A thin film material heat dissipation characteristics testing system and method

Abstract

The present invention provides a system and method for testing the heat dissipation characteristics of thin film materials. The system includes: a thermal imaging device and a substrate. The substrate is provided with a heating end and a cooling end at opposite ends, and a plurality of grooves connecting the heating end and the cooling end are provided on the upper surface of the substrate, and thermal conductive strips are provided in the grooves. The present invention provides a plurality of grooves connecting the heating end and the cooling end on the upper surface of the substrate, and thermal conductive strips are provided in the grooves. The heating end and the cooling end are connected by the plurality of thermal conductive strips, and the substrate is divided into different heat conductive areas. The thermal imaging device is used to photograph the film material under test in the heat conductive area to form a thermal imaging image, thereby expanding the narrow heat conductive hot spot measured in the prior art into a larger heat conductive area. The thermal imaging image can be used to intuitively observe and compare the heat dissipation characteristics of different thin film materials, improve the sensitivity of the test data to the differences in the thermal conductivity of different ink materials, and reduce the impact of the test system error on the test results.

Description

Technical Field

[0001] The present invention relates to the technical field of material performance characterization, and in particular to a system and method for testing the heat dissipation characteristics of thin film materials. Background Art

[0002] With the advent of the 5G era, more high-frequency, high-power, and lightweight devices are emerging. With the emergence of these devices, thin film materials are widely used in the thermal management of these devices. Therefore, accurate measurement of the heat dissipation characteristics of thin film materials is particularly important.

[0003] In the prior art, the temperature and heat transfer conditions at different locations on the thin film material are detected by heating methods, thereby achieving the measurement of the material's heat dissipation characteristics. Figure 1a and 1b As shown in the figure, a heating end (temperature T1) and a cooling end (temperature T2) are provided on the substrate. During the test, the material to be tested is placed on the substrate and pressed by the heating end and the cooling end. After a certain period of heating, the temperature of the material to be tested reaches an equilibrium state, that is, the temperature of each point of the material to be tested remains basically stable. For different materials to be tested, the temperature of points at different distances from the heating end on the material to be tested is measured to form the following Figure 1c The temperature-distance curve shown can be used to compare the heat dissipation characteristics of different tested materials.

[0004] When the above method is used to measure thin film materials (such as heat dissipation oil film, etc.), the difference in thermal conductivity between different inks is relatively small, and the thermal conductivity of ink is very low. For example, the thermal conductivity of epoxy resin glass fiber cloth substrate FR4 is only 0.2W / m / K, while the thermal conductivity of copper can reach 400W / m / K. Due to the low thermal conductivity of the oil film, heat cannot be transferred to the cold end in time, resulting in a rapid drop in the oil film temperature very close to the heating end, such as Figures 1a to 1c In the example, the oil film temperature drops sharply at points A and B, which are very close to the heating end, while the temperature at points C and D, which are farther away from the heating end, remains essentially the same. However, in actual measurements, points A and B are too close to the heating end to be easily measured, and the temperature differences at points C and D for different film materials are not apparent. Therefore, it is impossible to accurately describe the differences in thermal conductivity between different inks. Summary of the Invention

[0005] The present invention aims to provide a system and method for testing the heat dissipation characteristics of thin film materials, in order to at least partially solve at least one of the above-mentioned technical problems.

[0006] In the first aspect, in order to solve the above-mentioned technical problems, the present invention provides a thin film material heat dissipation characteristics testing system, comprising: a thermal imaging device and a substrate, wherein the substrate is respectively provided with a heating end and a cooling end at two opposite ends, and the upper surface of the substrate is provided with a plurality of grooves connecting the heating end and the cooling end, and a heat conductive strip is stuck in the groove.

[0007] According to a preferred embodiment of the present invention, the plurality of heat conducting strips are parallel to each other and have equal spacing therebetween.

[0008] According to a preferred embodiment of the present invention, the widths of the heating end and the cooling end are the same as the width of the substrate.

[0009] According to a preferred embodiment of the present invention, the cooling end and the heat conducting strip are integrally formed using the same heat conducting material.

