Electronic device

Abstract

The board shield (52) covers the area on the lower surface of the circuit board (50) where electronic components are mounted. A memory accommodation chamber (R1) capable of accommodating a semiconductor memory is fixed to the lower side of the circuit board. The board shield (52) includes a shielding wall (52e) along the memory accommodation chamber (R1). Thereby, the semiconductor memory can be protected while suppressing an increase in the number of components.

Description

Technical Field

[0001] The present disclosure relates to an electronic device in which a semiconductor memory can be used as an external storage device. Background Art

[0002] Many electronic devices such as personal computers or game consoles have a hard disk drive as an external storage device. For example, Japanese Patent Laid-Open No. 2018-18452 discloses a game console including a hard disk drive as an external storage device for storing game data and the like. The electronic device is configured to allow replacement of the hard disk drive. A user can install a hard disk drive having a large storage capacity in the electronic device by a simple operation. Summary of the Invention

[0003] In some cases, a semiconductor memory called an SSD (Solid State Drive) can be used as an external storage device of an electronic device. It is preferable to protect the semiconductor memory so that, for example, the influence of external static electricity is reduced.

[0004] The electronic device proposed in the present disclosure includes: a circuit board having electronic components mounted on a surface on one side of the circuit board; a board shield covering a region where the electronic components are provided on the surface on one side of the circuit board; and a memory accommodation chamber defined on one side of the circuit board and capable of accommodating a semiconductor memory. The board shield includes a shielding wall along the memory accommodation chamber. With this electronic device, the semiconductor memory can be protected while suppressing an increase in the number of components. Brief Description of the Drawings

[0005] Figure 1A is a perspective view showing an example of an electronic device according to an embodiment of the present disclosure;

[0006] Figure 1B is a perspective view showing the electronic device;

[0007] Figure 1C is a front view showing the electronic device;

[0008] Figure 1D is a plan view showing the electronic device;

[0009] Figure 1E is a right side view showing the electronic device;

[0010] Figure 1F is a left side view showing the electronic device;

[0011] Figure 1G is a rear view showing the electronic device;

[0012] Figure 1H is a bottom view showing the electronic device;

[0013] Figure 2A is an exploded perspective view showing a device body and upper and lower outer panels included in an electronic device in a disassembled state;

[0014] Figure 2B is an exploded perspective view showing a device body and upper and lower outer panels included in an electronic device in a disassembled state;

[0015] Figure 3 is an exploded perspective view showing internal components of an electronic device;

[0016] Figure 4 is an exploded perspective view of a housing and a front cover included in the device body;

[0017] Figure 5 is a perspective view showing the inside of an upper housing member;

[0018] Figure 6A is a plan view of the device body;

[0019] Figure 6B is a plan view showing the positional relationship between an air flow channel and components formed on the upper side of a circuit board;

[0020] Figure 7A is a sectional view of the device body taken in a cutting plane represented by line VIIa-VIIa in Figure 6B ;

[0021] Figure 7B is a sectional view of the device body taken in a cutting plane represented by line VIIb-VIIb in Figure 6B ;

[0022] Figure 7C is a sectional view of the device body taken in a cutting plane represented by line VI1c-VI1c in Figure 6B ;

[0023] Figure 8A is a bottom view of the device body;

[0024] Figure 8B is a bottom view showing the positional relationship between an air flow channel and components formed on the lower side of a circuit board;

[0025] Figure 9 is a sectional view of the device body taken in a cutting plane represented by line IX-IX in Figure 7A ;

[0026] Figure 10A is a plan view of a fan shroud;

[0027] Figure 10Bis a cross-sectional view of the fan shroud and the cooling fan, which is represented by the line Xb-Xb in Figure 10A ;

[0028] Figure 11A is a perspective view of the power supply unit;

[0029] Figure 11B is a cross-sectional view of the intake wall and the side wall;

[0030] Figure 12 is a cross-sectional view of the device main body, which is obtained in the cutting plane represented by the line XII-XII in Figure 6B ;

[0031] Figure 13A is a plan view of the heat dissipation device provided on the upper side of the circuit board, and the heat dissipation device is shown in Figure 3 ;

[0032] Figure 13B is Figure 13A the bottom view of the heat dissipation device shown, in which the substrate supporting the fins is omitted;

[0033] Figure 14A is a cross-sectional view of the heat dissipation device and the circuit board, which is obtained in the cutting plane represented by the line XIVa-XIVa in Figure 13A ;

[0034] Figure 14B is a cross-sectional view of the heat dissipation device, which is obtained in the cutting plane represented by the line XIVb-XIVb in Figure 13A ;

[0035] Figure 14C is a cross-sectional view of the heat dissipation device and the circuit board, which is obtained in the cutting plane represented by the line XIVc-XIVc in Figure 13B ;

[0036] Figure 15 is a view showing the lower surface of the circuit board;

[0037] Figure 16A is a cross-sectional view of the circuit board and the board shield, which is represented by the line XVIa-XVIa in Figure 15 and shows the side surface of the heat dissipation device;

[0038] Figure 16B is a schematic view (plan view) of the heat dissipation device observed from the circuit board side;

[0039] Figure 17A is a schematic view (plan view) of the modified heat dissipation device observed from the circuit board side;

[0040] Figure 17Bis a cross-sectional view obtained in a cutting plane indicated by line XVIIb-XVIIb in Figure 17A ;

[0041] Figure 17C is a side view of a modified heat dissipation device;

[0042] Figure 18A is a cross-sectional view obtained in a cutting plane indicated by line XVIIIa-XVIIIa in Figure 8A ;

[0043] Figure 18B is a cross-sectional view obtained in a cutting plane indicated by line XVIII b-XVIII in Figure 18A ;

[0044] Figure 18C is a cross-sectional view obtained in a cutting plane indicated by line XVIIIc-XVIIIc in Figure 18A ;

[0045] Figure 19 is a plan view showing a memory accommodation chamber, in which a plate shield is depicted;

[0046] Figure 20A is a cross-sectional view of an outer panel and a housing, the cross-sectional view being obtained in a cutting plane indicated by line XXa-XXa in Figure 1D ;

[0047] Figure 20B is a cross-sectional view of an outer panel and a housing, the cross-sectional view being obtained in a cutting plane indicated by line XXb-XXb in Figure 1D ;

[0048] Figure 21A is a cross-sectional view of an outer panel and a housing of an electronic device excluding an optical disc drive, wherein the cutting plane of the cross-sectional view is the same as the cutting plane indicated by line XXa-XXa in Figure 1D ;

[0049] Figure 21B is Figure 21A a cross-sectional view of the outer panel and the housing shown, wherein the cutting plane of the cross-sectional view is the same as the cutting plane indicated by line XXb-XXb in Figure 1D ;

[0050] Figure 21C is Figure 21A a front view of the electronic device shown;

[0051] Figure 22 is a cross-sectional view of an upper outer panel and an upper housing member, the cross-sectional view being obtained in a cutting plane indicated by line XX-XX in Figure 1D ;

[0052] Figure 23 is a schematic view for helping to explain the attachment structure of the upper outer panel and the upper housing member;

[0053] Figure 24 is a modified perspective view for helping to explain the attachment structure of the upper outer panel and the upper housing member;

[0054] Figure 25 is a cross-sectional view of the electronic device, and this cross-sectional view is obtained in the cutting plane indicated by the line XXV - XXV in Figure 1C ;

[0055] Figure 26A is a plan view showing Figure 13A the modification of the heat dissipation device shown;

[0056] Figure 26B is Figure 26A a side view of the heat dissipation device shown, and is a view of the heat dissipation device observed in the direction indicated by the arrow XXVIb in the figure;

[0057] Figure 26C is Figure 26A a plan view of the heat dissipation device shown, in which the radiator is omitted;

[0058] Figure 27 is Figure 26A a plan view of the device body including the heat dissipation device shown. DETAILED DESCRIPTION

[0059] Embodiments of the present disclosure will be described below with reference to the accompanying drawings. Figures 1A to 1H etc. show the electronic device 1 as an example of an embodiment. In the following description, Figures 1A to 1H the X1 and X2 shown will be set as the rightward direction and the leftward direction respectively, the Y1 and Y2 will be set as the forward direction and the backward direction respectively, and the Z1 and Z2 will be set as the upward direction and the downward direction respectively. However, these directions are defined to describe the shape, relative positional relationship, movement, etc. of the components (parts, members, and portions) of the electronic device 1, and do not limit the posture of the electronic device 1 during use. For example, although Figure 1A etc. show the electronic device 1 in a horizontally placed posture, during use, the electronic device 1 can be in a vertically placed posture. ("Vertically placed posture" is a posture in which the right side surface or the left side surface of the electronic device 1 is the lower side.)

[0060] The electronic device 1 is, for example, an entertainment device used as a game device or an audio-visual device. The electronic device 1 outputs moving image data generated by executing a game program, video and audio data obtained through a network, and video and audio data obtained from a recording medium such as an optical disc to a display device such as a television set. The electronic device may be, for example, a personal computer.

[0061] [Conventional configuration]

[0062] As Figure 2A shown, the electronic device 1 includes a device main body 10, an upper outer panel 20A covering the upper side of the device main body 10, and a lower outer panel 20B covering the lower side of the device main body 10. As Figure 3 shown, the device main body 10 includes a circuit board 50, internal devices such as a heat dissipation device 70, and a housing 30 that houses the internal devices. The housing 30 includes an upper housing member 30A covering the upper side of the circuit board 50 and a lower housing member 30B covering the lower side of the circuit board 50. These housings are joined to each other in the vertical direction. The upper housing member 30A forms the upper surface of the device main body 10. The lower housing member 30B forms the lower surface of the device main body 10. The upper outer panel 20A can be detached from the upper housing member 30A. The lower outer panel 20B can be detached from the lower housing member 30B. The outer panels 20A and 20B and the housing members 30A and 30B include, for example, resins such as acrylonitrile-butadiene-styrene (ABS) resin or polycarbonate.

[0063] As Figure 1A shown, the device main body 10 may have a power button 2a and a disc eject button 2b on the front surface of the device main body 10. The device main body 10 may also have connectors 3a and 3b on its front surface. In addition, the device main body 10 may have connectors 4a to 4e in the rear surface of the device main body 10 (see Figure 1G ).

[0064] As Figure 3 shown, in addition to the circuit board 50 and the power supply unit 60, the device main body 10 further includes a cooling fan 5, a heat dissipation device 70, and a disc drive 6 as internal devices. As described below, the heat dissipation device 70 includes radiators 71 and 72 (see Figure 6B ) and heat pipes 73A to 73F (see Figure 13B ). The upper surface of the circuit board 50 is covered with an upper board shield 51 that blocks electromagnetic waves from the electronic components mounted on the upper surface. The lower surface of the circuit board 50 is covered with a lower board shield 52 that blocks electromagnetic waves from the electronic components mounted on the lower surface. The board shields 51 and 52 are respectively attached to the upper surface and the lower surface of the circuit board 50. The board shields 51 and 52 are metal plates. The material of the metal plates may be, for example, iron, stainless steel, aluminum, etc.

[0065] [Overview of Component Layout]

[0066] The power supply unit 60 and the heat dissipation device 70 are provided, for example, on the upper side of the circuit board 50 (more specifically, on the upper side of the upper board shield 51). The integrated circuit 50a (see Figure 3 ) serving as a central processing unit (CPU), a graphics processing unit (GPU), etc. is mounted on the upper surface of the circuit board 50. The integrated circuit 50a is a heat generating device and is connected to the heat dissipation device 70. The power supply unit 60 is also a heat generating device. The air flow generated by the cooling fan 5 is supplied to the heat dissipation device 70 and the power supply unit 60. The layout of the internal devices such as the heat dissipation device 70, the power supply unit 60, and the cooling fan 5 is not limited to the example of the electronic device 1.

[0067] The optical disc drive 6 is provided, for example, on the lower side of the circuit board 50 (more specifically, on the lower side of the lower board shield 52). The heat dissipation device 80 (see Figure 7A ) can be provided on the lower side of the circuit board 50. Electronic components (for example, power transistors that generate driving power for the integrated circuit 50a) are mounted on the lower surface of the circuit board 50. The heat dissipation device 80 can be connected to the electronic component.

[0068] [Cooling Fan]

[0069] As Figure 7A shown, the cooling fan 5 is arranged such that the rotation center line Cf of the cooling fan 5 is along the thickness direction of the circuit board 50 (the up - and - down direction in the electronic device 1). In addition, the cooling fan 5 is provided outside the outer edge of the circuit board 50. The cooling fan 5 is provided, for example, on the right side of the right edge of the circuit board 50. In the description here, the up - and - down direction of the electronic device 1 is the direction along the normal line of the circuit board 50. In addition, the directions mentioned in this specification do not limit the posture of the electronic device 1 during use. Therefore, when the electronic device 1 is arranged in a vertically placed posture, for example, the rotation center line Cf of the cooling fan 5 is a line along the left - and - right direction.

[0070] The cooling fan 5 can have a portion above the horizontal plane Hp1 including the circuit board 50 and a portion below the horizontal plane Hp1 including the circuit board 50. More specifically, each of the plurality of fins 5a that rotate around the rotation center line Cf can have a portion 5b above the horizontal plane Hp1 and a portion 5c below the horizontal plane Hp1. This arrangement of the cooling fan 5 can generate an air flow F1 along the upper surface of the circuit board 50 and an air flow F2 along the lower surface of the circuit board 50. Therefore, the heat generating devices arranged or mounted on the upper side of the circuit board 50 and the heat generating devices arranged or mounted on the lower side of the circuit board 50 can be cooled without increasing the number of components.

[0071] As Figure 2AAs shown, the upper housing member 30A has an upper inlet 31a located above the cooling fan 5. As Figure 2B shown, the lower housing member 30B has a lower inlet 31b located below the cooling fan 5. By forming the inlets 31a and 31b in the upper and lower surfaces of the housing 30 respectively, air can be effectively drawn into the interior of the housing 30.

[0072] The heat generation amount of the heat generating devices arranged on the upper surface of the circuit board 50 can be greater than that of the heat generating devices arranged on the lower surface of the circuit board 50. For example, the total heat generation amount of the integrated circuit 50a and the power supply unit 60 arranged on the upper surface of the circuit board 50 can be greater than the total heat generation amount of the electronic components 50c (such as power transistors and integrated circuits such as memories) arranged on the lower surface of the circuit board 50. When the heat generating devices are arranged in this way, the center Ch of the cooling fan 5 in the vertical direction can be located above the horizontal plane Hp1 including the circuit board 50, as Figure 7A shown. This enables a large amount of air to be supplied to the devices that generate a large amount of heat.

