Capacitor Module

Abstract

The present invention provides a capacitor module with improved insulation. The capacitor module comprises: a housing having a bottom surface and an opening; a first capacitor group including one or more first capacitors each having a first electrode, a second electrode, and a side surface connecting the first electrode and the second electrode; a second capacitor group including one or more second capacitors each having a third electrode, a fourth electrode, and a side surface connecting the third electrode and the fourth electrode; a plate-shaped first bus bar having an electrode contact portion contacting the first electrode; a plate-shaped second bus bar having an electrode contact portion contacting the third electrode; a third bus bar having an electrode contact portion contacting the second electrode and the fourth electrode; a sealing resin filled in the housing; and an insulating member disposed between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and surrounded by the sealing resin.

Description

Technical Field

[0001] The present invention relates to a capacitor module. Background Art

[0002] There is known a capacitor module in which one or more capacitors are housed in a case and bus bars are connected to electrodes at both ends of each capacitor. The capacitor is formed by winding or laminating a dielectric film having a metal film provided on the surface.

[0003] For example, Patent Document 1 discloses a film capacitor in which a capacitor element and an electronic component are housed in a manner isolated from each other by a partition provided on the bottom surface of a casing.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2001-210548 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] The film capacitor described in Patent Document 1 still has room for improvement in terms of improving insulation properties.

[0009] Therefore, an object of the present invention is to provide a capacitor module having improved insulation properties.

[0010] Technical solutions to solve problems

[0011] A capacitor module according to one embodiment of the present invention includes:

[0012] The housing has an opening formed at a position opposite to the bottom surface;

[0013] a first capacitor group, arranged inside the housing, comprising one or more first capacitors each having a first electrode, a second electrode, and a side surface connecting the first electrode and the second electrode;

[0014] a second capacitor group, arranged inside the housing, comprising one or more second capacitors each having a third electrode, a fourth electrode, and a side surface connecting the third electrode and the fourth electrode;

[0015] a plate-shaped first bus bar disposed on the opening side relative to the first capacitor group inside the housing and having an electrode contact portion in contact with the first electrode;

[0016] a plate-shaped second bus bar disposed on the opening side relative to the second capacitor group inside the housing and having an electrode contact portion in contact with the third electrode;

[0017] a third bus bar disposed on the bottom surface side relative to the first capacitor group and the second capacitor group in the interior of the housing and having an electrode contact portion that contacts the second electrode and the fourth electrode;

[0018] A sealing resin filled in the housing; and

[0019] An insulating member is provided between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and is surrounded by the sealing resin.

[0020] Effects of the Invention

[0021] According to the present invention, it is possible to provide a capacitor module having improved insulation properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a perspective view schematically showing the capacitor module according to the first embodiment of the present invention.

[0023] Figure 2 yes Figure 1 Top view of the capacitor module.

[0024] Figure 3A It is shown Figure 1 A three-dimensional view of a first capacitor included in a first capacitor group of a capacitor module.

[0025] Figure 3B It is shown Figure 1 A three-dimensional view of a second capacitor included in a second capacitor group of the capacitor module.

[0026] Figure 4 It is shown Figure 1 A three-dimensional diagram of a first bus bar and a second bus bar included in a capacitor module.

[0027] Figure 5 It is shown Figure 1 A perspective view of a third bus bar included in a capacitor module.

[0028] Figure 6 It is shown Figure 1 A three-dimensional view of an insulating member included in a capacitor module.

[0029] Figure 7 yes Figure 2 Cross-sectional view in the AA direction.

[0030] Figure 8 Yes Figure 7 A magnified portion of the image.

[0031] Fig. 9 yes Figure 2 Cross-sectional view along the BB direction.

[0032] Fig.10 yes Figure 2 Cross-sectional view along the CC direction.

[0033] Fig.11A Yes Figure 1 An enlarged perspective view of a portion of a capacitor module.

[0034] Fig. 11B It is omitted Fig.11A A three-dimensional view of an insulating member of a capacitor module.

[0035] Fig. 12A It is a diagram showing the manufacturing process of the capacitor module according to the first embodiment.

[0036] Fig. 12B It is a diagram showing the manufacturing process of the capacitor module according to the first embodiment.

[0037] Fig. 12C It is a diagram showing the manufacturing process of the capacitor module according to the first embodiment.

[0038] Fig.12D It is a diagram showing the manufacturing process of the capacitor module according to the first embodiment.

[0039] Fig.12E It is a diagram showing the manufacturing process of the capacitor module according to the first embodiment.

[0040] Fig.12F It is a diagram showing the manufacturing process of the capacitor module according to the first embodiment.

[0041] Fig.13A This is a perspective view of a part of a capacitor module according to a modification of the first embodiment of the present invention, in an enlarged manner.

[0042] Fig. 13B It is omitted Fig.13A A three-dimensional view of an insulating member of a capacitor module.

[0043] Fig.14 This is a perspective view in which a case and a sealing resin of the capacitor module according to the second embodiment are omitted.

[0044] Fig.15 Yes Fig.14 An enlarged view of region R1 of the capacitor module.

[0045] Fig.16 It is shown Fig.14 FIG. 1 is a diagram of an insulating member of a capacitor module.

[0046] Fig.17 It is shown Fig.14 FIG. 1 is a diagram of a first bus bar and a second bus bar of a capacitor module.

[0047] Fig.18A It is a diagram showing a manufacturing process of the capacitor module according to the second embodiment.

[0048] Fig.18B It is a diagram showing a manufacturing process of the capacitor module according to the second embodiment.

[0049] Fig.18C It is a diagram showing a manufacturing process of the capacitor module according to the second embodiment.

[0050] Fig.18D It is a diagram showing a manufacturing process of the capacitor module according to the second embodiment.

[0051] Fig.18E It is a diagram showing a manufacturing process of the capacitor module according to the second embodiment.

[0052] Fig.18F It is a diagram showing a manufacturing process of the capacitor module according to the second embodiment.

[0053] Figure 18G It is a diagram showing a manufacturing process of the capacitor module according to the second embodiment.

[0054] Fig.19 This is a perspective view of a capacitor module according to a modification of the second embodiment in which a case and a sealing resin are omitted.

[0055] Fig. 20 Yes Fig.19 An enlarged view of region R2 of the capacitor module.

[0056] Fig.21 It is shown Fig.19 FIG. 1 is a diagram showing a first bus bar, a second bus bar, and an insulating member of a capacitor module. DETAILED DESCRIPTION

[0057] (Process of Completing the Invention)

[0058] A capacitor module having two or more capacitor groups with different functions is known. For example, there is a capacitor module in which each capacitor group is housed in a housing and the housing is filled with insulating resin. Each capacitor group includes one or more capacitors. Each capacitor group is insulated by the insulating resin filled in the housing. However, in the case of such a structure, there is a problem that the insulation property is reduced due to bubbles generated in the insulating resin.

