Wafer Microscope Inspection Machine

Abstract

The present invention discloses a wafer microscope inspection machine, comprising: a wafer cassette, a handling module, a wafer observation module and a wafer microscope; the wafer cassette is used for storing wafers; the wafer observation module is arranged on one side of the wafer cassette and is used for observing wafers; the wafer microscope is arranged on the other side of the wafer cassette and is used for detecting and simulating wafers; the handling module is arranged on one side of the wafer cassette and is used for handling wafers. The present invention solves the defects of high labor cost and low working efficiency existing in the prior art, is used for observing wafers of different models, and has the characteristics of high working efficiency, low processing cost, high processing precision and high production yield.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer inspection equipment, and particularly to a wafer microscope inspection machine. Background Art

[0002] When sorting and inspecting wafers, processes such as handling and code reading are required. Conventionally, mechanical equipment is used for automatic sorting, but manual inspection requires human cooperation. Human contact with wafers will cause wafer contamination, and the two steps of handling and code reading cannot be fully automated, resulting in low work efficiency and high labor costs. Summary of the Invention

[0003] According to an embodiment of the present invention, there is provided a wafer microscope inspection machine, comprising: a wafer cassette, a handling module, a wafer observation module, and a wafer microscope; the wafer cassette is used for storing wafers;

[0004] The wafer observation module is arranged on one side of the wafer cassette and is used for observing wafers;

[0005] The wafer microscope is arranged on the other side of the wafer cassette and is used for performing detection simulation on wafers;

[0006] The handling module is arranged on one side of the wafer cassette and is used for handling wafers.

[0007] Further, the handling module comprises: a mounting plate, a first carrier bracket, a first manipulator, a second manipulator, and a third manipulator; the mounting plate is arranged on one side of the wafer cassette;

[0008] The first carrier bracket is slidably arranged on the mounting plate;

[0009] The first manipulator is arranged on the first carrier bracket and is used for transferring the wafers in the wafer cassette to the wafer observation module;

[0010] The second manipulator is arranged on the first carrier bracket and is used for transferring wafers inside the wafer observation module;

[0011] The third manipulator is arranged on the first carrier bracket and is used for transferring the wafers inside the wafer observation module to the wafer microscope.

[0012] Further, the handling module further comprises: a pair of guiding members and a first linear module; the pair of guiding members are arranged in parallel on the top of the mounting plate, and the pair of guiding members are slidably connected to the first carrier bracket and are used for guiding the first carrier bracket;

[0013] The first linear module is arranged on the mounting plate, and the execution end of the first linear module is connected to the first carrier bracket and is used for driving the first carrier bracket to slide along the guidance of the pair of guiding members.

[0014] Further, the wafer observation module includes: a second carrier bracket, a camera, a clamping component, and a wafer aligner; the second carrier bracket is disposed on one side of the wafer cassette;

[0015] The camera is disposed on the second carrier bracket for observing the wafer;

[0016] The clamping component is disposed on one side of the second carrier bracket for carrying the wafer;

[0017] The wafer aligner is disposed on one side of the clamping component for adjusting the placement direction of the wafer.

[0018] Further, the clamping component includes: a pair of third carrier brackets, a lifting mechanism, and a clamping mechanism; the pair of third carrier brackets are symmetrically disposed on one side of the second carrier bracket, and the pair of third carrier brackets are located between the second carrier bracket and the handling module;

[0019] A pair of lifting mechanisms are respectively disposed on the pair of third carrier brackets;

[0020] A pair of clamping mechanisms are respectively disposed at the execution ends of the pair of lifting mechanisms for clamping and fixing the wafer.

[0021] Further, the clamping component further includes: a pair of second linear modules, the pair of second linear modules are symmetrically disposed on one side of the second carrier bracket, and the execution ends of the pair of second linear modules are respectively connected to the pair of third carrier brackets for driving the pair of third carrier brackets to move laterally.

[0022] Further, the wafer observation module further includes: a pair of grating sensors, one of the grating sensors is disposed on the second carrier bracket, and the other grating sensor is disposed on one side of the clamping component, and the positions of the pair of grating sensors correspond to each other.

[0023] The wafer microscope inspection machine according to an embodiment of the present invention solves the defects of high labor cost and low working efficiency in the prior art, and is used for observing wafers of different models, and has the characteristics of high working efficiency, low processing cost, high processing precision, and high production yield.

[0024] It is to be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further explanation of the claimed technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a perspective view of a wafer microscope inspection machine according to an embodiment of the present invention;

[0026] Figure 2 is Figure 1 a partial enlarged view of area A in DETAILED DESCRIPTION

[0027] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, and the present invention will be further elaborated.

