A motor base and a manufacturing method thereof

Abstract

The present invention relates to a motor base and a manufacturing method thereof. The motor base includes an insulating base, a metal circuit provided on the insulating base, and electronic components welded to the metal circuit. The metal circuit includes a plurality of conductive terminals. The conductive terminals include a first conductive terminal, a second conductive terminal, and a third conductive terminal located therebetween. Each of the conductive terminals includes a solder foot end for welding electronic components and a connection section extending from the solder foot end. The bridging portion of the first conductive terminal spans across the third conductive terminal from the corresponding connection section, so that the second overlapping portion of the second conductive terminal overlaps and is fixedly connected with the first overlapping portion, avoiding the inability to form due to excessive bending times of a single conductive terminal, improving the forming yield of the conductive terminal, and saving the wiring space of the conductive terminal.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and particularly to a motor base for an electronic device field and a manufacturing method thereof. Background Art

[0002] Existing motors and their motor bases generally include components such as an insulating base, a metal circuit injection-molded in the insulating base, electronic components welded to the metal circuit, a coil formed by winding or assembled by mounting, and a magnetic structure that interacts with the coil. The metal circuit includes a plurality of conductive terminals. Usually, one end of the conductive terminal serves as a solder foot end to connect the electronic components, and the other end of the conductive terminal serves as a pin end to extend out of the motor base to connect with external components. If there are many electronic components, the number of required conductive terminals is correspondingly large, and it is impossible to arrange many conductive terminals in a limited space.

[0003] To overcome the above problems, different electronic components can be connected to the same conductive terminal and extended out of the motor base through the same pin end to connect with external components, that is, two spaced conductive terminals need to be connected so that different electronic components are connected to the same conductive terminal. However, since the electronic components need to be arranged at different positions according to functional requirements and are relatively scattered, in order to be able to connect different electronic components at different positions at the same time, the conductive terminal needs to be bent many times to connect different electronic components. The conductive terminal not only has a long path, but also too many bends of the conductive terminal will cause it to be unable to be formed, or even if it can be formed, it is impossible to avoid being easily bent and broken during the manufacturing process, resulting in a decrease in the manufacturing yield of the product.

[0004] Therefore, it is indeed necessary to provide a new motor base and its manufacturing method to overcome the above defects. Summary of the Invention

[0005] The purpose of the present invention is to provide a motor base and its manufacturing method, which can avoid the situation that the conductive terminal cannot be formed due to excessive bending times and save the wiring space of the conductive terminal.

[0006] The object of the present invention is achieved by the following technical solution 1: A motor base includes an insulating base, a metal circuit provided on the insulating base, and electronic components soldered to the metal circuit. The metal circuit includes a plurality of conductive terminals. The conductive terminals include a first conductive terminal, a second conductive terminal, and a third conductive terminal located between the first conductive terminal and the second conductive terminal. Each conductive terminal includes a solder foot end for soldering the electronic component and a connection section extending from the solder foot end. The first conductive terminal includes a bridging portion and a first overlapping portion extending from the bridging portion. The second conductive terminal includes a second overlapping portion extending from the corresponding connection section. The bridging portion of the first conductive terminal spans across the third conductive terminal from the corresponding connection section, so that the first overlapping portion and the second overlapping portion overlap and are fixedly connected. The insulating base is injection-molded and at least covers and fixes the outside of the first conductive terminal and the second conductive terminal.

[0007] Further, the electronic components include at least two different electronic components. The solder foot ends of the first conductive terminal and the second conductive terminal are respectively soldered to two different electronic components. Only one of the first conductive terminal and the second conductive terminal is provided with a pin end extending out of the insulating base from the corresponding connection section to be electrically connected to an external circuit, so that the first conductive terminal and the second conductive terminal share the same pin end.

[0008] Further, the insulating base includes a plurality of plastic blocks injection-molded once to cover the metal circuit. The solder foot end, the first overlapping portion, and the second overlapping portion are exposed on the same surface of the corresponding plastic block. The insulating base further includes a plastic body injection-molded twice to cover the metal circuit and the plurality of plastic blocks. The plurality of plastic blocks are vertically arranged and located in different vertical planes. Different electronic components are positioned on different plastic blocks and are exposed on the corresponding plastic blocks.

[0009] Further, the connection section of the second conductive terminal extends from the corresponding solder foot end and continuously spans at least three planes. The connection section spans from the vertical plane where the corresponding solder foot end is located to the horizontal plane where the bottom surface of the plastic body is located, and then spans to the vertical plane where the solder foot end of the first conductive terminal is located.

[0010] Further, the position where the second overlapping portion overlaps with the first overlapping portion is defined as an overlapping area. The second conductive terminal and the bridging portion are fixedly connected by soldering, and at least one of the first overlapping portion and the second overlapping portion is provided with an opening for accommodating solder in the overlapping area.

[0011] Further, the first conductive terminal and the second conductive terminal are surface gold-plated in the overlapping area to form a gold-plated area, and the gold-plated area covers the upper surface of the first conductive terminal corresponding to the overlapping area, the lower surface opposite to the upper surface, the inner wall of the opening, and the upper wall of the second conductive terminal relatively close to the lower surface of the first conductive terminal.

[0012] Further, the first overlapping portion defines an opening in the overlapping area, and the opening is defined as a holding through hole. The holding through hole has an open end away from the second conductive terminal and a abutting end close to the second conductive terminal. The size of the open end is smaller than that of the abutting end, and solder is accommodated in the holding through hole.

[0013] Further, the second overlapping portion protrudes a convex bump into the holding through hole from the upper wall, and the solder is accommodated in the holding through hole and concentrated on the convex bump.

[0014] Further, the first overlapping portion defines an opening in the overlapping area, and the opening of the first overlapping portion is defined as a holding through hole. The holding through hole has an open end away from the second conductive terminal and a abutting end close to the second conductive terminal. The second overlapping portion defines an opening in the overlapping area, and the opening of the second overlapping portion is defined as a receiving hole. The receiving hole of the second overlapping portion communicates with the holding through hole in the overlapping area, and the solder is accommodated in the holding through hole and the receiving hole.

[0015] Further, the size of the open end is larger than that of the abutting end, and the size of the receiving hole is larger than that of the abutting end.

[0016] Further, the size of the open end is larger than that of the abutting end. The holding through hole and the receiving hole are arranged in a staggered manner and communicate with each other. The size of the receiving hole on the side close to the first overlapping portion is smaller than the size of the receiving hole on the side away from the first overlapping portion, and the solder is accommodated in the holding through hole and the receiving hole.

[0017] Further, the lower surface and the upper wall of the first conductive terminal and the second conductive terminal in the overlapping area are both provided with wavy concavo-convex structures, and the extending directions of the concavo-convex structures on the lower surface and the upper wall are different, and the solder is accommodated in the concavo-convex structures between the opening and the lower surface and the upper wall.

[0018] Furthermore, the area of the first overlapping portion is smaller than that of the second overlapping portion. The first overlapping portion has an annular structure, and the annular structure is provided with a hollow interior to form the opening. The opening of the annular structure is defined as a holding through-hole, the inner wall is defined as the first inner wall for setting the holding through-hole, and the outer wall of the annular structure is set as an outer wall surface. The solder is received in the opening along at least the second overlapping portion.

[0019] Furthermore, the second overlapping portion is provided with the opening, which is defined as a receiving hole. The first overlapping portion is pressed into the receiving hole of the second overlapping portion within the overlapping area, and the first overlapping portion is fixedly welded to the second overlapping portion.

[0020] Furthermore, the position where the second overlapping portion overlaps with the first overlapping portion is defined as an overlapping area. The first overlapping portion and the second overlapping portion are riveted and fixed within the overlapping area. The first overlapping portion is convexly provided with a protruding portion downward, and the second overlapping portion is provided with a receiving hole for receiving the protruding portion within the overlapping area.

[0021] Furthermore, the position where the second overlapping portion overlaps with the first overlapping portion is defined as an overlapping area. The first overlapping portion is arranged in parallel and overlapped with the second overlapping portion within the overlapping area, and the first overlapping portion and the second overlapping portion are fixedly connected by resistance welding or laser welding or riveting.

