Electronic Devices

Abstract

The present invention discloses an electronic device, which is used to be connected to an external heat dissipation device and includes a housing, a heat source and a heat dissipation component. The heat source is arranged in the housing. The heat dissipation component includes an evaporator, a condenser and a heat dissipation fin group. The evaporator is in thermal contact with the heat source. The condenser has an outer surface, a condensation space and a liquid cooling space. The outer surface faces away from the condensation space and the liquid cooling space. The condensation space and the liquid cooling space are not connected to each other. The condensation space is connected to the evaporator. The liquid cooling space is used to be connected to the external heat dissipation device. The heat dissipation fin group is in thermal contact with the condenser and protrudes from the outer surface of the condenser in a direction away from the condensation space or the liquid cooling space.

Description

Technical Field

[0001] The invention relates to an electronic device, in particular to an electronic device comprising a heat dissipation component. Background Art

[0002] Generally speaking, a cabinet is installed in a computer room equipped with air conditioning equipment and multiple servers are housed in the cabinet. In addition, the greater the temperature difference between the airflow flowing into the cabinet and the airflow flowing out of the cabinet, the better the cooling efficiency of the cabinet by the air conditioning equipment. Therefore, in order to increase the temperature difference between the airflow flowing into the cabinet and the airflow flowing out of the cabinet and thus increase the overall cooling efficiency of the cabinet, a water cooling plate is installed at the air outlet of the cabinet to cool the hot air flowing out of the server.

[0003] However, because the water cooling plate is installed at the air outlet of the cabinet, when a server in the cabinet needs to be repaired, the water cooling plate needs to be removed first. In this way, the hot air flowing out of other servers still in operation in the cabinet cannot be cooled by the water cooling plate, which reduces the temperature difference between the airflow flowing into the cabinet and the airflow flowing out of the cabinet, thereby reducing the cooling efficiency of the cabinet. Summary of the invention

[0004] The present invention provides an electronic device to prevent the problem of reduced cooling efficiency of a cabinet caused by maintenance of a single electronic device.

[0005] An electronic device disclosed in an embodiment of the present invention is used to connect to an external heat dissipation device and includes a housing, a heat source and a heat dissipation component. The heat source is arranged in the housing. The heat dissipation component includes an evaporator, a condenser and a heat dissipation fin group. The evaporator is in thermal contact with the heat source. The condenser has an outer surface, a condensation space and a liquid cooling space. The outer surface faces away from the condensation space and the liquid cooling space. The condensation space and the liquid cooling space are not connected to each other. The condensation space is connected to the evaporator. The liquid cooling space is used to connect to the external heat dissipation device. The heat dissipation fin group is in thermal contact with the condenser and protrudes from the outer surface of the condenser in a direction away from the condensation space or the liquid cooling space.

[0006] The electronic device disclosed in another embodiment of the present invention is used to connect to an external heat dissipation device and includes a housing, a heat source and a heat dissipation component. The heat source is arranged in the housing. The heat dissipation component includes an evaporator, a pipeline, a liquid cooling plate and a heat dissipation fin group. The evaporator is in thermal contact with the heat source. The pipeline includes an evaporation section and a condensation section. The evaporation section is connected to the condensation section and is in thermal contact with the evaporator. The liquid cooling plate is arranged in the housing and separated from the heat source. The liquid cooling plate has an outer surface and a liquid cooling space. The outer surface faces away from the liquid cooling space. The liquid cooling space is used to connect to the external heat dissipation device. The condensation section of the pipeline is located in the liquid cooling space. The heat dissipation fin group is in thermal contact with the liquid cooling plate and protrudes from the outer surface of the liquid cooling plate in a direction away from the liquid cooling space.

[0007] According to the electronic device disclosed in the above embodiment, the heat sink fin group protrudes from the outer surface of the condenser or the liquid cooling plate in the direction away from the condensing space or the liquid cooling space. Therefore, the heat sink assembly can not only cool the condensing section or the heat dissipation fluid in the condensing space through the coolant in the liquid cooling space, but also cool the hot air in the shell through the heat sink fin group. Since the hot air in the cooling shell will be cooled through the heat sink fin group inside the shell, the maintenance of a single electronic device in the cabinet will not affect the cooling operation of the heat sink fin group in the shell of other electronic devices, and there is no need to set a water cooling plate at the air outlet of the cabinet equipped with multiple electronic devices, thereby preventing the problem of reduced cooling efficiency of the cabinet caused by the maintenance of a single electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 1 is a three-dimensional diagram of an external heat dissipation device and an electronic device according to a first embodiment of the present invention.

