A driving backplate and a display panel

Abstract

This invention discloses a driving backplane and a display panel. The driving backplane includes: a substrate; a first connecting electrode located on the surface of the substrate; an insulating support layer having a Y-shaped groove, the Y-shaped groove including a first groove and a second groove that are connected; the first groove exposing a portion of the first connecting electrode; and the minimum opening area of ​​the second groove being greater than the maximum opening area of ​​the first groove; a second connecting electrode located within the Y-shaped groove or extending from the Y-shaped groove to the surface of the insulating support layer away from the substrate, and connected to the first connecting electrode. The technical solution provided by this invention improves the situation where short circuits easily occur between conductive layers of different layers within the driving backplane under pressure.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a driving backplane and a display panel. Background Technology

[0002] MicroLED technology refers to the integration of a high-density, tiny LED array on a single chip. It has the advantages of inorganic LEDs, such as high efficiency, high brightness, high reliability, and fast response time. It also has the characteristics of self-illumination without the need for a backlight, and has the advantages of energy saving, small size, and simple structure.

[0003] After the micro LED chip is transferred to the surface of the driver backplane using mass transfer technology, during the bonding process between the micro LED chip and the driver backplane, a pressure bonding force is required to bond the micro LED chip and the driver backplane together. During this process, the conductive layers of different layers inside the driver backplane are prone to short circuits under the action of the pressure bonding force. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a driving backplate and a display panel to improve the situation where short circuits easily occur between different conductive layers inside the driving backplate under the action of crimping force.

[0005] This invention provides a drive backplane, comprising:

[0006] Substrate;

[0007] The first connecting electrode is located on the surface of the substrate;

[0008] An insulating support layer is provided with a Y-shaped groove, the Y-shaped groove including a first groove and a second groove that are connected, the first groove exposing a portion of the first connecting electrode, and the minimum opening area of ​​the second groove being greater than the maximum opening area of ​​the first groove.

[0009] The second connecting electrode is located within the Y-shaped groove or extends from the Y-shaped groove to the surface of the insulating support layer opposite to the substrate, and is connected to the first connecting electrode.

[0010] The driving backplane of this invention has a Y-shaped groove in the insulating support layer, which includes a first groove and a second groove that are connected. During the bonding process, part of the force acting on the insulating support layer acts directly on the sidewall of the second groove, and another part of the force acts directly on the sidewall of the first groove. The minimum opening area of ​​the second groove is greater than the maximum opening area of ​​the first groove, which increases the area of ​​the force acting on the insulating support layer in the direction perpendicular to the substrate thickness, thereby improving the support capacity and compressive strength of the insulating support layer.

[0011] Optionally, the slope of the sidewall of the second groove is less than or equal to 90°. This can increase the area of ​​the force acting on the insulating support layer in the direction perpendicular to the substrate thickness. Preferably, the slope of the sidewall of the second groove is greater than or equal to 20° and less than or equal to 90°, which can both increase the area of ​​the force acting on the insulating support layer in the direction perpendicular to the substrate thickness and enable miniaturization of the driving backplane and display panel.

[0012] Optionally, a third groove is provided on the surface of the second connecting electrode facing away from the substrate. The depth of the third groove is less than the depth of the second groove in the thickness direction parallel to the substrate. This third groove on the surface of the second connecting electrode facing away from the substrate can limit the positioning of the first and second electrodes of the micro-LED chip placed on the surface of the second connecting electrode using a mass transfer device, thereby improving the alignment accuracy of the micro-LED chip and the second connecting electrode. Simultaneously, the location of the first and second electrodes of the micro-LED chip within the third groove increases the contact area between the second connecting electrode and the first and second electrodes of the micro-LED chip, thereby improving the bonding strength between the driving backplate and the micro-LED chip. Furthermore, the third groove on the surface of the second connecting electrode facing away from the substrate increases the surface area of ​​the second connecting electrode facing away from the substrate, thus increasing the area available for vapor deposition and reducing the difficulty of forming the first connecting layer on the surface of the second connecting electrode facing away from the substrate using vapor deposition.