[0022] Furthermore, the position where the second overlapping portion overlaps with the first overlapping portion is defined as an overlapping area. The first overlapping portion wraps the second overlapping portion within the overlapping area, and the first overlapping portion is in contact connection with the second overlapping portion.

[0023] Furthermore, the bridging portion is integrally bent and extended from the connecting section of the first conductive terminal; or the bridging portion is separately arranged from the connecting section. The connecting section of the first conductive terminal is further provided with a third overlapping portion, and the bridging portion is further provided with a fourth overlapping portion. The third overlapping portion and the fourth overlapping portion overlap and are fixedly connected.

[0024] Furthermore, the thickness of the bridging portion is smaller than the thicknesses of the connecting section of the first conductive terminal and the second conductive terminal.

[0025] Furthermore, at least on the side surface facing the third conductive terminal of the portion of the bridging portion that does not overlap with the first conductive terminal and the second conductive terminal, an insulating coating is provided so that the bridging portion directly abuts against the third conductive terminal.

[0026] Further, a plastic block is injection-molded outside the metal circuit, and the portions of the bridging portion overlapping and lapping with the first conductive terminal and the second conductive terminal are exposed to the plastic block, while the portions of the bridging portion not overlapping and lapping with the first conductive terminal and the second conductive terminal are covered by the plastic block.

[0027] The object of the present invention is achieved by the following technical solution II: A manufacturing method of a motor base, comprising the following steps:

[0028] In the first step, a metal circuit having a plurality of conductive terminals is provided. The conductive terminals include a first conductive terminal, a second conductive terminal, and a third conductive terminal located between the first conductive terminal and the second conductive terminal. Each conductive terminal includes a solder foot end and a connection segment extending from the solder foot end. The first conductive terminal includes a bridging portion connected to the connection segment and a first overlapping portion extending from the bridging portion. The second conductive terminal includes a second overlapping portion extending from the corresponding connection segment. The bridging portion spans across the third conductive terminal from the corresponding connection segment, so that the first overlapping portion and the second overlapping portion overlap and lap.

[0029] In the second step, the region where the second overlapping portion and the first overlapping portion overlap and lap is defined as the overlapping and lapping region, and the first overlapping portion and the second overlapping portion are fixedly connected in the overlapping and lapping region.

[0030] In the third step, an electronic component is positioned at the corresponding solder foot end and welded.

[0031] In the fourth step, an insulating base is injection-molded on the metal circuit.

[0032] Further, before the second step, a thimble jig is provided to abut and position the overlapping and lapping region of the first conductive terminal and the second conductive terminal, and a plastic block is injection-molded on the metal circuit at one time, and the solder foot end, the first overlapping portion, and the second overlapping portion are exposed on the same surface of the corresponding plastic block.

[0033] Further, the fixed connection is made by soldering. Before the second step, the first overlapping portion and the second overlapping portion are first tinned in the overlapping and lapping region, and then passed through a reflow oven for soldering to complete the fixed connection.

[0034] Further, at least one of the first overlapping portion and the second overlapping portion is provided with an opening for accommodating solder in the overlapping and lapping region.

[0035] Further, the bridging portion extends integrally and bent from the connecting section of the first conductive terminal; alternatively, the bridging portion is separately provided from the connecting section, the connecting section of the first conductive terminal is further provided with a third overlapping portion, and the bridging portion is further provided with a fourth overlapping portion. In the second step, the first overlapping portion and the fourth overlapping portion are respectively overlapped and fixedly connected with the second overlapping portion and the third overlapping portion correspondingly.

[0036] Further, the first overlapping portion and the second overlapping portion are overlapped in parallel, and the fixed connection is made by laser welding to laser-weld the first overlapping portion and the second overlapping portion.

[0037] Further, the fixed connection is made by riveting connection. The first overlapping portion is provided with a protruding portion protruding downward in the overlapping region, and the second overlapping portion is provided with a receiving hole for receiving the protruding portion in the overlapping region.

[0038] Further, the fixed connection is made by riveting connection. The first overlapping portion wraps the second overlapping portion in the overlapping region and is fixedly connected to the second overlapping portion.

[0039] In the present invention, the bridging portion of the first conductive terminal in the motor base crosses the third conductive terminal from the corresponding connecting section, so that the first overlapping portion and the second overlapping portion of the second conductive terminal are overlapped and fixedly connected, avoiding the inability to be formed due to excessive bending times of a single conductive terminal, improving the forming yield rate of the conductive terminal, and saving the wiring space of the conductive terminal. Description of the Drawings

[0040] Figure 1 It is a three-dimensional schematic diagram of the motor base in the first embodiment of the present invention.

[0041] Figure 2 is Figure 1 A three-dimensional schematic diagram seen from another direction.

[0042] Figure 3 It is a three-dimensional exploded view of the motor base in the first embodiment of the present invention.

[0043] Figure 4 is Figure 3 A further three-dimensional exploded view of

[0044] Figure 5 is Figure 3 A schematic diagram of an angle of the first retaining wall of the plastic block in

[0045] Figure 6 is Figure 3 Another angle schematic diagram of the first retaining wall of the plastic block in

[0046] Figure 7 is Figure 4 a partial enlarged view in

[0047] Figure 8 is Figure 4 a top view of the metal circuit in

[0048] Figure 9 is Figure 8 a cross-sectional view along line A-A in

[0049] Figure 10 is Figure 9 a partial enlarged view in

[0050] Figure 11 an enlarged view of a cross-sectional view of the overlapping and lapping area in the second embodiment of the present invention.

[0051] Figure 12 an enlarged view of a cross-sectional view of the overlapping and lapping area in the third embodiment of the present invention.

[0052] Figure 13 an enlarged view of a cross-sectional view of the overlapping and lapping area in the fourth embodiment of the present invention.

[0053] Figure 14 an enlarged view of a cross-sectional view of the overlapping and lapping area in the fifth embodiment of the present invention.

[0054] Figure 15 a perspective schematic view of the overlapping and lapping area in the sixth embodiment of the present invention.

[0055] Figure 16 an enlarged view of a cross-sectional view of the overlapping and lapping area in the sixth embodiment of the present invention.

[0056] Figure 17 a perspective schematic view of the overlapping and lapping area in the seventh embodiment of the present invention.

[0057] Figure 18 an enlarged view of a cross-sectional view of the overlapping and lapping area in the seventh embodiment of the present invention.

[0058] Figure 19 a top view of the motor base in the eighth embodiment of the present invention.

[0059] Figure 20 is Figure 19 a cross-sectional view along line B-B in

[0060] Figure 21 is Figure 20 a partial enlarged view in

[0061] Figure 22Schematic perspective view of the overlapping joint region in the ninth embodiment of the present invention.

[0062] Figure 23 Enlarged view of a cross-sectional view of the overlapping joint region in the ninth embodiment of the present invention.

[0063] Figure 24 Schematic perspective view of the overlapping joint region in the tenth embodiment of the present invention.

[0064] Figure 25 Enlarged view of a cross-sectional view of the overlapping joint region in the tenth embodiment of the present invention.

[0065] Figure 26 Schematic perspective view of the metal circuit in the eleventh embodiment of the present invention.

[0066] Figure 27 For Figure 26 Enlarged view of the overlapping joint region in

[0067] Description of main reference numerals

[0068] Please refer to the following reference numerals of the attached drawings: motor base 100; metal circuit 1; first conductive terminals 11, 11A, 11B, 11C, 11D, 11F, 11G, 11H, 11I, 11J, 11K; first overlapping portions 110, 110A, 110B, 110C, 110D, 110F, 110G, 110H, 110I, 110J, 110K; holding through holes 111, 111B, 111C, 111D, 111H, 1110I; open ends 1111, 1111B, 1111C, 1111D, 1111H; abutting ends 1112, 1112B, 1112C, 1112D, 1112H; protruding portions 111F; bent portions 111G; first inner walls 1113, 1113B, 1113C, 1113D, 1113H, 1111I; outer wall surfaces 1112I; concavo-convex structures 13H; annular structures 111I; upper surfaces 112, 112B, 112C, 112D, 112H, 112I; lower surfaces 113, 113B, 113C, 113D, 113H, 113I; main body portions 111J; first bent segments 112J; second bent segments 113J; second conductive terminals 12, 12A, 12B, 12C, 12D, 12F, 12G, 12H, 12I, 12J, 12K; second overlapping portions 120, 120A, 120B, 120C, 120D, 120F, 120G, 120H, 120I, 120J, 120K; upper walls 121, 123B, 121C, 121D, 121H, 121I; receiving holes 122D, 122F, 122G; second inner walls 122B, 1221D; convex hulls 1211C; grooves 121B; third conductive terminals 13, 13K; clamping blocks 1101G; relief notches 1221G; pin ends 14; solder feet ends 15; spanning segments 16; connecting segments 17, 17K; third overlapping portions 171K; bridging portions 18, 18K; fourth overlapping portions 181K; electronic components 2; insulating bases 3; plastic bodies 31; plastic blocks 4; first retaining walls 41; bearing grooves 410; recessed grooves 4101; stepped portions 411; second retaining walls 42; third retaining walls 43; coils 5; solder 6; overlapping overlapping regions R; concave holes S; first planes P1; second planes P2; third planes P3; fourth planes P4. Detailed implementation manners

[0069] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0070] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the term "connection" should be understood in a broad sense. For those of ordinary skill in the art, the specific meaning of the above terms in the present invention can be understood according to specific circumstances.

