Circuit board assembly, electronic device, and circuit board assembly manufacturing method

Abstract

The present application discloses a circuit board assembly, an electronic device, and a method for manufacturing a circuit board assembly, wherein the circuit board assembly includes: a chip; a circuit board body, wherein a groove-shaped cavity is provided on one side surface of the circuit board body, and the cavity is used to accommodate the chip; a conductive column group is protruding from the bottom of the cavity, and the conductive column group includes multiple conductive columns, which are electrically connected to the conductive layer of the circuit board body, the multiple conductive columns support the chip, and the multiple conductive columns are electrically connected to the pads on the chip in a one-to-one correspondence; a connection structure, wherein the circuit board body is detachably connected to the chip through the connection structure. In an embodiment of the present application, the chip arrangement structure on the circuit board avoids the chip welding process, allowing the chip to be directly assembled and applied without high-temperature welding, thereby reducing the risk of thermal stress cracking failure of the chip, while solving the problem of solder ball cracking used in existing chip welding, which is conducive to improving chip reliability.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to a circuit board assembly, an electronic device, and a method for manufacturing the circuit board assembly. Background Art

[0002] With the rapid development of the smartphone industry, consumers are increasingly demanding more diverse mobile phone functions and a smoother user experience, placing increasing pressure on chip computing power and storage efficiency. At the same time, to enhance product competitiveness, mobile phone manufacturers are increasing their R&D investments at all costs, vying for first-mover rights to market key chips like the central processing unit (CPU).

[0003] As manufacturing requirements for key chips like CPUs continue to rise, from 10nm to 5nm and then 4nm, the lack of maturity in advanced processes has led to poor heat resistance in high-end chips. This has led to frequent reliability issues such as internal chip cracking and solder joint cracking after soldering, impacting product reputation. Furthermore, with the widespread adoption of sandwich stacking technology, the number of times chips pass through reflow ovens and are subjected to heat continues to increase, increasing the risk of chip failure.

[0004] In the process of implementing this application, the inventors found that there are at least the following problems in the prior art: the existing chip is soldered and mounted on a printed circuit board (PCB), which can easily cause cracks inside the chip and cracks in the solder joints, resulting in chip failure. Summary of the Invention

[0005] The present application aims to provide a circuit board assembly, an electronic device and a method for manufacturing a circuit board assembly, which at least solves one of the problems of existing chip soldering and mounting on a printed circuit board (PCB), which easily leads to internal cracking of the chip and cracking of the solder joints, resulting in chip failure.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In the first aspect, an embodiment of the present application proposes a circuit board assembly, comprising: a chip; a circuit board body, a surface of one side of the circuit board body being provided with a groove-shaped cavity, the cavity being used to accommodate the chip; a conductive column group being protruding from the bottom of the cavity, the conductive column group comprising a plurality of conductive columns, the conductive columns being electrically connected to the conductive layer of the circuit board body, the plurality of conductive columns supporting the chip, and the plurality of conductive columns being electrically connected to the pads on the chip in a one-to-one correspondence; a connection structure, the circuit board body being detachably connected to the chip via the connection structure.

[0008] In a second aspect, an embodiment of the present application proposes an electronic device, comprising: a housing; a circuit board assembly, wherein the circuit board assembly is the above-mentioned circuit board assembly, and the circuit board assembly is arranged inside the housing.

[0009] In a third aspect, an embodiment of the present application proposes a method for manufacturing a circuit board assembly, wherein the circuit board assembly is the above-mentioned circuit board assembly, and the method includes: manufacturing a first circuit substrate provided with the conductive column group, wherein the conductive column group includes a plurality of conductive columns, the first end of the conductive column protrudes from the first side surface of the first circuit substrate, and the second end of the conductive column is electrically connected to the conductive layer of the first circuit substrate; arranging substrate layers on both sides of the first circuit substrate provided with the conductive column group to manufacture a second circuit substrate; opening a cavity on the side surface of the second circuit substrate corresponding to the position of the conductive column group, and making the first end of the conductive column protrude from the bottom of the cavity to form the circuit board body; assembling the chip at the cavity to form the circuit board assembly.

[0010] In an embodiment of the present application, a cavity is provided on the surface of the circuit board body, a conductive column group is provided at the bottom of the cavity, and the chip is provided inside the cavity. The circuit connection of the chip can be achieved through the conductive column group, and the chip and the circuit board body are detachably connected and fixed through a connecting structure. The chip setting structure on the circuit board avoids the chip welding process, so that the chip can be directly assembled and applied without high-temperature welding, thereby reducing the risk of thermal stress cracking failure of the chip, and at the same time solves the problem of solder ball cracking used in existing chip welding, which is conducive to improving chip reliability and enhancing user experience.

