A high-integration, low-inductance and low-voltage inverter device and its installation method

Abstract

The present invention relates to a highly integrated low-inductance low-voltage inverter device and an installation method thereof. The device comprises an input rectification component, a voltage-stabilizing energy storage capacitor, a DC inverter device, a current sensing component and a carrier board. The input rectification component, the voltage-stabilizing energy storage capacitor, the DC inverter device and the current sensing component are electrically connected in sequence. The input rectification component, the voltage-stabilizing energy storage capacitor, the DC inverter device and the current sensing component are all fixed on the carrier board through fasteners. Compared with the prior art, the present invention has the advantages of low cost, easy disassembly, small loop inductance, excellent heat dissipation, compact volume, etc.

Description

Technical Field

[0001] The present invention relates to the field of inverter devices, and particularly to a highly integrated, low-inductance, low-voltage inverter device and an installation method thereof. Background Art

[0002] An idle start device refers to a set of motor inverter systems formed by integrating a starting motor and a motor inverter. Integrating this set of motor inverter systems with an engine and applying it in a traditional vehicle can quickly increase the engine speed to the idle stage during the engine starting phase, which is beneficial to improving the fuel efficiency of traditional vehicles. In existing motor inverter systems, the main core electrical components inside the inverter are power modules, capacitors, sensors, etc. The integration degree of these core electrical components determines whether the entire system can be miniaturized and integrated. Currently, the connection between these core electrical components in the system often uses ultrasonic or laser welding, which is costly and not convenient for disassembly and repair after the core components are damaged. Thermal management is the core design of the inverter device. The inverter devices of existing mild hybrid systems often use air-cooled heat dissipation, and the limited heat dissipation conditions often limit the performance of DC inverter devices. At the same time, the inverter circuit, especially the low-voltage inverter circuit, is particularly sensitive to circuit inductance. Excessive circuit inductance will cause damage to the DC inverter devices in the inverter device.

[0003] The invention disclosed in the publication number CN107017787A discloses a vehicle inverter, which includes: a housing; a cooling bottom plate disposed between the housing and the motor; an upper cover fixed to the upper end of the housing for sealing the opening at the upper end of the housing; wherein, a capacitor, a power module, a current sensor, and an AC terminal block are fixed on the cooling bottom plate; a DC terminal block is fixed on the upper cover, and a circuit board is disposed above the power module and the current sensor.

[0004] Although this inverter improves the integration degree of the structure by integrating the power module, its circuit board, capacitor, current sensor, and AC terminal block on the cooling bottom plate, it still has the following defects:

[0005] 1. The distribution of each component is scattered, and it is not convenient to disassemble, which is not conducive to disassembly and repair after the core components are damaged;

[0006] 2. The heat dissipation performance is not strong, and there is still much room for improvement. Summary of the Invention

[0007] The purpose of the present invention is to overcome the above-mentioned defects of the existing technology, such as poor heat dissipation performance and inconvenient disassembly, and provide a highly integrated, low-inductance, low-voltage inverter device and an installation method thereof.

[0008] The purpose of the present invention can be achieved by the following technical solutions:

[0009] A highly integrated low-inductance low-voltage inverter device includes an input rectification component, a voltage-stabilizing energy storage capacitor, a DC inverter device, a current sensing component, and a carrier board. The input rectification component, the voltage-stabilizing energy storage capacitor, the DC inverter device, and the current sensing component are electrically connected in sequence. The input rectification component, the voltage-stabilizing energy storage capacitor, the DC inverter device, and the current sensing component are all fixed on the carrier board through fasteners.

[0010] Further, the input rectification component includes a differential-mode ceramic capacitor, two common-mode ceramic capacitors, an O-shaped magnetic ring, and a plastic-encapsulated body that supports the entire input rectification component.

[0011] The plastic-encapsulated body includes an N-pole grounding plate, an N-pole current guiding plate, a P-pole current guiding plate, a P-pole grounding plate, and a body structure that fixes the entire plastic-encapsulated body.

[0012] The differential-mode ceramic capacitor is respectively connected to the N-pole current guiding plate and the P-pole current guiding plate.

[0013] The grounding ends of the two common-mode ceramic capacitors are respectively connected to the N-pole grounding plate and the P-pole grounding plate, and the output ends of the two common-mode ceramic capacitors are respectively connected to the N-pole current guiding plate and the P-pole current guiding plate.

[0014] The O-shaped magnetic ring is located outside the N-pole current guiding plate and the P-pole current guiding plate.

[0015] Further, the body structure includes a fourth concave cavity provided in the middle, third concave cavities and second concave cavities located on both sides of the fourth concave cavity, and a first concave cavity located above the fourth concave cavity. The N-pole grounding plate is located on one side of the second concave cavity, and the P-pole grounding plate is located on one side of the third concave cavity.

[0016] The differential-mode ceramic capacitor is installed in the first concave cavity, the two common-mode ceramic capacitors are respectively installed in the second concave cavity and the third concave cavity, and the O-shaped magnetic ring is installed in the fourth concave cavity.

[0017] Further, both the N-pole current guiding plate and the P-pole current guiding plate include a magnetic ring through portion and a fixing portion that are perpendicularly connected to each other. The magnetic ring through portions of the N-pole current guiding plate and the P-pole current guiding plate are close to each other and are both located in the fourth concave cavity. The fixing portion of the N-pole current guiding plate is provided with an N-pole grounding bent hook and an N-pole bent hook, and the fixing portion of the P-pole current guiding plate is provided with a P-pole grounding bent hook and a P-pole bent hook.

[0018] The differential-mode ceramic capacitor pins of the differential-mode ceramic capacitor are respectively electrically connected to the P-pole bent hook and the N-pole bent hook. The common-mode ceramic capacitor grounding pins of the two common-mode ceramic capacitors are respectively electrically connected to the P-pole grounding bent hook and the N-pole grounding bent hook. The common-mode ceramic capacitor pins of the two common-mode ceramic capacitors are respectively electrically connected to the N-pole grounding plate and the P-pole grounding plate.

[0019] Further, both the N - pole current - guiding plate and the P - pole current - guiding plate are connected to the input end of the voltage - stabilizing energy - storage capacitor.

[0020] Further, the carrier plate is provided with a core cavity and a semi - surrounding rib strip located outside the core cavity, and the voltage - stabilizing energy - storage capacitor is installed in the core cavity.

[0021] Further, the DC inverter device includes an input - side copper terminal, an insulating substrate with a chip inside, and a plastic package bracket for supporting the entire DC inverter device. The plastic package bracket is connected with a signal terminal for connecting the insulating substrate, a plastic card slot for connecting the rib strip, and a three - phase copper row;

[0022] The insulating substrate is connected to the carrier plate, the signal terminal is connected to the insulating substrate, the plastic card slot is clamped with the rib strip, the plastic package bracket and the current sensing component are electrically connected, and the plastic package bracket is installed on the carrier plate.

