Method, device and equipment for correcting assembly printed circuit board model offset and medium

Abstract

This application provides a method, apparatus, electronic device, and storage medium for correcting offsets in an assembled printed circuit board (PCB) model. The method includes: constructing an assembled PCB model based on PCB production files; determining each pad group and its target component using the assembled PCB model; determining whether the assembled PCB model has experienced an overall offset based on the positional relationship between the pad groups and the target components; and correcting the assembled PCB model according to a preset procedure if an overall offset has occurred. Thus, by determining whether an overall offset has occurred in the assembled PCB model constructed based on the PCB production files before production, and correcting any PCB models exhibiting overall offset, the normal operation of the PCB simulation and testing process is ensured, reducing unnecessary time consumption.

Description

Technical Field

[0001] This application relates to the field of printed circuit boards, and more specifically to a method, apparatus, electronic device, and storage medium for correcting offsets in assembled printed circuit board models. Background Technology

[0002] With societal progress, a wide variety of electronic products are emerging. These products not only boast novel appearances but also possess unique functions. The generation of these functions relies heavily on built-in printed circuit board assemblies (PCBAs). PCBAs consist of electronic components and circuit boards. Electronic components are assembled onto the circuit boards using equipment such as pick-and-place machines. The assembly process is quite complex. If the production documents contain errors, the finished PCBAs may require manual modification or even be scrapped. Currently, there are software programs on the market that can simulate and test the production of PCBAs in advance, checking for potential problems and risks in the production documents.

[0003] However, existing software occasionally makes mistakes when parsing simulation models. For example, when the model circuit board and components are misaligned, the component pins and pads may become misaligned, making it impossible to perform manufacturability analysis of the circuit board and affecting production schedule. Summary of the Invention

[0004] In view of this, this application provides a method, apparatus, storage medium, and electronic device for correcting the offset of an assembled printed circuit board model, which solves the technical problem that it is difficult to detect the overall offset of an assembled printed circuit board model in the prior art.

[0005] According to one aspect of this application, a method for correcting offset of an assembled printed circuit board model is provided, comprising:

[0006] Construct an assembly printed circuit board model based on printed circuit board production files;

[0007] The assembly printed circuit board model is used to determine the pad group and the target components corresponding to the pad group.

[0008] Determine whether the assembly printed circuit board model has undergone overall offset based on the positional relationship between the pad group and the target component;

[0009] If the assembled printed circuit board model experiences an overall offset, the assembled printed circuit board model will be corrected according to a preset procedure.

[0010] In one possible embodiment, determining whether the assembled printed circuit board model has undergone an overall offset based on the positional relationship between the pad group and the target component includes:

[0011] Determine the center point of the pad group and the center point of the target component.

[0012] Determine the distance between the center point of the pad group and the center point of the target component;

[0013] The overall offset of the assembled printed circuit board model is determined based on the distance to the center point.

[0014] In one possible embodiment, determining the center point of the pad group and the center point of the target component includes:

[0015] The four vertices of the pad group are determined, including the top left vertex, the top right vertex, the bottom left vertex, and the bottom right vertex;

[0016] Based on the four vertices, two intersecting lines are determined, and the intersection of the two intersecting lines is determined as the center point of the pad group; and

[0017] Determine multiple corner points of the component, and determine the center point of the component based on the multiple corner points.

[0018] In one possible embodiment, determining whether the assembled printed circuit board model has experienced an overall offset based on the center point distance includes:

[0019] If the distance to the center point is less than or equal to the preset distance, it is determined that the assembled printed circuit board model has not undergone overall offset.

[0020] If the distance to the center point is greater than the preset distance, it is determined that the assembled printed circuit board model has undergone an overall offset.

[0021] In one possible embodiment, the calibration of the assembled printed circuit board model according to a preset procedure includes:

[0022] From each of the pad groups, determine the first pad group, the first component, the second pad group, and the second component, and determine the first bottom center point of the first pad group, the center point of the first pad group, and the first component center point of the first component; determine the second bottom center point of the second pad group, the center point of the second pad group, and the second component center point of the second component.