[0011] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0013] Figure 1 is an overall schematic diagram of a circuit board body according to an embodiment of the present invention;

[0014] Figure 2 is a partial schematic diagram of a circuit board body according to an embodiment of the present invention;

[0015] Figure 3 is a schematic top view of a circuit board body according to an embodiment of the present invention;

[0016] Figure 4 is a cross-sectional view of a circuit board body at a cavity according to an embodiment of the present invention;

[0017] Figure 5 is a schematic diagram of a tabletting arrangement according to an embodiment of the present invention;

[0018] Figure 6 is a schematic flow chart of a method for manufacturing a circuit board assembly according to an embodiment of the present invention;

[0019] Figure 7 This is a schematic diagram of a specific process for manufacturing a first circuit substrate provided with a conductive column group according to an embodiment of the present invention;

[0020] Figure 8 This is a schematic diagram of a specific structure of a first circuit substrate provided with a conductive column group according to an embodiment of the present invention;

[0021] Figure 9 is a schematic diagram of a specific process for manufacturing a second circuit substrate and a circuit board body according to an embodiment of the present invention;

[0022] Figure 10 It is a schematic diagram of the specific structure of manufacturing the second circuit substrate and the circuit board body according to an embodiment of the present invention.

[0023] Reference numerals:

[0024] 1: PCB body; 11: First circuit substrate; 111: Conductive layer; 112: Slot; 12: Substrate layer; 121: Isolation layer; 13: Second circuit substrate; 131: Slot body; 2: Cavity; 3: Conductive column group; 31: Conductive column; 311: Positioning slot; 4: Pressing piece; 41: Protruding contact; 5: Fixing column; 6: Circuit dry film; 61: First hole position; 62: Second hole position; 63: Third hole position. DETAILED DESCRIPTION

[0025] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and are not to be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of this application.

[0026] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. Furthermore, the character " / " in the specification and claims generally indicates an "or" relationship between the preceding and following elements.

[0027] In the description of the present invention, it should be understood that the terms "length", "width", "thickness", "up", "down", "bottom", "inside", "axial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0028] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0029] The following combination Figures 1-10 A circuit board assembly, an electronic device, and a method for manufacturing the circuit board assembly according to embodiments of the present invention are described.

[0030] like Figure 1 As shown, according to some embodiments of the present invention, the circuit board assembly includes: a chip; a circuit board body 1, a cavity 2 in the shape of a groove is provided on one side of the circuit board body 1, and the cavity 2 accommodates the chip; that is, the circuit board body 1 has a certain thickness, the cavity 2 is a groove provided on one side of the circuit board body 1, and the chip is placed inside the cavity 2. Figure 2 The circuit board body 1 also includes a conductive column group 3. The bottom of the cavity 2 is protruded with a conductive column group 3. The conductive column group 3 includes a plurality of conductive columns 31. The conductive columns 31 are electrically connected to the conductive layer 111 of the circuit board body 1. The plurality of conductive columns 31 support the chip, and the plurality of conductive columns 31 are electrically connected to the pads on the chip in a one-to-one correspondence; a connection structure, the circuit board body 1 is detachably connected to the chip through the connection structure.

[0031] In the circuit board assembly of this embodiment, the chip is disposed in the cavity 2 on one side of the circuit board body 1, and the chip is placed on the conductive column group 3. Electrical connection is achieved through the conductive column 31. The electrical connection is also a conductive connection. The circuit conduction of the chip is achieved through the conductive column group 3. Specifically, the multiple conductive columns 31 in the conductive column group 3 are arranged to correspond one-to-one with the pads on the chip. Therefore, when the chip is placed in the cavity 2, the pads on the chip are conductively connected one-to-one with the conductive columns, thereby achieving circuit switching of the chip. In addition, the conductive columns 31 protrude from the bottom of the cavity 2, and a gap can be created between the chip and the bottom of the cavity 2, which can adapt to the unevenness of the chip connection surface and better achieve conductive connection of the chip.

[0032] Furthermore, a connection structure is provided for securing the chip to the circuit board body 1. In this embodiment, the chip is detachably connected to the circuit board body 1 via the connection structure. The connection structure may be a structure that enables the chip to be detachably attached to the circuit board body 1, such as a bolt structure, where the chip is detachably attached to the circuit board body 1 via bolts; or a pressure plate 4 structure, where the pressure plate 4 is disposed on the chip at the opening of the cavity 2 to secure and detach the chip. The connection structure may also be other structures that enable the chip to be securely attached to the circuit board body 1 and detachably attached, without specific limitation.

[0033] According to the circuit board assembly of the embodiment of the present invention, a cavity 2 is set on the surface of the circuit board body 1, a conductive column group 3 is set at the bottom of the cavity 2, and the chip is set inside the cavity 2. The circuit connection of the chip can be achieved through the conductive column group 3, and the chip and the circuit board body 1 are detachably connected and fixed through a connection structure. The arrangement structure of the chip on the circuit board body 1 avoids the welding process of the chip, so that the chip can be directly assembled and applied without high-temperature welding, thereby reducing the risk of thermal stress cracking failure of the chip, and solving the problem of solder ball cracking used in existing chip welding, which is conducive to improving chip reliability and enhancing user experience.

[0034] On the other hand, by placing the chip inside the cavity 2, the wall of the cavity 2 can also protect the chip, which is conducive to cutting off the transmission path of external mechanical stress, thereby reducing the risk of mechanical stress failure of the chip.

[0035] Further, refer to Figure 3 The circuit board body 1 can be provided with multiple cavities 2, each corresponding to a plurality of chips. The cavities 2 can be arranged according to the specific arrangement requirements of the chips. Various electronic components and structural parts can be mounted on other locations of the circuit board body 1. The arrangement of various electronic components and structural parts is similar to the existing technology and will not be repeated here.

