Device system and method for processing sputtering ring accessories

Abstract

The present invention provides a device system and method for processing a sputtering ring accessory, the device system comprises an upper template, a stripping template and a die, the stripping template is located between the upper template and the die; the upper template is provided with a punch and at least one guide column; the punch and the guide column are penetrated in the stripping plate; the die is provided with a slot, a forming hole and a blanking hole in sequence from top to bottom along the central axis, the slot, the forming hole and the blanking hole pass through the die; the punch, the slot, the forming hole and the blanking hole are all coaxially arranged with the die; the method comprises the following steps: the sheet metal material is moved into the slot, the punch is driven by the upper template to punch the sheet metal material downward, the sputtering ring accessory is formed by the restriction of the forming hole, the punch is driven by the upper template to be lifted, and the sputtering ring accessory detaches from the punch after hitting the stripping template; the method performs one-time stamping and forming, ensures that the size of the outer circle and the inner wall of the product is uniform, has high processing efficiency, and only needs one lathe step after stamping to be processed into a finished product, reduces processing loss, and is suitable for industrial production.

Description

Technical Field

[0001] The invention belongs to the field of target material sputtering equipment, and in particular relates to a device system and method for processing sputtering ring accessories. Background Art

[0002] In the production process of modern semiconductor chips, sputtering is an indispensable thin film deposition technology. During the sputtering process, high-energy particles hit a solid plate of high-purity target material, knocking out atoms according to physical processes. These knocked-out atoms pass through the vacuum and are finally deposited on the silicon wafer. Focusing rings are used whenever sputtering is performed using target materials. The main functions of focusing rings in semiconductor processes include: constraining the motion trajectory of sputtered particles and focusing them; absorbing large particles generated during the sputtering process and purifying them. In the sputtering process of IMP (ionized metal plasma), the focusing ring needs to participate in the sputtering. In this way, the life of the focusing ring is extremely limited. Moreover, in actual production, the life of the focusing ring is very short, and the processing technology of the focusing ring is complex and expensive, which makes the consumption of the focusing ring extremely expensive in chip production.

[0003] The existing processing methods mostly use Ta rods that are larger than the product diameter as raw materials. After lathe outer circle processing, a solid cylindrical cup-shaped product is obtained, and then it is sent to the wire cutting to cut the product from the rod. After that, the inside of the product is hollowed out and the bottom through hole size is processed to the right size through the machining center. Finally, it is sent to the lathe for processing to ensure the total height of the product. Since the chips cannot be discharged during the machining process of the machining center, the inner wall will be roughened, and the inner wall of the product needs to be polished later. The existing process has many steps and a long processing cycle. Due to the high cost of tantalum materials, the loss of the inner wall and outer circle processing materials causes cost waste.

[0004] CN113560825B discloses a semiconductor sputtering ring guard and a processing method thereof, the processing method comprising the following steps: stamping a blank to obtain a cylindrical structure with a groove; milling the groove of the cylindrical structure, and then milling a circular hole on the bottom surface to form a through structure; knurling the outer surface of the through structure to obtain a semiconductor sputtering ring guard. The processing method sequentially uses stamping, milling and knurling operation processes according to the structure and application of the sputtering ring guard, and the milling step causes a certain amount of waste;

[0005] CN101574780B discloses a method for producing a tantalum convex body for a magnetron sputtering ring. The method uses a tantalum rod as a raw material and is completed by a die stamping and precision machining method. The process is as follows: sawing the tantalum rod, turning the end surface, stamping, finishing, drilling a center hole, tapping, and drilling a side hole. The stamping die comprises an upper die plate (1) and a lower die plate (9), with a guide column (3) between the two. The lower die plate (9) is provided with a concave die (7), a convex die (6) is provided on the concave die, and a stripping rod (5) is provided on the convex die. The production method avoids waste caused by turning, but a stripping rod needs to be used for material removal after stamping, which is inefficient.