[0023] A first straight line is generated based on the first bottom center point and the second bottom center point, and a first coordinate axis is established with the first bottom center point as the origin. The first angle between the first straight line and the x-axis of the first coordinate axis is determined.

[0024] A second straight line is generated based on the center point of the first component and the center point of the second component, and a second coordinate axis is established with the center point of the first component as the origin. The second angle between the second straight line and the x-axis of the second coordinate axis is determined.

[0025] Compare the first included angle with the second included angle;

[0026] If the first included angle and the second included angle are the same, then the correction can be completed by translating the second component;

[0027] If the first included angle and the second included angle are not the same, the second component is rotated with the center point of the first component as the origin until the first included angle and the second included angle are the same. Then the second component is translated to complete the correction.

[0028] In one possible embodiment, determining each pad group and its target component using the assembled printed circuit board model includes:

[0029] The reference designator around each pad group is identified using text recognition technology.

[0030] Confirm whether the size of the pad group matches the size of the component represented by the reference designation;

[0031] If the pad group matches the component represented by the reference designation, then the component represented by the reference designation is identified as the target component of the pad group.

[0032] In one possible embodiment, the printed circuit board (PCB) production file includes a Gerber file, a bill of materials (BOM) file, and a coordinate file. The step of constructing an assembly PCB model based on the PCB production file includes:

[0033] Based on the Gerber file, obtain the model data of the printed circuit board;

[0034] According to the bill of materials file, obtain the parameter information of the components assembled on the printed circuit board, and match and search the model data of multiple components assembled on the printed circuit board in the component model database according to the parameter information of the components assembled on the printed circuit board.

[0035] Based on the coordinate file, obtain the position information of the components assembled on the printed circuit board on the printed circuit board; and

[0036] The assembled printed circuit board model is generated based on the model data of the printed circuit board, the model data of the components assembled on the printed circuit board, and the position information of the multiple components assembled on the printed circuit board on the circuit board.

[0037] As another aspect of this application, an apparatus for correcting offset of a printed circuit board model is provided, comprising:

[0038] The model building module is used to build assembly printed circuit board models based on printed circuit board production files.

[0039] The first determining module is used to determine the pad group and the target components corresponding to the pad group based on the assembled printed circuit board model.

[0040] The second determining module is used to determine whether the assembly printed circuit board model has undergone an overall offset based on the positional relationship between the pad group and the target component.

[0041] The correction module is used to correct the assembled printed circuit board model according to a preset process if the overall offset of the assembled printed circuit board model occurs.

[0042] As a third aspect of this application, an electronic device is provided, the electronic device comprising:

[0043] Processor; and

[0044] Memory used to store processor-executable information;

[0045] The processor is used to perform the method for correcting the offset of the assembled printed circuit board model as described above.

[0046] As a fourth aspect of this application, a computer-readable storage medium is provided that stores a correction program for an offset of a printed circuit board model, the correction program for the offset of the printed circuit board model being executed by a processor to implement the steps of the method described above.

[0047] Compared to existing technologies, this application provides a method, apparatus, electronic device, and storage medium for correcting offsets in assembled printed circuit board (PCB) models. The method includes: constructing an assembled PCB model based on PCB production files; determining each pad group and the corresponding target component based on the assembled PCB model; determining whether the assembled PCB model has experienced an overall offset based on the positional relationship between the pad groups and the target components; and correcting the assembled PCB model according to a preset procedure if an overall offset has occurred. Thus, by determining whether an overall offset has occurred in the assembled PCB model constructed based on the PCB production files before production, and correcting any PCB models exhibiting overall offset, the normal operation of the PCB simulation and testing process is ensured, reducing unnecessary time consumption. Attached Figure Description

[0048] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0049] Figure 1 The diagram shown is a flowchart illustrating a method for correcting offset of an assembled printed circuit board model according to an embodiment of this application.