[0059] Therefore, the inventors of the present invention have studied a structure for improving the insulation between capacitor groups in a capacitor module having two or more capacitor groups, and have completed the following invention.

[0060] A capacitor module according to one embodiment of the present invention includes:

[0061] The housing has an opening formed at a position opposite to the bottom surface;

[0062] a first capacitor group, arranged inside the housing, comprising one or more first capacitors each having a first electrode, a second electrode, and a side surface connecting the first electrode and the second electrode;

[0063] a second capacitor group, arranged inside the housing, including one or more second capacitors each having a third electrode, a fourth electrode arranged on the bottom surface side, and a side surface connecting the third electrode and the fourth electrode;

[0064] a plate-shaped first bus bar disposed on the opening side relative to the first capacitor group inside the housing and having an electrode contact portion in contact with the first electrode;

[0065] a plate-shaped second bus bar disposed on the opening side relative to the second capacitor group inside the housing and having an electrode contact portion in contact with the third electrode;

[0066] a third bus bar disposed on the bottom surface side relative to the first capacitor group and the second capacitor group in the interior of the housing and having an electrode contact portion that contacts the second electrode and the fourth electrode;

[0067] A sealing resin filled in the housing; and

[0068] An insulating member is provided between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and is surrounded by the sealing resin.

[0069] According to this structure, it is possible to provide a capacitor module with improved insulation properties.

[0070] Alternatively, the insulating component may be configured such that, in a direction from the opening toward the bottom surface, one end is located closer to the opening than the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar, and the other end is located closer to the bottom surface than the first electrode and the third electrode.

[0071] According to this configuration, the distance between the first capacitor group and the second capacitor group can be reduced while ensuring the insulation distance between the capacitor groups. Therefore, the capacitor module can be miniaturized while improving the insulation performance.

[0072] A recessed portion for receiving the insulating member in a direction from the opening toward the bottom surface may be formed on the inner side surface of the housing.

[0073] According to this structure, it is possible to prevent the positional deviation of the insulating member in the housing.

[0074] The third bus bar may further include an extension portion extending from the electrode contact portion of the third bus bar along a side surface of the case through the opening portion to the outside of the case, and a through hole penetrating the insulating member may be formed in the extension portion.

[0075] According to this configuration, interference between the third bus bar and the insulating member can be prevented.

[0076] The insulating member may be positioned by being received by the third bus bar at one end of the through hole on the bottom surface side.

[0077] According to this configuration, it is not necessary to provide a recessed portion in the housing, so that the manufacturing cost can be reduced.

[0078] Alternatively, the insulating member may include:

[0079] a first portion extending between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar; and

[0080] The second portion extends to intersect the first portion and extends so that a surface of the electrode contact portion of the first bus bar on the first electrode side and a surface of the electrode contact portion of the second bus bar on the third electrode side are located on the bottom surface side of the case.

[0081] According to this structure, it is possible to prevent the insulating member from floating due to the buoyancy of the sealing resin.

[0082] Alternatively, the side surface of the first capacitor and the side surface of the second capacitor may each include a pair of flat portions facing each other and a pair of bent portions connecting the pair of flat portions to each other.

[0083] The second portion of the insulating member is disposed between the adjacent bent portions of the adjacent first capacitors and between the adjacent bent portions of the adjacent second capacitors.

[0084] According to this structure, the second portion can be arranged in the vacant space between the capacitors, which is advantageous in miniaturizing the capacitor module.

[0085] The second portion of the insulating member may have a protrusion.

[0086] The protrusions are inserted into holes respectively provided in the first bus bar and the second bus bar.

[0087] According to this structure, the insulating member can be easily positioned.

[0088] The second portion of the insulating member may include a recessed portion.

[0089] The invention further includes screws inserted into the holes and the recessed portions respectively provided in the first bus bar and the second bus bar.

[0090] According to this structure, the insulating member can be easily positioned.

[0091] Alternatively, the bottom surface of the housing may be flat.

[0092] According to this structure, the filling property of the sealing resin can be improved.

[0093] Hereinafter, Embodiment 1 according to the present invention will be described with reference to the drawings. In each drawing, each element is exaggeratedly shown for ease of description.

[0094] (Implementation Method 1)

[0095] Figure 1 It is a perspective view schematically showing the capacitor module 1 according to the first embodiment of the present invention. Figure 2 yes Figure 1 A top view of the capacitor module 1 is shown. Figure 3A It is shown Figure 1 1 is a perspective view of a first capacitor 20 included in a first capacitor group 12 of a capacitor module 1 . Figure 3B It is shown Figure 1 1 is a perspective view of a second capacitor 30 included in the second capacitor group 13 of the capacitor module 1. Figure 4 It is shown Figure 1 A perspective view of a first bus bar 14 and a second bus bar 15 included in a capacitor module 1 is shown in FIG. Figure 5 It is shown Figure 1 1 is a perspective view of a third bus bar 16 included in the capacitor module 1 . Figure 6 It is shown Figure 1 1 is a perspective view of an insulating member 18 included in the capacitor module 1. Figure 7 yes Figure 2 A cross-sectional view of the capacitor module 1 taken along the AA direction. Figure 8 Yes Figure 7 A magnified portion of the image. Fig. 9 yes Figure 2 A cross-sectional view of the capacitor module 1 taken along the BB direction. Fig.10 yes Figure 2 A cross-sectional view of the capacitor module 1 along the CC direction. Fig.11A Yes Figure 1 FIG. 1 is an enlarged perspective view of a portion of the capacitor module 1 . Fig. 11B It is omitted Fig.11A 1 is a perspective view of an insulating member 18 of a capacitor module 1. In addition, the X, Y, and Z directions in the figure respectively represent the lateral direction, the height direction, and the longitudinal direction of the capacitor module 1.

[0096] [Overall structure]

[0097] like Figure 1 as well as Figure 2 As shown in FIG. 1 , the capacitor module 1 includes a housing 11, a first capacitor group 12, a second capacitor group 13, a first bus bar 14, a second bus bar 15, a third bus bar 16, a sealing resin 17, and an insulating member 18. Figure 2 In the figure, the sealing resin 17 is omitted.

[0098] The housing 11 is connected to the bottom surface 11b (see Figure 7 ) is formed at a position opposite to the opening 11a (see Figure 1 A first capacitor group 12 , a second capacitor group 13 , a first bus bar 14 , a second bus bar 15 , a third bus bar 16 , and an insulating member 18 are accommodated inside the housing 11 , and a sealing resin 17 is filled inside the housing 11 .

[0099] In capacitor module 1, first bus bar 14, second bus bar 15, and third bus bar 16 are formed to extend outward along the side surface of case 11. First bus bar 14, second bus bar 15, and third bus bar 16 have terminals 14a, 15a, and 16a for connecting to external elements and circuits, respectively.

