Assembly system and assembly method of micro-hemispherical gyroscope curved surface electrode

Abstract

The invention discloses an assembly system and an assembly method of a micro-hemispherical gyroscope curved surface electrode, wherein the assembly system comprises an assembly platform, a six-degree-of-freedom vacuum adsorption displacement device, an imaging camera and a control unit; the assembly platform is horizontally arranged and made of a transparent material; the imaging camera is arranged below the assembly platform and is used to collect images of a micro-hemispherical resonator and a micro-hemispherical curved surface electrode; the six-degree-of-freedom vacuum adsorption displacement device and the imaging camera are respectively connected to the control unit, and the control unit judges the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode by acquiring images of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, so as to control the six-degree-of-freedom vacuum adsorption displacement device to adjust the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, so as to complete the assembly of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode. The assembly system can effectively ensure the coaxiality of the assembly of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode and the uniformity of the electrode gap.

Description

Technical Field

[0001] The invention belongs to the technical field of micro-electromechanical system micro-assembly, and in particular relates to an assembly system and an assembly method for a micro-hemispherical gyroscope curved surface electrode. Background Art

[0002] The hemispherical gyroscope is a new type of solid-state gyroscope with high precision, high reliability and long life. It is a Coriolis vibrating gyroscope that uses the precession effect of the vibration standing wave on the lip of the hemispherical shell to sense the rotation of the base. It has the advantages of high measurement accuracy, strong stability, good reliability and long service life. It is widely used in aviation, aerospace, shipbuilding and other fields. However, the traditional hemispherical gyroscope resonator is obtained by mechanical processing of quartz glass, which has a long processing cycle and high cost. With the development of existing MEMS technology, some research institutions have begun to study micro-hemispherical gyroscopes. Based on materials such as polysilicon, polycrystalline diamond, borosilicate glass, and fused quartz glass, different types of micro-hemispherical gyroscopes have been prepared, which have the characteristics of small size, low cost and excellent performance.

[0003] The main components of the micro-hemispherical gyroscope are the resonator and the electrode. There is a uniform gap between the resonator and the electrode. The gap constitutes a capacitor to apply electrostatic excitation, that is, the electric field of the capacitor changes with the alternating voltage to excite the resonator to vibrate. At the same time, it also has the function of capacitance detection, and the vibration amplitude and phase change can be obtained according to the capacitance change. According to the above values, the external motion information, including the rotation angle or angular velocity, can be inferred.

[0004] At present, micro-hemispherical gyroscopes mainly use planar electrodes or radial electrode structures. Gyroscopes using planar electrodes are easy to obtain small and uniform capacitance gaps, but the capacitance area of ​​this structure is small, resulting in low circuit excitation efficiency and detection efficiency. Radial electrodes include curved electrodes, spherical electrodes, cylindrical electrodes, etc. The capacitance area of ​​radial electrodes is larger than that of planar electrodes, and they have the advantages of higher excitation and detection efficiency.

[0005] Chinese patent CN202111340195.0 discloses a micro-hemispherical gyroscope structure with a curved electrode and a preparation method thereof, and specifically discloses its micro-hemispherical gyroscope structure, such as Figure 1As shown, it includes a micro-hemispherical resonator 1 and a micro-hemispherical curved surface electrode 3. A resonator anchor point 2 is set at the center of the micro-hemispherical resonator 1, and a curved surface electrode anchor point 4 is set at the center of the micro-hemispherical curved surface electrode 3; a micro-hemispherical resonator outer edge reference plane 5 is set at the edge of the micro-hemispherical resonator 1; a curved surface electrode outer edge reference plane 6 is set at the edge of the micro-hemispherical curved surface electrode 3; a photolithography plate containing an optical lens structure is aligned with the inner surface of the curved surface electrode, and an excitation detection electrode, a shielding electrode and an anchor point electrode are formed on the micro-hemispherical curved surface electrode 3; the micro-hemispherical resonator 1 is coaxially aligned with the micro-hemispherical curved surface electrode 3, and the resonator anchor point 2 is cured and connected with the curved surface electrode anchor point 4. When assembling the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, how to ensure the coaxiality of the micro-hemispherical resonator and the curved surface electrode and the uniformity of the electrode gap are technical problems that technicians in this field hope to solve. Summary of the invention

[0006] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an assembly system and an assembly method for a micro-hemispherical gyroscope curved surface electrode, which can effectively ensure the coaxiality of the assembly of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode and the uniformity of the electrode gap.

