Electronic devices and heat dissipation components

Abstract

The present invention discloses an electronic device and a heat dissipation assembly. The electronic device is used to connect to an external heat dissipation device and includes a housing, a heat source, and a heat dissipation assembly. The heat source is disposed in the housing. The heat dissipation assembly includes an evaporator, a pipeline, and a liquid cooling plate. The evaporator is in thermal contact with the heat source. The pipeline includes an evaporation section and a condensation section. The evaporation section is connected to the condensation section and is in thermal contact with the evaporator. The liquid cooling plate is disposed in the housing and is separated from the heat source. The liquid cooling plate has a condensation space and is used to connect to the external heat dissipation device. The condensation section of the pipeline is located in the condensation space. The condensation section of the pipeline includes a first pipe portion, a second pipe portion, and a plurality of connecting pipe portions. The opposite ends of each connecting pipe portion are respectively connected to the first pipe portion and the second pipe portion, so that the connecting pipe portions are connected in parallel. The first pipe portion and the second pipe portion are connected to the evaporation section.

Description

Technical Field

[0001] The present invention relates to an electronic device and a heat dissipation component, and in particular to an electronic device and a heat dissipation component comprising a liquid cooling plate. Background Art

[0002] Typically, in an open-type thermosyphon cooling system for a server, the condensing section of the flow tube is in thermal contact with the outer surface of the top cover of the liquid cold plate, and both the flow tube and the liquid cold plate are located within the server chassis. Furthermore, the liquid cold plate is connected to a heat sink located outside the server chassis via another flow tube. This allows the coolant circulating through the external heat sink and the liquid cold plate to absorb heat from the cooling fluid in the condensing section.

[0003] However, because the condensing section of the flow tube is in thermal contact with the outer surface of the liquid cooling plate's top cover, heat exchange between the cooling fluid in the condensing section and the cooling liquid in the liquid cooling plate must pass through the tube wall and the top cover of the liquid cooling plate. This results in excessive heat resistance due to the excessive number of mediators required to transfer heat between the cooling fluid in the condensing section and the cooling liquid in the liquid cooling plate.

[0004] Therefore, some manufacturers replace the liquid cold plate with a sleeve with a larger diameter than the flow tube, and then insert the flow tube into the sleeve. This allows the coolant flowing in the sleeve to exchange heat with the cooling fluid in the condensing section of the flow tube simply through the tube wall. However, this configuration can lead to structural complexity when multiple condensing sections are required to increase the flow rate of the cooling fluid in the condensing section. These reasons make open thermosiphon cooling systems unsuitable for heat sources with high cooling requirements. Summary of the Invention

[0005] The present invention provides an electronic device and a heat dissipation assembly to reduce the thermal resistance between the heat dissipation fluid in the condensation section and the cooling liquid in the liquid cooling plate.

[0006] An electronic device disclosed in one embodiment of the present invention is configured to be connected to an external heat sink and includes a housing, a heat source, and a heat sink assembly. The heat source is disposed in the housing. The heat sink assembly includes an evaporator, a pipeline, and a liquid cooling plate. The evaporator is in thermal contact with the heat source. The pipeline includes an evaporation section and a condensation section. The evaporation section is connected to the condensation section and is in thermal contact with the evaporator. The liquid cooling plate is disposed in the housing and separated from the heat source. The liquid cooling plate has a condensation space and is configured to be connected to the external heat sink. The condensation section of the pipeline is located in the condensation space. The condensation section of the pipeline includes a first tube portion, a second tube portion, and a plurality of connecting tube portions. The opposite ends of each connecting tube portion are respectively connected to the first tube portion and the second tube portion, so that the connecting tube portions are connected in parallel. The first tube portion and the second tube portion are connected to the evaporation section.

[0007] Another embodiment of the present invention discloses a heat dissipation assembly for connection to an external heat dissipation device and for thermal contact with a heat source, and includes an evaporator, a pipeline, and a liquid cooling plate. The evaporator is for thermal contact with the heat source. The pipeline includes an evaporation section and a condensation section. The evaporation section is connected to the condensation section and is in thermal contact with the evaporator. The liquid cooling plate is disposed in a housing and separated from the heat source. The liquid cooling plate has a condensation space and is for connection to the external heat dissipation device. The condensation section of the pipeline is located in the condensation space. The condensation section of the pipeline includes a first pipe portion, a second pipe portion, and a plurality of connecting pipe portions. The opposite ends of each connecting pipe portion are respectively connected to the first pipe portion and the second pipe portion, so that the connecting pipe portions are connected in parallel. The first pipe portion and the second pipe portion are connected to the evaporation section.