[0013] Optionally, the insulating support layer includes a first insulating layer and a second insulating layer. The first insulating layer has the first groove, and the second insulating layer has the second groove. A portion of the force acting on the insulating support layer acts directly on the sidewall of the second groove in the second insulating layer, and another portion acts directly on the sidewall of the first groove in the first insulating layer. Furthermore, the minimum opening area of ​​the second groove is greater than the maximum opening area of ​​the first groove, increasing the area of ​​force acting on the insulating support layer in the direction perpendicular to the substrate thickness. This, in turn, improves the support capacity and compressive strength of the first insulating layer, which is in direct contact with the first connecting electrode.

[0014] Optionally, the first insulating layer comprises an organic material. The first insulating layer has a first groove, and since it comprises an organic material, the surface of the first insulating layer facing away from the substrate is planar. A first insulating layer composed of an organic material is more likely to form a first insulating layer with high flatness. A first insulating layer with high flatness provides a smooth surface for subsequently formed films, improving the yield of subsequent films.

[0015] Optionally, the thickness of the second insulating layer is greater than or equal to 3000 nanometers and less than or equal to 2 micrometers. A second insulating layer with a thickness greater than or equal to 3000 nanometers and less than or equal to 2 micrometers has good support and compressive strength, and the increase in the overall thickness of the display panel is within a controllable range.

[0016] Optionally, the insulating support layer further includes a third insulating layer, which is located between the first insulating layer and the second insulating layer and covers the sidewall of the first groove. The third insulating layer, located between the first and second insulating layers and covering the sidewall of the first groove, covers the surface and side of the first insulating layer, preventing the first insulating layer from directly contacting the second connecting electrode. With the third insulating layer providing support for the second connecting electrode, this effectively mitigates the problem of short circuits easily occurring between different conductive layers inside the drive backplate under pressure.

[0017] Optionally, the surface of the insulating support layer facing away from the substrate is planar. This technical solution can provide a flat surface for miniature light-emitting diode chips.

[0018] The third insulating layer can include organic materials, which are more likely to form a high-flatness third insulating layer. A high-flatness third insulating layer provides a smooth surface for subsequent film layers, improving their yield. Alternatively, the third insulating layer can include inorganic materials. Inorganic materials have higher density, which can enhance the support and compressive strength of the insulating support layer, effectively mitigating the short-circuiting phenomenon that easily occurs between different conductive layers within the drive backplane under compression force. The combination of organic and inorganic materials in the third insulating layer enhances both the support and compressive strength of the insulating support layer, effectively mitigating the short-circuiting phenomenon that easily occurs between different conductive layers within the drive backplane under compression force. Furthermore, it can form a high-flatness third insulating layer, providing a smooth surface for subsequent film layers and improving their yield.

[0019] Optionally, the insulating support layer includes a reflective material and / or a light-absorbing material. An insulating support layer including a reflective material reflects light, increasing the luminous efficiency of the display panel. An insulating support layer including a light-absorbing material absorbs light incident on it, thus preventing light leakage from the drive back panel side. An insulating support layer including both reflective and light-absorbing materials, on the one hand, reflects light, increasing the luminous efficiency of the display panel; on the other hand, it absorbs light incident on it, thus preventing light leakage from the drive back panel side.

[0020] This invention also provides a display panel, including any of the driving backplates described in the above technical solutions;

[0021] It also includes a micro light-emitting diode chip, which is located on the surface of the second connection electrode away from the substrate.

[0022] The display panel includes any of the driving backplanes described in the above technical solutions; it also includes a micro light-emitting diode chip. During the bonding process between the micro light-emitting diode chip and the driving backplane, the support capacity and compressive strength of the insulating support layer are enhanced by pressing force, which can effectively improve the situation where the conductive layers of different layers inside the driving backplane are prone to short circuits under the action of pressing force, thereby improving the yield of the display panel.

