An upper electrode assembly and a semiconductor processing device

Abstract

The present application discloses an upper electrode assembly and a semiconductor processing device. The upper electrode assembly is applied to a process chamber, and the process chamber includes a chamber body and a chamber cover plate. The upper electrode assembly includes: a bracket disposed on the top surface of the chamber cover plate; a connecting cylinder passing through the chamber cover plate and connected to the chamber cover plate through a bellows; a gas distribution plate disposed inside the chamber body and connected to the connecting cylinder; a leveling structure connected to one end of the connecting cylinder; a lifting driving structure connected between the bracket and the leveling structure for driving the connecting cylinder and the gas distribution plate to lift through the leveling structure. The leveling structure, the connecting cylinder, and the gas distribution plate are coaxially arranged with the lifting driving structure. In the present application, the driving force of the lifting driving structure and the gravity of the driven component are substantially on the same vertical line, and the parallelism between the gas distribution plate and the lower electrode during the up and down movement is substantially not affected, which can improve the uniformity of edge etching.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor manufacturing equipment, and particularly relates to an upper electrode assembly and a semiconductor processing equipment. Background Art

[0002] During the processes of wafer deposition and etching, polymers with different components will remain on the edge of the wafer. These polymers will cause defects in the subsequent processing of the wafer, especially in the edge part of the wafer. Currently, the above polymers are mainly removed by an edge etcher. Specifically, a plasma is formed by discharging a process gas between an upper electrode and a lower electrode, and the wafer is etched with the plasma.

[0003] During the process, the upper electrode needs to move up and down frequently. It moves upward to pick and place the wafer, and moves downward to etch the wafer after the wafer is placed. Please refer to Figure 1 , Figure 1 which is a schematic top view structure of a process chamber of an edge etcher in the related art. It includes a left support 1, a right support 2, a lifting drive structure 3 arranged on the right support 2, and four guiding structures 4 arranged on the left support 1 and the right support 2. Driven by the lifting drive structure 3, the upper electrode moves up and down along the guiding structure 4.

[0004] Since the driving force of the lifting drive structure 3 is located on one side of the overall structure of the process chamber, and the center of gravity of the overall guiding of the four guiding structures 4 is located on the central axis, such a driving force will generate an additional moment relative to the center of gravity, resulting in the inclination of the upper electrode and non-parallelism with the lower electrode, ultimately affecting the uniformity of edge etching. Summary of the Invention

[0005] Aiming at the above technical problems, this application provides an upper electrode assembly and a semiconductor processing equipment, which can improve the problem that the additional moment generated by the lifting drive structure in the related art causes the upper electrode to be inclined and non-parallel with the lower electrode, ultimately affecting the uniformity of edge etching.

[0006] To solve the above technical problems, in a first aspect, an embodiment of this application provides an upper electrode assembly, which is applied to a process chamber of a semiconductor processing equipment. Wherein, the process chamber includes a chamber body and a chamber cover plate covering the chamber body, and the upper electrode assembly includes:

[0007] A bracket, arranged on the top surface of the chamber cover plate;

[0008] A connecting cylinder, penetrating through the chamber cover plate and being movably connected to the chamber cover plate;

[0009] An air distribution plate, arranged inside the chamber body and connected to the connecting cylinder;

[0010] A leveling structure, connected to one end of the connecting cylinder outside the chamber body;

[0011] A lifting drive structure, connected between the bracket and the leveling structure, for driving the connecting cylinder and the air distribution plate to lift through the leveling structure; wherein, the leveling structure, the connecting cylinder and the air distribution plate are coaxially arranged with the lifting drive structure.

[0012] Optionally, the leveling structure includes:

[0013] A tension-bearing joint seat;

[0014] A moving flat plate, connected to the lifting drive structure, and the bottom surface of the moving flat plate is fixedly connected to one end of the tension-bearing joint seat;

[0015] A horizontal adjusting plate, located below the moving flat plate, and there is a gap between the horizontal adjusting plate and the moving flat plate. The horizontal adjusting plate is rotatably connected to the other end of the tension-bearing joint seat in all directions, and the bottom surface of the horizontal adjusting plate is connected to the connecting cylinder;

[0016] A gap adjusting member, connected between the moving flat plate and the horizontal adjusting plate, for adjusting the gap between the moving flat plate and the horizontal adjusting plate.

