Two-phase immersion liquid cooling equipment and system

Abstract

The present invention provides a two-phase immersion liquid cooling device and system, which belongs to the technical field of electronic equipment cooling, and is intended to solve the technical problem of poor sealing performance between cable joints and cabinets and gas leakage; the liquid cooling device includes a first chamber and a second chamber that are isolated from each other, the first chamber has a first liquid phase area and a first gas phase area, the second chamber has a second liquid phase area and a second gas phase area, the first liquid phase area is used to place electronic equipment, and the electronic equipment is immersed in cooling liquid, the second liquid phase area is provided with a first through hole connected to the first liquid phase area, and the second gas phase area is provided with a second through hole connected to the outside of the cabinet; a first seal is provided in the first through hole, and a second seal is provided in the second through hole; one end of the cable passes through the second seal and the first seal, and is connected to the electronic equipment. The two-phase immersion liquid cooling device and system provided by the present invention can avoid the occurrence of gas leakage and improve the sealing performance of the liquid cooling device.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment cooling, and in particular to a two-phase immersion liquid cooling device and system. Background Art

[0002] With the rapid development of cloud computing, the requirements for computing performance are getting higher and higher. As server performance improves, power consumption is rising sharply, and cabinet power consumption is increasing exponentially. Therefore, the heat dissipation problem of servers has become a hot topic.

[0003] At present, a two-phase immersion liquid cooling system is generally used to cool down the server to improve the computing performance of the server. The two-phase immersion liquid cooling equipment includes a cabinet and a cable connector. The cabinet includes a liquid phase area and a gas phase area. The liquid phase area has a coolant. The server and other electronic equipment are placed in the liquid phase area. The cable connector is set on the side wall of the cabinet and is located in the gas phase area, so that the cables inside and outside the cabinet are connected together through the cable connector. However, the sealing performance between the above cable connector and the cabinet is poor, and there is a phenomenon of gas leakage. Summary of the invention

[0004] The embodiment of the present invention provides a two-phase immersion liquid cooling device, which can avoid gas leakage and improve the sealing performance of the liquid cooling device.

[0005] In order to achieve the above purpose, the embodiment of the present invention adopts the following technical solution:

[0006] According to a first aspect of an embodiment of the present invention, there is provided a two-phase immersion liquid cooling device, comprising a cabinet and a cable; the cabinet comprises a first chamber and a second chamber isolated from each other, the second chamber is located outside the first chamber, the first chamber is provided with a cooling liquid, the liquid surface of the cooling liquid and the top of the first chamber form a first gas phase zone, and the liquid surface of the cooling liquid and the bottom of the first chamber form a first liquid phase zone; the second chamber is provided with a sealing liquid, the liquid surface of the sealing liquid and the top of the second chamber form a second gas phase zone, and the liquid surface of the sealing liquid and the bottom of the second chamber form a second liquid phase zone; the first liquid phase zone is used to place an electronic device, and at least part of the electronic device is immersed in the cooling liquid, the second liquid phase zone is provided with a first through hole connected to the first liquid phase zone, and the second gas phase zone is provided with a second through hole connected to the outside of the cabinet; a first sealing member is provided in the first through hole, and a second sealing member is provided in the second through hole; one end of the cable is located outside the cabinet, and the other end passes through the second sealing member and the first sealing member in sequence, and is connected to the electronic device.

[0007] Furthermore, a sealing partition is provided in the cabinet along the height direction of the cabinet, and the space in the cabinet is separated into the first chamber and the second chamber.

[0008] Furthermore, the cooling liquid and the sealing liquid are the same liquid.

[0009] Furthermore, the first seal is configured as a seal made of an isolation material with a microporous structure; the first seal is configured to isolate the vapor bubbles in the first liquid phase region, and the coolant can flow to the second chamber.

[0010] Furthermore, the top of the first chamber is provided with an opening and a top cover; the top cover is hinged on the cabinet body and flipped relative to one side of the cabinet body; the top cover is provided with a third sealing member along its circumference and is sealed with the opening through the third sealing member.