[0007] The technical solution of the present invention is achieved in this way:

[0008] An assembly system for a micro-hemispherical gyroscope curved surface electrode comprises an assembly platform, a six-degree-of-freedom vacuum adsorption displacement device, an imaging camera and a control unit.

[0009] The assembly platform is arranged horizontally and is made of transparent material.

[0010] The six-degree-of-freedom vacuum adsorption displacement device is used to adsorb the micro-hemispherical resonator and the micro-hemispherical curved surface electrode above the assembly platform, and adjust the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode.

[0011] The imaging camera is arranged below the assembly platform and is used to collect images of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode.

[0012] The six-degree-of-freedom vacuum adsorption displacement device and the imaging camera are respectively connected to the control unit. The control unit determines the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode by acquiring images of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, so as to control the six-degree-of-freedom vacuum adsorption displacement device to adjust the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, so as to complete the assembly of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode.

[0013] Furthermore, it also includes a heating platform, which is in a circular ring structure and is horizontally arranged below the assembly platform, for heating the assembly platform to achieve solidification of the micro-hemispherical resonator and the assembly platform, the micro-hemispherical resonator anchor point and the curved electrode anchor point.

[0014] Furthermore, the heating platform is connected to a control unit, so that the control unit can control the heating platform to heat the assembly platform.

[0015] Furthermore, the assembly platform is made of quartz glass, and the heating platform is made of a material having a thermal expansion coefficient corresponding to that of quartz glass.

[0016] Furthermore, the six-degree-of-freedom vacuum adsorption displacement device is composed of an adsorption unit and a micro-movement unit. The adsorption unit is arranged above the assembly table and is used to adsorb the micro-hemispherical resonator and the micro-hemispherical curved surface electrode. The micro-movement unit is connected to the adsorption unit and is used to adjust the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode. The micro-movement unit is connected to the control unit.

[0017] The present invention also provides a method for assembling a micro-hemispherical gyroscope curved surface electrode, which is assembled using the aforementioned micro-hemispherical gyroscope curved surface electrode assembly system, and specifically comprises the following steps:

[0018] S1: using a six-degree-of-freedom vacuum adsorption displacement device to adsorb the micro-hemispherical resonator, using an imaging camera to collect the image of the micro-hemispherical resonator in real time, fitting its outer contour curve, judging the horizontal posture and horizontal position of the micro-hemispherical resonator according to the roundness and center of the outer contour curve, and then adjusting the horizontal posture of the micro-hemispherical resonator until the outer contour roundness of the micro-hemispherical resonator collected by the imaging camera is within the first set roundness threshold range;

[0019] S2: Adjust the horizontal position of the micro-hemispherical resonator so that it is located in the middle of the assembly table, record the coordinates corresponding to the center of the outer contour of the micro-hemispherical resonator at this time, and move the micro-hemispherical resonator vertically downward and temporarily bond it to the assembly table;

[0020] S3: using a six-degree-of-freedom vacuum adsorption displacement device to adsorb the micro-hemispherical curved surface electrode, using an imaging camera to collect the image of the micro-hemispherical curved surface electrode in real time, fitting its outer contour curve, judging the horizontal posture and horizontal position of the micro-hemispherical curved surface electrode according to the roundness and center of the outer contour curve, and then adjusting the horizontal posture of the curved surface electrode until the outer contour roundness of the micro-hemispherical curved surface electrode collected by the imaging camera is within the second set roundness threshold range;

[0021] S4: adjusting the horizontal position of the micro-hemispherical curved surface electrode so that the coordinates corresponding to the center of its outer contour coincide with the coordinates corresponding to the center of the outer contour of the micro-hemispherical resonator, and then vertically moving the micro-hemispherical curved surface electrode downward and placing it on the assembly table, and then curing and conducting the curved surface electrode anchor point and the micro-hemispherical resonator anchor point;

[0022] S5: removing the temporary bond between the micro-hemispherical resonator and the assembly platform, thereby completing the assembly of the micro-hemispherical resonator and the micro-hemispherical curved electrode.