[0017] Optionally, the gap adjusting member includes at least three non-collinear piezoelectric sensors;

[0018] The piezoelectric sensors are arranged on the top surface of the horizontal adjusting plate and are in bottom contact connection with the moving flat plate, or the piezoelectric sensors are arranged on the bottom surface of the moving flat plate and are in top contact connection with the horizontal adjusting plate.

[0019] Optionally, the tension-bearing joint seat includes a fixed connection part and a movable connection part connected to each other;

[0020] The bottom surface of the moving flat plate is connected to the fixed connection part, and the horizontal adjusting plate is connected to the movable connection part;

[0021] The side surface of the movable connection part is spherical;

[0022] The horizontal adjusting plate is provided with a first through hole, the first through hole includes a first part close to the top surface of the horizontal adjusting plate and a second part close to the bottom surface of the horizontal adjusting plate, and the first part is connected to the second part;

[0023] The first part is a curved surface that matches the spherical surface, and the diameter of the first part on the top surface of the horizontal adjusting plate is smaller than the diameter of the spherical surface and larger than the diameter of the fixed connection part;

[0024] The aperture of the second part is larger than the diameter of the spherical surface.

[0025] Optionally, the tensile joint seat further includes a connecting plate, which is detachably connected to the end face of the fixed connection part and extends radially along the fixed connection part and protrudes from the fixed connection part;

[0026] The fixed connection part is connected to the bottom surface of the moving flat plate through the connecting plate.

[0027] Optionally, a first connection hole is provided on the moving flat plate;

[0028] The tensile joint seat further includes a second connection hole longitudinally penetrating the tensile joint seat, and the second connection hole is coaxially arranged with the first connection hole;

[0029] The lifting drive structure includes:

[0030] A lead screw nut, passing through the first connection hole and sleeved in the second connection hole;

[0031] A lead screw, one end of which is connected to the bracket and the other end is connected to the lead screw nut.

[0032] Optionally, the upper electrode assembly further includes:

[0033] At least two guiding structures, connected between the bracket and the leveling structure and evenly distributed around the lifting drive structure;

[0034] The guiding structure includes:

[0035] A guiding bearing, arranged on the leveling structure;

[0036] A guiding shaft, one end of which is connected to the bracket and the other end is connected to the guiding bearing.

[0037] Optionally, the horizontal adjustment plate is provided with a first gas channel;

[0038] The connecting cylinder is provided with a second gas channel;

[0039] The air distribution plate is provided with a third gas channel;

[0040] The first gas channel, the second gas channel and the third gas channel are connected in sequence to form a gas flow channel;

[0041] The air inlet of the gas flow channel is arranged on the side surface of the horizontal adjustment plate, and the air outlet of the gas flow channel is arranged at a position close to the edge of the bottom surface of the air distribution plate.

[0042] Optionally, the upper electrode assembly further includes:

[0043] A first annular seal is sleeved outside the connecting cylinder, with one end sealingly connected to the chamber cover plate and the other end sealingly connected to the leveling structure;

[0044] And / or, a second annular seal is disposed around the outer periphery of the connection between the first gas passage and the second gas passage.

[0045] Optionally, the bracket includes two support plates supported on the top surface of the chamber cover plate, a cross beam mounted on the two support plates, and a fixing seat disposed on the bottom surface of the cross beam;

[0046] The lifting drive structure is connected to the fixing seat;

[0047] A second through hole is provided on the cross beam opposite to the lifting drive structure, and the lifting drive structure is connected to the drive source through the second through hole.

[0048] In a second aspect, an embodiment of the present application further provides a semiconductor processing apparatus, including a process chamber and the upper electrode assembly as described in each of the above embodiments. Among them, a lower electrode for carrying a wafer is disposed in the process chamber opposite to the upper electrode assembly.

