Circuit board device and electronic apparatus

Abstract

The application discloses a circuit board device and an electronic device. The circuit board device comprises a circuit board, a chip, a heat sink, a first connecting piece, an elastic piece and a loose and tight holding assembly. The chip is arranged on the circuit board and is clamped and fixed between the circuit board and the heat sink. The holding assembly is fixed to the heat sink and is clamped and fixed with the first connecting piece. The first end of the first connecting piece penetrates through the heat sink and is fixed to the circuit board. The elastic piece is in contact with the second end of the first connecting piece and is in contact with the holding assembly. The above technical scheme can solve the problem that the circuit board device in the background art is prone to damaging the chip in a non-steady state and cannot better dissipate heat from the chip.

Description

Circuit board assembly and electronic equipment Technical Field

[0001] This application belongs to the field of heat dissipation design technology for electronic devices, specifically relating to a circuit board device and an electronic device. Background Technology

[0002] Electronic devices are becoming increasingly prevalent in people's lives. To meet user needs, electronic devices are equipped with more and more functional components. Electronic devices generate a significant amount of heat during operation. Timely heat dissipation is crucial for ensuring the proper functioning of electronic devices.

[0003] In electronic devices, heat sinks are one of the main methods for dissipating heat from heat-generating components. As electronic devices become increasingly powerful, some are equipped with high-power chips. To dissipate heat from these high-power chips, these devices use large and heavy heat sinks.

[0004] To ensure proper heat dissipation between large, heavy heatsinks and high-power chips, the industry currently uses springs and screws to secure the heatsink, with thermal grease filling the gap between the chip and the heatsink. However, due to the limited pressure resistance of chips and the significant weight of heatsinks, this method of securing heatsinks can easily lead to excessive pressure between the heatsink and the chip in unstable scenarios (such as downward or upward acceleration of electronic devices). This pressure can exceed the chip's pressure limit, ultimately causing the chip to be easily damaged by the heatsink or impact.

[0005] For example, when an electronic device accelerates downwards (or decelerates upwards or accelerates downwards), the spring is further compressed, causing the heat sink to separate from the chip. When the heat sink falls back down, it may strike the chip, damaging it. As another example, when an electronic device accelerates upwards (including upward acceleration and downward deceleration), the chip may exert excessive "push" on the heat sink. Conversely, the heat sink may exert excessive pressure on the chip, exceeding its pressure resistance, leading to pressure damage.

[0006] As a highly sensitive component in electronic devices, chip damage not only leads to severe damage to the electronic equipment but also results in high repair costs for users. Furthermore, this mounting method lacks constraints on the lateral movement of the heatsink, making it prone to lateral displacement. This significantly reduces the thermal conductivity between the heatsink and the chip, hindering efficient heat dissipation. Summary of the Invention

[0007] The purpose of this application is to disclose a circuit board device and an electronic device that can solve the problem in the background art where the heat sink of the electronic device is easily damaged and cannot effectively dissipate heat from the chip.

[0008] To solve the above-mentioned technical problems, this application is implemented as follows:

[0009] In a first aspect, embodiments of this application disclose a circuit board device, which includes a circuit board, a chip, a heat sink, a first connector, an elastic member, and a releasable clamping assembly, wherein:

[0010] The chip is disposed on the circuit board and clamped and fixed between the circuit board and the heat sink.

[0011] The clamping component is fixed to the radiator and clamps tightly with the first connector;

[0012] The first end of the first connector passes through the heat sink and is fixed to the circuit board; the elastic member abuts against the second end of the first connector and against the clamping assembly.

[0013] Secondly, embodiments of this application disclose an electronic device, which includes the circuit board device described above.