[0009] Figure 2 for Figure 1 Exploded view of the electronics and external heat sink.

[0010] Figure 3 for Figure 1 A side cross-sectional schematic diagram of an electronic device in FIG.

[0011] Figure 4 FIG. 4 is a schematic side cross-sectional view of an electronic device according to a second embodiment of the present invention.

[0012] Figure 5 is a three-dimensional diagram of an external heat dissipation device and an electronic device according to a third embodiment of the present invention.

[0013] Figure 6 for Figure 5 Exploded view of the electronics and external heat sink.

[0014] Figure 7 for Figure 5 A top cross-sectional view of an electronic device in FIG.

[0015] Figure 8 for Figure 5 A side cross-sectional schematic diagram of an electronic device in FIG.

[0016] Fig. 9 is a schematic side cross-sectional view of an electronic device according to a fourth embodiment of the present invention.

[0017] Explanation of symbols:

[0018] 10, 10b…Electronic devices

[0019] 100, 100b…housing

[0020] 101, 101a, 101b, 101c…base plate

[0021] 1010, 1010b…periphery

[0022] 102, 102b…side panel

[0023] 103, 103b…partition

[0024] 1030…Groove

[0025] 200, 200b…heat source

[0026] 300, 300b…heat dissipation components

[0027] 301, 301b…evaporator

[0028] 302, 302a…condenser

[0029] 3020…First heat conducting plate

[0030] 3021…Second heat conducting plate

[0031] 3022, 3022a…third heat conducting plate

[0032] 3023…Fourth heat conducting plate

[0033] 3024…Connecting pipe

[0034] 3025…First convex hull

[0035] 30250…Groove

[0036] 3026…Second convex hull

[0037] 30260…Groove

[0038] 3027, 3032b…External surface

[0039] 3028…Condensation space

[0040] 3029, 306, 3033b…Liquid cooling space

[0041] 303, 303a, 305b, 305c…heat dissipation fin assembly

[0042] 304…First flow tube

[0043] 3040…End

[0044] 305…Second flow tube

[0045] 3050…end

[0046] 20, 20b…External heat sink

[0047] H1, H2, H3, H4…Height

[0048] A1, A2…Hot air

[0049] 302b…Pipeline

[0050] 3020b…Evaporation section

[0051] 3021b…first connecting section

[0052] 3022b…Second connecting section

[0053] 3023b…Condensation section

[0054] 3024b…First pipe

[0055] 3025b…Second pipe

[0056] 3026b…Connecting pipe

[0057] 3027b…Bend

[0058] 303b, 303c…Liquid cooling plate

[0059] 304b…catheter

[0060] F…Extension direction DETAILED DESCRIPTION

[0061] The detailed features and advantages of the embodiments of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable any person with ordinary knowledge in the art to understand the technical contents of the embodiments of the present invention and implement them accordingly. According to the contents, claims and drawings disclosed in this specification, any person with ordinary knowledge in the art can easily understand the relevant purposes and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.

[0062] See also Figures 1 to 3 . Figure 1 1 is a three-dimensional diagram of an external heat dissipation device and an electronic device according to a first embodiment of the present invention. Figure 2 for Figure 1 Exploded view of the electronics and external heat sink. Figure 3 for Figure 1 A side cross-sectional schematic diagram of an electronic device in FIG.

[0063] The electronic device 10 is used to connect to an external heat dissipation device 20 and includes a housing 100, a heat source 200 and a heat dissipation assembly 300. The electronic device 10 is, for example, a server. In this embodiment, the housing 100 includes a bottom plate 101, a side plate 102 and a partition plate 103. The side plate 102 stands on the periphery 1010 of the bottom plate 101. The partition plate 103 stands on the bottom plate 101 and is connected to two opposite sides of the side plate 102. The heat source 200 is disposed on the bottom plate 101 and is, for example, a central processing unit or a graphics processing unit.

