A high-power semiconductor testing device and method

Abstract

The present invention discloses a high-power semiconductor testing device and method, which relates to the technical field of semiconductor testing. In order to solve the problems in the prior art that usually a single testing head sequentially tests high-power semiconductors, and manual feeding and discharging are carried out sequentially, resulting in a long testing time, increased labor force, greatly reduced testing efficiency, greatly shortened service life of a single testing head, and increased testing costs. A high-power semiconductor testing device includes a testing base, a fixed flipping mechanism and a testing mechanism. A fixed flipping mechanism is installed on one side of the upper surface of the testing base, and a testing mechanism is arranged on one side of the fixed flipping mechanism; by synchronously testing the high-power semiconductors fixed in the fixing plate through the detection plate, the testing efficiency is greatly improved. Multiple high-power semiconductors are placed at one time by the tester, shortening the testing time, reducing manual labor, effectively improving the service life of the detection needles, reducing the number of wear times, and bringing good economic benefits to the enterprise.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing, and particularly relates to a high-power semiconductor testing device and method. Background Art

[0002] Application No. CN202110415652.1 discloses a high-power semiconductor device power-on heating performance testing device, including: a semiconductor device unit, a heat dissipation unit that can be in contact with the semiconductor device unit to dissipate heat from the semiconductor device therein, a temperature measurement unit connected to the heat dissipation unit for detecting the temperature of the heat dissipation unit, a driving unit connected to the heat dissipation unit and the temperature measurement unit for driving the heat dissipation unit to contact the semiconductor device unit, and an intelligent temperature control water cooling unit connected to the heat dissipation unit for intelligently controlling the heat dissipation unit to dissipate heat from the semiconductor device in the semiconductor device unit. However, there are still the following problems in the testing process:

[0003] 1. In the prior art, when testing a plate-shaped high-power semiconductor, it is impossible to test both sides of the high-power semiconductor. It is necessary to manually flip it for double-sided testing, which greatly increases the manual labor, and it is easy to have the situation of over-flipping or missed flipping during the flipping process, and the testing quality cannot be guaranteed;

[0004] 2. In the prior art, usually a single test head tests the high-power semiconductor in sequence, and the feeding and discharging are carried out manually in sequence. The testing time is long, the labor is increased, the testing efficiency is greatly reduced, the service life of a single test head is greatly shortened, and the testing cost is increased. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-power semiconductor testing device and method, in which a fixed flipping mechanism drives the high-power semiconductor to turn over, and a testing mechanism tests both sides of it, improving the testing efficiency, simplifying the flipping step, and prolonging the service life of the testing equipment, so as to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] A high-power semiconductor testing device includes a testing base, a fixed flipping mechanism, and a testing mechanism. On one side of the upper surface of the testing base, a fixed flipping mechanism is installed. On one side of the fixed flipping mechanism, a testing mechanism is arranged. The fixed flipping mechanism is composed of a flipping driving device, a flipping fixing device, and a limiting device. The flipping driving device and the limiting device are symmetrically arranged on both sides of the flipping fixing device respectively, and the limiting device is arranged on the side close to the flipping fixing device. The flipping driving device is fixedly connected to the testing base.

[0008] Further, the testing mechanism includes a sliding base, a translation slider, a driving cylinder, and a detection body. The lower surface of the sliding base is fixedly connected to the upper surface of the testing base by bolts respectively. A translation chute is provided on the upper surface of the sliding base. The sliding base is slidably connected to the translation slider through the translation chute. The upper surface of the translation slider is fixedly connected to the driving cylinder by bolts. The upper surface of the driving cylinder is fixedly connected to a support rod through a cylinder rod. One end of the support rod is fixedly connected to the detection body.

[0009] Further, a detection plate is installed on the lower surface of the detection body. Detection needles evenly distributed are respectively provided on the lower surface of the detection plate. The detection needles are electrically connected to the detection body through wires respectively.

[0010] Further, the flipping driving device includes a driving base, a flipping cylinder, and a driving rack. The lower surface of the driving base is fixedly connected to the upper surface of the testing base by bolts. The flipping cylinder is fixedly connected to one end of the driving base by bolts. The upper surface of the driving base is slidably connected to a short sliding bar. A chute adapted to the short sliding bar is provided on the upper surface of the driving base. The upper surface of the short sliding bar is slidably connected to a long sliding bar. One side of the upper surface of the long sliding bar is fixedly connected to a connecting block by bolts. The upper surface of the connecting block is fixedly connected to the lower surface of the driving rack.