[0023] In the technical solution provided by this embodiment of the invention, part of the force acting on the insulating support layer acts directly on the sidewall of the second groove, and another part acts directly on the sidewall of the first groove. Furthermore, the minimum opening area of ​​the second groove is greater than the maximum opening area of ​​the first groove, increasing the area of ​​the force acting on the insulating support layer in the direction perpendicular to the substrate thickness. This, in turn, improves the support capacity and compressive strength of the insulating support layer. In summary, the technical solution provided by this embodiment of the invention enhances the support capacity and compressive strength of the insulating support layer during the bonding process of the micro-LED chip and the driving backplane, effectively mitigating the problem of short circuits easily occurring between different conductive layers within the driving backplane under the action of the compressive force. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a display panel in the prior art;

[0025] Figure 2 for Figure 1 A schematic diagram of the structure in which the conductive layers of different layers of the drive backplate S region are short-circuited under the action of pressing force;

[0026] Figure 3 This is a schematic diagram of a drive backplate provided in an embodiment of the present invention;

[0027] Figure 4 For including Figure 3 A schematic diagram of the display panel structure shown in the diagram;

[0028] Figure 5 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention;

[0029] Figure 6 For including Figure 5 A schematic diagram of the display panel structure shown in the diagram;

[0030] Figure 7This is a schematic diagram of another drive backplate provided in an embodiment of the present invention;

[0031] Figure 8 For including Figure 7 A schematic diagram of the display panel structure shown in the diagram;

[0032] Figure 9 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention;

[0033] Figure 10 For including Figure 9 A schematic diagram of the display panel structure shown in the diagram;

[0034] Figure 11 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention;

[0035] Figure 12 For including Figure 11 A schematic diagram of the display panel structure shown in the diagram. Detailed Implementation

[0036] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0037] After careful research, the inventors discovered that during the bonding process between the micro LED chip and the driver backplane, a pressure bonding force is required to bond the micro LED chip and the driver backplane together. During this process, the conductive layers of different layers inside the driver backplane are prone to short-circuiting under the pressure bonding force. Figure 1 This is a schematic diagram of the structure of a display panel in the prior art. Figure 2 for Figure 1 A schematic diagram showing the structure in region S of the drive backplate where different conductive layers short-circuit under pressure. (Combined with...) Figure 1 and Figure 2The reason for this is that the display panel includes a light-emitting unit 201, a micro light-emitting diode chip 200 with a first electrode 202 and a second electrode 203, and a driving backplate. The driving backplate includes a substrate 10, on which a first connection electrode 20 is disposed; an organic layer 30, on which a trapezoidal groove 31 is disposed, exposing part of the first connection electrode 20; and a second connection electrode 40, which is located in the trapezoidal groove 31 and extends to the surface of the organic layer 30 away from the substrate 10, and is connected to the first connection electrode 20. The forces acting on the organic layer 30 parallel to the thickness direction (Y direction) of the substrate 10 include the combined force of the gravity of the first connecting electrode 20, the second connecting electrode 40, and the micro LED chip 200, as well as the pressing force of the mass transfer device. This combined force acts on a concentrated region of the organic layer 30 belonging to the S region. The organic layer 30 is a film layer that separates the first connecting electrode 20 and the second connecting electrode 40. After the micro LED chip is transferred to the surface of the driving backplane by mass transfer technology, during the bonding process between the micro LED chip 200 and the second connecting electrode 40 of the driving backplane, the first electrode 202 and the second electrode 203 of the micro LED chip 200 need to be bonded together with the second connecting electrode 40 of the driving backplane by pressing force. During this process, the organic layer 30 has insufficient support force, and the first connecting electrode 20 and the second connecting electrode 40 of different layers inside the driving backplane short-circuit under the action of pressing force.