[0011] Furthermore, the liquid cooling equipment also includes a condenser and a heat circulation device connected to the condenser; the condenser is arranged in the first gas phase zone, the heat circulation device is arranged outside the cabinet, and the heat circulation device is configured to provide a cold source to the condenser.

[0012] Furthermore, the thermal cycle device includes a circulation pipeline, an evaporator, a circulation pump and a refrigerant; the evaporator, the circulation pump and the condenser are connected to the circulation pipeline; the refrigerant is arranged in the circulation pipeline, and the refrigerant flows along the circulation pipeline under the action of the circulation pump; the evaporator is used for heat exchange with the external environment so that the refrigerant releases heat.

[0013] Furthermore, the liquid cooling device also includes a pressure sensor and a liquid level detector; the pressure sensor is arranged in the first gas phase region, and the pressure sensor is configured to detect the gas pressure in the first gas phase region; the liquid level detector is arranged in the first liquid phase region, and the liquid level detector is configured to detect the liquid level of the coolant.

[0014] Furthermore, a plurality of the first through holes are disposed at intervals between the first liquid phase region and the second liquid phase region, and a plurality of the second through holes are disposed at intervals between the second gas phase region.

[0015] A second aspect of an embodiment of the present invention provides a two-phase immersion liquid cooling system, comprising a plurality of electronic devices and the liquid cooling device of the first aspect; the plurality of electronic devices are arranged at intervals in a first liquid phase region of the liquid cooling device.

[0016] Compared with the prior art, the two-phase immersion liquid cooling device and system provided by the embodiment of the present invention has the following advantages:

[0017] An embodiment of the present invention provides a two-phase immersion liquid cooling device and system, wherein a cabinet in the liquid cooling device includes an isolated first chamber and a second chamber, a first liquid phase region of the first chamber is provided with a cooling liquid, a first through hole is provided between the first liquid phase region and the second liquid phase region of the second chamber, a second through hole communicating with the outside of the cabinet is provided with a second gas phase region of the second chamber, a sealing liquid is provided in the second liquid phase region, and the second through hole is located above the liquid surface of the sealing liquid.

[0018] The electronic device to be cooled is at least partially arranged in the coolant, and one end of the cable passes through the second through hole and the first through hole and is connected to the electronic device, wherein a first seal is arranged between the first through hole and the cable, and a second seal is arranged between the second through hole and the cable, thereby achieving sealing between the cable and the cabinet.

[0019] In the related art, a cable joint is arranged in the gas phase region to achieve sealing between the cable and the cabinet, and the cable joint is in a high-temperature and high-pressure gas environment. After long-term use, the cable joint is prone to aging, resulting in a decrease in its sealing performance, and thus there is a risk of gas leakage in the cabinet.

[0020] However, in the embodiment of the present invention, the first through hole is located below the liquid level of the cooling liquid, and the first through hole is located below the liquid level of the sealing liquid, and a first sealing member is disposed in the first through hole; the second through hole is located above the liquid level of the sealing liquid. Therefore, the second gas phase region is isolated from the first gas phase region by the liquid phase, which prevents high-pressure saturated steam from entering the second gas phase region and prevents the second sealing member from being corroded by high-temperature and high-pressure gas. At the same time, the second through hole does not contact the sealing liquid, which can prevent liquid from leaking from the second through hole, thereby improving the sealing performance and reliability of the liquid cooling device.

[0021] Furthermore, the gas pressure in the second gas phase zone is much lower than that in the first gas phase zone, and the sealing requirements between the second seal, the cable and the second through hole are much lower than the solution in which the sealing joint is arranged in the first gas phase zone. Therefore, the embodiment of the present invention can also reduce the sealing process at the second through hole, thereby further improving the sealing performance and reliability of the liquid cooling equipment.