[0011] Further, the flipping fixing device includes a fixing plate, a movable plate, and a transmission lead screw. Lower fixing lugs are respectively installed at both ends of the fixing plate. Upper fixing lugs are respectively installed at both ends of the movable plate. The lower fixing lugs are fixedly connected to the lower end of the transmission lead screw through bearings. The upper fixing lugs are rotatably connected to a transmission sleeve through bearings. The transmission sleeve is nested with the transmission lead screw. An external thread is provided at the upper end of the transmission lead screw. An internal thread adapted to the transmission lead screw is provided on the inner wall of the transmission sleeve. Fixing detection grooves evenly distributed are respectively provided on the surfaces of the fixing plate and the movable plate. The fixing detection grooves are symmetrically arranged on the fixing plate and the movable plate respectively.

[0012] Further, the lower surface of the fixing plate is fixedly connected to the movable plate driving mechanism by bolts. Both ends of the fixing plate are respectively fixedly connected to a rotating shaft. Both ends of the rotating shaft are respectively rotatably connected to a transmission gear through pins. The transmission gear meshes with the driving rack. Bearing seats are respectively provided at both ends of the fixing plate. A bearing groove is provided at the upper end of the bearing seat. The rotating shaft is respectively in contact with the surface of the bearing groove.

[0013] Further, the limiting device includes a limiting block, a first connecting rod, a second connecting rod, and a fixed connecting plate. Both ends of the first connecting rod are respectively fixedly connected to the limiting block. The limiting blocks are symmetrically arranged on both sides of the fixing plate respectively. The limiting block is in an inverted "7" shape and the lower surface of the upper end is in contact with both sides of the upper end of the rotating shaft. The lower surface of the limiting block is fixedly connected to a positioning column. A fixed sleeve is sleeved on the center of the second connecting rod. One side of the fixed sleeve is fixedly connected to the fixed connecting plate. One end of the fixed connecting plate is fixed to one side of the short sliding bar. Both ends of the second connecting rod are respectively fixedly connected to the positioning column.

[0014] Further, evenly distributed tooth groove sections are arranged on the upper surface of the driving rack. The interval distance of the tooth groove sections is the same as the interval distance of the turning shaft. The tooth groove sections are respectively engaged with the transmission gears through the tooth grooves.

[0015] Further, the movable plate driving mechanism includes a driving motor, a driving rotating shaft and a driving gear. The driving motor is fixedly connected to one side of the lower surface of the fixed plate through a motor fixing plate. The driving motor is fixedly connected to the driving rotating shaft through a motor shaft. One end of the driving rotating shaft is fixedly connected to the driving gear. The upper surface of the driving gear contacts the transmission cross shaft through a tooth groove. A spiral blade engaged with the driving gear is arranged at the center of the transmission cross shaft. Side bevel gears are respectively fixed at both ends of the transmission cross shaft. The side bevel gears are respectively engaged with the positive bevel gears. The positive bevel gears are fixedly connected to the lower surface of the transmission lead screw.

[0016] The present invention provides another technical solution, a test method for a high-power semiconductor test device, including the following steps:

[0017] Step 1: Place high-power semiconductors in the fixed plate respectively. The movable plate driving mechanism drives the movable plate to move downward to fix the high-power semiconductors. The driving cylinder drives the detection plate to move downward to test the high-power semiconductors respectively.

[0018] Step 2: The flipping cylinder drives the short sliding bar to slide. The limiting block fixes the turning shaft on one side of the fixed plate. The flipping cylinder drives the long sliding bar to slide, driving the fixed plate to make a circular motion around the axis of the turning shaft for flipping.

[0019] Step 3: The driving cylinder slides on the sliding base to the other side to test the other side of the high-power semiconductor.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. By synchronously testing the high-power semiconductors fixed in the fixed plate through the detection plate, the test efficiency is greatly improved. Multiple high-power semiconductors are placed by the tester at one time, shortening the test time, reducing the labor force, effectively increasing the service life of the detection needles, reducing the number of wear times, and lowering the test cost, bringing good economic benefits to the enterprise.