[0100] The first capacitor group 12 is a collection of capacitors including a plurality of Figure 3A The first capacitor 20 is shown. The second capacitor group 13 is a collection of capacitors, which includes one or more Figure 3B The first capacitor group 12 and the second capacitor group 13 have different functions (for example, electrostatic capacitance), so the capacitor module 1 has two functions. Figure 2 As shown, the first capacitor group 12 includes six first capacitors 20 , and the second capacitor group 13 includes two second capacitors 30 .

[0101] The first capacitor 20 and the second capacitor 30 are respectively wound film capacitors. Figure 3A As shown in FIG. 1 , the first capacitor 20 includes a first electrode 21, a second electrode 22, and a side surface 23 connecting the first electrode 21 and the second electrode 22. Figure 3B As shown, the second capacitor 30 includes a third electrode 31 , a fourth electrode 32 , and a side surface 33 connecting the third electrode 31 and the fourth electrode 32 .

[0102] Return to Figure 1 , a first bus bar 14 and a second bus bar 15 are arranged on the opening side of the housing 11. The so-called opening side of the housing 11 refers to a side closer to the opening 11a than the bottom surface 11b inside the housing 11. The first bus bar 14 is connected to the first electrode 21 of each first capacitor 20. The second bus bar 15 is connected to the third electrode 31 of each second capacitor 30.

[0103] A plate-shaped third bus bar 16 is arranged on the bottom side of the housing 11. The bottom side of the housing 11 refers to the side closer to the bottom surface 11b than the opening 11a in the interior of the housing 11. Each of the first capacitors 20 and the second capacitor 30 is arranged on the third bus bar 16. The second electrode 22 of each of the first capacitors 20 and the fourth electrode 32 of each of the second capacitors 30 are connected to the third bus bar 16. That is, each of the first capacitors 20 is arranged so that the first electrode 21 faces the opening side and the second electrode 22 faces the bottom side. Similarly, each of the second capacitors 30 is arranged so that the third electrode faces the opening side and the fourth electrode 32 faces the bottom side.

[0104] An insulating member 18 is disposed between the first bus bar 14 and the second bus bar 15 . The insulating member 18 insulates the first electrode 21 and the first bus bar 14 of the first capacitor 20 from the third electrode 31 and the second bus bar 15 of the second capacitor 30 .

[0105] Hereinafter, each component of the capacitor module 1 will be described in detail.

[0106] <Capacitor>

[0107] The first capacitor 20 and the second capacitor 30 have the same structure, so only the first capacitor 20 will be described here. The first capacitor 20 is a wound film capacitor. The first capacitor 20 is formed by winding a dielectric film having a metal vapor-deposited film formed on the surface, and pressing the wound body of the dielectric film into a flat shape. Figure 3A As shown, the side surface 23 of the first capacitor 20 has a pair of flat portions 24 facing each other and a pair of bent portions 25 connecting the pair of flat portions 24 to each other.

[0108] As the dielectric film of the first capacitor 20, for example, a plastic film such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate can be used. In addition, as a metal vapor-deposited film formed on the surface of the plastic film, Al, Zn, etc. can be used. At the end of the wound dielectric film, for example, Zn or the like is sprayed to form the first electrode 21 and the second electrode 22.

[0109] <Bus Bar No. 1>

[0110] The first bus bar 14 is a conductive member connected to the first electrodes 21 of the first capacitors 20 of the first capacitor group 12. Figure 4 As shown, the first bus bar 14 includes a terminal portion 14 a connected to an element or circuit outside the capacitor module 1 , and an electrode contact portion 14 b that contacts each of the first electrodes 21 .

[0111] The terminal portion 14a and the electrode contact portion 14b are formed integrally by bending a metal plate. The first bus bar 14 is formed of a conductive metal such as Al, Cu, or brass. In addition, a hole 14c for connecting each first electrode 21 by solder is formed in the electrode contact portion 14b. The terminal portion 14a is formed to extend from the electrode contact portion 14b in the height direction (Y direction) and then bend in the longitudinal direction (Z direction) near the opening portion 11a of the housing 11.

[0112] <Bus Bar No. 2>

[0113] The second bus bar 15 is a conductive member connected to the third electrode 31 of each second capacitor 30 of the second capacitor group 13. Figure 4 As shown, the second bus bar 15 includes a terminal portion 15 a connected to an element or circuit outside the capacitor module 1 , and an electrode contact portion 15 b that contacts each of the third electrodes 31 .

[0114] The terminal portion 15a and the electrode contact portion 15b are formed integrally by bending a metal plate. The second bus bar 15 is formed of a conductive metal such as Al, Cu, or brass. In addition, a hole 15c for connecting each third electrode 31 by solder is formed in the electrode contact portion 15b. The terminal portion 15a is formed to extend from the electrode contact portion 15b in the height direction (Y direction) and then bend in the longitudinal direction (Z direction) near the opening portion 11a of the housing 11.

[0115] The first bus bar 14 and the second bus bar 15 are as described below. Figure 8 As shown, they are arranged with a gap d in the lateral direction (X direction) for electrical insulation.

[0116] <Bus Bar No. 3>

[0117] The third bus bar 16 is connected to the second electrode 22 of each first capacitor 20 of the first capacitor group 12 and the fourth electrode 32 of each second capacitor 30 of the second capacitor group 13. Figure 5 As shown, the third bus bar 16 has a terminal portion 16a, an electrode contact portion 16b, and an extension portion 16c. The terminal portion 16a is connected to an element or circuit outside the capacitor module 1. The electrode contact portion 16b is in contact with the second electrode 22 and the fourth electrode 32. The extension portion 16c extends outward from the electrode contact portion 16b along the side surface of the housing 11.

[0118] The terminal portion 16a, the electrode contact portion 16b, and the extension portion 16c are formed integrally by bending a sheet of metal. The third bus bar 16 is formed of a conductive metal such as Al, Cu, or brass. In addition, a hole 16d for connecting each of the second electrode 22 and the fourth electrode 32 by solder is formed in the electrode contact portion 16b. The extension portion 16c extends from the electrode contact portion 16b in the height direction (Y direction) and is bent in the longitudinal direction (Z direction) near the opening portion 11a of the housing 11.

[0119] like Figure 5 As shown in FIG. 1 , a through hole 16e is formed in the extending portion 16c of the third bus bar. The through hole 16e is used to insert the insulating member 18 toward the −Y direction.

[0120] <Insulating member>

[0121] like Figure 1 as well as Figure 2 As shown, the insulating member 18 is a member that insulates the first bus bar 14 and the first electrode 21 from the second bus bar 15 and the third electrode 31. By disposing the insulating member 18, the first bus bar 14 and the first electrode 21 from the second bus bar 15 and the third electrode 31 can be insulated more reliably.

