Vibrating device and device comprising the vibrating device

Abstract

Vibration device and device including the same. A vibration device includes a vibration plate, a vibration generator located at the vibration plate and including a vibration structure, and a connecting member located between the vibration plate and the vibration generator. The connecting member includes a first connecting member located between the vibration plate and the vibration structure and overlapping the vibration structure, and a second connecting member surrounding the first connecting member. A modulus of the first connecting member is greater than a modulus of the second connecting member.

Description

Vibrating equipment and equipment including the vibrating equipment

[0001] Cross-references to related applications

[0002] This application claims the benefit and priority of Korean Patent Application No. 10-2021-0086155, filed on June 30, 2021, the entire contents of which are incorporated herein by reference for all purposes, as if fully set forth herein. Technical Field

[0003] This disclosure relates to a device, and more specifically, for example but not limited to, to a vibration device and an apparatus including the vibration device, and more specifically, to a vibration device having flexible and enhanced acoustic characteristics and / or sound pressure level characteristics and an apparatus including the vibration device. Background Technology

[0004] Vibration devices can be based on types such as coil type, which includes magnets and coils, or piezoelectric type, which uses piezoelectric devices to vibrate and output sound.

[0005] Piezoelectric vibratory devices are susceptible to damage from external impacts due to the fragility of the piezoelectric element, leading to low reliability in sound reproduction. Furthermore, because of the low piezoelectric constant, piezoelectric vibratory devices have the disadvantage that their sound pressure level (SPL) is lower than that of coil vibratory devices in the low-pitched audio band. An additional disadvantage of piezoelectric vibratory devices is that the SPL flatness, defined as the difference between the highest and lowest SPL, is high in the reproduction frequency band.

[0006] The descriptions provided in the background section should not be considered prior art simply because they are mentioned in or associated with the background section. The background section may include information describing one or more aspects of the subject matter art. Summary of the Invention

[0007] Therefore, the inventors have recognized the aforementioned problems and conducted various experiments to achieve a flexible vibrating device, as well as various other experiments to achieve a vibrating device with flexible and enhanced sound characteristics and / or sound pressure level characteristics. The inventors have thus invented a novel flexible vibrating device, and a vibrating device with flexible and enhanced sound characteristics and / or sound pressure level characteristics.

[0008] One or more aspects of this disclosure are intended to provide a flexible vibration device and an apparatus including the vibration device.

[0009] One or more aspects of this disclosure are intended to provide a vibration device having flexible and enhanced acoustic characteristics and / or sound pressure level characteristics, and devices including the vibration device.

[0010] Additional features and aspects of this disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practicing the inventive concepts provided herein. Other features and aspects of the inventive concept may be realized and obtained through the structures pointed out or derived therefrom in this disclosure, the claims thereof, and the accompanying drawings.

[0011] To achieve these and other aspects of this disclosure, as embodied and broadly described herein, in one or more aspects, a vibration device may include: a vibrating plate, a vibration generator located at the vibrating plate, and a connecting member located between the vibrating plate and the vibration generator. The vibration generator may include a vibration structure. The connecting member includes a first connecting member located between the vibrating plate and the vibration structure, and the first connecting member overlaps with the vibration structure. The connecting member also includes a second connecting member surrounding the first connecting member. The modulus of the first connecting member is greater than the modulus of the second connecting member.

[0012] In one or more aspects of this disclosure, a vibration device may include: a vibrating plate, a vibration generator located on the vibrating plate, and a connecting member located between the vibrating plate and the vibration generator. The connecting member may be made of metallic material.

[0013] In one or more aspects of this disclosure, a vibration device may include: a vibrating plate, a vibration generator configured to vibrate the vibrating plate, and a connecting member located between the vibrating plate and the vibration generator. The vibration generator may include a vibrating structure, a first electrode portion located on a first surface of the vibrating structure, and a second electrode portion located on a second surface of the vibrating structure opposite to the first surface. Each of the first and second electrode portions comprises silver and glass frit.

[0014] In one or more aspects of this disclosure, an apparatus is provided that may include a vibrating member and one or more vibration generating devices connected to the vibrating member. The one or more vibration generating devices may include the aforementioned vibrating devices.

[0015] A vibration device according to one or more embodiments of the present disclosure can vibrate a vibrating plate to generate sound, and can output sound with enhanced sound pressure level characteristics in the forward direction of the vibrating plate.

[0016] In the apparatus according to one or more embodiments of the present disclosure, the mid-tone, low-tone, and / or mid-low-tone characteristics of the sound generated by the increase in amplitude displacement of the diaphragm can be enhanced.

[0017] In a vibration device according to one or more embodiments of the present disclosure, the characteristics of the mid-tone, low-tone, and / or mid-low-tone sound bands generated based on the displacement of the vibrating plate can be enhanced.

[0018] Other systems, methods, features, and advantages will be or will become apparent to those skilled in the art upon examination of the following drawings and detailed description. All such additional systems, methods, features, and advantages are intended to be included within this specification, falling within the scope of this disclosure, and protected by the appended claims. Nothing in this section should be construed as limiting these claims. Further aspects and advantages are discussed below in conjunction with embodiments of this disclosure.

[0019] It will be understood that the foregoing general description and the following detailed description of this disclosure are exemplary and explanatory, and are intended to provide further explanation of the claimed disclosure.

[0020] Appendix 1. A vibration device, comprising:

[0021] Vibrating plate;

[0022] A vibration generator, located on the vibrating plate, the vibration generator comprising a vibration structure; and

[0023] A connecting member located between the vibrating plate and the vibration generator.

[0024] The connecting component includes:

[0025] A first connecting member is located between the vibrating plate and the vibrating structure, and the first connecting member overlaps with the vibrating structure; and

[0026] A second connecting member surrounds the first connecting member, and

[0027] The modulus of the first connecting member is greater than that of the second connecting member.

[0028] Note 2. The vibration device according to Note 1, wherein the connecting member comprises a metallic material.

[0029] Appendix 3. The vibration device according to Appendix 1, wherein the vibration structure comprises:

[0030] A first electrode portion, the first electrode portion being located at a first surface of the vibrating structure; and

[0031] The second electrode portion is located on the second surface of the vibrating structure opposite to the first surface, and

[0032] Each of the first electrode portion and the second electrode portion comprises silver and glass frit.

[0033] Note 4. The vibration device according to Note 3 further includes:

[0034] A signal cable electrically connected to the vibrating structure; and

[0035] A signal generation circuit is mounted on the signal cable.

[0036] Note 5. The vibration device according to Note 4, wherein the vibration generator further includes:

[0037] A first cover member, the first cover member covering the first electrode portion; and

[0038] The second cover member covers the second electrode portion, and

[0039] The signal cable includes:

[0040] A first conductive wire, the first conductive wire being located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and

[0041] The second conductor is located between the second cover member and the second electrode portion and is electrically connected to the second electrode portion.

[0042] Note 6. The vibration device according to Note 5, wherein the first cover member and the second cover member are connected or coupled to a surface of the vibrating plate by the connecting member.

[0043] Note 7. The vibration device according to Note 4, wherein the vibration structure further includes:

[0044] A first vibrating structure having a first piezoelectric coefficient;

[0045] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0046] The connecting part is located between the first vibration structure and the second vibration structure.

[0047] Appendix 8. The vibration device according to Appendix 3, wherein the vibration structure further includes:

[0048] A first vibrating structure having a first piezoelectric coefficient;

[0049] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0050] The connecting part is located between the first vibration structure and the second vibration structure.

[0051] Note 9. The vibration device according to Note 3, wherein the vibration structure further includes:

[0052] The vibrating portion is located between the first electrode portion and the second electrode portion.

[0053] Note 10. The vibration device according to Note 1 further includes:

[0054] A signal cable electrically connected to the vibrating structure; and

[0055] A signal generation circuit is mounted on the signal cable.

[0056] Note 11. The vibration device according to Note 10, wherein the vibration structure further includes:

[0057] A first electrode portion, which is located at a first surface of the vibrating structure;

[0058] The second electrode portion is located on the second surface of the vibration structure opposite to the first surface;

[0059] A first cover member, the first cover member covering the first electrode portion; and

[0060] The second cover member covers the second electrode portion, and

[0061] The signal cable includes:

[0062] A first conductive wire, the first conductive wire being located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and

[0063] The second conductor is located between the second cover member and the second electrode portion and is electrically connected to the second electrode portion.

[0064] Note 12. The vibration device according to Note 11, wherein the vibration structure further includes:

[0065] A first vibrating structure having a first piezoelectric coefficient;

[0066] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0067] The connecting part is located between the first vibration structure and the second vibration structure.

[0068] Note 13. The vibration device according to Note 1, wherein the vibration structure further includes:

[0069] A first vibrating structure having a first piezoelectric coefficient;

[0070] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0071] The connecting part is located between the first vibration structure and the second vibration structure.

[0072] Appendix 14. The vibration device according to Appendix 1, wherein the vibration generator further comprises:

[0073] A first adhesive layer, the first adhesive layer being located between the vibrating structure and the first cover member; and

[0074] A second adhesive layer is located between the vibrating structure and the second cover member.

[0075] Appendix 15. A vibration device, the vibration device comprising:

[0076] Vibrating plate;

[0077] A vibration generator located at the vibrating plate; and

[0078] A connecting member located between the vibrating plate and the vibration generator.

[0079] The connecting component comprises a metallic material.

[0080] Note 16. The vibration device according to Note 15, wherein the vibration generator comprises:

[0081] Vibrating structure;

[0082] A first electrode portion, the first electrode portion being located on a first surface of the vibrating structure; and

[0083] The second electrode portion is located on the second surface of the vibrating structure opposite to the first surface, and

[0084] Each of the first electrode portion and the second electrode portion comprises silver and glass frit.

[0085] Note 17. The vibration device according to Note 16 further includes:

[0086] A signal cable electrically connected to the vibrating structure; and

[0087] A signal generation circuit is mounted on the signal cable.

[0088] Note 18. The vibration device according to Note 17, wherein the vibration structure further includes:

[0089] A first cover member, the first cover member covering the first electrode portion; and

[0090] The second cover member covers the second electrode portion, and

[0091] The signal cable includes:

[0092] A first conductive wire, the first conductive wire being located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and

[0093] The second conductor is located between the second cover member and the second electrode portion and is electrically connected to the second electrode portion.

[0094] Note 19. The vibration device according to Note 17, wherein the vibration structure further includes:

[0095] A first vibrating structure having a first piezoelectric coefficient;

[0096] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0097] The connecting part is located between the first vibration structure and the second vibration structure.

[0098] Note 20. The vibration device according to Note 16, wherein the vibration structure further includes:

[0099] A first vibrating structure having a first piezoelectric coefficient;

[0100] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0101] The connecting part is located between the first vibration structure and the second vibration structure.

[0102] Note 21. The vibration device according to Note 15 further includes:

[0103] A signal cable electrically connected to the vibration generator; and

[0104] A signal generation circuit is mounted on the signal cable.

[0105] Note 22. The vibration device according to Note 21, wherein the vibration generator includes a vibration structure.

[0106] The vibration structure further includes:

[0107] A first electrode portion, which is located at a first surface of the vibrating structure;

[0108] The second electrode portion is located on the second surface of the vibration structure opposite to the first surface;

[0109] A first cover member, the first cover member covering the first electrode portion; and

[0110] The second cover member covers the second electrode portion, and

[0111] The signal cable includes:

[0112] A first conductive wire, the first conductive wire being located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and

[0113] The second conductor is located between the second cover member and the second electrode portion and is electrically connected to the second electrode portion.

[0114] Note 23. The vibration device according to Note 22, wherein the vibration structure further includes:

[0115] A first vibrating structure having a first piezoelectric coefficient;

[0116] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0117] The connecting part is located between the first vibration structure and the second vibration structure.

[0118] Appendix 24. A vibrating device, the vibrating device comprising:

[0119] Vibrating plate;

[0120] A vibration generator configured to vibrate the vibrating plate; and

[0121] A connecting member located between the vibrating plate and the vibration generator.

[0122] The vibration generator includes:

[0123] Vibrating structure;

[0124] A first electrode portion, the first electrode portion being located on a first surface of the vibrating structure; and

[0125] The second electrode portion is located on the second surface of the vibrating structure opposite to the first surface, and

[0126] Each of the first electrode portion and the second electrode portion comprises silver and glass frit.

[0127] Note 25. The vibration device according to Note 24 further includes:

[0128] A signal cable electrically connected to the vibrating structure; and

[0129] A signal generation circuit is mounted on the signal cable.

[0130] Note 26. The vibration device according to Note 25, wherein the vibration structure further includes:

[0131] A first cover member, the first cover member covering the first electrode portion; and

[0132] The second cover member covers the second electrode portion, and

[0133] The signal cable includes:

[0134] A first conductive wire, the first conductive wire being located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and

[0135] The second conductor is located between the second cover member and the second electrode portion and is electrically connected to the second electrode portion.

[0136] Note 27. The vibration device according to Note 25, wherein the vibration structure further includes:

[0137] A first vibrating structure having a first piezoelectric coefficient;

[0138] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0139] The connecting part is located between the first vibration structure and the second vibration structure.

[0140] Note 28. The vibration device according to Note 24, wherein the vibration structure further includes:

[0141] A first vibrating structure having a first piezoelectric coefficient;

[0142] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0143] The connecting part is located between the first vibration structure and the second vibration structure.

[0144] Note 29. The vibrating device according to Note 24, wherein in each of the first electrode portion and the second electrode portion, the area occupied by silver is 70% to 90%.

[0145] Note 30. The vibration device according to Note 24, wherein the thickness of each of the first electrode portion and the second electrode portion is 1 μm to 3 μm.

[0146] Note 31. The vibrating device according to Note 24, wherein in each of the first electrode portion and the second electrode portion, the silver comprises 80 to 90 parts by weight, and the glass frit comprises 10 to 20 parts by weight.

[0147] Appendix 32. A vibration device, comprising:

[0148] Vibrating plate;

[0149] A vibration generator that causes the vibrating plate to vibrate; and

[0150] A connecting member located between the vibrating plate and the vibration generator.

[0151] The vibration generator includes:

[0152] Vibrating structure;

[0153] A first electrode portion, which is located on the first surface of the vibrating structure;

[0154] The second electrode portion is located on the second surface of the vibration structure opposite to the first surface;

[0155] A signal cable electrically connected to the vibrating structure; and

[0156] A signal generation circuit is mounted on the signal cable.

[0157] Note 33. The vibration device according to Note 32, wherein the vibration structure further includes:

[0158] A first cover member, the first cover member covering the first electrode portion; and

[0159] The second cover member covers the second electrode portion, and

[0160] The signal cable includes:

[0161] A first conductive wire, the first conductive wire being located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and

[0162] The second conductor is located between the second cover member and the second electrode portion and is electrically connected to the second electrode portion.

[0163] Note 34. The vibration device according to Note 32, wherein the vibration structure further includes:

[0164] A first vibrating structure having a first piezoelectric coefficient;

[0165] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0166] The connecting part is located between the first vibration structure and the second vibration structure.

[0167] Appendix 35. A vibration device, comprising:

[0168] Vibrating plate;

[0169] A vibration generator located at the vibrating plate; and

[0170] A connecting member located between the vibrating plate and the vibration generator.

[0171] The vibration generator includes:

[0172] A first vibrating structure having a first piezoelectric coefficient;

[0173] A second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and

[0174] The connecting part is located between the first vibration structure and the second vibration structure.

[0175] Note 36. The vibration device according to Note 35, wherein the first piezoelectric coefficient is greater than the second piezoelectric coefficient.

[0176] Note 37. An apparatus comprising:

[0177] Vibrating components; and

[0178] One or more vibration generating devices are connected to the vibrating component.

[0179] The one or more vibration generating devices include the vibration devices described in any one of Appendices 1 to 36.

[0180] Note 38. The device according to Note 37, wherein:

[0181] The vibrating component is configured to output sound based on the vibrations of the one or more vibration generating devices, and

[0182] The vibrating component includes one or more materials selected from metal, non-metal, plastic, fiber, leather, wood, cloth, paper, and glass.

[0183] Note 39. The device according to Note 37, wherein the vibrating component comprises one of the following: a display panel comprising a plurality of pixels configured to display an image, a screen panel projecting an image from a display device thereto, a lighting panel, a sign panel, an interior part of a vehicle, an exterior part of a vehicle, a vehicle window, an interior ceiling of a building, and a window of a building. Attached Figure Description

[0184] The accompanying drawings are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this application. The drawings illustrate aspects and embodiments of this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0185] Figure 1 illustrates a vibration device according to an exemplary embodiment of the present disclosure.

[0186] Figure 2 is a perspective view of a vibration device according to an exemplary embodiment of the present disclosure.

[0187] Figure 3A illustrates the damping characteristics of the first connecting member, Figure 3B illustrates the damping characteristics of the second connecting member, and Figure 3C illustrates the damping characteristics after the second connecting member is stacked.

[0188] Figure 4 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0189] Figure 5 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0190] Figures 6A to 10F illustrate scanning electron microscope (SEM) images of the surface of an electrode portion according to one or more exemplary embodiments of the present disclosure, and illustrate examples of SEM images of the cross-sectional surface of the boundary between the electrode portion and the vibrating structure.

[0191] Figure 11 is an electron microscope photograph of the cross-sectional surface of the boundary between the electrode portion and the vibrating structure according to Experimental Example 1.

[0192] Figure 12A illustrates an example of a scanning electron microscope image of the surface of the electrode portion according to Experimental Example 2, and Figure 12B illustrates an example of a scanning electron microscope image of the cross-sectional surface of the boundary between the electrode portion and the vibrating structure.

[0193] Figure 13 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0194] Figure 14 is a plan view of a vibration generator according to an exemplary embodiment of the present disclosure.

[0195] Figure 15 is a cross-sectional view taken along line II′ shown in Figure 14.

[0196] Figure 16 illustrates a vibration generator according to another exemplary embodiment of the present disclosure.

[0197] Figure 17 is a cross-sectional view taken along line II-II′ shown in Figure 16.

[0198] Figure 18 is a side view of the cross-sectional surface taken along line III-III′ shown in Figure 16.

[0199] Figure 19 is a perspective view illustrating the piezoelectric vibration component shown in Figure 18.

[0200] Figures 20A to 20D are perspective views illustrating the piezoelectric vibration portion of a vibration device according to another exemplary embodiment of the present disclosure.

[0201] Figure 21 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0202] Figure 22 is a cross-sectional view taken along line IV-IV′ shown in Figure 21.

[0203] Figure 23 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0204] Figure 24 illustrates a device according to another exemplary embodiment of the present disclosure.

[0205] Figure 25 illustrates an example of the main cable and the first signal cable to the nth signal cable shown in Figure 24.

[0206] Figure 26 is an example of a waveform diagram showing the output signal of the audio data generation circuit section shown in Figure 23.

[0207] Figure 27 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0208] Figure 28 illustrates an example of the vibration generator of Figure 27.

[0209] Figure 29 illustrates a vibration drive circuit according to an exemplary embodiment of the present disclosure.

[0210] Figure 30 illustrates the displacement of a vibration generator according to an exemplary embodiment of the present disclosure.

[0211] Figures 31A and 31B are cross-sectional views of a vibration device according to another exemplary embodiment of the present disclosure.

[0212] Figure 32 illustrates a vibration generator according to another exemplary embodiment of the present disclosure.

[0213] Figure 33 illustrates an example of the vibrating structure shown in Figure 32.

[0214] Figure 34 is an example of a cross-sectional view taken along line VV′ shown in Figure 32.

[0215] Figure 35 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0216] Figure 36 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0217] Figure 37 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0218] Figure 38 is an example of a cross-sectional view taken along line VI-VI′ shown in Figure 37.

[0219] Figure 39 illustrates an apparatus according to an example embodiment of the present disclosure.

[0220] Figure 40 is an example of a cross-sectional view taken along line VII-VII′ shown in Figure 39.

[0221] Figures 41 and 42 illustrate examples of vibration equipment connected to or attached to a display panel in the device of Figure 40.

[0222] Figure 43 is an example of another cross-sectional view taken along line VII-VII′ shown in Figure 39.

[0223] Figure 44 illustrates an example of a vibration device connected to a display panel in the device of Figure 43.

[0224] Figure 45 is an example of another cross-sectional view taken along line VII-VII′ shown in Figure 39.

[0225] Figure 46 illustrates an example of a vibration device connected to a display panel in the device of Figure 45.

[0226] Figure 47 illustrates a device according to another exemplary embodiment of the present disclosure.

[0227] Figure 48 is an example of a cross-sectional view taken along line VIII-VIII′ shown in Figure 47.

[0228] Throughout the accompanying drawings and detailed description, unless otherwise described, the same reference numerals shall be understood to refer to the same elements, features, and structures. For clarity, illustrative purposes, and convenience, the relative dimensions and drawings of these elements may be exaggerated. Detailed Implementation

[0229] Embodiments of this disclosure will now be described in detail with reference to the accompanying drawings, examples of which may be illustrated. In the following description, detailed descriptions of well-known functions or structures may be omitted where such obscuration would unnecessarily obscure aspects of this disclosure. The described progression of processing steps and / or operations is exemplary; however, the order of steps and / or operations is not limited to the order set forth herein and may be varied as is known in the art, except that they must occur in a specific order. Unless otherwise stated, similar reference numerals always refer to similar elements. The names of the various elements used in the following description are chosen solely for ease of writing and may therefore differ from those used in actual products.

[0230] The advantages and features of this disclosure, and its implementation methods, will be illustrated by the following description of embodiments with reference to the accompanying drawings. However, this disclosure may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make this disclosure thorough and complete, and to fully convey the scope of this disclosure to those skilled in the art. Furthermore, this disclosure is defined only by the claims and their equivalents.

[0231] The shapes, dimensions, areas, proportions, angles, quantities, etc., disclosed in the accompanying drawings for the purpose of describing embodiments of this disclosure are merely examples, and therefore, this disclosure is not limited to the details shown. Similar reference numerals always refer to similar elements. In the following description, detailed descriptions of related known functions or structures will be omitted where it is determined that they unnecessarily obscure aspects of this disclosure. When terms such as “comprising,” “having,” “including,” “containing,” “constituting,” “made of,” “formed from,” etc., are used, one or more other elements may be added unless terms such as “only” are used. Singular terms may include plural forms unless the context clearly indicates otherwise. Any implementation described herein as “example” is not necessarily to be construed as superior to or better than other embodiments.

[0232] When interpreting a component, it is interpreted as including such an error or tolerance range, even if no explicit description of the error or tolerance range is provided.

[0233] When describing positional relationships, for example, when using terms such as "above," "over," "below," "on top," "below," "under," "near," "close to," "adjacent," "side," "next," etc., to describe the positional relationship between two parts, one or more other parts may be located between these two parts, unless more restrictive terms such as "immediately following," "directly," or "closely" are used. For example, when a structure is described as being "above," "below," "over," "below," "below," "near," "side," or "next" to another structure, or "close to" or "adjacent" to another structure, the description should be interpreted to include situations where the structures are in contact with each other and situations where one or more additional structures are located or situated between them. Furthermore, the terms "front," "back," "left," "right," "top," "bottom," "downward," "upward," "above," "below," etc., refer to any frame of reference.

[0234] When describing temporal relationships, such as when time sequence is described as “after,” “following,” “next,” “before,” “prior to,” etc., discontinuous situations may be included unless more restrictive terms such as “just,” “immediately,” or “directly” are used.

[0235] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be a second element, and similarly, a second element may be a first element.

[0236] In describing the elements of this disclosure, the terms “first,” “second,” “A,” “B,” “(a),” “(b),” etc., may be used. These terms are intended to identify the corresponding element from other elements, and the basis, order, or number of the corresponding elements shall not be limited by these terms.

[0237] Unless otherwise stated, when describing an element or layer as “connected,” “joined,” or “adhered” to another element or layer, the element or layer may not only be directly connected, joined, or adhered to another element or layer, but may also be indirectly connected, joined, or adhered to another element or layer, and one or more intervening elements or layers may be disposed or situated between these elements or layers.

[0238] Unless otherwise stated, descriptions of a component or layer "contacting" or "overlapping" with another component or layer mean that the component or layer may not only directly contact or overlap with another component or layer, but also indirectly contact or overlap with another component or layer, and one or more intervening components or layers may be disposed or located between these components or layers.

[0239] The term "at least one" should be understood to include any combination of one or more of the associated listed items. For example, "at least one of the first, second, and third items" means a combination of two or more items proposed from the first, second, and third items, as well as an item consisting of only one of the first, second, or third items.

[0240] The expressions "first element," "second element," and " / or" "third element" should be understood as one of the first element, the second element, and the third element, or any combination thereof. For example, A, B, and / or C could refer to only A; only B; only C; any or some combination of A, B, and C; or all of A, B, and C.

[0241] Features of the various embodiments of this disclosure can be linked or combined with each other in part or in whole, and can interoperate, link or drive each other in various ways. Embodiments of this disclosure can be implemented independently of each other, or can be implemented together in a dependent or related relationship.

[0242] The term "display device" as used herein is used to encompass not only display panels in the narrow sense, such as liquid crystal modules (LCMs) or organic light-emitting diode (OLED) modules that include a display panel and a driving section for driving the display panel, but also complete electronic devices or assemblies, such as laptops, TVs, computer monitors, equipment displays (such as display devices for automotive displays or other types of in-vehicle displays), or mobile electronic devices (e.g., smartphones or tablets) as complete products or end products including LCMs, OLED modules, etc.

[0243] In other words, the term "display device" as used here is used to mean not only the display device itself, such as an LCM or OLED module in the narrow sense, but also the so-called "set device" as an application product or end-consumer device in which a display device is implemented.

[0244] Furthermore, according to some exemplary embodiments of this disclosure, LCM and OLED modules, which consist of a display panel and its driving unit, can be referred to as a "display device," while electronic devices comprising the final product of LCM and OLED modules can be referred to differently as "equipment sets" or "assemblies." For example, a display device may include a liquid crystal display (LCD) panel or an organic light-emitting diode (OLED) display panel and a source printed circuit board (PCB) serving as a controller for driving them. An assembly may also include an assembly of PCBs, which is a set of controllers electrically connected to the source PCB and controlling the overall operation of the assembly or the complete set of equipment.

[0245] The display panel used in the various embodiments of this disclosure can be any type of display panel, such as a liquid crystal display panel, an organic light-emitting display panel, an electroluminescent display panel, etc., but is not limited to these types. For example, the display panel of this disclosure can be any panel capable of generating sound based on the vibration of the sound generating device. Furthermore, the display panel used in the exemplary embodiments of this disclosure is not limited in shape or size.

[0246] In one or more examples, the liquid crystal display panel may include multiple gate lines, multiple data lines, and multiple pixels disposed at various intersections of the gate lines and data lines. Furthermore, the liquid crystal display panel may include: an array substrate including thin-film transistors corresponding to switching devices for controlling the transmittance of each pixel; an upper substrate including a color filter and / or a black matrix; and a liquid crystal layer formed between the array substrate and the upper substrate.

[0247] In one or more examples, an organic light-emitting display panel may include multiple gate lines, multiple data lines, and multiple pixels disposed at various intersections of the gate lines and data lines. Furthermore, the organic light-emitting display panel may include: an array substrate including thin-film transistors corresponding to means for selectively applying voltage to each pixel; an organic light-emitting device layer disposed on the array substrate; and an encapsulation substrate disposed on the array substrate to cover the organic light-emitting device layer. The encapsulation substrate protects the thin-film transistors and the organic light-emitting device layer from external impacts and prevents moisture or oxygen from penetrating into the organic light-emitting device layer. Alternatively, the organic light-emitting device layer disposed on the array substrate may be replaced with an inorganic light-emitting layer, such as a nanomaterial layer or a quantum dot material layer.

[0248] The display panel may also include a backing, such as a metal plate, attached to the rear surface of the display panel. It may include one or more structures containing different materials.

[0249] A display panel including a sound generation apparatus according to one or more exemplary embodiments of the present disclosure can be implemented in a vehicle's user interface module (such as the central control panel area of ​​a car). For example, such a display panel can be configured between two front-seat passengers, such that sound caused by vibrations of the display panel propagates into the vehicle. Thus, the in-vehicle audio experience can be improved compared to having speakers only inside the vehicle.

[0250] Features of the various embodiments of this disclosure may be partially or entirely linked or combined with each other, and may interoperate, link, or drive each other in various ways, as will be readily understood by those skilled in the art. Embodiments of this disclosure may be implemented independently of each other, or may be implemented together in a dependent or related relationship. In one or more aspects, components of each device according to the various embodiments of this disclosure are operatively linked and constructed.

[0251] In the following, an apparatus, a vibration device, and a vehicle including the apparatus according to exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. When adding reference numerals to elements in each drawing, although the same elements may be illustrated in other drawings, similar reference numerals may refer to similar elements. Furthermore, for ease of description, the scale, size, and thickness of each element illustrated in the drawings may differ from the actual scale, size, and thickness; therefore, embodiments of the present disclosure are not limited to the scale, size, and thickness shown in the drawings.