[0049] As described above, for the upper electrode assembly of the present application, the lifting drive structure is disposed above the chamber cover plate through the bracket, and is connected to the leveling structure. Moreover, the overall center of gravity of the leveling structure, the connecting cylinder, and the gas distributor is on the same vertical line as the lifting drive structure, which can make the driving force of the lifting drive structure and the gravity of the driven components (the leveling structure, the connecting cylinder, and the gas distributor) substantially on the same vertical line, without generating torque, which can make the up and down movement of the gas distributor more stable. When the gas distributor moves up and down, the parallelism with the lower electrode is basically not affected, and the uniformity of edge etching can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0051] Figure 1 It is a schematic top view structure diagram of a process chamber of an edge etching machine in the related art;

[0052] Figure 2 It is a schematic structural diagram of a process chamber provided by an embodiment of the present application;

[0053] Figure 3 Is alongFigure 2 Schematic cross-sectional structure diagram along line A-A in [the figure];

[0054] Figure 4 It is along Figure 2 Schematic diagram of the upper part of the cross-sectional structure along line B-B in [the figure];

[0055] Figure 5 It is Figure 4 Enlarged structure schematic diagram of part C in [the figure].

[0056] The realization of the purpose of this application, functional features and advantages will be further described in combination with embodiments with reference to the accompanying drawings. Through the above-mentioned accompanying drawings, specific embodiments of this application have been shown, and there will be more detailed descriptions hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. Specific Embodiments

[0057] Here, exemplary embodiments will be described in detail, and their examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. On the contrary, they are merely examples of devices and methods consistent with some aspects of this application as detailed in the appended claims.

[0058] It should be noted that in this article, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or elements inherent to such a process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article or device including that element. In addition, components, features, elements with the same name in different embodiments of this application may have the same meaning or different meanings, and their specific meanings need to be determined based on their explanations in the specific embodiments or further in combination with the context of the specific embodiments.

[0059] It should be further understood that the terms "comprising" and "including" indicate the presence of the described features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or", "and / or", "including at least one of the following", etc. used in this application can be interpreted inclusively, or mean any one or any combination. For example, "including at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C", and again, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C". An exception to this definition occurs only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0060] It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this document, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, as used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms, unless the context indicates otherwise.

[0061] It should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", "upper", "lower", "vertical", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to this application.

[0062] Please refer to Figure 2 and Figure 3 , Figure 2 is a schematic top view structure diagram of a process chamber provided by an embodiment of this application, Figure 3 is a schematic cross-sectional structure diagram along the Figure 2 A-A line in. The upper electrode assembly provided by the embodiment of this application can be applied to this process chamber. Among them, this process chamber includes a chamber body 10 and a chamber cover plate 20 covering the chamber body 10. The upper electrode assembly provided by the embodiment of this application includes: a bracket 30, a connecting cylinder 40, a gas distribution plate 60, a leveling structure 70, and a lifting drive structure 80.

