Sheet peeling method and sheet peeling device, and dividing method and dividing device

Abstract

A sheet peeling method is provided for peeling an adhesive sheet (AS1) adhered to an adherend (WK1) from the adherend, wherein the sheet peeling method implements the following steps: a sheet holding step for holding the adhesive sheet (AS1); an adherend holding step for holding the adherend (WK1); a peeling step for applying tension to the adhesive sheet (AS1) held in the sheet holding step to peel the adhesive sheet (AS1) from the adherend (WK1); a tension detection step for detecting the sheet tension applied to the adhesive sheet (AS1) when peeling the adhesive sheet (AS1) from the adherend (WK1) in the peeling step; and in the peeling step, based on the detection result in the tension detection step, peeling the adhesive sheet (AS1) from the adherend (WK1) while maintaining the sheet tension at a desired tension.

Description

Technical Field

[0001] The present invention relates to a sheet peeling method and a sheet peeling device, and a dividing method and a dividing device. Background Art

[0002] There is known a sheet peeling method for peeling a pressure-sensitive adhesive sheet adhered to an adherend from the adherend (for example, refer to Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: (Japanese) Patent Publication No. 2012-222308 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] In the sheet peeling method disclosed in Patent Document 1, when peeling the adhesive sheet S1 (adhesive sheet) from the semiconductor wafer W (adherend), if the tension applied to the adhesive sheet is inappropriate, unexpected excessive tension may be applied to the adhesive sheet, and the adherend may be damaged under its influence.

[0008] An object of the present invention is to provide a sheet peeling method and a sheet peeling device which can prevent damage to an adherend when a pressure-sensitive adhesive sheet affixed to an adherend is peeled from the adherend.

[0009] Another object of the present invention is to provide a dividing method and a dividing device that can prevent the thinned adherends from being damaged when dividing the adherend affixed to a pressure-sensitive adhesive sheet into a plurality of thinned adherends.

[0010] Means for solving technical problems

[0011] One embodiment of the present invention employs the configuration described in the claims.

[0012] According to a sheet peeling method and a sheet peeling device of one embodiment of the present invention, the adhesive sheet is peeled from the adherend while maintaining the sheet tension applied to the adhesive sheet at the desired tension, so that unexpected excessive tension is not applied to the adhesive sheet, thereby preventing the adherend from being damaged when the adhesive sheet stuck to the adherend is peeled off.

[0013] Furthermore, in the peeling step, if the tension of the sheet is reduced by reducing the adhesive surface between the adherend and the adhesive sheet, damage to the adherend can be easily prevented.

[0014] In addition, in the peeling process, as long as the adhesive sheet is peeled off from the adherend while maintaining a constant ratio of the sheet tension to the length of the outer edge of the adhesive surface or the area of ​​the adhesive surface, the sheet tension corresponding to the bonding state of the adhesive sheet and the adherend can be controlled, thereby easily preventing damage to the adherend.

[0015] Furthermore, if the peeling state control step is performed in the peeling step, it is possible to prevent the adhesive sheet from being rapidly peeled off, and to contribute to suppressing deformation of the adhesive sheet and adhesive residue on the adherend.

[0016] According to a splitting method and a splitting device of one embodiment of the present invention, the adherend is split into a plurality of thinned adherends while maintaining the sheet tension applied to the adhesive sheet adhered to the adherend at a desired tension, so that unexpected excessive tension is not applied to the adhesive sheet, and when the adherend adhered to the adhesive sheet is split into a plurality of thinned adherends, damage to the second thinned adherend can be prevented.

[0017] Furthermore, when dividing the adherend into the first thinned adherend and the second thinned adherend, the first thinned adherend can be divided into a plurality of sheets without performing a thinning step such as a dicing step or a cutting step. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A It is an explanatory diagram of a sheet peeling device according to one embodiment of the present invention.

[0019] Figure 1B It is an explanatory diagram showing a peeled state of the pressure-sensitive adhesive sheet.

[0020] Figure 1C It is an explanatory diagram showing a peeled state of the pressure-sensitive adhesive sheet.

[0021] Figure 2A It is an operation explanation diagram of the sheet peeling device.

[0022] Figure 2B It is an operation explanation diagram of the sheet peeling device.

[0023] Figure 2C It is an operation explanation diagram of the sheet peeling device.

[0024] Figure 3A It is a diagram for explaining the operation of the dividing device according to one embodiment of the present invention.

[0025] Figure 3B It is a diagram for explaining the operation of the dividing device according to one embodiment of the present invention.

