Mold tool, handling device, and method of manufacturing an array of elements

Abstract

The present invention provides a press tool for a handling head, which is easy to share, a handling device that easily picks up and handles a handling target component disposed on the surface of a substrate without leaving the press tool on the substrate side, and a manufacturing method for a component array using the same. The press tool (10) has a press layer (12) that is detachably adhered to a component (32r) as a handling target component, a support plate (14) to which the press layer (12) is fixed, and a conversion plate (16) having a mounting surface (16a) on which the support plate (14) is detachably mounted, and on which a handling head (22) is detachably mounted.

Description

TECHNICAL FIELD

[0001] The present application relates to a press mold tool, a carrying device, and a manufacturing method of an element array. BACKGROUND

[0002] In the carrying of extremely small components, a carrying tool in the shape of a press mold having a plurality of convex portions on the surface (a press mold tool) is under consideration. In the following Patent Literature 1, an example of this press mold-shaped carrying tool is disclosed. In the prior art, a press mold tool for making detachment of a carrying object by the coefficient of thermal expansion possible is disclosed.

[0003] An example of an extremely small component assumed as a carrying object of the press mold tool is an LED element called a small LED or a micro LED. The so-called small LED or micro LED is extremely small in that the width is 1 to 8 μm, the length is 5 to 10 μm, and the height is 0.5 to 3 μm, as compared with a general LED element of the prior art.

[0004] In the prior art, there is also disclosed a case where, from a wafer on which a plurality of such LED elements are arranged, the elements are picked up and carried toward a substrate corresponding to a display, thereby manufacturing an LED display, but wafers on which LED elements are arranged are various depending on the wafer manufacturer or the use.

[0005] When the LED elements are carried toward the substrate, sometimes it is performed while replacing wafers of different specifications, in which case, a press mold tool corresponding to each wafer must be used. The press mold tool is replaceably mounted to the front end of a head (carrying head) having a suction mechanism in general. In addition, for each press mold tool of a plurality of kinds, a plurality of kinds of carrying heads must also be prepared, and the carrying device becomes complicated.

[0006] The adhesive convex portions formed on the surface of the press mold tool mounted to the carrying head are brought into contact with the LED on the wafer, thereby being transferred to the press mold. At this time, when the press mold tool comes into contact with the wafer surface on which the LED is fixed, the adhesion force to the press mold tool by the wafer surface is smaller than the suction force to the press mold tool by the carrying head, and thus, there is a risk that the press mold tool is detached from the carrying head.

[0007] Especially, when the size of the component becomes smaller as a carrying object, in correspondence thereto, the size of the convex portions of the press mold tool also becomes smaller, and thus, the possibility that the flat surface other than the convex portions comes into contact with the wafer surface increases. When the contact with the flat surface of the press mold tool occurs, the contact area increases, and thus, an undesirable adhesion force acts on the press mold tool, thereby causing a technical problem that the press mold tool is adhered to the substrate side such as the wafer and becomes unable to be peeled off.

[0008] Prior Art Documents

[0009] Patent Literature

[0010] Patent Literature 1: US 2017 / 0173852 A1 SUMMARY

[0011] PROBLEMS TO BE SOLVED BY THE INVENTION

[0012] The present invention has been achieved in view of such circumstances, and has an object to provide a press tool in which a handling head is easily commonized, a handling device in which a handling target element arranged on a surface of a substrate is easily picked up from the substrate and handled without leaving the press tool on the substrate side, and a manufacturing method of an element array using them.

[0013] MEANS FOR SOLVING THE PROBLEMS

[0014] To achieve the above object, the press tool of the present invention has:

[0015] a press layer having a portion to which a handling target element is detachably adhered;

[0016] a support plate in which the press layer is fixed; and

[0017] an adapter plate having a mounting surface on which the support plate is detachably mounted, and on which a handling head is detachably mounted.

[0018] In the press tool of the present invention, the support plate in which the press layer is fixed is replaced from the adapter plate without replacing the entire press tool. Therefore, it is easy to prepare press tools having different kinds of press layers at low cost. In addition, even if the size of the press layer or the size of the support plate is changed, it becomes easy to unify the size of the adapter plate, and the handling head or the setting stage becomes easy to be commonized. In addition, since the press layer is fixed to the support plate, it is easy to ensure the flatness of the press surface of the press layer.

[0019] It is preferable that the support plate is detachably mounted to the adapter plate by an adhesive layer. By using the adhesive layer, it is easy to detachably mount the support plate to the adapter plate, and it is easy to ensure the flatness of the support plate, that is, the flatness of the press surface of the press layer.

[0020] It is preferable that the handling target element is a plurality of elements formed on a surface of a substrate, and a plurality of convex portions corresponding to the elements are formed in the press layer, and the elements are detachably adhered to the convex portions. By being thus configured, it is easy to simultaneously take out the plurality of elements as the plurality of handling target elements from the substrate, and to transfer or mount.

[0021] It is preferable that the support plate be a glass plate or a ceramic plate having a flat surface. By so configuring, it is easy to ensure the flatness of the support plate, i.e., the flatness of the molding surface of the molding layer. In particular, by configuring the support plate of a glass plate, it becomes easy to form the adsorbable surface around the molding layer.

[0022] It is preferable that a tapered surface having an outer diameter that decreases toward the support plate be formed on the side surface of the adapter plate. The claw portion of the clamp mechanism (also referred to as a chuck mechanism) is detachably engaged with the tapered surface formed on the side surface of the adapter plate. In addition, the mounting force of the molding tool of the transfer head by the clamp mechanism can be increased. Furthermore, the positioning of the molding tool along the inclined surface of the guide member provided on the upper portion of the setting stand for the molding tool becomes easy.

[0023] It is preferable that the maximum width of the adapter plate be greater than the width of the support plate. By so configuring, the inclined surface of the guide member and the tapered surface of the molding tool become easy to engage.

[0024] It is preferable that an insertable surface facing the tapered surface of the adapter plate be present on the surface of the support plate on the adapter plate side. By the presence of the insertable surface on the support plate of the molding tool, the claw portion of the clamp mechanism becomes easy to be detachably engaged with the tapered surface of the adapter plate.