[0014] The technical solution adopted in this application can achieve the following beneficial effects:

[0015] The circuit board device disclosed in this application improves the structure of circuit board devices in related technologies by setting a clamping component and an elastic element. Before the clamping component and the first connector are clamped together, the elastic element can adjust the clamping position of the clamping component relative to the first connector, that is, adjust the clamping force of the heat sink on the chip, so as to adjust the heat sink to a position that can dissipate heat well for the chip without damaging the chip. At this time, the clamping component and the first connector are clamped and fixed together, so that after the clamping component and the first connector are clamped together, the clamping component and the heat sink are fixed together, so that the clamping component, the heat sink and the first connector are all fixedly connected, thereby fixing the chip and the heat sink relatively. In this way, the relative position between the chip and the heat sink remains unchanged in the non-steady-state scenario, thus achieving relative fixation.

[0016] In other words, when the circuit board device is in an unsteady state, the relative position between the heat sink and the chip can remain unchanged, thereby enabling the heat sink to dissipate heat from the chip effectively while avoiding pressure or impact damage between the chip and the heat sink. It can be seen that the circuit board device disclosed in this application can solve the problem that heat sinks in electronic devices are prone to damaging chips and cannot dissipate heat from the chips effectively. Attached Figure Description

[0017] Figure 1 is a schematic diagram of the overall structure of the circuit board device disclosed in an embodiment of this application;

[0018] Figure 2 is an enlarged schematic diagram of a partial structure of Figure 1;

[0019] Figures 3 and 4 are schematic diagrams of cross-sectional structures of different sections of Figure 2;

[0020] Figure 5 is an exploded structural diagram of a portion of the circuit board device disclosed in an embodiment of this application;

[0021] Figures 6 and 7 are schematic diagrams of the second limiting member disclosed in the embodiments of this application in different states.

[0022] Explanation of reference numerals in the attached figures:

[0023] 100 - Circuit board; 110 - Second connector;

[0024] 200-chip;

[0025] 300-Radiator, 310-Radiator body, 320-Radiator bracket, 321-First connecting hole, 322-Second connecting hole;

[0026] 400 - First connector;

[0027] 500 - Elastic component;

[0028] 600-Clamping assembly, 610-Clamping piece, 611-Clamping space, 612-Third connecting hole, 613-Fourth connecting hole, 614-Fifth connecting hole, 615-First part, 616-Second part, 617-First mating slope, 620-First limiting piece, 630-Second limiting piece, 631-Second mating slope, 640-Third connecting piece, 650-Fourth connecting piece, 660-First end face, 670-Second end face, 680-Fifth connecting piece, 690-Washer. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0031] The circuit board device and electronic device disclosed in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0032] As shown in Figures 1 to 7, this application discloses a circuit board device, which includes a circuit board 100, a chip 200, a heat sink 300, a first connector 400, an elastic member 500, and a retractable clamping assembly 600.

[0033] In this circuit board assembly, circuit board 100 serves as the mounting base and provides power. Chip 200 is the functional component of the circuit board assembly. During the process of chip 200 performing its function, a large amount of heat is generated within it. Heat sink 300, with its large contact area with the air, can conduct and dissipate the heat generated on chip 200, thereby reducing its temperature. Chip 200 is mounted on circuit board 100 and clamped between circuit board 100 and heat sink 300. This allows circuit board 100 to provide power to chip 200 and also enables a tight connection between chip 200 and heat sink 300, facilitating heat transfer from chip 200 to heat sink 300, which then dissipates the heat from chip 200 outside the circuit board assembly.

[0034] The clamping component 600 is fixed to the heat sink 300 and clamps tightly with the first connector 400. The first end of the first connector 400 passes through the heat sink 300 and is fixed to the circuit board 100. The elastic member 500 abuts against the second end of the first connector 400 and also abuts against the clamping component 600.

[0035] In this application, during the installation of the clamping component 600, the clamping component 600 and the first connecting member 400 are initially in a clearance fit. At this time, the elastic force between the elastic member 500 and the clamping component 600 can be adjusted by adjusting the compression amount of the elastic member 500 or changing the specifications of the elastic member 500. This indirectly adjusts the elastic force between the clamping component 600 and the heat sink 300, that is, the relative position between the heat sink 300 and the chip 200 is adjusted. When the position of the heat sink 300 is adjusted to achieve good heat dissipation for the chip 200 without damaging the chip 200, it indicates that the elastic force applied by the elastic member 500 to the clamping component 600 is appropriate. This allows the operator to clamp and fix the clamping component 600 to the first connecting member 400, thereby enabling the operator to apply elastic force to the clamping component 600 through the elastic member 500 to ensure that the heat sink 300 can adaptably achieve good heat dissipation for the chip 200.

