two components is produced after cooling.

[0042] Figure 5 Show Figure 4 The cooling channel cover 14 is shown arranged on Figure 3a The cooling channel cover 14 is mounted with its second side 142 on the cover 16 of the coolant guide housing 20 in such a way that the turbulence pads 18 fixed to the cooling channel cover 14 protrude into the corresponding turbulence pad receiving recesses 24. In order to achieve an optimal cooling effect, the turbulence pads 18 are ideally dimensioned so that when the cooling channel cover 14 is mounted on the cover 16, the turbulence pads 18 rest on the bottom of their respective corresponding turbulence pad receiving recesses 24. There is no material connection between the turbulence pads 18 and the bottom 243 of the turbulence pad receiving recesses 24, because even if the turbulence pads 18 are fixed on one side to the hot side, sufficient mechanical stability of the cooling device is achieved.

[0043] exist Figure 6 The cooling channel cover 14 and Figure 5 The cover plate 16 of the coolant-conducting housing 20 is laser welded on its periphery. As a result, a fluid-tight connection is created between the cooling channel cover 14 and the cover plate 16 .

[0044] Figure 7 Finally, an optional but preferred production step is shown, in which the cooling channel cover 14 is welded, in particular laser welded, to the cover plate 16 of the coolant-conducting housing 20 at the material-joined connection points 26 in addition to the material-joined connection on the periphery. This provides the entire cooling device 10 with a higher mechanical stability. The material-joined connection points 26, which are designed as through holes, are spaced apart from the outer edge of the cooling channel cover 14 and are located outside the cooling points 143, on which the electronic components 12 are arranged. The through holes are laser welded to the cover plate 16 on their inner periphery 261, forming a fine weld seam. The connection of the components by laser welding allows the use of thin-walled sheet metal for the cooling channel cover 14 and the cover plate 16 of the coolant-conducting housing 20, so that a cooling device 10 with an improved cooling effect is obtained.

[0045] In general, the method according to the invention for producing the cooling device 10 according to the invention is a particularly easy to implement, inexpensive method, wherein the heat-sensitive electronic components 12 fixed to the cooling channel cover 14 are protected from heat-related damage due to the highly localized effect of the laser welding. At the same time, the laser welded connection points are particularly durable with respect to high temperatures and mechanical influences. Of course, the embodiments discussed in the detailed description and the embodiments shown in the figures represent only illustrative embodiments of the invention. A person skilled in the art will be able to obtain a wide range of variants under the guidance of the disclosure herein.

[0046] List of Reference Numerals

[0047] 10 Cooling device

[0048] 12 Electronic components

[0049] 14 Cooling channel cover

[0050] 141 first side surface of cooling channel cover 14

[0051] 142 second side of cooling channel cover 14

[0052] 143 Cooling position

[0053] 16 Cover

[0054] 18 Turbulence Pad

[0055] 20 Cooler guide housing

[0056] 201 input channels

[0057] 202 Exhaust channel

[0058] 22 Cooling channels

[0059] 24 Turbulence pad receiving recess

[0060] 241 Coolant inlet

[0061] 242 Coolant outlet

[0062] 243 The bottom of the turbulence pad receiving recess 24

[0063] 26 Material joint connection position

[0064] 261 Material bonding connection location 26 inner periphery

Claims

1. A cooling device (10) for cooling an electronic component (12) of a vehicle, the cooling device comprising: - a plate-shaped cooling channel cover (14), on a first side (141) of which an electronic component (12) to be cooled is fixed in thermal contact at a cooling point (143), and on a second side (142) of which, opposite the first side (141), a turbulence mat (18) is fixed in a materially bonded manner in the region of the cooling point (143), - and a coolant guide housing (20), in which an inlet channel (201) and an outlet channel (202) through which coolant can flow are arranged, a cover plate (16) of the coolant guide housing connected to the second side (142) of the cooling channel cover (14) in a fluid-tight manner has a turbulence pad receiving recess (24) forming the cooling channel (22), the turbulence pad receiving recess is fluidically connected to the inlet channel (201) via a coolant inlet (241) and fluidically connected to the outlet channel (202) via a coolant outlet (242), and the turbulence pad (18) is embedded in the turbulence pad receiving recess, The invention is characterized in that one side of the turbulence pad (18) is laser welded to the cooling channel cover (14), and the turbulence pad (18) extends into the turbulence pad receiving recess (24) without forming a material connection with the bottom of the turbulence pad receiving recess (24), wherein the cooling channel cover (14) is laser welded to the cover plate (16) of the coolant guide housing (20) on the periphery of its second side (142).