[0071] In the present invention, the conductive terminals in the motor base 100 include two first conductive terminals, a second conductive terminal which are spaced apart from each other, and a third conductive terminal located between the first conductive terminal and the second conductive terminal. After the first conductive terminal is bent across the line and straddles the third conductive terminal and then overlaps and lapped with the second conductive terminal, a plastic block 4 is injection-molded once to achieve mutual positioning, and is directly fixedly connected by welding or riveting to facilitate the electrical connection between the first conductive terminal and the second conductive terminal. By adopting the technical solution of the present invention, the motor base 100 does not need to connect different electronic components 2 only by repeatedly bending a single conductive terminal across the line, but two conductive terminals with relatively short conductive paths are provided for connection processing, thereby realizing local fixed connection and electrical connection. In this embodiment, since the first conductive terminal and the second conductive terminal are fixed to each other and electrically connected, the two can share the pin end 14. Therefore, on the one hand, the technical solution of the present application can avoid the inability to form due to excessive bending of a single conductive terminal, and can also connect different electronic components 2 to the same pin end, thereby saving the wiring space of the conductive terminal. The overlapping and lapping of the two conductive terminals result in a large contact area between the two, and the electrical connection performance after connection processing is relatively good, and at least one of the first conductive terminal and the second conductive terminal is bent in three directions, increasing the strength of the motor base 100.

[0072] Please refer to Figures 1 to 27, the motor base 100 includes an insulating base 3, a metal circuit 1 disposed on the insulating base 3, and electronic components 2 soldered to the metal circuit 1. The insulating base 3 includes a plurality of plastic blocks 4 formed by one-shot injection molding and covering the metal circuit 1, and a plastic body 31 formed by two-shot injection molding and covering at least the metal circuit 1 and the plurality of plastic blocks 4. The electronic components 2 are positioned on the plastic blocks 4 and exposed from the plastic blocks 4. In the present invention, the electronic components 2 refer to electronic components such as IC chips, Hall elements, capacitors, or inductors. Each of the conductive terminals includes a solder foot end 15 for soldering the electronic component 2 and a connection section connecting the solder foot end 15. In an embodiment of the present application, the metal circuit 1 includes at least two conductive terminals that connect different electronic components 2 and are spaced apart from each other, and at least one third conductive terminal located between the two conductive terminals. One of the two conductive terminals has a pin end 14 that connects the connection section and is exposed outside the insulating base 3, and the two conductive terminals share the pin end 14. In the following Embodiments 1 to 11 of the present application, the two conductive terminals are respectively defined as a first conductive terminal and a second conductive terminal. Specifically, in all the following embodiments, the first conductive terminal is respectively defined as the first conductive terminal 11, 11A, 11B, 11C, 11D, 11F, 11G, 11H, 11I, 11J, 11K. The second conductive terminal is respectively defined as the second conductive terminal 12, 12A, 12B, 12C, 12D, 12F, 12G, 12H, 12I, 12J, 12K in all the following embodiments. In the following embodiments, the third conductive terminal is respectively defined as the third conductive terminal 13, 13K. Only one of the first conductive terminal and the second conductive terminal is provided with a pin end 14 extending from the corresponding connection section out of the insulating base 3 for electrical connection with an external circuit, so that the first conductive terminal and the second conductive terminal share the same pin end 14. The external circuit is a control circuit outside the motor base 100 for transmitting an electrical signal to the metal circuit 1 in the motor base 100. In order to enable the first conductive terminal and the second conductive terminal to share the pin end 14, both the first conductive terminal and the second conductive terminal include a lapping portion extending from the connection section. The lapping portion of the first conductive terminal is defined as the first lapping portion, and the lapping portion of the second conductive terminal is defined as the second lapping portion.

[0073] Since there is a third conductive terminal between the two conductive terminals, in order to facilitate the cross-over connection between the two relative to the third conductive terminal, at least one of the two conductive terminals needs to be provided with a cross-over structure that crosses the third conductive terminal to achieve overlapping connection with the other conductive terminal. In an embodiment of the present application, the first conductive terminal also includes a bridging portion connecting the first overlapping portion and the corresponding connecting section, and the bridging portion is a cross-over structure that is provided on the first conductive terminal and crosses the third conductive terminal. The bridging portion spans the third conductive terminal from the corresponding connecting section so that the first overlapping portion overlaps and is fixedly connected with the second overlapping portion. The position where the second overlapping portion overlaps and overlaps with the first overlapping portion is defined as an overlapping overlapping region R. The insulating base 3 is injection molded and coated and fixed outside the two conductive terminals, and the overlapping overlapping region R is exposed to the plastic block 4 of the insulating base 3.

[0074] In the following embodiments 1 to 11 of the present application, the first overlapping portions belonging to different first conductive terminals 11, 11A, 11B, 11C, 11D, 11F, 11G, 11H, 11I, 11J, 11K are respectively first overlapping portions 110, 110A, 110B, 110C, 110D, 110F, 110G, 110H, 110I, 110J, 110K, and the first overlapping portions belonging to different second conductive terminals 12, 12A, 12B, 12 The second overlapping parts of C, 12D, 12F, 12G, 12H, 12I, 12J, and 12K are respectively second overlapping parts 120, 120A, 120B, 120C, 120D / 120F, 120G / 120H, 120I, 120J, and 120K, the connecting sections belonging to different first conductive terminals 11, 11K are respectively connecting sections 17, 17K, and the bridging parts belonging to different first conductive terminals 11, 11K are respectively 18, 18K.

[0075] The plastic body 31 is secondarily injection-molded on the metal circuit 1 and the plastic blocks 4. The plurality of plastic blocks 4 are located in different planes perpendicular to the plastic body 31. The electronic components 2 are respectively positioned and exposed on the plastic blocks 4 in different planes. Further, the solder feet ends 15 of the conductive terminals are all welded to the electronic components 2 and also need to be positioned and exposed on the plastic blocks 4 in different planes. The solder feet ends 15, the first overlapping portion, and the second overlapping portion are all exposed on the same surface of the corresponding plastic block 4. In an embodiment of the present application, the plastic block 4 includes a first retaining wall 41 perpendicular to the bottom surface of the plastic body 31, a second retaining wall 42 perpendicular to the bottom surface of the plastic body 31 and adjacent to the first retaining wall 41, and a third retaining wall 43 perpendicular to the bottom surface of the plastic body 31 and parallel to the first retaining wall 41 and connecting the second retaining wall 42. Wherein the plane where the first retaining wall 41 is located is the first plane P1, the plane where the second retaining wall 42 is located is the second plane P2, the plane where the third retaining wall 43 is located is the third plane P3, and the plane where the bottom surface of the plastic body 31 is located is the fourth plane P4. Coils 5 are provided on the first retaining wall 41, the second retaining wall 42, and the third retaining wall 43. Two of the coils 5 are installed on the first retaining wall 41 and the second retaining wall 42 to prevent jitter during imaging, and one of the coils 5 is installed on the third retaining wall 43 for driving zoom. One of the electronic components 2 is welded to the solder feet end 15 of the first conductive terminal held by the first retaining wall 41, and the other electronic component 2 is welded to the solder feet end 15 of the second conductive terminal held by the second retaining wall 42. Of course, in other embodiments, there is also an electronic component 2 welded to the solder feet end 15 of the second conductive terminal held by the third retaining wall 43, as long as the second overlapping portion of the second conductive terminal overlaps and overlaps with the first overlapping portion in three directions. In the present invention, the connecting section 17 of the second conductive terminal extends from the corresponding solder feet end 15 and continuously crosses at least three planes. The connecting section 17 crosses from the vertical plane where the solder feet end of the second conductive terminal is located to the horizontal plane where the bottom surface of the plastic body is located, and then crosses to the vertical plane where the solder feet end of the first conductive terminal is located. Specifically, the connecting section 17 of the second conductive terminal crosses from the second plane P2 to the fourth plane P4 and then to the first plane P1, thereby completing the overlapping and overlapping of the two conductive terminals. Since the second overlapping portion needs to cross to the fourth plane P4, the second conductive terminal is further provided with a spanning section 16 held on the insulating base 3, which can strengthen the strength of the motor base 100 while achieving the crossing.