[0073] As Figure 7A shown, the distance D5 between the upper inlet 31a and the lower inlet 31b corresponds to the width of the cooling fan 5 in the vertical direction. Therefore, air is drawn in from the inlets 31a and 31b and flows smoothly in the radial direction of the cooling fan 5. In the example of the electronic device 1, the lower part (specifically, the substrate 5d, see Figure 3 ) of the cooling fan 5 is attached to the edge of the lower inlet 31b. On the other hand, the upper end of the cooling fan 5 (specifically, the upper end of the rotor 5e) is located at substantially the same height as the edge of the inlet 31a.

[0074] The distance in the vertical direction between the upper housing member 30A and the lower housing member 30B at the positions of the inlets 31a and 31b, that is, the distance D5 between the inlets 31a and 31b (see Figure 7A ), can be smaller than the distance between the upper housing member 30A and the lower housing member 30B at other positions. In the example of the electronic device 1, the upper housing member 30A has a recessed plate portion 32a in its upper surface (see Figure 2A ). The recessed plate portion 32a is recessed toward the circuit board 50 with respect to another part 32c in the upper surface. (In the description here, another part 32c will be referred to as the "main board portion".) The upper inlet 31a is formed in the recessed plate portion 32a. The heat dissipation device 70, the power supply unit 60, etc. are arranged between the main board portion 32c and the circuit board 50.

[0075] Similar to the upper housing member 30A, the lower housing member 30B has a recessed plate portion 32b in its lower surface. As Figure 2BAs shown, the recessed plate portion 32b is recessed with respect to another portion 32d in the lower surface. (In the description herein, the other portion 32d will be referred to as the "main board portion.") The lower inlet 31b is formed in the recessed plate portion 32b. The fins 81 of the heat dissipation device 80 (see Figure 8A and Figure 8B ) are arranged between the main board portion 32d and the circuit board 50.

[0076] Then, the distance between the upper and lower recessed plate portions 32a and 32b corresponds to the height of the cooling fan 5. According to this structure, a sufficient distance between the upper and lower main board portions 32c and 32d can be ensured, and sufficient space for the heat dissipation devices 70 and 80 arranged between the upper and lower main board portions 32c and 32d can be ensured, while making the distance between the inlets 31a and 31b correspond to the height of the cooling fan 5.

[0077] As Figure 3 shown, the cooling fan 5 includes a rotor 5e having a plurality of fins 5a and a substrate 5d supporting the rotor 5e. The rotor 5e is rotatable relative to the substrate 5d. As Figure 8B shown, the substrate 5d may have, for example, an annular peripheral portion 5f, a central portion 5g located inside the peripheral portion 5f, and a bridge 5i connecting the peripheral portion 5f and the central portion 5g to each other. Such a substrate 5d can be attached to the lower housing member 30B. Specifically, the annular peripheral portion 5f can be attached to the edge of the lower inlet 31b.

[0078] Since such a substrate 5d is located on the lower side of the cooling fan 5, the air resistance on the upper part of the cooling fan 5 is smaller than the air resistance on the lower part of the cooling fan 5. As described above, the heat generation amount of the heat generating device arranged on the upper surface of the circuit board 50 is greater than the heat generation amount of the heat generating device arranged on the lower surface of the circuit board 50. That is, the cooling fan 5 is arranged such that the upper part of the cooling fan 5 with small air resistance corresponds to such a flow channel in which the device generating a large amount of heat is arranged.

[0079] The circuit board 50 may have a curved edge 50b (see Figure 15 ) bent in an arc shape as the right edge of the circuit board 50. The cooling fan 5 is arranged inside the curved edge 50b. According to this arrangement of the circuit board 50 and the cooling fan 5, airflows can be generated on both the upper surface and the lower surface of the circuit board 50 while suppressing an increase in the size of the electronic device 1.

[0080] [Position relationship between the cooling fan and the radiator]

[0081] The power supply unit 60 and the heat dissipation device 70 can be arranged side by side with each other in the left - right direction. For example, as Figure 6BAs shown, the first heat sink 71 is provided on the right side of the power supply unit 60. The cooling fan 5 can be arranged such that the center line Cf of the cooling fan 5 is located on the right side of the right end of the first heat sink 71. In the example of the electronic device 1, the entire cooling fan 5 is located on the right side of the right end of the first heat sink 71. According to this layout, even when the size of the first heat sink 71 in the front-rear direction increases, the first heat sink 71 and the cooling fan 5 do not interfere with each other. Therefore, an increase in the size of the entire electronic device 1 in the front-rear direction can be suppressed while ensuring a sufficient size of the first heat sink 71 in the front-rear direction. In the description herein, the front-rear direction of the heat sink 71 is the direction in which air passes through the heat sink 71. The left-right direction is the direction orthogonal to the direction in which air passes through the heat sink 71. In addition, the directions mentioned in this specification do not limit the attitude of the electronic device 1 during use. Therefore, for example, the power supply unit 60 and the heat dissipation device 70 can be arranged adjacent to each other in the front-rear direction, and the cooling fan 5 and the heat sink 71 can also be arranged adjacent to each other in the front-rear direction. In this case, the size of the heat sink 71 in the left-right direction can be increased.

[0082] As Figure 6B shown, the cooling fan 5 is located behind the front end 61n of the power supply unit housing 61, which will be described later. In addition, the center line Cf of the cooling fan 5 is located behind the front end of the first heat sink 71.

[0083] As Figure 6B shown, the second heat sink 72 (heat dissipation device) can be provided on the right side of the first heat sink 71. Then, at least a part of the cooling fan 5 can be located in front of the second heat sink 72. According to this arrangement of the cooling fan 5 and the second heat sink 72, the air flowing backward from the cooling fan 5 can also be effectively used.

[0084] As Figure 6B shown, the width of the second heat sink 72 in the front-rear direction can be smaller than the width of the first heat sink 71 in the front-rear direction. Then, the cooling fan 5 can be provided in front of the second heat sink 72. According to this arrangement of the heat sinks 71 and 72 and the cooling fan 5, the air flowing backward from the cooling fan 5 can be effectively utilized while suppressing an increase in the size of the electronic device 1 in the front-rear direction.

[0085] As will be explained in detail later, the heat dissipation device 70 has a plurality of heat pipes 73A to 73F (see Figure 13B ). The two heat sinks 71 and 72 are thermally connected to each other through the plurality of heat pipes 73. In addition, the two heat sinks 71 and 72 are fixed to a common substrate 75 (see Figure 13A ).

[0086] Incidentally, unlike the example of the electronic device 1, the first heat sink 71 and the second heat sink 72 may not be connected to each other through a heat transfer device such as a heat pipe. For example, the second heat sink 72 may be used to cool a heat generating component (e.g., an electronic component) different from the integrated circuit 50a to which the first heat sink 71 is connected. Additionally, the component provided on the right side of the first heat sink 71 and behind the cooling fan 5 may not be the heat sink 72. For example, the heat generating component to be cooled (e.g., an electronic component) may be provided behind the cooling fan 5.

[0087] [Airflow Channel between the Housing and the Outer Panel]

[0088] The upper surface of the housing 30 is covered by the upper outer panel 20A. A gap Ua (see Figure 20A ) that allows air to flow to the upper inlet 31a may be formed between the upper surface of the housing 30 and the upper outer panel 20A. (The gap Ua will be referred to as the upper flow channel hereinafter.) As described above, the upper surface of the upper housing member 30A has a recessed plate portion 32a that is recessed with respect to the main board portion 32c (see Figure 2A ). The recessed plate portion 32a is formed, for example, at the right front of the upper housing member 30A, and the upper inlet 31a is formed in the recessed plate portion 32a. For example, the upper flow channel Ua is fixed between the recessed plate portion 32a and the upper outer panel 20A.

[0089] The upper flow channel Ua may open, for example, toward the front side and / or the right side of the electronic device 1. That is, an inlet may be provided between the front edge of the upper surface of the upper housing member 30A (specifically, the front edge of the recessed plate portion 32a) and the front edge of the upper outer panel 20A, or an inlet may be provided between the right edge of the upper surface of the upper housing member 30A (specifically, the right edge of the recessed plate portion 32a) and the right edge of the upper outer panel 20A. In the example of the electronic device 1, as Figure 1C and Figure 1E shown, an inlet Ea that extends from the front edge of the upper surface of the upper housing member 30A and the upper outer panel 20A to the right edge of the upper outer panel 20A is provided. The inlet Ea may extend, for example, from the center in the left - right direction of the front edge of the upper outer panel 20A to the rear of the right edge of the upper outer panel 20A. The upper housing member 30A may have a louver 33A in the inlet Ea.

[0090] The lower surface of the housing 30 is covered by the lower outer panel 20B. The lower surface of the housing 30 of the electronic device 1 and the lower outer panel 20B may have the same structure as the above - described structure of the housing 30 and the upper outer panel 20A.

[0091] That is, a gap Ub (see Figure 20A)It can be formed between the lower surface of the housing 30 and the lower outer panel 20B. (The gap Ub will be referred to as the lower flow channel Ub hereinafter.) As described above, the lower surface of the lower housing member 30B has a recessed plate portion 32b that is recessed with respect to the main board portion 32d (see FIG. 2b). The recessed plate portion 32b is formed, for example, at the right front portion of the lower housing member 30B, and the lower inlet 31b is formed in the recessed plate portion 32b. For example, the lower flow channel Ub is fixed between the recessed plate portion 32b and the lower outer panel 20B.

[0092] The lower flow channel Ub can also be open, for example, toward the front side and / or the right side of the electronic device 1. That is, the inlet can be provided between the front edge of the lower surface of the lower housing member 30B (specifically, the front edge of the recessed plate portion 32b) and the front edge of the lower outer panel 20B, or the inlet can be provided between the right edge of the lower surface of the lower housing member 30B (specifically, the right edge of the recessed plate portion 32b) and the right edge of the lower outer panel 20B. In the example of the electronic device 1, as Figure 1C and Figure 1E shown, an inlet Eb is provided that extends from the front edge of the lower surface of the lower housing member 30B and the front edge of the lower outer panel 20B to the right edge of the lower outer panel 20B. The inlet Eb can, for example, extend from the center in the left - right direction of the front edge of the lower outer panel 20B to the rear portion of the right edge of the lower outer panel 20B. The lower housing member 30B can have a shutter 33B in the inlet Eb.

[0093] The portion of the upper surface of the upper housing member 30A other than the recessed plate portion 32a, that is, the main board portion 32c, is close to the upper outer panel 20A. The main board portion 32c and the upper outer panel 20A can be in contact with each other, or a gap can be formed between the main board portion 32c and the upper outer panel 20A, and the width of this gap in the up - down direction is smaller than that of the upper flow channel Ua.

[0094] The air flow formed by driving the cooling fan 5 is discharged backward from the exhaust port M formed in the rear surface of the housing 30 (see Figure 1G and Figure 6A ). The shutters 33C and 33D can be formed in the exhaust port M. As Figure 2A shown, the main board portion 32c can have a portion 32e located behind the recessed plate portion 32a. According to this structure, the main board portion 32c can prevent the air discharged backward from the exhaust port M from flowing again toward the inlet 31a.

[0095] The part of the lower surface of the lower housing member 30B other than the recessed plate portion 32b, that is, the main board portion 32d, approaches the lower outer panel 20B. The main board portion 32d and the lower outer panel 20B may be in contact with each other, or a gap may be formed between the main board portion 32d and the lower outer panel 20B, and the width of the gap in the vertical direction is smaller than that of the lower flow channel Ub. As Figure 2B shown, the main board portion 32d may have a portion 32f located at the rear side of the recessed plate portion 32b. According to this structure, the main board portion 32d can prevent the air discharged backward from the exhaust port M from flowing back to the inlet 31b again.

[0096] The outer surface of the electronic device 1 is curved such that the width of the electronic device 1 in the vertical direction increases in the right front portion of the electronic device 1 where the inlets 31a and 31b are formed. In other words, the outer panels 20A and 20B are curved such that the distance between the outer panels 20A and 20B increases in the right front portion of the electronic device 1. Such an outer shape of the electronic device 1 makes it easy to ensure sufficient widths of the above-mentioned flow channels Ua and Ub in the vertical direction. The curvature of the outer panels 20A and 20B will be explained in detail later.

[0097] Incidentally, the positions of the inlets 31a and 31b formed in the housing 30 and the positions of the inlets Ea and Eb formed between the housing 30 and the outer panels 20A and 20B are not limited to the examples shown in the electronic device 1. For example, the inlets 31a and 31b may be formed in the left side portion of the housing 30. In addition, the inlets 31a and 31b may be formed only in the upper surface or the lower surface of the housing 30. The positions of the inlets Ea and Eb can be appropriately changed according to the positions of the inlets 31a and 31b.

[0098] As Figure 6A shown, the electronic device 1 may have a fan shroud 38A attached to the edge of the inlet 31a and covering the upper side of the cooling fan 5. Similarly, the electronic device 1 may have a fan shroud 38B attached to the edge of the inlet 31b and covering the lower side of the cooling fan 5.

[0099] As Figure 10A shown, the fan shroud 38A includes a plurality of rings 38a, a central portion 38b located at the center of the plurality of rings 38a, and a plurality of spokes 38c extending from the outer ring 38a to the central portion 38b. In the example of the electronic device 1, the cooling fan 5 rotates in the clockwise direction in the plan view. The spokes 38c are inclined so as to be consistent with the rotation direction of the cooling fan 5. Specifically, the spokes 38c are inclined with respect to the radial direction so as to advance toward the center Cf in the clockwise direction. According to this structure, the spokes 38c can avoid becoming an air resistance.

[0100] AsFigure 10B As shown, the positions of the multiple rings 38a and the position of the central portion 38b rise toward the center Cf. In addition, the spokes 38c extend obliquely so as to rise toward the center Cf. This can increase the area of the opening formed between the ring 38a and the spoke 38c.

[0101] As described above, the spokes 38c extend obliquely, thus rising toward the center Cf. On the other hand, each ring 38a may have a cross-section along a plane ( Figure 10B plane Hp5 in) perpendicular to the rotation center line Cf of the cooling fan 5. This can increase the area of the opening formed between the ring 38a and the spoke 38c. The upper outer panel 20A is provided on the upper side of the fan shroud 38A. As described above, the upper outer panel 20A is curved. The fan shroud 38A may be curved in accordance with the curvature of the upper outer panel 20A.

[0102] The fan shroud 38B covering the lower side of the cooling fan 5 may have the same structure as the upper fan shroud 38A. That is, the fan shroud 38B can be obtained by inverting the upper surface and the lower surface of the fan shroud 38A.