[0038] To address the aforementioned technical problems, embodiments of the present invention provide the following technical solutions:

[0039] Figure 3 This is a schematic diagram of a drive backplate provided in an embodiment of the present invention. Figure 4 For including Figure 3 A schematic diagram of the display panel structure shown in the diagram. Figure 5 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention. Figure 6 For including Figure 5 A schematic diagram of the display panel structure of the driving backplate is shown. See also: Figures 3-6 The drive backplate includes: a substrate 10; a first connecting electrode 20 located on the surface of the substrate 10; an insulating support layer 60 having a Y-shaped groove 61, the Y-shaped groove 61 including a first groove 610 and a second groove 611 communicating with each other, the first groove 610 exposing a portion of the first connecting electrode 20, and the minimum opening area of ​​the second groove 611 being greater than the maximum opening area of ​​the first groove 610; and a second connecting electrode 40 located within the Y-shaped groove 61 or extending from the Y-shaped groove 61 to the surface of the insulating support layer 60 away from the substrate 10, and connected to the first connecting electrode 20.

[0040] It should be pointed out that, Figures 3-6An exemplary embodiment shows a technical solution where the slope ∠1 of the sidewall of the second groove 611 is less than 90°. This embodiment also includes a technical solution where the slope ∠1 of the sidewall of the second groove 611 is equal to 90° (not shown). Furthermore, the technical solution where the slope ∠1 of the sidewall of the second groove 611 is less than 90° further increases the area of ​​the force acting on the insulating support layer 60 in the direction perpendicular to the thickness of the substrate 10 (X direction) compared to the technical solution where the slope ∠1 of the sidewall of the second groove 611 is equal to 90°.

[0041] It is known that a driving circuit layer can be disposed between the substrate 10 and the first connection electrode 20. The driving circuit layer includes a thin film transistor and a capacitor structure. The thin film transistor transmits the driving signal of the driving chip to the second connection electrode 40 through the first connection electrode 20. The second connection electrode 40 then transmits the signal to the micro light-emitting diode chip 200 to drive the micro light-emitting diode chip 200 to emit light.

[0042] Specifically, taking a miniature LED display panel as an example, the force exerted on the insulating support layer 60 in the direction parallel to the thickness of the substrate 10 (Y direction) includes the combined force of the gravity of the first connecting electrode 20, the second connecting electrode 40, and the miniature LED chip 200, as well as the pressing force of the mass transfer device. The miniature LED chip 200 includes a light-emitting unit 201, a first electrode 202, and a second electrode 203.

[0043] Optionally, the material of the first connecting electrode 20 includes a Ti / Al / Ti composite material. Compared to the composite material composed of ITO / Ag / ITO used in traditional organic light-emitting diode (OLED) display panels, the Ti / Al / Ti composite material can avoid the diffusion of easily diffusing elements (such as Ag) in the electrode during the formation of subsequent film layers, thus preventing pollution to the equipment and environment that form the subsequent film layers. Here, ITO is conductive glass.

[0044] It should be noted that, Figure 3 A schematic diagram of the drive backplate showing the second connecting electrode 40 located within the Y-shaped groove 61 is shown. See also... Figure 3 In the thickness direction (Y direction) parallel to the substrate 10, the thickness of the second connecting electrode 40 is less than the depth of the Y-shaped groove 61. The embodiments of the present invention may also include a technical solution in which the thickness of the second connecting electrode 40 in the thickness direction (Y direction) parallel to the substrate 10 is greater than or equal to the depth of the Y-shaped groove 61. Figure 5A schematic diagram of a drive backplate is shown, showing the second connecting electrode 40 extending from the Y-shaped groove 61 to the surface of the insulating support layer 60 facing away from the substrate 10. Compared to the technical solution where the second connecting electrode 40 extends from the Y-shaped groove 61 to the surface of the insulating support layer 60 facing away from the substrate 10, the second connecting electrode 40 is located in the drive backplate within the Y-shaped groove 61, resulting in better isolation of the second connecting electrode 40.