[0010] According to a preferred embodiment of the present invention, temperature measuring elements are respectively provided on the heating end, the cooling end and the heat conducting strip.

[0011] According to a preferred embodiment of the present invention, the thermal imaging device is installed above the substrate within a predetermined shooting range, and the system further comprises: a controller connected to each temperature measuring element and the thermal imaging device,

[0012] The controller is used to prompt spraying of the film to be tested according to the data of each temperature measuring element, and / or to control the thermal imaging device to collect thermal imaging images according to the data of each temperature measuring element.

[0013] In a second aspect, the present invention provides a method for testing the heat dissipation characteristics of a thin film material, which is performed using any of the above-described thin film material heat dissipation characteristics testing systems, the method comprising:

[0014] Turn on the heating end;

[0015] When the temperatures of the heating end, the cooling end, and all the heating strips reach a balanced state, spraying the thin film material to be tested onto the upper surface of the substrate;

[0016] When the temperature of the film material to be tested reaches an equilibrium state, a thermal imaging image of the film to be tested on the upper surface of the substrate is collected by the thermal imaging device;

[0017] The heat dissipation characteristics of the film to be tested are determined according to the thermal imaging image.

[0018] According to a preferred embodiment of the present invention, when the temperatures of the heating end, the cooling end and all the heating strips are detected in real time to see whether they have reached a balanced state, if so, the film material to be tested is sprayed onto the upper surface of the substrate;

[0019] Alternatively, the first time required from turning on the heating end to the temperature of the heating end, the cooling end and all the heating strips reaching a balanced state is detected in advance, and after the heating end is turned on for the first time, the film material to be tested is sprayed on the upper surface of the substrate.

[0020] According to a preferred embodiment of the present invention, determining the heat dissipation characteristics of the film to be tested based on the thermal imaging image includes:

[0021] Display thermal images of each film material to be tested;

[0022] The differences in heat dissipation characteristics of the film materials to be tested are analyzed based on the thermal images.

[0023] In summary, the system and method for testing the heat dissipation characteristics of thin film materials of the present invention are provided with a plurality of grooves connecting the heating end and the cooling end on the surface of the substrate, and thermal conductive strips are provided in the grooves, the heating end and the cooling end are connected by the plurality of thermal conductive strips, and the substrate is divided into different heat conductive areas, and the film material to be tested in the heat conductive area is photographed by a thermal imaging device to form a thermal imaging image, thereby expanding the narrow heat conductive hot spot measured in the prior art into a larger heat conductive area. The heat dissipation characteristics of different thin film materials can be intuitively observed and compared through the thermal imaging image; the sensitivity of the test data to the differences in the thermal conductivity of different ink materials is improved, and the influence of the test system error on the test results is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1a It is a structural diagram of an existing material heat dissipation characteristic testing device;

[0025] Figure 1b Figure 1a OO cross-section diagram;

[0026] Figure 1c yes Figure 1a Schematic diagram of the temperature distance curve of points A, B, C and D;

[0027] Figure 2a This is a schematic diagram of the structural framework of a thin film material heat dissipation characteristics testing system according to embodiment 1 of the present invention;

[0028] Figure 2b yes Figure 2a Schematic diagram of the middle AA section;

[0029] Figure 3 It is a flow chart of a method for testing the heat dissipation characteristics of a thin film material according to the second embodiment of the present invention. DETAILED DESCRIPTION

[0030] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with the accompanying drawings and Examples. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present invention by illustrating examples of the present invention.