[0036] After the clamping assembly 600 and the first connecting member 400 are clamped and fixed, the clamping engagement between the clamping assembly 600 and the first connecting member 400 fixes their positional relationship. Furthermore, the clamping assembly 600 is fixedly connected to the heat sink 300, thus fixing the relative positional relationship between the clamping assembly 600, the heat sink 300, and the first connecting member 400. That is, the relative positional relationship between the three will not change without disassembling the circuit board assembly. Therefore, in a non-steady-state scenario, regardless of the direction of acceleration or deceleration of the circuit board assembly, the relative positional relationship of each component of the circuit board assembly remains fixed and unchanged, especially the relative position between the chip 200 and the heat sink 300.

[0037] Meanwhile, in this embodiment, workers can select elastic elements 500 with different elastic coefficients according to the pressure-bearing capacity of different chips 200. This allows the elastic elements 500 to apply different elastic forces to the heat sink 300 through the clamping assembly 600 before the clamping assembly 600 clamps the first connecting member 400. This results in different clamping forces between the heat sink 300 and the chip 200, thereby improving the heat dissipation performance of the heat sink 300 on the chip 200. It should be noted that within the pressure-bearing limit of the chip 200, the greater the clamping force of the heat sink 300 on the chip 200, the smaller the contact thermal resistance between the two contact surfaces between the heat sink 300 and the chip 200. In other words, appropriately increasing the clamping force of the heat sink 300 on the chip 200 helps improve the heat dissipation performance of the heat sink 300 on the chip 200 without exceeding the pressure limit of the chip 200 and causing damage.

[0038] The circuit board device disclosed in this application improves the structure of circuit board devices in related technologies by providing a clamping component 600 and an elastic member 500. Before the clamping component 600 and the first connecting member 400 are tightly engaged, the elastic member 500 can adjust the clamping position of the clamping component 600 relative to the first connecting member 400. This allows adjustment of the pressure force of the heat sink 300 on the chip 200, positioning the heat sink 300 to provide good heat dissipation for the chip 200 without damaging it. The clamping component 600 and the first connector 400 are clamped and fixed together, so that after the clamping component 600 and the first connector 400 are clamped together, the clamping component 600 and the heat sink 300 are fixed together. Thus, the clamping component 600, the heat sink 300 and the first connector 400 are all fixedly connected, so that the chip 200 and the heat sink 300 are relatively fixed. In this way, the relative position between the chip 200 and the heat sink 300 can remain unchanged in the non-steady-state scenario, thus achieving relative fixation.

[0039] In other words, when the circuit board device is in an unstable state, the relative position between the heat sink 300 and the chip 200 can remain unchanged. This allows the heat sink 300 to effectively dissipate heat from the chip 200 while also preventing pressure damage or collision damage between the chip 200 and the heat sink 300. Therefore, the circuit board device disclosed in this application can solve the problem that heat sinks in electronic devices are prone to damaging the chip 200 and cannot effectively dissipate heat from the chip 200.

[0040] In the circuit board device disclosed in the embodiments of this application, the heat sink 300 may include a heat sink body 310 and a heat sink bracket 320. The heat sink body 310 and the heat sink bracket 320 are connected. The chip 200 is clamped and fixed between the circuit board 100 and the heat sink body 310. The heat sink bracket 320 has a first connection hole 321. The circuit board 100 includes a second connector 110. The clamping assembly 600 has a clamping space 611. The first end of the first connector 400 passes through the clamping space 611 and the first connection hole 321 in sequence and is fixedly engaged with the second connector 110. The first connector 400 and the clamping space 611 are interference-fitted.