[0122] like Figure 6 As shown in FIG. 1 , the insulating member 18 includes a plate-shaped first portion 18a and a second portion 18b extending crosswise along the first portion 18a. The insulating member 18 is formed of an electrically insulating resin such as polyphenylene sulfide (PPS resin) or polybutylene terephthalate (PBT resin). The insulating member 18 is formed by injection molding, so it is preferable to use a resin suitable for injection molding.

[0123] like Figure 1 as well as Figure 2 As shown in FIG. 1 , the first portion 18a of the insulating member 18 is disposed between the electrode contact portion 14b of the first bus bar 14 and the electrode contact portion 15b of the second bus bar 15. Figure 7 as well as Figure 8As shown, in the direction from the opening 11a toward the bottom surface 11b, that is, in the height direction (Y direction), one end 19a of the first portion 18a is located closer to the opening than the electrode contact portion 14b of the first bus bar 14 and the electrode contact portion 15b of the second bus bar 15. In addition, the other end 19b of the first portion 18a is closer to the bottom surface than the first electrode 21 and the third electrode 31.

[0124] By configuring the first portion 18a of the insulating member 18 in this manner, the distance between the first bus bar 14 and the second bus bar 15 can be reduced while ensuring the insulation distances i1 and i2 between the bus bars, compared to a case where the insulating member 18 is not configured. Figure 8 Arrows i1 and i2 indicate insulation distances i1 and i2 between the first bus bar 14 and the first electrode 21 and the second bus bar 15 and the third electrode 31 .

[0125] When the insulating member 18 is not provided, the interval d between the first bus bar 14 and the second bus bar 15 becomes the insulation distance, so the interval d must be increased, and it becomes difficult to miniaturize the capacitor module 1. By providing the insulating member 18 as in the present embodiment, the insulation distance can be ensured while reducing the interval d between the first bus bar 14 and the second bus bar 15. Therefore, the first bus bar 14 and the first electrode 21 and the second bus bar 15 and the third electrode 31 can be insulated more reliably.

[0126] The insulation distances i1 and i2 are preferably set to appropriate values ​​in consideration of the maximum applied voltage of the capacitor banks 12 and 13. The insulation distance can be changed by adjusting the height positions of the one end 19a and the other end 19b of the first portion 18a of the insulating member 18.

[0127] In addition, if Fig. 9 As shown in FIG. 1 , the second portion 18b of the insulating member 18 is located closer to the bottom surface side of the housing 11 with respect to the surface 14d on the first electrode 21 side of the electrode contact portion 14b of the first bus bar 14 and the surface 15d on the third electrode 31 side of the electrode contact portion 15b of the second bus bar 15. That is, the second portion 18b of the insulating member 18 is arranged on the lower side in the height direction of the first bus bar 14 and the second bus bar 15. By arranging the second portion 18b on the lower side of the first bus bar 14 and the second bus bar 15, it is possible to prevent the insulating member 18 from floating up due to the buoyancy of the sealing resin 17.

[0128] Return to Figure 2, the second portion 18b of the insulating member 18 is disposed between the adjacent curved portions 25 of the adjacent first capacitors 20 and between the adjacent curved portions 35 of the adjacent second capacitors 30. Since the first capacitor 20 has a shape having the curved portion 25, a space is generated between the adjacent curved portions 25 of the adjacent first capacitors 20. Similarly, in the case of the second capacitor 30, a space is generated between the adjacent curved portions 35. If the second portion 18b of the insulating member 18 is configured using this space, the second portion 18b of the insulating member 18 can be configured without increasing the size of the housing 11, and the floating of the insulating member 18 can be prevented while effectively utilizing the space.

[0129] In addition, in the present embodiment, a third portion 18c for preventing positional deviation in the horizontal direction including the lateral direction (X direction) and the longitudinal direction (Z direction) is provided in the first portion 18a of the insulating member 18. In order to form a space for arranging the third portion 18c, notches 14e and 15e are provided in the electrode contact portion 14b of the first bus bar 14 and the electrode contact portion 15b of the second bus bar 15, respectively. Fig.10 As shown, the third portion 18c is arranged to be placed on a portion of the first electrode 21 and a portion of the third electrode 31. The third portion 18c of the insulating member 18 is arranged on the upper side of the first capacitor 20 and the second capacitor 30 in the height direction and is surrounded by the notches 14e and 15e, thereby preventing the insulating member 18 from shifting in the longitudinal direction (Z direction) or the lateral direction (Z direction).

[0130] As described above, the insulating member 18 can restrict movement in the +Y direction by the second portion 18 b and restrict movement in the X direction and the Z direction by the third portion 18 c.

[0131] <Shell>

[0132] The housing 11 accommodates the components of the capacitor module 1. In the present embodiment, the housing 11 is formed with an opening 11a at a position opposite to the bottom surface 11b. In the present embodiment, the housing 11 has a substantially square opening 11a and a bottom surface 11b, and is box-shaped. The shape of the housing 11 is not limited thereto, and various shapes can be adopted according to the configuration of the capacitor group. The housing 11 is formed of, for example, a synthetic resin such as polyphenylene sulfide (PPS resin) or polybutylene terephthalate (PBT resin).

[0133] like Fig.11A as well as Fig. 11BAs shown, a protrusion 11c for positioning the insulating member 18 is formed on the housing 11. The protrusion 11c is a protrusion formed from the inner side surface of the housing 11 toward the inside, and forms a recess 11d that receives the first portion 18a of the insulating member 18 in the direction from the opening 11a toward the bottom surface 11b. The protrusion 11c restricts the movement of the insulating member 18 in the lateral direction (X direction) and the longitudinal direction (Z direction). That is, the insulating member 18 is positioned in the X direction and the Z direction by the protrusion 11c. The shape of the protrusion 11c is not limited to Fig.11A as well as Fig. 11B The shape shown may be any shape as long as it can hold the end of the insulating member 18 .

[0134] If the first portion 18a of the insulating member 18 is disposed on the protrusion 11c, the movement of the insulating member 18 in the X direction and the Z direction can be restricted. Furthermore, the movement of the insulating member 18 in the -Y direction can also be restricted. Since the insulating member 18 is filled with the sealing resin 17 around it, the insulating member 18 is positioned by the protrusion 11c of the housing 11 and the sealing resin 17.

[0135] like Fig.11A as well as Fig. 11B As shown, when the third bus bar 16 is arranged in the housing 11, the through hole 16e of the third bus bar 16 overlaps with the protrusion 11c of the housing 11. By forming the through hole 16e of the third bus bar 16 and the protrusion 11c of the housing 11 in such an arrangement, the insulating member 18 can be inserted in the direction from the opening 11a toward the bottom surface 11b.

[0136] In addition, if Figure 7 , Fig. 9 , Fig.10 As shown, the bottom surface 11b of the case 11 is flat. By making the bottom surface 11b of the case 11 flat, the sealing resin 17 is more likely to spread over the entire bottom surface 11b than when a convex portion is provided on the bottom surface 11b, so that the filling property of the sealing resin 17 can be improved.