[0023] Further, the three - phase copper row is injection - molded in the plastic package bracket.

[0024] Further, the core cavity and the rib strip are filled with epoxy glue.

[0025] Further, an RC absorption circuit is provided in the internal circuit of the DC inverter device.

[0026] The present invention also provides an installation method for a highly integrated low - inductance low - voltage inverter device. The highly integrated low - inductance low - voltage inverter device includes an input rectification component, a voltage - stabilizing energy - storage capacitor, a DC inverter device, a current sensing component, and a carrier plate. The carrier plate is provided with a core cavity for installing the voltage - stabilizing energy - storage capacitor and a semi - surrounding rib strip located outside the core cavity; the DC inverter device includes an input - side copper terminal, an insulating substrate with a chip inside, and a plastic package bracket for supporting the entire DC inverter device. The plastic package bracket is connected with a signal terminal for connecting the insulating substrate, a plastic card slot for connecting the rib strip, and a three - phase copper row;

[0027] The installation method includes: assembling the current sensing component and installing it in the carrier plate, welding the insulating substrate to the carrier plate, aligning the plastic package bracket with the insulating substrate, then welding the signal terminal to the insulating substrate, then clamping and positioning the plastic card slot with the rib strip, and making the plastic package bracket and the current sensing component electrically connected, and finally locking the carrier plate and the plastic package bracket with screws;

[0028] Respectively assembling the input rectification component and the voltage - stabilizing energy - storage capacitor, installing them in the carrier plate, making the input rectification component, the voltage - stabilizing energy - storage capacitor, and the DC inverter device electrically connected in sequence, and filling epoxy glue in the core cavity and the rib strip.

[0029] Furthermore, the input rectification component includes a differential-mode ceramic capacitor, two common-mode ceramic capacitors, an O-shaped magnetic ring, and a plastic package body for supporting the entire input rectification component;

[0030] The plastic package body includes an N-pole grounding plate, an N-pole current guiding plate, a P-pole current guiding plate, a P-pole grounding plate, and a body structure for fixing the entire plastic package body,

[0031] The assembly process of the input rectification component includes:

[0032] Install the differential-mode ceramic capacitor, the two common-mode ceramic capacitors, and the O-shaped magnetic ring in the plastic package body respectively, and connect the differential-mode ceramic capacitor to the N-pole current guiding plate and the P-pole current guiding plate respectively;

[0033] The grounding ends of the two common-mode ceramic capacitors are connected to the N-pole grounding plate and the P-pole grounding plate respectively, and the output ends of the two common-mode ceramic capacitors are connected to the N-pole current guiding plate and the P-pole current guiding plate respectively;

[0034] The O-shaped magnetic ring is located outside the N-pole current guiding plate and the P-pole current guiding plate.

[0035] Furthermore, the body structure includes a fourth concave cavity arranged in the middle, third concave cavities and second concave cavities on both sides of the fourth concave cavity, and a first concave cavity above the fourth concave cavity. The N-pole grounding plate is located on one side of the second concave cavity, and the P-pole grounding plate is located on one side of the third concave cavity;

[0036] Both the N-pole current guiding plate and the P-pole current guiding plate include a magnetic-ring through part and a fixing part that are perpendicularly connected to each other. The magnetic-ring through parts of the N-pole current guiding plate and the P-pole current guiding plate are close to each other and are both located in the fourth concave cavity; the fixing part of the N-pole current guiding plate is provided with an N-pole grounding folding hook and an N-pole folding hook, and the fixing part of the P-pole current guiding plate is provided with a P-pole grounding folding hook and a P-pole folding hook;

[0037] The specific assembly process of the input rectification component includes:

[0038] Install the differential-mode ceramic capacitor in the first concave cavity and fix it by filling epoxy glue. The pins of the differential-mode ceramic capacitor are electrically connected to the P-pole folding hook and the N-pole folding hook through resistance clip welding;

[0039] Install the two common-mode ceramic capacitors in the second concave cavity and the third concave cavity respectively and fix them by filling epoxy glue; the grounding pins of the two common-mode ceramic capacitors are electrically connected to the P-pole grounding folding hook and the N-pole grounding folding hook through resistance clip welding; the pins of the two common-mode ceramic capacitors are electrically connected to the N-pole grounding plate and the P-pole grounding plate through resistance clip welding;

[0040] The O-shaped magnetic ring is sintered from magnetic materials. The O-shaped magnetic ring is installed in the fourth concave cavity, such that the magnetic ring through portions of the N-pole current guiding plate and the P-pole current guiding plate are located inside the O-shaped magnetic ring, and are fixed by potting epoxy glue.

[0041] Further, the input rectification assembly is electrically connected to the voltage stabilizing energy storage capacitor by laser seam welding, and the tail ends of the through portions of the N-pole current guiding plate and the P-pole current guiding plate are connected to the input end of the voltage stabilizing energy storage capacitor.

[0042] Further, the input-side copper terminals adopt an up-and-down stacked design, including a P-terminal and an N-terminal. A gap is provided between the P-terminal and the N-terminal, and they are injection molded together with the plastic package bracket;

[0043] The output end of the voltage stabilizing energy storage capacitor includes a first terminal and a second terminal. The position of the first terminal corresponds to that of the P-terminal, and the position of the second terminal corresponds to that of the N-terminal. The first terminal, the second terminal, the P-terminal, and the N-terminal are all provided with fastening through holes. When electrically connecting the voltage stabilizing energy storage capacitor and the DC inverter device, the first terminal and the P-terminal are connected by a fastener passing through the fastening through hole, and the second terminal and the N-terminal are connected by a fastener passing through the fastening through hole.

[0044] Further, an RC absorption circuit is provided in the internal circuit of the DC inverter device.

[0045] Further, the signal copper terminal is connected to the insulating substrate by ultrasonic welding.

[0046] Further, the three-phase copper busbar is injection molded in the plastic package bracket, and the plastic package bracket is also inlaid with round nuts.

[0047] Further, the method further includes passing the motor-end three-phase copper busbar fastener through the current induction component, connecting the plastic package bracket by a round nut, and electrically connecting it to the three-phase copper busbar.

[0048] Further, the carrier plate is supported by a hot forging forming process and is integrally nickel-plated. The bottom of the carrier plate is provided with heat conducting ribs arranged in a semi-circular pattern.

[0049] Compared with the prior art, the present invention has the following advantages:

[0050] (1) First, through optimizing the structural design, the present invention integrates the core electrical components inside the inverter into a modular form by fasteners without increasing the volume, thus facilitating disassembly and making the volume compact. In addition, the insulating substrate of the DC inverter device is directly reflow soldered on the surface of the aluminum alloy, and the heat generated by the core device can be quickly dissipated, enabling the performance potential of the DC inverter device to be greatly released. The present invention provides a plastic-sealed bracket to connect the insulating substrate to the voltage-stabilizing energy storage capacitor and the current sensing component. Ribs are provided in the carrier plate, which can not only fill epoxy glue inside the core cavity and the ribs to increase the thermal conductivity, but also fix one end of the plastic-sealed bracket, with excellent heat dissipation performance.

