Electronic packaging and method of manufacturing the same

Abstract

The present invention relates to an electronic package and a method for manufacturing the same, including forming a heat sink on an electronic component and combining the heat sink so that the electronic component, the heat sink and the heat sink form a housing space, and a heat sink material is formed in the housing space and contacts the heat sink and the electronic component, wherein a fluid regulating space is formed between the heat sink and the heat sink to serve as a volume regulating space for the heat sink when thermal expansion and contraction occur.

Description

Technical Field

[0001] The present invention relates to a packaging structure, in particular to an electronic packaging component with a heat dissipation component and a manufacturing method thereof. Background Art

[0002] As the demand for electronic products in terms of functions and processing speed increases, semiconductor chips, as the core components of electronic products, need to have higher density electronic components and electronic circuits. Therefore, semiconductor chips will generate more heat energy during operation. In addition, since the conventional packaging colloid that covers the semiconductor chip has a thermal conductivity of only 0.8 W / (meter.Kelvin) (Wm -1 .k -1 ) has poor heat transfer materials (i.e., poor heat dissipation efficiency). Therefore, if the heat generated by the semiconductor chip cannot be effectively dissipated, it will cause damage to the semiconductor chip and product reliability problems.

[0003] Therefore, in order to quickly dissipate the heat to the outside, the industry usually configures a heat sink (heat spreader) in the semiconductor package. The heat sink is usually combined with the back of the semiconductor chip through a heat dissipation adhesive, such as a thermal interface material (TIM), so that the heat generated by the semiconductor chip can be dissipated by the heat dissipation adhesive and the heat sink. In addition, the top surface of the heat sink is usually exposed to the packaging glue or directly exposed to the atmosphere, so as to achieve a better heat dissipation effect.

[0004] like Figure 1 As shown, the existing semiconductor package 1 first sets a semiconductor chip 11 with its active surface 11a on a packaging substrate 10 using a flip chip bonding method (i.e., through conductive bumps 110 and bottom glue 111), and then combines a heat sink 13 with its top plate 130 on the inactive surface 11b of the semiconductor chip 11 through a TIM layer 12, and the supporting legs 131 of the heat sink 13 are mounted on the packaging substrate 10 through an adhesive layer 14.

[0005] During operation, heat energy generated by the semiconductor chip 11 is conducted to the top plate 130 of the heat sink 13 through the inactive surface 11 b and the TIM layer 12 to be dissipated to the outside of the semiconductor package 1 .

[0006] In addition, in order to meet the development trend of electronic products towards multi-connection (I / O), large-size packaging specifications, large area and high heat dissipation, liquid metal is used to make the TIM layer 12 to replace the traditional hard material TIM.

[0007] However, in the conventional semiconductor package 1, since the TIM layer 12 is liquid metal, which is fluid and expands at high temperatures, it cannot be stably laid on the non-active surface 11b of the semiconductor chip 11, and may even overflow outside the semiconductor package 1, causing other components outside the semiconductor package 1 to be contaminated.

[0008] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the invention

[0009] In view of the above-mentioned defects of the prior art, the present invention provides an electronic package and a method for manufacturing the same, which can adjust the volume space during thermal expansion and contraction.

[0010] The electronic package of the present invention comprises: a supporting structure; an electronic component, which is arranged on the supporting structure; a heat sink, which is arranged around the electronic component; a heat sink, which is arranged on the heat sink so that the electronic component, the heat sink and the heat sink form a accommodating space; and a heat dissipation material, which is formed in the accommodating space and contacts the heat sink and the electronic component, wherein a fluid regulating space is formed between the heat dissipation material and the heat sink.

[0011] The present invention also provides a method for manufacturing an electronic package, comprising: providing a heat generating object and a heat dissipation element, the heat generating object comprising a supporting structure and an electronic component disposed on the supporting structure; annularly disposing a heat dissipation body on the electronic component; forming a heat dissipation material on the electronic component; and disposing the heat dissipation element on the heat dissipation body so that the electronic component, the heat dissipation body and the heat dissipation element form a containing space, so that the heat dissipation material is located in the containing space and contacts the heat dissipation element and the electronic component, wherein a fluid regulating space is formed between the heat dissipation material and the heat dissipation body.

[0012] In the aforementioned electronic package and its manufacturing method, the fluid regulating space contains air or is filled with the heat dissipating material.

[0013] In the aforementioned electronic package and its manufacturing method, the heat sink is annularly surrounding the heat sink material, so that the outer periphery of the heat sink material and the inner periphery of the heat sink define the fluid regulating space.

[0014] In the aforementioned electronic package and its manufacturing method, the heat sink is arranged along the edge of the upper surface of the electronic component.