[0006] Therefore, it is necessary to develop a new method for manufacturing tantalum focusing rings that takes into account both utilization and production efficiency. Summary of the invention

[0007] In view of the problems of low mechanical processing efficiency and high material waste in the processing process in the prior art, the present invention proposes a device system and method for processing sputtering ring accessories. By stamping, tantalum discs with equal wall thickness are directly stamped into shape in one step, ensuring the uniformity of the dimensions of the outer circle and the inner wall of the product, eliminating material waste caused by turning, and saving processing costs and material costs.

[0008] To achieve this object, the present invention adopts the following technical solutions:

[0009] In a first aspect, the present invention provides a device system for processing a sputtering ring accessory, the device system comprising an upper mold plate, a stripper mold plate and a concave mold;

[0010] The stripping plate is located between the upper plate and the concave die;

[0011] The upper template is provided with a punch and at least one guide column; the punch and the guide column are inserted into the demoulding plate;

[0012] The die is provided with a slot, a forming hole and a blanking hole in sequence from top to bottom along the central axis, and the slot, the forming hole and the blanking hole pass through the die;

[0013] The punch, the slot, the forming hole and the blanking hole are all coaxially arranged with the die.

[0014] The present invention provides a device system for processing a sputtering ring accessory, wherein the shape of the punch is consistent with that of the sputtering ring accessory, so that one-time stamping is convenient and waste caused by turning and trimming of tantalum rods is avoided. A stripping plate is provided to facilitate automatic unloading after stamping, thereby ensuring uniformity of size between the outer circle and the inner wall of the product. Subsequently, the overall height is maintained, bottom surface through-hole processing and inner hole polishing are performed on a lathe, thereby saving processing costs and material costs.

[0015] Preferably, the bottom of the punch has an outer rounded corner.

[0016] Preferably, the radius of the outer chamfer of the bottom of the punch is 1-1.5 mm, for example, it can be 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm or 1.5 mm, but it is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0017] Preferably, the diameter of the punch is 16.3-16.8 mm, for example, it can be 16.3 mm, 16.4 mm, 16.5 mm, 16.6 mm, 16.7 mm or 16.8 mm, but it is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0018] Preferably, the central axis of the punch coincides with the central axis of the upper template.

[0019] Preferably, a steric block is provided at the bottom of the guide column.

[0020] Preferably, the diameter of the steric block is greater than the diameter of the guide post.

[0021] Preferably, the number of the guide columns is a multiple of 4.

[0022] Preferably, the guide columns are evenly distributed around the central axis of the punch.

[0023] Preferably, the inner diameter of the card slot is 60.5-61.5 mm, for example, it can be 60.5 mm, 60.8 mm, 61 mm, 61.2 mm or 61.5 mm, but it is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0024] Preferably, the portion of the forming hole close to the slot end is an outer rounded corner.

[0025] Preferably, the radius of the outer chamfer of the forming hole is 24.5-25.5 mm, for example, it can be 24.5 mm, 24.8 mm, 25 mm, 25.2 mm or 25.5 mm, but it is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0026] Preferably, the portion of the forming hole close to the feeding hole end is a circular hole;

[0027] Preferably, the diameter of the circular hole of the forming hole is equal to the outer diameter of the sputtering ring accessory.

[0028] Preferably, the diameter of the feed hole is 49.5-50.5 mm, for example, it can be 49.5 mm, 49.8 mm, 50 mm, 50.2 mm or 50.5 mm, but it is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0029] Preferably, the punch and the die are made of SKH9, M2 or SKH51 high speed steel.

[0030] The present invention preferably uses SKH9, M2 or SKH51 high-speed steel to prepare the punch and the die, whose hardness is sufficient to form the sheet-like tantalum and titanium materials in one step without damaging the appearance and internal structure of the sputtering ring.

[0031] In a second aspect, the present invention provides a method for processing a sputtering ring accessory, wherein a sheet metal material is punched in the apparatus system described in the first aspect to obtain the sputtering ring accessory.