[0008] According to the electronic device and heat dissipation assembly disclosed in the above embodiments, since the condensing section of the pipeline is located in the condensing space containing the coolant in the liquid cooling plate, the heat transferred between the cooling fluid in the condensing section of the pipeline and the coolant in the liquid cooling plate only needs to pass through the pipe wall of the condensing section, without passing through the top cover of the liquid cooling plate. As a result, the thermal resistance between the cooling fluid in the condensing section and the coolant in the liquid cooling plate is reduced, and the parallel connection of the connecting pipe sections increases the flow rate of the cooling fluid in the condensing section, thereby making the heat dissipation assembly suitable for heat sources with high heat dissipation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 1 is a perspective view of an external heat dissipation device and an electronic device according to a first embodiment of the present invention.

[0010] Figure 2 for Figure 1 Exploded view of the electronics and external heat sink.

[0011] Figure 3 for Figure 1 A partially enlarged view of the top view of the electronic device with the top cover of the liquid cooling plate omitted.

[0012] Figure 4 for Figure 1 A three-dimensional diagram of the piping of the electronic device in FIG.

[0013] Figure 5 FIG. 4 is a perspective view of a pipeline of an electronic device according to a second embodiment of the present invention.

[0014] Figure 6 FIG. 4 is a perspective view of a pipeline of an electronic device according to a third embodiment of the present invention.

[0015] Explanation of symbols:

[0016] 10…Electronic devices

[0017] 100…Housing

[0018] 101…baseboard

[0019] 1010…periphery

[0020] 102…Side panels

[0021] 103…partition

[0022] 1030…Piercing

[0023] 200…heat source

[0024] 300...Heat dissipation components

[0025] 301…evaporator

[0026] 302…Pipeline

[0027] 3020…Evaporation section

[0028] 3021…first connected segment

[0029] 3022…Second connecting section

[0030] 3023…Condensation section

[0031] 3024…First Pipe

[0032] 3025…Second pipe

[0033] 3026…Connecting pipe

[0034] 3027…Bend

[0035] 3029…outer surface

[0036] 303…Liquid cooling plate

[0037] 3030…base

[0038] 3031…top cover

[0039] 3032…Condensation space

[0040] 304…catheter

[0041] 20…External heat sink

[0042] 302a, 302b…pipes

[0043] 3023a, 3023b…condensation section

[0044] 3026a, 3026b…connecting pipe

[0045] 3028a, 3028b…concave-convex structure

[0046] 3029a, 3029b…outer surface

[0047] F…Extension direction DETAILED DESCRIPTION

[0048] The following detailed description of the features and advantages of the embodiments of the present invention is sufficient to enable anyone skilled in the art to understand the technical content of the embodiments of the present invention and implement them accordingly. Furthermore, based on the disclosure, claims, and figures of this specification, anyone skilled in the art can readily understand the relevant objectives and advantages of the present invention. The following examples further illustrate the concepts of the present invention and are not intended to limit the scope of the present invention in any way.

[0049] See also Figure 1 and Figure 2 , Figure 1 1 is a perspective view of an external heat dissipation device and an electronic device according to a first embodiment of the present invention. Figure 2 for Figure 1 Exploded view of the electronics and external heat sink.

[0050] In this embodiment, the electronic device 10 is, for example, a server. In this embodiment, the electronic device 10 is used to connect to an external heat dissipation device 20 and includes a housing 100 , a heat source 200 , and a heat dissipation assembly 300 .

[0051] In this embodiment, the housing 100 includes a base plate 101, a side plate 102, and a partition plate 103. The side plate 102 is disposed on a peripheral edge 1010 of the base plate 101. The partition plate 103 is disposed on the base plate 101 and connected to opposite sides of the side plate 102. Furthermore, in this embodiment, the partition plate 103 has two through-holes 1030. The heat source 200 is disposed on the base plate 101 and is, for example, a central processing unit (CPU) or a graphics processing unit (GPU).

[0052] See also Figures 1 to 4 . Figure 3 for Figure 1 A partially enlarged view of the top view of the electronic device with the top cover of the liquid cooling plate omitted. Figure 4 for Figure 1 In this embodiment, the heat dissipation assembly 300 includes an evaporator 301 , a pipe 302 , a liquid cooling plate 303 and two conduits 304 .