[0063] Specifically, the bracket 30 is disposed on the top surface of the chamber cover plate 20. The connecting cylinder 40 penetrates through the chamber cover plate 20 and is movably connected to the chamber cover plate 20. For example, the connecting cylinder 40 can move up and down relative to the chamber cover plate 20, and the connecting cylinder 40 can tilt in any direction relative to the chamber cover plate 20. While the connecting cylinder 40 is moving, the sealing performance of the chamber body 10 needs to be maintained. For example, a first annular seal can be sleeved outside the connecting cylinder 40. One end of the first annular seal is hermetically connected to the chamber cover plate 20, and the other end is hermetically connected to the leveling structure 70. As an example, the first annular seal can be a bellows 50. The connecting cylinder 40 can be connected to the chamber cover plate 20 through the bellows 50, so that while the connecting cylinder 40 moves up and down or tilts relative to the chamber cover plate 20, the sealing performance of the chamber body 10 can still be maintained. The gas distribution plate 60 is disposed inside the chamber body 10 and is connected to the connecting cylinder 40. For example, the gas distribution plate 60 can be fixed to the lower end surface of the connecting cylinder 40, and the gas distribution plate 60 faces the lower electrode 101 located at the bottom surface of the chamber body 10. The leveling structure 70 is connected to one end of the connecting cylinder 40 outside the chamber body 10. The leveling structure 70 is used to adjust the tilt angle of the connecting cylinder 40 relative to the chamber cover plate 20, so as to indirectly adjust the levelness of the gas distribution plate 60 connected to the connecting cylinder 40. The leveling structure 70 can adopt a conventional structure in the art. The lifting drive structure 80 is connected between the bracket 30 and the leveling structure 70 and is used to drive the connecting cylinder 40 and the gas distribution plate 60 to lift through the leveling structure 70, so as to adjust the height of the gas distribution plate 60. In addition, in this embodiment, the leveling structure 70, the connecting cylinder 40, and the gas distribution plate 60 are coaxially arranged with the lifting drive structure 80 to avoid generating additional torque.

[0064] In this embodiment, the lifting drive structure 80 is disposed above the chamber cover plate 20 through the bracket 30 and is connected to the leveling structure 70. Moreover, the overall center of gravity of the leveling structure 70, the connecting cylinder 40, and the gas distribution plate 60 is on the same vertical line as the lifting drive structure 80, which can make the driving force of the lifting drive structure 80 and the gravity of the driven components (the leveling structure 70, the connecting cylinder 40, and the gas distribution plate 60) be basically on the same vertical line, without generating torque, can make the up and down movement of the gas distribution plate 60 smoother, and the parallelism between the gas distribution plate 60 and the lower electrode 101 during the up and down movement of the gas distribution plate 60 is basically not affected, which can improve the uniformity of edge etching.

[0065] As an example of the leveling structure, please refer to Figure 3 and Figure 4 , Figure 4 is along Figure 2Schematic diagram of the upper part of the sectional structure of the B-B line in the figure. The leveling structure 70 may include a tension-bearing joint seat 71, a moving flat plate 72, a horizontal adjustment plate 73, and a gap adjustment member 74. The moving flat plate 72 is connected to the lifting drive structure 80, and the bottom surface of the moving flat plate 72 is fixedly connected to one end of the tension-bearing joint seat. The horizontal adjustment plate 73 is located below the moving flat plate 72, and there is a gap between the horizontal adjustment plate 73 and the moving flat plate 72. The horizontal adjustment plate 73 is connected to the other end of the tension-bearing joint seat in a gimbal-rotatable manner, and the bottom surface of the horizontal adjustment plate 73 is connected to the connecting cylinder 40. That is, when the horizontal adjustment plate 73 is connected to the other end of the tension-bearing joint seat, it can rotate in all directions relative to the tension-bearing joint seat 71. As an example, the horizontal adjustment plate 73 and the other end of the tension-bearing joint seat 71 can be connected by a universal joint.

[0066] The gap adjustment member 74 is connected between the moving flat plate 72 and the horizontal adjustment plate 73 and is used to adjust the gap between the moving flat plate 72 and the horizontal adjustment plate 73.

[0067] The leveling principle of the upper electrode assembly of this embodiment for the gas distribution plate 60 is as follows: When the gap adjustment member 74 adjusts the gap between the horizontal adjustment plate 73 and the moving flat plate 72, since the moving flat plate 72 is fixed, the horizontal adjustment plate 73 will change the inclination angle as the gap size changes, so that the horizontal adjustment plate 73 rotates correspondingly relative to the other end of the tension-bearing joint seat 71. At the same time, since the gas distribution plate 60 is connected to the horizontal adjustment plate 73 through the connecting cylinder 40, adjusting the inclination angle of the horizontal adjustment plate 73 is equal to adjusting the inclination angle of the gas distribution plate 60, that is, the inclination angle of the gas distribution plate 60 can be adjusted through the gap adjustment member 74, and thus the leveling of the gas distribution plate 60 is achieved.