[0026] Figure 3CIt is a diagram for explaining the operation of the dividing device according to one embodiment of the present invention. DETAILED DESCRIPTION

[0027] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0028] It should be noted that the X-axis, Y-axis, and Z-axis in this embodiment are orthogonal to each other, the X-axis and the Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Figure 1A or Figure 3A When indicating directions, "up" is the direction of the arrow on the Z axis, and "down" is the opposite direction. "Left" is the direction of the arrow on the X axis. "Right" is the opposite direction. "Front" is the direction of the arrow on the Y axis, and "back" is the opposite direction.

[0029] [First Implementation Method]

[0030] like Figure 1A As shown, the sheet peeling device EA1 is a device for peeling the first adhesive sheet AS1, which is an adhesive sheet adhered to the adherend WK1, from the adherend WK1, and comprises: a sheet holding mechanism 10, which holds the first adhesive sheet AS1; an adherend holding mechanism 20, which holds the adherend WK1; a peeling mechanism 30A, which applies tension to the first adhesive sheet AS1 held by the sheet holding mechanism 10, and peels the first adhesive sheet AS1 from the adherend WK1; and a tension detecting mechanism 40, which detects the sheet tension applied to the first adhesive sheet AS1 when the first adhesive sheet AS1 is peeled from the adherend WK1 by the peeling mechanism 30A.

[0031] Note that the first adhesive sheet AS1 is bonded to the adherend WK1 and the first ring frame RF1 as a frame member via the adhesive layer AD1 laminated on one surface.

[0032] The sheet holding mechanism 10 includes a linear motor 12 as a driving device supported by a base plate 11 , and two holding members 14 that support an output shaft 13 of the linear motor 12 and are provided so as to support the first ring frame RF1 from left and right.

[0033] The adherend holding mechanism 20 includes a workbench 21 having a support surface 21A that can be held by suction by a decompression mechanism (not shown) such as a decompression pump or a vacuum ejector. It should be noted that the adherend holding mechanism 20 of the present embodiment is configured such that the second ring frame RF2 as a frame member holds the adherend WK1 via the second adhesive sheet AS2 adhered to the adhesive layer AD2.

[0034] The peeling mechanism 30A includes: a plurality of moving mechanisms 31, which raise and lower the sheet holding mechanism 10; a peeling state control mechanism 32, which controls the peeling state of the first adhesive sheet AS1 peeled off from the adherend WK1; a rotating mechanism 33, which rotates the sheet holding mechanism 10, the moving mechanism 31 and the peeling state control mechanism 32; and is configured to peel the first adhesive sheet AS1 from the adherend WK1 while maintaining the sheet tension at a desired tension based on the detection result of the tension detection mechanism 40.

[0035] The moving mechanism 31 includes a linear motor 31A as a driving device that supports the sheet holding mechanism 10 via an output shaft 31B.

[0036] The peeling state control mechanism 32 includes a linear motor 32A as a driving device and a contact mechanism 32C as a pressing mechanism supported by an output shaft 32B of the linear motor 32A. The contact mechanism 32C is configured such that an elastic member 32E having a planar shape slightly larger than that of the adherend WK1 and having elasticity is supported by a supporting member 32D.

[0037] The rotating mechanism 33 includes a rotary motor 33A as a driving device, and a support plate 33C that is supported by an output shaft 33B of the rotary motor 33A and supports the linear motors 31A and 32A.

[0038] The tension detection mechanism 40 includes: a contact type or non-contact type tension sensor 41, which can detect the sheet tension between the first ring frame RF1 and the adherend WK1; a control mechanism 42 such as a sequencer or a personal computer, which can control the overall operation of the sheet peeling device EA1; a camera or a projector, which can measure Figure 1B , Figure 1C The illustrated first adhesive sheet AS1 is bonded to the adherend WK1 over a length in the left-right direction, that is, a bonding length DT1.

[0039] The above operation of the sheet peeling device EA1 will be described.

[0040] First, the user of the sheet peeling device EA1 (hereinafter referred to as "user") configures each component via an operation panel (not shown) or an operation mechanism such as a personal computer. Figure 1AThe sheet peeling device EA1 in the initial position shown by the solid line inputs a signal for starting automatic operation. Next, when the user or a conveying mechanism (not shown) such as a multi-jointed robot or a belt conveyor places the second adhesive sheet AS2 attached to the second ring frame RF2 on the workbench 21, the adherend holding mechanism 20 drives the decompression mechanism (not shown) to start adsorption and holding of the second adhesive sheet AS2 on the supporting surface 21A. Thereafter, when the user or a conveying mechanism (not shown) places the first ring frame RF1 supporting the adherend WK1 via the first adhesive sheet AS1 on the holding member 14, the sheet holding mechanism 10 drives the linear motor 12 to raise the holding member 14, so that the first ring frame RF1 is sandwiched between the holding member 14 and the substrate 11 to hold the first adhesive sheet AS1 (sheet holding process).