[0050] Figure 2 The diagram shown is a flowchart illustrating a method for correcting offset of an assembled printed circuit board model according to another embodiment of this application.

[0051] Figure 3 The diagram shown is a flowchart illustrating a method for correcting offset of an assembled printed circuit board model according to another embodiment of this application.

[0052] Figure 4 The diagram shown is a schematic diagram of the composition of a device for correcting offset of an assembled printed circuit board model according to an embodiment of this application.

[0053] Figure 5 The diagram shown is a structural schematic of an electronic device provided in an embodiment of this application.

[0054] Specific implementation methods

[0055] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, top, bottom, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of the components in a specific posture (as shown in the figures). If the specific posture changes, the directional indication will also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0056] Furthermore, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0058] Figure 1 The diagram shown is a flowchart illustrating a method for correcting offset of an assembled printed circuit board model according to an embodiment of this application. Figure 1 As shown, the method for correcting the offset of the assembled printed circuit board model includes:

[0059] Step S101: Construct an assembly printed circuit board model based on the printed circuit board production files;

[0060] Printed circuit board (PCB) production documentation generally refers to the PCB design engineering documents, including Gerber files, coordinate files, and location diagrams. PCB production documentation defines the composition, structure, and connection methods for assembling the PCB.

[0061] Specifically, the assembled printed circuit board model is constructed by selecting the components from the model library based on the bill of materials file in the printed circuit board production document.

[0062] The bill of materials (BOM) includes detailed information on the manufacturers, models, and specifications of all components required for assembling the printed circuit board (PCB). Therefore, the final PCB assembly can be determined based on the PCB production documents and the BOM during the actual production process.

[0063] In this embodiment, model data of the printed circuit board is obtained according to the Gerber file; parameter information of the components assembled on the printed circuit board is obtained according to the bill of materials file; model data of multiple components assembled on the printed circuit board are matched and searched in the component model database according to the parameter information of the components assembled on the printed circuit board; position information of the components assembled on the printed circuit board on the printed circuit board is obtained according to the coordinate file; and an assembled printed circuit board model is generated according to the model data of the printed circuit board, the model data of the components assembled on the printed circuit board, and the position information of the multiple components assembled on the printed circuit board on the circuit board. The assembled printed circuit board model is a simulation of the finished assembled printed circuit board, and various characteristics of the finished assembled printed circuit board can be obtained by simulating the assembled printed circuit board model.

[0064] Therefore, this embodiment can determine whether the PCB and components have shifted as a whole based on the assembled printed circuit board model.

[0065] Step S102: Determine the pad group and the target components corresponding to the pad group through the assembly printed circuit board model;

[0066] Generally, an assembled printed circuit board model includes multiple pad groups, each with its corresponding components. In this embodiment, the components corresponding to the pad groups are marked as target components. Therefore, before determining the location of the pad groups and their components, it is necessary to classify the pad groups to which the components belong, that is, to determine the pad groups and their corresponding components. In this embodiment, the target components of the pad groups refer to the components soldered within the pad groups.

[0067] Specifically, optical character recognition (OCR) technology is used to identify the reference designators around each pad group; it is confirmed whether the size of the pad group matches the size of the component represented by the reference designator; if the pad group matches the component represented by the reference designator, the component represented by the reference designator is identified as the target component of the pad group.

[0068] OCR (Optical Character Recognition) refers to the process by which electronic devices (such as scanners or digital cameras) examine characters printed on paper and then use character recognition methods to translate the shapes into computer text; that is, scanning text materials and then analyzing and processing image files to obtain text and layout information.

