Test device

By designing a detachable motherboard and daughterboard structure, the problems of high cost and inconvenience in replacing integrated circuit chip test daughterboards are solved, enabling flexible adaptation to the testing of different types of chips and improving testing efficiency and compatibility.

CN115267480BActive Publication Date: 2025-11-28SKY CHIP INTERCONNECTION TECH CO LTD
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Patent Information

Application Number
CN202111619098.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-12-27
Publication Date
2025-11-28
Estimated Expiration
2041-12-27

AI Technical Summary

Technical Problem

In existing technologies, integrated circuit chip test boards are costly and inconvenient to replace, resulting in low testing efficiency.

Method used

Design a testing device that uses a detachable motherboard and multiple daughter boards. The daughter boards include detachable chip mounting circuit boards and peripheral circuit integrated circuit boards. The detachable connectors allow for flexible replacement to adapt to different types of chips and packages.

Benefits of technology

It improves the compatibility and adaptability of the testing equipment, reduces the manufacturing cost and time of the daughterboard, and improves the efficiency of chip testing.

✦ Generated by Eureka AI based on patent content.

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    Figure CN115267480B_ABST
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Abstract

The application discloses a test device, wherein the test device comprises a motherboard, a plurality of test areas are arranged on the motherboard, a plurality of sub-boards, each sub-board comprises a chip mounting circuit board and a peripheral circuit integrated circuit board which are detachably connected, and each sub-board is detachably connected to a test area on the motherboard through the chip mounting circuit board. Through the above structure, the test device can flexibly replace the chip mounting circuit board and the peripheral circuit integrated circuit board to cope with different chip tests by using the detachable connection of the chip mounting circuit board and the peripheral circuit integrated circuit board, so that the test device can avoid replacing the entire sub-board to realize the test of different chips, improve the compatibility of the test device, and further reduce the manufacturing cost and time of the sub-board and improve the efficiency of the chip test.
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Citation Information

Patent Citations

  • Aging test device and method of integrated circuit chip on the basis of daughter boards and mother board

    CN106771987A

  • Chip testing assembly, chip testing system and chip testing method

    CN112834909A