[0076] In an embodiment of the present application, the materials of the first conductive terminal and the second conductive terminal can be the same or different. Specifically, in this embodiment, the material of the first conductive terminal is copper, and the material of the second conductive terminal is stainless steel. In an embodiment of the present application, the thicknesses of the first conductive terminal and the second conductive terminal can also be different. For example, the thickness of the first conductive terminal is designed to be greater than that of the second conductive terminal. In this way, the overall thickness after their overlapping and lapping can be reduced, and thus the injection molding thickness of the subsequent insulating base 3 can be reduced. In an embodiment of the present application, the thickness of the first conductive terminal made of copper is 0.08 mm, and the thickness of the second conductive terminal made of stainless steel is 0.05 mm.

[0077] In this embodiment, after the first conductive terminal and the second conductive terminal are overlapped and lapped, a positioning jig is used to relatively position the overlapping and lapping area R of the two, and the plastic block 4 is injection-molded at one time to realize the relative positioning of the two conductive terminals. In this embodiment, a thimble jig can be specifically selected as the positioning jig. After the plastic block 4 is injection-molded, the thimble jig is removed. The plastic block 4 forms a concave hole S corresponding to the overlapping and lapping area R, and the overlapping and lapping area R of the first lapping portion of the first conductive terminal and the second lapping portion of the second conductive terminal is exposed on the opposite side of the concave hole S of the plastic block 4. The plastic block 4 is provided with a carrier groove 410 for carrying the electronic component 2 on the opposite side of the concave hole S. The carrier groove 410 is further recessed with a recessed groove 4101. The top surface of the solder leg end 15 of the conductive terminal is exposed on the bottom surface of the recessed groove 4101, so as to facilitate the electrical welding of the electronic component 2 arranged in the carrier groove 410 and the solder leg end 15. Since the thickness of the overlapping and lapping area R is greater than that of the solder leg end 15 after the first and second lapping portions overlap and lap each other, the top surface of the lapping portion is higher than the top surface of the solder leg end 15. In order to facilitate the plastic block 4 to cover a part of the overlapping and lapping area R and expose their electrical connection area, the carrier groove 410 is provided with a step portion 411 protruding from the bottom wall of the carrier groove 410. The step portion 411 corresponds to the overlapping and lapping area R to cover the first and second lapping portions.

[0078] In the present application, although the two conductive terminals have been overlapped together by means of cross-wire bending, in order to further strengthen the fixing and electrical connection performance, the overlapping and lapping area R of the two conductive terminals needs to be further electrically connected. The following will introduce Embodiments 1 to 11 of the present application in detail to illustrate how to further electrically connect the two conductive terminals.

[0079] Specifically, please refer to Figures 1 to 27After the two conductive terminals are bent and overlapped across the line, subsequent fixing connection and electrical connection processing are performed on the two conductive terminals. Specific fixing connection and electrical connection processing methods can include soldering with solder paste and passing through a reflow oven (also known as SMT soldering), resistance welding, laser welding, etc. In addition to the soldering processing methods exemplified above, some mechanical fixing processing methods such as riveting and stamping can also be used to achieve mutual fixation and electrical connection between the two.

[0080] In the first to sixth embodiments of the present application, surface mount soldering technology (SMT soldering technology) is specifically selected to achieve the fixing connection and electrical connection between the two conductive terminals. Specifically, solder paste 6 is dotted at the overlapping area R of the two conductive terminals. In order to facilitate the full contact and coverage of the solder paste 6 with the welding area, at least one of the first overlapping portion or the second overlapping portion is provided with an opening for accommodating the solder paste 6 in the overlapping area R. After the plastic block 4 is injection-molded, the first conductive terminal and the second conductive terminal are dotted with solder paste 6 at the overlapping area R and then subjected to reflow soldering treatment, and then the plastic body 31 is injection-molded again. It can be understood that during the welding process, in order to avoid problems such as poor solder wetting or poor contact after welding, the surface of the overlapping area R of the first conductive terminal and the second conductive terminal is gold-plated to form a gold-plated area (not labeled), and then tin is plated outside the gold-plated area through the welding process to achieve welding fixation. The gold-plated area can isolate the copper metal of the conductive terminal from the air and prevent the conductive terminal from oxidizing. The gold-plated area specifically covers the upper surface and the lower surface opposite to the upper surface within the overlapping area R of the first conductive terminal, the inner wall of the opening, and the upper wall of the second conductive terminal relatively close to the lower surface of the first conductive terminal. Since the wettability and ductility of gold are better than those of other metals, when the solder paste 6 is dotted in the opening, the solder paste 6 is more likely to be adsorbed in the gold-plated area. In the embodiments of the present application, there are a total of 6 specific implementation manners for realizing the welding fixation between the two conductive terminals by using surface mount soldering technology (SMT soldering technology), and they are the first to sixth embodiments respectively.

[0081] In one of the first embodiments of the present application, please refer to Figures 1 to 10, the first overlapping portion 110 of the first conductive terminal 11 is provided with the opening in the overlapping overlapping area R, and the opening is defined as the holding through hole 111. The inner wall is defined as the first inner wall 1113 provided for the holding through hole 111. The holding through hole 111 is provided with an open end 1111 away from the second conductive terminal 12, a close end 1112 close to the second conductive terminal 12 and the first inner wall 1113. And the first overlapping portion 110 is provided with the upper surface 112 and the lower surface 113 in the overlapping overlapping area R. And the second overlapping portion 120 of the second conductive terminal 12 has an upper wall 121 disposed opposite to the lower surface 113. The gold plating area is provided on the upper surface 112, the lower surface 113, the first inner wall 1113 and the upper wall 121, so that the solder 6 is more likely to fully contact the holding through hole 111, realizing stable welding between the overlapping portions of the two conductive terminals. At the same time, in the first embodiment of the present application, the size of the open end 1111 of the holding through hole 111 is designed to be smaller than the size of the close end 1112. During the process of applying the solder 6, the solder 6 is less likely to fall from the holding through hole 111, thereby ensuring the welding effect between the two conductive terminals and strengthening the electrical connection performance.

[0082] In one of the second embodiments of the present application, please refer to Figure 11, the first overlapping portion 110B of the first conductive terminal 11B and the second overlapping portion 120B of the second conductive terminal 12B are both provided with the openings in the overlapping region R. The opening of the first overlapping portion 110B is defined as the holding through hole 111B, and the inner wall is defined as the first inner wall 1113B provided for the holding through hole 111B. The holding through hole 111B is provided with an open end 1111B away from the second conductive terminal 12B, a contacting end 1112B close to the second conductive terminal 12B, and the first inner wall 1113B. In the second embodiment, the size of the open end 1111B is designed to be larger than the size of the contacting end 1112B. The opening of the second overlapping portion 120B is defined as the receiving hole 121B communicating with the holding through hole 111B. The inner wall of the second overlapping portion 120B is defined as the second inner wall 122B provided for the receiving hole 121B. The size of the receiving hole 121B is larger than the size of the contacting end 1112B. With such a setting, the solder 6 can more easily enter into the holding through hole 111B and be received in the holding through hole 111B and the receiving hole 121B. The gold-plated area is arranged on the upper surface 112B, the lower surface 113B, the first inner wall 1113B, the second inner wall 122B, and the upper wall 123B of the first conductive terminal 11B, so that the solder 6 can more easily and fully contact the holding through hole 111B and the receiving hole 121B, and better realize the welding between the overlapping portions of the two conductive terminals. Since the second overlapping portion 120B of the second conductive terminal 12B is recessed downward to form the receiving hole 121B, the solder 6 can enter into the receiving hole 121B after passing through the holding through hole 111B. On the basis of the capacity of the holding through hole 111B, the ability to receive the solder 6 can be further improved. And since the size of the receiving hole 121B is larger than the size of the contacting end 1112B, the solder 6 can be clamped in the receiving hole 121B and is not easy to fall off.