[0041] Next, the peeling mechanism 30A drives the linear motors 31A and 32A, as shown in FIG. Figure 2A As shown, the substrate 11 is lowered to bring the holding member 14 close to the second ring frame RF2, and the contact mechanism 32C is lowered to press the adherend WK1 to the second adhesive sheet AS2 (adhesive holding step). In addition, the peeling mechanism 30A drives the linear motor 31A, as shown in FIG. Figure 2B , Figure 2C As shown, the sheet holding mechanism 10 is raised, thereby peeling the first adhesive sheet AS1 from the adherend WK1 (peeling process). It should be noted that in the peeling process of this embodiment, the sheet tension is reduced according to the reduction of the adhesive surface between the adherend WK1 and the first adhesive sheet AS1, and the first adhesive sheet AS1 is peeled from the adherend WK1. That is, in this peeling process, the tension detection mechanism 40 drives the tension sensor 41, the control mechanism 42 and the shooting mechanism 43, and the tension sensor 41 detects the sheet tension, and the shooting mechanism 43 measures the bonding length DT1, and sends these data to the control mechanism 42 (tension detection process). The control mechanism 42 that receives the data calculates the length of the outer edge AE of the bonding surface, or the area of ​​the bonding surface, based on the bonding length DT1, and drives the linear motor 31A to peel the first bonding sheet AS1 from the adherend WK1 while maintaining the ratio of the sheet tension to the length of the outer edge AE of the bonding surface (hereinafter referred to as the "tension / length ratio") or the ratio of the sheet tension to the area of ​​the bonding surface (hereinafter referred to as the "tension / area ratio") constant.

[0042] In addition, in the peeling step, when the first adhesive sheet AS1 is peeled off from the adherend WK1, Figure 2B , Figure 2CAs shown, the elastic member 32E is pressed by the first adhesive sheet AS1 and elastically deformed, thereby preventing the first adhesive sheet AS1 from being rapidly peeled off from the adherend WK1, and the deformation of the first adhesive sheet AS1 or the adhesive residue on the adherend WK1 is also suppressed (peeling state control process). At this time, the peeling mechanism 30A can drive the linear motor 32A to raise and lower the contact mechanism 32C in a manner that the tension / length ratio or the tension / area ratio is constant. In addition, the peeling mechanism 30A can also drive the rotary motor 33A to reciprocate the support plate 33C at a predetermined angle with the Z axis as the rotation center. Thus, a predetermined tension is applied in the surface direction of the first adhesive sheet AS1, and not only the upward peeling force but also the surface tension is applied to the first adhesive sheet AS1, thereby promoting the peeling of the first adhesive sheet AS1 from the adherend WK1.

[0043] Next, the sheet holding mechanism 10 continues to rise, and when the first adhesive sheet AS1 is peeled off from the adherend WK1 as a whole, the sheet holding mechanism 10 and the peeling mechanism 30A drive the linear motors 12, 31A, 32A to return the holding component 14, the substrate 11 and the abutment mechanism 32C to the initial position. After that, the adherend holding mechanism 20 stops driving the decompression mechanism (not shown) to release the adsorption holding of the second adhesive sheet AS2 on the supporting surface 21A. Next, after the user or the conveying mechanism (not shown) conveys the adherend WK1 supported by the second adhesive sheet AS2 on the second ring frame RF2 to the next process, the user or the conveying mechanism removes the first adhesive sheet AS1 with the first ring frame RF1 from which the adherend WK1 is peeled from the holding component 14, and then repeats the same action as above.

[0044] According to the present embodiment described above, the first adhesive sheet AS1 is peeled off from the adherend WK1 while maintaining the sheet tension applied to the first adhesive sheet AS1 at the desired tension, so that unexpected excessive tension is not applied to the first adhesive sheet AS1, thereby preventing the adherend WK1 from being damaged when the first adhesive sheet AS1 adhered to the adherend WK1 is peeled off.

