A wafer thickness sorting system

Abstract

A wafer thickness sorting system of the present invention comprises a thickness detection component and a sorting component, wherein the sorting component comprises a wafer input mechanism and a wafer storage mechanism, wherein the thickness detection component detects the thickness of the wafer and then transports it to the sorting component through the wafer input mechanism, wherein the sorting component places wafers of different thicknesses into different storage mechanisms according to the set classification rules, wherein the wafers detected by the thickness detection component are transported to the wafer input mechanism, and the wafer storage mechanism comprises at least one group of symmetrically arranged conveyor belts, wherein at least one group of conveyor belts is provided with a top sensor and a bottom sensor at both ends, wherein the top sensor is used to detect whether there is a wafer on the top of the conveyor belt, and the bottom sensor is used to detect whether there is a fixed tooth passing through. The conveyor belt drives the wafer to rise at a slot spacing each time, and during the movement, each time the wafer triggers the top sensor to send an interrupt signal so that the conveyor belt stops immediately, thereby ensuring the consistency of the wafer lifting height.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer sorting, in particular to a wafer thickness sorting system. Background Art

[0002] At present, various process flows or sorting processes are required in wafer production and manufacturing. The robot often needs to put wafers in and out of the storage box, and the robot's fork needs to move to each slot in the wafer storage box to take or put the wafer. When using an automatic wafer storage box, the robot only needs to take the wafer from the top slot of the automatic wafer storage box. The automatic wafer storage box can automatically lift each slot in the storage box, and can always move the slot that needs to be taken and placed to the top, making it convenient for the robot to take and place the wafer. The position accuracy of the robot is very high, which requires the automatic wafer storage box to lift each slot wafer to the top with at least the same position accuracy, otherwise the distance will be too far and the robot cannot take the wafer; or the distance is too close and the wafer is crushed.

[0003] Each slot in the automatic wafer storage box is composed of teeth bonded on four movable belts. The servo motor drives the belt to make each slot rise or fall one grid. On the one hand, the belt slot accuracy is not up to standard. On the other hand, due to some differences in the belt tension and installation of each automatic wafer storage box, the spacing between the slots of each group of automatic wafer storage boxes is different. The current control method is to consider the spacing between the slots to be the same, that is, the distance the motor moves one slot is the same, and the pulse value converted into the motor is also the same. The automatic wafer storage box uses a more common position control method. The control board sends a command to move to the target position, the motor starts to rotate, and the encoder rotates with it. The encoder will send a pulse signal while rotating. The control board accumulates the pulse signal and compares it with the target position value until the pulse value is equal to the target value. Stop sending pulses and the motor stops moving. The same pulse value is sent and the motor moves the same distance. Due to the substandard belt accuracy and installation differences, there are differences in rising or falling one slot, and the consistency of the wafer lifting height cannot be guaranteed. Summary of the invention

[0004] 1. Technical problem to be solved by the invention

[0005] The purpose of the present invention is to solve the problem that the existing wafer thickness sorting system is difficult to ensure the consistency of wafer lifting height during automatic storage.

[0006] 2. Technical solution

[0007] In order to achieve the above object, the technical solution provided by the present invention is:

[0008] A wafer thickness sorting system of the present invention comprises a thickness detection component and a sorting component, wherein the sorting component comprises a wafer input mechanism and a wafer storage mechanism, wherein the wafers detected by the thickness detection component are transported to the wafer input mechanism, and the wafer storage mechanism comprises at least one group of symmetrically arranged conveyor belts, wherein the opposite sides of at least one group of conveyor belts are provided with corresponding fixed teeth for supporting the wafers, and the two ends of at least one group of conveyor belts are respectively provided with a top sensor and a bottom sensor, wherein the top sensor is used to detect whether there is a wafer on the top of the conveyor belt, and the bottom sensor is used to detect whether a fixed tooth passes by.