[0103] [Power supply unit]

[0104] As Figure 7B shown, the power supply unit 60 includes a power supply circuit 62 and a power supply unit housing 61 that houses the power supply circuit 62. The power supply unit housing 61 has a wall portion 61a located in front of the first radiator 71. A plurality of intake holes 61b may be formed in the wall portion 61a. (The wall portion 61a will be referred to as the "intake wall" hereinafter.) As Figure 6B shown, the radiators 71 and 72 have a plurality of fins 71a and 72a arranged side by side in the left-right direction. Therefore, air passes through the radiators 71 and 72 in the front-rear direction. The intake wall 61a is inclined with respect to the front-rear direction and the left-right direction. The outer surface of the intake wall 61a faces the first radiator 71. Here, "the outer surface of the intake wall 61a faces the first radiator 71" means that a straight line extending from the outer surface and perpendicular to the outer surface intersects the first radiator 71. The cooling fan 5 is arranged to deliver air to the intake wall 61a. In the example of the electronic device 1, the cooling fan 5 is separated from the outer surface of the intake wall 61a to the right. The airflow from the cooling fan 5 to the intake wall 61a is formed by the flow channel walls 34A and 34B to be described later.

[0105] According to the shape and arrangement of the power supply unit housing 61, as Figure 6BAs shown, a part of the air reaching the intake wall 61a passes through the intake holes 61b and enters the interior of the power supply unit housing 61. Additionally, another part of the air reaching the intake wall 61a moves to the first radiator 71 while being guided by the intake wall 61a. That is, the intake wall 61a enables ensuring the air flow to be supplied to the first radiator 71 and, at the same time, cools the power supply unit 60 with cold air (air not heated by another heat generating device or heat dissipating device). When the power supply unit 60 can be cooled by cold air, the gap between the circuit parts 62a and 62b (e.g., transformers and capacitors) included in the power circuit 62 can be reduced, enabling the power supply unit 60 to be miniaturized.

[0106] The power supply unit housing 61 includes a housing rear part 61c located on the left side of the first radiator 71 and a housing front part 61d extending forward beyond the front end of the first radiator 71. In the example of the electronic device 1, the intake wall 61a is the right side wall of the housing front part 61d and extends obliquely forward and to the right from the right side wall 61f of the housing rear part 61c. On the other hand, the left side wall 61e of the power supply unit housing 61 extends linearly forward from the housing rear part 61c to the housing front part 61d. Therefore, the width of the housing front part 61d in the left - right direction gradually increases toward the front.

[0107] As Figure 11B shown, the intake holes 61b can be formed obliquely with respect to the intake wall 61a. That is, the center line Ch1 of the intake holes 61b can be inclined with respect to the intake wall 61a. For example, the center line Ch1 of the intake holes 61b can be along the left - right direction. This makes it easy for the air discharged from the cooling fan 5 to pass through the intake wall 61a. Incidentally, the structure of the intake holes 61b is not limited to the example of the electronic device 1. The center line Ch1 of the intake holes 61b can be inclined with respect to the left - right direction and the front - rear direction in accordance with the air flow direction. For example, the center line Ch1 can extend obliquely forward and to the right from the intake wall 61a.

[0108] As Figure 11A and Figure 11B shown, the intake holes 61m can also be formed in the right side wall 61f of the housing rear part 61c. In this case, the direction in which the intake holes 61m penetrate the right side wall 61f, that is, the direction of the center line Ch2 of the intake holes 61m, can be the same as the direction of the intake holes 61b in the intake wall 61a. This can facilitate the formation of both intake holes 61b and 61m.

[0109] As Figure 7B shown, a part of the power circuit 62 can be arranged in the space within the housing front part 61d and fixed by the inclination of the intake wall 61a, that is, the space Sf formed inside the intake wall 61a (see Figure 6B)。The circuit portion 62b included in the power supply circuit 62 is accommodated in this space and is located in front of the first heat sink 71. According to such a layout, the volume of the power supply unit housing 61 can be effectively utilized.

[0110] The circuit portion 62b arranged in the space formed inside the intake wall 61a can have a smaller size than the other portion 62a. This can promote the air flow inside the power supply unit housing 61.

[0111] A plurality of exhaust holes 61g and 61h can be formed in the rear portion 61c of the housing. More specifically, as Figure 7C shown, a plurality of exhaust holes 61g can be formed in the rear wall 61i of the rear portion 61c of the housing, and a plurality of exhaust holes 61h can be formed in the rear portion 61k of the upper wall 61j of the power supply unit housing 61. In the example of the electronic device 1, the rear portion 61k of the upper wall 61j is recessed with respect to the front portion of the upper wall 61j. Due to this recess, the air flow passage Se is fixed between the upper housing member 30A and the rear portion 61k.

[0112] The positions of the exhaust holes 61g and 61h are not limited to the example shown in the electronic device 1. For example, the exhaust hole 61h formed in the upper wall 61j may not exist. A plurality of exhaust holes can be formed in the last part of the left side wall 61e.

[0113] [Flow passage wall defining the air flow passage]

[0114] The heat dissipation device 70 includes a first heat sink 71 and a second heat sink 72 arranged side by side with each other in the left - right direction. The cooling fan 5 is located in front of the second heat sink 72. As Figure 4 and Figure 6B shown, the upper housing member 30A can have a flow passage wall 34A that defines the flow passage of the air flow sent out from the cooling fan 5 and guides the air flow to the first heat sink 71. The flow passage wall 34A has a portion that curves along the outer periphery of the cooling fan 5. In the example of the electronic device 1, the entire flow passage wall 34A is curved.

[0115] As Figure 6B shown, as the distance from the starting point 34A of the flow passage wall 34a increases in the extending direction of the flow passage wall 34A, the distance from the cooling fan 5 to the flow passage wall 34A (the distance in the radial direction of the cooling fan 5) increases. The flow passage wall 34A extends from the periphery of the cooling fan 5 to the intake wall 61a of the power supply unit housing 61. The intake wall 61a is located on the extending portion of the end 34b of the flow passage wall 34A. Such a flow passage wall 34A enables the air from the cooling fan 5 to be smoothly sent to the intake wall 61a.

[0116] The intake wall 61a can be curved similarly to the flow channel wall 34A. For example, the flow channel wall 34A is formed along a curve defined by a predetermined function. The intake wall 61a can be arranged along the same curve. For example, the flow channel wall 34A is formed along a cycloid curve with the rotation center line Cf of the cooling fan 5 as the origin. In this case, the intake wall 61a can also be curved along the same cycloid curve. Therefore, a smooth air flow is formed from the cooling fan 5 to the intake wall 61a and the first radiator 71. Incidentally, the curve based on which the flow channel wall 34A and the intake wall 61a are curved can be, for example, an involute, a logarithmic spiral, a Nielsen spiral, etc., instead of a cycloid curve.

[0117] The flow channel wall 34A surrounds the periphery of the cooling fan 5 located outside the outer edge of the circuit board 50. The flow channel wall 34A extends downward from the part (which is the recessed plate part 32a in the example of the electronic device 1) that forms the upper surface of the device body 10 in the upper housing member 30A. The lower edge of the flow channel wall 34A can reach the lower housing member 30B.

[0118] In the example of the electronic device 1, as Figure 4 and Figure 8B shown, the upwardly protruding flow channel wall 34B is formed on the lower housing member 30B. Similar to the flow channel wall 34A, the flow channel wall 34B defines a flow channel for the air flow sent out from the cooling fan 5. The flow channel wall 34B has a part that is curved along the periphery of the cooling fan 5. In the example of the electronic device 1, similar to the flow channel wall 34A, the entire flow channel wall 34B is curved.

[0119] As Figure 7B shown, the lower edge of the flow channel wall 34A of the upper housing member 30A is connected in the vertical direction to the flow channel wall 34B of the lower housing member 30B. The flow channel walls 34A and 34B are connected to each other to form a single wall that extends along the periphery of the cooling fan 5. In the example of the electronic device 1, the flow channel walls 34A and 34B serve as the walls on the front side of the cooling fan 5.

[0120] The structure of the flow channel walls 34A and 34B is not limited to the example of the electronic device 1. For example, only the upper housing member 30A or the lower housing member 30B can have the flow channel walls formed thereon. Then, the flow channel walls formed on one housing member can extend upward or downward until they reach the other housing member.

[0121] As Figure 4As shown, the electronic device 1 has a front external panel 35 that covers the flow channel walls 34A and 34B which are part of the external components. The front external panel 35 is located on the front side and the right side of the curved flow channel walls 34A and 34B and covers the entire flow channel walls 34A and 34B. Due to the presence of the front external panel 35, the degree of freedom in the shape of the flow channel walls 34A and 34B can be ensured. A circuit board on which switches operated by the power button 2a and the optical disc eject button 2b are installed can be attached to the front external panel 35, or a circuit board on which connectors 3a and 3b are installed can be attached to the front external panel 35.

[0122] [Air flow channel under the circuit board]

[0123] As described above, the power supply unit 60 and the heat dissipation device 70 are arranged on the upper surface of the circuit board 50, and the power supply unit 60 and the heat dissipation device 70 are arranged side by side with each other in the left - right direction. The air sent out from the cooling fan 5 passes through the heat dissipation device 70 and the power supply unit housing 61. Thus, an air flow is formed in the entire space between the circuit board 50 and the upper housing member 30A. On the other hand, a member for reducing the width of the air flow channel between the circuit board 50 and the lower housing member 30B can be provided on the lower side of the circuit board 50. Then, the width of the air flow channel between the lower surface of the circuit board 50 and the lower housing member 30B can be narrower than the width of the air flow channel between the upper surface of the circuit board 50 and the upper housing member 30A. This helps to ensure the speed of the air flow formed on the lower side of the circuit board 50.

[0124] In the example of the electronic device 1, the optical disc drive 6 is provided on the lower side of the circuit board 50. The optical disc drive 6 reduces the width of the air flow channel between the circuit board 50 and the lower housing member 30B.

[0125] As Figure 8B shown, when viewed from the plan view of the electronic device 1, the optical disc drive 6 is separated to the left from the cooling fan 5. The optical disc drive 6 has a disc drive housing 6a. A spindle motor (not shown) for rotating the optical disc, a pickup module (not shown), etc. are arranged inside the disc drive housing 6a.

[0126] As Figure 8B shown, an air flow channel Sb from the cooling fan 5 to the exhaust port M (see Figure 8A ) is formed between the cooling fan 5 and the disc drive housing 6a. The disc drive housing 6a restricts the air flow channel Sb to the right - hand region of the circuit board 50. The disc drive housing 6a has a right - hand wall 6b facing the cooling fan 5, and the right - hand wall 6b extends in the front - rear direction at a position separated to the left from the cooling fan 5. The air flow channel Sb is formed between the right - hand wall 6b and the cooling fan 5. A plurality of fins 81 included in the heat dissipation device 80 are arranged at the mid - point of the air flow channel Sb.

[0127] The wall defining the air flow passage Sb may be formed on the lower housing member 30B. For example, as Figure 4 and Figure 8B shown, the lower housing member 30B may have a flow passage wall 34c extending from the periphery of the cooling fan 5 toward the heat sink 80. In the example of the electronic device 1, the flow passage wall 34c extends from the starting point of the above-mentioned flow passage wall 34B that bends on the periphery of the cooling fan 5 toward the heat sink 80.

[0128] Incidentally, the electronic device 1 may not have an optical disc drive 6. In this case, the wall may limit the air flow passage Sb. The wall portion formed on the lower housing member 30B may be used as a member that reduces the width of the air flow passage between the circuit board 50 and the lower housing member 30B compared to the air flow passage between the circuit board 50 and the upper housing member 30A.

[0129] As Figure 4 shown, an opening 30c corresponding to the disc drive housing 6a in size and shape is formed in the lower housing member 30B. The lower surface of the disc drive housing 6a may be exposed downward from the opening 30c. According to this structure, the width of the electronic device 1 in the up-down direction is reduced by the thickness of the lower housing member 30B.

[0130] [Dust collection chamber]

[0131] As Figure 6B shown, a dust collection chamber Ds may be provided in the flow passage wall 34A. The dust collection chamber Ds captures the dust contained in the air flow formed on the upper side of the circuit board 50 and collects the captured dust. According to this structure, the amount of dust entering the devices arranged downstream of the dust collection chamber Ds, such as the first heat sink 71, the power supply unit 60, etc., can be reduced.

[0132] The dust collection chamber Ds is defined by a dust collection chamber wall 34C (see Figure 5 ). The dust collection chamber wall 34C is in the shape of a box open in two directions, which will be described later. The dust collection chamber wall 34C is integrally formed with the upper housing member 30A, for example. This makes it possible to ensure the dust collection chamber Ds without increasing the number of parts. In addition, since the upper housing member 30A is a member that covers the entire internal device, when the dust collection chamber wall 34C is integrally formed with the upper housing member 30A, the degree of freedom in the position of the dust collection chamber Ds can be ensured.

[0133] In the plan view of the electronic device 1, the cooling fan 5 rotates clockwise around the rotation center line Cf. In the example of the electronic device 1, the flow channel wall 34A extends clockwise along the periphery of the cooling fan 5 from the starting point 34a of the flow channel wall 34A. The entire flow channel wall 34A is curved. The dust collection chamber Ds can be provided in such a curved flow channel wall 34A. More specifically, the dust collection chamber Ds can be located at the end of the flow channel wall 34A. The position of the dust collection chamber Ds is not limited to the example of the electronic device 1. The dust collection chamber Ds can be provided at the midpoint of the flow channel wall 34A.

[0134] Two devices, each being a heat generating device or a heat dissipating device, can be provided downstream of the air flow channel formed by the flow channel wall 34A. The dust collection chamber Ds can be located upstream of the two devices. In the example of the electronic device 1, the power supply unit 60 and the first radiator 71 are located downstream of the air flow channel defined by the flow channel wall 34A. The dust collection chamber Ds is located upstream of the power supply unit 60 and the first radiator 71. In this way, dust can be prevented from being sent to the two devices by one dust collection chamber Ds. In the example of the electronic device 1, the dust collection chamber Ds is located between the intake wall 61a of the power supply unit housing 61 and the flow channel wall 34A.

[0135] As Figure 12 shown, the dust collection chamber Ds has a first opening A1, and the first opening A1 opens along the direction of the circuit board 50 toward the air flow channel Sa defined by the flow channel wall 34A and the intake wall 61a. Dust contained in the air flowing through the air flow channel Sa is captured from the first opening A1 into the dust collection chamber Ds. The dust collection chamber Ds also has a second opening A2, and the second opening A2 opens to the outside of the air flow channel Sa in a direction intersecting the circuit board 50. According to this structure of the dust collection chamber Ds, dust can be collected in the dust collection chamber Ds, and the collected dust can be discharged through the second opening A2 by relatively simple work.

[0136] The direction in which the second opening A2 opens is, for example, a direction orthogonal to the circuit board 50. The second opening A2 opens to the outside of the housing 30, and more specifically, opens to the upper side of the upper housing member 30A. The upper outer panel 20A covers the second opening A2 and prevents the second opening A2 from being exposed to the outside. The user can expose the second opening A2 by removing the upper outer panel 20A from the upper housing member 30A, and extract the dust collected in the dust collection chamber Ds. For example, the dust collected in the dust collection chamber Ds can be sucked in by a vacuum cleaner. In addition, since the upper outer panel 20A serves as a member covering the second opening A2, an increase in the number of components can be suppressed.