[0023] Furthermore, before adjusting the horizontal postures of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, the roundness of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode are measured in advance using a roundness meter to obtain a first set roundness threshold and a second set roundness threshold.

[0024] Furthermore, the specific steps of determining the horizontal posture and horizontal position in step S1 and step S3 are as follows:

[0025] (1) Read the image based on the OpenCV vision library and use a filtering algorithm to denoise the image to obtain a denoised image;

[0026] (2) Convert the denoised image into a grayscale image;

[0027] (3) Convert the grayscale image into a binary image;

[0028] (4) Fit and draw the outer contour curve of the binary image in step (3) based on the Hough transform algorithm, calculate the center coordinates and roundness, and determine the horizontal position based on the center coordinates and the horizontal posture based on the roundness, where:

[0029]

[0030] Where: A is the area of ​​the fitting region;

[0031] P is the perimeter of the fitting area.

[0032] Furthermore, in step S2, the temporary bonding method includes but is not limited to gluing or prefabricated solder welding.

[0033] Furthermore, in step S4, the methods of curing and conducting include but are not limited to gluing or prefabricated solder welding.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] 1. The present invention uses an imaging camera to perform image recognition on the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, and adjusts them through a six-degree-of-freedom vacuum adsorption displacement device, which can effectively ensure the coaxiality of the assembly of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode and the uniformity of the electrode gap.

[0036] 2. The assembly method of the present invention is simple to operate, highly automated, efficient, and has good stability and repeatability. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 -Schematic diagram of the structure of a micro-hemispherical gyroscope with curved electrodes.

[0038] Figure 2 - A schematic diagram of the structure of the assembly system of the present invention.

[0039] Figure 3 - Schematic diagram of the working principle of the assembly system of the present invention.

[0040] Among them: 1-micro-hemispherical resonator; 2-resonator anchor point; 3-micro-hemispherical curved electrode; 4-curved electrode anchor point; 5-micro-hemispherical resonator outer edge reference plane; 6-curved electrode outer edge reference plane; 7-adsorption unit; 8-micro-movement unit; 9-assembly table; 10-heating table; 11-control unit; 12-imaging camera. DETAILED DESCRIPTION

[0041] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0042] See also Figure 1 , Figure 2 and Figure 3 , an assembly system for a micro-hemispherical gyroscope curved surface electrode, comprising an assembly table 9, a six-degree-of-freedom vacuum adsorption displacement device, an imaging camera 12 and a control unit 11.

[0043] The assembly platform 9 is arranged horizontally and is made of transparent material.

[0044] The six-degree-of-freedom vacuum adsorption displacement device is used to adsorb the micro-hemispherical resonator 1 and the micro-hemispherical curved surface electrode 3 above the assembly platform 9, and adjust the horizontal posture and horizontal position of the micro-hemispherical resonator 1 and the micro-hemispherical curved surface electrode 3.

[0045] The imaging camera 12 is disposed below the assembly platform 9 and is used to collect images of the micro-hemispherical resonator 1 and the micro-hemispherical curved electrode 3 .

[0046] The six-degree-of-freedom vacuum adsorption displacement device and the imaging camera 12 are respectively connected to the control unit 11. The control unit 11 determines the horizontal posture and horizontal position of the micro-hemispherical resonator 1 and the micro-hemispherical curved surface electrode 3 by acquiring images of the micro-hemispherical resonator 1 and the micro-hemispherical curved surface electrode 3, so as to control the six-degree-of-freedom vacuum adsorption displacement device to adjust the horizontal posture and horizontal position of the micro-hemispherical resonator 1 and the micro-hemispherical curved surface electrode, so as to complete the assembly of the micro-hemispherical resonator 1 and the micro-hemispherical curved surface electrode 3.