[0252] Figure 1 illustrates a vibration device 1 according to an exemplary embodiment of the present disclosure, and Figure 2 is a perspective view of a vibration device according to an exemplary embodiment of the present disclosure.

[0253] Referring to Figures 1 and 2, a vibration device 1 according to an exemplary embodiment of the present disclosure may include a vibrating plate 10, a vibration generator 20 disposed on the vibrating plate 10 and including a vibration structure 21, and a connecting member 15 located between the vibrating plate 10 and the vibration generator 20. The connecting member 15 may include a first connecting member 15a disposed between the vibrating plate 10 and the vibration structure 21 to overlap with the vibration structure 21, and a second connecting member 15b disposed around the first connecting member 15a. The first connecting member 15a may have a modulus greater than that of the second connecting member 15b.

[0254] The vibration generator 20 can contract or expand in the driving direction (or displacement direction) based on the vibration driving signal applied to it to generate displacement (or bending force) or amplitude displacement. Therefore, the vibration generator 20 can increase (or maximize) the displacement (or bending force) or amplitude displacement of the vibrating plate 10, thereby enhancing the acoustic characteristics and sound pressure level characteristics of the sound generated based on the vibration of the vibrating plate 10. For example, the vibration generator 20 can be referred to as a vibrating structure, vibrator, vibration generating device, vibration apparatus, vibration generator, sound source, sound device, sound generating apparatus, or sound generator, but the terminology is not limited thereto.

[0255] The vibration generator 20 according to an exemplary embodiment of this disclosure may include a piezoelectric material (or electroactive material) having piezoelectric properties. Based on the vibration (or displacement or drive) of the piezoelectric material according to an electrical signal (or voice signal) applied to the piezoelectric material, the vibration generator 20 may vibrate (or displace or drive) autonomously or vibrate (or displace) a vibrating member (or vibrating plate or vibrating object). For example, the vibration generator 20 may vibrate (or displace or drive) by alternately and repeatedly contracting and expanding based on the piezoelectric effect (or piezoelectric properties). For example, the vibration generator 20 may vibrate (or displace) in the vertical direction (or thickness direction) Z by alternately and repeatedly contracting and expanding based on the inverse piezoelectric effect. The vibration generator 20 according to an exemplary embodiment of this disclosure may be a piezoelectric vibration device. For example, the vibration generator 20 according to the exemplary embodiments of this disclosure may be referred to by terms such as piezoelectric vibration structure, piezoelectric vibrator, piezoelectric vibration generating device, piezoelectric vibration generator, piezoelectric sound generator, piezoelectric sound device, piezoelectric sound generating device, piezoelectric sound generator, piezoelectric actuator, piezoelectric exciter, or piezoelectric transducer, but the terminology is not limited thereto.

[0256] The vibration generator 20 according to an exemplary embodiment of the present disclosure can be configured to be flexible. For example, the vibration generator 20 can be configured to be bent into a non-planar shape including curved surfaces. Therefore, the vibration generator 20 according to an exemplary embodiment of the present disclosure can be referred to as a flexible vibration structure, flexible vibrator, flexible vibration generating device, flexible vibration generator, flexible sound generator, flexible sound device, flexible sound generating device, flexible sound generator, flexible actuator, flexible exciter, or flexible transducer, but the terminology is not limited thereto.

[0257] The diaphragm 10 may include a plate structure with a constant thickness. For example, the diaphragm 10 may be referred to by terms such as vibrating member, vibrating object, sound output member, vibrating panel, or sound output panel, but embodiments of this disclosure are not limited thereto.

[0258] The diaphragm 10 may comprise a non-metallic material (or a non-metallic composite material) or a metallic material having material properties suitable for outputting sound based on vibration. The metallic material of the diaphragm 10 according to an example embodiment may include one or more of stainless steel, aluminum (Al), aluminum (Al) alloys, magnesium (Mg), magnesium (Mg) alloys, and magnesium-lithium (Mg-Li) alloys, but embodiments of this disclosure are not limited thereto. The non-metallic material (or non-metallic composite material) of the diaphragm 10 may include one or more of glass, plastic, fiber, leather, wood, cloth, and paper, but embodiments of this disclosure are not limited thereto.

[0259] The vibrating structure 21 may include a piezoelectric material (or piezoelectric device) having piezoelectric properties (or piezoelectric effect). For example, a piezoelectric material may have the following properties: when pressure or torsion is applied to a crystal structure by an external force, a potential difference is generated due to dielectric polarization caused by the change in the relative positions of positive (+) ions and negative (-) ions, and vibration is generated by an electric field based on the voltage applied thereto.

[0260] The vibration structure 21 according to an exemplary embodiment of the present disclosure may include: a vibration portion 21a including a piezoelectric material, a first electrode portion 21b disposed on a first surface of the vibration portion 21a, and a second electrode portion 21c disposed on a second surface of the vibration portion 21a that is opposite to or different from the first surface.

[0261] The vibrating portion 21a may include a piezoelectric material. The vibrating portion 21a may be referred to by terms such as vibrating layer, piezoelectric layer, piezoelectric material layer, electroactive material, piezoelectric vibrating part, piezoelectric material portion, electroactive portion, inorganic material layer, inorganic material portion, etc., but the embodiments of this disclosure are not limited thereto.

[0262] The vibrating part 21a may include a transparent piezoelectric material, a semi-transparent piezoelectric material, or an opaque piezoelectric material, and therefore the vibrating part 21a may be transparent, semi-transparent, or opaque.

[0263] The vibrating portion 21a can be formed from a ceramic matrix material used to generate relatively high vibrations, or it can be formed from a piezoelectric ceramic having a perovskite crystal structure. The perovskite crystal structure can exhibit both piezoelectric and inverse piezoelectric effects, and can be an oriented plate-like structure. The perovskite crystal structure can be represented by the chemical formula "ABO3". Here, A can include a divalent metal element, and B can include a tetravalent metal element. For example, in the chemical formula "ABO3", A and B can be cations, and O can be an anion. For example, the chemical formula "ABO3" can include one of PbTiO3, PbZrO3, BaTiO3, and SrTiO3, but the embodiments of this disclosure are not limited thereto.

[0264] The vibration portion 21a according to the exemplary embodiments of this disclosure may include one or more of lead (Pb), zirconium (Zr), titanium (Ti), zinc (Zn), nickel (Ni) and niobium (Nb), but the embodiments of this disclosure are not limited thereto.

[0265] As another example, the vibrating part 21a may include a lead zirconate titanate (PZT) based material containing lead (Pb), zirconium (Zr), and titanium (Ti), or it may include a nickel zirconate niobate (PZNN) based material containing lead (Pb), zinc (Zn), nickel (Ni), and niobium (Nb), but the embodiments of this disclosure are not limited thereto. Furthermore, the vibrating part 21a may include at least one of CaTiO3, BaTiO3, and SrTiO3 that does not contain lead (Pb), but the embodiments of this disclosure are not limited thereto.

[0266] As another example, the vibrating part 21a can have a piezoelectric deformation modulus d of more than 1000 pC / N in its thickness direction Z. 33 The vibrating part 21a can have a high voltage deformation modulus d. 33 Therefore, it can be applied to large-size display panels to provide a vibration device 1 with sufficient vibrational or piezoelectric characteristics. For example, the vibration part 21a may include a PZT-based material (PbZrTiO3) as the main component, and may include, for example, a softening dopant material (Pb) doped at the A site and a relaxor ferroelectric material (ZrTi) doped at the B site.

[0267] The softener dopant material can enhance the piezoelectric and dielectric properties of the vibrating part 21a. For example, the softener dopant material can increase the piezoelectric deformation modulus d of the vibrating part 21a. 33 If the softening agent dopant material includes monovalent elements, the piezoelectric and dielectric properties can be reduced. For example, if the softening agent dopant material includes potassium (K) and rubidium (Rb), the piezoelectric and dielectric properties can be reduced. Therefore, the inventors have discovered through various experiments that the softening agent dopant material can include divalent and trivalent elements to enhance the piezoelectric and dielectric properties. The softening agent dopant material according to the exemplary embodiments of this disclosure can include divalent and trivalent elements. Quasi-isomorphic phase boundaries (MPBs) can be formed by adding the softening agent dopant material to a PZT-based material (PbZrTiO3). Therefore, the piezoelectric and dielectric properties can be enhanced. For example, the softening agent dopant material can include strontium (Sr), barium (Ba), lanthanum (La), neodymium (Nd), calcium (Ca), yttrium (Y), erbium (Er), or ytterbium (Yb). For example, softener dopant ions (Sr) doped into PZT-based materials (PbZrTiO3) 2+ Ba 2+ La 2+ 、Nd3 + Ca 2+ Y 3+ Er 3+ or Yb 3+ This substance can replace a portion of the lead (Pb) in PZT-based materials (PbZrTiO3), and the substitution amount can be from about 2 mol% to about 20 mol%. For example, if the substitution amount is less than 2 mol% or greater than 20 mol%, the perovskite crystal structure may be destroyed. Therefore, the electromechanical coupling coefficient kP and the piezoelectric deformation modulus d can be reduced. 33 If the softener dopant material is replaced, a quasi-isomorphic phase boundary (MPB) can be formed, and high voltage and high dielectric properties can be achieved in the MPB, thereby realizing a vibration device with high voltage and high dielectric properties.

[0268] According to an exemplary embodiment of this disclosure, the relaxor ferroelectric material doped into a PZT-based material (PbZrTiO3) can enhance the electro-deformation properties of the vibrating portion 21a. The relaxor ferroelectric material according to an exemplary embodiment of this disclosure may include lead magnesium niobate (PMN)-based materials or nickel lead magnesium niobate (PNN)-based materials, but the embodiments of this disclosure are not limited thereto. The PMN-based material may include lead (Pb), magnesium (Mg), and niobium (Nb), and may be, for example, Pb(Mg,Nb)O3. For example, the relaxor ferroelectric material doped into the PZT-based material (PbZrTiO3) can replace a portion of each of zirconium (Zr) and titanium (Ti) in the PZT-based material (PbZrTiO3), with a substitution amount of about 5 mol% to about 25 mol%. For example, if the substitution amount is less than 5 mol% or greater than 25 mol%, the perovskite crystal structure may be destroyed. Therefore, the electromechanical coupling coefficient kP and the piezoelectric deformation modulus d can be reduced. 33 .

[0269] According to an exemplary embodiment of this disclosure, the vibration portion 21a may further include donor material doped into the B-site (ZrTi) of the PZT-based material (PbZrTiO3) to further improve the piezoelectric coefficient. For example, the donor material doped into the B-site (ZrTi) may include tetravalent to hexavalent elements. For example, the donor material doped into the B-site (ZrTi) may include tellurium (Te), germanium (Ge), uranium (U), bismuth (Bi), niobium (Nb), tantalum (Ta), antimony (Sb), or tungsten (W).

[0270] The vibrating part 21a can be represented by the following formula 1:

[0271] [Formula 1]

[0272] (Pb A-B C B (Mg) 1 / 3Nb 2 / 3 ) a (Ni 1 / 3 Nb 2 / 3 ) b Zr c Ti d O3

[0273] In Equation 1, C can be one of calcium (Ca), strontium (Sr), and barium (Ba). Furthermore, a + b + c + d = 1, 0.02 ≤ B ≤ 0.20, 0.80 ≤ AB ≤ 0.98, 0.05 ≤ a ≤ 0.25, 0.05 ≤ b ≤ 0.25, 0.10 ≤ c ≤ 0.50, and 0.10 ≤ d ≤ 0.50.

[0274] According to an exemplary embodiment of this disclosure, the vibrating portion 21a can have a piezoelectric deformation modulus of 1000 pC / N or more based on its thickness direction Z. 33 This allows for the creation of vibration devices with enhanced vibration characteristics. For example, vibration devices with enhanced vibration characteristics can be implemented in large-scale equipment.

[0275] The vibration portion 21a according to the exemplary embodiments of this disclosure may be configured to have a circular shape, an elliptical shape or a polygonal shape, but the embodiments of this disclosure are not limited thereto.

[0276] The first electrode portion 21b may be disposed on the first surface (or upper surface) of the vibrating portion 21a. For example, the first electrode portion 21b may be electrically connected to the first surface of the vibrating structure 21. For example, the first electrode portion 21b may have a common electrode (or single electrode or single-electrode) shape in which the first electrode portion 21b is disposed on the entire first surface of the vibrating structure 21. For example, the first electrode portion 21b may have the same shape as the vibrating portion 21a, but embodiments of this disclosure are not limited thereto. The first electrode portion 21b according to an exemplary embodiment may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, a transparent conductive material or a semi-transparent conductive material may include indium tin oxide (ITO) or indium zinc oxide (IZO), but embodiments of this disclosure are not limited thereto. An opaque conductive material may include aluminum (Al), copper (Cu), gold (Au), molybdenum (Mo), magnesium (Mg), or alloys thereof, but embodiments of this disclosure are not limited thereto.

[0277] The second electrode portion 21c may be disposed on a second surface (or rear surface) of the vibrating portion 21a that is opposite to or different from the first surface. For example, the second electrode portion 21c may have a single electrode (or common electrode) shape in which the second electrode portion 21c is disposed on the entire second surface of the vibrating portion 21a. For example, the second electrode portion 21c may have the same shape as the vibrating portion 21a, but embodiments of the present disclosure are not limited thereto. The second electrode portion 21c according to an exemplary embodiment may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the second electrode portion 21c may include the same material as the first electrode portion 21b, but embodiments of the present disclosure are not limited thereto. As another example, the second electrode portion 21c may include a material different from the material of the first electrode portion 21b.

[0278] The connecting member 15 can be disposed between the vibrating plate 10 and the vibration generator 20, and can connect or attach the vibration generator 20 to a surface of the vibrating plate 10. For example, the vibration generator 20 can be connected or attached to the front or rear surface of the vibrating plate 10 through the connecting member 15, and can be supported or disposed on the front or rear surface of the vibrating plate 10.

[0279] According to the exemplary embodiment, the connecting member 15 may include a material comprising an adhesive layer that has good adhesion or bonding force to each of the surfaces of the vibration generator 20 and the vibrating plate 10. For example, the connecting member 15 may include a foam pad, double-sided tape, or adhesive, but embodiments of this disclosure are not limited thereto. For example, the adhesive layer of the connecting member 15 may include epoxy resin, acrylic resin, silicone resin, or polyurethane, but is not limited thereto. For example, the adhesive layer of the connecting member 15 may include an acrylic-based material that has relatively greater adhesion and hardness than polyurethane-like materials. Therefore, the vibration of the vibration generator 20 can be well transmitted to the vibrating plate 10.

[0280] In the vibration generator 20, a first protective member 21e may be disposed on the first electrode portion 21b and can protect the first electrode portion 21b. A second protective member 21f may be disposed on the second electrode portion 21c and can protect the second electrode portion 21c. For example, each of the first protective member 21e and the second protective member 21f of the vibration generator 20 may include a plastic material, a fiber material, or a wood material, but embodiments of this disclosure are not limited thereto. For example, in the vibration generator 20, the first protective member 21e may include a material that is the same as or different from the material of the second protective member 21f. One or more of the first protective member 21e and the second protective member 21f of the vibration generator 20 may be connected or coupled to a surface of the vibrating plate 10 by a connecting member 15. For example, the first protective member and the second protective member may be referred to as a first cover member and a second cover member, respectively.

[0281] In the vibration generator 20, each of the first protective member 21e and the second protective member 21f may be a polyimide film or a polyethylene terephthalate film, but the embodiments of this disclosure are not limited thereto.

[0282] The vibration generator 20 according to an exemplary embodiment of the present disclosure may further include a first adhesive layer 21d and a second adhesive layer 21g.

[0283] In the vibration generator 20, a first adhesive layer 21d may be disposed between the vibration structure 21 and the first protective member 21e. For example, the first adhesive layer 21d may be disposed between the first protective member 21e and the first electrode portion 21b of the vibration structure 21. The first protective member 21e may be disposed on the first surface (or the first electrode portion 21b) of the vibration structure 21 via the first adhesive layer 21d. For example, the first protective member 21e may be connected or attached to the first surface (or the first electrode portion 21b) of the vibration structure 21 via the first adhesive layer 21d through a film lamination process.

[0284] In the vibration generator 20, a second adhesive layer 21g can be disposed between the vibration structure 21 and the second protective member 21f. For example, the second adhesive layer 21g can be disposed between the second protective member 21f and the second electrode portion 21c of the vibration structure 21. The second protective member 21f can be disposed on the second surface (or the second electrode portion 21c) of the vibration structure 21 via the second adhesive layer 21g. For example, the second protective member 21f can be connected or attached to the second surface (or the second electrode portion 21c) of the vibration structure 21 via the second adhesive layer 21g through a film lamination process.

[0285] In the vibration generator 20, the first adhesive layer 21d and the second adhesive layer 21g may include an electrically insulating material. For example, the electrically insulating material may be a material that has adhesive properties and is capable of compression and decompression. For example, one or more of the first adhesive layer 21d and the second adhesive layer 21g may include epoxy resin, acrylic resin, silicone resin, or polyurethane resin, but embodiments of this disclosure are not limited thereto. For example, the adhesive layer may be referred to as an adhesive member, a connecting member, or a connecting layer, but the terminology is not limited thereto.

[0286] In the vibration generator 20, the first adhesive layer 21d and the second adhesive layer 21g can be connected or joined to each other between the first protective member 21e and the second protective member 21f. For example, in the vibration generator 20, the first adhesive layer 21d and the second adhesive layer 21g can be connected or joined to each other at the edge (or peripheral) portion between the first protective member 21e and the second protective member 21f. Therefore, in the vibration generator 20, the vibrating structure 21 can be surrounded by the first adhesive layer 21d and the second adhesive layer 21g. For example, the first adhesive layer 21d and the second adhesive layer 21g can completely surround all the vibrating structures 21 of the vibration generator 20.

[0287] The adhesive layer of the connecting member 15 may further include additives, such as tackifiers, wax components, or antioxidants. The additives can prevent the connecting member 15 from detaching (or peeling off) from the vibrating plate 10 due to vibration of the vibration generator 20. For example, the tackifier may be a rosin derivative, and the wax component may be paraffin wax, etc. For example, the antioxidant may be a phenolic antioxidant such as a thioester, but embodiments of this disclosure are not limited thereto.

[0288] According to another exemplary embodiment of this disclosure, the connecting member 15 may further include a hollow portion disposed between the vibrating plate 10 and the vibration generator 20. The hollow portion of the connecting member 15 can provide an air gap between the vibrating plate 10 and the vibration generator 20. This air gap allows sound waves (or sound pressure levels) based on the vibration of the vibration generator 20 to be concentrated on the vibrating plate 10 without being dispersed by the connecting member 15. Therefore, vibration loss caused by the connecting member 15 can be minimized, thereby increasing the sound pressure level characteristics of the sound generated based on the vibration of the vibrating plate 10.

[0289] The connecting member 15 may overlap with the vibrating structure 21 and includes a first connecting member 15a disposed between the vibrating plate 10 and the vibrating structure 21 and a second connecting member 15b disposed around the first connecting member 15a.

[0290] The first connecting member 15a can perform the function of transmitting vibrations generated in the vibrating structure 21, and therefore may include a connecting member with a high modulus for enhancing the performance of the vibrating device. For example, the first connecting member 15a may include an epoxy resin adhesive, a hot melt adhesive, or a silicone adhesive, and the second connecting member 15b may include an acrylic adhesive.

[0291] According to an exemplary embodiment of this disclosure, the first connecting member 15a may have a modulus greater than that of the second connecting member 15b. For example, when the first connecting member 15a is an epoxy resin adhesive or a silicone adhesive, the modulus may range from 0.1 GPa (gigapascals) to 1 GPa, while when the second connecting member 15b is an acrylic adhesive, the modulus may range from 0.01 MPa (megapascals) to 0.1 MPa, but the embodiments of this disclosure are not limited thereto.

[0292] Figure 3A illustrates an example of the damping characteristics of the first connecting member, Figure 3B illustrates an example of the damping characteristics of the second connecting member 15b, and Figure 3C illustrates an example of the damping characteristics after the second connecting member 15b is stacked. In the damping characteristics of Figures 3A to 3C, a vibrating structure of approximately 20 mm is provided using a vibrating plate with two glass plates stacked with 0.5t (or 0.5 mm) of glass. The first connecting member 15a or the second connecting member 15b, provided as a sample, is positioned between adjacent vibrating structures. The damping characteristics have been measured by calculating the damping ratio at a measurement frequency of 66 kHz, and the 80 ms interval of a one-cycle sine wave signal has been adjusted. The damping characteristics have been measured at a position 0.5 cm apart from the vibrating structure and the first / second connecting member (15a, 15b). Table 1 shows an example of the damping ratio measurement results for Figures 3A and 3C. A high damping ratio indicates that the vibration or signal generated in the vibrating structure is quickly removed and the reverberation is eliminated.

[0293] [Table 1]

[0294]

[0295] Referring to Figures 3A to 3C and Table 1, it can be seen that the measured damping ratios of the silicone-based adhesives in samples A and B are 0.193% and 0.524%, respectively. The deviation between samples A and B indicates a low value. Furthermore, the measured damping ratios of the acrylic-based adhesives in samples C to E represent high values, with a maximum of 0.939% and a minimum of 0.744%. Sample F, which consists of stacked identical samples, has also been measured, with damping ratios ranging from 0.372% to 0.398%.

[0296] Referring to Figure 1, Figures 3A to 3C, and the results in Table 1, in the example where the first connecting member comprises a material with a high modulus, the vibration generated by the vibrating structure 21 can be effectively transmitted to the vibrating plate in the area overlapping with the vibrating structure 21, and in the example where the second connecting member 15b comprises a material with a low modulus, residual vibration caused by the vibration generated by the vibrating structure 21 can be quickly prevented.

[0297] Figure 4 illustrates a vibration device 2 according to another exemplary embodiment of the present disclosure.

[0298] Referring to FIG4, a vibration device 2 according to another exemplary embodiment of the present disclosure may include a vibrating plate 10, a vibration generator 20 disposed on the vibrating plate 10, and a connecting member 15 located between the vibrating plate 10 and the vibration generator 20. The connecting member 15 may include a metallic material.

[0299] Except for the application of a single connecting member 15, the vibration device 2 can be substantially the same as the vibration device 1 described above with reference to Figures 1 to 3C. Therefore, similar reference numerals refer to similar elements, and repeated descriptions of them can be omitted for the sake of brevity.

[0300] Referring to FIG4, the connecting member according to an exemplary embodiment of the present disclosure may include a metallic material and an adhesive layer. For example, the metallic material may include particles such as aluminum (Al), nickel (Ni), copper (Cu), or silver (Ag), and / or similar metal particles, and may include conductive carbon nanoparticles, carbon nanotubes, or carbon nanofibers. The adhesive layer may include epoxy resin, acrylic resin, silicone resin, or polyurethane, but embodiments of the present disclosure are not limited thereto.

[0301] The connecting member of the vibration device 2 according to another exemplary embodiment of the present disclosure may include a metallic material having a high modulus and may be enhanced in terms of modulus, thereby increasing the vibration transmission force for transmitting the vibration generated by the vibration generator to the vibrating plate. Additionally, the connecting member of the vibration device 2 according to another exemplary embodiment of the present disclosure may include a metal having a high melting point and may have light-temperature characteristics in which the modulus change due to temperature variations is small. Furthermore, the connecting member of the vibration device 2 according to another exemplary embodiment of the present disclosure may include a metallic material and may increase density and interfacial adhesion, thus enhancing adhesion uniformity and minimizing air bubbles.

[0302] Figure 5 illustrates a vibration device according to another exemplary embodiment of the present disclosure.

[0303] According to another exemplary embodiment of the present disclosure, the vibration device 3 may include a vibrating plate 10, a vibration generator 20 for vibrating the vibrating plate 10, and a connecting member 15 located between the vibrating plate 10 and the vibration generator 20. The vibration generator 20 may include a vibration structure 21, a first electrode portion 21b located on a first surface of the vibration structure 21, and a second electrode portion 21c located on a second surface of the vibration structure opposite to the first surface.

[0304] The first electrode portion 21b and the second electrode portion 21c used in the vibration device 3 should have good interfacial properties, thus possessing excellent adhesion, good surface coverage, and good conductivity based on low resistivity, and ensuring the reliability of the vibration device. Therefore, the inventors have conducted various experiments on electrode portions suitable for the vibration device 3 using aluminum (Al), copper (Cu), gold (Au), and silver (Ag). Through various experiments, the first electrode portion 21b and the second electrode portion 21c have been constructed using silver (Ag) electrodes. However, silver (Ag) electrodes may have the following problems: degradation in the vibration generator 20 occurs in high temperature and high humidity environments, and the adhesion to the vibration generator 20 decreases. For example, when constructing the first electrode portion 21b and the second electrode portion 21c using silver (Ag) electrodes capable of low-temperature firing, the inventors have recognized the following problems: low contact characteristics with the interface (e.g., the inorganic portion) of the vibration generator 20, weak adhesion of the silver (Ag) electrodes, reduced surface area of ​​the silver (Ag), and decreased reliability of the vibration generator 20 due to low conductivity. Therefore, the inventors have conducted various experiments to improve the adhesion and reliability of the electrode portions. Through these experiments, the inventors have developed electrode portions that can increase the reliability of the vibration generator 20 in high-temperature and high-humidity environments and enhance adhesion and reliability during high-temperature firing.

[0305] Each of the first electrode portion 21b and the second electrode portion 21c may include silver (Ag) and glass frit. For example, when each of the first electrode portion 21b and the second electrode portion 21c is constructed with a silver (Ag) electrode that can be fired at high temperatures, and the amount of glass frit is less than the amount of silver (Ag), the inventors have recognized the following problems: the surface coverage and adhesion of the silver (Ag) electrode are weak; the silver (Ag) content increases, the cost increases, and the reliability decreases when the first electrode portion 21b and the second electrode portion 21c have been driven for a long time. For example, when each of the first electrode portion 21b and the second electrode portion 21c is constructed with a silver (Ag) electrode that can be fired at high temperatures, and the amount of glass frit is greater than the amount of silver (Ag), the inventors have recognized the following problems: even if the surface coverage and adhesion of silver (Ag) are good, the conductivity and piezoelectric properties decrease due to the higher glass frit content. Therefore, the inventors have conducted various experiments (e.g., varying the amount of glass frit and silver (Ag)) to improve the reliability and adhesion of the vibration generator. This will be described in more detail below.

[0306] Except for the construction of the individual connecting member 15 and the electrode portions 21b and 21c, the vibration device 3 of FIG5 is substantially the same as the vibration device 1 described above with reference to FIGS. 1 to 3C. Therefore, similar reference numerals refer to similar elements, and repeated descriptions of them can be omitted for brevity. The detailed construction and features of the electrode portions 21b and 21c will now be described with reference to FIGS. 6A to 12B.

[0307] For example, the first electrode portion 21b and the second electrode portion 21c can be prepared by forming or coating the first electrode portion 21b and the second electrode portion 21c on each and both surfaces of the vibrating portion 21a with a composition comprising silver (Ag), glass frit, binder, solvent, and resin, and then firing it. Firing can be performed at a high temperature. During the firing process of the first electrode portion 21b and the second electrode portion 21c, all the solvent and binder can evaporate. Therefore, when the first electrode portion 21b and the second electrode portion 21c are prepared using a composition comprising silver (Ag), glass frit, binder, solvent, and resin, the binder, solvent, and resin can evaporate, and thus, the first electrode portion 21b and the second electrode portion 21c can be represented as Equation 1 below.

[0308] [Equation 1]

[0309] The weight of silver (Ag) or glass frit in the electrode portion = (the weight of silver (Ag) or glass frit in the composition) / (the total amount of silver (Ag) or glass frit in the composition)

[0310] For example, silver (Ag) can be made from fine particles with a size of less than 1 μm, while glass frit can be made from particles with a size of 1 μm to 3 μm, but the embodiments disclosed herein are not limited thereto. When the particles of silver (Ag) or glass frit are too large, the formation of the electrode portion may be uneven during the firing process, and the firing time may be increased.

[0311] For example, the glass frit can be a lead (Pb)-based glass frit or a bismuth (Bi)-based glass frit, but the embodiments disclosed herein are not limited thereto. The glass transition temperature (Tg) of the glass frit can be from 330°C to 380°C.