[0051] (2) The input rectification component of the present invention integrates a differential-mode ceramic capacitor, two common-mode ceramic capacitors, and an O-shaped magnetic ring. After the input current signal passes through the input rectification component and the voltage-stabilizing energy storage capacitor, it can be effectively absorbed and filtered, making the entire inverter device have better electromagnetic compatibility performance.

[0052] To achieve a high degree of integration of the input rectification component, the plastic-sealed body proposed by the present invention realizes the connection of the differential-mode ceramic capacitor, two common-mode ceramic capacitors, and the O-shaped magnetic ring with the smallest occupied space.

[0053] (3) In a conventional power module, the signal terminals inside are connected to the chip through bonding wire bonding. Under relatively harsh conditions, the bonding wire may fail. The present invention adopts an ultrasonic welding connection method to replace the bonding process, connecting the signal copper terminal and the insulating substrate through ultrasonic welding, greatly improving the mechanical strength and vibration resistance of the DC inverter device, and ensuring the safe operation of the DC inverter device under the condition of high-intensity vibration of the engine.

[0054] (4) Inverter devices, especially low-voltage inverter devices, are particularly sensitive to loop inductance. Excessive circuit inductance will cause damage to the DC inverter device. The present invention adopts customized production. The positive and negative copper terminals at its output end adopt a laminated structure to increase the overlapping area between the positive and negative terminals and reduce the terminal length, reducing the path of the loop inductance in terms of structure. At the same time, an RC circuit is provided inside the DC inverter device to further reduce the loop inductance.

[0055] (5) The present invention uses a fastener connection method to connect the core component, the DC inverter device, and the voltage-stabilizing energy storage capacitor. At the same time, at the output side of the DC inverter device, an injection-molded embedded round nut is used to connect to the three-phase end of the motor through fasteners. This connection method is convenient for disassembly and repair, avoiding the phenomenon that the entire inverter device is scrapped when the DC inverter device or the voltage-stabilizing energy storage capacitor fails, greatly saving the material loss generated after an accident and saving a large amount of quality costs. Description of the Drawings

[0056] Figure 1Schematic three - dimensional structure diagram of the low - voltage inverter device of the present invention;

[0057] Figure 2 Exploded structure diagram of the low - voltage inverter device of the present invention;

[0058] Figure 3 Schematic structure diagram of the input rectification component of the present invention;

[0059] Figure 4 Schematic structure diagram of the plastic - encapsulated body in the input rectification component of the present invention;

[0060] Figure 5 Schematic structure diagram of the positive and negative copper bars in the input rectification component of the present invention;

[0061] Figure 6 Schematic structure diagram of the DC inverter device of the present invention;

[0062] Figure 7 Schematic diagram of the input - side copper terminal in the DC inverter device of the present invention;

[0063] Figure 8 Front - side structure diagram of the carrier board of the present invention;

[0064] Figure 9 Back - side structure diagram of the carrier board of the present invention;

[0065] 1. Input rectification component, 1 - 1. Differential - mode ceramic capacitor, 1 - 1 - 1. Differential - mode ceramic capacitor lead, 1 - 2. Plastic - encapsulated body, 1 - 2 - 1. N - pole grounding plate, 1 - 2 - 2. Second cavity, 1 - 2 - 3. N - pole current - guiding plate, 1 - 2 - 3 - 1. N - pole grounding bending hook, 1 - 2 - 3 - 2. N - pole bending hook, 1 - 2 - 4. Fourth cavity, 1 - 2 - 5. P - pole current - guiding plate, 1 - 2 - 5 - 1. P - pole grounding bending hook, 1 - 2 - 5 - 2. P - pole bending hook, 1 - 2 - 6. Third cavity, 1 - 2 - 7. P - pole grounding plate, 1 - 2 - 8. First cavity, 1 - 3. Common - mode ceramic capacitor, 1 - 3 - 1. Common - mode ceramic capacitor grounding lead, 1 - 3 - 2. Common - mode ceramic capacitor lead, 1 - 4. O - type magnetic ring, 2. Voltage - stabilizing energy - storage capacitor, 3. DC inverter device, 3 - 1. Plastic card slot, 3 - 2. Input - side copper terminal, 3 - 2 - 1. N - pole terminal, 3 - 2 - 2. P - pole terminal, 3 - 3. Insulating substrate, 3 - 4. Signal terminal, 3 - 5. Plastic - encapsulated bracket, 4. Current sensing component, 5. Carrier board, 5 - 1. Core cavity, 5 - 2. Ribbed strip, 5 - 3. Heat - conducting rib. Detailed implementation mode

[0066] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Components of the embodiments of the present invention usually described and illustrated in the drawings here can be arranged and designed in various different configurations.

[0067] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0068] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0069] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0070] It should be noted that the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality" means two or more unless otherwise specifically defined.

[0071] Embodiment 1

[0072] This embodiment provides a highly integrated low-inductance low-voltage inverter device, which includes an input rectification component 1, a voltage-stabilizing energy storage capacitor 2, a DC inverter device 3, a current sensing component 4, and a carrier board 5. The input rectification component 1, the voltage-stabilizing energy storage capacitor 2, the DC inverter device 3, and the current sensing component 4 are electrically connected in sequence, and the input rectification component 1, the voltage-stabilizing energy storage capacitor 2, the DC inverter device 3, and the current sensing component 4 are all fixed on the carrier board 5 through fasteners.

[0073] As a preferred embodiment, the input rectification component includes a differential-mode ceramic capacitor 1-1, two common-mode ceramic capacitors 1-3, an O-shaped magnetic ring 1-4, and a plastic-sealed body 1-2 that supports the entire input rectification component;

[0074] The plastic-sealed body 1-2 includes an N-pole grounding plate 1-2-1, an N-pole current guiding plate 1-2-3, a P-pole current guiding plate 1-2-5, a P-pole grounding plate 1-2-7, and a body structure that fixes the entire plastic-sealed body 1-2.

[0075] The differential-mode ceramic capacitor 1-1 is respectively connected to the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5;

[0076] The grounding ends of the two common-mode ceramic capacitors 1-3 are respectively connected to the N-pole grounding plate 1-2-1 and the P-pole grounding plate 1-2-7, and the output ends of the two common-mode ceramic capacitors 1-3 are respectively connected to the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5;

[0077] The O-shaped magnetic ring 1-4 is located outside the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5.

[0078] As a preferred embodiment, the body structure includes a fourth concave cavity 1-2-4 provided in the middle, third concave cavities 1-2-6 and second concave cavities 1-2-2 located on both sides of the fourth concave cavity, and a first concave cavity 1-2-8 located above the fourth concave cavity. The N-pole grounding plate 1-2-1 is located on one side of the second concave cavity 1-2-2, and the P-pole grounding plate 1-2-7 is located on one side of the third concave cavity 1-2-6;

[0079] The differential-mode ceramic capacitor 1-1 is installed in the first concave cavity 1-2-8, the two common-mode ceramic capacitors 1-3 are respectively installed in the second concave cavity 1-2-2 and the third concave cavity 1-2-6, and the O-shaped magnetic ring 1-4 is installed in the fourth concave cavity 1-2-4.