[0083] In one of the third embodiments of the present application, please refer to Figure 10, an opening is provided in the first overlapping portion 110C of the first conductive terminal 11C in the overlapping region R. The opening is defined as a holding through hole 111C. The inner wall is defined as a first inner wall 1113C provided for the holding through hole 111C. The holding through hole 111C is provided with an open end 1111C away from the second conductive terminal 12C and a contact end 1112C close to the second conductive terminal 12C. In the third embodiment, the size of the open end 1111C is designed to be smaller than the size of the contact end 1112C. A convex bump 1211C protrudes from the second overlapping portion 120C of the second conductive terminal 12C into the holding through hole 111C from the upper wall 121C. The solder 6 is accommodated in the holding through hole 111C and is concentrated in the peripheral area of the convex bump 1211C. By providing the convex bump 1211C on the second overlapping portion 120C, on the one hand, the first conductive terminal 11C and the second conductive terminal 12C can be initially positioned, optimizing the positioning effect in the manufacturing process and strengthening the welding and fixing effect. On the other hand, during soldering, the contact area between the solder 6 and the first overlapping portion 110C and the second overlapping portion 120C can be further increased, making the contact area larger and the contact more sufficient. The gold plating area is provided on the upper surface 112C, the lower surface 113C, the first inner wall 1113C of the first conductive terminal 11C, the peripheral area of the convex bump 1211C, and the upper wall 121C, so that the solder 6 can more easily and fully contact the holding through hole 111C to achieve welding between the overlapping portions of the two conductive terminals.

[0084] In a fourth embodiment of the present application, please refer to Figure 13, the first overlapping portion 110D of the first conductive terminal 11D and the second overlapping portion 120D of the second conductive terminal 12D are both provided with the openings in the overlapping region R. The opening of the first overlapping portion 110D is defined as the holding through-hole 111D. The inner wall is defined as the first inner wall 1113D provided for the holding through-hole 111D. The holding through-hole 111D is provided with an open end 1111D away from the second conductive terminal 12D, a contacting end 1112D close to the second conductive terminal 12D, and the first inner wall 1113D. In the fourth embodiment, the size of the open end 1111D is designed to be larger than the size of the contacting end 1112D to facilitate the entry of the solder 6. The opening of the second overlapping portion 120D is defined as the receiving hole 122D which is arranged in a staggered manner with the holding through-hole 111D and is partially communicated. The inner wall of the receiving hole 122D is defined as the second inner wall 1221D. The size of the side of the receiving hole 122D close to the first overlapping portion 110D is smaller than the size of the side of the receiving hole 122D away from the first overlapping portion 110D, that is, the receiving hole 122D is a tapered structure in the direction close to the first overlapping portion 110D. The solder 6 enters through the holding through-hole 111D and is received in the holding through-hole 111D and the receiving hole 122D. By controlling the amount of the solder 6, even if there is a connected portion between the first conductive terminal 11D and the second conductive terminal 12D, the solder 6 will not drip out from the receiving hole 122D. The gold-plated area is arranged on the upper surface 112D, the lower surface 113D, the first inner wall 1113D, the second inner wall 1221D, and the upper wall 121D of the first conductive terminal 11D, so that the solder 6 can more easily and fully contact the holding through-hole 111D and the receiving hole 122D, and realize the welding between the overlapping portions of the two conductive terminals.

[0085] In one fifth embodiment of the present application, please refer to Figure 14, an opening is provided in the first overlapping portion 110H of the first conductive terminal 11H in the overlapping overlapping region R, and the opening is defined as a holding through hole 111H, and the inner wall is defined as a first inner wall 1113H provided in the holding through hole 111H. The holding through hole 111H is provided with an open end 1111H away from the second conductive terminal 12H, a abutting end 1112H close to the second conductive terminal 12H, and the first inner wall 1113H. In the fifth embodiment, the size of the open end 1111H is designed to be larger than the size of the abutting end 1112H to facilitate the entry of the solder 6. The first conductive terminal 11H and the second conductive terminal 12H are both provided with a wavy uneven structure 13H on the lower surface 113H and the upper wall 121H in the overlapping overlapping region R, and the extending directions of the uneven structures 13H on the lower surface 113H and the upper wall 121H are different. The solder 6 enters from the holding through hole 111H and is accommodated in the uneven structure 13H between the holding through hole 111H, the lower surface 113H, and the upper wall 121H. Since the lower surface 113H and the upper wall 121H are both provided with wavy uneven structures 13H that are misaligned and embedded with each other, a point-to-point contact form is formed, making the positioning contact between the two more reliable. Moreover, a certain gap is formed between the wavy uneven structures 13H, which is more convenient for the solder 6 to fully climb during spot welding. The gold plating area is provided on the upper surface 112H, the lower surface 113H, the first inner wall 1113H, and the upper wall 121H of the first conductive terminal 11H, so that the solder 6 can more easily and fully contact the holding through hole 111H, realizing the welding between the overlapping portions of the two conductive terminals.

[0086] In one of the sixth embodiments of the present application, please refer to Figures 15 to 16, the area of the first overlapping portion 110I of the first conductive terminal 11I is smaller than the area of the second overlapping portion 120I of the second conductive terminal 12I. The first overlapping portion 110I has an annular structure 111I, and the annular structure 111I is hollow to form the opening. The opening of the annular structure 111I is defined as the holding through hole 1110I, and the inner wall is defined as the first inner wall 1111I where the holding through hole 1110I is provided. The outer wall of the annular structure 111I is defined as the outer wall surface 1112I. The second overlapping portion 120I is disposed on one side of the annular structure 111I. The solder 6 wraps the annular structure 111I along the second overlapping portion 120I and is fully received in the outer wall surface 1112I of the annular structure 111I and the holding through hole 1110I, thus strengthening the full contact between the solder 6 and the two conductive terminals and ensuring the welding effect. The gold plating area is provided on the upper surface 112I, the lower surface 113I, the outer wall surface 1112I, the first inner wall 1111I and the upper wall 121I of the first conductive terminal 11I located in the overlapping overlapping area R, so that the solder 6 can more easily fully contact the annular structure 111I and the upper wall 121I of the second overlapping portion 120I, realizing the welding between the first overlapping portion 110I and the second overlapping portion 120I of the two conductive terminals.

[0087] In the first to sixth embodiments of the present invention, the welding method between the electronic component 2 and the solder pad end 15 is surface mount welding (SMT - Surface Mounting Technology, also known as surface mounting technology). Since a single SMT welding process is required for welding the metal circuit 1 and the electronic component 2, in the first to sixth embodiments of the present application, solder 6 can be first applied and pre - positioned in the openings of the first conductive terminal and / or the second conductive terminal, and then the mutual welding and fixing can be completed together through the welding process of the electronic component 2, thus eliminating the need for an additional independent welding process for the first conductive terminal and the second conductive terminal.

[0088] In other embodiments of the present application, in order to achieve the fixed connection and electrical connection processing of the overlapping portions of the two conductive terminals in the overlapping overlapping area R, in addition to the above - mentioned method of applying solder 6 and then performing SMT welding, the mechanical fixing between the two can also be achieved through mechanical fixing and electrical conduction can be simultaneously achieved. In one of the seventh embodiments of the present application, please refer to Figures 17 to 18, the first overlapping portion 110F of the first conductive terminal 11F and the second overlapping portion 120F of the second conductive terminal 12F are fixedly connected by mechanical riveting in the overlapping region R, more specifically, by cold heading riveting. By cold heading, the first overlapping portion 110F is provided with a convex portion 111F protruding downward, and the second overlapping portion 120F is provided with a receiving hole 122F for receiving the convex portion 111F in the overlapping region R. In the seventh embodiment of the present application, compared with the welding fixing method of the first to sixth embodiments of the present application, the riveting fixing method requires an additional riveting fixing process. However, the riveting fixing method can achieve both the fixed connection and the electrical connection between the two at one time. In other embodiments, the mechanical fixing method can specifically also adopt mechanical fixing methods such as crimping fixing and snap fixing to facilitate the electrical connection while achieving the fixed connection.