[0045] In the technical solution provided by the embodiments of the present invention, part of the force acting on the insulating support layer 60 acts directly on the sidewall of the second groove 611, and another part of the force acts directly on the sidewall of the first groove 610. Moreover, the minimum opening area of ​​the second groove 611 is greater than the maximum opening area of ​​the first groove 610, which increases the area of ​​the force acting on the insulating support layer 60 in the direction perpendicular to the thickness of the substrate 10 (X direction), thereby improving the support capacity and compressive strength of the insulating support layer 60.

[0046] In summary, the technical solution provided by the embodiments of the present invention enhances the support and compressive strength of the insulating support layer 60 during the bonding process of the micro LED chip 200 and the driving backplate by pressing force. This effectively improves the situation where short circuits easily occur between different conductive layers inside the driving backplate under the action of pressing force.

[0047] Specifically, the bonding process between the miniature LED chip 200 and the driver backplane is as follows:

[0048] A first connection layer is formed on the surface of the second connection electrode 40 of the driving backplane facing away from the substrate 10, and a second connection layer is formed on the surfaces of the first electrode 202 and the second electrode 203 of the micro LED chip 200. The first and second connection layers are bonded together with solder to achieve bonding between the micro LED chip 200 and the driving backplane. The first connection layer, the second connection layer, and the solder are not shown in this embodiment. Optionally, the first connection layer can be formed on the surface of the second connection electrode 40 of the driving backplane facing away from the substrate 10 using a vapor deposition process.

[0049] Optionally, based on the above technical solution, the surface of the insulating support layer 60 facing away from the substrate 10 is flat, which can provide a flat surface for the micro light-emitting diode chip 200.

[0050] Optionally, based on the above technical solution, the slope ∠1 of the sidewall of the second groove 611 is less than or equal to 90°. Preferably, the slope ∠1 of the sidewall of the second groove 611 is greater than or equal to 20° and less than or equal to 90°.

[0051] Specifically, the slope ∠1 of the sidewall of the second groove 611 is less than or equal to 90°. The smaller the slope value of the sidewall of the second groove 611, the larger the area of ​​the force acting on the insulating support layer 60 in the direction perpendicular to the thickness of the substrate 10 (X direction). When the slope ∠1 of the sidewall of the second groove 611 is too small, less than 20°, the opening area of ​​the second groove 611 is too large, resulting in the second connecting electrode 40 having a large size in the direction perpendicular to the thickness of the substrate 10 (X direction), which is not conducive to the miniaturization of the driving backplate and the display panel. Therefore, in this embodiment of the invention, the slope ∠1 of the sidewall of the second groove 611 is greater than or equal to 20° and less than or equal to 90°, which can both increase the area of ​​the force acting on the insulating support layer 60 in the direction perpendicular to the thickness of the substrate 10 (X direction) and achieve the miniaturization of the driving backplate and the display panel.

[0052] To improve the alignment accuracy of the miniature light-emitting diode chip 200 and the second connecting electrode 40, the embodiments of the present invention also provide the following technical solutions:

[0053] Figure 7 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention. Figure 8 For including Figure 7 The diagram shows a structural schematic of the display panel with a driving backplate. Optionally, based on the above technical solution, see... Figure 7 and Figure 8 The second connecting electrode 40 has a third groove 41 on its surface away from the substrate 10. In the thickness direction (Y direction) parallel to the substrate 10, the depth of the third groove 41 is less than the depth of the second groove 611.

[0054] Specifically, in the thickness direction (Y direction) parallel to the substrate 10, a third groove 41 is provided on the surface of the second connecting electrode 40 facing away from the substrate 10. The third groove 41 can limit the first electrode 202 and the second electrode 203 of the micro LED chip 200 placed on the surface of the second connecting electrode 40 by the mass transfer device, thereby improving the alignment accuracy of the micro LED chip 200 and the second connecting electrode 40. At the same time, the first electrode 202 and the second electrode 203 of the micro LED chip 200 are located in the third groove 41, which can also increase the contact area between the second connecting electrode 40 and the first electrode 202 and the second electrode 203 of the micro LED chip 200, thereby improving the firmness between the driving backplate and the micro LED chip 200. Meanwhile, a third groove 41 is provided on the surface of the second connecting electrode 40 away from the substrate 10, which increases the area of ​​the surface of the second connecting electrode 40 away from the substrate 10, thereby increasing the area of ​​the surface of the second connecting electrode 40 away from the substrate 10 that can be subjected to vapor deposition process, thereby reducing the process difficulty of forming the first connecting layer on the surface of the second connecting electrode 40 away from the substrate 10 of the driving back plate by vapor deposition process.