[0022] In addition to the technical problems solved by the present invention, the technical features that constitute the technical scheme, and the beneficial effects brought about by the technical features of the technical scheme described above, other technical problems that can be solved by the two-phase immersion liquid cooling equipment and system provided by the present invention, other technical features included in the technical scheme, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments of the present invention or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only part of the embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the internal structure of a two-phase immersion liquid cooling device provided in an embodiment of the present invention;

[0025] Figure 2 for Figure 1 AA section view Figure 1 ;

[0026] Figure 3 A schematic diagram of the arrangement of a plurality of first through holes and a plurality of second through holes on a cabinet provided in an embodiment of the present invention.

[0027] Description of reference numerals:

[0028] 10-cabinet;

[0029] 11- first chamber;

[0030] 111-first liquid phase region; 112-first gas phase region;

[0031] 12 - second chamber;

[0032] 121- second liquid phase region; 122- second gas phase region;

[0033] 13- first sealing member;

[0034] 14- second sealing member;

[0035] 20-cable;

[0036] 30-sealing partition;

[0037] 40-top cover;

[0038] 41 - third sealing member;

[0039] 50-server;

[0040] 60-Coolant;

[0041] 70-sealing liquid;

[0042] 100-Liquid cooling equipment. DETAILED DESCRIPTION

[0043] As described in the background technology, in the two-phase immersion liquid cooling equipment in the related art, there is a phenomenon of gas leakage between the cable connector arranged in the gas phase zone and the cabinet. The inventors have found that the reason for this problem is that the existing cable connector is arranged on the side wall of the cabinet and is located in the gas phase zone, so that the cables inside and outside the cabinet are connected together through the cable connector. However, the cable connector is in a high-temperature and high-pressure gas environment, and the cable connector is prone to aging after long-term use, resulting in a decrease in its sealing performance, so there is a risk of gas leakage in the cabinet.

[0044] In response to the above technical problems, the two-phase immersion liquid cooling equipment and system provided in the embodiments of the present invention are provided with a first chamber and a second chamber isolated from each other in the cabinet of the liquid cooling equipment, the first chamber has a first liquid phase region and a first gas phase region filled with cooling liquid, and the second chamber has a second liquid phase region and a second gas phase region filled with sealing liquid. A first through hole is provided between the first liquid phase region and the second liquid phase region, the second gas phase region is provided with a second through hole connected to the outside of the cabinet, and the second through hole is located above the liquid surface of the sealing liquid. Furthermore, the electronic device is provided in the cooling liquid, one end of the cable passes through the second through hole and the first through hole in sequence and is connected to the electronic device, and a first seal is provided between the first through hole and the cable, and a second seal is provided between the second through hole and the cable.

[0045] With such a configuration, the second gas phase region is isolated from the first gas phase region by the liquid phase, thereby preventing high-temperature and high-pressure gas from entering the second gas phase region and preventing the second seal from being corroded by the high-temperature and high-pressure gas. At the same time, the second through hole is not in contact with the sealing liquid, thereby preventing the sealing liquid from leaking from the second through hole, thereby improving the sealing performance and reliability of the liquid cooling equipment.

[0046] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0047] A two-phase immersion liquid cooling system provided in an embodiment of the present invention includes multiple electronic devices and a two-phase immersion liquid cooling device, wherein the electronic devices may be data center devices such as servers and switches. The embodiment of the present invention is described by taking an example in which multiple servers are arranged in the liquid cooling device.

[0048] like Figure 1 and Figure 2As shown, the two-phase immersion liquid cooling device 100 provided in an embodiment of the present invention includes a cabinet 10, a cable 20 and various seals, wherein one end of the cable 20 is located outside the cabinet 10, and the other end of the cable 20 is passed through the cabinet 10 and connected to the server 50 located in the cabinet 10, and the cabinet 10 is provided with a through hole matching the cable 20, and a seal is provided between the through hole and the cable 20 to achieve sealing of the cabinet 10.