[0080] As a preferred embodiment, both the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5 include a magnetic ring through portion and a fixing portion that are perpendicularly connected to each other. The magnetic ring through portions of the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5 are close to each other and are both located in the fourth concave cavity 1-2-4; the fixing portion of the N-pole current guiding plate 1-2-3 is provided with an N-pole grounding bent hook 1-2-3-1 and an N-pole bent hook 1-2-3-2, and the fixing portion of the P-pole current guiding plate 1-2-5 is provided with a P-pole grounding bent hook 1-2-5-1 and a P-pole bent hook 1-2-5-2;

[0081] The pins 1-1-1 of the differential-mode ceramic capacitor 1-1 are electrically connected to the P-pole bent hook 1-2-5-2 and the N-pole bent hook 1-2-3-2 respectively. The grounding pins 1-3-1 of the two common-mode ceramic capacitors 1-3 are electrically connected to the P-pole grounding bent hook 1-2-5-1 and the N-pole grounding bent hook 1-2-3-1 respectively. The pins 1-3-2 of the two common-mode ceramic capacitors 1-3 are electrically connected to the N-pole grounding plate 1-2-1 and the P-pole grounding plate 1-2-7 respectively.

[0082] As a preferred embodiment, both the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5 are connected to the input end of the voltage stabilizing energy storage capacitor 2.

[0083] As a preferred embodiment, the carrier plate 5 is provided with a core cavity 5-1 and a semi-surrounding rib 5-2 located outside the core cavity. The voltage stabilizing energy storage capacitor is installed in the core cavity 5-1.

[0084] As a preferred embodiment, the DC inverter device 3 includes an input-side copper terminal 3-2, an insulating substrate 3-3 with a chip inside, and a plastic package bracket 3-5 for supporting the entire DC inverter device. The plastic package bracket 3-5 is connected with a signal terminal 3-4 for connecting the insulating substrate, a plastic card slot 3-1 for connecting the rib, and a three-phase copper bar;

[0085] The insulating substrate 3-3 is connected to the carrier plate 5. The signal terminal 3-4 is connected to the insulating substrate 3-3. The plastic card slot 3-1 is clamped with the rib 5-2. The plastic package bracket 3-5 is electrically connected to the current sensing component 4. The plastic package bracket 3-5 is installed on the carrier plate 5.

[0086] As a preferred embodiment, the three-phase copper bar is injection-molded in the plastic package bracket 3-5.

[0087] As a preferred embodiment, the core cavity 5-1 and the rib 5-2 are filled with epoxy glue inside.

[0088] As a preferred embodiment, an RC absorption circuit is provided in the internal circuit of the DC inverter device 3.

[0089] This embodiment also provides a method for installing a high-integration, low-inductance, and low-voltage inverter device, including the following steps:

[0090] S1: Obtain the components of the pre-constructed input rectification component 1, voltage stabilizing energy storage capacitor 2, DC inverter device 3, current sensing component 4, and carrier plate 5 respectively;

[0091] The carrier plate 5 is provided with a core cavity 5-1 for installing the voltage stabilizing energy storage capacitor and a semi-surrounding rib 5-2 located outside the core cavity;

[0092] The DC inverter device 3 includes an input-side copper terminal 3-2, an insulating substrate 3-3 with a chip inside, and a plastic encapsulation bracket 3-5 for supporting the entire DC inverter device. The plastic encapsulation bracket 3-5 is connected with a signal terminal 3-4 for connecting the insulating substrate, a plastic card slot 3-1 for connecting the rib strip, and a three-phase copper bar;

[0093] S2: Assemble the current sensing component 4 and install it in the carrier plate 5, weld the insulating substrate 3-3 to the carrier plate 5, align the plastic encapsulation bracket 3-5 with the insulating substrate 3-3, then weld the signal terminal 3-4 to the insulating substrate 3-3, then clamp and position the plastic card slot 3-1 with the rib strip 5-2, and make the plastic encapsulation bracket 3-5 and the current sensing component 4 electrically connected. Lock the carrier plate 5 and the plastic encapsulation bracket 3-5 with screws. Finally, fill silicone inside the plastic encapsulation bracket 5-5 to improve the thermal conductivity and vibration resistance of the chip inside the DC inverter device 3;

[0094] S3: Assemble the input rectification component 1 and the voltage stabilizing energy storage capacitor 2 respectively, install them in the carrier plate 5, and make the input rectification component 1, the voltage stabilizing energy storage capacitor 2, and the DC inverter device 3 electrically connected in sequence.

[0095] The input rectification component 1 can adopt a conventional filtering component. This embodiment provides a preferred implementation. The input rectification component 1 includes a differential-mode ceramic capacitor 1-1, two common-mode ceramic capacitors 1-3, an O-shaped magnetic ring 1-4, and a plastic encapsulation body 1-2 for supporting the entire input rectification component;

[0096] The plastic encapsulation body 1-2 includes an N-pole grounding plate 1-2-1, an N-pole current guiding plate 1-2-3, a P-pole current guiding plate 1-2-5, a P-pole grounding plate 1-2-7, and a body structure for fixing the entire plastic encapsulation body 1-2,

[0097] The assembly process of the input rectification component 1 includes:

[0098] Install the differential-mode ceramic capacitor 1-1, two common-mode ceramic capacitors 1-3, and the O-shaped magnetic ring 1-4 in the plastic encapsulation body 1-2 respectively, and make the differential-mode ceramic capacitor 1-1 connect to the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5 respectively;

[0099] The grounding ends of the two common-mode ceramic capacitors 1-3 are connected to the N-pole grounding plate 1-2-1 and the P-pole grounding plate 1-2-7 respectively, and the output ends of the two common-mode ceramic capacitors 1-3 are connected to the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5 respectively;

[0100] The O-shaped magnetic ring 1-4 is located outside the N-pole current guiding plate 1-2-3 and the P-pole current guiding plate 1-2-5.