[0137] <Sealing resin>

[0138] The sealing resin 17 is filled into the housing 11 to seal the components of the capacitor module 1. The sealing resin 17 is a thermosetting resin, such as epoxy resin. Alternatively, it may be urethane resin. As the material of the sealing resin 17, it is preferable to use a material with high fluidity and adhesion.

[0139] [Manufacturing method]

[0140] Reference Figures 12A to 12F A method for manufacturing the capacitor module 1 will be described. Figures 12A to 12FIt is a diagram showing the manufacturing process of the capacitor module 1 according to the first embodiment.

[0141] First, prepare the third bus bar 16. Figure 5 In order to insulate the third bus bar 16 from the first electrode 21 of each first capacitor 20 and the third electrode 31 of the second capacitor 30 , an insulating paper 41 is firstly attached to the extending portion 16 c of the third bus bar 16 .

[0142] Next, the first capacitor 20 and the second capacitor 30 are arranged at the electrode contact portion 16b of the third bus bar 16. Specifically, Fig. 12A As shown, each of the first capacitor 20 and the second capacitor 30 is arranged so that the second electrode 22 and the fourth electrode 32 face the electrode contact portion 16 b.

[0143] Next, the insulating member 18 is disposed. Specifically, Fig. 12B As shown in FIG. 1 , the first portion 18a of the insulating member 18 is arranged between the first capacitor group 12 and the second capacitor group 13. At this time, the second portion 18b is located between the bent portion 25 of the first capacitor 20 and between the bent portion 35 of the second capacitor 30. In addition, the third portion 18c is placed on the first capacitor 20 and the second capacitor 30. By arranging the insulating member 18 in this way, the first portion 18a of the insulating member 18 is arranged to be sandwiched between the first capacitor group 12 and the second capacitor group 13, and the lateral movement can be restricted. In addition, at this time, the end of the first portion 18a passes through the through hole 16e of the third bus bar, so that the first portion 18a and the third bus bar 16 do not interfere with each other.

[0144] exist Fig. 12B In the embodiment, the insulating member 18 is not fixed, but is configured so that the end of the insulating member 18 can be embedded in the recess 11d in the process of inserting each component into the housing 11 described later. At this time, by positioning the second portion 18b closer to the -Y direction than the first electrode 21 and the third electrode 31, the insulating member 18 is movable in the Y direction, so that it can be easily fitted into the recess 11d.

[0145] Next, the first bus bar 14 and the second bus bar 15 are arranged. Specifically, Fig. 12CAs shown, the electrode contact portion 14b of the first bus bar 14 is placed on the first electrode 21 of each first capacitor 20 of the first capacitor group 12. In addition, the electrode contact portion 15b of the second bus bar 15 is placed on the third electrode 31 of each second capacitor 30 of the second capacitor group 13. At this time, the first bus bar 14 and the second bus bar 15 are arranged so that the third portion 18c of the insulating member 18 is located in the notch portions 14e and 15e of the first bus bar 14 and the second bus bar 15, respectively.

[0146] Then, in the hole 14c of the electrode contact portion 14b of the first bus bar 14, the electrode contact portion 14b is connected to each first electrode 21 by solder (not shown). In addition, in the hole 15c of the electrode contact portion 15b of the second bus bar 15, the electrode contact portion 15b is connected to each third electrode 31 by solder (not shown). By performing welding, the first bus bar 14 and each first electrode 21, and the second bus bar 15 and each third electrode 31 can be electrically connected.

[0147] Next, the third bus bar 16 and each of the second electrode 22 and the fourth electrode 32 are connected by solder (not shown). Fig.12D As shown, welding is performed in the hole 16 d provided in the electrode contact portion 16 b of the third bus bar 16 , thereby electrically connecting the third bus bar 16 and the second electrode 22 and the fourth electrode 32 .

[0148] Then, if Fig.12E As shown, the welded first capacitor 20, second capacitor 30, first bus bar 14, second bus bar 15, third bus bar 16, and insulating member 18 are inserted into the housing 11. At this time, the end of the first portion 18a of the insulating member 18 is inserted into the recess 11d of the protrusion 11c of the housing 11 (see Fig.11A ). When the end of the first portion 18a is inserted into the protrusion 11c, the insulating member 18 is positioned in the X direction and the Z direction inside the housing 11.

[0149] After being inserted into the housing 11, as Fig.12F As shown, the sealing resin 17 is filled in the housing 11 and cured to complete the capacitor module 1. At this time, the second portion 18b of the insulating member 18 is restricted from moving in the +Y direction by the first bus bar 14 and the second bus bar 15 (see Fig. 9 ). Therefore, it is possible to prevent the insulating member 18 from floating up when the sealing resin 17 is filled. In addition, since the bottom surface 11b of the housing 11 is formed flat, the filling property of the sealing resin 17 is improved.

[0150] [Effect]

[0151] According to the capacitor module 1 according to the first embodiment, the following effects can be achieved.

[0152] The capacitor module 1 includes a housing 11, a first capacitor group 12, a second capacitor group 13, a first bus bar 14, a second bus bar 15, a third bus bar 16, a sealing resin 17, and an insulating member 18. The housing 11 is formed with an opening 11a at a position opposite to the bottom surface 11b. The first capacitor group 12 includes one or more first capacitors 20. The first capacitor 20 is arranged inside the housing 11, and has a first electrode 21, a second electrode 22, and a side surface 23 connecting the first electrode 21 and the second electrode 22. The second capacitor group 13 includes one or more second capacitors 30. The second capacitor 30 is arranged inside the housing 11, and has a third electrode 31, a fourth electrode 32, and a side surface 23 connecting the third electrode 31 and the fourth electrode 32. The first bus bar 14 is arranged on the opening 11a side relative to the first capacitor group 12 inside the housing 11, and is a plate-shaped electrode contact portion 14b that contacts the first electrode 21. The second bus bar 15 is arranged on the opening 11a side relative to the second capacitor group 13 inside the housing 11, and is in a plate shape having an electrode contact portion 15b in contact with the third electrode 31. The third bus bar 16 is arranged on the bottom surface 11b side relative to the first capacitor group 12 and the second capacitor group 13 inside the housing 11, and has an electrode contact portion 16b in contact with both the second electrode 22 and the fourth electrode 32. The sealing resin 17 is filled in the housing 11. The insulating member 18 is provided between the electrode contact portion 14b of the first bus bar 14 and the electrode contact portion 15b of the second bus bar 15, and is surrounded by the sealing resin 17.