2. The cooling device (10) according to claim 1, It is characterized in that The turbulence pad (18) rests on the bottom (243) of the turbulence pad receiving recess (24).

3. The cooling device (10) according to any one of the preceding claims, It is characterized in that The cooling channel cover (14) has a material connection point (26) on its second side (142) at a distance from its outer edge and outside the cooling point (143), at which the cooling channel cover (14) is additionally connected to the cover plate (16) of the coolant guide housing (20) in a point-shaped material connection.

4. The cooling device (10) according to claim 3, It is characterized in that The cooling channel cover (14) is welded to a cover plate (16) of a coolant-conducting housing (20) at a material-bonded connection point (26).

5. The cooling device (10) according to claim 4, It is characterized in that The cooling channel cover (14) is laser welded to a cover plate (16) of a coolant-conducting housing (20) at a material-bonded connection point (26).

6. The cooling device (10) according to claim 4, It is characterized in that The integrally bonded connection point (26) is designed as a through hole in the cooling channel cover (14), and the cooling channel cover (14) is welded to the cover plate (16) of the coolant guide housing (20) at the inner circumference (261) of the through hole.

7. The cooling device (10) according to claim 6, It is characterized in that The cooling channel cover (14) and the cover plate (16) of the coolant guide housing (20) are laser welded at the inner periphery (261) of the through hole.

8. A method for manufacturing a cooling device (10) for cooling an electronic component (12) of an automobile, the method comprising the following steps: - providing a plate-shaped cooling channel cover (14), on a first side (141) of which the electronic component (12) to be cooled is fixed in thermal contact at a cooling point (143), - providing a turbulence pad (18), - providing a coolant guide housing (20) which is open on the cover side, in which an inlet channel (201) and an outlet channel (202) through which the coolant can flow are arranged, - providing a cover plate (16) for a coolant guide housing (20), said cover plate having a turbulence pad receiving recess (24) forming a cooling channel (22) with a coolant inlet (241) for flow connection with the inlet channel (201) and a coolant outlet (242) for flow connection with the outlet channel (202), - fastening the turbulence mat (18) in a materially bonded manner to a second side (142) of the cooling channel cover (14) which is opposite the first side (141) in the region of the cooling point (143), It is characterized in that The turbulence pad (18) is fixed to the cooling channel cover (14) by means of laser welding in a material-joined manner, and the cover plate (16) is fixed to the coolant guide housing (20) in a manner that closes the coolant guide housing (20) on the cover side. The cooling channel cover (14) is then placed on the cover plate (16) of the coolant guide housing (20) so that the turbulence pad (18) fixed to the cooling channel cover (14) extends into the turbulence pad receiving recess (24) without forming a material-joined connection with the bottom of the turbulence pad receiving recess (24). Subsequently, the cooling channel cover (14) is connected to the cover plate (16) of the coolant guide housing (20) in a fluid-tight manner on the periphery of its second side (142) by means of laser welding.

9. The method according to claim 8, It is characterized in that A turbulence mat (18) is used, which is dimensioned such that the turbulence mat (18) abuts against a bottom (243) of a turbulence mat receiving recess (24) after the cooling channel cover (14) is placed on the cover plate (16).

10. The method according to claim 8 or 9, It is characterized in that The cooling channel cover (14) is additionally connected to the cover plate (16) of the coolant guide housing (20) in a point-shaped material connection at a material connection point (26), which is arranged on a second side (142) of the cooling channel cover (14) at a distance from its outer edge and outside the cooling point (143).

11. The method according to claim 10, It is characterized in that The cooling channel cover (14) is welded to a cover plate (16) of a coolant-conducting housing (20) at a material-bonded connection point (26).

12. The method according to claim 11, It is characterized in that The cooling channel cover (14) is laser welded to a cover plate (16) of a coolant-conducting housing (20) at a material-bonded connection point (26).

13. The method according to claim 11, It is characterized in that The cooling channel cover (14) has a materially bonded connection point (26) configured as a through hole, and the cooling channel cover (14) is welded to a cover plate (16) of a coolant guide housing (20) at the inner circumference (261) of the through hole.

14. The method according to claim 13, It is characterized in that The cooling channel cover (14) and the cover plate (16) of the coolant guide housing (20) are laser welded at the inner periphery (261) of the through hole.

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