[0025] It is preferable that an adsorbable surface be formed on the surface of the support plate on the molding layer side around the molding layer. By the presence of the adsorbable surface on the support plate of the molding tool, it becomes easy to seal and hold the molding layer inside the accommodation recess with the top surface of the setting stand for the molding tool adsorbing the support plate. The molding layer inside the accommodation recess is held cleanly.

[0026] A spacer plate for adjusting the parallelism (flatness) of the support plate can be interposed between the molding layer and the adapter plate. By so configuring, the flatness of the support plate can be improved, and the flatness of the molding surface can also be improved.

[0027] The manufacturing method of the element array of the present application has a step of simultaneously extracting and transferring a plurality of transfer target elements from a substrate using any one of the above-described molding tools. In the manufacturing method of the element array of the present application, an element array having a plurality of elements can be easily manufactured.

[0028] In addition, in order to achieve the above object, the transfer device of the present application has:

[0029] a molding tool; and

[0030] a transfer head that detachably transfers the molding tool,

[0031] the molding tool has:

[0032] a mold layer that can adhere the handling target component arranged on the substrate with a predetermined adhesion force (F2) with a predetermined fixing force (Fl), and

[0033] a conversion board having a mounting surface on which the mold layer is supported and on which the handling head is detachably mounted,

[0034] the mounting force (F3) of the handling head to the mounting surface of the conversion board is greater than the fixing force,

[0035] the adhesion force (F2) of the mold layer to the handling target component is greater than the fixing force (Fl).

[0036] In the handling apparatus of the present application, the mounting force (F3) of the handling head to the mounting surface of the conversion board is greater than the fixing force, and the adhesion force (F2) of the mold layer to the handling target component is greater than the fixing force (Fl). Therefore, the handling target component arranged on the surface of the substrate can be easily picked up and handled from the substrate without leaving the mold tool on the substrate side.

[0037] Preferably, the mounting force (F3) of the handling head to the mounting surface of the conversion board includes a main mounting force (F3a) by a main mounting means and a sub mounting force (F3b) by a sub mounting means other than the main mounting means. Preferably, the main mounting means includes a vacuum suction hole formed in the handling head. In a general handling head having a vacuum suction hole, it is easy to make the mounting force (F3) of the handling head to the mounting surface of the conversion board greater than the fixing force (Fl) of the handling target component to the substrate by providing the sub mounting means.

[0038] Preferably, the sub mounting means includes at least any one of a gripper mechanism (also referred to as a chuck mechanism), an electrostatic chucking mechanism, a fitting mechanism, and a screwing mechanism that detachably mounts the conversion board to the handling head. By providing these mechanisms to the handling head, it is easy to make the mounting force (F3) of the handling head to the mounting surface of the conversion board greater than the fixing force (Fl) of the handling target component to the substrate.

[0039] Preferably, a tapered surface whose outer diameter becomes smaller toward the mold layer is formed on a side surface of the conversion board. In addition, a claw portion of the gripper mechanism of the sub mounting means can be engaged with the tapered surface formed on the side surface of the conversion board. By so configuring, the claw portion of the gripper mechanism becomes easy to detachably engage with the tapered surface of the side surface of the conversion board. In addition, the mounting force (F3) of the mold tool of the handling head by the gripper mechanism can be improved.

[0040] The mold tool also has a support plate on which the mold layer is fixed, and on which the adapter plate is replaceably mounted. With this configuration, the support plate on which the mold layer is fixed can be replaced from the adapter plate without replacing the entire mold tool. Therefore, it becomes easy to prepare a mold tool having different kinds of mold layers at low cost.

[0041] Preferably, the support plate is replaceably mounted on the adapter plate by an adhesive layer. The adhesive force of the adhesive layer is preferably greater than the fixing force (Fl) of the elements on the substrate.

[0042] The elements on the substrate can also be a plurality of elements formed on the surface of the substrate. Preferably, a plurality of convex portions corresponding to the elements are formed in the mold layer, and the elements are replaceably attached to the convex portions. With this configuration, a plurality of elements as a plurality of elements on the substrate can be simultaneously extracted.

[0043] The element array manufacturing method of the present application has a step of simultaneously extracting and transporting a plurality of elements as a plurality of elements on the substrate using any one of the above-described transport devices. In the element array manufacturing method of the present application, an element array having a plurality of elements can be easily manufactured. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1A is a schematic front view and an enlarged view of an important part of a mold tool of a transport device for one embodiment of the present application.

[0045] Figure 1B is a schematic front view of a mold tool of another embodiment of the present application.

[0046] Figure 1C is a schematic plan view of a mold tool of Figure 1B a modification example.

[0047] Figure 1D is a sectional view of the mold tool along ID-ID shown in Figure 1C .

[0048] Figure 1E is a sectional view of the mold tool along IE-IE shown in Figure 1C .

[0049] Figure 2A is a schematic view of a transport device including a transport head replaceably transporting Figure 1A the mold tool shown in .

[0050] Figure 2B is a schematic view of a transport device showing a state in which the transport head shown in Figure 2A grasps the mold tool.

[0051] Figure 3A This is a schematic diagram showing the transport device in a state before picking up a component from a semiconductor substrate.

[0052] Figure 3B It means self Figure 3A The state shown is a schematic diagram of a transport device in which a stamping layer of a stamping tool is pressed against a component on a semiconductor substrate.

[0053] Figure 3C This is a schematic diagram showing a transport device in a state after picking up a component from a semiconductor substrate.

[0054] Figure 4A This is a partial schematic diagram showing details of a claw portion of a clamp mechanism used in a transport device according to another embodiment of the present invention.

[0055] Figure 4B This is a partial schematic diagram showing details of a claw portion of a clamp mechanism used in a transport device according to another embodiment of the present invention.

[0056] Figure 5A This is a schematic cross-sectional view of a device formed on a semiconductor substrate.

[0057] Figure 5B This is a schematic cross-sectional view showing a state in which a component on a semiconductor substrate is picked up by a pressing tool of a transport device.

