A bulb planting device

Abstract

The present application discloses a ball planting device, which relates to the technical field of ball planting. It includes a ball planting mesh plate provided with mesh holes corresponding to the wafer PAD points for allowing solder balls to fall onto the wafer; a ball supply assembly for quantitatively supplying solder balls onto the ball planting mesh plate; and a ball planting assembly for implanting the solder balls from the ball planting mesh plate onto the wafer. The ball supply assembly includes a material box and a driving member for driving the material box to rotate in the X direction. The material box is provided with a filling cavity and a material conveying channel communicating with the filling cavity. An inlet is formed at the communicating part of the filling cavity and the material conveying channel. In the initial state, the solder balls in the filling cavity enter the material conveying channel through the inlet. When the driving member drives the material box to rotate into the ball supply state, the inlet is located above the filling cavity and the material conveying channel, and the solder balls fall from the material conveying channel onto the ball planting mesh plate. The present application realizes the automatic and quantitative supply of solder balls.

Description

Technical Field

[0001] This application relates to the technical field of ball planting, and particularly to a ball planting device. Background Art

[0002] Wafer ball planting is a high-end semiconductor packaging technology used to accurately place solder balls on a wafer that has already been printed with flux. A large number of solder balls are required for ball planting, and ball supply is one of the key technologies.

[0003] Currently, the ball planting equipment mainly uses the method of manual ball supply. The Chinese patent with the authorization announcement number CN203774257U discloses manual operation. This method cannot control the supply quantity of solder balls, and sometimes there is a phenomenon of wasting solder balls. In the case of mass production in the factory, the quality of ball planting is affected by manual operation. That is, there are areas for improvement in the existing ball supply method. Summary of the Invention

[0004] In order to achieve automatic and quantitative supply of solder balls, this application provides a ball planting device.

[0005] The ball planting device provided by this application adopts the following technical solutions:

[0006] A ball planting device includes a ball planting mesh plate provided with mesh holes corresponding to the wafer PAD points for allowing solder balls to fall onto the wafer.

[0007] A ball supply assembly for quantitatively supplying solder balls onto the ball planting mesh plate.

[0008] A ball planting assembly for implanting the solder balls from the ball planting mesh plate onto the wafer.

[0009] The ball supply assembly includes a material box and a driving member for driving the material box to rotate in the X direction. The material box is provided with a filling cavity and a feeding channel communicating with the filling cavity. An inlet is formed at the communicating portion of the filling cavity and the feeding channel. In the initial state, the solder balls in the filling cavity enter the feeding channel through the inlet. When the driving member drives the material box to rotate into the ball supply state, the inlet is located above the filling cavity and the feeding channel, and the solder balls fall from the feeding channel onto the ball planting mesh plate.

[0010] By adopting the above technical solutions, the wafer is fixed below the corresponding position of the ball planting mesh plate and waits for ball planting. Then, the solder balls are filled into the filling cavity. The solder balls in the filling cavity will enter the feeding channel and are in a state of waiting for ball supply. The driving member drives the material box to rotate by a certain angle, so that the feeding port of the feeding channel faces the ball planting mesh plate. At this time, the inlet is located above the filling cavity and the feeding channel, that is, the solder balls in the filling cavity will no longer enter the feeding channel. That is, the solder balls falling from the feeding channel onto the ball planting mesh plate are quantitative, realizing quantitative and automatic ball supply operation. Subsequently, the ball planting assembly implants the solder balls onto the wafer to realize the ball planting operation.

[0011] Preferably, the material conveying channel is composed of a quantitative storage cavity and a discharge cavity. The feed inlet is formed between the quantitative storage cavity and the filling cavity. The discharge cavity is located at one end of the quantitative storage cavity away from the feed inlet. The quantitative storage cavity is arranged obliquely downward in the direction away from the feed inlet. The discharge cavity is arranged obliquely upward in the direction away from the quantitative storage cavity. The filling cavity is located above the quantitative storage cavity.

[0012] By adopting the above technical solution, the storage cavity is arranged obliquely downward, which is convenient for the solder balls to enter the storage cavity. In addition, the discharge cavity is arranged obliquely upward, that is, the solder balls in the storage cavity will not immediately enter it. That is, the "quantity" in the quantitative refers to the number of solder balls that the quantitative storage cavity can accommodate. After the driving member drives the material box to rotate a certain angle, the solder balls will slide out evenly after passing through the buffer of the discharge cavity, which helps to improve the uniformity of the sliding of the solder balls.

