A wafer cutting protection system

Abstract

The present invention relates to a wafer cutting protection system, comprising a dispensing coating device, a glue layer curing device, a cutting device and a glue layer removal device, wherein the glue layer removal device comprises an immersion cleaning device and a rotary spray cleaning device, wherein a cleaning box in the rotary spray cleaning device is provided with an immersion chamber, a first rinsing chamber and a second rinsing chamber, gates are provided between the immersion chamber and the first rinsing chamber and between the first rinsing chamber and the second rinsing chamber, a first spray water pipe is provided at the top of the immersion chamber, a first cleaning liquid spray pipe and a second spray water pipe are provided at the top of the first rinsing chamber, a second cleaning liquid spray pipe and a third spray water pipe are provided at the top of the second rinsing chamber, and a first nitrogen blowing pipe is provided at the top of the second rinsing chamber. The present invention solves the technical problems of low removal efficiency and poor cleaning effect of wafer cutting protection coating.

Description

Technical Field

[0001] The invention relates to a semiconductor processing device, and more particularly to a wafer cutting protection system, belonging to the technical field of semiconductor cutting. Background Art

[0002] Before wafer cutting, the wafer needs to be transferred to the stage of the spin coater, and then an appropriate amount of protective liquid is added to the center of the wafer. Spin coating is started according to the set program. After the coating is evenly applied, the wafer is transferred to the oven for baking to allow the protective liquid to solidify into a film. After cooling to room temperature, the wafer is transferred to the cutter wheel cutting stage for cutting. After cutting, the temporary protective coating on the surface of the wafer needs to be removed before proceeding to subsequent processes such as film expansion, sorting, and flip chip. Cleaning the temporary protective coating on the wafer is a very critical step. After cutting, the cleaning effect of the temporary protective coating on the wafer directly affects the yield of the subsequent process. If the temporary protective coating of the wafer is not completely cleaned, the efficiency of the subsequent process will be greatly reduced.

[0003] However, the current wafer cutting protective coating removal steps are complicated, the cleaning efficiency is low, and the removal effect is not ideal. How to efficiently and thoroughly remove the wafer cutting protective coating has always been a technical problem that has troubled technical personnel in this field.

[0004] Therefore, in the field of semiconductor cleaning equipment technology, there is still a need for research and improvement of wafer cutting protection systems. This is also a research hotspot and focus in the current field of semiconductor cleaning equipment technology, and it is also the starting point for the completion of the present invention. Summary of the invention

[0005] Based on the above defects and the technical problems of video memory, the technical problem to be solved by the present invention is: to provide a wafer cutting protection system to solve the technical problems of low removal efficiency and poor cleaning effect of wafer cutting protection coating.

[0006] In order to solve the above technical problems, the technical solution of the present invention is: to provide a wafer cutting protection system, the wafer cutting protection system includes a dispensing coating device, a glue layer curing device, a cutting device and a glue layer removal device which are arranged in sequence, the glue layer removal device includes an immersion cleaning device and a rotary spray cleaning device which are arranged in sequence, the rotary spray cleaning device includes a bracket, a cleaning box is fixedly installed on the bracket, the top of the cleaning box is covered with a cover plate, the bottom of the cleaning box is provided with a lifting column which is driven by a first power mechanism and vertically lifted, the lifting column is connected to a second power mechanism which drives the lifting column to rotate around a rotation center, the lifting column passes through the bottom surface of the cleaning box and extends into the cleaning box, a rotating disk is fixedly installed on the top of the lifting column, the lifting column has a central through hole, a plurality of suction cups are provided on the upper surface of the rotating disk, all suction cups are connected to the central through hole, and the bottom end of the lifting column is connected to a vacuum pump through a rotary joint; the cleaning box is rotated from bottom to top according to the rotation of the lifting column. A soaking chamber, a first flushing chamber and a second flushing chamber are provided. The soaking chamber is filled with soaking liquid. An ultrasonic generator is provided in the soaking chamber. Gates are provided between the soaking chamber and the first flushing chamber and between the first flushing chamber and the second flushing chamber. A first spray water pipe is provided on the top of the soaking chamber, a first drain pipe is provided on the bottom of the soaking chamber, a first cleaning liquid spray pipe and a second spray water pipe are provided on the top of the first flushing chamber, the second spray water pipe is located above the first cleaning liquid spray pipe, a second drain pipe is provided on the bottom of the first flushing chamber, a second cleaning liquid spray pipe and a third spray water pipe are provided on the top of the second flushing chamber, the third spray water pipe is located above the second cleaning liquid spray pipe, a third drain pipe is provided on the bottom of the second flushing chamber, a first nitrogen blowing pipe is provided on the top of the second flushing chamber above the third spray water pipe, the first cleaning liquid spray pipe is connected to the first cleaning liquid storage tank, and the second cleaning liquid spray pipe is connected to the second cleaning liquid storage tank.

[0007] Among them, the dispensing coating equipment is preferably a spin coater, the glue layer curing equipment is preferably a baking oven, and the cutting equipment is preferably a wafer cutting machine. These equipments are mature products and can be purchased and used directly, and will not be described in detail here.

[0008] The cleaning box is usually made of corrosion-resistant materials, such as polytetrafluoroethylene or stainless steel.

[0009] Among them, as a preferred technical solution, the lifting column is connected to a second power mechanism that drives the lifting column to rotate around the rotation center. Specifically, the lifting column is installed on the lifting base for vertical rotation and penetrates the lifting base. The lifting base slides vertically through a guide rail. A first power mechanism is provided below the lifting base. The first power mechanism is usually a hydraulic cylinder. The cylinder body of the hydraulic cylinder is fixed. The piston rod of the hydraulic cylinder is connected to the lifting base. The lifting base drives the lifting column to rise and fall synchronously. The rotation of the lifting column is driven by the second power mechanism. The second power mechanism includes a rotary motor fixedly installed on the lifting base. A driving gear is fixedly installed on the power output shaft of the rotary motor. A driven gear is fixedly installed on the lifting column. The driven gear is coaxially arranged with the lifting column. The driving gear meshes with the driven gear. The rotation of the rotary motor drives the rotation of the lifting column, and the rotation and lifting of the lifting column do not interfere with each other.

[0010] With such a structural arrangement, rotation and lifting can be performed simultaneously, thereby saving working hours and improving cleaning efficiency.

[0011] Among them, as a preferred technical solution, the turntable is provided with a plurality of air flow channels respectively connecting the suction cups and the central through hole, and all the suction cups are connected to the central through hole through the corresponding air flow channels.

[0012] With such a structural setting, when the wafer needs to be cleaned, the wafer surface is placed in contact with the suction cup, and the vacuum pump is started. The suction cup can then absorb the wafer and fix the wafer on the turntable.

[0013] Among them, by using the ultrasonic generator, ultrasonic waves can be generated when the wafer is immersed, so as to thoroughly clean the attachments on the surface of the wafer.

[0014] The first nitrogen blowing pipe can be connected to a positive pressure nitrogen source, usually hot nitrogen.

[0015] Through the above-mentioned structural setting, the immersion, two-time rinsing and drying operations of the wafer of the present invention can be completed in a closed cleaning box, without having to be transferred in the exposed air, which not only effectively protects the fine structure on the front side of the wafer, prevents foreign matter from falling on the front side of the wafer and contaminating the wafer, but also improves the cleaning effect of the temporary protective coating of the wafer and improves the cleaning efficiency. In addition, the immersion liquid, the first cleaning liquid and the second cleaning liquid are collected separately to avoid cross contamination.

[0016] Further preferably, the first cleaning liquid storage tank and the second cleaning liquid storage tank are both provided with heating coils, so that the first cleaning liquid and the second cleaning liquid can meet the required flushing temperature; further, the first cleaning liquid storage tank and the second cleaning liquid storage tank are both provided with stirring blades driven by a stirring motor, so that the temperature of the cleaning liquid in the tank is uniform to achieve the best flushing effect.

[0017] With such a structural setting, since the immersion chamber is set at the bottom of the rotary spray cleaning device, when the wafer moves to the rotary spray cleaning device, it is detected by the amplification detection device. If it is detected that the coating on the surface of the wafer has not been removed, it is not necessary to reuse the immersion cleaning device, but directly use the immersion chamber for further immersion, thereby improving the cleaning efficiency of the wafer coating. If it is detected that the wafer coating is removed, it is not necessary to continue immersing in the immersion chamber, and the first cleaning liquid spraying and flushing are directly performed, further improving the cleaning efficiency of the wafer coating. In the wafer cutting protection system of the present invention, as an improvement, the immersion and cleaning device includes a steel structure frame, a immersion box and a spray box are arranged in the steel structure frame, a walking frame driven by a walking power mechanism is provided on the steel structure frame, a lifting basket driven by a winch power mechanism is installed on the walking frame, the lifting basket corresponds to the position of the immersion box and the spray box, a plurality of clamping plates parallel to each other and arranged at intervals are fixedly installed in the lifting basket, each clamping plate is provided with a plurality of claws for clamping the wafer, and the axis of the clamping plate is arranged perpendicular to the walking direction of the walking frame; a fourth spray water pipe is provided in the spray box, and the spraying direction of the fourth spray water pipe is consistent with the surface direction of the wafer.