[0022] 2. The flipping cylinder is used to push the short sliding bar to translate, so that the limiting block fixes the flipping shaft on one side of the fixed plate in the load-bearing groove, releases the flipping shaft on the other side of the fixed plate, and the flipping cylinder pushes the long sliding bar to translate, so that the long sliding bar drives the driving rack to move horizontally. Thus, the flipping shaft that meshes with the driving rack and is fixed in the load-bearing groove drives the fixed plate to perform circular motion, flipping the high-power semiconductor fixed inside it. The design is reasonable, the driving structure is stable, it is flexible to use, convenient for testing both sides of the high-power semiconductor, simplifies the flipping step, avoids the situation of missing flipping or less flipping caused by manual flipping, reduces the testing time, and improves the testing efficiency.

[0023] 3. The tester places the high-power semiconductor to be tested in the fixed detection groove. The driving motor drives the transmission cross shaft to rotate, thereby driving the side bevel gears at both ends to rotate synchronously. The positive bevel gear drives the transmission lead screw to rotate, moving the movable plate downward to closely contact the fixed plate, fixing the high-power semiconductor in the fixed plate. The transmission is stable, converting the horizontal rotation into synchronous vertical rotation on both sides, improving the transmission stability, reducing the driving cost, and enhancing the fixing effect. Description of the Drawings

[0024] Figure 1 Isometric view of the test base, fixed flipping mechanism and connection shaft of the test mechanism of the present invention;

[0025] Figure 2 Isometric view of the test mechanism of the present invention;

[0026] Figure 3 Isometric view of the fixed flipping mechanism of the present invention;

[0027] Figure 4 Isometric view of another form of the fixed flipping mechanism of the present invention;

[0028] Figure 5 Isometric view of the limiting device of the present invention;

[0029] Figure 6 Isometric view of the fixed plate and the movable plate of the present invention;

[0030] Figure 7 Isometric view of the driving mechanism of the movable plate of the present invention;

[0031] Figure 8 Front view cross-sectional view of the fixed plate and the movable plate of the present invention.

[0032] In the figure: 1. Test base; 2. Fixed flipping mechanism; 21. Flipping drive device; 211. Drive base; 212. Flipping cylinder; 213. Drive rack; 214. Short sliding bar; 215. Long sliding bar; 216. Connecting block; 217. Tooth groove section; 22. Flipping fixing device; 221. Fixing plate; 222. Movable plate; 223. Transmission lead screw; 224. Lower fixed ear seat; 225. Upper fixed ear seat; 226. Fixed detection groove; 227. Flipping shaft; 228. Transmission gear; 229. Bearing seat; 23. Limiting device; 231. Limiting block; 232. First connecting rod; 233. Second connecting rod; 234. Fixed connecting plate; 235. Positioning column; 236. Fixed sleeve; 24. Movable plate drive mechanism; 241. Drive motor; 242. Drive rotating shaft; 243. Drive gear; 244. Motor fixing plate; 245. Transmission cross shaft; 246. Spiral blade; 247. Side bevel gear; 248. Positive bevel gear; 3. Test mechanism; 31. Sliding base; 32. Translation slider; 33. Drive cylinder; 34. Detection body; 35. Support rod; 36. Detection plate. Detailed implementation mode

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0034] In order to solve the technical problem that usually a single test head tests high-power semiconductors in sequence, and manual loading and unloading are carried out in sequence, with a long test time, please refer to Figure 1-2 , the following technical solutions are provided in this embodiment:

[0035] A high-power semiconductor testing device and method, including a test base 1, a fixed flipping mechanism 2 and a test mechanism 3. A fixed flipping mechanism 2 is installed on one side of the upper surface of the test base 1. A test mechanism 3 is arranged on one side of the fixed flipping mechanism 2. The fixed flipping mechanism 2 is composed of a flipping drive device 21, a flipping fixing device 22 and a limiting device 23. The flipping drive device 21 and the limiting device 23 are symmetrically arranged on both sides of the flipping fixing device 22 respectively. The limiting device 23 is arranged on the side close to the flipping fixing device 22. The flipping drive device 21 is fixedly connected to the test base 1;

[0036] The testing mechanism 3 includes a sliding base 31, a translation slider 32, a driving cylinder 33, and a detection body 34. The lower surface of the sliding base 31 is fixedly connected to the upper surface of the testing base 1 by bolts respectively. A translation chute is provided on the upper surface of the sliding base 31. The sliding base 31 is slidably connected to the translation slider 32 through the translation chute. The upper surface of the translation slider 32 is fixedly connected to the driving cylinder 33 by bolts. The upper surface of the driving cylinder 33 is fixedly connected to a support rod 35 through a cylinder rod. One end of the support rod 35 is fixedly connected to the detection body 34. A detection plate 36 is installed on the lower surface of the detection body 34. Uniformly distributed detection needles are provided on the lower surface of the detection plate 36. The detection needles are electrically connected to the detection body 34 through wires respectively.