[0058] Figure 5C This is a schematic cross-sectional view showing a state in which a component on a semiconductor substrate is picked up by a pressing tool of a transport device and then arranged on a first transfer substrate (sheet).

[0059] Figure 5D This is a schematic cross-sectional view showing a state in which an element array arranged on a first transfer substrate (sheet) is transferred to a second transfer substrate (sheet).

[0060] Figure 5E This is a schematic cross-sectional view showing a state before the element array arranged on the second transfer substrate (sheet) is transferred to the mounting substrate (sheet).

[0061] Figure 5F This is a schematic cross-sectional view showing a state in which the element array arranged on the second transfer substrate (sheet) is transferred to the mounting substrate (sheet).

[0062] Figure 6 Is set with Figure 1A A schematic perspective view of the die mounting platform of the die tool shown.

[0063] Figure 7 It is along Figure 6A schematic cross-sectional view of the stamper mounting table taken along line VII-VII is shown. DETAILED DESCRIPTION

[0064] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0065] First embodiment

[0066] like Figure 2A As shown in FIG. 2 , the transport device 20 of this embodiment includes a die tool 10 and a transport head 22. Figure 1A As shown, the stamping tool 10 has a stamping layer 12 , a support plate 14 , and an adapter plate 16 .

[0067] The stamper layer 12 has projections 11 projecting downward along the Z axis in a matrix at predetermined intervals in the X-axis and Y-axis directions. The width x1 of the projections 11 in the X-axis direction and the interval x2 between adjacent projections 11 in the X-axis direction are determined by the size of the substrate to be mounted, for example, Figure 5F The X-axis direction width x3 and the X-axis direction interval x4 of the red light emitting element (an example of the conveyed element) 32r on the surface of the mounting substrate (the substrate may also be a sheet / the same applies hereinafter) 70 shown are determined.

[0068] In addition, although Figure 1A Although not shown, the same applies to the Y-axis width of the projections 11 and the Y-axis spacing between adjacent projections 11. The projections 11 are arranged in a matrix on the lower surface of the stamper layer 12. The number of projections 11 is not particularly limited, but is between 10 and several hundred thousand.

[0069] In this embodiment, in the accompanying drawings, the X-axis (first axis), the Y-axis (second axis) and the Z-axis (third axis) are approximately perpendicular to each other, the X-axis and the Y-axis are parallel in the planar direction of the stamper layer 12, and the Z-axis is parallel in the direction in which the protrusion 11 protrudes.

[0070] like Figure 1A As shown, the protrusion height z1 of the convex portion 11 of the stamping layer 12 is Figure 5B The thickness z3 of the stamper layer 12 in the Z-axis direction is determined by the relationship between the Z-axis height z2 of the element 32r shown, and is preferably 1 to 8 times the Z-axis height z2. The Z-axis thickness z3 of the stamper layer 12 is not particularly limited, but is preferably approximately 0.25 times or greater than the protrusion height z1 of the protrusion 11. Furthermore, the X-axis width x3 of the element 32r (and the Y-axis width are also comparable) is, for example, 1 to 150 μm, and its height z2 is, for example, 1 to 150 μm.

[0071] The stamping layer 12 and the protrusion 11 may be made of different materials if they are strongly bonded, but they may also be made of the same material. By making them of the same material, the risk of the protrusion 11 peeling off from the stamping layer 12 is reduced. At least the protrusion 11 is made of a material having adhesiveness, so that it can be placed on the stamping layer 12 with a predetermined fixing force F1. Figure 5B Component 32r is attached to component-forming substrate 30 with a predetermined adhesion force F2. The material and shape of protrusion 11 are determined so that the adhesion force F2 of protrusion 11 on component 32r is greater than the fixing force F1 of component 32r on substrate 30 when the lower end of protrusion 11 is pressed against the upper surface of component 32r with a predetermined force.

[0072] The material of the protrusions 11 is not particularly limited; however, examples thereof include viscoelastic elastomers such as polydimethylsiloxane (PDMS), organosilicon compounds, and polyether rubber. The stamping layer 12 may also be made of the same material as the protrusions 11; however, the surface of the stamping layer 12 other than the protrusions 11 is preferably non-adhesive. Preferably, the component 32r is not picked up by adhesive force other than the protrusions 11.

[0073] like Figure 1A As shown, the die layer 12 is fixed to a support plate 14. The support plate 14 is made of a material that is more rigid than the die layer 12 and has excellent flatness, and is preferably made of a glass plate, a metal plate, a ceramic plate, etc. The thickness of the support plate 14 is not particularly limited, but is preferably at least 0.5 mm.

[0074] The die layer 12 can also be formed directly on the surface of the support plate 14, or fixed by an adhesive layer. Figure 5B The adhesion force F2 shown is greater than the adhesion force, and is fixed to the surface of the support plate 14. Since the element 32r is peeled off from the protrusion 11 in the subsequent process, it is placed on, for example Figure 5C The first transfer substrate (sheet) 50 is shown, so it is important that the stamper layer 12 does not peel off from the support plate 14 at this time.

[0075] like Figure 1A As shown, the support plate 14 is detachably fixed to the adhesive surface 16b of the adapter plate 16 via the adhesive layer 15 on the surface opposite to the die layer 12. The adhesive strength between the support plate 14 and the adapter plate 16 via the adhesive layer 15 is greater than Figure 5B However, when the stamping layer 12 is replaced after repeated use, the adhesive surface 16b of the transfer plate 16 is removed and the support plate 14 is removed. The adhesive layer 15 can also be composed of a double-sided tape or the like.

[0076] The X-axis direction width and the Y-axis direction width of the support plate 14 are larger than those of the stamper layer 14, and are preferably larger than the X-axis direction width and the Y-axis direction width of the bonding surface 16b of the adapter plate 16. On the surface of the support plate 14 on the stamper layer side, a flat adsorbable surface 14b not provided with the stamper layer 12 is formed around the stamper layer 12. In the present embodiment, the stamper layer 12 is rectangular as viewed in the Z-axis direction, but the support plate 14 can also be rectangular or circular. The adsorbable surface 14b is detachably mounted to the stamper layer 12 by the chuck mechanism 26 described later. Figure 7 The top surface of the setting table 82 is shown.