[0137] The dust collection chamber wall 34C defining the dust collection chamber Ds has a side wall 34e extending downward from the edge of the second opening A2 (see Figure 12 ). As Figure 6BAs shown, a part 34f of the side wall 34e is located between the flow channel wall 34A and the intake wall 61a and faces the air flow channel Sa. (The part 34f will be hereinafter referred to as the "inner wall".) The inner wall 34f can be curved in accordance with the flow channel wall 34A. For example, the inner wall 34f can be formed along a function curve (e.g., a clothoid) that defines the curvature of the flow channel wall 34A. Further, in another example, as shown by the dashed line in Figure 6B , the inner wall 34f can extend into the interior of a function curve (e.g., a clothoid) that defines the curvature of the flow channel wall 34A. This can enlarge the first opening A1 and increase the amount of air entering the dust collection chamber Ds.

[0138] As Figure 12 shown, the dust collection chamber wall 34C can have a bottom 34g located at the lower edge of the side wall 34e. Dust captured in the dust collection chamber Ds is collected on the bottom 34g. The bottom 34g can have a dike 34h along the edge of the first opening A1. Accordingly, dust collected on the bottom 34g can be prevented from returning to the air flow channel Sa. The bottom 34g can be attached to the circuit board 50 by means of a boss 34i and a screw 59.

[0139] Incidentally, when the upper outer panel 20A is attached to the upper housing member 30A, a gap can be formed between the edge of the second opening A2 and the upper outer panel 20A. This is conducive to forming an air flow that enters the dust collection chamber Ds from the first opening A1 and is discharged from the dust collection chamber Ds to the outside through the second opening A2.

[0140] Incidentally, the structure of the dust collection chamber Ds is not limited to the example of the electronic device 1. For example, instead of using the upper outer panel 20A as a cover for covering the second opening A2, a dedicated cover (lid) for covering the second opening A2 can be provided to the second opening A2. In another example, the dust collection chamber Ds can be formed in the power supply unit housing 61 instead of being formed in the upper housing member 30A.

[0141] As Figure 27 shown, in addition to the second opening A2 of the dust collection chamber Ds, a third opening A3 can be formed in the upper housing member 30A. In Figure 27In the example shown, the upper housing member 30A covers the heat dissipation device 170 (see FIGS. 26 to 26C), which will be described later as a modification of the heat dissipation device 70. The fins 171A of the front radiator 171a are inclined with respect to the front-rear direction and the left-right direction. Therefore, a substantially triangular space is formed between the fin 171c at the end of the radiator 171A and the right wall portion 61f of the power supply unit housing 61. The third opening A3 is located directly above this space. According to this structure, the dust collected in the space between the radiator 171A and the right wall portion 61f on the front side of the power supply unit housing 61 can be drawn out through the third opening A3. For example, the dust collected in this space can be sucked in by a vacuum cleaner.

[0142] [Upper heat dissipation device]

[0143] As Figure 13B shown, in addition to the radiators 71 and 72, the heat dissipation device 70 also has a plurality of heat pipes 73A to 73F. In the example of the electronic device 1, the heat dissipation device 70 has six heat pipes 73A to 73F. However, the number of heat pipes can be two or three, or can be greater than six. In the following description, when the plurality of heat pipes 73A to 73F are not distinguished from each other, the reference numeral 73 is used for the plurality of heat pipes 73A to 73F. In addition, as Figure 13A shown, the heat dissipation device 70 may have a substrate 75. The radiators 71 and 72 are fixed to the upper side of the substrate 75. The fins 71a and 72a of the radiators 71 and 72 are fixed to the substrate 75 by welding, for example.

[0144] As Figure 14A shown, each heat pipe 73 has a heat receiving portion 73a that is thermally connected to the integrated circuit 50a mounted on the circuit board 50. Here, "thermally connected to the heat receiving portion 73a of the integrated circuit 50a" means that the heat receiving portion 73a and the integrated circuit 50a are in direct contact with each other or are connected to each other via a metal member having high thermal conductivity (such as copper or aluminum) so that the heat of the integrated circuit 50a is transferred to the heat receiving portion 73a. In the example of the electronic device 1, the heat receiving portion 73a is the portion located directly above the integrated circuit 50a. The heat dissipation device 70 may have a heat transfer member 74 provided between the heat pipe 73 and the integrated circuit 50a. The heat receiving portion 73a may be connected to the integrated circuit 50a via the heat transfer member 74.

[0145] As Figure 14AAs shown, the heat receiving portions 73a of the plurality of heat pipes 73 are arranged side by side in the left - right direction and can be in contact with the heat receiving portions 73a of adjacent heat pipes 73. The cross - section of the heat receiving portion 73a is substantially rectangular, and the heat receiving portion 73a has an upper surface, a lower surface, a left side surface, and a right side surface. Those side surfaces of the heat receiving portion 73a are in contact with those side surfaces of the adjacent heat receiving portion 73a. Two adjacent heat receiving portions 73a can be in direct contact with each other or can be in contact with each other via a heat - conductive grease layer or the like.

[0146] As Figure 14A shown, each heat receiving portion 73a has a width W1 in the up - down direction and a width W2 in the left - right direction. The width W1 in the up - down direction is greater than the width W2 in the left - right direction. With this structure, it becomes easy to increase the number of heat pipes 73. As a result, it becomes easy to increase the sizes of the radiators 71 and 72, and the heat of the integrated circuit 50a is transferred to the radiators 71 and 72 through the heat pipes 73. In the example of the electronic device 1, the width W2 in the left - right direction is less than 3 / 4 of the width W1 in the up - down direction. The width W2 in the left - right direction can be less than 2 / 3 of the width W1 in the up - down direction. The width W2 in the left - right direction can be greater than 1 / 2 of the width W1 in the up - down direction.

[0147] As Figure 14A shown, the total width Wa (width in the left - right direction) of the heat receiving portions 73a of the plurality of heat pipes 73 can correspond to the width of the integrated circuit 50a in the left - right direction. More specifically, the width difference between the total width Wa and the integrated circuit 50a can be less than the thickness of one heat pipe 73 (width W2 of the heat receiving portion 73a in the left - right direction). In the example of the electronic device 1, this difference is less than half of the thickness of one heat pipe 73. Since the total width Wa thus corresponds to the width of the integrated circuit 50a, all the heat pipes 73 can operate effectively.

[0148] As Figure 14AAs shown, the heat transfer member 74 has two side portions 74b separated from each other in the left-right direction and a groove 74a formed between the two side portions 74b. The width of the groove 74a in the left-right direction corresponds to the total width Wa of the heat receiving portions 73a of the plurality of heat pipes 73. The heat receiving portions 73a of all the heat pipes 73 are arranged within the groove 74a. The side surfaces of the heat receiving portions 73a located at the corresponding right and left ends may be in contact with the inner surface (side portion 74b) of the groove 74a of the heat transfer member 74. The depth of the groove 74a corresponds to the width W1 of the heat receiving portion 73a in the up-down direction. Accordingly, the height of the upper surface of the heat receiving portion 73a and the height of the upper surface of the side portion 74b are substantially the same as each other. The lower edges of the fins 71a included in the radiator 71 are fixed to the upper surface of the side portion 74b. The fins 71a are fixed to the upper surface of the side portion 74b by welding, for example. According to the side portion 74b, heat can also be transferred to the fins 71a located on the right and left sides of the heat receiving portion 73a.

[0149] The width of the heat pipe 73 in the up-down direction and the width in the left-right direction may be changed in the extending direction of the heat pipe 73. Then, the heat pipe 73 may include a portion where the width in the up-down direction is smaller than the width in the left-right direction as compared with the heat receiving portion 73a. This can facilitate the bending of the heat pipe 73 and improve the heat conductivity from the heat pipe 73 to the radiators 71 and 72. In the example of the electronic device 1, the width of all the heat pipes 73 in the up-down direction varies in the extending direction of the heat pipe 73. Different from the example of the electronic device 1, only a part of the heat pipe 73 may have its width in the up-down direction changed in the extending direction of the heat pipe 73.

[0150] As Figure 13B shown, each heat pipe 73 has portions 73b and 73c that are in contact with the radiators 71 and 72 at positions separated from the heat receiving portion (see Figure 14A ) 73a in the extending direction of the heat pipe 73. Hereinafter, the portion 73b in contact with the first radiator 71 will be referred to as the first heat dissipation portion, and the portion 73c in contact with the second radiator 72 will be referred to as the second heat dissipation portion. For example, as Figure 14B shown, the heat pipes 73C and 73D have the second heat dissipation portion 73c that extends rightward below the second radiator 72 and is connected to the lower edge of each fin 72a. The heat pipes 73E and 73F have the second heat dissipation portion 73c that extends rightward above the second radiator 72 and is connected to the upper edge of each fin 72a. Additionally, as Figure 13B shown, the heat pipes 73A to 73F have the first heat dissipation portion 73b that is in contact with the lower edge of the first radiator 71.

[0151] The width of the second heat dissipation portion 73c in a direction orthogonal to the extending direction and the up-and-down direction of the second heat dissipation portion 73c can be greater than the width of the second heat dissipation portion 73c in the up-and-down direction. In the example of the electronic device 1, as Figure 14B shown, the second heat dissipation portion 73c has a width W3 in the up-and-down direction and a width W4 in the front-and-back direction. Then, the width W4 in the front-and-back direction is greater than the width W3 in the up-and-down direction. This enables heat to be effectively transferred from the second heat dissipation portion 73c to the second heat sink 72.

[0152] Similarly, the width of the first heat dissipation portion 73b in a direction orthogonal to the extending direction and the up-and-down direction of the first heat dissipation portion 73b can be greater than the width of the first heat dissipation portion 73b in the up-and-down direction. This can improve the thermal conductivity from the first heat dissipation portion 73b to the first heat sink 71.

[0153] In each heat pipe 73, the width W1 of the heat receiving portion 73a in the up-and-down direction is greater than the widths of the heat dissipation portions 73b and 73c in the up-and-down direction (W1 > W3). On the other hand, the width of the heat dissipation portions 73b and 73c in a direction perpendicular to the extending direction and the up-and-down direction of the heat dissipation portions 73b and 73c (for example, the width W4 of the second heat dissipation portion 73c) is greater than the width of the heat receiving portion 73a in a direction orthogonal to the extending direction and the up-and-down direction of the heat receiving portion 73a (that is, the width W2) (W4 > W2). According to this structure, a change in the outer peripheral length of the cross-section of each heat pipe 73 can be avoided.

[0154] Incidentally, the heat dissipation portions 73b and 73c may not be arranged on the upper side or the lower side of the heat sinks 71 and 72. For example, the second heat dissipation portion 73c can extend in the left-and-right direction on the front side or the rear side of the second heat sink 72. In this case, the width of the second heat dissipation portion 73c in the up-and-down direction can be greater than the width in the front-and-back direction. In addition, in another example, holes penetrating each fin 72a of the second heat sink 72 in the left-and-right direction can be formed in the fins 72a. Then, the second heat dissipation portion 73c can be inserted into the through holes. In this case, the upper surface and / or the lower surface of the second heat dissipation portion 73c can be in contact with the edges of the through holes of the heat sink 72. Then, the width of the second heat dissipation portion 73c in the front-and-back direction can be greater than the width in the up-and-down direction.

[0155] The radius of curvature of the corner portion 73d of the heat receiving portion 73a (see Figure 14A ) can be smaller than the radius of curvature of the corner portion or the side portion of the heat dissipation portions 73b and 73c (for example, Figure 14B the side portion 73e shown). Therefore, the cross-section of the heat receiving portion 73a is close to a rectangle, enabling a plurality of heat pipes 73 to be effectively arranged on the upper side of the integrated circuit 50a.

[0156] As Figure 14C shown, each heat pipe 73 has an intermediate portion 73h located between an integrated circuit 50a mounted on a circuit board 50 and a first heat sink 71. The intermediate portion 73h is a portion located between a heat receiving portion 73a and a first heat dissipating portion 73b. As shown in the plan view of the heat dissipating device 70, the intermediate portions 73h of the plurality of heat pipes 73 extend in a direction orthogonal to the extending direction of each heat receiving portion 73a (the left - right direction in the example of the electronic device 1) (see Figure 13B ).

[0157] As Figure 14C shown, the upper surface 73i of the intermediate portion 73h is connected to the lower edge of the fin 71a of the first heat sink 71. The upper surface 73i is parallel to the circuit board 50 and the lower edge of the fin 71a. On the other hand, the lower surface 73j of the intermediate portion 73h may be inclined such that the width W7 in the up - down direction of the intermediate portion 73h gradually decreases as the distance from the heat receiving portion 73a increases. This can improve the degree of freedom in the layout of the electronic components 50c below the intermediate portion 73h. Incidentally, the lower surface 73j of the intermediate portion 73h does not have to be inclined. A plurality of steps may be formed in the lower surface 73j such that the width W7 in the up - down direction of the intermediate portion 73h gradually decreases.

[0158] The substrate 75 has a bottom 75c located below the intermediate portion 73h. A plurality of steps may be formed in the bottom 75c to bias the lower surface 73j of the intermediate portion 73h toward the heat sink 71 side.

[0159] As described above, the second heat dissipating portions 73c of the heat pipes 73E and 73F are arranged along the upper side of the second heat sink 72. Therefore, as Figure 13A shown, the two heat pipes 73E and 73F may have a bent portion 73g that bends upward from the lower side of the first heat sink 71 to the upper side of the second heat sink 72.

[0160] As Figure 9 shown, the bent portion 73g has a width W5 in the up - down direction. In addition, the bent portion 73g has a width W6 in a direction orthogonal to the extending direction and the up - down direction of the bent portion 73g (the front - back direction in the example shown in Figure 9 ). Then, the width W6 may be greater than the width W5 in the up - down direction. According to this structure of the heat pipes 73E and 73F, the heat pipes 73E and 73F are easily bent upward.

[0161] Incidentally, the direction in which the bent portion 73g bends is not limited to the up-down direction. For example, when the second heat dissipation portion 73c is provided on the front side or the rear side of the second heat sink 72, the bent portion 73g can bend to the front side or the rear side. In this case, the width of the bent portion 73g in the up-down direction can be greater than the width of the bent portion 73g in the front-rear direction.

[0162] Figures 26A to 26C FIG. is a diagram showing a heat dissipation device 170 which is a modification of the heat dissipation device 70. Figure 27 FIG. is a plan view of the device main body 10 having the heat dissipation device 170. In Figure 27 it, the heat dissipation device 170 is covered by the upper housing member 30A.