[0009] Preferably, a plurality of evenly distributed wafer storage mechanisms are provided in the sorting component, and symmetrical and parallel wafer input mechanisms and wafer output mechanisms are provided around the periphery of the plurality of wafer storage mechanisms.

[0010] Preferably, the sorting component is further provided with a storage box, which is arranged at one end of the wafer input mechanism away from the thickness detection component, and is used to receive wafers dropped from the end of the wafer input mechanism.

[0011] Preferably, a detection mechanism for detecting the integrity of wafers is provided on the transport track of the wafer input mechanism.

[0012] Preferably, the outlet of the wafer output mechanism is connected to a guide assembly 1, and the guide assembly 1 includes a wafer transfer mechanism 1, a guide mechanism 1, and a guide lifting mechanism 1. The wafer transfer mechanism 1 is docked with the wafer output mechanism, and the guide lifting mechanism 1 drives the guide mechanism 1 to move, and the guide mechanism 1 transfers the guide lifting mechanism 1 and the wafer transfer mechanism 1.

[0013] Preferably, the wafer transfer mechanism is connected to a transmission component, and the transmission component includes a loading transmission mechanism for placing a wafer box to be stored and an unloading transmission mechanism for placing a stored wafer box.

[0014] Preferably, the thickness detection assembly comprises a fixed bracket and a plurality of detection mechanisms arranged side by side, the fixed bracket is provided with a plurality of height adjustment mechanisms, and the detection mechanisms are respectively arranged on separate height adjustment mechanisms.

[0015] Preferably, a guide plate assembly 2 is provided on one side of the symmetrical sorting assembly of the thickness detection assembly, and the guide plate assembly 2 is provided with a wafer transfer mechanism 2, a guide plate mechanism 2 and a guide plate lifting mechanism 2. The wafer transfer mechanism 2 extends outward and is connected to the thickness detection assembly, and the guide plate lifting mechanism 2 drives the guide plate mechanism 2 to move, and the guide plate mechanism 2 transfers the guide plate lifting mechanism 2 and the wafer transfer mechanism 2.

[0016] Preferably, the second guide mechanism is connected to a second transmission component, and the second transmission component includes a second loading transmission mechanism for placing the wafer box to be taken and a second unloading transmission mechanism for placing the wafer box that has been taken, and the second loading transmission mechanism and the second unloading transmission mechanism are connected by a vertical moving mechanism.

[0017] Preferably, the wafer storage mechanism also includes a base and a driving motor fixed on the base, a fixed bracket is vertically provided on the base, a driven shaft is provided on the upper and lower sides of the fixed bracket, a rotating wheel for driving the conveyor belt is provided on the driven shaft, and the rotating wheel is connected to the driving wheel of the driving motor through a transmission belt.

[0018] Preferably, two groups of conveyor belts are included and are arranged parallel to each other, each group of conveyor belts includes two symmetrically arranged conveyor belts, and the number of fixed teeth on the two groups of conveyor belts is the same.

[0019] Preferably, the fixing bracket comprises a lower fixing bracket and an upper fixing bracket, the lower fixing bracket and the upper fixing bracket are both provided with a rotating shaft fixing hole for fixing the driven shaft, the top sensor is fixed to the upper fixing bracket, and the bottom sensor is fixed to the lower fixing bracket.

[0020] Preferably, a fixing device is provided on the base or the lower fixed bracket, and the fixing device is used to fix the rotating shaft and the driving shaft of the driving motor. The rotating shaft and the driving shaft are arranged in parallel and are driven by a gear set. The rotating shaft and the driving shaft are both provided with transmission wheels.

[0021] Preferably, the gear set is a pair of gears of the same specification and meshing with each other.

[0022] Preferably, the drive motor is an integrated servo drive motor, and the drive motor includes an encoder, a control board and a brake mechanism, and the control board is communicatively connected with the top sensor and the bottom sensor.