[0077] The upper surface of the adapter plate 16 on the opposite side of the bonding surface 16b is a flat mounting surface 16a, and the area of the mounting surface 16a is made larger than that of the bonding surface 16b by being tapered on at least both sides in the X-axis direction of the adapter plate 16. That is, the tapered surface 16c in which the outer diameter is made smaller toward the stamper layer 12 is formed on at least the side surfaces in the X-axis direction of the adapter plate 16. The tapered surface 16c can also be formed on both side surfaces in the Y-axis direction of the adapter plate 16, or can be formed along the entire side surfaces of the adapter plate 16.

[0078] In the present embodiment, the tapered surface 16c is formed on both side surfaces in the Y-axis direction of the adapter plate 16, and is formed along the entire side surfaces of the adapter plate 16. In the present embodiment, the adapter plate 16 is rectangular as viewed in the Z-axis direction, and the maximum width in at least the X-axis direction of the adapter plate 16 is preferably larger than the X-axis direction width of the support plate 14. Further, as shown in Figure 7 the Y-axis direction width of the adapter plate 16 can be substantially the same as the Y-axis direction width of the support plate 14, or can be larger or smaller.

[0079] In Figure 1A the surface of the support plate 14 on the opposite side of the adsorbable surface 14b, a flat insertable surface 14c facing the tapered surface 16c is formed around the bonding surface 16b of the adapter plate 16. On the insertable surfaces 14c on both sides in the X-axis direction, Figure 2B the claw portions 26a of the chuck mechanism 26 are engaged with the tapered surfaces 16c of the adapter plate 16, respectively. Further, Figure 6 the inclined surfaces 89 of the guide members 88 of the setting table 82 are engaged with the tapered surfaces 16c of the adapter plate 16 on both sides in the X-axis direction, respectively.

[0080] Figure 1AThe thickness of the adapter plate 16 in the Z-axis direction is greater than the thickness of the support plate 14, and is preferably 1.2 times or more, and more preferably 2 to 6 times or so, the thickness of the support plate 14. In addition, a chamfered portion or an R portion is formed in the outer peripheral edge portion of the mounting surface 16a, which is the upper surface of the adapter plate 16. Furthermore, a chamfered portion or an R portion is preferably formed in the outer peripheral edge portion of the mounting surface 16a, which is the upper surface of the adapter plate 16.

[0081] The edge portion 16d of the adapter plate 16 on both sides in the Y-axis direction abuts against Figure 6 and Figure 7 The front end surface 92 of the pair of positioning members 90 shown abuts against the Y-axis direction position of the molding tool 10 on which the setting table 82 is placed. The X-axis direction position of the molding tool 10 is positioned by the inclined surface 89 of the guide member 88 shown and the claw portion 26b of the gripper mechanism 26 of the conveyance device 20 shown. Figure 6 Figure 2B

[0082] Figure 2A The suction surface 24 of the conveyance head 22 of the conveyance device 20 shown is configured to be able to be suctioned to the mounting surface 16a, which is the upper surface of the adapter plate 16. The vacuum suction hole, which is the main mounting means, is formed in the suction surface 24 of the conveyance head 22. By generating a negative pressure in the vacuum suction hole, the mounting surface 16a of the adapter plate 16 of the molding tool 10 is vacuum-suctioned to the suction surface 24. The vacuum-suctioning force of the mounting surface 16a of the adapter plate 16 of the molding tool 10 by the suction surface 24 is temporarily regarded as the main mounting force F3a.

[0083] In the present embodiment, the chuck mechanism 26 is mounted to the conveyance head 22 via the opening and closing mechanism 28. The claw portion 26a is formed inside the chuck mechanism 26. The chuck mechanism 26 including the claw portion 26a is moved in the X-axis direction by, for example, the opening and closing mechanism 28, and as shown in Figure 2A the claw portion 26a opens the entire lower surface of the suction surface 24, or as shown in Figure 2B the claw portion 26a is positioned below both sides in the X-axis direction of the suction surface 24.

[0084] A tapered engagement surface 26b is formed in each claw portion 26a. The tapered surface of the engagement surface 26b matches the shape of the tapered surface 16c of the adapter plate 16 of the molding tool 10, and is configured to be able to be engaged with the tapered surface 16c. As shown in Figure 2A-2B ​​As shown, before the mounting surface 16a of the adapter plate 16 is sucked by the suction surface 24 of the transport head 22, the collet mechanism 26 is moved by the opening and closing mechanism 28 in a direction in which the claw portion 26a is opened. After the mounting surface 16a of the adapter plate 16 is sucked by the suction surface 24 of the transport head 22, the collet mechanism 26 is moved by the opening and closing mechanism 28 in a direction in which the claw portion 26a is closed, and the engagement surface 26b is engaged to the tapered surface 16c.

[0085] As a result, the mold tool 10 is mounted to the transport head 22 by the mounting force F3 which is the sum of the main mounting force F3a by the vacuum suction hole as the main mounting means of the transport head 22 and the sub mounting force F3b by the collet mechanism 26 as the sub mounting means. With the miniaturization of the transport head 22 and the like, it is difficult to make the main mounting force F3 by the vacuum suction hole of the transport head 22 alone greater than the fixing force Fl. Figure 5B As shown, the tendency of the fixing force Fl. In the present embodiment, the sub mounting force F3b by the collet mechanism 26 as the sub mounting means is added to the main mounting force F3a, whereby the total mounting force F3 (= F3a + F3b) is reliably greater than the fixing force Fl.

[0086] Next, a manufacturing method of a display element array using the transport apparatus 20 having the mold tool 10 of the present embodiment will be described.

[0087] First, Figure 2A As shown, the transport apparatus 20 is configured to Figure 6 As shown, the mold tool 10 is set on the setting stand 82. In the present embodiment, the mold tool can be prepared at least three, for example, R, G, and B which are three primary colors of light, and each of the mold tools is preferably set on each of the setting stands 82. Alternatively, the setting stand 82 is replaced with respect to the base 80 for each of the mold tools 10 for R, G, and B.