[0018] Wherein, the soaking box contains soaking liquid.

[0019] The steel structure frame is usually provided with a track, and the walking power mechanism includes an active roller driven by a walking motor and rollingly mounted on the track. Of course, according to the size of the walking frame and actual needs, multiple driven rollers can also be provided, which will not be repeated here.

[0020] Among them, a plurality of flow gaps are arranged around the lifting basket to facilitate the medicine liquid to enter or flow out of the lifting basket. Those skilled in the art can refer to the existing technology for the structure of the lifting basket.

[0021] Among them, by making the axis of the clamping plate perpendicular to the traveling direction of the walking frame, that is, the surface of the wafer is parallel to the traveling direction of the walking frame, so that the resistance of the wafer is small when it moves laterally in the chemical solution, and all wafers correspondingly installed on the clamping plate can be rinsed with the chemical solution, the clamping claws clamp the wafers and fix them on the clamping plate, and multiple wafers can be placed in the lifting basket at the same time and soaked at the same time, and the wafers are fixed on the clamping plate at intervals. The surface area of ​​the wafer exposed to the chemical solution is large, and it swings back and forth in the immersion box with the lifting and lowering of the lifting basket and the horizontal movement of the walking frame, so that the surface of the wafer is fully soaked, the effect of the chemical solution is fully exerted, and the surface of the wafer is rinsed with the reciprocating horizontal movement of the lifting basket.

[0022] Furthermore, a nitrogen aeration tube is provided in the immersion box at the bottom of the immersion box. The aeration tube is a common component, including a microporous aeration tube, a nano aeration tube, etc. Those skilled in the art can purchase and use them as needed, and will not be described in detail here. The nitrogen aeration tube can generate nitrogen bubbles in the liquid medicine, stirring the liquid medicine, so that the liquid medicine can fully play a role in the protective layer on the surface of the wafer, achieving a better immersion effect.

[0023] Wherein, the fourth spray water pipe is connected to the pure water storage tank.

[0024] Among them, by making the spraying direction of the fourth spray water pipe consistent with the surface direction of the wafer, the front and back sides of the wafer can be rinsed with pure water from the side of the vertically placed wafer to remove the residual liquid on the surface of the wafer. The fourth spray water pipe is close to the inner wall of the immersion box to avoid mutual interference with the lifting basket. In the wafer cutting protection system of the present invention, as an improvement, the hoisting power mechanism includes a first rotating shaft and a second rotating shaft rotatably mounted on the walking frame, the first rotating shaft and the second rotating shaft are arranged in parallel and spaced apart, the first rotating shaft is connected to the lifting motor, the lifting motor is fixedly mounted on the walking frame, the first rotating shaft is fixedly mounted with a first double-groove rope pulley and a second double-groove rope pulley, the second rotating shaft is fixedly mounted with a first rope pulley and a second rope pulley, the first rope pulley corresponds to one of the first double-groove rope pulleys, the second rope pulley corresponds to one of the second double-groove rope pulleys, the first double-groove rope pulley, the second double-groove rope pulley, the first rope pulley and the second rope pulley Corresponding to the four corners of the lifting basket respectively, a first steel wire rope is wound around one pulley of the first double-groove rope pulley, and the other end of the first steel wire rope is fixed to the corresponding corner position of the lifting basket, a second steel wire rope is wound around the other pulley of the first double-groove rope pulley, and the second steel wire rope is fixed to the corresponding corner position of the lifting basket after passing through the first pulley, a third steel wire rope is wound around one pulley of the second double-groove rope pulley, and the other end of the third steel wire rope is fixed to the corresponding corner position of the lifting basket, a fourth steel wire rope is wound around the other pulley of the second double-groove rope pulley, and the fourth steel wire rope is fixed to the corresponding corner position of the lifting basket after passing through the second pulley.

[0025] Through such a structural setting, one lifting motor can be used to drive four steel ropes at the same time, ensuring the synchronization of the four steel ropes, thereby making the lifting basket lift more stable.

[0026] In the wafer cutting protection system of the present invention, as an improvement, a second nitrogen blowing pipe is provided in the spray box at the top of the spray box, the second nitrogen blowing pipe is close to the inner wall of the spray box, and the second nitrogen blowing pipe is provided with a plurality of nozzles facing the back side of the wafer.

[0027] Among them, the second nitrogen blowing pipe is connected to a positive pressure nitrogen gas source, usually using hot nitrogen, which can dry the pure water on the back of all wafers clamped on the clamping plate one by one as they are continuously taken out, so as to prevent residual moisture on the back of the wafer from entering the downstream suction cup.

[0028] Furthermore, in order to improve the spraying effect, two groups of fourth spray water pipes staggered in upper and lower positions can be arranged in the immersion box, and the two groups of fourth spray water pipes are respectively located on two opposite inner walls of the immersion box. The two groups of fourth spray water pipes arranged oppositely can thoroughly rinse the residual liquid on the surface of the wafer after immersion. In the wafer cutting protection system of the present invention, as an improvement, the annular array on the clamping disk has a plurality of waist-shaped grooves, the clamping claw passes through the waist-shaped groove and is slidably installed in the waist-shaped groove, the end of the clamping claw located on the front of the clamping disk is provided with a clamping part, and the end of the clamping claw located on the back of the clamping disk is provided with a tensioning part, all tensioning parts are connected together by an elastic element, and the clamping claw includes a first half body and a second half body connected together by a fastener, and the first half body and the second half body are both T-shaped structures, the clamping part is located on the first half body, and the tensioning part is located on the second half body.

[0029] Wherein, the extension direction of each waist-shaped groove is along the radial direction of the circle where it is located, so as to play a guiding role.

[0030] Among them, the elastic element is usually an annular tension spring, or a corrosion-resistant rubber elastic strip is used. The elastic element such as the tension spring surrounds all the tensioning parts in sequence. The wafer is clamped and fixed on the clamping plate by the clamping claws under the action of the elastic element such as the tension spring. Through such a structural setting, the use of wafers of various diameter specifications can be met.

[0031] Wherein, the first half body and the second half body are both T-shaped structures, that is, a structure with one large end and one small end.

[0032] The clamping portion is located on the first half body, that is, on the large end of the first half body; the tensioning portion is located on the second half body, that is, on the large end of the second half body.

[0033] As a preferred technical solution, the large end of the first half body abuts against the front side of the clamping disk, and the large end of the second half body abuts against the back side of the clamping disk. Through such a structural setting, a limiting effect is achieved.

[0034] Among them, the small ends of the first half body and the second half body both slide in the waist-shaped groove and can be connected together by fasteners such as screws, so as to divide the clamping jaw into the first half body and the second half body. It is not only convenient to manufacture, but also after installation, the clamping jaw can only slide along the waist-shaped groove and cannot fall out, and has high stability.

[0035] There is a flow gap between the clamping portion and the clamping plate, that is, after the wafer is clamped by the clamping claws, a flow gap is left between the back side of the wafer and the clamping plate, so that the back side of the wafer can also be immersed in the chemical solution.

[0036] Furthermore, in order to prevent the wafer from escaping from the clamping part during the movement of the lifting basket, an anti-escaping limit block is provided on the end face of the clamping part on the first half body. The anti-escaping limit block is usually installed on the first half body using fasteners to prevent the wafer from escaping from the clamping part.

[0037] Through the above-mentioned structural setting, when in use, appropriate amounts of soaking liquid are respectively contained in the soaking box, the wafer to be processed is placed in the clamping part of the clamping claw, and the wafer is fixed on the clamping plate by the force of an elastic element such as a tension spring. One wafer is placed on each clamping plate, and the lifting motor is started, and the lifting basket is placed in the soaking box. The nitrogen aeration pipe starts aeration to generate nitrogen bubbles to stir the soaking liquid, and the walking motor is started to drive the lifting basket to move back and forth in the soaking box. The soaking can be completed in about fifteen minutes, which is better than the traditional soaking effect of thirty minutes. After the soaking is completed, the lifting motor is started, the lifting basket is pulled out of the soaking liquid, the walking motor is started, and the lifting basket is moved into the spray box. The fourth spray water pipe starts to spray pure water on the wafer in the lifting basket to flush the soaking liquid on the surface of the wafer, and then the second nitrogen blowing pipe starts to spray hot nitrogen gas flow on the back of the outermost wafer, and the hot nitrogen gas flow dries the back of the wafer to facilitate entering the next process.

[0038] In the wafer cutting protection system of the present invention, as an improvement, the gate includes a gate plate fixed on the cleaning box, a mounting groove is provided on the gate plate, the width of the mounting groove at the center position is greater than the diameter of the turntable, a split telescopic joint is provided in the mounting groove, and a sealing strip is provided between the periphery of the telescopic joint and the gate plate.

[0039] The shape of the mounting groove is adapted to the shape of the telescopic joint, for example, it can be generally stepped. In the wafer cutting protection system of the present invention, as an improvement, the gate has a protruding portion protruding upward, and the mounting groove is opened in the protruding portion.

[0040] The gate has an upwardly protruding portion, so that a recessed portion is formed between the gate and the cleaning box, so as to facilitate the installation of a drain valve to discharge the liquid. When the cleaning liquid is sprayed, the cleaning liquid is thrown to the inner wall of the cleaning box by the rotating disk and flows into the recessed portion along the inner wall, thereby effectively avoiding cross contamination of the cleaning liquid.