[0047] In this way, during the assembly process, the micro-hemispherical resonator is first adsorbed by the six-degree-of-freedom vacuum adsorption displacement device, and then the imaging camera is used to collect the image of the micro-hemispherical resonator above the assembly table, and the image recognition technology is used to realize image recognition of the outer contour of the micro-hemispherical resonator. Then, the control unit is used to determine the horizontal posture and horizontal position of the micro-hemispherical resonator, and then the six-degree-of-freedom vacuum adsorption displacement device is used to adjust the horizontal posture and horizontal position of the micro-hemispherical resonator. After the adjustment is in place, the micro-hemispherical curved surface electrode is adsorbed by the six-degree-of-freedom vacuum adsorption displacement device, and then An imaging camera is used to collect the image of the micro-hemispherical curved surface electrode above the assembly table, and the image recognition technology is used to realize image recognition of the outer contour of the micro-hemispherical curved surface electrode. The control unit is then used to determine the horizontal posture and horizontal position of the micro-hemispherical curved surface electrode. Then, the six-degree-of-freedom vacuum adsorption displacement device is used to adjust the horizontal posture and horizontal position of the micro-hemispherical curved surface electrode, so that the corresponding coordinates of the outer contour center of the micro-hemispherical curved surface electrode and the outer contour center of the micro-hemispherical resonator coincide with each other, thereby ensuring the coaxiality of the assembly of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode and the uniformity of the electrode gap.

[0048] In a specific implementation, a heating platform 10 is also included. The heating platform 10 is in a circular ring structure and is horizontally arranged below the assembly platform 9 for heating the assembly platform 9 to achieve curing and conduction of the resonator anchor point 2 and the curved electrode anchor point 4 .

[0049] During the assembly process, the micro-hemispherical resonator and the assembly platform are temporarily bonded, and a fixing material is set between the anchor point of the micro-hemispherical resonator and the anchor point of the curved electrode. This type of fixing material is cured and conductive under heating conditions. In this way, after the heating platform heats the assembly platform, it further heats the fixing material and finally removes the temporary bond between the micro-hemispherical resonator and the assembly platform.

[0050] In a specific implementation, the heating platform 10 is connected to the control unit 11 , so that the control unit 11 controls the heating platform 10 to heat the assembly platform 9 .

[0051] In a specific implementation, the assembly platform 9 is made of quartz glass, and the heating platform 10 is made of a material having a thermal expansion coefficient corresponding to that of quartz glass.

[0052] The word "corresponding" here should be understood as similar, that is, the thermal expansion coefficients of the heating table and the assembly table should be similar.

[0053] In specific implementation, the six-degree-of-freedom vacuum adsorption displacement device is composed of an adsorption unit 7 and a micro-movement unit 8. The adsorption unit 7 is arranged above the assembly table 9 and is used to adsorb the micro-hemispherical resonator 1 and the micro-hemispherical curved surface electrode 3. The micro-movement unit 8 is connected to the adsorption unit 7 and is used to adjust the horizontal posture and horizontal position of the micro-hemispherical resonator 1 and the micro-hemispherical curved surface electrode 3. The micro-movement unit 8 is connected to the control unit 11.

[0054] A method for assembling a micro-hemispherical gyroscope curved surface electrode is provided, wherein the method adopts the above-mentioned assembly system for the micro-hemispherical gyroscope curved surface electrode for assembly, and specifically comprises the following steps:

[0055] S1: using a six-degree-of-freedom vacuum adsorption displacement device to adsorb the micro-hemispherical resonator, using an imaging camera to collect the image of the micro-hemispherical resonator in real time, fitting its outer contour curve, judging the horizontal posture and horizontal position of the micro-hemispherical resonator according to the roundness and center of the outer contour curve, and then adjusting the horizontal posture of the micro-hemispherical resonator until the outer contour roundness of the micro-hemispherical resonator collected by the imaging camera is within the first set roundness threshold range;

[0056] S2: Adjust the horizontal position of the micro-hemispherical resonator so that it is located in the middle of the assembly table, record the coordinates corresponding to the center of the outer contour of the micro-hemispherical resonator at this time, and move the micro-hemispherical resonator vertically downward and temporarily bond it to the assembly table;

[0057] Here, the micro-hemispherical resonator is temporarily bonded to the middle of the assembly platform, not limited to the center of the assembly platform, as long as it is ensured that the imaging camera can capture the image of the micro-hemispherical resonator.

[0058] S3: using a six-degree-of-freedom vacuum adsorption displacement device to adsorb the micro-hemispherical curved surface electrode, using an imaging camera to collect the image of the micro-hemispherical curved surface electrode in real time, fitting its outer contour curve, judging the horizontal posture and horizontal position of the micro-hemispherical curved surface electrode according to the roundness and center of the outer contour curve, and then adjusting the horizontal posture of the curved surface electrode until the outer contour roundness of the micro-hemispherical curved surface electrode collected by the imaging camera is within the second set roundness threshold range;

[0059] The first set roundness threshold and the second set roundness threshold here are just to distinguish that the first set roundness threshold corresponds to the micro-hemispherical resonator, and the second set roundness threshold corresponds to the micro-hemispherical curved electrode. The values ​​of the first set roundness threshold and the second set roundness threshold may be the same or different.