[0068] It should be noted that one or two gap adjustment members 74 can be provided to achieve leveling in a specific direction for the gas distribution plate 60, or three, four, or more than four can be provided. And when at least three are not on the same straight line, three-dimensional angle adjustment can be performed, that is, leveling in all directions for the gas distribution plate 60. Preferably, the distances D of the three gap adjustment members 74 from the axis of the lifting drive structure 80 are equal and are evenly distributed around the axis, which can improve the adjustment efficiency. When more than three gap adjustment members 74 are provided, they can be set at different distances D respectively. The larger the D value, the higher the adjustment accuracy. As an example, the gap adjustment members 74 with the same distance D can be set as an adjustment group, and the adjustment accuracies of the gap adjustment members 74 in different adjustment groups are different. When the inclination degree of the gas distribution plate 60 is relatively large, the gap adjustment members 74 in the adjustment group with low accuracy (smaller D value) and large adjustment amount can be used for rough adjustment first, and then the gap adjustment members 74 in the adjustment group with high accuracy (larger D value) and small adjustment amount can be used for fine adjustment.

[0069] In some embodiments, the gap adjuster 74 can be an adjusting flat head screw, which is threadedly connected to the moving flat plate 72 and abuts against the horizontal adjusting plate 73. By rotating the adjusting flat head screw, the gap between the moving flat plate 72 and the horizontal adjusting plate 73 at the position where the current adjusting flat head screw is located can be adjusted to adjust the inclination angle of the horizontal adjusting plate 73. However, this structure requires manual adjustment and has low efficiency. Preferably, the gap adjuster 74 is a piezoelectric sensor, and the deformation size of the piezoelectric sensor is controlled by controlling the voltage input to the piezoelectric sensor, so as to control the gap size between the moving flat plate 72 and the horizontal adjusting plate 73.

[0070] As an example, the gap adjuster 74 includes at least three non-collinear piezoelectric sensors. The piezoelectric sensors can be arranged on the top surface of the horizontal adjusting plate 73 and are connected to the bottom of the moving flat plate 72. As another example, the piezoelectric sensors are arranged on the bottom surface of the moving flat plate 72 and are connected to the top of the horizontal adjusting plate 73. For example, the gap size can be adjusted by controlling the voltage input to the piezoelectric sensors by the control module. For the case where there are three non-collinear piezoelectric sensors, by changing the voltage of any one or two piezoelectric sensors, the inclination angle of the air distribution plate 60 can be indirectly adjusted; the voltages of the three piezoelectric sensors can also be controlled to increase equally to increase the pre-tightening force between the horizontal adjusting plate 73 and the movable connecting part 712 of the tension-bearing joint seat 71, and prevent the connection between the horizontal adjusting plate 73 and the movable connecting part 712 from loosening during the lifting movement. Preferably, in the above abutting connection or bottom connection, the contact surface of the piezoelectric sensor is a spherical surface or an arc surface to reduce friction. In this embodiment, the voltage magnitude input to the piezoelectric sensors can be controlled by the control module to adjust the gap between the moving flat plate 72 and the horizontal adjusting plate 73. Combining with the real-time calculation and feedback of the gap size, automatic leveling can be achieved, which not only has high efficiency but also can reduce labor costs.

[0071] In an embodiment of the connection between the horizontal adjusting plate 73 and the tension-bearing joint seat 71, please refer to Figure 4 and Figure 5 , Figure 5 is Figure 4Schematic enlarged structure diagram of part C. The tension-bearing joint seat 71 includes a fixed connection part 711 and a movable connection part 712 which are connected to each other. The bottom surface of the movable flat plate 72 is connected to the fixed connection part 711, and the horizontal adjustment plate 73 is connected to the movable connection part 712. The side surface of the movable connection part 712 is a spherical surface. The horizontal adjustment plate 73 is provided with a first through hole 731. The first through hole 731 includes a first part 731A close to the top surface of the horizontal adjustment plate 73 and a second part 731B close to the bottom surface of the horizontal adjustment plate 73. The first part 731A is connected to the second part 731B. The first part 731A is a curved surface that fits the spherical surface on the side of the movable connection part 712. And the diameter of the first part 731A on the top surface of the horizontal adjustment plate 73 is smaller than the diameter of the above spherical surface and larger than the diameter of the fixed connection part 711. The aperture of the second part 731B is larger than the diameter of the spherical surface.

