An array laser and a manufacturing method thereof

Abstract

The present invention provides an array laser, comprising: a base, the front side of the base having a stepped structure, the stepped structure including a first step and a second step, wherein the top surface of the first step is lower than the top surface of the second step, and the base is configured as the positive electrode of the laser; a first bar, the first bar being encapsulated on the top surface of the first step, and a first collimating lens being installed in front of the first bar; a second bar, the second bar being encapsulated on the top surface of the second step, and a second collimating lens being installed in front of the second bar, the first bar and the second bar being connected in parallel; an upper seat, the upper seat being insulated from the base, the upper seat being detachably connected to the base, and the upper seat being configured as the negative electrode of the laser. When the two bars of the laser work simultaneously, a higher-power light spot can be obtained through optical shaping, and the size of this light spot is larger than that obtained by a single existing bar. The present invention also provides a manufacturing method for the array laser.

Description

Technical Field

[0001] The present invention relates to the technical field of lasers, and particularly to an array laser and a manufacturing method thereof. Background Art

[0002] The output power of a single laser diode ranges from milliwatts to several watts. The power can be increased by combining individual emitters into a laser diode bar. Therefore, there are currently CS (Conduction Submount) laser products that encapsulate laser diode bars to increase power.

[0003] In the process of implementing the present invention, the inventors found that there are at least the following problems in the prior art: the existing CS heat-conducting lasers generally have low power and small spot sizes, and usually single-bar encapsulation. When the power continues to increase, the wavelength red shift is obvious, and their reliability becomes worse and worse, which is not conducive to long-term industrial applications. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems in the related art to some extent.

[0005] To this end, an object of the present invention is to provide an array laser with good reliability and high power and a manufacturing method thereof.

[0006] To achieve the above object, an array laser provided in the first aspect of the present invention includes:

[0007] A base, the front side of the base has a stepped structure, the stepped structure includes a first step and a second step, wherein the top surface of the first step is lower than the top surface of the second step, and the base is configured as the positive electrode of the laser;

[0008] A first bar, the first bar is encapsulated on the top surface of the first step, and a first collimating lens is installed in front of the first bar;

[0009] A second bar, the second bar is encapsulated on the top surface of the second step, a second collimating lens is installed in front of the second bar, and the first bar and the second bar are connected in parallel;

[0010] An upper seat, the upper seat is insulated from the base, the upper seat is detachably connected to the base, and the upper seat is configured as the negative electrode of the laser.

[0011] The array laser according to the present invention has two bars connected in parallel, namely a first bar and a second bar. In the case where one bar fails, the other bar can still continue to work, thereby improving the reliability of the laser. The two bars are integrated on a base, with a high degree of integration, and the volume is reduced compared to a laser with two separately arranged bars. When the two bars work simultaneously, a higher-power light spot can be obtained through optical shaping, and the size of this light spot is larger than that obtained by a single existing bar. In addition, the laser in the prior art is encapsulated with a single bar, for example, the heat conduction area is only transferred through one side of a single bar. The embodiment of the present invention adopts a two-bar encapsulation structure with front and rear stepped surfaces, and the heat conduction area is equivalent to twice that of the previous one. At the same power, the power of each of the two bars is only half of the power of a single bar in the prior art, and the heat conduction rate is faster, that is, the heat generated by the bar is more easily transferred to the bottom heat sink, and thermal accumulation will not occur, resulting in solder failure of the product, thus further improving the reliability of the laser product.

[0012] According to an embodiment of the present invention, the light spots formed after the light beams emitted by the first bar are collimated by the first collimating lens and the light spots formed after the light beams emitted by the second bar are collimated by the second collimating lens are superimposed to form a light spot.

[0013] According to an embodiment of the present invention, on the top surface of the first step, a first insulating pad is attached behind the first bar; on the top surface of the second step, a second insulating pad is attached behind the second bar, and a third insulating pad is attached behind the second insulating pad.

[0014] According to an embodiment of the present invention, a conductive plate is fixed on the side surface of the first step and / or the second step. A first negative connection piece is fixed on the first bar and the first insulating pad, and a second negative connection piece is fixed on the second bar and the second insulating pad. The two ends of the first negative connection piece and the second negative connection piece are bent downward and connected to the conductive plate.