[0037] Specifically, the translation slider 32 drives the driving cylinder 33 to move horizontally within the sliding base 31, moving the detection body 34 above the flipping driving device 21. The driving cylinder 33 drives the detection body 34 to move downward, and the detection plate 36 synchronously tests the high-power semiconductors fixed in the fixing plate 221. After the fixing flipping mechanism 2 completes the flipping, the translation slider 32 drives the driving cylinder 33 to move synchronously, ensuring that the detection holes on the fixing plate 221 and the detection plate 36 correspond one by one with the detection needles on the lower surface of the detection plate 36. The movement is stable, greatly improving the testing efficiency. Multiple high-power semiconductors can be placed by the tester at one time, shortening the testing time, reducing the manual labor force, effectively increasing the service life of the detection needles, reducing the number of wear times, and lowering the testing cost, bringing good economic benefits to the enterprise.

[0038] In order to solve the technical problem that when testing plate-shaped high-power semiconductors, it is impossible to test both sides of the high-power semiconductors, please refer to Figure 3-6 , this embodiment provides the following technical solutions:

[0039] The flipping driving device 21 includes a driving base 211, a flipping cylinder 212, and a driving rack 213. The lower surface of the driving base 211 is fixedly connected to the upper surface of the testing base 1 by bolts. The flipping cylinder 212 is fixedly connected to one end of the driving base 211 by bolts. The upper surface of the driving base 211 is slidably connected to a short sliding bar 214. A chute adapted to the short sliding bar 214 is provided on the upper surface of the driving base 211. The upper surface of the short sliding bar 214 is slidably connected to a long sliding bar 215. One side of the upper surface of the long sliding bar 215 is fixedly connected to a connecting block 216 by bolts. The upper surface of the connecting block 216 is fixedly connected to the lower surface of the driving rack 213;

[0040] The limiting device 23 includes a limiting block 231, a first connecting rod 232, a second connecting rod 233 and a fixed connecting plate 234. The two ends of the first connecting rod 232 are respectively fixedly connected to the limiting block 231. The limiting blocks 231 are symmetrically arranged on both sides of the fixed plate 221. The limiting block 231 is in a "7" shape and the lower surface of the upper end contacts the upper ends on both sides of the turning shaft 227. The lower surface of the limiting block 231 is fixedly connected to the positioning column 235. A fixed sleeve 236 is sleeved on the center of the second connecting rod 233. One side of the fixed sleeve 236 is fixedly connected to the fixed connecting plate 234. One end of the fixed connecting plate 234 is fixedly connected to one side of the short sliding strip 214. The two ends of the second connecting rod 233 are respectively fixedly connected to the positioning column 235. Tooth groove sections 217 are evenly distributed on the upper surface of the driving rack 213. The interval distance of the tooth groove sections 217 is the same as the interval distance of the turning shaft 227. The tooth groove sections 217 are respectively meshed with the transmission gear 228 through the tooth grooves;

[0041] The flipping and fixing device 22 includes a fixed plate 221, a movable plate 222 and a transmission lead screw 223. Lower fixed ear seats 224 are respectively installed at both ends of the fixed plate 221. Upper fixed ear seats 225 are respectively installed at both ends of the movable plate 222. The lower fixed ear seat 224 is fixedly connected to the lower end of the transmission lead screw 223 through a bearing. The upper fixed ear seat 225 is rotationally connected to the transmission sleeve through a bearing. The transmission sleeve is nested with the transmission lead screw 223. An external thread is provided at the upper end of the transmission lead screw 223. An internal thread adapted to the transmission lead screw 223 is provided on the inner wall of the transmission sleeve. Fixed detection grooves 226 are evenly distributed on the surfaces of the fixed plate 221 and the movable plate 222. The fixed detection grooves 226 are symmetrically arranged on the fixed plate 221 and the movable plate 222 respectively. The lower surface of the fixed plate 221 is fixedly connected to the movable plate driving mechanism 24 through bolts. Both ends of the fixed plate 221 are respectively fixedly connected to the turning shaft 227. Both ends of the turning shaft 227 are respectively rotationally connected to the transmission gear 228 through pins. The transmission gear 228 is meshed with the driving rack 213. Bearing seats 229 are respectively arranged at both ends of the fixed plate 221. A load-bearing groove is provided at the upper end of the bearing seat 229. The turning shaft 227 respectively contacts the surface of the load-bearing groove.