[0153] According to such a structure, by providing the insulating member 18, the insulation of the first bus bar 14 and the first electrode 21 and the second bus bar 15 and the third electrode 31 can be improved compared with the case where the insulating member 18 is not provided and only the sealing resin 17 is provided. In the case where the insulating member 18 is not provided, although they are insulated by the sealing resin 17, there is a possibility that the insulation is poor due to bubbles generated in the sealing resin 17. By providing the insulating member 18 separately from the sealing resin 17, the first bus bar 14 and the first electrode 21 and the second bus bar 15 and the third electrode 31 can be reliably insulated, and the insulation is improved.

[0154] Furthermore, by disposing the insulating member 18, it is possible to reduce the distance d between the first bus bar 14 and the first electrode 21 and the second bus bar 15 and the third electrode 31 while ensuring long insulation distances i1 and i2. Therefore, it is possible to reduce the interval d between the first bus bar 14 and the first electrode 21 and the second bus bar 15 and the third electrode 31, which is conducive to miniaturization of the capacitor module 1.

[0155] In addition, one end 19a of the insulating member 18 is located closer to the opening of the housing 11 than the electrode contact portion 14b of the first bus bar 14 and the electrode contact portion 15b of the second bus bar 15 in the direction from the opening 11a toward the bottom surface 11b. In addition, the other end 19b of the insulating member 18 is located closer to the bottom surface of the housing 11 than the first electrode 21 and the third electrode 31. With such a structure, an appropriate insulation distance can be ensured.

[0156] The insulation distance between the first bus bar 14 and the second bus bar 15 can be changed by adjusting the positions of the ends 19a and 19b of the insulating member 18 in the height direction (Y direction). Figure 8 If the height direction position of one end 19a is located at a position greater than Figure 8 Similarly, if the height direction position of the other end 19b of the insulating member 18 is located at a position higher than Figure 8 The insulation distance i2 becomes longer as it moves downward (in the −Y direction). In this way, the lengths of the insulation distances i1 and i2 are preferably set appropriately according to the electrostatic capacitance of the capacitor module 1 and the like.

[0157] On the other hand, when the position in the height direction of one end 19a of the insulating member 18 is located below the first bus bar 14 and the second bus bar 15 (in the -Y direction), the insulation distance is the distance d between the electrode contact portion 14b and the electrode contact portion 15b. In this case, in order to ensure an appropriate insulation distance, the distance d must be increased, and miniaturization of the capacitor module 1 becomes difficult. Similarly, when the position in the height direction of the other end 19b of the insulating member 18 is located above the first electrode 21 and the third electrode 31 (in the +Y direction), the insulation distance is the distance d between the first electrode 21 and the third electrode 31. In this case, in order to ensure an appropriate insulation distance, the distance d must also be increased. By configuring the insulating member 18 as in Embodiment 1, the distance d can be reduced while ensuring insulation, which is conducive to miniaturization of the capacitor module 1.

[0158] The inner side surface of the housing 11 has a recess 11d for receiving the insulating member 18 in the direction from the opening 11a toward the bottom surface 11b, and a protrusion 11c for positioning the insulating member 18. With such a structure, the positional displacement of the insulating member 18 in the housing 11 can be prevented, and insulation can be performed more reliably.

[0159] In addition, the third bus bar 16 further includes an extension portion 16c extending from the electrode contact portion 16b of the third bus bar 16 to the outside of the housing 11 through the opening portion 11a along the side surface of the housing 11. The extension portion 16c is formed with a through hole 16e that passes through the insulating member 18. With such a structure, interference between the third bus bar 16 and the insulating member 18 can be prevented.

[0160] In addition, the insulating member 18 has a first portion 18a and a second portion 18b. The first portion 18a extends between the electrode contact portion 14b of the first bus bar 14 and the electrode contact portion 15b of the second bus bar 15. The second portion 18b extends crosswise with respect to the first portion 18a, and extends so that the surface 14d on the first electrode 21 side of the electrode contact portion 14b of the first bus bar 14 and the surface 15d on the third electrode 31 side of the electrode contact portion 15b of the second bus bar 15 are located on the bottom surface side of the housing 11. With such a structure, it is possible to prevent the insulating member 18 from floating due to the buoyancy of the sealing resin 17.

[0161] In addition, the side surface 23 of the first capacitor 20 has a pair of flat portions 24 facing each other and a pair of bent portions 25 connecting the pair of flat portions 24. The side surface 33 of the second capacitor 30 has a pair of flat portions 34 and a pair of bent portions 35 connecting the pair of flat portions 34. The second portion 18b of the insulating member 18 is arranged between the adjacent bent portions 25 of the adjacent first capacitors 20 and between the adjacent bent portions 35 of the adjacent second capacitors 30. With such a structure, the second portion 18b can be arranged in the space formed between the adjacent bent portions 25 and between the adjacent bent portions 35, which is conducive to the miniaturization of the capacitor module 1.

[0162] In addition, the bottom surface 11b of the housing 11 is flat. With such a structure, the filling property of the sealing resin 17 can be improved. When the bottom surface 11b of the housing 11 is flat, the fluidity of the resin is improved, so it is possible to prevent the resin filling process from being time-consuming and the manufacturing cost from increasing due to the flow of the resin being blocked when the housing is filled with the resin. In addition, when the bottom surface 11b of the housing 11 is flat, the manufacturing of the housing 11 becomes easy, so it can be miniaturized, which is conducive to the miniaturization of the capacitor module 1.

[0163] [Modifications]

[0164] In the first embodiment, the first capacitor group 12 includes six first capacitors 20 and the second capacitor group 13 includes two second capacitors 30, but the present invention is not limited thereto. The number of capacitors included in the first capacitor group 12 and the second capacitor group 13 may be one or more.

[0165] In the first embodiment, the second portion 18b of the insulating member 18 is described as extending toward both the first capacitor group 12 and the second capacitor group 13, but the present invention is not limited thereto. The second portion 18b only needs to extend toward either the first capacitor group 12 or the second capacitor group 13. In addition, the second portion 18b may be provided at two or more locations.

[0166] In the first embodiment, the example in which the second portion 18b and the third portion 18c are provided in the insulating member 18 is described, but the second portion 18b and the third portion 18c may not be provided. When the third portion 18c is not provided in the insulating member 18, the notches 14e and 15e of the first bus bar 14 and the second bus bar 15 may not be formed.

[0167] In the first embodiment, the insulating member 18 is positioned by the protrusion 11c of the housing 11, but the present invention is not limited to this case. Fig.13A , 13B As shown, the insulating member 18 is positioned in the through hole of the third bus bar 16 . Fig.13A This is a perspective view of a part of a capacitor module 1 a according to a modification of the first embodiment of the present invention, in an enlarged manner. Fig. 13B It is omitted Fig.13A A perspective view of the insulating member 18 of the capacitor module 1a. Figures 13A to 13B In the embodiment, the sealing resin 17 is omitted.