[0041] Among them, by providing the installation groove on the protruding part, the position of the expansion joint can be made higher than the recessed part, thereby preventing liquid from leaking into the cavity below.

[0042] In the wafer cutting protection system of the present invention, as an improvement, the innermost end of the telescopic joint is provided with an arc-shaped groove adapted to the lifting column.

[0043] With such a structural setting, when the two opposite telescopic joints are opened, the rotary disc can enter the upper cavity through the gap between the telescopic joints. When the two opposite telescopic joints are closed, the arc-shaped groove fits with the lifting column to form a seal, preventing the cleaning liquid in the cavity from leaking to the lower cavity, thereby effectively avoiding cross contamination of the cleaning liquid.

[0044] More preferably, the telescopic joint includes a first section body fixedly mounted on the gate plate, a second section body slidably mounted on the first section body, a third section body slidably mounted on the second section body, an outer end of the third section body is provided with an arc-shaped groove adapted to the lifting column, the first section body is connected to the second section body, a plunger slidably mounted on the end of the third section body is fixedly mounted on the second section body, a third center tube is provided in the third section body, an oil through port is provided at the end of the third center tube away from the plunger, the other end of the third center tube passes through the plunger and extends into the second section body, the second center tube is sleeved in the third center tube, the second center tube is adapted to the second section body, the first center tube is sleeved in the second center tube, the first center tube is adapted to the first section body, a first working oil port connected to the oil through port is provided at the end of the first section body, the second working oil port is connected to the A oil port of the reversing valve, the first working oil port is connected to the B oil port of the reversing valve, the P oil port of the reversing valve is connected to the oil inlet pipeline, and the T oil port of the reversing valve is connected to the oil return pipeline.

[0045] With such a structural setting, when the first working oil port is filled with oil, the second working oil port returns oil, the third section retracts to the second section, driving the second section to retract to the first section, and the gate is opened. When the second working oil port is filled with oil, the hydraulic oil pushes the third section and the second section out, closing the gate, and the arc-shaped groove blocks the lifting column, realizing the bottom sealing of the cavity.

[0046] Preferably, the first section, the second section and the third section are hollow structures with square cross-sections, which are assembled together in sequence, and a sealing strip is provided between two adjacent sections to prevent leakage of hydraulic oil.

[0047] Further preferably, in order to improve the smoothness and accuracy of the sliding trajectory of the telescopic joint, a third guide cylinder is provided in the third section, the third guide cylinder is parallel to the third center cylinder, one end of the third guide cylinder is fixed to the end of the third section away from the plunger, the other end of the third guide cylinder passes through the plunger and extends into the second section, the second guide cylinder is sleeved in the third guide cylinder, the second guide cylinder is adapted to the second section, the first guide cylinder is sleeved in the second guide cylinder, the first guide cylinder is adapted to the first section, and the end of the first guide cylinder is fixed to the end of the first section. The first guide cylinder, the second guide cylinder and the third guide cylinder sleeved together play a good guiding role, avoiding the tilting and jamming of the telescopic joint during the extension or retraction process, and making the telescopic joint extend and retract more smoothly.

[0048] In the wafer cutting protection system of the present invention, as an improvement, the first spray water pipe, the first cleaning liquid spray pipe, the second spray water pipe, the second cleaning liquid spray pipe, the third spray water pipe and the first nitrogen blowing pipe all extend into the cleaning box and the protruding ends are hingedly installed with a swing cylinder.

[0049] Among them, the cylinder body of the swing cylinder is hingedly installed on the cleaning box body, the piston rod of the swing cylinder is hingedly installed on the corresponding first spray water pipe, the first cleaning liquid spray pipe, the second spray water pipe, the second cleaning liquid spray pipe or the third spray water pipe, the first spray water pipe, the first cleaning liquid spray pipe, the second spray water pipe, the second cleaning liquid spray pipe, the third spray water pipe and the first nitrogen blowing pipe are all installed on the cleaning box body through self-aligning bearings.

[0050] With such a structural arrangement, the corresponding first spray water pipe, first cleaning liquid spray pipe, second spray water pipe, second cleaning liquid spray pipe and third spray water pipe can be swung by the push of the swing cylinder.

[0051] Among them, sealing elements are provided between the first spray water pipe, the first cleaning liquid spray pipe, the second spray water pipe, the second cleaning liquid spray pipe, the third spray water pipe and the first nitrogen blowing pipe and the inner wall of the cleaning box.

[0052] The sealing element is usually a rubber sealing sleeve, so as to seal the gaps between the corresponding first spray water pipe, the first cleaning liquid spray pipe, the second spray water pipe, the second cleaning liquid spray pipe, the third spray water pipe and the first nitrogen spray pipe and the cleaning box. This sealing sleeve is a common component, usually a corrugated sealing sleeve, and those skilled in the art can choose to use it according to their needs, and will not be described in detail here.

[0053] Through such a structural setting, the first spray water pipe, the first cleaning liquid spray pipe, the second spray water pipe, the second cleaning liquid spray pipe, the third spray water pipe and the first nitrogen blowing pipe can be operated while swinging in the cleaning box under the action of the swing cylinder, and when the wafer surface is sprayed or dried in all directions, they are swung to the position above the turntable under the action of the swing cylinder. When the spraying or drying is completed, the turntable needs to move up under the action of the lifting column, and it swings under the action of the swing cylinder to deviate from the upward movement trajectory of the turntable to avoid interference with the turntable.

[0054] In the wafer cutting protection system of the present invention, as an improvement, a rotating tube driven by a servo motor is rotatably installed on the cleaning box, and the rotating tube extends into the cleaning box along the radial direction of the turntable, and a slide driven by a first cylinder is axially slidably installed in the rotating tube, and a diamond-shaped four-bar mechanism is installed on the side of the slide away from the first cylinder, and the four-bar mechanism includes a first link, a second link, a third link and a fourth link hinged in sequence, and the hinge points of the first link and the fourth link are hinged on the slide, and a second cylinder is installed on the slide, and the hinge points of the second link and the third link are connected to the piston rod of the second cylinder, and the second link and the third link are both provided with an extension extending from the hinge point, and the ends of the extensions are provided with a clamping portion.

[0055] Wherein, the servo motor can be connected to the rotating tube through a gear pair, and the rotating tube can be usually arranged at the top position of the second flushing chamber.

[0056] Wherein, the cylinder body of the second cylinder is fixedly mounted on the slide seat, and the second cylinder and the first cylinder are located on the same side of the slide seat.

[0057] Wherein, the clamping range of the clamping part is adapted to the thickness of the wafer.

[0058] Through such a structural setting, the structure can not only realize automatic clamping and flipping of the wafer, but also, under the action of the first cylinder, the clamping part can avoid the lifting trajectory of the turntable, avoiding interference with the lifting of the turntable, replacing manual flipping of the wafer, and further improving the production efficiency of the wafer. In the wafer cutting protection system of the present invention, as an improvement, a limit element is provided on the rotary tube to limit the maximum stroke of the first cylinder.

[0059] Among them, the limiting element can usually choose to use a limiting screw, which is threaded on the rotating tube. The distance from the initial state of the first cylinder to the limiting screw is smaller than the stroke of the first cylinder. The limiting screw limits the maximum position of the extension of the piston rod of the first cylinder. When the second cylinder pushes the four-bar linkage at this position, the force of the second cylinder 4 acts on the limiting screw instead of the piston of the first cylinder, thereby protecting the piston of the first cylinder and extending the service life of the first cylinder.

[0060] In the wafer cutting protection system of the present invention, as an improvement, the four-bar linkage is provided with a compression spring arranged along the radial direction of the rotary tube.

[0061] By setting the compression spring, its force can act on the four-bar linkage in time, so that the clamping part is opened more quickly, and the wafer is effectively prevented from being subjected to the radial force of the clamping part.