[0036] According to some embodiments of the present invention, reference Figure 4 One end of the conductive post 31 is inserted into the circuit board body 1 corresponding to the bottom of the cavity 2, and the end of the conductive post 31 inserted into the circuit board body 1 is electrically connected to the conductive layer 111 of the circuit board body 1. In this embodiment, one end of the conductive post 31 is inserted into the bottom of the cavity 2 to a certain depth, that is, the conductive post 31 is grown on the circuit board body 1 corresponding to the bottom of the cavity 2, which helps to improve the firmness of the conductive post installation and enhance the structural stability. The one end of the conductive post 31 extends into the circuit board body 1, which also facilitates electrical connection with the conductive layer 111 inside the circuit board body 1 to achieve chip circuit transfer.

[0037] In other embodiments, the conductive pillar 31 may also be connected to the bottom of the cavity 2, that is, the end of the conductive pillar 31 is directly connected to the bottom of the cavity 2. The specific connection structure between the conductive pillar 31 and the circuit board body 1 is not limited, and the purpose is to achieve a stable connection between the conductive pillar 31 and the conductive layer 111 of the circuit board body 1. The conductive pillar 31 may also be electrically connected to the conductive layer 111 in other parts of the circuit board body 1. For example, the conductive layer 111 of the circuit board body 1 can be led to the bottom surface of the cavity 2 and connected to the conductive pillar 31. The specific connection structure is not limited, and the purpose is to achieve an electrically conductive connection between the conductive pillar 31.

[0038] Furthermore, the conductive pillars 31 can be conductive copper pillars, which have good conductivity reliability. The conductive pillars 31 can also be made of other conductive materials, which are not specifically limited.

[0039] According to a further embodiment of the present invention, a positioning groove 311 is provided on the end face of the conductive pillar 31 away from the bottom of the cavity 2, and the positioning groove 311 matches the pad of the chip. The positioning groove 311 matches the pad of the chip, that is, the positioning groove 311 matches the shape and size of the chip pad, so that the pad of the chip is placed in the positioning groove 311 accordingly. The chip support is placed on the conductive pillar 31, and the end of the conductive pillar 31 away from the bottom of the cavity 2 is the end in contact with the chip. This end of the conductive pillar 31 is used to connect with the pad on the chip. By providing the positioning groove 311 on this end face of the conductive pillar 31, the pad on the chip can be placed in the positioning groove 311 accordingly, which is beneficial to improving the stability of the relative position between the chip and the conductive pillar 31, and improving the reliability of the electrical connection between the chip and the conductive pillar 31.

[0040] Furthermore, the positioning groove 311 can be hemispherical. The hemispherical positioning groove 311 can mate with a pad on the bottom of the chip, such as a solder ball. In other embodiments, the positioning groove 311 can also have other shapes, such as an irregular groove, to better mate with the pad on the chip and achieve a mating connection between the chip pad and the conductive pillar 31. This is not limited to specific shapes.

[0041] According to some embodiments of the present invention, reference Figure 1 and Figure 2 The connection structure includes at least one pressing plate 4, which is connected to the circuit board body 1 and is disposed on the chip. In this embodiment, the connection structure is provided as a pressing plate 4. After the chip is placed in the cavity 2, the pressing plate 4 can limit and fix the chip above the cavity 2 at the cavity opening, preventing the chip from falling out of the cavity 2 and ensuring stable contact between the chip and the conductive pillar 31. The pressing plate 4 can be connected to the circuit board body 1 for fixation.

[0042] According to a further embodiment of the present invention, referring to Figure 4 The side of the pressing plate 4 that contacts the chip is provided with a protruding contact 41. After the chip is placed in the cavity 2, one side of the pressing plate 4 contacts the chip, and the pressing plate 4 is connected and fixed to the circuit board body 1 while also pressing and fixing the chip. In this embodiment, a protruding protruding contact 41 is provided on the side of the pressing plate 4 that contacts the chip, and the protruding contact 41 contacts the chip. The provision of the protruding contact 41 allows the pressing plate 4 to better press and fix the chip.

[0043] Furthermore, the protruding contact 41 may be a flexible structure; for example, it may be a flexible or elastic structure such as rubber, which can better achieve pressing the pressing sheet 4 on the chip and is beneficial to protecting the chip and avoiding damage to the chip surface.

[0044] According to a further embodiment of the present invention, the pressing plate 4 is a spring, one end of which is provided on the chip, and the other end of which is rotatably connected to the circuit board body 1. In this embodiment, the pressing plate 4 is set as a spring, that is, an elastic structure, which can apply pressure to the chip through its own elasticity to achieve stable pressing and fixing of the chip. And the end of the spring is set to be rotatably connected to the circuit board body 1. The spring can be rotated around the end relative to the circuit board body 1. When assembling or disassembling the chip, the spring can be turned away. After the chip is assembled, the spring can be turned onto the chip to press and fix the chip. The spring can be rotated 360° relative to the circuit board body 1 to facilitate the assembly of the chip; the rotation angle of the spring relative to the circuit board body 1 can also be other, with the purpose of enabling the assembly of the chip, and there is no specific limitation.

[0045] Further, refer to Figure 4 In this embodiment, the spring element is attached to the surface of the circuit board body 1. The spring element can be placed in contact with the surface of the circuit board body 1. The depth of the cavity 2 can match the thickness of the chip, so that when the chip is placed inside the cavity 2, the surface of the chip is flush with the surface of the circuit board body 1. Thus, the spring element can be rotated to press against the chip.