[0015] In the aforementioned electronic package and its manufacturing method, the heat sink is formed with at least one regulating channel, which has a gas section, and the gas section connects the fluid regulating space with the outside of the heat sink. For example, the regulating channel also has a fluid section formed on the inner annular surface, which is connected to the gas section in a shape that tapers toward the gas section, so that the fluid section defines the fluid regulating space. Alternatively, the minimum width of the regulating channel is between 10 and 1200 microns, and further, the minimum width of the regulating channel is between 10 and 800 microns.

[0016] In the aforementioned electronic package and its manufacturing method, the volume of the fluid regulating space is greater than or equal to the difference between the volume expansion of the heat dissipating material after being heated and the volume change of the accommodating space after being heated.

[0017] In the aforementioned electronic package and its manufacturing method, the ratio of the volume of the fluid regulating space to the volume of the heat dissipation material is between 27.72 and 146.16 (μm 3 / mm 3 )between.

[0018] In the aforementioned electronic package and its manufacturing method, the heat sink has a recess corresponding to the accommodating space, which is filled with the heat dissipation material. For example, the recess is a groove, which is located at a position corresponding to the center of the accommodating space of the heat sink. Alternatively, the recess is a channel, which is arranged along the edge of the heat sink corresponding to the accommodating space. Alternatively, the heat sink also has an auxiliary channel connected to the recess. Furthermore, the heat sink is formed with at least one regulating channel, which has a gas section, and the gas section connects the fluid regulating space with the outside of the heat sink, so that the auxiliary channel is connected or not connected to the gas section.

[0019] As can be seen from the above, the electronic package and the manufacturing method thereof of the present invention can effectively prevent the heat dissipation material from overflowing out of the electronic package through the heat dissipation body, thereby avoiding the problem of other components outside the electronic package being contaminated, and mainly through the formation of a fluid adjustment space between the heat dissipation body and the heat dissipation material, which serves as the volume adjustment space of the heat dissipation material when it expands and contracts due to heat, thereby avoiding the bursting problem caused by the incompressibility of the fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0021] FIG. 2A to FIG. 2C It is a cross-sectional schematic diagram of a method for manufacturing the first embodiment of the electronic package of the present invention.

[0022] Figure 2A-1 for Figure 2A Schematic diagram of the top view.

[0023] Figure 2C-1 for Figure 2C A partially enlarged cross-sectional schematic diagram in which the heat dissipation material is omitted.

[0024] Figure 2C-2 for Figure 2C-1 A cross-sectional schematic diagram of another embodiment of the present invention.

[0025] Figure 2D for Figure 2C The top view of the heat sink is omitted.

[0026] Figure 2D-1 for Figure 2D A partial enlarged top view of .

[0027] Figure 2D-2 for Figure 2D-1 A top schematic diagram of another embodiment of the present invention is shown in FIG.

[0028] FIG. 3A to FIG. 3C FIG. 4 is a cross-sectional schematic diagram of a manufacturing method of a second embodiment of an electronic package of the present invention.

[0029] Figure 3A-1 for Figure 3A A bottom view of a heat sink, wherein: Figure 3A for Figure 3A-1 Section view of the AA section line.

[0030] Figure 3D for Figure 3C The process shown is a cross-sectional schematic diagram after compression.

[0031] Figure 3D-1 for Figure 3C The top view of the heat sink is omitted.

[0032] FIG. 4A to FIG. 4C It is a cross-sectional schematic diagram of a manufacturing method of a third embodiment of an electronic package of the present invention.

[0033] Figure 4A-1 for Figure 4A A bottom view of a heat sink, wherein: Figure 4A for Figure 4A-1 Cross-sectional view of the BB section line.

[0034] Figure 4C-1 for Figure 4C Schematic diagram of the top view along the C1-C1 cross section.

[0035] Figure 4D-1 for Figure 4C The process shown is a partial enlarged cross-sectional schematic diagram before compression.

[0036] Figure 4D-2 for Figure 4C A partially enlarged cross-sectional schematic diagram of .