[0045] [Second embodiment]

[0046] The dividing device EA2 of this embodiment can use the same device as the sheet peeling device EA1 of the first embodiment, so the parts different from the first embodiment will be mainly described, and the same components as the first embodiment are denoted by the same reference numerals and the description thereof will be omitted or simplified.

[0047] That is, Figure 3AAs shown, the splitting device EA2 is for splitting the adherend WK2 formed with the first modified portion DP1 and adhered to the first adhesive sheet AS1 as the adhesive sheet into a first thinned adherend WT1 located on the side of the first adhesive sheet AS1 and a second thinned adherend WT2 located on the opposite side of the first thinned adherend WT1 across the first modified portion DP1, and the splitting device EA2 comprises: a sheet holding mechanism 10, which holds the first adhesive sheet AS1; an adherend holding mechanism 20, which holds the adherend WK2 from the side that becomes the second thinned adherend WT2; a splitting mechanism 30B, which applies tension to the first adhesive sheet AS1 held by the sheet holding mechanism 10, and splits the adherend WK2 into the first thinned adherend WT1 and the second thinned adherend WT2; and a tension detecting mechanism 40, which detects the tension applied to the first adhesive sheet AS1 when the adherend is split into the first thinned adherend WT1 and the second thinned adherend WT2 by the splitting mechanism 30B.

[0048] On the adherend WK2, at the second dividing surface ( Figure 3A A plurality of second modified portions DP2 are provided in a direction parallel to the YZ plane and the XZ plane in the state of Figure 3A The first and second modified portions DP1 and DP2 are portions that change the properties or strength of the adherend WK2 and make it fragile or softened. The first modified portion DP1 can divide the adherend WK2 into a first thinned adherend WT1 and a second thinned adherend WT2, and the second modified portion DP2 is a layer that can divide the first thinned adherend WT1 into a plurality of sheet bodies CP.

[0049] The splitting mechanism 30B has the same structure as the peeling mechanism 30A of the first embodiment, and splits the adherend WK2 into the first thinned adherend WT1 and the second thinned adherend WT2 while maintaining the sheet tension applied to the first adhesive sheet AS1 at the desired tension based on the detection result of the tension detection mechanism 40. In the present embodiment, the splitting mechanism 30B is configured to split the first thinned adherend WT1 along the second modified portion DP2 when splitting the adherend WK2 into the first thinned adherend WT1 and the second thinned adherend WT2, thereby splitting the first thinned adherend WT1 into a plurality of sheet bodies CP.

[0050] The tension detection mechanism 40 has the same configuration as that of the first embodiment, but is different in that the imaging mechanism 43 measures the length in the left-right direction of the first modified portion DP1 before being divided into the first thinned adherend WT1 and the second thinned adherend WT2 , that is, the modified portion length DT2 .

[0051] In the above operation of the separating device EA2, the separation process of the sheet separating device EA1 of the first embodiment is different from the content of the tension detecting process in that the separation process is a separation process.

[0052] That is, the splitting mechanism 30B drives the linear motors 31A and 32A, as shown in FIG. Figure 3A As shown, after the adherend WK2 is pressed and attached to the second adhesive sheet AS2, as shown in FIG. Figure 3B , Figure 3C As shown, the sheet holding mechanism 10 is raised. In this way, the adherend WK2 is divided into a first thinned adherend WT1 and a second thinned adherend WT2 with the first modified portion DP1 as a boundary, and the first thinned adherend WT1 is divided into a plurality of sheet bodies CP with the second modified portion DP2 as a boundary (dividing process). In this dividing process, the sheet tension is reduced according to the reduction of the first modified portion DP1, i.e., the first modified surface before being divided into the first thinned adherend WT1 and the second thinned adherend WT2, and the adherend WK2 is divided. That is, the tension detection mechanism 40 drives the tension sensor 41, the control mechanism 42 and the photographing mechanism 43, and the tension of the sheet is detected by the tension sensor 41, and the length DT2 of the modified portion is measured by the photographing mechanism 43, and these data are sent to the control mechanism 42 (tension detection process). Note that in this embodiment, the control mechanism 42 replaces the "adhesion length DT1" and "adhesive surface" in the operation shown in the first embodiment with the "modified portion length DT2" and "first modified surface" and drives the linear motor 31A.

[0053] According to the present embodiment described above, the adherend WK2 is divided into the first and second thinned adherends WT1 and WT2 while maintaining the sheet tension of the first adhesive sheet AS1 applied to the adherend WK2 at the desired tension. Therefore, unexpected excessive tension is not applied to the first adhesive sheet AS1, thereby preventing the second thinned adherend WT2 from being damaged when the adherend WK2 adhered to the first adhesive sheet AS1 is divided into the first and second thinned adherends WT1 and WT2.