[0015] According to an embodiment of the present invention, the conductive plate is a copper-clad laminate, the shape of the conductive plate is L-shaped, the front end of the conductive plate is located below the first insulating pad, and the rear end of the conductive plate is located below the second insulating pad.

[0016] According to an embodiment of the present invention, a third negative connection piece is arranged above the second negative connection piece and the third insulating pad. The third negative connection piece is connected to the second negative connection piece and completely covers the third insulating pad. The upper seat is installed on the third negative connection piece.

[0017] According to an embodiment of the present invention, the front side of the third negative electrode connecting piece overlaps with the rear side of the second negative electrode connecting piece to form an overlapping area.

[0018] According to an embodiment of the present invention, the bottom surface of the upper seat is disposed on the overlapping area. The upper seat, the third negative electrode connecting piece, and the third insulating pad all have matching through holes, and the base has threaded holes matching the through holes. The through holes and the threaded holes are fixed by fasteners.

[0019] According to an embodiment of the present invention, the upper seat has a protrusion on the side close to the first bar. The protrusion is used to prevent foreign objects from damaging the first bar and the second bar.

[0020] According to an embodiment of the present invention, both sides of the base have mounting platforms, and fixing holes are provided on the mounting platforms.

[0021] A method for manufacturing an array laser according to a second aspect of the present invention includes:

[0022] Obtain a base with a stepped structure, encapsulate a first bar on the top surface of the first step, and encapsulate a second bar on the top surface of the second step, where the P surfaces of the two bars are sintered on the top surfaces of the steps;

[0023] Paste a first insulating pad behind the first bar, paste a second insulating pad behind the second bar, and weld a conductive plate on each side of the stepped structure;

[0024] Sinter a first negative electrode connecting piece on the N surface of the first bar, sinter a second negative electrode connecting piece on the N surface of the second bar, bend both sides of the first negative electrode connecting piece and the second negative electrode connecting piece and weld them on the conductive plate, and place a third negative electrode connecting piece on the second insulating pad, where the front end of the third negative electrode connecting piece partially overlaps with the rear end of the second negative electrode connecting piece to form an overlapping area;

[0025] Place an upper seat on the third negative electrode connecting piece, where the front end of the upper seat presses on the overlapping area;

[0026] Collimate the light beams emitted by the first bar and the second bar using a collimating lens, and combine two independent light spots into one light spot.

[0027] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0028] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the following detailed description of the preferred embodiments. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present invention. Also, throughout the drawings, the same reference numerals are used to denote the same components. Wherein:

[0029] Figure 1 is a schematic structural diagram of an array laser proposed in an embodiment of the present invention.

[0030] Figure 2 is an exploded structural diagram of an array laser proposed in an embodiment of the present invention.

[0031] Figure 3 is a schematic diagram of the connection structure between the conductive plate and the negative connection piece of an array laser according to an embodiment of the present invention.

[0032] Figure 4 is a side view schematic diagram of an array laser proposed in an embodiment of the present invention.

[0033] Figure 5 is a top view schematic diagram of an array laser proposed in an embodiment of the present invention.

[0034] Figure 6 is a flow schematic diagram of a manufacturing method of an array laser proposed in an embodiment of the present invention.

[0035] Description of reference numerals:

[0036] 1 - base, 2 - upper seat, 3 - first collimating lens, 4 - second collimating lens, 5 - conductive plate, 7 - first bar, 8 - second bar, 9 - first insulating pad, 10 - second insulating pad, 11 - third insulating pad, 12 - third negative connection piece, 13 - first negative connection piece, 14 - second negative connection piece, 15 - fastener, 16 - through hole, 17 - threaded hole, 18 - fixing hole, 19 - protrusion, 20 - first step, 21 - second step, 22 - support plate, 23 - negative terminal hole, 24 - positive terminal hole. Detailed embodiments

[0037] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention. On the contrary, the embodiments of the present invention include all changes, modifications, and equivalents that fall within the spirit and scope of the appended claims.