[0031] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0032] Example 1

[0033] See also Figures 2a-2b , the first embodiment of the present invention provides a thin film material heat dissipation characteristics testing system, such as Figures 2a-2b As shown, the test system includes a thermal imaging device and a substrate 2, wherein the thermal imaging device is installed above the substrate 2 within a predetermined imaging range, and a heating end 21 and a cooling end 22 are respectively provided at opposite ends of the substrate 2. A plurality of grooves connecting the heating end 21 and the cooling end 22 are provided on the surface of the substrate 2, and thermal conductive strips 23 are fixed in the grooves, wherein the thermal conductive strips 23 match the size of the grooves to ensure a tight fit between the two without leaving any gaps. In this way, the plurality of thermal conductive strips 23 connect the heating end 21 and the cooling end 22, and form different thermal conductive areas on the surface of the substrate 2. The thermal imaging device can capture the film material under test in each thermal conductive area to form a thermal image, thereby expanding the narrow thermal conductive hot spot measured by the temperature measuring instrument in the prior art to a larger thermal conductive area on the substrate surface. The thermal image can then be used to visually observe and compare the heat dissipation characteristics of different film materials, thereby improving the sensitivity of the test data to the differences in the thermal conductivity properties of different ink materials and reducing the impact of the test system error on the test results.

[0034] The thermal imaging device can be a thermal imaging camera, and the substrate 2 can be configured as a rectangular parallelepiped. The heating end 21 and the cooling end 22 can be respectively disposed at the two ends of the wide sides of the substrate 2. Preferably, the widths of the heating end 21 and the cooling end 22 are the same as the width of the substrate 2, and the heating end 21 and the cooling end 22 are located above and in contact with the upper surface of the substrate 2 to ensure a uniform thickness of the sprayed film material and improve measurement accuracy.

[0035] For example, the heating end 21 can be a rectangular heating sheet or plate connected to a power supply. The heating power of the heating end 21 is regulated by the voltage and current applied by the power supply. The cooling end 22 can be a water-cooled plate connected to a chiller. The water-cooled plate can be made of copper or aluminum with high thermal conductivity. The upper surface of the water-cooled plate is polished to ensure sufficient contact between the film material to be tested and the water-cooled plate.

[0036] In order to form different heat-conducting areas on the upper surface of the base 2, the upper surface of the base 2 and the thermally conductive strip 23 are made of materials with different thermal conductivity coefficients. For example, the surface of the base 2 can be made of epoxy resin glass fiber cloth substrate FR4 material, and the water-cooling plate of the cooling end 21 and the thermally conductive strip 23 can be made of the same thermally conductive material (such as copper, aluminum, etc.). In addition, for ease of manufacturing, the cooling end 21 and the thermally conductive strip 23 can be made using an integrated molding process.

[0037] In this embodiment, the individual heat-conducting strips 23 may cross or be parallel to each other, as long as a heat-conducting region can be formed on the surface of the substrate 2. The shape of the heat-conducting strips 23 may be a straight strip, a zigzag strip, or any other shape, and the present invention does not specifically limit this. In a preferred embodiment, to facilitate observation of heat dissipation characteristics, the shapes and areas of the individual heat-conducting regions are unified. The heat-conducting strips 23 may be arranged to be parallel to each other and spaced equally apart. In this way, rectangular heat-conducting regions of equal area are formed between the heating end 21, the heat-conducting strips 23, and the cooling end 22, facilitating observation and comparison of heat dissipation characteristics.

[0038] Furthermore, in order to facilitate the measurement of the temperature of different positions of the substrate 2 and / or the thin film material to be tested during the measurement process to determine whether it has reached a temperature equilibrium state, temperature measuring elements (such as thermometers, temperature sensors, etc.) can be respectively set on the heating end 21, the cooling end 22 and the thermal conductive strip 23.

[0039] Furthermore, to achieve automated testing, the system may further include a controller connected to each temperature measuring element and thermal imaging device, the controller being configured to prompt spraying of the film to be tested based on data from each temperature measuring element, and / or to control the thermal imaging device to capture thermal images based on data from each temperature measuring element. The controller may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the present invention.

[0040] Example 2

[0041] See also Figure 3 The second embodiment of the present invention provides a method for testing the heat dissipation characteristics of thin film materials. The method is tested using any of the thin film material heat dissipation characteristics testing systems in the first embodiment. Figure 3 As shown, the method includes:

[0042] S301, turn on the heating end;

[0043] For example, the power supply of the heating end 21 is turned on, and further, the heating power of the heating end 21 can be controlled by adjusting the power supply voltage, thereby controlling the heating speed.