[0064] In this embodiment, the heat dissipation assembly 300 includes an evaporator 301, a condenser 302, a heat dissipation fin group 303, two first flow tubes 304 and two second flow tubes 305. The evaporator 301 is in thermal contact with the side of the heat source 200 away from the bottom plate 101. In this embodiment, the condenser 302 is a stacked structure and includes a first heat conducting plate 3020, a second heat conducting plate 3021, a third heat conducting plate 3022, a fourth heat conducting plate 3023, a plurality of connecting pipes 3024, a plurality of first convex bumps 3025 and a plurality of second convex bumps 3026. In addition, the condenser 302 has an outer surface 3027, a condensation space 3028, a first liquid cooling space 3029 and a second liquid cooling space 306.

[0065] The first heat conducting plate 3020, the second heat conducting plate 3021 and the third heat conducting plate 3022 are stacked in sequence, and the fourth heat conducting plate 3023 is stacked on the side of the first heat conducting plate 3020 away from the second heat conducting plate 3021. In other words, the fourth heat conducting plate 3023, the first heat conducting plate 3020, the second heat conducting plate 3021 and the third heat conducting plate 3022 are stacked in sequence. In addition, the first heat conducting plate 3020, the second heat conducting plate 3021, the third heat conducting plate 3022 and the fourth heat conducting plate 3023 are made of metal, for example.

[0066] The first heat conducting plate 3020, the second heat conducting plate 3021, the third heat conducting plate 3022 and the fourth heat conducting plate 3023 together form an outer surface 3027. The first liquid cooling space 3029 is formed between the second heat conducting plate 3021 and the third heat conducting plate 3022. The condensation space 3028 is formed between the first heat conducting plate 3020 and the second heat conducting plate 3021. The second liquid cooling space 306 is formed between the fourth heat conducting plate 3023 and the first heat conducting plate 3020. The condensation space 3028 is between the first liquid cooling space 3029 and the second liquid cooling space 306. In addition, the outer surface 3027 faces away from the condensation space 3028, the first liquid cooling space 3029 and the second liquid cooling space 306.

[0067] In this embodiment, the condensing space 3028 is connected to the evaporator 301 through the two first flow pipes 304. Figure 3As shown, one end 3040 of each first flow tube 304 away from the evaporator 301 extends from the fourth heat conducting plate 3023 of the condenser 302 close to the bottom plate 101 to the condenser 302 and communicates with the condensing space 3028. The second liquid cooling space 306 is used to connect to the external heat dissipation device 20 through the two second flow tubes 305. Figure 3 As shown, one end 3050 of each second flow tube 305 away from the external heat sink 20 extends from the side of the fourth heat conducting plate 3023 of the condenser 302 close to the bottom plate 101 into the condenser 302 and is connected to the second liquid cooling space 306. In addition, in this embodiment, the first liquid cooling space 3029 is connected to the second liquid cooling space 306 through the connecting pipe 3024. Specifically, the opposite ends of each connecting pipe 3024 are respectively connected to the first liquid cooling space 3029 and the second liquid cooling space 306 and are connected in parallel with each other, and the connecting pipe 3024 passes through but is not connected to the condensing space 3028.

[0068] The partition 103 is located between the heat source 200 and the condenser 302 to prevent the coolant leaking from the condenser 302 from further flowing to the heat source 200. The partition 103 has two grooves 1030. The two grooves 1030 are recessed from one side of the partition 103 away from the bottom plate 101 and the two first flow pipes 304 are respectively located in the two grooves 1030.

[0069] The heat dissipation fin group 303 is in thermal contact with the fourth heat conduction plate 3023 of the condenser 302 and protrudes from the outer surface 3027 of the condenser 302 in a direction away from the second liquid cooling space 306. In this embodiment, the heat dissipation fin group 303 protrudes from a side of the fourth heat conduction plate 3023 of the condenser 302 close to the bottom plate 101 and extends to the bottom plate 101 so that the condenser 302 and the bottom plate 101 are spaced apart from each other by a distance. Figure 3 As shown, in this embodiment, the heat dissipation fin set 303 raises the condenser 302 relative to the bottom plate 101, so that the height H1 of the side of the third heat conducting plate 3022 of the condenser 302 away from the bottom plate 101 relative to the bottom plate 101 is equal to the height H2 of the side of the side plate 102 away from the bottom plate 101 relative to the bottom plate 101. The heat dissipation fin set 303 is used to allow hot air A1 to flow through and absorb the heat of the hot air A1, wherein the hot air A1 is guided by a fan (not shown) inside or outside the electronic device 10 and absorbs the heat generated in the electronic device 10.