[0054] In addition, the first thinned adherend WT1 can be divided into a plurality of sheet-like bodies CP without performing the thinning step.

[0055] The above-mentioned description discloses the best structure, method, etc. for implementing the present invention, but the present invention is not limited thereto. That is, the present invention mainly shows and describes a specific embodiment, but as long as it does not deviate from the technical idea and purpose scope of the present invention, those skilled in the art can add various deformations to the shape, material, quantity, and other detailed structures of the above-mentioned embodiment. In addition, the description of the shape, material, etc. disclosed above is used to make the present invention easy to understand, but does not limit the present invention, so the description of the names of the parts that are partly or completely omitted from the limitations of these shapes, materials, etc. is also included in the present invention.

[0056] The sheet holding mechanism 10 can be constructed to hold the first adhesive sheet AS1 by a clamping mechanism such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, sticky agent, magnetic force, Bernoulli adsorption, suction adsorption, driving device, etc., and the number of the sheet holding mechanism 10 can be 1 or more than 3, and the number can be the same as that of the moving mechanism 31 or a different number. For example, a plurality of sheet holding mechanisms 10 connected by a connecting component can be moved by one moving mechanism 31, or the first adhesive sheet AS1 can be directly held without going through the first ring frame RF1.

[0057] The adherend holding mechanism 20 can be constructed by holding the second adhesive sheet AS2 by a clamping mechanism such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, sticky agent, magnetic force, Bernoulli adsorption, suction adsorption, driving device, etc. It can hold the second adhesive sheet AS2 that is not adhered to the second ring frame RF2, or directly hold the adherends WK1, WK2 without going through the second adhesive sheet AS2 and the second ring frame RF2. It may not have a decompression mechanism not shown in the figure. For example, it can be constructed by using an L-shaped or key-shaped hook part to hook the adherends WK1, WK2, the second adhesive sheet AS2 or the second ring frame RF2 to resist the peeling of the first adhesive sheet AS1 from the adherend WK1, or resist the separation of the first thinned adherend WT1 and the second thinned adherend WT2.

[0058] The peeling mechanism 30A and the splitting mechanism 30B can peel the first adhesive sheet AS1 from the adherend WK1 and split the adherend WK2 into the first thinned adherend WT1 and the second thinned adherend WT2 without moving the sheet holding mechanism 10, or by moving the sheet holding mechanism 10 and moving the adherend holding mechanism 20. The number of moving mechanisms 31 can be one or more than three. The sheet holding mechanism 10 can also be moved in either direction to the left or right, and the adherend holding mechanism 20 can be moved in the opposite direction. These relative movements can also be implemented by causing the elastic component 32E to abut against the first adhesive sheet AS1. The elastic component 32E can discontinuously maintain the state of pressing the first adhesive sheet AS1 and the adherends WK1 and WK2. After the pressing state is temporarily released by separating the abutting mechanism 32C from the first adhesive sheet AS1, the sheet holding mechanism 10 can be raised to return to the pressed state. Alternatively, the abutting mechanism 32C and the sheet holding mechanism 10 can be raised at the same time to continuously maintain the pressed state.

[0059] The peeling mechanism 30A can move the sheet holding mechanism 10 from one end side toward the other end side of the outer edge AE of the adhesive surface to peel the first adhesive sheet AS1 from the adherend WK1.

[0060] The splitting mechanism 30B can enable the sheet holding mechanism 10 to move from one end side of the outer edge AE of the first modified surface toward the other end side, thereby splitting the adherend WK2 into a first thinned adherend WT1 and a second thinned adherend WT2. It can also be a structure in which the adherend WK2 is not provided with a second modified portion DP2, and the first thinned adherend WT1 is not split into multiple sheet bodies CP.

[0061] The peeling state control mechanism 32 can also adopt a segmented displacement component such as a roller rolling on the first adhesive sheet AS1, or a retractable antenna, for example, an elastic component 32E such as rubber, sponge, resin, spring, etc. The sheet peeling device EA1 or the splitting device EA2 of the present invention may be equipped with the peeling state control mechanism 32, or may not be equipped with the peeling state control mechanism 32.