[0013] Preferably, it includes a base. The ball-planting mesh plate is arranged in the middle of the base. A mounting seat is slidably connected to one side of the base where the ball-planting mesh plate is located. The material box is rotatably connected to the mounting seat. The driving member is arranged on the mounting seat. A driving assembly for driving the mounting seat to reciprocate is arranged on the base. The sliding direction of the mounting seat is parallel to the rotation axis direction of the material box.

[0014] By adopting the above technical solution, in the ball supply state, the driving assembly can be used to drive the mounting seat to slide. At this time, the solder balls sliding out from the discharge cavity will be evenly arranged along the length direction on one side of the ball-planting mesh plate and will not be redundant together, which is convenient for efficiently implanting the solder balls into the wafer during subsequent ball planting.

[0015] Preferably, the driving assembly includes a pulley assembly and a servo motor for driving the pulley assembly to move. The mounting seat is fixedly arranged on the belt of the pulley assembly.

[0016] By adopting the above technical solution, while operating the driving member to rotate the material box to the feeding state, the servo motor is operated to make the mounting seat drive the material box to move linearly along the X direction, realizing the reciprocating movement of the mounting seat.

[0017] Preferably, the driving member is set as a driving cylinder fixedly arranged on the mounting seat. The telescopic direction of the piston rod of the driving cylinder is horizontal and perpendicular to the sliding direction of the mounting seat. A linkage plate is fixedly arranged at the end of the piston rod of the driving cylinder. A linkage block is arranged on the side wall of the material box. The linkage block is located on the side of the material box rotation connection away from the ball-planting mesh plate. A sliding groove is opened vertically on the linkage plate. The linkage block slides in the sliding groove.

[0018] By adopting the above technical solution, when the driving cylinder is operated to drive the linkage plate to move, at this time the linkage block will slide in the sliding groove, realizing the flipping action of the material box.

[0019] Preferably, a buffer is provided on one side of the mounting base away from the rotational connection of the cartridge, and the buffer abuts against the bottom of the cartridge and causes the cartridge to have a tendency to flip towards the ball planting stencil side.

[0020] By adopting the above technical solution, the buffer abuts against the bottom of the cartridge, causing the cartridge to have a tendency to flip towards the ball planting stencil side, that is, causing the linkage block to have an upward sliding tendency in the sliding groove, which helps the linkage block to smoothly move in the sliding groove when the linkage plate moves, preventing jamming; in addition, when the driving member drives the cartridge to rotate, the buffer can play a buffering role.

[0021] Preferably, mounting blocks are provided on the base along the sliding direction of the mounting base, proximity sensors are provided at both ends of the mounting blocks, an induction block is provided on the mounting base for contacting the induction surface of the proximity sensor, and the proximity sensor is signal-connected to an external alarm.

[0022] By adopting the above technical solution, the reciprocating movement range of the mounting base is between the two proximity sensors. When the induction block on the mounting base contacts the induction surface of the proximity sensor, it means that the mounting base has deviated from its own movement stroke. At this time, a signal will be transmitted to the alarm to emit an alarm sound and the servo motor will be turned off, playing a protective role and helping to improve the safety performance of the device.

[0023] Preferably, the ball planting assembly includes a six-axis robot fixed on the base and a squeegee mounted on the six-axis robot, and the squeegee implants solder balls onto the wafer through the mesh holes on the ball planting stencil.

[0024] By adopting the above technical solution, the six-axis robot drives the squeegee to move, causing the squeegee to scrape the solder balls along a set path, so that the solder balls uniformly fall from the mesh holes on the ball planting stencil onto the wafer, realizing the ball planting operation.

[0025] In summary, the present application includes at least one of the following beneficial technical effects:

[0026] 1. First, the solder balls are filled into the filling cavity of the cartridge, and then the solder balls in the filling cavity enter the quantitative storage cavity from the feeding port. Then, the driving member drives the cartridge to rotate by a certain angle, so that the feeding port is located above the filling cavity and the quantitative storage cavity, that is, the two chambers are separated. At this time, the solder balls in the quantitative storage cavity will quantitatively roll into the ball planting stencil from the discharging cavity, that is, the ball planting device realizes automatic and quantitative ball supply operation;

[0027] 2. With the buffer abutting against the bottom of the cartridge, the cartridge is in a tendency to flip towards the ball planting stencil side, that is, the linkage block has an upward sliding tendency in the sliding groove, which helps the linkage block to smoothly slide in the sliding groove when the linkage plate moves, thereby realizing the rotation of the cartridge and preventing the linkage block from jamming on the linkage plate. Description of the Drawings

[0028] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the present application;

[0029] Figure 2 It is a schematic diagram of a partial mechanism of the embodiment of the present application, mainly showing the structures of the ball supply assembly and the driving assembly;

[0030] Figure 3 It is a schematic diagram of the internal structure of the cartridge in the embodiment of the present application;

[0031] Figure 4 It is a schematic diagram of the feeding state of the cartridge in the embodiment of the present application, mainly showing the structures of the linkage plate and the linkage block.