[0312] According to an exemplary embodiment of this disclosure, the silver (Ag) particles may comprise 63 wt% to 67 wt% of the electrode composition used to form the first electrode portion 21b and the second electrode portion 21c, and the glass frit may comprise 3 wt% to 4 wt% of the electrode composition. The glass frit may be a lead (Pb) based glass frit. The electrode composition prepared in this manner may be coated or formed on a surface of a vibrating structure having a thickness of about 7 μm to about 8 μm, and then fired at a temperature of 650°C. Then, as in the structure of the vibrating device of FIG. 5, the adhesive layers 21d and 21g and the protective members 21e and 21f may be bonded or attached to the respective electrode portions by a film lamination process. FIG. 6A is an example of a scanning electron microscope image of the surface of the electrode portion prepared according to the exemplary embodiment described above. FIG. 6B is an example of a scanning electron microscope image of a cross-sectional surface of the boundary between the electrode portion and the vibrating structure. Referring to Figures 6A and 6B, it can be seen that the electrode portion has excellent surface coverage without voids. The interface between the electrode portion and the vibrating structure exhibits good adhesion, whereby the electrode portion is bonded or attached to the vibrating structure without voids based on its high bonding properties, and the film uniformity of the electrode portion is good. In the electrode portion of the example embodiment prepared under the conditions of Figures 6A and 6B, silver (Ag) may account for approximately 95.7 wt%, and glass frit may account for approximately 4.3 wt%.

[0313] Furthermore, sound pressure level characteristics were measured in the vibration device fabricated under the conditions shown in Figures 6A and 6B, and in this case, the measured values ​​were adjusted to the reference sound pressure level values. In addition, the inventors conducted reliability tests in which sound pressure level values ​​were measured, and then the vibration device fabricated under the conditions shown in Figures 6A and 6B was exposed to a high temperature and high humidity environment. After performing the reliability tests, the inventors analyzed the interface characteristics of the fabricated electrodes based on whether the reference sound pressure level values ​​were altered. In this case, the sound pressure level of the vibration device was measured using the commercially available Audio Precision APX525. Using this device, the inventors set the input voltage to 5Vrms, applied the amplified signal (AMP) to the vibration device under a sinusoidal sweep in the range of 150Hz to 8kHz, and measured the average sound pressure level using a microphone (MIC) at a position 30cm away from the vibrating plate 10, the sound pressure level measured by the Precision APX525 was recorded. The measured sound pressure level was corrected for 1 / 3 octave band smoothing. Sine sweep can be a method of performing a sweep for a short period of time, and the measurement method is not limited to this method.

[0314] Figure 6C is an example of a scanning electron microscope image obtained by taking a 3000x magnified photograph of the surface of the electrode portion prepared in Figure 6A. Figure 6D is an example of an image mapped to the silver (Ag) element by an energy dispersive X-ray spectroscopy (EDS) analysis device. Figure 6E is an example of an image mapped to the lead (Pb) element by an EDS analysis device. Figure 6F is an example of an image mapped to the zinc (Zn) element by an EDS analysis device.

[0315] Referring to Figures 6C to 6F, based on image analysis of photographs and scanning electron microscope images mapped to silver (Ag) elements, it has been determined that silver (Ag) occupies approximately 83% of the area in the electrode portion. Furthermore, the surface resistivity of the prepared electrode portion has been measured to be less than 0.01 Ω / sq, and the thickness of the electrode portion has been measured to be approximately 3.4 μm, as a result of measuring the average thickness through cross-sectional analysis. Each of the lead (Pb) and zinc (Zn) elements can be a material representing the composition of the glass frit and piezoelectric element contained in the vibrating portion. Lead (Pb) and zinc (Zn) elements can be mapped into regions in the vibrating portion where no elements are formed. Furthermore, during the firing process, the glass frit can move towards the interface between the vibrating portion and the electrode portion, and only a portion can be observed at the surface. Therefore, in addition to the area occupied by silver (Ag) elements, lead (Pb) and zinc (Zn) elements can occupy approximately 17% of the area.

[0316] According to another exemplary embodiment of this disclosure, silver (Ag) particles may comprise about 50 wt% of the electrode composition used to form the first electrode portion 21b and the second electrode portion 21c, and glass frit may comprise 5 wt% to 12 wt% of the electrode composition. The electrode composition prepared in this manner can be coated or formed on a surface of the vibrating structure with a thickness of about 7 μm to about 8 μm, and then fired at a temperature of 650°C. The glass frit may be a lead (Pb)-based glass frit. The electrode composition prepared in this manner can be fired at a temperature of 650°C. Subsequently, as in the structure of the vibrating device of FIG. 5, adhesive layers 21d and 21g and protective members 21e and 21f can be bonded or attached to the electrode portions by a film lamination process. FIG. 7A is an example scanning electron microscope image of an electrode surface prepared according to an exemplary embodiment containing about 50 wt% silver (Ag) particles and about 12 wt% glass frit, and FIG. 7B is an example scanning electron microscope image of a cross-sectional surface of the boundary between the electrode portion and the vibrating structure. Figure 8A is an example scanning electron microscope (SEM) image of an electrode surface prepared according to an exemplary embodiment containing approximately 50 wt% silver (Ag) particles and approximately 8 wt% glass frit. Figure 8B is an example SEM image of the cross-sectional surface of the boundary between the electrode portion and the vibrating structure. Figure 9A is an example SEM image of an electrode surface prepared according to an exemplary embodiment containing approximately 50 wt% silver (Ag) particles and approximately 5 wt% glass frit. Figure 9B is an example SEM image of the cross-sectional surface of the boundary between the electrode portion and the vibrating structure. Referring to Figures 7A to 9B, it can be seen that the surface coverage of the electrode portion is excellent and without voids, the interface between the electrode portion and the vibrating structure exhibits good adhesion in which the electrode portion is bonded to the vibrating structure without voids based on high adhesion properties, and the film uniformity of the electrode portion is good. In the vibration device prepared according to the exemplary embodiments of Figures 7A to 9B, the initial sound pressure level measurement has been measured to be approximately 100% higher than the sound pressure level measurements of Figures 6A to 6F, and after the reliability test under high temperature and high humidity, the sound pressure level has been measured to the level before the reliability test. In the electrode portion of the exemplary embodiments prepared under the conditions of Figures 7A to 9B, silver (Ag) may account for approximately 80.7 wt% to approximately 90.9 wt%, and glass frit may account for approximately 9.9 wt% to approximately 19.4 wt%.

[0317] Figure 7C is an example of a scanning electron microscope image obtained by taking a 3000x magnified photograph of the surface of the electrode portion prepared in Figure 7A; Figure 7D is an example of an image mapped to the silver (Ag) element by an EDS analysis device; Figure 7E is an example of an image mapped to the lead (Pb) element by an EDS analysis device; and Figure 7F is an example of an image mapped to the zinc (Zn) element by an EDS analysis device.

[0318] Referring to Figures 7C to 7F, based on image analysis of photographs and scanning electron microscope images mapped to silver (Ag) elements, it has been determined that silver (Ag) occupies approximately 75% of the area in the electrode portion. Furthermore, the surface resistivity of the prepared electrode portion has been measured to be less than 0.015 Ω / sq (ohm / sqare), and the thickness of the electrode portion has been measured to be approximately 2.1 μm, as a result of measuring the average thickness through cross-sectional analysis. Each of the lead (Pb) and zinc (Zn) elements can be a material representing the composition of the glass frit and piezoelectric element included in the vibrating portion. Lead (Pb) and zinc (Zn) elements can be mapped into areas in the vibrating portion where no element is formed. Furthermore, during the firing process, the glass frit can move towards the interface between the vibrating portion and the electrode portion, and only a portion of it can be observed on the surface. Therefore, in addition to the area occupied by silver (Ag), lead (Pb) and zinc (Zn) elements can occupy approximately 25% of the area.

[0319] According to another exemplary embodiment of this disclosure, silver (Ag) particles may comprise about 40 wt% of the electrode composition used to form the first electrode portion 21b and the second electrode portion 21c, and glass frit may comprise 4 wt% of the electrode composition. The glass frit may be a bismuth (Bi) based glass frit. The electrode composition prepared in this manner can be fired at a temperature of 650°C. The electrode composition prepared in this manner can be coated or formed on a surface of the vibrating structure with a thickness of about 7 μm to about 8 μm, and then fired at a temperature of 650°C. Subsequently, as in the structure of the vibrating device of FIG. 5, adhesive layers 21d and 21g and protective members 21e and 21f can be bonded or attached to the electrode portions by a film lamination process. FIG. 10A is an example of a scanning electron microscope image of the electrode surface prepared according to the above exemplary embodiment. FIG. 10B is an example of a scanning electron microscope image of a cross-sectional surface of the boundary between the electrode portion and the vibrating structure. Referring to Figures 10A and 10B, it can be seen that the surface coverage of the electrode portion is excellent and without voids. The interface between the electrode portion and the vibrating structure exhibits good adhesion, whereby the electrode portion is bonded to the vibrating structure without voids based on high adhesion properties, and the film uniformity of the electrode portion is good. In the vibration device prepared according to the example embodiments of Figures 10A to 10F, the initial sound pressure level measurement value has been measured to be approximately 100% compared to the sound pressure level measurement values ​​of Figures 6A to 6F, and after the reliability test under high humidity, the sound pressure level has been measured to the level before the reliability test. In the electrode portion of the example embodiments prepared under the conditions of Figures 10A to 10F, silver (Ag) may account for approximately 83.3 wt%, and glass frit may account for approximately 9.9 wt% to approximately 19.4 wt%.

[0320] Figure 10C is an example of a scanning electron microscope image obtained by taking a 3000x magnified photograph of the surface of the electrode portion prepared in Figure 10A. Figure 10D is an example of an image mapped to the silver (Ag) element by an EDS analysis device. Figure 10E is an example of an image mapped to the lead (Pb) element by an EDS analysis device. Figure 10F is an example of an image mapped to the zinc (Zn) element by an EDS analysis device.

[0321] Referring to Figures 10C to 10F, based on image analysis of photographs and scanning electron microscope images mapped to silver (Ag) elements, it has been determined that silver (Ag) occupies approximately 75% of the area in the electrode portion. Furthermore, the surface resistivity of the prepared electrode portion has been measured to be less than 0.037 Ω / sq (ohm / sqare), and the thickness of the electrode portion has been measured to be approximately 1.8 μm (microparticle) as a result of measuring the average thickness through cross-sectional analysis. Each of the lead (Pb) and zinc (Zn) elements can be a material representing the composition of the glass frit and piezoelectric element included in the vibrating portion. Lead (Pb) and zinc (Zn) elements can be mapped into areas in the vibrating portion where no element is formed. Furthermore, during the firing process, the glass frit can move towards the interface between the vibrating portion and the electrode portion, and only a portion of it can be observed on the surface. Therefore, in addition to the area occupied by silver (Ag), lead (Pb) and zinc (Zn) elements can occupy approximately 25% of the area.

[0322] According to Experimental Example 1, the first and second electrode portions can be prepared by low-temperature firing of silver (Ag) electrodes. In the electrode portion according to the experimental example, the silver (Ag) electrode paste can be formed on the vibrating portion by a printing process, and then prepared by low-temperature firing at 150°C. Then, as in the structure of the vibration device in Figure 5, the adhesive layers 21d and 21g and the protective members 21e and 21f can be bonded or attached to the electrode portion by a film lamination process. Figure 11 is an example of a cross-sectional surface scanning electron microscope image of the boundary between the electrode portion and the vibration structure prepared by Experimental Example 1 above. Referring to Figure 11, it can be seen that the silver (Ag) particles are used as a sheet, therefore, the non-surface area is low, voids V are formed in the interface due to the low adhesion between the electrode portion and the vibration structure, and the interfacial adhesion is reduced. In the vibration device prepared by Experimental Example 1 in Figure 11, the initial sound pressure level measurement and the sound pressure level measurement after the high temperature and high humidity reliability test all fail to meet the expected sound pressure level values. Here, the desired sound pressure level value can represent a value that is less than 97% of 100%. In preparing the electrode portion of Experimental Example 1 under the conditions shown in Figure 11, silver (Ag) can account for approximately 98.0 wt%, while the glass frit can account for approximately 2.0 wt%.

[0323] According to Experimental Example 2, silver (Ag) particles may comprise about 40 wt% of the electrode composition used to form the first electrode portion 21b and the second electrode portion 21c, and glass frit may comprise about 20 wt% of the electrode composition. Alternatively, silver (Ag) particles may comprise about 50 wt%, and glass frit may comprise about 1 wt% to about 3 wt%. In this case, the glass frit may be lead (Pb) based glass frit. The electrode composition prepared in this manner can be fired at a temperature of 650°C. Then, as in the structure of the vibration device in FIG. 5, adhesive layers 21d and 21g and protective members 21e and 21f may be bonded or attached to the electrode portions by a film lamination process. FIG. 12A is an example of a scanning electron microscope image of the electrode surface prepared according to Experimental Example 2 above. FIG. 12B is an example of a scanning electron microscope image of a cross-sectional surface of the boundary between the electrode portion and the vibration structure. Referring to Figures 12A and 12B, it can be seen that several voids are formed on the surface of the electrode portion, and the surface coverage of the electrode portion is low. Furthermore, the adhesion between the electrode portion and the vibrating structure is low, resulting in several voids V and low adhesion characteristics between the electrode portion and the vibrating structure. In the vibration device prepared using Experimental Example 2 as shown in Figures 12A and 12B, both the initial sound pressure level measurement and the sound pressure level measurement after the high-temperature and high-humidity reliability test do not meet the expected sound pressure level values. In the electrode portion of Experimental Example 2 prepared under the conditions shown in Figures 12A and 12B, silver (Ag) can account for approximately 94.3 wt%, and glass frit can account for approximately 5.7 wt%.

[0324] Referring to Figures 5 to 12B, the electrode portion of the vibration device according to an exemplary embodiment of the present disclosure may include 80 to 95 wt% (parts by weight) of silver (Ag) and 5 to 20 wt% (parts by weight) of lead (Pb)-based glass frit. Furthermore, the electrode portion of the vibration device according to an exemplary embodiment of the present disclosure may include 80 to 90 wt% (parts by weight) of silver (Ag) and 10 to 20 wt% (parts by weight) of lead-based glass frit. Additionally, the electrode portion of the vibration device according to an exemplary embodiment of the present disclosure may include 80 to 90 wt% (parts by weight) of silver (Ag) and 10 to 20 wt% (parts by weight) of bismuth (Bi)-based glass frit. For example, the electrode portion according to an exemplary embodiment of the present disclosure may include at least 40 wt% (parts by weight) of silver (Ag) and glass frit in the metal paste of the electrode portion, and the glass frit content may be at least 12 wt% (parts by weight) or less. Therefore, the piezoelectric properties and reliability of the electrode portion can be enhanced.

[0325] Figure 13 illustrates a vibration device 4 according to another exemplary embodiment of the present disclosure, Figure 14 is a plan view of a vibration generator according to an exemplary embodiment of the present disclosure, and Figure 15 is a cross-sectional view taken along line I-I' shown in Figure 14.

[0326] Referring to Figures 13 and 14, a vibration device 4 according to another exemplary embodiment of the present disclosure may include a vibrating plate 10, a vibration generator for vibrating the vibrating plate 10, and a connecting member 15 located between the vibrating plate 10 and the vibration generator. The vibration generator may include a vibration structure, a first electrode portion 21b on a first surface of the vibration structure, and a second electrode portion 21c on a second surface of the vibration structure opposite to the first surface. The vibration generator may also include a first cover member 21e on the first electrode portion 21b, a second cover member 21f on the second electrode portion 21c, a signal cable 30 electrically connected to the vibration structure, and a signal generation circuit 40 mounted on the signal cable 30.

[0327] The signal generation circuit 40 can be mounted on the signal cable 30. For example, the signal generation circuit 40 can be mounted on the edge (or peripheral) portion of the signal cable 30 adjacent to the pad portion 21p of the vibration generator. The signal generation circuit 40 can be integrated (or mounted) within the signal cable 30; therefore, the signal generation circuit 40 and the signal cable 30 can be implemented as a single component. For example, the signal generation circuit 40 can be referred to as a sound processing circuit and a vibration driving circuit, but the terminology is not limited thereto.

[0328] The signal cable 30 can be configured as a double-sided flexible printed circuit board, but the embodiments of this disclosure are not limited thereto, and can be configured as a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board.

[0329] According to an exemplary embodiment of the present disclosure, the signal cable 30 may include a wiring layer 31, a lower film (or first film) 32 connected to a first surface of the wiring layer 31 via an adhesive layer 33, an upper film (or second film) 34 connected to a second surface of the wiring layer 31 via an adhesive layer 35, and a first terminal and a second terminal and a plurality of contact pads disposed on the upper film and connected to the wiring layer 31.

[0330] The wiring layer 31 may include a base film, and multiple signal lines, a first drive signal supply line, and a second drive signal supply line formed on one or more surfaces of the base film's front (or upper) and bottom (or lower) surfaces. For example, the multiple signal lines, the first drive signal supply line, and the second drive signal supply line may include a conductive material, such as copper (Cu), aluminum (Al), silver (Ag), or an alloy of copper (Cu) and silver (Ag), but embodiments of this disclosure are not limited thereto. For example, the wiring layer 31 may be referred to as a line, wiring line, wiring trace, signal line, or metal wire, but the terminology is not limited thereto.

[0331] Each of the multiple contact pads can be located at one of the lower and upper films, and can be selectively connected to multiple signal lines, as well as a first drive signal supply line and a second drive signal supply line, via vias.

[0332] The first terminal and the second terminal can be electrically connected to the first pad electrode and the second pad electrode respectively, which are disposed in the pad portion 21p in the vibration generator.

[0333] The signal generation circuit 40 can be mounted on the signal cable 30 and electrically connected to multiple contact pads. The signal generation circuit 40 can receive sound data (or digital sound data), clock signals, enable signals, and various drive voltages provided by an external sound data generation circuit through some of the multiple contact pads. The signal generation circuit 40 can generate a first vibration drive signal and a second vibration drive signal based on the sound data, and can output each of the generated first and second vibration drive signals to each of the first and second terminals through corresponding contact pads and corresponding drive signal supply lines. Therefore, the vibration generator 20 can vibrate based on the first and second vibration drive signals provided by the signal generation circuit 40 mounted on the signal cable 30 through the signal lines, the first and second terminals, the pad portion 21p, and the first power line PL1 and second power line PL2 of the signal cable 30.

[0334] The signal generation circuit 40 according to an example embodiment of the present disclosure may include a decoding unit that receives sound data provided from an external sound data generation circuit unit, an audio amplifier circuit that generates and outputs a first vibration drive signal and a second vibration drive signal based on the sound data provided from the decoding unit, a storage circuit that stores setting values ​​of the audio amplifier circuit, a control circuit that controls the operation of each of the decoding unit, the audio amplifier circuit and the storage circuit, and passive components such as resistors.

[0335] The audio amplifier circuit may include, but is not limited to, a preamplifier circuit that generates a first vibration drive signal and a second vibration drive signal based on sound data, and a power amplifier circuit that converts the voltage and / or current of each of the first vibration drive signal and the second vibration drive signal into a level suitable for driving the vibration generator 20.

[0336] Each of the decoding unit, audio amplifier circuit, storage circuit, and control circuit can be implemented as an integrated circuit (IC) and can be mounted on the signal cable 30.

[0337] According to another exemplary embodiment of this disclosure, the vibration generator 20 may include a signal generation circuit 40 mounted on the signal cable 30, thereby simplifying the connection structure between the vibration generator 20, the signal generation circuit 40, the signal cable 30, and the sound data generation circuit. Since the signal generation circuit 40 is disposed adjacent to the vibration generator 20, the filtering circuit including an inductor and a capacitor, which is used to prevent electromagnetic interference (EMI) due to the length of the signal cable 30 based on the distance between the signal generation circuit 40 and the vibration generator 20, can be omitted.

[0338] According to another exemplary embodiment of the present disclosure, in the vibration generator 20 according to another exemplary embodiment of the present disclosure, the signal cable 30 on which the signal generation circuit 40 is integrated or mounted can be applied to the vibration generator 20 described above with reference to one or more of Figures 1, 4, and 5. For example, the signal cable 30 and the signal generation circuit 40 are not shown in Figures 1, 4, and 5, but the signal cable 30 of the vibration generator 20 described above with reference to one or more of Figures 13 may include the signal generation circuit 40.

[0339] Figure 16 illustrates a vibration generator according to another exemplary embodiment of the present disclosure, Figure 17 is an example of a cross-sectional view taken along line II-II′ shown in Figure 16, and Figure 18 is an example of a side view of the cross-sectional surface taken along line III-III′ shown in Figure 16. Figure 19 is an example of a perspective view illustrating the piezoelectric vibration portion shown in Figure 18. Figure 16 illustrates an exemplary embodiment implemented by modifying the connection structure between the electrode portion and the signal cable shown in Figure 14.

[0340] Referring to Figures 16 to 19, a vibration generator 20 according to another exemplary embodiment of the present disclosure may include a vibration generating section and a signal cable 30.

[0341] The vibration structure may include a piezoelectric vibration part 21a, a first electrode part 21b, and a second electrode part 21c. The vibration structure may be substantially the same as the vibration structure 21 of the vibration generator 20 described above with reference to FIG1. ​​Therefore, similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0342] The signal cable 30 can be electrically connected to the first electrode portion 21b and the second electrode portion 21c on one side of the vibration generator 20, and therefore can be integrated into the vibration structure. For example, the signal cable 30 can be directly electrically connected to the first electrode portion 21b and the second electrode portion 21c.

[0343] According to an exemplary embodiment of the present disclosure, the signal cable 30 may include a first protruding wire 31a and a second protruding wire 31b. For example, the first protruding wire 31a may overlap with at least a portion of the first electrode portion 21b and may be electrically connected to, or may be directly electrically connected to, the first electrode portion 21b. The second protruding wire 31b may overlap with at least a portion of the second electrode portion 21c and may be electrically connected to, or may be directly electrically connected to, the second electrode portion 21c. For example, each of the first protruding wire 31a and the second protruding wire 31b may be bent toward the corresponding electrode portion of the first electrode portion 21b and the second electrode portion 21c, but embodiments of the present disclosure are not limited thereto. For example, each of the first protruding wire 31a and the second protruding wire 31b may be referred to by terms such as power line, conductive wire, protruding electrode, extension wire, extension electrode, finger wire, or finger electrode, but the terminology is not limited thereto.

[0344] According to an exemplary embodiment of the present disclosure, the signal cable 30 may include a main body portion, a first protruding wire 31a and a second protruding wire 31b, and a signal generation circuit 40.

[0345] The main body can be constructed as a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board, but the embodiments disclosed herein are not limited thereto.

[0346] The main body of an exemplary embodiment of this disclosure may include a wiring layer 31, a lower film (or first film) 32 connected or attached to a first surface of the wiring layer 31 via a first adhesive layer 33, an upper film (or second film) 34 connected or attached to a second surface of the wiring layer 31 via a second adhesive layer 35, and a plurality of contact pads disposed on the upper film 34 and connected to the wiring layer 31.

[0347] The wiring layer 31 may include a base film, and further may include multiple signal lines, a first drive signal supply line, and a second drive signal supply line, etc., formed on one or more surfaces of the front and bottom surfaces of the base film. For example, the multiple signal lines, the first drive signal supply line, and the second drive signal supply line may include a conductive material, such as copper (Cu), aluminum (Al), silver (Ag), or an alloy of copper (Cu) and silver (Ag), but the embodiments of this disclosure are not limited thereto.

[0348] Each of the multiple contact pads can be located at one of the lower and upper films, and can be selectively connected to multiple signal lines, as well as a first drive signal supply line and a second drive signal supply line, via vias.

[0349] The first protruding line 31a and the second protruding line 31b may be electrically connected to the first drive signal supply line and the second drive signal supply line disposed in the wiring layer 31, or may pass through the first drive signal supply line and the second drive signal supply line through a side surface 30s of the main body portion and may extend or protrude outwards. Each of the first protruding line 31a and the second protruding line 31b may protrude from a side surface 30s of the main body portion to have a certain length. For example, each of the first protruding line 31a and the second protruding line 31b may extend or protrude from a side surface 30s of the main body portion along the second direction Y to have a length that overlaps with at least a portion of each of the first electrode portion 21b and the second electrode portion 21c.

[0350] The first protruding wire 31a may be bent toward the first electrode portion 21b from one side surface 30s of the main body (or one side of the vibration generator 20) and may be electrically connected to at least a portion of the first electrode portion 21b. For example, the first protruding wire 31a may be directly electrically connected to and in contact with at least a portion of the first electrode portion 21b. For example, the first protruding wire 31a may be electrically connected to the first electrode portion 21b by a conductive member such as a conductive ball or conductive double-sided tape.

[0351] The second protruding wire 31b may bend from one side surface 30s of the main body (or one side (or a portion) of the vibration generator 20) toward the second electrode portion 21c and may be electrically connected to at least a portion of the second electrode portion 21c. For example, the second protruding wire 31b may be directly electrically connected to or in contact with at least a portion of the second electrode portion 21c. For example, the second protruding wire 31b may be electrically connected to the second electrode portion 21c via a conductive member such as a conductive ball or conductive double-sided tape.

[0352] The signal generation circuit 40 can be mounted on the signal cable 30 and electrically connected to multiple contact pads. The signal generation circuit 40 can receive sound data (or digital sound data), clock signals, enable signals, and various drive voltages provided by an external sound data generation circuit through some of the multiple contact pads. The signal generation circuit 40 can generate a first vibration drive signal and a second vibration drive signal based on the sound data, and can output each of the generated first and second vibration drive signals to each of the first and second terminals through corresponding contact pads and corresponding drive signal lines. Therefore, the vibration generator 20 can vibrate based on the first and second vibration drive signals provided by the signal generation circuit 40 mounted on the signal cable 30 through the signal lines, the first power line, the second power line, and the first and second protruding lines 31a and 31b of the signal cable 30.

[0353] The signal generation circuit 40 according to an exemplary embodiment of this disclosure may include a decoding unit, an audio amplifier circuit, a storage circuit, a control circuit, and passive components such as resistors. The components of the signal generation circuit 40 may be substantially the same as those described above; therefore, similar reference numerals refer to similar components, and repeated descriptions of them may be omitted for brevity.

[0354] According to an exemplary embodiment of this disclosure, the signal cable 30 can directly provide a vibration drive signal to each of the first electrode portion 21b and the second electrode portion 21c through each of the first protruding wire 31a and the second protruding wire 31b. Therefore, the voltage drop based on the surface resistance characteristics of each of the first electrode portion 21b and the second electrode portion 21c can be reduced, the electrical characteristics of each of the first electrode portion 21b and the second electrode portion 21c can be supplemented, and the degree of freedom in selecting the conductive materials used in the first electrode portion 21b and the second electrode portion 21c can be increased.

[0355] The vibration generator 20 according to another exemplary embodiment of the present disclosure may also include a first cover member 21e and a second cover member 21f.

[0356] The first cover member 21e may be disposed on the first surface of the vibration generator 20. For example, the first cover member 21e may be configured to cover the first protruding wire 31a and the first electrode portion 21b of the signal cable 30. Therefore, the first cover member 21e can protect the first protruding wire 31a and the first electrode portion 21b of the signal cable 30, and can electrically connect the first protruding wire 31a of the signal cable 30 to the first electrode portion 21b, or can maintain the electrical connection between the first protruding wire 31a and the first electrode portion 21b of the signal cable 30.

[0357] The second cover member 21f can be disposed on the second surface of the vibration generator 20. For example, the second cover member 21f can be configured to cover the second protruding wire 31b and the second electrode portion 21c of the signal cable 30. Therefore, the second cover member 21f can protect the second protruding wire 31b and the second electrode portion 21c of the signal cable 30, and can electrically connect the second protruding wire 31b of the signal cable 30 to the second electrode portion 21c, or can maintain the electrical connection between the second protruding wire 31b and the second electrode portion 21c of the signal cable 30.

[0358] Each of the first cover member 21e and the second cover member 21f according to the exemplary embodiments of this disclosure may include one or more materials selected from plastic, fiber, and wood, but the embodiments of this disclosure are not limited thereto. For example, the first cover member 21e and the second cover member 21f may include the same material or different materials. For example, each of the first cover member 21e and the second cover member 21f may be a polyimide film or a polyethylene terephthalate film, but the embodiments of this disclosure are not limited thereto.

[0359] According to an exemplary embodiment of this disclosure, the first cover member 21e can be connected or coupled to the first protruding wire 31a and the first electrode portion 21b of the signal cable 30 via the first adhesive layer 21d. For example, the first cover member 21e can be connected or coupled to the first protruding wire 31a and the first electrode portion 21b of the signal cable 30 via a film process using the first adhesive layer 21d. Therefore, the first protruding wire (or first finger wire) 31a of the signal cable 30 can be disposed between the first electrode portion 21b and the first cover member 21e and can be configured to be integral (or integrated) with the vibration generator 20.