[0062] The abutment mechanism 32C can adopt a supporting component 32D or an elastic component 32E whose planar shape is a circle, ellipse, triangle, quadrilateral or other polygonal shape, or a structure in which gas or liquid is sealed between the supporting component 32D and the elastic component 32E, so that it can be a component that can arbitrarily change the shape or hardness of the elastic component 32E by controlling the pressure of these gases or liquids. It can also stop at a position away from the first adhesive sheet AS1 and adjust the filling amount of the gas or liquid in the abutment mechanism 32C to control the pressing area, or it can also continuously change (control) the elastic state of the elastic component 32E when the adherends WK1 and WK2 are adhered to the second adhesive sheet AS2, or when the first adhesive sheet AS1 is peeled off from the adherend WK1.

[0063] The rotating mechanism 33 can make the sheet holding mechanism 10, the moving mechanism 31 and the peeling state control mechanism 32 rotate or not, and rotate the adherend holding mechanism 20, or not rotate the peeling state control mechanism 32. The sheet peeling device EA1 or the splitting device EA2 of the present invention can be equipped with the rotating mechanism 33 or not.

[0064] The tension detection mechanism 40 may not include the photographing mechanism 43. In this case, it is sufficient to apply a desired tension to the first adhesive sheet AS1 regardless of the area of ​​the adhesive surface or the length of the outer edge AE of the adhesive surface. It should be noted that the desired tension can be preset or stored in the sheet peeling device EA1 or the splitting device EA2, and can be arbitrarily set by the user, etc. The value of the desired tension is not limited or specified by a specific numerical value, etc.

[0065] In the tension detection mechanism 40, the position for detecting the sheet tension applied to the first adhesive sheet AS1 may be any position as long as it is a position where the first ring frame RF1 is not attached, a position not held by the sheet holding mechanism 10, and a position not attached to the adherend WK1, the first thinned adherend WT1, or the sheet body CP. The sheet tension may be detected at only one position or at two or more positions. In the case where the position for detecting the sheet tension is two or more positions, the desired tension for maintaining the sheet tension may be determined based on the detected multiple tension values, such as the minimum tension value, the maximum tension value, the average value of multiple tension values, or the relative value of multiple tension values ​​(such as the difference or ratio of the tension values ​​at two opposing positions).

[0066] The control mechanism 42 does not need to calculate the area of ​​the bonding surface or the first modified surface, or the length of the outer edge AE of the bonding surface or the first modified surface. Instead, the operator may arbitrarily set or determine the driving force of the driving device of the peeling mechanism 30A or the splitting mechanism 30B to a specified value based on the tension detection result displayed on a display mechanism such as a display or the tension detection result printed and output in a printing mechanism such as a printer.

[0067] The sheet peeling device EA1 or the splitting device EA2 can have a grinding mechanism for grinding the adherend WK1, WK2 or the first and second thinned adherends WT1, WT2, or can have an integrated mechanism for integrating the adherend WK1, WK2 or the first and second thinned adherends WT1, WT2 and the frame component via other adhesive sheets such as cutting tape, expansion tape, back grinding tape, etc.

[0068] The sheet peeling apparatus EA1 can peel the first and second adhesive sheets AS1 and AS2 from the first and second thinned adherends WT1 and WT2.

[0069] The first adhesive sheet AS1 does not necessarily need to be attached to the first ring frame RF1.

[0070] The frame member may be an annular structure, or a non-annular structure (the outer periphery is not connected), circular, elliptical, a polygon larger than a triangle, or other shapes.

[0071] If the adhesive force of the first adhesive sheet AS1 is smaller than the adhesive force of the second adhesive sheet AS2, the first adhesive sheet AS1 can be more effectively peeled from the adherend WK1. However, the first and second adhesive sheets AS1 and AS2 do not necessarily need to have such adhesive force.

[0072] The first and second adhesive sheets AS1 and AS2 may have their adhesive strength reduced by irradiation with energy rays such as ultraviolet rays or X-rays, and may also have the functions of a dicing tape, an expanding tape, or a back grinding tape.

[0073] The first and second modified parts DP1 and DP2 can be formed, for example, by the formation method disclosed in International Publication No. 2019 / 044588. In addition to laser, the characteristics, properties, properties, materials, composition, structure, size, etc. of the adherend WK2 can be changed by applying electromagnetic waves, vibrations, heat, drugs, chemicals, etc., so as to make the adherend WK2 fragile, crushed, liquefied or hollowed out.