[0049] To facilitate the description of this embodiment, the coordinate system shown in the accompanying drawings is first defined, where the X-axis direction is defined as the left and right directions of the cabinet 10, the Y-axis direction is defined as the front and rear directions of the cabinet 10, and the Z-axis direction is defined as the height direction of the cabinet 10.

[0050] Specifically, the cabinet 10 of the liquid cooling device 100 in the embodiment of the present invention is a rectangular cabinet 10, and the cabinet 10 includes a first chamber 11 and a second chamber 12 that are isolated from each other. Along the X-axis direction, the second chamber 12 is located on one side of the first chamber 11, that is, the first chamber 11 and the second chamber 12 are arranged on the left and right, and the second chamber 12 is located on the right side of the first chamber 11.

[0051] Along the Z-axis direction, the first chamber 11 is provided with a first liquid phase region 111 and a first gas phase region 112 along the upper and lower sides, that is, the first chamber 11 is filled with the coolant 60, and the first liquid phase region 111 is formed between the liquid surface of the coolant 60 and the bottom of the first chamber 11, and there is a gap between the liquid surface of the coolant 60 and the top of the first chamber 11, and a first gas phase region 112 is formed.

[0052] Along the Y-axis direction, the plurality of servers 50 are arranged at intervals in the first liquid phase region 111, and each server 50 is at least partially located below the liquid surface of the coolant 60. Preferably, the top of the server 50 is located above the liquid surface of the coolant 60 to expose the connector of the server 50, so as to facilitate the connection of the cable 20 with the connector of the server 50.

[0053] The server 50 of the embodiment of the present invention generates a large amount of heat during operation. The coolant 60 absorbs the heat from the server 50, changes from a liquid coolant to a gaseous coolant, and generates a large number of steam bubbles. After the steam bubbles float to the first gas phase region 112, a large amount of high-pressure saturated steam exists in the first gas phase region 112. Further, the gaseous coolant exchanges heat with the condenser of the first gas phase region 112, changes from a gaseous coolant to a liquid coolant, and flows back to the first liquid phase region 111 under the action of gravity to continue cooling the server 50. That is, the embodiment of the present invention utilizes the liquid-gas phase conversion of the coolant 60 to achieve cooling of the server 50.

[0054] Further, along the Z-axis direction, the second chamber 12 is provided with a second liquid phase region 121 and a second gas phase region 122 in the upper and lower directions. The second chamber 12 is provided with a sealing liquid 70 to form a sealing liquid column in the second chamber 12. The second liquid phase region 121 is formed from the liquid surface of the sealing liquid 70 to the bottom of the second chamber 12, and there is a gap from the liquid surface of the sealing liquid 70 to the top of the second chamber 12, and a second gas phase region 122 is formed.

[0055] In the embodiment of the present invention, in order to allow one end of the cable 20 to pass through the first chamber 11, a first through hole is provided between the first liquid phase region 111 and the second liquid phase region 121, that is, the first through hole is located below the liquid surface of the cooling liquid 60 and also below the liquid surface of the sealing liquid 70. Further, the first through hole is provided with a first sealing member 13, and the first sealing member 13 is used to seal the first through hole and the cable 20.

[0056] The second gas phase zone 122 is provided with a second through hole, and the second through hole is located above the liquid level of the sealing liquid 70, that is, there is a certain height difference between the second through hole and the liquid level of the sealing liquid 70; similarly, a second sealing member 14 is also provided in the second through hole, and the second sealing member 14 is used to seal the cable 20 and the second through hole.

[0057] When it is necessary to connect the cable 20 to the server 50 located in the first chamber 11, the first end of the cable 20 is located outside the cabinet 10, the second end of the cable 20 passes through the second through hole and extends downward in the second chamber 12, the second end of the cable 20 extends to the first through hole, and passes through the first through hole into the first chamber 11, the second end of the cable 20 extends upward in the first chamber 11 and extends to the top of the server 50, so as to realize the connection between the second end of the cable 20 and the server 50.