[0032] Reference numerals: 1, base; 11, mounting block; 12, proximity sensor; 2, ball planting mesh plate; 3, ball supply assembly; 31, cartridge; 311, partition plate; 312, linkage block; 32, driving cylinder; 4, ball planting assembly; 41, six-axis manipulator; 42, scraper; 5, mounting seat; 51, buffer; 52, sensing block; 6, driving assembly; 61, pulley assembly; 62, servo motor; 7, filling cavity; 8, material conveying channel; 81, quantitative storage cavity; 82, discharge cavity; 821, discharge port; 9, feed port; 10, linkage plate; 101, sliding groove. Detailed Description of the Embodiment

[0033] The following will further describe the present application in detail with reference to the attached Figures 1-4 drawings.

[0034] The embodiment of the present application discloses a ball planting device.

[0035] Referring to Figure 1 , the ball planting device includes a base 1. A ball planting mesh plate 2 is fixedly connected to the middle of the base 1. The ball planting mesh plate 2 is provided with mesh holes corresponding to the wafer PAD points for allowing solder balls to fall into the wafer. A ball supply assembly 3 for quantitatively supplying solder balls onto the ball planting mesh plate 2 is arranged on one side of the base 1, and a ball planting assembly 4 for implanting the solder balls on the ball planting mesh plate 2 onto the wafer is also arranged on one side of the base 1.

[0036] The ball supply assembly 3 is used to quantitatively pour the solder balls onto the ball planting mesh plate 2, and then the ball planting assembly 4 scrapes the solder balls so that the solder balls fall from the mesh holes of the ball planting mesh plate 2 onto the PAD points of the wafer, realizing the ball planting operation.

[0037] Referring to Figure 1 and Figure 2, a base 1 is slidably connected with a mounting seat 5 along the X direction on one side of a ball-planting net plate 2, and a driving assembly 6 for driving the mounting seat 5 to reciprocate is arranged on the base 1; a buffer 51 is vertically installed on the mounting seat 5, and the ball supply assembly 3 includes a material box 31 rotatably connected to the mounting seat 5 through a hinge and a driving member for driving the material box 31 to rotate along the X direction. The rotation connection part of the material box 31 is located on the side of the mounting seat 5 close to the ball-planting net plate 2. A cover is hinged to the top of the material box 31 and is fixed by a buckle to realize the opening and closing actions; the upper end of the buffer 51 abuts and cooperates with the bottom of the material box 31 on the side far from its rotation connection part, so that the material box 31 is in a state of being slightly inclined towards the ball-planting net plate 2 side.

[0038] Referring to Figure 2 and Figure 3 , a partition plate 311 is fixedly installed in the material box 31. A filling cavity 7 for filling solder balls is formed above the partition plate 311 in the material box 31, and a material conveying channel 8 is formed below the partition plate 311 in the material box 31. An inlet 9 for communicating the filling cavity 7 and the material conveying channel 8 is formed between the partition plate 311 and the inner wall of the material box 31, and the inlet 9 is located on the side of the material box 31 far from the ball-planting net plate 2; the material conveying channel 8 is composed of a quantitative storage cavity 81 and a discharge cavity 82. The quantitative storage cavity 81 is communicated with the inlet 9, the discharge cavity 82 is located on the side of the quantitative storage cavity 81 far from the inlet 9, and a discharge port 821 is formed on the side of the discharge cavity 82 far from the quantitative storage cavity 81.

[0039] Among them, the upper surface of the partition plate 311 is inclined, and is inclined upward along the direction away from the inlet 9. Due to the abutting relationship between the buffer 51 and the material box 31, in the initial state, the quantitative storage cavity 81 is inclined, and is inclined downward along the direction away from the inlet 9, and the discharge cavity 82 is inclined upward along the direction away from the quantitative storage cavity 81.