[0101] The body structure can adopt a conventional fixed housing, and the N - pole grounding plate 1 - 2 - 1, N - pole current - guiding plate 1 - 2 - 3, P - pole current - guiding plate 1 - 2 - 5, and P - pole grounding plate 1 - 2 - 7 can be specifically arranged. This embodiment provides a preferred implementation manner. The body structure includes a fourth concave cavity 1 - 2 - 4 arranged in the middle, third concave cavities 1 - 2 - 6 and second concave cavities 1 - 2 - 2 located on both sides of the fourth concave cavity, and a first concave cavity 1 - 2 - 8 located above the fourth concave cavity. The N - pole grounding plate 1 - 2 - 1 is located on one side of the second concave cavity 1 - 2 - 2, and the P - pole grounding plate 1 - 2 - 7 is located on one side of the third concave cavity 1 - 2 - 6;

[0102] Both the N - pole current - guiding plate 1 - 2 - 3 and the P - pole current - guiding plate 1 - 2 - 5 include a magnetic - ring through - hole part and a fixing part that are perpendicularly connected to each other. The magnetic - ring through - hole parts of the N - pole current - guiding plate 1 - 2 - 3 and the P - pole current - guiding plate 1 - 2 - 5 are close to each other and are both located in the fourth concave cavity 1 - 2 - 4. The fixing part of the N - pole current - guiding plate 1 - 2 - 3 is provided with an N - pole grounding bent hook 1 - 2 - 3 - 1 and an N - pole bent hook 1 - 2 - 3 - 2. The fixing part of the P - pole current - guiding plate 1 - 2 - 5 is provided with a P - pole grounding bent hook 1 - 2 - 5 - 1 and a P - pole bent hook 1 - 2 - 5 - 2;

[0103] The assembly process of the input rectification component 1 specifically includes:

[0104] Install the differential - mode ceramic capacitor 1 - 1 in the first concave cavity 1 - 2 - 8 and fix it by filling epoxy glue. The differential - mode ceramic - capacitor pins 1 - 1 - 1 of the differential - mode ceramic capacitor 1 - 1 are electrically connected to the P - pole bent hook 1 - 2 - 5 - 2 and the N - pole bent hook 1 - 2 - 3 - 2 through resistance clamp soldering;

[0105] Install two common - mode ceramic capacitors 1 - 3 in the second concave cavity 1 - 2 - 2 and the third concave cavity 1 - 2 - 6 respectively and fix them by filling epoxy glue. The common - mode ceramic - capacitor grounding pins 1 - 3 - 1 of the two common - mode ceramic capacitors 1 - 3 are electrically connected to the P - pole grounding bent hook 1 - 2 - 5 - 1 and the N - pole grounding bent hook 1 - 2 - 3 - 1 through resistance clamp soldering. The common - mode ceramic - capacitor pins 1 - 3 - 2 of the two common - mode ceramic capacitors 1 - 3 are electrically connected to the N - pole grounding plate 1 - 2 - 1 and the P - pole grounding plate 1 - 2 - 7 through resistance clamp soldering;

[0106] The O - shaped magnetic ring 1 - 4 is formed by sintering magnetic materials. Install the O - shaped magnetic ring 1 - 4 in the fourth concave cavity 1 - 2 - 4 so that the magnetic - ring through - hole parts of the N - pole current - guiding plate 1 - 2 - 3 and the P - pole current - guiding plate 1 - 2 - 5 are located inside the O - shaped magnetic ring 1 - 4 and fix it by potting epoxy glue.

[0107] The input rectification component 1 realizes high integration through the plastic-sealed body 1-2, and uses a highly integrated C-L-C (capacitor-inductor-capacitor) filtering structure to filter out loop interference signals. The input rectification component used integrates ceramic differential-mode capacitors, common-mode ceramic capacitors, and O-shaped magnetic rings. After the input current signal passes through the input rectification component and the voltage-stabilizing energy storage capacitor, it can basically be effectively absorbed and filtered, making the entire inverter device have better electromagnetic compatibility performance.

[0108] As a preferred embodiment, the input rectification component 1 is electrically connected to the voltage-stabilizing energy storage capacitor 2 by laser seam welding, and the end of the through part of the N-pole current-carrying plate 1-2-3 and the P-pole current-carrying plate 1-2-5 is connected to the input end of the voltage-stabilizing energy storage capacitor 2.

[0109] As a preferred embodiment, the method further includes: after installing the voltage-stabilizing energy storage capacitor 2 on the carrier plate 5, filling epoxy glue inside the core cavity 5-1 and the rib 5-2.

[0110] As a preferred embodiment, the input-side copper terminal 3-2 adopts an up-and-down stacked design, including a P-terminal 3-2-2 and an N-terminal 3-2-1. There is a gap between the P-terminal 3-2-2 and the N-terminal 3-2-1, and they are injection-molded together with the plastic-sealed bracket 3-5;

[0111] The output end of the voltage-stabilizing energy storage capacitor 2 includes a first terminal and a second terminal. The first terminal corresponds to the position of the P-terminal 3-2-2, and the second terminal corresponds to the position of the N-terminal 3-2-1. The first terminal, the second terminal, the P-terminal 3-2-2, and the N-terminal 3-2-1 are all provided with fastening through holes. When electrically connecting the voltage-stabilizing energy storage capacitor 2 and the DC inverter device 3, the first terminal and the P-terminal 3-2-2 are connected through a fastener passing through the fastening through hole, and the second terminal and the N-terminal 3-2-1 are connected through a fastener passing through the fastening through hole.

[0112] Especially, low-voltage inverter devices are particularly sensitive to loop inductance. Excessive circuit inductance will cause damage to the DC inverter device. The DC inverter device of the present invention is custom-made. The positive and negative copper terminals at its output end adopt a stacked structure, increasing the overlapping area between the positive and negative terminals and reducing the terminal length, thereby reducing the path of loop inductance in terms of structure.

[0113] As a preferred embodiment, an RC absorption circuit is provided in the internal circuit of the DC inverter device 3, further reducing the loop inductance.

[0114] As a preferred embodiment, the signal copper terminal 3-4 is connected to the insulating substrate 3-3 by ultrasonic welding.

[0115] In a conventional power module, the internal signal terminals and the chip are connected by bonding wires. Under relatively harsh conditions, the bonding wires may fail. The present invention uses an ultrasonic welding connection method to replace the bonding process, effectively connecting the signal terminals to the inside of the DC inverter device, greatly improving the mechanical strength and vibration resistance of the DC inverter device, and ensuring the safe operation of the DC inverter device under the condition of high-intensity vibration of the engine.

[0116] As a preferred embodiment, the three-phase copper busbars are injection-molded in the plastic encapsulation bracket 3-5. The method further includes passing the three-phase copper busbar fasteners at the motor end through the current sensing component 4 and electrically connecting the three-phase copper busbars.

[0117] As a preferred embodiment, the carrier plate 5 is supported by a hot forging process and is integrally nickel-plated. The bottom of the carrier plate 5 is provided with heat conducting ribs arranged in a semi-circular pattern.

[0118] The carrier plate 5 is formed by hot forging of aluminum alloy profiles, and its thermal conductivity is more than twice that of ordinary die-cast aluminum alloys. The insulating substrate of the DC inverter device is directly reflow soldered on the surface of this aluminum alloy. With the dense heat conducting ribs on the back of the carrier plate, the heat generated by the core device can be quickly dissipated, and the performance potential of the DC inverter device of the inverter device can be greatly released.

[0119] Combining the above preferred embodiments can obtain an optimal embodiment. The following describes the specific implementation process of this optimal embodiment.