[0053] The evaporator 301 is in thermal contact with the heat source 200. In this embodiment, the pipeline 302 is used to carry a heat dissipation fluid (not shown) and includes an evaporation section 3020, a first connecting section 3021, a second connecting section 3022, and a condensation section 3023. The evaporation section 3020 is connected to the condensation section 3023 through the first connecting section 3021 and the second connecting section 3022. The opposite ends of the first connecting section 3021 are connected to the evaporation section 3020 and the condensation section 3023, respectively. The opposite ends of the second connecting section 3022 are connected to the evaporation section 3020 and the condensation section 3023, respectively. The evaporation section 3020 is in thermal contact with the evaporator 301 and is located on the side of the evaporator 301 away from the heat source 200. In this embodiment, the first connecting section 3021 and the second connecting section 3022 are respectively penetrated through the two through-holes 1030 of the partition 103.

[0054] The condensing section 3023 of the pipeline 302 includes a first pipe portion 3024, a second pipe portion 3025, and a plurality of connecting pipe portions 3026. The opposite ends of each connecting pipe portion 3026 are connected to the first pipe portion 3024 and the second pipe portion 3025, respectively, so that the connecting pipe portions 3026 are connected in parallel. The first pipe portion 3024 and the second pipe portion 3025 are connected to the first connecting section 3021 and the second connecting section 3022, respectively.

[0055] It should be noted that in this embodiment, the opposite ends of one of these connecting tube portions 3026 that is farthest away from the first connecting section 3021 and the second connecting section 3022 are respectively connected to the first tube portion 3024 and the second tube portion 3025 through the two bent portions 3027 of the condensation section 3023 so that the heat dissipation fluid can flow smoothly in the condensation section 3023.

[0056] Furthermore, in this embodiment, the outer peripheral surface 3029 of the connecting pipe portion 3026 is flat. Figure 3 As shown, in this embodiment, the extending directions F of the connecting tube portions 3026 are substantially parallel to each other.

[0057] In other embodiments, the condensing section may not include two bends, and the one of the connecting tube sections furthest from the first and second connecting sections may be directly and perpendicularly connected to the first and second tube sections. In other embodiments, the extending directions of these connecting tube sections may not be parallel to each other. In other embodiments, the partition may not have two perforations, and the first and second connecting sections may be supported on the side of the partition away from the bottom plate.

[0058] In this embodiment, the liquid cooling plate 303 includes a base 3030 and a top cover 3031. The base 3030 of the liquid cooling plate 303 is disposed on the bottom plate 101 of the housing 100 and is separated from the heat source 200. The top cover 3031 is fixed to the side of the base 3030 away from the bottom plate 101 and together with the base 3030, forms a condensation space 3032. The condensation space 3032 is used for the flow of a coolant. The entire condensation section 3023 of the pipeline 302 is located in the condensation space 3032. The partition 103 is located between the heat source 200 and the base 3030 of the liquid cooling plate 303 to prevent coolant leaking from the condensation space 3032 from further flowing to the heat source 200. It should be noted that in other embodiments, the housing may not need to include a partition.

[0059] The condensation space 3032 of the liquid cooling plate 303 is connected to the external heat sink 20 through the two pipes 304. In other words, the cooling liquid circulates among the liquid cooling plate 303, the two pipes 304 and the external heat sink 20.

[0060] The outer peripheral surface of the connecting pipe is not limited to being flat. Figure 5 , Figure 5 FIG. 4 is a perspective view of a pipeline of an electronic device according to a second embodiment of the present invention. Figure 5 Electronic devices and Figures 1 to 4 The difference between the electronic devices in the embodiment is only in the structure of the condensing section of the pipeline, so the following only describes the above difference and omits the description of other features.

[0061] like Figure 5 As shown, in this embodiment, the pipe 302a further includes a plurality of concave-convex structures 3028a. The concave-convex structures 3028a are respectively located on the outer circumference 3029a of the connecting pipe portion 3026a of the condensing section 3023a. Moreover, in this embodiment, the concave-convex structures 3028a are fins, but the present invention is not limited thereto.

[0062] See also Figure 6 , Figure 6 FIG. 4 is a perspective view of a pipeline of an electronic device according to a third embodiment of the present invention. Figure 6 Electronic devices and Figures 1 to 4 The difference between the electronic devices in the embodiment lies solely in the structure of the condensing section of the pipe. Therefore, the following description will focus on these differences and omit descriptions of other features. In this embodiment, pipe 302b further includes a plurality of concave-convex structures 3028b. These concave-convex structures 3028b are located on the outer circumference 3029b of the connecting pipe portion 3026b of the condensing section 3023b and are threaded grooves.