[0072] It can be understood that in this embodiment, the aperture of the second part 731B is larger than the aperture of the first part 731A, and the diameter of the first part 731A on the top surface of the horizontal adjustment plate 73 is larger than the diameter of the fixed connection part 711, which can enable the fixed connection part 711 to penetrate from the bottom surface of the horizontal adjustment plate 73 to the top surface of the horizontal adjustment plate 73; since the diameter of the first part 731A on the top surface of the horizontal adjustment plate 73 is smaller than the diameter of the above spherical surface, that is, the first through hole 731 is a necked-in structure on the top surface of the horizontal adjustment plate 73, it can prevent the spherical surface structure of the movable connection part 712 from disengaging from the first through hole 731; and since the movable connection part 712 is in spherical contact with the horizontal adjustment plate 73 in the first through hole 731, the horizontal adjustment plate 73 can rotate in all directions relative to the movable connection part 712. In this embodiment, the horizontal adjustment plate 73 and the tension-bearing joint seat 71 are not only simple in structure but also easy to assemble.

[0073] For the convenience of assembling the horizontal adjustment plate 73 and the tension-bearing joint seat 71, in one embodiment, please continue to refer to Figure 5 , the tension-bearing joint seat 71 may further include a connecting plate 713. The connecting plate 713 is detachably connected to the end face of the fixed connection part 711 and extends radially along the fixed connection part 711 and protrudes from the fixed connection part 711; the fixed connection part 711 is connected to the bottom surface of the movable flat plate 72 through the connecting plate 713. In this embodiment, the connecting plate 713 is equivalent to a flange of the fixed connection part 711. The tension-bearing joint seat 71 is connected to the bottom surface of the horizontal adjustment plate 73 through the flange, which can facilitate the assembly of the two. Of course, for the need of assembly, the connecting plate 713 is detachably connected to the end face of the fixed connection part 711.

[0074] Further, please continue to refer to Figure 4 and Figure 5, a groove 732 may also be provided on the top surface of the horizontal adjustment plate 73, and the first through hole 731 is provided in the groove 732. The projection of the connecting plate 713 on the horizontal adjustment plate 73 is located within the groove 732, and the depth of the groove 732 is greater than or equal to the sum of the thickness of the connecting plate 713 and the length of the fixed connection portion 711. The groove 732 serves to avoid the connecting plate 713 and the fixed connection portion 711, and also facilitates adjusting the size of the assembly gap between the moving plate 72 and the horizontal adjustment plate 73, and correspondingly adjusting the height of the gap adjustment member 74.

[0075] In one embodiment, please continue to refer to Figure 5 , a first connection hole 721 is further provided on the moving plate 72. The tension-bearing joint seat 71 further includes a second connection hole 714 that longitudinally penetrates the tension-bearing joint seat 71. The second connection hole 714 is coaxially arranged with the first connection hole 721. The lifting drive structure 80 may include a lead screw nut 81 and a lead screw 82. The lead screw nut 81 passes through the first connection hole 721 and is sleeved in the second connection hole 714. One end of the lead screw 82 is connected to the bracket 30, and the other end is connected to the lead screw nut 81. When the motor drives the lead screw 82 to rotate, the lead screw nut 81 drives the entire leveling structure 70, the connecting cylinder 40, and the air distribution plate 60 to move up or down relative to the lead screw 82, realizing the control of the height of the air distribution plate 60 for wafer picking and placing.