[0038] Figure 1It is a schematic structural diagram of an array laser proposed in an embodiment of the present invention. The laser in the embodiment of the present invention uses a semiconductor bar laser. A bar laser, also known as a slab laser, is a type of high-power solid-state bulk laser, where the gain medium has the shape of a slab. To use semiconductor lasers, the semiconductor laser bar must be in electrical contact with the upper and lower sides of the semiconductor (the P and N junctions of the semiconductor). To achieve better cooling, the bar needs to be mounted on a heat sink. Heat is conducted between the heat sink and the bar.

[0039] Combined with Figures 1-5 As shown, a first aspect of the embodiment of the present invention provides an array laser, including a base 1, a first bar 7, a second bar 8, and an upper seat 2. Among them:

[0040] The front side of the base 1 has a stepped structure, and the stepped structure includes a first step 20 and a second step 21. Among them, the top surface of the first step 20 is lower than the top surface of the second step 21. The base 1 is configured as the positive electrode of the laser. The upper seat 2 is insulated from the base 1, and the upper seat 2 is detachably connected to the base 1. The upper seat 2 is configured as the negative electrode of the laser. Both the base 1 and the upper seat 2 are heat sinks and have heat conduction capabilities. In one embodiment, the front side surface of the first step 20 is in the same plane as the front side surface of the base 1. The light beams emitted by the first bar 7 and the second bar 8 need to pass through the plane where the front side surface of the base 1 is located.

[0041] The first bar 7 is encapsulated on the top surface of the first step 20, and a first collimating lens 3 is installed in front of the first bar 7; the second bar 8 is encapsulated on the top surface of the second step 21, and a second collimating lens 4 is installed in front of the second bar 8. The first bar 7 and the second bar 8 are connected in parallel. The positive electrodes of the first bar 7 and the second bar 8 are connected to the base 1, and their negative electrodes are connected to the upper seat 2. In one embodiment, the first bar 7 and the second bar 8 are sintered on the stepped structure.

[0042] In one embodiment, the light spot formed after the light beam emitted by the first bar 7 is collimated by the first collimating lens 3 and the light spot formed after the light beam emitted by the second bar 8 is collimated by the second collimating lens 4 are superimposed to form a light spot.

[0043] The array laser according to the present invention has two bars, namely a first bar and a second bar, which are connected in parallel. In the case where one bar fails, the other bar can still continue to work, thereby improving the reliability of the laser. The two bars are integrated on a base, with a high degree of integration, and the volume is reduced compared to a laser with two separately arranged bars. When the two bars work simultaneously, a high-power light spot can be obtained through optical shaping, and the size of this light spot is larger than that obtained by a single existing bar. In addition, the laser in the prior art is encapsulated with a single bar, for example, the heat conduction area is only transferred on one side of a single bar; the embodiment of the present invention adopts a two-bar encapsulation structure with front and rear steps, and the heat conduction area is equivalent to twice that of the previous one. At the same power, the power of each of the two bars is only half of the power of a single bar in the prior art, and the heat conduction rate is faster, that is, the heat generated by the bar is more easily transferred to the bottom heat sink, and thermal accumulation will not occur, resulting in the failure of the product solder, thus further improving the reliability of the laser product.

[0044] In some embodiments, referring to Figure 2 , on the top surface of the first step 20, the P surface of the first bar 7 is sintered downward on the first step 20, and a first insulating pad 9 is attached behind the first bar 7. On the top surface of the second step 21, the P surface of the second bar 8 is sintered downward on the second step 21, a second insulating pad 10 is attached behind the second bar 8, and a third insulating pad 11 is attached behind the second insulating pad 10. The first insulating pad 9, the second insulating pad 10, and the third insulating pad 11 form an insulating part, which is used to isolate the base 1 and the upper seat 2 with different potentials to avoid short circuits.