[0042] Specifically, the high-power semiconductor is fixed by the movable plate 222 and the fixed plate 221. The fixed detection groove 226 is set as a fixed groove with a T-shaped cross-section. While the fixed detection groove 226 cooperates with the movable plate 222 and the fixed plate 221 for fixing, it is convenient to test both sides of the high-power semiconductor, ensuring that the high-power semiconductor will not fall off or become loose. The transmission lead screw 223 is meshed with the upper fixed ear seat 225, so that the movable plate 222 moves through the rotation of the transmission lead screw 223. The friction between the short sliding strip 214 and the driving base 211 is less than the friction between the short sliding strip 214 and the long sliding strip 215. When the flipping cylinder 212 pushes the cylinder rod, the short sliding strip 214 slides to the buckle limiting position and then the long sliding strip 215 moves;

[0043] The flipping cylinder 212 pushes the short sliding bar 214 to translate, so that the fixed connecting plate 234 fixed to the short sliding bar 214 drives the second connecting rod 233 to move horizontally. The limit blocks 231 at both ends of the second connecting rod 233 move synchronously, fixing the turning shaft 227 on one side of the fixed plate 221 in the load-bearing groove and releasing the turning shaft 227 on the other side of the fixed plate 221. The flipping cylinder 212 pushes the long sliding bar 215 to translate, so that the long sliding bar 215 drives the driving rack 213 to move horizontally. Thus, the turning shaft 227 engaged with the driving rack 213 and fixed in the load-bearing groove drives the fixed plate 221 to perform a circular motion, flipping the high-power semiconductor fixed inside it. The design is reasonable, the driving structure is stable, the use is flexible, it is convenient to test both sides of the high-power semiconductor, simplifies the flipping steps, avoids the situation of missing flipping or less flipping caused by manual flipping, reduces the test time, and improves the test efficiency.

[0044] To solve the technical problems that the high-power semiconductor is often not fixed firmly enough and the fixed plate is prone to loosen during the flipping process, resulting in the gear and the tooth groove falling off, please refer to Figure 3-8 This embodiment provides the following technical solutions:

[0045] The movable plate driving mechanism 24 includes a driving motor 241, a driving rotating shaft 242 and a driving gear 243. The driving motor 241 is fixedly connected to one side of the lower surface of the fixed plate 221 through a motor fixing plate 244. The driving motor 241 is fixedly connected to the driving rotating shaft 242 through a motor shaft. One end of the driving rotating shaft 242 is fixedly connected to the driving gear 243. The upper surface of the driving gear 243 contacts the transmission cross shaft 245 through a tooth groove. A spiral blade 246 meshing with the driving gear 243 is arranged at the center of the transmission cross shaft 245. Side bevel gears 247 are respectively fixed at both ends of the transmission cross shaft 245. The side bevel gears 247 are respectively meshed with a positive bevel gear 248. The positive bevel gear 248 is fixedly connected to the lower surface of the transmission lead screw 223. Mounting plates for mounting the driving rotating shaft 242 and the transmission cross shaft 245 are respectively arranged on the lower surface of the fixed plate 221.

[0046] Specifically, the tester places the high-power semiconductor to be tested in the fixed detection groove 226. The driving motor 241 drives the driving rotating shaft 242 to rotate. The driving rotating shaft 242 is movably connected to the mounting plate through a bearing. The driving rotating shaft 242 drives the driving gear 243 to rotate synchronously. The transmission cross shaft 245 meshing with the driving gear 243 rotates accordingly, thereby driving the side bevel gears 247 at both ends to rotate synchronously. The positive bevel gear 248 drives the transmission lead screw 223 to rotate, moving the movable plate 222 downward to closely contact the fixed plate 221, fixing the high-power semiconductor in the fixed plate 221. The transmission is stable, converting the horizontal rotation into synchronous vertical rotation on both sides, improving the transmission stability, reducing the driving cost, and improving the fixing effect.