[0037] Description of Reference Numerals

[0038] 1: Semiconductor packaging

[0039] 10:Packaging substrate

[0040] 11: Semiconductor Chips

[0041] 11a, 25a: Action surface

[0042] 11b, 25b: non-active surface

[0043] 110: Conductive bump

[0044] 111,250: Primer

[0045] 12: TIM layer

[0046] 13: Heat sink

[0047] 130: Top sheet

[0048] 131,21: Support feet

[0049] 14: Adhesive layer

[0050] 2,3,4: Electronic packaging

[0051] 2a: Heat generating objects

[0052] 2b, 3b, 4b: heat sink

[0053] 20: Heat sink

[0054] 20a: First side

[0055] 20b: Second side

[0056] 22: Heat sink

[0057] 220: Adjustment channel

[0058] 221: Fluid section

[0059] 222: Gas section

[0060] 23: Heat dissipation material

[0061] 230: Air gap

[0062] 24: Bearing structure

[0063] 25: Electronic components

[0064] 25c: Side

[0065] 26: Binding material

[0066] 30,40: concave part

[0067] 31: Auxiliary channel

[0068] A: Fluid conditioning space

[0069] D: Cross-sectional area

[0070] D1,D2,W: Width

[0071] R: Dashed outline

[0072] R1: Solid outline

[0073] S, S1: Accommodation space

[0074] Z: Central area. DETAILED DESCRIPTION

[0075] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0076] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0077] FIG. 2A to FIG. 2C It is a cross-sectional schematic diagram of a manufacturing method of a first embodiment of an electronic package 2 of the present invention.

[0078] like Figure 2A As shown, a heat generating object 2a is provided, and a heat sink 22 is arranged on the heat generating object 2a.

[0079] In this embodiment, the heat generating object 2a is, for example, a package module, which includes a supporting structure 24 and an electronic component 25 disposed on the supporting structure 24 , and the heat sink 22 is combined with the electronic component 25 , and a bonding material 26 such as glue is formed on the supporting structure 24 .

[0080] The supporting structure 24 is, for example, a package substrate with a core layer and a circuit structure, a package substrate with a coreless circuit structure, a silicon interposer (TSI) with conductive through-silicon via (TSV), or other board types, which include at least one insulating layer and at least one circuit layer combined with the insulating layer, such as at least one fan-out redistribution layer (RDL). It should be understood that the supporting structure 24 can also be other board materials for supporting chips, such as a leadframe, a wafer, or other boards with metal routing, etc., and is not limited to the above.

[0081] The electronic component 25 is an active component, a passive component, a chip module or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. In the present embodiment, the electronic component 25 is a semiconductor chip having an active surface 25a (or a lower surface) and an inactive surface 25b (or an upper surface) opposite to each other, and the active surface 25a is disposed on the circuit layer of the supporting structure 24 in a flip chip manner through a plurality of conductive bumps such as solder materials, metal pillars or other conductive bumps and electrically connected to the circuit layer, and the electronic component 25 is encapsulated with a primer 250, and the heat sink 22 is combined with the inactive surface 25b; or, the electronic component 25 can be electrically connected to the circuit layer of the supporting structure 24 by a wire bonding manner through a plurality of welding wires (not shown); or, the electronic component 25 can directly contact the circuit layer of the supporting structure 24. It should be understood that there are many ways to electrically connect the electronic component 25 to the supporting structure 24 , and the required type and number of electronic components can be placed on the supporting structure 24 , which are not limited to the above.

[0082] In addition, the heat sink 22 is disposed around the edge of the non-active surface 25b to form a ring shape, and the heat sink 22 is formed with an adjustment channel 220 (such as Figure 2A-1 As shown), the volume of the heat dissipation material 23 used in subsequent processes is adjusted.

[0083] The regulating channel 220 defines a fluid section 221 connected to the non-active surface 25b in the ring of the heat sink 22, and at least one gas section 222 connected to the fluid section 221 outside the non-active surface 25b. For example, one opening end of the gas section 222 is connected to the fluid section 221, and the other opening end of the gas section 222 is away from the fluid section 221. Figure 2A-1Preferably, the cross-sectional area D of the fluid section 221 gradually decreases toward the gas section 222, as shown in FIG. Figure 2A-1 As shown, the gas section 222 is a channel, and the distance between the two opposite sides (ie, the width W of the gas section 222) can be gradually reduced (not shown) or uniform (such as Figure 2A-1 It should be understood that the channel path and shape of the gas section 222 can be designed according to the needs and there is no particular limitation.

[0084] In addition, the heat sink 22 has a low thermal conductivity of about 2 to 20 W / (meter.Kelvin) (Wm-1K-1), and may be a bonding film containing silicone material or ultraviolet (UV) glue such as acrylic material, and may also contain metal particles, graphite material or other appropriate fillers. For example, the silicone material not only has high ductility, but also has a higher thermal conductivity than UV glue, so compared to UV glue, the heat sink 22 is preferably made of silicone material.

[0085] like Figure 2B As shown, a heat sink 2b is provided, and a heat dissipation material 23 is formed on the inactive surface 25b of the electronic component 25, so that the heat dissipation material 23 and the inactive surface 25b of the electronic component 25 are tightly joined without other media (such as air or other gases). In another embodiment, the heat dissipation material 23 can also be formed first, and then the bonding material 26 can be formed on the supporting structure 24.