[0028] First, in conjunction with Figure 1 and 2 a wafer microscope inspection machine according to an embodiment of the present invention will be described, which is used to detect wafers and has a wide range of application scenarios.

[0029] As Figure 1 shown, the wafer microscope inspection machine of the embodiment of the present invention includes: a wafer cassette 1, a handling module, a wafer observation module, and a wafer microscope 4.

[0030] Specifically, as Figure 1 shown, the wafer cassette 1 is used to store wafers; the wafer microscope 4 is arranged on the other side of the wafer cassette 1 and is used to perform detection simulation on the wafers; the handling module is arranged on one side of the wafer cassette 1 and is used to handle wafers.

[0031] Further, as Figure 1 shown, the handling module includes: a mounting plate 21, a first carrying bracket 23, a first manipulator 25, a second manipulator 26, and a third manipulator 27; the mounting plate 21 is arranged on one side of the wafer cassette 1; the first carrying bracket 23 is slidably arranged on the mounting plate 21; the first manipulator 25 is arranged on the first carrying bracket 23 and is used to transfer the wafers in the wafer cassette 1 to the wafer observation module, enhancing the working efficiency of this embodiment, reducing the labor cost, and making this embodiment have the advantage of low processing cost; the second manipulator 26 is arranged on the first carrying bracket 23 and is used to transfer the wafers from the clamping mechanism 343 to the wafer array 33, enhancing the working efficiency of this embodiment, reducing the labor cost, and making this embodiment have the advantage of low processing cost; the third manipulator 27 is arranged on the first carrying bracket 23 and is used to transfer the wafers from the wafer array 33 to the stage of the wafer microscope 4, enhancing the working efficiency of this embodiment, reducing the labor cost, and making this embodiment have the advantage of low processing cost.

[0032] Further, as Figure 1 shown, the handling module further includes: a pair of guide members 22 and a first linear module; the pair of guide members 22 are arranged in parallel on the top of the mounting plate 21, the pair of guide members 22 are slidably connected to the first carrying bracket 23, and the pair of guide members 22 are guide rails for guiding the first carrying bracket 23; the first linear module 24 is arranged on the mounting plate 21, and the execution end of the first linear module 24 is connected to the first carrying bracket 23 and is used to drive the first carrying bracket 23 to slide along the guidance of the pair of guide members 22, saving the working space of the first manipulator 25, the second manipulator 26, and the third manipulator 27, reducing the volume of this embodiment, and enhancing the flexibility of this embodiment.

[0033] Specifically, asFigure 1 , 2 As shown in 2 , the wafer observation module is disposed on one side of the wafer cassette 1 for observing the wafer.

[0034] Furthermore, as Figure 1 , 2 shown in 2 , the wafer observation module includes: a second carrier bracket 31, a camera 32, a clamping assembly, and a wafer aligner 33; the second carrier bracket 31 is disposed on one side of the wafer cassette 1; the camera 32 is disposed on the second carrier bracket 31 for observing the wafer; the clamping assembly is disposed on one side of the second carrier bracket 31 for carrying the wafer; the wafer aligner 33 is disposed on one side of the clamping assembly for adjusting the placement direction of the wafer and displaying that the string of ORC is aligned with the specified angle.

[0035] Furthermore, as Figure 1 , 2 shown in 2 , the clamping assembly includes: a pair of third carrier brackets 341, a lifting mechanism 342, and a clamping mechanism 343; the pair of third carrier brackets 341 are symmetrically disposed on one side of the second carrier bracket 31, and the pair of third carrier brackets 341 are located between the second carrier bracket 31 and the handling module; the pair of lifting mechanisms 342 are respectively disposed on the pair of third carrier brackets 341 for driving the pair of clamping mechanisms 343 to lift; the pair of clamping mechanisms 343 are respectively disposed at the execution ends of the pair of lifting mechanisms 342 for fixing the wafer.

[0036] Furthermore, as Figure 1 , 2 shown in 2 , the clamping assembly further includes: a pair of second linear modules 344, the pair of second linear modules 344 are symmetrically disposed on one side of the second carrier bracket 31, and the execution ends of the pair of second linear modules 344 are respectively connected to the pair of third carrier brackets 341 for driving the pair of third carrier brackets 341 to move laterally, so that this embodiment is suitable for observing wafers of different sizes and different models.

[0037] Furthermore, as Figure 1 shown in Figure 1 , the wafer observation module further includes: a pair of grating sensors 345, any one of the grating sensors 345 is disposed on the second carrier bracket 31, and the other grating sensor 345 is disposed on one side of the clamping assembly, and the positions of the pair of grating sensors 345 correspond to each other for detecting whether the wafer is placed in place, improving the working efficiency and processing accuracy of this embodiment and increasing the production yield of this embodiment.