[0120] A method for installing a high-integration, low-inductance, and low-voltage inverter device includes fixing the input rectification component at the front end of the carrier plate through fasteners and laser seam welding it to the input-side copper busbar of the voltage-stabilizing energy storage capacitor. The output-side copper busbar of the voltage-stabilizing energy storage capacitor is electrically connected to the input-side copper terminal of the DC inverter device through fasteners. The entire voltage-stabilizing energy storage capacitor is fixed above the carrier plate through fasteners. The DC inverter device includes an insulating substrate with a chip inside and an external plastic encapsulation bracket. The insulating substrate with the chip is directly reflow soldered to a specific area of the carrier plate, and the external plastic encapsulation bracket is locked on the back of the carrier plate through self-tapping screws. The current sensing component is arranged on the output side of the DC inverter device and fixed to the carrier plate. It has the advantages of excellent heat dissipation, small loop inductance, high vibration resistance, simple assembly process, good electromagnetic compatibility performance, convenient disassembly and repair of later repair parts, and low cost, which is beneficial to the modularization, integration, and miniaturization of the entire starting and generating system.

[0121] Specifically, it includes the following steps:

[0122] First, fix the current induction component 4 in the installation groove of the carrier plate 5. The insulating substrate 3-3 in the DC inverter device 3 is soldered by reflow soldering to a specific area in the middle of the carrier plate 5 after nickel plating treatment. Place the plastic package bracket 3-5 in the DC inverter device 3 on the front side of the carrier plate 5. After the signal terminal 3-4 in the plastic package bracket 3-5 is ultrasonically welded to the insulating substrate 3-3, then clamp and position the plastic card slot 3-1 provided on the plastic package bracket 3-5 with the rib 5-2 of the carrier plate 5. Lock the plastic package bracket 3-5 from the back side of the carrier plate 5 with self-tapping screws. Finally, fill silicone inside the plastic package bracket 5-5 to improve the heat conductivity and vibration resistance of the chips inside the DC inverter device 3.

[0123] Furthermore, obtain the plastic package body 1-2 by integral injection molding, and apply a small amount of epoxy glue at a point in the first concave cavity 1-2-8. Place the differential-mode ceramic capacitor into the first concave cavity 1-2-8. After the epoxy glue cures, apply epoxy glue at points in the second concave cavity 1-2-2, the third concave cavity 1-2-6, and the fourth concave cavity 1-2-4 respectively, and place 2 common-mode ceramic capacitors 1-3 and the O-shaped magnetic ring 1-4 into the corresponding concave cavities for fixation respectively; electrically connect the leads 1-1-1 of the differential-mode ceramic capacitor 1-1 to the bent hooks 1-2-5-2 of the P-pole current conducting plate 1-2-5 and the bent hooks 1-2-3-2 of the N-pole current conducting plate 1-2-3 by resistance clip welding; electrically connect the one-side leads 1-3-1 of the two common-mode ceramic capacitors 1-3 to the bent hooks 1-2-5-1 of the P-pole current conducting plate 1-2-5 and the bent hooks 1-2-3-1 of the N-pole current conducting plate 1-2-3 by resistance clip welding respectively; electrically connect the other-side leads 1-3-2 of the two common-mode ceramic capacitors 1-3 to the N-pole grounding plate 1-2-1 and the P-pole grounding plate 1-2-7 by resistance clip welding respectively; the input rectification assembly obtained after resistance clip welding is then laser seam welded to the input side copper busbar of the voltage stabilizing energy storage capacitor 2.

[0124] Furthermore, integrally install the input rectification assembly 1 and the voltage stabilizing energy storage capacitor 2 after laser seam welding on the front side of the carrier plate 5, and lock the two side feet of the input rectification assembly 1 with fasteners. On the one hand, the input rectification assembly 1 can be fixed, and on the other hand, the grounding of the common-mode ceramic capacitor 1-3 can be achieved; 6 through holes are provided in the voltage stabilizing energy storage capacitor 2, and the voltage stabilizing energy storage capacitor 2 is locked to the carrier plate 5 by passing 6 fasteners through the above 6 through holes, realizing the fixation of the voltage stabilizing energy storage capacitor 2. Then, fix the output side copper busbar of the voltage stabilizing energy storage capacitor 2 and the input side copper terminal of the DC inverter device 3 with fasteners to achieve electrical connection.

[0125] Furthermore, fill epoxy glue inside the core cavity 5-1 and the rib 5-2 of the carrier plate 5, so that the bottom of the entire voltage stabilizing energy storage capacitor 2 is filled with epoxy glue, increasing the heat dissipation and vibration resistance of the capacitor.

[0126] The structure of the highly integrated low-inductance low-voltage inverter device thus obtained is described as follows.

[0127] A highly integrated low-inductance low-voltage inverter device mainly includes an input rectification component 1, a voltage-stabilizing energy storage capacitor 2, a DC inverter device 3, a current sensing component 4, and a carrier board 5. The input rectification component 1 is fixed to the front end of the carrier board 5 by fasteners and is laser seam welded to the input-side copper busbar of the voltage-stabilizing energy storage capacitor 2. The output-side copper busbar of the voltage-stabilizing energy storage capacitor 2 is electrically connected to the input-side copper terminals of the DC inverter device 3 by fasteners. The entire voltage-stabilizing energy storage capacitor 2 is fixed above the carrier board 5 by fasteners. The DC inverter device 3 is locked to the back of the carrier board 5 by self-tapping screws. The current sensing component 4 is arranged on the output side of the DC inverter device 3 and is fixed to the carrier board 5.

[0128] As Figure 3 、 4 shown in Figures 4, 5 and 5, the input rectification component consists of a differential-mode ceramic capacitor, a plastic package body, two common-mode ceramic capacitors, and an O-shaped magnetic ring. The plastic package body 1-2 is manufactured by an integral injection molding process from an N-pole grounding plate 1-2-1, an N-pole current guiding plate 1-2-3, a P-pole current guiding plate 1-2-5, and a P-pole grounding plate 1-2-7. At the same time, the plastic package body 1-2 contains a first cavity 1-2-8, a second cavity 1-2-2, a third cavity 1-2-6, and a fourth cavity 1-2-4.

[0129] The differential-mode ceramic capacitor 1-1 is installed in the first cavity 1-2-8 and is fixed by filling with epoxy glue. The pins 1-1-1 of the differential-mode ceramic capacitor 1-1 are electrically connected to the bent hooks 1-2-5-2 of the P-pole current guiding plate 1-2-5 and the bent hooks 1-2-3-2 of the N-pole current guiding plate 1-2-3 by resistance clip welding.