[0058] In this way, the first through hole of the embodiment of the present invention is located below the liquid surface of the cooling liquid 60, and the first through hole is located below the liquid surface of the sealing liquid 70, and a first sealing member 13 is provided in the first through hole; the second through hole is located above the liquid surface of the sealing liquid 70, and a second sealing member 14 is provided. Therefore, the second gas phase region 122 is isolated from the first gas phase region 112 by the liquid phase, so that the high-pressure saturated steam of the first gas phase region 112 is prevented from entering the second gas phase region 122, and the second sealing member 14 is prevented from being corroded by high-temperature and high-pressure gas, thereby improving the sealing performance of the second sealing member 14 and preventing gas leakage. At the same time, the second through hole is not in contact with the sealing liquid 70, so that liquid leakage from the second through hole can be prevented, thereby improving the sealing performance and reliability of the liquid cooling device 100.

[0059] Furthermore, the gas pressure in the second gas phase zone 122 is much lower than the gas pressure in the first gas phase zone 112, and the sealing requirement between the second seal 14, the cable 20 and the second through hole is much lower than the solution in which the sealing joint is arranged in the first gas phase zone 112. Therefore, the embodiment of the present invention can also reduce the sealing process at the second through hole, and further improve the sealing performance and reliability of the liquid cooling device 100.

[0060] On the basis of the above embodiments, the cabinet 10 of the embodiment of the present invention is a rectangular cabinet, and a sealing partition 30 is provided in the cabinet 10. The sealing partition 30 is arranged along the Z-axis direction and isolates the space in the cabinet 10 into a first chamber 11 and a second chamber 12.

[0061] For example, see Figure 1 The sealing partition 30 is arranged close to the right side wall of the cabinet 10 , and the sealing partition 30 and the side wall of the cabinet 10 close thereto, the bottom wall and the top wall of the cabinet 10 form a second chamber 12 , and the volume of the second chamber 12 is smaller than the volume of the first chamber 11 .

[0062] The first through hole is disposed on the sealing baffle 30, and the first through hole is disposed near the bottom of the cabinet 10, so that the first through hole is located below the liquid level of the cooling liquid 60, and similarly, the first through hole is also located below the liquid level of the sealing liquid 70. The second through hole is disposed on the side wall near the sealing baffle 30, and the second through hole is connected to the second chamber 12 and the outside of the cabinet 10.

[0063] Continue reading Figure 3 The liquid cooling device 100 in the embodiment of the present invention may include a plurality of cables 20, each cable 20 being connected to at least one server 50. For example, each server 50 is provided with a corresponding cable 20, and each cable 20 is connected to each server 50 in the first chamber 11, respectively.

[0064] Accordingly, the cabinet 10 may be provided with a plurality of first through holes and a plurality of second through holes, wherein the plurality of first through holes are arranged at intervals on the sealing partition 30, and the plurality of second through holes are arranged at intervals on the side wall of the cabinet 10, that is, a plurality of first through holes are arranged at intervals between the first liquid phase region 111 and the second liquid phase region 121, and a plurality of second through holes are arranged at intervals between the second gas phase region 122. Further, the number of the first through holes and the second through holes is consistent with the number of the cables 20, that is, each cable 20 passes through a second through hole and a first through hole respectively, and is connected to the server 50.

[0065] On the basis of the above embodiment, the cooling liquid 60 and the sealing liquid 70 in the embodiment of the present invention are the same liquid. For example, the cooling liquid 60 injected into the second chamber 12 through the second through hole can be used as the sealing liquid 70. Alternatively, part of the cooling liquid 60 in the first chamber 11 flows into the second chamber 12, that is, the cooling liquid 60 is used as the sealing liquid 70. This embodiment is not limited to this.