[0044] S302, when the temperatures of the heating end, the cooling end, and all the heating strips reach a balanced state, spraying the thin film material to be tested onto the upper surface of the substrate;

[0045] The term "temperature equilibrium" refers to the thermal stability of various points, resulting in a constant temperature that neither increases nor decreases. Specifically, when the temperatures of the heating end 21, the cooling end 22, and all the heating strips 23 reach equilibrium, the entire structure formed by the heating end 21, the cooling end 22, and the heating strips 23 therebetween is thermally stable, thereby maintaining a constant temperature.

[0046] In this embodiment, the temperature measuring element can be used to detect in real time whether the temperatures of the heating end 21, the cooling end 22 and all the heating strips 23 have reached a equilibrium state. If so, the thin film material to be tested is sprayed on the upper surface of the substrate 2. A first initialization step can also be set before step S301. The first initialization step pre-detects the first time required from turning on the heating end 21 to the time when the temperatures of the heating end 21, the cooling end 22 and all the heating strips 23 reach a equilibrium state under a predetermined heating power. In this step, the thin film material to be tested is sprayed on the upper surface of the substrate 2 after the heating end 21 is turned on for the first time under the predetermined heating power.

[0047] S303, when the temperature of the thin film material to be tested reaches an equilibrium state, collecting a thermal image of the thin film to be tested on the upper surface of the substrate by the thermal imaging device;

[0048] When the temperature of the thin film material to be tested reaches an equilibrium state, the heat of the thin film material in each heat-conducting area on the surface of the substrate 2 is stable, so that the temperature of the thin film material in each heat-conducting area remains constant.

[0049] In this embodiment, the temperature measuring element can be used to detect in real time whether the temperature of the film to be tested in each heat-conducting area has reached an equilibrium state. If so, a thermal imaging image of the film to be tested on the upper surface of the substrate 2 is collected by the thermal imaging device. A second initialization step can also be set before step S301. The second initialization step pre-detects the second time required from spraying the film material to be tested on the upper surface of the substrate 2 to the temperature of the film material to be tested reaching an equilibrium state under a predetermined heating power. In this step, the film material to be tested is sprayed on the substrate 2 under the predetermined heating power after the second time has passed, and a thermal imaging image of the film to be tested on the upper surface of the substrate 2 is collected by the thermal imaging device.

[0050] S304: Determine the heat dissipation characteristics of the film to be tested according to the thermal imaging image.

[0051] The thermal image corresponds to the heat distribution field of the thin film material on the surface of substrate 2, and the different colors in the thermal image represent different temperatures of the measured thin film material. In this embodiment, multiple thermally conductive strips 23 are used to connect the heating end 21 and the cooling end 22, forming different heat conduction zones on the surface of substrate 2. A thermal imaging device is used to capture the measured thin film material within each heat conduction zone, generating a thermal image. This expands the narrow, point-like heat conduction zone measured by temperature measuring instruments in the prior art into a larger heat conduction zone on the substrate surface. The thermal image allows for intuitive display and comparison of the heat dissipation performance of different thin film materials.

[0052] Exemplarily, after obtaining thermal images of a plurality of different films to be tested, this step may include:

[0053] S31, displaying thermal images of each thin film material to be tested;

[0054] For example, a user may select multiple film materials to compare through a visual interface. Based on the user's selection, multiple test film materials to be compared are obtained, such as Film A, Film B, and Film C. During the display process, the thermal images of the multiple test film materials may be displayed according to a preset display mode. For example, the preset display mode may be to display the thermal images of the multiple test film materials in horizontal order.

[0055] S32. Analyze differences in heat dissipation characteristics of the thin film materials to be tested based on the thermal imaging images.

[0056] In this embodiment, different colors on the thermal image represent different temperatures of the thin film material being tested. Therefore, by comparing the colors of the thermal image, the difference in heat dissipation characteristics of the thin film materials being tested can be intuitively determined.