[0130] The two common-mode ceramic capacitors 1-3 are respectively installed in the second cavity 1-2-2 and the third cavity 1-2-6 of the plastic package body 1-2 and are fixed by filling with epoxy glue. One side pins 1-3-1 of the two common-mode ceramic capacitors 1-3 are electrically connected to the bent hooks 1-2-5-1 of the P-pole current guiding plate 1-2-5 and the bent hooks 1-2-3-1 of the N-pole current guiding plate 1-2-3 by resistance clip welding. The pins 1-3-2 on the other side of the two common-mode ceramic capacitors 1-3 are electrically connected to the N-pole grounding plate 1-2-1 and the P-pole grounding plate 1-2-7 by resistance clip welding. The O-shaped magnetic ring 1-4 is sintered from magnetic materials, is located in the fourth cavity 1-2-4, and is fixed by potting epoxy glue.

[0131] As Figure 6 and 7As shown in the figure, the DC inverter device 3 includes an insulating substrate 3-3 with a chip inside and an external plastic package bracket 3-5; the insulating substrate 3-3 with a chip in the DC inverter device 3 is directly soldered to a specific area of the carrier plate 5 by reflow soldering, and the external plastic package bracket 3-5 is locked on the back of the carrier plate 5 by self-tapping screws; after the insulating substrate 3-3 and the external plastic package bracket 3-5 are welded and fixed on the carrier plate 5, potting silicone treatment is carried out. The external plastic package bracket 3-5 is provided with plastic card slots 3-1 at both ends for clamping the rib strips 5-2 on both sides of the core cavity 5-1 of the carrier plate 5.

[0132] The input-side copper row terminals 3-2 of the DC inverter device 3 all adopt an up-and-down laminated design. The P-terminal 3-2-2 and the N-terminal 3-2-1 have a vertical gap of 0.5 mm and are injection-molded together with the plastic package bracket 3-5.

[0133] The signal copper terminals 3-4 of the DC inverter device 3 are injection-molded inside the plastic package bracket 3-5 and are ultrasonically welded to the insulating substrate 3-3.

[0134] As Figure 8 and 9 shown in the figure, the carrier plate 5 is provided with a core cavity 5-1, rib strips 5-2 and heat-conducting ribs 5-3. The bottom of the voltage-stabilizing energy storage capacitor 2 is located in the core cavity 5-1 of the carrier plate 5. After the voltage-stabilizing energy storage capacitor 2 is installed on the carrier plate 5, epoxy glue is filled inside the core cavity 5-1 and the rib strips 5-2 to facilitate heat dissipation of the voltage-stabilizing energy storage capacitor 2 and enhance its structural strength. The back of the carrier plate 5 is provided with heat-conducting ribs 5-3. Under air-cooled conditions, the circumferentially distributed heat-conducting ribs 5-3 divert the air, thereby effectively dissipating heat from the DC inverter device 3.

[0135] The preferred specific embodiments of the present invention have been described in detail above. It should be understood that those of ordinary skill in the art can make many modifications and variations based on the concept of the present invention without creative work. Therefore, all technical solutions that can be obtained by those skilled in the art in the technical field according to the concept of the present invention through logical analysis, reasoning or limited experiments on the basis of the prior art should be within the protection scope determined by the claims.

Claims

1. A high-integration, low-inductance, low-voltage inverter device, characterized in that, It includes an input rectification component (1), a voltage-stabilizing energy storage capacitor (2), a DC inverter device (3), a current sensing component (4), and a carrier board (5). The input rectification component (1), the voltage-stabilizing energy storage capacitor (2), the DC inverter device (3), and the current sensing component (4) are electrically connected in sequence. The input rectification component (1), the voltage-stabilizing energy storage capacitor (2), the DC inverter device (3), and the current sensing component (4) are all fixed on the carrier board (5) through fasteners; The input rectification component includes a differential-mode ceramic capacitor (1-1), two common-mode ceramic capacitors (1-3), an O-shaped magnetic ring (1-4), and a plastic package body (1-2) that supports the entire input rectification component; The plastic package body (1-2) includes an N-pole grounding plate (1-2-1), an N-pole current guiding plate (1-2-3), a P-pole current guiding plate (1-2-5), a P-pole grounding plate (1-2-7), and a body structure that fixes the entire plastic package body (1-2); The differential-mode ceramic capacitor (1-1) is respectively connected to the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5); The grounding ends of the two common-mode ceramic capacitors (1-3) are respectively connected to the N-pole grounding plate (1-2-1) and the P-pole grounding plate (1-2-7), and the output ends of the two common-mode ceramic capacitors (1-3) are respectively connected to the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5); The O-shaped magnetic ring (1-4) is located outside the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5); The body structure includes a fourth concave cavity (1-2-4) arranged in the middle, third concave cavities (1-2-6) and second concave cavities (1-2-2) located on both sides of the fourth concave cavity, and a first concave cavity (1-2-8) located above the fourth concave cavity. The N-pole grounding plate (1-2-1) is located on one side of the second concave cavity (1-2-2), and the P-pole grounding plate (1-2-7) is located on one side of the third concave cavity (1-2-6); The differential-mode ceramic capacitor (1-1) is installed in the first concave cavity (1-2-8), the two common-mode ceramic capacitors (1-3) are respectively installed in the second concave cavity (1-2-2) and the third concave cavity (1-2-6), and the O-shaped magnetic ring (1-4) is installed in the fourth concave cavity (1-2-4).

2. The high-integration low-inductance low-voltage inverter device according to claim 1, wherein, Both the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5) include a magnetic ring through portion and a fixing portion that are perpendicularly connected to each other. The magnetic ring through portions of the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5) are close to each other and are both located in the fourth concave cavity (1-2-4); the fixing portion of the N-pole current guiding plate (1-2-3) is provided with an N-pole grounding bending hook (1-2-3-1) and an N-pole bending hook (1-2-3-2), and the fixing portion of the P-pole current guiding plate (1-2-5) is provided with a P-pole grounding bending hook (1-2-5-1) and a P-pole bending hook (1-2-5-2); The pins (1-1-1) of the differential-mode ceramic capacitor (1-1) are electrically connected to the P-pole bent hook (1-2-5-2) and the N-pole bent hook (1-2-3-2) respectively. The ground pins (1-3-1) of the two common-mode ceramic capacitors (1-3) are electrically connected to the P-pole ground bent hook (1-2-5-1) and the N-pole ground bent hook (1-2-3-1) respectively. The pins (1-3-2) of the two common-mode ceramic capacitors (1-3) are electrically connected to the N-pole grounding plate (1-2-1) and the P-pole grounding plate (1-2-7) respectively.

3. A high-integration, low-inductance, low-voltage inverter device according to claim 1, characterized in that, The carrier plate (5) is provided with a core cavity (5-1) and a semi-surrounding rib (5-2) located outside the core cavity. The voltage-stabilizing energy storage capacitor is installed in the core cavity (5-1). The DC inverter device (3) includes an input-side copper terminal (3-2), an insulating substrate (3-3) with a chip inside, and a plastic package bracket (3-5) for supporting the entire DC inverter device. The plastic package bracket (3-5) is connected with a signal terminal (3-4) for connecting the insulating substrate, a plastic card slot (3-1) for connecting the rib, and a three-phase copper bar. The insulating substrate (3-3) is connected to the carrier plate (5). The signal terminal (3-4) is connected to the insulating substrate (3-3). The plastic card slot (3-1) is clamped with the rib (5-2). The plastic package bracket (3-5) is electrically connected to the current sensing component (4). The plastic package bracket (3-5) is installed on the carrier plate (5).