[0074] The mechanisms and processes in the present invention are not limited in any way as long as they can achieve the actions, functions or processes described in these mechanisms and processes, and are not limited to the structures or processes of only one embodiment shown in the embodiment. For example, the sheet holding process can be any process as long as it is a process for holding the adhesive sheet, and is not limited as long as it is within its technical scope with reference to the technical common sense at the time of application (the same applies to other mechanisms and processes).

[0075] The materials, types, shapes, etc. of the first and second adhesive sheets AS1, AS2, adherends WK1, WK2, first and second thinned adherends WT1, WT2, and sheet CP are not particularly limited. For example, the shapes of the first and second adhesive sheets AS1, AS2, adherends WK1, WK2, first and second thinned adherends WT1, WT2, and sheet CP may be circular, elliptical, triangular, quadrilateral, or other polygonal shapes, and the first and second adhesive sheets AS1, AS2 may be pressure-sensitive adhesive, heat-sensitive adhesive, or other bonding methods. In addition, such first and second adhesive sheets AS1, AS2 may be, for example, a single-layer structure with only an adhesive layer, or a structure with an intermediate layer between the substrate and the adhesive layer, or a structure with more than three layers such as a covering layer on the substrate. In addition, it may also be a structure such as a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer. The double-sided adhesive sheet may be a structure with a single-layer or multi-layer core layer, or a single-layer or multi-layer structure without an intermediate layer. In addition, the adherends WK1, WK2, the first and second thinned adherends WT1, WT2, and the sheet CP are not limited to plate-like parts, and may be, for example, food, resin containers, semiconductor wafers such as silicon semiconductor wafers or compound semiconductor wafers, circuit substrates, information storage substrates such as optical disks, glass plates, steel plates, pottery, wood boards, or monomers such as resins, or may be composites formed by two or more of these, and may be parts or articles in any form. It should be noted that the first and second adhesive sheets AS1, AS2 may also be replaced by names based on their functions and uses, such as information recording labels, decorative labels, protective tapes, processing tapes, dicing tapes, chip films, chip tapes, storage layer forming resin sheets, and other arbitrary sheets, films, tapes, and the like.

[0076] The driving device in the above-mentioned embodiment can not only adopt electric devices such as rotary motors, linear motors, single-axis robots, multi-joint robots with 2 or more than 3 axes of joints, actuators such as air cylinders, hydraulic cylinders, rodless cylinders and rotary cylinders, but also can combine them directly or indirectly.

[0077] In the above-mentioned embodiment, when a rotating member such as a roller is used, a driving device for rotating the rotating member may be provided, and the surface of the rotating member or the rotating member body may be formed by a deformable member such as rubber or resin, or the surface of the rotating member or the rotating member body may be formed by a non-deformable member. Other members such as a shaft or a plate that rotates or does not rotate instead of the roller may be used. When a pressing mechanism such as a pressing roller or a pressing head or a pressing member that presses the object to be pressed is used, a roller, a round rod, a plate, rubber, a resin may be used instead of the above-mentioned structure or in combination with it. , sponge and other parts, or a structure that presses by blowing in air or gas, etc., can also be composed of deformable parts such as rubber or resin to form the pressing structure, or it can be composed of non-deformable parts. When using a supporting (holding) supporting (holding) mechanism or a supporting (holding) part or other supported parts (held parts), a structure that supports (holds) the supported parts using clamping mechanisms such as mechanical chucks or chuck cylinders, Coulomb force, adhesives (adhesive sheets, adhesive tapes), adhesives (adhesive sheets, adhesive tapes), magnetic force, Bernoulli adsorption, suction adsorption, driving equipment, etc. can be used.

[0078] Description of Reference Numerals

[0079] EA1: Sheet stripping device;

[0080] EA2: splitting device;

[0081] 10: Sheet holding mechanism;

[0082] 20: Adhesion holding mechanism;

[0083] 30A: peeling mechanism;

[0084] 30B: splitting mechanism;

[0085] 40: Tension detection mechanism;

[0086] AS1: first adhesive sheet (adhesive sheet);

[0087] AE: outer edge;

[0088] CP: lamellar body;

[0089] DP1: first modified part;

[0090] DP2: second modified part;

[0091] WK1: adherend;

[0092] WK2: adherend;

[0093] WT1: first thinned adherend;

[0094] WT2: Second thinned adherend.