[0047] In order to better demonstrate the test process of a high-power semiconductor test device, this embodiment proposes a test method for a high-power semiconductor test device, including the following steps:

[0048] Step 1: Place the high-power semiconductor in the fixed plate 221 respectively. The movable plate driving mechanism 24 drives the movable plate 222 to move downward to fix the high-power semiconductor. The driving cylinder 33 drives the detection plate 36 to move downward to test the high-power semiconductor respectively, improving the transmission stability, reducing the driving cost, and enhancing the fixing effect.

[0049] Step 2: The flipping cylinder 212 drives the short sliding bar 214 to slide. The limiting block 231 fixes the rotating shaft 227 on one side of the fixed plate 221. The flipping cylinder 212 drives the long sliding bar 215 to slide, driving the fixed plate 221 to perform a circular motion with the rotating shaft 227 as the center of the circle for flipping, avoiding the situation of missing flipping or less flipping caused by manual flipping, reducing the test time, and improving the test efficiency.

[0050] Step 3: The driving cylinder 33 slides on the sliding base 31 to the other side to test the other side of the high-power semiconductor, effectively improving the service life of the detection needle, reducing the number of wear times, lowering the test cost, and bringing good economic benefits to the enterprise.

[0051] As described above, it is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present invention.

Claims

1. A high-power semiconductor testing device, comprising a testing base (1), a fixed turning mechanism (2) and a testing mechanism (3), characterized in that: On one side of the upper surface of the test base (1), a fixed flipping mechanism (2) is installed. On one side of the fixed flipping mechanism (2), a test mechanism (3) is arranged. The fixed flipping mechanism (2) is composed of a flipping driving device (21), a flipping fixing device (22), and a limiting device (23). The flipping driving device (21) and the limiting device (23) are symmetrically arranged on both sides of the flipping fixing device (22) respectively. The limiting device (23) is arranged on the side close to the flipping fixing device (22). The flipping driving device (21) is fixedly connected to the test base (1). The flipping driving device (21) includes a driving base (211), a flipping cylinder (212), and a driving rack (213). The lower surface of the driving base (211) is fixedly connected to the upper surface of the test base (1) by bolts. The flipping cylinder (212) is fixedly connected to one end of the driving base (211) by bolts. The upper surface of the driving base (211) is slidably connected to a short sliding bar (214). A chute adapted to the short sliding bar (214) is arranged on the upper surface of the driving base (211). The upper surface of the short sliding bar (214) is slidably connected to a long sliding bar (215). One side of the upper surface of the long sliding bar (215) is fixedly connected to a connecting block (216) by bolts. The upper surface of the connecting block (216) is fixedly connected to the lower surface of the driving rack (213). The flipping fixing device (22) includes a fixing plate (221), a movable plate (222), and a transmission screw rod (223). Lower fixing lugs (224) are respectively installed at both ends of the fixing plate (221). Upper fixing lugs (225) are respectively installed at both ends of the movable plate (222). The lower fixing lugs (224) are fixedly connected to the lower end of the transmission screw rod (223) through bearings. The upper fixing lugs (225) are rotatably connected to a transmission sleeve through bearings. The transmission sleeve is nested with the transmission screw rod (223). The upper end of the transmission screw rod (223) is provided with an external thread, and the inner wall of the transmission sleeve is provided with an internal thread adapted to the transmission screw rod (223). Uniformly distributed fixing detection grooves (226) are respectively arranged on the surfaces of the fixing plate (221) and the movable plate (222). The fixing detection grooves (226) are symmetrically arranged on the fixing plate (221) and the movable plate (222) respectively.

2. The high-power semiconductor testing device according to claim 1, wherein: The test mechanism (3) includes a sliding base (31), a translation slider (32), a driving cylinder (33), and a detection body (34). The lower surface of the sliding base (31) is fixedly connected to the upper surface of the test base (1) by bolts respectively. A translation chute is arranged on the upper surface of the sliding base (31). The sliding base (31) is slidably connected to the translation slider (32) through the translation chute. The upper surface of the translation slider (32) is fixedly connected to the driving cylinder (33) by bolts. The upper surface of the driving cylinder (33) is fixedly connected to a support rod (35) through a cylinder rod. One end of the support rod (35) is fixedly connected to the detection body (34).