[0086] In this embodiment, the heat dissipation material 23 has a high thermal conductivity of about 25 to 80 W·m -1 Kelvin -1 (Wm -1 K -1 ). For example, the heat dissipation material 23 is solid indium (In) or liquid metal.

[0087] In addition, the heat sink 2 b includes a heat sink 20 and at least one supporting leg 21 vertically disposed on the heat sink 20 , wherein the heat sink 20 has a first side 20 a and a second side 20 b opposite to each other.

[0088] In addition, the heat dissipation material 23 is located in the ring of the heat dissipation body 22 , and the heat dissipation material 23 can be arranged on the surface of the first side 20 a of the heat dissipation sheet 20 according to needs.

[0089] In addition, the supporting foot 21 is disposed at an edge of the first side 20 a of the heat sink 20 and extends toward the supporting structure 24 .

[0090] like Figure 2CAs shown, the heat sink 2b is combined with the heat generating object 2a, so that the heat sink 20 is combined with the electronic component 25 of the heat generating object 2a through the heat dissipation material 23, and the support leg 21 of the heat sink 2b is combined with the combination material 26 on the supporting structure 24 of the heat generating object 2a, so that the non-active surface 25b of the electronic component 25, the first side 20a of the heat sink 20 and the heat sink 22 form an accommodating space S, as shown in FIG. Figure 2C-1 As shown, the heat dissipation material 23 is accommodated. Afterwards, baking and curing are performed to obtain the desired electronic package 2.

[0091] In this embodiment, the heat dissipation material 23 is used as a thermal interface material (TIM) to be combined with the heat generating object 2a. Figure 2D For example, the outer periphery of the heat dissipation material 23 and the inner periphery of the heat dissipation body 22 form an air gap 230, and the air gap 230 and the fluid section 221 define a fluid regulating space A. If the heat dissipation material 23 expands outward toward the heat dissipation body 22 after thermal expansion, since the heat dissipation material 23 is a fluid and is incompressible, the fluid regulating space A can be used to adjust the volume expansion and contraction of the heat dissipation material 23 during thermal expansion, as shown in FIG. Figure 2D-1 to Figure 2D-2 The heat dissipation material 23 shown fills the air gap 230 and diffuses to the fluid section 221 , thereby avoiding the popcorn problem.

[0092] In addition, the width W of the gas section 222 of the heat sink 22 is designed so that it can stop the heat sink 23 from diffusing and overflowing from the accommodation space S through the surface tension and cohesive force, so the heat sink 22 can prevent the heat sink 23 from leaking from the side (i.e., the side 25c of the electronic component 25). For example, the width W is 10 to 1200 micrometers (um), preferably 10 to 800 micrometers.

[0093] In addition, the fluid section 221 can accommodate part of the heat dissipation material 23 to adjust the volume of the heat dissipation material 23, such as Figure 2D-1 to Figure 2D-2 As shown, the gas section 222 maintains an air state to adjust the volume of the gas so that the excess gas can be quickly discharged to a predetermined location, that is, the heat dissipation material 23 will not remain in the gas section 222.

[0094] In addition, the volume of the fluid regulating space A is greater than or equal to the volume expansion of the heat dissipation material 23 at high temperature (about 300° C.) (e.g. Figure 4D-1 to Figure 4D-2 The volume change e) shown in FIG23 and the volume change caused by the warping of the accommodation space S when heated (about 300° C.) (i.e., Figure 2C-2The difference between the accommodating space S1 in the warped state shown in the figure and the normal accommodating space S, wherein when the volume of the accommodating space S increases due to heat, the volume change e is a positive value, and when the volume of the accommodating space S decreases due to heat, the volume change e is a negative value) (i.e., A≧e-(S1-S)). For example, at room temperature, when the heat dissipation material 23 is liquid metal (whose gallium (Ga) / indium (In) ratio is 7:3, but not limited to this), the ratio of the volume of the fluid regulating space A to the volume of the heat dissipation material 23 is between 27.72 and 146.16 (μm 3 / ㎜ 3 ), the optimal fluid volume adjustment effect can be achieved, and the effective contact and heat dissipation area between the heat dissipation material 23 and the heat dissipation element 2b can be optimized before and after the thermal warping state occurs. It can be seen that the volume of the fluid adjustment space A needs to take into account the thermal expansion of the heat dissipation material 23 and the volume change of the accommodating space S caused by the warping due to heat.