[0062] The specific operating principle and process flow of the wafer cutting protection system of the present invention are as follows: during operation, after the wafer is soaked in the soaking liquid, rinsed with pure water and the back of the wafer is dried, the operator opens the cover plate, fills an appropriate amount of soaking liquid in the soaking chamber, and the hydraulic cylinder pushes the lifting column to move up, places the wafer to be processed on the suction cup, starts the vacuum pump, and fixes the wafer on the turntable. Under the action of the hydraulic cylinder, the lifting column moves down, blocks the cover plate, blocks the cleaning box, and the turntable drives the wafer to sink into the soaking liquid in the soaking chamber for soaking. After the soaking is completed, the lifting column drives the turntable to start moving up to the position below the first spray water pipe, and the swing cylinder swings the first spray water pipe to the center of the turntable, and swings back and forth at a certain swing amplitude. At this time, the first spray water pipe The pipe starts to spray pure water, rinses and removes the soaking liquid residue, then the lifting column moves up, and the wafer is transferred to the first rinse chamber. The telescopic joint at the bottom of the first rinse chamber is closed, and then the rotary motor is started to drive the wafer to rotate. At this time, the swing cylinder moves the first cleaning liquid spray pipe to the top of the wafer, sprays and rinses the wafer surface, opens the second drain pipe, and the first cleaning liquid after rinsing flows out through the second drain pipe for collection. After the first cleaning liquid is rinsed, there is no need to turn off the rotary motor, swing the first cleaning liquid spray pipe out of the center position, swing the second spray water pipe to the center position, spray pure water on the wafer surface, rinse and remove the first cleaning liquid residue, and at the same time, discharge the first cleaning liquid remaining in the first rinse chamber through the second drain pipe. The hydraulic cylinder drives the wafer to move up to the second rinse chamber and closes. The telescopic joint at the bottom of the second rinsing chamber, the second cleaning liquid spray pipe swings to the center position, and the second cleaning liquid is sprayed on the surface of the wafer. At this time, the third drain pipe is opened, and the cleaning liquid is discharged and collected through the third drain pipe. After rinsing, the third spray water pipe sprays pure water on the surface of the wafer to rinse and remove the residue of the second cleaning liquid. After rinsing, the rotary motor drives the wafer to continue to rotate, and shakes off the residual water droplets on the front of the wafer. If the back of the wafer does not need to be cleaned, the first nitrogen spray pipe sprays nitrogen on the surface of the wafer for drying. After drying, the wafer can be taken out. If the back of some wafer products also needs to be cleaned, and the front of the wafer product allows suction cup adsorption, the rotary motor stops, the first cylinder moves, and pushes the slide to move toward the turntable. After the clamp moves to the wafer position, the second cylinder moves The four-bar linkage is deformed, and the two opposite clamps merge to clamp the upper and lower surfaces of the wafer. The vacuum pump stops pumping air, the suction cup releases the wafer, the lifting column moves down a certain distance, the servo motor starts, the rotary tube drives the wafer to flip 180 degrees, the lifting column rises, the vacuum pump starts to pump air, the suction cup adsorbs the wafer, the second cylinder pulls the four-bar linkage to deform, the clamp opens, and then the first cylinder pulls back the slide, the lifting column moves down, the rotary motor starts, and the previous actions are repeated to continue spraying the first cleaning liquid and the second cleaning liquid on the other side of the wafer. After the spraying and rinsing is completed, the first nitrogen spray pipe sprays nitrogen to dry the wafer surface, the third spray water pipe deviates from the center position, the rotary motor stops, the cover is opened, and the hydraulic cylinder drives the wafer to move up.When the vacuum pump stops pumping, the operator can take out the processed wafer, put in another wafer to be cleaned, and continue cleaning.

[0063] In order to reduce the operator's labor intensity and improve the degree of automation, a control unit such as a programmable controller or a microcomputer is usually used for control, and a temperature sensor is set at the corresponding position to make the action instructions and temperature control more accurate and timely control the relevant actuators. Those skilled in the art can implement it according to the actual situation, and will not be repeated here. In addition, the pressure or flow rate of the separate cleaning liquid spray pipe and nitrogen blowing pipe can be controlled to meet the use of wafers of different specifications.

[0064] As described above, the present invention provides a wafer cutting protection system, which achieves many excellent technical effects through a unique structural design, including but not limited to:

[0065] After adopting the above technical solution, the beneficial effects of the present invention are:

[0066] (1) In the embodiment of the present invention, the immersion, double rinsing and drying operations of the wafer are all completed in a closed cleaning box, and there is no need to transfer the wafer in the exposed air, which effectively protects the protective coating of the wafer. Not only the cleaning effect of the wafer protective coating is improved, but also the cleaning efficiency is improved. In addition, the immersion solution, the first cleaning solution and the second cleaning solution are collected separately, thereby avoiding cross contamination.

[0067] (2) In the embodiment of the present invention, the first spray water pipe, the first cleaning liquid spray pipe, the second spray water pipe, the second cleaning liquid spray pipe, the third spray water pipe and the first nitrogen blowing pipe all penetrate the cleaning box and are hingedly mounted with a swing cylinder at the protruding ends, thereby achieving swing-while-operating operation. Not only can the center position of the wafer be sprayed or dried accurately, but the center position can also be moved away in time, thereby avoiding interference with the lifting and lowering of the turntable.

[0068] (3) The gate plate of the embodiment of the present invention has an upwardly protruding portion, so that a recessed portion is formed between the gate plate and the cleaning box body. The mounting groove is provided in the protruding portion, so that the position of the telescopic joint is higher than the recessed portion, so as to facilitate the installation of the drain valve to discharge the liquid. In particular, when the cleaning liquid is sprayed, the cleaning liquid is thrown to the inner wall of the cleaning box by the rotating disk and flows into the recessed portion along the inner wall, thereby preventing the liquid from leaking into the cavity below, and effectively preventing cross contamination of the cleaning liquid.

[0069] (4) The soaking liquid, the first cleaning liquid and the second cleaning liquid of the present invention can be recovered separately and recycled, thus saving the use cost.

[0070] (5) Since an immersion chamber is provided at the bottom layer of the rotary spray cleaning device, when the wafer is moved to the rotary spray cleaning device, if it is detected that the coating on the surface of the wafer has not been removed, there is no need to reuse the immersion cleaning device, but the immersion chamber can be directly used for further immersion, thereby improving the cleaning efficiency of the wafer coating. If it is detected that the wafer coating has been removed, there is no need to continue immersing in the immersion chamber, but the first cleaning liquid can be directly sprayed and rinsed, thereby further improving the cleaning efficiency of the wafer coating.

[0071] (6) Since a rotating tube is provided on the cleaning box, a diamond-shaped four-bar linkage is provided inside the rotating tube, and a clamping part is provided on the four-bar linkage, not only can the automatic clamping and flipping of the wafer be realized, but also under the action of the first cylinder, the clamping part can also avoid the lifting and lowering trajectory of the turntable, thereby avoiding interference with the lifting and lowering of the turntable, replacing manual flipping of the wafer, and further improving the wafer production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0073] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0074] Figure 1 is a structural schematic diagram of a rotary spray cleaning device in an embodiment of the present invention;

[0075] Figure 2 is a schematic structural diagram of a rotary disk in an embodiment of the present invention;

[0076] Figure 3 is a schematic diagram of the structure of the gate in an embodiment of the present invention;

[0077] Figure 4 yes Figure 3 A schematic diagram of a top view structure;

[0078] Figure 5 is a schematic structural diagram of an expansion joint in an embodiment of the present invention;

[0079] Figure 6This is a schematic diagram of a use state of the first cleaning liquid spray pipe in an embodiment of the present invention;

[0080] Figure 7 Schematic diagram of the installation structure of the rotary tube in the embodiment of the present invention;

[0081] Figure 8 is a schematic diagram of a clamping state of a clamping portion in an embodiment of the present invention;

[0082] Fig. 9 is a schematic diagram of the clamping part in the open state in an embodiment of the present invention;

[0083] Fig.10 Schematic diagram of the spraying state of the second cleaning liquid in an embodiment of the present invention;

[0084] Fig.11 is a schematic structural diagram of a soaking and cleaning device in an embodiment of the present invention;

[0085] Fig.12 yes Fig.11 Schematic diagram of the left view structure;

[0086] Fig.13 is a schematic structural diagram of a clamping disk in an embodiment of the present invention;

[0087] Fig.14 yes Fig.13 Schematic diagram of the left view structure;

[0088] Fig.15 yes Fig.13 A right view structural diagram of ;

[0089] Fig.16 yes Fig.13 A is a schematic diagram of the partially enlarged structure of the middle part;

[0090] Fig.17 yes Fig.16 A schematic diagram of a top view structure;

[0091] Fig.18 is a schematic diagram of the connection relationship of the clamping jaws in an embodiment of the present invention;

[0092] Among them, Figures 1 to 18 In the drawings, each numerical label refers to the following specific meanings, elements and / or components respectively.

[0093] In the figure: 1, bracket, 2, cleaning box, 201, soaking chamber, 202, first flushing chamber, 203, second flushing chamber, 204, ultrasonic generator, 3, cover plate, 4, lifting column, 401, center through hole, 5, lifting base, 6, turntable, 601, air flow channel, 7, suction cup, 8, hydraulic cylinder, 9, driving gear, 10, driven gear, 11, rotary motor, 12, rotary joint, 13, first spray water pipe, 14, first cleaning liquid spray pipe, 15, second spray water pipe, 16, second cleaning liquid spray pipe, 17, The third spray water pipe, 18, gate, 1801, gate, 1802, expansion joint, 1803, sealing strip, 1804, arc groove, 1805, first section, 1806, second section, 1807, third section, 1808, third center tube, 1809, second center tube, 1810, first center tube, 1811, plunger, 1812, third guide tube, 1813, second guide tube, 1814, first guide tube, 1815, first working oil port, 1816, second working oil port, 1817, protrusion , 1818, recessed portion, 19, first liquid discharge pipe, 20, second liquid discharge pipe, 21, third liquid discharge pipe, 22, self-aligning bearing, 23, sealing element, 24, swing cylinder, 25, first cleaning liquid storage tank, 26, second cleaning liquid storage tank, 27, heating coil, 28, stirring motor, 29, stirring blade, 30, rotary tube, 31, servo motor, 32, slide seat, 33, first cylinder, 34, second cylinder, 35, first connecting rod, 36, second connecting rod, 37, third connecting rod, 38, fourth connecting rod, 39, clamping portion, 40 , limit screws, 41, steel structure frame, 42, walking frame, 43, walking power mechanism, 44, winch power mechanism, 45, lifting basket, 46, clamping plate, 4601, waist-shaped groove, 47, clamping claws, 4701, first half body, 4702, second half body, 4703, clamping part, 4704, tensioning part, 48, immersion box, 49, nitrogen aeration pipe, 50, fourth spray water pipe, 51, tension spring, 52, anti-drop limit block, 53, first nitrogen blowing pipe, 54, spray box, 55, second nitrogen blowing pipe. DETAILED DESCRIPTION

[0094] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0095] The terms such as "front", "back", "left", "right", "inside", "outside", "middle", etc. cited in this specification are only for the convenience of description and are not intended to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships should be regarded as within the scope of implementation of the present invention without substantially changing the technical content.