[0088] In the following description, one setting stand 82 will be described. As Figure 6 and Figure 7 As shown, the block-shaped setting stand 82 is detachably set on the base 80 using a bolt or the like. As Figure 7 As shown, in the upper portion in the Z-axis direction of the setting stand 82, a receiving recess 86 and a top surface 84 surrounding the receiving recess 86 are formed. The receiving recess 86 is formed by, for example, a counterbore molding of the central portion of the upper surface of the square prism-shaped setting stand 82. As Figure 7 As shown, the mold layer 12 of the mold tool 10 is made to enter the receiving recess 86 completely.

[0089] Furthermore, suction holes 85 are formed at multiple locations along the circumference of the top surface 84 formed around the accommodating recess 86, allowing the absorbable surface 14b of the support plate 14 to removably absorb and hold the top surface 84. Furthermore, the accommodating recess 86 communicates with multiple gas flow holes 83 formed in the mounting table 82. By allowing the absorbable surface 14b of the support plate 14 to be absorbed by the top surface 84, the accommodating recess 86 can be sealed except for the gas flow holes 83. Purified gas flows into the accommodating space 86 through the gas flow holes 83, thereby discharging impurities and contaminants adhering to the stamper layer 12 to the outside.

[0090] Two guide members 88 are detachably mounted on one side of the mounting table 82 above both side surfaces substantially perpendicular to the X-axis using bolts, etc. An inclined surface 89 is formed on the upper side of the inner surface of the guide member 88 . Figure 1A The tapered surface 16c of the adapter plate 16 shown in FIG. 1 is in contact with each inclined surface 89, and the tapered surface 16c of the adapter plate 16 facing the X-axis direction slides along each inclined surface 89. Therefore, the adapter plate 16 of the die tool 10 slides on the inclined surface 89 while falling onto the mounting table 82. Figure 7 As shown, the stamper layer 12 is housed in the housing recess 86. In addition, the stamper tool 10 is roughly aligned with respect to the mounting table 82 in the X-axis direction.

[0091] like Figure 6 As shown, the four guide members 88 are mounted on the mounting table 82 so as to be located further inward than the two edges 16d in the Y-axis direction of the adapter plate 16 of the die tool 10. Positioning members 90 in the Y-axis direction are disposed on both sides of the mounting table 82 so as to be movable in the Y-axis direction. The positioning members 90 are each formed with a front end surface 92 that faces each other along the Y-axis. Figure 7 As shown, the front end surface 92 can abut against the Y-axis edge 16d of the adapter plate 16. By abutting against the Y-axis edge 16d of the adapter plate 16, the press tool 10 is positioned relative to the mounting table 82 in the Y-axis direction.

[0092] Next, we will explain how to use Figure 2A The transport device 20 shown in FIG. Figure 6 and Figure 7 The method of setting up the mounting table 82 to pick up the stamper tool 10 is shown.

[0093] First, the positioning member 90 is used to position the die tool 10 in the Y-axis direction on the mounting table 82. Then, the mounting table 82 is moved together with the base 80 to be positioned at the position Figure 2AThe transport head 22 of the transport device 20 shown in FIG. 8 is shown in FIG. 8 . In addition, the transport head 22 may be moved without moving the mounting table 82, or both may be moved. The transport head 22 may also be rotated around the Z axis as needed.

[0094] After the die tool 10 on the mounting table 82 is positioned below the Z axis of the transport head 22, the transport head 22 is moved below the Z axis so that the lower end of the transport head 22 contacts the mounting surface 16a of the adapter plate 16 and vacuum adsorption by the transport head 22 is started. Figure 2A-2B As shown, the clamp mechanism 26 is closed, so that the engaging surfaces 26 b of the claw portion 26 a are engaged with the tapered surfaces 16 c of the adapter plate 16 located on both sides in the X-axis direction.

[0095] Afterwards, Figure 7 The pair of positioning members 90 shown in FIG. 1 are opened in the Y-axis direction, releasing the contact between the front end face 92 and the edge 16d of the adapter plate 16. Before and after this, the suction of the support plate 14 toward the top surface 84 of the mounting table through the suction holes 85 of the mounting table 82 is released. Afterwards, if the transport head 22 is moved to the upper side of the Z-axis, as shown in FIG. Figure 2B As shown, the pressing tool 10 is positioned in the X-axis and the Y-axis at the lower end of the transfer head 22 , and is held in a state where the horizontality of the pressing tool 10 is maintained.

[0096] like Figure 2B As shown, when the die tool 10 is mounted on the transport head 22, the transport device 20 is relatively moved in the X-axis and Y-axis directions, as shown in FIG. Figure 3A As shown, it is located on the element 32r formed on the surface of the element forming substrate 30 placed on the installation table 40. Figure 5A As shown, a red light-emitting element 32r, a green light-emitting element 32g, or a blue light-emitting element 32b is embedded on the surface of an element-forming substrate 30. The substrate 30 varies depending on the type of element (blue light-emitting element, red light-emitting element, green light-emitting element, etc.), but for example, a sapphire substrate, a glass substrate, a GaAs substrate, or a SiC substrate can be used.

[0097] In this embodiment, the components 32r, 32g, and 32b are, for example, micro LED components. In the following description, only the component 32r is described, but the same operation is performed on the other components 32g and 32b using separate die tools 10. The die tools 10 are preferably prepared for each type of component 32r, 32g, and 32b, but the conveying head 22 can be used in common. The die tool 10 in the standby state is set, for example, Figure 6 and Figure 7On the mounting table 82 shown, the stamper layer 12 is sealed inside the accommodation recess 86 and is maintained in a clean state.

[0098] like Figure 3A-3B As shown, the transport device 20 is moved downward in the Z-axis direction, and the protrusion 11 of the die tool 10 is pressed against the upper surface of the component 32r of the substrate 30. As a result, the component 32r adheres to the protrusion 11. Figure 3C As shown in FIG. 1 , the die tool 10 and the transport device 20 are lifted up to the upper side in the Z-axis direction. Figure 5B As shown, components 32r are attached to each protrusion 11, and the protrusion 11 and the components 32r are picked up from the substrate 30. The components 32r remaining on the substrate 30 are then picked up by the stamper layer 10 of the transport device 20 in the same manner.