[0163] In the heat dissipation device 170, as Figure 13A shown etc., the first heat sink 71 is divided into two heat sinks 171A and 171B (two fin blocks) in the direction along the air flow (the front-rear direction in the example of the electronic device 1), as Figure 26A shown. The heat sinks 171A and 171B are fixed to the common substrate 75. In addition, the heat sinks 171A and 171B are coupled to each other by the common heat pipe 73 which has a heat receiving portion 73a thermally connected to the integrated circuit 50a mounted on the circuit board 50. The front heat sink 171A is located on the left side of the center line Cf of the cooling fan 5, and a line along the left-right direction passes through the center line Cf and the heat sink 171A (see Figure 27 ). The heat transfer member 74 and the heat receiving portion 73a of the heat pipe 73 are fixed to the front heat sink 171A (the front fin block). The front heat sink 171A is connected to the integrated circuit 50a through the heat transfer member 74 and the heat receiving portion 73a. The rear heat sink 171B (the rear fin block) is located at the rear of the heat sink 171A. The heat dissipation portions 73c of the plurality of heat pipes 73 are fixed to the rear heat sink 171B. The rear second heat sink 72 and the heat sink 171B are arranged side by side in the left-right direction.

[0164] In the following description, the front heat sink 171A will be referred to as the first front heat sink, the heat sink 171B will be referred to as the first rear heat sink, and the heat sink 72 will be referred to as the second heat sink, as Figure 13A shown in the example of.

[0165] As Figure 26AAs shown, the front edge of the first rear radiator 171B is separated backward from the rear edge of the first front radiator 171A, and the gap Gn is fixed between the front edge of the first rear radiator 171B and the rear edge of the first front radiator 171A. According to this structure, the air that has passed through the rear edge of the first front radiator 171A mixes in the gap Gn (i.e., the flow of the air is disturbed in the gap Gn), and thereafter, the air enters the first rear radiator 171B. Therefore, the air to be cooled is easily distributed throughout the first rear radiator 171B. As a result, the first rear radiator 171B can be effectively utilized, thereby improving the cooling performance.

[0166] As Figure 26A shown, in the heat dissipation device 170, the radiators 171A and 171B respectively have a plurality of fins 171a and 171b, and these fins are arranged side by side with each other in the left - right direction. The fins 171A included in the first front radiator 171a are inclined with respect to both the front - rear direction and the left - right direction. The wall 61a (the intake wall of the power supply unit housing 61, see Figure 6B ) that conveys air to the first front radiator 171A is formed in front of the first front radiator 171A. Each fin 171a can be inclined in the same direction as the wall 61a. This enables the air to smoothly pass through the radiator 171A. In the example of the electronic device 1, the wall 61a extends obliquely backward and leftward from the front edge of the wall 61a. Similar to the wall 61a, each fin 171a extends obliquely backward and leftward from the front edge of the fin 171a. The fin 171a and the wall 61a may not be parallel to each other.

[0167] On the other hand, each fin 171B of the first rear radiator 171b is arranged along the front - rear direction. Therefore, the fins 171A of the first front radiator 171a are inclined with respect to the fins 171B of the first rear radiator 171b.

[0168] The gap Gn preferably ensures the size required for air mixing. The gap Gn can be, for example, greater than 1 / 5 of the width of the first front radiator 171A in the front - rear direction. The gap Gn can be greater than 1 / 4 of the width of the first front radiator 171A in the front - rear direction.

[0169] In Figure 26A the example shown, the middle portions 73h of the plurality of heat pipes 73 are exposed in the gap Gn. As Figure 26B shown, the upper surface of the heat - receiving portion 73a of the heat pipe 73 and the upper surface of the heat - transfer member 74 are in contact with the lower edge of the fin 171a of the first front radiator. The heat - dissipating portions 73c of the plurality of heat pipes 73 are in contact with the lower edge of the fin 171b of the first rear radiator 171B. Therefore, in Figures 26A to 26CIn the example shown, both the radiators 171A and 171B are in contact with a portion of the heat pipe 73, where the widths W1 and W3 ( Figure 14A and Figure 14B ) in the vertical direction of the heat pipe 73 are uniform.

[0170] [Lower heat dissipation device]

[0171] As Figure 15 shown, the heat dissipation device 80 provided on the lower surface of the circuit board 50 includes a substrate 82, a plurality of fins 81, and a heat pipe 83. As Figure 16A shown, the heat pipe 83 is provided between the lower plate shield 52 and the circuit board 50. An opening 52a is formed in the lower plate shield 52. The fins 81 are arranged inside the opening 52a and are exposed to the outside of the lower plate shield 52 (in the example of the electronic device 1, the lower side of the lower plate shield 52). The fins 81 are arranged in the above-mentioned air flow channel Sb formed between the circuit board 50 and the lower housing member 30B (see Figure 8B ).

[0172] The substrate 82 is, for example, a metal plate such as copper, aluminum, or stainless steel. The substrate 82 is formed by extruding a metal plate. That is, the portion of the substrate 82 is formed by one metal plate. The plurality of fins 81 are supported by the substrate 82. The fins 81 are fixed to the lower surface of the substrate 82 by welding, for example.

[0173] As Figure 15 shown, the heat pipe 83 has a heat receiving portion 83n at a position separated from the fins 81. For example, the heat pipe 83 is L-shaped. The heat receiving portion 83n is provided between the above-mentioned optical disc drive 6 and the circuit board 50. The fins 81 are arranged in an area that does not overlap with the optical disc drive 6 (in the example of the electronic device 1, the area to the right of the optical disc drive 6). During the process of manufacturing the circuit board 50 (the process of mounting electronic components on the circuit board 50), a jig can be pressed against the surface of the circuit board 50 to suppress warping in the circuit board 50. The heat pipe 83 can have a shape that coincides with the area where the jig is pressed.

[0174] The heat receiving portion 83n is in contact with the electronic component 50c mounted on the lower surface of the circuit board 50. The electronic component 50c is, for example, a power transistor that generates driving power for the integrated circuit 50a (specifically, the CPU) mounted on the upper surface of the circuit board 50 from the power supplied by the power supply unit 60. The components and devices cooled by the heat dissipation device 80 are not limited to transistors, and the heat dissipation device 80 can be used to cool memories.

[0175] As Figure 16AAs shown, the heat pipe 83 has a connection portion 83a on the side opposite to the heat receiving portion 83n. The connection portion 83a is located between the fin 81 and the circuit board 50 and extends in the left - right direction. A holding recess 82f extending in the left - right direction is formed in the lower surface of the substrate 82. The lower surface of the substrate 82 is recessed upward in the holding recess 82f. A first through - hole 82g penetrating the substrate 82 in the left - right direction is formed at the left end of the holding recess 82f. A second through - hole 82h penetrating the substrate 82 in the left - right direction is formed at the right end of the holding recess 82f. The connection portion 83a is inserted into the holding recess 82f from the first through - hole 82g on the left side, for example, and is held within the holding recess 82f. The connection portion 83a is fixed to the holding recess 82f by welding, for example. Both the holding recess 82f and the connection portion 83a are linearly extending portions.

[0176] As Figure 16A shown, gaps G1 and G2 are generated between the edge of the opening 52a of the lower - plate shield 52 and the fin 81. Specifically, the gap G1 is generated between the edge (left edge) of the opening 52a and the fin 81 located at the left end, and the gap G2 is generated between the edge (right edge) of the opening 52a and the fin 81 located at the right end.

[0177] As Figure 16A shown, the substrate 82 may have a left - hand plate portion 82c located on the left side of the holding recess 82f. The left - hand plate portion 82c may cover the lower surface of the heat pipe 83 (the surface on the side of the plate shield 52) and close the gap G1. This can prevent electromagnetic waves from being transmitted outside the lower - plate shield 52 through the gap G1. The left - hand plate portion 82c may have a size greater than the gap G1 in the front - rear direction and close the entire gap G1.

[0178] Similarly, as Figure 16A shown, the substrate 82 may have a right - hand plate portion 82d located on the right side of the holding recess 82f. The right - hand plate portion 82d may cover the lower surface of the heat pipe 83 (the surface on the side of the plate shield 52) and close the gap G2. This can prevent electromagnetic waves from being transmitted outside the lower - plate shield 52 through the gap G2. The right - hand plate portion 82d may have a size greater than the gap G2 in the front - rear direction and close the entire gap G2.

[0179] As Figure 16A shown, the width T1 of the left - hand plate portion 82c is greater than the distance (gap G1) between the fin 81 at the left end of the plurality of fins 81 and the edge (left edge) of the opening 52a of the plate shield 52. Therefore, as shown in the plan view of the circuit board 50, the left - hand plate portion 82c overlaps the fin 81 at the left end and also overlaps the edge of the opening 52a of the plate shield 52. As a result, electromagnetic waves can be effectively prevented from leaking through the gap G1. In the example of the electronic device 1, the plurality of fins 81 overlap the left - hand plate portion 82c.

[0180] As Figure 16A shown, the width T2 of the right portion 82d of the plate is greater than the distance (gap G2) between the fin 81 at the right end among the plurality of fins 81 and the edge (right edge) of the opening 52a of the plate shield 52. Therefore, as shown in the plan view of the circuit board 50, the right portion 82d of the plate overlaps the fin 81 at the right end and also overlaps the edge of the opening 52a of the plate shield 52. As a result, electromagnetic waves can be effectively prevented from leaking from the gap G2. In the example of the electronic device 1, the plurality of fins 81 also overlap the right portion 82d of the plate.

[0181] As Figure 16B shown, the substrate 82 has a front plate portion 82a and a rear plate portion 82b. The front plate portion 82a and the rear plate portion 82b are located on opposite sides in the front-rear direction, and the holding recess 82f is inserted therebetween. The front plate portion 82a, the rear plate portion 82b, the left portion 82c of the plate, and the right portion 82d of the plate are joined to each other and surround the holding recess 82f. The four portions 82a to 82d are located in the same plane along the circuit board 50. The edges of the fins 81 are fixed to the lower surfaces of the front plate portion 82a and the rear plate portion 82b by welding, for example. The heat transferred from the heat pipe 83 to the holding recess 82f is transferred to the fins 81 via the front plate portion 82a and the rear plate portion 82b.

[0182] The front plate portion 82a extends forward from the holding recess 82f and overlaps the edge of the opening 52a of the plate shield 52. The rear plate portion 82b extends backward from the holding recess 82f and overlaps the edge of the opening 52a of the plate shield 52. Therefore, the substrate 82 can overlap the entire periphery of the edge of the opening 52a of the plate shield 52. This can effectively prevent electromagnetic wave leakage.

[0183] Each of the portions 82a to 82d can be fixed to the edge of the opening 52a of the plate shield 52 by a fixing device such as a screw or a rivet. The fixing structure of the substrate 82 and the lower plate shield 52 is not limited to the example of the electronic device 1. For example, only the front plate portion 82a and the rear plate portion 82b may be provided with fixing devices for fixing the substrate 82 to the lower plate shield 52.

[0184] As Figure 16BAs shown, the width W11 in the left-right direction of the first through-hole 82g can be greater than the width (width in the left-right direction) of one fin 81. Similarly, the width W12 in the left-right direction of the second through-hole 82h can be greater than the width (width in the left-right direction) of one fin 81. The first through-hole 82g is closed by a plurality of fins 81. The second through-hole 82h is also closed by a plurality of fins 81. Each fin 81 has a fixing portion 81b that bends to an adjacent fin 81 at its upper edge. The fixing portion 81b contacts the adjacent fin 81, and there is no gap between two adjacent fins 81. This can also prevent electromagnetic waves from leaking from the range between two adjacent fins 81.

[0185] As Figure 16B shown, the substrate 82 can have a stopper 82k that faces one end (the right end in the example of the electronic device 1) in the left-right direction of the heat pipe 83. During the manufacturing process of the heat dissipation device 80, when the connecting portion 83a of the heat pipe 83 is inserted into the holding recess 82f from the left, the stopper 82k can reduce the relative position displacement between the connecting portion 83a and the holding recess 82f.

[0186] Incidentally, in the example of the electronic device 1, the substrate 82 has a plate left portion 82c and a plate right portion 82d that are stacked on the edges of the opening 52a of the plate shield 52 on the right side and the left side of the holding recess 82f, respectively. Different from this example, only the plate left portion 82c or the plate right portion 82d can be stacked on the edge of the opening 52a of the plate shield 52.

[0187] In addition, in another example, the substrate 82 may not have the holding recess 82f. In this case, the heat dissipation device 80 can have a back plate that sandwiches the connecting portion 83a of the heat pipe 83 and the substrate 82. Figures 17A to 17C is a schematic diagram showing an example of such a heat dissipation device.

[0188] In the example shown in these figures, the heat dissipation device 180 has a substrate 182 and a back plate 184. As Figure 17BAs shown, the substrate 182 is disposed between the connecting portion 83a of the heat pipe 83 and the fin 81. The upper edge of the fin 81 is fixed to the substrate 182. Different from the above-mentioned substrate 82, no holding recess is formed in the substrate 182. The back plate 184 covers the upper surface of the connecting portion 83a and is attached to the substrate 182. A holding recess 184a extending in the left-right direction is formed in the back plate 184. The connecting portion 83a of the heat pipe 83 is assembled in this holding recess. The back plate 184 has a front plate portion 184b and a rear plate portion 184c which are located on opposite sides of each other, and the holding recess 184a is interposed therebetween. The portions 184b and 184c are attached to the substrate 182. Incidentally, in the heat dissipation device 180, different from the heat dissipation device 80, for example, the connecting portion 83a of the heat pipe 83 may be curved instead of linear. In this case, the holding recess 184a can be curved in accordance with the connecting portion 83a.

[0189] As Figure 17C shown, the substrate 182 has a left plate portion 182c located on the left side of the fin 81 and a right plate portion 182d located on the right side of the fin 81. The left plate portion 182c closes the gap G1. The right plate portion 182d closes the gap G2. This can prevent electromagnetic waves from leaking from the gaps G1 and G2.

[0190] As Figure 17C shown, the left plate portion 182c extends leftward beyond the edge (left edge) of the opening 52a of the plate shield 52 and overlaps with the plate shield 52. The right plate portion 182d extends rightward beyond the edge (right edge) of the opening 52a of the plate shield 52 and overlaps with the plate shield 52. This can more effectively prevent electromagnetic waves from leaking from the gaps G1 and G2.

[0191] As Figure 17B shown, the substrate 182 has a front plate portion 182a and a rear plate portion 182b which are located on opposite sides of each other in the front-rear direction, and the connecting portion 83a is inserted therebetween. The front plate portion 182a and the rear plate portion 182b also extend forward and backward respectively beyond the edge of the opening 52a of the plate shield 52 and overlap with the plate shield 52. Therefore, the substrate 182 can be stacked on the entire periphery of the edge of the opening 52a of the plate shield 52. This can effectively prevent electromagnetic wave leakage.