[0046] Further, refer to Figure 4 and Figure 5 A fixing post 5 is connected to the circuit board body 1, and the other end of the spring clip is rotatably connected to the fixing post 5. The fixing post 5 can be provided to achieve a rotatable connection between the spring clip and the circuit board body 1. Specifically, the fixing post 5 can be fixedly connected to the circuit board body 1, and the spring clip and the fixing post 5 can be rotatably connected. The fixing post 5 can be connected to the circuit board body 1 by bolts or welding. The end of the spring clip can be rotatably connected to the fixing post 5 by a pin structure or the like.

[0047] refer to Figure 4In one embodiment of the present invention, the fixing post 5 can be embedded in the circuit board body 1 and connected to the circuit board body 1. This allows the spring to contact the surface of the circuit board body 1. The circuit board body 1 can be provided with a mounting hole, such as a threaded hole, into which the fixing post 5 is inserted and connected to the circuit board body 1 via a threaded structure. The fixing post 5 can also be welded to the circuit board body 1.

[0048] In another embodiment of the present invention, the fixing post 5 can also be connected to the surface of the circuit board body 1 by welding or other means, and then be rotatably connected to the spring. The specific connection structure between the fixing post 5 and the circuit board body 1 is not limited, and the purpose is to enable the spring to be rotatably connected to the circuit board body 1.

[0049] Further, refer to Figure 3 In this embodiment, a plurality of pressing plates 4 are distributed on the periphery of the cavity 2. For any cavity 2, a plurality of pressing plates 4 can be provided to press and fix the chip at multiple locations. Specifically, in this embodiment, one end of the pressing plate 4 is connected to the circuit board body 1, and the other end can extend into the interior of the cavity 2 to press the chip. A pressing plate 4 can be provided at each of the four corners of the cavity 2 to press and fix the chip at the four corners of the chip. The pressing plates 4 can also be provided at other locations of the cavity 2, for example, in the middle of the length direction of the cavity 2, or in the middle of the width direction; the specific location and number of the pressing plates 4 can be flexibly set according to actual needs, and are not specifically limited.

[0050] Furthermore, in other embodiments, the setting form of the pressing sheet 4 can also be other. For example, the pressing sheet 4 can span the cavity 2, and the two ends are respectively connected to the circuit board body 1, so that the pressing sheet 4 is pressed on the chip at the corresponding position of the opening of the cavity 2 to fix the chip; the two ends of the pressing sheet 4 and the circuit board body 1 can be detachably connected by bolts; one end of the pressing sheet 4 can also be rotatably connected to the circuit board body 1, and the other end can be detachably connected to the circuit board body 1; or, when the pressing sheet 4 is set to an elastic structure, the two ends of the pressing sheet 4 can also be respectively connected to the circuit board body 1, and the chip can be assembled or disassembled by pulling up or putting down the elastic deformation of the pressing sheet 4.

[0051] Furthermore, the pressing sheet 4 can also be a combination of multiple setting forms. For example, when multiple pressing sheets 4 are provided on the periphery of any cavity 2, some of the pressing sheets 4 can be provided with one end of the pressing sheet 4 connected to the circuit board body 1 and the other end extending into the cavity 2 to press the chip; some of the pressing sheets 4 can be provided with the pressing sheet 4 crossing the cavity 2 and connected to the circuit board body 1 at both ends; the specific setting form of the pressing sheet 4 can also be other, with the purpose of fixing the chip, and there is no specific limitation.

[0052] According to some other embodiments of the present invention, the connection structure between the chip and the circuit board body 1 may also be other. For example, a mounting hole may be provided on the chip, and the chip may be connected and fixed to the circuit board body 1 by bolts; or a connector may be provided on the chip, and the chip may be connected to the circuit board body 1 through the connector, and the connector and the circuit board body 1 may be connected by means of threads or the like.

[0053] According to the circuit board assembly of an embodiment of the present invention, a cavity 2 is designed on the circuit board body 1, and a chip is embedded in cavity 2. Compared with existing chip welding solutions, the chip in this embodiment is in contact with the conductive pillar 31 in cavity 2 and is fixed by a connection structure. The chip does not need to undergo high-temperature welding and can be directly assembled and applied, thus eliminating the problem of thermal stress failure during the heating process of chip welding. On the other hand, because the chip is embedded in cavity 2 of the circuit board body 1, the side walls of cavity 2 provide comprehensive protection for the chip, cutting off the transmission path of external mechanical stress, thereby effectively avoiding the problem of mechanical stress failure of the chip. At the same time, this solution does not require welding, fundamentally eliminating the problem of solder ball cracking in existing applications, greatly improving the durability and reliability of the product.

[0054] Other components of the circuit board assembly according to the embodiment of the present invention, such as other electronic components and operations, are well known to those skilled in the art and will not be described in detail here.

[0055] According to some embodiments of the present invention, an electronic device includes: a housing; and a circuit board assembly, wherein the circuit board assembly is the circuit board assembly described in the above embodiments and is disposed within the housing. The circuit board assembly includes a circuit board body 1 and a chip disposed on the circuit board body 1. Specifically, the electronic device may be a mobile phone, and the circuit board assembly may be a motherboard. The electronic device may also be other devices requiring a circuit board assembly, such as a tablet, a computer, or the like, without limitation.