[0032] Preferably, the stamping comprises the following steps:

[0033] The sheet metal material moves into the slot, the punch is driven by the upper template to punch the sheet metal material downward, and the sputtering ring accessory is formed under the restriction of the forming hole. The punch is driven to lift up by the upper template, and the sputtering ring accessory detaches from the punch after hitting the stripping template.

[0034] The method for processing a sputtering ring accessory provided by the present invention feeds the material through a robot arm, and obtains the sputtering ring by one-time stamping and forming. The forming holes and the stripping plate coated with hydraulic oil facilitate the automatic falling off of the sputtering ring accessory after forming, thereby greatly improving the single-time production efficiency and saving tantalum or titanium materials lost in processing.

[0035] Preferably, the thickness of the sheet metal material is 2.2-2.5 mm, for example, 2.2 mm, 2.3 mm, 2.4 mm or 2.5 mm, but is not limited to the listed values, and other values ​​not listed within the range are also applicable.

[0036] Preferably, the diameter of the sheet metal material is 60.5-61.5 mm, for example, 60.5 mm, 60.8 mm, 61 mm, 61.2 mm or 61.5 mm, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0037] Preferably, the metal comprises tantalum or titanium.

[0038] Preferably, the purity of the sheet metal material tantalum is ≥99.95%, for example, it can be 99.95%, 99.96%, 99.97%, 99.98% or 99.99%, but it is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0039] Preferably, the purity of the titanium is ≥ 99.95%, for example, it may be 99.95%, 99.96%, 99.97%, 99.98% or 99.99%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable;

[0040] Preferably, the thickness of the sheet metal material is 0.01-0.05 mm smaller than the depth of the slot, for example, it may be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm or 0.05 mm, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0041] Preferably, the diameter of the sheet metal material is equal to the inner diameter of the slot.

[0042] Preferably, before moving into the slot, the punch and the forming hole are cleaned to prevent the debris remaining in the previous step from scratching the next sputtering ring, and then hydraulic oil is applied to the surface of the punch and the forming hole.

[0043] Preferably, the hydraulic oil includes No. 46 hydraulic oil.

[0044] Preferably, the inner diameter of the sputtering ring accessory is equal to the diameter of the punch.

[0045] Preferably, the inner bottom of the sputtering ring accessory has an inner rounded corner.

[0046] Preferably, the radius of the inner chamfer of the sputtering ring accessory is equal to the radius of the outer chamfer of the punch bottom.

[0047] Preferably, the downward punching pressure is ≥10t, for example, it can be 10t, 11t, 12t, 13t, 14t or 15t, etc., but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0048] Preferably, the sheet metal material is moved into the slot by a robotic arm.

[0049] Preferably, the total time of a single punching is 15-20 s, for example, 15 s, 16 s, 17 s, 18 s, 19 s or 20 s, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0050] As a preferred technical solution of the present invention, the method comprises the following steps:

[0051] The surface of the punch and the forming hole is coated with No. 46 hydraulic oil. The sheet metal material with a thickness of 2.2-2.5mm, a diameter of 60.5-61.5mm and a purity of ≥99.95% is moved into the slot by the robot arm. The punch is driven by the upper template to punch the sheet metal material downward with a pressure of ≥10t. The sputtering ring accessory is formed by the restriction of the forming hole. The punch is lifted by the upper template, and the sputtering ring accessory is separated from the punch after hitting the stripping template. The total time of a single stamping is 15-20s.

[0052] The inner diameter of the sputtering ring accessory is equal to the diameter of the punch, and the inner bottom has an inner fillet with a radius equal to the radius of the outer fillet of the bottom of the punch.

[0053] Compared with the prior art, the present invention has the following beneficial effects:

[0054] (1) The present invention provides a device system for processing a sputtering ring accessory. Through the arrangement of a punch, a forming hole and a stripping plate, the sputtering ring can fall off naturally after being stamped and formed. The total time for a single stamping is ≤90s, which greatly saves time compared to the turning method.