[0192] The back plate 184 may have substantially the same dimensions as the substrate 182 in at least one of the left-right direction and the front-rear direction. In the example of the electronic device 1, as Figure 17AAs shown, the dimension K2 of the back plate 184 in the front-back direction is the same as the dimension of the substrate 182. Additionally, the dimension K1 of the back plate 184 in the left-right direction is the same as the dimension of the substrate 182. According to this structure of the back plate 184 and the substrate 182, the heat transferred from the heat pipe 83 to the back plate 184 is easily transferred to the entire substrate 182 and thus easily transferred to the entire fin 81. Incidentally, the back plate 184 may have dimensions substantially the same as those of the substrate 182 only in the left-right direction or the front-back direction. Here, the back plate 184 and the substrate 182 having the same dimension in the front-back direction means that its foremost part can be attached to the plate shield 52 by a common fixing means (screw or rivet), and its rearmost part can be attached to the plate shield 52 by a common fixing means. For example, connection holes for inserting the common fixing means are formed in each of the foremost part and the rearmost part of the plates 184 and 182. Similarly, the back plate 184 and the substrate 182 having the same dimension in the left-right direction means that its rightmost part can be attached to the plate shield 52 by a common fixing means, and its leftmost part can be attached to the plate shield 52 by a common fixing means.

[0193] Additionally, according to this structure, unlike the above-described substrate 82, holes (the above-described through holes 82g and 82h) penetrating the substrate 182 are not formed. Therefore, electromagnetic wave leakage can be more effectively prevented.

[0194] [Memory housing chamber]

[0195] As Figure 15 shown, a ground pattern 50f including a conductor and serving as an electrical ground is formed on the lower surface of the circuit board 50. In Figure 15 , the ground pattern 50f is shaded. The ground pattern 50f surrounds the entire periphery of the area B1 (this area will be referred to as the shielding area hereinafter) where electronic components 50c and 50e etc. are mounted. The lower plate shield 52 covers the shielding area B1. The lower plate shield 52 has a ground contact portion 52b (see Figure 7C ), and this ground contact portion 52b is fixed to the ground pattern 50f by a fixing means such as a screw.

[0196] As Figure 15 shown, a memory connector 50g from which the semiconductor memory 55 (see Figure 18A ) can be detached is mounted on an area outside the shielding area B1 on the lower surface of the circuit board 50. In the example of the electronic device 1, the semiconductor memory 55 is provided on the right side of the memory connector 50g. The lower plate shield 52 may have a connector cover 52c (see Figure 18A ) covering the memory connector 50g. A memory housing chamber R1 (see Figure 18A ) for accommodating the semiconductor memory 55 is defined on the lower side of the circuit board 50.

[0197] As Figure 18C shown, the lower plate shield 52 has shielding walls 52e and 52f formed along the memory accommodation chamber R1. With this structure, the influence of static electricity on the semiconductor memory 55 can be reduced while suppressing an increase in the number of components. The shielding walls 52e and 52f are walls higher than the semiconductor memory 55 and also have a length (width in the left-right direction) corresponding to the semiconductor memory 55.

[0198] In the example of the electronic device 1, the memory accommodation chamber R1 is defined near the front surface 10a of the electronic device 1 (see Figure 8A ). As Figure 15 shown, the memory accommodation chamber R1 is located in front of the center of the circuit board 50 in the front-rear direction and is formed, for example, along the front edge 50h of the circuit board 50. The shielding wall 52e is formed on the front side of the memory accommodation chamber R1. With this structure, when a user touches the front surface 10a of the electronic device 1, the flow of static electricity to the semiconductor memory 55 can be suppressed by the shielding wall 52e.

[0199] As Figure 18C shown, the shielding wall 52f can be formed on the rear side of the memory accommodation chamber R1. Accordingly, the influence of static electricity on the semiconductor memory 55 can be more effectively suppressed.

[0200] As Figure 15 shown, the ground pattern 50f can have ground portions 50i and 50j formed along the memory accommodation chamber R1. The ground portions 50i and 50j have, for example, a length (length in the left-right direction) corresponding to the memory accommodation chamber R1. The ground portion 50i is formed on the front side of the memory accommodation chamber R1. The ground portion 50j is formed on the rear side of the memory accommodation chamber R1. Hereinafter, the ground portion 50i will be referred to as the front ground portion, and the ground portion 50j will be referred to as the rear ground portion.

[0201] As Figure 18C shown, the lower plate shield 52 has a contact portion 52g in contact with the front ground portion 50i and a contact portion 52h in contact with the rear ground portion 50j. The front shielding wall 52e extends downward from the contact portion 52g. The rear shielding wall 52f extends downward from the contact portion 52h. With this structure, the distance from the shielding walls 52e and 52f to the ground pattern 50f of the circuit board 50 is reduced. Therefore, the influence of static electricity can be more effectively reduced.

[0202] Incidentally, the structures of the ground pattern 50f and the lower plate shield 52 are not limited to the examples shown in the electronic device 1. For example, the ground pattern 50f may have only one of the two ground portions 50i and 50j (e.g., the front ground portion 50i). In this case, the lower plate shield 52 may have only one of the two contact portions 52g and 52h (e.g., the contact portion 52g on the front side).

[0203] As Figure 18A shown, the memory accommodation chamber R1 may be covered by the memory cover 56. The memory cover 56 includes, for example, a conductive material (e.g., a metal such as copper, aluminum, or iron). The memory cover 56 is electrically connected to the shielding walls 52e and 52f. Accordingly, the influence of static electricity on the semiconductor memory 55 can be more effectively suppressed.

[0204] In the example of the electronic device 1, the memory cover 56 is electrically connected to the shielding wall 52e through a conductive pad 56a ( Figure 18C ) provided between the edge of the memory cover 56 and the edge of the shielding wall 52e on the front side. In addition, the memory cover 56 is electrically connected to the shielding wall 52f through a conductive pad 56b provided between the edge of the memory cover 56 and the edge of the shielding wall 52f on the rear side.

[0205] As Figure 18C shown, an opening 30d exposing the memory accommodation chamber R1 is formed in the lower housing member 30B. Support walls 37a, 37b, and 37c surrounding the memory accommodation chamber R1 may be formed on the lower housing member 30B. The support walls 37a, 37b, and 37c are walls extending from the edge of the opening 30d toward the circuit board 50. The support walls 37a, 37b, and 37c can ensure the strength of the lower housing member 30B around the periphery of the opening 30d.

[0206] As Figure 18C shown, the shielding walls 52e and 52f may be located inside the support walls 37a, 37b, and 37c. The shielding wall 52e on the front side is provided, for example, inside the support wall 37a on the front side and along the support wall 37a. The shielding wall 52f on the rear side is provided, for example, inside the support wall 37b on the rear side and along the support wall 37b. In the example of the electronic device 1, the plate shield 52 does not have a shielding wall located inside the support wall 37c formed on the right side of the memory accommodation chamber R1. Different from the example of the electronic device 1, the plate shield 52 may have a shielding wall located inside the support wall 37c.

[0207] The outer peripheral edge of the memory cover 56 is provided, for example, at the lower edges of the support walls 37a, 37b, and 37c. As Figure 18AAs shown, the protruding portion 56c is formed at the end of the memory cover 56 (the left end in the example shown in the electronic device 1). An opening into which the protruding portion 56c is fitted in the horizontal direction is formed in the lower housing member 30B. The end of the opposite side of the memory cover 56 (the right end in the example shown in the electronic device 1) is set on the support wall 37c and fixed to the support wall 37c. For example, a hole is formed in the support wall 37c, and the end of the memory cover 56 is fixed to the hole by a fixing means such as a screw 58a.

[0208] The semiconductor memory 55 can be fixed to the circuit board 50 or the upper plate shield 51 at a position separated from the memory connector 50g. For example, as Figure 18A shown, the right end 55a of the semiconductor memory 55 can be fixed to the threaded hole 51b formed in the upper plate shield 51 by a screw 58b. In this case, a spacer 57 can be provided between the upper plate shield 51 and the right end 55a of the semiconductor memory 55. A hole 50k for setting the spacer 57 can be formed at a position corresponding to the threaded hole 51b in the circuit board 50.

[0209] The electronic device 1 can allow the selective use of a plurality of semiconductor memories having different storage capacities. Such semiconductor memories have different lengths in the left - right direction according to the storage capacity. Therefore, as Figure 18A shown, a plurality of threaded holes 51b can be formed in the upper plate shield 51 so that a plurality of semiconductor memories having different lengths can be fixed to the upper plate shield 51. Additionally, in the circuit board 50, holes for setting the spacer 57 can be formed at positions corresponding to the threaded holes 51b.

[0210] In a state where the memory cover 56 is closed, a ventilation hole H1 (see Figure 18A and Figure 18B ) that allows air to flow between the inside and outside of the memory accommodation chamber R1 can be formed in the memory accommodation chamber R1. This can improve the heat dissipation characteristics of the semiconductor memory 55.

[0211] As described above, the memory accommodation chamber R1 is provided near the front surface 10a of the electronic device 1. The ventilation hole H1 can be formed in the wall portion on the rear side of the memory accommodation chamber R1. In the example of the electronic device 1, the ventilation hole H1 can be provided in the rear shielding wall 52f or the rear support wall 37b. Additionally, the ventilation hole H1 can open toward the rear side of the electronic device 1. According to this structure of the ventilation hole H1, the ventilation hole H1 is far from the front surface 10a of the electronic device 1, and thus, it is possible to effectively prevent the ventilation hole H1 from becoming an electrostatic path.

[0212] In the example of the electronic device 1, a plurality of gaps 52i (see Figure 19 ) are formed in the rear shielding wall 52f. AsFigure 18B As shown, the lower edge of the support wall 37b of the lower housing member 30B has a recess 37e at a position corresponding to the gap 52i. A ventilation hole H1 that opens toward the rear side of the electronic device 1 is formed between the recess 37e and the edge of the memory cover 56. Attachment holes 52j (see Figure 18B ) for fixing the ground contact portion 52h of the lower plate shield 52 to the circuit board 50 may be formed in the gap 52i.

[0213] The above-described lower flow channel Ub (see Figure 20A ) is formed between the lower surface of the lower housing member 30B and the lower outer panel 20B. The ventilation hole H1 opens into the lower flow channel Ub. Further, the ventilation hole H1 opens from the memory accommodation chamber R1 toward the inlet 31b of the lower housing member 30B (see Figure 8A ). Thus, when the cooling fan 5 is driven, an air flow is formed from the inside of the memory accommodation chamber R1 through the ventilation hole H1 to the inlet 31b.

[0214] In addition to the ventilation hole H1, holes leading to the outside of the memory accommodation chamber R1 may be formed in the wall portions that define the memory accommodation chamber R1, such as the shielding walls 52e and 52f, the support walls 37a, 37b, and 37c, the circuit board 50, etc. When the cooling fan 5 is driven, air flows into the inside of the memory accommodation chamber R1 through the holes. The holes leading to the outside of the memory accommodation chamber R1, i.e., the intake holes, are, for example, the holes 50k formed in the circuit board 50 for fixing the semiconductor memory 55.

[0215] [External Panel]

[0216] As described above, the electronic device 1 has an upper outer panel 20A attached to the upper surface of the device main body 10 and a lower outer panel 20B attached to the lower surface of the device main body 10. The device main body 10 has an upper housing member 30A and a lower housing member 30B that are joined to each other in the vertical direction. The upper outer panel 20A is attached to the upper surface of the upper housing member 30A. The lower outer panel 20B is attached to the lower surface of the lower housing member 30B.

[0217] As Figure 1C shown, the upper outer panel 20A may have a right protruding portion 20a on its right side that protrudes to the right beyond the position of the right side surface 10b (the right outer surface of the front outer panel 35) of the device main body 10. Further, the upper outer panel 20A may have a left protruding portion 20b ( Figure 1G ) on its left side that protrudes to the left beyond the position of the left side surface 10c (the left side surface of the housing 30) of the device main body 10. As Figure 1B shown, the protruding portions 20a and 20b may extend from the rear edge to the front edge of the upper outer panel 20A.

[0218] The protruding portions 20a and 20b can protect the device main body 10. For example, when the electronic device 1 is placed vertically such that the right side surface 10b of the electronic device 1 is on the lower side, the right protruding portion 20a abuts against the floor surface and supports the device main body 10, thereby preventing the side surface of the device main body 10 from being damaged or soiled.

[0219] Similar to the upper outer panel 20A, as Figure 1C shown, the lower outer panel 20B may have a right protruding portion 20c on its right side that protrudes to the right beyond the position of the right side surface 10b of the device main body 10, and a left protruding portion 20d on its left side that protrudes to the left beyond the position of the left side surface 10c of the device main body 10 (see Figure 1G ). The protruding portions 20c and 20d can extend from the rear edge to the front edge of the lower outer panel 20B. According to this structure of the outer panels 20A and 20B, the device main body 10 can be protected more effectively.

[0220] As Figure 1E shown, the upper outer panel 20A may have a front protruding portion 20e at its front side that protrudes forward beyond the position of the front surface 10a of the device main body 10 (the front surface of the front outer panel 35). Similarly, the lower outer panel 20B may have a front protruding portion 20f at its front side that protrudes forward beyond the position of the front surface 10a of the device main body 10. According to this structure of the outer panels 20A and 20B, the front surface 10a of the device main body 10 and the components arranged on the front surface 10a (e.g., buttons 2a and 2b, connectors 3a and 3b, etc.) can be protected. The front protruding portion 20e extends from the right edge to the left edge of the upper outer panel 20A. The front protruding portion 20f extends from the right edge to the left edge of the lower outer panel 20B. In addition, the outer panels 20A and 20B may have rear protruding portions that protrude backward beyond the position of the rear surface of the device main body 10 (the rear surface of the housing 30).

[0221] Incidentally, the outer panels 20A and 20B may have protruding portions only on a part of their right side, left side, and front side. For example, the outer panels 20A and 20B may not have the protruding portions 20e and 20f on the front side. In addition, only one of the two outer panels 20A and 20B may have a protruding portion.

[0222] As Figure 1A shown, the upper outer panel 20A has a shape obtained by gently bending a plate in its thickness direction, and does not have a wall portion that descends toward the lower outer panel 20B at its outer peripheral edge. That is, the upper outer panel 20A is not box-shaped. Therefore, the upper outer panel 20A has a right end surface 20g that faces the right side and has a width T3 (width in the up-down direction) corresponding to the thickness of the upper outer panel 20A (seeFigure 1E ) Similarly, the upper outer panel 20A has a left end surface facing left and having a width corresponding to the thickness of the upper outer panel 20A, a front end surface facing forward and having a width corresponding to the thickness of the upper outer panel 20A, and a rear end surface facing rearward and having a width corresponding to the thickness of the upper outer panel 20A.

[0223] Similar to the upper outer panel 20A, the lower outer panel 20B does not have a wall portion extending toward the upper outer panel 20A at its outer peripheral edge. Thus, the lower outer panel 20B has a right end surface 20h facing right and having a width T4 (width in the vertical direction) corresponding to the thickness of the lower outer panel 20B (see Figure 1G ), a left end surface facing left and having a width corresponding to the thickness of the lower outer panel 20B, a front end surface facing forward and having a width corresponding to the thickness of the lower outer panel 20B, and a rear end surface facing rearward and having a width corresponding to the thickness of the lower outer panel 20B.