[0056] Other components of the electronic device according to the embodiment of the present invention, such as connection circuits and operations, are known to those skilled in the art and will not be described in detail here.

[0057] According to some embodiments of the present invention, the circuit board assembly manufacturing method, wherein the circuit board assembly is the circuit board assembly according to any one of the above embodiments, Figure 6 , the method comprising:

[0058] S1, making a first circuit substrate 11 provided with the conductive column group 3, wherein the conductive column group 3 includes a plurality of conductive columns 31, the first end of the conductive column 31 protrudes from the first side surface of the first circuit substrate 11, and the second end of the conductive column 31 is electrically connected to the conductive layer 111 of the first circuit substrate 11; S2, respectively arranging substrate layers 12 on both sides of the first circuit substrate 11 provided with the conductive column group 3 to make a second circuit substrate 13; S3, opening a cavity 2 on the side surface of the second circuit substrate 13 corresponding to the position of the conductive column group 3, and making the first end of the conductive column 31 protrude from the bottom of the cavity 2 to form the circuit board body 1; S4, assembling the chip in the cavity 2 to form the circuit board assembly.

[0059] According to the circuit board assembly manufacturing method of this embodiment, a first circuit substrate 11 having a conductive column group 3 is first manufactured; then, substrate layers 12 are stacked on both sides of the first circuit substrate 11 having the conductive column group 3, and a second circuit substrate 13 having a target stacking thickness is manufactured using a multi-layer lamination process. The second circuit substrate 13 has the conductive column group 3; then, a cavity 2 is opened on the side of the second circuit substrate 13 corresponding to the conductive column group 3, so that the conductive column group 3 is exposed, thereby completing the manufacturing of the circuit board.

[0060] According to the circuit board assembly manufacturing method of this embodiment, the conductive column group 3 is first manufactured on the first circuit substrate 11 and then formed inside the second circuit substrate 13 through a pressing process, and then a cavity is opened to expose the conductive column group 3. This manufacturing process allows the conductive column group 3 to be inserted into the bottom of the cavity 2, which is beneficial to improving the structural stability of the conductive column group 3. In addition, the first circuit substrate 11 provided with the conductive column group 3 is manufactured separately, which can facilitate the setting of the circuit connection between the conductive column group 3 and the first circuit substrate 11. The circuit connection between the conductive column group 3 and the first circuit substrate 11 is first set according to the preset connection circuit, which can facilitate the circuit connection setting in subsequent processes.

[0061] According to a further embodiment of the present invention, the second end of the conductive pillar 31 of the conductive pillar group 3 is inserted into the first circuit substrate 11 and electrically connected to the conductive layer 111 on the second side surface of the first circuit substrate 11. This helps to improve the stability of the conductive pillar structure and facilitates the circuit connection between the conductive pillar 31 and the first circuit substrate 11.

[0062] According to a further embodiment of the present invention, the production of the first circuit substrate 11 provided with the conductive column group 3 specifically includes: drilling a groove 112 on the first side of the first circuit substrate 11, and the groove 112 is connected to the conductive layer 111 on the second side of the first circuit substrate 11; attaching a wiring dry film 6 on both sides of the first circuit substrate 11, exposing and developing, so that a hole connected to the groove 112 is formed in the wiring dry film 6 on the first side of the first circuit substrate 11; electroplating the conductive column 31 in the groove 112 and the hole to form the first circuit substrate 11 provided with the conductive column group 3.

[0063] Figure 8 The structure shown is Figure 7 Schematic diagram of structural changes corresponding to the process shown; reference Figure 7 and Figure 8 In this embodiment, the specific process for producing the first circuit substrate 1 provided with the conductive pillar group 3 includes: S11, first cutting the material to produce the first circuit substrate 11; the first circuit substrate 11 is a printed circuit board (PCB) structure. Specifically, the first circuit substrate 11 can be a single-layer substrate structure, with an insulating dielectric layer in the middle of the first circuit substrate 11, and conductive layers 111 are respectively provided on both sides of the dielectric layer. S12, drilling a groove 112 on the first side of the first circuit substrate 11. The groove 112 can be formed by a laser drilling process. Then, a conductive pillar 31 is formed in the groove 112 by an electroplating process. The conductive pillar 31 can be a conductive copper pillar; the conductive pillar 31 is connected to the conductive layer 111 on the second side of the first circuit substrate 11.

[0064] Specifically, the electroplating of the conductive pillar 31 includes: S13, respectively attaching a circuit dry film 6 to both sides of the first circuit substrate 11 after the groove 112 is drilled, exposing and developing, so that a hole connected to the groove 112 is formed in the circuit dry film 6 on the first side of the first circuit substrate 11, the hole being the first hole 61, that is, forming Figure 8 S14, electroplating the conductive column 31 in the slot 112 and the first hole 61 to form a structure corresponding to the third step; Figure 8 The structure corresponding to step 4 in

[15] is shown. Applying the wiring dry film 6 helps protect the conductive layer 111 of the first circuit substrate 11 during the electroplating process, preventing damage to the conductive layer 111. Exposing and developing the wiring dry film 6 creates holes, facilitating the electroplating of the conductive pillars 31. The wiring dry film 6 can be applied or removed as needed to form the desired structure.