[0089] In other embodiments of the present application, in order to achieve the fixing and electrical connection processing of the overlapping portions of the two conductive terminals in the overlapping region R, in addition to the above-mentioned fixing means of applying solder paste 6 and then performing SMT welding fixing, other welding processes can also be used to achieve this. In one of the eighth embodiments of the present application, please refer to Figures 19 to 21 , the first overlapping portion 110A of the first conductive terminal 11A and the second overlapping portion 120A of the second conductive terminal 12A are arranged in parallel and overlapping in the overlapping region R. Specifically, the overlapping region R of the two conductive terminals is further fixedly connected to each other by resistance welding or laser welding. Since resistance welding cannot utilize the soldering process through the reflow oven, the welding fixing methods of resistance welding or laser welding require additional specific welding processes compared with the welding fixing methods of the first to sixth embodiments of the present application. However, for some ordinary motor bases, such as those without other electronic components to be welded, since there is no need to pre-position the solder pads for welding with electronic components in advance, it is possible to first perform welding and then complete the injection molding of the plastic base 3 at one time. Compared with the need to separately inject the plastic block 4 and the plastic body 31, the injection molding process can be saved.

[0090] In other embodiments of the present application, in order to achieve the fixing and electrical connection processing of the overlapping portions of the two conductive terminals in the overlapping region R, it can also be achieved by stamping welding process. In the ninth embodiment of the present application, please refer to Figures 22 to 23, the first overlapping portion 110G of the first conductive terminal 11G is pressed into the receiving hole 122G formed in the second overlapping portion 120G of the second conductive terminal 12G within the overlapping region R, and then further welded and fixed. During the pressing process, the bridging portion of the first conductive terminal 11G has a bent portion 111G, such that the first overlapping portion 110G and the second overlapping portion 120G are located in the same plane. When the first overlapping portion 110G located within the receiving hole 122G of the second overlapping portion 120G is pressed, the first overlapping portion 110G deforms and expands and directly comes into tensioned and fixed contact with the second overlapping portion 120G, and then is welded and fixed, thereby strengthening their direct contact and enhancing the electrical connection performance. A pair of oppositely disposed engaging blocks 1101G are provided on the first overlapping portion 110G, and a pair of relief notches 1221G are provided on the second overlapping portion 120G opposite to the engaging blocks 1101G. The engaging blocks 1101G and the relief notches 1221G cooperate with each other, such that after the first overlapping portion 110G deforms and expands, it is difficult for the first overlapping portion 110G to disengage from the receiving hole 122G formed in the second overlapping portion 120G. In other embodiments, after the second overlapping portion 120G is bent and overlapped across the line on the first overlapping portion 110G, in order to further strengthen the electrical connection performance therebetween, other corresponding changes may be made to the structures of the first overlapping portion 110G and the second overlapping portion 120G to enhance the connection and fixation therebetween.

[0091] In a tenth embodiment of the present application, please refer to Figures 24 to 25 , the first overlapping portion 110J of the first conductive terminal 11J wraps the second overlapping portion 120J of the second conductive terminal 12J by cold heading riveting within the overlapping region R, such that while achieving mechanical fixation between the two, electrical connection is also achieved. Specifically, the first overlapping portion 110J includes a main body portion 111J disposed parallel to the second overlapping portion 120J and a first bent segment 112J and a second bent segment 113J that are bent and wrapped from both sides of the main body portion 111J towards the second overlapping portion 120J. The main body portion 111J, the first bent segment 112J, and the second bent segment 113J wrap and fix the second overlapping portion 120J, and then the two are connected and fixed by cold heading.

[0092] In the embodiments of the present application, the bridge portion is integrally bent and extended from the connecting section of the first conductive terminal or is separately provided from the connecting section. In the above embodiments of the present application, i.e., the first to tenth embodiments, the bridge portion is integrally bent and extended from the connecting section of the first conductive terminal; in one of the eleventh embodiments of the present application, the bridge portion 18K is separately provided from the connecting section 17K of the first conductive terminal 11K, and the two are also mutually fixed and electrically connected by overlapping. The bridging portion 18K and the connecting section 17K of the first conductive terminal 11K are separately arranged. On the one hand, the bending of the conductive terminal can be further reduced, which is convenient for realizing the spatial span of the first conductive terminal 11K relative to the third conductive terminal 13K and shortening the path of the first conductive terminal 11K as much as possible. On the other hand, since the bridging portion 18K can be regarded as an additional metal material segment relative to the first conductive terminal 11K, a material different from that of the first conductive terminal 11K and the second conductive terminal 12K and a different material thickness can be selected, thereby adjusting the resistivity of the conductive path while more flexibly controlling the welding method between the first conductive terminal 11K and the second conductive terminal 12K, thereby further enhancing the electrical connection effect between the two conductive terminals.

[0093] See also Figures 26 to 27, the first overlapping portion 110K and the second overlapping portion 120K of the second conductive terminal 12K are electrically connected through a bridging portion 18K. The bridging portion 18K enables the first overlapping portion 110K to overlap and lap on the second overlapping portion 120K by straddling the third conductive terminal 13K. The connecting section 17K of the first conductive terminal 11K is further provided with a third overlapping portion 171K, and the bridging portion 18K is further provided with a fourth overlapping portion 181K. The first overlapping portion 110K of the first conductive terminal 11K and the fourth overlapping portion 181K are respectively located at both ends of the bridging portion 18K. The third overlapping portion 171K and the fourth overlapping portion 181K overlap, lap, and are fixed and electrically connected. In this embodiment, the thickness of the bridging portion 18K is less than the thickness of the connecting section 17K of the first conductive terminal 11K and the second conductive terminal 12K. While achieving electrical connection, the injection thickness of the subsequent plastic block 4 can be reduced. The provision of the bridging portion 18K reduces the bending of the second conductive terminal 12K and increases the overlapping and fixing points to reduce the path of the conductive terminal. The portion of the bridging portion 18K that does not overlap and lap with the first conductive terminal 11K and the second conductive terminal 12K is provided with an insulating coating (not labeled) on at least one side facing the third conductive terminal 13K so that the bridging portion 18K directly abuts against the third conductive terminal 13K, preventing short - circuit phenomena and further reducing the injection thickness of the subsequent plastic block 4. A plastic block 4 is injection - molded outside the metal circuit 1. The portion of the bridging portion 18K that overlaps and laps with the first conductive terminal 11K (the fourth overlapping portion 181K) and the portion that overlaps and laps with the second conductive terminal 12K (the first overlapping portion 110K) are exposed to the plastic block 4, and the portion of the bridging portion 18K that does not overlap and lap with the first conductive terminal 11K and the second conductive terminal 12K is covered by the plastic block 4. Additionally, since the bridging portion 18K is separated from the first conductive terminal 11K, the material of the bridging portion 18K can be changed. If the resistance caused by the first conductive terminal 11K when straddling a wire is large, the impedance of the entire metal circuit 1 can be adjusted by changing the material of the bridging portion 18K. It can be understood that in this embodiment, the fixed connection and electrical connection methods between the bridging portion 18K and the first conductive terminal 11K and the second conductive terminal 12K can be selected from any one of the first to tenth embodiments above.

[0094] The present invention also relates to a manufacturing method for manufacturing a motor base 100, specifically including the following steps:

[0095] First step: Provide a metal circuit 1 having a plurality of conductive terminals. The conductive terminals include a first conductive terminal, a second conductive terminal, and a third conductive terminal located between the first conductive terminal and the second conductive terminal. Each conductive terminal includes a solder foot end 15 and a connection section extending from the solder foot end. The first conductive terminal includes a bridging portion connected to the connection section and a first overlapping portion extending from the bridging portion. The second conductive terminal includes a second overlapping portion extending from the corresponding connection section. The bridging portion spans across the third conductive terminal from the connection section corresponding to the first conductive terminal, such that the first overlapping portion and the second overlapping portion overlap and lap over each other.