[0095] Therefore, the electronic package 2 of the present invention defines a fluid regulating space A through the air gap 230 formed between the heat sink 22 and the heat sink material 23 and the fluid section 221, which is used as a volume regulating space for the heat sink 23 when it expands and contracts, thereby avoiding the bursting problem caused by the incompressibility of the fluid. It should be understood that the fluid regulating space A may also only include the fluid section 221, and there is no air gap 230 between the heat sink 22 and the heat sink material 23, so that the fluid volume can be adjusted only through the fluid section 221.

[0096] Furthermore, the heat sink 22 is designed with the regulating channel 220 to provide space for regulating the thermal expansion of the heat sink 23, and the air volume is regulated through the gas section 222 so that the air can be discharged outward without being squeezed. Therefore, compared with the prior art, the fluid section 221 of the present invention can provide space for regulating the thermal expansion of the heat sink 23, so that at high temperatures, the heat sink 23 can be stably laid on the non-active surface 25b of the electronic component 25, and through the width W of the gas section 222, the gas section 222 can act through surface tension and cohesion to produce the effect of stopping the heat sink 23 from overflowing into the gas section 222, which can not only effectively prevent the heat sink 23 from overflowing out of the electronic package 2 and avoid the problem of other components outside the electronic package 2 being contaminated, but also the pressure can be adjusted through the gas section 222 to avoid the problem of popcorn.

[0097] In addition, the cross-sectional area D of the fluid section 221 is gradually reduced, so that the width D1 of the inlet side of the heat dissipation material 23 is larger (the pressure here is smaller), such as Figure 2DAs shown, the heat dissipation material 23 will flow toward the fluid section 221 after being pressurized, and the volume adjustment space of the fluid can be effectively enlarged through the tapered design of the fluid section 221.

[0098] FIG. 3A to FIG. 3C 2 is a cross-sectional view of a manufacturing method of a second embodiment of the electronic package 3 of the present invention. The difference between this embodiment and the first embodiment lies in the structure of the heat sink 3b, so the same points will not be described in detail below.

[0099] like Figure 3A As shown, a heat sink 3b having a recess 30 in the shape of a groove is provided, and the recess 30 is formed on the first side 20a of the heat sink 20 and is rectangular in shape, as shown in FIG. Figure 3A-1 shown.

[0100] In this embodiment, the recess 30 is located at the center of the surface of the first side 20a of the heat sink 20, and at least one auxiliary channel 31 connected to the edge of the recess 30 may also be formed on the first side 20a of the heat sink 20. For example, the position of the auxiliary channel 31 may correspond to the position of the adjustment channel 220. It should be understood that the shape of the auxiliary channel 31 may also be designed according to needs, such as corresponding to the shape and width of the adjustment channel 220 (such as Figure 3A-1 The flattened channel shown in the figure) or other types are not particularly limited.

[0101] like Figure 3B As shown, proceed as Figure 2B In the manufacturing process shown, the heat dissipation material 23 is formed on the inactive surface 25 b of the electronic component 25 , and a portion of the heat dissipation material 23 can be arranged in the recess 30 of the heat dissipation element 3 b .

[0102] like Figure 3C As shown, the heat sink 3b is combined with the heat generating object 2a, so that the heat sink 20 is combined with the electronic component 25 of the heat generating object 2a via the heat dissipation material 23, and the support leg 21 of the heat sink 2b is combined with the combination material 26 on the bearing structure 24 of the heat generating object 2a, so that the non-active surface 25b of the electronic component 25, the heat sink 20, the recess 30 and the heat sink 22 form a receiving space to accommodate the heat dissipation material 23, wherein the recess 30 is filled with the heat dissipation material 23. Afterwards, baking and curing are performed to obtain the desired electronic package 3.

[0103] In this embodiment, a fluid regulating space A is formed between the heat sink 22 and the heat sink material 23, which is used as a volume regulating space for the heat sink material 23 when it is thermally expanded and contracted. If the heat sink material 23 expands outward toward the heat sink 22 after thermal expansion, the fluid regulating space A can be used to adjust the volume expansion and contraction of the heat sink material 23 when it is thermally expanded. Figure 3D and Figure 3D-1The heat dissipation material 23 shown fills the air gap 230 .

[0104] In addition, the auxiliary channel 31 is used to adjust the volume of the gas, allowing the gas to escape to prevent the problem of popcorn, and the auxiliary channel 31 can be connected to the regulating channel 220 or not. Specifically, the function of the auxiliary channel 31 is the same as that of the gas section 222, so that the air volume can be adjusted through the auxiliary channel 31, so that the air can be discharged outward without being squeezed. Therefore, the present invention is designed through the width D2 of the auxiliary channel 31, for example, the width D2 is 10 to 1200 microns (um), preferably 10 to 800 microns, such as Figure 3D-1 As shown, the auxiliary channel 31 can stop the heat dissipation material 23 from overflowing into the auxiliary channel 31 through the action of surface tension and cohesive force. This can not only effectively prevent the heat dissipation material 23 from overflowing out of the electronic package 2 and avoid the problem of other components outside the electronic package 2 being contaminated, but also the pressure can be adjusted through the auxiliary channel 31 to avoid the problem of popcorn.