[0041] In the above situation, the heat sink 300 dissipates heat from the chip 200 through the heat sink body 310 and is fixedly connected to the circuit board 100 and the first connector 400 through the heat sink bracket 320. Thus, the heat dissipation function and the fixed connection function of the heat sink 300 are respectively realized by the heat sink body 310 and the heat sink bracket 320, thereby avoiding interference of the fixed connection of the heat sink 300 with the heat dissipation function, which helps to ensure that the heat sink body 310 has a better heat dissipation effect on the chip 200. Meanwhile, the interference fit between the first connector 400 and the clamping space 611 increases the friction between the inner wall of the clamping space 611 and the first connector 400, thereby making the connection stability between the clamping space 611 and the first connector 400 higher. Even when the circuit board device moves, it can still maintain a fixed relative position between the clamping component 600 and the first connector 400, which is conducive to maintaining the relative position between the clamping component 600 and the heat sink bracket 320, thereby fixing the relative position between the heat sink body 310 and the chip 200, and thus ensuring a good heat dissipation effect of the heat sink body 310 on the chip 200.

[0042] In the circuit board device disclosed in the embodiments of this application, in order to make the relative positional relationship between the heat sink 300, the chip 200 and the clamping component 600 more stable, the heat sink 300 may include multiple heat sink brackets 320. The number of heat sink brackets 320, the first connector 400, the elastic member 500 and the clamping component 600 may be multiple and correspond one-to-one.

[0043] It should be noted that, to facilitate the interference fit between the clamping space 611 and the first connecting member 400, the clamping assembly 600 can be composed of two detachably connected parts, each with a portion of the clamping space 611. That is, during the installation of the first connecting member 400 into the clamping space 611, the two parts of the clamping assembly 600 separate, and the clamping space 611 is not fully formed at this time. This allows the clamping space 611 to form a clearance fit with the first connecting member 400, making it easier for the first connecting member 400 to be installed in the clamping space 611 of the clamping assembly 600. Once the first connecting member 400 is installed in the clamping space 611, the operator can then tighten the two parts of the clamping assembly 600 (i.e., the two clamping arms), causing the clamping space 611 to gradually form. The clearance fit between the incompletely formed clamping space 611 and the first connecting member 400 changes to a true interference fit. Of course, the two clamping arms can be separate structures, connected detachably via detachable connectors. In a more optimized solution, the two clamping arms can be a single, integrated structure, which facilitates a stronger clamping effect.

[0044] To ensure a more secure clamping fit between the clamping space 611 and the first connecting member 400, and to increase the friction between the inner wall of the clamping space 611 and the first connecting member 400, in one optional technical solution, anti-slip textures can be provided on the inner wall of the clamping space 611, thereby further increasing the friction between the inner wall of the clamping space 611 and the first connecting member 400. Alternatively, in another optional technical solution, anti-slip textures can be provided on the portion of the first connecting member 400 that clamps with the inner wall of the clamping space 611, which also increases the friction between the inner wall of the clamping space 611 and the first connecting member 400. When required by the circuit board assembly, anti-slip textures can be provided on both the inner wall of the clamping space 611 and the portion of the first connecting member 400 that clamps with the inner wall of the clamping space 611. This application does not specifically limit the location of the anti-slip textures to increase the friction between the inner wall of the clamping space 611 and the first connecting member 400.

[0045] In the circuit board device disclosed in this application embodiment, the clamping assembly 600 may include a clamping member 610 and a first limiting member 620. The clamping member 610 has a clamping space 611. The first limiting member 620 is connected to the heat sink bracket 320 and is sleeved on the first connecting member 400. The first limiting member 620 and the first connecting member 400 are mutually limitingly engaged in a first direction, which is the direction in which the first connecting member 400 disengages from the clamping space 611 in its extension direction. In this case, the first limiting member 620 can restrict the first connecting member 400 from disengaging from the clamping space 611 in its extension direction, thereby further preventing the first connecting member 400 from disengaging from the clamping space 611 and thus avoiding changes in the relative position between the first connecting member 400 and the clamping member 610. Specifically, the first limiting member 620 may be an elastic washer. The extension direction of the first connecting member 400 is the length direction of the first connecting member 400.