[0168] like Figures 13A to 13B As shown, in the capacitor module 1a, no protrusion is formed on the housing 11, and the insulating member 18 is supported and positioned by the third bus bar 16 at one end on the bottom side of the through hole 16f formed in the extension portion 16c. The through hole 16f is formed with a portion whose width decreases as it moves from the opening side toward the bottom side and a portion having a fixed width substantially the same as that of the insulating member 18. The insulating member 18 is positioned at the portion having a fixed width. Therefore, when the insulating member 18 is inserted from the opening side to the bottom side, the insulating member 18 is positioned in the lateral direction (X direction).

[0169] With such a structure, it is also possible to not form a protrusion on the housing 11, and only the shape of the third bus bar 16 can be changed, so that the insulating member 18 can be positioned with a simple structure, and the manufacturing cost can be reduced. Fig.13A , 13B In the case of such a through hole 16f, Fig. 12B In the state, the insulating member 18 has been positioned. Fig.12EThus, it is possible to prevent the insulating member 18 from being displaced relative to the bus bar or the capacitor when inserted into the housing 11. Therefore, the positioning accuracy of the insulating member 18 is improved, and the insulation performance can be improved.

[0170] (Implementation Method 2)

[0171] A capacitor module 1 b according to a second embodiment of the present invention will be described.

[0172] In Embodiment 2, the differences from Embodiment 1 are mainly described. In Embodiment 2, the same or equivalent configurations as those in Embodiment 1 are denoted by the same reference numerals and described. In addition, in Embodiment 2, descriptions overlapping with those in Embodiment 1 are omitted.

[0173] Fig.14 This is a perspective view in which the case and sealing resin of the capacitor module 1b according to the second embodiment are omitted. Fig.15 Yes Fig.14 FIG. 1 is an enlarged view of region R1 of the capacitor module 1 b. Fig.16 It is shown Fig.14 FIG. 5 is a diagram of an insulating member 58 of a capacitor module 1 b. Fig.17 It is shown Fig.14 FIG. 5 is a diagram of a first bus bar 54 and a second bus bar 55 of a capacitor module 1 b.

[0174] In the second embodiment, the difference from the first embodiment is that Fig.14 as well as Fig.15 As shown, the second portion 58b of the insulating member 58 has a protrusion 58c, and the protrusion 58c is inserted into the holes 54e and 55e respectively provided in the first bus bar 54 and the second bus bar 55 (see Fig.17 ).

[0175] like Fig.16 As shown, the insulating member 58 has two second parts 58b at both ends of the first part 58a. That is, four second parts 58b are formed on the first part 58a. In addition, a protrusion 58c is formed from each second part 58b of the insulating member 58 toward the +Y direction. The front end of the protrusion 58c is formed in a hook shape.

[0176] In addition, if Fig.17As shown in FIG. 1 , holes 54e and 55e are formed in the first bus bar 54 and the second bus bar 55, respectively. Each protrusion 58c of the second portion 58b of the insulating member 58 is inserted into the hole 54e of the first bus bar 54 or the hole 55e of the second bus bar 55, whereby the hook portion of the protrusion 58c is caught in the hole 54e or 55e and fixed. That is, the protrusion 58c and the hole 54e or 55e are respectively engaged by snap fit. In this way, the insulating member 58 is joined to the first bus bar 54 and the second bus bar 55.

[0177] In addition, in the present embodiment, the insulating member 58 is joined and positioned with the first bus bar 54 and the second bus bar 55. Therefore, no protrusion or through hole for positioning the insulating member 58 is formed in the housing 11 and the third bus bar 16. In addition, the insulating member 18 and the first bus bar 54 and the second bus bar 55 are engaged by snap fitting, so the insulating member 58 is not provided with a portion for preventing floating (the second portion 18b of the first embodiment), resulting in a simpler structure than the first embodiment.

[0178] [Manufacturing method]

[0179] Reference Figures 18A to 18F A method for manufacturing the capacitor module 1 b will be described. Figures 18A to 18F It is a diagram showing the manufacturing process of the capacitor module 1b according to the second embodiment.

[0180] First, if Fig.18A As shown, the first bus bar 54 and the second bus bar 55 are prepared. The first bus bar 54 is formed with an electrode contact portion 54b, a terminal portion 54a, a hole 54c for welding, and a hole 54e for joining with the insulating member 58. Similarly, the second bus bar 55 is formed with an electrode contact portion 55b, a terminal portion 55a, a hole 55c for welding, and a hole 55e for joining with the insulating member 58.

[0181] Then, if Fig.18B As shown, the protrusion 58c of the insulating member 58 is inserted into the hole 54e of the first bus bar 54 and the hole 55e of the second bus bar 55. The protrusion 58c of the insulating member 58 is inserted in the direction (Y direction) from the bottom surface 11b of the housing 11 toward the opening 11a. The insulating member 58 and the first bus bar 54 and the second bus bar 55 are joined by snap-fit, so that the insulating member 58 can be firmly fixed to the first bus bar 54 and the second bus bar 55. In addition, if the insulating member 18 and the first bus bar 54 and the second bus bar 55 are joined in this way, the electrode contact portion 54b of the first bus bar 54 and the electrode contact portion 15b of the second bus bar 55 can be fixed while being kept in approximately the same plane.

[0182] Then, if Fig.18CAs shown in FIG. 1 , the first capacitor 20 and the second capacitor 30 are respectively arranged at the electrode contact portion 16 b of the third bus bar 16. Fig.18D As shown, the first capacitor 20 and the second capacitor 30 are arranged in Fig.18B The first bus bar 54 and the second bus bar 55 are connected to the insulating member 58. At this time, unlike the first embodiment, the insulating member 58 may not be arranged in the through hole of the third bus bar 16, and the first bus bar 54 and the second bus bar 55 are maintained in substantially the same plane, so they can be easily arranged.

[0183] After the first bus bar 54 and the second bus bar 55 are arranged, the first bus bar 54 and the first electrode 21 of each first capacitor 20, and the second bus bar 55 and the third electrode 31 of each second capacitor 30 are connected by solder (not shown). The first bus bar 54 and each first electrode 21 are electrically connected by welding at the hole 54c provided in the electrode contact portion 54b of the first bus bar 54. Similarly, the second bus bar 55 and the third electrode 31 are also welded at the hole 55c provided in the electrode contact portion 55b of the second bus bar 55, thereby electrically connecting the second bus bar 55 and the third electrode 31.

[0184] Then, if Fig.18E As shown, the third bus bar 16 is connected to each of the second electrode 22 and the fourth electrode 32 by solder (not shown). Soldering is performed in the hole 16d provided in the electrode contact portion 16b of the third bus bar 16, thereby electrically connecting the third bus bar 16 and the second electrode 22 and the fourth electrode 32.

[0185] like Fig.18F As shown, the welded first capacitor 20, second capacitor 30, first bus bar 54, second bus bar 55, third bus bar 16, and insulating member 58 are inserted into the housing 11. At this time, no protrusion is formed on the housing 11, and the insulating member 58 and the housing 11 do not need to be aligned, so the arrangement is easy.