[0057] In summary, the system and method for testing the heat dissipation characteristics of thin film materials of the present invention are provided with a plurality of grooves connecting the heating end and the cooling end on the surface of the substrate, and thermal conductive strips are provided in the grooves, the heating end and the cooling end are connected by the plurality of thermal conductive strips, and the substrate is divided into different heat conductive areas, and the film material to be tested in the heat conductive area is photographed by a thermal imaging device to form a thermal imaging image, thereby expanding the narrow heat conductive hot spot measured in the prior art into a larger heat conductive area. The heat dissipation characteristics of different thin film materials can be intuitively observed and compared through the thermal imaging image; the sensitivity of the test data to the differences in the thermal conductivity of different ink materials is improved, and the influence of the test system error on the test results is reduced.

[0058] It should be understood that the present invention is not limited to the specific structures and processes described above and illustrated in the figures. For the sake of simplicity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and illustrated as examples. However, the method process of the present invention is not limited to the specific steps described and illustrated. Those skilled in the art can make various changes, modifications, and additions, or change the order of the steps after understanding the spirit of the present invention.

[0059] It should also be noted that the exemplary embodiments described herein describe methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the steps described above. In other words, the steps may be performed in the order described in the embodiments, or in a different order, or several steps may be performed simultaneously.

[0060] The above description is only a specific embodiment of the present invention. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention.

Claims

1. A thin film material heat dissipation characteristics testing system, characterized in that: include: A thermal imaging device and a substrate, wherein a heating end and a cooling end are respectively provided at opposite ends of the substrate, a plurality of grooves connecting the heating end and the cooling end are provided on the surface of the substrate, and a heat conducting strip is fixed in the groove, and the size of the heat conducting strip matches the size of the groove.

2. The thin film material heat dissipation characteristic testing system according to claim 1, characterized in that: The plurality of heat conducting strips are parallel to each other and have equal spacing.

3. The thin film material heat dissipation characteristic testing system according to claim 1, characterized in that: The widths of the heating end and the cooling end are both the same as the width of the base.

4. The thin film material heat dissipation characteristic testing system according to claim 3, characterized in that: The cooling end and the heat conducting strip are integrally formed using the same heat conducting material.

5. The thin film material heat dissipation characteristic testing system according to claim 1, characterized in that: The heating end, the cooling end and the heat conducting strip are respectively provided with temperature measuring elements.

6. The thin film material heat dissipation characteristic testing system according to claim 5, characterized in that: The thermal imaging device is installed above the substrate within a predetermined shooting range. The system further comprises: a controller connected to each temperature measuring element and the thermal imaging device, The controller is used to prompt spraying of the film to be tested according to the data of each temperature measuring element, and / or to control the thermal imaging device to collect thermal imaging images according to the data of each temperature measuring element.

7. A method for testing the heat dissipation characteristics of thin film materials, characterized in that: The thin film material heat dissipation characteristic testing system according to any one of claims 1 to 6 is used for testing, the method comprising: Turn on the heating end; When the temperatures of the heating end, the cooling end, and all the heating strips reach a balanced state, spraying the thin film material to be tested onto the upper surface of the substrate; When the temperature of the film material to be tested reaches an equilibrium state, a thermal imaging image of the film to be tested on the upper surface of the substrate is collected by the thermal imaging device; The heat dissipation characteristics of the film to be tested are determined according to the thermal imaging image.

8. The method for testing the heat dissipation characteristics of thin film materials according to claim 7, characterized in that: When the temperatures of the heating end, the cooling end and all the heating strips are detected in real time to see whether they have reached a balanced state, if so, spraying the film material to be tested onto the upper surface of the substrate; Alternatively, the first time required from turning on the heating end to the temperature of the heating end, the cooling end and all the heating strips reaching a balanced state is detected in advance, and after the heating end is turned on for the first time, the film material to be tested is sprayed on the upper surface of the substrate.

9. The method for testing the heat dissipation characteristics of thin film materials according to claim 7, characterized in that: Determining the heat dissipation characteristics of the film to be tested according to the thermal imaging image includes: Display thermal images of each film material to be tested; The differences in heat dissipation characteristics of the film materials to be tested are analyzed based on the thermal images.

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