[0055] (2) The present invention provides a method for processing a sputtering ring accessory, which can be processed into a finished product in one step on a lathe after stamping, has high processing efficiency and saves materials for early turning and boring. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 A schematic diagram of a device system for processing sputtering ring accessories provided in a specific embodiment of the present invention.

[0057] Figure 2 A schematic flow chart of a method for processing a sputtering ring accessory provided for a specific embodiment of the present invention.

[0058] Among them, 1. upper template; 2. stripping template; 3. die; 4. punch; 5. slot; 6. forming hole; 7. feed hole; 8. guide column; 9. sheet metal material; 10. sputtering ring accessories. DETAILED DESCRIPTION

[0059] For the convenience of understanding the present invention, the present invention lists the following embodiments. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0060] It should be understood that, in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0061] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "disposed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0062] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0063] In a specific embodiment, the present invention provides a device system for processing a sputtering ring accessory, such as Figure 1 As shown, the device system includes an upper template 1, a stripping template 2 and a die 3, wherein the stripping template 2 is located between the upper template 1 and the die 3; a punch 4 and a guide column 8 are arranged between the upper template 1 and the stripping template 2, and a steric block with a diameter larger than that of the guide column 8 is arranged at the bottom of the guide column 8, and the guide columns 8 are evenly distributed around the central axis of the upper template 1 at the same central angle, and the number is a multiple of 4; the die 3 is provided with a slot 5, a forming hole 6 and a blanking hole 7 in sequence from top to bottom along the central axis, and the slot 5, the forming hole 6 and the blanking hole 7 pass through the die 3, the central axis of the punch 4 coincides with the central axis of the upper template 1, the bottom of the punch 4 has an outer rounded corner, and the punch 4 The radius of the outer chamfer of the bottom is 1-1.5mm, and the diameter of the punch 4 is 16.3-16.8mm; the diameter of the slot 5 is equal to the diameter of the sheet metal material 9, and the depth of the slot 5 is 0.01-0.05mm greater than the thickness of the sheet metal material 9; the portion of the forming hole 6 close to the slot end is an outer chamfer with a radius of 24.5-25.5mm, and the portion of the forming hole 6 close to the blanking hole end is a round hole with a diameter of 49.5-50.5mm; the punch 4, the slot 5, the forming hole 6 and the blanking hole 7 are all coaxially arranged with the die 3; the material of the punch 4 and the die 3 includes SKH9, M2 or SKH51 high-speed steel;

[0064] In another specific embodiment, the present invention provides a method for processing a sputtering ring accessory by stamping a sheet metal material in the above-mentioned device system to obtain the sputtering ring accessory, the method comprising the following steps:

[0065] like Figure 2As shown, the surface of the punch 4 and the forming hole 6 is coated with No. 46 hydraulic oil, the sheet metal material 9 with a thickness of 2.2-2.5mm, a diameter of 60.5-61.5mm, and a purity of ≥99.95% is moved into the card slot 5 by the robot arm, and the punch 4 is driven by the upper template 1 to punch the sheet metal material 9 downward with a pressure of ≥10t, and the sputtering ring accessory 10 is formed by the restriction of the forming hole 6. The punch 4 is driven to lift up by the upper template 1, and the sputtering ring accessory 10 hits the stripping template 2 and then separates from the punch 4. The total time of a single punching is 15-20s;

[0066] The diameter of the sputtering ring accessory 10 is equal to the diameter of the punch 4 , and the inner bottom has an inner fillet with a radius equal to the radius of the outer fillet of the bottom of the punch 4 .

[0067] It should be clear that the use of the process provided by the embodiment of the present invention or the replacement or change of conventional data all fall within the protection scope and disclosure scope of the present invention.