[0360] According to an exemplary embodiment of this disclosure, the second cover member 21f can be connected or coupled to the second protruding wire 31b and the second electrode portion 21c of the signal cable 30 via the second adhesive layer 21g. For example, the second cover member 21f can be connected or coupled to the second protruding wire 31b and the second electrode portion 21c of the signal cable 30 via a film lamination process using the second adhesive layer 21g. Therefore, the second protruding wire (or second finger wire) 31b of the signal cable 30 can be disposed between the second electrode portion 21c and the second cover member 21f and can be configured to be integral (or integrated) with the vibration generator 20.

[0361] Each of the first cover member 21e and the second cover member 21f according to an exemplary embodiment of this disclosure may not include or require a pad portion and a power line for receiving vibration drive signals from the signal cable 30, and therefore may be an insulating film or protective film for protecting the piezoelectric vibration portion 21a and the first electrode portion 21b and the second electrode portion 21c. For example, each of the first cover member 21e and the second cover member 21f may be a polyimide film or a polyethylene terephthalate film, but embodiments of this disclosure are not limited thereto.

[0362] According to another exemplary embodiment of this disclosure, each of the first cover member 21e and the second cover member 21f can be electrically insulated from the first electrode portion 21b and the second electrode portion 21c by the first adhesive layer 21d and the second adhesive layer 21g. Therefore, one or more of the first cover member 21e and the second cover member 21f may include a metal film or a metal plate. Each of the first cover member 21e and the second cover member 21f, which includes a metallic material, can enhance the mass of the vibration generator 20 or the piezoelectric vibration portion 21a to reduce the resonant frequency of the vibration generator 20 based on the increase in mass, thereby increasing the sound characteristics and / or sound pressure level characteristics of the low-pitched audio band generated by the vibration of the vibration generator 20 or the piezoelectric vibration portion 21a. For example, each of the first cover member 21e and the second cover member 21f, which includes a metallic material, may include one or more materials selected from stainless steel, aluminum (Al), aluminum (Al) alloys, magnesium (Mg), magnesium (Mg) alloys, and magnesium-lithium (Mg-Li) alloys, but embodiments of this disclosure are not limited thereto.

[0363] According to exemplary embodiments of this disclosure, the first adhesive layer 21d and the second adhesive layer 21g may comprise an electrically insulating material capable of compression and decompression. For example, each of the first adhesive layer 21d and the second adhesive layer 21g may comprise an epoxy resin, an acrylic resin, a silicone resin, or a polyurethane resin, but embodiments of this disclosure are not limited thereto.

[0364] In another example, at least a portion of the signal cable 30 may be disposed or inserted (or accommodated) between the first cover member 21e and the second cover member 21f. For example, a side surface (or portion or part) 30s of the main body portion (or an edge portion or peripheral portion of the main body portion) of the signal cable 30 and each of the first protruding wire 31a and the second protruding wire 31b may be disposed or inserted (or accommodated) between the first cover member 21e and the second cover member 21f. For example, a side surface 30s of the main body portion of the signal cable 30 and each of the first protruding wire 31a and the second protruding wire 31b may be accommodated or inserted into the vibration generator 20. Therefore, at least a portion of the signal cable 30 and each of the first protruding wire 31a and the second protruding wire 31b may not be exposed to the outside of each of the first cover member 21e and the second cover member 21f, thus preventing short circuits (or shorting) of the first protruding wire 31a and the second protruding wire 31b caused by stresses such as movement or bending of the signal cable 30.

[0365] As described above, in the vibration generator 20 according to another exemplary embodiment of the present disclosure, based on the integrated structure between the first electrode portion 21b and the second electrode portion 21c and the signal cable 30, the patterning process for forming power lines and pad portions in the first cover member 21e and the second cover member 21f, as well as the soldering process between the pad portions and the signal cable 30, are not required, thus simplifying the structure and manufacturing process. Furthermore, in the vibration generator 20 according to another exemplary embodiment of the present disclosure, the vibration drive signal can be directly provided to the first electrode portion 21b and the second electrode portion 21c through protruding lines 31a and 31b protruding from the signal cable 30, thus supplementing the electrical characteristics of each of the first electrode portion 21b and the second electrode portion 21c. Furthermore, since the vibration generator 20 according to another exemplary embodiment of this disclosure includes a signal generation circuit 40 mounted on the signal cable 30, the connection structure between the vibration generator 20, the sound generation circuit 40, the signal cable 30 and the sound data generation circuit section can be simplified. And since the signal generation circuit 40 is arranged adjacent to the vibration generator 20, the method for preventing electromagnetic interference (EMI) due to the length of the signal cable 30 based on the distance between the signal generation circuit 40 and the vibration generator 20 can be omitted.

[0366] Referring to Figures 18 and 19, the vibration device 21 according to the exemplary embodiment of this disclosure may be referred to by terms such as flexible vibration structure, flexible vibrator, flexible vibration generating device, flexible vibration generator, flexible sound generator, flexible sound device, flexible sound generating device, flexible sound generator, flexible actuator, flexible loudspeaker, flexible piezoelectric loudspeaker, membrane actuator, membrane piezoelectric composite actuator, membrane loudspeaker, membrane piezoelectric loudspeaker or membrane piezoelectric composite loudspeaker, but the terminology is not limited thereto.

[0367] The vibration device 21 according to an exemplary embodiment of the present disclosure may include a vibration generating portion, which includes a piezoelectric vibration portion 21a, a first electrode portion 21b, and a second electrode portion 21c.

[0368] The piezoelectric vibrating portion 21a may include a piezoelectric material (or an electroactive material) exhibiting a piezoelectric effect. For example, a piezoelectric material may possess the characteristic that, when pressure or torsion is applied to its crystal structure by an external force, a potential difference is generated due to dielectric polarization caused by the change in the relative positions of positive (+) ions and negative (-) ions, and vibration is generated by an electric field based on the voltage applied to it. The piezoelectric vibrating portion 21a may be referred to by terms such as vibrating layer, piezoelectric layer, piezoelectric material layer, electroactive layer, vibrating portion, piezoelectric material portion, electroactive portion, piezoelectric structure, piezoelectric composite layer, piezoelectric composite material, or piezoelectric ceramic composite material, but the terminology is not limited thereto. The piezoelectric vibrating portion 21a may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material, and the piezoelectric vibrating portion 21a may be transparent, semi-transparent, or opaque.

[0369] The piezoelectric vibrating portion 21a according to an exemplary embodiment of the present disclosure may include a plurality of first portions 21a1 and a plurality of second portions 21a2. For example, the plurality of first portions 21a1 and the plurality of second portions 21a2 may be arranged alternately and repeatedly in a first direction X (or a second direction Y). For example, the first direction X may be the width direction of the piezoelectric vibrating portion 21a, and the second direction Y may be the length direction of the piezoelectric vibrating portion 21a, but the embodiments of the present disclosure are not limited thereto. In another exemplary embodiment of the present disclosure, the first direction X may be the length direction of the piezoelectric vibrating portion 21a, and the second direction Y may be the width direction of the piezoelectric vibrating portion 21a.

[0370] Each of the plurality of first portions 21a1 may include a ceramic matrix material for achieving relatively high vibration, or may include a piezoelectric ceramic having a perovskite crystal structure. The perovskite crystal structure may have both piezoelectric and inverse piezoelectric effects and may be an oriented plate-like structure. The perovskite crystal structure may be represented by the chemical formula "ABO3", in which "A" may include a divalent metal element and "B" may include a tetravalent metal element. For example, in the chemical formula "ABO3", "A" and "B" may be cations, and "O" may be an anion. For example, first portion 51a may include one or more of lead(II) titanate (PbTiO3), lead zirconate (PbZrO3), lead zirconate titanate (PbZrTiO3), barium titanate (BaTiO3), and strontium titanate (SrTiO3), but embodiments of this disclosure are not limited thereto.

[0371] The piezoelectric vibrating portion 21a according to an exemplary embodiment of this disclosure may include a lead zirconate titanate (PZT)-based material containing lead (Pb), zirconium (Zr), and titanium (Ti), or may include a nickel zirconate niobate (PZNN)-based material containing lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb), but the embodiments of this disclosure are not limited thereto. Furthermore, the piezoelectric vibrating portion 21a may include at least one or more of calcium titanate (CaTiO3), BaTiO3, and SrTiO3 that do not contain Pb, but the embodiments of this disclosure are not limited thereto.

[0372] Each of the plurality of first portions 21a1 according to the exemplary embodiments of this disclosure may be disposed between a plurality of second portions 21a2 and may have a first width W1 parallel to a first direction X (or a second direction Y) and a length parallel to the second direction Y (or the first direction X). Each of the plurality of second portions 21a2 may have a second width W2 parallel to the first direction X (or the second direction Y) and a length parallel to the second direction Y (or the first direction X). The first width W1 may be the same as or different from the second width W2. For example, the first width W1 may be greater than the second width W2. For example, the first portions 21a1 and the second portions 21a2 may include linear or strip shapes having the same or different dimensions. Therefore, the piezoelectric vibrating portion 21a may have a 2-2 composite structure with piezoelectric characteristics having a 2-2 type vibration mode and may have a resonant frequency below 20 kHz, but the embodiments of this disclosure are not limited thereto. For example, the resonant frequency of the piezoelectric vibrating portion 21a may vary based on at least one or more of shape, length, or thickness.

[0373] In the piezoelectric vibrating portion 21a, a plurality of first portions 21a1 and a plurality of second portions 21a2 may be arranged in parallel on the same plane (or the same layer). Each of the plurality of second portions 21a2 may be configured to fill the gap between two adjacent first portions 21a1 and may be connected or adhered to an adjacent first portion 21a1. Therefore, the piezoelectric vibrating portion 21a may extend to a desired size or length based on the lateral connection (or coupling) between the first portions 21a1 and the second portions 21a2.

[0374] In the piezoelectric vibration section 21a, the width W2 of each of the plurality of second sections 21a2 may gradually decrease in the direction from the center of the piezoelectric vibration section 21a or the vibration device 21 toward its two edge sections (or both ends or two peripheral sections).

[0375] According to an exemplary embodiment of this disclosure, when the piezoelectric vibrating portion 21a or the vibrating device 21 vibrates in the vertical direction Z (or the thickness direction), the second portion 21a2 with the largest width W2 among the plurality of second portions 21a2 can be provided at the portion where the relative stress is concentrated. When the piezoelectric vibrating portion 21a or the vibrating device 21 vibrates in the vertical direction Z, the second portion 21a2 with the smallest width W2 among the plurality of second portions 21a2 can be provided at the portion where the relative stress is minimal. For example, the second portion 21a2 with the largest width W2 among the plurality of second portions 21a2 can be provided at the central portion of the piezoelectric vibrating portion 21aa, and the second portion 21a2 with the smallest width W2 among the plurality of second portions 21a2 can be provided at the two edge portions (or two peripheral portions) of the piezoelectric vibrating portion 21aa. Therefore, when the piezoelectric vibrating part 21a or the vibrating device 21 vibrates in the vertical direction Z, the overlap or interference of the resonant frequencies of the sound waves that occur at the part where the maximum stress is concentrated can be minimized. Thus, the sound pressure level value that occurs in the low-pitched audio band can be reduced, and the flatness of the sound characteristics in the low-pitched audio band can be improved.

[0376] In the piezoelectric vibrating section 21a, the plurality of first sections 21a1 can have different dimensions (or widths). For example, the dimension (or width) of each of the plurality of first sections 21a1 can gradually decrease or increase in the direction from the center portion of the piezoelectric vibrating section 21a or the vibrating device 21 toward its two edge portions (or both ends or two peripheral portions). In this case, the sound pressure level characteristics of the piezoelectric vibrating section 21a can be enhanced by various inherent vibration frequencies based on the vibrations of the plurality of first sections 21a1 with different dimensions, and the sound reproduction frequency band can be extended.

[0377] Each of the plurality of second portions 21a2 can be disposed between the plurality of first portions 21a1. Therefore, in the piezoelectric vibration portion 21a or vibration device 21, the vibrational energy of the links in the unit lattice based on the first portions 21a1 can be increased by the second portions 21a2, thus enhancing vibrational characteristics and ensuring piezoelectric properties and flexibility. For example, the second portions 21a2 may comprise one of epoxy-based polymers, acrylic polymers, and silicone polymers, but embodiments of this disclosure are not limited thereto.

[0378] Each of the plurality of second portions 21a2 according to the exemplary embodiments of the present disclosure can be constructed using organic material portions. For example, the organic material portion can be disposed between two adjacent inorganic material portions, thereby absorbing impacts applied to the inorganic material portion (or the first portion) and releasing stress concentrated on the inorganic material portion, thereby enhancing the durability of the piezoelectric vibrating portion 21a or the vibration device 21 and achieving the flexibility of the piezoelectric vibrating portion 21a or the vibration device 21.

[0379] According to an exemplary embodiment of this disclosure, the second portion 21a2 may have a lower modulus and viscoelasticity than the first portion 21a1. Therefore, the second portion 21a2 may enhance the reliability of the first portion 21a1, which is susceptible to impact due to the brittle nature of the first portion 21a1. For example, the second portion 21a2 may comprise a material having a loss coefficient of about 0.01 to about 1 and a modulus of about 0.1 GPa to about 10 GPa.

[0380] The organic material portion included in the second part 21a2 may include organic materials, organic polymers, organic piezoelectric materials, or organic non-piezoelectric materials that have flexible properties compared to the inorganic material portion of the first part 21a1. For example, the second part 21a2 may be referred to as an adhesive portion, a stretching portion, a bending portion, a damping portion, a flexible portion, or an extended portion, etc., but the embodiments of this disclosure are not limited to this.

[0381] Multiple first portions 21a1 and multiple second portions 21a2 can be disposed on the same plane (or connected to the same plane), therefore, the piezoelectric vibrating portion 21a according to the exemplary embodiment of this embodiment can be formed in the form of a single thin film. For example, the piezoelectric vibrating portion 21a can have a structure in which multiple first portions 21a1 are connected to one side thereof. For example, the piezoelectric vibrating portion 21a can have a structure in which multiple first portions 21a1 are connected in all piezoelectric vibrating portions 21a. For example, the piezoelectric vibrating portion 21a can vibrate in the vertical direction by means of the first portions 21a1 having vibration characteristics, and can be bent into a curved shape by means of the flexible second portions 21a2. In addition, in the piezoelectric vibrating portion 21a according to this embodiment, the dimensions of the first portions 21a1 and the second portions 21a2 can be adjusted based on the piezoelectric characteristics and flexibility required by the piezoelectric vibrating portion 21a or the vibrating device 21. For example, in the piezoelectric vibrating portion 21a where piezoelectric characteristics are required rather than flexibility, the dimensions of the first portions 21a1 can be adjusted to be larger than the dimensions of the second portions 21a2. As another example, in a piezoelectric vibrating portion 21a that requires flexibility rather than piezoelectric properties, the size of the second portion 21a2 can be adjusted to be larger than the size of the first portion 21a1. Therefore, the size of the piezoelectric vibrating portion 21a can be adjusted based on the desired properties, and the piezoelectric vibrating portion 21a can be easily designed.

[0382] The first electrode portion 21b may be disposed on the first surface (or upper surface) of the piezoelectric vibration portion 21a. The first electrode portion 21b may be commonly disposed on or connected to the first surface of each of the plurality of first portions 21a1 and the first surface of each of the plurality of second portions 21a2, and may be electrically connected to the first surface of each of the first portions 21a1. For example, the first electrode portion 21b may have a common electrode (or single electrode or single-electrode electrode) shape on the entire first surface of the piezoelectric vibration portion 21a. For example, the first electrode portion 21b may have a shape substantially the same as that of the piezoelectric vibration portion 21a, but embodiments of this disclosure are not limited thereto.

[0383] The first electrode portion 21b according to an exemplary embodiment of this disclosure may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the transparent or semi-transparent conductive material may include ITO (indium tin oxide) or IZO (indium zinc oxide), but embodiments of this disclosure are not limited thereto. The opaque conductive material may include aluminum (Al), copper (Cu), gold (Au), silver (Ag), molybdenum (Mo), magnesium (Mg), or alloys thereof, but embodiments of this disclosure are not limited thereto.

[0384] The second electrode portion 21c may be disposed on a second surface (or rear surface) of the piezoelectric vibrating portion 21a that is opposite to or different from the first surface. The second electrode portion 21c may be commonly disposed on or connected to the second surface of each of the plurality of first portions 21a1 and the second surface of each of the plurality of second portions 21a2, and may be electrically connected to the second surface of each of the plurality of first portions 21a1. For example, the second electrode portion 21c may have a common electrode (or single electrode or monolithic electrode) shape on the entire second surface of the piezoelectric vibrating portion 21a. For example, the second electrode portion 21c may have a shape substantially the same as that of the piezoelectric vibrating portion 21a, but embodiments of the present disclosure are not limited thereto. According to exemplary embodiments of the present disclosure, the second electrode portion 21c may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the second electrode portion 21c may include the same material as the first electrode portion 21b, but embodiments of the present disclosure are not limited thereto. In another exemplary embodiment of the present disclosure, the second electrode portion 21c may include a material different from that of the first electrode portion 21b.

[0385] The piezoelectric vibrating portion 21a can be polarized (or polarized) by applying a specific voltage to the first electrode portion 21b and the second electrode portion 21c in a certain temperature atmosphere or in a temperature atmosphere that can be changed from high temperature to room temperature, but the embodiments of this disclosure are not limited thereto. For example, the piezoelectric vibrating portion 21a can vibrate by alternately and repeatedly contracting and expanding based on the inverse piezoelectric effect of a sound signal (or speech signal) applied from the outside to the first electrode portion 21b and the second electrode portion 21c. For example, the piezoelectric vibrating portion 21a can vibrate based on vertical vibration and planar (or plane-direction) vibration of the first electrode portion 21b and the second electrode portion 21c. The displacement of the vibrating member (or vibrating plate or vibrating object) can be increased based on the planar contraction and expansion of the piezoelectric vibrating portion 21a, thus further enhancing the vibration.

[0386] The vibration device 21 according to the exemplary embodiments of this disclosure may further include a first cover member 21e and a second cover member 21f.

[0387] The first cover member 21e may be disposed on the first surface of the vibration device 21. For example, the first cover member 21e may be configured to cover the first electrode portion 21b. Therefore, the first cover member 21e can protect the first electrode portion 21b.

[0388] The second cover member 21f can be disposed on the second surface of the vibration device 21. For example, the second cover member 21f can be configured to cover the second electrode portion 21c. Therefore, the second cover member 21f can protect the second electrode portion 21c.

[0389] Each of the first cover member 21e and the second cover member 21f according to the exemplary embodiments of this disclosure may include one or more materials selected from plastic, fiber, and wood, but the embodiments of this disclosure are not limited thereto. For example, the first cover member 21e and the second cover member 21f may include the same material or different materials. For example, each of the first cover member 21e and the second cover member 21f may be a polyimide film or a polyethylene terephthalate film, but the embodiments of this disclosure are not limited thereto.

[0390] According to an exemplary embodiment of this disclosure, the first cover member 21e can be connected or coupled to the first electrode portion 21b via the first adhesive layer 21d. For example, the first cover member 21e can be connected or coupled to the first electrode portion 21b via a film lamination process of the first adhesive layer 21d.

[0391] According to an exemplary embodiment of this disclosure, the second cover member 21f can be connected or coupled to the second electrode portion 21c via the second adhesive layer 21g. For example, the second cover member 21f can be connected or coupled to the second electrode portion 21c via a film lamination process of the second adhesive layer 21g.

[0392] A first adhesive layer 21d may be disposed between the first electrode portion 21b and the first cover member 21e. A second adhesive layer 21g may be disposed between the second electrode portion 21c and the second cover member 21f. For example, the first adhesive layer 21d and the second adhesive layer 21g may be constructed between the first cover member 21e and the second cover member 21f to completely (or entirely) surround the piezoelectric vibrating portion 21a, the first electrode portion 21b, and the second electrode portion 21c. For example, the piezoelectric vibrating portion 21a, the first electrode portion 21b, and the second electrode portion 21c may be embedded or recessed between the first adhesive layer 21d and the second adhesive layer 21g.

[0393] Each of the first adhesive layer 21d and the second adhesive layer 21g according to an exemplary embodiment of the present disclosure may include an electrically insulating material capable of compression and decompression. For example, each of the first adhesive layer 21d and the second adhesive layer 21g may include an epoxy resin, an acrylic resin, a silicone resin, or a polyurethane resin, but embodiments of the present disclosure are not limited thereto.

[0394] One of the first cover member 21e and the second cover member 21f can be attached or connected to the vibrating member (or vibrating plate or vibrating object) by means of a connecting member.

[0395] According to an exemplary embodiment of this disclosure, one of the first cover member 21e and the second cover member 21f can be attached to or connected to the vibrating member (or vibrating plate or vibrating object) via a connecting member. For example, one of the first cover member 21e and the second cover member 21f, as described or illustrated above with reference to Figures 1 to 8B, or as described above with reference to, for example, Figures 1, 2, 4, 5 and 13, can be attached to or connected to the vibrating member (or vibrating plate or vibrating object) via a connecting member 15.

[0396] Referring back to Figures 13, 14, and 15, the vibration device 21 according to an exemplary embodiment of the present disclosure may include a piezoelectric vibration portion 21a, a first electrode portion 21b, and a second electrode portion 21c. The vibration device 21 may also include a first power line PL1 disposed in a first cover member 21e, a second power line PL2 disposed in a second cover member 21f, and pad portions 21p electrically connected to the first power line PL1 and the second power line PL2.

[0397] A first power line PL1 may be disposed between the first electrode portion 21b and the first cover member 21e and may be electrically connected to the first electrode portion 21b. The first power line PL1 may extend long in the second direction Y and may be electrically connected to the central portion of the first electrode portion 21b. In an exemplary embodiment of this disclosure, the first power line PL1 may be electrically connected to the first electrode portion 21b via an anisotropic conductive film. In another exemplary embodiment of this disclosure, the first power line PL1 may be electrically connected to the first electrode portion 21b via a conductive material (or particles) contained in the first adhesive layer 21d.

[0398] A second power line PL2 may be disposed between the second electrode portion 21c and the second cover member 21f and may be electrically connected to the second electrode portion 21c. The second power line PL2 may extend long in the second direction Y and may be electrically connected to the central portion of the second electrode portion 21c. In an exemplary embodiment of this disclosure, the second power line PL2 may be electrically connected to the second electrode portion 21c via an anisotropic conductive film. In another exemplary embodiment of this disclosure, the second power line PL2 may be electrically connected to the second electrode portion 21c via a conductive material (or particles) contained in the second adhesive layer 21g.

[0399] The pad portion 21p may be disposed on an edge portion (or a peripheral portion) of one of the first cover member 21e and the second cover member 21f to be electrically connected to one side (or one end or a portion) of each of the first power line PL1 and the second power line PL2.

[0400] According to an exemplary embodiment of this disclosure, the pad portion 21p may include a first pad electrode electrically connected to one end (or a portion) of a first power line PL1 and a second pad electrode electrically connected to one end (or a portion) of a second power line PL2.

[0401] The first pad electrode may be disposed on an edge portion (or a peripheral portion) of one of the first cover member 21e and the second cover member 21f, and may be electrically connected to one end (or a portion) of the first power line PL1. For example, the first pad electrode may pass through one of the first cover member 21e and the second cover member 21f and may be electrically connected to one end (or a portion) of the first power line PL1.

[0402] The second pad electrode can be arranged parallel to the first pad electrode and can be electrically connected to one end (or a portion) of the second power line PL2. For example, the second pad electrode can pass through one of the first cover member 21e and the second cover member 21f and can be electrically connected to one end (or a portion) of the second power line PL2.

[0403] According to an exemplary embodiment of this disclosure, each of the first power line PL1, the second power line PL2, and the pad portion 21p may be configured to be transparent, translucent, or opaque.

[0404] According to an exemplary embodiment of this disclosure, the pad portion 21p can be electrically connected to the signal cable 30.

[0405] The signal cable 30 can be electrically connected to the pad portion 21p disposed in the vibration device 21, and can supply the vibration device 21 with a vibration drive signal (or sound signal) provided from the sound processing circuit. According to an exemplary embodiment of this disclosure, the signal cable 30 may include a first terminal electrically connected to a first pad electrode of the pad portion 21p and a second terminal electrically connected to a second pad electrode of the pad portion 21p. For example, the signal cable 30 may be configured as a double-sided flexible printed circuit, but embodiments of this disclosure are not limited thereto, and may be configured as a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board.

[0406] The sound processing circuit can generate an AC vibration drive signal, including a first vibration drive signal and a second vibration drive signal, based on sound data provided from an external sound data generation circuit. The first vibration drive signal can be either a positive (+) vibration drive signal or a negative (-) vibration drive signal, and the second vibration drive signal can also be either a positive (+) vibration drive signal or a negative (-) vibration drive signal. For example, the first vibration drive signal can be provided to the first electrode portion 21b via the first terminal of the signal cable 30, the first pad electrode of the pad portion 21p, and the first power line PL1. The second vibration drive signal can be provided to the second electrode portion 21c via the second terminal of the signal cable 30, the second pad electrode of the pad portion 21p, and the second power line PL2.

[0407] According to an exemplary embodiment of this disclosure, the signal cable 30 may be configured to be transparent, semi-transparent, or opaque.

[0408] As described above, the vibration device 21 according to the exemplary embodiment of this disclosure can be implemented in a thin-film shape because the first portion 21a1 having piezoelectric properties and the second portion 21a2 having flexibility are alternately and repeatedly connected to each other, thus allowing it to be bent into a shape corresponding to the shape of the vibrating member or vibrating object. For example, when the vibration device 21 is connected or coupled to a vibrating member including various curved surfaces via a connecting member, the vibration device 21 can be bent in a curved shape along the shape of the curved surface portion of the vibrating member, and despite being bent in a curved shape, reliability is not reduced, such as by damage or breakage. Furthermore, the vibration device 21 according to the exemplary embodiment of this disclosure can have a modulus greater than that of the connecting member 15, thus allowing the vibrating member including various curved surfaces to vibrate easily. Therefore, the reliability of sound reproduction can be enhanced, and the sound characteristics and / or sound pressure level characteristics in the low-pitched audio band generated by the vibration of the vibrating member can be enhanced.

[0409] Figures 20A to 20D are examples of perspective views illustrating a piezoelectric vibration portion of a vibration device according to another exemplary embodiment of the present disclosure in an exemplary embodiment of the present disclosure.

[0410] Referring to FIG20A, the piezoelectric vibration portion 21a according to another exemplary embodiment of the present disclosure may include a plurality of first portions 21a1 spaced apart from each other in a first direction X and a second direction Y, and a second portion 21a2 disposed between the plurality of first portions 21a1.

[0411] Multiple first portions 21a1 may be spaced apart from each other in each of the first direction X and the second direction Y. For example, the multiple first portions 21a1 may have a hexahedral shape of the same size and may be arranged in a lattice shape. Each of the multiple first portions 21a1 may include a piezoelectric material substantially the same as the piezoelectric material of the first portion 21a1 described above with reference to FIG19, therefore similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0412] The second portion 21a2 may be disposed between the plurality of first portions 21a1 in each of the first direction X and the second direction Y. The second portion 21a2 may be configured to fill the gap between two adjacent first portions 21a1 or surround each of the plurality of first portions 21a1, thus being able to connect to or attach to adjacent first portions 21a1. According to an exemplary embodiment of this disclosure, the width of the second portion 21a2 disposed between two first portions 21a1 adjacent to each other along the first direction X may be the same as or different from the width of the first portions 21a1, and the width of the second portion 21a2 disposed between two first portions 21a1 adjacent to each other along the second direction Y may be the same as or different from the width of the first portions 21a1. The second portion 21a2 may comprise an organic material substantially the same as the organic material of the second portion 21a2 described above with reference to FIG19; therefore, similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0413] As described above, the piezoelectric vibration portion 21a according to another exemplary embodiment of the present disclosure may include a 1-3 composite structure having piezoelectric characteristics with 1-3 vibration modes, and therefore may have a resonant frequency of less than 30 MHz, but the embodiments of the present disclosure are not limited thereto. For example, the resonant frequency of the piezoelectric vibration portion 21a may vary based on at least one or more of its shape, length, or thickness.

[0414] Referring to FIG20B, the piezoelectric vibration portion 21a according to another exemplary embodiment of the present disclosure may include a plurality of first portions 21a1 spaced apart from each other in a first direction X and a second direction Y, and a second portion 21a2 disposed between the plurality of first portions 21a1.