[0045] In some embodiments, in combination with Figure 1 , Figure 4 shown, both the first collimating lens 3 and the second collimating lens 4 are fast-axis collimating lenses. The first collimating lens 3 is attached to the front side surface of the first step 20, and the second collimating lens 4 is attached to the front side surface of the second step 21. In order to ensure the firm connection of the collimating lenses, a support plate 22 is installed under each of the first collimating lens 3 and the second collimating lens 4, which plays a supporting role for the collimating lenses. Since the collimating lenses need to shape the light beam emitted by the bar, therefore, the first collimating lens 3 and the second collimating lens 4 are close to the front cavity surface of the corresponding bar and are bonded to the support plate 22 with a specific glue.

[0046] In some embodiments, in combination with Figure 2 , Figure 3, a conductive plate 5 is fixed to the side of the first step 20 and / or the second step 21 of the laser. A first negative connection piece 13 is fixed to the first bar 7 and the first insulating pad 9, and a second negative connection piece 14 is fixed to the second bar 8 and the second insulating pad 10. In other words, the N surface of the first bar 7 is connected to the first negative connection piece 13, and the N surface of the second bar 8 is connected to the second negative connection piece 14. Both ends of the first negative connection piece 13 and the second negative connection piece 14 are bent downward and connected to the conductive plate 5. In one example, the first negative connection piece 13 and the second negative connection piece 14 are connected to the conductive plate 5 by welding. The advantage of welding is reliable connection and good integrity. In another example, the material of the conductive plate 5 is copper-clad laminate, the shape of the conductive plate 5 is L-shaped, the front end of the conductive plate 5 is located below the first insulating pad 9, and the rear end of the conductive plate 5 is located below the second insulating pad 10. In one example, the first negative connection piece 13 is sintered on the N surface of the first bar 7, and the second negative connection piece 14 is sintered on the N surface of the second bar 8. Sintering needs to be completed in a sintering furnace.

[0047] In some embodiments, in combination Figure 2 , Figure 3 , a third negative connection piece 12 is provided above the second negative connection piece 14 and the third insulating pad 11 of the laser. The third negative connection piece 12 is connected to the second negative connection piece 14 and completely covers the third insulating pad 11. The upper seat 2 is mounted on the third negative connection piece 12, so as to avoid short-circuit connection between the upper seat 2 and the base 1. In one example, the materials of the first negative connection piece 13, the second negative connection piece 14 and the third negative connection piece 12 are gold-plated copper foils. In one example, the front side of the third negative connection piece 12 overlaps with the rear side of the second negative connection piece 14 to form an overlapping area, the purpose of which is to make the third negative connection piece 12 and the second negative connection piece 14 contact fully for conduction. It should be noted that the upper and lower surfaces of the first insulating pad 9, the second insulating pad 10 and the third insulating pad 11 have adhesiveness within a certain temperature range. Therefore, they can be heated for an appropriate time, and after cooling, the components that can be adhered to their upper and lower surfaces can be firmly adhered.

[0048] In some embodiments, in combination Figure 1 , Figure 2 , Figure 4 and Figure 5 as shown, the bottom surface of the upper seat 2 is arranged on the overlapping area. The upper seat 2, the third negative connection piece 12 and the third insulating pad 11 all have matching through holes 16, and the base 1 has a threaded hole 17 matching the through hole 16. The through hole 16 and the threaded hole 17 are fixed by a fastener 15. It should be noted that when the fastener 15 connects the upper seat 2 and the base 1 together, the fastener 15 shall not electrically conduct the upper seat 2 and the base 1 after power-on. Therefore, optionally, an insulating terminal is fixed to the lower part of the fastener 15, or the fastener 15 is sleeved with an insulating sleeve.

[0049] In some embodiments, in combination with Figure 2 , Figure 4 as shown, the upper seat 2 has a protrusion 19 on the side close to the first bar 7. The protrusion 19 is used to prevent foreign objects from damaging the first bar 7 and the second bar 8. Optionally, the front side of the protrusion 19 is flush with the front side of the base 1, and the widths of the left and right sides of the protrusion 19 are not less than the widths of the bars (7, 8).