[0224] [Bending of the outer panel]

[0225] The upper outer panel 20A may have a bent portion in a cutting plane along the vertical direction and intersecting the left - right direction. Compared with the case where the upper outer panel 20A is a flat plate, this can increase the strength of the outer member when the electronic device 1 is placed vertically. As Figure 20A and Figure 20B shown, the upper outer panel 20A may have portions bent in different ways in two cutting planes that are along the vertical direction and intersect each other. Here, the two cutting planes are, for example, the cutting plane represented by the line XXa - XXa shown in Figure 1D and the cutting plane represented by the line XXb - XXb. The cutting planes are not limited to the Figure 1D shown example and may be, for example, a plane along the vertical direction and the front - rear direction. Also in this case, the strength of the upper outer panel 20A (strength against forces acting in the left - right direction) can be increased.

[0226] In Figure 1D , a first position P1, a second position P2 on the opposite side of the center Pc of the upper outer panel 20A from the first position P1, a third position P3, and a fourth position P4 on the opposite side of the center Pc of the upper outer panel 20A from the third position P3 are set at the four corners of the upper outer panel 20A. In Figure 1D , the first position P1 is at the right - front corner, the second position P2 is at the left - rear corner, the third position P3 is at the left - front corner, and the fourth position P4 is at the right - rear corner.

[0227] When the four positions are defined as such in the example of the electronic device 1, the line L1 along the upper surface of the upper outer panel 20A that connects the first position P1 and the second position P2 to each other is a downwardly convex curve, as Figure 20A shown. In other words, when observing the cutting plane along the first diagonal of the electronic device 1, the upper outer panel 20A bends along an arc around the point separated upward from the upper outer panel 20A. Here, the "first diagonal" is Figure 1D the XXa-XXa line shown in

[0228] On the other hand, the line L2 along the upper surface of the upper outer panel 20A that connects the third position P3 and the fourth position P4 to each other is an upwardly convex curve, as Figure 20B shown. In other words, when observing the cutting plane along the second diagonal of the electronic device 1, the upper outer panel 20A can bend along an arc around the point separated downward from the upper outer panel 20A. Here, the "second diagonal" is Figure 1D the line XXb-XXb shown in

[0229] According to such bending of the upper outer panel 20A, as Figure 20A shown, the thickness (width in the up-down direction) of the electronic device 1 at the right front corner (first position P1) of the electronic device 1 and the thickness (width in the up-down direction) of the electronic device 1 at the left rear corner (second position P2) of the electronic device 1 increase. Therefore, when the electronic device 1 is placed vertically, the posture of the electronic device 1 can be stabilized.

[0230] For example, when the electronic device 1 is placed vertically such that the right side surface of the electronic device 1 is on the lower side, the right front corner (first position P1) with a large thickness is on the lower side and supports the electronic device 1. In addition, when the electronic device 1 is placed such that the front surface of the electronic device 1 is on the lower side, the right front corner (first position P1) with a large thickness is also on the lower side. On the other hand, when the electronic device 1 is placed vertically such that the left side surface of the electronic device 1 is on the lower side, the left rear corner (second position P2) with a large thickness is on the lower side and supports the electronic device 1. Therefore, according to the above bending of the upper outer panel 20A, when the electronic device 1 is placed vertically, the posture of the electronic device 1 can be stabilized.

[0231] Figure 20A The first distance D1 at the first position P1 (right front corner) and the second distance D2 at the second position P2 (left rear corner) are shown as the distances from the horizontal plane Hp1 including the circuit board 50 to the upper surface of the upper outer panel 20A. In addition, Figure 20BThe third distance D3 at the third position P3 (left front corner) and the fourth distance D4 at the fourth position P4 (right rear corner) are shown as the distances from the horizontal plane Hp1 including the circuit board 50 to the upper surface of the upper outer panel 20A. As described above, the line L1 connecting the first position P1 and the second position P2 to each other (the first position P1 and the second position P2 are defined on the diagonal of the upper outer panel 20A) is a downwardly convex curve, and the line L2 connecting the third position P3 and the fourth position P4 to each other (the third position P3 and the fourth position P4 are on the other diagonal of the upper outer panel 20A) is an upwardly convex curve. Therefore, each of the first distance D1 and the second distance D2 is greater than each of the third distance D3 and the fourth distance D4. Therefore, by arranging the devices and components of the cooling system near the first position P1 and the second position P2, smooth intake and exhaust can be achieved.

[0232] For example, as Figure 1D shown, in the plan view of the electronic device 1, the line connecting the center Pc of the upper outer panel 20A and the first position P1 to each other (the line XXa - XXa represents the cutting plane) passes through the inlet Ea formed between the upper surface of the upper outer panel 20A and the upper housing member 30A (see Figure 1C ). In addition, the line connecting the center Pc of the upper outer panel 20A and the first position P1 to each other passes through the upper flow channel Ua formed between the upper outer panel 20A and the recessed plate portion 32a of the upper housing member 30A (see Fig. 2a) (see Figure 20A ). This is beneficial for ensuring sufficient width of the inlet Ea in the vertical direction and sufficient width of the upper flow channel Ua in the vertical direction.

[0233] In addition, as seen in the plan view of the electronic device 1, the line connecting the center Pc of the upper outer panel 20A and the second position P2 to each other (the line XXa - XXa represents the cutting plane) can pass through the flow channel from the cooling fan 5 to the exhaust port M provided in the rear surface of the electronic device 1. In the example of the electronic device 1, the air flowing out from the cooling fan 5 passes through the inside of the power supply unit housing 61 and is discharged from the exhaust port M. As seen in the plan view of the electronic device 1, the line connecting the center Pc of the upper outer panel 20A and the second position P2 to each other (the line XXa - XXa represents the cutting plane) passes through the air flow channel formed in the rear part of the power supply unit housing 61 (the rear housing part 61c). Therefore, it is easy to ensure sufficient dimensions of the rear part of the power supply unit housing 61 in the vertical direction, and the exhaust efficiency can be improved.

[0234] In addition, as seen in the plan view of the electronic device 1, the line connecting the center Pc of the upper outer panel 20A and the second position P2 to each other passes through the rear wall 61i of the power supply unit housing 61 in which the exhaust hole 61g is formed (see Figure 7C) and the rear portion 61k of the upper wall 61j in which the exhaust hole 61h is formed (see Figure 7C ). This helps to ensure sufficient dimensions in the vertical direction of the rear wall 61i of the power supply unit housing 61, and to ensure sufficient width in the vertical direction of the air flow passage Se formed between the rear portion 61k of the upper wall 61j and the upper housing member 30A (see Figure 7C ).

[0235] The lower outer panel 20B can also be bent as a whole. For example, as Figure 20A shown, when observing the cutting plane along the first diagonal line ( Figure 1D the line XXa - XXa in Figure 20B ) of the electronic device 1, the lower outer panel 20B is bent. As ​ shown, when observing the cutting plane along the second diagonal line ( ​ the line XXb - XXb in

[0236] ) of the electronic device 1, the lower outer panel 20B can be bent in a manner different from the cutting plane shown in ​ and ​ As described above, the optical disc drive 6 is provided on the lower side of the circuit board 50. The optical disc drive 6 is located in the left portion of the electronic device 1. Therefore, the left portion of the lower outer panel 20B bulges downward to cover the lower side of the optical disc drive 6. The right portion Br of the lower outer panel 20B can have a shape symmetric to the right portion of the upper outer panel 20A. ​ shows cross - sections of the outer panels 20A and 120B, which are obtained in the same cutting plane as the cutting plane shown by the line XXa - XXa in ​ . ​ shows cross - sections of the outer panels 20A and 120B, which are obtained in the same cutting plane as the cutting plane shown by the line XXb - XXb in ​ . ​ is a front view of the electronic device 101 having the outer panels 20A and 120B shown in ​ and ​ .

[0237] In ​ and ​In the illustrated example, a fifth position P5, a sixth position P6 on the opposite side of the center Pc of the lower outer panel 120B from the fifth position P5, a seventh position P7, and an eighth position P8 on the opposite side of the center Pc of the lower outer panel 120B from the seventh position P7 are provided at the four corners of the lower outer panel 120B. For example, the fifth position P5 is located at the right front corner of the lower outer panel 120B, the sixth position P6 is located at the left rear corner of the lower outer panel 120B, the seventh position P7 is located at the left front corner of the lower outer panel 120B, and the eighth position P8 is located at the right rear corner of the lower outer panel 120B. Accordingly, when viewed from the plan view of the electronic device 1, the fifth position P5, the sixth position P6, the seventh position P7, and the eighth position P8 respectively correspond to the above-described first position P1, second position P2, third position P3, and fourth position P4.

[0238] When four positions are thus defined in the lower outer panel 120B, a line L3 that connects the fifth position P5 and the sixth position P6 to each other and extends along the lower surface of the lower outer panel 120B may be a curve that bulges upward, as ​ shown. On the other hand, a line L4 that connects the seventh position P7 and the eighth position P8 to each other and extends along the lower surface of the lower outer panel 120B may be a curve that bulges downward, as ​ shown.

[0239] Incidentally, the bending form of the upper outer panel 20A is not limited to the example of the electronic device 1. For example, the above-described four positions P1 to P4 that define the bending form of the upper outer panel 20A may not be the four corners of the upper outer panel 20A. For example, the first position P1 may be defined at the center of the front edge of the upper outer panel 20A, the second position P2 may be defined on the side opposite to the first position P1 with respect to the center Pc of the upper outer panel 20A, the third position P3 may be defined at the center of the right edge of the upper outer panel 20A, and the fourth position P4 may be defined on the side opposite to the third position P3 with respect to the center Pc of the upper outer panel 20A. When the four positions P1 to P4 are defined in this way, a line that connects the first position P1 and the second position P2 to each other and extends along the upper surface of the upper outer panel 20A may be, for example, a curve that bulges downward. On the other hand, a line that connects the third position P3 and the fourth position P4 to each other and extends along the upper surface of the upper outer panel 20A may be a curve that bulges upward.

[0240] In this case, the bending form of the lower outer panel 20B can correspond to the bending form of the upper outer panel 20A. For example, the entire shape (bending) of the lower outer panel 20B can be symmetrical to the shape (bending) of the upper outer panel 20A. In addition, in another example, although only the upper outer panel 20A is bent as described above, the lower outer panel 20B can be in a flat plate shape. In yet another example, a part of the upper outer panel 20A or a part of the lower outer panel 20B can include a flat surface.

[0241] [Outer panel attachment structure]

[0242] As ​ and Figure 22 shown, a plurality of attachment holes 30e and 30f are formed in the upper surface of the device body 10 (the upper surface of the upper housing member 30A). A plurality of attachment target protrusions 21 and 22 (see Figure 2B ) are formed on the lower surface of the upper outer panel 20A. The attachment target protrusions 21 and 22 are respectively fitted into the attachment holes 30e and 30f. The attachment holes 30e and 30f are, for example, holes penetrating the upper housing member 30A.

[0243] In Figure 22 , the fitting directions in which the attachment target protrusions 21 and 22 are respectively fitted into the attachment holes 30e and 30f are indicated by the arrow Da. The fitting direction Da corresponds, for example, to the direction in which the attachment target protrusions 21 and 22 protrude from the lower surface of the upper outer panel 20A. In addition, the fitting direction Da corresponds, for example, to the direction in which the attachment holes 30e and 30f penetrate the upper housing member 30A. The fitting directions Da in which the plurality of attachment target protrusions 21 and 22 are fitted into the attachment holes 30e and 30f are parallel to each other. The fitting direction Da can be inclined with respect to a plane perpendicular to the vertical direction ( Figure 22 the horizontal plane Hp3 parallel to the circuit board 50 in). For example, the fitting direction Da can be a direction that is inclined with respect to the horizontal plane Hp3 and along a plane parallel to the vertical direction and the left - right direction.

[0244] As described above, the upper outer panel 20A is bent in two cutting planes that are along the vertical direction and intersect each other in different ways. That is, the upper outer panel 20A is bent to bulge downward in the cutting plane along the first diagonal line ( Figure 1D the line XXa - XXa in), and is bent to bulge upward in the cutting plane along the second diagonal line ( Figure 1D the line XXb - XXb in). As Figure 22As shown, the upper surface of the device body 10 is also curved and is consistent with the upper outer panel 20A. When the assembly direction Da is inclined with respect to the horizontal plane Hp3, the curved upper outer panel 20A can be attached to the similarly curved upper surface of the device body 10, and the upper outer panel 20A and the upper surface of the device body 10 can be in close contact with each other.

[0245] Figure 23 is a schematic diagram to help explain this. In the example shown in this figure, a horizontal portion 30i and an inclined portion 30j are formed in the upper housing member 30A. A horizontal portion 20i and an inclined portion 20j are also formed in the upper outer panel 20A. The attachment target protruding portions 21 and 22 protrude in the direction Da inclined with respect to the horizontal plane. The attachment holes 30e and 30f penetrate the upper housing member 30A in the direction Da inclined with respect to the horizontal plane Hp3. The assembly direction Da is more inclined than the inclined portions 30j and 20j. That is, the angle θ1 formed between the horizontal plane Hp3 and the assembly direction Da is greater than the angle θ2 formed between the horizontal plane Hp3 and the inclined portions 20j and 30j. Therefore, the attachment target protruding portions 21 and 20 can be inserted into the attachment holes 30e and 30f without interference between the inclined portion 20j and the inclined portion 30j and without interference between the horizontal portion 20i and the horizontal portion 30i. In addition, after the attachment target protruding portions 21 and 20 are inserted, the inclined portion 20j and the inclined portion 30j can be in close contact with each other, and the horizontal portion 20i and the horizontal portion 30i can be in close contact with each other.

[0246] To reduce the size of the electronic device 1 in the vertical direction, a method is effective in which the upper outer panel 20A and the upper housing member 30A are attached to each other by, for example, sliding the upper outer panel 20A in the right direction or the left direction with respect to the upper housing member 30A. However, this method results in a gap between the inclined portions 20j and 30j and interference between another inclined portion of the upper outer panel 20A and the upper housing member 30A. On the other hand, in the example of the electronic device 1, the assembly direction Da is more inclined than the inclined portions 20j and 30j. Therefore, the upper outer panel 20A can be attached to the upper housing member 30A without causing such a gap or interference. Therefore, it is desirable that the assembly direction Da of the attachment target protruding portions 21 and 22 and the attachment holes 30e and 30f be more inclined with respect to the horizontal plane Hp3 than the most inclined portion in the upper outer panel 20A.