[0060] At the same time, in order to ensure that the imaging camera can capture the image of the micro-hemispherical curved surface electrode located above the assembly platform, when the six-degree-of-freedom vacuum adsorption displacement device is used to adsorb the micro-hemispherical curved surface electrode, the heating platform and the micro-hemispherical resonator should be avoided from being blocked.

[0061] S4: adjusting the horizontal position of the micro-hemispherical curved surface electrode so that the coordinates corresponding to the center of its outer contour coincide with the coordinates corresponding to the center of the outer contour of the micro-hemispherical resonator, and then vertically moving the micro-hemispherical curved surface electrode downward and placing it on the assembly table, and then curing and connecting the curved surface electrode anchor point 4 and the resonator anchor point 2;

[0062] S5: removing the temporary bond between the micro-hemispherical resonator and the assembly platform, thereby completing the assembly of the micro-hemispherical resonator and the micro-hemispherical curved electrode.

[0063] In a specific implementation, before adjusting the horizontal posture of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, the roundness of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode are measured in advance using a roundness meter to obtain a first set roundness threshold and a second set roundness threshold.

[0064] For example, when the roundness meter measures the roundness of the outer contour of the micro-hemispherical resonator to be 10μm, the first set lower limit threshold of the roundness is 10μm, and the first set upper limit threshold of the roundness can be set according to actual needs. If it is set to 12μm, when adjusting the horizontal posture of the micro-hemispherical resonator, the roundness of the outer contour of the resonator is calculated in real time through the image. When the calculated roundness is within the first set roundness threshold range of 10-12μm, the resonator can be considered to be in a horizontal state.

[0065] In specific implementation, the specific steps of determining the horizontal posture and horizontal position in step S1 and step S3 are as follows:

[0066] (1) Read the image based on the OpenCV vision library and use a filtering algorithm to denoise the image to obtain a denoised image;

[0067] (2) Convert the denoised image into a grayscale image;

[0068] (3) Convert the grayscale image into a binary image;

[0069] (4) Fit and draw the outer contour curve of the binary image in step (3) based on the Hough transform algorithm, calculate the center coordinates and roundness, and determine the horizontal position based on the center coordinates and the horizontal posture based on the roundness, where:

[0070]

[0071] Where: A is the area of ​​the fitting region;

[0072] P is the perimeter of the fitting area. In specific implementation, in step S2, the temporary bonding method includes but is not limited to gluing or prefabricated solder welding.

[0073] In specific implementation, in step S4, the method of curing and conducting includes but is not limited to gluing or prefabricated solder welding.