[0050] In some embodiments, in combination with Figure 2 , Figure 5 as shown, both sides of the base 1 have mounting platforms, and fixing holes 18 are provided on the mounting platforms. The laser can be fixedly installed on the constant temperature device through the fixing holes 18. The temperature of the constant temperature device is lower than the temperature of the laser, which can take away the excess heat generated by the laser product and prevent the laser product from failing due to heat accumulation. The top surface height of the mounting platform can be set according to actual needs. In one example, the top surface height of the mounting platform is lower than the top surface height of the first step 20. A positive connection hole 24 is formed on the base 1, and a negative connection hole 23 is formed on the upper seat 2.

[0051] When the laser provided in the above embodiment is powered on and working, it is connected between the positive connection hole 24 and the positive pole of the external power supply through a positive wire, and is connected between the negative connection hole 23 and the negative pole of the external power supply through a negative wire.

[0052] Based on the above purpose, in combination with Figure 2 , Figure 6 as shown, a second aspect of the embodiment of the present invention provides a method for manufacturing an array laser, and the steps are as follows:

[0053] Step S102, obtain a base 1 with a stepped structure, encapsulate the first bar 7 on the top surface of the first step 20, and encapsulate the second bar 8 on the top surface of the second step 21, wherein the P surfaces of the two bars (7, 8) are sintered on the top surfaces of the steps (20, 21).

[0054] In this embodiment, the base 1 is a heat sink and can conduct heat. The base 1 is configured as the positive pole of the laser.

[0055] Step S104, paste a first insulating pad 9 behind the first bar 7, paste a second insulating pad 10 behind the second bar 8, and weld a conductive plate 5 on each side of the stepped structure.

[0056] In this embodiment, the shape of the conductive plate 5 is L-shaped. Optionally, the material of the conductive plate is copper clad laminate.

[0057] Step S106: Sinter the first negative electrode connecting piece 13 on the N side of the first bar 7, sinter the second negative electrode connecting piece 14 on the N side of the second bar 8, bend both sides of the first negative electrode connecting piece 13 and the second negative electrode connecting piece 14 and weld them on the conductive plate 5, place the third negative electrode connecting piece 12 on the second insulating pad 10, wherein the front end of the third negative electrode connecting piece 12 partially overlaps with the rear end of the second negative electrode connecting piece 14 to form an overlapping area.

[0058] In this embodiment, the purpose of setting the overlapping area is to ensure sufficient contact and conductivity between the second negative electrode connecting piece 14 and the third negative electrode connecting piece 12.

[0059] Step S108: Place the upper seat 2 on the third negative electrode connecting piece 12, wherein the front end of the upper seat 2 presses on the overlapping area.

[0060] In this embodiment, the upper seat 2 is also a heat sink and has good heat conduction ability. The upper seat 2 is configured as the negative electrode of the laser. The upper seat 2 and the base 1 are connected into one body by fasteners, and an insulating material is sleeved on the surface part of the fasteners.

[0061] Step S110: Collimate the light beams emitted from the first bar 7 and the second bar 8 using a collimating lens, and combine two independent light spots into one light spot.

[0062] In this embodiment, optionally, a fast-axis collimating lens is used to shape the light beam, and by adjusting its position, the effect of combining two independent light spots emitted from the bar into a larger light spot is achieved.

[0063] An array laser manufactured according to the method of the embodiment of the present invention has a small volume, high integration, meets the requirements of large light spots, has a small voltage and large current, and has a higher power than conventional CS laser products.

[0064] It should be noted that in the description of the present invention, terms such as "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plural" is two or more.

[0065] In the present invention, unless otherwise clearly defined and limited, terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0066] In the present invention, unless otherwise explicitly specified or limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.

[0067] In the description of the present invention, the orientation or positional relationship indicated by terms such as "left", "right", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0068] Any process or method description in the flowchart or described in other ways herein may be understood to represent a module, segment or part of code including one or more executable instructions for implementing a specific logical function or process. The scope of the preferred embodiments of the present invention includes additional implementations, where the functions may be executed in a substantially simultaneous manner or in the reverse order according to the involved functions, rather than in the order shown or discussed. This should be understood by those skilled in the art to which the embodiments of the present invention pertain.