[0105] Therefore, the electronic package 3 of the present invention has a concave portion 30 through the design of the heat sink 3b to increase the space for accommodating the heat sink 23, so that more heat sink 23 can be filled in. Therefore, when the electronic package 3 is heated and warped (such as Figure 2C-2 ), by pre-filling more heat dissipation material 23 to compensate for the deformation of the accommodation space caused by the warping phenomenon, the heat dissipation contact area between the heat dissipation material 23 and the heat dissipation element 3b can still meet the requirements to effectively perform heat dissipation. Preferably, when the warping direction of the electronic package 3 is U-shaped (such as Figure 2C-2 In other words, in the first embodiment, when the smiling face state (the dotted outline R shown in FIG. 1 ) is formed, the compensation condition of the concave portion 30 is better. Figure 2C-2 When the warping phenomenon is shown, the contact area between the heat dissipation material 23 and the heat dissipation sheet 20 will be reduced, resulting in a lower heat dissipation efficiency than that of the present embodiment.

[0106] FIG. 4A to FIG. 4C Schematic cross-sectional view of the manufacturing method of the third embodiment of the electronic package 4 of the present invention. The difference between this embodiment and the first embodiment lies in the design of the heat sink 4b, so the same points will not be described in detail below.

[0107] like Figure 4A As shown, a heat sink 4b having a channel-like recess 40 is provided, and the recess 40 is formed on the first side 20a of the heat sink 20, and is annular, as shown in FIG. Figure 4A-1 Rectangular ring shown.

[0108] In this embodiment, the recess 40 is located along the edge of the non-active surface 25b of the electronic component 25 and within the ring of the heat sink 22 to be formed at the edge of the surface center area Z of the first side 20a of the heat sink 20. Figure 4A-1 As shown, at least one auxiliary channel 31 communicating with the recess 40 may also be formed on the first side 20a of the heat sink 20. For example, the position of the auxiliary channel 31 may correspond to the position of the adjustment channel 220.

[0109] like Figure 4B As shown, proceed as Figure 2B The manufacturing process shown forms the heat dissipation material 23 on the inactive surface 25 b of the electronic component 25 , and a portion of the heat dissipation material 23 can be disposed on the heat sink 20 at the inner ring of the recess 40 .

[0110] like Figure 4C As shown, the heat sink 4b is combined with the heat generating object 2a, so that the heat sink 20 is combined with the electronic component 25 of the heat generating object 2a through the heat dissipation material 23, and the support leg 21 of the heat sink 2b is combined with the combination material 26 on the supporting structure 24 of the heat generating object 2a, so that the non-active surface 25b of the electronic component 25, the heat sink 20, the recess 40 and the heat sink 22 form a receiving space to accommodate the heat dissipation material 23, wherein the recess 40 can be filled with the heat dissipation material 23, as shown in FIG. Figure 4C-1 Afterwards, baking and curing are performed to obtain the desired electronic package 4.

[0111] In this embodiment, the heat dissipation material 23 expands outward toward the heat dissipation body 22 after thermal expansion, so that the heat dissipation material 23 fills the fluid adjustment space A (such as Figure 2D-1 to Figure 2D-2 ).

[0112] Therefore, the electronic package 4 of the present invention has a design of the concave portion 40 through which the heat sink 4b is provided to increase the space for accommodating the heat sink 23, so that more heat sink 23 can be filled in. Figure 4C As shown, when the electronic package 4 is heated and warped (such as Figure 2C-2 ), by pre-filling more heat dissipation material 23 to compensate for the deformation of the accommodation space S caused by the warping phenomenon, the heat dissipation contact area between the heat dissipation material 23 and the heat dissipation element 4b can still meet the requirements to effectively perform the heat dissipation function. Preferably, when the warping direction of the electronic package 4 is an inverted U shape (such as Figure 2C-2 When the solid line profile R1 is in the crying face state shown in FIG. 1 , the compensation condition of the recess 40 is better.