[0023] Preferably, the transmission component 1 is provided with upper and lower cavities or left and right cavities that are interconnected, and the upper and lower cavities or left and right cavities are respectively provided with a loading transmission mechanism 1 and a unloading transmission mechanism 1.

[0024] Preferably, the second transmission component is provided with upper and lower cavities or left and right cavities that are interconnected, and the upper and lower cavities or left and right cavities are respectively provided with a second loading transmission mechanism and a second unloading transmission mechanism.

[0025] 3. Beneficial effects

[0026] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0027] A wafer thickness sorting system of the present invention comprises a thickness detection component and a sorting component, wherein the sorting component comprises a wafer input mechanism and a wafer storage mechanism, wherein the thickness detection component detects the thickness of the wafer and then transports the wafer to the sorting component through the wafer input mechanism, wherein the sorting component places wafers of different thicknesses into different storage mechanisms according to the set classification rules, wherein the wafers detected by the thickness detection component are transported to the wafer input mechanism, wherein the wafer storage mechanism comprises at least one group of symmetrically arranged conveyor belts, wherein the opposite sides of at least one group of conveyor belts are provided with corresponding fixed teeth for supporting the wafers, and the two ends of at least one group of conveyor belts are respectively provided with a top sensor and a bottom sensor, wherein the top sensor is used to detect whether there is a wafer on the top of the conveyor belt, and the bottom sensor is used to detect whether there is a fixed tooth passing by. The conveyor belt drives the wafer to rise at a slot spacing each time, and during the movement, the top sensor continuously detects, and when the top sensor detects that there is a wafer on the top of the conveyor belt, the top sensor sends an interrupt signal to the driving motor; when the top sensor does not detect that there is a wafer on the top of the conveyor belt, the conveyor belt continues to move at the slot spacing. Each time the wafer triggers the top sensor to send an interrupt signal, the conveyor belt stops immediately, ensuring the consistency of the wafer lifting height. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of a wafer thickness sorting system of the present invention;

[0029] Figure 2 It is a structural schematic diagram of a transmission component 1 of the present invention;

[0030] Figure 3 It is a structural schematic diagram of a guide vane assembly 1 of the present invention;

[0031] Figure 4 It is a structural schematic diagram of the sorting component of the present invention;

[0032] Figure 5 It is a structural schematic diagram of the thickness detection component of the present invention;

[0033] Figure 6 It is a structural schematic diagram of the guide vane assembly 2 of the present invention;

[0034] Figure 7 It is a structural schematic diagram of the transmission component 2 of the present invention;

[0035] Figure 8 is a schematic structural diagram of the wafer storage mechanism of this embodiment;

[0036] Fig. 9 It is a front view of the wafer storage mechanism of this embodiment;

[0037] Fig.10 is a side view of the wafer storage mechanism of this embodiment;

[0038] Fig.11 It is a partial schematic diagram of the driving motor of the wafer storage mechanism of this embodiment.

[0039] Explanation of the symbols in the schematic diagram:

[0040] 100, a transmission component 1; 110, a loading transmission mechanism 1; 120, a unloading transmission mechanism 1; 130, a wafer box to be stored 1; 140, a stored wafer box 1; 150, a wafer box moving mechanism 1;

[0041] 200, a guide assembly 1; 210, a wafer transfer mechanism 1; 220, a guide mechanism 1; 230, a guide lifting mechanism 1;

[0042] 300, sorting assembly; 310, wafer output mechanism; 320, storage box; 410, wafer input mechanism; 420, moving arm; 430, gripper; 440, wafer storage mechanism; 450, robot; 460, wafer tracking and detection assembly;

[0043] 500, thickness detection assembly; 510, fixing bracket; 520, detection mechanism; 530, height adjustment mechanism;

[0044] 600, guide plate assembly 2; 610, wafer transfer mechanism 2; 620, guide plate mechanism 2; 630, guide plate lifting mechanism 2;