[0069] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0070] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as a limitation to the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An array laser, characterized in that, Comprising: A base (1), the front side of the base (1) having a stepped structure, the stepped structure including a first step (20) and a second step (21), wherein the top surface of the first step (20) is lower than the top surface of the second step (21), and the base (1) is configured as the positive electrode of the laser; A first bar (7), the first bar (7) being encapsulated on the top surface of the first step (20), and a first collimating lens (3) being installed in front of the first bar (7); A second bar (8), the second bar (8) being encapsulated on the top surface of the second step (21), and a second collimating lens (4) being installed in front of the second bar (8), the first bar (7) and the second bar (8) being connected in parallel; An upper seat (2), the upper seat (2) being insulated from the base (1), the upper seat (2) and the base (1) being detachably connected, and the upper seat (2) being configured as the negative electrode of the laser; On the top surface of the first step (20), a first insulating pad (9) is pasted behind the first bar (7); on the top surface of the second step (21), a second insulating pad (10) is pasted behind the second bar (8), and a third insulating pad (11) is pasted behind the second insulating pad (10); A conductive plate (5) is fixed to the side surface of the first step (20) and / or the second step (21), a first negative connection piece (13) is fixed to the first bar (7) and the first insulating pad (9), a second negative connection piece (14) is fixed to the second bar (8) and the second insulating pad (10), and both ends of the first negative connection piece (13) and the second negative connection piece (14) are bent downward and connected to the conductive plate (5); The conductive plate (5) is a copper-clad laminate, the shape of the conductive plate (5) is L-shaped, the front end of the conductive plate (5) is located below the first insulating pad (9), and the rear end of the conductive plate (5) is located below the second insulating pad (10); A third negative connection piece (12) is provided above the second negative connection piece (14) and the third insulating pad (11), the third negative connection piece (12) is connected to the second negative connection piece (14) and completely covers the third insulating pad (11), and the upper seat (2) is installed on the third negative connection piece (12).

2. The array laser according to claim 1, wherein The light spot formed after the light beam emitted by the first bar (7) is collimated by the first collimating lens (3) and the light spot formed after the light beam emitted by the second bar (8) is collimated by the second collimating lens (4) are superimposed to form a light spot.

3. The array laser according to claim 2, characterized in that, The front side of the third negative connection piece (12) overlaps with the rear side of the second negative connection piece (14) to form an overlapping area.

4. The array laser according to claim 3, wherein The bottom surface of the upper seat (2) is arranged on the overlapping area. The upper seat (2), the third negative connection piece (12) and the third insulating pad (11) are all provided with through holes (16) that match each other. The base (1) has threaded holes (17) that match the through holes (16). The through holes (16) and the threaded holes (17) are fixed by fasteners (15).

5. The array laser according to claim 1, wherein The upper seat (2) has a protrusion (19) on the side close to the first bar (7). The protrusion (19) is used to prevent foreign objects from damaging the first bar (7) and the second bar (8).

6. The array laser according to any one of claims 1 to 5, characterized in that, Both sides of the base (1) have mounting platforms, and fixing holes (18) are arranged on the mounting platforms.

7. A manufacturing method of an array laser, characterized in that, Comprising: Obtain a base (1) with a stepped structure. Encapsulate the first bar (7) on the top surface of the first step (20), and encapsulate the second bar (8) on the top surface of the second step (21), wherein the P surfaces of the two bars (7, 8) are sintered on the top surfaces of the steps (20, 21); Paste a first insulating pad (9) behind the first bar (7), paste a second insulating pad (10) behind the second bar (8), and weld a conductive plate (5) on each side of the stepped structure; Sinter a first negative connection piece (13) on the N surface of the first bar (7), sinter a second negative connection piece (14) on the N surface of the second bar (8), bend both sides of the first negative connection piece (13) and the second negative connection piece (14) and weld them on the conductive plate (5). Place a third negative connection piece (12) on the second insulating pad (10), wherein the front end of the third negative connection piece (12) partially overlaps with the rear end of the second negative connection piece (14) to form an overlapping area; Place the upper seat (2) on the third negative connection piece (12), wherein the front end of the upper seat (2) presses on the overlapping area; Collimate the light beams emitted by the first bar (7) and the second bar (8) by using a collimating lens, and combine two independent light spots into one light spot.

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