[0096] A wafer cutting protection system includes a glue coating device, a glue layer curing device, a cutting device and a glue layer removal device arranged in sequence, wherein the glue coating device is preferably a spin coater, the glue layer curing device is preferably a baking oven, and the cutting device is preferably a wafer cutting machine. These devices are mature products and can be purchased and used directly, and will not be described in detail here. The glue layer removal device includes an immersion cleaning device and a rotary spray cleaning device arranged in sequence, such as Figure 1 As shown, the rotary spray cleaning device includes a bracket 1, on which a cleaning box 2 is fixedly mounted, the cleaning box 2 is usually made of corrosion-resistant materials such as polytetrafluoroethylene or stainless steel, the top of the cleaning box 2 is covered with a cover plate 3, and the bottom of the cleaning box 2 is provided with a lifting column 4 driven by a first power mechanism and vertically lifted, the lifting column 4 is connected to a second power mechanism that drives the lifting column 4 to rotate around a rotation center, specifically, the lifting column 4 is vertically rotatably mounted on a lifting base 5 and penetrates the lifting base 5, the lifting base 5 slides vertically through a guide rail, and a first power mechanism is provided below the lifting base 5, the first power mechanism is usually a hydraulic cylinder 8, the cylinder body of the hydraulic cylinder 8 is fixed, the piston rod of the hydraulic cylinder 8 is connected to the lifting base 5, and the lifting base 5 drives the lifting column 4 to rise and fall synchronously. The rotation of the lifting column 4 is driven by a second power mechanism, which includes a rotary motor 11 fixedly mounted on the lifting base 5, a driving gear 9 fixedly mounted on the power output shaft of the rotary motor 11, and a driven gear 10 fixedly mounted on the lifting column 4. The driven gear 10 is coaxially arranged with the lifting column 4, and the driving gear 9 meshes with the driven gear 10. The rotation of the rotary motor 11 drives the rotation of the lifting column 4, and the rotation and lifting of the lifting column 4 do not interfere with each other and can be performed simultaneously, which saves man-hours and improves cleaning efficiency. The lifting column 4 penetrates the bottom surface of the cleaning box 2 and extends into the cleaning box 2. Figure 2As shown, a turntable 6 is fixedly installed on the top of the lifting column 4, and the lifting column 4 has a central through hole 401. A plurality of suction cups 7 are arranged on the upper surface of the turntable 6. A plurality of air flow channels are opened on the turntable 6, which respectively connect the suction cups 7 and the central through hole 401. All suction cups 7 are connected with the central through hole 401 through corresponding air flow channels. The bottom end of the lifting column 4 is connected to the vacuum pump through a rotary joint 12. When the wafer needs to be cleaned, the wafer surface is fitted with the suction cup 7, and the vacuum pump is started. The suction cup 7 can adsorb the wafer and fix the wafer on the turntable 6. The cleaning box 2 is provided with a soaking chamber 201, a first rinsing chamber 202 and a second rinsing chamber 203 from bottom to top. The soaking chamber 201 is filled with soaking liquid. An ultrasonic generator 204 is arranged in the soaking chamber 201. The ultrasonic generator 204 can generate ultrasonic waves when the wafer is soaked, so as to thoroughly clean the attachments on the surface of the wafer. Gates 18 are provided between the first flushing chamber 202 and between the first flushing chamber 202 and the second flushing chamber 203. A first spray water pipe 13 is provided at the top of the immersion chamber 201, and a first drain pipe 19 is provided at the bottom of the immersion chamber 201; a first cleaning liquid spray pipe 14 and a second spray water pipe 15 are provided at the top of the first flushing chamber 202, and the second spray water pipe 15 is located above the first cleaning liquid spray pipe 14; a second drain pipe 20 is provided at the bottom of the first flushing chamber 202; a second cleaning liquid spray pipe 16 and a third spray water pipe 17 are provided at the top of the second flushing chamber 203, and the third spray water pipe 17 is located above the second cleaning liquid spray pipe 16; a third drain pipe 21 is provided at the bottom of the second flushing chamber 203; a first nitrogen blowing pipe 53 is provided at the top of the second flushing chamber 303, and is located above the third spray water pipe 17. The first nitrogen blowing pipe 53 is connected to a positive pressure nitrogen gas source, usually hot nitrogen.

[0097] The immersion, two-time rinsing and drying operations of the wafer of the present invention are all completed in a closed cleaning box 2, and there is no need to transfer in the exposed air. It not only effectively protects the fine structure on the front side of the wafer and prevents foreign matter from falling on the front side of the wafer and contaminating the wafer, but also improves the cleaning effect of the temporary protective coating of the wafer, improves the cleaning efficiency, and the immersion liquid, the first cleaning liquid and the second cleaning liquid are collected separately to avoid cross contamination. The first cleaning liquid spray pipe 14 is connected to the first cleaning liquid storage tank 25, and the second cleaning liquid spray pipe 16 is connected to the second cleaning liquid storage tank. The first cleaning liquid storage tank 25 and the second cleaning liquid storage tank 26 are both provided with a heating coil 27, so that the first cleaning liquid and the second cleaning liquid can meet the required rinsing temperature. The first cleaning liquid storage tank 25 and the second cleaning liquid storage tank 26 are both provided with a stirring blade 29 driven by a stirring motor 28, so that the temperature of the cleaning liquid in the storage tank is uniform to achieve the best rinsing effect.

[0098] Since the immersion chamber 201 is set at the bottom layer of the rotary spray cleaning device, when the wafer moves to the rotary spray cleaning device, it is detected by the amplifying detection device. If it is detected that the coating on the surface of the wafer has not been removed, there is no need to reuse the immersion cleaning device, but the immersion chamber can be directly used for further immersion, thereby improving the cleaning efficiency of the wafer coating. If it is detected that the wafer coating is removed, there is no need to continue immersing in the immersion chamber 201, and the first cleaning liquid can be directly sprayed and rinsed, thereby further improving the cleaning efficiency of the wafer coating.

[0099] like Figure 3 and Figure 4 As shown in common, the gate 18 includes a gate plate 1801 fixed on the cleaning box 2, a mounting groove is provided on the gate plate 1801, the width of the center position of the mounting groove is greater than the diameter of the rotary disk 6, a split telescopic joint 1802 is provided in the mounting groove, the shape of the mounting groove is adapted to the shape of the telescopic joint 1802, and is usually stepped, a sealing strip 1803 is provided between the periphery of the telescopic joint 1802 and the gate plate 1801, and an arc groove 1804 adapted to the lifting column 4 is provided at the innermost end of the telescopic joint 1802, when the two opposite telescopic joints 1802 are opened, the rotary disk 6 can enter the upper cavity through the gap between the telescopic joints 1802, and when the two opposite telescopic joints 1802 are opened, the rotary disk 6 can enter the upper cavity through the gap between the telescopic joints 1802. When the gate 1801 is closed, the arc groove 1804 fits with the lifting column 4 to form a seal, which prevents the cleaning liquid in the cavity from leaking into the cavity below, thereby effectively preventing cross-contamination of the cleaning liquid. The gate 1801 has an upwardly protruding protrusion 1817, so that a recessed portion 1818 is formed between the gate 1801 and the cleaning box 2 to facilitate the installation of a drain valve to discharge liquid. The installation groove is provided in the protruding portion 1817, so that the position of the expansion joint 1802 is higher than the recessed portion 1818, thereby preventing liquid from leaking into the cavity below. When spraying the cleaning liquid, the cleaning liquid is thrown by the turntable 6 to the inner wall of the cleaning box 2, and flows into the recessed portion 1818 along the inner wall, thereby effectively preventing cross-contamination of the cleaning liquid. Specifically, if Figure 5As shown, the telescopic joint 1802 includes a first joint body 1805 fixedly mounted on the gate plate 1801, a second joint body 1806 is slidably mounted in the first joint body 1805, a third joint body 1807 is slidably mounted in the second joint body 1806, an arc-shaped groove 1804 adapted to the lifting column 4 is provided at the outer end of the third joint body 1807, the first joint body 1805 is connected to the second joint body 1806, and a third joint body 1807 is fixedly mounted at the end of the third joint body 1807. The plunger 1811 in the second joint 1806, the third central tube 1808 is provided in the third joint 1807, the end of the third central tube 1808 away from the plunger 1811 is provided with an oil port, the other end of the third central tube 1808 passes through the plunger 1811 and extends into the second joint 1806, the second central tube 1809 is sleeved in the third central tube 1808, the second central tube 1809 is adapted to the second joint 1806, and the second central tube 1809 is sleeved in the second central tube 1809 There is a first center cylinder 1810, the first center cylinder 1810 is adapted to the first joint 1805, the end of the first center cylinder 1810 is provided with a first working oil port 1815 connected to the oil port, the end of the first joint 1805 is provided with a second working oil port 1816, the second working oil port 1816 is connected to the A oil port of the reversing valve, the first working oil port 1815 is connected to the B oil port of the reversing valve, the P oil port of the reversing valve is connected to the oil inlet pipeline, and the T oil port of the reversing valve is connected to the return oil pipe When oil flows into the first working oil port 1815, oil returns to the second working oil port 1816, and the third section 1807 retracts the second section 1806, driving the second section 1806 to retract the first section 1805, thereby opening the gate 18; when oil flows into the second working oil port 1816, the hydraulic oil pushes the third section 1807 and the second section 1806 out, thereby closing the gate 18, and the arc-shaped groove 1804 blocks the lifting column 4, thereby sealing the bottom of the cavity.