[0045] 700, transmission component 2; 710, unloading transmission mechanism 2; 720, loading transmission mechanism 2; 730, wafer box taken; 740, wafer box to be taken; 750, wafer box moving mechanism 2; 760, vertical moving mechanism;

[0046] 4100, base; 4101, base fixing hole; 4110, lower fixed bracket; 4111, shaft fixing hole; 4112, bracket fixing hole; 4113, bottom sensor; 4114, drive shaft; 4115, rotating shaft; 4116, fixing device; 4120, drive motor; 4121, transmission wheel; 4122, transmission belt; 4123, driven wheel; 4124, rotating wheel; 4125, driven shaft; 4126, conveyor belt; 4127, fixed teeth; 4128, gear set; 4130, upper fixed bracket; 4131, horizontal fixing rod; 4132, top sensor; 4140, fixing plate; 4150, wafer. DETAILED DESCRIPTION

[0047] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0048] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element; when an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be a central element; the terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0050] Example 1

[0051] See attached Figure 1 -Attached Fig.11The present embodiment provides a wafer thickness sorting system, comprising a thickness detection component 500 and a sorting component 300, wherein the sorting component 300 comprises a wafer input mechanism 410 and a wafer storage mechanism 440, wherein the thickness detection component 500 detects the thickness of the wafer and then transports the wafer to the sorting component 300 through the wafer input mechanism 410, and the sorting component 300 places wafers of different thicknesses into different storage mechanisms 440 according to the set classification rules, and the wafers detected by the thickness detection component 500 are transported to the wafer input mechanism 410. 10. The wafer storage mechanism 440 includes at least one group of symmetrically arranged conveyor belts 4126. The opposite sides of at least one group of conveyor belts 4126 are provided with corresponding fixed teeth 4127 for supporting wafers 4150. The two ends of at least one group of conveyor belts 4126 are provided with a top sensor 4132 and a bottom sensor 4113 respectively. The top sensor 4132 is used to detect whether there is a wafer 4150 on the top of the conveyor belt 4126, and the bottom sensor 4113 is used to detect whether there is a fixed tooth 4127 passing by. The conveyor belt 4126 drives the wafer to rise at the slot spacing each time. During the movement, the top sensor 4132 continuously detects. When the top sensor 4132 detects that there is a wafer on the top of the conveyor belt 4126, the top sensor 4132 sends an interrupt signal to the driving motor; when the top sensor 4132 does not detect that there is a wafer on the top of the conveyor belt 4126, the conveyor belt 4126 continues to move at the slot spacing. Each time the wafer triggers the top sensor 4132 to send out an interrupt signal, the conveyor belt stops immediately, thereby ensuring the consistency of the wafer lifting height.

[0052] A plurality of evenly distributed wafer storage mechanisms 440 are disposed in the sorting component 300 , and symmetrical and parallel wafer input mechanisms 410 and wafer output mechanisms 310 are disposed on the periphery of the plurality of wafer storage mechanisms 440 .

[0053] The sorting assembly 300 is further provided with a storage box 320 , which is disposed at one end of the wafer input mechanism 410 away from the thickness detection assembly 500 , and is used to receive wafers dropped from the end of the wafer input mechanism 410 .

[0054] The transport track of the wafer input mechanism 410 is provided with a detection mechanism 520 for detecting the integrity of the wafer. The detection mechanism 520 is an image recognition device. When detecting a complete wafer, it sends a signal to control the robot 450. The moving arm 420 of the robot 450 moves and clamps the complete wafer through the gripper 430 and places it in the corresponding storage mechanism 440. When the detected wafer is incomplete, no signal is sent to the robot 450 for grabbing. The incomplete wafer that is not grabbed moves with the wafer input mechanism 410 and falls into the storage box 320. The wafer input mechanism 410 and the wafer output mechanism 310 are conveyor belts and other conveying equipment.