[0055] The insulating support layer 60 is described below. The insulating support layer 60 in this embodiment of the invention can be a single film layer with a Y-shaped groove 61, or it can be a multi-film layer structure mentioned in the following technical solutions.

[0056] Figure 9 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention. Figure 10 For including Figure 9 The diagram shows a structural schematic of the display panel with a driving backplate. Optionally, based on the above technical solution, see... Figure 9 and Figure 10 The insulating support layer 60 includes a first insulating layer 60A and a second insulating layer 60B. The first insulating layer 60A is provided with a first groove 610, and the second insulating layer 60B is provided with a second groove 611.

[0057] Specifically, part of the force acting on the insulating support layer 60 acts directly on the sidewall of the second groove 611 of the second insulating layer 60B, and another part of the force acts directly on the sidewall of the first groove 610 of the first insulating layer 60A. The minimum opening area of ​​the second groove 611 is greater than the maximum opening area of ​​the first groove 610, which increases the area of ​​the force acting on the insulating support layer 60 in the direction perpendicular to the thickness of the substrate 10 (X direction), thereby improving the support capacity and compressive strength of the first insulating layer 60A that is in direct contact with the first connecting electrode 20.

[0058] In summary, the technical solution provided by the embodiments of the present invention enhances the support and compressive strength of the first insulating layer 60A in the insulating support layer 60 during the bonding process of the micro LED chip 200 and the driving backplate by pressing force. This can effectively improve the situation where short circuits easily occur between different conductive layers inside the driving backplate under the action of pressing force.

[0059] Optionally, the thickness of the second insulating layer 60B is greater than or equal to 3000 nanometers and less than or equal to 2 micrometers. The second insulating layer 60B within this thickness range has good support and compressive strength, and the increase in the overall thickness of the display panel is within a controllable range.

[0060] Optionally, based on the above technical solutions, see [reference needed]. Figure 9 and Figure 10 The first insulating layer 60A comprises organic materials.

[0061] Specifically, the first insulating layer 60A has a first groove 610, and the first insulating layer 60A comprises an organic material. The surface of the first insulating layer 60A facing away from the substrate 10 is planar. The first insulating layer 60A, being composed of an organic material, is easier to form with high flatness. The high flatness of the first insulating layer 60A provides a smooth surface for subsequently formed film layers, improving the yield of subsequent film layers. Specifically, when the surface of the first insulating layer 60A facing away from the substrate 10 is planar, it facilitates the formation of a second insulating layer 60B with a planar surface facing away from the substrate 10, thereby providing a smooth surface for the micro-LED chip 200. Exemplarily, the organic material includes at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI).

[0062] It should be noted that the first insulating layer 60A may also be a film layer made of an inorganic material with high flatness. Specifically, the first insulating layer 60A includes an inorganic material, and the surface of the first insulating layer 60A facing away from the substrate 10 is planar. For example, the inorganic material includes silicon oxide, silicon nitride, or a stack of silicon oxide and silicon nitride.

[0063] Optionally, based on the above technical solutions, see [reference needed]. Figure 9 and Figure 10 The second insulating layer 60B comprises organic and / or inorganic materials.

[0064] Specifically, the second insulating layer 60B includes inorganic materials. The inorganic materials have high density, which can enhance the support and compressive strength of the insulating support layer 60, thereby effectively improving the situation where the conductive layers of different layers inside the drive backplate are prone to short circuits under the action of crimping force.