[0065] According to a further embodiment of the present invention, the production of the first circuit substrate 11 provided with the conductive column group 3 further includes: producing a positioning groove 311 on the first end surface of the conductive column 31 formed by electroplating, and the positioning groove 311 matches the pad on the chip.

[0066] According to a further embodiment of the present invention, a positioning groove 311 is made on the first end face of the conductive column 31 formed by electroplating, specifically including: S15, after the conductive column group 3 is formed by electroplating in the groove 112 and the first hole position 61, a wiring dry film 6 is respectively attached to both sides of the first circuit substrate 11, and exposed and developed, so that a second hole position 62 connected to the first end of the conductive column is formed in the wiring dry film 6 on the first side surface of the first circuit substrate 11; S16, etching the positioning groove 311 on the first end face of the conductive column through the second hole position 62.

[0067] Specifically, refer to Figure 7 and Figure 8 After the conductive pillar group 3 is formed by electroplating the conductive pillar 31 in the groove 112 and the hole, the circuit dry film 6 may not be washed off first. The circuit dry film 6 may be applied to both sides of the first circuit substrate 11, exposed and developed. A hole connected to the first end of the conductive pillar 31 is formed in the circuit dry film 6 on the first side of the first circuit substrate 11. The hole is the second hole 62, that is, the following is formed: Figure 8 Then, the first end surface of the conductive column 31 is etched in the second hole 62 to form a positioning groove 311, forming a structure corresponding to the fifth step. Figure 8 The structure corresponding to the sixth step. The positioning groove 311 can be spherical. Then S17, the line dry film 6 on both sides can be removed to form the first circuit substrate 11 with the conductive column group 3 grown thereon, that is, Figure 8 The structure corresponding to the seventh step in .

[0068] According to a further embodiment of the present invention, the manufacturing of the first circuit substrate 11 provided with the conductive pillar group 3 further includes: etching the conductive layers 111 on both sides of the first circuit substrate 11 respectively according to the preset connection circuit of the circuit board assembly. Figure 8 In the structure corresponding to step 7, the second ends of the conductive pillars 31 are all connected to the conductive layer 111 on the second side of the first circuit substrate 11. In actual applications, not all pads on the chip are connected together. Instead, there is a preset connection circuit, and the pads on the chip need to be conductively connected according to the preset connection circuit. Accordingly, the conductive pillars in the conductive pillar group 3 need to be electrically connected according to the preset connection circuit. That is, there are disconnected portions between the second ends of the multiple conductive pillars 31 and the conductive layer 111 of the first circuit substrate 11 according to the preset connection circuit, and the conductive layer 111 should be etched according to the preset connection circuit.

[0069] Specifically, according to the preset connection circuit of the circuit board, the conductive layers 111 on both sides of the first circuit substrate 11 are etched separately, including: S18, attaching a wiring dry film 6 to the second side of the first circuit substrate 11, exposing and developing, and forming a third hole 63 on the second side of the first circuit substrate 11 that is connected to the conductive layer 111 on the second side of the first circuit substrate 11; S19, according to the preset connection circuit, etching the conductive layers 111 on both sides of the first circuit substrate 11 separately; S110, removing the wiring dry film 6, and completing the production of the conductive column group 3 on the first circuit substrate 11.

[0070] That is, in this embodiment, after the positioning groove 311 is formed, the circuit dry film 6 is removed; then the circuit dry film 6 is attached to the second side of the first circuit substrate 11, exposed and developed, and the third hole 63 is formed. Figure 8 In this embodiment, the conductive layer 111 on the first side of the first circuit substrate 11 is completely etched, and the conductive layer 111 on the second side of the first circuit substrate 11 is etched according to the preset connection circuit, such as Figure 8 The structure shown in the ninth step in the process is to facilitate subsequent circuit connection. Therefore, it is necessary to attach a circuit dry film 6 to the second side of the first circuit substrate 11, expose and develop it to protect the conductive layer 111 on the second side of the first circuit substrate 11 that does not need to be etched. The third hole 63 is the part of the conductive layer 111 that needs to be etched. After etching the conductive layer 111 on both sides of the first circuit substrate 11, the circuit dry film 6 can be removed to form a first circuit substrate 11 with a conductive column group 3, and the conductive columns in the conductive column group 3 are electrically connected to the first circuit substrate 11 according to the preset connection circuit, as shown in FIG. Figure 8 The structure shown in step 10.

[0071] According to a further embodiment of the present invention, substrate layers are respectively provided on both sides of the first circuit substrate 11 provided with the conductive pillar group 3, including: providing an isolation layer 121 on the substrate layer 12 adjacent to the first end of the conductive pillar. That is, the isolation layer 121 is pre-provided on the substrate layer 12 adjacent to the first end of the conductive pillar, and then the substrate layer 12 provided with the isolation layer 121 is provided above the first circuit substrate 11, adjacent to the first end of the conductive pillar 31. Multi-layer lamination is then performed to form the second circuit substrate 13, so that the isolation layer 121 is pre-embedded above the conductive pillar 31 in the second circuit substrate 13 to facilitate subsequent cavity opening. Because the second circuit substrate 13 formed by the multi-layer lamination process has a strong sense of integrity, it would be difficult to open the cavity 2 without the isolation layer 121. In this embodiment, the isolation layer 121 is first provided, and the second circuit substrate 13 is disconnected at the isolation layer 121, which is conducive to the subsequent opening of the cavity 2.