[0415] Each of the plurality of first portions 21a1 may have a planar structure with a circular shape. For example, each of the plurality of first portions 21a1 may have a circular plate shape, but the embodiments of this disclosure are not limited thereto. For example, each of the plurality of first portions 21a1 may have a point shape including an elliptical shape, a polygonal shape, a ring shape, etc. Each of the plurality of first portions 21a1 may include a piezoelectric material substantially the same as the piezoelectric material of the first portion 21a1 described above with reference to FIG19, therefore similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0416] The second portion 21a2 may be disposed between the plurality of first portions 21a1 in each of the first direction X and the second direction Y. The second portion 21a2 may be constructed to surround each of the plurality of first portions 21a1, and thus may be connected to or attached to the side surface of each of the plurality of first portions 21a1. The plurality of first portions 21a1 and second portions 21a2 may be arranged in parallel (or arranged) on the same plane (or the same layer). The second portion 21a2 may comprise an organic material substantially the same as the organic material of the second portion 21a2 described above with reference to FIG19, therefore similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0417] Referring to FIG20C, in a vibration device 21 according to another exemplary embodiment of the present disclosure, the piezoelectric vibration portion 21a may include a plurality of first portions 21a1 spaced apart from each other in a first direction X and a second direction Y, and a second portion 21a2 disposed between the plurality of first portions 21a1.

[0418] Each of the plurality of first portions 21a1 may have a planar structure in the shape of a triangle. For example, each of the plurality of first portions 21a1 may have a triangular shape, but embodiments of the present disclosure are not limited thereto. Each of the plurality of first portions 21a1 may include a piezoelectric material substantially the same as the piezoelectric material of the first portion 21a1 described above with reference to FIG19. Therefore, similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0419] According to an exemplary embodiment of this disclosure, four adjacent first portions 21a1 of a plurality of first portions 21a1 may be arranged adjacent to each other to form a quadrilateral shape (or a square shape). The vertex of each of the four adjacent first portions 21a1 forming the quadrilateral shape may be arranged to be adjacent to the middle portion (or center portion) of the quadrilateral shape.

[0420] The second portion 21a2 may be disposed between the plurality of first portions 21a1 in each of the first direction X and the second direction Y. The second portion 21a2 may be constructed to surround each of the plurality of first portions 21a1, and thus may be connected to or attached to the side surface of each of the plurality of first portions 21a1. The plurality of first portions 21a1 and second portions 21a2 may be arranged in parallel (or arranged) on the same plane (or the same layer). The second portion 21a2 may comprise an organic material substantially the same as the organic material of the second portion 21a2 described above with reference to FIG19, therefore similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0421] Referring to FIG20D, in a vibration device 21 according to another exemplary embodiment of the present disclosure, the piezoelectric vibration portion 21a may include a plurality of first portions 21a1 spaced apart from each other in a first direction X and a second direction Y, and a second portion 21a2 disposed between the plurality of first portions 21a1.

[0422] According to an exemplary embodiment of this disclosure, six adjacent first portions 21a1 of a plurality of first portions 21a1 may be configured to be adjacent to each other to form a hexagonal shape (or a regular hexagonal shape). The vertex of each of the six adjacent first portions 21a1 forming the hexagonal shape may be configured to be adjacent to the middle portion (or center portion) of the hexagonal shape.

[0423] The second portion 21a2 may be disposed between the plurality of first portions 21a1 in each of the first direction X and the second direction Y. The second portion 21a2 may be constructed to surround each of the plurality of first portions 21a1, and thus may be connected to or attached to the side surface of each of the plurality of first portions 21a1. The plurality of first portions 21a1 and second portions 21a2 may be arranged in parallel (or arranged) on the same plane (or the same layer). The second portion 21a2 may comprise an organic material substantially the same as the organic material of the second portion 21a2 described above with reference to FIG19, therefore similar reference numerals refer to similar elements, and repeated descriptions thereof are omitted for brevity.

[0424] Figure 21 illustrates a vibration generator 20 according to another exemplary embodiment of the present disclosure, while Figure 22 is an example of a cross-sectional view taken along line IV-IV′ shown in Figure 21. Figure 17 illustrates an example of a cross-sectional surface taken along line II-II′ shown in Figure 21. Figures 21 and 22 illustrate exemplary embodiments implemented by modifying the connection structure between the electrode portion and the signal cable shown in Figure 17. Therefore, in the following description, elements other than the electrode portion, signal cable, and related components are indicated by similar reference numerals, and for brevity, repeated descriptions of them may be omitted or will be briefly given.

[0425] Referring to Figures 21 and 22, a vibration generator 20 according to another exemplary embodiment of the present disclosure may include a first vibration generating portion 21-1 and a second vibration generating portion 21-2, a first signal cable 30a and a second signal cable 30b.

[0426] The first vibration generating portion 21-1 and the second vibration generating portion 21-2 may be configured to be spaced apart from each other and electrically disconnected (or isolated) in the first direction X. Each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 may include a piezoelectric vibration portion 21a, a first electrode portion 21b, and a second electrode portion 21c.

[0427] The first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be arranged spaced apart from each other and electrically disconnected (or isolated) in the first direction X. Each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can alternately and repeatedly contract and expand based on the piezoelectric effect to vibrate. For example, the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be arranged or laid flat at a certain interval D1 in the first direction X. Therefore, the vibration device 21 in which the first vibration generating portion 21-1 and the second vibration generating portion 21-2 are laid flat can be a vibration array, a vibration array portion, a vibration module array portion, a vibration array structure, a flat vibration array, a flat array module, or a flat vibration membrane.

[0428] Each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 according to the exemplary embodiments of this disclosure may have a quadrilateral shape. For example, each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 may have a quadrilateral shape with a width of 5 cm or more. For example, each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 may have a square shape with a size of 5 cm × 5 cm or more, but the embodiments of this disclosure are not limited thereto.

[0429] Each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be set or laid flat on the same plane. Therefore, the vibration device 21 can be realized to have a large area by laying flat the first vibration generating portion 21-1 and the second vibration generating portion 21-2, which have relatively small sizes.

[0430] The first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be arranged at a certain interval or laid flat, thus enabling them to be implemented as a single vibration device (or a single vibration device) driven as a complete unit without the need for independent drive. According to an exemplary embodiment of this disclosure, with respect to the first direction X, the first separation distance D1 between the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be greater than 0.1 mm and less than 3 cm, but the embodiments of this disclosure are not limited thereto.

[0431] According to an exemplary embodiment of this disclosure, the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be arranged or tiled with a separation distance (or interval) D1 of 0.1 mm or more and less than 3 cm, thus enabling them to be driven as a vibration device. The sound pressure level characteristics and sound reproduction band of the sound generated by the individual vibrations of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be increased. For example, the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be arranged with an interval D1 of 0.1 mm or more and less than 5 mm to increase the sound reproduction band of the sound generated by the individual vibrations of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2, and to increase the sound pressure level characteristics of the low-pitched sound band (e.g., below 500 Hz).

[0432] According to an exemplary embodiment of this disclosure, when the first vibration generating portion 21-1 and the second vibration generating portion 21-2 are arranged with a spacing D1 of less than 0.1 mm or without a spacing D1, the reliability of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 or the vibration device 21 may be reduced due to damage or cracks caused by physical contact between the first vibration generating portion 21-1 and the second vibration generating portion 21-2 when they are vibrating.

[0433] According to an exemplary embodiment of this disclosure, when the first vibration generating portion 21-1 and the second vibration generating portion 21-2 are arranged at a spacing D1 of 3 cm or more, the first vibration generating portion 21-1 and the second vibration generating portion 21-2 cannot be driven as a single vibration device due to the independent vibration of each of them. Therefore, the sound pressure level characteristics and sound reproduction band of the sound generated based on the vibration of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be reduced. For example, when the first vibration generating portion 21-1 and the second vibration generating portion 21-2 are arranged at a spacing D1 of 3 cm or more, each of the sound characteristics and sound pressure level characteristics in the low-pitched sound frequency band (e.g., below 500 Hz) can be reduced.

[0434] According to an exemplary embodiment of this disclosure, when the first vibration generating portion 21-1 and the second vibration generating portion 21-2 are arranged at a 5mm interval D1, each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 may not be driven as a vibration device. Therefore, each of the sound characteristics and sound pressure level characteristics in the low-pitched audio frequency band (e.g., below 200Hz) may be reduced.

[0435] According to another exemplary embodiment of this disclosure, when the first vibration generating portion 21-1 and the second vibration generating portion 21-2 are arranged with a 1 mm interval D1, the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be driven as a vibration device. Therefore, the sound reproduction frequency band can be increased, and the sound pressure level characteristics of the sound in the low-pitched audio band (e.g., below 500 Hz) can be increased. For example, when the first vibration generating portion 21-1 and the second vibration generating portion 21-2 are arranged with a 1 mm interval D1, the separation distance between the first vibration generating portion 21-1 and the second vibration generating portion 21-2 can be optimized. Therefore, the vibration device 21 can be implemented as a vibrator with a large area. Therefore, the vibration device 21 can be driven as a large-area vibrator based on the individual vibrations of the first vibration generating portion 21-1 and the second vibration generating portion 21-2, thereby increasing or enhancing the sound reproduction frequency band and the sound pressure level characteristics and sound characteristics in the low-pitched audio band generated by the large-area vibration of the vibration device 21.

[0436] Therefore, in order to achieve individual vibration (or a single vibration device) of the first vibration generating part 21-1 and the second vibration generating part 21-2, the separation distance D1 between the first vibration generating part 21-1 and the second vibration generating part 21-2 can be adjusted to be 0.1 mm or more and less than 3 cm. Furthermore, in order to increase the sound pressure level characteristics of the low-pitched audio band along with achieving individual vibration (or a single vibration device) of the first vibration generating part 21-1 and the second vibration generating part 21-2, the separation distance D1 between the first vibration generating part 21-1 and the second vibration generating part 21-2 can be adjusted to be 0.1 mm or more and less than 5 mm.

[0437] Each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 according to an exemplary embodiment of the present disclosure may include a piezoelectric vibration portion 21a, a first electrode portion 21b, and a second electrode portion 21c.

[0438] The piezoelectric vibration portion 21a of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 may include a piezoelectric material (or an electroactive material) having a piezoelectric effect. For example, the piezoelectric vibration portion 21a of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 may be substantially the same as one of the vibration portions 21a described above with reference to FIG1, therefore, for the sake of brevity, its repeated description is omitted.

[0439] According to an exemplary embodiment of the present disclosure, each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 may include one or different piezoelectric vibration portions 21a among the piezoelectric vibration portions 21a described above with reference to FIG1.

[0440] The first signal cable 30a can be electrically connected to, or directly electrically connected to, the first electrode portion 21b and the second electrode portion 21c of the first vibration generating portion 21-1, and therefore can be integrated into the first vibration generating portion 21-1. For example, the first signal cable 30a can be electrically connected to the first electrode portion 21b and the second electrode portion 21c of the first vibration generating portion 21-1 without passing through the power line described above with reference to FIG14.

[0441] The second signal cable 30b can be electrically connected, or directly electrically connected, to the first electrode portion 21b and the second electrode portion 21c of the first vibration generating portion 21-2 on one side of the vibration generator 20, and therefore can be integrated into the second vibration generating portion 21-2. For example, the second signal cable 30b can be electrically connected to the first electrode portion 21b and the second electrode portion 21c of the second vibration generating portion 21-2 without passing through the power line and pad portions described above with reference to FIG14.

[0442] Each of the first signal cable 30a and the second signal cable 30b according to an exemplary embodiment of the present disclosure may include a first protruding wire 31a and a second protruding wire 31b. For example, each of the first protruding wire 31a and the second protruding wire 31b may be referred to by terms such as power line, conductive wire, protruding electrode, extension wire, extension electrode, finger wire, or finger electrode, but the terminology is not limited thereto.

[0443] The first protruding wire 31a (or the first upper protruding wire 31a1) of the first signal cable 30a may overlap with at least a portion of the first electrode portion 21b of the first vibration generating portion 21-1 and may be electrically connected to, or directly electrically connected to, the first electrode portion 21b. The second protruding wire 31b (or the first lower protruding wire 31b1) of the first signal cable 30a may overlap with at least a portion of the second electrode portion 21c of the first vibration generating portion 21-1 and may be electrically connected to, or directly electrically connected to, the second electrode portion 21c. For example, each of the first protruding wire 31a and the second protruding wire 31b of the first signal cable 30a may be bent toward the corresponding electrode portions 21b and 21c of the first vibration generating portion 21-1, but the embodiments of this disclosure are not limited thereto.

[0444] The first protruding wire 31a (or the second upper protruding wire 31a2) of the second signal cable 30b may overlap with at least a portion of the first electrode portion 21b of the second vibration generating portion 21-2 and may be electrically connected to, or directly electrically connected to, the first electrode portion 21b. The second protruding wire 31b (or the second lower protruding wire 31b2) of the second signal cable 30b may overlap with at least a portion of the second electrode portion 21c of the second vibration generating portion 21-2 and may be electrically connected to, or directly electrically connected to, the second electrode portion 21c. For example, each of the first protruding wire 31a and the second protruding wire 31b of the second signal cable 30b may be bent toward the corresponding electrode portions 21b and 21c of the second vibration generating portion 21-2, but the embodiments of this disclosure are not limited thereto.

[0445] Each of the first signal cable 30a and the second signal cable 30b according to an exemplary embodiment of the present disclosure may include a main body portion, a first protruding wire 31a and a second protruding wire 31b, and sound processing circuits 40a and 40b. Each of the first signal cable 30a and the second signal cable 30b may be substantially the same as the signal cable 30 described above with reference to Figures 13 to 17; therefore, similar reference numerals refer to similar elements, and for the sake of brevity, repeated descriptions of them may be omitted or briefly given below.

[0446] The sound processing circuit (or first sound processing circuit) 40a, installed or integrated in the first signal cable 30a, can generate a first vibration drive signal and a second vibration drive signal based on sound data provided from an external sound data generation circuit section. The first and second vibration drive signals can be provided to the first electrode section 21b and the second electrode section 21c of the first vibration generation section 21-1 via the first protruding line 31a and the second protruding line 31b. The sound processing circuit 40a installed in the first signal cable 30a may include a decoding section, an audio amplifier circuit, a storage circuit, a control circuit, and passive components such as resistors. These components may be substantially the same as those in the signal generation circuit 40 described above with reference to FIG14 or FIG16; therefore, similar reference numerals refer to similar components, and repeated descriptions of them may be omitted for brevity. For example, the signal generation circuit 40 may be referred to as a signal generation circuit and a vibration drive circuit, but the terminology is not limited thereto.

[0447] The sound processing circuit (or second sound processing circuit) 40b, mounted on or integrated into the second signal cable 30b, can generate a first vibration drive signal and a second vibration drive signal circuit based on sound data provided from an external sound data generation circuit. The first and second vibration drive signals can be provided to the first electrode portion 21b and the second electrode portion 21c of the second vibration generation portion 21-2 via the first protruding line 31a and the second protruding line 31b. The sound processing circuit 40b mounted in the second signal cable 30b may include a decoding unit, an audio amplifier circuit, a storage circuit, a control circuit, and passive components such as resistors. These components may be substantially the same as those in the signal generation circuit 40 described above with reference to FIG14 or FIG16; therefore, similar reference numerals refer to similar components, and repeated descriptions may be omitted for brevity.

[0448] The vibration generator 20 according to another exemplary embodiment of this disclosure may further include a first cover member 21e and a second cover member 21f. Except that the first cover member 21e and the second cover member 21f are configured to cover each of the first vibration generating portions 21-1 and the second vibration generating portions 21-2, and the first protruding line 31a and the second protruding line 31b of each of the first signal cables 30a and the second signal cables 30b, the first cover member 21e and the second cover member 21f may be substantially identical to each of the first cover member 21e and the second cover member 21f described above with reference to FIGS. 13 to 18. Therefore, similar reference numerals refer to similar elements, and for brevity, their repeated descriptions may be omitted or will be briefly given below.

[0449] The first cover member 21e may be disposed on the first surface of the vibration device 21. For example, the first cover member 21e may be constructed to the first electrode portion 21b of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2, and the first protruding line 31a of each of the first signal cable 30a and the second signal cable 30b.

[0450] The second cover member 21f may be disposed on the second surface of the vibration device 21. For example, the second cover member 21f may be configured to cover the second electrode portion 21c of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2, as well as the second protruding line 31b of each of the first signal cable 30a and the second signal cable 30b.

[0451] According to an exemplary embodiment of this disclosure, the first cover member 21e can be connected or coupled via a first adhesive layer 21d to the first electrode portion 21b of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2, and to the first protruding wire 31a of each of the first signal cables 30a and the second signal cables 30b. Therefore, the first protruding wire (or first finger wire) 31a of each of the first signal cables 30a and the second signal cables 30b can be disposed between the first electrode portion 21b of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2 and the first cover member 21e, and can be integrally formed (or integrated) with the vibration device 21.

[0452] According to an exemplary embodiment of this disclosure, the second cover member 21f can be connected or coupled via a second adhesive layer 21g to the second electrode portion 21c of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2, and to the second protruding wire 31b of each of the first signal cable 30a and the second signal cable 30b. Therefore, the second protruding wire (or second finger wire) 31b of each of the first signal cable 30a and the second signal cable 30b can be disposed between the second electrode portion 21c of each of the first vibration generating portion 21-1 and the second cover member 21f, and can be integrally formed (or integrated) with the vibration device 21.

[0453] A first adhesive layer 21d may be disposed between the first vibration generating portion 21-1 and the second vibration generating portion 21-2 and on a first surface of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2. A second adhesive layer 21g may be disposed between the first vibration generating portion 21-1 and the second vibration generating portion 21-2 and on a second surface of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2. For example, the first adhesive layer 21d and the second adhesive layer 21g may be disposed between the first cover member 21e and the second cover member 21f to completely (or entirely) surround each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2. The first adhesive layer 21d and the second adhesive layer 21g may be connected or coupled between the first vibration generating portion 21-1 and the second vibration generating portion 21-2.

[0454] In another example, at least a portion of each of the first signal cable 30a and the second signal cable 30b may be disposed or inserted (or accommodated) between the first cover member 21e and the second cover member 21f, thereby preventing short circuits (or shorting of) of the first protruding wire 31a and the second protruding wire 31b caused by movement or bending of the signal cable 30.

[0455] As described above, the vibration generator 20 according to another exemplary embodiment of the present disclosure can be driven as a large-area vibrator based on individual vibration. Furthermore, in the vibration generator 20 according to another exemplary embodiment of the present disclosure, similar to the vibration generator 20 described above with reference to FIGS. 16 to 19, the structure and manufacturing process can be simplified, the electrical characteristics of each electrode portion 21b and 21c can be supplemented, the connection structure between the vibration generation portions 21-1 and 21-2, the sound processing circuits 40a and 40b, the signal cables 30a and 30b, and the sound data generation circuit portion can be simplified, and the filter circuit including inductors and capacitors for preventing electromagnetic interference (EMI) can be omitted.

[0456] In another example, in the vibration generator 20 according to another exemplary embodiment of the present disclosure, a single signal cable 30 can be used to replace or construct the first signal cable 30a and the second signal cable 30b. The signal cable 30 according to the exemplary embodiment of the present disclosure can be simply constructed without modifying the structure of the first signal cable 30a and the second signal cable 30b, and therefore can have a width greater than the sum of the widths of the first signal cable 30a and the second signal cable 30b. The signal cable 30 according to another exemplary embodiment of the present disclosure can be constructed such that an edge portion (or a peripheral portion) of the main body on which the first sound processing circuit 40a and the second sound processing circuit 40b are mounted has a relative width, and the other portions of the main body, excluding said edge portion (or said peripheral portion), have the same width as one of the widths of the first signal cable 30a and the second signal cable 30b.

[0457] Signal generation circuit 40

[0458] Figure 23 illustrates a vibration generator 20 according to another exemplary embodiment of the present disclosure. Figure 23 illustrates an example in which four vibration generating sections are provided in the vibration generator shown in Figures 16 and 21. Therefore, in the following, other elements besides the four vibration generating sections and related components are referred to by similar reference numerals, and for the sake of brevity, their repeated descriptions may be omitted or will be briefly given. Figure 17 illustrates an example of a cross-sectional surface taken along line II-II′ of Figure 23, and Figure 22 illustrates an example of a cross-sectional surface taken along line IV-IV′ shown in Figure 23.

[0459] Referring to FIG. 23 in conjunction with FIG. 17 and FIG. 22, a vibration generator 20 according to another exemplary embodiment of the present disclosure may include a plurality of vibration generating portions 21-1 to 21-4, a first signal cable 30a, and a second signal cable 30b.

[0460] Multiple vibration generating portions 21-1 to 21-4 can be electrically disconnected (or isolated) in each of the first direction X and the second direction Y and are spaced apart from each other. For example, the multiple vibration generating portions 21-1 to 21-4 can be arranged or tiled in an i×j configuration. Each of the multiple vibration generating portions 21-1 to 21-4 may include a piezoelectric vibration portion 21a, a first electrode portion 21b, and a second electrode portion 21c. Each of the multiple vibration generating portions 21-1 to 21-4 can be substantially the same as each of the multiple vibration generating portions 21-1 to 21-4 of the vibration device 21 described above with reference to FIG21; therefore, similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity. In the following description, an example of a vibration generator 20 including the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 will be described.

[0461] The first signal cable 30a can be electrically connected, or directly electrically connected, to the first electrode portion 21b and the second electrode portion 21c of each of the first vibration generating portion 21-1 and the third vibration generating portion 21-3 on one side of the vibration device 21, and therefore can be integrated into the first vibration generating portion 21-1 and the third vibration generating portion 21-3. For example, the first signal cable 30a can be electrically connected to the first electrode portion 21b and the second electrode portion 21c of each of the first vibration generating portion 21-1 and the third vibration generating portion 21-3 without passing through the power line and pad portions described above with reference to FIG21.

[0462] The second signal cable 30b can be electrically connected, or directly electrically connected, to the first electrode portion 21b and the second electrode portion 21c of each of the second vibration generating portions 21-2 and 21-4 on one side of the vibration device 21, and therefore can be integrated into the second vibration generating portions 21-2 and 21-4. For example, in the case described above with reference to FIG21 without the power line and pad portion, the second signal cable 30b can be electrically connected to the first electrode portion 21b and the second electrode portion 21c of each of the second vibration generating portions 21-2 and 21-4.

[0463] Each of the first signal cable 30a and the second signal cable 30b according to an exemplary embodiment of the present disclosure may include a first protruding wire 31a and a second protruding wire 31b. For example, each of the first protruding wire 31a and the second protruding wire 31b may be referred to by terms such as protruding electrode, extension wire, extension electrode, finger wire, or finger electrode, but the terminology is not limited thereto.

[0464] The first protruding wire 31a (or the first upper protruding wire 31a1) of the first signal cable 30a may overlap with at least a portion of the first electrode portion 21b of each of the first vibration generating portion 21-1 and the third vibration generating portion 21-3, and may be electrically connected to or directly electrically connected to the first electrode portion 21b. The second protruding wire 31b (or the first lower protruding wire 31b1) of the first signal cable 30a may overlap with at least a portion of the second electrode portion 21c of each of the first vibration generating portion 21-1 and the third vibration generating portion 21-3, and may be electrically connected to or directly electrically connected to the second electrode portion 21c. For example, each of the first protruding wire 31a and the second protruding wire 31b of the first signal cable 30a may be bent toward the corresponding electrode portions 21b and 21c of each of the first vibration generating portion 21-1 and the third vibration generating portion 21-3, but the embodiments of this disclosure are not limited thereto.

[0465] The first protruding wire 31a (or the second upper protruding wire 31a2) of the second signal cable 30b may overlap with at least a portion of the first electrode portion 21b of each of the second vibration generating portions 21-2 and the fourth vibration generating portions 21-4, and may be electrically connected to or directly electrically connected to the first electrode portion 21b. The second protruding wire 31b (or the second lower protruding wire 31b2) of the second signal cable 30b may overlap with at least a portion of the second electrode portion 21c of each of the second vibration generating portions 21-2 and the fourth vibration generating portions 21-4, and may be electrically connected to or directly electrically connected to the second electrode portion 21c. For example, each of the first protruding wire 31a and the second protruding wire 31b of the second signal cable 30b may be bent toward the corresponding electrode portions 21b and 21c of each of the second vibration generating portions 21-2 and the fourth vibration generating portions 21-4, but the embodiments of this disclosure are not limited thereto.

[0466] Each of the first signal cable 30a and the second signal cable 30b according to an exemplary embodiment of the present disclosure may include a main body portion, a first protruding wire 31a and a second protruding wire 31b, and sound processing circuits 40a and 40b. Each of the first signal cable 30a and the second signal cable 30b may be substantially the same as the signal cable 30 described above with reference to Figures 13 to 17; therefore, similar reference numerals refer to similar elements, and for the sake of brevity, repeated descriptions of them may be omitted or will be briefly given below.

[0467] The sound processing circuit (or first sound processing circuit) 40a, mounted on or integrated into the first signal cable 30a, can generate a first vibration drive signal and a second vibration drive signal based on sound data provided from an external sound data generation circuit. The first and second vibration drive signals can be provided to the first electrode portion 21b and the second electrode portion 21c of each of the first vibration generation portion 21-1 and the third vibration generation portion 21-3 via the first protruding line 31a and the second protruding line 31b. The sound processing circuit 40a mounted in the first signal cable 30a may include a decoding unit, an audio amplifier circuit, a storage circuit, a control circuit, and passive components such as resistors. These components may be substantially the same as those in the signal generation circuit 40 described above with reference to FIG14 or FIG16; therefore, similar reference numerals refer to similar components, and repeated descriptions of them may be omitted for brevity.

[0468] The sound processing circuit (or second sound processing circuit) 40b, mounted on or integrated into the second signal cable 30b, can generate a first vibration drive signal and a second vibration drive signal circuit based on sound data provided from an external sound data generation circuit. The first and second vibration drive signals can be provided to the first electrode portion 21b and the second electrode portion 21c of each of the second vibration generation portions 21-2 and the fourth vibration generation portions 21-4 via the first protruding line 31a and the second protruding line 31b. The sound processing circuit 40b mounted in the second signal cable 30b may include a decoding unit, an audio amplifier circuit, a storage circuit, a control circuit, and passive components such as resistors. These components may be substantially the same as those in the signal generation circuit 40 described above with reference to FIG14 or FIG16; therefore, similar reference numerals refer to similar components, and repeated descriptions of them may be omitted for brevity.

[0469] The vibration generator 20 according to another exemplary embodiment of this disclosure may further include a first cover member 21e and a second cover member 21f. Except that the first cover member 21e and the second cover member 21f are configured to cover each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 and the first protruding line 31a and the second protruding line 31b of each of the first signal cables 30a and the second signal cables 30b, the first cover member 21e and the second cover member 21f may be substantially identical to each of the first cover member 21e and the second cover member 21f described above with reference to FIGS. 13 to 22. Therefore, similar reference numerals refer to similar elements, and for brevity, their repeated descriptions may be omitted or briefly given below.

[0470] The first cover member 21e may be disposed on the first surface of the vibration device 21. For example, the first cover member 21e may be configured as a first electrode portion 21b of each of the first vibration generating portion 21-1 and the second vibration generating portion 21-2, and a first protruding line 31a of each of the first signal cable 30a and the second signal cable 30b.

[0471] The second cover member 21f may be disposed on the second surface of the vibration device 21. For example, the second cover member 21f may be configured to the second electrode portion 21c of each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 and the second protruding line 31b of each of the first signal cable 30a and the second signal cable 30b.

[0472] According to an exemplary embodiment of this disclosure, the first cover member 21e can be connected or coupled via a first adhesive layer 21d to a first electrode portion 21b of each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 and a first protruding wire 31a of each of the first signal cables 30a and the second signal cables 30b. Therefore, the first protruding wire (or first finger wire) 31a of each of the first signal cables 30a and the second signal cables 30b can be disposed between the first electrode portion 21b of each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 and the first cover member 21e, and can be integrally formed (or integrated) with the vibration device 21.

[0473] According to an exemplary embodiment of this disclosure, the second cover member 21f can be connected or coupled via a second adhesive layer 21g to the second electrode portion 21c of each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 and the second protruding wire 31b of each of the first signal cables 30a and the second signal cables 30b. Therefore, the second protruding wire (or second finger wire) 31b of each of the first signal cables 30a and the second signal cables 30b can be disposed between the second electrode portion 21c of each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 and the second cover member 21f, and can be integrally formed (or integrated) with the vibration device 21.

[0474] A first adhesive layer 21d may be disposed between the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 and on the first surface of each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4. A second adhesive layer 21g may be disposed between the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4 and on the second surface of each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4. For example, the first adhesive layer 21d and the second adhesive layer 21g may be disposed between the first cover member 21e and the second cover member 21f to completely surround each of the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4. The first adhesive layer 21d and the second adhesive layer 21g may be connected or joined between the first vibration generating portions 21-1 to the fourth vibration generating portions 21-4.

[0475] At least a portion of each of the first signal cable 30a and the second signal cable 30b can be disposed or inserted (or accommodated) between the first cover member 21e and the second cover member 21f, thereby preventing short circuits (or shorting) of the first protruding wire 31a and the second protruding wire 31b caused by movement or bending of the signal cable 30.