[0113] In addition, the auxiliary channel 31 is used to adjust the volume of the gas, allowing the gas to escape to prevent the problem of popcorn, and the auxiliary channel 31 can be connected to the regulating channel 220 or not. Specifically, the function of the auxiliary channel 31 is the same as that of the gas section 222, so that the air volume can be adjusted through the auxiliary channel 31, so that the air can be discharged outward without being squeezed. Therefore, the present invention is designed through the width D2 of the auxiliary channel 31, for example, the width D2 is 10 to 1200 microns (um), preferably 10 to 800 microns, such as Figure 4C-1 As shown, the auxiliary channel 31 can stop the heat dissipation material 23 from overflowing into the auxiliary channel 31 through the action of surface tension and cohesive force. This can not only effectively prevent the heat dissipation material 23 from overflowing out of the electronic package 2 and avoid the problem of other components outside the electronic package 2 being contaminated, but also the pressure can be adjusted through the auxiliary channel 31 to avoid the problem of popcorn.

[0114] In other embodiments, the recess 40 may also be in a straight strip shape, along the edge of the inactive surface 25 b of the configured electronic component 25 and located within the ring of the heat sink 22 , so as to be formed at the edge of the surface center area Z of the first side 20 a of the heat sink 20 .

[0115] The present invention also provides an electronic package 2, 3, 4, comprising: a supporting structure 24, an electronic component 25 arranged on the supporting structure 24, a heat sink 22 arranged around the electronic component 25, a heat sink material 23 arranged on the electronic component 25, and a heat sink 2b, 3b, 4b arranged on the heat sink 22.

[0116] The electronic component 25 , the heat sink 22 and the heat sinks 2 b , 3 b , 4 b form an accommodation space S.

[0117] The heat dissipation material 23 is formed in the accommodating space S and contacts the heat dissipation elements 2 b , 3 b , 4 b and the electronic component 25 , wherein a fluid regulating space A is formed between the heat dissipation material 23 and the heat dissipation body 22 .

[0118] In one embodiment, the fluid regulating space A contains air (such as the air gap 230 and / or the fluid section 221 ) or is filled with the heat dissipation material 23 .

[0119] In one embodiment, the heat sink 22 surrounds the heat sink material 23 in a ring shape, so that the fluid regulating space A is defined by the outer periphery of the heat sink material 23 and the inner periphery of the heat sink 22 .

[0120] In one embodiment, the heat sink 22 is disposed along a surface edge of the electronic component 25 .

[0121] In one embodiment, the heat sink 22 is formed with at least one regulating channel 220, which has a gas section 222, and the gas section 222 connects the fluid regulating space A with the outside of the heat sink 22. For example, the regulating channel 22 also has a fluid section 221 formed on the inner annular surface, which is connected to the gas section 222 in a state of gradually contracting toward the gas section 222, so that the fluid section 221 defines the fluid regulating space A. Alternatively, the minimum width W of the regulating channel 220 is between 10 and 1200 microns, preferably between 10 and 800 microns.

[0122] In one embodiment, the volume of the fluid regulating space A is greater than or equal to the difference between the volume expansion of the heat dissipating material 23 after being heated and the volume change of the accommodating space S after being heated.

[0123] In one embodiment, the ratio of the volume of the fluid regulating space A to the volume of the heat dissipation material 23 is between 27.72 and 146.16 (μm 3 / mm 3 )between.

[0124] In one embodiment, the heat sink 3b, 4b has recesses 30, 40 corresponding to the accommodating space S, which are filled with the heat sink 23. For example, the recess 30 is a groove, which is located at the center of the heat sink 3b corresponding to the accommodating space S. Alternatively, the recess 40 is a channel, which is arranged along the edge of the heat sink 4b corresponding to the accommodating space S. Alternatively, the heat sink 3b, 4b also has an auxiliary channel 31 connecting the recesses 30, 40. Further, the heat sink 22 is formed with at least one regulating channel 220, which has a gas section 222, and the gas section 222 connects the fluid regulating space A with the outside of the heat sink 22, so that the auxiliary channel 31 is connected or not connected to the gas section 222.

[0125] In summary, the electronic package and the manufacturing method thereof of the present invention can effectively prevent the heat dissipation material from overflowing out of the electronic package mainly by surrounding the heat dissipation material with the heat dissipation body, thereby avoiding the problem of other components outside the electronic package being contaminated, and a fluid regulating space is formed between the heat dissipation body and the heat dissipation material to serve as a volume regulating space for the heat dissipation material when it expands and contracts with heat, thereby avoiding the bursting problem caused by the incompressibility of the fluid.

[0126] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, characterized in that: include: load-bearing structure; an electronic component disposed on the supporting structure; A heat sink is disposed around the electronic component, wherein the heat sink is formed with at least one regulating channel having a gas section; A heat sink is disposed on the heat sink so that the electronic component, the heat sink and the heat sink form a containing space; and A heat dissipation material is formed in the accommodating space and contacts the heat dissipation element and the electronic component, wherein a fluid regulating space is formed between the heat dissipation material and the heat sink, and the gas section connects the fluid regulating space with the outside of the heat sink, wherein the regulating channel also has a fluid section formed on the inner annular surface, which is connected to the gas section in a shape that tapers toward the gas section so that the fluid section defines the fluid regulating space.