[0069] PCB component designators are typically formatted as "letter attribute + number," where the letter represents the component type (e.g., R12, where R indicates a resistor) and the number represents the component's serial number. After the OCR system identifies the printed designator on the PCB, it retrieves the component attributes (category, number of pins, package specifications, etc.) from the bill of materials. Then, it compares the parameters in the component attributes with the pad groups. For example, it determines whether the type represented by the letter in the designator corresponds to the component type; if they match, the component corresponding to that designator is identified as the target component in the pad group. Alternatively, it compares the number of pads in the pad group with the number of pins in the component attributes; if they match, the component corresponding to that designator is identified as the target component in the pad group. This process is repeated for each component, skipping any unidentifiable components. It's understandable that each pad group and component can be numbered for easy storage; for example, the pad groups and their corresponding components can be saved as (Pad Group 1: Target Component 1-1-R12, Target Component 1-2-R26).

[0070] Step S103: Determine whether the assembly printed circuit board model has undergone overall offset based on the positional relationship between the pad group and the target component;

[0071] The positions of each pad group are pre-set; once the PCB leaves the factory, the positions of each pad group are fixed. The positions of each component are also pre-designed according to needs. Therefore, in an ideal PCB assembly, the positional relationship between each pad group and its corresponding component is pre-designed, meaning the positional relationship between each pad group and its target component is fixed.

[0072] However, components are soldered on during the manufacturing process. If the pins of the component are misaligned with the pads, the component will be soldered to a non-preset position, meaning the component is in the wrong position.

[0073] In actual production, if there are errors in the printed circuit board (PCB) production files or system parsing errors, it can cause the PCB and components to shift, resulting in an overall offset of the assembled PCB. When this overall offset occurs, all components on the assembled PCB shift in the same direction, position, and angle. In other words, there is a misalignment between the target component of the pad group and the position of the pad group.

[0074] In this embodiment, the positional relationship between the pad group and the target component is used to determine whether the overall offset of the assembled printed circuit board model has occurred.

[0075] Step S104: If the assembly printed circuit board model has shifted as a whole, the assembly printed circuit board model is corrected according to the preset process.

[0076] If the PCB assembly model experiences an overall offset, it indicates a mismatch between the pad groups and the component positions, which will first affect the simulation and testing process. Continuing with production could lead to equipment malfunction or the production of faulty products. Therefore, if the PCB assembly model experiences an overall offset, it needs to be corrected to ensure accuracy and avoid unnecessary production losses.

[0077] This embodiment constructs a Printed Circuit Board Assembly (PCB Assembly) model based on the PCB production file using the above-described scheme. The PCB Assembly model is used to determine each pad group and its target components. Based on the positional relationship between the pad groups and the target components, it is determined whether the PCB Assembly model has experienced an overall offset. If an overall offset has occurred, the PCB Assembly model is corrected according to a preset procedure. Thus, by determining whether an overall offset has occurred in the PCB Assembly model constructed based on the PCB production file before production, and correcting any PCB Assembly models with overall offsets, the normal operation of the PCB Assembly simulation and testing process is ensured, and unnecessary time loss is reduced.

[0078] Figure 2 The diagram shown is a flowchart illustrating a method for correcting offset of an assembled printed circuit board model according to another embodiment of this application. Figure 2 As shown, step S103 includes:

[0079] Step S1031: Determine the center point of the pad group and the center point of the target component.

[0080] A pad group typically consists of multiple pads, each corresponding to a pin of a component. The pads are generally rectangular in shape; therefore, the intersection of the diagonals within the pad group is the center of the pad group. Specifically, four vertices of the pad group are determined, including the top-left, top-right, bottom-left, and bottom-right vertices. Based on these four vertices, two intersecting lines are determined, and the intersection of these two lines is defined as the center point of the pad group.

[0081] Multiple corner points of the component are determined, and the center point of the component is determined based on these corner points. The component can be circular or square. If it is circular, the center point is the center of the circle, and the corner points are the endpoints of line segments passing through the center. If it is square, the center point is the intersection of the diagonals, and the corner points are the four vertices of the square. If the component is irregularly shaped, its centroid can be determined as the center point.