[0476] As described above, similar to the vibration generator 20 described with reference to FIG23, the vibration generator 20 according to another exemplary embodiment of the present disclosure can be driven as a large-area vibrator based on the individual vibrations of the first vibration generating portion 21-1 to the fourth vibration generating portion 21-4. Furthermore, in the vibration generator 20 according to another exemplary embodiment of the present disclosure, similar to the vibration generator 20 described with reference to FIGS. 16 to 19, the structure and manufacturing process can be simplified, the electrical characteristics of each electrode portion 21b and 21c can be supplemented, the connection structure between the first vibration generating portion 21-1 to the fourth vibration generating portion 21-4, the sound processing circuits 40a and 40b, the signal cables 30a and 30b, and the sound data generation circuit section can be simplified, and the filter circuit including inductors and capacitors for preventing electromagnetic interference (EMI) can be omitted.

[0477] In another example, in the vibration generator 20 according to another exemplary embodiment of the present disclosure, as shown by the dashed lines in FIG23, a single signal cable 30 can be used to replace or construct the first signal cable 30a and the second signal cable 30b. Without modifying the structure of the first signal cable 30a and the second signal cable 30b, the single signal cable 30 according to the exemplary embodiment of the present disclosure can be simply constructed as a single cable, and therefore can have a width greater than the sum of the widths of the first signal cable 30a and the second signal cable 30b. The single signal cable 30 according to another exemplary embodiment of the present disclosure can be constructed such that an edge portion (or a peripheral portion) of the main body on which the first sound processing circuit 40a and the second sound processing circuit 40b are mounted has a relative width, and the other portions of the main body, excluding said edge portion (or said peripheral portion), have the same width as one of the widths of the first signal cable 30a and the second signal cable 30b.

[0478] Figure 24 illustrates a device according to another exemplary embodiment of the present disclosure, Figure 25 illustrates an example of the main cable and the first signal cable to the nth signal cable shown in Figure 24, and Figure 26 is an example of a waveform diagram illustrating the output signal of the audio data generation circuit section shown in Figure 23.

[0479] Referring to Figures 24 to 26, the device according to an exemplary embodiment of the present disclosure may include a first vibration device 20[1] to an nth vibration device 20[n], a sound data generation circuit unit 50, a main cable 60, and a first signal cable 30[1] to an nth signal cable 30[n].

[0480] Each of the first vibration device 20[1] to the nth vibration device 20[n] can be one of the vibration devices described above with reference to Figures 1 to 23. For example, the first vibration device 20[1] to the nth vibration device 20[n] can be the same or different from each other. One or more of the first vibration device 20[1] to the nth vibration device 20[n] can be different from each other. Therefore, for the sake of brevity, repeated descriptions of each of the first vibration device 20[1] to the nth vibration device 20[n] can be omitted.

[0481] Each of the first vibration device 20[1] to the nth vibration device 20[n] may include one of the vibration devices 21[1] to 21[n]. For example, the vibration devices 21[1] to 21[n] of each of the first vibration device 20[1] to the nth vibration device 20[n] may be the same or different. One or more of the vibration devices 21[1] to 21[n] of the first vibration device 20[1] to the nth vibration device 20[n] may be different. Therefore, for the sake of brevity, repeated descriptions of the vibration devices 21[1] to 21[n] of each of the first vibration device 20[1] to the nth vibration device 20[n] may be omitted.

[0482] The sound data generation circuit unit 50 (or sound card) can generate sound data Sdata based on a sound source (or digital sound source). The sound data generation circuit unit 50 can generate a first enable signal EN[1] to an nth enable signal EN[n] corresponding to the drive mode of the device based on the sound source or sound data. The sound data generation circuit unit 50 can encode the reference clock CLK, the sound data Sdata, and the first enable signal EN[1] to an nth enable signal EN[n] based on a predetermined serial interface type (or digital serial interface type), and can provide the encoded reference clock CLK, the sound data Sdata, and the first enable signal EN[1] to an nth enable signal EN[n] to the first vibration device 20[1] to the nth vibration device 20[n]. For example, the sound data generation circuit unit 50 can transmit the sound data Sdata corresponding to each of the first vibration device 20[1] to the nth vibration device 20[n] based on the serial interface type. For example, the serial interface type can be integrated chip-to-chip audio (I2S), but the embodiments of this disclosure are not limited to this.

[0483] The main cable 60 can be connected to the sound data generation circuit section 50. For example, the main cable 60 can have a length corresponding to the longest distance between the sound data generation circuit section 50 and each of the first vibration device 20[1] to the nth vibration device 20[n].

[0484] The main cable 60 according to an exemplary embodiment of the present disclosure may include a first enable signal line ESL[1] to an nth enable signal line ESL[n], a clock line CL and a data line DL.

[0485] The audio data generation circuit 50 can provide first enable signals EN[1] to nth enable signals EN[n] corresponding to the first enable signal line ESL[1] to the nth enable signal line ESL[n], respectively, provide a reference clock CLK to the clock line CL, and provide audio data Sdata to the data line DL.

[0486] Each of the first signal cable 30[1] to the nth signal cable 30[n] can be connected between the main cable 60 and the corresponding vibration device among the first vibration device 20[1] to the nth vibration device 20[n].

[0487] According to an exemplary embodiment of this disclosure, each of the first signal cable 30[1] to the nth signal cable 30[n] may branch off from or extend from the main cable 60 to a corresponding vibration device among the first vibration devices 20[1] to the nth vibration devices 20[n]. For example, each of the first signal cable 30[1] to the nth signal cable 30[n] may branch off from or extend from the main cable 60 and may be individually connected to a corresponding vibration device among the first vibration devices 20[1] to the nth vibration devices 20[n].

[0488] According to another exemplary embodiment of this disclosure, each of the first signal cable 30[1] to the nth signal cable 30[n] may be connected to the main cable 60 based on a connector scheme. For example, the main cable 60 may also include the first connector 61[1] to the nth connector 61[n].

[0489] Each of the first connector 61[1] to the nth connector 61[n] may include a first connection terminal to a third connection terminal. The first connection terminal of each of the first connector 61[1] to the nth connector 61[n] may be electrically connected to the corresponding enable signal line in the first enable signal line ESL[1] to the nth enable signal line ESL[n]. The second connection terminal of each of the first connector 61[1] to the nth connector 61[n] may be electrically connected together to the clock line CL. The third connection terminal of each of the first connector 61[1] to the nth connector 61[n] may be electrically connected together to the data line DL.

[0490] According to an exemplary embodiment of this disclosure, as described above with reference to FIG16, at least a portion of each of the first signal cable 30[1] to the nth signal cable 30[n] connected to the main cable 60 according to the connector scheme can be inserted (or accommodated) between the first cover member 21e and the second cover member 21f of the vibration device 21, and its repeated description may be omitted for brevity.

[0491] Each of the first signal cable 30[1] to the nth signal cable 30[n] according to an exemplary embodiment of the present disclosure may include a main body portion, a first protruding wire 31a and a second protruding wire 31b, and a signal generation circuit 40.

[0492] As shown in FIG16, the main body may include a wiring layer 31, a lower film 32 connected to a first surface of the wiring layer 31 by a first adhesive 33, an upper film 34 connected to a second surface of the wiring layer 31 by a second adhesive 35, and a plurality of contact pads disposed on the upper film 34 and connected to the wiring layer 31.

[0493] The wiring layer 31 may include a first signal line SL1 to a third signal line SL3, a first drive signal supply line VLa, and a second drive signal supply line VLb.

[0494] The first signal line SL1 to the third signal line SL3 can be set to be parallel to each other.

[0495] The first signal line SL1 of each of the first signal cables 30[1] to the nth signal cable 30[n] can be individually connected to the corresponding enable signal line among the first enable signal lines ESL[1] to the nth enable signal lines ESL[n] of the main cable 60. For example, the first signal line SL1 of the first signal cable 30[1] can be electrically connected to the first enable signal line ESL[1] of the main cable 60, and the first signal line SL1 of the nth signal cable 30[n] can be electrically connected to the nth enable signal line ESL[n] of the main cable 60.

[0496] The second signal line SL2 of each of the first signal cable 30[1] to the nth signal cable 30[n] can be connected together to the clock line CL of the main cable 60.

[0497] The third signal line SL3 of each of the first signal cable 30[1] to the nth signal cable 30[n] can be connected together to the data line DL of the main cable 60.

[0498] Each of the first drive signal supply line VLa and the second drive signal supply line VLb can be arranged parallel to the end of the corresponding signal cable in the first signal cable 30[1] to the nth signal cable 30[n].

[0499] The first protruding line 31a and the second protruding line 31b can be electrically connected to the first drive signal supply line VLa and the second drive signal supply line VLb, respectively, or can pass through a side surface of the main body portion from the first drive signal supply line VLa and the second drive signal supply line VLb, respectively, and can extend or protrude.

[0500] The first protruding wire 31a can be electrically connected to the first electrode portion of the vibration device 21 of the corresponding vibration device, while the second protruding wire 31b can be electrically connected to the second electrode portion of the vibration device 21 of the corresponding vibration device. As described above, its repeated description can be omitted for the sake of brevity.

[0501] The signal processing circuit 40 can be installed on each of the first signal cable 30[1] to the nth signal cable 30[n], and can be electrically connected to each of the first signal line SL1 to the third signal line SL3 and each of the first drive signal supply line VLa and the second drive signal supply line VLb.

[0502] The signal processing circuit 40 can decode the reference clock CLK, sound data Sdata, and first enable signal EN[1] to nth enable signal EN[n] provided by the sound data generation circuit unit 50 through the first signal line SL1 to the third signal line SL3. Based on the decoded reference clock CLK, sound data Sdata, and first enable signal EN[1] to nth enable signal EN[n], it generates a first vibration drive signal and a second vibration drive signal for vibrating each of the first vibration devices 20[1] to nth vibration devices 20[n]. It outputs the first vibration drive signal and the second vibration drive signal to the first drive signal supply line VLa and the second drive signal supply line VLb. Therefore, each of the first vibration devices 20[1] to nth vibration devices 20[n] can vibrate based on the first vibration drive signal and the second vibration drive signal provided through the first drive signal supply line VLa and the second drive signal supply line VLb and the first protruding line 31a and the second protruding line 31b of the corresponding signal cable in the first signal cable 30[1] to the nth signal cable 30[n], so as to output a sound corresponding to the sound data Sdata. For example, each of the first vibration device 20[1] to the nth vibration device 20[n] may be driven sequentially or simultaneously based on the corresponding enable signal in the first enable signal EN[1] to the nth enable signal EN[n].

[0503] According to an exemplary embodiment of this disclosure, a signal processing circuit 40 installed on each of the first signal cable 30[1] to the nth signal cable 30[n] can be enabled based on an enable signal having a first logic level LL1 provided through the first signal line SL1 of the corresponding signal cable to generate a first vibration drive signal and a second vibration drive signal, or can be disabled based on a disable signal having a second logic level LL2. For example, the signal processing circuit 40 installed on the first signal cable 30[1] can be enabled based on a first enable signal EN[1] having a first logic level LL1 provided through the first signal line SL1 of the first enable signal EN, generate a first vibration drive signal and a second vibration drive signal based on a reference clock CLK and sound data Sdata, and output the first vibration drive signal and the second vibration drive signal to the first drive signal supply line VLa and the second drive signal supply line VLb. Similarly, the signal processing circuit 40 installed on the nth signal cable 30[n] can generate a first vibration drive signal and a second vibration drive signal based on the first signal line SL1 with a first logic level LL1 provided by the first signal line SL1 of the nth enable signal EN[n], and output the first vibration drive signal and the second vibration drive signal to the first drive signal supply line VLa and the second drive signal supply line VLb.

[0504] As described above, in the vibration device according to the exemplary embodiment of this disclosure, the sound data Sdata output from the sound data generation circuit unit 50 can be transmitted to each of the first vibration devices 20 [1] to the nth vibration device 20 [n] using the main cable 60 and the first signal cable 30 [1] to the nth signal cable 30 [n] based on a serial interface type. Therefore, the wiring structure between the sound data generation circuit unit 50 and the first vibration device 20 [1] to the nth vibration device 20 [n] can be simplified, and assemblability can be enhanced. Furthermore, since the signal processing circuit 40 is mounted on each of the first signal cable 30 [1] to the nth signal cable 30 [n], the circuit construction can be simplified, and the filter circuit including inductors and capacitors for preventing electromagnetic interference (EMI) due to the length of each of the main cable 60 and the first signal cable 30 [1] to the nth signal cable 30 [n] can be omitted.

[0505] Figure 27 illustrates a vibration device 5 according to another exemplary embodiment of the present disclosure, while Figure 28 illustrates an example of the vibration generator of Figure 27.

[0506] Referring to Figures 27 and 28, a vibration device 5 according to another exemplary embodiment of the present disclosure may include a vibrating plate 10, a vibration generator on the vibrating plate 10, and a connecting member between the vibrating plate 10 and the vibration generator. The vibration generator may include a first vibration structure having a first piezoelectric coefficient, a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a connecting portion 25 located between the first and second vibration structures. Here, the first and second vibration structures may be opposite each other with the connecting portion 25 between them, and may have, for example, a stacked structure. Therefore, the first vibration structure may be disposed in the first vibration generator 20a, and the second vibration structure may be disposed in the second vibration generator 20b.

[0507] The connecting portion 25 may include a foam pad, double-sided tape, or an adhesive with insulating properties, but embodiments of this disclosure are not limited thereto. For example, the adhesive layer of the connecting member 15 may include epoxy resin, acrylic resin, silicone, or polyurethane, but embodiments of this disclosure are not limited thereto. The connecting portion may be referred to by terms such as adhesive layer, connecting member, buffer layer, etc., but these terms are not limited thereto.

[0508] Figure 29 illustrates a signal processing circuit 40 according to an exemplary embodiment of the present disclosure, while Figure 30 illustrates the displacement of a vibration generator according to an exemplary embodiment of the present disclosure.

[0509] Referring to Figures 29 and 30, the signal circuit 40 according to an exemplary embodiment of the present disclosure can be electrically connected to the vibration device 5, and can generate a vibration drive signal based on a sound source, and can provide the vibration drive signal to the vibration device 5, thereby causing the vibration device 5 to vibrate or displace.

[0510] The signal processing circuit 40 according to an exemplary embodiment of the present disclosure may include a plurality of amplifiers 41 and 42 connected to each of the plurality of vibration generators 20a and 20b of the constructed vibration device 5. For example, the signal processing circuit 40 may include a first amplifier 41 and a second amplifier 42, each respectively connected to the first vibration generator 20a and the second vibration generator 20b of the constructed vibration device 5. For example, the vibration driving circuit may be referred to as a signal generation circuit and a sound processing circuit, but the terminology is not limited thereto.

[0511] The first amplifier 41 can generate an AC vibration drive signal, including a first vibration drive signal and a second vibration drive signal, based on a sound source.

[0512] According to an exemplary embodiment of the present disclosure, the first amplifier 41 may include a first output terminal T11 for outputting a first vibration drive signal and a second output terminal T12 for outputting a second vibration drive signal.

[0513] In the first amplifier 41, the first output terminal T11 can be electrically connected to one of the first electrode portion 21b and the second electrode portion 21c of the first vibration generator 20a. The second output terminal T12 can be electrically connected to the other of the first electrode portion 21b and the second electrode portion 21c of the first vibration generator 20a. For example, the first output terminal T11 of the first amplifier 41 can be electrically connected to the first electrode portion 21b of the first vibration generator 20a, while the second output terminal T12 of the first amplifier 41 can be electrically connected to the second electrode portion 21c of the first vibration generator 20a. For example, the first vibration drive signal output from the first output terminal T11 of the first amplifier 41 can be provided to the first electrode portion 21b via the flexible cable 29 and the pad portion 27 of the first vibration generator 20a and the first power line PL1. The second vibration drive signal output from the second output terminal T12 of the first amplifier 41 can be provided to the second electrode portion 21c via the flexible cable 29 and the pad portion 27 of the first vibration generator 20a and the second power line PL2.

[0514] The second amplifier 42 according to an exemplary embodiment of the present disclosure may include a first output terminal T21 for outputting a first vibration drive signal and a second output terminal T22 for outputting a second vibration drive signal.

[0515] The first output terminal T21 and the second output terminal T22 of the first amplifier 42 can be connected to the first electrode 21b and the second electrode 21c of the second vibration generator 20a, respectively, so that the second vibration generator 20b is displaced (or vibrates or is driven) in the same direction as the displacement direction of the first vibration generator 20a. In the second amplifier 42, the first output terminal T21 can be electrically connected to one of the first electrode portion 21b and the second electrode portion 21c of the second vibration generator 20b. The second output terminal T22 can be electrically connected to the other of the first electrode portion 21b and the second electrode portion 21c of the second vibration generator 20b. For example, the first output terminal T21 of the second amplifier 42 can be electrically connected to the second electrode portion 21c of the second vibration generator 20b, while the second output terminal T12 of the second amplifier 42 can be electrically connected to the first electrode portion 21b of the second vibration generator 20b. For example, the first vibration drive signal output from the first output terminal T21 of the second amplifier 42 can be provided to the second electrode portion 21c via the flexible cable 29 and the pad portion 27 of the second vibration generator 20b and the second power line PL2. The second vibration drive signal output from the second output terminal T22 of the second amplifier 42 can be provided to the first electrode portion 21b via the flexible cable 29 and pad portion 27 of the second vibration generator 20b and the first power line PL1.

[0516] In Figure 29 and the related description, the signal processing circuit 40 according to an exemplary embodiment of the present disclosure is described as including a first amplifier 41 and a second amplifier 42, but embodiments of the present disclosure are not limited thereto. For example, the signal processing circuit 40 according to an exemplary embodiment of the present disclosure may include a plurality (e.g., three or more) of amplifiers 41 and 42 corresponding to the number of vibration generators 20a and 20b included in the vibration device 5. Each of the three or more amplifiers 41 and 42 may provide a vibration drive signal for displacing the three or more vibration generators 20a and 20b in the same direction. According to an exemplary embodiment of the present disclosure, the three or more vibration generators 20a and 20b may include a first group and a second group, and the plurality of amplifiers 41 and 42 may include the first group and the second group, such that the three or more vibration generators 20a and 20b are displaced (or vibrate or driven) in the same direction.

[0517] The vibration generators 20a in the first group (e.g., odd-numbered vibration generators) can be displaced by a vibration drive signal applied from amplifier 41 (e.g., odd-numbered amplifier) ​​in the first amplifier group, while the vibration generators 20b in the second group (e.g., even-numbered vibration generators) can be displaced by a vibration drive signal applied from amplifier 42 (e.g., even-numbered amplifier) ​​in the second amplifier group. Therefore, three or more vibration generators 20a and 20b can be displaced (or vibrate or be driven) in the same direction. For example, in amplifier 41 of the first amplifier group, a first output terminal T11 can be electrically connected to the first electrode portion 21b of the vibration generator 20a in the first group, and a second output terminal T12 can be electrically connected to the second electrode portion 21c of the vibration generator 20a in the first group. Furthermore, in amplifier 42 of the second amplifier group, a first output terminal T21 can be electrically connected to the second electrode portion 21c of the vibration generator 20b in the second group, and a second output terminal T22 can be electrically connected to the first electrode portion 21b of the vibration generator 20b in the second group.

[0518] Referring to FIG30, the first vibration generator 20a and the second vibration generator 20b according to an exemplary embodiment of the present disclosure can be displaced (or vibrate or be driven) with a third amplitude DW3 relative to the thickness direction Z of the vibrating plate 10 based on a vibration drive signal. Based on the overlapping layered structure of the first vibration generator 20a and the second vibration generator 20b, the first vibration generator 20a and the second vibration generator 20b can be displaced (or vibrate or be driven) in the same direction. Therefore, a vibration device including the layered structure of the first vibration generator 20a and the second vibration generator 20b can be displaced (or vibrated or be driven) with a relatively larger amplitude than a vibration device including a single vibration generator or a vibration generator with a single structure. For example, the vibration portion 21a of each of the first vibration generator 20a and the second vibration generator 20b may include a first region (or a first polarization region or a first polarization region) adjacent to the first electrode portion 21b and a second region (or a second polarization region or a second polarization region) adjacent to the second electrode portion 21c. The vibration portion 21a of the first vibration generator 20a can be displaced (or vibrated or driven) with a first amplitude DW1 based on the expansion of a first region based on a positive (+) vibration drive signal and the contraction of a second region based on a negative (-) vibration drive signal. Simultaneously, the vibration portion 21a of the second vibration generator 20b can be displaced (or vibrated or driven) with a second amplitude DW2 based on the contraction of the first region based on a negative (-) vibration drive signal and the expansion of the second region based on a positive (+) vibration drive signal. Therefore, the vibrating plate 10 can be displaced (or vibrated or driven) with a third amplitude DW3 corresponding to the first amplitude DW1 of the first vibration generator 20a and the second amplitude DW2 of the second vibration generator 20b. Thus, it can vibrate with a relatively larger amplitude than vibrations based on a single vibration generator or a vibration generator with a single structure. For example, the vibration device 5 according to embodiments of this disclosure can match the driving direction of the vibration device to the driving direction of a vibration device including a single vibration generator or a vibration generator with a single structure, thereby maximizing or enhancing the driving force of the vibration device 5. Therefore, the displacement (or bending force) or amplitude displacement of the diaphragm 10 can be increased (or maximized), thereby enhancing the sound pressure level characteristics and sound characteristics of the mid-to-low pitch sound band generated by the vibration of the diaphragm 10.

[0519] Figures 31A and 31B are cross-sectional views of a vibration device 5 according to another exemplary embodiment of the present disclosure.

[0520] Referring to Figures 31A and 31B, in order to maximize or increase the displacement or amplitude displacement of the vibration device 5, the number of layers of the vibration portion 21a of the first vibration structure and the vibration portion 21a of the second vibration structure can be different. For example, the number of layers of the vibration portion 21a of the first vibration structure can be more than the number of layers of the vibration portion 21a of the second vibration structure. According to another exemplary embodiment of this disclosure, in order to maximize or increase the displacement or amplitude displacement of the vibration device 5, the thickness or volume of the vibration portion 21a of the first vibration structure and the thickness or volume of the vibration portion 21a of the second vibration structure can be different. For example, the thickness or volume of the vibration portion 21a of the first vibration structure can be thicker or larger than the thickness or volume of the vibration portion 21a of the second vibration structure. According to another exemplary embodiment of this disclosure, the vibration portion 21a of the first vibration structure and the vibration portion 21a of the second vibration structure can have the same polarization direction.

[0521] Figure 32 illustrates a vibration generator according to another exemplary embodiment of the present disclosure. Figure 33 illustrates an example of the vibration structure shown in Figure 32. Figure 34 is a cross-sectional view taken along line VV′ shown in Figure 32 and illustrates an example embodiment implemented by modifying the vibration structure in the vibration device shown in Figure 27. Therefore, in the following, elements other than the vibration structure and related components are referred to by similar reference numerals, and for the sake of brevity, either omit or will be briefly described repeatedly.

[0522] Referring to Figures 32 to 34, in a vibration device 5 according to another exemplary embodiment of the present disclosure, each of the vibration structures 21 of the first vibration generator 20a and the second vibration generator 20b may include a vibration portion 21a, a first electrode portion 21b, and a second electrode portion 21c.

[0523] Vibrating portion 21a may include a piezoelectric material, a composite piezoelectric material, or an electroactive material exhibiting a piezoelectric effect. Vibrating portion 21a may include inorganic and organic materials. For example, vibrating portion 21a may include multiple inorganic material portions comprising a piezoelectric material and at least one organic material portion comprising a stretchable material. For example, vibrating portion 21a may be referred to by terms such as piezoelectric vibrating portion, piezoelectric composite layer, piezoelectric composite, piezoelectric ceramic composite, etc., but the terms are not limited thereto. Vibrating portion 21a may include transparent, translucent, or opaque piezoelectric materials, and vibrating portion 21a may be transparent, translucent, or opaque. Each of the first vibration generator 20a and the second vibration generator 20b, or the vibration structure 21 including vibrating portion 21a, may be referred to by terms such as flexible vibration generator, flexible actuator, flexible loudspeaker, flexible piezoelectric loudspeaker, membrane actuator, membrane-type piezoelectric composite actuator, membrane loudspeaker, membrane-type piezoelectric loudspeaker, or membrane-type piezoelectric composite loudspeaker, but the terms are not limited thereto.

[0524] The vibration portion 21a according to embodiments of the present disclosure may include a plurality of first portions 21a1 and a plurality of second portions 21a2. For example, the plurality of first portions 21a1 and the plurality of second portions 21a2 may be arranged alternately and repeatedly in a first direction X (or a second direction Y). For example, the first direction X may be the width direction of the vibration portion 21a, and the second direction Y may be the length direction of the vibration portion 21a that intersects the first direction X, but embodiments of the present disclosure are not limited thereto. For example, the first direction X may be the length direction of the vibration portion 21a, and the second direction Y may be the width direction of the vibration portion 21a.

[0525] Each of the plurality of first portions 21a1 may include an inorganic material portion. The inorganic material portion may include the material described above. For example, each of the plurality of first portions 21a1 may include a material substantially the same as the material of each of the plurality of first portions 21a1 described above with reference to FIG18, and therefore, for the sake of brevity, their repeated descriptions are omitted.

[0526] Each of the plurality of first portions 21a1 according to an exemplary embodiment of the present disclosure may be disposed between a plurality of second portions 21a2. The plurality of second portions 21a2 may be disposed (or arranged) such that the plurality of first portions 21a1 are located between them. Each of the plurality of first portions 21a1 may have a first width W1 parallel to a first direction X (or a second direction Y) and a length parallel to the second direction Y (or the first direction X). Each of the plurality of second portions 21a2 may have a second width W2 parallel to the first direction X (or the second direction Y) and a length parallel to the second direction Y (or the first direction X). The first width W1 may be the same as or different from the second width W2. All of the plurality of second portions 21a2 may have the same dimensions (e.g., width, area, or volume). For example, the plurality of second portions 21a2 may have the same dimensions (e.g., width, area, or volume) within process errors (or tolerances or tolerances) occurring in the manufacturing process. For example, the first width W1 may be greater than the second width W2. For example, the first part 21a1 and the second part 21a2 may include line or strip shapes having the same or different dimensions. Therefore, the vibrating part 21a may have a 2-2 composite structure and may have a resonant frequency below 20 kHz, but embodiments of this disclosure are not limited thereto. For example, the resonant frequency of the vibrating part 21a may vary based on one or more of its shape, length, or thickness.

[0527] In the vibrating portion 21a, a plurality of first portions 21a1 and a plurality of second portions 21a2 may be arranged (or configured) in parallel on the same plane (or the same layer). Each of the plurality of second portions 21a2 may be configured to fill the gap between two adjacent first portions 21a1. Each of the plurality of second portions 21a2 may be connected to or adhered to an adjacent first portion 21a1. Therefore, the vibrating portion 21a may extend to a desired size or length based on the lateral connection (or lateral linkage) between the first portions 21a1 and the second portions 21a2.

[0528] In the vibrating portion 21a, the width W2 of each of the plurality of second portions 21a2 may gradually decrease in the direction from the center portion of the vibrating portion 21a toward its two edge portions (or both ends or two peripheral portions).

[0529] According to embodiments of this disclosure, when the vibrating portion 21a vibrates in the vertical direction Z (or the thickness direction), the second portion 21a2 with the largest width W2 among the plurality of second portions 21a2 can be disposed in the portion where the relative stress is concentrated. When the vibrating portion 21a vibrates in the vertical direction Z, the second portion 21a2 with the smallest width W2 among the plurality of second portions 21a2 can be disposed in the portion where the relative stress is minimal. For example, the second portion 21a2 with the largest width W2 among the plurality of second portions 21a2 can be disposed in the central portion of the piezoelectric vibrating portion 21a, while the second portion 21a2 with the smallest width W2 among the plurality of second portions 21a2 can be disposed in the two edge portions (or two peripheral portions) of the vibrating portion 21a. Therefore, when the vibrating portion 21a vibrates in the vertical direction Z, the overlap or interference of the resonant frequencies of the sound waves occurring in the portion where the maximum stress is concentrated can be minimized. Therefore, the drop in sound pressure level occurring in the low-pitched audio band can be reduced, and the flatness of the sound characteristics in the low-pitched audio band can be improved. For example, flatness can be the magnitude of the deviation between the highest and lowest sound pressure levels.

[0530] In the vibrating portion 21a, the plurality of first portions 21a1 may have different dimensions (or widths). For example, the dimension (or width) of each of the plurality of first portions 21a1 may gradually decrease or increase in the direction from the center portion of the vibrating portion 21a to its two edge portions (or both ends or two peripheral portions). In this case, by using various inherent vibration frequencies based on the vibration of the plurality of first portions 21a1 with different dimensions, the sound pressure level characteristics of the sound of the vibrating portion 21a can be enhanced, and the sound reproduction frequency band can be extended.