[0055] The outlet of the wafer output mechanism 310 is connected to a guide assembly 200, and the guide assembly 200 includes a wafer transfer mechanism 210, a guide mechanism 220, and a guide lifting mechanism 230. The wafer transfer mechanism 210 is docked with the wafer output mechanism 310, and the guide lifting mechanism 230 drives the guide mechanism 220 to move. The guide mechanism 220 transfers the guide lifting mechanism 230 and the wafer transfer mechanism 210.

[0056] The wafer transfer mechanism 210 is connected to the transmission component 100, and the transmission component 100 includes a loading transmission mechanism 110 for placing the wafer box 130 to be stored and an unloading transmission mechanism 120 for placing the stored wafer box 140. The loading transmission mechanism 110 transports the wafer box 130 to be stored to the wafer transfer mechanism 210, and the wafer transfer mechanism 210 transports the wafer box 130 to be stored to the guide mechanism 220 for fixation. The guide lifting mechanism 230 places the wafer output by the wafer output mechanism 310 in the wafer box 130 to be stored, and then the stored wafer box 140 is transported to the unloading transmission mechanism 120 of the transmission component 100 through the wafer transfer mechanism 210 for output.

[0057] The thickness detection assembly 500 includes a fixed bracket 510 and a plurality of detection mechanisms 520 arranged side by side. The fixed bracket 510 is provided with a plurality of height adjustment mechanisms 530 , and the detection mechanisms 520 are respectively arranged on separate height adjustment mechanisms 530 .

[0058] A guide plate assembly 600 is provided on one side of the symmetrical sorting assembly 300 of the thickness detection assembly 500. The guide plate assembly 600 is provided with a wafer transfer mechanism 610, a guide plate mechanism 620 and a guide plate lifting mechanism 630. The wafer transfer mechanism 610 extends outward and is connected to the thickness detection assembly 500. The guide plate lifting mechanism 630 drives the guide plate mechanism 620 to move. The guide plate mechanism 620 transfers the guide plate lifting mechanism 630 and the wafer transfer mechanism 610.

[0059] The second guide mechanism 620 is connected to the second transmission component 700, and the second transmission component 700 includes a loading transmission mechanism 720 for placing the wafer box 740 to be taken and a unloading transmission mechanism 710 for placing the taken wafer box 730. The loading transmission mechanism 720 and the unloading transmission mechanism 710 are connected by a vertical moving mechanism 760.

[0060] The wafer storage mechanism 440 also includes a base 4100 and a driving motor 4120 fixed on the base 4100. A fixed bracket is vertically provided on the base 4100. A driven shaft 4125 is provided on the upper and lower sides of the fixed bracket. A rotating wheel 4124 for driving a conveyor belt 4126 is provided on the driven shaft 4125. The rotating wheel 4124 is connected to the driving wheel 4121 of the driving motor 4120 through a transmission belt 4122.

[0061] It includes two groups of conveyor belts 4126 which are arranged parallel to each other. Each group of conveyor belts 4126 includes two symmetrically arranged conveyor belts 4126. The numbers of fixed teeth 4127 on the two groups of conveyor belts 4126 are the same.

[0062] The fixing bracket includes a lower fixing bracket 4110 and an upper fixing bracket 4130 , and both the lower fixing bracket 4110 and the upper fixing bracket 4130 are provided with a shaft fixing hole 4111 for fixing the driven shaft 4125 , the top sensor 4132 is fixed to the upper fixing bracket 4130 , and the bottom sensor 4113 is fixed to the lower fixing bracket 4110 .

[0063] A fixing device 4116 is provided on the base 4100 or the lower fixed bracket 4110, and the fixing device 4116 is used to fix the rotating shaft 4115 and the driving shaft 4114 of the driving motor 4120. The rotating shaft 4115 and the driving shaft 4114 are arranged in parallel and are driven by a gear set 4128. A transmission wheel 4121 is provided on both the rotating shaft 4115 and the driving shaft 4114.