3. The high-power semiconductor testing device according to claim 2, characterized in that: A detection plate (36) is installed on the lower surface of the detection body (34). Uniformly distributed detection needles are respectively arranged on the lower surface of the detection plate (36). The detection needles are electrically connected to the detection body (34) through wires respectively.

4. A high-power semiconductor testing device according to claim 1, characterized in that: The lower surface of the fixed plate (221) is fixedly connected to the movable plate driving mechanism (24) by bolts. Both ends of the fixed plate (221) are respectively fixedly connected to the turning shafts (227). Both ends of the turning shafts (227) are respectively rotatably connected to the transmission gears (228) through pin shafts. The transmission gears (228) are engaged with the driving racks (213). Both ends of the fixed plate (221) are respectively provided with receiving seats (229). The upper ends of the receiving seats (229) are provided with load-bearing grooves, and the turning shafts (227) are respectively in contact with the surfaces of the load-bearing grooves.

5. The high-power semiconductor testing device according to claim 4, characterized in that: The limiting device (23) includes a limiting block (231), a first connecting rod (232), a second connecting rod (233) and a fixed connecting plate (234). Both ends of the first connecting rod (232) are respectively fixedly connected to the limiting block (231). The limiting blocks (231) are symmetrically arranged on both sides of the fixed plate (221). The limiting blocks (231) are in the shape of "7", and the lower surfaces of the upper ends are in contact with the upper sides of both ends of the turning shaft (227). The lower surface of the limiting block (231) is fixedly connected to the positioning column (235). A fixed sleeve (236) is sleeved on the center of the second connecting rod (233). One side of the fixed sleeve (236) is fixedly connected to the fixed connecting plate (234). One end of the fixed connecting plate (234) is fixedly connected to one side of the short sliding bar (214). Both ends of the second connecting rod (233) are respectively fixedly connected to the positioning column (235).

6. The high-power semiconductor testing device according to claim 4, wherein: The upper surface of the driving rack (213) is distributed with evenly spaced tooth groove sections (217). The spacing distance of the tooth groove sections (217) is the same as the spacing distance of the turning shafts (227). The tooth groove sections (217) are respectively engaged with the transmission gears (228) through the tooth grooves.

7. The high-power semiconductor testing device according to claim 4, wherein: The movable plate driving mechanism (24) includes a driving motor (241), a driving rotating shaft (242) and a driving gear (243). The driving motor (241) is fixedly connected to the lower surface of one side of the fixed plate (221) through a motor fixing plate (244). The driving motor (241) is fixedly connected to the driving rotating shaft (242) through a motor shaft. One end of the driving rotating shaft (242) is fixedly connected to the driving gear (243). The upper surface of the driving gear (243) is in contact with the transmission cross shaft (245) through a tooth groove. A spiral blade (246) engaged with the driving gear (243) is arranged at the center of the transmission cross shaft (245). Side bevel gears (247) are respectively fixed at both ends of the transmission cross shaft (245). The side bevel gears (247) are respectively engaged with the positive bevel gears (248). The positive bevel gears (248) are fixedly connected to the lower surface of the transmission lead screw (223). Installation plates for installing the driving rotating shaft (242) and the transmission cross shaft (245) are respectively arranged on the lower surface of the fixed plate (221).

8. A testing method for a high-power semiconductor testing device as described in claim 5, characterized in that: It includes the following steps: Step 1: Place high-power semiconductors in the fixed plate (221) respectively. The movable plate driving mechanism (24) drives the movable plate (222) to move downward to fix the high-power semiconductors. The driving cylinder (33) drives the detection plate (36) to move downward to test the high-power semiconductors respectively. Step 2: The flipping cylinder (212) drives the short sliding bar (214) to slide. The limiting block (231) fixes the flipping shaft (227) on one side of the fixed plate (221). The flipping cylinder (212) drives the long sliding bar (215) to slide, driving the fixed plate (221) to make a circular motion with the flipping shaft (227) as the center of the circle for flipping. Step 3: The driving cylinder (33) slides on the sliding base (31) to the other side to test the other side of the high-power semiconductor.

Images