[0247] Incidentally, the plurality of attachment holes 30e and 30f are preferably distributed over the entire upper surface of the upper housing member 30A. This can cause the entire upper outer panel 20A to be in close contact with the upper surface of the upper housing member 30A. In the example of the electronic device 1, a recessed plate portion 32a is formed in the upper surface of the upper housing member 30A. The attachment holes 30e and 30f are preferably distributed in a region other than the recessed plate portion 32a.

[0248] As Figure 22 shown, the attachment target protruding portion 21 has a joining protruding portion 21a at its base. A recess 30h is formed in the bottom surface of the attachment hole 30e. The joining protruding portion 21a is fitted into the recess 30h and restricts the sliding of the attachment target protruding portion 21 out of the attachment hole 30e. On the other hand, the attachment target protruding portion 22 does not have a protruding portion at its base. The joining protruding portion 21a has a surface 21b facing the direction of pulling the attachment target protruding portion 21 out of the attachment hole 30e. At the surface 21b, the joining protruding portion 21a engages with the recess 30h. (The surface 21b will be referred to as a locking surface hereinafter.) The upper outer panel 20A holds the upper surface of the upper housing member 30A by means of the attachment target protruding portion 22 and the locking surface 21b of the attachment target protruding portion 21. A plurality of attachment target protruding portions 22 are arranged along the left edge of the upper outer panel 20A. Different from the attachment target protruding portion 21, a protruding portion may not be formed at the base of the attachment target protruding portion 22.

[0249] The structure for attaching the lower outer panel 20B to the lower housing member 30B may be the same as the structure for attaching the upper outer panel 20A to the upper housing member 30A. That is, as Figure 2A shown, the lower outer panel 20B may have an attachment target protruding portion 25 and an attachment target protruding portion 24, the attachment target protruding portion 25 having a protruding portion formed at its base and the attachment target protruding portion 24 not having such a protruding portion formed thereon. Attachment holes into which the attachment target protruding portions 24 and 25 are to be fitted may be formed in the lower surface of the lower housing member 30B.

[0250] Incidentally, the structure for fixing the upper outer panel 20A to the upper housing member 30A is not limited to the example of the electronic device 1. For example, as Figure 24As shown, the engaging protrusion 26 may be formed in the lower surface of the upper outer panel 20A, instead of the engaging protrusion 21a formed on the base of the attachment target protrusion 21. The engaging protrusion 26 may be formed, for example, such that its center line is along the vertical direction. On the other hand, the hole or recess into which the engaging protrusion 26 is to be fitted may be formed in the upper housing member 30A. According to this structure, the size of the protrusion is more likely to increase compared to the engaging protrusion 21a of the attachment target protrusion 21. As a result, the strength of the engaging protrusion can be increased.

[0251] [Disc insertion slot]

[0252] As Figure 1B and Figure 25 shown, a disc insertion slot 23a may be formed in the lower outer panel 20B, into which the optical disc will be inserted toward the optical disc drive 6. The lower outer panel 20B has a front inclined surface 23 on its front side. The front inclined surface 23 is a surface that extends downward and backward from the front edge 20k of the lower outer panel 20B. The disc insertion slot 23a is formed in the front inclined surface 23. This can prevent the disc insertion slot 23a from being conspicuous.

[0253] As Figure 25 shown, a guiding curved surface 23c connected to the edge of the disc insertion slot 23a is formed in the upper part of the disc insertion slot 23a. The guiding curved surface 23c can be used as a guide for the optical disc D. For example, when the optical disc D is inserted, in the case where the front edge of the optical disc hits just below the front edge 20k of the lower outer panel 20B, the guiding curved surface 23c guides the optical disc D into the interior of the disc insertion slot 23a.

[0254] In the example of the electronic device 1, the disc insertion slot 23a is located in the left side portion of the electronic device 1. The front inclined surface 23 in which the disc insertion slot 23a is formed is inclined such that the right side portion (the portion closer to the center in the left - right direction of the electronic device 1) of the front inclined surface 23 is in front of the left side portion of the front inclined surface 23. Therefore, as Figure 1H shown, in the bottom view of the electronic device 1, the front edge 23e of the disc insertion slot 23a is inclined forward from the left end of the front edge 23e toward the center (the center in the left - right direction) of the electronic device 1. Therefore, when the optical disc D is inserted, the guiding of the optical disc D starts earlier near the center of the electronic device 1.

[0255] As Figure 25 shown, an inclined surface 23d is formed at the lower edge of the disc insertion slot 23a. The inclined surface 23d extends backward and upward from its leading edge. In the case where the front edge of the optical disc hits the inclined surface 23d, the inclined surface 23d guides the optical disc D to the insertion opening 6c formed in the front surface of the disc drive housing 6a.

[0256] The insertion opening 6c formed in the front surface of the disk drive housing 6a is located above the lower portion of the inclined surface 23d. Accordingly, the distance from the insertion opening 6c to the disk insertion slot 23a formed in the lower housing member 30B is reduced. As a result, the operation of inserting the optical disk D can be facilitated.

[0257] As described above, in the electronic device 1, the housing 30 includes an upper housing member 30A that covers the upper surface of the circuit board 50 and a lower housing member 30B that covers the lower surface of the circuit board 50. The cooling fan 5 is provided outside the outer edge of the circuit board 50. The cooling fan 5 has a rotation center line Cf in the vertical direction as the thickness direction of the circuit board 50. The cooling fan 5 forms an air flow between the upper surface of the circuit board 50 and the upper housing member 30A, and forms an air flow between the lower surface of the circuit board 50 and the lower housing member 30B. The upper housing member 30A has an upper inlet 31a defined above the cooling fan 5. The lower housing member 30B has a lower inlet 31b defined below the cooling fan 5. According to the electronic device 1, one cooling fan 5 can send air to both surfaces of the circuit board 50. Accordingly, components provided on both surfaces of the circuit board 50 can be cooled without increasing the number of components. Further, since the upper inlet 31a and the lower inlet 31b are formed in the housing 30, air can be effectively sucked in, and thus the cooling performance can be improved.

[0258] Further, the electronic device 1 includes: a first heat radiator 71 that allows air to pass therethrough in the front-rear direction; a power supply unit 60 including a power supply circuit 62 and a power supply unit housing 61 that houses the power supply circuit 62 and has an intake wall 61a, and a plurality of intake holes 61b are formed in the intake wall 61a; and a cooling fan 5. The intake wall 61a is located in front of the first heat radiator 71. Further, the intake wall 61a has an outer surface that is inclined with respect to the front-rear direction and the left-right direction and faces the first heat radiator 71. The cooling fan 5 is provided to deliver air to the intake wall. Such an intake wall 61a enables ensuring an air flow supply to the first heat radiator 71 and simultaneously cooling the power supply unit 60 with cold air (air not heated by another heat generating device or heat dissipating device). When the power supply unit 60 can be cooled by cold air, the gap between circuit components 62a and 62b (e.g., transformers and capacitors) included in the power supply circuit 62 can be reduced, so that the power supply unit 60 can be miniaturized.

[0259] In addition, the electronic device 1 includes: a circuit board 50; a cooling fan 5 that forms an air flow for cooling components mounted on the circuit board 50; a flow channel wall 34A that defines a flow channel for the air flow sent out from the cooling fan 5; and a dust collection chamber Ds that captures dust in the air flow and collects the captured dust, and the dust collection chamber Ds is provided to the flow channel wall 34A. According to this structure, the amount of dust entering the devices arranged downstream of the dust collection chamber Ds, such as the first radiator 71, the power supply unit 60, etc., can be reduced. In addition, the dust collection chamber Ds has a first opening A1 that opens toward the air flow channel Sa in the direction along the circuit board 50, and a second opening A2 that opens to the outside of the dust collection chamber Ds in the direction intersecting the circuit board 50. In the example of the electronic device 1, the direction in which the second opening A2 opens is a direction orthogonal to the circuit board 50. According to this structure of the dust collection chamber Ds, dust can be collected in the dust collection chamber Ds, and the collected dust can be discharged through the second opening A2 by relatively simple work.

[0260] In addition, the heat dissipation device 70 includes: a plurality of heat pipes 73A to 73F located above the integrated circuit 50a, each heat pipe having a heat receiving portion 73a thermally connected to the integrated circuit 50a; and radiators 71 and 72 connected to the plurality of heat pipes 73A to 73F. The heat receiving portions 73a of the heat pipes 73A to 73F are arranged side by side with each other in the left-right direction and are in contact with the heat receiving portions 73a of adjacent heat pipes 73. The heat receiving portion 73a has a first width W1 in the up-down direction and a second width W2 less than the first width W1 in the left-right direction. According to this structure, it becomes easy to increase the number of heat pipes 73. As a result, it becomes easy to increase the sizes of the radiators 71 and 72 to which the heat of the integrated circuit 50a is transferred through the heat pipes 73. Therefore, the cooling performance of the integrated circuit 50a can be improved.

[0261] In addition, the electronic device 1 includes: a circuit board 50; a board shield 52 that covers the circuit board 50 and has an opening 52a formed therein; and a heat dissipation device 80. The heat dissipation device 80 includes: a plurality of fins 81 arranged inside the opening 52a; a heat pipe 83 having a connecting portion 83a located between the plurality of fins 81 and the circuit board 50 and extending in the left-right direction along the circuit board 50; and a substrate 82 or 182 that supports the plurality of fins 81. The substrate 82 or 182 has a board left portion 82c or 182c. The board left portion 82c or 182c covers the lower surface of the heat pipe 83, that is, the lower surface facing the board shield 52 side, and closes the gap G1 between the left ends of the plurality of fins 81 and the left edge of the opening 52a of the board shield 52. According to this structure, electromagnetic wave leakage from the gap G1 between the left ends of the plurality of fins 81 and the left edge of the opening 52a of the board shield 52 can be effectively suppressed.

[0262] As described above, in the electronic device 1, the lower surface of the circuit board 50 has a shielding region B1, the electronic components 50c and 50e are arranged on the shielding region B1, and the board shield 52 covers the shielding region. A memory accommodation chamber R1 capable of accommodating the semiconductor memory 55 is defined outside the shielding region. The board shield 52 has shielding walls 52e and 52f along the memory accommodation chamber R1. Since the shielding walls 52e and 52f are formed on the board shield 52 in the electronic device 1, the semiconductor memory 55 can be protected from static electricity while suppressing an increase in the number of components.

[0263] As described above, the electronic device 1 includes an upper outer panel 20A having an upper surface. The upper surface of the upper outer panel 20A has a first position P1 on its peripheral portion, a second position P2 on the opposite side of the center Pc defined on the upper surface from the first position P1, a third position P3, and a fourth position P4 defined on the opposite side of the center Pc from the third position P3. A line L1 connecting the first position P1 and the second position P2 and formed along the upper surface is a downwardly convex curve. A line L2 connecting the third position P3 and the fourth position P4 and formed along the upper surface is an upwardly convex curve. According to the electronic device 1, the appearance is improved, and it is easy to ensure the strength of the outer panel 20A. Incidentally, it can be applied to an electronic device that does not have the outer panel 20A. In this case, the upper surface of the housing that houses an internal device such as the circuit board 50 can be curved as described above.

[0264] In addition, the electronic device 1 includes a device main body 10 having an upper surface and a right side surface 10b and a curved upper outer panel 20A. The upper outer panel 20A covers the upper surface of the device main body 10 and is attached to the upper surface. The upper outer panel 20a has a right protruding portion 20A at the end of the upper outer panel 20A that extends beyond the position of the right side surface 10b. According to the electronic device 1, when the electronic device 1 is placed vertically with the right side surface 10b on the lower side, the device main body 10 can be protected by the upper outer panel 20A. In addition, since the upper outer panel 20A is curved, the strength of the upper outer panel 20A can be ensured as compared with, for example, the case where the upper outer panel 20A has a flat plate shape. In addition, the upper outer panel 20A has a curved portion in a cutting plane that extends in the vertical direction and intersects the left-right direction (specifically, in Figure 1D the cutting plane represented by the line XXa-XXa in). Accordingly, sufficient strength of the outer panel 20A can be ensured. The cutting plane that extends in the vertical direction and intersects the left-right direction can be, for example, a plane that extends in the vertical direction and the front-rear direction. Also in this case, sufficient strength of the outer panel 20A against an external force acting in the left-right direction can be ensured.

[0265] In addition, the upper outer panel 20A is a panel attached to the housing 30 having an upper surface and a right side surface 10b, and is disposed above the housing 30. The upper outer panel 20 is curved and has a plurality of attachment target protrusions 21 and 22 to be respectively attached to a plurality of attachment holes 30e and 30f formed in the upper surface of the housing 30, and has a right protrusion 20a at its end that extends beyond the position of the right side surface 10b. According to the upper outer panel 20A, when the electronic device 1 is placed such that the right side surface 10b is on the lower side, the device body 10 can be protected by the upper outer panel 20A.

Claims

1. An electronic device, comprising: A circuit board having electronic components mounted on a surface of one side of the circuit board; A board shield covering an area where the electronic components are provided on a surface of one side of the circuit board; A memory accommodation chamber defined on one side of the circuit board and capable of accommodating a semiconductor memory; A memory cover covering the memory accommodation chamber, wherein An opening for defining the memory accommodation chamber is formed in the board shield, The board shield includes a shielding wall formed on an inner edge of the opening and along the memory accommodation chamber, The memory cover is electrically connected to the shielding wall.

2. The electronic device according to claim 1, wherein The board shield includes a first shielding wall and a second shielding wall located on opposite sides of each other as the shielding wall, and the memory accommodation chamber is between the first shielding wall and the second shielding wall.

3. The electronic device according to claim 1, wherein The circuit board has a ground pattern formed on a surface of one side of the circuit board and adjacent to the memory accommodation chamber, The board shield has a contact portion in contact with the ground pattern, and The shielding wall extends from the contact portion.

4. The electronic device according to claim 3, wherein The ground pattern includes a first ground portion and a second ground portion located on opposite sides of each other, and the memory accommodation chamber is between the first ground portion and the second ground portion, The contact portion includes a first contact portion in contact with the first ground portion and a second contact portion in contact with the second ground portion, and The board shield includes a first shielding wall extending from the first contact portion and a second shielding wall extending from the second contact portion as the shielding wall.

5. The electronic device according to claim 1, further comprising: A housing accommodating the circuit board and the board shield, wherein The housing has a first outer surface that is part of an outer surface of the electronic device, The memory accommodation chamber has a first side along the first outer surface and a second side opposite to the first side, Among the first side and the second side, at least the first side is provided with a shielding wall.

6. The electronic device according to claim 5, wherein The memory accommodation chamber has a ventilation hole, and The ventilation hole is provided on the second side.

7. The electronic device according to claim 1, further comprising: A housing accommodating the circuit board and the board shield, wherein The housing includes a wall portion surrounding the memory accommodation chamber, and The shielding wall is provided inside the wall portion of the housing.

8. The electronic device according to claim 7, further comprising: wherein The memory cover is supported by the wall portion of the housing.

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