[0100] Here, the first section 1805, the second section 1806 and the third section 1807 are preferably hollow structures with square cross-sections, which are sequentially mounted together, and sealing strips are provided between two adjacent sections to prevent leakage of hydraulic oil.

[0101] In order to improve the stability and accuracy of the sliding trajectory of the telescopic joint 1802, a third guide cylinder 1812 is provided in the third section 1807. The third guide cylinder 1812 is parallel to the third center cylinder 1808. One end of the third guide cylinder 1812 is fixed to the end of the third section 1807 away from the plunger 1811. The other end of the third guide cylinder 1812 passes through the plunger 1811 and extends into the second section 1806. The third guide cylinder 1812 is sleeved with a second guide cylinder 1813. The second guide cylinder 1813 is parallel to the third center cylinder 1808. The second section 1806 is adapted to each other, and the first guide cylinder 1814 is installed in the second guide cylinder 1813. The first guide cylinder 1814 is adapted to the first section 1805, and the end of the first guide cylinder 1814 is fixed to the end of the first section 1805. The first guide cylinder 1814, the second guide cylinder 1813 and the third guide cylinder 1812 installed together play a good guiding role, avoiding the tilting and jamming of the telescopic joint 1802 during the extension or retraction process, making the telescopic joint 1802 extend and retract more smoothly.

[0102] like Figure 6 As shown, the first spray water pipe 13, the first cleaning liquid spray pipe 14, the second spray water pipe 15, the second cleaning liquid spray pipe 16, the third spray water pipe 17 and the first nitrogen blowing pipe 53 are all extended into the cleaning box 2 and the extended ends are hingedly installed with a swing cylinder 24, the cylinder body of the swing cylinder 24 is hingedly installed on the cleaning box 2, and the piston rod of the swing cylinder 24 is hingedly installed on the corresponding first spray water pipe 13, the first cleaning liquid spray pipe 14, the second spray water pipe 15, the second cleaning liquid spray pipe 16 or the third spray water pipe 17, the first spray water pipe 13, the first cleaning liquid spray pipe 14, the second spray water pipe 15, the second cleaning liquid spray pipe 16 or the third spray water pipe 17. The water pipe 15, the second cleaning liquid spray pipe 16, the third spray water pipe 17 and the first nitrogen blowing pipe 53 are all installed on the cleaning box 2 through the self-aligning bearing 22. The corresponding first spray water pipe 13, the first cleaning liquid spray pipe 14, the second spray water pipe 15, the second cleaning liquid spray pipe 16 and the third spray water pipe 17 are swung by the push of the swing cylinder 24. The first spray water pipe 13, the first cleaning liquid spray pipe 14, the second spray water pipe 15, the second cleaning liquid spray pipe 16, the third spray water pipe 17 and the first nitrogen blowing pipe 53 are all provided with sealing elements 23 between the inner wall of the cleaning box 2. The sealing element 23 is usually a rubber sealing sleeve, which seals the gaps between the corresponding first spray water pipe 13, the first cleaning liquid spray pipe 14, the second spray water pipe 15, the second cleaning liquid spray pipe 16, the third spray water pipe 17 and the first nitrogen blowing pipe 53 and the cleaning box 2. This sealing sleeve is a commonly used component, usually a corrugated sealing sleeve. Those skilled in the art can choose to use it according to their needs, and will not be repeated here.

[0103] The first spray water pipe 13, the first cleaning liquid spray pipe 14, the second spray water pipe 15, the second cleaning liquid spray pipe 16, the third spray water pipe 17 and the first nitrogen blowing pipe 53 can be operated while swinging in the cleaning box 2 under the action of the swing cylinder 24, so as to realize all-round spraying or drying of the wafer surface. When the swing cylinder 24 swings to the position above the turntable 6, when the spraying or drying is completed and the turntable 6 needs to move upward under the action of the lifting column 4, it swings under the action of the swing cylinder 24 to deviate from the upward movement trajectory of the turntable 6 to avoid interference with the turntable 6.

[0104] like Fig.11 and Fig.12 As shown in common, the soaking and cleaning device includes a steel structure frame 41, in which a soaking box 48 and a spray box 54 are arranged, and soaking liquid is contained in the soaking box 48. A walking frame 42 driven by a walking power mechanism 43 is arranged on the steel structure frame 41, and a track is usually arranged on the steel structure frame 41. The walking power mechanism 43 includes an active roller driven by a walking motor and rollingly installed on the track. Of course, according to the size of the walking frame 42, a plurality of driven rollers can be arranged, which will not be repeated here. A lifting basket 45 driven by a winch power mechanism 44 is installed on the walking frame 42, and a plurality of flow gaps are arranged around the lifting basket 45 to facilitate the liquid to enter or flow out of the lifting basket 45. The structure of the lifting basket 45 can be implemented by those skilled in the art with reference to the prior art. The lifting basket 45 corresponds to the soaking box 48 and the spray box 54 in position, and the lifting basket 45 has a plurality of flow gaps around the lifting basket 45 to facilitate the liquid to enter or flow out of the lifting basket 45. The structure of the lifting basket 45 can be implemented by referring to the prior art. The lifting basket 45 corresponds to the soaking box 48 and the spray box 54 in position, and the lifting basket 45 has a plurality of flow gaps around the lifting basket 45 to facilitate the liquid to enter or flow out of the lifting basket 45. A plurality of clamping plates 46 are fixedly installed, which are parallel to each other and arranged at intervals. Each clamping plate 46 is provided with a plurality of claws 47 for clamping wafers. The axis of the clamping plate 46 is arranged perpendicular to the traveling direction of the walking frame 42. That is to say, the surface of the wafer is parallel to the traveling direction of the walking frame 42. When the wafer moves laterally in the chemical solution, the resistance is small. All wafers correspondingly installed on the clamping plates 46 can be rinsed with the chemical solution. The claws 47 clamp the wafers and fix them on the clamping plates 46. Multiple wafers can be placed in the lifting basket 45 at the same time and soaked at the same time. The wafers are fixed on the clamping plates 46 at intervals. The surface area of ​​the wafers exposed to the chemical solution is large. With the lifting and lowering of the lifting basket 45 and the horizontal movement of the walking frame 42, the wafers swing back and forth in the immersion box 48, so that the surface of the wafer is fully soaked, and the effect of the chemical solution is fully exerted. With the reciprocating horizontal movement of the lifting basket 45, the surface of the wafer is rinsed.

[0105] like Fig.13 , Fig.14 and Fig.15As shown, there are several waist-shaped grooves 4601 in an annular array on the clamping disk 46. The extension direction of each waist-shaped groove 4601 is along the radial direction of the circle. The clamping jaw 47 passes through the waist-shaped groove 4601 and is slidably installed in the waist-shaped groove 4601. The waist-shaped groove 4601 plays a guiding role. The end of the clamping jaw 47 located on the front of the clamping disk is provided with a clamping part 4703, and the end of the clamping jaw 47 located on the back of the clamping disk 46 is provided with a tensioning part 4704. All tensioning parts 4704 are connected together by elastic elements. The elastic element is usually an annular tension spring 51, or a corrosion-resistant rubber elastic strip is used. The tension spring 51 surrounds all the tensioning parts 4704 in turn. The wafer is clamped and fixed on the clamping disk 46 by the clamping jaw 47 under the action of the tension spring 51, and can meet the use of wafers of various diameter specifications. Fig.16 , Fig.17 and Fig.18 As shown, the clamping jaw 47 includes a first half body 4701 and a second half body 4702 connected together by a fastener, and the first half body 4701 and the second half body 4702 are both T-shaped structures, that is, a structure with a large end and a small end, wherein the clamping portion 4703 is located on the first half body 4701, that is, located on the large end of the first half body 4701, and the tensioning portion 4704 is located on the second half body 4702, that is, located on the large end of the second half body 4702. The large end of the first half 4701 is against the front of the clamping plate 46, and the large end of the second half 4702 is against the back of the clamping plate 46, which plays a limiting role. The small ends of the first half 4701 and the second half 4702 slide in the waist groove 4601 and are connected together by fasteners such as screws. The clamping jaw 47 is divided into the first half 4701 and the second half 4702, which is not only convenient to manufacture, but also allows the clamping jaw 47 to only slide along the waist groove 4601 after installation, and cannot fall out, and has high stability. A flow gap is provided between the clamping portion 4703 and the clamping plate 46, that is, after the clamping jaw 47 clamps the wafer, the flow gap is left between the back of the wafer and the clamping plate 46, so that the back of the wafer can also be soaked in the liquid.