[0068] Example 1

[0069] The present embodiment provides a device system for processing sputtering ring accessories, the device system comprises an upper template 1, a stripping template 2 and a die 3, the stripping template 2 is located between the upper template 1 and the die 3; a punch 4 and a guide column 8 are arranged between the upper template 1 and the stripping template 2, a steric block with a diameter greater than that of the guide column 8 is arranged at the bottom of the guide column 8, the guide columns 8 are evenly distributed around the central axis of the upper template 1 at the same central angle, and the number is 4; the die 3 is provided with a slot 5, a forming hole 6 and a feed hole 7 in sequence from top to bottom along the central axis, the slot 5, the forming hole 6 and the feed hole 7 pass through the die 3, the central axis of the punch 4 is parallel to the upper template 1 and the stripping template 2; the punch 4 and the guide column 8 are arranged at the bottom of the guide column 8 and the guide column 8 is evenly distributed at the same central angle around the central axis of the upper template 1 and the number is 4; the die 3 is provided with a slot 5, a forming hole 6 and a feed hole 7 in sequence from top to bottom along the central axis, the slot 5, the forming hole 6 and the feed hole 7 pass through the die 3, the central axis of the punch 4 is parallel to the upper template 1 and the stripping template 2; the punch 4 and the guide column 8 are arranged at the bottom of the guide column 8 and the stripping template 2; the stripping template 2 is located between the upper template 1 and the die 3 ... The central axis of the template 1 coincides, the bottom of the punch 4 has an outer chamfer, the radius of the outer chamfer at the bottom of the punch 4 is 1.3mm, and the diameter of the punch 4 is 16.5mm; the diameter of the slot 5 is equal to the diameter of the sheet metal material 9, and the depth of the slot 5 is 0.05mm greater than the thickness of the sheet metal material 9; the portion of the forming hole 6 close to the slot end is an outer chamfer with a radius of 25mm, and the portion of the forming hole 6 close to the blanking hole end is a circular hole with a diameter of 50mm; the punch 4, the slot 5, the forming hole 6 and the blanking hole 7 are all coaxially arranged with the die 3; the material of the punch 4 and the die 3 is SKH9 high-speed steel;

[0070] This embodiment also provides a method for processing a sputtering ring accessory by stamping a sheet metal material in the above-mentioned device system to obtain the sputtering ring accessory, the method comprising the following steps:

[0071] The surface of the punch 4 and the forming hole 6 is coated with No. 46 hydraulic oil. The sheet tantalum material 9 with a thickness of 2.4 mm, a diameter of 16.5 mm and a purity of ≥99.95% is moved into the card slot 5 by the robot arm. The punch 4 is driven by the upper template 1 to punch the sheet metal material 9 downward with a pressure of 10 t. The sputtering ring accessory 10 is formed by the restriction of the forming hole 6. The punch 4 is lifted up by the upper template 1. The sputtering ring accessory 10 hits the stripping template 2 and then separates from the punch 4. The total time of a single punching is 18 s.

[0072] The diameter of the sputtering ring accessory 10 is equal to the diameter of the punch 4 , and the inner bottom has an inner fillet with a radius equal to the radius of the outer fillet of the bottom of the punch 4 .

[0073] Example 2

[0074] The present embodiment provides a device system for processing sputtering ring accessories, the device system includes an upper template 1, a stripping template 2 and a die 3, the stripping template 2 is located between the upper template 1 and the die 3; a punch 4 and a guide column 8 are arranged between the upper template 1 and the stripping template 2, a steric block with a diameter greater than that of the guide column 8 is arranged at the bottom of the guide column 8, the guide columns 8 are evenly distributed around the central axis of the upper template 1 at the same central angle, and the number is 4; the die 3 is provided with a slot 5, a forming hole 6 and a feed hole 7 in sequence from top to bottom along the central axis, the slot 5, the forming hole 6 and the feed hole 7 pass through the die 3, the central axis of the punch 4 is aligned with the upper die The central axis of the plate 1 coincides, the bottom of the punch 4 has an outer chamfer, the radius of the outer chamfer at the bottom of the punch 4 is 1mm, and the diameter of the punch 4 is 16.3mm; the diameter of the slot 5 is equal to the diameter of the sheet metal material 9, and the depth of the slot 5 is 0.05mm greater than the thickness of the sheet metal material 9; the portion of the forming hole 6 close to the slot end is an outer chamfer with a radius of 24.5mm, and the portion of the forming hole 6 close to the blanking hole end is a round hole with a diameter of 49.5mm; the punch 4, the slot 5, the forming hole 6 and the blanking hole 7 are all coaxially arranged with the die 3; the material of the punch 4 and the die 3 includes M2 high-speed steel;