[0076] As an example, please continue to refer to Figure 3 , the upper electrode assembly further includes at least two guiding structures 90. The guiding structures 90 are connected between the bracket 30 and the leveling structure 70 and are evenly distributed around the lifting drive structure 80. The guiding structures 90 may include guiding bearings 91 and guiding shafts 92. The guiding bearings 91 are provided on the leveling structure 70. For example, the guiding bearings 91 may be provided on the moving plate 72. One end of the guiding shaft 92 is connected to the bracket 30, and the other end is connected to the guiding bearing 91. For example, a guiding shaft support 93 may be provided on the bracket 30, and the guiding shaft 92 is connected to the bracket 30 through the guiding shaft support 93.

[0077] As an example, please continue to refer to Figure 3 , in the leveling structure 70, the horizontal adjustment plate 73 is provided with a first gas channel 75, the connecting cylinder 40 is provided with a second gas channel 41, and the air distribution plate 60 is provided with a third gas channel 61. The first gas channel 75, the second gas channel 41, and the third gas channel 61 are sequentially connected to form a gas flow path. The air inlet 76 of the gas flow path is provided on the side surface of the horizontal adjustment plate 73, and the air outlet 62 of the gas flow path is provided at a position near the edge of the bottom surface of the air distribution plate 60. In addition, an exhaust port 11 may be provided on the bottom surface of the chamber body 10.

[0078] To improve the sealing performance of the first gas channel 75 and the second gas channel 41, please continue to refer toFigure 3 The upper electrode assembly may further include a second annular seal 77, which is disposed around the outer periphery of the connection between the first gas passage 75 and the second gas passage 41, and can prevent air leakage at this connection.

[0079] As an example, please continue to refer to Figure 2 and Figure 3 The bracket 30 of the process chamber may be a gantry. For example, the bracket 30 may include two support plates 31 supported on the top surface of the chamber cover 20, a cross beam 32 erected on the two support plates 31, and a fixing seat 33 provided on the bottom surface of the cross beam 32. The lifting drive structure 80 is connected to the fixing seat 33. A second through hole 34 is provided on the cross beam 32 opposite to the lifting drive structure 80, and the lifting drive structure 80 can be connected to the drive source through the second through hole 34. For example, the drive source can input driving force to the lead screw 82 of the lifting drive structure 80 through the second through hole 34.

[0080] The embodiment of the present application also provides a semiconductor processing device, which may include the upper electrode assembly described in each of the above embodiments. Among them, a lower electrode for carrying a wafer is provided in the process chamber opposite to the upper electrode assembly. For example, the semiconductor processing device may be an edge etching device.

[0081] The above has introduced in detail an upper electrode assembly and a semiconductor processing device provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. It should be noted that in the present application, the descriptions of each embodiment have their own emphases. For the parts not detailed or recorded in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0082] The technical features of the technical solution of the present application can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not conflict, it should be considered as the scope recorded in the present application.

[0083] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. An upper electrode assembly is applied to a process chamber of a semiconductor processing device, wherein, The process chamber includes a chamber body and a chamber cover plate covering the chamber body, and is characterized in that the upper electrode assembly includes: a bracket disposed on the top surface of the chamber cover plate; a connecting cylinder penetrating through the chamber cover plate and movably connected to the chamber cover plate, the connecting cylinder being movable up and down relative to the chamber cover plate and tiltable in any direction relative to the chamber cover plate; a gas distribution plate disposed inside the chamber body and connected to the connecting cylinder; a leveling structure connected to one end of the connecting cylinder outside the chamber body for adjusting the tilt angle of the connecting cylinder relative to the chamber cover plate; a lifting drive structure connected between the bracket and the leveling structure for driving the connecting cylinder and the gas distribution plate to lift through the leveling structure; wherein, the leveling structure, the connecting cylinder and the gas distribution plate are coaxially arranged with the lifting drive structure.

2. The upper electrode assembly according to claim 1, wherein, The leveling structure includes: a tension joint seat; a moving flat plate connected to the lifting drive structure, and the bottom surface of the moving flat plate is fixedly connected to one end of the tension joint seat; a horizontal adjusting plate located below the moving flat plate and having a gap therebetween, the horizontal adjusting plate being rotatably connected to the other end of the tension joint seat in all directions, and the bottom surface of the horizontal adjusting plate being connected to the connecting cylinder; a gap adjusting member connected between the moving flat plate and the horizontal adjusting plate for adjusting the gap between the moving flat plate and the horizontal adjusting plate.