[0040] In practice, the wafer is fixed below the corresponding position of the ball-planting net plate 2 and waits for the ball-planting operation. Then, the solder balls are filled into the filling cavity 7 of the material box 31. Since the upper side of the partition plate 311 is inclined, that is, the bottom of the filling cavity 7 is inclined, the solder balls will enter the quantitative storage cavity 81 from the inlet 9. When the driving member drives the material box 31 to rotate along the X direction, that is, rotate towards the ball-planting net plate 2 side and is in the ball supply state, at this time, the inlet 9 is located above the filling cavity 7 and the quantitative storage cavity 81, and the solder balls in the filling cavity 7 will not enter the quantitative storage cavity 81 anymore. The solder balls in the quantitative storage cavity 81 will enter the discharge cavity 82 and be poured from the discharge cavity 82 onto the ball-planting net plate 2. At the same time, the driving assembly 6 drives the mounting seat 5 to reciprocate along the X direction, so that the solder balls can be laid quantitatively and evenly on one side of the ball-planting net plate 2, and it helps to improve the efficiency of the subsequent ball-planting operation.

[0041] In addition, a transmitting sensor is installed on the mounting base 5. The cartridge 31 is made of a transparent material. The transmitting sensor is used to detect the height of the solder balls in the filling cavity 7 of the cartridge 31. When the height of the solder balls is low, the transmitting sensor will transmit a signal to prompt the staff to perform the ball-adding operation.

[0042] Referring to Figure 1 and Figure 2 , the driving assembly 6 includes a pulley assembly 61 installed on the base 1 and a servo motor 62 that drives the pulley assembly 61 to move. In the pulley assembly 61, the belt moves in the X direction. The output shaft of the servo motor 62 is coaxially fixed to the driving wheel in the pulley assembly 61. The mounting base 5 is fixedly arranged on the belt of the pulley assembly 61. A guide rail is also laid along the sliding direction of the mounting base 5 on the base 1. The mounting base 5 is fixedly connected to the slider on the slide rail to improve the stability of the mounting base 5 when it moves.

[0043] The servo motor 62 is used to drive the pulley assembly 61 to operate, so as to realize the reciprocating movement of the mounting base 5, so that when the solder balls are poured out of the cartridge 31, they can be arranged evenly and neatly, which is convenient for subsequent ball-planting operations.

[0044] On one side of the base 1 where the slide rail is located, a long strip-shaped mounting block 11 is also laid. The length direction of the mounting block 11 is parallel to the length direction of the slide rail. Proximity sensors 12 are installed at both ends of the mounting block 11. An induction block 52 is fixedly connected to the lower part of the mounting base 5 for contacting the induction surface of the proximity sensor 12. The proximity sensor 12 is signal-connected to an external alarm.

[0045] When in the ball supply state, the servo motor 62 drives the mounting base 5 to move. Normally, the mounting base 5 will reciprocate between the two proximity sensors 12. When the induction block 52 touches the induction surface of the proximity sensor 12, it means that the mounting base 5 has deviated from its original stroke. At this time, the proximity sensor 12 transmits a signal to the alarm to send an alarm signal and stops the servo motor 62, which helps to improve the safety performance of the device.

[0046] Referring to Figure 2 and Figure 4 , the driving member is set as a driving cylinder 32. The driving cylinder 32 is fixedly installed on the mounting base 5. The telescopic direction of the piston rod of the driving cylinder 32 is horizontally arranged and perpendicular to the sliding direction of the mounting base 5. The end of the piston rod of the driving cylinder 32 is fixedly connected to a linkage plate 10. A sliding groove 101 is opened in the linkage plate 10 along the vertical direction. A linkage block 312 is fixedly connected to one side of the cartridge 31 close to the driving cylinder 32. The linkage block 312 is located on the side of the cartridge 31 far from its rotation connection. The top of the sliding groove 101 is higher than the highest end of the rotation trajectory of the linkage block 312. Among them, a rotating bearing is fixed on the linkage block 321 in this application, which is in rolling fit with the inner wall of the sliding groove 101.

[0047] Operate the driving cylinder 32 to drive the linkage plate 10 to move. Since the cartridge 31 is in an inclined state in the initial state and has a tendency to flip towards the ball-planting mesh plate 2, at this time, the linkage block 312 will slide in the sliding groove 101, that is, the rotation of the cartridge 31 is realized.

[0048] Refer to Figure 1 , the ball-planting assembly 4 includes a six-axis manipulator 41 fixed on the base 1 and a squeegee 42 mounted on the six-axis manipulator 41. The squeegee 42 is used to evenly and efficiently implant the solder balls on the ball-planting mesh plate 2 onto the wafer.