[0106] In order to prevent the wafer from escaping from the clamping part 4703 during the movement of the lifting basket 45, an anti-slip limit block 52 is provided on the end face of the clamping part 4703 on the first half body 4701. The anti-slip limit block 52 is usually installed on the first half body 4701 using fasteners to prevent the wafer from escaping from the clamping part 4703.

[0107] Specifically, the hoisting power mechanism 44 includes a first rotating shaft and a second rotating shaft rotatably mounted on the walking frame 42, the first rotating shaft and the second rotating shaft are arranged in parallel and spaced apart, the first rotating shaft is connected to the lifting motor, the lifting motor is fixedly mounted on the walking frame 42, the first rotating shaft is fixedly mounted with a first double-groove rope pulley and a second double-groove rope pulley, the second rotating shaft is fixedly mounted with a first rope pulley and a second rope pulley, the first rope pulley corresponds to one of the rope pulleys in the first double-groove rope pulley, the second rope pulley corresponds to one of the rope pulleys in the second double-groove rope pulley, the first double-groove rope pulley, the second double-groove rope pulley, the first rope pulley and the second rope pulley respectively correspond to the four corners of the lifting basket 45, and a rope pulley of the first double-groove rope pulley is wound with a first steel wire rope The other end of the first steel wire rope is fixed to the corresponding corner position of the lifting basket 45, the second steel wire rope is wound around the other rope wheel of the first double-groove rope pulley, and the second steel wire rope is fixed to the corresponding corner position of the lifting basket 45 after passing through the first rope wheel, a third steel wire rope is wound around one rope wheel of the second double-groove rope pulley, and the other end of the third steel wire rope is fixed to the corresponding corner position of the lifting basket 45, a fourth steel wire rope is wound around the other rope wheel of the second double-groove rope pulley, and the fourth steel wire rope is fixed to the corresponding corner position of the lifting basket 45 after passing through the second rope wheel, and four steel wire ropes are driven simultaneously by a lifting motor to ensure the synchronization of the four steel wire ropes, so that the lifting of the lifting basket 45 is more stable.

[0108] A nitrogen aeration pipe 49 is provided at the bottom of the immersion box 48. The aeration pipe is a commonly used component and includes a microporous aeration pipe, a nano aeration pipe, etc. Those skilled in the art can purchase and use them as needed. The details will not be repeated here. The nitrogen aeration pipe 49 can generate nitrogen bubbles in the drug solution, which stirs the drug solution, so that the drug solution can fully exert its protective layer on the surface of the wafer, thereby achieving a better immersion effect.

[0109] A fourth spray water pipe 50 is provided in the spray box 54, and the fourth spray water pipe 50 is connected to the pure water storage tank. The spraying direction of the fourth spray water pipe 50 is consistent with the surface direction of the wafer. Pure water can be used to rinse the front and back sides of the vertically placed wafer from the side of the wafer to rinse and remove residual liquid on the surface of the wafer. The fourth spray water pipe 50 is close to the inner wall of the immersion box 48 to avoid interference with the lifting basket 45.

[0110] A second nitrogen blowing pipe 55 is provided at the top of the spray box 54 in the spray box 54. The second nitrogen blowing pipe 55 is close to the inner wall of the spray box 54. The second nitrogen blowing pipe 55 is provided with a plurality of nozzles facing the back side of the wafer. The second nitrogen blowing pipe 55 has a positive pressure nitrogen gas source, usually hot nitrogen, which can dry the pure water on the back side of all wafers clamped on the clamping plate 46 as they are continuously taken out one by one, so as to prevent residual moisture on the back side of the wafer from entering the downstream suction cup.

[0111] In order to improve the spraying effect, two groups of fourth spray water pipes 50 are usually arranged in the immersion box 48, which are staggered in upper and lower positions. The two groups of fourth spray water pipes 50 are respectively located on two opposite inner walls of the immersion box 48. The two groups of fourth spray water pipes 50 arranged relatively can thoroughly rinse the residual liquid on the surface of the wafer after immersion.

[0112] When in use, a proper amount of soaking liquid is respectively placed in the soaking box 48, and the wafer to be processed is placed on the clamping part 4703 of the clamping claw 47. The wafer is fixed on the clamping plate 46 by the force of the tension spring 51, and each clamping plate 46 is placed with one wafer. The lifting motor is started, and the lifting basket 45 is placed in the soaking box 48. The nitrogen aeration pipe 49 starts to aerate and generate nitrogen bubbles to stir the soaking liquid. The walking motor is started to drive the lifting basket 45 to move back and forth in the soaking box 48 for about fifteen seconds. The soaking can be completed in minutes, which is better than the traditional soaking of thirty minutes. After the soaking is completed, the lifting motor is started to pull the lifting basket 45 out of the soaking solution, the walking motor is started to move the lifting basket 45 into the spray box 54, and the fourth spray water pipe 50 starts to spray pure water on the wafers in the lifting basket 45 to flush away the soaking solution on the surface of the wafers, and then the second nitrogen blowing pipe 55 starts to spray hot nitrogen gas flow on the back of the outermost wafer, and the hot nitrogen gas flow dries the back of the wafer to facilitate entering the next process.

[0113] The wafer flipping adopts the following mechanism, such as Figure 7 , Figure 8 and Fig. 9As shown in the figure, a rotating tube 30 driven by a servo motor 31 is rotatably installed on the cleaning box 2 through a bearing. Usually, the servo motor 31 is connected to the rotating tube 30 through a gear pair. The rotating tube 30 extends into the cleaning box 2 along the radial direction of the rotating disk 6. The rotating tube 30 is usually arranged at the top position of the second flushing chamber 203. A slide seat 32 driven by a first cylinder 33 is axially slidably installed in the rotating tube 30. A diamond-shaped four-bar linkage is installed on the side of the slide seat 32 away from the first cylinder 33. The four-bar linkage includes a first connecting rod 35, a second connecting rod 36, and a third connecting rod 37 which are hinged in sequence. The hinge points of the three connecting rods 37 and the fourth connecting rod 38, the first connecting rod 35 and the fourth connecting rod 38 are hinged on the slide 32, the slide 32 is equipped with a second cylinder 34, the cylinder body of the second cylinder 34 is fixedly installed on the slide 32, and the second cylinder 34 and the first cylinder 33 are located on the same side of the slide 32, the hinge points of the second connecting rod 36 and the third connecting rod 37 are connected to the piston rod of the second cylinder 34, the second connecting rod 36 and the third connecting rod 37 are both provided with an extension extending from the hinge point, and the end of the extension is provided with a clamping part 39, and the clamping range of the clamping part 39 is adapted to the thickness of the wafer. This structure can not only realize the automatic clamping and flipping of the wafer, but also under the action of the first cylinder 33, the clamping part 39 can also avoid the lifting and lowering trajectory of the turntable, avoid interfering with the lifting and lowering of the turntable, replace the manual flipping of the wafer, and further improve the production efficiency of the wafer.

[0114] A limiting element for limiting the maximum stroke of the first cylinder 33 is provided on the rotating tube 30. The limiting element is usually a limiting screw 40, which is threadedly connected to the rotating tube 30. The distance from the initial state of the first cylinder 33 to the limiting screw 40 is less than the stroke of the first cylinder 33. The limiting screw 40 limits the maximum position of the extension of the piston rod of the first cylinder 33. When the second cylinder 34 pushes the four-bar linkage at this position, the force of the second cylinder 34 acts on the limiting screw 40 instead of on the piston of the first cylinder 33, thereby protecting the piston of the first cylinder 33 and extending the service life of the first cylinder 33.

[0115] The four-bar linkage is provided with a compression spring arranged radially along the rotating tube 30 , and the force of the compression spring can act on the four-bar linkage in time, so as to open the clamping part 39 more quickly, thereby effectively preventing the wafer from being subjected to the radial force of the clamping part 39 .