[0072] Furthermore, an isolation layer 121 is provided on the substrate layer 12 adjacent to the first end of the conductive pillar 31; accordingly, a cavity 2 is provided on the side of the second circuit substrate 13 at a position corresponding to the conductive pillar group 3, and the first end of the conductive pillar protrudes from the bottom of the cavity 2, specifically comprising: providing a groove 131 on the side of the second circuit substrate 13 at a position corresponding to the conductive pillar group 3 to the isolation layer 121; etching the bottom of the groove 131 to form the cavity 2, so that the first end of the conductive pillar protrudes from the bottom of the cavity 2,

[0073] Specifically, Figure 10 The structure shown is Figure 9 Schematic diagram of structural changes corresponding to the process shown; reference Figure 9 and Figure 10 The operation steps of this embodiment specifically include: S21, first cutting a substrate layer 12; S22, making an isolation layer 121 on one side surface of the substrate layer 12; S23, placing the substrate layer 12 on the top of the first circuit substrate 11 so that the isolation layer 121 is placed close to the first end of the conductive column, and then stacking and laminating the layers to form a circuit board as shown in FIG. Figure 10 The second circuit substrate 13 shown in the third step of step S24 is formed by laser drilling, electroplating, circuit production and other processes, and repeated lamination process, layer by layer until the target stacking thickness is reached, and the second circuit substrate 13 with the target stacking thickness and the circuit connection as the preset connection circuit is formed. Figure 10 The second circuit substrate 13 structure shown in the fourth step is shown in FIG. The laser drilling, electroplating, circuit production and repeated lamination processes are conventional process flows for manufacturing multi-layer circuit boards, and the specific operations are not repeated here.

[0074] Furthermore, the cavity 2 is formed on the second circuit substrate 13, specifically comprising: S31, first forming a groove 131, wherein the depth of the groove 131 on the side of the second circuit substrate 13 reaches the isolation layer 121. Because the isolation layer 121 is provided, it is easy to form the groove 131. At this time, the conductive column is not exposed in the cavity 2. Figure 10 S32, the bottom of the tank 131 can be processed by plasma etching or other processes to expose the conductive column and reach the preset cavity 2 depth to form a cavity 2, such as Figure 10 The structure of the sixth step is shown. S33, after the cavity 2 is processed, the circuit board is completed.

[0075] Furthermore, the circuit board manufacturing method further includes: providing a connection structure on the second circuit substrate 13. The connection structure can be a pressing sheet 4 or a mounting hole.

[0076] According to some embodiments of the present invention, a technical solution for implementing chip transfer using a printed circuit board (cavity PCB) with a cavity structure is provided. First, a corresponding cavity structure (cavity) is designed at the chip placement location on the PCB. That is, the entire circuit board is a cavity PCB, and the cavity structure is the individual cavities 2 thereon. Cavity 2 is used to place the target chip. Various electronic components and structural parts are soldered to the upper and lower surfaces of other locations on the cavity PCB according to design and application requirements. PCB copper pillars, or conductive pillars, similar to a bed of needles are designed within the cavity 2 structure. Electrical signal conduction between the PCB and the chip is achieved through contact between the copper pillars and the solder balls (or pads) at the bottom of the chip. A spring is attached to the cavity PCB. After the chip is assembled, the spring contacts the top of the chip and provides downward pressure, thereby ensuring good contact between the solder balls (or pads) at the bottom of the chip and the PCB copper pillars / bed of needles.

[0077] Specifically, a cavity PCB is a PCB with a cavity structure, on which a plurality of cavity cavities 2 are designed according to needs, and various electronic components and structural parts are mounted in other positions. Cavity structure: It is made on the PCB through the PCB process, and mainly plays the role of structural limitation for the chip; its dimensional processing accuracy can reach 20um, which can greatly improve the limitation accuracy. Shrapnel: It is mounted or assembled on the PCB and can rotate around the shrapnel fixing column 5; it mainly provides downward pressure to the test chip, pressing the test chip to fix it in the cavity 2 structure, ensuring that the solder balls on the chip are in close contact with the PCB copper column / needle bed to achieve good conduction; its microstructure is as follows Figure 5 PCB copper pillar / needle bed: Its microstructure is as shown. Figure 2 and Figure 4 As shown, it is manufactured using PCB technology and features a hemispherical groove on the top, which allows for close contact with the test chip solder balls, ensuring good conductivity. Spring clip fixing post 5: Welded or assembled to the PCB, it secures the spring clip. The spring clip can rotate about its central axis, allowing for structural opening and closing and test chip replacement.

[0078] This embodiment utilizes an integrated cavity PCB design. Compared to traditional solutions in which various chips are soldered to the PCB surface via solder paste to achieve chip fixation and electrical conductivity, this embodiment first designs a cavity 2 within the PCB and then embeds the chip within this cavity 2. Unlike conventional soldering solutions, the chip in this embodiment is electrically connected to the conductive copper pillars within the cavity PCB. This embodiment achieves chip transfer and conductivity through a solderless method, resulting in the following beneficial effects: By utilizing cavity technology for chip transfer, the chip can be directly assembled and applied without undergoing high-temperature soldering, effectively avoiding the heat-induced chip soldering process and thus eliminating the problem of thermal stress failure during the soldering process. This can significantly improve the durability and reliability of electronic devices such as mobile phones, reduce customer rejection rates, and enhance product reputation and brand image. Furthermore, because the chip is embedded within the cavity PCB, the sidewalls of the cavity PCB provide comprehensive protection for the chip, cutting off the transmission path of external mechanical stress and effectively preventing mechanical stress failure of the chip. At the same time, this solution does not require welding, fundamentally eliminating the problem of solder ball cracking in existing applications and greatly improving the durability and reliability of mobile phone products.