Claims

1. A sheet peeling method for peeling a pressure-sensitive adhesive sheet adhered to an adherend from the adherend, the sheet peeling method comprising the following steps: a sheet holding step of holding the adhesive sheet; an adherend holding step of holding the adherend; a peeling step of applying tension to the adhesive sheet held in the sheet holding step to peel the adhesive sheet from the adherend; a tension detection step of detecting a sheet tension applied to the adhesive sheet when the adhesive sheet is peeled off from the adherend in the peeling step; In the peeling step, based on the detection result of the tension detection step, while maintaining the sheet tension at a desired tension, the sheet tension is reduced in accordance with the reduction of the bonding surface between the adherend and the adhesive sheet, and the adhesive sheet is peeled from the adherend.

2. The sheet peeling method according to claim 1, wherein: In the peeling step, the adhesive sheet is peeled from the adherend while maintaining a constant ratio of the sheet tension to the length of the outer edge of the adhesive surface or a constant ratio of the sheet tension to the area of ​​the adhesive surface.

3. A sheet peeling method for peeling a pressure-sensitive adhesive sheet adhered to an adherend from the adherend, the sheet peeling method comprising the following steps: a sheet holding step of holding the adhesive sheet; an adherend holding step of holding the adherend; a peeling step of applying tension to the adhesive sheet held in the sheet holding step to peel the adhesive sheet from the adherend; a tension detection step of detecting a sheet tension applied to the adhesive sheet when the adhesive sheet is peeled off from the adherend in the peeling step; In the peeling process, a process of peeling the adhesive sheet from the adherend while maintaining the sheet tension at a desired tension is implemented based on the detection result of the tension detection process, and a peeling state control process is implemented. The peeling state control process controls the peeling state of the adhesive sheet peeled from the adherend by elastic deformation of an elastic component abutting against the adhesive sheet.

4. A sheet peeling device for peeling an adhesive sheet adhered to an adherend from the adherend, the sheet peeling device comprising: a sheet holding mechanism that holds the adhesive sheet; an adherend holding mechanism that holds the adherend; a peeling mechanism that applies tension to the adhesive sheet held by the sheet holding mechanism to peel the adhesive sheet from the adherend; a tension detection mechanism for detecting a sheet tension applied to the adhesive sheet when the adhesive sheet is peeled off from the adherend by the peeling mechanism; Based on the detection result of the tension detection mechanism, the peeling mechanism peels the adhesive sheet from the adherend by reducing the sheet tension in accordance with a reduction in the adhesive surface between the adherend and the adhesive sheet while maintaining the sheet tension at a desired tension.

5. A method for dividing an adherend having a first modified portion formed thereon and attached to an adhesive sheet, into a first thinned adherend located on the adhesive sheet side and a second thinned adherend located on the opposite side of the first thinned adherend across the first modified portion, with the first modified portion serving as a boundary, wherein the following steps are performed: a sheet holding step of holding the adhesive sheet; an adherend holding step of holding the adherend from the side that becomes the second thinned adherend; a dividing step of applying tension to the adhesive sheet held in the sheet holding step to divide the adherend into the first thinned adherend and the second thinned adherend; a tension detection step of detecting a sheet tension applied to the adhesive sheet when the adhesive sheet is divided into the first thinned adherend and the second thinned adherend in the dividing step; In the dividing step, based on the detection result in the tension detecting step, the adherend is divided into the first thinned adherend and the second thinned adherend while maintaining the sheet tension at a desired tension.

6. The segmentation method according to claim 5, wherein: The adherend is provided with a plurality of second modified portions in a direction parallel to a second dividing surface, and the second dividing surface intersects with a first dividing surface provided with the first modified portions, In the dividing step, when dividing the adherend into the first thinned adherend and the second thinned adherend, the first thinned adherend is divided along the second dividing surface to divide the first thinned adherend into a plurality of sheet-like bodies.

7. A dividing device for dividing an adherend having a first modified portion formed thereon and attached to an adhesive sheet into a first thinned adherend located on the adhesive sheet side and a second thinned adherend located on the opposite side of the first thinned adherend across the first modified portion, the dividing device comprising: a sheet holding mechanism that holds the adhesive sheet; an adherend holding mechanism that holds the adherend from a side that becomes the second thinned adherend; a splitting mechanism that applies tension to the adhesive sheet held by the sheet holding mechanism to split the adherend into the first thinned adherend and the second thinned adherend; a tension detection mechanism for detecting a sheet tension applied to the adhesive sheet when the adhesive sheet is divided into the first thinned adherend and the second thinned adherend by the dividing mechanism; The dividing mechanism divides the adherend into the first thinned adherend and the second thinned adherend while maintaining the sheet tension at a desired tension based on the detection result of the tension detection mechanism.

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