[0049] The implementation principle of a ball-planting device in an embodiment of the present application is as follows: In practice, the solder balls are poured into the filling cavity 7 in the cartridge 31, and then the solder balls will enter the quantitative storage cavity 81 from the feed port 9. When the driving cylinder 32 drives the cartridge 31 to rotate by a certain angle, at this time, the filling cavity 7 will be separated from the quantitative storage cavity 81, that is, the solder balls in the quantitative storage cavity 81 will be quantitatively poured from the discharge cavity 82 onto the ball-planting mesh plate 2. The quantity determined in the quantification is the number of solder balls that the quantitative storage cavity 81 can accommodate, realizing quantitative ball supply; in addition, the servo motor 62 will drive the mounting seat 5 to move in the X direction, driving the cartridge 31 to move, so that the solder balls can be evenly arranged on the ball-planting mesh plate 2. When the squeegee 42 scrapes the solder balls subsequently, the solder balls can fall onto the wafer more efficiently, reducing the number of times the squeegee 42 scrapes the balls, that is, helping to improve the efficiency of ball planting.

[0050] The above are all the preferred embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A ball planting device, characterized in that: Including a ball-planting stencil (2) provided with mesh holes corresponding to the wafer PAD points for allowing solder balls to fall onto the wafer; a ball supply assembly (3) for quantitatively supplying solder balls onto the ball-planting stencil (2); a ball-planting assembly (4) for implanting the solder balls from the ball-planting stencil (2) onto the wafer; The ball supply assembly (3) includes a cartridge (31) and a driving member for driving the cartridge (31) to rotate in the X direction. A filling cavity (7) and a material conveying channel (8) communicating with the filling cavity (7) are provided in the cartridge (31). An inlet (9) is formed at the connection between the filling cavity (7) and the material conveying channel (8). In the initial state, the solder balls in the filling cavity (7) enter the material conveying channel (8) through the inlet (9). When the driving member drives the cartridge (31) to rotate into the ball supply state, the inlet (9) is located above the filling cavity (7) and the material conveying channel (8), and the solder balls fall from the material conveying channel (8) onto the ball-planting stencil (2); The material conveying channel (8) is composed of a quantitative storage cavity (81) and a discharge cavity (82). The inlet (9) is formed between the quantitative storage cavity (81) and the filling cavity (7). The discharge cavity (82) is located at one end of the quantitative storage cavity (81) away from the inlet (9). The quantitative storage cavity (81) is inclined downward along the direction away from the inlet (9), and the discharge cavity (82) is inclined upward along the direction away from the quantitative storage cavity (81). The filling cavity (7) is located above the quantitative storage cavity (81); Including a base (1), the ball-planting stencil (2) is arranged in the middle of the base (1). A mounting seat (5) is slidably connected to one side of the base (1) where the ball-planting stencil (2) is located. The cartridge (31) is rotatably connected to the mounting seat (5), and the driving member is arranged on the mounting seat (5). A driving assembly (6) for driving the mounting seat (5) to reciprocate slidably is arranged on the base (1). The sliding direction of the mounting seat (5) is parallel to the rotation axis direction of the cartridge (31). The driving assembly (6) includes a pulley assembly (61) and a servo motor (62) for driving the pulley assembly (61) to move. The mounting seat (5) is fixedly arranged on the belt of the pulley assembly (61); The driving member is set as a driving cylinder (32) fixedly arranged on the mounting seat (5). The telescopic direction of the piston rod of the driving cylinder (32) is horizontal and perpendicular to the sliding direction of the mounting seat (5). A linkage plate (10) is fixedly arranged at the end of the piston rod of the driving cylinder (32). A linkage block (312) is arranged on the side wall of the cartridge (31). The linkage block (312) is located on the side of the rotation connection of the cartridge (31) away from the ball-planting stencil (2). A sliding groove (101) is opened in the linkage plate (10) in the vertical direction, and the linkage block (312) slides in the sliding groove (101). A buffer (51) is arranged on one side of the mounting seat (5) away from the rotation connection of the cartridge (31). The buffer (51) abuts against the bottom of the cartridge (31) and makes the cartridge (31) tend to turn towards the ball-planting stencil (2).

2. The ball planting device according to claim 1, characterized in that: The base (1) is provided with a mounting block (11) along the sliding direction of the mounting seat (5). Proximity sensors (12) are provided at both ends of the mounting block (11). An induction block (52) is arranged on the mounting seat (5) and is used to contact the induction surface of the proximity sensor (12). The proximity sensor (12) is signal-connected to an external alarm.

3. The ball planting device according to claim 1, characterized in that: The ball mounting assembly (4) includes a six-axis robot (41) fixed on the base (1) and a squeegee (42) mounted on the six-axis robot (41). The squeegee (42) implants solder balls into the wafer through the mesh holes on the ball mounting stencil (2).

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