[0065] Based on the above technical solution, a first groove 610 is provided in the first insulating layer 60A, and a second groove 611 is provided in the second insulating layer 60B. This ensures that the supporting capacity and compressive strength of the insulating support layer 60 are enhanced, effectively improving the situation where short circuits easily occur between different conductive layers inside the drive backplane under pressure. Furthermore, the second insulating layer 60B includes organic materials, making it easier to form a second insulating layer 60B with high flatness. The high flatness of the second insulating layer 60B provides a smooth surface for the subsequently formed film layers, improving the yield of subsequent film layers.

[0066] The second insulating layer 60B comprises organic and inorganic materials. On one hand, it enhances the support and compressive strength of the insulating support layer 60, thereby effectively mitigating the short circuit phenomenon that easily occurs between different conductive layers inside the drive backplane under compression force. On the other hand, it forms a second insulating layer 60B with high flatness, providing a smooth surface for subsequent film layers and improving the yield of subsequent film layers.

[0067] For example, organic materials include at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI). Inorganic materials include silicon oxide, silicon nitride, or a stack of silicon oxide and silicon nitride.

[0068] Figure 11 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention. Figure 12 For including Figure 11 The diagram shows a structural schematic of the display panel with a driving backplate. Optionally, based on the above technical solution, see... Figure 11 and Figure 12 The insulating support layer 60 also includes a third insulating layer 60C, which is located between the first insulating layer 60A and the second insulating layer 60B and covers the sidewall of the first groove 610.

[0069] Specifically, the third insulating layer 60C is located between the first insulating layer 60A and the second insulating layer 60B, and covers the sidewall of the first groove 610. That is, the third insulating layer 60C covers the surface and side of the first insulating layer 60A, avoiding direct contact between the first insulating layer 60A and the second connecting electrode 40. With the third insulating layer 60C supporting the second connecting electrode 40, the short circuit phenomenon that easily occurs between different conductive layers inside the drive backplate under the action of crimping force can be effectively improved.

[0070] Optionally, based on the above technical solutions, see [reference needed]. Figure 11 and Figure 12 The third insulating layer 60C includes organic and / or inorganic materials.

[0071] Specifically, the third insulating layer 60C includes organic materials. The organic materials used in the third insulating layer 60C facilitate the formation of a highly flat third insulating layer 60C. This highly flat third insulating layer 60C provides a smooth surface for subsequent film layers, improving the yield of those layers.

[0072] The third insulating layer 60C includes inorganic materials. The inorganic materials have high density, which can enhance the support and compressive strength of the insulating support layer 60, thereby effectively improving the situation where the conductive layers of different layers inside the drive backplate are prone to short circuits under the action of crimping force.

[0073] The third insulating layer 60C comprises organic and inorganic materials. On one hand, it enhances the support and compressive strength of the insulating support layer 60, thereby effectively mitigating the short circuit phenomenon that easily occurs between different conductive layers inside the drive backplane under compression force. On the other hand, it forms a highly flat third insulating layer 60C, providing a smooth surface for subsequent film layers and improving the yield of subsequent film layers.

[0074] For example, organic materials include at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI). Inorganic materials include silicon oxide, silicon nitride, or a stack of silicon oxide and silicon nitride.

[0075] It should be particularly pointed out that, and compared to Figure 1 Figures and Figure 2 In the illustrated drive backplane, the passivation layer 50 is formed after the second connecting electrode 40 and does not increase the support and compressive strength of the organic layer 30. However, in this embodiment, the insulating support layer 60, including the first insulating layer 60A, the second insulating layer 60B, and the third insulating layer 60C, is formed before the second connecting electrode 40. Since the first insulating layer 60A has a first groove 610 and the second insulating layer 60B has a second groove 611, the support and compressive strength of the insulating support layer 60 are enhanced, effectively improving the situation where short circuits easily occur between conductive layers of different layers within the drive backplane under pressure. For example, the passivation layer 50 includes silicon oxide, silicon nitride, or a stack of silicon oxide and silicon nitride.