[0099] Next, the component 32r picked up by the protrusion 11 of the stamper layer 10 is transported to, for example, Figure 5C The first transfer substrate (the substrate may also be a sheet / the same below) 50 is shown and is arranged on the adhesive layer 52. Alternatively, the component 32r picked up by the protrusion 11 of the stamper layer 10 can also be transported to, for example, a location by the transport device 20. Figure 5F The substrate 70 for mounting is shown, and thus, the substrate 70 for mounting is arranged. In this embodiment, the transfer method is used for description.

[0100] Adhere to Figure 5B The array of elements 32r of the protrusions 11 of the stamping layer 12 is transferred to the Figure 5C The adhesive layer 52 of the substrate 50 is formed of an adhesive sheet or the like. Therefore, after the components 32r adhered to the protrusions 11 of the stamping layer 12 are pressed against the surface of the adhesive layer 52, the stamping layer 12 is lifted together with the transport device 20. As a result, a plurality of components 32r are simultaneously transferred to the surface of the adhesive layer 52. In addition, before this, Figure 3C The transport device 20 shown is moved to the Figure 5C On the substrate 50 shown.

[0101] The adhesive strength of the adhesive layer 52 of the adhesive sheet formed by the substrate 50 is adjusted so that the adhesive strength of the adhesive layer 52 is greater than the adhesive strength of the protrusion 11. The adhesive layer 52 is made of an adhesive resin such as natural rubber, synthetic rubber, acrylic resin, or silicone rubber, and its thickness z4 is preferably equal to the height z2 of the element 32r (see Figure 5B ) is about 0.5 to 2.0 times. In addition, in order to make the element 32r move smoothly from the protrusion 11 to the adhesive layer 52, an operation for easily peeling the element 32r from the protrusion 11 (for example, applying heat) may be added.

[0102] Similar to the above, other elements 32g and 32b are also transferred to the adhesive layer 52 of the substrate 50. The three elements 32r, 32g, and 32b of R, G, and B constitute a pixel unit, and these pixel units are arranged in a matrix, thereby forming a color display screen.

[0103] Similarly to the above, other elements 32g and 32b are also transferred to the adhesive layer 52 of the substrate 50. The three elements 32r, 32g, and 32b of R, G, and B constitute a pixel unit, and these pixel units are arranged in a matrix, thereby forming a color display screen.

[0104] Then, if Figure 5D As shown, the entire arrangement of three components 32r, 32g, and 32b arranged on the surface of the first transfer substrate 50 is transferred to the adhesive layer 62 of the second transfer substrate 60, with the terminals of the components 32r, 32g, and 32b facing outward from the substrate 60. This transfer can be performed using a technique such as laser lift-off, transfer utilizing a difference in adhesive strength, or transfer accompanied by heat peeling. While the terminals of the components 32r, 32g, and 32b face outward from the substrate 60, a tin plating film can be formed on each terminal using a method such as electroless plating.

[0105] Then, if Figure 5E and Figure 5F As shown, the entire arrangement of the three components 32r, 32g, and 32b is transferred from the adhesive layer 62 of the substrate 60 to the mounting substrate 70. This transfer may be performed by a technique such as a laser lift-off method, or by a transfer method utilizing a difference in adhesive strength or a transfer method accompanied by heat peeling.

[0106] Furthermore, after transfer, in order to connect the terminals of the components 32r, 32g, and 32b to the electronic circuits of the mounting substrate, it is preferable to apply anisotropic conductive paste (ACP) or anisotropic conductive film (ACF) in advance on the surface of the mounting substrate 70, for example. Figure 5F As shown, after components 32r, 32g, and 32b are placed on substrate 70 via ACP or ACF, a heating and pressing device (not shown) is used to press and heat components 32r, 32g, and 32b toward substrate 70. As a result, the terminals of components 32r, 32g, and 32b can be connected to the electronic circuits of the mounting substrate.

[0107] In the conveying device 20 of this embodiment, Figure 2BThe mounting force F3 of the transport head 22 on the mounting surface 16a of the adapter plate 16 is greater than Figure 5B The fixing force F1 shown is greater than the adhesion force F2 of the protrusions 11 of the stamping layer 12 of the component 32r. Therefore, the stamping tool 10 does not remain on the substrate 30 side, and the component 32r placed on the surface of the substrate 30 can be easily picked up and transported from the substrate 30.

[0108] In addition, in this embodiment, by Figure 2B The mounting force F3 of the transport head 22 on the mounting surface 16a of the adapter plate 16 shown is the sum of the main mounting force F3a corresponding to the suction force of the vacuum suction hole and the auxiliary mounting force F3b by the clamp mechanism 26 as the auxiliary mounting means. That is, in this embodiment, by only providing the clamp mechanism 26 on the conventional transport head 22 having vacuum suction holes, the mounting force F3 on the mounting surface 16a of the adapter plate 16 by the transport head 22 is greater than Figure 5B The fixing force F1 of the illustrated element 32 r toward the substrate 30 is facilitated.

[0109] Furthermore, in this embodiment, tapered surfaces 16c are formed on both side surfaces of the adapter plate 16 in the X-axis direction, with the outer diameter decreasing toward the stamper layer 12. Furthermore, the claws 26a of the clamp mechanism 26 can engage with the tapered surfaces 16c. This configuration allows the claws 26a of the clamp mechanism 26 to easily and detachably engage with the tapered surfaces 16c on the side surfaces of the adapter plate 16. Furthermore, the force F3 of attaching the stamper tool 10 to the transfer head 22 by the clamp mechanism 26 can be increased.

[0110] In addition, tapered surfaces 16c are formed on both sides of the adapter plate 16 in the X-axis direction, the outer diameter of which decreases toward the die layer 12. Figure 6 The inclined surface 89 of the guide member 88 on the upper portion of the mounting table 82 shown in the figure makes it easier to roughly position the die tool 10 in the X-axis direction. Figure 1A As shown, the maximum width of the adapter plate 16 in the X-axis direction is larger than the width of the support plate 14 , thereby facilitating engagement between the inclined surface 89 of the guide member 88 and the tapered surface 16 c of the die tool 10 .