[0066] Preferably, the cooling liquid 60 in the first chamber 11 can flow to the second chamber 12, and the steam bubbles in the first liquid phase region 111 cannot flow to the second chamber 12. Exemplarily, the first seal 13 is configured as a seal made of an isolation material having a microporous structure, and the micropores of the isolation material can be millimeter-level micropores or micrometer-level micropores. Since the pore size of the above-mentioned microporous structure is small, it can allow liquid molecules to pass through, but cannot allow steam bubbles with larger physical size to pass through; that is, the first seal 13 can isolate the steam bubbles in the first liquid phase region 111, prevent the steam bubbles from entering the second chamber 12, thereby preventing the steam bubbles from entering the second gas phase region 122, and avoiding the existence of high-pressure saturated steam in the second gas phase region 122.

[0067] Furthermore, the first sealing member 13 can allow the coolant 60 to pass through, so that the liquid in the first liquid phase region 111 and the second liquid phase region 121 can flow, that is, the liquid level of the coolant 60 in the first liquid phase region 111 is the same as the liquid level of the coolant 60 in the second liquid phase region 121. This arrangement can facilitate the formation of a sealed liquid column in the second chamber 12, and enhance the isolation effect of the high-pressure saturated steam in the first gas phase region 112.

[0068] On the basis of the above embodiment, in order to place the electronic equipment in the first chamber 11, the top of the first chamber 11 is provided with an opening and a top cover 40, wherein the opening is communicated with the first gas phase region 112, and the top cover 40 is hinged at the opening of the cabinet 10 and can be flipped toward one side relative to the cabinet 10. When the top cover 40 is in an open state, the top cover 40 can be located at one side of the cabinet 10, and at this time, the server 50 can be placed in the first liquid phase region 111 through the opening.

[0069] Furthermore, the top cover 40 is provided with a third sealing member 41 along its circumference, and the third sealing member 41 may be a sealing rubber ring, which is arranged around the top cover 40. When the top cover 40 is arranged at the opening of the cabinet 10, the third sealing member 41 is located between the opening and the top cover 40, and the third sealing member 41 seals the gap between the opening and the top cover 40, thereby preventing the leakage of the high-pressure saturated steam in the first gas phase region 112, and improving the sealing performance of the liquid cooling device.

[0070] The liquid cooling device 100 provided in the embodiment of the present invention further includes a heat circulation device, which is connected to a condenser located in the first gas phase region 112 , and the heat circulation device can provide a cold source to the condenser and take away the heat of the first gas phase region 112 .

[0071] Specifically, the thermal circulation device in the embodiment of the present invention includes an evaporator, a circulation pump, a refrigerant and a circulation pipeline, wherein the evaporator and the circulation pump are arranged outside the cabinet 10 and are located on the circulation pipeline, the circulation pipeline extends into the first chamber 11 and is connected to the condenser, that is, the evaporator, the condenser and the circulation pump are all arranged on the circulation pipeline.

[0072] A refrigerant is also arranged in the circulation pipeline, and a circulation pump is arranged between the evaporator and the condenser. Under the action of the circulation pump, the liquid refrigerant enters the condenser, and the liquid refrigerant exchanges heat with the gaseous coolant in the first gas phase area 112. The gaseous coolant releases heat and changes into liquid refrigerant, and flows back to the first liquid phase area 111 under the action of gravity; the liquid refrigerant absorbs heat and changes into gaseous refrigerant in the condenser, and the gaseous refrigerant enters the evaporator through the circulation pipeline, releases heat at the evaporator to change into liquid refrigerant, and flows into the condenser under the action of the circulation pump to complete a cycle.

[0073] It should be understood that the heat dissipation mode of the evaporator of the thermal cycle device includes water cooling or air cooling mode, which is not limited in the embodiment of the present invention. For example, a fan is provided at the evaporator to dissipate heat from the evaporator.

[0074] On the basis of the above embodiments, the liquid cooling device 100 provided in the embodiments of the present invention also includes a pressure sensor and a liquid level detector; wherein the pressure sensor is arranged in the first gas phase region 112, and the pressure sensor is configured to detect the gas pressure in the first gas phase region 112. Such an arrangement facilitates the detection of the pressure of the liquid cooling device 100 to prevent excessive pressure from affecting the safe operation of the liquid cooling device 100.