[0082] Step S1032: Determine the distance between the center point of the pad group and the center point of the target component;

[0083] Once the center point of the pad group and the center point of the component are determined, the distance between them is measured and marked as the center point distance.

[0084] Step S1033: Determine whether the assembled printed circuit board model has undergone overall offset based on the center point distance.

[0085] Generally, the positions of components are pre-designed. Therefore, if the assembled printed circuit board model meets the requirements, the center point distance will be within the preset distance. Conversely, if the assembled printed circuit board model does not meet the requirements, that is, the position of the component is not in the specified position within the corresponding pad group, the center point distance will exceed the preset distance. Specifically, if the center point distance is less than or equal to the preset distance, it is determined that the assembled printed circuit board model has not undergone overall offset; if the center point distance is greater than the preset distance, it is determined that the assembled printed circuit board model may have undergone overall offset. The preset distance is set according to actual needs. In actual production, after determining the preset distance, a threshold for the proportion of offset components must also be set. Only when the component model deviates by more than a certain proportion will it be considered an overall offset. For example, if this threshold is set to 2%, then after determining the center point distance, the proportion of components with center points greater than the preset distance is further counted. If this proportion exceeds the threshold, it is determined that the assembled printed circuit board model has undergone overall offset.

[0086] In this embodiment, after determining the center point of the pad group and the center point of the component through the above scheme, the distance between the two center points is used to determine whether the assembly printed circuit board model has undergone overall displacement, which helps to detect the assembly printed circuit board model that may have undergone overall displacement in a timely manner.

[0087] Figure 3 The diagram shown is a flowchart illustrating a method for correcting offset of an assembled printed circuit board model according to another embodiment of this application. Figure 3 As shown, step S104 includes:

[0088] Step S1041: Determine the first pad group, the first component, the second pad group, and the second component from each of the pad groups, and determine the first bottom center point of the first pad group, the center point of the first pad group, and the first component center point of the first component; determine the second bottom center point of the second pad group, the center point of the second pad group, and the second component center point of the second component.

[0089] Before calibration, identify the relevant pad groups, components, and their corresponding center points to serve as reference points for subsequent calibration.

[0090] Step S1042: Generate a first straight line based on the first bottom center point and the second bottom center point, establish a first coordinate axis with the first bottom center point as the origin, and determine the first angle between the first straight line and the x-axis of the first coordinate axis;

[0091] The first coordinate axis is the xy coordinate axis. The first coordinate axis takes the first bottom center point of the first pad group as the origin. The first straight line passing through the first bottom center point and the second bottom center point is a straight line passing through the origin of the first coordinate axis, and the angle between the first straight line and the x-axis is marked as the first angle.

[0092] Step S1043: Generate a second straight line based on the center point of the first component and the center point of the second component, establish a second coordinate axis with the center point of the first component as the origin, and determine the second angle between the second straight line and the x-axis of the second coordinate axis;

[0093] The second coordinate axis is also an xy coordinate axis, with the center point of the first component as its origin. The second straight line passes through the origin of the second coordinate axis, and the angle between the second straight line and the x-axis of the second coordinate axis is marked as the second angle.

[0094] Step S1044: Compare the first included angle with the second included angle;

[0095] That is, comparing the degree measures of the first included angle and the second included angle.

[0096] Step S1045: If the first included angle and the second included angle are the same, then the second component can be translated to complete the correction;

[0097] If the included angles are the same, it means that the whole has shifted in one direction. Simply translate it to correct the distance between the center point of the pad group and the center point of the component to the preset range.

[0098] Step S1046: If the first included angle and the second included angle are not the same, rotate the second component with the center point of the first component as the origin until the first included angle and the second included angle are the same. Then, translate the second component to complete the correction. If the included angles are not the same, it indicates that there is an offset in multiple directions. It is worth noting that in other embodiments, translation can be performed first and then rotation. The order of translation and rotation is not limited.

[0099] This embodiment corrects the overall offset of the assembled printed circuit board model through the above-described scheme, ensuring the normal operation of the assembly printed circuit board simulation and testing work and reducing unnecessary time loss.