[0111] In addition, the support plate 14 of the die tool 10 has an insertable surface 14c, whereby the claw 26a of the clamp mechanism 26 can be easily and detachably engaged with the tapered surface 16c of the side of the adapter plate 16. In addition, the support plate 14 of the die tool 10 has an adsorbable surface 14b, whereby, as shown in FIG. Figure 7As shown, the top surface 84 of the mounting table 82 can be sucked onto the support plate 14, thereby easily sealing and retaining the stamper layer 12 within the accommodating recess 86. The suckable surface 14b can be easily formed around the stamper layer 12 by forming the support plate 14 from a glass plate or the like.

[0112] The die tool 10 further includes a support plate 14 to which the die layer 12 is fixed and to which an adapter plate 16 is replaceably mounted. This configuration allows only the support plate 14 to which the die layer 12 is fixed to be replaced from the adapter plate 16, without replacing the entire die tool 10. This makes it easy to prepare die tools 10 with different types of die layers 12 at low cost. Furthermore, by using a common adapter plate 16, there is no need to adapt the die tool to accommodate different types of transport heads, simplifying the overall structure of the transport device.

[0113] In this embodiment, a plurality of protrusions 11 corresponding to the elements 32r (32g, 32b) are formed on the stamper layer 12, and an element 32r (32g, 32b) is detachably attached to each protrusion 11. This configuration allows for simultaneous removal of multiple elements 32r (32g, 32b) from the substrate 30. The element array manufacturing method of this embodiment makes it easy to manufacture an element array having multiple elements 32r (32g, 32b).

[0114] In addition, in this embodiment, Figure 6 As shown, a mounting table 82 is replaceably mounted on the base 80. Therefore, by preparing a mounting table 82 corresponding to the die tool 10 in advance, it is possible to replace only the mounting table 82 when switching to a different type of die tool 10. The mounting table 82 maintains flatness relative to the base 80, eliminating the need to adjust the flatness of the die tool when replacing the die tool 10.

[0115] Therefore, in this embodiment, neither suction errors by the transport head 22 nor gripping errors by the clamp mechanism 26 occur, and the transport head 22 can satisfactorily pick up the stamper tool 10 from the placement table 82 .

[0116] Second embodiment

[0117] like Figure 1B As shown, in the stamping tool 10a for a transport device of this embodiment, a shim plate 18 for adjusting the parallelism of the support plate 14 is interposed between the stamping layer 12 and the adapter plate 16. An inclined surface 14a is formed on a portion of the side surface of the support plate, and the shim plate 18 engages with this inclined surface 14a to adjust the parallelism of the support plate 14. By placing the shim plate 18 between the support plate 14 and the adapter plate 16 via the adhesive layer 15, the parallelism of the support plate 14 can be adjusted.

[0118] In addition, the purpose of setting the shim plate 18 is to adjust the parallelism, so the position of setting the shim plate 18 is not limited to this. The shim plate 18 can also be set all over the periphery of the adapter plate 16, or intermittently. Figure 1C 、 Figure 1D and Figure 1E As shown, adhesive layers 15 may be provided at the four corners of the adapter plate 16, so that the spacer plate 18 is placed between the adhesive surface 16b and the support plate 14 via the adhesive layer 15 at only two locations on one side in the Y-axis direction. With this configuration, when the adapter plate 16 (or support plate 14) is rectangular, the parallelism can be finely adjusted.

[0119] That is, Figure 1C As shown, when the adapter plate 16 (or support plate 14) is rectangular, parallelism can be adjusted by placing a shim plate 18 on any of the opposite sides. Alternatively, when the adapter plate 16 (or support plate 14) is circular, parallelism can be adjusted by placing a shim plate 18 on any of the arc regions at point-symmetrical positions.

[0120] More specifically, for example Figure 1E As shown, when the thickness of the die layer 12 varies along the Y-axis direction, a spacer plate 18 can be placed in the gap between the support plate 14 and the adapter plate 16 on one side of the Y-axis direction. As a result, the mounting surface 16a and the die surface of the die layer 12 become parallel, making it possible to adjust the parallelism. Figure 1E In order to facilitate understanding of the description, the thickness and inclination of the stamper layer 12, the spacer plate 18, and the adhesive layer 15 are shown larger than the actual ones.

[0121] The other structures and effects of the transport device and the pressing tool of this embodiment are the same as those of the first embodiment, and their detailed description is omitted.

[0122] Third embodiment

[0123] like Figure 4A As shown, in the transport device of this embodiment, an elastically deformable engaging protrusion 26c is installed on the engaging surface 26b of the claw portion 26a of the chuck mechanism 26. The engaging protrusion 26c can be engaged with the tapered surface 16c of the adapter plate 16. The engaging protrusion 26c can also be made of, for example, a spring material and protrude in an arc shape from the engaging surface 26b. In addition, as shown in FIG. Figure 4B As shown, the engaging surface 26b is not necessarily a flat surface, but may be a convex curved surface that can engage with the tapered surface 16c of the adapter plate 16. The other structures and effects of the transport device and the die press tool of this embodiment are the same as those of the first embodiment or the second embodiment, and their detailed description is omitted.

[0124] Moreover, the present application is not limited to the above-described embodiments, and various changes can be made within the scope of the present application.

[0125] For example, the press tool is not limited to the press tool 10 of the above-described embodiment, and other press tools can be used. In addition, at least any one of the electrostatic chucking mechanism, the fitting mechanism, and the screwing mechanism can be provided at the transfer head 22 as a sub-mounting means other than the clamping mechanism 26. By providing these mechanisms at the transfer head, it becomes easy to make the mounting force F3 of the transfer head 22 to the mounting surface 16a of the adapter plate 16 larger than the fixing force Fl to the element 32r (32g, 32b as well) of the substrate 30.

[0126] In addition, in the above-described embodiment, the vacuum suction through the vacuum suction hole is used as the main mounting means of the transfer head 22, but in the present application, it is not necessary to use the vacuum suction, and the press tool 10 can be detachably mounted to the transfer head 22 only by the sub-mounting means such as the clamping mechanism 26.