[0079] On the other hand, each existing chip upgrade and platform change will lead to the re-opening of the project mold research and development, which has a long research and development cycle and a large resource investment. When the chip pad arrangement forms a unified rule, the solution provided in this embodiment can greatly improve the versatility of PCBs and various devices. By using this solution, iterative upgrades of products can be achieved by replacing key chips such as CUP, improving product research and development efficiency, shortening the project research and development cycle, and reducing resource investment.

[0080] This embodiment is suitable for modular PCB design, for example, for mass-produced electronic products such as CPUs, storage, charging chips, and antenna chips. By replacing soldering processes, subsequent product upgrades can be achieved simply by replacing the chips. This reduces the R&D cycle for electronic products such as mobile phones and enables user-differentiated designs. The present invention also includes, but is not limited to, applications in other electronic products such as mobile phones.

[0081] This embodiment is also applicable to early chip testing, and can replace existing sockets and brackets. This refers to a chip test adapter bed-of-nails (socket) test solution, which can effectively shorten the chip test cycle and reduce the cost of proofing.

[0082] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0083] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: chip; A circuit board body, wherein a groove-shaped cavity is provided on one side surface of the circuit board body, and the cavity is used to accommodate the chip; a conductive column group is protruding from the bottom of the cavity, and the conductive column group includes a plurality of conductive columns, the conductive columns are electrically connected to the conductive layer of the circuit board body, the plurality of conductive columns support the chip, and the plurality of conductive columns are electrically connected to the pads on the chip in a one-to-one correspondence; a connecting structure, through which the circuit board body is detachably connected to the chip; A positioning groove is provided on an end surface of the conductive column away from the bottom of the cavity, and the positioning groove matches the bonding pad of the chip; The positioning groove is hemispherical.

2. The circuit board assembly according to claim 1, wherein: One end of the conductive column is inserted into the circuit board body corresponding to the bottom of the cavity and is electrically connected to the conductive layer of the circuit board body.

3. The circuit board assembly according to any one of claims 1 to 2, wherein: The connection structure includes at least one pressing piece, the pressing piece is connected to the circuit board body, and the pressing piece is arranged on the chip.

4. The circuit board assembly according to claim 3, wherein: The side of the pressing piece that contacts the chip is provided with a protruding contact.

5. The circuit board assembly according to claim 3, wherein: The pressing piece is a spring piece, one end of which is arranged on the chip, and the other end of which is rotatably connected to the circuit board body.

6. An electronic device, characterized in that: include: case; A circuit board assembly, wherein the circuit board assembly is the circuit board assembly according to any one of claims 1 to 5, and the circuit board assembly is arranged inside the shell.

7. A method for manufacturing a circuit board assembly, characterized in that: The circuit board assembly is a circuit board assembly according to any one of claims 1 to 5, and the method comprises: Producing a first circuit substrate provided with the conductive pillar group, wherein the conductive pillar group includes a plurality of conductive pillars, a first end of each conductive pillar protrudes from a first side surface of the first circuit substrate, and a second end of each conductive pillar is electrically connected to a conductive layer of the first circuit substrate; Disposing substrate layers on both sides of the first circuit substrate provided with the conductive pillar group to manufacture a second circuit substrate; A cavity is formed on the side surface of the second circuit substrate at a position corresponding to the conductive pillar group, and the first end of the conductive pillar protrudes from the bottom of the cavity to form the circuit board body; The chip is assembled in the cavity to form the circuit board assembly.

8. The method for manufacturing a circuit board assembly according to claim 7, wherein: The manufacturing of the first circuit substrate provided with the conductive pillar group specifically includes: Drilling a groove on the first side surface of the first circuit substrate, wherein the groove is connected to the conductive layer on the second side surface of the first circuit substrate; Applying circuit dry films on both sides of the first circuit substrate, exposing and developing the films, so that holes communicating with the grooves are formed in the circuit dry films on the first side surface of the first circuit substrate; The conductive pillars are electroplated in the slots and the holes to form the first circuit substrate provided with the conductive pillar group.

9. The method for manufacturing a circuit board assembly according to claim 8, wherein: The manufacturing of the first circuit substrate provided with the conductive pillar group further includes: A positioning groove is formed on the first end surface of the conductive column formed by electroplating, and the positioning groove matches the pad on the chip.

10. The method for manufacturing a circuit board assembly according to any one of claims 7 to 9, characterized in that: The manufacturing of the first circuit substrate provided with the conductive pillar group further includes: According to the preset connection circuit of the circuit board assembly, the conductive layers on both sides of the first circuit substrate are etched respectively.

11. The method for manufacturing a circuit board assembly according to any one of claims 7 to 9, wherein: The substrate layers are respectively provided on both sides of the first circuit substrate provided with the conductive pillar group, and include: An isolation layer is provided on the substrate layer adjacent to the first end of the conductive pillar.

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