3. The upper electrode assembly according to claim 2, wherein, The gap adjusting member includes at least three piezoelectric sensors arranged non-collinearly; The piezoelectric sensor is disposed on the top surface of the horizontal adjusting plate and is in bottom contact connection with the moving flat plate, or the piezoelectric sensor is disposed on the bottom surface of the moving flat plate and is in top contact connection with the horizontal adjusting plate.

4. The upper electrode assembly according to claim 2, characterized in that, The tension joint seat includes a fixed connection portion and a movable connection portion connected to each other; The bottom surface of the moving flat plate is connected to the fixed connection portion, and the horizontal adjusting plate is connected to the movable connection portion; The side surface of the movable connection portion is a spherical surface; The horizontal adjusting plate is provided with a first through hole, the first through hole includes a first portion near the top surface of the horizontal adjusting plate and a second portion near the bottom surface of the horizontal adjusting plate, and the first portion is connected to the second portion; The first portion is a curved surface matching the spherical surface, and the diameter of the first portion on the top surface of the horizontal adjusting plate is smaller than the diameter of the spherical surface and larger than the diameter of the fixed connection portion; The aperture of the second portion is larger than the diameter of the spherical surface.

5. The upper electrode assembly according to claim 4, wherein The tension joint seat further includes a connecting plate detachably connected to the end face of the fixed connection portion and extending radially along the fixed connection portion and protruding from the fixed connection portion; The fixed connection portion is connected to the bottom surface of the moving flat plate through the connecting plate.

6. The upper electrode assembly according to any one of claims 2-5, characterized in that, The moving flat plate is provided with a first connection hole; The tension joint seat further includes a second connection hole longitudinally penetrating through the tension joint seat, and the second connection hole is coaxially arranged with the first connection hole; The lifting drive structure includes: A lead screw nut passes through the first connection hole and is sleeved in the second connection hole; A lead screw has one end connected to the bracket and the other end connected to the lead screw nut.

7. The upper electrode assembly according to claim 6, characterized in that, It further includes: At least two guiding structures, which are connected between the bracket and the leveling structure and are evenly distributed around the lifting drive structure; The guiding structure includes: A guiding bearing, which is arranged on the leveling structure; A guiding shaft, with one end connected to the bracket and the other end connected to the guiding bearing.

8. The upper electrode assembly according to claim 6, wherein The horizontal adjustment plate is provided with a first gas passage; The connecting cylinder is provided with a second gas passage; The air distribution disc is provided with a third gas passage; The first gas passage, the second gas passage and the third gas passage are connected in sequence to form a gas flow channel; The air inlet of the gas flow channel is arranged on the side surface of the horizontal adjustment plate, and the air outlet of the gas flow channel is arranged at a position close to the edge of the bottom surface of the air distribution disc.

9. The upper electrode assembly according to claim 8, characterized in that, It further includes: A first annular seal is sleeved on the outer side of the connecting cylinder, and one end is hermetically connected to the chamber cover plate and the other end is hermetically connected to the leveling structure; And / or, a second annular seal is arranged around the outer periphery of the joint of the first gas passage and the second gas passage.

10. The upper electrode assembly according to claim 1, wherein, The bracket includes two support plates supported on the top surface of the chamber cover plate, a cross beam erected on the two support plates, and a fixing seat arranged on the bottom surface of the cross beam; The lifting drive structure is connected to the fixing seat; A second through hole facing the lifting drive structure is arranged on the cross beam, and the lifting drive structure is connected to the drive source through the second through hole.

11. A semiconductor processing device, characterized in that, It includes a process chamber and the upper electrode assembly according to any one of claims 1-10, wherein a lower electrode for carrying a wafer is arranged in the process chamber opposite to the upper electrode assembly.

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