[0064] The gear set 4128 is a pair of gears of the same specification that mesh with each other.

[0065] The drive motor 4120 is an integrated servo drive motor, and the drive motor 4120 includes an encoder, a control board and a brake mechanism. The control board is communicatively connected with the top sensor 4132 and the bottom sensor 4113 .

[0066] The transmission component 100 is provided with upper and lower cavities or left and right cavities that are interconnected, and the upper and lower cavities or left and right cavities are respectively provided with a loading transmission mechanism 110 and a unloading transmission mechanism 120.

[0067] The second transmission component 700 is provided with upper and lower cavities or left and right cavities that are interconnected, and the upper and lower cavities or left and right cavities are respectively provided with a second loading transmission mechanism 720 and a second unloading transmission mechanism 710.

[0068] A top sensor 4132 and a bottom sensor 4113 are respectively provided at both ends of the conveyor belt 4126 for storing and conveying wafers 4150, and a driving motor 4120 is provided for driving the conveyor belt 4126. The driving motor 4120 drives the conveyor belt 4126 to drive the wafers 4150 to rise. When the top sensor 4132 detects that there is a wafer 4150 on the top of the conveyor belt 4126, the top sensor 4132 sends an interrupt signal to the driving motor 4120, and the driving motor 4120 stops rotating to keep the wafer 4150 at a set height. This ensures that the wafer 4150 is accurately and stably placed at the position to be picked up.

[0069] The method of this embodiment also includes detecting the number of fixed teeth 4127 of the conveyor belt 4126 passing through by the bottom sensor 4113 , and calculating the spacing between adjacent fixed teeth 4127 by comparing the number of fixed teeth 4127 with the encoding value of the encoder of the corresponding drive motor 4120 .

[0070] The method is specifically as follows: first, the conveyor belt 4126 is driven by the driving motor 4120 so that all the fixed teeth 4127 are located above the bottom sensor 4113, and then the driving motor 4120 drives the conveyor belt 4126 to descend. When the bottom sensor 4113 detects the first fixed tooth 4127, the motor encoding value is cleared, and this position is the zero position. Then, the conveyor belt 4126 continues to descend so that the last fixed tooth 4127 stops moving when it is detected by the bottom sensor 4113, and the number of fixed teeth 4127 and the encoding value of the encoder of the corresponding driving motor 4120 are calculated, and the spacing between adjacent fixed teeth 4127 is the slot spacing. By determining the value of the motor encoding value in the process of all fixed teeth 4127 passing through the bottom sensor 4113, the spacing between adjacent fixed teeth 4127 is calculated as the slot spacing, and the conveyor belt 4126 is controlled by the encoding value to rise or fall by one slot spacing each time, so as to ensure that the conveyor belt 4126 moves stably and evenly to achieve stable picking or storage of the wafer 4150.

[0071] The conveyor belt 4126 drives the wafer 4150 to rise at the slot spacing each time. During the movement, the top sensor 4132 continues to detect. When the top sensor 4132 detects that there is a wafer 4150 on the top of the conveyor belt 4126, the top sensor 4132 sends an interrupt signal to the drive motor 4120; when the top sensor 4132 does not detect that there is a wafer 4150 on the top of the conveyor belt 4126, the conveyor belt 4126 continues to move at the slot spacing.