[0127] In addition, although the transfer device 20 of the present embodiment is used to pick up the element 32r (32g, 32b) from the element-formed substrate 30, it is not limited to this use, and can be used to pick up the element 32r (32g, 32b) from a substrate (sheet) having an adhesive layer transferred from the substrate 30 by a laser lift-off method or the like.

[0128] In addition, the transfer device 20 of the present embodiment can also be used to pick up elements other than the elements 32r, 32g, 32b for red, green, and blue light emission. As other display elements, fluorescent elements and the like can be exemplified. In addition, the other elements are not limited to display elements, and can be light-receiving elements, electronic elements such as ceramic capacitors and chip inductors, or semiconductor elements.

[0129] [Explanation of Symbols]

[0130] 10... press tool

[0131] 11... protrusion

[0132] 12... press layer

[0133] 14... support plate

[0134] 14a... inclined surface

[0135] 14b... adsorbable surface

[0136] 14c... insertable surface

[0137] 15... adhesive layer

[0138] 16... adapter plate

[0139] 16a …… mounting surface

[0140] 16b …… bonding surface

[0141] 16c …… tapered surface

[0142] 16d …… rim portion

[0143] 18 …… spacer plate

[0144] 20 …… conveyance device

[0145] 22 …… conveyance head

[0146] 24 …… adsorption surface

[0147] 26 …… chuck mechanism

[0148] 26a …… claw portion

[0149] 26b …… engagement surface

[0150] 26c …… engagement protrusion

[0151] 28 …… opening and closing mechanism

[0152] 30 …… element formation substrate

[0153] 32r, 32g, 32b …… element

[0154] 40 …… setting table

[0155] 50 …… first transfer substrate (sheet)

[0156] 52 …… adhesive layer

[0157] 60 …… second transfer substrate (sheet)

[0158] 62 …… adhesive layer

[0159] 70 …… mounting substrate

[0160] 80 …… pedestal

[0161] 82 …… placement table

[0162] 83 …… gas flow-through hole

[0163] 84 …… top surface

[0164] 85 …… suction hole

[0165] 86 …… accommodating recess

[0166] 88 …… guide member

[0167] 89 …… inclined surface

[0168] 90 positioning member

[0169] 92 front end face

Claims

1. A die tool, wherein: have: A stamping layer having a portion to which a component to be transported can be detachably adhered; a support plate to which the compression molding layer is fixed; and The adapter plate has a mounting surface on which the support plate is replaceably mounted and a transport head is detachably mounted. The stamping layer is fixed to the support plate with a stronger adhesion than the adhesive force to the conveying object. The support plate is replaceably mounted on the adapter plate via an adhesive layer having an adhesive force higher than the adhesive force of the stamper layer to the conveying target component.

2. The die tool according to claim 1, wherein The transported components are a plurality of components formed on the surface of the substrate. The die layer is provided with a plurality of protrusions corresponding to the elements. The element is detachably attached to each convex portion.

3. The die tool according to claim 1 or 2, wherein: The support plate includes a glass plate or a ceramic plate having a flat surface.

4. The die tool according to claim 1 or 2, wherein A tapered surface is formed on the side surface of the adapter plate, the outer diameter of which decreases toward the support plate.

5. The die tool according to claim 1 or 2, wherein The maximum width of the adapter plate along the first axis direction is greater than the width of the support plate.

6. The die tool according to claim 4, wherein An insertable surface facing the tapered surface of the adapter plate is provided on the surface of the support plate on the adapter plate side.

7. The die tool according to claim 1 or 2, wherein: An adsorbable surface is formed on the surface of the support plate on the side of the stamper layer, around the stamper layer.

8. The die tool according to claim 1 or 2, wherein: A spacer plate for adjusting the parallelism of the support plate is interposed between the die layer and the adapter plate.

9. A method for manufacturing an element array, wherein: The method comprises the step of simultaneously taking out and conveying a plurality of conveyance target components from a substrate using the pressing tool according to any one of claims 1 to 8.

10. A transport device, wherein: have: Die tools; as well as A transport head that can transport the die tool in a detachable manner. The die tool has: A stamping layer that can adhere a component to be transferred, which is placed on a substrate with a predetermined fixing force F1, with a predetermined adhesion force F2; as well as The adapter plate has a mounting surface that supports the die layer and on which the transport head can be detachably mounted. The mounting force F3 of the transport head on the mounting surface of the adapter plate is greater than the fixing force F1. The adhesion force F2 of the stamping layer on the transported component is greater than the fixing force F1. The die tool also has: The die layer is fixed, and the support plate on which the adapter plate is installed is replaceable. The support plate is replaceably mounted on the adapter plate via an adhesive layer having an adhesive force higher than the adhesive force F2 of the stamping layer.

11. The transport device according to claim 10, wherein: The mounting force F3 applied to the mounting surface of the adapter plate by the transport head includes a main mounting force F3a applied by a main mounting means and a secondary mounting force F3b applied by a secondary mounting means other than the main mounting means.

12. The transport device according to claim 11, wherein: The main mounting means includes a vacuum suction hole formed in the transport head.

13. The transport device according to claim 11 or 12, wherein: The auxiliary mounting means includes at least one of a clamp mechanism, an electrostatic adsorption mechanism, a fitting mechanism, and a screwing mechanism for detachably mounting the adapter plate on the transport head.

14. The transport device according to any one of claims 10 to 12, wherein A tapered surface whose outer diameter decreases toward the die layer is formed on the side surface of the adapter plate.

15. The transport device according to claim 13, wherein: The claw portion of the clamp mechanism included in the auxiliary mounting means can be engaged with a tapered surface formed on the side surface of the adapter plate.

16. The transport device according to any one of claims 10 to 12, wherein: The transported components are a plurality of components formed on the surface of the substrate. The die layer is provided with a plurality of protrusions corresponding to the elements. The components are detachably attached to the respective protrusions.

17. A method for manufacturing an element array, wherein: The method comprises the step of simultaneously taking out and conveying a plurality of components as a plurality of conveyance target components from the substrate using the conveyance device according to any one of claims 10 to 16.

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