[0046] To achieve a more stable connection between the clamping assembly 600 and the radiator bracket 320, in one optional technical solution, the clamping assembly 600 may include a first end face 660 and a second end face 670. The second end of the elastic member 500 elastically abuts against the first end face 660, and the second end face 670 is connected to the radiator bracket 320. The first end face 660 and the second end face 670 are two opposite end faces of the clamping assembly 600, and the area of ​​the first end face 660 is smaller than the area of ​​the second end face 670. In this case, the first end of the elastic member 500 is connected to the second end of the first connecting member 400. Since the clamping assembly 600 is connected to the radiator bracket 320 through the second end face, with a larger second end face, there is a larger contact area between the clamping assembly 600 and the radiator bracket 320, which is beneficial for setting a larger number of connecting members to achieve a stable connection between them. Furthermore, the smaller size of the first end face 660 results in a smaller volume of the portion of the clamping assembly 600 containing the first end face 660, which helps to reduce the weight of the clamping assembly 600.

[0047] In the circuit board device disclosed in this application embodiment, the clamping assembly 600 may include a clamping member 610 and a second limiting member 630. The clamping member 610 has a clamping space 611. To facilitate the installation of the first connecting member 400 with the clamping space 611, the clamping member 610 may include two detachably connected parts, namely a first part 615 and a second part 616. Both the first part 615 and the second part 616 may have a portion of the clamping space 611. That is, in the direction perpendicular to the central axis of the clamping space 611, the first part 615 and the second part 616 of the clamping member 610 are detachably connected. To avoid poor fastening of the clamping member 610, which includes the first part 615 and the second part 616, to the first connecting member 400 after assembly.

[0048] In one alternative technical solution, the second limiting member 630 and the clamping member 610 can be engaged in a limiting cooperation in a second direction, with the central axis of the clamping space 611 perpendicular to the second direction. In this case, after the circuit board assembly is completed, the second limiting member 630 can prevent the first part 615 and the second part 616 of the clamping member 610 from separating in the second direction, thereby avoiding any adverse effect on the clamping cooperation between the clamping space 611 and the first connecting member 400.

[0049] Optionally, the second limiting member 630 can be an elastic limiting member with a limiting barb. A fifth connecting hole 614 can be provided on the first part 615. The clamping assembly 600 may also include a fifth connecting member 680, which passes through the second limiting member 630 and is threadedly fastened to the fifth connecting hole 614, thereby fixing the second limiting member 630 to the first part 615. The limiting engagement between the second limiting member 630 and the clamping member 610 can be specifically achieved by the limiting barb between the second part 616 and the second limiting member 630.

[0050] Specifically, after the worker places part of the first connector 400 into the clamping space 611, the first part 615 and the second part 616 can gradually approach each other and achieve a detachable connection. The second part 616 can have a first mating slope 617, and the second limiting member 630 can have a second mating slope 631. As the first part 615 and the second part 616 gradually approach each other, the first mating slope 617 and the second mating slope 631 slide into contact. When the first part 615 and the second part 616 are connected, the sliding contact between the first mating slope 617 and the second mating slope 631 ends. At this time, the limiting barb of the second limiting member 630 and the second part 616 can achieve a limiting contact in the second direction.

[0051] To ensure a more secure connection between the first part 615 and the second part 616, in a further technical solution, the clamping assembly 600 may also include a third connector 640. The clamping member 610 has a third connecting hole 612 along the second direction, and the third connector 640 is threadedly fastened to the clamping member 610 through the third connecting hole 612. In this case, both the first part 615 and the second part 616 have third connecting holes 612, so that the cooperation between the third connector 640 and the third connecting hole 612 can achieve a secure connection between the first part 615 and the second part 616, which is beneficial to strengthening the clamping fit between the clamping space 611 of the clamping member 610 and the first connector 400.