[0096] Second step: Perform one-time injection molding to form a plurality of plastic blocks 4 that hold the metal circuit 1, and the solder foot end 15 and the overlapping portions are exposed from the plastic blocks 4. After the first conductive terminal and the second conductive terminal are overlapped and lap over each other, specifically use a thimble jig to top and position the first conductive terminal and the second conductive terminal, so as to facilitate one-time injection molding of the plastic blocks 4 around the overlapping portions.

[0097] Third step: Position a plurality of electronic components 2 on the corresponding plastic blocks 4 and weld them to the corresponding solder foot ends 15.

[0098] Fourth step: Define the region where the second overlapping portion and the first overlapping portion overlap and lap over each other as the overlapping and lapping region. In the overlapping and lapping region, perform a fixed connection process on the first overlapping portion and the second overlapping portion. The fixed connection process can be any one of surface mount welding, riveting, laser welding, or resistance welding.

[0099] Fifth step: Perform secondary injection molding of a plastic body 31 outside the metal circuit 1 and the plastic blocks 4 to form an insulating base 3, thereby forming a motor base 100.

[0100] Wherein, as in the fourth step, when performing surface mount welding treatment on the first overlapping portion and the second overlapping portion, apply spot welding solder 6 to the first overlapping portion and the second overlapping portion within the overlapping and lapping region R, and then perform welding through a reflow oven.

[0101] When two conductive terminals are selected to be fixedly connected by surface mount welding, at least one of the first overlapping portion and the second overlapping portion opens a hole in the overlapping and lapping region R for accommodating the solder 6.

[0102] When two conductive terminals are selected to be fixedly connected by laser welding or resistance welding, in the overlapping and lapping region, arrange the first overlapping portion and the second overlapping portion to be parallel and overlap each other, so as to facilitate laser welding or resistance welding of the first overlapping portion and the second overlapping portion.

[0103] When the two conductive terminals are fixedly connected by riveting, the first overlapping portion and the second overlapping portion are riveted and fixed within the overlapping area. Specifically, by cold heading, the first overlapping portion is convexly provided with a protruding portion 111F downward, and the second overlapping portion is provided with a receiving hole 122F for receiving the protruding portion within the overlapping area.

[0104] When the two conductive terminals are fixedly connected by riveting, within the overlapping area, the first overlapping portion wraps the second overlapping portion through riveting, which is specifically achieved by cold heading riveting.

[0105] While fixedly connecting the overlapping portions of the two conductive terminals by welding, laser welding or resistance welding, the first conductive terminal 11K can also be separately provided with a bridging portion 18K. Specifically, the bridging portion 18K is separately provided from the connecting section 17K of the first conductive terminal 11K. At this time, the connecting section 17K of the first conductive terminal 11K is further provided with a third overlapping portion 171K, and both ends of the bridging portion 18K are respectively provided with a first overlapping portion 110K and a fourth overlapping portion 181K. The fourth overlapping portion 181K of the bridging portion 18K overlaps and is fixedly connected with the third overlapping portion 171K of the first conductive terminal 11K, and the first overlapping portion 110K of the bridging portion 18K overlaps and is fixedly connected with the second overlapping portion 120K of the second conductive terminal 12K, thereby realizing the indirect electrical connection between the first conductive terminal 11K and the second conductive terminal 12K. The fixing and electrical connection manner between the bridging portion 18K and the second overlapping portion 120K and the third overlapping portion 171K can also adopt the above-mentioned methods such as soldering, resistance welding, laser welding or riveting, which will not be elaborated here.

[0106] In the present invention, the bridging portion of the first conductive terminal in the motor base 100 spans the third conductive terminal from the corresponding connecting section of the first conductive terminal, so that the first overlapping portion and the second overlapping portion overlap and are fixedly connected, avoiding the situation that the conductive terminal cannot be formed due to excessive bending times of a single conductive terminal, improving the forming yield rate of the conductive terminal, saving the wiring space of the conductive terminal, and the large contact area between the two overlapping conductive terminals results in excellent electrical connection performance.

[0107] In the first to sixth embodiments of the present invention, after the first and second overlapping portions of the first and second conductive terminals are relatively positioned, the relative electrical connection can be simultaneously completed by using the welding process of the electronic component 2, which can further reduce the welding process and simplify the manufacturing process.

[0108] In the first to sixth embodiments of the present invention, at least one of the first and second overlapping portions of the first and second conductive terminals is provided with an opening to promote sufficient contact between the solder 6 and the first and second overlapping portions and strengthen the soldering effect. Gold-plated areas are provided on the portions of the first and second overlapping portions of the first and second conductive terminals that are in contact with the solder 6 to further enhance the sufficient contact between the solder and the first and second overlapping portions and strengthen the soldering effect.

[0109] In the present invention, the plastic block 4 is provided with a stepped portion 411 protruding in the bearing groove 410 corresponding to the first and second overlapping portions of the first and second conductive terminals or corresponding to the first and fourth overlapping portions of the bridging portion 18K and the second and third overlapping portions of the second and first conductive terminals. The stepped portion 411 covers the first and second overlapping portions or the outer edge regions of the third and fourth overlapping portions, and only the welding region within the overlapping overlapping region R is exposed to the plastic block 4, thereby strengthening the fixing effect of the first and fourth overlapping portions overlapping with the second and third overlapping portions respectively.

[0110] In the present invention, the connecting section 17 of the second conductive terminal extends from the corresponding solder foot end 15 and continuously spans at least three planes, which can strengthen the strength of the motor base 100 while achieving the position span between the corresponding pin end 14 and the solder foot end 15 of the conductive terminal.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

[0112] The above is only a partial embodiment of the present invention, not all embodiments. Any equivalent changes made by those of ordinary skill in the art to the technical solutions of the present invention by reading the specification of the present invention are covered by the claims of the present invention.

Claims

1. A motor base, comprising an insulating base, a metal circuit provided on the insulating base, and at least two electronic components welded at different positions of the metal circuit. The metal circuit includes a plurality of conductive terminals. The conductive terminals include a first conductive terminal, a second conductive terminal, and a third conductive terminal located between the first conductive terminal and the second conductive terminal. The third conductive terminal connects the two electronic components. The first conductive terminal and the third conductive terminal both include a solder foot end for soldering the electronic component and a connection section extending from the solder foot end. It is characterized in that: The first conductive terminal includes a bridging portion and a first overlapping portion extending from the bridging portion. The second conductive terminal includes a second overlapping portion. The bridging portion of the first conductive terminal spans across the third conductive terminal from the corresponding connection segment, such that the first overlapping portion and the second overlapping portion overlap and are fixedly connected. The insulating base is injection-molded and at least covers and fixes the first conductive terminal and the second conductive terminal thereon.

2. The motor base according to claim 1, characterized in that: The first conductive terminal or the second conductive terminal is provided with a pin end extending out of the insulating base for electrical connection with an external circuit, such that the first conductive terminal and the second conductive terminal share the same pin end.

3. The motor base according to claim 2, characterized in that: The insulating base includes a plurality of plastic blocks injection-molded once to cover the metal circuit. The solder foot end, the first overlapping portion, and the second overlapping portion are exposed on the same surface of the corresponding plastic block. The insulating base further includes a plastic body injection-molded twice to cover the metal circuit and the plurality of plastic blocks. The plurality of plastic blocks are vertically arranged and located in different vertical planes. Different electronic components are respectively positioned in different plastic blocks and are exposed on the corresponding plastic blocks.

4. The motor base according to claim 3, wherein: The connection segment of the third conductive terminal extends from the corresponding solder foot end and continuously spans at least three planes. The connection segment spans from the vertical plane where the corresponding solder foot end is located to the horizontal plane where the bottom surface of the plastic body is located, and then spans to the vertical plane where the other solder foot end of the third conductive terminal is located.

5. The motor base according to claim 4, wherein: The position where the second overlapping portion overlaps with the first overlapping portion is defined as an overlapping region. The second conductive terminal and the bridging portion are fixedly connected by soldering, and at least one of the first overlapping portion and the second overlapping portion is provided with an opening for receiving solder in the overlapping region.