[0100] As another aspect of this application, an apparatus for correcting offset of a printed circuit board model is provided, comprising:

[0101] Model building module 01 is used to build an assembly printed circuit board model based on the printed circuit board production file.

[0102] The first determining module 02 is used to determine the pad group and the target components corresponding to the pad group based on the assembled printed circuit board model.

[0103] The second determining module 03 is used to determine whether the assembly printed circuit board model has undergone an overall offset based on the positional relationship between the pad group and the target component.

[0104] The correction module 04 is used to correct the assembled printed circuit board model according to a preset process if the overall offset of the assembled printed circuit board model occurs.

[0105] Below, for reference Figure 5 This describes an electronic device according to embodiments of the present application. Figure 5 The diagram shown is a structural schematic of an electronic device provided in an embodiment of this application.

[0106] like Figure 5 As shown, the electronic device 600 includes one or more processors 601 and memory 602.

[0107] The processor 601 may be a central processing unit (CPU) or other form of processing unit with data processing and / or information execution capabilities, and may control other components in the electronic device 600 to perform desired functions.

[0108] The memory 602 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program information may be stored on the computer-readable storage medium, and the processor 601 may run the program information to implement the methods for correcting offsets of the assembled printed circuit board model as described above in the various embodiments of this application, or other desired functions.

[0109] In one example, the electronic device 600 may also include an input device 603 and an output device 604, which are interconnected via a bus system and / or other forms of connection mechanism (not shown).

[0110] The input device 603 may include, for example, a keyboard, a mouse, etc.

[0111] The output device 604 can output various information to the outside. The output device 604 may include, for example, a display, a communication network, and remote output devices connected thereto.

[0112] Of course, for the sake of simplicity, Figure 5 Only some of the components of the electronic device 600 relevant to this application are shown in this illustration; components such as buses, input / output interfaces, etc., are omitted. In addition, the electronic device 600 may include any other suitable components depending on the specific application.

[0113] In addition to the methods and devices described above, embodiments of this application may also be computer program products, which include computer program information that, when run by a processor, causes the processor to perform the steps of the method for correcting offset of an assembled printed circuit board model according to various embodiments of this application as described in this specification.

[0114] The computer program product can be written in any combination of one or more programming languages ​​to perform the operations of the embodiments of this application. The programming languages ​​include object-oriented programming languages ​​such as Java and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0115] Furthermore, embodiments of this application may also be computer-readable storage media storing computer program information thereon, which, when run by a processor, causes the processor to perform steps in the method for correcting offset of an assembled printed circuit board model according to various embodiments of this application.

[0116] The computer-readable storage medium may be any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may, for example, include, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatuses, or devices, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: electrical connections having one or more wires, portable disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0117] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0118] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0119] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0120] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features of the invention herein.

[0121] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Any modifications or equivalent substitutions made within the spirit and principles of the present application shall be included within the protection scope of the present application.

Claims

1. A method for correcting offset of an assembled printed circuit board model, characterized in that, include: Construct an assembly printed circuit board model based on printed circuit board production files; Based on the assembled printed circuit board model, determine the pad group and the target components corresponding to the pad group; Determine whether the assembly printed circuit board model has undergone overall offset based on the positional relationship between the pad group and the target component; If the assembly printed circuit board model is shifted overall, the assembly printed circuit board model will be corrected according to a preset procedure. Determining whether the assembled printed circuit board model has undergone an overall offset based on the positional relationship between the pad group and the target component includes: Determine the center point of the pad group and the center point of the target component. Determine the distance between the center point of the pad group and the center point of the target component; The overall offset of the assembled printed circuit board model is determined based on the distance to the center point.

2. The method according to claim 1, characterized in that, Determining the center point of the pad group and the center point of the target component includes: The four vertices of the pad group are determined, including the top left vertex, the top right vertex, the bottom left vertex, and the bottom right vertex; Based on the four vertices, two intersecting lines are determined, and the intersection of the two intersecting lines is determined as the center point of the pad group; and Multiple corner points of the component are determined, and the center point of the component is determined based on the multiple corner points.