[0052] Of course, in addition to improving connection stability, the third connector 640 can also achieve a second clamping engagement between the first part 615 and the second part 616 of the clamping assembly 600. Side-operated third connector 640 can also achieve a clamping engagement between the first part 615 and the second part 616. The third connector 640 extends in a direction parallel to the circuit board 100, thus making it suitable for assembly scenarios where it is inconvenient to fasten the first part 615 and the second part 616 from a direction perpendicular to the circuit board 100.

[0053] To achieve a more secure connection between the radiator bracket 320 and the clamping assembly 600, in one optional technical solution, the clamping assembly 600 may include a clamping member 610 and a fourth connecting member 650. The clamping member 610 has a clamping space 611 and may also have a fourth connecting hole 613. The radiator bracket 320 may also have a second connecting hole 322. The fourth connecting member 650 passes through the fourth connecting hole 613 and is threadedly fastened to the second connecting hole 322, and / or the fourth connecting member 650 passes through the second connecting hole 322 and is threadedly fastened to the fourth connecting hole 613.

[0054] In the above-described manner, to achieve a stable connection between the clamping member 610 and the radiator bracket 320, the fourth connecting member 650 can pass through the radiator bracket 320 to achieve a tight fit with the clamping member 610, or the fourth connecting member 650 can pass through the clamping member 610 to achieve a tight fit with the radiator bracket 320. Of course, to make the connection between the radiator bracket 320 and the clamping member 610 more stable, multiple fourth connecting members 650 can be used simultaneously to achieve a tight fit between the clamping member 610 and the radiator bracket 320, and also to achieve a tight fit between the clamping member 610 and the clamping member 610, respectively. The number of fourth connecting holes 613 and second connecting holes 322 matches the number of fourth connecting members 650. This application does not impose specific limitations on the number of fourth connecting members 650, nor on the specific number of fourth connecting holes 613 and second connecting holes 322.

[0055] In the circuit board device disclosed in this application embodiment, the chip 200 and the heat sink 300 are in contact through two planes, thereby allowing heat from the chip 200 to be transferred to the heat sink 300. However, due to manufacturing and assembly errors of the chip 200 and the heat sink 300, as well as insufficient manufacturing and assembly precision, there are still many small depressions on the contact plane between the chip 200 and the heat sink 300. These small depressions contain air, and air has a high thermal resistance. To reduce the air thermal resistance between the chip 200 and the heat sink 300, in an optional technical solution, the circuit board device may further include a thermally conductive component, which is disposed between the chip 200 and the heat sink 300, and the thermally conductive component is thermally conductive silicone grease.

[0056] In the above scenario, because thermal grease is a fluid that can flow, and because it has high thermal conductivity, it can fill the contact surface between the chip 200 and the heat sink 300, effectively filling small depressions on the contact surface and expelling air from these depressions. Furthermore, due to its fluidity, using less thermal grease can significantly reduce the thermal resistance between the contact surface of the chip 200 and the heat sink 300. In other words, the use of thermal grease helps reduce the contact thermal resistance between the chip 200 and the heat sink 300, thereby improving the heat dissipation performance of the heat sink 300 on the chip 200.

[0057] To reduce the weight of the entire circuit board assembly, the surfaces of the clamping member 610 that do not require mating connections can be concave to reduce the volume and weight of the clamping member 610. In this application, the clamping assembly 600 may also include a washer 690, which is sleeved on the first connector 400 and connected to the first end face 660. The diameter of the connecting hole in the washer 690 is smaller than the diameter of the clamping space 611, so that the second end of the elastic member 500 can achieve elastic abutment with the washer 690.

[0058] This application discloses an electronic device, which includes the circuit board device described in any of the above-mentioned embodiments.

[0059] The electronic devices disclosed in this application can be mobile phones, PDAs, e-readers, and game consoles, etc. This application does not impose specific limitations on the types of electronic devices.