[0116] During operation, after the wafer is soaked in the immersion liquid, rinsed with pure water and dried on the back of the wafer, the operator opens the cover plate 3, fills an appropriate amount of immersion liquid in the immersion chamber 201, and the hydraulic cylinder 8 pushes the lifting column 4 to move up, places the wafer to be processed on the suction cup 7, starts the vacuum pump, fixes the wafer on the turntable 6, and under the action of the hydraulic cylinder 8, the lifting column 4 moves down to block the cover plate 3 and the cleaning box 2. Figure 1As shown, the turntable 6 drives the wafer to sink into the soaking liquid in the soaking chamber 201 for soaking. After the soaking is completed, the lifting column 4 drives the turntable 6 to start moving up to the position below the first spray water pipe 13. The swing cylinder 24 swings the first spray water pipe 13 to the center position of the turntable 6 and swings back and forth at a certain swing amplitude. At this time, the first spray water pipe 13 starts to spray pure water to rinse and remove the soaking liquid residue. After that, the lifting column 4 moves up. Fig.10As shown, the wafer is transferred to the first rinsing chamber 202, the telescopic joint 1802 at the bottom of the first rinsing chamber 202 is closed, and then the rotary motor 11 is started to drive the wafer to rotate. At this time, the swing cylinder 24 moves the first cleaning liquid spray pipe 14 to the top of the wafer, sprays and rinses the wafer surface, and opens the second drain pipe 20. The first cleaning liquid after rinsing flows out through the second drain pipe 20 for collection. After the first cleaning liquid is rinsed, it is not necessary to turn off the rotary motor 11. The first cleaning liquid spray pipe 14 is swung out of the center position, and the second spray water pipe 15 is swung to the center position to spray pure water on the wafer surface to rinse and remove the first cleaning liquid residue. At the same time, the residue in the first rinse is removed. The first cleaning liquid in the washing chamber 202 is discharged through the second drain pipe 20, the hydraulic cylinder 8 drives the wafer to move up to the second washing chamber 203, the telescopic joint 1802 at the bottom of the second washing chamber 203 is closed, and the second cleaning liquid spray pipe 16 swings to the center position to spray the second cleaning liquid on the surface of the wafer. At this time, the third drain pipe 21 is opened, and the cleaning liquid is discharged and collected through the third drain pipe 21. After rinsing, the third spray water pipe 17 sprays pure water on the surface of the wafer to rinse and remove the residue of the second cleaning liquid. After rinsing, the rotary motor 11 drives the wafer to continue to rotate to shake off the residual water droplets on the front of the wafer. If the back of the wafer does not need to be cleaned, the first nitrogen spray pipe 53 sprays nitrogen to dry the wafer surface. After drying, the wafer can be taken out. If the back of some wafer products also needs to be cleaned, and the front of the wafer product allows suction cup adsorption, the rotary motor 11 stops, the first cylinder 33 acts, and pushes the slide 32 to move toward the turntable 6. After the clamping part 39 moves to the wafer position, the second cylinder 34 acts, pushing the four-bar mechanism to deform, and the two opposite clamping parts 39 merge to clamp the upper and lower surfaces of the wafer. The vacuum pump stops exhausting, the suction cup 7 releases the wafer, the lifting column 4 moves down a certain distance, the servo motor 31 starts, the rotary tube 30 drives the wafer to flip 180 degrees, the lifting column 4 rises, the vacuum pump starts exhausting, and the suction cup 7 The wafer is adsorbed, the second cylinder 34 pulls the four-bar linkage to deform, the clamping part 39 opens, and then the first cylinder 33 pulls back the slide 32, the lifting column 4 moves down, the rotary motor 11 starts, and repeats the previous action to continue spraying the first cleaning liquid and the second cleaning liquid on the other side of the wafer. After the spraying and rinsing is completed, the first nitrogen spray pipe 53 sprays nitrogen to the surface of the wafer for drying treatment, the third spray water pipe 17 deviates from the center position, the rotary motor 11 stops, the cover plate 3 is opened, the hydraulic cylinder 8 drives the wafer to move up, the vacuum pump stops vacuuming, and the operator can take out the processed wafer, put in another wafer to be cleaned, and continue cleaning.

[0117] In order to reduce the operator's labor intensity and improve the degree of automation, a control unit such as a programmable controller or a microcomputer is usually used for control, and a temperature sensor is set at the corresponding position to make the action instructions and temperature control more accurate and timely control the relevant actuators. Those skilled in the art can implement it according to the actual situation, and will not be repeated here. In addition, the pressure or flow rate of the separate cleaning liquid spray pipe and nitrogen blowing pipe can be controlled to meet the use of wafers of different specifications.

[0118] As described above, the present invention provides a wafer cutting protection system, which achieves many excellent technical effects through a unique structural design.

[0119] Although the present invention has been described in detail above by general description and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A wafer cutting protection system, comprising a dispensing coating device, a glue layer curing device, a cutting device and a glue layer removal device arranged in sequence, characterized in that: The adhesive layer removal equipment comprises an immersion cleaning device and a rotary spray cleaning device which are arranged in sequence, the rotary spray cleaning device comprises a bracket, a cleaning box is fixedly mounted on the bracket, the top of the cleaning box is covered with a cover plate, a lifting column which is driven by a first power mechanism and vertically lifted at the bottom of the cleaning box is provided, the lifting column is connected to a second power mechanism which drives the lifting column to rotate around a rotation center, the lifting column passes through the bottom surface of the cleaning box and extends into the cleaning box, a rotating disk is fixedly mounted on the top of the lifting column, the lifting column has a central through hole, a plurality of suction cups are arranged on the upper surface of the rotating disk, all of the suction cups are connected with the central through hole, and the bottom end of the lifting column is connected to a vacuum pump through a rotary joint; the cleaning box is provided with an immersion chamber, a first flushing chamber and a second flushing chamber from bottom to top, the immersion chamber is filled with immersion liquid, an ultrasonic generator is provided in the immersion chamber, gates are provided between the immersion chamber and the first flushing chamber and between the first flushing chamber and the second flushing chamber, The gate includes a gate plate fixed on the cleaning box body, a mounting groove is provided on the gate plate, the width of the mounting groove at the center position is greater than the diameter of the rotating disk, a split telescopic joint is provided in the mounting groove, a sealing strip is provided between the periphery of the telescopic joint and the gate plate, a first spray water pipe is provided at the top of the immersion chamber, a first drain pipe is provided at the bottom of the immersion chamber, a first cleaning liquid spray pipe and a second spray water pipe are provided at the top of the first flushing chamber, the second spray water pipe is located above the first cleaning liquid spray pipe, a second drain pipe is provided at the bottom of the first flushing chamber, a second cleaning liquid spray pipe and a third spray water pipe are provided at the top of the second flushing chamber, the third spray water pipe is located above the second cleaning liquid spray pipe, a third drain pipe is provided at the bottom of the second flushing chamber, the first cleaning liquid spray pipe is connected to the first cleaning liquid storage tank, the second cleaning liquid spray pipe is connected to the second cleaning liquid storage tank, and a first nitrogen blowing pipe is provided at the top of the second flushing chamber above the third spray water pipe.

2. The wafer cutting protection system according to claim 1, characterized in that: The immersion cleaning device includes a steel structure frame, in which an immersion box and a spray box are arranged, a walking frame driven by a walking power mechanism is arranged on the steel structure frame, a lifting basket driven by a winch power mechanism is installed on the walking frame, the lifting basket corresponds to the position of the immersion box and the spray box, a plurality of clamping plates parallel to each other and arranged at intervals are fixedly installed in the lifting basket, each clamping plate is provided with a plurality of clamping claws for clamping wafers, and the axis of the clamping plate is arranged perpendicular to the walking direction of the walking frame; a fourth spray water pipe is arranged in the spray box, and the spraying direction of the fourth spray water pipe is consistent with the surface direction of the wafer.

3. The wafer cutting protection system according to claim 2, characterized in that: A second nitrogen blowing pipe is provided in the spray box at the top of the spray box, the second nitrogen blowing pipe is close to the inner wall of the spray box, and a plurality of nozzles facing the back side of the wafer are provided on the second nitrogen blowing pipe.

4. The wafer cutting protection system according to claim 3, characterized in that: There are several waist-shaped grooves in a circular array on the clamping disk, and the clamping claw passes through the waist-shaped grooves and is slidably installed in the waist-shaped grooves. A clamping part is provided at the end of the clamping claw located on the front side of the clamping disk, and a tensioning part is provided at the end of the clamping claw located on the back side of the clamping disk. All tensioning parts are connected together by elastic elements. The clamping claw includes a first half body and a second half body connected together by fasteners. The first half body and the second half body are both T-shaped structures. The clamping part is located on the first half body, and the tensioning part is located on the second half body.

5. The wafer cutting protection system according to any one of claims 1 to 4, characterized in that: The gate plate has a protruding portion protruding upward, and the mounting groove is arranged in the protruding portion.

6. The wafer cutting protection system according to claim 5, characterized in that: The innermost end of the telescopic joint is provided with an arc-shaped groove matched with the lifting column.

7. The wafer cutting protection system according to claim 1, characterized in that: The first spray water pipe, the first cleaning liquid spray pipe, the second spray water pipe, the second cleaning liquid spray pipe, the third spray water pipe and the first nitrogen blowing pipe all extend into the cleaning box body and the extended ends are hingedly mounted with a swing cylinder.

8. The wafer cutting protection system according to claim 1, characterized in that: A rotating tube driven by a servo motor is rotatably installed on the cleaning box, and the rotating tube extends into the cleaning box along the radial direction of the turntable, and a sliding seat driven by a first cylinder is axially slidably installed in the rotating tube, and a diamond-shaped four-bar mechanism is installed on the side of the sliding seat away from the first cylinder, and the four-bar mechanism includes a first connecting rod, a second connecting rod, a third connecting rod and a fourth connecting rod hinged in sequence, and the hinge points of the first connecting rod and the fourth connecting rod are hinged on the sliding seat, and the second cylinder is installed on the sliding seat, and the hinge points of the second connecting rod and the third connecting rod are connected to the piston rod of the second cylinder, and the second connecting rod and the third connecting rod are both provided with extension parts extending from the hinge points, and the ends of the extension parts are provided with clamping parts.

9. The wafer cutting protection system according to claim 8, characterized in that: The rotary tube is provided with a limiting element for limiting the maximum stroke of the first cylinder.

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