[0076] It should be noted that, Figures 7-12 In the drive backplate shown, the second connection electrode 40 is located within the Y-shaped groove 61. Figures 7-12 The improvements can also be applied to the second connecting electrode 40 extending from the Y-shaped groove 61 to the surface of the insulating support layer 60 away from the substrate 10 in the drive backplate.

[0077] Optionally, based on the above technical solution, in order to improve the optical performance of the drive backplane, the insulating support layer 60 in this embodiment of the invention includes reflective material and / or light-absorbing material.

[0078] Specifically, the insulating support layer 60, which includes reflective material, reflects light, thereby increasing the luminous efficiency of the display panel. The insulating support layer 60, which includes light-absorbing material, absorbs light incident on it, thus preventing light leakage from the drive back panel side. In short, the insulating support layer 60, which includes both reflective and light-absorbing materials, reflects light, increasing the luminous efficiency of the display panel, and absorbs light incident on it, thus preventing light leakage from the drive back panel side.

[0079] Optionally, the insulating support layer 60 includes a transparent insulating material and a reflective material located within the transparent insulating material. The reflective material may include high-refractive-index glass microspheres or a thin metal film layer with good reflective properties. The insulating support layer 60 includes a transparent insulating material and a light-absorbing material located within the transparent insulating material. The light-absorbing material may be a black material with high light absorption. Preferably, the light-absorbing material may be a carbon nanotube blackbody capable of absorbing at least 99% of light. Exemplarily, the transparent insulating material may be a transparent film layer composed of at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI).

[0080] This invention also provides a display panel, which includes any of the driving backplates described in the above technical solutions, and also includes a micro light-emitting diode chip 200, which is located on the surface of the second connecting electrode 40 away from the substrate 10.

[0081] The display panel provided in this embodiment of the invention includes the driving backplane described in the above embodiments. Therefore, the display panel provided in this embodiment of the invention also has the beneficial effects described in the above embodiments, which will not be repeated here. It should be noted that the display panel provided in this embodiment of the invention can be applied to display devices with display functions such as mobile phones, computers, and wearable devices, and this embodiment of the invention does not limit it.

[0082] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A drive backplane, characterized in that, include: Substrate; The first connecting electrode is located on the surface of the substrate; An insulating support layer is provided with a Y-shaped groove, the Y-shaped groove including a first groove and a second groove that are connected, the first groove exposing a portion of the first connecting electrode, and the minimum opening area of ​​the second groove being greater than the maximum opening area of ​​the first groove. The second connecting electrode is located within the Y-shaped groove and its upper surface is located between the upper and lower surfaces of the second groove, or the second connecting electrode extends from the Y-shaped groove to the surface of the insulating support layer away from the substrate and is connected to the first connecting electrode. The insulating support layer includes a first insulating layer and a second insulating layer, wherein the first insulating layer is provided with the first groove and the second insulating layer is provided with the second groove; The insulating support layer further includes a third insulating layer, which is located between the first insulating layer and the second insulating layer and covers the sidewall of the first groove.

2. The drive backplane according to claim 1, characterized in that, The slope of the sidewall of the second groove is less than or equal to 90°.

3. The drive backplane according to claim 1, characterized in that, The second connecting electrode has a third groove on its surface away from the substrate, and the depth of the third groove is less than the depth of the second groove in the thickness direction parallel to the substrate.

4. The drive backplane according to claim 1, characterized in that, The first insulating layer comprises organic materials.

5. The drive backplane according to claim 1, characterized in that, The surface of the insulating support layer facing away from the substrate is planar.

6. The drive backplane according to claim 1, characterized in that, The insulating support layer includes reflective and / or light-absorbing materials.

7. A display panel, characterized in that, Includes the drive backplate as described in any one of claims 1-6; It also includes a micro light-emitting diode chip, which is located on the surface of the second connection electrode away from the substrate.

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