[0060] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0061] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A circuit board device, characterized in that, The device includes a circuit board (100), a chip (200), a heat sink (300), a first connector (400), an elastic element (500), and a releasable clamping assembly (600), wherein: the chip (200) is disposed on the circuit board (100) and clamped and fixed between the circuit board (100) and the heat sink (300); the clamping assembly (600) is fixed to the heat sink (300); the clamping assembly (600) has a clamping space (611); the clamping assembly (600) includes a first part (615), a second part (616), and a second limiting element (630); both the first part (615) and the second part (616) have portions of the clamping space (611); the first connector (400) is installed in the clamping space (611) so that the clamping assembly (600) and the chip (200) are clamped together. The first connector (400) is clamped and fixed, and the clamping position of the clamping component (600) relative to the first connector (400) is adjustable; the second limiting component (630) is an elastic limiting component with a limiting barb, the second limiting component (630) is fixed to the first part (615), and the limiting barb cooperates with the second part (616) in the second direction to prevent the first part (615) and the second part (616) from separating in the second direction; the first connector (400) is located above the circuit board (100), the first end of the first connector (400) passes through the heat sink (300) and is fixed to the circuit board (100); the elastic component (500) abuts against the second end of the first connector (400) and against the clamping component (600).

2. The circuit board device according to claim 1, characterized in that, The heat sink (300) includes a heat sink body (310) and a heat sink bracket (320). The heat sink body (310) is connected to the heat sink bracket (320). The chip (200) is clamped and fixed between the circuit board (100) and the heat sink body (310). The heat sink bracket (320) has a first connection hole (321). The circuit board (100) includes a second connector (110). The first end of the first connector (400) passes through the clamping space (611) and the first connection hole (321) in sequence, and is fixedly engaged with the second connector (110). The first connector (400) and the clamping space (611) are interference-fitted.

3. The circuit board device according to claim 2, characterized in that, The inner wall of the hugging space (611) is provided with anti-slip texture.

4. The circuit board device according to claim 2, characterized in that, The clamping assembly (600) includes a clamping member (610) and a first limiting member (620). The clamping member (610) includes a first part (615) and a second part (616). The first limiting member (620) is connected to the radiator bracket (320). The first limiting member (620) is sleeved on the first connecting member (400). The first limiting member (620) and the first connecting member (400) are limited and engaged in a first direction. The first direction is the direction in which the first connecting member (400) disengages from the clamping space (611) in its extension direction.

5. The circuit board device according to claim 2, characterized in that, The clamping assembly (600) includes a first end face (660) and a second end face (670). The second end of the elastic member (500) elastically abuts against the first end face (660). The second end face (670) is connected to the radiator bracket (320). The first end face (660) and the second end face (670) are two opposite end faces of the clamping assembly (600). The area of ​​the first end face (660) is smaller than the area of ​​the second end face (670).

6. The circuit board device according to claim 2, characterized in that, The clamping assembly (600) includes a clamping member (610) and a second limiting member (630). The clamping member (610) includes a first part (615) and a second part (616). The second limiting member (630) cooperates with the clamping member (610) in a limiting manner in a second direction. The central axis of the clamping space (611) is perpendicular to the second direction.

7. The circuit board device according to claim 6, characterized in that, The clamping assembly (600) further includes a third connector (640), the clamping assembly (610) having a third connecting hole (612) along the second direction, the third connector (640) being threadedly fastened to the clamping assembly (610) through the third connecting hole (612).

8. The circuit board device according to claim 2, characterized in that, The clamping assembly (600) includes a clamping member (610) and a fourth connecting member (650). The clamping member (610) includes a first part (615) and a second part (616). The clamping member (610) also has a fourth connecting hole (613). The radiator bracket (320) also has a second connecting hole (322). The fourth connecting member (650) passes through the fourth connecting hole (613) and is threadedly fastened to the second connecting hole (322), and / or the fourth connecting member (650) passes through the second connecting hole (322) and is threadedly fastened to the fourth connecting hole (613).

9. The circuit board device according to claim 1, characterized in that, The circuit board assembly further includes a thermal conductive component disposed between the chip (200) and the heat sink (300), and the thermal conductive component is thermally conductive silicone grease.

10. An electronic device, characterized in that, The circuit board device includes any one of claims 1 to 9.

Images