[0072] The above-described embodiments only express a certain implementation mode of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A wafer thickness sorting system, characterized in that: The invention comprises a thickness detection component (500) and a sorting component (300), wherein the sorting component (300) comprises a wafer input mechanism (410) and a wafer storage mechanism (440), wherein wafers detected by the thickness detection component (500) are transported to the wafer input mechanism (410), and the wafer storage mechanism (440) comprises at least one group of symmetrically arranged conveyor belts (4126), wherein the opposite sides of at least one group of conveyor belts (4126) are provided with corresponding fixed teeth (4127) for supporting wafers (4150), and the two ends of at least one group of conveyor belts (4126) are respectively A top sensor (4132) and a bottom sensor (4113) are provided, and a driving motor (4120) is provided for driving a conveyor belt (4126), wherein the top sensor (4132) is used to detect whether there is a wafer (4150) on the top of the conveyor belt (4126), and the bottom sensor (4113) is used to detect whether a fixed tooth (4127) passes through and the number of fixed teeth (4127) that pass through, and the number of fixed teeth (4127) and the encoding value of the encoder of the corresponding driving motor (4120) are used to calculate the spacing between adjacent fixed teeth (4127); The system specifically comprises the following steps: firstly, the conveyor belt (4126) is driven by the driving motor (4120) so that all the fixed teeth (4127) are located above the bottom sensor (4113); then, the driving motor (4120) drives the conveyor belt (4126) to descend; when the bottom sensor (4113) detects the first fixed tooth (4127), the motor encoding value is cleared, and this position is the zero position; then, the conveyor belt (4126) continues to descend so that the last fixed tooth (4127) stops moving when it is detected by the bottom sensor (4113); and the number of the fixed teeth (4127) and the corresponding drive motor (4120) are compared. The encoder's encoding value is used to calculate the spacing between adjacent fixed teeth (4127) as the slot spacing; the conveyor belt (4126) drives the wafer (4150) to rise at the slot spacing each time. During the movement, the top sensor (4132) continues to detect. When the top sensor (4132) detects that there is a wafer (4150) on the top of the conveyor belt (4126), the top sensor (4132) sends an interrupt signal to the drive motor (4120); when the top sensor (4132) does not detect that there is a wafer (4150) on the top of the conveyor belt (4126), the conveyor belt (4126) continues to move at the slot spacing.

2. A wafer thickness sorting system according to claim 1, characterized in that: A plurality of evenly distributed wafer storage mechanisms (440) are arranged inside the sorting component (300), and symmetrical and parallel wafer input mechanisms (410) and wafer output mechanisms (310) are arranged outside the plurality of wafer storage mechanisms (440).

3. A wafer thickness sorting system according to claim 2, characterized in that: The sorting component (300) is further provided with a storage box (320), the storage box (320) being arranged at an end of the wafer input mechanism (410) away from the thickness detection component (500), the storage box (320) being used to receive wafers dropped from the end of the wafer input mechanism (410).

4. A wafer thickness sorting system according to claim 2, characterized in that: A detection mechanism (520) for detecting the integrity of wafers is provided on the transport track of the wafer input mechanism (410).

5. The wafer thickness sorting system according to claim 2, characterized in that: The outlet of the wafer output mechanism (310) is connected to a guide plate assembly (200), and the guide plate assembly (200) includes a wafer transfer mechanism (210), a guide plate mechanism (220), and a guide plate lifting mechanism (230). The wafer transfer mechanism (210) is docked with the wafer output mechanism (310), and the guide plate lifting mechanism (230) drives the guide plate mechanism (220) to move. The guide plate mechanism (220) transfers the guide plate lifting mechanism (230) and the wafer transport mechanism (210).

6. A wafer thickness sorting system according to claim 5, characterized in that: The wafer transfer mechanism 1 (210) is connected to a transmission component 1 (100), and the transmission component 1 (100) includes a loading transmission mechanism 1 (110) for placing a wafer box 1 (130) to be stored and a unloading transmission mechanism 1 (120) for placing a stored wafer box 1 (140).

7. The wafer thickness sorting system according to claim 1, characterized in that: The thickness detection assembly (500) comprises a fixed bracket (510) and a plurality of detection mechanisms (520) arranged side by side, the fixed bracket (510) being provided with a plurality of height adjustment mechanisms (530), and the detection mechanisms (520) being respectively arranged on separate height adjustment mechanisms (530).