3. The method according to claim 1, characterized in that, The step of determining whether the assembled printed circuit board model has experienced an overall offset based on the center point distance includes: If the distance to the center point is less than or equal to the preset distance, it is determined that the assembled printed circuit board model has not undergone overall offset. If the distance to the center point is greater than the preset distance, it is determined that the assembled printed circuit board model has undergone an overall offset.

4. The method according to claim 3, characterized in that, The step of correcting the assembled printed circuit board model according to a preset process includes: From each of the pad groups, determine the first pad group, the first component, the second pad group, and the second component, and determine the first bottom center point of the first pad group, the center point of the first pad group, and the first component center point of the first component; determine the second bottom center point of the second pad group, the center point of the second pad group, and the second component center point of the second component. A first straight line is generated based on the first bottom center point and the second bottom center point, and a first coordinate axis is established with the first bottom center point as the origin. The first angle between the first straight line and the x-axis of the first coordinate axis is determined. A second straight line is generated based on the center point of the first component and the center point of the second component, and a second coordinate axis is established with the center point of the first component as the origin. The second angle between the second straight line and the x-axis of the second coordinate axis is determined. Compare the first included angle with the second included angle; If the first included angle and the second included angle are the same, then the correction can be completed by translating the second component; If the first included angle and the second included angle are not the same, the second component is rotated with the center point of the first component as the origin until the first included angle and the second included angle are the same. Then the second component is translated to complete the correction.

5. The method according to claim 1, characterized in that, The step of determining the pad group and the target component corresponding to the pad group through the assembly printed circuit board model includes: The reference designator around each pad group is identified using text recognition technology. Confirm whether the size of the pad group matches the size of the component represented by the reference designation; If the pad group matches the component represented by the reference designation, then the component represented by the reference designation is identified as the target component of the pad group.

6. The method according to claim 1, characterized in that, The printed circuit board (PCB) production documents include Gerber files, bill of materials (BOM) files, and coordinate files. The process of constructing an assembly PCB model based on the PCB production documents and BOM files includes: Based on the Gerber file, obtain the model data of the printed circuit board; According to the bill of materials file, obtain the parameter information of the components assembled on the printed circuit board, and match and search the model data of multiple components assembled on the printed circuit board in the component model database according to the parameter information of the components assembled on the printed circuit board. Based on the coordinate file, obtain the position information of the components assembled on the printed circuit board on the printed circuit board; and The assembled printed circuit board model is generated based on the model data of the printed circuit board, the model data of the components assembled on the printed circuit board, and the position information of the multiple components assembled on the printed circuit board on the circuit board.

7. An apparatus for correcting offset of a printed circuit board model, characterized in that, include: The model building module is used to build assembly printed circuit board models based on printed circuit board production files. The first determining module is used to determine the pad group and the target components corresponding to the pad group based on the assembled printed circuit board model. The second determining module is used to determine whether the assembly printed circuit board model has undergone an overall offset based on the positional relationship between the pad group and the target component. The step of determining whether the assembled printed circuit board model has undergone overall offset based on the positional relationship between the pad group and the target component includes: determining the center point of the pad group and the center point of the target component; Determine the center-point distance between the center point of the pad group and the center point of the target component; based on the center-point distance, determine whether the assembly printed circuit board model has experienced an overall offset; The correction module is used to correct the assembled printed circuit board model according to a preset process if the overall offset of the assembled printed circuit board model occurs.

8. An electronic device, characterized in that, The electronic device includes: Processor; and Memory used to store processor-executable information; The processor is used to perform the method for correcting the offset of the assembled printed circuit board model as described in any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a correction program for the offset of an assembly printed circuit board model, which is executed by a processor to implement the steps of the method as described in any one of claims 1-6.

Images