6. The motor base according to claim 5, wherein: The first conductive terminal and the second conductive terminal are surface-gilded in the overlapping region to form a gilded region. The gilded region covers the upper surface of the first conductive terminal corresponding to the overlapping region, the lower surface opposite to the upper surface, the inner wall of the opening, and the upper wall of the second conductive terminal relatively close to the lower surface of the first conductive terminal.

7. The motor base according to claim 6, wherein: The first overlapping portion is provided with the opening in the overlapping region. The opening is defined as a holding through hole. The holding through hole is provided with an open end away from the second conductive terminal and a abutting end close to the second conductive terminal. The size of the open end is smaller than the size of the abutting end. Solder is received in the holding through hole.

8. The motor base according to claim 7, wherein: The second overlapping portion protrudes a convex bump into the holding through hole from the upper wall. The solder is received in the holding through hole and concentrated on the convex bump.

9. The motor base according to claim 6, wherein: The first overlapping portion forms the opening in the overlapping region. The opening of the first overlapping portion is defined as a holding through-hole. The holding through-hole has an open end away from the second conductive terminal and a abutting end close to the second conductive terminal. The second overlapping portion forms the opening in the overlapping region. The opening of the second overlapping portion is defined as a receiving hole. The receiving hole of the second overlapping portion communicates with the holding through-hole within the overlapping region. The solder is received within the holding through-hole and the receiving hole.

10. The motor base according to claim 9, characterized in that: The size of the open end is larger than that of the abutting end, and the size of the receiving hole is larger than that of the abutting end.

11. The motor base according to claim 9, characterized in that: The size of the open end is larger than that of the abutting end. The holding through-hole and the receiving hole are arranged in a staggered manner and communicate with each other. The size of the side of the receiving hole close to the first overlapping portion is smaller than the size of the side of the receiving hole away from the first overlapping portion. The solder is received within the holding through-hole and the receiving hole.

12. The motor base according to claim 6, wherein: Both the lower surface and the upper wall of the first conductive terminal and the second conductive terminal within the overlapping region are provided with wavy uneven structures, and the extending directions of the uneven structures on the lower surface and the upper wall are different. The solder is received within the uneven structures between the opening and the lower surface and the upper wall.

13. The motor base according to claim 6, wherein: The area of the first overlapping portion is smaller than that of the second overlapping portion. The first overlapping portion has an annular structure. The annular structure is hollow to form the opening. The opening of the annular structure is defined as a holding through-hole. The inner wall is defined as the first inner wall where the holding through-hole is arranged. The outer wall of the annular structure is set as an outer wall surface. The solder is received along the second overlapping portion at least within the opening.

14. The motor base according to claim 5, characterized in that: The second overlapping portion forms the opening, which is defined as a receiving hole. The first overlapping portion is punched into the receiving hole of the second overlapping portion within the overlapping region, and the first overlapping portion is welded and fixed to the second overlapping portion.

15. The motor base according to claim 1, characterized in that: The position where the second overlapping portion and the first overlapping portion overlap is defined as the overlapping region. The first overlapping portion and the second overlapping portion are riveted and fixed within the overlapping region. The first overlapping portion protrudes downward with a protruding portion, and the second overlapping portion is provided with a receiving hole for receiving the protruding portion within the overlapping region.

16. The motor base according to claim 1, wherein: The position where the second overlapping portion and the first overlapping portion overlap is defined as the overlapping region. The first overlapping portion is arranged in parallel and overlaps with the second overlapping portion within the overlapping region. The first overlapping portion and the second overlapping portion are connected and fixed by resistance welding or laser welding or riveting.

17. The motor base according to claim 1, characterized in that: The position where the second overlapping portion and the first overlapping portion overlap is defined as the overlapping region. The first overlapping portion wraps the second overlapping portion within the overlapping region, and the first overlapping portion is in contact connection with the second overlapping portion.

18. The motor base according to claim 1, characterized in that: The bridging portion extends integrally and bent from the connecting section of the first conductive terminal; alternatively, the bridging portion is separately provided from the connecting section, the connecting section of the first conductive terminal is further provided with a third overlapping portion, and the bridging portion is further provided with a fourth overlapping portion, and the third overlapping portion and the fourth overlapping portion overlap and are fixedly connected.

19. The motor base according to claim 18, characterized in that: The thickness of the bridging portion is less than the thickness of the connecting section of the first conductive terminal and the second conductive terminal.

20. The motor base according to claim 18, wherein: For the portion of the bridging portion that does not overlap and lap with the first conductive terminal and the second conductive terminal, at least one side surface facing the third conductive terminal is provided with an insulating coating so that the bridging portion directly abuts against the third conductive terminal.

21. The motor base according to claim 20, characterized in that: A plastic block is injection-molded outside the metal circuit, and the portion of the bridging portion that overlaps and laps with the first conductive terminal and the second conductive terminal is exposed to the plastic block, and the portion of the bridging portion that does not overlap and lap with the first conductive terminal and the second conductive terminal is covered by the plastic block.

22. A manufacturing method of a motor base, characterized in that, It includes the following steps: In the first step, a metal circuit with a plurality of conductive terminals is provided. The conductive terminals include a first conductive terminal, a second conductive terminal, and a third conductive terminal located between the first conductive terminal and the second conductive terminal. Both the first conductive terminal and the third conductive terminal include a solder foot end and a connecting section extending from the solder foot end. The first conductive terminal includes a bridging portion connected to the connecting section and a first overlapping portion extending from the bridging portion. The second conductive terminal includes a second overlapping portion. The bridging portion extends across the third conductive terminal from the corresponding connecting section, so that the first overlapping portion and the second overlapping portion overlap and lap. In the second step, the region where the second overlapping portion and the first overlapping portion overlap and lap is defined as the overlapping and lapping region, and the first overlapping portion and the second overlapping portion are fixedly connected in the overlapping and lapping region. In the third step, at least two electronic components at different positions are positioned at the corresponding solder foot ends and welded, and the solder foot ends of the third conductive terminal are respectively connected to the two electronic components. In the fourth step, an insulating base is injection-molded on the metal circuit, and the insulating base is at least covered and fixed outside the first conductive terminal and the second conductive terminal.

23. The manufacturing method of the motor base according to claim 22, characterized in that: Before the second step, a thimble jig is provided to abut and position the overlapping and lapping region of the first conductive terminal and the second conductive terminal, and a plastic block is injection-molded on the metal circuit at one time, and the solder foot end, the first overlapping portion, and the second overlapping portion are exposed on the same surface of the corresponding plastic block.

24. The manufacturing method of the motor base according to claim 23, characterized in that: The fixed connection adopts a tin soldering method. Before the second step, the first overlapping portion and the second overlapping portion are first tinned in the overlapping and lapping region, and then passed through a reflow oven for soldering to complete the fixed connection.

25. The manufacturing method of the motor base according to claim 24, characterized in that: At least one of the first overlapping portion and the second overlapping portion is provided with an opening for accommodating solder in the overlapping and lapping region.

26. The manufacturing method of the motor base according to claim 22, characterized in that: The bridging portion extends integrally and bent from the connecting section of the first conductive terminal; alternatively, the bridging portion is separately provided from the connecting section, a third overlapping portion is further provided on the connecting section of the first conductive terminal, and a fourth overlapping portion is further provided on the bridging portion. In the second step, the first overlapping portion and the fourth overlapping portion are respectively overlapped and fixed to the second overlapping portion and the third overlapping portion correspondingly.

27. The manufacturing method of the motor base according to claim 22, characterized in that: The first overlapping portion and the second overlapping portion are overlapped in parallel, and the fixed connection is made by laser welding to laser-weld the first overlapping portion and the second overlapping portion.

28. The manufacturing method of the motor base according to claim 22, characterized in that: The fixed connection is made by riveting connection. The first overlapping portion is convexly provided with a protruding portion downward in the overlapping region, and the second overlapping portion is provided with a receiving hole for receiving the protruding portion in the overlapping region.

29. The manufacturing method of the motor base according to claim 22, characterized in that: The fixed connection is made by riveting connection. The first overlapping portion wraps the second overlapping portion within the overlapping region and is fixedly connected to the second overlapping portion.

Images