[0075] Furthermore, a liquid level detector is arranged in the first liquid phase area 111, and the liquid level detector is configured to detect the liquid level of the coolant. Such an arrangement facilitates the detection of the liquid level of the coolant, and the coolant can be replenished in time to keep the coolant within a certain liquid level range, thereby improving the cooling effect of the liquid cooling equipment.

[0076] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0077] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0078] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0079] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A two-phase immersion liquid cooling device, characterized in that: Including cabinet and cables; The cabinet comprises a first chamber and a second chamber which are isolated from each other, wherein the second chamber is located outside the first chamber; a cooling liquid is provided in the first chamber, wherein the liquid surface of the cooling liquid and the top of the first chamber form a first gas phase region, and the liquid surface of the cooling liquid and the bottom of the first chamber form a first liquid phase region; a sealing liquid is provided in the second chamber, wherein the liquid surface of the sealing liquid and the top of the second chamber form a second gas phase region, and the liquid surface of the sealing liquid and the bottom of the second chamber form a second liquid phase region; The first liquid phase region is used to place electronic equipment, and at least part of the electronic equipment is immersed in the cooling liquid, the second liquid phase region is provided with a first through hole communicating with the first liquid phase region, and the second gas phase region is provided with a second through hole communicating with the outside of the cabinet; A first seal is disposed in the first through hole, and a second seal is disposed in the second through hole; one end of the cable is located outside the cabinet, and the other end passes through the second seal and the first seal in sequence and is connected to the electronic device.

2. The liquid cooling device according to claim 1, characterized in that: A sealing partition is provided in the cabinet along the height direction of the cabinet, and separates the space in the cabinet into the first chamber and the second chamber.

3. The liquid cooling device according to claim 1, characterized in that: The cooling liquid and the sealing liquid are the same liquid.

4. The liquid cooling device according to claim 3, characterized in that: The first sealing member is configured as a sealing member made of an isolation material having a microporous structure; The first sealing member is configured to isolate vapor bubbles in the first liquid phase region, and the cooling liquid can flow toward the second chamber.

5. The liquid cooling device according to claim 1, characterized in that: The top of the first chamber is provided with an opening and a top cover; The top cover is hinged on the cabinet body and flipped relative to one side of the cabinet body; The top cover is provided with a third sealing member along its circumference and is sealed with the opening by the third sealing member.

6. The liquid cooling device according to any one of claims 1 to 5, characterized in that: The liquid cooling device also includes a condenser and a heat circulation device connected to the condenser; The condenser is arranged in the first gas phase region, the heat cycle device is arranged outside the cabinet, and the heat cycle device is configured to provide a cold source for the condenser.

7. The liquid cooling device according to claim 6, characterized in that: The thermal cycle device comprises a circulation pipeline, an evaporator, a circulation pump and a refrigerant; The evaporator, the circulation pump and the condenser are connected to the circulation pipeline; the refrigerant is arranged in the circulation pipeline, and the refrigerant flows along the circulation pipeline under the action of the circulation pump; The evaporator is used for heat exchange with the external environment so that the refrigerant releases heat.

8. The liquid cooling device according to claim 6, characterized in that: The liquid cooling device also includes a pressure sensor and a liquid level detector; The pressure sensor is disposed in the first gas phase region, and the pressure sensor is configured to detect the gas pressure in the first gas phase region; The liquid level detector is disposed in the first liquid phase region, and the liquid level detector is configured to detect the liquid level of the cooling liquid.

9. The liquid cooling device according to claim 1, characterized in that: A plurality of first through holes are disposed between the first liquid phase region and the second liquid phase region, and a plurality of second through holes are disposed between the second gas phase region.

10. A two-phase immersion liquid cooling system, characterized in that: comprising a plurality of electronic devices and a liquid cooling device as claimed in any one of claims 1 to 9; A plurality of the electronic devices are arranged at intervals in the first liquid phase region of the liquid cooling device.

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