[0075] This embodiment also provides a method for processing a sputtering ring accessory by stamping a sheet metal material in the above-mentioned device system to obtain the sputtering ring accessory, the method comprising the following steps:

[0076] The surface of the punch 4 and the forming hole 6 is coated with No. 46 hydraulic oil. The sheet metal material 9 with a thickness of 2.2 mm, a diameter of 60.5 mm and a purity of ≥99.95% is moved into the slot 5 by the robot arm. The punch 4 is driven by the upper template 1 to punch the sheet titanium material 9 downward with a pressure of 12t. The sputtering ring accessory 10 is formed by the restriction of the forming hole 6. The punch 4 is lifted up by the upper template 1. The sputtering ring accessory 10 hits the stripping template 2 and then separates from the punch 4. The total time for a single punching is 15s.

[0077] The diameter of the sputtering ring accessory 10 is equal to the diameter of the punch 4 , and the inner bottom has an inner fillet with a radius equal to the radius of the outer fillet of the bottom of the punch 4 .

[0078] Example 3

[0079] The present embodiment provides a device system for processing sputtering ring accessories, the device system comprises an upper template 1, a stripping template 2 and a die 3, the stripping template 2 is located between the upper template 1 and the die 3; a punch 4 and a guide column 8 are arranged between the upper template 1 and the stripping template 2, a steric block with a diameter greater than that of the guide column 8 is arranged at the bottom of the guide column 8, the guide columns 8 are evenly distributed around the central axis of the upper template 1 at the same central angle, and the number of the guide columns 8 is 4; the die 3 is provided with a slot 5, a forming hole 6 and a feed hole 7 in sequence from top to bottom along the central axis, the slot 5, the forming hole 6 and the feed hole 7 pass through the die 3, the central axis of the punch 4 is aligned with the upper template 1 The center axis of the punch 4 coincides, the bottom of the punch 4 has an outer chamfer, the radius of the outer chamfer at the bottom of the punch 4 is 1.5mm, and the diameter of the punch 4 is 16.8mm; the diameter of the slot 5 is equal to the diameter of the sheet metal material 9, and the depth of the slot 5 is 0.05mm greater than the thickness of the sheet metal material 9; the portion of the forming hole 6 close to the slot end is an outer chamfer with a radius of 25.5mm, and the portion of the forming hole 6 close to the blanking hole end is a round hole with a diameter of 50.5mm; the punch 4, the slot 5, the forming hole 6 and the blanking hole 7 are all coaxially arranged with the die 3; the material of the punch 4 and the die 3 includes SKH51 high-speed steel;

[0080] This embodiment also provides a method for processing a sputtering ring accessory by stamping a sheet metal material in the above-mentioned device system to obtain the sputtering ring accessory, the method comprising the following steps:

[0081] The surface of the punch 4 and the forming hole 6 is coated with No. 46 hydraulic oil. The sheet metal material 9 with a thickness of 2.5 mm, a diameter of 61.5 mm and a purity of ≥99.95% is moved into the card slot 5 by the robot arm. The punch 4 is driven by the upper template 1 to punch the sheet tantalum material 9 downward with a pressure of 10 t. The sputtering ring accessory 10 is formed by the restriction of the forming hole 6. The punch 4 is lifted up by the upper template 1. The sputtering ring accessory 10 is separated from the punch 4 after hitting the stripping template 2. The total time of a single punching is 20 s.