[0070] The first convex bump 3025 protrudes from the first heat conducting plate 3020 toward the condensing space 3028. In the present embodiment, the first convex bump 3025 is, for example, a structure formed by performing a stamping process on the first heat conducting plate 3020, so that the first heat conducting plate 3020 has a groove 30250 located in the second liquid cooling space 306. The second convex bump 3026 protrudes from the second heat conducting plate 3021 toward the condensing space 3028. In the present embodiment, the second convex bump 3026 is, for example, a structure formed by performing a stamping process on the second heat conducting plate 3021, so that the second heat conducting plate 3021 has a groove 30260 located in the first liquid cooling space 3029.

[0071] The evaporator 301, the first flow tube 304 and the condensation space 3028 are used for a heat dissipation fluid (not shown) to circulate, wherein the heat dissipation fluid is, for example, a refrigerant. The first liquid cooling space 3029, the second liquid cooling space 306, the connecting pipe 3024 and the external heat dissipation device 20 are used for a coolant (not shown) to circulate, wherein the coolant is, for example, water. After the heat dissipation fluid evaporates into gas in the evaporator 301, it flows to the condensation space 3028 through one of the first flow tubes 304. The coolant flowing in the first liquid cooling space 3029 and the second liquid cooling space 306 cools the heat dissipation fluid flowing into the condensation space 3028 and condenses the heat dissipation fluid into liquid. The heat dissipation fluid condensed into liquid flows back to the evaporator 301 through another first flow tube 304. The coolant that absorbs heat from the heat dissipation fluid flows to the external heat dissipation device 20 and is cooled by the external heat dissipation device 20. In this embodiment, the flow directions of the heat dissipation fluid and the cooling liquid in the condenser 302 are, for example, opposite to each other, so as to increase the heat exchange efficiency between the heat dissipation fluid and the cooling liquid.

[0072] In other embodiments, the condenser may not be a stacked structure but an integrated structure having a condensing space and a liquid cooling space that are not connected to each other. In other embodiments, the condenser may only include the first liquid cooling space but not the second liquid cooling space.

[0073] In other embodiments, the height of the side of the third heat conducting plate of the condenser away from the bottom plate relative to the bottom plate may also be smaller than the height of the side of the side plate away from the bottom plate relative to the bottom plate.

[0074] In other embodiments, the end of each first flow tube away from the evaporator may also extend from the side of the third heat conduction plate of the condenser away from the bottom plate into the condenser, and the end of each second flow tube away from the external heat dissipation device may also extend from the side of the third heat conduction plate away from the bottom plate into the condenser.

[0075] In other embodiments, the partition plate may not have the groove and the first flow tube may be separated from the partition plate. In still other embodiments, the housing may not include the partition plate.

[0076] In other embodiments, the first convex hump may also protrude from the first heat conducting plate toward the second liquid cooling space. In still other embodiments, the condenser may not include the first convex hump. In other embodiments, the second convex hump may also protrude from the second heat conducting plate toward the first liquid cooling space. In still other embodiments, the condenser may not include the second convex hump.

[0077] In other embodiments, the condenser may also include only a single connecting pipe. In addition, in other embodiments, the connecting pipe may not need to penetrate the condensing space but may be located outside the condensing space.

[0078] The heat dissipation fin group 303 is not limited to protruding from the side of the fourth heat conducting plate 3023 of the condenser 302 close to the bottom plate 101. Figure 4 . Figure 4 FIG. 2 is a side cross-sectional view of an electronic device according to a second embodiment of the present invention. In this embodiment, the heat dissipation fin set 303 a protrudes from a side of the third heat conducting plate 3022 a of the condenser 302 a away from the bottom plate 101 a .