8. The wafer thickness sorting system according to claim 1, characterized in that: The thickness detection component (500) is symmetrically provided with a guide plate component 2 (600) on one side of the sorting component (300), and the guide plate component 2 (600) is provided with a wafer transfer mechanism 2 (610), a guide plate mechanism 2 (620) and a guide plate lifting mechanism 2 (630). The wafer transfer mechanism 2 (610) extends outwardly and is connected to the thickness detection component (500), and the guide plate lifting mechanism 2 (630) drives the guide plate mechanism 2 (620) to move. The guide plate mechanism 2 (620) transfers the guide plate lifting mechanism 2 (630) and the wafer transfer mechanism 2 (610).

9. A wafer thickness sorting system according to claim 8, characterized in that: The second guide mechanism (620) is connected to a second transmission component (700), and the second transmission component (700) includes a second loading transmission mechanism (720) for placing a wafer box (740) to be taken out and a second unloading transmission mechanism (710) for placing a wafer box (730) that has been taken out. The second loading transmission mechanism (720) and the second unloading transmission mechanism (710) are connected via a vertical moving mechanism (760).

10. The wafer thickness sorting system according to claim 1, characterized in that: The wafer storage mechanism (440) further comprises a base (4100) and a driving motor (4120) fixed on the base (4100); a fixing bracket is vertically provided on the base (4100); a driven shaft (4125) is provided on the upper and lower sides of the fixing bracket; a rotating wheel (4124) for driving a conveyor belt (4126) is provided on the driven shaft (4125); the rotating wheel (4124) is connected to a driving wheel (4121) of the driving motor (4120) via a transmission belt (4122).

11. A wafer thickness sorting system according to claim 10, characterized in that: It comprises two groups of conveyor belts (4126) which are arranged parallel to each other, each group of conveyor belts (4126) comprises two conveyor belts (4126) which are symmetrically arranged, and the number of fixed teeth (4127) on the two groups of conveyor belts (4126) is the same.

12. A wafer thickness sorting system according to claim 11, characterized in that: The fixed bracket comprises a lower fixed bracket (4110) and an upper fixed bracket (4130), and the lower fixed bracket (4110) and the upper fixed bracket (4130) are both provided with a rotating shaft fixing hole (4111) for fixing the driven shaft (4125), the top sensor (4132) is fixed to the upper fixed bracket (4130), and the bottom sensor (4113) is fixed to the lower fixed bracket (4110).

13. A wafer thickness sorting system according to claim 12, characterized in that: A fixing device (4116) is provided on the base (4100) or the lower fixing bracket (4110), and the fixing device (4116) is used to fix the rotating shaft (4115) and the driving shaft (4114) of the driving motor (4120). The rotating shaft (4115) and the driving shaft (4114) are arranged in parallel and driven by a gear set (4128). The rotating shaft (4115) and the driving shaft (4114) are both provided with a transmission wheel (4121).

14. A wafer thickness sorting system according to claim 13, characterized in that: The gear set (4128) is a pair of gears of the same specification that mesh with each other.

15. A wafer thickness sorting system according to claim 14, characterized in that: The drive motor (4120) is an integrated servo drive motor, and the drive motor (4120) comprises an encoder, a control board and a brake mechanism, and the control board is communicatively connected with the top sensor (4132) and the bottom sensor (4113).

16. The wafer thickness sorting system according to claim 6, characterized in that: The transmission component 1 (100) is provided with upper and lower cavities or left and right cavities that are interconnected, and the upper and lower cavities or left and right cavities are respectively provided with a loading transmission mechanism 1 (110) and a unloading transmission mechanism 1 (120).

17. The wafer thickness sorting system according to claim 9, characterized in that: The second transmission component (700) is provided with upper and lower cavities or left and right cavities that are interconnected, and the upper and lower cavities or left and right cavities are respectively provided with a second loading transmission mechanism (720) and a second unloading transmission mechanism (710).

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