[0038] When the device is running, the first manipulator 25 transports the wafers in the wafer cassette 1 to the clamping mechanism 343. The grating sensor 345 detects the wafers. A pair of second linear modules 344 drive a pair of third carrier brackets 341 to move towards each other. The clamping mechanism 343 clamps and fixes the wafers. After the clamping mechanism 343 clamps and fixes the wafers, the lifting mechanism 342 drives the clamping mechanism 343 to rise a certain distance. The first clamping jaw returns to its initial position. The lifting mechanism 342 drives the clamping mechanism 343 to perform a lifting motion. After the lifting mechanism 342 adjusts the height of the clamping mechanism 343 to a position convenient for the camera 32 to observe, the camera 32 observes the clamping mechanism 343. Then, the second manipulator 26 grabs the wafers fixed by the clamping mechanism 343. After the second manipulator 26 finishes grabbing, the clamping mechanism 343 releases the wafers. A pair of second linear modules 344 drive a pair of third carrier brackets 341 to move away from each other, so that a pair of clamping mechanisms 343 move away from the wafers. The second manipulator 26 places the wafers on the wafer array device 33 and then returns to its initial position. The wafer array device 33 drives the wafers to rotate to adjust the placement positions of the wafers. Finally, the third manipulator 27 transfers the wafers on the wafer array device 33 to the stage of the wafer microscope 4. The user checks the wafers through the wafer microscope 4.

[0039] As above, with reference to Figure 1 、 2 The wafer microscope inspection machine according to the embodiment of the present invention is described, which solves the defects of high labor cost and low working efficiency in the prior art, is used to observe wafers of different models, and has the characteristics of high working efficiency, low processing cost, high processing precision, and high production yield.

[0040] It should be noted that in this specification, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article or device including the said elements.

[0041] Although the content of the present invention has been introduced in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and alternatives to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A wafer microscope inspection machine, characterized in that, It includes: a wafer cassette, a handling module, a wafer observation module and a wafer microscope; The wafer cassette is used for storing wafers; The wafer observation module is arranged on one side of the wafer cassette and is used for observing the wafers; The wafer microscope is arranged on the other side of the wafer cassette and is used for detecting the wafers; The handling module is arranged on one side of the wafer cassette and is used for handling the wafers; The handling module includes: a mounting plate, a first carrying bracket, a first manipulator, a second manipulator and a third manipulator; The mounting plate is arranged on one side of the wafer cassette; The first carrying bracket is slidably arranged on the mounting plate; The first manipulator is arranged on the first carrying bracket and is used for transferring the wafers in the wafer cassette to the wafer observation module; The second manipulator is arranged on the first carrying bracket and is used for transferring the wafers inside the wafer observation module; The third manipulator is arranged on the first carrying bracket and is used for transferring the wafers inside the wafer observation module to the wafer microscope; The wafer observation module includes: a second carrying bracket, a camera, a clamping component and a wafer array device; The second carrying bracket is arranged on one side of the wafer cassette; The camera is arranged on the second carrying bracket and is used for observing the wafers; The clamping component is arranged on one side of the second carrying bracket and is used for carrying the wafers; The wafer array device is arranged on one side of the clamping component and is used for adjusting the placement direction of the wafers; The clamping component includes: a pair of third carrying brackets, a lifting mechanism and a clamping mechanism; The pair of third carrying brackets are symmetrically arranged on one side of the second carrying bracket, and the pair of third carrying brackets are located between the second carrying bracket and the handling module; The pair of lifting mechanisms are respectively arranged on the pair of third carrying brackets; The pair of clamping mechanisms are respectively arranged at the execution ends of the pair of lifting mechanisms and are used for clamping and fixing the wafers; The wafer observation module further includes: a pair of grating sensors, with any one of the grating sensors arranged on the second carrying bracket and the other grating sensor arranged on one side of the clamping component, and the positions of the pair of grating sensors correspond to each other.

2. The wafer microscope inspection machine according to claim 1, wherein The handling module further includes: a pair of guiding members and a first linear module; The pair of guiding members are arranged in parallel on the top of the mounting plate, and the pair of guiding members are slidably connected to the first carrying bracket and are used for guiding the first carrying bracket; The first linear module is arranged on the mounting plate, and the execution end of the first linear module is connected to the first carrying bracket and is used for driving the first carrying bracket to slide along the guiding of the pair of guiding members.

3. The wafer microscope inspection machine according to claim 1, wherein The clamping component further includes: a pair of second linear modules, the pair of second linear modules are symmetrically arranged on one side of the second carrying bracket, and the execution ends of the pair of second linear modules are respectively connected to the pair of third carrying brackets and are used for driving the pair of third carrying brackets to move laterally.

Images