[0079] The present invention is not limited to the structure of the heat dissipation component. Figures 5 to 8 . Figure 5 is a three-dimensional diagram of an external heat dissipation device and an electronic device according to a third embodiment of the present invention. Figure 6 for Figure 5 Exploded view of the electronics and external heat sink. Figure 7 for Figure 5 A top cross-sectional view of an electronic device in FIG. Figure 8 for Figure 5 A side cross-sectional schematic diagram of an electronic device in FIG.

[0080] In this embodiment, the electronic device 10b is, for example, a server. In this embodiment, the electronic device 10b is used to connect to an external heat dissipation device 20b and includes a housing 100b, a heat source 200b, and a heat dissipation assembly 300b.

[0081] In this embodiment, the housing 100b includes a bottom plate 101b, a side plate 102b and a partition plate 103b. The side plate 102b stands on the periphery 1010b of the bottom plate 101b. The partition plate 103b stands on the bottom plate 101b and is connected to two opposite sides of the side plate 102b. The heat source 200b is disposed on the bottom plate 101b and is, for example, a central processing unit or a graphics processing unit.

[0082] In this embodiment, the heat dissipation assembly 300b includes an evaporator 301b, a pipeline 302b, a liquid cooling plate 303b, a heat dissipation fin group 305b and two conduits 304b. The evaporator 301b is in thermal contact with the heat source 200b. In this embodiment, the pipeline 302b is used for a heat dissipation fluid (not shown) to flow and includes an evaporation section 3020b, a first connecting section 3021b, a second connecting section 3022b and a condensation section 3023b, wherein the heat dissipation fluid is, for example, a refrigerant. The evaporation section 3020b is connected to the condensation section 3023b through the first connecting section 3021b and the second connecting section 3022b. The opposite ends of the first connecting section 3021b are respectively connected to the evaporation section 3020b and the condensation section 3023b. The opposite ends of the second connecting section 3022b are respectively connected to the evaporation section 3020b and the condensation section 3023b. The evaporation section 3020b is in thermal contact with the evaporator 301b and is located on a side of the evaporator 301b away from the heat source 200b. In this embodiment, the first connecting section 3021b and the second connecting section 3022b are separated from the partition 103b.

[0083] The condensation section 3023b of the pipeline 302b includes a first pipe portion 3024b, a second pipe portion 3025b and a plurality of connecting pipe portions 3026b. The opposite ends of each connecting pipe portion 3026b are respectively connected to the first pipe portion 3024b and the second pipe portion 3025b so that the connecting pipe portions 3026b are connected in parallel. The first pipe portion 3024b and the second pipe portion 3025b are respectively connected to the first connecting section 3021b and the second connecting section 3022b.

[0084] It should be noted that in this embodiment, the two opposite ends of one of these connecting tube portions 3026b that is farthest from the first connecting section 3021b and the second connecting section 3022b are respectively connected to the first tube portion 3024b and the second tube portion 3025b through the two bent portions 3027b of the condensation section 3023b so that the heat dissipation fluid can flow smoothly in the condensation section 3023b.

[0085] In addition, if Figure 7 As shown, in this embodiment, the extending directions F of the connecting tube portions 3026b are substantially parallel to each other.

[0086] In other embodiments, the condensing section may not need to include two bends, and one of the connecting tubes that is farthest from the first connecting section and the second connecting section may be directly and vertically connected to the first tube and the second tube. In other embodiments, the extending directions of the connecting tubes may not be parallel to each other. In other embodiments, the partition may not need to have two through holes, and the first connecting section and the second connecting section may be supported on the side of the partition away from the bottom plate.

[0087] In other embodiments, the condensing section may also include only a single connecting pipe portion, and the connecting pipe portion, the first pipe portion, and the second pipe portion are connected in series.

[0088] In this embodiment, the liquid cooling plate 303b has an outer surface 3032b and a liquid cooling space 3033b. The liquid cooling plate 303b is disposed on the bottom plate 101b of the housing 100b and is separated from the heat source 200b. The liquid cooling space 3033b is used for a coolant to flow, wherein the coolant is, for example, water. The entire condensation section 3023b of the pipeline 302b is located in the liquid cooling space 3033b. The partition 103b is located between the heat source 200b and the liquid cooling plate 303b to prevent the coolant leaking from the liquid cooling space 3033b from further flowing to the heat source 200b. It should be noted that in other embodiments, the housing may not need to include a partition.