[0531] Each of the plurality of second portions 21a2 can be disposed between the plurality of first portions 21a1. Therefore, in the vibrating portion 21a, the vibrational energy of the links in the unit lattice based on the first portions 21a1 can be increased by the second portions 21a2, thereby increasing vibrational characteristics and ensuring piezoelectric properties and flexibility. For example, the second portions 21a2 may comprise one of epoxy-based polymers, acrylic polymers, and silicone polymers, but embodiments of this disclosure are not limited thereto.

[0532] Each of the plurality of second portions 21a2 according to embodiments of the present disclosure can be constructed using an organic material portion. For example, the organic material portion can be disposed between two adjacent inorganic material portions, thereby absorbing impacts applied to the inorganic material portion (or the first portion) and releasing stress concentrated on the inorganic material portion, thereby enhancing the durability of the vibrating portion 21a and achieving flexibility of the vibrating portion 21a.

[0533] According to the embodiments of this disclosure, the second part 21a2 may have a modulus and viscoelasticity lower than that of the first part 21a1. Therefore, the second part 21a2 may enhance the reliability of the first part 21a1, which is susceptible to impact due to the brittle nature of the first part 21a1.

[0534] For example, when the vibration device 5 used to vibrate the diaphragm 1 has shock resistance and high stiffness, the vibration device 5 can have maximum vibration characteristics. To make the vibration device 5 shock-resistant and high stiffness, each of the plurality of second parts 21a2 may include a material having a relatively high damping factor (tanδ) and relatively high stiffness. For example, each of the plurality of second parts 21a2 may include a material having a damping factor (tanδ) of about 0.1 GPa to about 1 GPa and a relatively high stiffness of about 0 GPa to about 10 GPa. Furthermore, the damping factor (tanδ) and stiffness characteristics can be described based on the correlation between the loss coefficient and the modulus, and in this case, each of the plurality of second parts 21a2 may include a material having a loss coefficient of about 0.01 to about 1 and a modulus of about 1 GPa to about 10 GPa.

[0535] Compared to the inorganic material portion of the first portion 21a1, the organic material portions included in the second portion 21a2 may each comprise an organic material or an organic polymer with flexible properties. For example, each of the plurality of second portions 21a2 may comprise an organic material, an organic polymer, an organic piezoelectric material, or an organic non-piezoelectric material. For example, each of the plurality of second portions 21a2 may be referred to as a flexible adhesive portion, a tensile portion, an elastic portion, a bending portion, a damping portion, a flexible portion, or an extended portion, but the terminology is not limited thereto.

[0536] The organic material portion of the organic piezoelectric material can absorb the impact applied to the inorganic material portion (or the first portion), thus enhancing the overall durability of the vibrating device 5 and providing piezoelectric properties corresponding to a certain level or higher. The organic piezoelectric material according to the example embodiment can be an organic material having electroactive properties. For example, the organic piezoelectric material may include at least one of polyvinylidene fluoride (PVDF), β-polyvinylidene fluoride (β-PVDF), and polyvinylidene trifluoride (PVDF-TrFE), but embodiments of this disclosure are not limited thereto.

[0537] The organic material portion, including the organic non-piezoelectric material, may include a curable resin composition and a binder comprising the curable resin composition, thereby absorbing impacts applied to the inorganic material portion (or the first portion), thus enhancing the overall durability of the vibration device 5. The organic non-piezoelectric material according to the exemplary embodiments may include at least one of epoxy-based polymers, acrylic polymers, and silicone polymers, but embodiments of this disclosure are not limited thereto.

[0538] For example, to achieve the high stiffness required by the vibration device 5, the organic material portion, including the organic non-piezoelectric material, may include a bonding accelerator for bonding between the epoxy resin and the inorganic material portion. For example, the bonding accelerator may be a phosphate or the like. The organic material portion can be cured by at least one of a thermosetting process and a photocuring process. In the process of curing the organic material portion, a solvent-free epoxy resin can be used to prevent shrinkage of the organic material portion due to solvent evaporation, which would reduce the thickness uniformity of the vibration device 5.

[0539] Furthermore, the organic material portion, including the organic non-piezoelectric material, may further include a reinforcing agent for damping properties of the vibrating device 5 in addition to high stiffness. For example, the reinforcing agent may be a core-shell type methyl methacrylate-butadiene-styrene (MBS), and its content may be from about 5 wt% to about 40 wt%. The reinforcing agent may be an elastomer of the core unit type and may have high bonding strength with epoxy resins, such as acrylic polymers, thus enhancing the impact resistance or damping properties of the vibrating device 5.

[0540] Multiple first portions 21a1 and multiple second portions 21a2 can be disposed on the same plane (or connected to the same plane), therefore, the vibrating portion 21a according to the embodiment of this invention can be formed from a single thin film. For example, the vibrating portion 21a can have a structure in which multiple first portions 21a1 are connected to one side thereof. For example, the vibrating portion 21a can have a structure in which multiple first portions 21a1 are connected in all piezoelectric vibrating portions 21a. For example, the vibrating portion 21a can vibrate in the vertical direction by means of the first portions 21a1 having vibratory characteristics, and can be bent into a curved shape by means of the flexible second portions 21a2. Furthermore, in the vibrating portion 21a according to the embodiment of this disclosure, the dimensions of the first portions 21a1 and the second portions 21a2 can be adjusted based on the piezoelectric characteristics and flexibility required for the vibrating portion 21a or the vibrating device 21. For example, in a vibrating portion 21a that requires piezoelectric characteristics rather than flexibility, the dimension of the first portion 21a1 can be adjusted to be larger than the dimension of the second portion 21a2. As another example, in a vibrating portion 21a that requires flexibility rather than piezoelectric properties, the size of the second portion 21a2 can be adjusted to be larger than the size of the first portion 21a1. Therefore, the size of the vibrating portion 21a can be adjusted based on the desired characteristics, and the vibrating portion 21a can be easily designed.

[0541] The vibration structure 21 of the first vibration generator 20a and the vibration structure 21 of the second vibration generator 20b may have the same dimensions and may overlap to maximize or increase the displacement or amplitude displacement of the vibration device 5. For example, each first portion 21a1 (end portion or end or outer surface or each edge portion or each peripheral portion) of the vibration structure 21 (or vibration portion 21a) of the first vibration generator 20a may be substantially aligned or overlapped so as not to intersect with each first portion 21a1 (end portion or end or outer surface or each edge portion or each peripheral portion) of the vibration structure 21 (or vibration portion 21a) of the second vibration generator 20b. For example, within the tolerance range of the manufacturing process, each first portion 21a1 (end portion, end, outer surface, edge portion, or peripheral portion) of the vibration structure 21 (or vibration part 21a) of the first vibration generator 20a can be substantially aligned or overlapped so as not to intersect with each first portion 21a1 (end portion, end, outer surface, edge portion, or peripheral portion) 23a of the vibration structure 21 (or vibration part 21a) of the second vibration generator 20b. For example, each first portion 21a1 (end portion, end, outer surface, edge portion, or peripheral portion) 21a of the vibration structure 21 (or vibration part 21a) of the first vibration generator 20a can be aligned with or disposed within a dummy first extension line VL2. For example, each first portion 21a1 (end portion, end, outer surface, edge portion, or peripheral portion) 21a of the vibration structure 21 (or vibration part 21a) of the first vibration generator 20a can be precisely aligned in the dummy first extension line VL2, or can be precisely disposed in the first extension line VL2. Each first portion 21a1 (end portion, end, outer surface, edge portion, or peripheral portion) of the vibration structure 21 (or vibration part 21a) of the second vibration generator 20b can be aligned in the first extension line VL2, or can be precisely disposed in the first extension line VL2. For example, each first portion 21a1 (end portion, end, outer surface, edge portion, or peripheral portion) 23a of the vibration structure 21 (or vibration part 21a) of the second vibration generator 20b can be precisely aligned in the first extension line VL2, or can be precisely disposed in the first extension line VL2.

[0542] According to embodiments of the present disclosure, a plurality of first portions 21a1 of the first vibration generator 20a and a plurality of first portions 21a1 of the second vibration generator 20b may have the same size and may substantially overlap or stack without interleaving. For example, within the tolerance range of the manufacturing process, the plurality of first portions 21a1 of the first vibration generator 20a and the plurality of first portions 21a1 of the second vibration generator 20b may have the same size and may substantially overlap or stack without interleaving. According to embodiments of the present disclosure, the first portion of each of the plurality of first portions 21a1 of the first vibration generator 20a and the first portion of each of the plurality of first portions 21a1 of the second vibration generator 20b may substantially overlap or stack without interleaving. For example, within the tolerance range of the manufacturing process, the first portion of each of the plurality of first portions 21a1 of the first vibration generator 20a and the first portion of each of the plurality of first portions 21a1 of the second vibration generator 20b may have the same size and may substantially overlap or stack without interleaving. For example, the first portion of each of the plurality of first portions 21a1 of the first vibration generator 20a and the first portion of each of the plurality of first portions 21a1 of the second vibration generator 20b can be aligned in the second extension line VL2, or can be positioned in the second extension line VL2 without intersecting. For example, within the tolerance range of the manufacturing process, the first portion of each of the plurality of first portions 21a1 of the first vibration generator 20a and the first portion of each of the plurality of first portions 21a1 of the second vibration generator 20b can be precisely aligned in the second extension line VL2, or can be precisely positioned in the second extension line VL2 without intersecting.

[0543] According to embodiments of this disclosure, a plurality of second portions 21a2 of the first vibration generator 20a and a plurality of second portions 21a2 of the second vibration generator 20b may have the same size and may substantially overlap or stack without intersecting. For example, within the tolerance range of the manufacturing process, the plurality of second portions 21a2 of the first vibration generator 20a and a plurality of second portions 21a2 of the second vibration generator 20b may have the same size and may substantially overlap or stack without intersecting. For example, each of the plurality of second portions 21a2 of the first vibration generator 20a and each of the plurality of second portions 21a2 of the second vibration generator 20b may substantially overlap or stack without intersecting. For example, each of the plurality of second portions 21a2 of the first vibration generator 20a and each of the plurality of second portions 21a2 of the second vibration generator 20b may be aligned in a first extension line VL1 or a second extension line VL2, or may be disposed in a first extension line VL1 or a second extension line VL2 without intersecting. For example, within the tolerance range of the manufacturing process, the first portion of each of the plurality of second portions 21a2 of the first vibration generator 20a and the first portion of each of the plurality of second portions 21a2 of the second vibration generator 20b can be accurately aligned in the first extension line VL1 or the second extension line VL2, or can be accurately positioned in the first extension line VL1 or the second extension line VL2 so as not to intersect. Therefore, in the vibration device 5 according to the embodiment of the present disclosure, the vibration portion 21a of the first vibration generator 20a and the vibration portion 21a of the second vibration generator 20b can be displaced (or vibrated or driven) in the same direction, thus maximizing or increasing the amount of displacement or amplitude displacement, thereby increasing (or maximizing) the amount of displacement (or bending force) or amplitude displacement of the vibrating plate 10.

[0544] The first electrode portion 21b may be disposed on the first surface (or upper surface) of the vibrating portion 21a. The first electrode portion 21b may be commonly disposed on or connected to the first surface of each of the plurality of first portions 21a1 and the first surface of each of the plurality of second portions 21a2. The first electrode portion 21b may be electrically connected to the first surface of each of the plurality of first portions 21a1. For example, the first electrode portion 21b may have a common electrode (or single electrode or single-electrode electrode) shape wherein the first electrode portion 21b is disposed on the entire first surface of the vibrating portion 21a. For example, the first electrode portion 21b may have a shape substantially the same as that of the vibrating portion 21a, but embodiments of the present disclosure are not limited thereto. The first electrode portion 21b according to embodiments of the present disclosure may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material, but embodiments of the present disclosure are not limited thereto.

[0545] The second electrode portion 21c may be disposed on a second surface (or rear surface) of the vibrating portion 21a that is opposite to or different from the first surface. The second electrode portion 21c may be commonly disposed on or connected to the second surface of each of the plurality of first portions 21a1 and the second surface of each of the plurality of second portions 21a2. The second electrode portion 21c may be electrically connected to the second surface of each of the plurality of first portions 21a1. For example, the second electrode portion 21c may be disposed on the entire second surface of the vibrating portion 21a. The second electrode portion 21c may have a common electrode (or single electrode or single-electrode) shape. For example, the second electrode portion 21c may have a shape substantially the same as that of the vibrating portion 21a, but embodiments of this disclosure are not limited thereto. The second electrode portion 21c according to exemplary embodiments of this disclosure may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material, but embodiments of this disclosure are not limited thereto.

[0546] The first electrode portion 21b can be covered by the first protective member 21e. The second electrode portion 21c can be covered by the second protective member 21f.

[0547] The vibrating portion 21a of each of the first vibration generator 20a and the second vibration generator 20b can be polarized (or polarized) by applying a certain voltage to the first electrode portion 21b and the second electrode portion 21c under a specific temperature atmosphere or in a temperature atmosphere that can change from high temperature to room temperature, but the embodiments of this disclosure are not limited thereto. For example, the vibrating portion 21a of each of the first vibration generator 20a and the second vibration generator 20b can alternately contract and / or expand based on the inverse piezoelectric effect of the vibration drive signal applied to the first electrode portion 21b and the second electrode portion 21c, and thus can vibrate. For example, the vibrating portion 21a of each of the first vibration generator 20a and the second vibration generator 20b can vibrate based on vertical vibration and planar vibration of the first electrode portion 21b and the second electrode portion 21c. The displacement of the vibration device 5 or the displacement of the display panel can be increased based on the planar contraction and expansion of the vibrating portion 21a, and thus the vibration of the vibration device 5 or the display panel can be further enhanced.

[0548] In Figures 31A to 33 and the related description, a vibration device 5 according to another exemplary embodiment of the present disclosure is described as including a first vibration generator 20a and a second vibration generator 20b, but the embodiments of the present disclosure are not limited thereto. For example, a vibration device 5 according to another exemplary embodiment of the present disclosure may include a plurality of (e.g., three or more) vibration generators. Even in this case, in order to maximize or increase the displacement or amplitude displacement of the vibration device 5, the plurality of vibration generators may have the same size and may overlap. According to an embodiment of the present disclosure, the first portion 21a1 of the vibration generator 20 disposed in the upper (or top) layer and the first portion 21a1 of the vibration generator disposed in the lower (or bottom) layer among the three or more vibration generators may substantially overlap or stack without interleaving. For example, within the tolerance range of the manufacturing process, the first portion 21a1 of the vibration generator disposed in the upper layer and the first portion 21a1 of the vibration generator disposed in the lower layer among the three or more vibration generators may substantially overlap or stack without interleaving. For example, the first portions 21a1 of the vibration generators disposed in the upper layer and the first portions 21a1 of the vibration generators disposed in the lower layer among three or more vibration generators can be aligned in a dummy extension line VL, or can be disposed in a dummy extension line VL. For example, the first portions 21a1 of the vibration generators disposed in the upper layer and the first portions 21a1 of the vibration generators disposed in the lower layer among three or more vibration generators can be precisely aligned in a dummy extension line VL, or can be precisely disposed in a dummy extension line VL. Furthermore, the second portions 21a2 of the vibration generators disposed in the upper layer and the second portions 21a2 of the vibration generators disposed in the lower layer among three or more vibration generators can substantially overlap or superimpose without intersecting. For example, within the tolerance range of the manufacturing process, the second portions 21a2 of the vibration generators disposed in the upper layer and the second portions 21a2 of the vibration generators disposed in the lower layer among three or more vibration generators can substantially overlap or superimpose without intersecting. For example, the second portions 21a2 of the vibration generator in the upper layer and the second portions 21a2 of the vibration generator in the lower layer among three or more vibration generators can be aligned in a dummy extension line VL, or can be disposed in a dummy extension line VL. For example, the second portions 21a2 of the vibration generator in the upper layer and the second portions 21a2 of the vibration generator in the lower layer among three or more vibration generators can be precisely aligned in a dummy extension line VL, or can be precisely disposed in a dummy extension line VL.

[0549] Figure 35 illustrates a vibration device according to another exemplary embodiment of the present disclosure, and illustrates an exemplary embodiment implemented by modifying the vibration portion described above with reference to Figures 32 to 34. Therefore, in the following description, elements other than the vibration portion are referred to by similar reference numerals, and for the sake of brevity, their repeated descriptions may be omitted or will be given briefly.

[0550] Referring to Figures 27 and 35, in the vibration generator 20 of the vibration device 5 according to another exemplary embodiment of the present disclosure, the vibration portion 21a of the vibration structure 21 included in each of the first vibration generator 20a and the second vibration generator 20b may include a plurality of first portions 21a1 and second portions 21a2 disposed between the plurality of first portions 21a1. The plurality of first portions 21a1 may be spaced apart from each other in the first direction X and the second direction Y.

[0551] Each of the plurality of first portions 21a1 may be spaced apart from each other in each of the first direction X and the second direction Y. For example, each of the plurality of first portions 21a1 may have a hexahedral shape of the same size and may be arranged in a lattice shape. Each of the plurality of first portions 21a1 may comprise substantially the same material as the first portion 21a1 described above with reference to FIG31A and FIG33; therefore, similar reference numerals refer to similar elements, and their repeated descriptions are omitted for brevity.

[0552] The second portion 21a2 may be disposed between the plurality of first portions 21a1 in each of the first direction X and the second direction Y. The second portion 21a2 may be configured to fill the gap between two adjacent first portions 21a1 or surround each of the plurality of first portions 21a1, thus being able to connect to or attach to adjacent first portions 21a1. According to embodiments of the present disclosure, the width of the second portion 21a2 disposed between two first portions 21a1 adjacent to each other along the first direction X may be the same as or different from the width of the first portion 21a1, and the width of the second portion 21a2 disposed between two first portions 21a1 adjacent to each other along the second direction Y may be the same as or different from the width of the first portion 21a1. The second portion 21a2 may comprise substantially the same material as the second portion 21a2 described above with reference to Figures 31A to 33; therefore, similar reference numerals refer to similar elements, and repeated descriptions may be omitted for brevity.

[0553] In Figures 27 and 35 and the related description, a vibration device 5 according to another exemplary embodiment of the present disclosure is described as including a first vibration generator 20a and a second vibration generator 20b, but the embodiments of the present disclosure are not limited thereto. For example, a vibration device 5 according to another exemplary embodiment of the present disclosure may include a plurality of (e.g., three or more) vibration generators. Even in this case, in order to maximize or increase the displacement or amplitude displacement of the vibration device 5, the plurality of vibration generators may have the same size and may overlap. According to an exemplary embodiment of the present disclosure, the first portion 21a1 of the vibration generator 20 disposed in the upper layer and the first portion 21a1 of the vibration generator disposed in the lower layer among the three or more vibration generators may substantially overlap or stack without interleaving. For example, within the tolerance range of the manufacturing process. The first portion 21a1 of the vibration generator disposed in the upper layer and the first portion 21a1 of the vibration generator disposed in the lower layer among the three or more vibration generators may substantially overlap or stack without interleaving. Furthermore, the second portions 21a2 of the vibration generator disposed in the upper layer and the second portions 21a2 of the vibration generator disposed in the lower layer among the three or more vibration generators can substantially overlap or superimpose without interleaving. For example, within the tolerance range of the manufacturing process, the second portions 21a2 of the vibration generator disposed in the upper layer and the second portions 21a2 of the vibration generator disposed in the lower layer among the three or more vibration generators can substantially overlap or superimpose without interleaving.

[0554] Therefore, the vibration portion 21a of each of the first vibration generator 20a and the second vibration generator 20b according to embodiments of the present disclosure may include a 1-3 composite structure, and thus may have a resonant frequency below 30MHz, but embodiments of the present disclosure are not limited thereto. For example, the resonant frequency of the vibration portion 21a may vary based on at least one or more of its shape, length, or thickness.

[0555] Figure 36 illustrates a vibration device according to another exemplary embodiment of the present disclosure, and illustrates an exemplary embodiment implemented by modifying the vibration portion described above with reference to Figures 32 to 34. Therefore, in the following description, other elements besides the vibration portion are referred to by similar reference numerals, and for the sake of brevity, repeated descriptions of them may be omitted or will be given briefly.

[0556] Referring to Figures 27 and 36, in the vibration generator 20 of the vibration device 5 according to another exemplary embodiment of the present disclosure, the vibration portion 21a of the vibration structure 21 included in each of the first vibration generator 20a and the second vibration generator 20b may include a plurality of first portions 21a1 spaced apart from each other in the first direction X and the second direction Y, and a second portion 21a2 disposed between the plurality of first portions 21a1.

[0557] Each of the plurality of first portions 21a1 according to embodiments of the present disclosure may have a planar structure with a circular shape. For example, each of the plurality of first portions 21a1 may have a circular plate shape, but embodiments of the present disclosure are not limited thereto. For example, each of the plurality of first portions 21a1 may have a point shape including an elliptical shape, a polygonal shape, or a ring shape. Each of the plurality of first portions 21a1 may include a piezoelectric material substantially the same as the piezoelectric material of the first portion 21a1 described above with reference to FIG19; therefore, similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0558] The second portion 21a2 may be disposed between the plurality of first portions 21a1 in each of the first direction X and the second direction Y. The second portion 21a2 may be constructed to surround each of the plurality of first portions 21a1, and thus may be connected to or attached to the side surface of each of the plurality of first portions 21a1. The plurality of first portions 21a1 and second portions 21a2 may be disposed (or arranged) in parallel on the same plane (or the same layer). The second portion 21a2 may comprise an organic material substantially the same as the organic material of the second portion 21a2 described above with reference to FIG19; therefore, similar reference numerals refer to similar elements, and repeated descriptions thereof are omitted for brevity.

[0559] In the vibration portion 21a of the first vibration generator 20a according to another exemplary embodiment of the present disclosure, each of the plurality of first portions 21a1 may have a triangular planar structure instead of a circular planar structure. For example, each of the plurality of first portions 21a1 may have a triangular shape.

[0560] According to an exemplary embodiment of this disclosure, four adjacent first portions 21a1 of a plurality of first portions 21a1 may be arranged adjacent to each other to form a quadrilateral shape (or a square shape). The vertex of each of the four adjacent first portions 21a1 forming the quadrilateral shape may be arranged adjacent to the middle portion (or center portion) of the quadrilateral shape. According to another exemplary embodiment of this disclosure, six adjacent first portions 21a1 of a plurality of first portions 21a1 may be arranged adjacent to each other to form a hexagonal shape (or a regular hexagonal shape). The vertex of each of the six adjacent first portions 21a1 forming the hexagonal shape may be arranged adjacent to the middle portion (or center portion) of the hexagonal shape.

[0561] Figure 37 illustrates a vibration device according to another exemplary embodiment of the present disclosure, while Figure 38 is an example of a cross-sectional view taken along line VI-VI′ shown in Figure 37. The figures illustrate an exemplary embodiment implemented by modifying the vibration generator described above with reference to Figure 34.

[0562] Referring to Figures 27, 37, and 38, in the vibration generator 20 of the vibration device 5 according to another exemplary embodiment of the present disclosure, each of the first vibration generator 20a and the second vibration generator 20b may include one or more vibration structures 200A to 200D or multiple vibrators 200A to 200D. Figures 37 and 38 illustrate an example providing four vibration structures, and each of the first vibration generator 20a and the second vibration generator 20b according to the exemplary embodiment of the present disclosure may be constructed using two or more vibration modules.

[0563] Multiple vibration structures 200A to 200D can be electrically disconnected (or isolated) in each of the first direction X and the second direction Y and are spaced apart from each other.

[0564] Each of the plurality of vibrating structures 200A to 200D can vibrate by alternately and repeatedly contracting and expanding based on the piezoelectric effect. For example, the plurality of vibrating structures 200A to 200D can be arranged or laid out at a certain interval D1 in the first direction X. Therefore, each of the first vibration generator 20a and the second vibration generator 20b in which the plurality of vibrating structures 200A to 200D are laid out can be a vibration module, a vibration array, a vibration array portion, a vibration module array portion, a vibration array structure, a laid-out vibration array, a laid-out array module, or a laid-out vibration membrane, but the terminology is not limited thereto.

[0565] Each of the plurality of vibration structures 200A to 200D according to the exemplary embodiments of the present disclosure may have a quadrilateral shape. For example, each of the plurality of vibration structures 200A to 200D may have a quadrilateral shape with a width of 5 cm or more. For example, each of the plurality of vibration structures 200A to 200D may have a square shape with a size of 5 cm × 5 cm or more, but the embodiments of the present disclosure are not limited thereto.

[0566] Each of the plurality of vibrating structures 200A to 200D can be arranged or laid flat at certain intervals (or a certain distance), thus enabling a single vibrating device (or a single vibrating device) to be driven as a complete unit without the need for individual drive. According to an exemplary embodiment of this disclosure, the first separation distance D1 between the plurality of vibrating structures 200A to 200D relative to the first direction X can be 0.1 mm or more and less than 3 cm, but embodiments of this disclosure are not limited thereto. Furthermore, the second separation distance D2 between the plurality of vibrating structures 200A to 200D relative to the second direction Y can be 0.1 mm or more and less than 3 cm, but embodiments of this disclosure are not limited thereto. For example, the first separation distance D1 can be the same as the second separation distance D2. For example, the first separation distance D1 can be the same as the second separation distance D2 within the process error range.

[0567] According to an exemplary embodiment of this disclosure, a plurality of vibrating structures 200A to 200D can be arranged or tiled with a separation distance (or interval) D1 or D2 of 0.1 mm or more and less than 3 cm, thus enabling them to be driven as a vibrating device and increasing the sound pressure level characteristics and sound reproduction band of the sound generated based on the individual vibration of each of the plurality of vibrating structures 200A to 200D. For example, the plurality of vibrating structures 200A to 200D can be arranged at intervals of 0.1 mm or more and less than 5 mm to increase the sound reproduction band of the sound generated based on the individual vibration of each of the plurality of vibrating structures 200A to 200D and to increase the sound pressure level characteristics of the low-pitched sound frequency band (e.g., below 500 Hz).

[0568] According to an exemplary embodiment of this disclosure, when the plurality of vibrating structures 200A to 200D are arranged with a spacing D1 or D2 of less than 0.1 mm or without a spacing D1 or D2, the reliability of the plurality of vibrating structures 200A to 200D or the first vibration generator 20a and the second vibration generator 20b may be reduced due to damage or cracks caused by physical contact between the plurality of vibrating structures 200A to 200D when the plurality of vibrating structures 200A to 200D are vibrating.

[0569] According to an exemplary embodiment of this disclosure, when a plurality of vibrating structures 200A to 200D are arranged at intervals D1 or D2 of 3 cm or more, the plurality of vibrating structures 200A to 200D may not be driven as a single vibrating device due to the independent vibration of each of the plurality of vibrating structures 200A to 200D. Therefore, the sound pressure level characteristics and sound reproduction band of the sound generated based on the vibration of each of the plurality of vibrating structures 200A to 200D can be reduced. For example, when the plurality of vibrating structures 200A to 200D are arranged at intervals D1 or D2 of 3 cm or more, each of the sound characteristics and sound pressure level characteristics in the low-pitched sound frequency band (e.g., below 500 Hz) can be reduced.

[0570] According to an exemplary embodiment of this disclosure, when a plurality of vibrating structures 200A to 200D are arranged at 5mm intervals, each of the plurality of vibrating structures 200A to 200D may not be driven as a vibrating device, thereby reducing each of the sound characteristics and sound pressure level characteristics in the low-pitched audio frequency band (e.g., below 200Hz).

[0571] According to another exemplary embodiment of this disclosure, when multiple vibrating structures 200A to 200D are arranged at 1mm intervals, the multiple vibrating structures 200A to 200D can be driven as a single vibrating device. Therefore, the sound reproduction frequency band can be increased, and the sound pressure level characteristics in the low-pitched audio frequency band (e.g., below 500Hz) can be enhanced. For example, when the multiple vibrating structures 200A to 200D are arranged at 1mm intervals, the separation distance between the multiple vibrating structures 200A to 200D can be optimized. Therefore, the vibrators of the first vibration generator 20a and the second vibration generator 20b can be implemented as vibrators with large areas. Thus, the first vibration generator 20a and the second vibration generator 20b can be driven as large-area vibrators based on the individual vibrations of the multiple vibrating structures 200A to 200D. Therefore, the sound reproduction frequency band and the sound characteristics and sound pressure level characteristics in the low-pitched audio frequency band generated by interconnecting the large-area vibrations of each of the first vibration generator 20a and the second vibration generator 20b can be increased or enhanced.