[0082] The diameter of the sputtering ring accessory 10 is equal to the diameter of the punch 4 , and the inner bottom has an inner fillet with a radius equal to the radius of the outer fillet of the bottom of the punch 4 .

[0083] Example 4

[0084] This embodiment provides a device system and method for processing sputtering ring accessories. The only difference in method from Embodiment 1 is that the punch is driven by the upper template to punch the sheet tantalum material downward at a pressure of 9t.

[0085] Example 5

[0086] This embodiment provides a device system and method for processing sputtering ring accessories. The only difference in method from Embodiment 1 is that the punch is driven by the upper template to punch the sheet tantalum material downward at a pressure of 8t.

[0087] Comparative Example 1

[0088] This comparative example provides a device system and method for processing sputtering ring accessories. The device is consistent with the device in the specific implementation of CN101574780B. During stamping, the sheet tantalum material is stamped downward with a pressure of 10t.

[0089] Comparative Example 2

[0090] This comparative example provides a method for processing a sputtering ring accessory, wherein the method uses a tantalum rod having a diameter the same as that of an expected tantalum sputtering ring to perform internal turning, surface processing, and external shaping to obtain the sputtering ring accessory.

[0091] The properties of the sputtering ring accessories obtained by the device systems and methods provided in Examples 1-5 and Comparative Examples 1-2 are shown in Table 1.

[0092] Table 1

[0093] Product qualification rate (%) Average processing time per piece (min) Example 1 99 0.25 Example 2 97 0.6 Example 3 95 1.5 Example 4 89 1.2 Example 5 86 1.5 Comparative Example 1 99 2 Comparative Example 2 99 26

[0094] From the data in Table 1 we can see that:

[0095] (1) The sputtering ring parts processed by the methods of Examples 1-3 can be naturally removed after being stamped and formed by the positional relationship between the punch, the forming hole and the stripping plate. The average processing time of a single piece is ≤90s, which improves production efficiency and saves materials for early turning and hole punching. At the same time, the quality of the sputtering ring is guaranteed, and the product qualification rate is ≥95%;

[0096] (2) It can be seen from the comprehensive analysis of Example 1 and Examples 4-5 that the stamping pressure of Example 1 is 10t, while the stamping pressures of Examples 4-5 are 9t and 8t respectively, and the product qualification rate of Example 1 is 99%, while the product qualification rates of Examples 4-5 are only 89% and 86% respectively. This shows that the device system provided by the present invention can obtain a sputtering ring accessory with a qualified shape and smooth inner and outer surfaces by using a reasonable stamping strength;

[0097] (3) It can be seen from Example 1 and Comparative Examples 1-2 that Example 1 adopts the stamping device system of the present application, while Comparative Example 1 adopts a stamping device without a stripper plate, and Comparative Example 2 adopts a metal rod turning method. The average single-piece processing time of Example 1 is 0.25 min, while the average single-piece processing time of Examples 4-5 is 2 min and 26 min, respectively. This shows that using the device system provided by the present invention to stamp out metal sputtering ring accessories can save a lot of production time and improve production efficiency.

[0098] In summary, the present invention provides a device system and method for processing sputtering ring accessories, which can be stamped and formed in one step with high processing efficiency. After stamping, it can be processed into a finished product in one step on a lathe, saving tantalum materials wasted in early turning and boring, and is suitable for industrial production.