[0089] The heat dissipation fin group 305b is in thermal contact with the liquid cooling plate 303b and protrudes from the outer surface 3032b of the liquid cooling plate 303b in a direction away from the liquid cooling space 3033b. In this embodiment, the heat dissipation fin group 305b protrudes from a side of the liquid cooling plate 303b close to the bottom plate 101b and extends to the bottom plate 101b so that the liquid cooling plate 303b and the bottom plate 101b are separated by a distance. Figure 8 As shown, in this embodiment, the heat dissipation fin group 305b raises the liquid cooling plate 303b, so that the height H3 of the side of the liquid cooling plate 303b away from the bottom plate 101b relative to the bottom plate 101b is equal to the height H4 of the side of the side plate 102b away from the bottom plate 101b relative to the bottom plate 101b. The heat dissipation fin group 305b is used to allow hot air A2 to flow through and absorb the heat of the hot air A2, wherein the hot air A2 is guided by a fan (not shown) inside or outside the electronic device 10b and absorbs the heat generated in the electronic device 10b.

[0090] The liquid cooling space 3033b of the liquid cooling plate 303b is connected to the external heat sink 20b through the two pipes 304b. In other words, the cooling liquid circulates between the liquid cooling plate 303b, the two pipes 304b and the external heat sink 20b.

[0091] It should be noted that in other embodiments, the height of the side of the liquid cooling plate away from the bottom plate relative to the bottom plate may also be smaller than the height of the side of the side plate away from the bottom plate relative to the bottom plate.

[0092] In addition, the heat dissipation fin group 305b is not limited to protruding from the side of the liquid cooling plate 303b close to the bottom plate 101b. Fig. 9 . Fig. 9 FIG. 4 is a side cross-sectional view of an electronic device according to a fourth embodiment of the present invention. In this embodiment, the heat dissipation fin set 305 c protrudes from a side of the liquid cooling plate 303 c away from the bottom plate 101 c.

[0093] According to the electronic device disclosed in the above embodiment, the heat sink fin group protrudes from the outer surface of the condenser or the liquid cooling plate in the direction away from the condensing space or the liquid cooling space. Therefore, the heat sink assembly can not only cool the condensing section or the heat dissipation fluid in the condensing space through the coolant in the liquid cooling space, but also cool the hot air in the shell through the heat sink fin group. Since the hot air in the cooling shell will be cooled through the heat sink fin group inside the shell, the maintenance of a single electronic device in the cabinet will not affect the cooling operation of the heat sink fin group in the shell of other electronic devices, and there is no need to set a water cooling plate at the air outlet of the cabinet equipped with multiple electronic devices, thereby preventing the problem of reduced cooling efficiency of the cabinet caused by the maintenance of a single electronic device.

[0094] In addition, since the heat dissipation fin group protrudes from the side of the liquid cooling plate or condensation plate close to the bottom plate and extends to the bottom plate to raise the liquid cooling plate or condensation plate, it is possible to promote the heat dissipation fluid in the condensation space to flow back to the evaporator, thereby improving the heat exchange efficiency between the heat dissipation fluid and the coolant. In addition, the first flow tube and the second flow tube do not need to extend to the opposite sides of the side plate respectively in order to promote the heat dissipation fluid in the condensation space to flow back to the evaporator, thereby reducing the structural complexity of the first flow tube and the second flow tube. In addition, with the simplification of the structure of the first flow tube and the second flow tube, these heat conduction plates can have similar structures and be manufactured with the same mold, thereby reducing the manufacturing cost of the condenser.

[0095] In one embodiment of the present invention, the server of the present invention can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, a cloud server, or an Internet of Vehicles server.

[0096] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be subject to the definition of the claims attached to this specification.