[0572] Therefore, in order to achieve individual vibration of multiple vibrating structures 200A to 200D (or a single vibrating device), the separation distance between the multiple vibrating structures 200A to 200D can be set to 0.1mm or more, or less than 3cm. Furthermore, in order to enhance the sound pressure level characteristics of the low-pitched audio band along with achieving individual vibration of multiple vibrating structures 200A to 200D (or a single vibrating device), the separation distance between the multiple vibrating structures 200A to 200D can be adjusted to 0.1mm or more, and less than 5mm.

[0573] According to embodiments of the present disclosure, the first vibration generator 20a may include first vibration structures 200A to fourth vibration structures 200D that are electrically disconnected (or isolated) in each of the first direction X and the second direction Y and are spaced apart from each other. For example, the first vibration structures 200A to fourth vibration structures 200D may be arranged in a 2×2 configuration or laid flat.

[0574] According to embodiments of this disclosure, the first vibration structure 200A and the second vibration structure 200B may be spaced apart from each other in a first direction X. The third vibration structure 200C and the fourth vibration structure 200D may be spaced apart from each other in the first direction X, and may be spaced apart from each of the first vibration structure 200A and the second vibration structure 200B in a second direction Y. The first vibration structure 200A and the third vibration structure 200C may be spaced apart from each other in the second direction Y so as to face each other. The second vibration structure 200B and the fourth vibration structure 200D may be spaced apart from each other in the second direction Y so as to face each other.

[0575] Each of the first vibration structure 200A to the fourth vibration structure 200D according to an exemplary embodiment of the present disclosure may include a vibration portion 21a, a first electrode portion 21b, and a second electrode portion 21c.

[0576] The vibrating portion 21a may include a ceramic matrix material for achieving relatively high vibration. For example, the vibrating portion 21a may have a 1-3 composite structure (piezoelectric properties with 1-3 vibration modes) or a 2-2 composite structure (piezoelectric properties with 2-2 vibration modes). For example, the vibrating portion 21a may include a piezoelectric ceramic similar to the vibrating portion 21a described above with reference to Figures 3A to 12B, or may include a first portion 21a1 and a second portion 21a2 similar to the vibrating portion 21a described above with reference to one of Figures 19 to 20D. Therefore, similar reference numerals refer to similar elements, and repeated descriptions of them may be omitted for brevity.

[0577] According to embodiments of the present disclosure, the vibrating portion 21a may include a transparent, translucent, or opaque piezoelectric material. Therefore, the vibrating portion 21a may be transparent, translucent, or opaque.

[0578] The first electrode portion 21b can be disposed on the first surface of the vibrating portion 21a and can be electrically connected to the first surface of the vibrating portion 21a. This can be substantially the same as the first electrode portion 21b described above with reference to one of Figures 2 to 14, so similar reference numerals refer to similar elements, and repeated descriptions of them can be omitted for brevity.

[0579] The second electrode portion 21c can be disposed on the second surface of the vibrating portion 21a and can be electrically connected to the second surface of the vibrating portion 21a. This can be substantially the same as the second electrode portion 21c described above with reference to one of Figures 2 to 14. Therefore, similar reference numerals refer to similar elements, and repeated descriptions of them can be omitted for brevity.

[0580] Each of the first vibration generator 20a and the second vibration generator 20b according to another exemplary embodiment of the present disclosure may further include a first protective member 21e and a second protective member 21f.

[0581] The first protective member 21e may be disposed on the first surface of each of the first vibration generator 20a and the second vibration generator 20b. For example, the first protective member 21e may cover the first electrode portion 21b disposed on the first surface of each of the plurality of vibration structures 200A to 200D, and thus may be commonly connected to or support the first surface of each of the plurality of vibration structures 200A to 200D. Therefore, the first protective member 21e may protect the first electrode 21b or the first surface of each of the plurality of vibration structures 200A to 200D.

[0582] According to embodiments of the present disclosure, the first protective member 21e can be disposed on the first surface of each of the plurality of vibrating structures 200A to 200D via the first adhesive layer 21d. For example, the first protective member 21e can be disposed on the first surface of each of the plurality of vibrating structures 200A to 200D via a film lamination process of the first adhesive layer 21d. For example, the first protective member 21e can be directly disposed on the first surface of each of the plurality of vibrating structures 200A to 200D via a film lamination process of the first adhesive layer 21d. Therefore, each of the plurality of vibrating structures 200A to 200D can be integrated (or disposed) or laid flat in the first protective member 21e with a certain interval D1 or D2.

[0583] The second protective member 21f can be disposed on the second surface of each of the first vibration generator 20a and the second vibration generator 20b. For example, the second protective member 21f can cover the second electrode portion 21c disposed on the second surface of each of the plurality of vibration structures 200A to 200D, and thus can be commonly connected to or can commonly support the second surface of each of the plurality of vibration structures 200A to 200D. Therefore, the second protective member 21f can protect the second electrode 21c or the second surface of each of the plurality of vibration structures 200A to 200D.

[0584] According to embodiments of the present disclosure, the second protective member 21f can be disposed on the second surface of each of the plurality of vibrating structures 200A to 200D via the second adhesive layer 21g. For example, the second protective member 21f can be disposed on the second surface of each of the plurality of vibrating structures 200A to 200D via a film lamination process of the second adhesive layer 21g. For example, the second protective member 21f can be directly disposed on the second surface of each of the plurality of vibrating structures 200A to 200D via a film lamination process of the second adhesive layer 21g. Therefore, each of the plurality of vibrating structures 200A to 200D can be integrated (or disposed) or laid flat in the second protective member 21f with a certain interval D1 or D2.

[0585] Each of the first protective member 21e and the second protective member 21f according to embodiments of the present disclosure may include plastic, fibrous, or wood materials, but embodiments of the present disclosure are not limited thereto. One of the first protective member 21e and the second protective member 21f may be adhered to or connected to the vibrating plate 10 by a connecting member (or a second connecting member 150b).

[0586] The first adhesive layer 21d may be disposed between the first surface of each of the plurality of vibrating structures 200A to 200D and the plurality of vibrating structures 200A to 200D. For example, the first adhesive layer 21d may be disposed on the rear surface (or inner surface) of the first protective member 21e facing each of the first surfaces of the first vibration generator 20a and the second vibration generator 20b. For example, the first adhesive layer 21d may be disposed at the first surface of each of the plurality of vibrating structures 200A to 200D and may fill the spaces between the plurality of vibrating structures 200A to 200D.

[0587] The second adhesive layer 21g can be disposed between the second surface of each of the plurality of vibrating structures 200A to 200D and the plurality of vibrating structures 200A to 200D. For example, the second adhesive layer 21g can be disposed on the front surface (or inner surface) of the second protective member 21f facing the second surface of each of the first vibration generator 20a and the second vibration generator 20b. For example, the second adhesive layer 21g can be disposed on the second surface of each of the plurality of vibrating structures 200A to 200D and can fill the space between the plurality of vibrating structures 200A to 200D.

[0588] The first adhesive layer 21d and the second adhesive layer 21g can be connected or coupled between multiple vibrating structures 200A to 200D. Therefore, each of the multiple vibrating structures 200A to 200D can be surrounded by the first adhesive layer 21d and the second adhesive layer 21g. For example, the first adhesive layer 21d and the second adhesive layer 21g can completely (or entirely) surround all of the multiple vibrating structures 200A to 200D. For example, the first adhesive layer 21d and the second adhesive layer 21g can be referred to as cover members, but the terminology is not limited thereto. When each of the first adhesive layer 21d and the second adhesive layer 21g is a cover member, a first protective member 21e can be disposed on a first surface of the cover member, and a second protective member 21f can be disposed on a second surface of the cover member.

[0589] Each of the first adhesive layer 21d and the second adhesive layer 21g according to embodiments of the present disclosure may include an electrically insulating material capable of compression and decompression. For example, each of the first adhesive layer 21d and the second adhesive layer 21g may include epoxy resin, acrylic resin, silicone resin, or polyurethane resin, but embodiments of the present disclosure are not limited thereto. For example, each of the first adhesive layer 21d and the second adhesive layer 21g may be configured to be transparent, translucent, or opaque.

[0590] Each of the first vibration generator 20a and the second vibration generator 20b according to another exemplary embodiment of the present disclosure may further include a first power line PL1 disposed at the first protective member 21e, a second power line PL2 disposed at the second protective member 21f, and a pad portion 27 electrically connected to the first power line PL1 and the second power line PL2.

[0591] A first power line PL1 may be disposed on the rear surface of the first protective member 21e facing each of the first electrode portion 21b and the first cover member 21e. The first power line PL1 may be electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A to 200D. For example, the first power line PL1 may be electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A to 200D. For example, the first power line PL1 may be directly electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A to 200D. In an exemplary embodiment of this disclosure, the first power line PL1 may be electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A to 200D via an anisotropic conductive film. In another exemplary embodiment of this disclosure, the first power line PL1 may be electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A to 200D via a conductive material (or particles) contained in the first adhesive layer 21d.

[0592] According to embodiments of the present disclosure, the first power line PL1 may include a first-1 power line PL11 and a first-2 power line PL12 disposed in the second direction Y. For example, the first-1 power line PL11 may be electrically connected to the first electrode portion 21b of each of the first vibration structure 200A and the third vibration structure 200C (or the first group) among the plurality of vibration structures 200A to 200D. For example, the first vibration structure 200A and the third vibration structure 200C may be arranged in a first row parallel to the second direction Y among the plurality of vibration structures 200A to 200D. The first-2 second power line PL12 may be electrically connected to the second electrode portion 21c of each of the second vibration structure 200B and the fourth vibration structure 200D (or the second group) among the plurality of vibration structures 200A to 200D. For example, the second vibration structure 200B and the fourth vibration structure 200D may be arranged in a second row parallel to the second direction Y among the plurality of vibration structures 200A to 200D.

[0593] The second power line PL2 may be disposed on a first surface of the second protective member 21f facing each of the first electrode portion 21b and the first cover member 21e. For example, the first surface may be the bottom surface of the second protective member 21f. The second power line PL2 may be electrically connected to the second electrode portion 21c of each of the plurality of vibrating structures 200A to 200D. For example, the second power line PL2 may be electrically connected to the second electrode portion 21c of each of the plurality of vibrating structures 200A to 200D. In an exemplary embodiment of this disclosure, the second power line PL2 may be electrically connected to the second electrode portion 21c of each of the plurality of vibrating structures 200A to 200D via an anisotropic conductive film. In another exemplary embodiment of this disclosure, the second power line PL2 may be electrically connected to the second electrode portion 21c of each of the plurality of vibrating structures 200A to 200D via a conductive material (or particles) contained in the second adhesive layer 21g.

[0594] According to embodiments of the present disclosure, the second power line PL2 may include a second-1 power line PL21 and a second-2 power line PL22 disposed in the first direction X. For example, the second-1 power line PL21 may be electrically connected to the second electrode portion 21c of each of the first vibration structure 200A and the third vibration structure 200C (or the first group) among the plurality of vibration structures 200A to 200D. For example, the first vibration structure 200A and the third vibration structure 200C may be disposed in a first row parallel to the second direction Y among the plurality of vibration structures 200A to 200D. The second-2 power line PL22 may be electrically connected to the second electrode portion 21c of each of the second vibration structure 200B and the fourth vibration structure 200D (or the second group) among the plurality of vibration structures 200A to 200D. For example, the second vibration structure 200B and the fourth vibration structure 200D may be disposed in a second row parallel to the second direction Y among the plurality of vibration structures 200A to 200D.

[0595] The pad portion 27 may be disposed in each of the first vibration generator 20a and the second vibration generator 20b to be electrically connected to one side (or one end or a portion) of at least one of the first power line PL1 and the second power line PL2. According to embodiments of the present disclosure, the pad portion 27 may include a first pad electrode electrically connected to one side (or a portion) of the first power line PL1 and a second pad electrode electrically connected to one side (or a portion) of the second power line PL2.

[0596] The first pad electrode can be connected to one side (or one end or part) of each of the first-1 power line PL11 and the first-2 power line PL12. For example, one side (or one end or part) of each of the first-1 power line PL11 and the first-2 power line PL12 can branch off from the first pad electrode.

[0597] The second pad electrode can be connected to one side (or one end) of each of the 2-1 power line PL21 and the 2-2 power line PL22. For example, one side (or one end or part) of each of the 2-1 power line PL21 and the 2-2 power line PL22 can branch off from the second pad electrode.

[0598] According to embodiments of this disclosure, each of the first power line PL1, the second power line PL2, and the pad portion 27 may include a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material, and is therefore transparent, semi-transparent, or opaque.

[0599] Each of the first vibration generator 20a and the second vibration generator 20b according to another exemplary embodiment of this disclosure may also include a flexible cable 29.

[0600] The flexible cable 29 can be electrically connected to pad portions 27 disposed in each of the first vibration generator 20a and the second vibration generator 20b, and can provide a vibration drive signal from a vibration drive circuit to each of the first vibration generator 20a and the second vibration generator 20b. According to an exemplary embodiment of this disclosure, the flexible cable 29 may include a first terminal electrically connected to a first pad electrode of the pad portion 27 and a second terminal electrically connected to a second pad electrode of the pad portion 27. For example, the flexible cable 29 may be a flexible printed circuit cable or a flexible flat cable, but embodiments of this disclosure are not limited thereto.

[0601] Therefore, the vibration device 5 according to another exemplary embodiment of this disclosure may include a plurality of vibration structures 200A to 200D, such that each of the first vibration generator 20a and the second vibration generator 20b is implemented as a single vibrator without being driven independently. Thus, it can be driven as a large-area vibrator based on the individual vibration of the plurality of vibration structures 200A to 200D. For example, the plurality of vibration structures 200A to 200D may be a single vibrator in which the plurality of vibration structures 200A to 200D are arranged (or tiled) at intervals D1 or D2. Therefore, the vibration device 5 can cause large-area vibration of the display panel or can autonomously perform large-area vibration, thereby increasing or enhancing each of the sound characteristics and sound pressure level characteristics in the reproduction frequency band and low-pitched audio frequency band of the sound output from the display panel.

[0602] Figure 39 illustrates an apparatus according to an exemplary embodiment of the present disclosure, while Figure 40 is an example of a cross-sectional view taken along line VII-VII′ shown in Figure 39.

[0603] Referring to Figures 39 and 40, an apparatus according to an exemplary embodiment of the present disclosure may include a display panel 100 for displaying images and a vibration device for vibrating the display panel 100 on its rear surface (or back surface).

[0604] Display panel 100 can display images (e.g., electronic or digital images). For example, display panel 100 can output light to display images. Display panel 110 can be a curved display panel or any type of display panel such as a liquid crystal display panel, an organic light-emitting display panel, a quantum dot light-emitting display panel, a micro-light-emitting diode display panel, and an electrophoretic display panel. Display panel 100 can be a flexible display panel. For example, display panel 100 can be a flexible light-emitting display panel, a flexible electrophoretic display panel, a flexible electrowetting display panel, a flexible micro-light-emitting diode display panel, or a flexible quantum dot light-emitting display panel, but the embodiments of this disclosure are not limited thereto.

[0605] The display panel 100 according to an exemplary embodiment of the present disclosure may include a display area AA, which displays an image based on the driving of a plurality of pixels. Furthermore, the display panel 100 may also include a non-display area IA surrounding the display area AA, but embodiments of the present disclosure are not limited thereto.

[0606] According to an exemplary embodiment of this disclosure, the display panel 110 may include an anode electrode, a cathode electrode, and a light-emitting device. Based on the structure of a pixel array layer comprising multiple pixels, the display panel 110 may display images in a type such as top-emitting, bottom-emitting, or dual-emitting. A top-emitting type displays an image by illuminating light emitted from the pixel array layer in the forward direction (FD) of the base substrate, while a bottom-emitting type displays an image by illuminating light emitted from the pixel array layer in the backward direction of the base substrate.

[0607] A display panel 100 according to an exemplary embodiment of the present disclosure may include a pixel array portion disposed in a display area of ​​a substrate. The pixel array portion may include a plurality of pixels that display an image based on signals provided to signal lines. The signal lines may include gating lines, data lines, and pixel driving power lines, etc., but embodiments of the present disclosure are not limited thereto.

[0608] The vibration device 200 can vibrate the display panel 100 on its rear surface to provide sound and / or tactile feedback to the user based on the vibration of the display panel 100. The vibration device 200 can be implemented on the rear surface of the display panel to directly vibrate the display panel 100.

[0609] For example, the vibration device 200 may vibrate based on a vibration drive signal synchronized with an image displayed on the display panel 100, thereby causing the display panel 100 to vibrate. As another example, the vibration device 200 may vibrate based on a haptic feedback signal (or touch feedback signal) synchronized with a user touch applied to a touch panel (or touch sensor layer) set or embedded in the display panel 100, thereby causing the display panel 100 to vibrate. Therefore, the display panel 100 may vibrate based on the vibration of the vibration device 200 and provide at least one of sound and haptic feedback to the user (or viewer).

[0610] The vibration device 200 according to an exemplary embodiment of this disclosure can be implemented with a size corresponding to the display area AA of the display panel 100. The size of the vibration device 200 can be 0.9 to 1.1 times the size of the display area AA, but the embodiments of this disclosure are not limited thereto. For example, the size of the vibration device 200 can be less than or equal to the size of the display area AA. For example, the size of the vibration device 200 can be the same as or nearly equal to the size of the display area AA, so that the vibration device 200 can cover most of the display panel 100 and the vibration generated by the vibration device 200 can cause the entire display panel 100 to vibrate, thereby improving user satisfaction and increasing the sound localization. Additionally, the contact area (or panel coverage) between the display panel 100 and the vibration device 200 can be increased, thus increasing the vibration area of ​​the display panel 100, thereby improving the sound in the mid-to-low frequency bands generated by the vibration of the display panel 100. Furthermore, the vibration device 200 applied to a large-size display device can vibrate the entire display panel 100, which has a large size (or large area), thereby further enhancing the sound localization based on the vibration of the display panel 100, thus achieving an enhanced sound effect. Therefore, the vibration device 200 according to the exemplary embodiment of this disclosure can be provided on the rear surface of the display panel 100 and can make the display panel 100 vibrate sufficiently in the vertical (or front-back) direction, thus allowing the desired sound to be output to the device or the forward direction FD of the display device.

[0611] Vibration devices that include a single vibration generator may have the problem of insufficient sound output. For example, when a vibration device including a single vibration generator is installed in a display device such as a television (TV), it may be difficult to ensure sufficient sound. Therefore, when a vibration device implemented with two parallel vibration generators is applied to a display device, the attachment area between the display panel 100 and the vibration device may be widened. However, with the widening of the attachment area, the following problem may arise: it may be difficult to attach the vibration device to the rear surface of the display panel 100 without air bubbles. For example, when the display panel 100 is a light-emitting display panel, the following problem may arise: it may be difficult to attach the display panel 100 to the encapsulation substrate without air bubbles. Furthermore, a vibration device implemented with two parallel vibration generators may have the problem of segmental vibration, where different vibrations occur due to the different vibrations of adjacent vibration generators. As a result, it may be difficult to output a sound that enhances sound flatness. There may also be a problem that segmental vibration increases with the increase of the attachment area of ​​the vibration device. The vibration device 200 according to an exemplary embodiment of this disclosure may include a plurality of vibration generators 210 and 230 overlapping each other, as shown in Figures 45 and 46. The vibration device 200 may include one or more vibration generators stacked or overlapping to displace (or vibrate or be driven) in the same direction. Here, the vibration generator may be substantially the same as the vibration generator 20 described above with reference to Figures 1 and 13, and therefore its repeated description may be omitted for brevity.

[0612] One or more vibration devices 200 according to exemplary embodiments of this disclosure may include one or more of the vibration devices 1 to 5 described above with reference to Figures 1 to 38. Therefore, for the sake of brevity, a detailed description of one or more vibration devices 200 may be omitted.

[0613] The apparatus according to an exemplary embodiment of the present disclosure may further include a connecting member 150 disposed between the display panel 100 and the vibration device 200 (or vibration generator 210). The connecting member 150 according to an exemplary embodiment of the present disclosure may include an adhesive layer comprising a material having good adhesion or bonding force with respect to each of the rear surfaces of the vibration device 200 and the display panel 100. For example, the connecting member 150 may include a foam pad, double-sided tape, or adhesive, but embodiments of the present disclosure are not limited thereto. For example, the adhesive layer of the connecting member 150 may include epoxy resin, acrylic resin, silicone, or polyurethane, but embodiments of the present disclosure are not limited thereto.

[0614] The device according to an example embodiment of the present disclosure may further include a support member 300 disposed on the rear surface of the display panel 100.

[0615] The support member 300 may cover the rear surface of the display panel 100. For example, the support member 300 may cover the entire rear surface of the display panel 100, and there is a gap space GS between them. For example, the support member 300 may include one or more materials selected from glass, metal, and plastic. For example, the support member 300 may be a rear structure or a complete structure. For example, the support member 300 may be referred to by terms such as cover base, plate base, back cover, base frame, metal frame, metal chassis, chassis base, m chassis, etc. There...

Claims

1. A vibration device, the vibration device comprising: Vibrating plate; A vibration generator located on the vibrating plate, the vibration generator comprising a vibration structure; The system also includes a connecting member located between the vibrating plate and the vibration generator, wherein the connecting member comprises: a first connecting member located between the vibrating plate and the vibration structure, the first connecting member overlapping the vibration structure; and a second connecting member surrounding the first connecting member and not overlapping the vibration structure, wherein the modulus of the first connecting member is greater than the modulus of the second connecting member.

2. The vibration device according to claim 1, wherein, The connecting component comprises a metallic material.

3. The vibration device according to claim 1, wherein, The vibration structure includes: a first electrode portion located at a first surface of the vibration structure; and a second electrode portion located at a second surface of the vibration structure opposite to the first surface, wherein each of the first electrode portion and the second electrode portion comprises silver and glass frit.

4. The vibration device according to claim 3, further comprising: A signal cable, which is electrically connected to the vibrating structure; And a signal generation circuit, which is mounted on the signal cable.

5. The vibration device according to claim 4, wherein, The vibration generator further includes: a first cover member covering the first electrode portion; and a second cover member covering the second electrode portion, wherein the signal cable includes: a first wire located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and a second wire located between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

6. The vibration device according to claim 5, wherein, The first cover member and the second cover member are connected or coupled to a surface of the vibrating plate via the connecting member.

7. The vibration device according to claim 4, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

8. The vibration device according to claim 3, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

9. The vibration device according to claim 3, wherein, The vibration structure further includes a vibration portion located between the first electrode portion and the second electrode portion.

10. The vibration device according to claim 1, further comprising: A signal cable, which is electrically connected to the vibrating structure; And a signal generation circuit, which is mounted on the signal cable.

11. The vibration device according to claim 10, wherein, The vibration structure further includes: a first electrode portion located at a first surface of the vibration structure; a second electrode portion located at a second surface of the vibration structure opposite to the first surface; a first cover member covering the first electrode portion; and a second cover member covering the second electrode portion, wherein the signal cable includes: a first conductor located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and a second conductor located between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

12. The vibration device according to claim 11, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

13. The vibration device according to claim 1, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

14. The vibration device according to claim 1, wherein, The vibration generator further includes: a first adhesive layer located between the vibration structure and the first cover member; and a second adhesive layer located between the vibration structure and the second cover member.

15. A vibration device, the vibration device comprising: Vibrating plate; A vibration generator located at the vibrating plate, the vibration generator comprising a vibration structure; The connection includes a connecting member located between the vibrating plate and the vibration generator, wherein the connecting member comprises a metallic material, and wherein the connecting member comprises: a first connecting member located between the vibrating plate and the vibration structure, the first connecting member overlapping the vibration structure; and a second connecting member surrounding the first connecting member and not overlapping the vibration structure.

16. The vibration device according to claim 15, wherein, The vibration generator further includes: a first electrode portion located on a first surface of the vibration structure; and a second electrode portion located on a second surface of the vibration structure opposite to the first surface, wherein each of the first electrode portion and the second electrode portion comprises silver and glass frit.

17. The vibration device according to claim 16, further comprising: A signal cable electrically connected to the vibrating structure; And a signal generation circuit, which is mounted on the signal cable.

18. The vibration device according to claim 17, wherein, The vibration structure further includes: a first cover member covering the first electrode portion; and a second cover member covering the second electrode portion, wherein the signal cable includes: a first wire located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and a second wire located between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

19. The vibration device according to claim 17, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

20. The vibration device according to claim 16, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

21. The vibration device according to claim 15, further comprising: A signal cable that is electrically connected to the vibration generator; And a signal generation circuit, which is mounted on the signal cable.

22. The vibration device according to claim 21, wherein, The vibration generator includes a vibration structure, wherein the vibration structure further includes: a first electrode portion located at a first surface of the vibration structure; a second electrode portion located at a second surface of the vibration structure opposite to the first surface; a first cover member covering the first electrode portion; and a second cover member covering the second electrode portion, wherein the signal cable includes: a first wire located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and a second wire located between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

23. The vibration device according to claim 22, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

24. A vibration device, the vibration device comprising: Vibrating plate; A vibration generator configured to cause the vibrating plate to vibrate. The vibration generator includes a connecting member located between the vibrating plate and the vibration generator, wherein the vibration generator comprises: a vibrating structure; a first electrode portion located on a first surface of the vibrating structure; and a second electrode portion located on a second surface of the vibrating structure opposite to the first surface, wherein each of the first electrode portion and the second electrode portion comprises silver and glass frit, and wherein the connecting member comprises: a first connecting member located between the vibrating plate and the vibrating structure, the first connecting member overlapping the vibrating structure; and a second connecting member surrounding the first connecting member and not overlapping the vibrating structure.

25. The vibration device according to claim 24, further comprising: A signal cable electrically connected to the vibrating structure; And a signal generation circuit, which is mounted on the signal cable.

26. The vibration device according to claim 25, wherein, The vibration structure further includes: a first cover member covering the first electrode portion; and a second cover member covering the second electrode portion, wherein the signal cable includes: a first wire located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and a second wire located between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

27. The vibration device according to claim 25, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

28. The vibration device according to claim 24, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

29. The vibration device according to claim 24, wherein, In each of the first electrode portion and the second electrode portion, the area occupied by silver is 70% to 90%.

30. The vibration device according to claim 24, wherein, The thickness of each of the first electrode portion and the second electrode portion is 1 μm to 3 μm.

31. The vibration device according to claim 24, wherein, In each of the first electrode portion and the second electrode portion, the silver comprises 80 to 90 parts by weight, and the glass frit comprises 10 to 20 parts by weight.

32. A vibration device, the vibration device comprising: Vibrating plate; A vibration generator that causes the vibrating plate to vibrate; The system includes a connecting member located between the vibrating plate and the vibration generator, wherein the vibration generator comprises: a vibrating structure; a first electrode portion located on a first surface of the vibrating structure; a second electrode portion located on a second surface of the vibrating structure opposite to the first surface; a signal cable electrically connected to the vibrating structure; and a signal generation circuit mounted on the signal cable. The connecting member comprises: a first connecting member located between the vibrating plate and the vibrating structure, overlapping the vibrating structure; and a second connecting member surrounding the first connecting member and not overlapping the vibrating structure.

33. The vibration device according to claim 32, wherein, The vibration structure further includes: a first cover member covering the first electrode portion; and a second cover member covering the second electrode portion, wherein the signal cable includes: a first wire located between the first cover member and the first electrode portion and electrically connected to the first electrode portion; and a second wire located between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

34. The vibration device according to claim 32, wherein, The vibration structure further includes: a first vibration structure having a first piezoelectric coefficient; a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibration structure and the second vibration structure.

35. A vibration device, the vibration device comprising: Vibrating plate; A vibration generator located at the vibrating plate; The vibration generator includes a connecting member located between the vibrating plate and the vibration generator, wherein the vibration generator comprises: a first vibrating structure having a first piezoelectric coefficient; a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; and a connecting portion located between the first vibrating structure and the second vibrating structure, wherein the connecting member comprises: a first connecting member located between the vibrating plate and the first and second vibrating structures, the first connecting member overlapping the first and second vibrating structures; and a second connecting member surrounding the first connecting member and not overlapping the first and second vibrating structures.

36. The vibration device according to claim 35, wherein, The first piezoelectric coefficient is greater than the second piezoelectric coefficient.

37. An apparatus including a vibration device, the apparatus comprising: Vibrating components; And one or more vibration generating devices connected to the vibrating member, wherein the one or more vibration generating devices include the vibration device according to any one of claims 1 to 36.

38. The apparatus according to claim 37, wherein: The vibrating component is configured to output sound based on the vibration of the one or more vibration generating devices, and the vibrating component comprises one or more materials selected from metal, non-metal, plastic, fiber, leather, wood, cloth, paper, and glass.

39. The device according to claim 37, wherein, The vibrating component includes one of the following: a display panel comprising a plurality of pixels configured to display an image, a screen panel projecting an image from a display device thereto, a lighting panel, a sign panel, an interior part of a vehicle, an exterior part of a vehicle, a vehicle window, an interior ceiling of a building, and a window of a building.

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