[0099] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A method for processing a sputtering ring accessory, characterized in that: The method comprises: punching a sheet metal material in a device system for processing a sputtering ring accessory to obtain a sputtering ring accessory; The device system for processing the sputtering ring accessories comprises an upper mold plate, a stripper mold plate and a concave mold; The stripping plate is located between the upper plate and the concave die; The upper template is provided with a punch and at least one guide column; the punch and the guide column are inserted into the stripping template; The bottom of the punch has an outer rounded corner; The radius of the outer rounded corner of the bottom of the punch is 1-1.5 mm; The diameter of the punch is 16.3-16.8 mm; The die is provided with a slot, a forming hole and a blanking hole in sequence from top to bottom along the central axis, and the slot, the forming hole and the blanking hole pass through the die; The punch, the slot, the forming hole and the blanking hole are all coaxially arranged with the die; The punch and die are made of SKH9, M2 or SKH51 high speed steel; The inner diameter of the card slot is 60.5-61.5 mm; The portion of the forming hole close to the slot end is an outer rounded corner; The radius of the outer rounded corner of the forming hole is 24.5-25.5 mm; The portion of the forming hole close to the feeding hole end is a circular hole; The diameter of the circular hole of the forming hole is equal to the outer diameter of the sputtering ring accessory; The diameter of the feed hole is 49.5-50.5 mm; The stamping comprises the following steps: The sheet metal material moves into the slot, the punch is driven by the upper template to punch the sheet metal material downward, and the sputtering ring accessory is formed by the restriction of the forming hole. The punch is driven by the upper template to lift up, and the sputtering ring accessory hits the stripping template and then separates from the punch. The inner diameter of the sputtering ring accessory is equal to the diameter of the punch; The inner bottom of the sputtering ring accessory has an inner rounded corner; The radius of the inner chamfer of the sputtering ring accessory is equal to the radius of the outer chamfer of the punch bottom.

2. The method according to claim 1, characterized in that The central axis of the punch coincides with the central axis of the upper template.

3. The method according to claim 1, characterized in that A steric block is arranged at the bottom of the guide column.

4. The method according to claim 3, characterized in that The diameter of the steric block is greater than the diameter of the guide column.

5. The method according to claim 1, characterized in that The number of the guide columns is a multiple of 4.

6. The method according to claim 1, characterized in that The guide columns are evenly distributed around the central axis of the punch.

7. The method according to claim 1, characterized in that The thickness of the sheet metal material is 2.2-2.5 mm.

8. The method according to claim 1, characterized in that The diameter of the sheet metal material is 60.5-61.5 mm.

9. The method according to claim 1, characterized in that: The sheet metal material includes tantalum or titanium.

10. The method according to claim 9, characterized in that The purity of the tantalum is ≥99.95%.

11. The method according to claim 9, characterized in that The purity of the titanium is ≥99.95%.

12. The method according to claim 1, characterized in that The thickness of the sheet metal material is 0.01-0.05 mm smaller than the depth of the slot.

13. The method according to claim 1, characterized in that The diameter of the sheet metal material is equal to the inner diameter of the slot.

14. The method according to claim 1, characterized in that Before the sheet metal material is moved into the slot, hydraulic oil is applied to the surface of the punch and the forming hole.

15. The method according to claim 14, characterized in that The hydraulic oil includes No. 46 hydraulic oil.

16. The method according to claim 1, characterized in that The pressure for punching the sheet metal material downward is ≥10t.

17. The method according to claim 1, characterized in that The sheet metal material is moved into the slot by a robotic arm.

18. The method according to claim 1, characterized in that The total time for a single punch is 15-20s.

19. The method according to claim 1, characterized in that The method comprises the following steps: The punch and the forming hole are coated with No. 46 hydraulic oil, with a thickness of 2.2-2.5mm and a diameter of 60.5-61.5mm. The sheet metal material with a purity of ≥99.95% is moved into the slot by the robot arm. The punch is driven by the upper template to punch the sheet metal material downward with a pressure of ≥10t. The sputtering ring accessory is formed by the forming hole. The punch is lifted by the upper template, and the sputtering ring accessory is separated from the punch after hitting the stripping template. The total time of a single stamping is 15-20s. The inner diameter of the sputtering ring accessory is equal to the diameter of the punch, and the inner bottom has an inner fillet with a radius equal to the radius of the outer fillet of the bottom of the punch.

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