Claims

1. An electronic device for connecting to an external heat sink, characterized in that: The electronic device comprises: a housing; a heat source disposed in the housing; and A heat dissipation component, comprising: an evaporator in thermal contact with the heat source; a condenser having an outer surface, a condensing space and a liquid cooling space, wherein the outer surface faces away from the condensing space and the liquid cooling space, the condensing space and the liquid cooling space are not connected to each other, the condensing space is connected to the evaporator, and the liquid cooling space is used to connect to the external heat dissipation device; as well as a heat dissipation fin group, which is in thermal contact with the condenser and protrudes from the outer surface of the condenser in a direction away from the condensation space or the liquid cooling space; The liquid cooling space further includes a first liquid cooling space and a second liquid cooling space, and the condensing space is between the first liquid cooling space and the second liquid cooling space.

2. The electronic device according to claim 1, wherein: The shell includes a bottom plate and a side plate, the side plate stands on the periphery of the bottom plate, the heat source is arranged on the bottom plate, the heat dissipation fin group protrudes from a side of the condenser close to the bottom plate and extends to the bottom plate so that the condenser and the bottom plate are separated by a distance.

3. The electronic device according to claim 2, wherein: The height of the side of the condenser away from the bottom plate relative to the bottom plate is equal to the height of the side of the side plate away from the bottom plate relative to the bottom plate.

4. The electronic device as claimed in claim 2, characterized in that: The heat dissipation component further includes two first flow tubes and two second flow tubes, the evaporator is connected to the condensation space through the two first flow tubes, one end of each of the first flow tubes away from the evaporator extends from a side of the condenser close to the base plate to the condenser and is connected to the condensation space, and the liquid cooling space is used to be connected to the external heat dissipation device through the two second flow tubes, and one end of each of the second flow tubes away from the external heat dissipation device extends from a side of the condenser close to the base plate to the condenser and is connected to the liquid cooling space.

5. The electronic device as claimed in claim 4, characterized in that: The shell further includes a partition, which stands on the bottom plate and is connected to the opposite sides of the side plates, and the partition is located between the heat source and the condenser. The partition has two grooves, which are recessed from one side of the partition away from the bottom plate and the two first flow tubes are respectively located in the two grooves.

6. The electronic device as claimed in claim 1, wherein: The shell comprises a bottom plate and a side plate, wherein the side plate stands on the periphery of the bottom plate, the heat source is arranged on the bottom plate, and the heat dissipation fin group protrudes from a side of the condenser away from the bottom plate.

7. An electronic device for connecting to an external heat sink, characterized in that: The electronic device comprises: a housing; a heat source disposed in the housing; and A heat dissipation component, comprising: an evaporator in thermal contact with the heat source; A pipeline, comprising an evaporation section and a condensation section, wherein the evaporation section is connected to the condensation section and is in thermal contact with the evaporator; the condensation section comprises a first pipe portion, a second pipe portion and a plurality of connecting pipe portions, wherein opposite ends of each connecting pipe portion are respectively connected to the first pipe portion and the second pipe portion so that the connecting pipe portions are connected in parallel with each other; a liquid cooling plate, arranged on the housing and separated from the heat source, the liquid cooling plate having an outer surface and a liquid cooling space, the outer surface facing away from the liquid cooling space, the liquid cooling space being used to connect to the external heat sink, the condensing section of the pipeline being located in the liquid cooling space; as well as A heat dissipation fin group is in thermal contact with the liquid cooling plate and protrudes from the outer surface of the liquid cooling plate in a direction away from the liquid cooling space.

8. The electronic device as claimed in claim 7, characterized in that: The shell includes a bottom plate and a side plate, the side plate stands on the periphery of the bottom plate, the heat source is arranged on the bottom plate, the heat dissipation fin group protrudes from a side of the liquid cooling plate close to the bottom plate and extends to the bottom plate so that the liquid cooling plate and the bottom plate are separated by a distance from each other.

9. The electronic device as claimed in claim 8, characterized in that: The height of the side of the liquid cooling plate away from the bottom plate relative to the bottom plate is equal to the height of the side of the side plate away from the bottom plate relative to the bottom plate.

10. The electronic device as claimed in claim 8, characterized in that The shell includes a bottom plate and a side plate, the side plate stands on the periphery of the bottom plate, the heat source is arranged on the bottom plate, and the heat dissipation fin group protrudes from a side of the liquid cooling plate away from the bottom plate.

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