[0063] According to the electronic device and heat dissipation assembly disclosed in the above embodiments, since the condensing section of the pipeline is located in the condensing space containing the coolant in the liquid cooling plate, the heat transferred between the cooling fluid in the condensing section of the pipeline and the coolant in the liquid cooling plate only needs to pass through the pipe wall of the condensing section, without passing through the top cover of the liquid cooling plate. As a result, the thermal resistance between the cooling fluid in the condensing section and the coolant in the liquid cooling plate is reduced, and the parallel connection of the connecting pipe sections increases the flow rate of the cooling fluid in the condensing section, thereby making the heat dissipation assembly suitable for heat sources with high heat dissipation requirements.

[0064] Furthermore, the concave-convex structure of the pipeline is located on the outer circumference of the connecting pipe portion of the condensing section. This increases the contact area between the coolant in the condensing space and the connecting pipe portion, and promotes turbulent flow of the coolant within the condensing space of the liquid cold plate. This further enhances the heat exchange efficiency between the coolant in the condensing space and the heat dissipation fluid in the condensing section of the pipeline.

[0065] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Anyone skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the claims attached to this specification.

Claims

1. An electronic device for connecting to an external heat sink, characterized in that: The electronic device comprises: a housing; a heat source disposed in the housing; and A heat dissipation assembly comprising: an evaporator in thermal contact with the heat source; a pipeline comprising an evaporation section and a condensation section, wherein the evaporation section is connected to the condensation section and is in thermal contact with the evaporator; as well as a liquid cooling plate, disposed in the housing and separated from the heat source, the liquid cooling plate having a condensation space and connected to the external heat sink, the entire condensation section of the pipeline being located in the condensation space; In which, the condensing section of the pipeline includes a first tube portion, a second tube portion and multiple connecting tube portions, and the opposite ends of each connecting tube portion are respectively connected to the first tube portion and the second tube portion so that these connecting tube portions are connected in parallel to each other, and the first tube portion and the second tube portion are connected to the evaporation section.

2. The electronic device according to claim 1, wherein The pipeline further includes a plurality of concave-convex structures, and the concave-convex structures are respectively located on the outer peripheral surfaces of the connecting pipe parts of the condensing section.

3. The electronic device according to claim 2, wherein: The concave-convex structures are fins.

4. The electronic device according to claim 2, wherein: The concave-convex structures are grooves.

5. The electronic device according to claim 1, wherein: The extending directions of the connecting pipe portions of the condensation section are substantially parallel to each other.

6. The electronic device according to claim 1, wherein: The shell includes a bottom plate, a side plate and a partition, and the pipeline further includes a first connecting section and a second connecting section. The heat source and the liquid cooling plate are arranged on the bottom plate, the side plate stands on the periphery of the bottom plate, the partition stands on the bottom plate and is connected to the opposite sides of the side plate, and the partition is located between the heat source and the liquid cooling plate. The evaporation section is connected to the condensation section through the first connecting section and the second connecting section, and the first pipe portion and the second pipe portion of the condensation section are respectively connected to the first connecting section and the second connecting section. The partition has two through-holes, and the first connecting section and the second connecting section of the pipeline are respectively penetrated by the two through-holes.

7. A heat dissipation assembly for connection to an external heat dissipation device and for thermal contact with a heat source, characterized in that: The heat dissipation component comprises: an evaporator in thermal contact with the heat source; a pipeline comprising an evaporation section and a condensation section, wherein the evaporation section is connected to the condensation section and is in thermal contact with the evaporator; as well as a liquid cooling plate disposed in the housing and separated from the heat source, the liquid cooling plate having a condensation space and connected to the external heat sink, the entire condensation section of the pipeline being located in the condensation space; In which, the condensing section of the pipeline includes a first tube portion, a second tube portion and multiple connecting tube portions, and the opposite ends of each connecting tube portion are respectively connected to the first tube portion and the second tube portion so that these connecting tube portions are connected in parallel to each other, and the first tube portion and the second tube portion are connected to the evaporation section.

8. The heat dissipation assembly according to claim 7, wherein: The pipeline further includes a plurality of concave-convex structures, and the concave-convex structures are respectively located on the outer peripheral surfaces of the connecting pipe parts of the condensing section.

9. The heat dissipation assembly according to claim 8, wherein: The concave-convex structures are fins.

10. The heat dissipation assembly according to claim 8, wherein: The concave-convex structures are grooves.

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