[0186] After being inserted into the housing 11, as Figure 18G As shown, the sealing resin 17 is filled in the housing 11, and the sealing resin 17 is cured to complete the capacitor module 1b. At this time, the protrusion 58c of the insulating member 58 is inserted into each hole 54e, 55e. Therefore, it is possible to prevent the insulating member 58 from floating due to the buoyancy of the sealing resin 17 without separately providing a floating prevention structure of the insulating member 58 (the second part 18b of the first embodiment).

[0187] [Effect]

[0188] According to the capacitor module 1b according to the second embodiment, the following effects can be achieved.

[0189] The second portion 58 b of the insulating member 58 of the capacitor module 1 b has a protrusion 58 c and is inserted into the holes 54 e and 55 e provided in the first bus bar 54 and the second bus bar 55 , respectively.

[0190] With such a structure, the insulating member 58 can be easily positioned.

[0191] Reference Figure 19 to Figure 21 , a capacitor module 1c according to a modified example of the second embodiment will be described.

[0192] Fig.19 This is a perspective view of a capacitor module 1c according to a modified example of the second embodiment, in which a case and a sealing resin are omitted. Fig. 20 Yes Fig.19 FIG. 1 is an enlarged view of region R2 of the capacitor module 1 c. Fig.21 It is shown Fig.19 FIG. 1 is a diagram showing a first bus bar 64 , a second bus bar 65 , and an insulating member 68 of a capacitor module 1 c .

[0193] In the capacitor module 1 b of the second embodiment, the insulating member 58 and the first bus bar 54 and the second bus bar 55 are joined by a snap-fit ​​structure, but in the capacitor module 1 c , they are joined by screws.

[0194] like Fig.19 as well as Fig. 20 As shown, the insulating member 68 and the first bus bar 64 and the second bus bar 65 are joined together by four screws 69 .

[0195] More specifically, if Fig.21 As shown, the second portion 68b of the insulating member 68 has a recess 68c. In addition, circular holes 64e and 65e are provided in the first bus bar 64 and the second bus bar 65, respectively. In addition, the capacitor module 1c further includes screws 69 inserted into the holes 64e and 65e and the recess 68c provided in the first bus bar 64 and the second bus bar 65, respectively.

[0196] With such a structure, the insulating member 68 and the first bus bar 64 and the second bus bar 65 can be fixed more firmly than with a snap fit. In addition, the positioning accuracy of the insulating member 68 can be improved.

[0197] Industrial Applicability

[0198] The present invention is useful for capacitors used in various electronic devices, electrical equipment, industrial equipment, vehicle devices, and the like.

[0199] Description of Reference Numerals

[0200] 1. 1a~1c: capacitor module;

[0201] 11: Shell;

[0202] 11a: opening;

[0203] 11b: bottom surface;

[0204] 11c: protuberance;

[0205] 12: The first capacitor bank;

[0206] 13: The second capacitor group;

[0207] 14, 54, 64: Bus No. 1;

[0208] 14b, 54b, 64b: electrode contact portion;

[0209] 15, 55, 65: Bus No. 2;

[0210] 15b, 55b, 65b: electrode contact portion;

[0211] 16: Bus bar 3;

[0212] 16b: electrode contact portion;

[0213] 16c: extension;

[0214] 16e, 16f: through holes;

[0215] 17: Sealing resin;

[0216] 18, 58, 68: Insulating components;

[0217] 18a, 58a, 68a: Part 1;

[0218] 18b, 58b, 68b: Part 2;

[0219] 19a: end;

[0220] 19b: end;

[0221] 20: 1st capacitor;

[0222] 21: 1st electrode;

[0223] 22: second electrode;

[0224] 23: side;

[0225] 24: flat part;

[0226] 25: bending part;

[0227] 30: 2nd capacitor;

[0228] 31: 3rd electrode;

[0229] 32: 4th electrode;

[0230] 33: side;

[0231] 34: flat part;

[0232] 35: bending part.

Claims

1. A capacitor module, comprising: The housing has an opening formed at a position opposite to the bottom surface; a first capacitor group, arranged inside the housing, comprising one or more first capacitors each having a first electrode, a second electrode, and a side surface connecting the first electrode and the second electrode; a second capacitor group, arranged inside the housing, comprising one or more second capacitors each having a third electrode, a fourth electrode, and a side surface connecting the third electrode and the fourth electrode; a plate-shaped first bus bar disposed on the opening side relative to the first capacitor group inside the housing and having an electrode contact portion in contact with the first electrode; a plate-shaped second bus bar disposed on the opening side relative to the second capacitor group inside the housing and having an electrode contact portion in contact with the third electrode; a third bus bar disposed on the bottom surface side relative to the first capacitor group and the second capacitor group in the interior of the housing and having an electrode contact portion that contacts the second electrode and the fourth electrode; A sealing resin filled in the housing; as well as an insulating member, provided between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and surrounded by the sealing resin, A recessed portion for receiving the insulating member in a direction from the opening toward the bottom surface is formed on the inner side surface of the housing.

2. The capacitor module according to claim 1, wherein: The insulating component is configured such that, in the direction from the opening toward the bottom surface, one end is located closer to the opening than the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar, and the other end is located closer to the bottom surface than the first electrode and the third electrode.

3. The capacitor module according to claim 1 or 2, wherein: The third bus bar further includes an extension portion extending from the electrode contact portion of the third bus bar along the side surface of the housing through the opening portion toward the outside of the housing, The extending portion has a through hole formed therein through which the insulating member passes.

4. The capacitor module according to claim 3, wherein: The insulating member is received and positioned by the third bus bar at one end of the through hole on the bottom surface side.

5. The capacitor module according to claim 1 or 2, wherein: The insulating member comprises: a first portion extending between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar; as well as The second portion extends to intersect the first portion and extends so that a surface of the electrode contact portion of the first bus bar on the first electrode side and a surface of the electrode contact portion of the second bus bar on the third electrode side are located on the bottom surface side of the case.

6. The capacitor module according to claim 5, wherein: The side surface of the first capacitor and the side surface of the second capacitor each have a pair of flat portions facing each other and a pair of bent portions connecting the pair of flat portions to each other. The second portion of the insulating member is disposed between the adjacent bent portions of the adjacent first capacitors and between the adjacent bent portions of the adjacent second capacitors.

7. The capacitor module according to claim 5, wherein: The second portion of the insulating member has a protrusion, The protrusions are inserted into holes provided in the first bus bar and the second bus bar, respectively.

8. The capacitor module according to claim 5, wherein: The second portion of the insulating member has a recessed portion, The capacitor module further includes screws inserted into holes provided in the first bus bar and the second bus bar, respectively, and the recessed portions.

9. The capacitor module according to claim 1 or 2, wherein: The bottom surface of the housing is flat.

Images