[0074] Finally, it should be noted that the above embodiments of the present invention are only examples for illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes and modifications can be made based on the above description. It is impossible to list all implementation methods here. Any obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A method for assembling a micro-hemispherical gyroscope curved surface electrode, characterized in that: The assembly is performed using an assembly system, wherein the assembly system includes an assembly table, a six-degree-of-freedom vacuum adsorption displacement device, an imaging camera, and a control unit; The assembly platform is arranged horizontally and is made of transparent material; The six-degree-of-freedom vacuum adsorption displacement device is used to adsorb the micro-hemispherical resonator and the micro-hemispherical curved surface electrode above the assembly platform, and adjust the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode; The imaging camera is arranged below the assembly platform and is used to collect images of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode; The six-degree-of-freedom vacuum adsorption displacement device and the imaging camera are respectively connected to the control unit, and the control unit determines the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode by acquiring images of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, so as to control the six-degree-of-freedom vacuum adsorption displacement device to adjust the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, so as to complete the assembly of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode; The assembly method specifically comprises the following steps: S1: using a six-degree-of-freedom vacuum adsorption displacement device to adsorb the micro-hemispherical resonator, using an imaging camera to collect the image of the micro-hemispherical resonator in real time, fitting its outer contour curve, judging the horizontal posture and horizontal position of the micro-hemispherical resonator according to the roundness and center of the outer contour curve, and then adjusting the horizontal posture of the micro-hemispherical resonator until the outer contour roundness of the micro-hemispherical resonator collected by the imaging camera is within the first set roundness threshold range; S2: Adjust the horizontal position of the micro-hemispherical resonator so that it is located in the middle of the assembly table, record the coordinates corresponding to the center of the outer contour of the micro-hemispherical resonator at this time, and move the micro-hemispherical resonator vertically downward and temporarily bond it to the assembly table; S3: using a six-degree-of-freedom vacuum adsorption displacement device to adsorb the micro-hemispherical curved surface electrode, using an imaging camera to collect the image of the micro-hemispherical curved surface electrode in real time, fitting its outer contour curve, judging the horizontal posture and horizontal position of the micro-hemispherical curved surface electrode according to the roundness and center of the outer contour curve, and then adjusting the horizontal posture of the curved surface electrode until the outer contour roundness of the micro-hemispherical curved surface electrode collected by the imaging camera is within the second set roundness threshold range; S4: adjusting the horizontal position of the micro-hemispherical curved surface electrode so that the coordinates corresponding to the center of its outer contour coincide with the coordinates corresponding to the center of the outer contour of the micro-hemispherical resonator, and then vertically moving the micro-hemispherical curved surface electrode downward and placing it on the assembly table, and then curing and conducting the curved surface electrode anchor point and the micro-hemispherical resonator anchor point; S5: removing the temporary bonding between the micro-hemispherical resonator and the assembly platform, thereby completing the assembly of the micro-hemispherical resonator and the micro-hemispherical curved electrode; The specific steps of determining the horizontal posture and horizontal position in step S1 and step S3 are as follows: (1) Read the image based on the OpenCV vision library and use a filtering algorithm to denoise the image to obtain a denoised image; (2) Convert the denoised image into a grayscale image; (3) Convert the grayscale image into a binary image; (4) Fit and draw the outer contour curve of the binary image in step (3) based on the Hough transform algorithm, calculate the center coordinates and roundness, and determine the horizontal position based on the center coordinates and the horizontal posture based on the roundness, where: Where: A is the area of ​​the fitting region; P is the perimeter of the fitting area.

2. The method for assembling a micro-hemispherical gyroscope curved surface electrode according to claim 1, characterized in that: It also includes a heating platform, which is in a circular ring structure and is horizontally arranged below the assembly platform, and is used to heat the assembly platform to achieve solidification of the micro-hemispherical resonator and the assembly platform, the micro-hemispherical resonator anchor point and the curved electrode anchor point.

3. The method for assembling a micro-hemispherical gyroscope curved surface electrode according to claim 2, characterized in that: The heating platform is connected to the control unit, so that the control unit can control the heating platform to heat the assembly platform.

4. The method for assembling a micro-hemispherical gyroscope curved surface electrode according to claim 2, characterized in that: The assembly platform is made of quartz glass, and the heating platform is made of a material having a thermal expansion coefficient corresponding to that of quartz glass.

5. The method for assembling a micro-hemispherical gyroscope curved surface electrode according to claim 1, characterized in that: The six-degree-of-freedom vacuum adsorption displacement device is composed of an adsorption unit and a micro-movement unit. The adsorption unit is arranged above the assembly table and is used to adsorb the micro-hemispherical resonator and the micro-hemispherical curved surface electrode. The micro-movement unit is connected to the adsorption unit and is used to adjust the horizontal posture and horizontal position of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode. The micro-movement unit is connected to the control unit.

6. The method for assembling a micro-hemispherical gyroscope curved surface electrode according to claim 1, characterized in that: Before adjusting the horizontal postures of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode, the roundness of the micro-hemispherical resonator and the micro-hemispherical curved surface electrode are measured respectively using a roundness meter to obtain a first set roundness threshold and a second set roundness threshold.

7. The method for assembling a micro-hemispherical gyroscope curved surface electrode according to claim 1, characterized in that: In step S2, the temporary bonding method includes but is not limited to gluing or prefabricated solder welding.

8. The method for assembling a micro-hemispherical gyroscope curved surface electrode according to claim 1, characterized in that: In step S4, the methods of curing and conducting include but are not limited to gluing or prefabricated solder welding.

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