4. An installation method of a high-integration low-inductance low-voltage inverter device, characterized in that The high-integration low-inductance low-voltage inverter device includes an input rectification component (1), a voltage-stabilizing energy storage capacitor (2), a DC inverter device (3), a current sensing component (4), and a carrier plate (5). The carrier plate (5) is provided with a core cavity (5-1) for installing the voltage-stabilizing energy storage capacitor and a semi-surrounding rib (5-2) located outside the core cavity. The DC inverter device (3) includes an input-side copper terminal (3-2), an insulating substrate (3-3) with a chip inside, and a plastic package bracket (3-5) for supporting the entire DC inverter device. The plastic package bracket (3-5) is connected with a signal terminal (3-4) for connecting the insulating substrate, a plastic card slot (3-1) for connecting the rib, and a three-phase copper bar. The installation method includes: assembling the current sensing component (4) and installing it in the carrier plate (5), welding the insulating substrate (3-3) to the carrier plate (5), aligning the plastic package bracket (3-5) with the insulating substrate (3-3), then welding the signal terminal (3-4) to the insulating substrate (3-3), clamping and positioning the plastic card slot (3-1) with the rib (5-2), making the plastic package bracket (3-5) and the current sensing component (4) electrically connected, and finally locking the carrier plate (5) and the plastic package bracket (3-5) with screws. Assemble the input rectification component (1) and the voltage stabilizing energy storage capacitor (2) separately and install them in the carrier plate (5) so that the input rectification component (1), the voltage stabilizing energy storage capacitor (2) and the DC inverter device (3) are electrically connected in sequence, and fill epoxy glue inside the core cavity (5-1) and the rib (5-2); The input rectification component (1) includes a differential mode ceramic capacitor (1-1), two common mode ceramic capacitors (1-3), an O-shaped magnetic ring (1-4) and a plastic package body (1-2) for supporting the entire input rectification component; The plastic package body (1-2) includes an N-pole grounding plate (1-2-1), an N-pole current guiding plate (1-2-3), a P-pole current guiding plate (1-2-5), a P-pole grounding plate (1-2-7) and a body structure for fixing the entire plastic package body (1-2); The assembly process of the input rectification component (1) includes: Install the differential mode ceramic capacitor (1-1), two common mode ceramic capacitors (1-3) and the O-shaped magnetic ring (1-4) in the plastic package body (1-2) respectively, and connect the differential mode ceramic capacitor (1-1) to the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5) respectively; The grounding ends of the two common mode ceramic capacitors (1-3) are connected to the N-pole grounding plate (1-2-1) and the P-pole grounding plate (1-2-7) respectively, and the output ends of the two common mode ceramic capacitors (1-3) are connected to the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5) respectively; The O-shaped magnetic ring (1-4) is located outside the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5); The body structure includes a fourth cavity (1-2-4) arranged in the middle, third cavities (1-2-6) and second cavities (1-2-2) located on both sides of the fourth cavity, and a first cavity (1-2-8) located above the fourth cavity. The N-pole grounding plate (1-2-1) is located on one side of the second cavity (1-2-2), and the P-pole grounding plate (1-2-7) is located on one side of the third cavity (1-2-6); Both the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5) include a magnetic ring through part and a fixing part that are perpendicularly connected to each other. The magnetic ring through parts of the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5) are close to each other and are both located in the fourth cavity (1-2-4); the fixing part of the N-pole current guiding plate (1-2-3) is provided with an N-pole grounding bent hook (1-2-3-1) and an N-pole bent hook (1-2-3-2), and the fixing part of the P-pole current guiding plate (1-2-5) is provided with a P-pole grounding bent hook (1-2-5-1) and a P-pole bent hook (1-2-5-2); The specific assembly process of the input rectification component (1) includes: Install the differential-mode ceramic capacitor (1-1) in the first concave cavity (1-2-8) and fix it by filling with epoxy glue. The pins (1-1-1) of the differential-mode ceramic capacitor are electrically connected to the P-pole bent hook (1-2-5-2) and the N-pole bent hook (1-2-3-2) by resistance clip welding respectively; Install the two common-mode ceramic capacitors (1-3) in the second concave cavity (1-2-2) and the third concave cavity (1-2-6) respectively and fix them by filling with epoxy glue; the grounding pins (1-3-1) of the two common-mode ceramic capacitors are electrically connected to the P-pole grounding bent hook (1-2-5-1) and the N-pole grounding bent hook (1-2-3-1) by resistance clip welding respectively; the pins (1-3-2) of the two common-mode ceramic capacitors are electrically connected to the N-pole grounding plate (1-2-1) and the P-pole grounding plate (1-2-7) by resistance clip welding respectively; The O-shaped magnetic ring (1-4) is sintered from magnetic materials. Install the O-shaped magnetic ring (1-4) in the fourth concave cavity (1-2-4) so that the magnetic ring through parts of the N-pole current guiding plate (1-2-3) and the P-pole current guiding plate (1-2-5) are located inside the O-shaped magnetic ring (1-4) and fix it by potting epoxy glue.

5. The installation method of a highly integrated low-inductance low-voltage inverter device according to claim 4, characterized in that The input-side copper terminal (3-2) adopts an up-and-down stacked design, including a P-pole terminal (3-2-2) and an N-pole terminal (3-2-1). There is a gap between the P-pole terminal (3-2-2) and the N-pole terminal (3-2-1), and it is injection-molded together with the plastic package bracket (3-5); The output end of the voltage-stabilizing energy storage capacitor (2) includes a first terminal and a second terminal. The first terminal corresponds to the position of the P-pole terminal (3-2-2), and the second terminal corresponds to the position of the N-pole terminal (3-2-1). The first terminal, the second terminal, the P-pole terminal (3-2-2) and the N-pole terminal (3-2-1) are all provided with fastening through holes. When electrically connecting the voltage-stabilizing energy storage capacitor (2) and the DC inverter device (3), connect the first terminal and the P-pole terminal (3-2-2) through the fastening through hole by a fastener, and connect the second terminal and the N-pole terminal (3-2-1) through the fastening through hole by a fastener.

6. The installation method of a highly integrated low-inductance low-voltage inverter device according to claim 4, characterized in that, The three-phase copper busbar is injection-molded in the plastic package bracket (3-5), and the plastic package bracket (3-5) is also inlaid with round nuts; The method further includes passing the three-phase copper busbar fastener at the motor end through the current sensing component (4), connecting the plastic package bracket (3-5) through a round nut, and electrically connecting it to the three-phase copper busbar.

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