2. The electronic package according to claim 1, wherein: The fluid regulating space contains air.

3. The electronic package according to claim 1, wherein: The heat sink is annularly surrounding the heat sink material, so that the outer periphery of the heat sink material and the inner periphery of the heat sink define the fluid regulating space.

4. The electronic package according to claim 1, wherein: The heat sink is arranged along the edge of the upper surface of the electronic component.

5. The electronic package according to claim 1, wherein: The minimum width of the gas segment is between 10 and 1200 microns.

6. The electronic package according to claim 1, wherein: The minimum width of the gas segment is between 10 and 800 microns.

7. The electronic package according to claim 1, wherein: The volume of the fluid regulating space is greater than or equal to the difference between the volume expansion of the heat dissipating material after being heated and the volume change of the accommodating space after being heated.

8. The electronic package according to claim 1, wherein: The ratio of the volume of the fluid regulating space to the volume of the heat dissipation material is between 27.72 and 146.16 (μm 3 / mm 3 )between.

9. The electronic package according to claim 1, wherein: The heat dissipation element has a concave portion corresponding to the accommodating space, and the concave portion is filled with the heat dissipation material.

10. The electronic package according to claim 9, wherein: The concave portion is a groove, which is located at a position of the heat sink corresponding to the center of the accommodating space.

11. The electronic package according to claim 9, wherein: The recess is a channel, which is arranged along the edge of the heat sink corresponding to the accommodating space.

12. The electronic package according to claim 9, wherein: The heat sink also has an auxiliary channel connected to the recess.

13. The electronic package according to claim 12, wherein: The auxiliary channel is connected to or not connected to the gas section.

14. A method for manufacturing an electronic package, characterized in that: include: A heat generating object and a heat dissipating element are provided, wherein the heat generating object comprises a supporting structure and an electronic component disposed on the supporting structure; A heat sink is disposed around the electronic component, wherein the heat sink is formed with at least one regulating channel having a gas section; forming a heat dissipation material on the electronic component; and The heat sink is arranged on the heat sink so that the electronic component, the heat sink and the heat sink form a accommodating space, so that the heat sink is located in the accommodating space and contacts the heat sink and the electronic component, wherein a fluid regulating space is formed between the heat sink and the heat sink, and the gas section connects the fluid regulating space with the outside of the heat sink, wherein the regulating channel also has a fluid section formed on the inner annular surface, which is connected to the gas section in a shape that tapers toward the gas section, so that the fluid section defines the fluid regulating space.

15. The method for manufacturing an electronic package as claimed in claim 14, wherein: The fluid regulating space contains air.

16. The method for manufacturing an electronic package as claimed in claim 14, wherein: The heat sink is annularly surrounding the heat sink material, so that the outer periphery of the heat sink material and the inner periphery of the heat sink define the fluid regulating space.

17. The method for manufacturing an electronic package as claimed in claim 14, wherein: The heat sink is arranged along the edge of the upper surface of the electronic component.

18. The method for manufacturing an electronic package as claimed in claim 14, wherein: The minimum width of the regulating channel is between 10 and 1200 microns.

19. The method for manufacturing an electronic package as claimed in claim 14, wherein: The minimum width of the regulating channel is between 10 and 800 microns.

20. The method for manufacturing an electronic package as claimed in claim 14, wherein: The volume of the fluid regulating space is greater than or equal to the difference between the volume expansion of the heat dissipating material after being heated and the volume change of the accommodating space after being heated.

21. The method for manufacturing an electronic package as claimed in claim 14, wherein: The ratio of the volume of the fluid regulating space to the volume of the heat dissipation material is between 27.72 and 146.16 (μm 3 / mm 3 )between.

22. The method for manufacturing an electronic package as claimed in claim 14, wherein: The heat dissipation component has a concave portion corresponding to the accommodating space, and the concave portion is filled with the heat dissipation material.

23. The method for manufacturing an electronic package as claimed in claim 22, wherein: The concave portion is a groove, which is located at a position of the heat sink corresponding to the center of the accommodating space.

24. The method for manufacturing an electronic package as claimed in claim 22, wherein: The recess is a channel, which is arranged along the edge of the heat sink corresponding to the accommodating space.

25. The method for manufacturing an electronic package as claimed in claim 22, wherein: The heat sink also has an auxiliary channel connected to the recess.

26. The method for manufacturing an electronic package as claimed in claim 25, wherein: The auxiliary channel is connected to or not connected to the gas section.

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